Head-mounted display device incorporating a piezoelectric device for heat dissipation and

Abstract

Disclosed are head-mounted electronic devices incorporating piezoelectric devices for dissipating heat, and related methods of controlling piezoelectric devices to dissipate heat from the head-mounted electronic devices. To dissipate heat in a head-mounted electronic device, a piezoelectric device is integrated in the head-mounted electronic device and fluidly coupled to an internal air plenum in the head-mounted electronic device in fluid communication with an integrated circuit (IC). The piezoelectric device draws the heated air around the IC into the interior chamber, thereby heating the air inside the interior chamber. The piezoelectric device is configured to pump heated air in the interior chamber through the outlet to dissipate the heated air from the interior chamber. The dissipation of the heated air heated by the heat generated from the IC can keep the IC not exceeding its thermal limit and / or prevent the head-mounted electronic device from exceeding its skin temperature limit.

Description

[0001] Priority application

[0002] This application claims priority to U.S. Patent Application Serial No. 18 / 465,792, filed September 12, 2023, entitled "HEAD-MOUNTED DISPLAY DEVICEINCORPORATING PIEZO-ELECTRIC DEVICE FOR HEAT DISSIPATION, AND RELATED METHODS", the entire contents of which are incorporated herein by reference. Background Technology

[0003] I. Technical Field

[0004] The field of this disclosure relates to wearable electronic devices including computing devices, such as head-mounted display devices, including virtual reality (VR) head-mounted display devices, augmented reality (AR) head-mounted display devices, and extended reality (XR) head-mounted display devices.

[0005] II. Background Technology

[0006] According to the formula: Power = Capacitor × Voltage (V) 2 × Frequency (f): Power consumption in computing electronic devices is a function of voltage and the frequency at which the circuit is clocked. Higher operating voltage (V) results in faster signal propagation in the circuit. Higher operating frequency (V) results in faster signal computation and processing. Therefore, to achieve higher levels of computing performance in computing electronic devices, the operating voltage (V) and / or operating frequency (f) can be increased up to the voltage rail and / or frequency limits of the circuitry in the device. However, increasing the operating voltage (V) and / or operating frequency (f) increases power consumption, which may lead to additional heat generation due to energy losses from the power supply operation of the circuitry. Electronic devices have thermal limits that can be based on the device's reliability, performance, and / or safety. For example, an electronic device may have a thermal limit at which performance begins to degrade or the circuitry in the device can no longer operate reliably. Electronic devices may also have skin temperature limits as the maximum temperature at which contact with the external environment or the user's skin is permitted. Therefore, there is an increasing need to design computing electronic devices to dissipate the increased heat to prevent the electronic device from exceeding thermal limits and / or skin temperature limits.

[0007] One type of computing electronic device that can have both thermal limits and skin temperature limits is a wearable computing electronic device, such as a computing device that can be used for extended reality applications, including virtual reality (VR), augmented reality (AR), and extended reality (XR) applications. For example, a reality computing device can display imaged real-world objects and computer-generated information, such as images or text, on a screen. An example of a reality mobile computing device is a head-mounted XR glasses device (such as...) Figure 1 The illustrated electronic glasses 100 is a head-mounted electronic device in the form of electronic glasses 100. The electronic glasses 100 is an electronic computing device including a computing device 102 that controls an integrated display 104 integrated into lenses 106. The integrated display 104 allows the user to view VR images and / or real-world objects added by the computing device 102. The computing device 102, the integrated display 104, and other supporting circuitry included in the electronic glasses 100 must be powered to operate. Therefore, the computing device 102, the integrated display 104, and the other supporting circuitry included in the electronic glasses 100 will dissipate energy losses as heat. The computing device 102 has a thermal limit for operation. Additionally, since the electronic glasses 100 are worn by a user, a skin temperature limit may also exist for the electronic glasses 100. Therefore, it is important to dissipate the heat generated by energy losses in the electronic glasses 100 to keep the electronic glasses 100 within both its thermal limit and skin temperature limit. However, the particularly small shape factor of the electronic glasses 100 may make it more challenging to dissipate heat and keep the electronic glasses 100 within its thermal and / or skin temperature limits. Summary of the Invention

[0008] The aspects disclosed herein include head-mounted electronic devices incorporating piezoelectric devices for heat dissipation. Related methods for controlling the piezoelectric devices to dissipate heat from the head-mounted electronic device are also disclosed. For example, the head-mounted electronic device may be a virtual reality (VR) head-mounted display device, an augmented reality (AR) head-mounted display device, or an extended reality (XR) head-mounted display device, which incorporates an integrated display and electronic circuitry to drive the display and / or provide other functionality. The electronic circuitry incorporated in the head-mounted electronic device includes an integrated circuit (IC) (e.g., a computing device) configured to control the integrated display. Improving the performance of the IC can be achieved by operating it at increased operating voltages and / or operating frequencies, but this will increase the power consumption of the IC, thereby generating additional heat due to increased energy loss. In this regard, in an exemplary aspect, a piezoelectric device is integrated into the head-mounted electronic device to dissipate heat. The piezoelectric device is fluidly coupled to an internal air chamber in fluid communication with the IC within the head-mounted electronic device. A piezoelectric device can be electronically controlled to draw heated air around the IC into an internal chamber, thereby heating the air inside the internal chamber as a form of convective cooling for the IC. The piezoelectric device is configured to pump the heated air from the internal chamber through an outlet to dissipate the heated air from the internal chamber. The piezoelectric device can be arranged such that it dissipates the heated air to the outside of the head-mounted electronic device through the outlet. The dissipation of the heated air, heated by heat generated from the IC, keeps the IC below its thermal limits and / or prevents the head-mounted electronic device from exceeding its skin temperature limits. The piezoelectric device can extend the thermal performance boundaries of the head-mounted electronic device that might otherwise be limited by skin temperature and junction temperature limits.

[0009] In one example, the piezoelectric device includes a piezoelectric element that can be excited by an electrical signal generated by electronic circuitry integrated into a head-mounted electronic device. In this example, the piezoelectric element is disposed within a housing as part of a piezoelectric device having an inlet and an outlet. The piezoelectric element is in fluid communication with the inlet of the housing of the piezoelectric device. The inlet is in fluid communication with an internal chamber within the head-mounted display device. The piezoelectric element also contacts a pump chamber adjacent to the outlet of the housing of the piezoelectric device. In response to receiving an electrical signal, the piezoelectric element vibrates to agitate the pump chamber (e.g., causing the pump chamber to continuously contract and relax), thereby generating a pressure difference between the inlet and outlet within the housing. The pressure difference generated within the housing directs air from the inlet of the housing to the outlet of the housing, drawing air into the inlet and dissipating it through the outlet. One advantage of this exemplary piezoelectric device is that it can be provided with a thin form factor, which allows for easier integration into head-mounted electronic devices such as the temples or frames of electronic glasses. Another advantage of this exemplary piezoelectric device is that its pump mechanism can operate with lower power consumption. Another benefit of this exemplary piezoelectric device is that, compared to fan devices with rotating blades, the pump mechanism of this exemplary piezoelectric device can operate at a lower noise level, thus not disturbing users of head-mounted electronic devices.

[0010] In another example, a head-mounted electronic device may be provided in the form of electronic glasses, which include an integrated display in one or more lenses of the glasses. As an example, a piezoelectric device may be integrated into the temples or frame of the electronic glasses. An IC may also be integrated into the temples or frame of the electronic glasses, which further include an internal air chamber. In this way, heated air generated in the internal chamber due to heat generated by the IC is in fluid communication with the piezoelectric device. The piezoelectric device may pump the heated air present in the internal chamber to an outlet for heat dissipation. As an example, the outlet may be located in the housing of the piezoelectric device, which is exposed to the outside through the temples or frame of the electronic glasses to dissipate the heated air to the outside of the electronic glasses. The electronic glasses may also include an air inlet in fluid communication with the air chamber to provide supplemental air for the air dissipated by the piezoelectric device. For example, the air inlet may be provided at the hinge between the temples and the frame of the electronic glasses. The hinge of the electronic glasses may be configured to provide natural leakage into the air chamber in the temples.

[0011] Piezoelectric devices can be integrated into any area of ​​a head-mounted electronic device that is in fluid communication with an internal chamber containing air heated by heat generated by the IC. The piezoelectric devices can be integrated into any area of ​​the head-mounted electronic device that allows the air heated by the IC to be dissipated (including dissipated to the exterior of the head-mounted electronic device). The piezoelectric devices can be controlled by electronic circuitry within the head-mounted electronic device to be switched on and off as needed. For example, the electronic circuitry in the head-mounted electronic device can be configured to selectively switch the piezoelectric devices on and off based on the temperature within the head-mounted electronic device. For example, the head-mounted electronic device may include a thermocouple or thermostat coupled to the electronic circuitry to switch the piezoelectric devices on and off respectively in response to temperatures exceeding and not exceeding defined or programmed temperature limits.

[0012] In this regard, in one exemplary aspect, a head-mounted electronic device is provided. The head-mounted electronic device includes a body that includes a first internal chamber. The head-mounted electronic device also includes a first IC integrated into the body and in fluid communication with the first internal chamber. The head-mounted electronic device further includes a first piezoelectric device that includes a first inlet and a first outlet, the first inlet being in fluid communication with the first internal chamber. The first IC is configured to generate heat to heat air in the first internal chamber. The first piezoelectric device is configured to dissipate the air in the first internal chamber to the first outlet.

[0013] In another exemplary aspect, a method for dissipating heat from a head-mounted electronic device is provided. The head-mounted electronic device includes: a body including an internal chamber; an IC integrated into the body and in fluid communication with the internal chamber; a piezoelectric device including an inlet and an outlet, the inlet being in fluid communication with the internal chamber; a temperature sensor coupled to the head-mounted electronic device; and electronic control circuitry electrically coupled to the temperature sensor and the piezoelectric device. The method includes the electronic control circuitry: operating the IC such that the IC generates heat in the internal chamber to heat air in the internal chamber; and generating an electrical signal to the piezoelectric device to cause the piezoelectric device to dissipate the heated air in the internal chamber to the outlet. Attached Figure Description

[0014] Figure 1 This is a front perspective view of an exemplary head-mounted electronic device in the form of electronic glasses; Figure 2A This is a side perspective view of another exemplary head-mounted electronic device in the form of electronic glasses, illustrating the thermal gradient in the temples of the electronic glasses caused by temperature hotspots resulting from heat dissipation of integrated circuit (IC) chips incorporated into the electronic glasses; Figure 2B yes Figure 2A A side perspective view of the temple of an electronic eyeglass, illustrating an IC chip attached to a circuit board integrated into the temple of the electronic eyeglass; Figure 3A This is a side perspective view of another exemplary head-mounted electronic device in the form of electronic glasses, which includes one or more integrated piezoelectric devices configured to pump heated air, heated by heat generated from an IC, out of an internal chamber to dissipate air from the electronic glasses. Figure 3B and Figure 3C This is an example Figure 3A The side perspective view of the temple of the electronic glasses illustrates a piezoelectric device having an inlet and an outlet, the inlet being fluidly connected to an internal chamber of the temple, the internal chamber being fluidly connected to an IC, and the outlet being located outside the temple, wherein the piezoelectric device is configured to pump air from the inlet to the outlet out of the internal chamber to dissipate air from the electronic glasses. Figure 3D yes Figure 3A A side view of the temple of the electronic glasses, illustrating the airflow of heated air pumped from the inner chamber into the inlet and out of the outlet by a piezoelectric device to dissipate air from the electronic glasses; Figure 4 This is a block diagram of an exemplary piezoelectric device, which includes a housing having an inlet and an outlet, and a piezoelectric element within the housing that can be excited by an electrical signal to cause a pump chamber within the housing to vibrate, thereby generating a pressure difference between the inlet and the outlet inside the housing, and thus pumping air from the inlet to the outlet. Figures 5A to 5C Exemplary temples of electronic glasses (including) Figure 3A A side view of the temple of an electronic eyeglass, the electronic eyeglass including one or more integrated piezoelectric devices configured to pump heated air heated by heat generated from an IC out of the inner chamber to dissipate air from the electronic eyeglass; Figure 6A This is a side perspective view of another exemplary head-mounted electronic device in the form of electronic glasses, which includes one or more alternatively integrated piezoelectric devices configured to pump heated air heated by heat generated from an IC out of an internal chamber to dissipate air from the electronic glasses; Figures 6B-1 to 6B-2 yes Figure 6A A side view of an exemplary temple of electronic glasses, the electronic glasses including one or more integrated piezoelectric devices configured to pump heated air heated by heat generated from an IC out of an internal chamber to dissipate air from the electronic glasses; Figure 7It can be integrated into head-mounted electronic devices (including but not limited to) Figures 3A to 3D , Figures 5A to 5B and Figures 6A to 6B-2 A block diagram of an exemplary electronic device in a head-mounted electronic device and / or its temples, the head-mounted electronic device including one or more piezoelectric devices, the one or more piezoelectric devices including but not limited to Figure 4 The piezoelectric device in the head-mounted electronic device includes a processor-based system that may include an IC, the IC including a computing device and configured to electronically control the piezoelectric device to pump heated air, heated by heat generated from the IC, out of the internal chamber to dissipate air from the head-mounted electronic device; and Figure 8 This illustrates the use of electronic devices from head-mounted electronic devices (including but not limited to...) Figures 3A to 3D , Figures 5A to 5B and Figures 6A to 6B-2 A flowchart illustrating an exemplary process for heat dissipation in a head-mounted electronic device and / or its temples, wherein the electronic device may include an IC, the IC including a computing device that controls piezoelectric devices (including, but not limited to, those with...). Figure 4 The piezoelectric device in the device pumps heated air, which is heated by heat generated from the IC, out of the internal chamber to dissipate air from the head-mounted electronic device. Detailed Implementation

[0015] Several exemplary aspects of this disclosure will now be described with reference to the accompanying drawings. The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects.

[0016] The aspects disclosed herein include head-mounted electronic devices incorporating piezoelectric devices for heat dissipation. Related methods for controlling the piezoelectric devices to dissipate heat from the head-mounted electronic device are also disclosed. For example, the head-mounted electronic device may be a virtual reality (VR) head-mounted display device, an augmented reality (AR) head-mounted display device, or an extended reality (XR) head-mounted display device, which incorporates an integrated display and electronic circuitry to drive the display and / or provide other functionality. The electronic circuitry incorporated in the head-mounted electronic device includes integrated circuits (ICs) including ICs configured to control the integrated display (e.g., a computing device). Performance improvements can be achieved by operating the IC at increased operating voltages and / or operating frequencies, but this will increase the power consumption of the IC, thereby generating additional heat due to increased energy loss. In this regard, in an exemplary aspect, a piezoelectric device is integrated into the head-mounted electronic device to dissipate heat. The piezoelectric device is fluidly coupled to an internal air chamber in fluid communication with the IC within the head-mounted electronic device. A piezoelectric device can be electronically controlled to draw heated air around the IC into an internal chamber, thereby heating the air inside the internal chamber as a form of convective cooling for the IC. The piezoelectric device is configured to pump the heated air from the internal chamber through an outlet to dissipate the heated air from the internal chamber. The piezoelectric device can be arranged such that it dissipates the heated air to the outside of the head-mounted electronic device through the outlet. The dissipation of the heated air, heated by heat generated from the IC, keeps the IC below its thermal limits and / or prevents the head-mounted electronic device from exceeding its skin temperature limits. The piezoelectric device can extend the thermal performance boundaries of the head-mounted electronic device that might otherwise be limited by skin temperature and junction temperature limits.

[0017] In one example, the piezoelectric device includes a piezoelectric element that can be excited by an electrical signal generated by electronic circuitry integrated into a head-mounted electronic device. In this example, the piezoelectric element is disposed within a housing as part of a piezoelectric device having an inlet and an outlet. The piezoelectric element is in fluid communication with the inlet of the housing of the piezoelectric device. The inlet is in fluid communication with an air chamber in the head-mounted display device. The piezoelectric element also contacts a pump chamber adjacent to the outlet of the housing of the piezoelectric device. In response to receiving an electrical signal, the piezoelectric element vibrates to agitate the pump chamber (e.g., causing the pump chamber to continuously contract and relax), thereby generating a pressure difference between the inlet and outlet within the housing. The pressure difference generated within the housing directs air from the inlet of the housing to the outlet of the housing, drawing air into the inlet and dissipating it through the outlet. One advantage of this exemplary piezoelectric device is that it can be provided with a thin form factor, which allows for easier integration into head-mounted electronic devices such as the temples or frames of electronic glasses. Another advantage of this exemplary piezoelectric device is that its pump mechanism can operate with lower power consumption. Another benefit of this exemplary piezoelectric device is that, compared to fan devices with rotating blades, the pump mechanism of this exemplary piezoelectric device can operate at a lower noise level, thus not disturbing users of head-mounted electronic devices.

[0018] Before discussing exemplary head-mounted electronic devices, including one or more integrated piezoelectric devices configured to pump heated air, heated by heat generated from the IC, out of the internal chamber to dissipate air from the head-mounted electronic device, as shown in Figure 3, let's first discuss... Figure 2A and Figure 2B The description does not include exemplary head-mounted electronic devices that use pumps for heat dissipation.

[0019] In this respect, Figure 2AThis is a side perspective view of a head-mounted electronic device 200 in the form of electronic glasses 202. The electronic glasses 202 has a body 204 including a frame 206 comprising a first lens holder 208(1) and a second lens holder 208(2) attached to and disposed on a corresponding first side 210(1) and second side 210(2) of a nose bridge 212 in a horizontal direction (X-axis direction). The first lens holder 208(1) and the second lens holder 208(2) each support a corresponding first lens 214(1) and second lens 214(2). One or each of the first lens 214(1) and the second lens 214(2) may include an integrated display 216 configured to generate a visual image that can be viewed by a user wearing the electronic glasses 202. The electronic glasses 202 also includes a first temple 218(1) and a second temple 218(2), which are connected to the corresponding third side 221(1) and fourth side 221(2) of the corresponding first lens holder 208(1) and second lens holder 208(2) and are located on opposite sides of each other in the horizontal direction (X-axis direction). Figure 2B It also shows Figure 2A The first temple 218(1) of the electronic glasses 202 illustrates an internal chamber 220 containing a circuit board 222, which includes an IC 224 in the form of a system-on-a-chip (SoC) 226. In this example, the SoC 226 includes a computing device 228, which may be a processor or a controller, the processor or controller including instructions configured to execute instructions to perform tasks related to the electronic glasses 202 (including driving the integrated display 216 (see...)). Figure 2A )) circuit.

[0020] Continue to refer to Figure 2B Because the SoC 226 consumes power during operation, the SoC 226 and its IC 224 generate heat due to energy loss. This energy loss is amplified by improvements in the performance of the IC 224 (e.g., increased voltage and / or operating frequency), resulting in additional heat and elevated temperature on the body 204 of the electronic glasses 202. This... Figure 2A The temperature gradient 230 in the first temple 218(1) of the electronic glasses 202 is shown. As shown in this temperature gradient, there is an elevated temperature in the region of IC 224, which may generate temperatures exceeding the thermal limit of IC 224 and / or the skin temperature limit of the user wearing the electronic glasses 202 in the first temple 218(1) and surrounding area.

[0021] Figure 3A It is similar to Figure 2A and Figure 2BThe electronic glasses 302 in FIG3 is another exemplary head-mounted electronic device 300 in the form of electronic glasses 202. However, as discussed in more detail below, the electronic glasses 302 in FIG3 includes a first piezoelectric device 332(1) and a second piezoelectric device 332(2), which are configured to pump heated air 334(1), 334(2) from corresponding first temples 318(1) and nose bridge 312 of the electronic glasses 302. For example, the first temples 318(1) may include an integrated first IC 324(1) located inside or fluidly coupled to the first internal chamber 320(1). Thus, when the first IC 324(1) is in operation, it will heat the air 334(1) inside the first internal chamber 320(1) due to heat generated by energy loss. Similarly, the second IC 324(2) is fluidly coupled to the second inner chamber 320(2) such that when the second IC 324(2) in fluid communication with the second inner chamber 320(2) is operated, it will also heat the air 334(2) inside the second inner chamber 320(2) due to heat generated by energy loss. Therefore, as discussed in more detail below, the first piezoelectric device 332(1) and the second piezoelectric device 332(2) in fluid communication with the corresponding first inner chamber 320(1) and the second inner chamber 320(2) are configured to pump the heated air 334(1), 334(2) out of the corresponding first inner chamber 320(1) and the second inner chamber 320(2) outside the body 304 of the electronic glasses 302 so that the heated air 334(1), 334(2) is dissipated from the electronic glasses 302. The first piezoelectric device 332(1) and the second piezoelectric device 332(2) may be electronically controlled, for example, by the first IC 324(1) and the second IC 324(2), to draw air 334(1) and 334(2) into the first inner chamber 320(1) and the second inner chamber 320(2), thereby heating the air inside the first inner chamber 320(1) and the second inner chamber 320(2) in the form of convection cooling of the first IC 324(1) and the second IC 324(2).

[0022] In this way, the dissipation of the heated air 334(1), 334(2) generated by the heat generated by the first IC 324(1) and the second IC 324(2) in the electronic glasses 302 can keep the first IC 324(1) and the second IC 324(2) from exceeding the thermal limits of the first IC and the second IC. The dissipation of the heated air 334(1), 334(2) can also prevent the electronic glasses 302 from exceeding the skin temperature limit of the electronic glasses. The first piezoelectric device 332(1) and the second piezoelectric device 332(2) can extend the thermal performance boundaries of the electronic glasses 302 that might otherwise be limited by the skin temperature limit and the junction temperature limit.

[0023] refer to Figure 3A The electronic glasses 302 has a main body 304, which includes a frame 306. The frame includes a first lens holder 308(1) and a second lens holder 308(2), which are attached to and disposed on corresponding first sides 310(1) and second sides 310(2) of a nose bridge 312 in a horizontal direction (X-axis direction). The first lens holder 308(1) and the second lens holder 308(2) each support a corresponding first lens 314(1) and second lens 314(2). One or each of the first lens 314(1) and the second lens 314(2) may include an integrated display 316 configured to generate a visual image that can be viewed by a user wearing the electronic glasses 302. The electronic glasses 302 also includes first temples 318(1) and second temples 318(2) (e.g., Figure 3B and Figure 3C As shown), the first temple and the second temple are connected to the corresponding third side 321(1) and fourth side 321(2) of the corresponding first lens holder 308(1) and second lens holder 308(2) and are located on opposite sides of each other in the horizontal direction (X-axis direction). In this example, the first IC 324(1) is in the form of a SoC 326 including a computing device 328, which may be a processor or a controller, the processor or controller including circuitry configured to execute instructions to perform tasks related to the electronic glasses 302, including driving the integrated display 316.

[0024] Figure 3B and Figure 3C This is an example Figure 3A A side perspective view of the electronic glasses 302 including the first temple 318(1) of the first piezoelectric device 332(1). The first piezoelectric device 332(1) is configured to direct heated air 334(1) ( Figure 3AThe heated air 334(1) is pumped out from the corresponding first internal chamber 320(1) outside the body 304 of the electronic glasses 302 to dissipate from the electronic glasses 302. If the first internal chamber 320(1) is also fluidly connected to the second internal chamber 320(2), the first piezoelectric device 332(1) can also be configured to pump the heated air 334(2) out from the corresponding first internal chamber 320(1) outside the body 304 of the electronic glasses 302 to dissipate from the electronic glasses 302. Figure 3A (2) is pumped out from the corresponding second inner chamber 320(2) outside the body 304 of the electronic glasses 302 so that heated air 334(2) is dissipated from the electronic glasses 302. Figure 3C An external view of the first temple 318(1) having a first outer surface 336(1) is shown. Figure 3B An internal view of the first temple 318(1) excluding the first outer surface 336(1) is shown.

[0025] like Figure 3C As shown, in this example, the first piezoelectric device 332(1) is mounted on the first outer surface 336(1) of the first temple 318(1). Figure 3B The first piezoelectric device 332(1) is also exemplified as being fluidly connected to the first inner chamber 320(1) of the first temple 318(1). Figure 3B As shown, in this example, the first inner chamber 320(1) of the first temple 318(1) includes a circuit board 322, which includes a first IC 324(1) in the form of a SoC 326. In this example, the SoC 326 includes a computing device 328, which may be a processor or a controller, the processor or controller including instructions configured to execute instructions to perform tasks related to the electronic glasses 302 (including driving the integrated display 316 (see...)). Figure 3A The circuit of the SoC 326. Because the SoC 326 consumes power during operation, the SoC 326 and its first IC 324(1) generate heat due to energy loss. These energy losses are increased due to the improved performance of the first IC 324(1) (e.g., increased voltage and / or operating frequency), thereby generating additional heat and increased temperature on the body 304 of the electronic glasses 302. Therefore, in this example, as Figure 3B and Figure 3C As shown, a first piezoelectric device 332(1) fluidly connected to a first internal chamber 320(1) includes a first outlet 338(1). The first piezoelectric device 332(1) is configured to direct heated air 334(1) into the first internal chamber 320(1). Figure 3A The heated air 334(1) is directed from the first interior chamber 320(1) to the first outlet 338(1) and dissipated from the first outlet to dissipate from the electronic glasses 302. Now, let's discuss... Figure 3D This is illustrated in more detail in the text.

[0026] In this respect, Figure 3D yes Figure 3A The side view of the first temple 318(1) of the electronic glasses 302 illustrates the airflow of heated air 334(1) pumped from the first inner chamber 320(1) into the first inlet 340(1) and pumped out from the first outlet 338(1) by the first piezoelectric device 332(1). This causes the heated air 334(1) to dissipate from the first inner chamber 320(1) of the first temple 318(1) of the electronic glasses 302 to an area outside the electronic glasses 302. In order to provide an air supply to replace the heated air 334(1) pumped from the first outlet 338(1) of the first piezoelectric device 332(1), the electronic glasses 302 (and more specifically, its first temple 318(1)) includes a first air inlet 342(1) disposed in the body 304. The first air inlet 342(1) is fluidly coupled to the first inner chamber 320(1). In this example, the first air inlet 342(1) is provided by a natural leakage point surrounding the first hinge 344(1), which connects the first temple 318(1) to the frame 306 of the electronic glasses 302. Figure 3A In this manner, when the first piezoelectric device 332(1) pumps heated air 334(1) out of the first internal chamber 320(1), the first intake air 346(1) is drawn into the first internal chamber 320(1) as supplemental air through the first intake port 342(1). The first intake air 346(1) will initially have the temperature of the ambient air surrounding the first intake port 342(1). As the first intake air 346(1) is pumped by the first piezoelectric device 332(1), it will pass close to the first IC 324(1) in the first internal chamber 320(1) and be heated by the heat generated by the first IC 324(1). This provides convective cooling for the first IC 324(1). The first piezoelectric device 332(1) pumps the first heated air 334(1) out of the first inner chamber 320(1) and out of the first outlet 338(1) to dissipate the first heated air 334(1).

[0027] It should be noted that, although Figures 3B to 3D An example is shown of a first piezoelectric device 332(1) in fluid communication with a first inner chamber 320(1) in a first temple 318(1) to be able to pump first heated air 334(1) out of the first temple 318(1), but the piezoelectric device may also be provided in fluid communication with an inner chamber in a second temple 318(2) to be able to pump heated air out of the second temple 318(2).

[0028] It should also be noted that, although Figures 3B to 3DAn example is illustrated of a first piezoelectric device 332(1) in fluid communication with a first internal chamber 320(1) to be able to pump first heated air 334(1), but the same concept can also be applied to a second piezoelectric device 332(2) which is configured to be in fluid communication with the second internal chamber 320(2) of the electronic glasses 302 in the frame 306 and nose bridge 312, such as Figure 3A As shown. The same first piezoelectric device 332(1) and its components can also be used as the second piezoelectric device 332(2). As previously discussed, the second IC 324(2) can be incorporated into the second inner chamber 320(2) of the electronic glasses 302, wherein the second piezoelectric device 332(2) can pump the second heated air 334(2) generated by such second IC 324(2) out of the nose bridge 312 of the electronic glasses 302.

[0029] It should also be noted that Figure 3A The second inner chamber 320(2) of the electronic glasses 302 is fluidly connected to the first inner chamber 320(1). In this way, the second piezoelectric device 332(2) can be omitted if necessary, such that the first piezoelectric device 332(1) pumps second heated air 334(2) from the second inner chamber 320(2) into the first inner chamber 320(1) to dissipate the first temple 318(1) together with the first heated air 334(1). Alternatively, the first piezoelectric device 332(1) can be omitted, such that the second piezoelectric device 332(2) pumps first heated air 334(1) from the first inner chamber 320(1) into the second inner chamber 320(2) to dissipate the nose bridge 312 together with the second heated air 334(2). The electronic glasses 302 may include both the first IC 324(1) and the second IC 324(2), or only one of the first IC 324(1) and the second IC 324(2). Furthermore, multiple piezoelectric devices (such as the first piezoelectric device 332(1) and / or the second piezoelectric device 332(2)) may be fluidly coupled to the same internal chamber (such as the first internal chamber 320(1) and / or the second internal chamber 320(2)) to provide additional pumping power.

[0030] Return to reference Figure 3BIn this example, the electronic glasses 302 (and particularly its first temple 318(1)) may also include an integrated temperature sensor 348 configured to detect the temperature around the temperature sensor 348. The temperature sensor 348 may be coupled to a circuit board 322 or provided elsewhere in the electronic glasses 302. The first IC 324(1) and / or the second IC 324(2) may also include corresponding electronic control circuitry 350 electrically coupled to the temperature sensor 348 and the first piezoelectric device 332(1) and / or the second piezoelectric device 332(2). The electronic control circuitry 350 may be configured to implement the operation of the computing device 328. The electronic control circuit 350 can be configured to activate the operation of the first piezoelectric device 332(1) and / or the second piezoelectric device 332(2) when the computing device 328 operates to pump heated air 334(1), 334(2) out of the respective first internal chamber 320(1) and second internal chamber 320(2) to dissipate the heated air 334(1), 334(2).

[0031] Figure 4 This is a block diagram of an exemplary piezoelectric device 432, which may be incorporated into... Figures 3A to 3D The electronic glasses 302 include a first piezoelectric device 332(1) and / or a second piezoelectric device 332(2). In this example, the piezoelectric device 432 includes a housing 402 having an inlet 440 and an outlet 438. The inlet 440 is configured to connect to an internal chamber (such as...). Figures 3A to 3D The electronic glasses 302 in the housing 302 have a first inner chamber 320(1) and / or a second inner chamber 320(2) to draw in air 434. The piezoelectric device 432 is configured to pump air 434 from an inlet 440 disposed in the housing 402 to an outlet 438 disposed in the housing 402. As an example, the inlet 440 and the outlet 438 may be Figures 3A to 3D The electronic glasses 302 have corresponding first inlet 340(1) and second inlet 340(2) and first outlet 338(1) and second outlet 338(2) for the first piezoelectric device 332(1) and the second piezoelectric device 332(2). In this respect, in this example, Figure 4 The piezoelectric device 432 includes a piezoelectric element 404 disposed in an inner chamber 406 within the housing 402. For example, the piezoelectric element 404 may be a piezoelectric transducer or a crystal, which is a type of material that can convert voltage or signal into mechanical stress or pressure.

[0032] In response to an electrical signal 408, the piezoelectric element 404 is configured to vibrate to cause the pump chamber 412 to contract or compress and relax or recover to generate a pumping force. For example, the electrical signal 408 may be generated by... Figures 3A to 3DElectronic control circuitry 350 is generated in the electronic glasses 302. A piezoelectric element 404 is adjacent to and coupled to the pump chamber 412, such that mechanical stress or force generated by the piezoelectric element 404 is mechanically transmitted to the pump chamber 412. The pump chamber 412 is adjacent to the outlet 438 and may be an elastic, flexible material, such as (for example) a closed flexible membrane, allowing the pump chamber 412 to easily contract under stress and then expand when no stress is applied. This creates a pressure difference between the inlet 440 and the outlet 438 to pump the heated air 434 in the inner chamber 406 to the outlet 438 for dissipation.

[0033] The design of the piezoelectric device 432, incorporating the piezoelectric element 404 and the pump chamber 412, allows for a thinner form factor, making its integration into head-mounted electronic devices such as electronic glasses 302 more ergonomically feasible. Furthermore, the piezoelectric device 432 can maintain a small pressure differential and a low flow rate. The piezoelectric device 432 generates less noise than other types of purging devices, such as those with rotating blades, providing an improved user experience.

[0034] piezoelectric equipment (such as) Figures 3A to 3D and Figure 4 Piezoelectric devices 332(1), 332(2), 432) can also be used in head-mounted electronic devices (including such as Figures 3A to 3D The electronic glasses 302 are provided in other areas and arrangements.

[0035] In this respect, Figures 5A to 5C These are side views of temples 518(1)-518(3), which may be included in the presentation of electronic glasses (such as...). Figures 3A to 3D In a head-mounted electronic device in the form of electronic glasses 302, and may be incorporated one or more integrated piezoelectric devices configured to pump heated air, heated by heat generated from the IC, out of the internal chamber to dissipate air from the electronic glasses. For example, Figure 5A The temple 518(1) of the mirror includes a single piezoelectric device 532(1), which may be similar to piezoelectric devices 332(1), 332(2), 432. Figure 5B The temple 518(2) includes two (2) piezoelectric devices 532(2) and 532(3), which may be similar to piezoelectric devices 332(1), 332(2) and 432. Figure 5C The temple 518(3) includes four piezoelectric devices 532(4)-532(7), which may be similar to piezoelectric devices 332(1), 332(2), 432.

[0036] Different shape factors can also be provided for integration into head-mounted electronic devices (such as electronic glasses) for dissipating heated air using piezoelectric devices. For example, Figure 6A Examples are shown that are similar to Figures 3A to 3D The electronic glasses 302 and the electronic glasses 602 in the head-mounted electronic device 600 are in the form of head-mounted electronic devices. Figure 6A The electronic glasses 602 and Figures 3A to 3D The common components among the electronic glasses 302 are shown by common component numbers. For example... Figure 6A As shown, the electronic glasses 602 include a first piezoelectric device 632(1) that extends and is integrated into a first temple 318(1). The first piezoelectric device 632(1) and the second piezoelectric device 632(2) can be designed for imaging. Figures 3A to 3D and Figure 4 The piezoelectric devices 332(1), 332, and 432 in the piezoelectric device 632(1) and 632(2) are configured to deliver heat pumps to the corresponding first internal chamber 320(1) and second internal chamber 320(2).

[0037] Figure 6B-1 and Figure 6B-2 These are side views of temples 618(1) and 618(2), which may be included in electronic glasses (such as...) Figures 3A to 3D In a head-mounted electronic device in the form of electronic glasses 302, and may be combined with one or more integrated piezoelectric devices, such as Figure 6A Piezoelectric devices 632(1) and 632(2) are included. For example, Figure 6B-1 The temple 618(1) of the mirror includes a single piezoelectric device 632(3), which can be similar to Figure 6A The piezoelectric devices 632(1) and 632(2) are included. Figure 6B-2 The temple 618(2) of the mirror includes two (2) piezoelectric devices 632(4) and 632(5), which can be similar to Figure 6A The piezoelectric devices 632(1) and 632(2) are included.

[0038] It should be noted that components described in this document as "mounted," "coupled," and "set on" are not limited to components that are directly or indirectly attached or coupled. It should also be noted that, as discussed herein, "adjacent" objects refer to objects being next to or close to another stated object. Adjacent objects may not be directly physically coupled to each other. Objects may be directly adjacent to another object, meaning that such objects are directly next to or adjacent to another object, without any other object or layer situated between the directly adjacent objects. Objects may be indirectly or indirectly adjacent to another object, meaning that such objects are not directly next to or close to each other, but rather with an intermediate object or layer situated between the non-directly adjacent objects.

[0039] Includes one or more piezoelectric devices (including, but not limited to, those configured to pump heated air, heated by heat generated from an IC in a head-mounted electronic device, out of an internal chamber to dissipate air from the head-mounted electronic device). Figures 3A to 3D , Figures 5A to 5B and Figures 6A to 6B-2 Head-mounted electronic devices (including but not limited to piezoelectric devices 332(1), 332(2), 432, 532(1)-532(7), 632(1)-632(5)) of the piezoelectric devices 332(1), 332(2), 432, 532(1)-532(7), 632(1)-632(5)) Figures 3A to 3D , Figures 5A to 5B and Figures 6A to 6B-2 The head-mounted electronic devices 300, 600 and / or their temples 318(1)-318(2), 518(1)-518(3), 618(1), 618(2)) (and according to any exemplary aspect discussed herein) may be provided in or integrated into any processor-based device. Examples of head-mounted electronic devices include, but are not limited to, electronic glasses, including XR glasses, head-mounted display devices, electronic watches, set-top boxes, entertainment units, navigation devices, communication devices, fixed location data units, mobile location data units, Global Positioning System (GPS) devices, mobile phones, cellular phones, smartphones, Session Initiation Protocol (SIP) phones, tablet devices, tablet phones, servers, computers, portable computers, mobile computing devices, laptops, wearable computing devices (e.g., smartwatches, health or fitness trackers, glasses, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, and automotive and vehicle components.

[0040] In this respect, Figure 7 An example is an electronic device in the form of a processor-based system 700, which can be incorporated into one or more piezoelectric devices 703 (including, but not limited to, those configured to pump heated air heated by heat generated from an IC) that are heated by heat generated from an IC. Figures 3A to 3D , Figures 5A to 5B and Figures 6A to 6B-2 The head-mounted electronic device 702 of the piezoelectric devices 332(1), 332(2), 432, 532(1)-532(7), 632(1)-632(5)) (including but not limited to) Figures 3A to 3D , Figures 5A to 5B and Figures 6A to 6B-2In the head-mounted electronic devices 300, 600 and / or their temples 318(1)-318(2), 518(1)-518(3), 618(1), 618(2)).

[0041] refer to Figure 7 The processor-based system 700 can be configured as IC 704 (this IC can be...) Figures 3A to 3D The first IC 324(1) and / or the second IC 324(2) are formed as part of an IC package such as a system-on-a-chip (SoC) 706. The processor-based system 700 includes a central processing unit (CPU) 708, which includes one or more processors 710, which may also be referred to as a CPU core or processor core. The CPU 708 may be similar to... Figures 3A to 3D The computing device 328 is a computing device and can be configured to control the activation of the piezoelectric device 703 to pump air for dissipation from the head-mounted electronic device 702. The CPU 708 may have a cache memory 712 coupled to the CPU 708 for fast access to temporarily stored data. The CPU 708 is coupled to a system bus 714 and may be coupled to master and slave devices included in the processor-based system 700. As is well known, the CPU 708 communicates with these other devices by exchanging address, control, and data information via the system bus 714. For example, the CPU 708 may communicate a bus transaction request to a memory controller 716, which is an example of a slave device. Although in Figure 7 Not illustrated, but multiple system buses 714 may be provided, each of which constitutes a different architecture.

[0042] Other master and slave devices can be connected to system bus 714. For example... Figure 7 As illustrated, these devices may include a memory system 720 (which includes a memory controller 716 and a memory array 718), one or more input devices 722, one or more output devices 724 (which may include or be coupled to a piezoelectric device 703), one or more network interface devices 726, and one or more display controllers 728. Input devices 722 may include any type of input device, including but not limited to input keys, switches, voice processors, etc. Output devices 724 may include any type of output device, including but not limited to audio, video, other visual indicators, etc. Network interface device 726 may be any device configured to allow data exchange to and from network 730. Network 730 may be any type of network, including but not limited to wired or wireless networks, private or public networks, local area networks (LANs), wireless local area networks (WLANs), wide area networks (WANs), and Bluetooth.™ Networks and the Internet. The network interface device 726 can be configured to support any type of communication protocol desired.

[0043] CPU 708 can also be configured to access display controller 728 via system bus 714 to control information transmitted to one or more displays 732. Display controller 728 transmits information to be displayed to displays 732 via one or more video processors 734, which process the information into a format suitable for use by displays 732. Displays 732 may include any type of display, including but not limited to cathode ray tube (CRT), liquid crystal display (LCD), plasma display, light-emitting diode (LED) display, etc.

[0044] Figure 8 This illustrates the use of electronic devices from head-mounted electronic devices (including but not limited to...) Figures 3A to 3D , Figures 5A to 5B and Figures 6A to 6B-2 A flowchart of an exemplary process 800 for heat dissipation of a head-mounted electronic device 300, 600 and / or its temples 318(1)-318(2), 518(1)-518(3), 618(1), 618(2)), wherein the electronic device may include an IC, the IC including a computing device that controls piezoelectric devices (including but not limited to...) Figures 3A to 3D , Figures 5A to 5B and Figures 6A to 6B-2 The piezoelectric devices 332(1), 332(2), 432, 532(1)-532(7), 632(1)-632(5) in the device pump heated air generated from the IC out of the internal chamber to dissipate air from the head-mounted electronic device.

[0045] In this regard, reference will be made Figures 3A to 3D Let's discuss the electronic glasses 302. Figure 8 The process 800 is described herein, but it should be noted that process 800 can also be used in other head-mounted electronic devices disclosed herein. In this regard, the first step in process 800 includes operating ICs 324(1), 324(2) such that ICs 324(1), 324(2) generate heat in the inner chambers 320(1), 320(2) to heat the air 334(1), 344(2) in the inner chambers 320(1), 320(2). Figure 8 (See box 802 in the text). The next step in process 800 includes generating an electrical signal 408 to piezoelectric devices 332(1), 332(2) to cause piezoelectric devices 332(1), 332(2) to dissipate heated air 334(1), 344(2) in inner chambers 320(1), 320(2) to outlets 338(1), 338(2). Figure 8(Box 804 in the middle).

[0046] Those skilled in the art will further understand that the various exemplary logic blocks, modules, circuits, and algorithms described in connection with the aspects disclosed herein can be implemented as electronic hardware, stored in memory or another computer-readable medium and executed by a processor or other processing device, or a combination of both. The memory disclosed herein can be of any type and size and can be configured to store any type of information desired. To clearly illustrate this interchangeability, the functionality of the various exemplary components, blocks, modules, circuits, and steps has been generally described above. How such functionality is implemented depends on the specific application, design choices, and / or design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such specific implementation decisions should not be construed as departing from the scope of this disclosure.

[0047] The various exemplary logic blocks, modules, and circuits described in conjunction with the aspects disclosed herein may be implemented or executed using a processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic unit, discrete hardware component, or any combination thereof, designed to perform the functions described herein. The processor may be a microprocessor, but in alternative embodiments, it may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors cooperating with a DSP core, or any other such configuration).

[0048] The aspects disclosed herein may be embodied in hardware and instructions stored in the hardware, and may reside in, for example, random access memory (RAM), flash memory, read-only memory (ROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), registers, hard disks, removable disks, CD-ROMs, or any other form of computer-readable medium known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Alternatively, the storage medium may be integral with the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a remote station. Alternatively, the processor and storage medium may reside as discrete components in a remote station, base station, or server.

[0049] It should also be noted that the operational steps described in any of the exemplary aspects of this document are described for the purpose of providing examples and discussion. The described operations may be performed in many different orders other than the order illustrated. Furthermore, the operations described in a single operational step may actually be performed in multiple different steps. Additionally, one or more operational steps discussed in the exemplary aspects may be combined. It should be understood that, as will be apparent to those skilled in the art, many different modifications may be made to the operational steps illustrated in the flowcharts. Those skilled in the art will also understand that any of a variety of different techniques and arts can be used to represent information and signals. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0050] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein can be applied to other variations. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0051] Specific implementation examples are described in the following numbered clauses: 1. A head-mounted electronic device, the head-mounted electronic device comprising: The main body includes a first internal chamber; A first integrated circuit (IC) is integrated into the body and is in fluid communication with the first internal chamber; and A first piezoelectric device, the first piezoelectric device including a first inlet and a first outlet, the first inlet being in fluid communication with the first internal chamber; in: The first IC is configured to generate heat to heat the air in the first internal chamber; and The first piezoelectric device is configured to dissipate the air in the first inner chamber to the first outlet.

[0052] 2. The head-mounted electronic device according to Clause 1, wherein the main body further includes a second internal chamber, and the head-mounted electronic device further includes: The second piezoelectric device includes a second inlet and a second outlet, the second inlet being in fluid communication with the second internal chamber; The second piezoelectric device is configured to dissipate air in the second inner chamber to the second outlet.

[0053] 3. The head-mounted electronic device according to Clause 1, the head-mounted electronic device further comprising a second piezoelectric device, the second piezoelectric device comprising a second inlet and a second outlet, the second inlet being in fluid communication with the first internal chamber; The second piezoelectric device is configured to dissipate air in the first inner chamber to the second outlet.

[0054] 4. The head-mounted electronic device according to any one of clauses 1 to 3, wherein the head-mounted electronic device further includes an air inlet in the main body; The first piezoelectric device is configured to draw air from outside the head-mounted electronic device through the air inlet into the first internal chamber.

[0055] 5. The head-mounted electronic device according to any one of clauses 1 to 4, wherein the head-mounted electronic device further comprises an outer surface; and

[0056] The first outlet is connected to the outer surface of the head-mounted electronic device.

[0057] 6. The head-mounted electronic device according to any one of clauses 1 to 5, wherein the first piezoelectric device comprises: Housing, wherein the first outlet is disposed through the housing; and A piezoelectric element, wherein the piezoelectric element is located within the housing; The piezoelectric element is configured to vibrate in response to an electrical signal to generate a pressure difference between the first inlet and the first outlet, thereby pumping air from the first inner chamber to the first outlet.

[0058] 7. The head-mounted electronic device according to Clause 6, wherein: The first piezoelectric device includes a pump chamber adjacent to the first outlet; The piezoelectric element is adjacent to and in contact with the pump chamber; and The piezoelectric element is configured to vibrate in response to the electrical signal to vibrate the pump chamber to generate the pressure difference between the first inlet and the first outlet, thereby pumping the air in the first inner chamber to the first outlet.

[0059] 8. The head-mounted electronic device according to Clause 7, wherein the pump chamber comprises a closed flexible membrane.

[0060] 9. A head-mounted electronic device according to any one of clauses 1 to 8, wherein the main body includes electronic glasses, the electronic glasses comprising: The picture frame includes: Nose bridge; A first lens holder, the first lens holder being located on a first side of the nose bridge; and The second lens holder is located on the second side of the nose bridge opposite to the first side; The first temple is attached to the frame on the third side of the first lens holder; and The second temple is attached to the frame on the fourth side of the second lens holder, opposite to the third side.

[0061] 10. The head-mounted electronic device according to Clause 9, wherein the electronic glasses further comprises a first hinge connecting the first temple to the frame and an air inlet in the first hinge; The first piezoelectric device is configured to draw air from outside the head-mounted electronic device through the air inlet into the first internal chamber.

[0062] 11. The head-mounted electronic device according to clause 9 or 10, wherein the first temple includes the first inner chamber.

[0063] 12. The head-mounted electronic device according to Clause 11, wherein the first IC is integrated inside the first temple.

[0064] 13. The head-mounted electronic device according to Clause 11, wherein the first IC is integrated in the nose bridge and the nose bridge is in fluid contact with the first internal chamber.

[0065] 14. The head-mounted electronic device according to Clause 9 or 12, wherein the nose bridge includes the first internal chamber.

[0066] 15. The head-mounted electronic device according to Clause 14, wherein the first IC is integrated in the nose bridge.

[0067] 16. The head-mounted electronic device according to Clause 14 or 15, wherein the first IC is integrated in the first temple and the first temple is in fluid contact with the first internal chamber.

[0068] 17. The head-mounted electronic device according to any one of clauses 1 to 16, wherein the first IC includes a computing device.

[0069] 18. The head-mounted electronic device according to any one of Clauses 1 to 17, wherein the head-mounted electronic device is integrated into a device selected from the group consisting of: electronic glasses; extended reality (XR) glasses; head-mounted display devices; electronic watches; set-top boxes; entertainment units; navigation devices; communication devices; fixed location data units; mobile location data units; global positioning system (GPS) devices; mobile phones; cellular phones; smartphones; session initiation protocol (SIP) phones; tablet computers; tablet phones; servers; computers; portable computers; mobile computing devices; wearable computing devices; desktop computers; personal digital assistants (PDAs); monitors; computer monitors; televisions; tuners; radios; satellite radios; music players; digital music players; portable music players; digital video players; video players; digital video disc (DVD) players; portable digital video players; automobiles; and vehicle components.

[0070] 19. A method for dissipating heat from a head-mounted electronic device, the head-mounted electronic device comprising: The main body includes an internal chamber; Integrated circuit (IC), said integrated circuit (IC) being integrated into the body and in fluid communication with the internal chamber; and A piezoelectric device, the piezoelectric device including an inlet and an outlet, the inlet being in fluid communication with the internal chamber; A temperature sensor, coupled to the head-mounted electronic device; and An electronic control circuit, which is electrically coupled to the temperature sensor and the piezoelectric device; The method includes the electronic control circuit: Operate the IC such that it generates heat in the internal chamber to heat the air in the internal chamber; and An electrical signal is generated to the piezoelectric device to cause the piezoelectric device to dissipate the heated air in the inner chamber to the outlet.

[0071] 20. The method according to Clause 19, wherein the body further includes an air inlet; Generating the electrical signal includes generating the electrical signal to the piezoelectric device so that the piezoelectric device draws air from outside the head-mounted electronic device from the air inlet into the inner chamber and dissipates the heated air in the inner chamber to the outlet.

[0072] 21. The method according to Clause 20, wherein the piezoelectric device comprises: Housing, wherein the outlet is disposed through the housing; and A piezoelectric element, wherein the piezoelectric element is located within the housing; Generating the electrical signal includes generating the electrical signal to the piezoelectric element to cause the piezoelectric element to vibrate and create a pressure difference between the inlet and the outlet, thereby pumping air from the inner chamber to the outlet.

[0073] 22. The method according to Clause 21, wherein: The piezoelectric device includes a pump chamber adjacent to the outlet; and The piezoelectric element is adjacent to and in contact with the pump chamber; Generating the electrical signal includes generating the electrical signal to the piezoelectric element to cause the piezoelectric element to vibrate the pump chamber to generate the pressure difference between the inlet and the outlet, thereby pumping air from the inner chamber to the outlet.

[0074] 23. The method according to any one of clauses 19 to 22, wherein the subject comprises electronic glasses, the electronic glasses comprising: The picture frame includes: Nose bridge; A first lens holder, the first lens holder being located on a first side of the nose bridge; and The second lens holder is located on the second side of the nose bridge opposite to the first side; The first temple is attached to the frame on the third side of the first lens holder; and The second temple is attached to the frame on the fourth side of the second lens holder, opposite to the third side.

[0075] 24. The method according to Clause 23, wherein the electronic glasses further comprises a first hinge connecting the first temple to the frame and an air inlet in the first hinge; Generating the electrical signal includes generating the electrical signal to the piezoelectric device so that the piezoelectric device draws air from outside the head-mounted electronic device from the air inlet into the inner chamber and dissipates the heated air in the inner chamber to the outlet.

Claims

1. A head-mounted electronic device, the head-mounted electronic device comprising: a body, the body comprising a first internal chamber; a first integrated circuit (IC), the first integrated circuit (IC) integrated into the body and in fluid communication with the first internal chamber; and a first piezoelectric device, the first piezoelectric device comprising a first inlet and a first outlet, the first inlet in fluid communication with the first internal chamber; wherein: the first IC is configured to generate heat to heat air in the first internal chamber; and the first piezoelectric device is configured to dissipate the air in the first internal chamber to the first outlet.

2. The head-mounted electronic device of claim 1, wherein the body further comprises a second internal chamber, and the head-mounted electronic device further comprises: a second piezoelectric device, the second piezoelectric device comprising a second inlet and a second outlet, the second inlet in fluid communication with the second internal chamber; wherein the second piezoelectric device is configured to dissipate air in the second internal chamber to the second outlet.

3. The head-mounted electronic device of claim 1, the head-mounted electronic device further comprising a second piezoelectric device, the second piezoelectric device comprising a second inlet and a second outlet, the second inlet in fluid communication with the first internal chamber; wherein the second piezoelectric device is configured to dissipate air in the first internal chamber to the second outlet.

4. The head-mounted electronic device of claim 1, the head-mounted electronic device further comprising an air intake in the body; wherein the first piezoelectric device is configured to draw air from outside the head-mounted electronic device from the air intake into the first internal chamber.

5. The head-mounted electronic device of claim 1, the head-mounted electronic device further comprising an outer surface; and wherein the first outlet is coupled to the outer surface of the head-mounted electronic device.

6. The head-mounted electronic device of claim 1, wherein the first piezoelectric device comprises: a housing, wherein the first outlet is disposed through the housing; and a piezoelectric element, the piezoelectric element located in the housing; wherein the piezoelectric element is configured to vibrate in response to an electrical signal to create a pressure differential between the first inlet and the first outlet to pump air in the first internal chamber to the first outlet.

7. The head-mounted electronic device of claim 6, wherein: the first piezoelectric device comprises a pump chamber adjacent to the first outlet; the piezoelectric element is adjacent to and in contact with the pump chamber; and the piezoelectric element is configured to vibrate in response to the electrical signal to vibrate the pump chamber to create the pressure differential between the first inlet and the first outlet to pump the air in the first internal chamber to the first outlet.

8. The head-mounted electronic device of claim 7, wherein the pump chamber comprises a closed, flexible membrane.

9. The head-mounted electronic device of claim 1, wherein the body comprises electronic eyeglasses, the electronic eyeglasses comprising: an eyeglass frame, the eyeglass frame comprising: a nose bridge; ​ ​ a first lens support on a first side of the nose bridge; and a second lens support on a second side of the nose bridge opposite the first side; a first temple coupled to the frame on a third side of the first lens support; and a second temple coupled to the frame on a fourth side of the second lens support opposite the third side.

10. The head-mounted electronic device of claim 9, wherein the electronic eyeglasses further comprise a first hinge coupling the first temple to the frame and an air inlet in the first hinge; wherein the first piezoelectric device is configured to draw air from outside the head-mounted electronic device into the first interior chamber from the air inlet.

11. The head-mounted electronic device of claim 9, wherein the first temple comprises the first interior chamber.

12. The head-mounted electronic device of claim 11, wherein the first IC is integrated inside the first temple.

13. The head-mounted electronic device of claim 11, wherein the first IC is integrated in the nose bridge and the nose bridge is in fluid contact with the first interior chamber.

14. The head-mounted electronic device of claim 9, wherein the nose bridge comprises the first interior chamber.

15. The head-mounted electronic device of claim 14, wherein the first IC is integrated in the nose bridge.

16. The head-mounted electronic device of claim 14, wherein the first IC is integrated in the first temple and the first temple is in fluid contact with the first interior chamber.

17. The head-mounted electronic device of claim 1, wherein the first IC comprises a computing device.

18. The head-mounted electronic device of claim 1, integrated into a device selected from a group consisting of: an electronic eyeglass; an extended reality (XR) eyeglass; a head-mounted display device; an electronic watch; a set-top box; an entertainment unit; a navigation device; a communications device; a fixed location data unit; a mobile location data unit; a global positioning system (GPS) device; a mobile phone; a cellular phone; a smart phone; a session initiation protocol (SIP) phone; a tablet; a phablet; a server; a computer; a portable computer; a mobile computing device; a wearable computing device; a desktop computer; a personal digital assistant (PDA); a monitor; a computer monitor; a television; a tuner; a radio; a satellite radio; a music player; a digital music player; a portable music player; a digital video player; a video player; a digital video disc (DVD) player; a portable digital video player; an automobile; and a transportation component.

19. A method of dissipating heat from a head-mounted electronic device, the head-mounted electronic device comprising: a body comprising an interior chamber; an integrated circuit (IC) integrated into the body and in fluid communication with the interior chamber; and a piezoelectric device comprising an inlet and an outlet, the inlet being in fluid communication with the internal chamber; a temperature sensor coupled to the head-wearable electronic device; and an electronic control circuit electrically coupled to the temperature sensor and the piezoelectric device; the method comprising the electronic control circuit: operating the IC such that the IC generates heat in the internal chamber to heat air in the internal chamber; and generating an electrical signal to the piezoelectric device to cause the piezoelectric device to dissipate the heated air in the internal chamber to the outlet.

20. The method of claim 19, wherein the body further comprises an air intake; wherein generating the electrical signal comprises generating the electrical signal to the piezoelectric device to cause the piezoelectric device to draw air from outside the head-wearable electronic device into the internal chamber from the air intake and to dissipate the heated air in the internal chamber to the outlet.

21. The method of claim 20, wherein the piezoelectric device comprises: a housing, wherein the outlet is disposed through the housing; and a piezoelectric element located in the housing; wherein generating the electrical signal comprises generating the electrical signal to the piezoelectric element to cause the piezoelectric element to vibrate to create a pressure differential between the inlet and the outlet to pump air in the internal chamber to the outlet.

22. The method of claim 21, wherein: the piezoelectric device comprises a pump chamber adjacent to the outlet; and the piezoelectric element is adjacent to and in contact with the pump chamber; wherein generating the electrical signal comprises generating the electrical signal to the piezoelectric element to cause the piezoelectric element to vibrate the pump chamber to create the pressure differential between the inlet and the outlet to pump air in the internal chamber to the outlet.

23. The method of claim 19, wherein the body comprises electronic eyeglasses comprising: a frame comprising: a nose bridge; a first lens holder located on a first side of the nose bridge; and a second lens holder located on a second side of the nose bridge opposite the first side; a first temple coupled to the frame on a third side of the first lens holder; and a second temple coupled to the frame on a fourth side of the second lens holder opposite the third side.

24. The method of claim 23, wherein the electronic eyeglasses further comprise a first hinge coupling the first temple to the frame and an air intake in the first hinge; wherein generating the electrical signal comprises generating the electrical signal to the piezoelectric device to cause the piezoelectric device to draw air from outside the head-wearable electronic device into the internal chamber from the air intake and to dissipate the heated air in the internal chamber to the outlet. ​

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