Glue uniformizing CUP tank cleaning device and glue uniformizing CUP tank cleaning method

Abstract

The invention provides a spin coating CUP tank cleaning device and a spin coating CUP tank cleaning method, and relates to the technical field of spin coating. The spin coating CUP tank cleaning device comprises a CUP tank base, a protective cover and a vacuum adsorption bearing table, the protective cover and the vacuum adsorption bearing table are arranged in the CUP tank base, the upper cover is arranged at the opening end of the CUP tank base, at least one cleaning pipeline is arranged on the inner wall of the upper cover, the cleaning pipeline extends in the circumferential direction of the upper cover to be in a ring shape, and the cleaning mechanism is arranged on the cleaning pipeline in the circumferential direction of the cleaning pipeline. A plurality of cleaning spray holes communicated with the cleaning pipeline are uniformly formed in the side wall of the cleaning pipeline at intervals, and the plurality of cleaning spray holes are configured to clean the upper cover and the CUP tank base; the cleaning mechanism communicates with the cleaning pipeline and is used for conveying cleaning liquid medicine to the cleaning pipeline. According to the spin coating CUP tank cleaning device, automatic cleaning of the upper cover and the CUP tank base can be completed, the cleaning range is guaranteed, the cleaning convenience is improved, and the using effect of the spin coating CUP tank cleaning device is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of spin coating technology, and in particular to a spin coating CUP tank cleaning device and a spin coating CUP tank cleaning method. Background Technology

[0002] Patterned Sapphire Substrate (PSS) is a process that creates microscopic patterns on the surface of a sapphire substrate. The PSS process includes cleaning, photoresist coating, photolithography, development, and etching. During the photoresist coating process, excess photoresist is thrown into the spin coater during high-speed spin coating. Over long production runs, a large amount of photoresist accumulates in the spin coater, which not only affects substrate yield and increases particle and pattern loss defects, but also clogs the waste outlet and exhaust vent of the spin coater base, reducing airflow. Therefore, the spin coater needs to be disassembled and cleaned regularly.

[0003] Most existing spin coater cup cleaning devices typically rely on manual disassembly by operators. After soaking in acetone, manual disassembly and cleaning not only wastes manpower but also affects the back spray piping after cleaning, potentially causing defects at the product edges. Furthermore, acetone is highly volatile and has a pungent odor, increasing discomfort for operators. While some spin coater cup cleaning devices have fixed supports with nozzles for cleaning, these supports are often located directly above the center of the base, making it difficult to cover the inner wall of the top cover and the edge of the base. This results in incomplete cleaning and may also interfere with the wafer adsorption platform, affecting the overall performance of the spin coater cup cleaning device and compromising cleaning convenience. Summary of the Invention

[0004] The purpose of this invention is to provide a CUP tank cleaning device that can automatically clean the top cover and CUP tank base, ensuring the cleaning range, improving cleaning convenience, and ensuring the effectiveness of the CUP tank cleaning device itself.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A spin coating cup tank cleaning device includes a cup tank base, a protective cover and a vacuum adsorption support stage disposed within the cup tank base, and the spin coating cup tank cleaning device further includes:

[0007] The top cover is disposed at the open end of the CUP tank base. The inner wall of the top cover is provided with at least one cleaning pipe. The cleaning pipe extends in a ring shape along the circumference of the top cover. Along the circumference of the cleaning pipe, the side wall of the cleaning pipe is evenly spaced with a plurality of cleaning spray holes, all of which are connected to the cleaning pipe. The plurality of cleaning spray holes are configured to clean the top cover and the CUP tank base.

[0008] A cleaning mechanism, connected to the cleaning pipeline, is used to deliver cleaning solution to the cleaning pipeline.

[0009] As a further technical solution, the upper cover is cylindrical, the lower end of the upper cover is connected to the CUP slot base, and the upper end of the upper cover is bent inward and contracted.

[0010] The cleaning pipeline is provided in two parts, namely a first cleaning pipeline and a second cleaning pipeline. The first cleaning pipeline is located at the upper end of the top cover and has a plurality of first cleaning nozzles evenly spaced on it. All of the first cleaning nozzles are configured to clean the top cover. The second cleaning pipeline is located at the lower end of the top cover and has a plurality of second cleaning nozzles evenly spaced on it. All of the second cleaning nozzles are configured to clean the CUP tank base.

[0011] As a further technical solution, the angle between the axis of the plurality of first cleaning nozzles and the upper inner wall of the top cover is an acute angle, and the angle between the axis of the plurality of second cleaning nozzles and the upper inner wall of the top cover is an acute angle.

[0012] As a further technical solution, the upper cover is cylindrical, the lower end of the upper cover is connected to the CUP slot base, and the upper end of the upper cover is bent inward and contracted.

[0013] The cleaning pipeline is configured as a third cleaning pipeline and is located in the middle of the upper cover. Along the circumference of the upper cover, a plurality of third cleaning nozzles are evenly spaced on the upper side of the third cleaning pipeline, and a plurality of fourth cleaning nozzles are evenly spaced on the lower side of the third cleaning pipeline. The plurality of third cleaning nozzles are configured to clean the upper end of the upper cover, and the plurality of fourth cleaning nozzles are configured to clean the lower end of the upper cover and the CUP slot base.

[0014] As a further technical solution, the third cleaning nozzle and the fourth cleaning nozzle are offset along the circumference of the third cleaning pipeline.

[0015] As a further technical solution, the distance between two adjacent cleaning nozzles is less than or equal to 2 mm, and the diameter of each cleaning nozzle is less than or equal to 0.2 mm.

[0016] As a further technical solution, the cleaning mechanism includes a liquid-passing pipe and a liquid storage tank. The two ends of the liquid-passing pipe are respectively connected to the cleaning pipeline and the liquid storage tank, and a first valve is provided on the liquid-passing pipe.

[0017] As a further technical solution, the cleaning mechanism also includes a vent pipe and a second valve. The first end of the vent pipe is disposed on the top wall of the liquid storage tank and communicates with the liquid storage tank. The second valve is disposed on the vent pipe, and the second section of the vent pipe is configured to communicate with an external gas filling device.

[0018] A method for cleaning a spin coater cup, applied to the aforementioned spin coater cup cleaning apparatus, comprising the following steps:

[0019] S1, Observe and determine the working status of the CUP slot base and top cover;

[0020] S2, determine whether the current state meets the cleaning setting based on the observation results. If not, proceed to S1; if yes, proceed to S3.

[0021] S3, open the first valve and deliver cleaning solution into the cleaning pipeline to clean the CUP tank base and the top cover;

[0022] S4, observe the condition of the CUP tank base and the top cover until the cleaning effect of the CUP tank base and the top cover reaches the preset value, and then close the first valve.

[0023] As a further technical solution, the CUP tank cleaning method is set to automatic cleaning or manual cleaning;

[0024] The set states include: the operation time reaches a set time, the number of operations reaches a set number, the exhaust volume of the exhaust channel on the CUP tank base reaches a set value, and the product processing on the vacuum adsorption support platform reaches a specific step.

[0025] Compared with the prior art, the spin coater CUP tank cleaning device and spin coater CUP tank cleaning method provided in this embodiment of the invention have the following technical advantages:

[0026] 1. The inner wall of the top cover is equipped with at least one cleaning pipe, which extends circumferentially around the top cover in a ring shape. Along the circumference of the cleaning pipe, multiple cleaning nozzles, all connected to the cleaning pipe, are evenly spaced on its sidewalls. The cleaning mechanism is also connected to the cleaning pipe to deliver cleaning solution. Therefore, when cleaning the CUP tank base and top cover is required, it is not necessary to disassemble the CUP tank cleaning device; the cleaning mechanism only needs to deliver cleaning solution to the cleaning pipe. Specifically, after the cleaning mechanism delivers cleaning solution to the cleaning pipe, the solution enters the pipe and is sprayed onto the top cover and CUP tank base through multiple cleaning nozzles. This provides close-range rinsing of the inner wall of the top cover, while the multiple circumferentially positioned cleaning nozzles form a ring-shaped spray area corresponding to the CUP tank base for spray cleaning. The entire cleaning process involves several key steps. First, the cleaning pipeline and cleaning mechanism effectively clean the top cover and CUP tank base, eliminating the need for manual disassembly of the spin coating CUP tank cleaning device. This reduces labor costs and avoids operator discomfort caused by the evaporation of cleaning solutions. Second, the multiple cleaning nozzles, evenly spaced circumferentially along the cleaning pipeline, ensure a consistent spray density across the inner wall of the top cover and the CUP tank base. This prevents uneven spray distribution from causing insufficient rinsing pressure in certain areas and incomplete removal of residual photoresist, thus guaranteeing effective cleaning. Finally, because the cleaning pipeline is located on the inner wall of the top cover, interference between the cleaning pipeline and the vacuum adsorption stage is avoided during lifting, lowering, and rotating. This ensures stable device operation during the switching between spin coating and cleaning processes, preventing substrate yield degradation due to interference and ensuring the optimal performance of the spin coating CUP tank cleaning device.

[0027] 2. The entire cleaning process is as follows: First, observe and determine the operating status of the CUP tank base and top cover. Only when the operating status of the CUP tank base meets the set conditions will the first valve be opened to deliver cleaning solution to the cleaning pipeline for cleaning the CUP tank base and top cover. Then, observe the CUP tank base and top cover again until the cleaning effect reaches the set value, at which point the first valve is closed. This setup allows for adaptive cleaning operations based on the operating status of the CUP tank base and top cover, and the amount of cleaning solution delivered to the cleaning pipeline can be adjusted by changing the opening degree of the first valve. The first valve is then closed based on the actual cleaning effect. This ensures cleaning convenience while improving cleaning effectiveness. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0029] Figure 1 This is a simplified cross-sectional view of the CUP tank cleaning device provided in an embodiment of the present invention;

[0030] Figure 2 yes Figure 1 A magnified view of a section at point A in the middle;

[0031] Figure 3 yes Figure 1 A magnified view of a section at point B in the middle;

[0032] Figure 4 This is a partial cross-sectional schematic diagram of the CUP tank cleaning device provided in an embodiment of the present invention.

[0033] In the picture:

[0034] 10. CUP tank base; 11. Drainage channel; 12. Exhaust channel; 20. Protective cover; 30. Vacuum adsorption support platform;

[0035] 100. Top cover; 101. First cover section; 102. Second cover section; 103. Third cover section; 110. First cleaning pipe; 111. First cleaning nozzle; 120. Second cleaning pipe; 121. Second cleaning nozzle;

[0036] 200. Cleaning mechanism; 210. Liquid inlet pipe; 211. First auxiliary pipe; 212. Second auxiliary pipe; 220. Liquid storage tank; 230. First valve; 240. Vent pipe; 250. Second valve. Detailed Implementation

[0037] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0038] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0039] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0040] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0041] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​that do not use relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0042] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0043] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0044] Combination Figures 1 to 4 As shown, this embodiment provides a CUP tank cleaning device, which can automatically clean the upper cover 100 and the CUP tank base 10, ensuring the cleaning range and the effectiveness of the device itself. Specifically, the CUP tank cleaning device includes a CUP tank base 10, a protective cover 20 and a vacuum adsorption support platform 30 disposed within the CUP tank base 10, and also includes an upper cover 100 and a cleaning mechanism 200: the upper cover 100 is disposed at the open end of the CUP tank base 10, and at least one cleaning pipe is provided on the inner wall of the upper cover 100. The cleaning pipe extends in a ring shape along the circumference of the upper cover 100. Along the circumference of the cleaning pipe, multiple cleaning nozzles are evenly spaced on the side wall of the cleaning pipe, each communicating with the cleaning pipe. The multiple cleaning nozzles are configured to clean the upper cover 100 and the CUP tank base 10; the cleaning mechanism 200 is connected to the cleaning pipe and is used to deliver cleaning solution to the cleaning pipe.

[0045] Since the inner wall of the top cover 100 is provided with at least one cleaning pipe, which extends in a ring shape along the circumference of the top cover 100, and multiple cleaning nozzles, all connected to the cleaning pipe, are evenly spaced along the circumference of the cleaning pipe, and the cleaning mechanism 200 is connected to the cleaning pipe for supplying cleaning solution to the cleaning pipe, when it is necessary to clean the CUP tank base 10 and the top cover 100, it is not necessary to disassemble the CUP tank cleaning device; only the cleaning mechanism 200 needs to supply cleaning solution to the cleaning pipe. Specifically, after the cleaning mechanism 200 supplies cleaning solution to the cleaning pipe, the cleaning solution enters the cleaning pipe and is sprayed onto the top cover 100 and the CUP tank base 10 through multiple cleaning nozzles on the cleaning pipe to rinse the inner wall of the top cover 100 at close range. At the same time, the multiple circumferentially arranged cleaning nozzles form an annular spray area corresponding to the CUP tank base 10 for spray cleaning of the CUP tank base 10. Throughout the cleaning process, firstly, the top cover 100 and the CUP tank base 10 are cleaned using the cleaning pipeline and cleaning mechanism 200, eliminating the need for manual disassembly of the spin coating CUP tank cleaning device. This not only reduces labor costs but also avoids discomfort to operators caused by the evaporation of cleaning solutions. Secondly, because multiple cleaning nozzles are evenly spaced along the circumference of the cleaning pipeline, a consistent spray density is achieved between the cleaning pipeline and the inner wall of the top cover 100 and the CUP tank base 10. This avoids problems such as insufficient rinsing pressure in localized areas and incomplete removal of residual photoresist due to uneven spray distribution, thus ensuring the cleaning effect. Finally, since the cleaning pipeline is located on the inner wall of the top cover 100, interference between the cleaning pipeline and the vacuum adsorption support stage 30 is avoided when the vacuum adsorption support stage 30 is raised, lowered, or rotated. This ensures stable operation of the device when switching between the spin coating and cleaning processes, preventing a decrease in substrate yield due to interference and thus guaranteeing the effectiveness of the spin coating CUP tank cleaning device itself.

[0046] In addition, in this embodiment, the bottom wall of the CUP tank base 10 is provided with a drain channel 11 and an exhaust channel 12 at intervals. The drain channel 11 is connected to an external waste liquid collection tank to discharge the cleaning solution after photoresist cleaning to the external waste liquid collection tank, avoiding the accumulation of the cleaning solution in the CUP tank base 10 and affecting the performance of the CUP tank cleaning device. The exhaust channel 12 is connected to an external exhaust system to form a directional negative pressure airflow in the CUP tank cleaning device, thereby removing splashed photoresist droplets and reducing the adhesion and suspension of contaminants in the CUP tank base 10. At the same time, the drain channel 11 and the exhaust channel 12 are relatively independent, which can prevent liquid photoresist from easily remaining and solidifying in the exhaust channel 12, thus avoiding blockage of the exhaust channel 12 and causing a sharp drop in exhaust efficiency.

[0047] The vacuum adsorption stage 30 is used to hold the wafer to facilitate the coating process on the wafer.

[0048] To further improve the cleaning effect, a time sensor, a quantity sensor, or an airflow sensor can be installed inside the CUP tank base 10. The quantity sensor is used to identify and record the number of wafers processed, the time sensor is used to identify and record the working time of the CUP tank base 10 and the top cover 100, and the airflow sensor is used to identify and record the real-time airflow of the exhaust channel 12, so that the cleaning mechanism 200 can adaptively adjust the delivery volume and delivery frequency of the cleaning solution based on the above information. The specific structure, mutual cooperation, and working principle of the CUP tank base 10, the protective cover 20, and the vacuum adsorption support platform 30 are not the focus of this embodiment and can be referred to in the prior art, and will not be elaborated here.

[0049] Regarding the specific structure of the CUP tank cleaning device for spin coating, this embodiment provides two implementation methods, as follows:

[0050] Implementation Method 1

[0051] Specifically, the top cover 100 is cylindrical, with its lower end connected to the CUP tank base 10, and its upper end bent inwards. Two cleaning pipes are provided: a first cleaning pipe 110 and a second cleaning pipe 120. The first cleaning pipe 110 is located at the upper end of the top cover 100, and has a plurality of first cleaning nozzles 111 evenly spaced on it, all configured to clean the top cover 100. The second cleaning pipe 120 is located at the lower end of the top cover 100, and has a plurality of second cleaning nozzles 121 evenly spaced on it, all configured to clean the CUP tank base 10.

[0052] Combination Figure 1 and Figure 4 As shown, the upper cover 100 includes a first cover portion 101, a second cover portion 102, and a third cover portion 103 arranged sequentially from top to bottom. The side wall of the third cover portion 103 extends in the vertical direction, the side wall of the first cover portion 101 extends in the horizontal direction, and the side wall of the second cover portion 102 extends towards the middle of the CUP slot base 10 from bottom to top. The side of the third cover portion 103 facing away from the second cover portion 102 serves as the lower end of the upper cover 100, and the side of the first cover portion 101 facing away from the second cover portion 102 serves as the upper end of the upper cover 100.

[0053] In this embodiment, the first cleaning pipe 110 is disposed on the side of the first cover portion 101 opposite to the second cover portion 102, and the second cleaning pipe 120 is disposed on the side of the third cover portion 103 opposite to the second cover portion 102. Both the first cleaning pipe 110 and the second cleaning pipe 120 are connected to the cleaning mechanism 200. When the cleaning mechanism 200 simultaneously delivers cleaning solution to the first cleaning pipe 110 and the second cleaning pipe 120, the cleaning solution sprayed by the multiple first cleaning nozzles 111 on the first cleaning pipe 110 is used to clean the inner wall of the upper cover 100, and the cleaning solution sprayed by the multiple second cleaning nozzles 121 on the second cleaning pipe 120 is used to clean the CUP tank base 10.

[0054] In other embodiments, the cleaning mechanism 200 can adaptively adjust the amount of cleaning solution delivered to the first cleaning pipeline 110 and the second cleaning pipeline 120 per unit time according to the adhesion of photoresist on the inner wall of the CUP tank base 10 and the top cover 100, thereby ensuring the removal effect of photoresist on the inner wall of the CUP tank base 10 and the top cover 100 while minimizing the amount of cleaning solution used to save cleaning costs.

[0055] Furthermore, to ensure that the cleaning solution sprayed from the multiple first cleaning nozzles 111 can all reach the inner wall of the upper cover 100, in this embodiment, the angles between the axes of the multiple first cleaning nozzles 111 and the upper inner wall of the upper cover 100 are all acute angles, specifically as follows: Figure 2 As shown, after the cleaning solution is sprayed onto the inner wall of the first cover portion 101 through multiple first cleaning nozzles 111, the cleaning solution flows sequentially along the inner wall of the first cover portion 101 to the inner walls of the second cover portion 102 and the third cover portion 103, thus completing the cleaning of the upper cover 100. To ensure that the cleaning solution sprayed from the multiple second cleaning nozzles 121 can all reach the CUP tank base 10, the angles between the axes of the multiple second cleaning nozzles 121 and the upper inner wall of the upper cover 100 are all acute angles, specifically as shown below. Figure 3 As shown, after the cleaning solution is sprayed onto the side wall of the CUP tank base 10 through multiple second cleaning nozzles 121, the cleaning solution flows along the side wall of the CUP tank base 10 to the bottom wall of the CUP tank base 10, thereby completing the cleaning of all parts of the CUP tank base 10. The angle between the axis of the first cleaning nozzle 111 and the upper inner wall of the top cover 100, and the angle between the axis of the second cleaning nozzle 121 and the upper inner wall of the top cover 100 can be adaptively adjusted according to actual needs, and no specific limitation is made in this embodiment.

[0056] To further ensure that the spraying pressure of the cleaning solution when sprayed from the first cleaning pipeline 110 and the second cleaning pipeline 120 to the corresponding sidewalls can meet the pressure required for photoresist cleaning, in this embodiment, the diameter of each cleaning nozzle gradually decreases from the inside of the cleaning pipeline to the outside of the cleaning pipeline, thereby increasing the spraying pressure of each cleaning nozzle when spraying the cleaning solution through the structural characteristics of the cleaning nozzle itself.

[0057] Preferably, to ensure that the spray density of the cleaning solution meets the photoresist cleaning requirements, in this embodiment, the distance between two adjacent cleaning nozzles is less than or equal to 2 mm, and the diameter of each cleaning nozzle is less than or equal to 0.2 mm. This avoids the situation where the cleaning solution cannot cover the corresponding sidewall due to an excessively large distance between two adjacent cleaning nozzles, thus ensuring the cleaning effect. At the same time, it avoids the situation where the manufacturing difficulty of the top cover 100 is increased due to an excessively small distance between two adjacent cleaning nozzles. Furthermore, if the diameter of the cleaning nozzle is too small, the amount of cleaning solution sprayed will not meet the photoresist cleaning requirements; if the diameter of the cleaning nozzle is too large, the spray pressure of the cleaning solution will not meet the photoresist cleaning requirements.

[0058] In other embodiments, the spacing between two adjacent cleaning nozzles and the diameter of each cleaning nozzle can be adaptively adjusted according to actual needs, and are not limited to this embodiment.

[0059] Furthermore, along the circumference of the top cover 100, the cross-sectional shape of the cleaning pipeline is circular or elliptical to ensure that the inner wall of the cleaning pipeline is smooth and to avoid the presence of four corners inside the cleaning pipeline. This reduces the flow resistance of the cleaning solution, prevents the cleaning solution from stagnating and causing blockage of the cleaning pipeline, and ensures that the cleaning solution is evenly delivered to each cleaning nozzle, thereby ensuring the cleaning effect.

[0060] Preferably, the cleaning mechanism 200 includes a liquid pipe 210 and a liquid storage tank 220. The two ends of the liquid pipe 210 are connected to the cleaning pipeline and the liquid storage tank 220 respectively, and a first valve 230 is provided on the liquid pipe 210.

[0061] In this embodiment, the cleaning mechanism 200 further includes a first auxiliary pipe 211, a second auxiliary pipe 212, and a three-way valve. The first end of the first auxiliary pipe 211 is connected to the first cleaning pipeline 110, and the first end of the second auxiliary pipe 212 is connected to the second cleaning pipeline 120. The second ends of both the first auxiliary pipe 211 and the second auxiliary pipe 212 are connected to the liquid-conducting pipe 210 via the three-way valve. The storage tank 220 is used to store the cleaning solution. When it is necessary to clean the photoresist adhering to the inner wall of the top cover 100 and the CUP tank base 10, the amount of cleaning solution delivered to the first cleaning pipeline 110 and the second cleaning pipeline 120 is adjusted by adjusting the opening degree of the first valve 230 on the liquid-conducting pipe 210. After the photoresist adhering to the inner wall of the top cover 100 and the CUP tank base 10 has been cleaned, the first valve 230 is closed.

[0062] Furthermore, the cleaning mechanism 200 also includes a vent pipe 240 and a second valve 250. The first end of the vent pipe 240 is disposed on the top wall of the storage tank 220 and communicates with the storage tank 220. The second valve 250 is disposed on the vent pipe 240, and the second section of the vent pipe 240 is configured to communicate with an external gas injection device. When delivering cleaning solution to the first cleaning pipeline 110 and the second cleaning pipeline 120, the second valve 250 is opened, and the external gas injection device injects gas into the storage tank 220 through the vent pipe 240 to increase the pressure inside the storage tank 220, thereby pressurizing the cleaning solution inside the storage tank 220 towards the liquid inlet pipe 210, thus realizing the delivery of the cleaning solution.

[0063] In this embodiment, both the first valve 230 and the second valve 250 are configured as solenoid valves, thereby realizing the automatic delivery of cleaning solution and automatic cleaning of photoresist.

[0064] In some other embodiments, the vent pipe 240 and the second valve 250 may be omitted, and a liquid transfer pump may be directly installed on the liquid pipe 210.

[0065] In this embodiment, the cleaning solution is acetone.

[0066] Implementation Method 2

[0067] In this embodiment, the specific structure of the cleaning mechanism 200, the cross-sectional shape of the cleaning pipeline, the spacing between two adjacent cleaning nozzles, and the diameter of each cleaning nozzle are exactly the same as in Embodiment 1. The only difference is the number and location of the cleaning pipelines. Specifically, the cleaning pipeline is set as a third cleaning pipeline (not shown in the figure) and is located in the middle of the upper cover 100. Along the circumference of the upper cover 100, a plurality of third cleaning nozzles are evenly spaced on the upper side of the third cleaning pipeline, and a plurality of fourth cleaning nozzles are evenly spaced on the lower side of the third cleaning pipeline. The plurality of third cleaning nozzles are configured to clean the upper end of the upper cover 100, and the plurality of fourth cleaning nozzles are configured to clean the lower end of the upper cover 100 and the CUP tank base 10.

[0068] Specifically, the third cleaning pipeline is located on the inner wall of the second cover portion 102. The cleaning mechanism 200 does not have the first auxiliary pipe 211, the second auxiliary pipe 212, or the three-way valve. The third cleaning pipeline is directly connected to the liquid inlet pipe 210. When the cleaning mechanism 200 delivers cleaning solution to the third cleaning pipeline, part of the cleaning solution in the third cleaning pipeline is sprayed upward through multiple third cleaning nozzles to clean the upper end of the inner wall of the second cover portion 102 and the inner wall of the first cover portion 101. Another part of the cleaning solution is sprayed downward through multiple fourth cleaning nozzles to clean the lower end of the inner wall of the second cover portion 102, the inner wall of the third cover portion 103, and the CUP tank base 10.

[0069] Meanwhile, in order to ensure the cleaning effect, the axis of each third cleaning nozzle is inclined from top to bottom towards the middle of the upper cover 100, so that the angle between the axis of the multiple third cleaning nozzles and the inner wall of the second cover part 102 is an acute angle; the axis of each fourth cleaning nozzle is inclined from top to bottom away from the middle of the upper cover 100, so that the angle between the axis of the multiple fourth cleaning nozzles and the inner wall of the second cover part 102 is an acute angle.

[0070] In order to prevent all the cleaning solution in the third cleaning pipeline from being sprayed out from the third cleaning nozzle or the fourth cleaning nozzle during the cleaning process, in this embodiment, the third cleaning nozzle and the fourth cleaning nozzle are staggered along the circumference of the third cleaning pipeline.

[0071] In some other embodiments, a first cleaning pipe 110, a second cleaning pipe 120, and a third cleaning pipe may also be provided on the inner wall of the top cover 100.

[0072] This embodiment also provides a method for cleaning a CUP tank for uniform coating, which is applied to the above-mentioned CUP tank cleaning device. The method for cleaning a CUP tank for uniform coating includes the following steps: First, observe and determine the operating status of the CUP tank base 10 and the top cover 100.

[0073] The second step is to determine whether the current state meets the cleaning settings based on the observation results. If not, proceed to the first step; if yes, proceed to the third step.

[0074] The third step is to open the first valve 230 and supply cleaning solution to the cleaning pipeline to clean the CUP tank base 10 and the top cover 100.

[0075] The fourth step is to observe the condition of the CUP tank base 10 and the top cover 100 until the cleaning effect of the CUP tank base 10 and the top cover 100 reaches the preset value, and then close the first valve 230.

[0076] The entire cleaning process involves first observing and judging the operating status of the CUP tank base 10 and top cover 100. Only when the operating status of the CUP tank base 10 is determined to meet the set conditions is the first valve 230 opened to deliver cleaning solution to the cleaning pipeline for cleaning the CUP tank base 10 and top cover 100. The CUP tank base 10 and top cover 100 are then observed again until the cleaning effect reaches the set value, at which point the first valve 230 is closed. This setup allows for adaptive cleaning operations based on the operating status of the CUP tank base 10 and top cover 100, and the amount of cleaning solution delivered to the cleaning pipeline can be adjusted by changing the opening degree of the first valve 230. The first valve 230 is then closed based on the actual cleaning effect, ensuring both convenience and improved cleaning efficiency.

[0077] Furthermore, the cleaning method is set to automatic cleaning or manual cleaning; the set states include: the operation time reaches the set number of operations, the number of operations reaches the set number, the exhaust volume of the exhaust channel 12 on the CUP tank base 10 reaches the set value, and the product processing on the vacuum adsorption support table 30 reaches a specific step.

[0078] When the cleaning method is manual, the operator observes the number of wafers processed and the time in real time, and opens the first valve 230. For example, when it is observed that ten wafers have been processed, or that the operation has been running continuously for ten minutes, the first valve 230 is manually opened to clean the CUP tank base 10 and the top cover 100. During the cleaning process, the operator observes the cleaning status of the photoresist in the CUP tank base 10 and the top cover 100 in real time. After the photoresist in the CUP tank base 10 and the top cover 100 is completely cleaned, the first valve 230 is manually closed to proceed to the next stage of the operation.

[0079] When the cleaning method is automatic cleaning, there are two cleaning modes, as detailed below;

[0080] The first method involves cleaning based on specific steps in the product processing. Specifically, a cleaning step is added to the coating unit formula, and the first valve 230 is opened simultaneously during the backwashing step. This setup automatically cleans the CUP tank base 10 and top cover 100 during each spin coating process, ensuring that any excess photoresist splashed onto the CUP tank base 10 and top cover 100 during spin coating is promptly cleaned. This prevents residual photoresist on the CUP tank base 10 and top cover 100, avoids clogging of the exhaust channel 12 by residual photoresist, maintains the internal ambient temperature and exhaust stability of the CUP tank base 10 and top cover 100, and thus improves the inter-wafer stability of the spin coating film thickness.

[0081] Taking one of the processing steps as an example, the coating unit's uniform coating steps are shown in the table below (wafer rotation speed). wafer rotation acceleration );

[0082]

[0083] The main process of photoresist preparation includes three stages: spin coating, back washing, and baking. Spin coating includes spin dispensing, photoresist spreading, high-speed spin coating, and solvent evaporation. Corresponding to the above steps, the first and second steps are wafer cooling stages. Specifically, the wafer is baked in a hot plate, and heat is transferred between the wafer and the clamping arm. To avoid film thickness fluctuations during continuous operation, the wafer needs to be rotated at high speed for cooling before spin coating. The third step is the spin coating stage. Specifically, the photoresist is dropped onto the center of the wafer and spread on the wafer surface under centrifugal force. The fourth step and... The fifth step is the film thickness adjustment stage. Specifically, the film thickness on the wafer is mainly determined by the rotation speed after dispensing. By adjusting the rotation speed, the film thickness on the wafer can be adjusted. The sixth and seventh steps are the film thickness maintenance stages. Specifically, the stability of the film thickness on the wafer is affected by the solvent evaporation time. By adjusting the time of this stage, the stability of the film thickness on the wafer can be ensured. The eighth and ninth steps are the back washing stages. Specifically, the rinsing dispenser is opened to rinse the wafer, and the first valve 230 is opened simultaneously to clean the excess photoresist that has been splashed onto the CUP tank base 10 and the top cover 100. After that, the wafer is baked.

[0084] The second method involves cleaning based on the set time, the set quantity of wafers processed, and the exhaust volume of the exhaust channel 12 on the CUP tank base 10. In this case, the time sensor, quantity sensor, or airflow sensor are all connected to the first valve 230. Specifically, in the first method, the quantity of wafers is used as an interval. When the quantity sensor identifies and records that the number of processed wafers is five or ten, the quantity sensor transmits the information to the first valve 230, which opens to deliver cleaning solution to the rinsing channel for 1-2 seconds; or when the quantity sensor identifies and records that the number of processed wafers is one box or two boxes, the quantity sensor transmits the information to the first valve 230, which opens to deliver cleaning solution to the rinsing channel for 10-30 seconds. In the second method, the time sensor senses that the homogenization process has lasted for a specific time, such as 10 min / 30 min / 60 min, and transmits the information to the first valve 230, which opens to deliver cleaning solution to the rinsing channel for 10-30 seconds. The third method uses the exhaust volume of the exhaust channel 12 as an interval. When the air volume sensor detects that the air volume at the exhaust channel 12 is less than 300 m³ / h, the air volume sensor transmits the information to the first valve 230. The first valve 230 opens to deliver cleaning solution to the flushing pipeline for 10-30 seconds.

[0085] Taking one of the work processes as an example, an example of a work process with a cleaning step is shown below:

[0086]

[0087] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A CUP tank cleaning device, comprising a CUP tank base (10) and a protective cover (20) and a vacuum adsorption support stage (30) disposed within the CUP tank base (10), characterized in that, The CUP tank cleaning device for spin coating also includes: The upper cover (100) is disposed at the open end of the CUP tank base (10). The inner wall of the upper cover (100) is provided with at least one cleaning pipe. The cleaning pipe extends in a ring shape along the circumference of the upper cover (100). Along the circumference of the cleaning pipe, the side wall of the cleaning pipe is evenly spaced with a plurality of cleaning nozzles that are all connected to the cleaning pipe. The plurality of cleaning nozzles are configured to clean the upper cover (100) and the CUP tank base (10). The cleaning mechanism (200) is connected to the cleaning pipeline and is used to deliver cleaning solution to the cleaning pipeline.

2. The CUP tank cleaning device according to claim 1, characterized in that, The upper cover (100) is cylindrical, the lower end of the upper cover (100) is connected to the CUP slot base (10), and the upper end of the upper cover (100) is bent inward and contracted. Two cleaning pipelines are provided, namely a first cleaning pipeline (110) and a second cleaning pipeline (120). The first cleaning pipeline (110) is located at the upper end of the upper cover (100), and a plurality of first cleaning nozzles (111) are evenly spaced on the first cleaning pipeline (110). The plurality of first cleaning nozzles (111) are all configured to clean the upper cover (100). The second cleaning pipeline (120) is located at the lower end of the upper cover (100), and a plurality of second cleaning nozzles (121) are evenly spaced on the second cleaning pipeline (120). The plurality of second cleaning nozzles (121) are all configured to clean the CUP tank base (10).

3. The CUP tank cleaning device according to claim 2, characterized in that, The angle between the axis of the plurality of first cleaning nozzles (111) and the upper inner wall of the cover (100) is an acute angle, and the angle between the axis of the plurality of second cleaning nozzles (121) and the upper inner wall of the cover (100) is an acute angle.

4. The CUP tank cleaning device according to claim 1, characterized in that, The upper cover (100) is cylindrical, the lower end of the upper cover (100) is connected to the CUP slot base (10), and the upper end of the upper cover (100) is bent inward and contracted. The cleaning pipeline is configured as a third cleaning pipeline and is located in the middle of the upper cover (100). Along the circumference of the upper cover (100), a plurality of third cleaning nozzles are evenly spaced on the upper side of the third cleaning pipeline, and a plurality of fourth cleaning nozzles are evenly spaced on the lower side of the third cleaning pipeline. The plurality of third cleaning nozzles are configured to clean the upper end of the upper cover (100), and the plurality of fourth cleaning nozzles are configured to clean the lower end of the upper cover (100) and the CUP slot base (10).

5. The CUP tank cleaning device according to claim 4, characterized in that, Along the circumference of the third cleaning pipeline, the third cleaning nozzle and the fourth cleaning nozzle are offset.

6. The CUP tank cleaning device according to claim 1, characterized in that, The distance between two adjacent cleaning nozzles is less than or equal to 2 mm, and the diameter of each cleaning nozzle is less than or equal to 0.2 mm.

7. The CUP tank cleaning apparatus according to any one of claims 1-6, characterized in that, The cleaning mechanism (200) includes a liquid pipe (210) and a liquid storage tank (220). The two ends of the liquid pipe (210) are connected to the cleaning pipeline and the liquid storage tank (220) respectively, and a first valve (230) is provided on the liquid pipe (210).

8. The CUP tank cleaning device according to claim 7, characterized in that, The cleaning mechanism (200) further includes a vent pipe (240) and a second valve (250). The first end of the vent pipe (240) is disposed on the top wall of the liquid storage tank (220) and communicates with the liquid storage tank (220). The second valve (250) is disposed on the vent pipe (240). The second section of the vent pipe (240) is configured to communicate with an external gas filling device.

9. A method for cleaning a spin coater cup, applied to the spin coater cup cleaning apparatus according to any one of claims 1-8, characterized in that, The method for cleaning the CUP tank for spin coating includes the following steps: S1, observe and determine the working status of the CUP slot base (10) and the top cover (100); S2, determine whether the current state meets the cleaning setting based on the observation results. If not, proceed to S1; if yes, proceed to S3. S3, open the first valve (230) and deliver cleaning solution to the cleaning pipeline to clean the CUP tank base (10) and the top cover (100); S4, observe the condition of the CUP tank base (10) and the top cover (100) until the cleaning effect of the CUP tank base (10) and the top cover (100) reaches the preset value, and close the first valve (230).

10. The method for cleaning the CUP tank for spin coating according to claim 9, characterized in that, The cleaning method for the CUP tank for homogenization is set to automatic cleaning or manual cleaning. The set states include: the operation time reaches the set time, the operation quantity reaches the set quantity, the exhaust volume of the exhaust channel (120) on the CUP slot base (10) reaches the set value, and the product processing on the vacuum adsorption support platform (30) reaches a specific step.

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