LED wafer cleaning device

Abstract

The invention discloses an LED wafer cleaning device, and relates to the field of wafer cleaning equipment.The LED wafer cleaning device comprises a cleaning box, a supporting plate and a fixing plate are arranged in the cleaning box, a feeding groove is formed in the fixing plate, a communicating pipe is arranged at the top of the cleaning box, and a plurality of water outlet pipes are arranged at the bottom of the communicating pipe; a water receiving box is arranged at the bottom of an inner cavity of the cleaning box, a sliding groove is formed in the supporting plate, sliding blocks are arranged in the sliding groove, rotating frames are arranged between the sliding blocks, lifting plates are arranged between the two rotating frames, the cleaning box is arranged between the two lifting plates, and lifting sleeves are arranged at the tops of the lifting plates. When the wafer is immersed in and rotates in cleaning liquid, the defects of the high-pressure spraying technology are overcome, direct impact damage of high-pressure water flow to the fragile surface structure of the LED wafer is avoided, the micro-crack and breaking risks are reduced, and clamping of the multi-station wafer is achieved.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning equipment, specifically an LED wafer cleaning device. Background Technology

[0002] LED chips are semiconductor light-emitting devices. As a core component of the modern optoelectronic industry, they are widely used in display, lighting, backlighting, and signal indication. By injecting charge carriers into semiconductor materials, electrons and holes recombine to release photons, thereby realizing the conversion of electrical energy into light energy. LED chips undergo multiple processes such as epitaxy, etching, evaporation, cutting, and testing during production. Their surfaces are prone to residual photoresist, particulate contaminants, metal ions, and organic impurities. Therefore, cleaning the chips before packaging is a key step to ensure their performance.

[0003] Common LED chip cleaning devices mostly use spray cleaning, which sprays cleaning fluid vertically or at an angle onto the chip surface through high-pressure nozzles. The impact force of the liquid flow is used to remove contaminants. However, this method can easily cause surface damage or microcracks to chips with micron-sized dimensions or fragile microstructures, affecting their structural integrity. Spraying is also difficult to form a uniform and continuous liquid film on the chip surface, resulting in cleaning dead zones or secondary adhesion of contaminants, and the cleaning effect is not ideal. Summary of the Invention

[0004] The purpose of this invention is to provide an LED chip cleaning device to solve the problem of inconvenience in using existing cleaning devices.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] An LED chip cleaning apparatus includes a cleaning chamber and further includes:

[0007] The cleaning box includes a fixed frame, a support plate and a fixed plate inside. The fixed plate has a feed chute inside. The top of the cleaning box has a connecting pipe, and the bottom of the connecting pipe has multiple water outlet pipes. The bottom of the inner cavity of the cleaning box has a water receiving box. The support plate has a sliding groove inside, and a slider is installed inside the sliding groove. A rotating frame is installed between two sliders, a lifting plate is installed between two rotating frames, and a cleaning box is installed between two lifting plates. A lifting sleeve is installed on the top of the lifting plate, and turntables are installed on both sides of the lifting sleeve. A support plate is fitted around the turntables, and a fixed frame for fixing the wafers is installed around the support plate.

[0008] The limiting plate includes a fixed frame comprising a telescopic component and a rotating component. A fixing groove for fixing the wafer is provided between the telescopic component and the rotating component. A limiting plate is provided on the opposite side of the two turntables. A top plate is provided on the outside of the limiting plate. A guide block that cooperates with the top plate is provided on the outside of the rotating component. One end of the telescopic component passes through the inside of the support plate and is provided with a fixing post. A transmission groove that cooperates with the fixing post is provided on the limiting plate. A limiting rod is provided on the top of the cleaning tank. The bottom end of the limiting rod contacts the side wall of the support plate.

[0009] The drive mechanism is connected to the slider. The limit plate rotates and drives the telescopic component to move toward the rotating component through the cooperation of the transmission groove and the fixed column, which can squeeze and fix the wafer placed between the telescopic component and the rotating component.

[0010] The transmission mechanism is located inside the lifting sleeve. When the lifting sleeve rises and falls, the transmission mechanism drives the support plate and turntable to rotate, driving the fixed crystal to contact the cleaning water in the water receiving box and complete the cleaning.

[0011] Based on the above technical solutions, the present invention also provides the following optional technical solutions:

[0012] In one alternative embodiment: the driving mechanism includes a lead screw, a transmission belt, and a drive motor; movable plates are provided on both sides of the outer surface of the cleaning tank; protective boxes are provided on the movable plates; a lead screw is provided inside the sliding groove; a threaded groove that mates with the lead screw is provided inside the slider; a drive motor is provided inside the protective box; one end of the lead screw passes through the protective box and is provided with a pulley; a transmission belt is provided between the rotating end of the drive motor and the pulley.

[0013] In one alternative: a connecting block is provided on the outside of the movable plate, and a plurality of locking bolts are provided on the connecting block.

[0014] In one alternative embodiment: the transmission mechanism includes a mounting plate, a rack and a gear; rotating rods are provided on both outer sides of the lifting sleeve; gears are provided on the rotating rods; a mounting plate is fixedly provided on the top of the inner cavity of the cleaning tank; one end of the mounting plate passes through the interior of the lifting sleeve and is provided with a rack.

[0015] In one alternative: a fixing screw is provided on the outside of the limiting plate, and one end of the fixing screw passes through the inside of the turntable.

[0016] In one alternative: a retaining plate is provided on the top of the cleaning box, and the retaining plate is connected to the lifting plate.

[0017] In one alternative: a protective plate is provided on the outside of the cleaning tank, and a water inlet pipe is provided between the two connecting pipes.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] The LED chip cleaning device uses a support plate to drive multiple sets of chips to rotate. As the chips are slowly immersed and rotated in the cleaning solution, a uniform shearing force is generated between their surface and the liquid, which can remove contaminants without dead angles. This overcomes the shortcomings of traditional high-pressure spray technology, avoids direct impact damage to the fragile surface structure of LED chips by high-pressure water flow, reduces the risk of micro-cracks and breakage, and achieves stable clamping of chips at multiple stations. This ensures the reliability of chip fixation during the cleaning process and improves the uniformity and efficiency of cleaning. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of an LED chip cleaning device.

[0021] Figure 2 This is a schematic diagram of the internal structure of the cleaning chamber in an LED chip cleaning device.

[0022] Figure 3 This is a schematic diagram of the structure of the fixing plate in the LED chip cleaning device.

[0023] Figure 4 This is a schematic diagram of the support plate in an LED chip cleaning device.

[0024] Figure 5 This is a schematic diagram of the cleaning box in an LED chip cleaning device.

[0025] Figure 6 This is a cross-sectional view of the support plate in an LED chip cleaning device.

[0026] Figure 7 This is a schematic diagram of the support plate in an LED chip cleaning device.

[0027] Figure 8 This is a cross-sectional view of the support plate in an LED chip cleaning device.

[0028] Figure 9 This is a cross-sectional view of the limiting plate in an LED chip cleaning device.

[0029] Figure 10 This is a schematic diagram of the telescopic component in an LED chip cleaning device.

[0030] Figure 11 This is a schematic diagram of the limiting disk in an LED chip cleaning device.

[0031] Figure 12 This is a schematic diagram of the rotating rod in an LED chip cleaning device.

[0032] Figure 13 This is a schematic diagram of the mounting plate in an LED chip cleaning device.

[0033] Attached Figure Labels: 1-Washing box, 101-Square trough, 2-Protective plate, 3-Modible plate, 4-Protective box, 5-Fixed trough, 6-Connecting block, 7-Locking bolt, 8-Connecting pipe, 9-Water inlet pipe, 10-Limiting rod, 11-Fixed plate, 111-Feed trough, 12-Support plate, 121-Sliding trough, 122-Slider, 13-Water receiving box, 14-Washing box, 15-Lifting sleeve, 16-Mounting plate 17-Rotating frame, 18-Lifting plate, 19-Clamping plate, 20-Turntable, 21-Limiting plate, 211-Fixing screw, 212-Top plate, 213-Transmission groove, 22-Support plate, 23-Telescopic component, 231-Fixing column, 24-Rotating component, 241-Guide block, 25-Rotating rod, 26-Gear, 27-Rack, 28-Screw screw, 29-Drive motor, 30-Transmission belt, 31-Pulley. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0035] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0036] like Figure 1-13 As shown, an LED wafer cleaning apparatus according to an embodiment of the present invention includes a cleaning tank 1, and further includes:

[0037] The cleaning chamber 1 has a fixed frame. A square groove 101 is formed inside the cleaning chamber 1. A support plate 12 is slidably mounted inside the square groove 101. Fixed plates 11 are inclinedly mounted on both sides of the outside of the cleaning chamber 1. A feed groove 111 is formed inside the fixed plates 11 to guide the wafers into the cleaning chamber 1 and move them to the fixed frame. A connecting pipe 8 is provided at the top of the cleaning chamber 1, and multiple water outlet pipes are provided at the bottom of the connecting pipe 8. During cleaning, water flows downwards and eventually falls into a water collection box 13, providing initial rinsing to the wafers sliding down from the feed groove 111 and removing some loose contaminants. A water collection box 13 is provided at the bottom of the inner cavity of the cleaning chamber 1 to fill with cleaning water for subsequent cleaning processes. A sliding groove 121 is formed inside the support plate 12. A slider 122 is slidably mounted inside the sliding groove 121. A rotating frame 17 is rotatably mounted between two sliders 122. A lifting plate 18 is rotatably mounted between the bottoms of two rotating frames 17. A cleaning... Box 14, the top of the lifting plate 18 is provided with a lifting sleeve 15, and the outer sides of the lifting sleeve 15 are provided with turntables 20. The turntables 20 are fitted with support plates 22. The support plates 22 are provided with fixing frames for fixing the chips. After the drive mechanism is started, the sliders 122 on both sides of the support plate 12 move closer or further away from each other. The sliders 122 slide along the sliding groove 121. The rotating frame 17 drives the lifting plate 18 and the lifting sleeve 15 to move up and down. The turntables 20 on both sides of the lifting sleeve 15 rotate in opposite directions. The turntables 20 drive the support plates 22 and the multiple sets of chips fixed by the fixing frames to rotate together. When the chips are gradually immersed in the cleaning water in the water receiving box 13, the continuous rotation makes the chip surface and the cleaning water flow relative to each other, avoiding the impact damage of high pressure spray on the fragile surface of the LED chip, reducing the risk of chip breakage and micro-cracks. The rotation ensures that the contact between each part of the chip and the cleaning medium is uniform, achieving a more thorough and uniform cleaning effect.

[0038] The limiting plate 21, the fixed frame includes a telescopic member 23 and a rotating member 24, a fixing groove 5 for accommodating and fixing the wafer is opened between the telescopic member 23 and the rotating member 24, the telescopic member 23 is slidably mounted on the support plate 22, the rotating member 24 is rotatably mounted on the outside of the support plate 22 via a rotating shaft, the two are in a one-to-one correspondence on the support plate 22, and a limiting plate 21 is provided on the side of each of the two turntables 20 that are far apart, the limiting plate 21 can rotate relative to the turntable 20, after adjustment, tighten the fixing screw 211 to make it fit with the turntable 20. The disc 20 is locked as a single unit. Multiple top plates 212 are provided on the outside of the limiting disc 21. A guide block 241 that cooperates with the top plate 212 is provided on the outside of the rotating component 24. One end of the telescopic component 23 passes through the interior of the supporting disc 22 and is provided with a fixing post 231. A transmission groove 213 that cooperates with the fixing post 231 is formed on the limiting disc 21. A limiting rod 10 is provided on the top of the cleaning tank 1. The bottom end of the limiting rod 10 contacts the side wall of the supporting disc 22. The structure of the limiting rod 10 is as follows: Figure 3 As shown, during the initial wafer loading, the limiting rod 10 is inserted downwards and presses the support plates 22 on both sides of the lifting sleeve 15, causing the two sets of support plates 22 to move away from each other. The movement of the support plates 22 drives the rotating parts 24 on them to move. The rotating parts 24 rotate to a horizontal position under the action of the top plate 212, controlling the turntable 20 to rotate. The wafers can then slide into the fixing slots 5 of each fixing frame in sequence. After all stations are filled with wafers, the turntable 20 stops rotating. The operator manually rotates the limiting plate 21. The transmission groove 213 on the limiting plate 21, through cooperation with the fixing column 231, converts the rotational motion into the linear motion of the telescopic parts 23, driving all the telescopic parts 23 to move closer to each other and towards the rotating parts 24, clamping all the wafers in the fixing slots 5, preparing for subsequent cleaning.

[0039] The driving mechanism is connected to the slider 122. The limiting disk 21 rotates and drives the telescopic member 23 to move toward the rotating member 24 through the cooperation of the transmission groove 213 and the fixed column 231, which can squeeze and fix the wafer placed between the telescopic member 23 and the rotating member 24.

[0040] The transmission mechanism is located inside the lifting sleeve 15. When the lifting sleeve 15 is raised or lowered, the transmission mechanism drives the support plate 22 and the turntable 20 to rotate, driving the fixed wafer to contact the cleaning water in the water receiving box 13 and complete the cleaning.

[0041] like Figure 1-6As shown in the preferred embodiment of the present invention, the driving mechanism includes a lead screw 28, a transmission belt 30, and a drive motor 29. Movable plates 3 are provided on both sides of the outer side of the cleaning tank 1. A protective box 4 is provided on the movable plate 3. The lead screw 28 is provided inside the sliding groove 121. The slider 122 is provided with a threaded groove that cooperates with the lead screw 28. The drive motor 29 is provided inside the protective box 4. One end of the lead screw 28 passes through the protective box 4 and is provided with a pulley 31. A transmission belt 30 is provided between the rotating end of the drive motor 29 and the pulley 31. When the drive motor 29 starts, it drives the lead screws 28 on both sides to rotate through the transmission belt 30. The rotational motion of the lead screw 28 is converted into the linear motion of the slider 122 in the sliding groove 121 through the threaded engagement, driving the two sliders 122 to move closer or further away from each other. In turn, the lifting plate 18 and the entire cleaning unit are lifted and lowered through the rotating frame 17.

[0042] like Figure 1-4 As shown, in a preferred embodiment of the present invention, the movable plate 3 is provided with a connecting block 6 on the outside, and a plurality of locking bolts 7 are provided on the connecting block 6. The movable plate 3 can drive the internal support plate 12 to move up and down as a whole. The initial height of the support plate 12 and the entire clamping and cleaning mechanism can be flexibly adjusted according to the wafer specifications and process requirements. After adjusting to a suitable position, tightening the locking bolts 7 can lock it on the cleaning box 1.

[0043] like Figure 1-13 As shown, in a preferred embodiment of the present invention, the transmission mechanism includes a mounting plate 16, a rack 27, and a gear 26. Rotating rods 25 are provided on both outer sides of the lifting sleeve 15, and gears 26 are mounted on the rotating rods 25. A mounting plate 16 is fixedly mounted on the top of the inner cavity of the cleaning tank 1. One end of the mounting plate 16 extends into the interior of the lifting sleeve 15 and is provided with a rack 27. The positions of the rack 27 and the gear 26 are as follows: Figure 13 As shown, the racks 27 on both sides of the lifting sleeve 15 are staggered. When the lifting sleeve 15 moves downward under the action of the drive mechanism, the racks 27 remain fixed, while the gears 26 move downward relative to the racks 27, thus rotating. The two sets of gears 26 rotate in opposite directions, which in turn drive the turntables 20 on both sides to rotate synchronously in opposite directions through the rotating rod 25, realizing the opposite rotation cleaning of the wafers. To further improve the cleaning effect, a cleaning brush is installed on the outside of the lifting sleeve 15. The bristles of the cleaning brush contact the outer surface of the wafer fixed on the support plate 22, and perform continuous and gentle mechanical scraping on the surface of the rotating wafer, thereby improving the cleaning efficiency and cleanliness.

[0044] like Figure 1-9As shown, in a preferred embodiment of the present invention, a fixing screw 211 is provided on the outside of the limiting plate 21. One end of the fixing screw 211 is inserted into the inside of the turntable 20. The limiting plate 21 is manually rotated to the required angle, the initial position of the telescopic member 23 is adjusted, and the fixing screw 211 is tightened to fix the limiting plate 21 and the turntable 20.

[0045] like Figure 1-3 As shown, in a preferred embodiment of the present invention, the top of the cleaning box 14 is provided with a retaining plate 19, which is connected to the lifting plate 18. The retaining plate 19 is provided with a fixing pin, which makes the installation and disassembly of the cleaning box 14 easier, and allows it to be taken out regularly for cleaning, maintenance or replacement.

[0046] like Figure 1 As shown, in a preferred embodiment of the present invention, the cleaning tank 1 is provided with a protective plate 2, and a water inlet pipe 9 is provided between the two connecting pipes 8. The external cleaning liquid is pumped in through the water inlet pipe 9 and distributed to each connecting pipe 8, providing a stable water source for the pre-rinsing of the wafer and the entire cleaning system.

[0047] The above embodiments of the present invention provide an LED wafer cleaning device. According to the specifications of the wafer to be cleaned, the locking bolt 7 on the connecting block 6 is loosened, and the initial height of the support plate 12 is adjusted via the movable plate 3, so that the fixed groove 5 aligns with the outlet of the feeding groove 111. The limiting rod 10 is inserted downwards, its bottom end pressing against the support plates 22 on both sides of the lifting sleeve 15. The two support plates 22 move away from each other. Through the cooperation of the top plate 212 and the guide block 241, the rotating component 24 is driven to rotate to a horizontal position. The wafer slides sequentially along the feeding groove 111 on the inclined fixed plate 11 and enters the fixed groove 5 on the support plate 22, which is in an open state. The support plate 22 is manually rotated, and multiple sets of wafers sequentially enter the fixed frame. After all stations are filled with wafers, the limiting plate 21 is manually rotated. The transmission groove 213, through its cooperation with the fixed column 231, drives all the telescopic components 23 to move synchronously toward the rotating component 24, clamping and fixing them. All wafers in slot 5; start drive motor 29, drive slider 122 to move closer together via transmission belt 30 and lead screw 28, rotating frame 17 drives lifting plate 18, lifting sleeve 15 and fixed wafers to descend, rack 27 fixed on mounting plate 16 causes gears 26 on both sides to rotate in opposite directions, gears 26 drive turntable 20 and support plate 22 to rotate via rotating rod 25, so that wafers rotate in the cleaning water in water box 13 for cleaning; after cleaning, pull out limit rod 10, the two sets of support plates 22 move closer together, multiple sets of rotating parts 24 tilt, wafers slide into cleaning box 14 along fixed slot 5, realizing quick unloading of multiple sets of wafers; drive motor 29 reverses, drives the entire clamping mechanism to rise, and wafers are loaded again. When support plate 12 descends, it can simultaneously drive cleaning box 14 to move up and down for immersion. Remove cleaning box 14 to take out wafers.

[0048] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An LED chip cleaning device, comprising a cleaning chamber (1), characterized in that, Also includes: The cleaning box (1) is provided with a support plate (12) and a fixed plate (11). The fixed plate (11) is provided with a feed groove (111). The top of the cleaning box (1) is provided with a connecting pipe (8). The bottom of the connecting pipe (8) is provided with multiple water outlet pipes. The bottom of the inner cavity of the cleaning box (1) is provided with a water receiving box (13). The support plate (12) is provided with a sliding groove (121). The sliding groove (121) is provided with a slider (122). A rotating frame (17) is provided between two sliders (122). A lifting plate (18) is provided between two rotating frames (17). A cleaning box (14) is provided between two lifting plates (18). A lifting sleeve (15) is provided on the top of the lifting plate (18). Turntables (20) are provided on both sides of the lifting sleeve (15). A support plate (22) is sleeved on the outside of the turntable (20). A fixed frame for fixing the wafer is provided on the outside of the support plate (22). The limiting plate (21) includes a telescopic component (23) and a rotating component (24). A fixing groove (5) for fixing the wafer is provided between the telescopic component (23) and the rotating component (24). A limiting plate (21) is provided on the side of the two turntables (20) that are far apart. A top plate (212) is provided on the outside of the limiting plate (21). A guide block (241) that cooperates with the top plate (212) is provided on the outside of the rotating component (24). One end of the telescopic component (23) is inserted into the support plate (22) and a fixing post (231) is provided. A transmission groove (213) that cooperates with the fixing post (231) is provided on the limiting plate (21). A limiting rod (10) is provided on the top of the cleaning box (1). The bottom end of the limiting rod (10) is in contact with the side wall of the support plate (22). The driving mechanism is connected to the slider (122). The limiting disk (21) rotates and drives the telescopic member (23) to move toward the rotating member (24) through the cooperation of the transmission groove (213) and the fixed column (231). It can squeeze and fix the wafer placed between the telescopic member (23) and the rotating member (24). The transmission mechanism is located inside the lifting sleeve (15). When the lifting sleeve (15) is raised or lowered, the transmission mechanism drives the support plate (22) and the turntable (20) to rotate, driving the fixed wafer to contact the cleaning water in the water receiving box (13) and complete the cleaning.

2. The LED wafer cleaning apparatus according to claim 1, characterized in that, The driving mechanism includes a lead screw (28), a transmission belt (30), and a drive motor (29). Movable plates (3) are provided on both sides of the outer side of the cleaning tank (1). A protective box (4) is provided on the movable plate (3). The lead screw (28) is provided inside the sliding groove (121). The threaded groove that cooperates with the lead screw (28) is provided inside the slider (122). The drive motor (29) is provided inside the protective box (4). One end of the lead screw (28) passes through the protective box (4) and is provided with a pulley (31). A transmission belt (30) is provided between the rotating end of the drive motor (29) and the pulley (31).

3. The LED wafer cleaning apparatus according to claim 2, characterized in that, The movable plate (3) is provided with a connecting block (6) on the outside, and a plurality of locking bolts (7) are provided on the connecting block (6).

4. The LED wafer cleaning apparatus according to claim 1, characterized in that, The transmission mechanism includes a mounting plate (16), a rack (27) and a gear (26). Rotating rods (25) are provided on both sides of the outer side of the lifting sleeve (15). Gears (26) are provided on the rotating rods (25). The mounting plate (16) is fixedly provided on the top of the inner cavity of the cleaning box (1). One end of the mounting plate (16) is inserted into the interior of the lifting sleeve (15) and is provided with a rack (27).

5. The LED wafer cleaning apparatus according to claim 1, characterized in that, The limiting plate (21) is provided with a fixing screw (211) on the outside, and one end of the fixing screw (211) is inserted into the turntable (20).

6. The LED wafer cleaning apparatus according to claim 5, characterized in that, The cleaning box (14) is provided with a card plate (19) on the top, and the card plate (19) is connected to the lifting plate (18).

7. The LED wafer cleaning apparatus according to claim 1, characterized in that, The cleaning tank (1) is equipped with a protective plate (2) on the outside, and a water inlet pipe (9) is provided between the two connecting pipes (8).

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