Probe cleaning method and device and control equipment

Abstract

The invention relates to the technical field of surface mounting, and discloses a probe cleaning method and device and control equipment, the method is applied to the control equipment in an automatic line body, and the automatic line body further comprises grabbing equipment, a test tool provided with a probe and a cleaning plate provided with a bonding layer; the method comprises the following steps: placing a cleaning plate on a test tool according to a preset orientation through grabbing equipment, wherein the preset orientation is a direction in which a bonding layer faces a probe; and controlling the probe of the test tool to press downwards to be in contact with the bonding layer, so that the bonding layer cleans the probe in a bonding manner. The probe of the test tool is controlled to be in contact with the bonding layer, so that the bonding layer cleans the probe in a bonding mode.

Description

Technical Field

[0001] This application relates to the field of surface mount technology, and in particular to a probe cleaning method, apparatus and control device. Background Technology

[0002] Currently, in surface mount technology (SMT) production, after components are mounted and reflow soldered, printed circuit boards (PCBs) must undergo electrical performance testing using specialized testing fixtures to verify their functionality. Specifically, the testing fixture may include an upper pressure plate and a lower pressure plate. The PCB under test can be fixed on the lower pressure plate, while probes can be positioned at corresponding locations on the upper pressure plate. During testing, the upper pressure plate precisely presses down, causing the probes to contact preset test points on the PCB, thereby completing a series of tests including continuity, insulation, voltage, and signal strength.

[0003] However, during high-speed production, the probe tip inevitably becomes contaminated with flux residue, solder dross, dust, and other pollutants from the board surface. When these contaminants accumulate to a certain level, they form an insulating film that hinders proper electrical contact between the probe and the test point, leading to misjudgments of test results and a significant decrease in the first-pass yield.

[0004] Therefore, how to clean the probe is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] The main objective of this application is to provide a probe cleaning method, apparatus, and control device, which aims to solve the technical problem of how to clean probes.

[0006] To achieve the above objectives, this application provides a probe cleaning method, which is applied to a control device in an automated production line. The automated production line further includes: a gripping device, a testing fixture with probes, and a cleaning plate with an adhesive layer. The method includes: The cleaning plate is placed on the test fixture by the gripping device according to a preset orientation, wherein the preset orientation is the direction in which the adhesive layer faces the probe. The probe of the test fixture is pressed down to contact the adhesive layer, so that the adhesive layer cleans the probe by sticking it on.

[0007] In one embodiment, at least two adhesive layers are provided, and the at least two adhesive layers are provided at different positions on the cleaning plate and correspond to the probe; The step of placing the cleaning plate onto the test fixture with a preset orientation using the gripping device includes: Obtain the layout position of the probe, and determine the corresponding placement direction based on the layout position; The cleaning plate is placed on the test fixture according to the preset orientation and the placement direction using the gripping device.

[0008] In one embodiment, the adhesive layers disposed at different locations correspond to different types of cleaning boards; The automated production line also includes: a refilling device equipped with a refilling station and a storage bin; The step of placing the cleaning plate on the test fixture according to the preset orientation and the placement direction using the gripping device includes: The target type of cleaning board is determined based on the layout location; The target type of cleaning plate is removed from the storage compartment by the re-dispensing device and placed in the re-dispensing seat; The gripping device grips the cleaning plate of the target type from the re-dispensing seat and places it on the test fixture according to the preset orientation and the placement direction.

[0009] In one embodiment, the cleaning plate is further provided with a label code; the automated production line also includes a barcode scanning device; The step of grasping the target type cleaning plate from the re-dispensing seat using the grasping device and placing it on the test fixture according to the preset orientation and the placement direction includes: The grabbing device grabs the cleaning board of the target type from the re-dispensing seat, and the scanning device scans the label code of the cleaning board to obtain the current type corresponding to the cleaning board; When the current type is the target type, the gripping device is placed on the test fixture according to the preset orientation and the placement direction.

[0010] In one embodiment, the cleaning plate is further provided with a label code; the automated production line also includes a barcode scanning device; The step of placing the cleaning plate onto the test fixture with a preset orientation using the gripping device includes: The current number of times the cleaning plate has been used and the current usage time can be obtained by scanning the label code of the cleaning plate using the scanning device. If the current number of uses has not reached a preset threshold, and the current usage time has not reached a preset duration threshold, the cleaning plate is placed on the test fixture with a preset orientation by the gripping device.

[0011] In one embodiment, the automated production line further includes: turnover equipment; After the step of obtaining the current number of times the cleaning plate has been used and the current duration of use, the method further includes: Obtain the quantity of the test fixtures to be cleaned, and determine the total estimated cleaning time based on the quantity to be cleaned and the unit cleaning time. The current number of uses is updated based on the number of items to be cleaned, and the current usage time is updated based on the estimated total cleaning time. After the step of controlling the probe of the test fixture to press down and contact the adhesive layer, the method further includes: Based on the updated current number of uses, the preset number of uses threshold, the updated current usage duration, and the preset duration threshold, the cleaning plate is moved by the turnover device.

[0012] In one embodiment, the step of moving the cleaning plate using the turnover device based on the updated current number of uses, the preset number of uses threshold, the updated current usage duration, and the preset duration threshold includes: If the updated current number of uses does not reach the preset number of uses threshold, and the updated current usage time does not reach the preset duration threshold, the cleaning board is stored by the turnover device; If the updated current number of uses reaches the preset number of uses threshold and / or the updated current usage duration reaches the preset duration threshold, the cleaning board is discarded by the turnover device.

[0013] The automated production line also includes: a standard test board; After the step of controlling the probe of the test fixture to press down and contact the adhesive layer, the method further includes: The cleaned test fixture is used to perform electrical tests on the standard test board to obtain the test results. Based on the test results, if the cleaned test fixture is determined to meet the corresponding preset cleaning requirements, the cleaning plate is stored.

[0014] Furthermore, to achieve the above objectives, embodiments of this application also propose a probe cleaning device, the device comprising: A placement module is used to place a cleaning plate onto a test fixture with a preset orientation by a gripping device, wherein the preset orientation is the direction in which the adhesive layer faces the probe. The pressing module is used to control the probe of the test fixture to press down and contact the adhesive layer, so that the adhesive layer cleans the probe by pasting.

[0015] Furthermore, to achieve the above objectives, this application also proposes a control device, which includes: a memory, a processor, and a probe cleaning program stored in the memory and executable on the processor. When the probe cleaning program is executed by the processor, it implements the steps of the probe cleaning method described above.

[0016] In addition, to achieve the above objectives, this application also proposes an automated production line, which includes: a gripping device, a testing fixture with probes, a cleaning plate with an adhesive layer, and a control device as described above.

[0017] This application provides a probe cleaning method, apparatus, and control device. The method is applied to the control device in an automated production line. The automated production line further includes: a gripping device, a testing fixture with probes, and a cleaning plate with an adhesive layer. The method includes: placing the cleaning plate on the testing fixture with a preset orientation, where the preset orientation is the direction of the adhesive layer towards the probe, using the gripping device; controlling the probes of the testing fixture to press down and contact the adhesive layer, so that the adhesive layer cleans the probes by adhering them. This application cleans the probes by controlling the contact between the probes of the testing fixture and the adhesive layer, thereby enabling the adhesive layer to clean the probes by adhering them. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the control device structure of the hardware operating environment involved in the embodiments of this application; Figure 2 This is a schematic diagram of the automated production line structure of the hardware operating environment involved in the embodiments of this application; Figure 3 This is a schematic diagram of the cleaning board structure of the hardware operating environment involved in the embodiments of this application; Figure 4 This is a schematic flowchart of the first embodiment of the probe cleaning method proposed in this application. Figure 5 This is a schematic flowchart of the second embodiment of the probe cleaning method proposed in this application. Figure 6This is a schematic flowchart of the third embodiment of the probe cleaning method proposed in this application. Figure 7 This is a structural block diagram of the first embodiment of the probe cleaning device of this application.

[0021] Explanation of icon numbers:

[0022] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0024] Reference Figure 1 , Figure 1 This is a schematic diagram of the control device structure of the hardware operating environment involved in the embodiments of this application.

[0025] like Figure 1 As shown, the control device may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may be connected to a display screen; optionally, the user interface 1003 may include a standard wired interface or a wireless interface. In this application, the wired interface of the user interface 1003 may be a USB interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wireless-Fidelity (Wi-Fi) interface). The memory 1005 may be high-speed random access memory (RAM) or non-volatile memory (NVM), such as a disk storage device. The memory 1005 may also optionally be a storage device independent of the aforementioned processor 1001.

[0026] Those skilled in the art will understand that Figure 1 The structure shown does not constitute a limitation on the control device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0027] like Figure 1 As shown, the memory 1005, which is identified as a computer storage medium, may include an operating system, a network communication module, a user interface module, and a probe cleaning program.

[0028] exist Figure 1 In the control device shown, the network interface 1004 is mainly used to connect to the backend server and communicate with the backend server; the user interface 1003 is mainly used to connect to the user equipment; the control device calls the probe cleaning program stored in the memory 1005 through the processor 1001 and executes the steps of the probe cleaning method provided in the embodiments of this application.

[0029] Reference Figure 2 , Figure 2 This is a schematic diagram of the automated production line structure of the hardware operating environment involved in the embodiments of this application.

[0030] like Figure 2 As shown, the automated production line may include: a control device 1 as described above, a gripping device 2, a testing fixture 3 equipped with probes, and a cleaning plate 4 equipped with an adhesive layer 41. The control device 1 may be a computer or programmable controller (PLC) for receiving instructions, processing data, and controlling other hardware devices in the automated production line to operate according to predetermined logic. Examples include a programmable logic controller (PLC) or an industrial computer running test software that interacts with a Manufacturing Execution System (MES). The gripping device 2 may refer to an automated mechanical device capable of multi-degree-of-freedom motion and performing gripping, handling, and placement operations, such as a four-axis manipulator with a vacuum suction cup at its end. The testing fixture 3 may refer to a fixture used during circuit board testing to fix the board under test and ensure precise contact between the probes and test points to complete electrical performance testing. Examples include a printed circuit board (PCB) testing fixture 3 comprising an upper pressure plate, a lower pressure plate, and probes. The aforementioned cleaning plate 4 may refer to a consumable or tool used for cleaning operations, having one or more functional surfaces, such as a PCB bare board surface covered with a polymer adhesive film (forming an adhesive layer 41) and capable of integrating a radio frequency identification (RFID) tag.

[0031] Those skilled in the art will understand that Figure 2 The structures shown do not constitute a limitation on the automated production line and may include more or fewer components than illustrated, or combine certain components, or have different component arrangements. Specific implementations of the above-described automated production line can be found in the descriptions of the following embodiments.

[0032] refer to Figure 3 , Figure 3 This is a schematic diagram of the cleaning board 4 structure in the hardware operating environment involved in the embodiments of this application. Figure 3 As shown, the cleaning board 4 includes an adhesive layer 41 and a label 42. The adhesive layer 41 can be a functional material layer with an adhesive surface, used to adsorb and remove contaminants through contact adhesion, such as a polymer adhesive film. The label 42 can be a code attached to the surface or interior of an object to store a unique identifier or related data, such as a one-dimensional barcode, a two-dimensional code, or an RFID tag.

[0033] Those skilled in the art will understand that Figure 3 The structure shown does not constitute a limitation on the cleaning plate 4, and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Specific implementations of the cleaning plate 4 described below can be found in the following embodiments.

[0034] It should be noted that in surface mount technology (SMT) production, after the printed circuit board (PCB) has completed component mounting and reflow soldering, it must undergo electrical performance testing using a specialized test fixture 3 to verify its functional compliance. Specifically, the test fixture 3 may include an upper pressure plate and a lower pressure plate. The PCB under test can be fixed on the lower pressure plate, while probes can be set at corresponding positions on the upper pressure plate. During testing, the upper pressure plate will precisely press down, causing the probes to contact preset test points on the PCB, thereby completing a series of tests such as continuity, insulation, voltage, and signal.

[0035] However, during high-speed production, probe tips inevitably become contaminated with flux residue, solder dross, dust, and other pollutants from the board surface. When these contaminants accumulate to a certain level, they form an insulating film that hinders proper electrical contact between the probe and the test point, leading to misjudgments and a significant decrease in the first-pass yield. Therefore, how to clean the probes is a pressing technical problem that needs to be solved.

[0036] Therefore, in order to solve the above-mentioned defects, this embodiment uses the gripping device 2 to place the cleaning plate 4 on the test fixture 3 according to a preset orientation, and controls the probe of the test fixture 3 to press down and contact the adhesive layer 41, so that the adhesive layer 41 cleans the probe by pasting, thereby achieving the cleaning of the probe.

[0037] Reference Figure 4 , Figure 4 This is a schematic flowchart of the first embodiment of the probe cleaning method proposed in this application. Figure 4 As shown, in this embodiment, the specific method includes: Step S10: The cleaning plate 4 is placed on the test fixture 3 with a preset orientation by the gripping device 2, wherein the preset orientation is the direction in which the adhesive layer 41 faces the probe.

[0038] It is understood that the aforementioned preset orientation can be the direction in which the adhesive layer 41 faces the probe. In actual use, the control device 1 sends a motion command to the gripping device 2 based on the pre-stored program logic and coordinate data, driving the gripping device 2 to move to the storage position of the cleaning plate 4. Then, the control device 2 performs a gripping action to fix the cleaning plate 4. Next, it calculates and plans the motion path to transport the cleaning plate 4 to the designated placement point on the test fixture 3. The control device 1 can maintain the posture of the cleaning plate 4 during transport, ensuring that its adhesive layer 41 is precisely facing the probe on the test fixture 3 when placement is completed. Finally, the control device 2 places the cleaning plate 4 in the preset position, i.e., on the lower pressure plate of the test fixture 3, and releases the gripping action, completing the placement process.

[0039] Furthermore, in order to save materials, in this embodiment, the adhesive layer 41 is only provided where the probe is located. At least two adhesive layers 41 are provided, and the at least two adhesive layers 41 are provided at different positions of the cleaning plate 4 and correspond to the probe.

[0040] The step of placing the cleaning plate 4 onto the test fixture 3 according to a preset orientation using the gripping device 2 includes: Step S11: Obtain the layout position of the probe and determine the corresponding placement direction based on the layout position; Step S12: The cleaning plate 4 is placed on the test fixture 3 according to the preset orientation and the placement direction by the gripping device 2.

[0041] It should be noted that the above-mentioned layout position can refer to the position of one or more objects in a specific space or plane, such as the array shape formed by multiple probes on the test fixture 3 and their respective coordinates. The above-mentioned placement direction can refer to the direction corresponding to the rotation angle of an object around an axis perpendicular to that plane in its plane, such as the direction corresponding to the specific angle formed between the long side of the cleaning plate 4 and the long side of the test fixture 3 when the cleaning plate 4 is placed.

[0042] In its implementation, the control device 1 reads the probe layout position information of the target test fixture 3 from the storage unit or receives it through the communication interface. Then, based on this layout position information, it performs calculations to determine the optimal placement direction of the cleaning plate 4 that allows all adhesive areas on the cleaning plate 4 to be optimally aligned with the corresponding probes. This calculated placement direction is then combined with a preset orientation (i.e., the adhesive layer 41 facing the probe) to determine the motion parameters of each joint axis of the gripping device 2. Based on these motion parameters, the gripping device 2 is driven to perform actions, causing its end effector to adjust to the calculated placement direction after gripping the cleaning plate 4. The gripping device 2 is then controlled to move the cleaning plate 4 to the space above the test fixture 3. Finally, the gripping device 2 places the cleaning plate 4 in this composite posture on the predetermined bearing surface of the test fixture 3 (i.e., the aforementioned lower pressure plate).

[0043] Furthermore, it is understood that, in order to facilitate the cleaning of the adhesive layer 41 of the test fixture 3 and the cleaning plate 4 at different probe positions, the adhesive layer 41 at different positions corresponds to different types of cleaning plates 4. The control device 1 can select the corresponding type of cleaning plate 4 for probe cleaning according to the type of test fixture 3.

[0044] refer to Figure 2 For ease of management, the aforementioned automated production line also includes a refilling device with a refilling station 5 and a storage bin. This refilling device can be an automated device for automatically supplying and recycling production line consumables, such as a mechanism that includes a storage bin and a refilling station 5, capable of transferring a specified type of cleaning plate 4 from the storage bin to the refilling station 5 for gripping, according to instructions. The refilling station 5 can be a specific workstation or platform on the refilling device for temporarily positioning and storing materials to be retrieved, such as a vacuum suction cup for a robotic arm to precisely pick up the cleaning plate 4 to a designated location. The storage bin can be a container or space on the refilling device for centrally storing and managing multiple spare materials or consumables, such as a material box or automated storage and retrieval system capable of holding multiple cleaning plates 4 of different types.

[0045] Accordingly, the step of placing the cleaning plate 4 on the test fixture 3 according to the preset orientation and the placement direction using the gripping device 2 includes: Step S121: Determine the target type of cleaning board 4 based on the layout location; Step S122: The target type cleaning plate 4 is taken out from the storage compartment by the re-dispensing device and placed in the re-dispensing seat 5; Step S123: The gripping device 2 grips the cleaning plate 4 of the target type from the re-dispensing seat 5 and places it on the test fixture 3 according to the preset orientation and the placement direction.

[0046] It is understood that the aforementioned target type of cleaning plate 4 may refer to the cleaning plate 4 selected from a variety of categories of cleaning plates 4 based on specific screening conditions (such as probe layout) and that best matches the current task, such as a cleaning plate 4 whose adhesive layer 41 pattern matches the annular probe layout of the current test fixture 3, in order to distinguish it from the cleaning plate 4 used for the adhesive layer 41 to be arranged in a rectangular array.

[0047] In its implementation, the control device 1 first parses or retrieves the probe layout position data of the current test fixture 3 to be cleaned. This layout position data is then matched with an internally stored database of cleaning plate 4 types. This database can record the probe layout patterns adapted to different types of cleaning plates 4.

[0048] Through matching calculations, the cleaning plate 4 of the target type that best matches the current probe layout position is determined. Then, the re-dispensing device is driven to locate and select the cleaning plate 4 of the target type in its storage compartment. The re-dispensing device is then controlled to remove the selected target type cleaning plate 4 from the storage compartment and transport it to the re-dispensing seat 5 for secure retrieval.

[0049] After confirming that the cleaning plate 4 is in place, the control device 1 moves the gripping device 2 above the re-submission seat 5. The gripping device 2 then performs a gripping operation on the target type cleaning plate 4 located on the re-submission seat 5. A complete placement posture is generated by combining the preset orientation (ensuring the adhesive layer 41 faces the probe) and the placement direction calculated for the current test fixture 3 (ensuring angular alignment in the horizontal plane). Finally, the gripping device 2 places the gripped target type cleaning plate 4 into the designated bearing position of the test fixture 3 in the calculated placement posture.

[0050] refer to Figure 2 as well as Figure 3 Furthermore, to prevent misuse, the cleaning plate 4 is also equipped with a label code 42 (e.g., ...). Figure 3 As shown); the automated production line also includes: a barcode scanning device 6 (as shown). Figure 2 (As shown). The aforementioned scanning device 6 can be a hardware device used to automatically identify and read the information stored in the tag code 42, such as a fixed barcode scanner, a handheld barcode reader, or an RFID reader / writer.

[0051] Accordingly, the step of grasping the target type cleaning plate 4 from the re-dispatch seat 5 using the grasping device 2 and placing it on the test fixture 3 according to the preset orientation and the placement direction includes: Step S1231: The grabbing device 2 grabs the cleaning board 4 of the target type from the re-dispensing seat 5, and the scanning device 6 scans the label code 42 of the cleaning board 4 to obtain the current type corresponding to the cleaning board 4; Step S1232: When the current type is the target type, the gripping device 2 is placed on the test fixture 3 according to the preset orientation and the placement direction.

[0052] It is understood that the aforementioned current type may refer to category information that characterizes the actual attributes or specifications of the cleaning plate 4, which is obtained in real time by scanning the tag code 42 on the cleaning plate 4.

[0053] In the specific implementation, during the movement of the cleaning plate 4 by the gripping device 2, the control device 1 triggers the scanning device 6 to scan the tag code 42 attached to the cleaning plate 4. The control device 1 receives the scanned data from the scanning device 6, parses the data, and extracts the current type information corresponding to the cleaning plate 4. The parsed current type is compared with the pre-stored target type. If the comparison result matches, i.e., the current type is confirmed as the target type, the subsequent placement process continues.

[0054] Step S20: Control the probe of the test fixture 3 to press down and contact the adhesive layer 41, so that the adhesive layer 41 cleans the probe by pasting.

[0055] It is understandable that the above-mentioned pasting method can be a physical cleaning method that uses the adsorption force of the adhesive material surface to remove contaminants. For example, the probe tip can be brought into contact with the adhesive film, and the adhesiveness of the adhesive film can be used to adhere the flux residue on the probe surface.

[0056] In its implementation, after confirming that the cleaning plate 4 has been correctly placed on the test fixture 3 according to the preset orientation and placement direction, the control device 1 sends a pressing command to the control unit of the test fixture 3. The control device 1 then triggers the drive mechanism of the test fixture 3 via this command, causing its upper pressure plate to carry the probe downwards. Key parameters of the pressing process can be monitored or set to ensure that the probe contacts the adhesive layer 41 of the cleaning plate 4 with a specific pressure and duration. After the contact holding phase ends, the upper pressure plate of the test fixture 3 is raised, separating the probe from the adhesive layer 41, thus completing one cleaning operation.

[0057] For ease of understanding, the following example is provided, but it does not limit the scope of this embodiment. Once the control device 1 (e.g., a PLC) confirms via sensor signals that the cleaning plate 4 has been placed in position, it sends a command containing a "press down" instruction to the controller of the test fixture 3 via a serial port. Upon receiving the instruction, the test fixture 3 uses a cylinder or motor to drive the upper pressure plate downwards, causing all the probes fixed on it to simultaneously contact the adhesive film on the surface of the cleaning plate 4. During this process, the PLC ensures that the pressing pressure is maintained at 0.5 kg and the contact time is 1.0 second. During this period, contaminants such as solder dross and dust adhering to the probe heads are effectively adhered to the adhesive film. After 1.0 second, the PLC triggers the upper pressure plate to lift, and the probes leave the surface of the cleaning plate 4, their heads becoming clean.

[0058] In this embodiment, the cleaning plate 4 is placed on the test fixture 3 according to a preset orientation by the gripping device 2, and the probe of the test fixture 3 is controlled to press down and contact the adhesive layer 41, so that the adhesive layer 41 cleans the probe by pasting, thereby achieving the cleaning of the probe.

[0059] Refer to 5, Figure 5 This is a flowchart illustrating the second embodiment of the probe cleaning method proposed in this application. Based on the first embodiment described above, a second embodiment of the probe cleaning method of this application is proposed.

[0060] Furthermore, to ensure the effective use of the cleaning plate 4, the step of placing the cleaning plate 4 in the test fixture 3 according to a preset orientation using the gripping device 2 includes: Step S13: Scan the label code 42 of the cleaning plate 4 using the scanning device 6 to obtain the current number of times the cleaning plate 4 has been used and the current usage time. Step S14: If the current number of uses has not reached the preset number of uses threshold and the current usage time has not reached the preset duration threshold, the cleaning plate 4 is placed on the test fixture 3 with a preset orientation by the gripping device 2.

[0061] Understandably, the aforementioned "current number of uses" could refer to the cumulative number of times a reusable item has been used to date, such as the total number of times a cleaning board 4 has been used for cleaning operations since it was first put into use. The aforementioned "current usage time" could refer to the cumulative time elapsed since a reusable item was first put into use, such as the total time elapsed from the first use of a cleaning board 4 to the present moment.

[0062] Furthermore, it should be noted that the aforementioned preset usage threshold can refer to a limit set for the maximum number of times a reusable item can be used, such as the system setting a limit of 100 uses for the cleaning board 4. The aforementioned preset duration threshold can refer to a limit set for the maximum allowable usage time for a reusable item, such as the system setting a limit of 72 hours for the cleaning board 4 from its first use.

[0063] In practical use, after the gripping device 2 obtains the cleaning plate 4 from the re-dispensing seat 5, the control device 1 triggers the scanning device 6 to scan the tag code 42 of the cleaning plate 4. The control device 1 receives the data read by the scanning device 6 and parses the current number of uses and the current usage duration corresponding to the cleaning plate 4 from the data. It accesses the preset parameters stored internally to obtain the preset number of uses threshold and preset usage duration threshold set for this type of cleaning plate 4. The parsed current number of uses is compared with the preset number of uses threshold and the current usage duration is compared with the preset usage duration threshold. If the logic determines that the current number of uses is less than the preset number of uses threshold and the current usage duration is less than the preset usage duration threshold, the cleaning plate 4 is determined to be in a valid state. After determining that the cleaning plate 4 is usable, the subsequent process continues, controlling the gripping device 2 to place the cleaning plate 4 in the test fixture 3 according to the preset orientation.

[0064] refer to Figure 2 Furthermore, in order to store the cleaning boards 4, the automated production line also includes a turnover device 7. The turnover device 7 can refer to a device in the automated production line used to transfer and temporarily store materials or tooling between workstations or different states, such as a turnover tray for storing used cleaning boards 4 that have not yet reached the end of their service life, or a turnover cart for sorting and collecting waste cleaning boards 4 to be recycled.

[0065] After obtaining the current number of uses and the current duration of use of the cleaning plate 4, the method further includes: Step S131: Obtain the quantity of the test fixture 3 to be cleaned, and determine the estimated total cleaning time based on the quantity to be cleaned and the unit cleaning time. Step S132: Update the current number of uses based on the number of items to be cleaned, and update the current used time based on the estimated total cleaning time.

[0066] It should be noted that the aforementioned quantity to be cleaned can refer to the total number of specific objects that currently require cleaning operations, such as the number of all test fixtures 3 that need probe cleaning in an automated testing line. The aforementioned unit cleaning time can refer to the average time required to complete the cleaning operation of a single object, such as the fixed time required to clean the probes of one test fixture 3 from start to finish. The aforementioned estimated total cleaning time can refer to the estimated time required to complete all cleaning tasks based on the number of objects to be cleaned and the processing time of a single object, such as the estimated total time required to clean all test fixtures 3 to be cleaned.

[0067] In its implementation, the control device 1 obtains a list of test fixtures 3 that need cleaning from the production management system or through sensor detection, and determines the quantity to be cleaned. It then calls the unit cleaning time parameter pre-stored in its memory. The quantity to be cleaned is multiplied by the unit cleaning time to calculate the estimated total cleaning time. The current number of times the cleaning plate 4 has been used, obtained through the barcode scanner 6, is read. This current number of uses is added to the quantity to be cleaned to obtain the updated current number of uses. Simultaneously, the current usage time of the cleaning plate 4 is read. This current usage time is added to the estimated total cleaning time to obtain the updated current usage time.

[0068] Accordingly, after the step of controlling the probe of the test fixture 3 to press down and contact the adhesive layer 41, the method further includes: Based on the updated current number of uses, the preset number of uses threshold, the updated current usage duration, and the preset duration threshold, the cleaning plate 4 is moved by the turnover device.

[0069] The updated current usage count mentioned above can refer to the new cumulative count obtained by adding the planned task execution amount to the original usage count. The updated current usage duration mentioned above can refer to the new cumulative duration obtained by adding the estimated time of this task to the original usage duration.

[0070] In practical use, after completing the predictive update of the usage status of the cleaning plate 4, the control device 1 compares the updated current number of uses with a preset threshold. Simultaneously, it compares the updated current usage duration with a preset duration threshold. Based on the comparison results, the route for transporting the cleaning plate 4 using the turnover equipment is determined.

[0071] Specifically, the step of moving the cleaning plate using the turnover device based on the updated current usage count, the preset usage count threshold, the updated current usage duration, and the preset duration threshold includes: Step S30: If the updated current number of uses does not reach the preset number of uses threshold and the updated current usage time does not reach the preset duration threshold, the cleaning board 4 is stored by the turnover device 7.

[0072] In practical use, after completing the predictive update of the usage status of the cleaning plate 4, the control device 1 compares the updated current number of uses with a preset threshold. Simultaneously, it compares the updated current usage duration with a preset duration threshold. If the logical judgment confirms that the updated current number of uses is still less than the preset threshold and the updated current usage duration is still less than the preset duration threshold, it determines that the cleaning plate 4 still has remaining service life after the current cleaning task ends. Based on this determination, the control device 1 generates a storage instruction. This storage instruction is sent to the transfer device 7, which then schedules the cleaning plate 4 to be transferred to a designated storage location for safekeeping after all predetermined cleaning tasks have been completed.

[0073] Step S40: If the updated current number of uses reaches the preset number of uses threshold and / or the updated current usage duration reaches the preset duration threshold, the cleaning board 4 is discarded by the turnover device 7.

[0074] In practical use, after completing the predictive update of the usage status of the cleaning plate 4, the control device 1 compares the updated current number of uses with a preset threshold, and simultaneously compares the updated current usage time with a preset duration threshold. If the logic determines that the updated current number of uses is greater than or equal to the preset threshold, and / or the updated current usage time is greater than or equal to the preset duration threshold, the cleaning plate 4 is deemed to have reached the end of its service life after the current cleaning task. Based on this determination, a discard instruction is generated. The control device 1 sends this discard instruction to the transfer device 7, which then moves the cleaning plate 4 to the designated waste area after it has completed all predetermined cleaning tasks.

[0075] Reference Figure 6 , Figure 6 This is a flowchart illustrating the third embodiment of the probe cleaning method proposed in this application. Based on the above embodiments, the third embodiment of the probe cleaning method of this application is proposed.

[0076] Considering that a single cleaning cycle or a preset number of cleaning cycles cannot guarantee complete probe cleaning, the aforementioned automated production line also includes a standard test board. This standard test board can be a reference circuit board known for its electrical characteristics and functional integrity, specifically designed to verify the accuracy and stability of the testing system itself. For example, it could be a dedicated calibration board with preset conductive loops, insulation gaps, and standard test points.

[0077] Correspondingly, after the step of controlling the probe of the test tooling 3 to press down and contact the bonding layer 41, the following steps are further included: Step S50: Control the cleaned test tooling 3 to perform an electrical test on the standard test board to obtain a test result; Step S60: Based on the test result, when it is determined that the cleaned test tooling 3 meets the corresponding preset cleaning requirements, store the cleaning board 4.

[0078] It can be understood that the above electrical test may refer to a test for verifying the circuit connectivity and performance by measuring electrical parameters, such as a conduction test, an insulation test, or a signal integrity test. The above preset cleaning requirements may refer to the technical requirements preset for judging whether the probe cleanliness of the test tooling 3 meets the standard, for example, requiring the contact resistance value of all test points to be lower than a certain threshold and the waveform to be distortion-free.

[0079] In a specific implementation, after the above control device 1 completes the probe cleaning process, it sends an instruction to the test tooling 3 to control it to perform an electrical test on the standard test board. Receive the test data returned by the test tooling 3 as the test result. Analyze the test result and extract the key performance parameters. Compare the extracted parameters with the technical standards specified in the preset cleaning requirements. When it is confirmed that all parameters meet the preset cleaning requirements after the comparison, determine that the current cleaning is qualified. Based on the determination result of the qualified cleaning, generate a storage instruction. Schedule the turnover device 7 to transfer the currently used cleaning board 4 to a designated storage area for storage.

[0080] [[ID=1�]]In another embodiment, before the step of when it is determined that the cleaned test tooling 3 meets the corresponding preset cleaning requirements based on the test result, the following steps are further included: Step S61: Determine the corresponding test parameters based on the test result, and the test parameters at least include two of the contact resistance value, the insulation resistance value, and the signal waveform; Step S62: Determine the target range threshold according to the current usage times, the current usage duration of the cleaning board 4, and the reference data corresponding to the standard test board; Step S63: Compare the test parameters with the target range threshold, and determine that the cleaned test tooling 3 meets the corresponding preset cleaning requirements according to the comparison result.

[0081] It can be understood that the above test parameters may refer to specific physical quantities or waveform characteristics collected during the electrical test of the test object and used to characterize its performance state, such as the contact resistance value, the insulation resistance value, or the signal waveform of a specific test point. The above target range threshold may refer to a variable numerical range used to judge whether the test result is qualified.

[0082] Furthermore, the aforementioned contact resistance value can refer to the resistance generated when current flows through the interface between two conductors, such as the resistance measured in milliohms when a probe contacts a test point. The aforementioned insulation resistance value can refer to the resistance measured under high voltage between two electrically isolated conductors, such as the insulation performance measured in megohms between different circuit nodes on test fixture 3. The aforementioned signal waveform can refer to the waveform of an electrical signal changing over time, such as the voltage pulse waveform acquired by test fixture 3 at a specific test point, used for analyzing signal integrity. The aforementioned reference data can refer to reference performance data representing the standard test board under ideal conditions, obtained in advance through experiments or calibration, such as the contact resistance reference value, insulation resistance reference value, and standard signal waveform characteristics of the standard test board in a brand-new state.

[0083] In practical use, the control device 1 obtains the test results returned after performing electrical tests on the standard test board from the test fixture 3. The test results are analyzed, and at least two parameters from the contact resistance value, insulation resistance value, and signal waveform characteristics are extracted as test parameters. The current number of uses and current usage duration of the cleaning board 4 are read. Reference data corresponding to the standard test board in the storage system is retrieved, including standard reference values ​​(such as contact resistance reference value and insulation resistance reference value). Based on the current number of uses and current usage duration of the cleaning board 4, and the reference data of the standard test board, the target range threshold is dynamically calculated.

[0084] As one implementation method, the specific calculation method can be: Dynamic upper limit = Standard reference value × (1 + Aging coefficient α + Attenuation coefficient β of cleaning board 4), where the aging coefficient α is positively correlated with the cumulative usage cycle of the probe, and the attenuation coefficient β of cleaning board 4 is positively correlated with the historical usage count of cleaning board 4. The control device 1 compares the extracted test parameters (such as contact resistance value and insulation resistance value) with the calculated target range threshold one by one. Based on the comparison results, a judgment is made: if all test parameters are better than the corresponding target range threshold (such as the measured value being lower than the dynamic upper limit), the cleaned test fixture 3 is judged to meet the preset cleaning requirements; if any key test parameter (such as the contact resistance value) deviates from the target range threshold (such as the measured value being higher than the dynamic upper limit), the cleaning is judged to have failed; if only non-key test parameters (such as the insulation resistance value of a specific non-core node) slightly deviate from the target range threshold, a warning of decreased cleaning effect is generated, and the subsequent cleaning cycle of the test fixture 3 is automatically shortened. The control device 1 performs corresponding operations based on the judgment results, such as storing the cleaning board 4 or triggering secondary cleaning.

[0085] For ease of understanding, the following example is used for illustration, but it does not impose specific limitations on this embodiment. Assume that after control device 1 controls test fixture 3 to complete electrical testing on a standard test board, it obtains test results, including a contact resistance value of 12 milliohms, an insulation resistance value of 60 megohms, and a signal waveform (without distortion) at a specific test point. Control device 1 analyzes this data and determines the test parameters as a contact resistance value of 12 milliohms, an insulation resistance value of 60 megohms, and signal waveform integrity. Control device 1 reads that the current number of uses of the cleaning board 4 is 50 and the current usage time is 40 hours, and retrieves the baseline data of the standard test board from the database: a contact resistance baseline value of 10 milliohms and an insulation resistance baseline value of 100 megohms. Control device 1 dynamically calculates the target range threshold: first, it calculates the aging coefficient α (e.g., 0.02) based on the cumulative usage cycle of the probe (assumed to be 1000 hours), and calculates the attenuation coefficient β (e.g., 0.05) of the cleaning board 4 based on its historical usage count of 50 times. Then, the dynamic upper limit of contact resistance is calculated as 10 milliohms × (1 + 0.02 + 0.05) = 10.7 milliohms; the dynamic lower limit of insulation resistance is calculated as 100 megohms × (1 - 0.02 - 0.05) = 93 megohms (since the insulation resistance requires a lower limit, the calculation method may be: dynamic lower limit = standard reference value × (1 - aging coefficient α - attenuation coefficient β of cleaning board 4)). Control device 1 compares the test parameters with the target range threshold: the contact resistance value of 12 milliohms is higher than the dynamic upper limit of 10.7 milliohms, the insulation resistance value of 60 megohms is lower than the dynamic lower limit of 93 megohms, and the signal waveform has no distortion (better than the threshold). Since the key parameters (contact resistance and insulation resistance) deviate from the target range threshold, control device 1 determines that cleaning has failed, does not meet the preset cleaning requirements, and triggers a secondary cleaning process. If only non-key parameters deviate slightly, such as the insulation resistance value being slightly lower than the dynamic lower limit but the contact resistance and waveform are normal, control device 1 may generate an early warning and shorten the cleaning cycle.

[0086] In addition, refer to Figure 7 , Figure 7 This is a structural block diagram of the first embodiment of the probe cleaning device of this application; as shown... Figure 7 As shown in the embodiments of this application, a probe cleaning device is also proposed, which includes: The placement module 701 is used to place the cleaning plate 4 on the test fixture 3 according to a preset orientation by the gripping device 2, wherein the preset orientation is the direction of the adhesive layer 41 toward the probe; The pressing module 702 is used to control the probe of the test fixture 3 to press down and contact the adhesive layer 41, so that the adhesive layer 41 cleans the probe by pasting.

[0087] In another implementation, the placement module 701 is also used to obtain the layout position of the probe and determine the corresponding placement direction according to the layout position; and to place the cleaning plate 4 on the test fixture 3 according to the preset orientation and the placement direction by the gripping device 2.

[0088] In another implementation, the placement module 701 is further configured to: determine the target type of cleaning board 4 based on the layout position; take the target type of cleaning board 4 from the storage bin using the re-dispensing device and place it on the re-dispensing seat 5; and grab the target type of cleaning board 4 from the re-dispensing seat 5 using the gripping device 2 and place it on the test fixture 3 according to the preset orientation and the placement direction.

[0089] In another implementation, the placement module 701 is also used to pick up the cleaning board 4 of the target type from the re-dispatch seat 5 by the gripping device 2, and scan the label code 42 of the cleaning board 4 by the scanning device 6 to obtain the current type corresponding to the cleaning board 4; if the current type is the target type, the cleaning board 4 is placed on the test fixture 3 by the gripping device 2 according to the preset orientation and the placement direction.

[0090] Based on the first embodiment of the probe cleaning device described above, a second embodiment of the probe cleaning device of this application is proposed.

[0091] In this embodiment, the placement module 701 is further configured to scan the label code 42 of the cleaning plate 4 using the scanning device 6 to obtain the current number of times the cleaning plate 4 has been used and the current usage time; if the current number of times used does not reach a preset threshold and the current usage time does not reach a preset duration threshold, the gripping device 2 will place the cleaning plate 4 in the test fixture 3 according to a preset orientation.

[0092] In another implementation, the placement module 701 is further configured to obtain the number of test fixtures 3 to be cleaned, and determine the estimated total cleaning time based on the number of items to be cleaned and the unit cleaning time; update the current number of uses based on the number of items to be cleaned, and update the current used time based on the estimated total cleaning time; The pressure module 702 is also used to move the cleaning plate through the turnover device based on the updated current number of uses, the preset number of uses threshold, the updated current usage duration, and the preset duration threshold.

[0093] In another implementation, the pressing module 702 is also used to store the cleaning board 4 through the turnover device 7 when the updated current number of uses does not reach the preset number of uses threshold and the updated current usage time does not reach the preset duration threshold; and to discard the cleaning board 4 through the turnover device 7 when the updated current number of uses reaches the preset number of uses threshold and / or the updated current usage time reaches the preset duration threshold.

[0094] Based on the above embodiments of the probe cleaning device of this application, a third embodiment of the probe cleaning device of this application is proposed.

[0095] In this embodiment, the pressure module 702 is also used to control the cleaned test fixture 3 to perform electrical tests on the standard test board and obtain test results; based on the test results, if it is determined that the cleaned test fixture 3 meets the corresponding preset cleaning requirements, the cleaned board 4 is stored.

[0096] Other embodiments or specific implementations of the probe cleaning device described in this application can be found in the above-described method embodiments, and will not be repeated here.

[0097] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0098] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0099] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as a read-only memory image (ROM) / random access memory (RAM), magnetic disk, optical disk), and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0100] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A probe cleaning method, characterized in that, The method is applied to control equipment in an automated production line, which further includes: a gripping device, a testing fixture with probes, and a cleaning plate with an adhesive layer; The method includes: The cleaning plate is placed on the test fixture by the gripping device according to a preset orientation, wherein the preset orientation is the direction in which the adhesive layer faces the probe. The probe of the test fixture is pressed down to contact the adhesive layer, so that the adhesive layer cleans the probe by sticking it on.

2. The method as described in claim 1, characterized in that, The adhesive layer is provided in at least two locations, and the at least two adhesive layers are provided at different positions on the cleaning plate and correspond to the probe; The step of placing the cleaning plate onto the test fixture with a preset orientation using the gripping device includes: Obtain the layout position of the probe, and determine the corresponding placement direction based on the layout position; The cleaning plate is placed on the test fixture according to the preset orientation and the placement direction using the gripping device.

3. The method as described in claim 2, characterized in that, The adhesive layers located in different positions correspond to different types of cleaning boards; The automated production line also includes: a refilling device equipped with a refilling station and a storage bin; The step of placing the cleaning plate on the test fixture according to the preset orientation and the placement direction using the gripping device includes: The target type of cleaning board is determined based on the layout location; The target type of cleaning plate is removed from the storage compartment by the re-dispensing device and placed in the re-dispensing seat; The gripping device grips the cleaning plate of the target type from the re-dispensing seat and places it on the test fixture according to the preset orientation and the placement direction.

4. The method as described in claim 3, characterized in that, The cleaning plate is also equipped with a label code; the automated production line also includes a barcode scanning device. The step of grasping the target type cleaning plate from the re-dispensing seat using the grasping device and placing it on the test fixture according to the preset orientation and the placement direction includes: The grabbing device grabs the cleaning board of the target type from the re-dispensing seat, and the scanning device scans the label code of the cleaning board to obtain the current type corresponding to the cleaning board; When the current type is the target type, the gripping device is placed on the test fixture according to the preset orientation and the placement direction.

5. The method as described in claim 1, characterized in that, The cleaning plate is also equipped with a label code; the automated production line also includes a barcode scanning device. The step of placing the cleaning plate onto the test fixture with a preset orientation using the gripping device includes: The current number of times the cleaning plate has been used and the current usage time can be obtained by scanning the label code of the cleaning plate using the scanning device. If the current number of uses has not reached a preset threshold, and the current usage time has not reached a preset duration threshold, the cleaning plate is placed on the test fixture with a preset orientation by the gripping device.

6. The method as described in claim 5, characterized in that, The automated production line also includes: turnover equipment; After the step of obtaining the current number of times the cleaning plate has been used and the current duration of use, the method further includes: Obtain the quantity of the test fixtures to be cleaned, and determine the total estimated cleaning time based on the quantity to be cleaned and the unit cleaning time. The current number of uses is updated based on the number of items to be cleaned, and the current usage time is updated based on the estimated total cleaning time. After the step of controlling the probe of the test fixture to press down and contact the adhesive layer, the method further includes: Based on the updated current number of uses, the preset number of uses threshold, the updated current usage duration, and the preset duration threshold, the cleaning plate is moved by the turnover device.

7. The method as described in claim 6, characterized in that, The step of moving the cleaning plate using the turnover device based on the updated current usage count, the preset usage count threshold, the updated current usage duration, and the preset usage duration threshold includes: If the updated current number of uses does not reach the preset number of uses threshold, and the updated current usage time does not reach the preset duration threshold, the cleaning board is stored by the turnover device; If the updated current number of uses reaches the preset number of uses threshold and / or the updated current usage duration reaches the preset duration threshold, the cleaning board is discarded by the turnover device.

8. The method as described in claim 1, characterized in that, The automated production line also includes: a standard test board; After the step of controlling the probe of the test fixture to press down and contact the adhesive layer, the method further includes: The cleaned test fixture is used to perform electrical tests on the standard test board to obtain the test results. Based on the test results, if the cleaned test fixture is determined to meet the corresponding preset cleaning requirements, the cleaning plate is stored.

9. A probe cleaning device, characterized in that, The device includes: A placement module is used to place a cleaning plate onto a test fixture with a preset orientation by a gripping device, wherein the preset orientation is the direction in which the adhesive layer faces the probe. The pressing module is used to control the probe of the test fixture to press down and contact the adhesive layer, so that the adhesive layer cleans the probe by pasting.

10. A control device, characterized in that, The control device includes: a memory, a processor, and a probe cleaning program stored in the memory and executable on the processor, wherein the probe cleaning program, when executed by the processor, implements the steps of the probe cleaning method as described in any one of claims 1 to 8.

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