Non-resonance type two-dimensional elliptical ultrasonic stamping machining device and using method thereof
By using a non-resonant two-dimensional elliptical ultrasonic stamping device to stamp micro-nano scale textures on the surface of cutting tools, the problems of rapid tool wear and low processing efficiency are solved, tool life is improved and costs are reduced, and efficient micro-nano texture processing is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-27
- Publication Date
- 2026-04-03
AI Technical Summary
Existing cutting tools suffer from problems such as high cutting force, high cutting temperature, and rapid tool wear in metal cutting, especially when cutting difficult-to-machine materials. Existing micro-nano texture processing technology is inefficient and costly, which limits its widespread use.
A non-resonant two-dimensional elliptical ultrasonic stamping processing device is adopted. The ultrasonic vibration of piezoelectric ceramic drives the stamping head to perform two-dimensional elliptical vibration, stamping out micro-nano scale textures with controllable size and depth on the surface of the cutting tool. The non-resonant design avoids thermal effects, and various forms of elliptical vibration are achieved by utilizing the adjustable frequency and amplitude of the piezoelectric ceramic sheet group.
It improves the service life of cutting tools, reduces tool wear, lowers processing costs, enables efficient processing of micro-nano textures, and enhances the surface hardness and wear resistance of tools.
Smart Images
Figure CN121776329A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of ultrasonic vibration processing technology, and in particular to a non-resonant two-dimensional elliptical ultrasonic stamping processing device and its usage method. Background Technology
[0002] In metal cutting, problems such as high cutting forces, high cutting temperatures, and rapid tool wear exist, severely shortening the service life of cutting tools. This problem is even more pronounced when cutting difficult-to-machine materials, and frequent tool replacements greatly increase production costs for enterprises. Machining micro- and nano-scale textures on the surface of cutting tools can improve the contact lubrication between cutting fluid, tools, workpieces, and chips, reduce cutting forces and heat, and achieve friction reduction and wear resistance, thus significantly extending the service life of cutting tools.
[0003] Existing micro / nanotexturing systems for cutting tool surfaces primarily utilize laser, electrical discharge machining (EDM), and electrochemical principles. While laser processing is highly efficient, it inevitably generates a heat-affected zone around the texture. EDM suffers from the same problem and has low processing efficiency. Electrochemical machining involves complex mask preparation, has limited reusability, and also suffers from low processing efficiency. These drawbacks increase the processing cost of micro / nanotexturing on cutting tool surfaces, limiting the widespread adoption of this technology. Summary of the Invention
[0004] The purpose of this invention is to provide a non-resonant two-dimensional elliptical ultrasonic stamping processing device and its usage method. It utilizes the energy generated by the ultrasonic vibration of piezoelectric ceramics to drive the stamping head to perform two-dimensional elliptical vibration, stamping out micro-nano scale textures with controllable size and depth on the surface of the cutting tool. This overcomes the shortcomings of existing technologies, such as low processing efficiency, heat-affected zones, and high equipment costs.
[0005] To achieve the above objectives, the present invention provides a non-resonant two-dimensional elliptical ultrasonic stamping processing device, comprising a two-dimensional ultrasonic stamping mechanism, a machine tool clamping mechanism, a cutting tool to be processed, and a control mechanism. The two-dimensional ultrasonic stamping mechanism is connected to the machine tool spindle, the cutting tool to be processed is mounted on the machine tool clamping mechanism, the processing positioning is completed by adjusting the position of the two-dimensional ultrasonic stamping mechanism and the machine tool clamping mechanism through the machine tool, and the control mechanism controls the movement of the two-dimensional ultrasonic stamping mechanism.
[0006] Preferably, the two-dimensional ultrasonic stamping mechanism includes a spindle adapter plate, a guide rod cylinder, a bracket, a piezoelectric ceramic sheet assembly, a flexible hinge, and a stamping head. The bottom of the spindle adapter plate is fixed to the guide rod cylinder by bolts, and the movable end of the guide rod cylinder is connected to the top of the bracket by bolts. Two piezoelectric ceramic sheet assemblies are arranged perpendicularly at 90° on the bracket. Each piezoelectric ceramic sheet assembly is pre-tightened between the flexible hinge and the bracket by bolts. A stamping head is provided at the bottom of the flexible hinge.
[0007] Preferably, each of the piezoelectric ceramic sheet groups consists of alternating piezoelectric ceramic sheets and copper electrode sheets, and the polarization directions of adjacent piezoelectric ceramic sheets in each piezoelectric ceramic sheet group are opposite.
[0008] Preferably, the tip of the stamping head is made of diamond.
[0009] Preferably, the two-dimensional ultrasonic stamping mechanism is mounted on the machine tool spindle via a spindle adapter plate, which is compatible with various machine tool spindle interface types.
[0010] Preferably, the control mechanism includes an ultrasonic piezoelectric power amplifier, a power amplifier control line, a multi-function acquisition card, a computer, and a pneumatic control valve. The guide rod cylinder is connected to the pneumatic control valve via an air pipe. The copper electrode of each piezoelectric ceramic plate group is connected to the ultrasonic piezoelectric power amplifier via a piezoelectric ceramic cable. Each ultrasonic piezoelectric power amplifier is connected to the multi-function acquisition card via a power amplifier control line. The multi-function acquisition card is connected to the computer via a data cable.
[0011] Preferably, the cutting tool to be processed is mounted on a tool holder, which is mounted on a machine tool clamping mechanism. The machine tool clamping mechanism drives the cutting tool to rotate to achieve machining positioning.
[0012] Preferably, the two-dimensional ultrasonic stamping mechanism is a non-resonant design. The two piezoelectric ceramic sheet groups arranged at 90° vertically are driven by the ultrasonic piezoelectric power amplifier to perform sinusoidal expansion and contraction with adjustable frequency, adjustable amplitude and arbitrary phase, thereby driving the stamping head to complete various forms of two-dimensional elliptical ultrasonic vibration, and stamping out micro-nano scale textures with controllable size and depth on the surface of the cutting tool.
[0013] A method for using a non-resonant two-dimensional elliptical ultrasonic stamping processing device, which includes the following steps when performing micro-nano scale texture stamping: Step 1: Install the two-dimensional ultrasonic stamping mechanism on the machine tool spindle, install the cutting tool to be processed on the machine tool clamping mechanism, connect all cables and air pipes, and adjust the air control valve pressure to the predetermined value. Step 2: Move the machine tool to adjust the relative position of the punch head and the cutting tool. While completing the machining positioning, press the punch head against the surface of the cutting tool and use the pressure of the guide rod cylinder to press the punch head and the cutting tool together. Step 3: After setting the frequency, amplitude, and phase, the computer controls the analog output channel of the multi-functional acquisition card to output two sinusoidal ultrasonic signals. After being amplified by the ultrasonic piezoelectric power amplifier, the signals drive the two piezoelectric ceramic sheet groups to extend and retract, thereby driving the stamping head to complete two-dimensional elliptical ultrasonic vibration and stamping out micro-nano scale textures with controllable size and depth on the surface of the cutting tool.
[0014] Preferably, the non-resonant two-dimensional elliptical ultrasonic stamping processing device operates in two modes: single-point multiple stamping mode performs multiple stampings on the same position and controls the number of stampings; continuous single stamping mode can efficiently stamp out continuous micro-nano scale textures.
[0015] The advantages and positive effects of the non-resonant two-dimensional elliptical ultrasonic stamping processing device and its usage method described in this invention are as follows: (1) This invention utilizes the energy generated by the ultrasonic vibration of piezoelectric ceramics to drive the stamping head to stamp out micro-nano scale textures on the surface of the cutting tool. Essentially, it causes plastic deformation of the metal surface of the tool, rather than thermal ablation or electrochemical corrosion. The material is not reduced, and there is no thermal effect problem. At the same time, under the action of ultrasonic stamping energy, the surface grains of the metal are refined and the surface compressive stress is increased, further increasing the hardness and wear resistance of the tool surface.
[0016] (2) The present invention uses two sets of piezoelectric ceramics that are perpendicular to each other as ultrasonic vibration sources. It is a non-resonant elliptical vibration system. Its ultrasonic frequency does not need to work at the natural frequency of the structure. The frequency, amplitude and phase of the two sets of piezoelectric ceramics can be adjusted arbitrarily to create different elliptical vibration forms, which makes it easy to process micro-nano scale textures with controllable size and depth on the surface of the tool.
[0017] (3) The two-dimensional ultrasonic stamping mechanism in this invention has a simple structure, reasonable design, is easy to promote and implement, and has low cost and good economic benefits. It provides technical support for the promotion of micro-nano texture processing technology on the surface of cutting tools, or for the research on the friction reduction and wear resistance of texture on the surface of other metals.
[0018] Therefore, the present invention provides a non-resonant two-dimensional elliptical ultrasonic stamping processing device and its usage method with the above-mentioned structure. By utilizing the energy generated by the ultrasonic vibration of two sets of piezoelectric ceramics, the stamping head is driven to perform two-dimensional elliptical vibration, and micro-nano scale textures with controllable size and depth arrangement are stamped on the surface of the cutting tool. This overcomes the shortcomings of the prior art, such as low processing efficiency, heat effects, and high equipment costs.
[0019] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description
[0020] Figure 1This is a schematic diagram of a non-resonant two-dimensional elliptical ultrasonic stamping processing device according to the present invention; Figure 2 This is a schematic diagram of the two-dimensional ultrasonic stamping mechanism of the present invention; Figure 3 This is a schematic diagram of a single-point texture example processed by a non-resonant two-dimensional elliptical ultrasonic stamping processing device of the present invention; Figure 4 This is a schematic diagram of an example of a continuous texture processed by a non-resonant two-dimensional elliptical ultrasonic stamping device according to the present invention.
[0021] Figure Labels 1. Ultrasonic piezoelectric power amplifier; 2. Power amplifier control line; 3. Multifunctional acquisition card; 4. Data cable; 5. Computer; 6. Pneumatic control valve; 7. Air tube; 8. Machine tool spindle; 9. Two-dimensional ultrasonic stamping mechanism; 901. Spindle adapter plate; 902. Guide rod cylinder; 903. Bracket; 904. Piezoelectric ceramic sheet; 905. Copper electrode sheet; 906. Flexible hinge; 907. Stamping head; 10. Machine tool clamping mechanism; 11. Tool holder; 12. Cutting tool; 13. Piezoelectric ceramic cable. Detailed Implementation
[0022] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0023] In this application, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. In case of any inconsistency, the meaning set forth in this specification or derived from the content described herein shall prevail. Furthermore, the terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit the scope of this application.
[0024] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0025] like Figures 1-4 As shown, a non-resonant two-dimensional elliptical ultrasonic stamping processing device includes a two-dimensional ultrasonic stamping mechanism 9, a machine tool clamping mechanism 10, a cutting tool 12 to be processed, and a control mechanism. The two-dimensional ultrasonic stamping mechanism 9 is connected to the machine tool spindle 8. The cutting tool 12 to be processed is mounted on the machine tool clamping mechanism 10. The processing positioning is completed by adjusting the position of the two-dimensional ultrasonic stamping mechanism 9 and the machine tool clamping mechanism 10 through the machine tool. The control mechanism controls the movement of the two-dimensional ultrasonic stamping mechanism 9.
[0026] The two-dimensional ultrasonic stamping mechanism 9 includes a spindle adapter plate 901, a guide rod cylinder 902, a bracket 903, a piezoelectric ceramic sheet 904 group, a flexible hinge 906, and a stamping head 907. The bottom of the spindle adapter plate 901 is fixed to the guide rod cylinder 902 by bolts, and the movable end of the guide rod cylinder 902 is connected to the top of the bracket 903 by bolts. Two piezoelectric ceramic sheet 904 groups are arranged vertically at 90° on the bracket 903. Each piezoelectric ceramic sheet 904 group is pre-tightened between the flexible hinge 906 and the bracket 903 by bolts. The stamping head 907 is arranged at the bottom of the flexible hinge 906.
[0027] Each piezoelectric ceramic sheet group 904 is composed of alternating piezoelectric ceramic sheets 904 and copper electrode sheets 905, and the polarization directions of adjacent piezoelectric ceramic sheets 904 in each piezoelectric ceramic sheet group 904 are opposite.
[0028] The tip of the stamping head 907 is made of diamond.
[0029] The two-dimensional ultrasonic stamping mechanism 9 is mounted on the machine tool spindle 8 via a spindle adapter 901, which is compatible with various machine tool spindle 8 interface types.
[0030] The control mechanism includes an ultrasonic piezoelectric power amplifier 1, a power amplifier control line 2, a multi-function acquisition card 3, a computer 5, and a pneumatic control valve 6. The guide rod cylinder 902 is connected to the pneumatic control valve 6 through an air pipe 7. The copper electrode 905 of each piezoelectric ceramic sheet 904 group is connected to the ultrasonic piezoelectric power amplifier 1 through a piezoelectric ceramic cable 13. Each ultrasonic piezoelectric power amplifier 1 is connected to the multi-function acquisition card 3 through the power amplifier control line 2. The multi-function acquisition card 3 is connected to the computer 5 through a data cable 4.
[0031] The cutting tool 12 to be machined is mounted on the tool holder 11, which is mounted on the machine tool clamping mechanism 10. The machine tool clamping mechanism 10 drives the cutting tool 12 to rotate to achieve machining positioning.
[0032] The two-dimensional ultrasonic stamping mechanism 9 is a non-resonant design. Two piezoelectric ceramic plates 904 arranged vertically at 90° are driven by the ultrasonic piezoelectric power amplifier 1 to perform sinusoidal expansion and contraction with adjustable frequency, adjustable amplitude and arbitrary phase, which drives the stamping head 907 to complete various forms of two-dimensional elliptical ultrasonic vibration, and stamp out micro-nano scale textures with controllable size and depth on the surface of the cutting tool 12.
[0033] A method for using a non-resonant two-dimensional elliptical ultrasonic stamping processing device, which includes the following steps when performing micro-nano scale texture stamping: Step 1: Install the two-dimensional ultrasonic stamping mechanism 9 on the machine tool spindle 8, install the cutting tool 12 to be processed on the machine tool clamping mechanism 10, connect all cables and air pipes 7, and adjust the pressure of the air control valve 6 to the predetermined value. Step 2: Move the machine tool to adjust the relative position of the punch head 907 and the cutting tool 12. While completing the machining positioning, press the punch head 907 against the surface of the cutting tool 12 and use the pressure of the guide rod cylinder 902 to press the punch head 907 and the cutting tool 12 together. Step 3: After setting the frequency, amplitude, and phase, the computer 5 controls the analog output channel of the multi-functional acquisition card 3 to output two sinusoidal ultrasonic signals. After being amplified by the ultrasonic piezoelectric power amplifier 1, the two piezoelectric ceramic plates 904 are extended and retracted, which drives the stamping head 907 to complete two-dimensional elliptical ultrasonic vibration, and stamp out a micro-nano scale texture with controllable size and depth on the surface of the cutting tool 12.
[0034] The non-resonant two-dimensional elliptical ultrasonic stamping processing device operates in two modes: single-point multiple stamping mode, which performs multiple stampings on the same location and controls the number of stampings; and continuous single stamping mode, which can efficiently stamp out continuous micro-nano scale textures.
[0035] like Figure 3 The image shows the surface morphology of a single-point textured example processed using a non-resonant two-dimensional elliptical ultrasonic stamping system of the present invention. In this single-point multiple stamping example, the piezoelectric ceramic driving voltage amplitude is 500V, the frequency is 20kHz, the preload is 100N, and the number of ultrasonic stampings is 100. The stamped single-point texture has a diameter of approximately 97.4μm and a depth of approximately 6.8μm.
[0036] like Figure 4 The image shows the surface morphology of a continuous textured example processed using a non-resonant two-dimensional elliptical ultrasonic stamping system of the present invention. In this continuous single-pass stamping example, the piezoelectric ceramic driving voltage amplitude is 400V, the frequency is 23kHz, the preload is 80N, and the feed rate is 2000mm / min. The stamped single-point texture has a diameter of approximately 1.5μm and a depth of approximately 0.216μm.
[0037] As can be seen from the figure, the non-resonant two-dimensional elliptical ultrasonic stamping system provided by the present invention can stamp micro-nano scale textures on the surface of cutting tools, providing support for the promotion of micro-nano texture processing technology on the surface of cutting tools.
[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the technical solutions of the present invention, and these modifications or equivalent substitutions cannot cause the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.
Claims
1. A non-resonant two-dimensional elliptical ultrasonic stamping processing device, characterized in that: It includes a two-dimensional ultrasonic stamping mechanism, a machine tool clamping mechanism, a cutting tool to be processed, and a control mechanism. The two-dimensional ultrasonic stamping mechanism is connected to the machine tool spindle, and the cutting tool to be processed is mounted on the machine tool clamping mechanism. The machining positioning is completed by adjusting the position of the two-dimensional ultrasonic stamping mechanism and the machine tool clamping mechanism through the machine tool. The control mechanism controls the movement of the two-dimensional ultrasonic stamping mechanism.
2. The non-resonant two-dimensional elliptical ultrasonic stamping processing device according to claim 1, characterized in that: The two-dimensional ultrasonic stamping mechanism includes a spindle adapter plate, a guide rod cylinder, a bracket, a piezoelectric ceramic sheet assembly, a flexible hinge, and a stamping head. The bottom of the spindle adapter plate is fixed to the guide rod cylinder by bolts, and the movable end of the guide rod cylinder is connected to the top of the bracket by bolts. Two piezoelectric ceramic sheet assemblies are arranged perpendicularly at 90° on the bracket. Each piezoelectric ceramic sheet assembly is pre-tightened between the flexible hinge and the bracket by bolts. A stamping head is provided at the bottom of the flexible hinge.
3. The non-resonant two-dimensional elliptical ultrasonic stamping processing device according to claim 2, characterized in that: Each of the piezoelectric ceramic sheet groups consists of alternating piezoelectric ceramic sheets and copper electrode sheets, and the polarization directions of adjacent piezoelectric ceramic sheets in each piezoelectric ceramic sheet group are opposite.
4. The non-resonant two-dimensional elliptical ultrasonic stamping processing device according to claim 3, characterized in that: The tip of the stamping head is made of diamond.
5. The non-resonant two-dimensional elliptical ultrasonic stamping processing device according to claim 4, characterized in that: The two-dimensional ultrasonic stamping mechanism is mounted on the machine tool spindle via a spindle adapter plate, which is compatible with various machine tool spindle interface types.
6. The non-resonant two-dimensional elliptical ultrasonic stamping processing device according to claim 5, characterized in that: The control mechanism includes an ultrasonic piezoelectric power amplifier, a power amplifier control line, a multi-function acquisition card, a computer, and a pneumatic control valve. The guide rod cylinder is connected to the pneumatic control valve via an air pipe. The copper electrode of each piezoelectric ceramic plate group is connected to the ultrasonic piezoelectric power amplifier via a piezoelectric ceramic cable. Each ultrasonic piezoelectric power amplifier is connected to the multi-function acquisition card via a power amplifier control line. The multi-function acquisition card is connected to the computer via a data cable.
7. The non-resonant two-dimensional elliptical ultrasonic stamping processing device according to claim 6, characterized in that: The cutting tool to be processed is mounted on a tool holder, which is mounted on a machine tool clamping mechanism. The machine tool clamping mechanism drives the cutting tool to rotate to achieve machining positioning.
8. The non-resonant two-dimensional elliptical ultrasonic stamping processing device according to claim 7, characterized in that: The two-dimensional ultrasonic stamping mechanism is a non-resonant design. The two piezoelectric ceramic sheet groups arranged at 90° vertically are driven by the ultrasonic piezoelectric power amplifier to perform sinusoidal expansion and contraction with adjustable frequency, adjustable amplitude and arbitrary phase, thereby driving the stamping head to complete various forms of two-dimensional elliptical ultrasonic vibration, and stamping out micro-nano scale textures with controllable size and depth on the surface of the cutting tool.
9. The method of using a non-resonant two-dimensional elliptical ultrasonic stamping processing device as described in any one of claims 1-8, characterized in that: The non-resonant two-dimensional elliptical ultrasonic stamping processing device includes the following steps when completing micro-nano scale textured stamping: Step 1: Install the two-dimensional ultrasonic stamping mechanism on the machine tool spindle, install the cutting tool to be processed on the machine tool clamping mechanism, connect all cables and air pipes, and adjust the air control valve pressure to the predetermined value. Step 2: Move the machine tool to adjust the relative position of the punch head and the cutting tool. While completing the machining positioning, press the punch head against the surface of the cutting tool and use the pressure of the guide rod cylinder to press the punch head and the cutting tool together. Step 3: After setting the frequency, amplitude, and phase, the computer controls the analog output channel of the multi-functional acquisition card to output two sinusoidal ultrasonic signals. After being amplified by the ultrasonic piezoelectric power amplifier, the signals drive the two piezoelectric ceramic sheet groups to extend and retract, thereby driving the stamping head to complete two-dimensional elliptical ultrasonic vibration and stamping out micro-nano scale textures with controllable size and depth on the surface of the cutting tool.
10. The method of using a non-resonant two-dimensional elliptical ultrasonic stamping processing device according to claim 9, characterized in that: The non-resonant two-dimensional elliptical ultrasonic stamping processing device operates in two modes: single-point multiple stamping mode performs multiple stampings on the same position and controls the number of stampings; continuous single stamping mode can efficiently stamp out continuous micro-nano scale textures.