Process formula optimization method and semiconductor process equipment

Abstract

The invention discloses a process formula optimization method and semiconductor process equipment. When the method is applied to a controller of semiconductor process equipment, the method comprises the following steps: receiving a modification instruction for a process parameter fine tuning coefficient value in a process formula sent by a user side, and storing a modification value of the process parameter fine tuning coefficient value in the modification instruction in local equipment, the dynamic process parameter value is a function about the process parameter fine tuning coefficient value; after each wafer in the process task enters the process chamber, the stored modification value is read from the local device, process processing is carried out on the wafer based on the modification value, each wafer is bound with a path, a process formula is added in the path, and the path comprises the process chamber. The method is easy to manage, process task execution errors are not prone to being caused, and the modification efficiency is improved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and in particular relates to a method for optimizing process formulations and semiconductor process equipment. Background Technology

[0002] Physical vapor deposition (PVD), a thin film deposition technology, is primarily used for depositing various functional thin films and is widely applied in the semiconductor field, including integrated circuits, solar cells, and light-emitting diodes (LEDs). PVD equipment mainly uses magnetron sputtering technology, which bombards a target to form gaseous molecules, which are then ionized into ions, and these ions are deposited to form a thin film. Process formulation is one of the core components of PVD equipment operation, and its design and optimization are crucial for ensuring the performance, yield, and consistency of semiconductor devices.

[0003] When validating a process, it is necessary to fine-tune the process formulation. In related technologies, it is first necessary to create multiple formulations with inconsistent parameters, such as... Figure 1 As shown, then create multiple paths, and add the previously created recipe to the paths as follows. Figure 2 As shown, then create a task, and bind the different wafers and specified paths in the task as follows: Figure 3 As shown, the task is executed. However, the above solution, when there are too many steps in the process recipe, requires manually modifying each key parameter of the process recipe and creating a large number of corresponding paths, which is inefficient. In addition, it requires the creation of multiple process recipes and multiple paths, which is cumbersome to manage and can easily cause errors in the execution of process tasks. Summary of the Invention

[0004] The purpose of this application is to provide a method for optimizing process formulations and semiconductor process equipment to solve the problems of low modification efficiency, cumbersome management, and easy errors in the execution of process tasks in related technologies.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, embodiments of this application provide a method for optimizing a process recipe, applied in a controller of a semiconductor process equipment. The method includes: receiving a modification instruction sent by a user terminal for a process parameter fine-tuning coefficient value in the process recipe, and storing the modified value of the process parameter fine-tuning coefficient value in the modification instruction in a local device. The process recipe includes dynamic process parameter values, which are functions of the process parameter fine-tuning coefficient values. After each wafer enters the process chamber in a process task, the modified value of the process parameter fine-tuning coefficient value stored in the local device is read, and the wafer is processed based on the modified value of the process parameter fine-tuning coefficient value. Each wafer is bound to a path, the process recipe is added to the path, and the path includes the process chamber.

[0006] Secondly, embodiments of this application provide a method for optimizing a process recipe, applied to a user end. The method includes: sending a modification instruction for a process parameter fine-tuning coefficient value in the process recipe to a controller of a semiconductor process equipment. The modification instruction includes a modification value for the process parameter fine-tuning coefficient value. The process recipe includes dynamic process parameter values, which are functions of the process parameter fine-tuning coefficient values. The controller then performs the following operations: storing the modification value for the process parameter fine-tuning coefficient value in a local device; and after each wafer enters the process chamber in a process task, reading the stored modification value for the process parameter fine-tuning coefficient value from the local device, and performing process processing on the wafer based on the modification value for the process parameter fine-tuning coefficient value. Each wafer is bound to a path, the path containing the process recipe, and the path including the process chamber; and storing the modification value for the process parameter fine-tuning coefficient value.

[0007] Thirdly, embodiments of this application provide a semiconductor process apparatus, including: a controller and a user terminal connected to the controller, the controller being disposed in a host computer and / or a slave computer of the semiconductor process apparatus, the controller being used to implement the steps of the process formulation optimization method as described in the first aspect embodiment of this application, and the user terminal being used to implement the steps of the process formulation optimization method as described in the second aspect embodiment of this application.

[0008] The above-described technical solutions adopted in the embodiments of this application can achieve the following beneficial effects: In this embodiment, when optimizing the process recipe, a modification instruction for the process parameter fine-tuning coefficient value in the process recipe is received from the user terminal. The modified value of the process parameter fine-tuning coefficient value in the modification instruction is stored in the local device. The process recipe includes dynamic process parameter values, which are functions of the process parameter fine-tuning coefficient values. After each wafer enters the process chamber in the process task, the stored modified value of the process parameter fine-tuning coefficient value is read from the local device, and the wafer is processed based on the modified value. Each wafer is bound to a path, and the path contains the process recipe and includes the process chamber. This embodiment, by setting dynamic process parameter values ​​in the process recipe that change with the process parameter fine-tuning coefficient value, only requires creating one process recipe and one path, simplifying management and reducing the likelihood of errors in process task execution. Furthermore, when different steps use the same process parameter fine-tuning coefficient value, modification of the process parameter fine-tuning coefficient value can simultaneously modify multiple steps, improving modification efficiency. Attached Figure Description

[0009] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 A schematic diagram for creating multiple formulations in related technologies; Figure 2 A schematic diagram illustrating the establishment of multiple paths in related technologies; Figure 3 A diagram illustrating the creation of a task within the relevant technology; Figure 4 A schematic flowchart illustrating a method for optimizing a process formulation, provided as an embodiment of this application; Figure 5 A schematic diagram illustrating the creation of process parameter fine-tuning coefficient values ​​provided for one embodiment of this application; Figure 6 A schematic diagram of process parameter settings provided for one embodiment of this application; Figure 7 A schematic flowchart illustrating a method for optimizing a process formulation, provided as another embodiment of this application; Figure 8 A schematic flowchart illustrating a method for optimizing a process formulation, provided as another embodiment of this application; Figure 9 A schematic flowchart illustrating a method for optimizing a process formulation, provided as another embodiment of this application; Figure 10 This is a schematic diagram of the structure of a semiconductor process apparatus provided in one embodiment of this application. Detailed Implementation

[0010] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0011] The terms "first," "second," etc., used in this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, "and / or" in this application indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship. It should be noted that all data involved in this application was obtained with the user's authorization.

[0012] PVD, a thin-film deposition technology, is mainly used for the deposition of various functional thin films and is widely used in the semiconductor industry, including integrated circuits, solar cells, and LEDs. PVD equipment primarily uses magnetron sputtering technology, which bombards a target to form gaseous molecules that are ionized into ions, which are then deposited to form a thin film. The process formulation is one of the core components of PVD equipment operation. In semiconductor manufacturing, each process step has its specific process parameters and conditions; the precise combination of these parameters is called the process formulation or process flow. Validating a new process generally requires the following four stages: 1) Laboratory Research and Development: First, in the research and development stage, researchers will conduct preliminary exploration and testing of new process formulations in a laboratory environment. Through the Design of Experiment (DOE) method, they will adjust and optimize various process parameters in order to achieve the expected material properties and device performance.

[0013] 2) Small-scale pilot production: Once the laboratory results meet the initial requirements, small-batch production verification will be carried out on a small-scale pilot line to evaluate the stability and reproducibility of the process. Life tests and reliability tests may also be conducted.

[0014] 3) Pilot Line Validation: The new process is further transferred to the pilot production line for larger-scale validation. The goal of this stage is to conduct a comprehensive and in-depth evaluation of the process, including yield improvement, process control capabilities, defect analysis, and countermeasure formulation.

[0015] 4) Pre-production validation: After the validation of the previous stages, validation needs to be carried out on a large production line that is close to or equal to the actual production environment to examine the performance of the new process in continuous production, such as whether it can maintain a stable yield and product quality, and whether it meets the cost-benefit analysis.

[0016] Process formulation design and optimization are crucial for ensuring semiconductor device performance, yield, and consistency. For a near-completed process formulation, engineers will customize and fine-tune process parameters according to requirements and conduct extensive testing and verification. When customers purchase new chambers, they typically purchase individual chambers for verification. For a single path, such as LoadPort (LP) 1 → Load Lock (LL) B → Chamber (Ch) A → Ch1 (the chamber requiring process verification) → ChB → LLB → LP1, process verification requires fine-tuning the process formulation. In related technologies, this is generally done remotely via a process formulation editing interface, where the formulation is first copied, and then some process parameters are manually fine-tuned, resulting in multiple formulations with inconsistent parameters, such as... Figure 1 As shown, Particle-1, ..., Particle-9 are used to establish multiple paths, such as... Figure 2 For example, add the previously created recipes to the paths for test_1, ..., test_9, as shown. Figure 2 As shown, add the third step in the path test_7. Figure 1 Use the recipe Particle-7 in the middle, and then create a task, such as Figure 2 The test shown binds different wafers in the task to specified paths, such as... Figure 3 The diagram shows how wafers in slots 1-3 are bound to the path test_1, ..., to execute tasks. However, this approach suffers from low efficiency when there are too many steps in the process recipe. Manually modifying key parameters and creating numerous corresponding paths is inefficient, requiring multiple process recipes and paths, leading to cumbersome management and potential errors in process task execution. Therefore, this application proposes a process recipe optimization method, semiconductor process equipment, and storage medium to address the problems of low modification efficiency, cumbersome management, and potential errors in process task execution in related technologies.

[0017] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0018] Figure 4 This is a schematic flowchart illustrating a method for optimizing a process formulation, provided as an embodiment of this application. Figure 4 As shown, the process formulation optimization method of this application embodiment, applied to the controller of semiconductor process equipment, may specifically include the following steps: S401, receives a modification instruction sent by the user terminal for the process parameter fine-tuning coefficient value in the process formula, and stores the modified value of the process parameter fine-tuning coefficient value in the modification instruction in the local device. The process formula includes dynamic process parameter values, and the dynamic process parameter values ​​are functions of the process parameter fine-tuning coefficient values.

[0019] In this embodiment of the application, the execution subject of the process formulation optimization method is a controller, which can be set in the host computer and / or slave computer of the semiconductor process equipment (such as PVD equipment).

[0020] like Figure 5 As shown, the controller can pre-create process parameter fine-tuning coefficient values ​​such as T0~T9 and P0-P9, and set at least one of the following information for the process parameter fine-tuning coefficient values: value range (e.g., 0~10), default value (e.g., 1), and current value (e.g., 1). By modifying the values ​​of T0~T9 (T value can generally fine-tune time parameters) and P0-P9 (P value can generally fine-tune power parameters), the process formula can be fine-tuned.

[0021] It should be noted that the controller can also generate an Equipment Constant Identity Document (ECID) based on the fine-tuning coefficients of the set process parameters, and send the ECID to the user terminal (or the factory terminal), such as the user's Equipment Automation Program (EAP). The user terminal receives the ECID sent by the controller, reads the ECID, and enters the process task execution system.

[0022] The controller creates a process recipe, and the process parameters in the recipe can be set in two modes: a fixed parameter mode and a parameterized mode. Figure 6 The dynamic parameter modes shown can be used in both modes within the same recipe.

[0023] In dynamic parameter mode, the actual value of the process parameter is set as the dynamic process parameter value, and the dynamic process parameter value is RCP. Actual RCP is a function of the process parameter fine-tuning coefficient value X. Actual =f(X), by modifying the value of X, the dynamic process parameter value RCP can be modified. Actual This allows for fine-tuning of the process formulation.

[0024] In fixed parameter mode, the actual value of the process parameter is set to a fixed process parameter value, which is a value calculated based on the above formula and a fixed X.

[0025] In some embodiments, a dynamic process parameter value RCP can be set.Actual It is linearly related to the value of the process parameter fine-tuning coefficient, such as setting the dynamic process parameter value RCP. Actual For: the set value of the process parameter RCP Setting The sum of the product X of the process parameter fine-tuning coefficient and the set constant C, i.e., the above formula RCP. Actual =f(X) can be specifically set as the following formula: RCP Actual =RCP Setting *X+C Among them, RCP Setting C represents the set value of the process parameters in the process formula, and C is a set constant.

[0026] For example, in the process formula to be optimized, if only the power value in step 3 needs to be fine-tuned, then the power value in step 3 can be set to 3000*P0+0.

[0027] It should be noted here that different steps can use the same process parameter fine-tuning coefficient value X. For example, if both steps 2 and 3 use the process parameter fine-tuning coefficient value T0, then when T0 is modified later, for example, when T0 is modified to 1.001, the T0 in steps 2 and 3 will be modified to 1.001 together.

[0028] Edit a path and add the process recipe created in step S401 above to that path. The path includes multiple process chambers, and at least one of the process chambers includes a process chamber for the process to be validated that corresponds to the process recipe. The process of editing the path and adding the process recipe is similar to... Figure 2 The process shown is similar.

[0029] Create a process task and bind each wafer in the process task to the path obtained in step S402, and then start executing the process task.

[0030] The client pre-sets specific values ​​for the corresponding process parameter fine-tuning coefficients for each wafer in the process task. It does not require an offline process chamber or stopping the process task. Instead, when the process parameter fine-tuning coefficient value of a certain wafer (e.g., the nth wafer) needs to be modified, at any time after the previous wafer (e.g., the (n-1th wafer) enters the process chamber and before the current wafer (e.g., the nth wafer) enters the process chamber, a modification instruction for the process parameter fine-tuning coefficient value of the wafer (e.g., the nth wafer) is sent. The modification instruction includes the modified value of the process parameter fine-tuning coefficient value of the wafer (e.g., the nth wafer).

[0031] Assuming the process task includes 25 wafers, all using the same process recipe, the user terminal sets the P0 value sequence for step 3 for the 25 wafers as [1, 1.001, 1.002, 1.003, 1.004, 1.005, ..., 1.025], a total of 25 process parameter fine-tuning coefficient values. The P0 value is 1 before the process task starts. Therefore, the P0 value does not need to be modified before the first wafer enters the process chamber. However, after the first wafer enters the process chamber and before the second wafer enters the process chamber, a modification command must be sent, which includes the modification value 1.001.

[0032] After receiving the modified value sent by the user, the controller stores the modified value in the local device, such as in the local database. For example, it can store it in a file in the database in XML format. The modified value stored in the local device for a certain process parameter fine-tuning coefficient is only one. The local device only stores the last received modified value to prevent the loss of modified values ​​that have taken effect when the controller exits and restarts unexpectedly. Alternatively, if the user has previously sent the modified value that they want to use, it will not be resent after the controller restarts. The modified value stored locally will take effect directly to prevent the loss of the latest modified value.

[0033] In addition, if the user sends multiple modification commands for the same process parameter fine-tuning coefficient value in the same process chamber after the (n-1)th wafer enters the process chamber but before the nth wafer enters the process chamber, the controller, since it only stores one modification value for each process parameter fine-tuning coefficient value, will store the final modified value as the last modified value sent by the user through multiple modifications. This modified value will take effect after the nth wafer enters the process chamber, preventing errors in the execution of process tasks caused by user-side anomalies (e.g., the modified value in the first modification command sent by the user is incorrect and needs to be corrected, so a second modification command will be sent).

[0034] It's important to note that after the user sends a modification command, it also stores the modified value and the corresponding sending time on its local device. Similarly, after receiving a modification command, the control terminal stores both the modified value and the corresponding storage time on its local device. If the control terminal detects an anomaly in the user's modified value, such as a malfunction in the user's automation system or the sending of an incorrect modified value, it can quickly troubleshoot and trace the cause based on the stored data (modified value and corresponding storage time).

[0035] It should be noted that, for a single process formulation to be optimized, related technologies require the creation of multiple process formulations and multiple paths. However, this embodiment only requires one process formulation and one path, simplifying management, reducing the likelihood of errors in process task execution, and allowing for simultaneous modification of multiple steps when different steps use the same process parameter fine-tuning coefficient value, thus improving modification efficiency. For example, if a process task involves 25 wafers using the same process formulation, and only the power value in step 3 needs fine-tuning, related technologies would require creating 25 process formulations, modifying the power value in step 3 of each formulation, and then creating 25 paths bound to those 25 process formulations. In this embodiment, only one process recipe needs to be created, and the power value in step 3 is set to dynamic parameter mode, for example, 3000*P0+0. The user terminal can set the P0 value sequence for step 3 for 25 wafers as [1, 1.001, 1.002, 1.003, 1.004, 1.005, ..., 1.025], a total of 25 process parameter fine-tuning coefficient values. If you want to use the same P value on multiple wafers to prevent errors in the process results due to wafer differences, you can modify the data corresponding to the P value sequence to be the same, for example [1.001, 1.001, 1.001, 1.003, 1.003, 1.003, ..., 1.025]. In this example, wafers 1, 2, and 3 use P value 1.001 with the same process recipe, and wafers 4, 5, and 6 use P value 1.003 with the same process recipe.

[0036] S402: After each wafer enters the process chamber in the process task, the modified value of the process parameter fine-tuning coefficient value stored in the local device is read, and the wafer is processed based on the modified value of the process parameter fine-tuning coefficient value.

[0037] In this embodiment, after each wafer enters the process chamber, the controller reads the modified value stored in the local device into memory and performs process processing on the wafer based on the modified value. That is, if the modified value is received after the (n-1)th wafer enters the process chamber but before the nth wafer enters the process chamber, for example, during the process of the (n-1)th wafer, the modified value is stored locally and does not take effect on the (n-1)th wafer. That is, the (n-1)th wafer still uses the previous parameters to perform the process. Instead, after the nth wafer enters the process chamber, the modified value is read from the local device into memory and takes effect on the nth wafer. That is, the nth wafer uses the modified value to perform the process.

[0038] Furthermore, such as Figure 7 As shown, step S402, "processing the wafer based on the modified value of the process parameter fine-tuning coefficient," may specifically include the following steps: S701 sends the modified values ​​of the process parameter fine-tuning coefficients to the user terminal.

[0039] In this embodiment of the application, after each wafer enters the process chamber, the controller reads the modified value of the process parameter fine-tuning coefficient stored in the local device and sends the modified value to the user terminal.

[0040] As one possible implementation, the controller sends a wafer entry notification message to the user terminal after each wafer enters the process chamber.

[0041] After receiving the wafer entry notification message, the user terminal sends a reply message to the controller and triggers the modified value verification mechanism. The user terminal then sends a modified value retrieval command to the controller. The controller receives the modified value retrieval command sent by the user terminal.

[0042] The controller receives the modification value and retrieves the modified value of the process parameter fine-tuning coefficient from the local device, and sends the modified value to the user terminal.

[0043] S702 receives a verification pass message sent by the user terminal. The verification pass message is sent by the user terminal after determining that the modified value of the received process parameter fine-tuning coefficient is consistent with the modified value of the process parameter fine-tuning coefficient corresponding to the wafer stored in its own memory.

[0044] In this embodiment, the user terminal determines whether the received modified value is consistent with the locally stored modified value corresponding to the wafer entering the process chamber. If they are consistent, the user terminal sends a verification pass message to the controller. The controller receives the verification pass message. If they are inconsistent, the user terminal sends a verification fail message to the controller. The controller receives the verification fail message.

[0045] Since the user terminal can send modification commands at any time to modify the specific values ​​of the process parameter fine-tuning coefficients, a verification mechanism is added to prevent abnormal situations or the use of incorrect process formulas. The user terminal compares the received modified value with the corresponding modified value stored locally to determine whether the modification is accurate. In other words, the user terminal can remotely monitor whether the modification is correct to ensure the correctness of the executed process formula.

[0046] S703, based on the verification pass message, performs process processing on the wafer based on the modified value of the process parameter fine-tuning coefficient.

[0047] In this embodiment of the application, after receiving the verification pass message, the controller performs process processing on the wafer based on the modified value read from the local machine.

[0048] Furthermore, the optimization method of the process formulation in this application embodiment may also include the following steps: receiving a verification failure message sent by the user terminal, wherein the verification failure message is sent by the user terminal when it is determined that the modified value of the received process parameter fine-tuning coefficient value is inconsistent with the modified value of the process parameter fine-tuning coefficient value corresponding to the wafer stored therein; and controlling the process chamber to go offline according to the verification failure message.

[0049] In this embodiment of the application, after receiving a verification failure message, the controller controls the process chamber to go offline, ending the process formulation optimization process.

[0050] In summary, the process formulation optimization method of this application embodiment, by setting dynamic process parameter values ​​that change with the process parameter fine-tuning coefficient values ​​in the process formulation, only requires one process formulation and one path, simplifying management and reducing the likelihood of errors in executing process tasks. Furthermore, when different steps use the same process parameter fine-tuning coefficient value, modifications to the process parameter fine-tuning coefficient value can be implemented simultaneously across multiple steps, improving modification efficiency. Through a verification mechanism, the user terminal compares the received modified value with the corresponding locally stored modified value to determine if the modification is accurate, ensuring the correctness of the executed process formulation and preventing anomalies or the use of incorrect process formulations. Modified values ​​are stored in the controller's local device to prevent the loss of effective modified values ​​when the controller unexpectedly exits and restarts. Alternatively, if the user terminal has previously sent the desired modified value, it will not resend it after restarting the controller; the locally stored modified value will take effect directly, preventing the loss of the latest modified value.

[0051] To clearly illustrate the optimization method of the process formulation in the embodiments of this application, the following is combined with... Figure 8 The optimization method of the process formulation in the embodiments of this application will be described in detail. For example... Figure 8 As shown, it includes the following steps: S801, the controller creates a process recipe.

[0052] S802, the controller edits a path.

[0053] S803, the controller creates a process task.

[0054] S804, the semiconductor process equipment is in an idle state (the modified value takes effect immediately).

[0055] S805, process task begins.

[0056] S806, the process chamber is in an idle state (the modified value takes effect immediately).

[0057] S807 allows the user terminal to send modification commands, including the modified value, at any time. Specifically, the user terminal sends the modification command, and the controller sends a modification completion message.

[0058] S808: After the wafer enters the process chamber, the controller sends a wafer entry notification message.

[0059] S809, the user terminal receives a wafer arrival notification message. Specifically, the user terminal sends a reply message, triggering the verification mechanism, i.e., executing step S810.

[0060] S810, the user terminal initiates the verification mechanism. Specifically, the user terminal sends a modified value retrieval command, and the controller replies with the modified value.

[0061] S811: The user terminal checks whether the received modified value matches the locally stored value. If not, it sends a verification failure message. If yes, it sends a verification success message.

[0062] S812, the controller controls the process chamber to be taken offline based on the verification failure message.

[0063] S813, the controller performs process processing on the wafer based on the verification pass message (the modified value takes effect on the next wafer).

[0064] S814, wafer processing ends. If there are remaining wafers, proceed to step S815. If there are no remaining wafers, proceed to step S816.

[0065] S815, wafer output. Return to step S806.

[0066] S816, Process task completed. Return to step S804.

[0067] Figure 9 This is a schematic flowchart illustrating a method for optimizing a process formulation, provided as another embodiment of this application. Figure 9 As shown, the process formulation optimization method of this application embodiment, when applied to a user terminal, may specifically include the following steps: S901, a modification instruction for the process parameter fine-tuning coefficient value in the process recipe is sent to the controller of the semiconductor process equipment. The modification instruction includes the modification value of the process parameter fine-tuning coefficient value. The process recipe includes dynamic process parameter values, which are functions of the process parameter fine-tuning coefficient values, so that the controller can perform the following operations: store the modification value of the process parameter fine-tuning coefficient value in the local device, and after each wafer in the process task enters the process chamber, read the stored modification value of the process parameter fine-tuning coefficient value from the local device, and perform process processing on the wafer based on the modification value of the process parameter fine-tuning coefficient value. Each wafer is bound to a path, and the path contains the process recipe and includes the process chamber.

[0068] S902, Modification value of the fine-tuning coefficient for storage process parameters.

[0069] Furthermore, the optimization method for the process formulation in this application embodiment may further include the following steps: receiving a modified value of the process parameter fine-tuning coefficient sent by the controller after each wafer enters the process chamber; determining whether the received modified value of the process parameter fine-tuning coefficient is consistent with the stored modified value of the process parameter fine-tuning coefficient corresponding to the wafer; if consistent, sending a verification pass message to the controller, so that the controller can perform process processing on the wafer based on the modified value of the process parameter fine-tuning coefficient according to the verification pass message; if inconsistent, sending a verification fail message to the controller, so that the controller can control the process chamber to be taken offline according to the verification fail message.

[0070] Furthermore, the process formulation optimization method of this application embodiment may also include the following steps: receiving a device constant identifier sent by the controller, wherein the device constant identifier is generated by the controller according to the set process parameter fine-tuning coefficient value, and the information of the set process parameter fine-tuning coefficient value includes at least one of the following: value range, default value and current value.

[0071] In the embodiments of this application, the specific process of optimizing the process formulation can be found in the relevant descriptions in the above embodiments, and will not be repeated here.

[0072] In summary, the process formulation optimization method of this application, by setting dynamic process parameter values ​​that change with the process parameter fine-tuning coefficient, only requires one process formulation and one path. This simplifies management, reduces the likelihood of errors in process task execution, and allows for simultaneous modification of multiple steps when different steps use the same process parameter fine-tuning coefficient value, improving modification efficiency. Through a verification mechanism, the user terminal compares the received modified value with the corresponding locally stored modified value to determine accuracy, ensuring the correctness of the executed process formulation and preventing anomalies or the use of incorrect process formulations.

[0073] This application also provides a semiconductor process apparatus. For example... Figure 10 As shown, the semiconductor process equipment 1000 includes: a controller 1001 and a user terminal 1002 connected to the controller 1001. The controller 1001 is disposed in the host computer and / or slave computer of the semiconductor process equipment 1000. The controller 1001 is used to implement the relevant steps of the optimization method embodiment of any of the above process recipes, and the user terminal 1002 is used to implement the relevant steps of the optimization method embodiment of any of the above process recipes.

[0074] The semiconductor process equipment in this application embodiment, by setting dynamic process parameter values ​​in the process recipe that change with the fine-tuning coefficient values ​​of the process parameters, only requires one process recipe and one path. This simplifies management, reduces the likelihood of errors in executing process tasks, and allows for simultaneous modification of multiple steps when different steps use the same fine-tuning coefficient value, improving modification efficiency. A verification mechanism compares the received modified value with the corresponding locally stored modified value to determine accuracy, ensuring the correctness of the executed process recipe and preventing anomalies or the use of incorrect process recipes. Modified values ​​are stored locally on the controller to prevent loss of effective modified values ​​when the controller unexpectedly exits and restarts. Alternatively, if the user has previously sent the desired modified value, restarting the controller does not require resending; the locally stored modified value takes effect immediately, preventing the loss of the latest modified value.

[0075] This application also proposes a readable storage medium storing one or more computer programs, the one or more computer programs including instructions. When the program or instructions are executed by a processor in a semiconductor process apparatus including multiple applications, the processor in the semiconductor process apparatus is able to perform various processes of the above-described process recipe optimization method embodiments, and is specifically used to perform the steps of any of the above-described process recipe optimization method embodiments.

[0076] The readable storage medium of this application embodiment, by setting dynamic process parameter values ​​in the process recipe that change with the fine-tuning coefficient values ​​of the process parameters, only requires creating one process recipe and one path, simplifying management and reducing the likelihood of errors in executing process tasks. Furthermore, when different steps use the same fine-tuning coefficient value, modifications to the fine-tuning coefficient value can be implemented simultaneously across multiple steps, improving modification efficiency. Through a verification mechanism, the user terminal compares the received modified value with the corresponding locally stored modified value to determine if the modification is accurate, ensuring the correctness of the executed process recipe and preventing anomalies or the use of incorrect process recipes. Modified values ​​are stored in the controller's local device to prevent the loss of effective modified values ​​when the controller unexpectedly exits and restarts. Alternatively, if the user terminal has previously sent the desired modified value, it will not be resent after restarting the controller; the locally stored modified value will take effect directly, preventing the loss of the latest modified value.

[0077] The systems, devices, modules, or units described in the above embodiments can be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, a computer can be, for example, a personal computer, laptop computer, cellular phone, camera phone, smartphone, personal digital assistant, media player, navigation device, email device, game console, tablet computer, wearable device, or any combination of these devices.

[0078] For ease of description, the above devices are described separately by function as various units. Of course, in implementing this application, the functions of each unit can be implemented in one or more software and / or hardware.

[0079] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0080] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0081] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0082] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0083] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0084] Memory may include non-persistent storage in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0085] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0086] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0087] This application can be described in the general context of computer-executable instructions, such as program modules, that are executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform a specific task or implement a specific abstract data type. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0088] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0089] The above are merely embodiments of this application and are not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A method for optimizing a process formulation, characterized in that, The method, applied in a controller for semiconductor process equipment, includes: The system receives a modification instruction from the user terminal for the fine-tuning coefficient value of the process parameter in the process formula, and stores the modified value of the fine-tuning coefficient value of the process parameter in the modification instruction in the local device. The process formula includes dynamic process parameter values, and the dynamic process parameter values ​​are functions of the fine-tuning coefficient values ​​of the process parameter. After each wafer enters the process chamber in the process task, the modified value of the process parameter fine-tuning coefficient value stored in the local device is read, and the wafer is processed based on the modified value of the process parameter fine-tuning coefficient value. Each wafer is bound to a path, and the process recipe is added to the path. The path includes the process chamber.

2. The method according to claim 1, characterized in that, The dynamic process parameter values ​​are linearly correlated with the process parameter fine-tuning coefficient values.

3. The method according to claim 1, characterized in that, The process of processing the wafer based on the modified value of the process parameter fine-tuning coefficient includes: The modified value of the process parameter fine-tuning coefficient is sent to the user terminal; The user terminal receives a verification pass message, which is sent by the user terminal after determining that the modified value of the received process parameter fine-tuning coefficient is consistent with the modified value of the process parameter fine-tuning coefficient corresponding to the wafer stored in its own memory. Based on the verification pass message, the wafer is processed according to the modified value of the process parameter fine-tuning coefficient.

4. The method according to claim 3, characterized in that, Also includes: The system receives a verification failure message sent by the user terminal. The verification failure message is sent by the user terminal when it determines that the modified value of the received process parameter fine-tuning coefficient is inconsistent with the modified value of the process parameter fine-tuning coefficient corresponding to the wafer stored in its own memory. Based on the verification failure message, the process chamber is controlled to be taken offline.

5. The method according to claim 1, characterized in that, Also includes: The storage time for storing the modified values ​​of the process parameter fine-tuning coefficients in the local device.

6. The method according to claim 1, characterized in that, Before receiving the instruction from the user terminal to modify the process parameter fine-tuning coefficient value in the process formula, the method further includes: Create the process parameter fine-tuning coefficient value, and set at least one of the following information for the process parameter fine-tuning coefficient value: value range, default value, and current value; Based on the set process parameter fine-tuning coefficient value, a device constant identifier is generated and sent to the user terminal.

7. A method for optimizing a process formulation, characterized in that, When applied to a user terminal, the method includes: A modification instruction for the process parameter fine-tuning coefficient value in the process recipe is sent to the controller of the semiconductor process equipment. The modification instruction includes a modification value for the process parameter fine-tuning coefficient value. The process recipe includes dynamic process parameter values, which are functions of the process parameter fine-tuning coefficient values. The controller performs the following operations: stores the modification value for the process parameter fine-tuning coefficient value in a local device, and after each wafer enters the process chamber in the process task, reads the stored modification value for the process parameter fine-tuning coefficient value from the local device, and performs process processing on the wafer based on the modification value for the process parameter fine-tuning coefficient value. Each wafer is bound to a path, the path of which contains the process recipe, and the path includes the process chamber. Store the modified values ​​of the process parameter fine-tuning coefficients.

8. The method according to claim 7, characterized in that, Also includes: Receive the modified value of the process parameter fine-tuning coefficient sent by the controller after each wafer enters the process chamber; Determine whether the received modified value of the process parameter fine-tuning coefficient is consistent with the stored modified value of the process parameter fine-tuning coefficient corresponding to the wafer; If they match, a verification pass message is sent to the controller, so that the controller can perform process processing on the wafer based on the modified value of the process parameter fine-tuning coefficient value according to the verification pass message; If there is a discrepancy, a verification failure message is sent to the controller, so that the controller can control the process chamber to be taken offline based on the verification failure message.

9. The method according to claim 7, characterized in that, Also includes: The device constant identifier sent by the controller is received. The device constant identifier is generated by the controller based on the set process parameter fine-tuning coefficient value. The information of the set process parameter fine-tuning coefficient value includes at least one of the following: value range, default value, and current value.

10. A semiconductor process apparatus, characterized in that, include: The controller and the user terminal connected to the controller, wherein the controller is disposed in the host computer and / or slave computer of the semiconductor process equipment, the controller is used to implement the steps of the method as described in any one of claims 1-5, and the user terminal is used to implement the steps of the method as described in any one of claims 6-9.

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