Refrigerating and heating device

Abstract

The invention provides a refrigerating and heating device, and belongs to the technical field of refrigerating and heating. The refrigerating and heating device comprises a heat regenerator, a driver and a heat exchanger. The heat regenerator comprises a sleeve and a solid elastic clamping assembly and is provided with an inlet and an outlet. A first through hole for heat conduction fluid to circulate is formed between the connected solid elastic clamping piece and the adjacent solid elastic clamping piece, and the first through hole is communicated with the inlet and the outlet to form a flow cavity. The solid elastic clamping pieces are connected through the connecting piece, and a first through hole for the heat conduction fluid to pass through is formed between the connected solid elastic clamping pieces, so that the first through hole can be communicated with the inlet and the outlet to form a flow cavity. The structure can be obtained only through simple stamping, the hollow-out through hole structures can be formed among the multiple solid elastic clamping pieces through the connecting pieces for fluid circulation, and therefore the processes of drilling, linear cutting and the like are avoided, the overall process is simpler, and loss of solid elastic clamping materials can be reduced.

Description

Technical Field

[0001] This application belongs to the field of refrigeration and heating technology, and specifically relates to a refrigeration and heating device. Background Technology

[0002] Solid-state spring-loaded cooling and heating technology is a new type of green cooling and heating technology that has emerged in recent years. Its core principle lies in periodically applying or removing stress to the solid spring-loaded material through an external driving device, inducing a phase change or reverse phase change process in the material, thereby releasing or absorbing heat. To achieve efficient heat transfer, cooling and heating devices built based on this principle typically have flow cavities inside or around the solid spring-loaded material, and a fluid pump drives a heat transfer medium through this area, thereby carrying the cold or heat generated by the material to a heat exchanger.

[0003] However, existing refrigeration and heating devices have certain structural flaws. To ensure the smooth passage of the heat transfer medium and sufficient heat exchange, additional drilling or cutting of the solid spring clip material placed inside the regenerator is usually required to create fluid channels. This complicates the process and increases the difficulty of machining, alignment, and fixing. Furthermore, secondary processing of the pre-formed solid spring clip material inevitably leads to material wear and waste, and may even cause microcracks under processing stress, affecting the spring clip life and reliability of the material. Summary of the Invention

[0004] This application provides a cooling and heating device, including a regenerator, a driver, and a heat exchanger; The regenerator includes a sleeve and a solid spring clip assembly. The sleeve has a receiving space, and the solid spring clip assembly is disposed in the receiving space. The regenerator has an inlet and an outlet. The solid spring clip assembly includes at least two solid spring clips, which are connected by a connector. The connected solid spring clips have a first through hole for heat-conducting fluid to flow between them and the adjacent solid spring clips. The first through hole communicates with the inlet and the outlet to form a flow cavity. The driver is used to load the solid-state ejector assembly to cause a phase change and generate heat, or to unload the solid-state ejector assembly to cause a reverse phase change and generate cooling. The heat exchanger is connected to the regenerator via a pipeline so that the heat-conducting medium that absorbs heat or cold can exchange heat.

[0005] In one possible implementation, there are multiple solid-state ejector components, and the multiple solid-state ejector components are stacked to connect the multiple first through holes to form the flow cavity.

[0006] In one possible implementation, the area of ​​the connecting surfaces at both ends of the connector and the solid spring clip is smaller than the area of ​​the cross-section at the middle of the connector.

[0007] In one possible implementation, the thickness of the connector is less than the thickness of the solid spring clip, and the solid spring clip assembly has a recess located between the two solid spring clips.

[0008] In one possible implementation, the connector is provided at one end of the solid-state ejector assembly, and the side of the connector away from the solid-state ejector assembly is arc-shaped.

[0009] In one possible implementation, the solid spring clip has a rectangular, circular, or hexagonal cross-sectional shape.

[0010] In one possible implementation, a second through hole is provided between the solid spring clip and the connector.

[0011] In one possible implementation, the cross-sectional shape of the connector is I-shaped.

[0012] In one possible implementation, the thickness of the solid spring clip is 3-10 mm.

[0013] In one possible implementation, the connector is integrally formed with the solid spring clip.

[0014] In one possible implementation, at least one side of the connector is provided with a soft layer.

[0015] In one possible implementation, the connector is manufactured by injection molding and connected to the solid spring clip.

[0016] In this embodiment, the solid spring clip assembly in the cooling and heating device can connect multiple solid spring clips together via connectors. The connected solid spring clips have a first through-hole through which heat-conducting fluid can pass, allowing the first through-hole to communicate with the inlet and outlet to form a flow cavity. This structure can be obtained simply by stamping. The connectors allow multiple solid spring clips to form a hollow through-hole structure for fluid flow, thus avoiding drilling, wire cutting, and other processes, simplifying the overall process and reducing the loss of solid spring clip material. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a refrigeration and heating device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a regenerator provided in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of a solid-state ejector assembly provided in one embodiment of this application; Figure 4 for Figure 3 Top view; Figure 5 for Figure 3 Front view; Figure 6 This is a schematic diagram of the structure of a solid-state ejector assembly provided in another embodiment of this application; Figure 7 This is a schematic diagram of the structure of a solid-state ejector assembly provided in another embodiment of this application; Figure 8 This is a schematic diagram of the structure of a solid-state ejector assembly provided in another embodiment of this application; Figure 9 This is a front view of a solid-state ejector assembly provided in one embodiment of this application.

[0019] Figure label: 10. Regenerator; 20. Driver; 30. Heat exchanger; 40. Piping; 100. Sleeve; 110. Accommodation space; 200. Solid spring clip assembly; 210. Solid spring clip component; 220. Connector; 230. First through hole; 240. Recess; 250. Second through hole; 260. Soft layer; 300. Inlet; 400. Outlet. Detailed Implementation

[0020] The solid-state tumbler material in this application refers to a solid material with a tumbler (thermal) effect, such as shape memory alloys, natural rubber, synthetic polymers, and plastic crystals. Among them, shape memory alloys (such as nickel-titanium alloys, copper-aluminum-manganese alloys, nickel-manganese-copper-cobalt alloys, and nickel-iron-gallium alloys) are widely used in tumbler solid-state refrigeration technology due to their extremely high phase transition entropy and material energy efficiency ratio. The working principle of the solid-state tumbler refrigeration system based on solid-state tumbler materials is as follows: the driving mechanism periodically applies stress and unloads stress on the solid-state tumbler material, causing the solid-state tumbler material to release heat to rise in temperature and absorb heat to cool down.

[0021] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0022] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0023] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified. Unless otherwise explicitly stated, "A and / or B" includes A, B, and A and B.

[0025] Figure 1 This is a schematic diagram of a cooling and heating device based on solid spring material provided in an embodiment of this application, with reference to... Figures 1 to 8 As shown, this application provides a cooling and heating device based on solid spring clip material, including: a regenerator 10, a driver 20, and a heat exchanger 30; wherein, the regenerator 10 includes a sleeve 100 and a solid spring clip assembly 200, the sleeve 100 has a receiving space 110, the solid spring clip assembly 200 is disposed in the receiving space 110, and the regenerator 10 has an inlet 300 and an outlet 400; the solid spring clip assembly 200 includes at least two solid spring clips 210, the solid spring clips 210 being connected to... The solid spring clip 210 is connected to the solid spring clip 220. The connected solid spring clip 210 has a first through hole 230 for the flow of heat-conducting fluid between it and the adjacent solid spring clip 210. The first through hole 230 is connected to the inlet 300 and the outlet 400 to form a flow cavity. The driver 20 is used to load the solid spring clip assembly 200 to cause it to undergo a phase change and generate heat or unload the solid spring clip assembly 200 to cause it to undergo a reverse phase change and generate cold. The heat exchanger 30 is connected to the regenerator 10 through the pipe 40 so that the heat-conducting medium that absorbs heat or cold can exchange heat.

[0026] In this way, multiple solid spring clips 210 are connected together by connectors 220. The connected solid spring clips 210 have a first through hole 230 through which heat-conducting fluid can pass, so that the first through hole 230 can communicate with the inlet 300 and the outlet 400 to form a flow cavity. The overall process of the regenerator 10 with this structure is simpler and can also reduce the loss of solid spring clip material.

[0027] It should be noted that there may be one or more solid-state ejector components 200. When there is one solid-state ejector component 200, multiple solid-state ejector components 210 are fixed to each other by connectors 220. In order to improve stability, multiple connectors 220 can be set to fix two connected solid-state ejector components 210.

[0028] Furthermore, when there are multiple solid-state spring clip assemblies 200, the multiple solid-state spring clip assemblies 200 are stacked to connect the multiple first through holes 230 to form a flow cavity. In this embodiment, the solid-state spring clip assemblies 200 in the regenerator 10 can be connected by connectors 220 to connect multiple solid-state spring clips 210. The connected solid-state spring clips 210 have first through holes 230 through which heat-conducting fluid can pass, so that the stacked solid-state spring clip assemblies 200 have a flow cavity.

[0029] The first through hole 230 on the solid spring card assembly 200 can be used to supply liquid heat exchange media such as water, ethylene glycol solution, heat transfer oil, nanofluid, and graphene fluid, and can also supply gaseous heat exchange media such as air.

[0030] Understandably, the modular solid spring clips 210 are assembled into components via connectors 220 and then stacked within the sleeve 100, where the first through-hole 230, after stacking, can form a flow cavity. This modular construction simplifies the manufacturing process and reduces production difficulty and costs. It allows the solid spring clips 210 to adopt a standardized unit structure, with the connectors 220 interconnecting to form through-holes, reducing material cutting losses and avoiding the need for cutting or secondary stamping of material to form flow channels, as required by traditional integral structures. Furthermore, the stacked structure prevents defect propagation during loading, improving the lifespan of the solid spring clip material.

[0031] In addition, the shape and size of the first through hole 230 can be adjusted by adjusting the shape and size of the connector 220 to adapt to the requirements of different refrigeration and heating systems.

[0032] In this embodiment, the connector 220 is integrally formed with the solid spring clip 210, or the connector 220 is formed by injection molding and connected to the solid spring clip 210.

[0033] As can be understood, manufacturing the solid spring clip assembly 200 by integral molding eliminates the connection interface between the connector 220 and the solid spring clip 210, improving overall mechanical strength and avoiding stress concentration caused by differences in thermal expansion coefficients, thus extending service life. Since the solid spring clip assembly 200 in this embodiment is integrally molded, the smoothness of the flow channel walls is improved, thereby reducing flow resistance. Integral molding also reduces assembly steps, improves manufacturing efficiency, and the one-time molding process is more suitable for mass production. Because the connector 220 and the solid spring clip 210 are made of the same material, the overall cooling / heating capacity is increased.

[0034] In this embodiment, the connector 220 can also be manufactured using injection molding. Simultaneously with the injection molding of the connector 220, it can be connected to the solid spring clip 210. It is understood that the connector 220 can be made of one or more materials such as rubber, Teflon, polyoxymethylene, nylon, polyester, and silicone. This reduces the weight of the connector 220, thereby reducing the overall weight of the regenerator 10 and achieving weight reduction. Furthermore, the materials used in injection molding generally have higher corrosion resistance than alloy materials, reducing the risk of corrosion damage to the connection points during long-term use and ensuring the integrity of the solid spring clip assembly 200. Moreover, using injection molding to connect the connector 220 to the solid spring clip 210 allows for the creation of a more complex solid spring clip assembly 200, such as adding internal flow channels, thereby improving the overall heat exchange capacity. Additionally, injection molding better supports small-batch production of solid spring clip assemblies 200 with different structures and shapes, reducing costs.

[0035] In this embodiment, the area of ​​the connection surfaces between the two ends of the connector 220 and the solid spring clip 210 is smaller than the area of ​​the cross-section in the middle of the connector 220, or it can be understood that the two ends of the connector 220 are smaller and the middle is larger. This increases the diameter of the first through hole 230, increases the contact area between the heat-conducting fluid and the solid spring clip 210, and thus improves the overall heat exchange efficiency. Specifically, if the connector 220 has a gradually changing cross-section from the middle to both ends, the stress distribution of the connector 220 can also be reduced, and the fatigue life can be improved.

[0036] In this embodiment, reference Figure 4 and Figure 6 As shown, a second through hole 250 is provided between the solid spring clip 210 and the connector 220. Specifically, a second through hole 250 can be provided between the connector 220 and the solid spring clips 210 on both sides. By adding the second through hole 250, it can cooperate with the first through hole 230 to increase the instantaneous flow rate of the heat transfer fluid in the regenerator 10. By opening the second through hole 250 to increase the contact area between the heat transfer fluid and the solid spring clip 210, the heat exchange efficiency can be improved, thereby improving the cooling / heating capacity.

[0037] In this embodiment, reference Figure 4 and Figure 6 As shown, the cross-sectional shape of the connector 220 is I-shaped. It can be understood that the I-shaped connector 220 forms a three- or four-channel structure in its cross-section, with first through holes 230 at the top and bottom, plus second through holes 250 on both sides. The I-shaped structure causes the fluid to form vortices within the through holes, which can increase the Nusselt number. Furthermore, setting the connector 220 to an I-shaped cross-section in this embodiment increases its bending stiffness, and the central rib in the middle makes the stress distribution of the connector 220 more uniform under pressure, which can reduce the maximum stress. In addition, the I-shaped structure provides a more favorable demolding angle during injection molding, which can improve the yield rate.

[0038] Of course, it is understandable that the connector 220 in this application can be, in addition to being I-shaped, also be, for example... Figure 7 and Figure 8 The shape shown can be a straight line or a rectangle, or it can be a double-shaped, O-shaped, arc-shaped, or any other shape that can connect the solid spring clips 210 on both sides.

[0039] In this embodiment, reference Figures 3 to 6 As shown, the thickness of the connector 220 is less than the thickness of the solid spring clip 210. The solid spring clip assembly 200 has a recess 240 located between the two solid spring clips 210. Furthermore, both sides of the connector 220 may have recesses 240. Thus, when the connector 220 and the solid spring clip 210 are not made of the same material, the connector 220 does not need to deform to participate in the cooling / heating operation. Therefore, the driver 20 can load only the solid spring clip 210 without contacting the connector 220. It is understandable that by providing the recess 240, damage to the connector 220 due to prolonged stress can be avoided. The specific dimensions of the recess 240 can be set according to the deformation range of the solid spring clip 210. For example, if the deformation range of the solid spring clip 210 during operation is within 5%, the surface of the connector 220 can be recessed by at least 5% of the thickness of the solid spring clip 210 relative to its surface. More specifically, when both sides of the connector 220 have recesses 240, if the deformation range of the solid spring clip 210 during operation is within 6%, the recesses 240 on both sides can be set to at least 3% of the thickness of the solid spring clip 210. Understandably, this prevents the solid spring clip 210 from being compressed and pressed against the connector 220 during operation. The recesses 240 form a non-contact buffer space, and there is no mechanical interference during the deformation process.

[0040] Additionally, refer to Figure 3 and Figure 5As shown, the recess 240 increases the flow path of the heat-conducting fluid. For example, the heat-conducting fluid can enter the first through hole 230 and / or the second through hole 250 through the recess 240. It is understood that in the stacked solid-state spring clip assemblies 200, the solid-state spring clips 210 are generally in close contact with each other. Due to the presence of the recess 240, a space is formed between the two solid-state spring clip assemblies 200 by the recess 240. In this way, when the heat-conducting fluid passes through the previous solid-state spring clip assembly 200, it can flow from the first through hole 230 of the previous solid-state spring clip assembly 200 to the first through hole 230 of the next solid-state spring clip assembly 200, or from the first through hole 230 or / and the second through hole 250 of the previous solid-state spring clip assembly 200 to the second through hole 250 of the next solid-state spring clip assembly 200, or it can enter the space formed by the recess 240 from the first through hole 230 or / and the second through hole 250 of the previous solid-state spring clip assembly 200, and then flow to the first through hole 230 or / and the second through hole 250 of the next solid-state spring clip assembly 200. Essentially, the recess 240 can serve as a transit point within the flow cavity. When misalignment occurs or the alignment accuracy of the connector 220 is insufficient, the space formed by the recess 240 ensures that the heat-conducting fluid can flow normally.

[0041] In this embodiment, reference Figure 7 As shown, a connector 220 is provided at one end of the solid spring clip assembly 200, and the side of the connector 220 away from the solid spring clip 210 is arc-shaped. Specifically, the connector can be located at one end of the solid spring clip 210. Thus, when the connector 220 is injection molded, its location at one end of the solid spring clip 210 prevents the solid spring clip 210 from directly scraping against the inner wall of the sleeve 100 and causing damage when it moves during operation. More specifically, connectors 220 can be provided at both ends of the solid spring clip assembly 200. Furthermore, multiple connectors 220 at one end can be connected together to form a single unit.

[0042] Understandably, the side of the connector 220 away from the solid spring clip 210 is arc-shaped. When the solid spring clip 210 moves during operation, the arc-shaped connector 220 can prevent it from directly scraping against the inner wall of the sleeve 100, effectively preventing damage and extending its service life. The connector 220 is located at one end of the solid spring clip 210. When manufactured using injection molding, this structure facilitates molding, improving production efficiency and yield. Connectors 220 are provided at both ends of the solid spring clip assembly 200, and multiple connectors 220 at one end can be connected into a single unit, thereby enhancing the structural stability and mechanical strength of the assembly, enabling it to work reliably even under complex working conditions. Furthermore, the arc-shaped solid spring clip assembly 200 has a low probability of wear even when it rubs against the inner wall of the sleeve 100.

[0043] In this embodiment, the solid spring clip 210 has a rectangular, circular, or hexagonal cross-sectional shape. It is understood that solid spring clips 210 with different cross-sectional shapes can better fit different sleeves 100. For example, if the sleeve 100 is square, using a solid spring clip 210 with a rectangular or hexagonal cross-sectional shape allows for the placement of more solid spring clips 210. Similarly, if the sleeve 100 is circular, using a solid spring clip 210 with a circular cross-sectional shape allows for the placement of more solid spring clips 210, reducing unnecessary gaps. Furthermore, a hexagonal cross-section solid spring clip 210 increases the equivalent diameter of the flow channel and reduces pressure drop, while a circular cross-section solid spring clip 210 can reduce turbulence intensity in high-speed fluids.

[0044] In one possible embodiment, reference Figure 9 As shown, a soft layer 260 is provided on at least one side of the connector 220, or both sides of the connector may have soft layers 260. Further, the thickness of the connector 220 plus the soft layer 260 may be equal to or approximately equal to the thickness of the solid spring clip 210. When the connector 220 and the solid spring clip 210 are made of different materials, for example, when the connector 220 is a rigid connector made of plastic or similar material, the soft layer 260 allows the connector 220 to move synchronously with the solid spring clip 210 when it deforms during loading or unloading, preventing long-term asynchronous displacement from disrupting the connection stability between the solid spring clip 210 and the connector 220.

[0045] In this embodiment, the thickness of the solid spring clip 210 is 3-10mm, and further, the thickness of the solid spring clip 210 is 4-6mm, for example, it can be 5mm. Such a thickness setting is moderate, taking into account both heat exchange efficiency and structural strength, and can also be understood as compressive strength, avoiding the easy deformation due to being too thin (<3mm) or the increase in thermal resistance due to being too thick (>10mm).

[0046] The above content is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A refrigeration and heating device, characterized in that, It includes a regenerator (10), a drive (20), and a heat exchanger (30); The regenerator (10) includes a sleeve (100) and a solid spring clip assembly (200). The sleeve (100) has a receiving space (110), and the solid spring clip assembly (200) is disposed in the receiving space (110). The regenerator (10) has an inlet (300) and an outlet (400). The solid spring clip assembly (200) includes at least two solid spring clips (210). The solid spring clips (210) are connected by a connector (220). The connected solid spring clips (210) and the adjacent solid spring clips (210) have a first through hole (230) for the flow of heat-conducting fluid. The first through hole (230) communicates with the inlet (300) and the outlet (400) to form a flow cavity. The driver (20) is used to load the solid-state ejector assembly (200) to cause a phase change and generate heat, or to unload the solid-state ejector assembly (200) to cause a reverse phase change and generate cold. The heat exchanger (30) is connected to the regenerator (10) via a pipe (40) to exchange heat with the heat-conducting fluid that absorbs heat or cold.

2. The cooling and heating device as claimed in claim 1, wherein there are multiple solid spring clip assemblies (200), and the multiple solid spring clip assemblies (200) are stacked to connect the multiple first through holes (230) to form the flow cavity.

3. The refrigeration and heating device as described in claim 1, characterized in that, The thickness of the connector (220) is less than the thickness of the solid spring clip (210), and the solid spring clip assembly (200) has a recess (240) located between the two solid spring clips (210).

4. The refrigeration and heating device as described in claim 1, characterized in that, One end of the solid spring clip assembly (200) is provided with the connector (220), and the side of the connector (220) away from the solid spring clip assembly (210) is arc-shaped.

5. The refrigeration and heating device as described in claim 1, characterized in that, The cross-sectional shape of the solid spring clip (210) is rectangular, circular, or hexagonal.

6. The refrigeration and heating device as described in claim 1, characterized in that, The solid spring clip (210) and the connector (220) have a second through hole (250).

7. The refrigeration and heating device as described in claim 1, characterized in that, The area of ​​the connecting surfaces at both ends of the connector (220) to the solid spring clip (210) is smaller than the area of ​​the cross-section in the middle of the connector (220), or the cross-section of the connector (220) is I-shaped.

8. The refrigeration and heating device as described in claim 1, characterized in that, The thickness of the solid spring clip (210) is 3-10mm.

9. The refrigeration and heating device as described in claim 1, characterized in that, At least one side of the connector is provided with a soft layer (260).

10. The refrigeration and heating device as described in claim 1, characterized in that, The connector (220) is injection molded and connected to the solid spring clip (210), or the connector (220) and the solid spring clip (210) are integrally formed.

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