Piezoelectric-driven micro-displacement scanning platform
By integrating piezoelectric actuators and capacitive displacement sensors onto the base of the micro-displacement scanning platform, the problem of the lack of feedback mechanisms in existing platforms is solved, enabling high-precision dynamic positioning and adjustment. The platform has a compact structure and is suitable for high-end microscopic scanning imaging and other fields.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-31
- Publication Date
- 2026-04-03
AI Technical Summary
Existing micro-displacement scanning platforms lack feedback mechanisms, resulting in the inability to provide timely feedback on the displacement of the mover during movement, which fails to meet the requirements for high-precision adjustment. Furthermore, asymmetric drive components suffer from uneven lateral displacement and normal pressure.
The load platform, piezoelectric actuator assembly, and capacitive displacement sensor mechanism are integrated on the base. The displacement of the load platform is measured in real time by the capacitive displacement sensor, and the feedback signal is sent to the control system to adjust the drive voltage to achieve closed-loop control. Meanwhile, Invar alloy material is used to reduce the impact of temperature changes.
It achieves high-precision dynamic positioning, ensuring the accuracy and reliability of load platform adjustment. Its compact structure allows for efficient installation and application in limited spaces.
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Figure CN121782976A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of ultra-precision measuring devices, and more specifically to a piezoelectrically driven micro-displacement scanning platform. Background Technology
[0002] Piezoelectric-driven micro-displacement scanning platforms are devices used for high-precision positioning and scanning, widely applied in optical experiments, dynamic image stabilization, and airborne imaging. They achieve nanometer-level displacement control through actuators such as piezoelectric ceramics, and feature compact structure and fast response speed.
[0003] With the rapid development of ultra-precision positioning technology, the requirements for positioning accuracy are becoming increasingly stringent in fields such as nanolithography, high-end microscopic scanning imaging, optical image stabilization, nanoimprinting, optical communication, and nanometry. Existing micro-displacement platforms or devices based on micro-displacement platforms generally adopt asymmetrical structures. For example, in the existing technology CN110829880, two piezoelectric drive units arranged in parallel are used in conjunction with the mover to achieve crawling linear motion of the mover. However, its structure lacks a corresponding feedback mechanism, and the displacement generated during the mover's movement cannot be fed back in a timely manner, failing to meet the requirements for precise adjustment. For example, the existing technology CN108199614 uses an asymmetrical rhombic amplification mechanism, which makes the asymmetrical drive component unevenly distributed along the axial stiffness, exciting the drive end of the asymmetrical drive component to generate lateral displacement, adjusting the normal pressure of the contact between the asymmetrical drive component and the guide rail component. However, the above structure still lacks a corresponding feedback mechanism, and real-time feedback cannot be provided during the adjustment process, failing to meet the requirements for precise adjustment.
[0004] Therefore, to solve the above problems, a piezoelectrically driven micro-displacement scanning platform is needed. Summary of the Invention
[0005] The piezoelectrically driven micro-displacement scanning platform of this technical solution integrates the load platform onto the base, and simultaneously integrates and installs the piezoelectric actuator components and capacitive displacement sensor mechanism for use with the load platform on the base. This ensures that the load platform adjustment is precise and reliable, the overall structure of the device is compact, and it can achieve high-precision dynamic positioning.
[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows:
[0007] A piezoelectrically driven micro-displacement scanning platform includes a base, a load platform slidably and adjustablely mounted on the base, a piezoelectric actuator mechanism mounted on the base and used in conjunction with the load platform, and a capacitive displacement sensor mechanism. The piezoelectric actuator mechanism includes a support frame connected between the base and the load platform, and a piezoelectric actuator assembly mounted in conjunction with the support frame. The piezoelectric actuator assembly causes the support frame to deform, thereby driving the load platform to move along the length direction of the base. The capacitive displacement sensor mechanism is used to measure and provide feedback on the movement distance of the load platform.
[0008] Furthermore, the capacitive displacement sensor mechanism includes a shielding plate fixedly mounted to the load platform, a sensing plate fixedly mounted on the base, and an amplification circuit board mounted on the base; the shielding plate and the sensing plate are opposite to each other and arranged in parallel, and the amplification circuit board is electrically connected to the sensing plate.
[0009] Furthermore, the piezoelectric actuator assembly includes a piezoelectric ceramic assembly and a gasket, wherein the piezoelectric ceramic assembly is mounted in conjunction with the gasket within a support frame.
[0010] Furthermore, the support frame is generally rhomboid in shape, with a left protrusion on one side of the support frame to cooperate with the load platform installation, and a right protrusion on the other side of the support frame to cooperate with the base installation.
[0011] Furthermore, the load platform has a recessed groove on its side for fixing the shielding electrode plate, and the base has an electrode plate mounting platform for fixing the induction electrode plate.
[0012] Furthermore, a connecting piece is formed between the base and the load platform, and the two ends of the connecting piece are respectively fixedly connected to the base and the load platform.
[0013] Furthermore, the connecting pieces are arranged in pairs, for a total of two sets, with both sets of connecting pieces positioned between the load platform and the base.
[0014] Furthermore, it also includes a preload assembly, which includes a mass block and a return spring that are fixedly installed with the base. The load platform has a platform positioning block that protrudes along the width direction of the base. One end of the return spring is fixedly installed on the mass block, and the other end of the return spring is fixedly installed with the platform positioning block.
[0015] Furthermore, the mass block has an overall Z-shaped structure, and multiple strip holes are provided on the mass block for adjustment and installation with the base.
[0016] Furthermore, the support frame is made of Invar alloy material.
[0017] The beneficial effects of this technical solution are:
[0018] The piezoelectrically driven micro-displacement scanning platform of this technical solution integrates the load platform onto the base, and simultaneously integrates and installs the piezoelectric actuator components and capacitive displacement sensor mechanism for use with the load platform on the base. This ensures that the load platform adjustment is precise and reliable, the overall structure of the device is compact, and it can achieve high-precision dynamic positioning. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the overall exploded structure of the present invention;
[0020] Figure 2 This is a schematic diagram of the internal installation of the base of the present invention;
[0021] Figure 3 This is a schematic diagram of the mounting on the back of the base of the present invention;
[0022] Figure 4 This is a top view of the interior of the base of the present invention;
[0023] Figure 5 This is a schematic diagram of the piezoelectric actuator assembly of the present invention;
[0024] Figure 6 This is a schematic diagram of the preload assembly of the present invention;
[0025] Figure 7 This is a schematic diagram of the piezoelectric actuator mechanism of the present invention;
[0026] Figure 8 This is a schematic diagram of the overall structure of the present invention; Figure 9 This is an isometric schematic diagram of the present invention.
[0027] The attached diagram lists the components represented by each number as follows:
[0028] 1-Base; 2-Piezoelectric actuator mechanism; 3-Load platform; 4-Preload assembly; 5-Capacitive displacement sensor mechanism; 6-Amplifier circuit board; 7-Top cover; 8-Connecting piece; 9-Piezoelectric ceramic assembly; 10-Support frame; 11-Shim; 12-Return spring; 13-Mass pressure block; 14-Induction electrode plate; 15-Shielding electrode plate; 16-Electrode plate mounting platform; 17-Bending arm; 18-First strip hole; 19-Second strip hole; 21-Platform groove; 22-Platform protrusion; 31-Platform positioning block. Detailed Implementation
[0029] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.
[0030] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0032] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0033] like Figures 1 to 4 As shown in this embodiment, a piezoelectrically driven micro-displacement scanning platform includes a base 1, a load platform 3 slidably and adjustablely mounted on the base 1, a piezoelectric actuator mechanism 2 mounted on the base 1 and used in conjunction with the load platform 3, and a capacitive displacement sensor mechanism 5. The piezoelectric actuator mechanism 2 includes a support frame 10 connected between the base 1 and the load platform 3, and a piezoelectric actuator assembly mounted in conjunction with the support frame 10. The piezoelectric actuator assembly causes the support frame 10 to deform, thereby driving the load platform 3 along the length direction of the base 1 (i.e., ...). Figure 4 The capacitive displacement sensor mechanism 5 is used to measure and provide feedback on the moving distance of the load platform 3 in the horizontal direction.
[0034] In this embodiment of the application, a piezoelectrically driven micro-displacement scanning platform also includes a top cover 7, which is fixedly installed on the upper end of the base 1. The top cover 7 has a through hole structure in the middle, which does not affect the normal use of external devices connected to the load platform 3.
[0035] A piezoelectric-driven micro-displacement scanning platform is disclosed, the core of which integrates a load platform 3, a piezoelectric actuator assembly 4, and a capacitive displacement sensor mechanism 5 onto a single base 1. Specifically, the load platform 3 supports loads requiring high-precision positioning, such as optical lenses, laser probes, and other precision instruments. The load platform 3 is configured to perform linear reciprocating motion along the length of the base 1. The piezoelectric actuator assembly 4 is mounted on the base 1 and directly or indirectly coupled to the load platform 3, providing high-precision driving force for the linear motion of the load platform 3. The capacitive displacement sensor mechanism 5 is also integrated on the base 1, used to measure the displacement of the load platform 3 relative to the base 1 in real time and with high accuracy. Through this integrated design, this application achieves high-precision dynamic positioning, ensuring the accuracy and reliability of the load platform 3 adjustment. Simultaneously, it makes the entire device compact, facilitating installation and application in limited spaces.
[0036] In this embodiment, the capacitive displacement sensor mechanism 5 includes a shielding plate 15 fixedly installed in conjunction with the load platform 3, a sensing plate 14 fixedly installed on the base 1, and an amplification circuit board 6 installed on the base 1; the shielding plate 15 and the sensing plate 14 are opposite to each other and arranged in parallel, and the amplification circuit board 6 is electrically connected to the sensing plate 14.
[0037] like Figure 1-4 As shown, the shielding plate 15 is fixedly installed in conjunction with the load platform 3 arranged in the middle, and the corresponding sensing plate 14 is fixedly installed on the base 1. The sensing plate 14 and the shielding plate 15 are arranged parallel to each other and face each other. After the amplification circuit board 6 is fixedly installed in conjunction with the base 1, the amplification circuit board 6 and the sensing plate 14 are connected by an electrical signal. The sensing plate 14, the shielding plate 15 and the amplification circuit board are integrated in the limited space of the micro-displacement platform to improve the integration and the anti-interference capability of the sensing signal. The sensing signal line is led out from the sensing plate 14 and connected to the amplification circuit board 14, and then transmitted to the capacitive displacement sensing demodulation circuit module outside the micro-displacement platform (the device is externally connected to a capacitive displacement sensing demodulation circuit module, not shown in the figure). The shielding plate 15 is fixedly connected to the load platform 3 and moves synchronously with it. When the distance between the shielding plate 15 and the sensing plate 14 changes, the capacitance value formed by the two changes accordingly. The capacitive displacement sensor mechanism 5 detects the change in capacitance value and converts it into an electrical signal corresponding to the displacement of the load platform 3. The electrical signal is sent to the control system as a feedback signal. The control system adjusts the driving voltage applied to the piezoelectric actuator assembly 4 accordingly, thereby changing the output force or displacement of the piezoelectric actuator assembly 4 and realizing closed-loop control of the position of the load platform 3.
[0038] The amplifier circuit board 6 performs primary conditioning on the output signal and converts the drive voltage of the piezoelectric actuator mechanism 2, which is achieved through PCB manufacturing process. It is also integrated in the limited space between the load platform 3 and the base 1 of the piezoelectric driven micro-displacement scanning platform. The base 1 of the scanning platform is a metal shell and grounded to improve the integration and anti-interference capability of the sensing signal.
[0039] In this embodiment, the piezoelectric actuator assembly 4 includes a piezoelectric ceramic assembly 9 and a gasket 11, with the piezoelectric ceramic assembly 9 and the gasket 11 being installed in the support frame 10.
[0040] like Figure 1-5 As shown, the support frame 10 can be elliptical, rhomboid, or other suitable shapes. Here, a rhomboid shape is used as an example (it can be understood that the overall structure is rhomboid, not a standard rhomboid). The support frame 10 serves as a frame structure, with the piezoelectric ceramic assembly 9 and the gasket 11 connected and installed in the middle. The piezoelectric ceramic assembly 9 adopts a stacked piezoelectric ceramic structure, with the gasket 11 installed at both ends respectively. When the piezoelectric ceramic assembly 9 deforms, it causes the support frame 10 to deform accordingly, thereby causing the load platform 3 to move (along the length direction of the base 1).
[0041] In this embodiment, the support frame 10 is generally rhomboid in shape. A left protrusion of the support frame 10 is formed on one side to cooperate with the load platform 3 for installation, and a right protrusion of the support frame 10 is formed on the other side to cooperate with the base 1 for installation.
[0042] The support frame 10 has two curved arms 17. The two ends of the curved arms 17 protrude to form a left support frame protrusion and a right support frame protrusion, respectively. The left support frame protrusion and the right support frame protrusion are fixedly installed with the load platform 3 and the base 1 by bolts. The load platform 3 has a platform protrusion 22 protruding at its end. The left support frame protrusion is fixedly installed with the platform protrusion 22. The left support frame protrusion deforms in the opposite direction, which drives the load platform 3 to move.
[0043] In this embodiment, the load platform 3 has a recessed groove 21 on its side for fixing the shielding electrode plate 15, and the base 1 has an electrode plate mounting platform 16 for fixing the induction electrode plate 14.
[0044] like Figure 2 As shown, a platform groove 21 is provided on the left side of the load platform 3, and the corresponding shielding plate 15 is fixedly installed inside the platform groove 21. An electrode mounting platform 16 is formed on the reference 1, and the corresponding sensing plate 14 is fixedly installed on the electrode mounting platform 16.
[0045] In this embodiment, a connecting piece 8 is formed between the base 1 and the load platform 3, and the two ends of the connecting piece 8 are respectively fixedly connected to the base 1 and the load platform 3.
[0046] like Figure 1 and Figure 2 As shown, there are four connecting pieces 8 in total, which are symmetrically distributed on both sides of the load platform 3 (e.g., Figure 2 As shown, four connecting pieces are formed between the base 1 and the load platform 3. The connecting pieces 8 are integrally processed by wire cutting. The two ends of the connecting pieces are respectively fixedly connected to the base 1 and the load platform 3 as a whole.
[0047] In this embodiment, the connecting pieces 8 are arranged in pairs, for a total of two sets, and both sets of connecting pieces 8 are arranged between the load platform 3 and the base 1.
[0048] The connecting piece 8 is a thin-plate structure that does not affect the movement of the load platform 3. The use of an integrated connecting piece 8 ensures that the load platform 3 moves stably and reliably along the length of the base 1, reducing errors caused by parasitic motion and ensuring the positioning accuracy of the rapid scanning platform.
[0049] In this embodiment, a piezoelectrically driven micro-displacement scanning platform further includes a pre-tightening force component 4. The pre-tightening force component 4 includes a mass block 13 and a return spring 12 that are fixedly installed with the base 1. The load platform 3 has a platform positioning block 31 that protrudes along the width direction of the base 1. One end of the return spring 12 is fixedly installed on the mass block 13, and the other end of the return spring 12 is fixedly installed with the platform positioning block 31.
[0050] like Figures 1-6 As shown, the preload assembly 4 includes a mass block 13 and a return spring 12. The load platform 3 protrudes along the width direction of the base 1 to form a platform positioning block 31 structure. The corresponding mass block is fixedly installed on the reference 1. One end of the return spring 12 is fixedly installed on the platform positioning block 31, and the other end is fixedly installed in conjunction with the mass block 13.
[0051] In this embodiment, the mass block 13 has a Z-shaped structure, and the mass block 13 has multiple strip holes (including the first strip hole 18 and the second strip hole 19) that are adjusted and installed in conjunction with the base 1.
[0052] The return spring 12 of the preload assembly 4 provides preload force to the load platform 3, and the mass block 13 limits the movement of the load platform 3. A set of preload assemblies 4 is symmetrically arranged on both sides of the load platform 3 in the transverse (length direction). The magnitude of the preload force can be adjusted by changing the position of the different strip holes on the mass block 13 fixed to the inner bottom plate of the platform base.
[0053] In this embodiment, the support frame 10 is made of Invar alloy material.
[0054] Since the piezoelectrically driven micro-displacement scanning platform of this technical solution is used in high-precision equipment, changes in ambient temperature will affect the measurement accuracy. Therefore, the support frame 10 is made of Invar alloy material to minimize the impact of temperature changes, as detailed below:
[0055] When the sensing plate 14 and the shielding plate 15 are vertically aligned, the measured capacitance of the parallel plate capacitor formed by the sensing plate 14 and the shielding plate 15 of the capacitive displacement sensor is:
[0056] (1)
[0057] In the formula, The dielectric constant between the shielding plate and the inductive plate is... The area of the shielding electrode and the sensing electrode facing each other. The length or width of the square sensing electrode on the sensing plate. and These represent the initial and varying distances between the shielding plate and the sensing plate, respectively. denoted as the capacitance value to be measured, and r as the radius of the circular sensing electrode on the sensing plate.
[0058] When the ambient temperature changes, the piezoelectrically driven micro-displacement scanning platform will experience thermal stress displacement due to the temperature change. Specifically, the thermal strain displacement of the piezoelectric ceramic assembly 9, support frame 10, and load platform 3 as a whole due to temperature change will affect the geometric center O point of the load platform 3 (e.g., Figure 8 The position (as shown) is shifted to the left, thus adjusting the initial electrode spacing of the capacitive displacement sensor mechanism 5 integrated on the left side of the load platform 3. The reduced deformation due to compression can cause the capacitive displacement sensor to exceed its range and become unable to effectively measure the linear displacement of the load platform, or even cause the entire positioning system of the fast piezoelectric-driven micro-displacement scanning platform to malfunction.
[0059] To address the aforementioned problems, this invention proposes a temperature compensation principle and method for a scanning platform. The core of this method is to reduce the overall thermal strain displacement of the piezoelectric ceramic assembly 9, support frame 10, and load platform 3 under varying temperature conditions, thereby reducing the impact of temperature changes on the electrode spacing of the capacitive displacement sensor. If the minute thermal strain of the capacitive displacement sensor electrodes is ignored, the electrode spacing of the capacitive displacement sensor affected by temperature changes... for:
[0060] (2)
[0061] In the formula, The thermal strain displacement corresponding to rhomboid mechanisms of different materials ( (This indicates the serial number corresponding to the diamond-shaped mechanism of different materials). This represents the thermal strain displacement of the load platform. This represents the thermal strain displacement of stacked piezoelectric ceramics. The ambient temperature.
[0062] The principle of thermal expansion of materials refers to the fact that when the ambient temperature is... When the ambient temperature changes by 1°C, the corresponding coefficient of thermal expansion of the material is defined as the instantaneous coefficient of thermal expansion, which is:
[0063] (3)
[0064] According to equation (3), we can obtain:
[0065] (4)
[0066] In the formula, The coefficient of thermal expansion of the material. For the changing temperature difference, The length of the component affected by heat at ambient temperature T. The initial ambient temperature, This represents the length change of the component due to temperature variations.
[0067] Based on the aforementioned principle of thermal expansion of metallic materials, the thermal strain displacement of stacked piezoelectric ceramics, load platforms, and rhombic mechanisms of different materials under varying temperature environments can be obtained. They are respectively:
[0068] (5)
[0069] (6)
[0070] (7)
[0071] In the formula, and These represent the linear thermal expansion coefficient and initial length of the stacked piezoelectric ceramic material, respectively. For rhombic structures made of different materials, the coefficient of linear thermal expansion is... This represents the initial length of the load platform. The thickness of the curved arm of the rhomboid mechanism.
[0072] Substituting equations (5), (6), and (7) into equation (2), we obtain the electrode spacing of the capacitive displacement sensor 5 after temperature compensation. With ambient temperature The equation for the change is as follows:
[0073] (8)
[0074] According to equation (8), when the linear thermal expansion coefficient of the material of the rhombic mechanism is... When the ambient temperature remains constant, Increase, that is The larger the difference, the smaller the electrode spacing of the capacitive displacement sensor. The smaller the value, the better. When the electrode spacing of the capacitive displacement sensor... When the value is too small, it can cause the capacitive displacement sensor to exceed its range and malfunction. When the difference remains constant and non-zero, the linear thermal expansion coefficient of the material in the rhombic structure is... The larger the value, the greater the electrode spacing of the capacitive displacement sensor. The smaller the coefficient of linear thermal expansion, the better. Conversely, the larger the coefficient of linear thermal expansion of the material in a rhombic structure. The smaller the spacing, the smaller the electrode spacing of the capacitive displacement sensor. The larger.
[0075] Therefore, the linear thermal expansion coefficient of the material in the rhombic structure is... The smaller the better. The material used for processing the rhombic mechanism is Invar alloy with a low coefficient of linear thermal expansion. This reduces the thermal strain displacement of the stacked piezoelectric ceramics, the rhombic mechanism, and the load platform as a whole under varying temperature conditions. This reduces the impact of temperature changes on the electrode spacing of the capacitive displacement sensor, ensuring that the capacitive displacement sensor can operate normally within a certain temperature range.
[0076] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0077] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A piezoelectrically driven micro-displacement scanning platform, characterized in that: The device includes a base (1), a load platform (3) that is slidably and adjustablely mounted on the base (1), a piezoelectric actuator mechanism (2) mounted on the base (1) and used in conjunction with the load platform (3), and a capacitive displacement sensor mechanism (5). The piezoelectric actuator mechanism (2) includes a support frame (10) connected between the base (1) and the load platform (3) and a piezoelectric actuator assembly mounted in conjunction with the support frame (10). The piezoelectric actuator assembly causes the support frame (10) to deform, thereby driving the load platform (3) to move along the length direction of the base (1). The capacitive displacement sensor mechanism (5) is used to measure and feedback the moving distance of the load platform (3).
2. The piezoelectrically driven micro-displacement scanning platform according to claim 1, characterized in that: The capacitive displacement sensor mechanism (5) includes a shielding plate (15) fixedly installed with the load platform (3), a sensing plate (14) fixedly installed on the base (1), and an amplifying circuit board (6) installed on the base (1); the shielding plate (15) and the sensing plate (14) are opposite to each other and arranged in parallel, and the amplifying circuit board (6) is electrically connected to the sensing plate (14).
3. The piezoelectrically driven micro-displacement scanning platform according to claim 1, characterized in that: The piezoelectric actuator assembly includes a piezoelectric ceramic assembly (9) and a gasket (11), wherein the piezoelectric ceramic assembly (9) and the gasket (11) are installed in the support frame (10).
4. The piezoelectrically driven micro-displacement scanning platform according to claim 3, characterized in that: The support frame (10) is generally rhomboid in shape. A left protrusion of the support frame (10) is formed on one side to cooperate with the load platform (3) for installation, and a right protrusion of the support frame (10) is formed on the other side to cooperate with the base (1) for installation.
5. The piezoelectrically driven micro-displacement scanning platform according to claim 2, characterized in that: The load platform (3) has a recessed groove (21) on its side for fixing the shielding electrode plate (15) in place, and the base (1) has an electrode plate mounting platform (16) for fixing the induction electrode plate (14) in place.
6. The piezoelectrically driven micro-displacement scanning platform according to claim 1, characterized in that: A connecting piece (8) is provided between the base (1) and the load platform (3), and the two ends of the connecting piece (8) are respectively fixedly connected to the base (1) and the load platform (3).
7. The piezoelectrically driven micro-displacement scanning platform according to claim 6, characterized in that: The connecting pieces (8) are in pairs, with a total of two sets. Both sets of connecting pieces (8) are arranged between the load platform (3) and the base (1).
8. The piezoelectrically driven micro-displacement scanning platform according to claim 1, characterized in that: It also includes a preload assembly (4), which includes a mass block (13) fixedly installed with the base (1) and a return spring (12). The load platform (3) has a platform positioning block (31) protruding along the width direction of the base (1). One end of the return spring (12) is fixedly installed on the mass block (13), and the other end of the return spring (12) is fixedly installed with the platform positioning block (31).
9. The piezoelectrically driven micro-displacement scanning platform according to claim 8, characterized in that: The mass block (13) has a Z-shaped structure, and the mass block (13) has multiple strip holes for adjustment and installation with the base (1).
10. The piezoelectrically driven micro-displacement scanning platform according to claim 1, characterized in that: The support frame (10) is made of Invar alloy material.