IToF ranging module and iToF ranging system

Abstract

The invention relates to the technical field of depth measurement, and discloses an iToF distance measurement module and a distance measurement system, and the iToF distance measurement module comprises an iToF transmitting unit which is used for transmitting a modulation light beam to a target object; the iToF receiving unit is used for collecting the modulated light beam reflected by the target object; the iToF transmitting unit and the iToF receiving unit are arranged in the packaging support, and one end of the packaging support is provided with an OLGA plate group; wherein the iToF transmitting unit at least comprises a laser driving chip and a laser transmitting light source, the iToF receiving unit at least comprises an iToF sensor and a metasurface optical lens, and the metasurface optical lens is located above the iToF sensor in the packaging support. The laser driving chip, the laser emission light source and the iToF sensor are all packaged on the OLGA plate group, and the laser driving chip is located on the side, away from the packaging support, of the OLGA plate group. The space of the distance measuring module is optimized, and the performance of the distance measuring module is improved.

Description

Technical Field

[0001] This application relates to the field of depth measurement technology, specifically to an iToF ranging module and ranging system. Background Technology

[0002] iToF ranging technology, as an important active optical 3D sensing solution, is widely used in mobile device facial recognition, gesture interaction, robot navigation, and augmented reality. In related technologies, the optical lenses used in the receiving part of iToF ranging are mostly plastic lens groups designed based on geometric optics principles. Although this design can achieve a certain image quality, the lens barrel structure results in a long axial dimension and a large lateral footprint of the optical system, which makes it difficult to meet the urgent needs of consumer electronic devices for miniaturization and thinness of modules. Moreover, plastic lenses are prone to softening and deformation, leading to optical axis misalignment, performance degradation, and even structural damage. Due to the large overall size of the module and the limited internal space, the heat generated by the high-power working unit is difficult to dissipate quickly through an effective path, resulting in heat accumulation and affecting the stability of the module and the ranging accuracy. Summary of the Invention

[0003] In view of this, this application provides an iToF ranging module and ranging system to solve the aforementioned technical problems.

[0004] In a first aspect, embodiments of this application disclose an iToF ranging module, comprising: iToF emission unit, used to emit modulated beams toward the target object; An iToF receiving unit is used to collect the modulated beam reflected back by the target object; The packaging bracket contains the iToF transmitting unit and the iToF receiving unit, and one end of the packaging bracket is provided with an OLGA board assembly. The iToF transmitting unit includes at least a laser driver chip and a laser emitting light source, and the iToF receiving unit includes at least an iToF sensor and a metasurface optical lens. The metasurface optical lens is located above the iToF sensor within the packaging bracket. The laser driver chip, the laser emitting light source, and the iToF sensor are all packaged on the OLGA board assembly, and the laser driver chip is located on the side of the OLGA board assembly away from the packaging bracket.

[0005] In one possible example, the OLGA board assembly includes at least an organic laminated substrate with a multilayer wiring structure, wherein the laser driver chip, the laser emission source, and the iToF sensor are all flip-chip bonded to the organic laminated substrate.

[0006] In one possible example, the iToF emitting unit further includes an optical diffuser disposed at one end of the packaging bracket away from the OLGA board assembly, corresponding to the laser emitting light source.

[0007] In one possible example, the packaging bracket has a first mounting window at the end opposite to the OLGA board assembly, and the optical diffuser is connected within the first mounting window.

[0008] In one possible example, the iToF receiving unit further includes a narrowband filter disposed at one end of the packaging bracket away from the OLGA board assembly, corresponding to the metasurface optical lens and the iToF sensor.

[0009] In one possible example, the packaging bracket has a second mounting window at the end opposite to the OLGA board assembly, the second mounting window being close to the first mounting window, and the narrow band filter being connected within the second mounting window.

[0010] In one possible example, the laser emission source comprises a vertical cavity surface-emitting laser array.

[0011] In one possible example, the metasurface optical lens comprises a glass or quartz substrate and an array of subwavelength micro / nano structures formed on the substrate.

[0012] In one possible example, the iToF sensor is an area array sensor, whose photosensitive area is directly opposite the effective optical area of ​​the metasurface optical lens.

[0013] Secondly, this application discloses an iToF ranging system, including a control processor and the iToF ranging module described in any of the above embodiments; The control processor controls the iToF transmitting unit of the iToF ranging module to emit a modulated beam toward the target object, and controls the iToF receiving unit of the iToF ranging module to collect the modulated beam reflected back from the target object to obtain modulated beam data, and calculates the depth and distance information of the target object based on the modulated beam data.

[0014] In summary, compared with the prior art, this application discloses an iToF ranging module and ranging system. The iToF ranging module includes an iToF transmitting unit, an iToF receiving unit, and a packaging bracket. The iToF transmitting unit is used to emit a modulated beam towards the target object, and the iToF receiving unit is used to collect the modulated beam reflected back from the target object. The iToF transmitting unit and the iToF receiving unit are disposed within the packaging bracket, and an OLGA board is disposed at one end of the packaging bracket. The iToF transmitting unit includes at least a laser driving chip and a laser emitting light source, and the iToF receiving unit includes at least an iToF sensor and a metasurface optical lens. The metasurface optical lens is located above the iToF sensor within the packaging bracket, and the laser driving chip, the laser emitting light source, and the iToF sensor are all packaged on the OLGA board, with the laser driving chip located on the side of the OLGA board away from the packaging bracket. That is, through the above arrangement, the space of the ranging module is optimized and the performance of the ranging module is improved. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is an exploded view of the iToF ranging module according to an embodiment of this application; Figure 2 This is a three-dimensional structural diagram of the iToF ranging module according to an embodiment of this application; Figure 3 This is a structural block diagram of the iToF ranging system according to an embodiment of this application. Detailed Implementation

[0017] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the claims.

[0018] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0019] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0020] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0021] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0023] This embodiment provides an indirect time-of-flight ranging module based on metasurface optical lenses and advanced packaging technology. This module aims to systematically solve the technical bottlenecks of traditional iToF modules, such as large size, inability to withstand the high temperature of surface mount reflow soldering, low heat dissipation efficiency, and complex assembly process.

[0024] Please refer to Figure 1 and Figure 2 The iToF ranging module of this application embodiment includes an iToF transmitting unit 101, an iToF receiving unit 102, and a packaging bracket 1.

[0025] In the specific implementation process, the iToF transmitting unit 101 is used to emit a modulated beam towards the target object, and the iToF receiving unit 102 is used to collect the modulated beam reflected back by the target object. The iToF transmitting unit 101 and the iToF receiving unit 102 are located inside the packaging bracket 1.

[0026] The encapsulation bracket 1 is a hollow structure, preferably made of black or dark opaque material, used to isolate external stray light, and forms a cavity inside to accommodate optical and electronic devices.

[0027] The packaging bracket 1 has an OLGA board assembly 2 at one end. The iToF emitting unit 101 includes at least a laser driver chip 3 and a laser emitting light source 4. The iToF receiving unit 102 includes at least an iToF sensor 5 and a metasurface optical lens 6. The metasurface optical lens 6 is located above the iToF sensor 5 inside the packaging bracket 1. The laser driver chip 3, the laser emitting light source 4, and the iToF sensor 5 are all packaged on the OLGA board assembly 2, and the laser driver chip 3 is located on the side of the OLGA board assembly 2 away from the packaging bracket 1.

[0028] Through the above structural design, a single, ultra-thin metasurface optical lens 6 is used to replace the traditional multi-piece plastic lens group, and high-density chip integration is achieved using OLGA (Organic Pad Grid Array) board group, realizing miniaturization of module size. Furthermore, the high-temperature resistant glass substrate of the metasurface optical lens 6, combined with OLGA packaging technology, allows the ranging module to be used as a standard surface mount component. In production, it can be mounted on the main circuit board along with other electronic components using an automatic placement machine, realizing a leap from the complex step-by-step assembly of traditional cameras to semiconductor-style automated production, greatly improving production efficiency and consistency.

[0029] Furthermore, the laser driver chip 3 used to generate high-frequency modulated current signals is set on the side of the OLGA board group 2 away from the packaging bracket 1 (i.e., the bottom of the module). This layout establishes an efficient heat dissipation path, significantly improves thermal management, and enhances the stability and ranging accuracy of the system during long-term operation.

[0030] It should be noted that the OLGA board 2 is not only the carrier of the circuit, but also the core of this embodiment to achieve high-density integration and heat dissipation optimization. It includes at least an organic laminated substrate with a multi-layer wiring structure, such as a multi-layer wiring substrate made of BT resin or ABF material. The laser driver chip 3, the laser emission light source 4 and the iToF sensor 5 can all be flip-chip soldered onto the organic laminated substrate to achieve the shortest electrical interconnection path and excellent electrothermal performance, and optimize the space of the ranging module.

[0031] In this embodiment, the laser emitting source 4 is electrically connected to the laser driver chip 3 and operates under the precise control of the laser driver chip 3. The laser driver chip 3 generates a high-frequency modulation electrical signal, which drives the laser emitting source 4 to emit a corresponding modulated light signal. Specifically, the laser emitting source 4 is configured to emit a high-frequency modulated near-infrared laser beam. The modulation waveform can be a sine wave, a square wave, or other forms of periodic waveform. This high-frequency modulation provides the iToF ranging module with the "time scale" required for phase difference ranging.

[0032] Preferably, the laser emission source 4 is a vertical-cavity surface-emitting laser array (VCSEL) to match the planar OLGA packaging architecture used in this embodiment. After the laser emission source 4 is packaged in the OLGA board 2, its effective beam is emitted directly upwards without the need for additional reflectors, prisms, or complex optical path deflection structures to change the optical path direction. This greatly simplifies the optomechanical design inside the packaging bracket 1 and is an important factor in achieving the ultra-small size and structural simplification of the module. Moreover, the VCSEL array allows the integration of dozens to hundreds of independent laser emission units on a single microchip to form a compact array. In other words, the VCSEL array as the laser emission source 4 not only achieves efficient and stable modulation light emission, but its vertical light emission and easy integration into an array, together with the planar metasurface optical lens 6 and the high-density OLGA packaging, constitute an optical system with internal coordination and extremely high space utilization, directly supporting the realization of the core goal of the "ultra-small ranging module".

[0033] Furthermore, the iToF emitting unit 101 also includes an optical diffuser 7, which is correspondingly positioned in front of the laser emitting source 4. Specifically, the optical diffuser 7 is positioned at the end of the packaging bracket 1 opposite to the OLGA board assembly 2, corresponding to the laser emitting source 4, to ensure that it completely covers the light emission path of the laser emitting source 4. It is used to homogenize and shape the emitted beam. Thus, the high-density area array emitting source of the laser emitting source 4, in conjunction with the optical diffuser 7, can generate a uniform and wide illumination spot, covering the area that matches the receiving field of view, thereby improving the uniformity and effectiveness of ranging. This ensures that the illumination intensity of the object surface is as consistent as possible throughout the entire target detection scene, which eliminates ranging errors caused by the non-uniformity of the light source itself, thereby significantly improving the spatial uniformity, stability, and overall effectiveness of the entire iToF ranging data.

[0034] To achieve precise positioning and stable installation of the optical diffuser 7, the end of the encapsulation bracket 1 facing away from the OLGA board assembly 2 is provided with a first assembly window 11. The optical diffuser 7 is connected in the first assembly window 11. That is, during the assembly process, the optical diffuser 7 is placed in or embedded in the first assembly window 11 and reliably connected to the encapsulation bracket 1 through processes such as hot pressing, ultrasonic welding, dispensing curing or mechanical snap-fit, thereby ensuring that it will not shift or fall off in subsequent use.

[0035] In this embodiment, the metasurface optical lens 6, as the core optical component of the iToF receiving unit 102, mainly comprises two parts: one is a glass substrate or quartz substrate as a supporting substrate; the other is a subwavelength micro-nano structure array fabricated on one surface of the substrate using semiconductor photolithography, etching and other micro-nano processing techniques. These periodic or non-periodic nanostructures (such as nanopillars, nanopores, etc.) can precisely control the phase and amplitude of the incident light, thereby replacing traditional curved lenses to achieve functions such as beam focusing.

[0036] The metasurface optical lens 6 comprises a glass or quartz substrate and a subwavelength micro / nano structure array formed on the substrate. The selected glass or quartz material endows the lens with extremely high thermal stability and chemical inertness. Specifically, it can completely withstand the high temperature environment above 260°C required for the soldering process in surface mount technology without any deformation, softening, or degradation of optical performance. This characteristic allows the entire iToF ranging module containing this optical lens to be picked up and positioned directly by a fully automated pick-and-place machine, just like standard resistors, capacitors, and integrated circuit chips, and to undergo the soldering process together with other components. This achieves a fundamental transformation from traditional complex step-by-step assembly to fully automated, high-efficiency semiconductor mounting. Moreover, its single-piece, planar structure (thickness can be less than 1 mm) makes a decisive contribution to the reduction of the overall thickness and volume of the module compared to traditional multi-lens groups with axial dimensions of several millimeters to tens of millimeters.

[0037] Furthermore, the iToF receiver unit 102 also includes a narrowband filter 8 as an optical filtering component to ensure ranging accuracy and system anti-interference capability.

[0038] In terms of structural configuration and integration, the narrowband filter 8 is correspondingly positioned in front of the receiving optical path of the metasurface optical lens 6 and the iToF sensor 5. That is, the narrowband filter 8 is positioned at the end of the packaging bracket 1 away from the OLGA board assembly 2, corresponding to the metasurface optical lens 6 and the iToF sensor 5.

[0039] The narrowband filter 8 is a bandpass optical element designed to precisely match the emission wavelength of the laser emission source 4 and has an extremely narrow half-width at half-maximum (HWHM) to act as a highly selective "spectral gate." It allows light signals within a very narrow band near the emitted laser wavelength to pass through efficiently, while strongly reflecting or absorbing ambient light of all other wavelengths, such as the rich infrared and visible light components contained in sunlight and indoor lighting. Therefore, under complex ambient lighting conditions, most stray light is blocked by the narrowband filter 8, and only the reflected laser carrying effective phase information can reach the metasurface optical lens 6 and be focused onto the iToF sensor 5. This greatly improves the signal-to-noise ratio of the received signal and effectively suppresses ranging errors that may be caused by ambient light interference and multipath effects. It is an indispensable part of ensuring that the iToF ranging module can achieve high-precision and high-robustness depth sensing.

[0040] To achieve precise and stable installation of the narrowband filter 8 and optimize the spatial layout of the module, preferably, the end of the packaging bracket 1 facing away from the OLGA board assembly 2 is provided with a second assembly window 12, the second assembly window 12 is close to the first assembly window 11, and the narrowband filter 8 is connected in the second assembly window 12.

[0041] On the same end face of the packaging bracket 1 away from the OLGA board assembly 2, in addition to the first assembly window 11 for mounting the optical diffuser 7, a second assembly window 12 is also provided in parallel. The position of the second assembly window 12 is adjacent to and close to the first assembly window 11. The two correspond precisely to the optical path entrances of the laser emission source 4 of the iToF emitting unit 101 and the metasurface optical lens 6 of the iToF receiving unit 102, respectively. The narrowband filter 8 is integrated in this second assembly window 12. During the assembly process, the narrowband filter 8 is reliably connected to the packaging bracket 1 through a process similar to that of the first assembly window 11 (such as dispensing curing, hot pressing or mechanical snap-fit), thereby ensuring that its position in the optical path is fixed.

[0042] It should be noted that the iToF sensor 5 in this embodiment is an area array sensor. Specifically, the photosensitive area of ​​the iToF sensor 5 (i.e., the area where its pixel array is located) is spatially strictly aligned with the effective optical area of ​​the metasurface optical lens 6 inside the package. This means that the optical axis of the metasurface optical lens 6 should be perpendicular to the photosensitive surface of the sensor, and all the imaging beams modulated by the lens must completely cover and converge within the entire photosensitive area of ​​the iToF sensor 5. This precise alignment ensures that the modulated light signal reflected from the target, after being converged by the metasurface optical lens 6, can be captured by the iToF sensor with minimal distortion and maximum efficiency. Each pixel received by the iToF sensor 5 is a prerequisite for obtaining a high-resolution, high-precision depth map. Traditional separate lens and sensor assembly requires complex active alignment processes for adjustment, which is inefficient. In this embodiment, the metasurface optical lens 6 is a monolithic planar element, and the iToF sensor 5 is precisely fixed on the OLGA board 2 by flip-chip bonding. Both have extremely high positioning reference accuracy. Combined with the precision-formed second assembly window 12 on the packaging bracket 1, passive and precise alignment between the lens and sensor becomes possible, thus adapting to efficient and automated semiconductor packaging and assembly processes.

[0043] During the operation of the iToF ranging module in this embodiment, the control processor sends instructions to the laser driver chip 3 of the iToF transmitting unit 101. This chip generates a high-frequency sinusoidal or square wave electrical signal as a modulation signal. This modulation signal drives the laser emitting source 4 to work, precisely converting the electrical signal into near-infrared laser light modulated at the same frequency. The laser is emitted vertically from the array. The emitted laser first passes through an optical diffuser 7, which mixes and scatters multiple discrete laser point sources to form a uniformly intense illumination spot with a wide field of view, thus covering the entire scene to be measured. The homogenized modulated laser beam is directed towards the target object. After traveling a certain distance in space, the beam illuminates the object's surface and is reflected. The reflected light carries the object's distance information (manifested as a delay in the light wave phase). Simultaneously, strong sunlight, artificial light, and other background light (containing a rich infrared spectrum) in the environment are also reflected from the object's surface and interact with the weak infrared light. The effective signal light is mixed and directed towards the iToF receiving unit 102. The mixed light also reaches the narrowband filter 8, which acts as a "spectral gate," allowing only narrow-band light that is strictly matched to the center wavelength of the emitted laser to pass through efficiently, while strongly blocking most of the background stray light. Thus, the signal light is initially "purified." The pure modulated light passing through the narrowband filter 8 is then incident on the metasurface optical lens 6. This lens, with its subwavelength micro-nano structure array on its surface, efficiently and precisely controls the beam, converging reflected light from different directions onto its focal plane. The converged modulated light is precisely projected onto the photosensitive area of ​​the area array iToF sensor 5. The special circuit inside each pixel of the iToF sensor 5, under the synchronous clock control provided by the laser driver chip 3, samples the incident modulated light to obtain modulated beam data, and the control processor calculates the depth and distance information of the target object based on the modulated beam data.

[0044] Therefore, the iToF ranging module described above uses a metasurface optical lens 6 to replace the traditional multi-piece plastic lens group, and utilizes an OLGA (Organic Pad Grid Array) board for high-density chip integration, achieving miniaturization of the module size. Furthermore, the high-temperature resistant glass substrate of the metasurface optical lens 6, combined with the OLGA packaging process, allows the ranging module to function as a standard surface mount component. In production, it can be automatically mounted onto the main circuit board along with other electronic components, achieving a leap from the complex step-by-step assembly of traditional cameras to semiconductor-style automated production, greatly improving production efficiency and consistency. The laser driver chip 3, used to generate high-frequency modulated current signals, is located on the side of the OLGA board 2 away from the packaging bracket 1. This layout establishes an efficient heat dissipation path, significantly improving thermal management and enhancing the performance, long-term stability, and ranging accuracy of the ranging module.

[0045] This application also discloses an iToF ranging system, which combines the ultra-small, high-performance iToF ranging module described in any of the foregoing embodiments with an intelligent control unit to form a complete, independently operating depth sensing solution. (Refer to...) Figure 3 The iToF ranging system includes a control processor 20 and an iToF ranging module 10 of any of the above embodiments. The control processor 20 is the core of the system's control and calculation. It can be a microcontroller unit, a digital signal processor, or a system-on-a-chip. The control processor 20 establishes a bidirectional communication and control connection with the iToF ranging module 10, especially with its internal laser driver chip 3 and iToF sensor 5, through an electrical interface (such as I2C, SPI, MIPI, etc.). Specifically, the control processor 20 controls the iToF transmitting unit 101 of the iToF ranging module 10 to emit a modulated beam towards the target object, and controls the iToF receiving unit 102 of the iToF ranging module 10 to collect the modulated beam reflected back from the target object to obtain modulated beam data, and calculates the depth and distance information of the target object based on the modulated beam data.

[0046] Because the ranging module 10 itself has the characteristics of high precision (high signal-to-noise ratio, excellent heat dissipation) and high stability (high temperature resistance, robust structure), it provides the control processor 20 with high-quality, low-noise raw data, making the final depth information calculation results more accurate and reliable. Moreover, thanks to the ultra-small size and SMT packaging characteristics of the ranging module 10, the iToF ranging system can be easily embedded into the motherboard of various terminal products such as mobile phones, robots, and AR / VR devices, greatly reducing the hardware integration difficulty of the client.

[0047] The present application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.

Claims

1. An iToF ranging module, characterized in that, include: iToF emission unit, used to emit modulated beams toward the target object; The iToF receiving unit is used to collect the modulated beam reflected back by the target object; The packaging bracket contains the iToF transmitting unit and the iToF receiving unit, and one end of the packaging bracket is provided with an OLGA board assembly. The iToF transmitting unit includes at least a laser driver chip and a laser emitting light source, and the iToF receiving unit includes at least an iToF sensor and a metasurface optical lens. The metasurface optical lens is located above the iToF sensor within the packaging bracket. The laser driver chip, the laser emitting light source, and the iToF sensor are all packaged on the OLGA board assembly, and the laser driver chip is located on the side of the OLGA board assembly away from the packaging bracket.

2. The iToF ranging module as described in claim 1, characterized in that, The OLGA board assembly includes at least an organic laminated substrate with a multilayer wiring structure, and the laser driver chip, laser emission source and iToF sensor are all flip-chip bonded to the organic laminated substrate.

3. The iToF ranging module as described in claim 1, characterized in that, The iToF emitting unit also includes an optical diffuser, which is disposed at one end of the packaging bracket away from the OLGA board assembly, corresponding to the laser emitting light source.

4. The iToF ranging module as described in claim 3, characterized in that, The packaging bracket has a first assembly window at the end opposite to the OLGA board assembly, and the optical diffuser is connected to the first assembly window.

5. The iToF ranging module as described in claim 4, characterized in that, The iToF receiving unit also includes a narrowband filter, which is disposed at one end of the packaging bracket away from the OLGA board assembly, corresponding to the metasurface optical lens and the iToF sensor.

6. The iToF ranging module as described in claim 5, characterized in that, The packaging bracket has a second assembly window at one end away from the OLGA board assembly. The second assembly window is close to the first assembly window, and the narrow band filter is connected within the second assembly window.

7. The iToF ranging module as described in claim 1, characterized in that, The laser emission source includes a vertical cavity surface-emitting laser array.

8. The iToF ranging module as described in claim 1, characterized in that, The metasurface optical lens includes a glass or quartz substrate and an array of subwavelength micro / nano structures formed on the substrate.

9. The iToF ranging module as described in claim 1, characterized in that, The iToF sensor is an area array sensor, and its photosensitive area is directly opposite the effective optical area of ​​the metasurface optical lens.

10. An iToF ranging system, characterized in that, Includes a control processor and the iToF ranging module as described in any one of claims 1 to 9; The control processor controls the iToF transmitting unit of the iToF ranging module to emit a modulated beam toward the target object, and controls the iToF receiving unit of the iToF ranging module to collect the modulated beam reflected back from the target object to obtain modulated beam data, and calculates the depth and distance information of the target object based on the modulated beam data.

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