Display module and display device

Abstract

The embodiment of the invention provides a display module and a display device. The display module comprises a display panel and a cover plate which are overlapped with each other, the display panel comprises a bending part and a binding part, the bending part is bent from the side close to the cover plate to the side, away from the cover plate, of the display panel, the binding part is located on the side, away from the cover plate, of the display panel, and the binding part is connected with the bending part; the sealing compound covers the bending part and is filled in the bending part, the cover plate and the inner side of the bending part; the flexible circuit board is in binding connection with the binding part; the flexible circuit board comprises an extension part, and the extension part extends into the sealing glue. According to the embodiment of the invention, the flexible circuit board is provided with the extension part extending into the sealing glue, the extension part can adjust the structural modulus, the extension part is matched with the sealing glue to form a stronger protection effect on the bending part, the bending part is prevented from being impacted to generate line breakage, the extrusion resistance and the falling performance of the whole machine are improved, and the service life of the whole machine is prolonged. The anti-extrusion capability of the bending portion of the display module can be enhanced, and meanwhile the smaller width of the lower frame can be achieved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the development of display technology, users have increasingly higher requirements for display products, such as narrower bezels and more uniform brightness. In existing technologies, to achieve a smaller bottom bezel, a bending section is incorporated into the non-display area of ​​the display panel. This bending section folds the edge of the display panel towards the back, where a flexible circuit board is then bonded to the panel. This design involves wiring within the bending section; breakage of this wiring can cause display defects. Therefore, improving the impact resistance of the bottom bezel area is a key research issue. Summary of the Invention

[0003] This invention provides a display module and a display device to solve the technical problem of improving the impact resistance of the display module when going down a step.

[0004] In a first aspect, embodiments of the present invention provide a display module, the display module comprising: The display panel and cover plate are stacked on top of each other. The display panel includes a bent part and a binding part. The bent part is bent from the side near the cover plate to the side of the display panel away from the cover plate. The binding part is located on the side of the display panel away from the cover plate and is connected to the bent part. Sealing, sealing the bend and filling the bend, cover plate and the inside of the bend; A flexible circuit board is bonded to a bonding portion; the flexible circuit board includes an extension portion that extends into the encapsulation.

[0005] Secondly, embodiments of the present invention also provide a display device, including the display module provided in any embodiment of the present invention.

[0006] The display module and display device provided in this invention have the following beneficial effects: The display panel includes a bending portion and a bonding portion. When the bending portion bends, the bonding portion is placed on the side of the display panel away from the cover plate. The bonding portion is bonded to the flexible circuit board on the back side of the display panel, thus narrowing the bottom bezel of the display module. The sealant covers the bending portion, fills the space between the bending portion and the cover plate, and fills the inner side of the bending portion. The flexible circuit board has an extension extending into the sealant. The extension embedded in the sealant can adjust the structural modulus and increase the compressive strength of the bending portion. On the outer side of the bending portion, the extension cooperates with the sealant to provide stronger protection, preventing wire breakage due to impact and increasing the overall compressive strength and drop resistance. This invention enhances the compressive strength of the bending portion while appropriately reducing the space between the bending portion and the edge of the cover plate, thereby achieving a smaller bottom bezel width. This invention can achieve a smaller bottom bezel width while enhancing the compressive strength of the bending portion of the display module. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of a display module in related technologies; Figure 2 This is a schematic diagram of a display module provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 11 This is a partial schematic diagram of a flexible circuit board according to an embodiment of the present invention; Figure 12 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 16 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 17 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 18 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 19 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 20 This is a schematic diagram of a display device provided in an embodiment of the present invention.

[0009] Reference numerals: 011, Bending portion; 01, Display panel; 02, Cover plate; 03, Sealing adhesive; 10, Display panel; 20, Cover plate; 30, Sealing adhesive; 40, Flexible circuit board; 50, Display driver chip; 60, Support structure; 11, Bending portion; 12, Binding portion; 121, First binding area; 122, Second binding area; 41, Extension portion; 411, Sub-part; 61, Functional material; 62, Light-absorbing material; 63, Protrusion structure; 64, Groove structure; 641, First groove; 65, Heat dissipation metal; 66, Copper-clad circuit; X1, First virtual line; K, Hollowed-out; AA, Display area; M1, First surface; M2, Second surface; x, Parallel to the plane of the display module; a, First direction; b, Second direction; B, Distance between the edges of the bending portion and the cover plate; 11m, Bending mid-plane; O, Tangent point. Detailed Implementation

[0010] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0011] The terminology used in the embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms “a,” “the,” and “the” as used in the embodiments of this invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0012] Figure 1 This is a schematic diagram of a display module in related technologies, such as... Figure 1 As shown, the display module includes a display panel 01 and a cover plate 02. The display panel 01 has a bent portion 011, which is located at the lower step of the display module and corresponds to the lower bezel of the display device when assembled. In related technologies, LIPO (Low Injection Pressure Over-molding) technology is used to create a sealant 03 on the bent portion 011 to protect it. To facilitate assembly, a large space needs to be reserved between the apex of the bent portion 011 and the edge of the cover plate 02, i.e., a distance B between the apex of the bent portion 011 and the edge of the cover plate 02. Figure 1 When display modules are used in electronic products such as tablets or mobile phones, drops can cause stress impacts to the product's edges. The sealant 03, made using the LIPO process, is relatively hard and directly transfers this stress to the bending section 011, causing deformation and leading to panel failure, display issues such as bright lines or dark spots. Furthermore, the current demand for smaller bottom bezels in electronic products like tablets and mobile phones necessitates reducing the distance B, which increases the requirements for the display module's resistance to pressure on the bottom bezel. Therefore, achieving a balance between narrowing the bottom bezel and ensuring the bottom bezel's resistance to pressure is a pressing technical challenge.

[0013] Figure 2 This is a schematic diagram of a display module provided in an embodiment of the present invention. Figure 2As shown, the display module includes a display panel 10 and a cover plate 20 stacked on top of each other. The display panel 10 includes multiple light-emitting devices and multiple pixel circuits. The pixel circuits are connected to the light-emitting devices to drive them. The light-emitting devices can be, for example, LEDs (light-emitting diodes), such as inorganic light-emitting diodes, OLEDs (Organic Light-Emitting Diodes), AMOLEDs (Active Matrix Organic Light-Emitting Diodes), Mini LEDs (sub-millimeter light-emitting diodes), Micro LEDs (micro light-emitting diodes), etc. The cover plate 20 can be a rigid cover plate or a flexible cover plate. The cover plate 20 is stacked on the light-emitting layer of the display panel 10. A support structure 60 is also provided on the backlight side of the display panel 10. The support structure 60 is used to protect the panel on the back side of the display panel 10. In some embodiments, the support structure 60 includes a support layer composed of an adhesive layer and a PET (polyethylene terephthalate) substrate. The thickness of the adhesive layer is generally 13 μm, and the thickness of the PET substrate can be 50 μm or 75 μm. In some embodiments, the support structure 60 may further include a heat dissipation buffer layer. The heat dissipation buffer layer is composed of foam (containing a mesh adhesive) and copper foil, or of silicone gel and copper foil, or of a stack of silicone gel / PI layer / silicone gel / copper foil, where PI is polyimide. The copper foil may be electrolytic copper, alloy copper, or stainless steel (SUS).

[0014] The display panel also includes a driving layer, which is located between multiple light-emitting devices and a substrate. Pixel circuits are located in the driving layer, and peripheral driving circuits, such as multiple cascaded shift register units, are also arranged in the driving layer. The peripheral driving circuits are used to drive multiple pixel rows in the display panel 10 line by line to realize the display of frame images.

[0015] Optionally, in some embodiments, the display panel further includes a touch layer for implementing touch functionality, the touch layer being located between the cover plate 20 and multiple light-emitting devices. Optionally, the display panel also includes an anti-reflection layer for reducing the reflection of ambient light by the display module. For example, an anti-reflection layer may be provided between the touch layer and the cover plate 10, the anti-reflection layer including a black matrix and color resist units, the multiple openings of the black matrix corresponding to multiple light-emitting devices, and the color resist units located within the openings.

[0016] The display panel 10 includes a bending portion 11 and a binding portion 12. The bending portion 11 is bent from the side near the cover plate 20 to the side of the display panel 10 away from the cover plate 20. The binding portion 12 is located on the side of the display panel 10 away from the cover plate 20 and is connected to the bending portion 11.

[0017] The sealant 30 covers the bend 11 and fills the bend 11, the cover plate 20, and the inside of the bend 11. Figure 2 The diagram illustrates the bent portion 11 in a bent state. The space formed between the bent portion 11 and the supporting structure 60 is the inner side of the bend 11. That is, after the bent portion 11 bends, the side closer to the main area of ​​the display panel is the inner side, and the side farther away from the main area of ​​the display panel is the outer side. The main area is understood as the area of ​​the display panel 10 where the image is displayed.

[0018] The flexible circuit board 40 is bonded to the bonding portion 12. Bonding terminals are arranged on the bonding portion 12, and multiple signal traces are arranged on the bending portion 11. The signal traces are connected to the bonding terminals and are used to transmit signals to drive multiple light-emitting devices in the display panel 10. The signal terminals on the flexible circuit board 40 are correspondingly bonded to the bonding terminals on the bonding portion 12, and the flexible circuit board 40 transmits signals to the signal traces through the bonding terminals. The flexible circuit board 40 includes an extension portion 41 that extends into the encapsulation 30. That is, the encapsulation 30 also covers the extension portion 41, or rather, both the upper and lower surfaces of the extension portion 41 are covered by the encapsulation 30. The extension portion 41 extends into the reserved space between the bending portion 11 and the edge of the cover plate 20. The encapsulation 30 is manufactured using the LIPO process. In the LIPO encapsulation process, the extension portion 41 is embedded in the LIPO adhesive and cured together with the adhesive under light, ultimately resulting in a structure where the extension portion 41 extends into the encapsulation 30.

[0019] In this embodiment of the invention, the display panel 10 includes a bending portion 11 and a bonding portion 12. The bending portion 11 bends, placing the bonding portion 12 on the side of the display panel 10 away from the cover plate 20. The bonding portion 12 is bonded to the flexible circuit board 40 on the back side of the display panel 10, thus narrowing the lower bezel of the display module. A sealant 30 covers the bending portion 11, fills the space between the bending portion 11 and the cover plate 20, and fills the inner side of the bending portion 11. An extension portion 41 of the flexible circuit board 40 extends into the interior of the sealant 30. The sealant 30 filling the inner side of the bending portion 11 provides support for the bending portion 11 from the inside. The extension portion 41, embedded within the sealant 30, can adjust the structural modulus, and can buffer stress when subjected to stress. On the outside of the bend 11, the extension 41 works in conjunction with the sealant 30 to provide stronger protection for the bend 11, increase the compressive strength of the bend 11, prevent the bend 11 from deforming due to impact and breaking, and increase the overall compressive strength and drop resistance of the machine. Figure 2The diagram illustrates the distance B between the bent portion 11 and the edge of the cover plate 20 in the direction x parallel to the plane of the display module. In this embodiment of the invention, while enhancing the compressive strength of the bent portion 11, the reserved space between the bent portion 11 and the edge of the cover plate 20 can be appropriately reduced, i.e., the distance B is shortened, thereby achieving a narrower bottom bezel width. This embodiment of the invention achieves a smaller bottom bezel width while enhancing the compressive strength of the bent portion 11 of the display module, striking a balance between narrowing the bottom bezel and ensuring the compressive strength of the lower step.

[0020] like Figure 2 As shown, when the bent portion 11 of the display panel 10 is in a bent state, the bent portion 11 is tangent to the first virtual line X1, which is perpendicular to the plane where the display module is located, or in other words, the first virtual line X1 is parallel to the thickness direction of the display module; the extension portion 41 intersects with the first virtual line X1. That is, the edge of the extension portion 41 extends beyond the bending apex of the bent portion 11. This arrangement allows the extension portion 41 to be embedded in the sealant 30 for a longer length, thus increasing the area protected by the extension portion 41 and the sealant 30, enabling the extension portion 41 to provide effective impact protection to most areas of the bent portion 11 from the outside.

[0021] For example, Figure 3 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 3 As shown, the flexible circuit board 40 is bonded to the bonding portion 12 of the display panel 10. The flexible circuit board 40 has an extension portion 41 extending into the interior of the sealant 30. The extension portion 41 extends to the periphery of the bent portion 11 and extends towards the cover plate 20. In this embodiment of the invention, the bent portion 11 is in a bent state. The extension portion 41 adapts to the bent shape of the bent portion 11 and extends towards the cover plate 20. The extension portion 41 can be set to have a certain curvature so that the shape of the extension portion 41 matches the spatial shape of the outer side of the bent portion 11 better. This allows the extension portion 41 to better cooperate with the sealant 30 on the outer side of the bent portion 11, enhancing the ability of the outer side of the bent portion 11 to withstand impacts from multiple directions. In addition, the extension portion 41 has a certain curvature, which makes the adhesion between the extension portion 41 and the sealant 30 stronger and the bonding more reliable.

[0022] For example, Figure 4 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 4As shown, the flexible circuit board 40 has an extension 41 extending into the encapsulation 30. The extension 41 extends to the periphery of the bent portion 11 and extends towards the cover plate 20. The extension 41 intersects with the bending mid-plane 11m of the bent portion 11. The bent portion 11 is tangent to the first virtual line X1, which is perpendicular to the plane where the display module is located. The point where the bent portion 11 intersects the first virtual line X1 is the tangent point O, located on the bending mid-plane 11m. The bending mid-plane 11m is parallel to the plane where the cover plate 20 is located, and the tangent point O is equivalent to the bending vertex of the bent portion 11. Along the direction x parallel to the plane where the display module is located, the distance between the tangent point O and the edge of the cover plate 20 is the distance B between the bent portion 11 and the edge of the cover plate 20. In this embodiment, the extension 41 is provided to adapt to the bending shape of the bent portion 11 and extend towards the cover plate 20, so that the shape of the extension 41 matches the spatial shape outside the bent portion 11 better. Furthermore, the extension 41 extends at least above the bending mid-plane 11m of the bending portion 11, resulting in a longer extension length and a larger area opposite to the bending portion 11. In this embodiment, the extension 41 is equivalent to a protective layer formed on the outside of the bending portion 11, providing greater protection for the outside of the bending portion 11. The extension 41, embedded within the sealant 30, can adjust the structural modulus. Under stress, the extension 41 can buffer the stress, and the cooperation between the extension 41 and the sealant 30 further enhances the ability of the outside of the bending portion 11 to withstand impacts from multiple directions. By enhancing the compressive strength of the bending portion 11, the reserved space between the bending portion 11 and the edge of the cover plate 20 can be appropriately reduced, thereby achieving a smaller lower frame width. A balance is achieved between narrowing the lower frame and ensuring the compressive strength of the lower step.

[0023] For example, such as Figure 2 As shown, the extension 41 of the flexible circuit board 40 extends into the encapsulation 30. The extension 41 is approximately parallel to the plane of the cover plate 20, so that both the upper and lower surfaces of the extension 41 are covered by the encapsulation 30. The extension 41 is located in the reserved space between the bent portion 11 and the edge of the cover plate 20. In this embodiment, the extension 41 extending and embedding into the encapsulation 30 can adjust the structural modulus. The extension 41 buffers the stress on the module. The cooperation between the extension 41 and the encapsulation 30 can provide stronger protection for the bent portion 11, enhance the bending resistance of the bent portion 11, prevent the bent portion 11 from deforming due to impact and thus break the wires, and increase the overall machine's compressive strength and drop resistance.

[0024] For example, Figure 5 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 5As shown, the extension 41 of the flexible circuit board 40 extends into the encapsulant 30, and the extension 41 extends away from the cover plate 20. In this embodiment, both the upper and lower surfaces of the extension 41 are wrapped by the encapsulant 30, so that the extension 41 is placed in the reserved space between the bent portion 11 and the edge of the cover plate 20. Setting the extension 41 embedded in the encapsulant 30 can adjust the structural modulus. By using the extension 41 to buffer the stress on the module, the compressive strength of the side of the encapsulant 30 away from the cover plate 20 can be enhanced. This effectively protects the bent portion 11 inside the encapsulant 30, preventing the bent portion 11 from deforming due to impact and thus breaking the wire, and increasing the overall compressive strength and drop resistance of the machine.

[0025] For example, Figure 6 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 6 As shown, the flexible circuit board 40 has an extension 41 extending into the encapsulation 30. The extension 41 includes a first surface M1 facing the bending portion 11 and a second surface M2 facing away from the bending portion 11. At least one of the first surface M1 and the second surface M2 is coated with a functional material 61, which releases photothermal conversion particles when exposed to light. The functional material 61 may include photoacids. The functional material 61 is disposed on the surface of the extension 41. In the LIPO process for encapsulation, after the adhesive is injected into the silicone mold, it needs to be cured by ultraviolet light irradiation. When exposed to light, the photothermal conversion particles or molecules released by the functional material 61 can increase the curing speed of the adhesive, thereby reducing the overall light curing time, lowering costs, and improving the light curing effect.

[0026] Figure 6 The diagram shows that both the first surface M1 and the second surface M2 are covered with functional material 61. The functional material 61 covers a relatively large area, which significantly improves the curing speed of the adhesive in the photocuring process, resulting in a shorter overall photocuring time and a better photocuring effect.

[0027] In some embodiments, the functional material 61 is covered only on the first surface M1 of the extension 41 facing the bend 11. In other embodiments, the functional material 61 is covered only on the second surface M2 of the extension 41 facing away from the bend 11. These embodiments are not illustrated in the accompanying drawings.

[0028] For example, Figure 7 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 7As shown, the flexible circuit board 40 has an extension 41 extending into the encapsulation 30. The extension 41 includes a first surface M1 facing the bending portion 11 and a second surface M2 facing away from the bending portion 11. At least one of the first surface M1 and the second surface M2 is coated with a light-absorbing material 62. The light-absorbing material 62 may be a black paint, a black organic material, etc. In the encapsulation process using the LIPO process, after the adhesive is injected into the silicone mold, it needs to be cured by ultraviolet light irradiation. In the light irradiation process, the light-absorbing material 62 coated on the surface of the extension 41 can absorb ultraviolet light, which can increase the light utilization rate and help accelerate the curing of the adhesive, thereby reducing the overall light curing time and reducing costs.

[0029] Figure 7 The diagram shows that both the first surface M1 and the second surface M2 are coated with light-absorbing material 62. The area covered by the light-absorbing material 62 is relatively large. In the light curing process, the light-absorbing material 62 can absorb more light, the light utilization rate is higher, the curing speed of the adhesive is improved more significantly, and the overall light curing time is shorter.

[0030] In some embodiments, the light-absorbing material 62 is coated only on the first surface M1 of the extension 41 facing the bend 11. In other embodiments, the light-absorbing material 62 is coated only on the second surface M2 of the extension 41 facing away from the bend 11. These are not illustrated in the accompanying drawings.

[0031] For example, Figure 8 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 8 As shown, the flexible circuit board 40 has an extension 41 extending into the interior of the sealant 30. The extension 41 includes a first surface M1 facing the side of the bending portion 11 and a second surface M2 facing away from the side of the bending portion 11. The first surface M1 has a protrusion structure 63 and the second surface M2 has a groove structure 64.

[0032] In other embodiments, the first surface M1 may have a groove structure 64, and the second surface M2 may have a protrusion structure 63. These are not illustrated in the accompanying drawings.

[0033] For example, Figure 9 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 9 As shown, the extension 41 includes a first surface M1 facing the side of the bend 11 and a second surface M2 facing away from the side of the bend 11; both the first surface M1 and the second surface M2 have protrusion structures 63. In other embodiments, both the first surface M1 and the second surface M2 may have groove structures 64.

[0034] For example, Figure 10This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 10 As shown, the extension 41 includes a first surface M1 facing the side of the bend 11 and a second surface M2 facing away from the side of the bend 11; a groove structure 64 is provided on the second surface M2. In some other embodiments, the groove structure 64 may only be provided on the first surface M1, which is not illustrated in the figures here.

[0035] In other embodiments, the protrusion structure 63 may be present only on the first surface M1 or only on the second surface M2.

[0036] In this embodiment of the invention, at least one of the first surface M1 and the second surface M2 is provided with a protrusion structure 63 and / or a groove structure 64. For example, the first surface M1 may only have a protrusion structure 63 or a groove structure 64, or the first surface M1 may have both a protrusion structure 63 and a groove structure 64. That is, at least one of the first surface M1 and the second surface M2 is an uneven surface, or in other words, at least one of the first surface M1 and the second surface M2 is a non-smooth surface. By providing the groove structure 64 and / or the protrusion structure 63, the surface area of ​​the extension 41 can be increased, thereby increasing the contact area between the surface of the extension 41 and the sealant 30, enhancing the adhesion performance between the extension 41 and the sealant 30, and improving mechanical stability.

[0037] like Figure 10 As shown, the groove structure 64 includes a first groove 641. Figure 11 This is a partial schematic diagram of a flexible circuit board according to an embodiment of the present invention. Figure 11 The middle indicates Figure 10 The flattened state of the middle extension 41. For example... Figure 11 As shown, in the flattened state of the extension 41: along the direction parallel to the plane of the extension 41, the groove width of the first groove 641 is d1, and the distance between the two opposite inner walls of the first groove 641 is d2, where d2 > d1. In the cross-sectional view, the shape of the first groove 641 is similar to a T-shape. The surface area of ​​the internal space of the first groove 641 is relatively large, which can increase the contact area between the extension 41 and the sealant 30. Furthermore, in the LIPO sealing process, the injected adhesive flows into the interior of the first groove 641, and after photocuring to form the sealant 30, the sealant 30 and the first groove 641 form a nested structure, making the interaction between the extension 41 and the sealant 30 stronger, the adhesion more reliable, and less prone to peeling.

[0038] For example, Figure 12 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 12As shown, the flexible circuit board 40 has an extension 41 extending into the encapsulation 30, and the extension 41 includes a heat dissipation metal 65. The heat dissipation metal 65 can be formed as a single piece, or multiple heat dissipation metals 65 can be disposed separately on the extension 41. The heat dissipation metal 65 may include materials such as copper and silver. The heat dissipation metal 65 can be attached to the surface of the extension 41, such as the surface near the bending portion 11 or the surface away from the bending portion 11. The heat dissipation metal 65 can also be formed inside the film layer during the coating process of the flexible circuit board 40. The heat dissipation metal 65 has good thermal conductivity, and its use can enhance the heat dissipation of the display driver chip, reduce the temperature of the display driver chip, and thereby improve the display function failure caused by excessive temperature.

[0039] For example, Figure 13 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 13 As shown, the flexible circuit board 40 has an extension 41 extending into the encapsulation 30, and the extension 41 includes a copper-clad circuit 66. The extension 41 is an additional portion of the flexible circuit board 40 in this embodiment of the invention. By extending the extension 41 into the encapsulation 30, the structural modulus is adjusted, allowing the extension 41 to work in conjunction with the encapsulation 30 to protect the bent portion 11 of the display panel 10, preventing deformation and wire breakage due to impact, and increasing the overall extrusion resistance and drop performance. In this embodiment, the copper-clad circuit 66 is further provided in the extension 41, which fully utilizes the extension 41 and improves the integration of the display module.

[0040] In some embodiments, the copper-clad circuit 66 includes an electromagnetic shielding circuit. Since the bend 11 has relatively dense signal traces connected to the display area of ​​the display panel 10, the signal transmission performance of these traces affects the display effect. The electromagnetic shielding circuit in the extension 41 provides electromagnetic shielding, ensuring that the signal traces in the bend 11 are not interfered with by other signals, thus ensuring the display effect. For example, in some applications, when using a stylus near the lower edge of the display screen, the signal traces within the bend 11 are easily affected by electromagnetic interference. The design of this embodiment can shield the electromagnetic pen signal through the electromagnetic shielding circuit in the extension 41, preventing electromagnetic interference with signal transmission in the bend 11 and improving the electromagnetic interference resistance at the extension 41 location.

[0041] In other embodiments, the copper-clad circuit 66 includes an antenna receiving structure. The antenna receiving structure disposed in the extension 41 can be a 5G signal receiving structure, thereby enhancing the 5G signal and improving the user experience. Furthermore, disposing of the antenna receiving structure in the extension 41 allows for full utilization of the extension 41 on the flexible circuit board 40, increasing module integration.

[0042] For example, Figure 14 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 14 As shown, the flexible circuit board 40 has an extension 41 extending into the encapsulation 30. The flexible circuit board 40 also includes a flat plate 42 located on the side of the display panel 10 facing away from the cover plate 20. The flat plate 42 is parallel to the cover plate 20 and has a thickness D1. The extension 41 includes a first surface M1 facing the bending portion 11 and a second surface M2 facing away from the bending portion 11; the distance between the first surface M1 and the second surface M2 is D2, where D2 is greater than the thickness D1 of the flat plate 42. The distance D2 between the first surface M1 and the second surface M2 is also the thickness of the extension 41. Both the flat plate 42 and the extension 41 are part of the flexible circuit board 40 and are connected to each other as a single structure. The extension 41 extends into the sealant 30, and its main function is to work with the sealant 30 to protect the bent portion 11 of the display panel 10, preventing the bent portion 11 from deforming due to impact and thus breaking the wires, thereby increasing the overall compression resistance and drop performance. In this embodiment, the extension 41 has a relatively large thickness, resulting in greater structural strength and better stability, and it can better play the role of adjusting the modulus. The extension 41 can provide better protection on the outside of the bent portion 11, further improving the compression resistance at the bent portion 11. This also makes it easier to narrow the reserved space between the bent portion 11 and the edge of the cover plate 20, further reducing the bezel width, and achieving a balance between improving the overall module's impact resistance and narrowing the lower bezel.

[0043] Furthermore, having a relatively large thickness in the extension 41 makes it easier to design the shape of the extension 41 itself, and also facilitates the addition of other functional structures to the extension 41. The above... Figures 6 to 13 Any of the embodiments can be with Figure 14 The embodiments are combined. Alternatively, without conflict, they can also be used in... Figure 14 Based on the example, add Figures 6 to 13 Two or more structural designs are used to make full use of the extension 41 and improve the module integration.

[0044] In some implementations, such as Figure 14 As shown, the extension 41 includes a first surface M1 facing the side of the bending portion 11 and a second surface M2 away from the side of the bending portion 11; the distance between the first surface M1 and the second surface M2 gradually increases along the direction in which the extension 41 gradually extends away from the flat plate portion 42. Figure 14The extension 41 extends from the back of the display panel 10 towards the cover plate 20, meaning it extends in accordance with the bending direction of the bent portion 11. The thickness of the extension 41 gradually increases as it approaches the cover plate 20. At the position where the bent portion 11 is tangent to the first virtual line X1, the degree of bending of the bent portion 11 is greatest, and its impact resistance is relatively weak at this position. In this embodiment of the invention, the thickness of the extension 41 gradually varies. The extension 41 adjacent to the position with the greatest degree of bending of the bent portion 11 can have a relatively larger thickness, resulting in greater strength and stability of the extension 41. This allows for better modulus adjustment, enabling the extension 41 to provide better protection on the outside of the bent portion 11, further enhancing the compression resistance at the bent portion 11 position, preventing deformation and wire breakage due to impact, and increasing the overall compression resistance and drop performance of the device. Furthermore, the gradual change in the thickness of the extension 41 simplifies the manufacturing process and makes it easier to implement.

[0045] In other embodiments, the flexible circuit board 40 further includes a flat plate portion 42 located on the side of the display panel 10 facing away from the cover plate 20, and the thickness of the flat plate portion 42 is D1. The extension portion 41 includes a first surface M1 facing the side of the bending portion 11 and a second surface M2 facing away from the side of the bending portion 11; the distance between the first surface M1 and the second surface M2 is D2, wherein D2 is greater than the thickness D1 of the flat plate portion 42. The thickness of the extension portion 41 is substantially the same at all locations, all being D2.

[0046] In some embodiments, the extension 41 includes at least n sub-parts 411, where n is an integer and n≥2; the n sub-parts 411 are stacked. Figure 15 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 15As shown, the flexible circuit board 40 has an extension 41 extending into the encapsulant 30. The extension 41 includes at least n sub-parts 411, where n is an integer and n≥2. The n sub-parts 411 are stacked and extend sequentially around the bending portion 11 in a direction away from it. The encapsulant 30 fills the spaces between adjacent sub-parts 411. In this embodiment, the n sub-parts 411 of the extension 41 are stacked in a divergent manner. In the cross-sectional view, the extension 41 is similar to a fan shape, and the spaces between adjacent sub-parts 411 are also filled with encapsulant 30. This is equivalent to multiple sub-parts 411 and encapsulant 30 forming a multi-layer nested structure. This not only makes the bond between the extension 41 and the sealant 30 tighter and more reliable, but also, because each sub-part 411 is stacked in a divergent state on the outside of the bending part 11, the extension direction of each sub-part 411 is slightly different. Thus, each sub-part 411 can resist external extrusion pressure from different directions. The cooperation of n sub-parts 411 and sealant 30 can improve the impact resistance of the bending part 11 in multiple different directions, prevent the bending part 11 from deforming due to impact and breaking the wire, and increase the overall machine's compressive strength and drop performance.

[0047] It should be noted that the above Figures 6 to 15 In the embodiments, the extension portion 41 is shown to extend to the periphery of the bent portion 11 and towards the cover plate 20. Figures 6 to 15 The extended design of extension 41 in the embodiment can also be applied to Figure 2 The extension 41 shown in the diagram is approximately parallel to the plane of the cover plate 20, and Figure 5 The extension 41 shown in the diagram extends away from the cover plate 20, and will not be shown in the diagram here.

[0048] Indicative, Figure 16 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 16 The diagram illustrates the bent portion 11 in a flattened state, and the extension portion 41 is also in a flattened state. Figure 16 Cover plate 20 is not shown. (e.g.) Figure 16As shown, the bent portion 11 and the binding portion 12 are arranged along the first direction a; along the second direction b, the length of the extension portion 41 is L1, and the length of the bent portion 11 is L2, where L1 ≥ L2, and the second direction b is perpendicular to the first direction a. When the bent portion 11 is flattened, both the second direction b and the first direction a are parallel to the plane where the display panel 10 is located. In this embodiment, the length of the extension portion 41 in the second direction b is greater than or equal to the length of the bent portion 11 in the second direction b, and the second direction b is perpendicular to the arrangement direction of the bent portion 11 and the binding portion 12. This allows the extension portion 41 to provide sufficient protection for each part of the bent portion 11 in the second direction b, making the cooperation between the extension portion 41 and the sealant 30 more secure in protecting the bent portion 11, improving the impact resistance at different locations of the bent portion 11, preventing the bent portion 11 from deforming due to impact and breaking the wire, and increasing the overall machine's compression resistance and drop performance.

[0049] Indicative, Figure 17 This is a schematic diagram of another display module provided in an embodiment of the present invention, such as... Figure 17 As shown, the display module includes a display driver chip 50, which is fixed on a flexible circuit board 40. The display driver chip 50 and the flexible circuit board 40 form a flip-chip film, which is bonded to the bonding portion 12 of the display panel 10. When assembled into an electronic device, the display driver chip 50 is connected to the main drive board through the flexible circuit board 40. In this embodiment, the bonding portion 12 is placed on the side of the display panel 10 away from the cover plate 20 by utilizing the bent state of the bending portion 11. The flexible circuit board 40 and the bonding portion 12 are bonded to the side of the display panel 10 away from the cover plate 20, which can reduce the width of the bottom bezel of the display module. Furthermore, the flexible circuit board 40 is provided with an extension portion 41, which extends into the encapsulation 30. The extension portion 41 is used to adjust the structural modulus. The extension portion 41, together with the encapsulation 30, protects the bending portion 11 on the outside of the bending portion 11, which can improve the compression resistance at the bending portion 11 position, prevent the bending portion 11 from deforming due to impact and thus breakage, and increase the overall compression resistance and drop performance of the device. By improving the compression resistance at the bend 11, the reserved space between the bend 11 and the edge of the cover plate 20 can be appropriately reduced, thereby further narrowing the bezel. This embodiment of the invention can achieve a smaller bottom bezel width while enhancing the compression resistance at the bend 11 of the display module.

[0050] Indicative, Figure 18 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 19 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 18 This diagram illustrates the bent portion 11 and the extension portion 41 in a flattened state. Figure 19 The diagram shows a cross-sectional view of the display module.

[0051] like Figure 18 As shown, when the bent portion 11 is in a flattened state, the bent portion 11 and the binding portion 12 are arranged along the first direction a, with the binding portion 12 located on the side of the bent portion 11 away from the display area AA. The first direction a is parallel to the plane where the display panel 10 is located. Figure 18 As can be seen from the top view, the extension 41 of the flexible circuit board 40 at least partially overlaps with the bent portion 11 of the display panel 10, the display driver chip 50 is bonded to the bonding portion 12 of the display panel 10, and the flexible circuit board 40 has a cutout K that exposes the display driver chip 50.

[0052] Combination Figure 19 The display module includes a display driver chip 50; the bonding portion 12 includes a first bonding area 121 and a second bonding area 122, with the first bonding area 121 located on the side of the second bonding area 122 away from the bending portion 11; the flexible circuit board 40 is bonded to the first bonding area 121, and the display driver chip 50 is bonded to the second bonding area 122. The flexible circuit board 40 includes a connecting portion 43, with an extension portion 41 connected to the connecting portion 43, and the connecting portion 43 has a cutout K; in the thickness direction of the display module, the cutout K exposes the display driver chip 50. In this embodiment, the bonding portion 12 is positioned on the side of the display panel 10 away from the cover plate 20 by utilizing the bent state of the bending portion 11, and the flexible circuit board 40 and the display driver chip 50 are respectively bonded to the bonding portion 12 on the side of the display panel 10 away from the cover plate 20, which can reduce the width of the lower bezel of the display module. Furthermore, the flexible circuit board 40 has an extension 41 extending into the encapsulation 30. The extension 41 adjusts the structural modulus, and in conjunction with the encapsulation 30, protects the bent portion 11 from compression on the outside, improving its resistance to pressure and preventing deformation and wire breakage due to impact. This increases the overall compression resistance and drop performance. By improving the compression resistance at the bent portion 11, the space between the bent portion 11 and the edge of the cover plate 20 can be appropriately reduced, further narrowing the bezel. Additionally, a cutout K is provided on the connecting portion 43 of the flexible circuit board 40, exposing the display driver chip 50. This reduces the overall thickness of the module at the location of the display driver chip 50, preventing the flexible circuit board 40 and the display driver chip 50 from being directly stacked and affecting the overall thickness of the display module.

[0053] The above Figure 17 and Figure 19 In the embodiments, the extension portion 41 is shown to extend to the periphery of the bent portion 11 and towards the cover plate 20. Figures 17 to 19 The bonding position design of the display driver chip 50 in this embodiment can also be applied to... Figure 2 The extension 41 shown in the diagram is approximately parallel to the plane of the cover plate 20, and Figure 5 The extension 41 shown in the diagram extends away from the cover plate 20, and will not be shown in the diagram here.

[0054] Based on the same inventive concept, embodiments of the present invention also provide a display device. Figure 20 This is a schematic diagram of a display device provided in an embodiment of the present invention, such as... Figure 20 As shown, the display device includes the display module 100 provided in any embodiment of the present invention. The structure of the display module 100 has been described in the above embodiments and will not be repeated here. The display device provided in the embodiments of the present invention can be, for example, an electronic device with display function such as a mobile phone, tablet, computer, television, or smart wearable product.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A display module, characterized in that, The display module includes: A display panel and a cover plate are stacked on top of each other. The display panel includes a bent portion and a binding portion. The bent portion is bent from a side close to the cover plate to a side of the display panel opposite to the cover plate. The binding portion is located on the side of the display panel opposite to the cover plate and is connected to the bent portion. A sealant is applied to cover the bend and to fill the bend, the cover plate, and the inside of the bend. A flexible circuit board, wherein the flexible circuit board is bonded to the bonding portion; the flexible circuit board includes an extension portion that extends into the encapsulation.

2. The display module according to claim 1, characterized in that, The bent portion is tangent to the first virtual line, which is perpendicular to the plane of the display module; the extended portion intersects with the first virtual line.

3. The display module according to claim 1, characterized in that, The extension extends to the periphery of the bend and extends toward the cover plate.

4. The display module according to claim 3, characterized in that, The extension intersects the bending mid-plane of the bending portion; the bending portion is tangent to the first virtual line, the first virtual line is perpendicular to the plane where the display module is located, the point where the bending portion intersects the first virtual line is the tangent point, the tangent point is located on the bending mid-plane, and the bending mid-plane is parallel to the plane where the cover plate is located.

5. The display module according to claim 1, characterized in that, The extension is parallel to the cover plate, or the extension extends away from the cover plate.

6. The display module according to claim 1, characterized in that, The extension includes a first surface facing the side of the bend and a second surface away from the side of the bend; At least one of the first surface and the second surface is coated with a functional material that releases photothermal conversion particles when exposed to light.

7. The display module according to claim 1, characterized in that, The extension includes a first surface facing the side of the bend and a second surface away from the side of the bend; At least one of the first surface and the second surface is coated with a light-absorbing material.

8. The display module according to claim 1, characterized in that, The extension includes a first surface facing the side of the bend and a second surface away from the side of the bend; At least one of the first surface and the second surface has a groove structure and / or a protrusion structure.

9. The display module according to claim 8, characterized in that, The groove structure includes a first groove; When the extension is flattened: along the direction parallel to the plane where the extension is located, the groove width of the first groove is d1, the distance between the two opposite inner walls of the first groove is d2, and d2 > d1.

10. The display module according to claim 1, characterized in that, The flexible circuit board also includes a flat plate portion, which is located on the side of the display panel opposite to the cover plate; The extension includes a first surface facing the side of the bend and a second surface away from the side of the bend; the distance between the first surface and the second surface is greater than the thickness of the flat plate.

11. The display module according to claim 10, characterized in that, As the extension gradually extends away from the flat plate, the distance between the first surface and the second surface gradually increases.

12. The display module according to claim 11, characterized in that, The extension includes at least n sub-parts, where n is an integer and n≥2; the n sub-parts are stacked and extend sequentially around the bend in a direction away from the bend. The sealant is filled between adjacent sub-parts.

13. The display module according to claim 1, characterized in that, The extension includes heat-dissipating metal.

14. The display module according to claim 1, characterized in that, The extension includes copper-clad circuitry.

15. The display module according to claim 14, characterized in that, The copper-clad circuit includes an electromagnetic shielding circuit.

16. The display module according to claim 14, characterized in that, The copper-clad circuit includes an antenna receiving structure.

17. The display module according to claim 1, characterized in that, When the bent portion is in a flattened state, the bent portion and the binding portion are arranged along a first direction; Along the second direction, the length of the extension is L1, the length of the bend is L2, L1≥L2, the second direction is perpendicular to the first direction, and the first direction and the second direction are parallel to the plane where the display panel is located.

18. The display module according to claim 1, characterized in that, The display module includes a display driver chip, which is fixed on the flexible circuit board.

19. The display module according to claim 1, characterized in that, The display module includes a display driver chip; The bonding portion includes a first bonding area and a second bonding area, wherein the first bonding area is located on the side of the second bonding area away from the bent portion; the flexible circuit board is bonded to the first bonding area, and the display driver chip is bonded to the second bonding area. The flexible circuit board includes a connecting portion, the extension portion is connected to the connecting portion, and the connecting portion has a cutout; in the thickness direction of the display module, the cutout exposes the display driver chip.

20. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 19.

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