Printed circuit board assembly and manufacturing method thereof

Abstract

A printed circuit board assembly according to an embodiment of the present disclosure may include an electronic component. The printed circuit board assembly may include a printed circuit board (PCB) provided with electronic components. The printed circuit board assembly may include a plurality of solder members between the electronic component and the printed circuit board and electrically connecting the electronic component with the printed circuit board. The printed circuit board assembly may include a plurality of protrusions disposed on the printed circuit board to be spaced apart from the plurality of solder members and positioned proximate an edge of the electronic component. The printed circuit board assembly may include a filling member that fills an edge of the electronic component between the printed circuit board and the electronic component. The distribution of the filling member may be promoted by an adhesive force between the filling member and the plurality of protrusions, and a cohesive force of the filling member when the filling member in a liquid state is filled between the printed circuit board and the electronic component.

Description

Technical Field

[0001] This disclosure relates to a printed circuit board assembly and a method of manufacturing the same, the printed circuit board assembly including electronic components and a circuit board on which the electronic components are mounted. Background Technology

[0002] Driven by the rapid development of the electronics industry and user demands, electronic devices are becoming increasingly miniaturized and multifunctional. Consequently, the demand for miniaturization and multifunctionality of electronic components used in electronic devices (such as semiconductor device components) is also increasing.

[0003] Surface mount technology (SMT) can be used to mount (or set) electronic components onto a circuit board (e.g., a printed circuit board (PCB)). The electronic components can be physically connected and electrically connected to the circuit board via multiple solder components.

[0004] Typically, multiple solder components can be placed in the internal region between the circuit board and the electronic component. Depending on the design, multiple solder components may not be placed in the edge region between the circuit board and the electronic component. In this case, the reliability of the electronic component may be lower than that of electronic components with different design structures. Summary of the Invention

[0005] Technical solutions to the problem Various embodiments of this disclosure may provide a printed circuit board assembly including a plurality of protrusions formed in an edge region of a circuit board without a plurality of solder members, and filler members filling the edge region of the circuit board along the plurality of protrusions.

[0006] A printed circuit board assembly according to embodiments of the present disclosure may include electronic components. The printed circuit board assembly may include a printed circuit board (PCB) on which the electronic components are mounted. The printed circuit board assembly may include a plurality of solder members located between the electronic components and the printed circuit board, and electrically connecting the electronic components and the printed circuit board. The printed circuit board assembly may include a plurality of protrusions located on the printed circuit board, configured to be spaced apart from the plurality of solder members, and positioned near the edges of the electronic components. The printed circuit board assembly may include filler members that fill the edges of the electronic components between the printed circuit board and the electronic components. The distribution of the filler members may be facilitated by the adhesive force between the filler members and the plurality of protrusions, and by the cohesive force of the filler members during liquid filling between the printed circuit board and the electronic components.

[0007] According to an example of the present disclosure, a method for manufacturing a printed circuit board assembly includes a printed circuit board on which electronic components are disposed. The method may include forming a plurality of protrusions in an edge region of the printed circuit board, the edge region being spaced apart from a soldering region of the printed circuit board on which a plurality of solder members are disposed. The method for manufacturing the printed circuit board assembly may include applying solder material to a plurality of connection pads disposed in the soldering region. The method for manufacturing the printed circuit board assembly may include disposing electronic components on the printed circuit board such that the plurality of protrusions and the edges of the electronic components face each other. The method for manufacturing the printed circuit board assembly may include filling the space between the plurality of protrusions with filler members. The distribution of the filler members may be facilitated by the adhesive force between the filler members and the plurality of protrusions, and by the cohesive force of the filler members B during liquid filling between the printed circuit board and the electronic components.

[0008] According to various embodiments of this disclosure, since multiple protrusions are formed in the edge regions of the circuit board where no solder members are provided, filler members can be uniformly filled (or applied) along the multiple protrusions in the edge regions. In this case, electronic components can be securely mounted on the substrate by the multiple solder members and filler members, thereby enhancing the reliability of the printed circuit board assembly.

[0009] The effects of this invention are not limited to the foregoing, and other effects not mentioned will be apparent to those skilled in the art from the following description. In other words, those skilled in the art can also derive unintended effects from the exemplary embodiments of this disclosure when practicing the embodiments of this disclosure. Attached Figure Description

[0010] In conjunction with the description of the accompanying drawings, the same or similar reference numerals may be used to denote the same or similar elements.

[0011] Figure 1 This is a top view showing a printed circuit board assembly according to an embodiment of the present disclosure.

[0012] Figure 2a It shows along Figure 1 The diagram shows a cross-sectional view of the printed circuit board assembly taken by line I-I'.

[0013] Figure 2b This is a partial cross-sectional view showing the state of a printed circuit board assembly according to an embodiment of the present disclosure before the filler member is filled.

[0014] Figure 3 This is a partial cross-sectional view showing a printed circuit board assembly according to an embodiment of the present disclosure, illustrating the state in which the filler member is filled.

[0015] Figure 4 yes Figure 1 A magnified view of part A.

[0016] Figure 5 This is a cross-sectional view showing the cross-sectional shape of a plurality of protrusions according to an embodiment of the present disclosure.

[0017] Figure 6 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0018] Figure 7 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0019] Figure 8 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0020] Figure 9 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0021] Figure 10 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0022] Figure 11 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0023] Figure 12 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0024] Figure 13 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0025] Figure 14 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0026] Figure 15 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0027] Figure 16 This is a view illustrating the arrangement of a plurality of protrusions according to an embodiment of the present disclosure.

[0028] Figure 17 This is a view showing the filling range of the filling member located on the circuit board according to an embodiment.

[0029] Figure 18 This is a diagram illustrating the manufacturing process of a printed circuit board assembly according to an embodiment of the present disclosure.

[0030] Figure 19This is a process diagram illustrating the formation process of a plurality of protrusions according to embodiments of the present disclosure.

[0031] Figure 20 This is a process diagram illustrating the formation process of a plurality of protrusions according to embodiments of the present disclosure.

[0032] Figure 21 This is a top view showing a printed circuit board assembly according to a comparative embodiment of the present disclosure.

[0033] Figure 22 This illustrates a comparative embodiment according to the present disclosure. Figure 21 The diagram shows a cross-sectional view of the printed circuit board assembly taken by line II-II'.

[0034] Figure 23 This is a view showing the filling range of the filling member in a circuit board of the present disclosure according to a comparative embodiment of the present disclosure.

[0035] Figure 24 This is a view showing the crack state of a solder component that occurs when the filler component is underfilled.

[0036] Figure 25 This is a view showing the filling range of a filling member located on a circuit board according to a comparative embodiment of the present disclosure.

[0037] Figure 26 This is a view showing the crack state of a solder component that occurs when the filler component is overfilled. Detailed Implementation

[0038] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather to include various changes, equivalents or substitutions to the corresponding embodiments.

[0039] Regarding the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements.

[0040] It should be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to the item can include one or more things.

[0041] As used herein, each of the phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B or C” can include all possible combinations of the items listed together in the corresponding phrase.

[0042] As used herein, terms such as “first” and “second”, or “first” and “second”, may be used only to distinguish corresponding parts from one other part and do not limit the parts in other respects (e.g., importance or order).

[0043] It should be understood that, with or without the terms “operably” or “communically”, if an element (e.g., a first element) is referred to as being “coupled” or “connected to”, or “coupled to”, or “connected to” another element (e.g., a second element), it means that the element can be coupled (connected or linked) to the other element directly (e.g., wired), wirelessly, or via a third element.

[0044] It will also be understood that the terms “comprising” and / or “having” as used herein specify the presence of the said feature, integer, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0045] It will be understood that when a component is referred to as being “connected to,” “coupled to,” “supported on,” or “in contact with” another component, the components may be directly or via a third component connected, coupled, supported, or in contact with each other.

[0046] Throughout the instruction manual, when one component is positioned "on" another component, the first component may be positioned directly on the second component, or other components may be positioned between the first and second components.

[0047] The term “and / or” can refer to multiple related components listed or any combination of components.

[0048] The working principle and embodiments of the present invention are described below with reference to the accompanying drawings.

[0049] Figure 1 This is a top view showing a printed circuit board assembly according to an embodiment of the present disclosure.

[0050] Figure 2a It shows along Figure 1 The diagram shows a cross-sectional view of the printed circuit board assembly taken by line I-I'.

[0051] Figure 2b This is a partial cross-sectional view showing the state of a printed circuit board assembly according to an embodiment of the present disclosure before the filler member is filled.

[0052] Figure 3 This is a partial cross-sectional view showing a printed circuit board assembly according to an embodiment of the present disclosure, illustrating the state in which the filler member is filled.

[0053] Figure 4 yes Figure 1 A magnified view of part A.

[0054] Figure 5 This is a cross-sectional view showing the cross-sectional shape of a plurality of protrusions according to an embodiment of the present disclosure.

[0055] The printed circuit board assembly 100 according to the examples of this disclosure can be implemented as various types of modules, such as solid-state drive (SSD) modules, memory modules, computer system modules, or mobile system modules. For example, the printed circuit board assembly 100 may correspond to a semiconductor module.

[0056] In the following description of this disclosure, the printed circuit board assembly 100 is described as an example of a semiconductor module, but this disclosure is not limited thereto.

[0057] refer to Figures 1 to 5 The printed circuit board assembly (PBA) 100 according to the example may include a circuit board (e.g., a printed circuit board (PCB)) 110, at least one electronic component 120, a plurality of solder components 130, a plurality of protrusions 140 and / or filler components B.

[0058] According to the example, various components (e.g., electronic components) constituting the printed circuit board assembly 100 may be mounted or disposed on the circuit board 110.

[0059] According to the example, circuit board 110 may have circuit traces on at least one surface for electrically connecting various components mounted on circuit board 110. In the example, circuit board 110 may be configured as a substrate for a single-layer PCB having circuit traces formed on only one surface. In the example, circuit board 110 may be configured as a substrate for a double-layer PCB having circuit traces formed on two opposing surfaces. For example, in the case where circuit board 110 is configured as a double-layer PCB, the upper and lower circuit traces may be electrically connected through conductive path structures (e.g., conductive vias) penetrating circuit board 110 (specifically, substrate body 111 described below).

[0060] According to the example, the circuit board 110 may include a substrate body 111, a protective layer 112 and / or a plurality of substrate pads 113.

[0061] According to an example, the substrate body 111 may include: a body layer formed by compressing various resins such as glass epoxy (or FR-4) resin, phenolic resin, or BT resin to a predetermined thickness, and circuit traces formed on the body layer. The circuit traces may be formed, for example, by patterning copper foil coated on the body layer.

[0062] In the example, the substrate body 111 may have the following structure: three or more copper foil layers are formed using an insulator called prepreg, and three or more circuit traces are formed depending on the number of copper foil layers, but this disclosure is not limited thereto.

[0063] According to the example, the protective layer 112 may be disposed on the upper side (e.g., in the +z axis direction) of the substrate body 111. In the example, the protective layer 112 may be configured to protect circuit traces formed on the substrate body 111. The protective layer 112 may be formed of, for example, a solder resist (SR) covering the circuit traces. The protective layer 112 may have a structure that covers the circuit traces while opening portions of a plurality of substrate pads 113 to the outside.

[0064] According to the example, a plurality of substrate pads 113 may be disposed on at least the upper surface (e.g., the surface facing the +z-axis direction) or the lower surface (e.g., the surface facing the -z-axis direction) of the circuit board 110. Although not specifically shown in the figures, the plurality of substrate pads 113 may also be electrically connected to other substrates in addition to being connected to electronic components 120. In the example, the plurality of substrate pads 113 may be disposed on the substrate body 111. In the example, the plurality of substrate pads 113 may be disposed on a plane substantially the same as the protective layer 112 (e.g., the XY plane), but this disclosure is not limited thereto.

[0065] According to the example, the plurality of substrate pads 113 can have various shapes. For example, the plurality of substrate pads 113 can have shapes such as circular, polygonal or annular, but this disclosure is not limited thereto.

[0066] According to the example, the multiple substrate pads 113 may include multiple connection pads 113a and / or multiple dummy pads 113b.

[0067] According to the example, a plurality of connection pads 113a can be electrically connected to at least one electronic component 120. In the example, each of the plurality of connection pads 113a can electrically connect the electronic component 120 and the circuit board 110 via a plurality of solder components 130.

[0068] According to the example, the plurality of connection pads 113a may be integrally provided with the circuit trace as part of the circuit trace, or may be provided as separate components on the circuit trace. The plurality of connection pads 113a may be referred to as, for example, electrode pads, contact pads, solder pads, or solder pads. The plurality of connection pads 113a may be formed of at least one of, for example, aluminum (Al), copper (Cu), nickel (Ni), tungsten (W), platinum (Pt), or gold (Au).

[0069] According to the example, multiple connection pads 113a can be disposed on the underside of the electronic component 120 (e.g., in the -z axis direction). In the example, the multiple connection pads 113a can be disposed on the circuit board 110 to overlap with the electronic component 120. In the example, the multiple connection pads 113a can be disposed in a soldering area SA where multiple solder components 130 are disposed. In this case, as... Figure 1 As shown, when viewing the printed circuit board assembly 100 from top to bottom, multiple connection pads 113a are hidden by electronic components 120.

[0070] According to the example, multiple dummy pads 113b are independent of the electrical connection to the electronic component 120 and can be formed on the circuit board 110 as intermediate parts for fixing the protrusion 140.

[0071] According to the example, multiple dummy pads 113b can be formed together with multiple connecting pads 113a in a single process. However, this disclosure is not limited thereto, and considering the formation process of the multiple protrusions 140 and the design conditions of the circuit board 110, the multiple dummy pads 113b can be omitted. For example, in the case described below where multiple protrusions 140 are formed using a bonding member P, the multiple dummy pads 113b can be omitted. Referring below... Figure 19 and Figure 20 The process of forming multiple protrusions 140 using the joining member P is described in detail.

[0072] According to the example, multiple dummy pads 113b may be disposed on the underside of electronic component 120 (e.g., in the -z-axis direction). In the example, multiple dummy pads 113b may be disposed on circuit board 110 to overlap with electronic component 120 (e.g., second electronic component 122). In the example, multiple dummy pads 113b may be disposed on the periphery (or near) of soldering area SA. For example, multiple dummy pads 113b may be spaced apart from multiple connecting pads 113a. In the example, multiple dummy pads 113b may be disposed in edge region PA where multiple solder members 130 are not disposed. Edge region PA may refer to the area formed between second electronic component 122 and circuit board 110, adjacent to or facing the edge or boundary of second electronic component 122, when second electronic component 122 is mounted (or disposed) on circuit board 110.

[0073] According to the example, the edge region PA may include a first edge region PA_l formed on the left side (e.g., in the -x-axis direction) relative to the welded region SA and a second edge region PA_r formed on the right side (e.g., in the +x-axis direction) relative to the welded region SA.

[0074] In the example, the first edge region PA_l can be formed to extend along a vertical direction (e.g., the ±y-axis direction) on the circuit board 110. In the example, the second edge region PA_r can be formed to extend along a vertical direction (e.g., the ±y-axis direction) on the circuit board 110.

[0075] Although not specifically shown in the accompanying drawings, the edge region PA can be formed in various shapes to overlap with the second electronic component 122, depending on the electrical connection structure of the second electronic component 122 (e.g., the arrangement of the plurality of solder members 130 and / or the arrangement of the plurality of contact points 125 described below). For example, with Figure 1 As shown, the edge region PA can be formed on all four sides of the weld area SA to surround the weld area SA. In this case, as... Figure 1 As shown, when viewing the printed circuit board assembly 100 from top to bottom, multiple dummy pads 113b are hidden by electronic components 120.

[0076] According to the example, at least one electronic component 120 may be mounted (or disposed) on the circuit board 110. For example, at least one electronic component 120 may be mounted on at least one surface (e.g., the upper or lower surface) of the circuit board 110. In the example, at least one electronic component 120 may be electrically / physically connected to the circuit board 110 via a plurality of solder components 130.

[0077] According to the example, at least one electronic component 120 may include various elements, such as passive and / or active elements. At least one electronic component 120 may be any element that can be mounted (or set) on the circuit board 110.

[0078] In the example, when electronic component 120 is mounted (or disposed) on circuit board 110, at least one electronic component 120 may include a plurality of contact points 125 formed on a surface (e.g., lower surface) facing circuit board 110. In the example, the plurality of contact points 125 may contact a plurality of solder members 130. The plurality of contact points 125 may be electrically connected via the plurality of solder members 130 to a plurality of connection pads 113a disposed on circuit board 110.

[0079] According to the example, at least one electronic component 120 may be a chip package including at least one semiconductor chip. For example, at least one memory chip or logic chip may be included in the electronic component 120. For example, when the electronic component 120 includes a memory chip, the electronic component 120 may be a storage element including a memory such as: Dynamic Random Access Memory (DRAM), Static Random Access Memory (SRAM), Flash Memory, Electrically Erasable Programmable Read-Only Memory (EEPROM), Phase-Change Random Access Memory (PRAM), Magnetoresistive Random Access Memory (MRAM), or Resistive Random Access Memory (RRAM). For example, when the electronic component 120 includes a logic chip, the electronic component 120 may be a logic element including a relatively small logic chip.

[0080] In this example, at least one electronic component 120 may include elements such as connectors, controllers, or electrolytic capacitors. Here, the electrolytic capacitor may be a unipolar capacitor, may have a large capacitance, and may be used for low-frequency filtering or bypassing.

[0081] In the example, at least one electronic component 120 may include a chip package, such as a microprocessor, central processing unit (CPU), controller, or application-specific integrated circuit (ASIC), which is typically large in size.

[0082] In the example, at least one electronic component 120 may also include an application processor (AP) of the system-on-chip (SoC) type used in mobile electronic devices.

[0083] The type of at least one electronic component 120 is not limited to the elements described above.

[0084] In this example, at least one electronic component 120 can be mounted (or set) on the circuit board 110 using surface mount technology (SMT). SMT can refer to so-called automated soldering technology, which uses soldering materials (or solder paste) to automatically mount electronic components onto the surface of the circuit board 110. For example, SMT can refer to a technology that uses soldering materials and devices such as chip mounters or multi mounters to automatically mount (or set) electronic components (such as semiconductors, diodes, and chips) onto a substrate and cure them. In such SMT, heat and pressure can be applied to promote bonding between the corresponding electronic components and the soldering materials.

[0085] According to the example, at least one electronic component 120 may include a first electronic component 121 and a second electronic component 122.

[0086] According to the example, the first electronic component 121 may correspond to an electronic component having substantially the same size as the soldering area SA on which a plurality of solder members 130 are disposed. The first electronic component 121 may correspond to, for example, an AP-related component.

[0087] According to the example, the second electronic component 122 may correspond to a component having a different size than the first electronic component 121. For example, the second electronic component 122 may have a larger size than the first electronic component 121.

[0088] According to the example, the second electronic component 122 may correspond to an electronic component having a different size than the soldering region SA on which the plurality of solder members 130 are provided. The second electronic component 122 may correspond to, for example, an electronic component including the soldering region SA and an edge region PA. The second electronic component 122 may correspond to, for example, a memory-related component.

[0089] According to the example, multiple solder components 130 may be disposed on the circuit board 110 to overlap with electronic components 120. In the example, the multiple solder components 130 may be disposed on multiple connection pads 113a. In the example, the multiple solder components 130 may be disposed in a soldering area SA. In the example, the multiple solder components 130 can physically / electrically connect at least one electronic component 120 and the circuit board 110. For example, a second electronic component 122 can be securely mounted (or disposed) on the circuit board 110 by the multiple solder components 130 and the filler component B described below. In the example, the multiple solder components 130 may include solder balls.

[0090] According to the example, a plurality of protrusions 140 may be disposed on the circuit board 110 to overlap with the second electronic component 122. In the example, the plurality of protrusions 140 may be disposed on a plurality of dummy pads 113b. For example, the plurality of protrusions 140 may be formed to be disposed on the plurality of dummy pads 113b by a soldering process. The plurality of protrusions 140 may be formed of soldering material, but this disclosure is not limited thereto. For example, the plurality of protrusions 140 may also be formed of a bonding member P described below, and will be referred to below. Figure 19 and Figure 20 describe.

[0091] In one example, multiple protrusions 140 can be set in the edge region PA. In the example, multiple protrusions 140 can be set in at least one or more rows in the edge region PA.

[0092] According to the example, the plurality of protrusions 140 can have various shapes, such as hemispherical, cylindrical, or polyhedral, but this disclosure is not limited thereto. For example, the shape of the plurality of protrusions 140 can be designed considering the filling amount and / or filling area (or filling range) of the filling member B when filling it. This is because, when filling the filling member B, the flow resistance of the filling member B varies depending on the shape of the plurality of protrusions 140. For example, the plurality of protrusions 140a can be designed to have a circular shape in the cross-section cut along the XY plane, such as... Figure 5 As shown in (a). For example, multiple protrusions 140b can be designed as strips with a convex center in a cross-section cut along the XY plane, such as... Figure 5 As shown in (b).

[0093] According to the example, the plurality of protrusions 140 can be configured to be spaced apart from each other at a predetermined interval. For example, the spacing d between the plurality of protrusions 140 can be 0.4 mm or greater, but this disclosure is not limited thereto. The spacing d between the plurality of protrusions 140 can be designed considering the filling amount and / or filling area (or filling range) of the filling member B in the case of filling member B. The filling area of ​​the filling member B can also be referred to as the overlapping area or the bonding area, as the area of ​​the filling member B in contact with the second electronic component 122 and the circuit board 110. For example, when the spacing d between the plurality of protrusions 140 is reduced, capillary action becomes more effective, and the filling amount and / or filling area of ​​the filling member B can be increased. Here, capillary action can refer to the phenomenon that the filling member B flows from the edge region PA to the soldering region SA along the plurality of protrusions 140 due to the cohesive force of the filling member B and the adhesive force between the filling member B and the plurality of protrusions 140. In this case, the second electronic component 122 can be securely mounted (or set or fixed) on the circuit board 110.

[0094] According to the example, the plurality of protrusions 140 can be configured to be spaced apart from the plurality of solder members 130 at predetermined intervals. For example, the spacing distance l between the plurality of protrusions 140 and the plurality of solder members 130 can be designed in the range of 0.9 mm to 2.0 mm, but this disclosure is not limited thereto. The spacing distance l between the plurality of protrusions 140 and the plurality of solder members 130 can be designed taking into account the amount and / or the area (or range) of the filler member B when it is filled. For example, the spacing distance l can be designed to be within a range where the filler member B, when filled, does not contact the plurality of solder members 130.

[0095] According to the example, multiple protrusions 140 may protrude from the surface of the circuit board 110 to a predetermined height h. In the example, the protrusion height h of the multiple protrusions 140 may be designed to be lower than the gap g between the circuit board 110 and the second electronic component 122 (see [reference]). Figure 2b and Figure 3 For example, the multiple protrusions 140 can be designed not to contact the lower surface of the second electronic component 122. For example, the protrusion height h of the multiple protrusions 140 can be designed in the range of 70 μm to 100 μm, but this disclosure is not limited thereto. For example, the gap g between the second electronic component 122 and the circuit board 110 can be designed in the range of 140 μm to 160 μm. For example, the gap between the multiple protrusions 140 and the second electronic component 122 can be designed in the range of 80 μm to 90 μm. In this case, no interference occurs between the multiple protrusions 140 and the second electronic component 122, thus preventing damage to the second electronic component 122 due to the formation of the multiple protrusions 140. However, this disclosure is not limited thereto, and in some examples, the protrusion height h of the multiple protrusions 140 can be designed to be substantially the same as the gap g between the circuit board 110 and the second electronic component 122, such that the multiple protrusions 140 connect the circuit board 110 and the second electronic component 122.

[0096] According to the example, the dimensions of the plurality of protrusions 140 can be smaller than those of the plurality of solder members 130. For example, the diameter of the plurality of protrusions 140 can be designed in the range of 0.1 mm to 0.2 mm, and the diameter of the plurality of solder members 130 can be designed to be about 0.3 mm, but this disclosure is not limited thereto. In this case, within a limited area (e.g., the edge region PA), the plurality of protrusions 140 can be provided in greater numbers than the plurality of solder members 130, thus the capillary action can be smoother.

[0097] In one example, the plurality of protrusions 140 can adjust the amount and / or area (or range) of the filling member B filling the space between the second electronic component 122 and the circuit board 110 by designing the spacing between the protrusions, the arrangement of the protrusions, and / or the shape of the protrusions in various ways, and can also enhance the uniformity of the filling member B. Here, the uniformity of the filling member B can refer to the degree to which the filling member B is uniformly applied to the circuit board 110.

[0098] According to the example, filler component B can physically connect the second electronic component 122 to the circuit board 110. In the example, filler component B can be filled in liquid form into the gap between the circuit board 110 and the second electronic component 122 using an underfill process and / or a sidefill process. The filled filler component B can then be cured by heat and / or pressure. In the example, filler component B can be made of a non-conductive material. For example, filler component B can be made of thermosetting resins such as epoxy resins, silicone resins, polyurethanes, acrylic resins, and polyamides, which have insulating properties.

[0099] In one example, the filling member B can uniformly fill the entire edge region PA along multiple protrusions 140 provided on the circuit board 110.

[0100] According to the example, multiple protrusions 140 can be arranged in at least one or more rows on the circuit board 110. See below for reference. Figures 6 to 16 Describe the various arrangements of multiple protrusions 140.

[0101] Figures 6 to 16 This is a view illustrating the arrangement of a plurality of protrusions according to various embodiments of the present disclosure.

[0102] Figures 6 to 16 It is a view showing a plurality of protrusions 140 arranged in at least one row or more rows (e.g., two or more rows) along a horizontal direction (e.g., ±x direction) on a circuit board 110.

[0103] Figure 6 (a) is a view showing that, when viewed from above (e.g., in the +z axis direction), a plurality of protrusions 140 are arranged in a grid pattern shape in the edge region PA of the circuit board 110. Figure 6 (b) is shown in such a way Figure 6 (a) shows a view of the filling state of the filling member B when multiple protrusions 140 are provided.

[0104] refer to Figure 6 (a) According to the example, the plurality of protrusions 140 can be configured to have at least two or more rows. In the example, each row of the plurality of protrusions 140 can be spaced apart at predetermined intervals along the horizontal direction (e.g., ±x-axis direction) of the circuit board 110.

[0105] In the example, multiple protrusions 140 may be provided on each of the left and right sides of the welding area SA, spaced apart from the welding area SA on which multiple solder members 130 or connecting pads 113a are provided. Edge areas PA may also be formed on each of the left and right sides of the welding area SA in correspondence with the arrangement of the multiple protrusions 140.

[0106] According to the example, when viewing the circuit board 110 from above (e.g., in the +z axis direction), the plurality of protrusions 140 can be configured to have an integral grid pattern in the edge region PA. For example, the plurality of protrusions 140 included in each row can be configured to face the plurality of protrusions 140 included in other adjacent rows. The plurality of protrusions 140 in each row can be spaced apart from each other by a predetermined spacing da. The spacing da of the plurality of protrusions 140 can be designed to be, for example, about 0.4 mm, but this disclosure is not limited thereto.

[0107] In the grid pattern arrangement structure of multiple protrusions 140, the distance 1a between the welding area SA and the edge area PA can be designed to be in the range of 0.9 mm to 2.0 mm, but this disclosure is not limited thereto.

[0108] Reference Figure 6 (b) Filling component B with Figure 6 In the case of the edge region PA corresponding to the arrangement structure shown in (a), the filling member B can be capillarily applied to the second electronic component (e.g., Figure 2a In the space between the second electronic component 122 and the circuit board 110, the filler component B flows inward (e.g., in the direction toward the soldering area SA) along the gaps formed between the plurality of protrusions 140, and is then cured. In this case, due to the arrangement of the plurality of protrusions 140, the filler component B does not contact the plurality of solder components 130 and can be uniformly filled within the periphery of the edge area PA.

[0109] Figure 7 (a) is a view showing at least some of the plurality of protrusions 140 arranged in a cross-pattern shape in the edge region PA of the circuit board 110 when viewed from above (e.g., in the +z axis direction). Figure 7 (b) is shown in such a way Figure 7 (a) shows a view of the filling state of the filling member B when multiple protrusions 140 are provided.

[0110] refer to Figure 7 (a) According to the example, the plurality of protrusions 140 can be configured to have at least two or more rows, such as three rows. In the example, each row of the plurality of protrusions 140 can be spaced apart at predetermined intervals along the horizontal direction (e.g., ±x-axis direction) of the circuit board 110.

[0111] In the example, multiple protrusions 140 may be provided on each of the left and right sides of the welding area SA, spaced apart from the welding area SA on which multiple solder members 130 are provided. In this case, edge areas PA may also be formed on each of the left and right sides of the welding area SA corresponding to the arrangement of the multiple protrusions 140.

[0112] According to the example, when viewing the circuit board 110 from above (e.g., the +z axis direction), at least some of the plurality of protrusions 140 can be configured to have a repeating cross pattern (e.g., an X-shaped pattern) along the vertical direction (e.g., the ±y axis direction). For example, at least some of the plurality of protrusions 140 included in each row can be configured not to face the plurality of protrusions 140 included in other adjacent rows. For example, the plurality of protrusions 140 included in each row can be alternately arranged with the plurality of protrusions 140 included in other adjacent rows.

[0113] In the cross-pattern arrangement of multiple protrusions 140, the multiple protrusions 140 included in each row can be spaced apart from each other by a predetermined distance db. The distance db between the multiple protrusions 140 can be designed, for example, about 1.0 mm, but this disclosure is not limited thereto.

[0114] In the cross-pattern arrangement structure, the distance lb between the welding area SA and the edge area PA can be designed to be, for example, in the range of 0.1 mm to 0.5 mm. For example, the distance lc between the solder member 130 located at the inner edge of the welding area SA and the edge area PA can be designed to be in the range of 1.0 mm to 2.0 mm. However, this disclosure is not limited thereto.

[0115] Comparison Reference Figure 7 (b) and Figure 6 (b) The arrangement of the plurality of protrusions 140 shown in each figure, and Figure 6 Compared to the arrangement of the multiple protrusions 140 shown in (b), with Figure 7 (b) As the number of rows in the arrangement of the plurality of protrusions 140 shown increases, the amount of filling member B between the second electronic component 122 and the circuit board 110 can be increased. Therefore, the second electronic component 122 can be securely mounted on the circuit board 110.

[0116] Figure 8 (a) shows, when viewed from above (e.g., in the +z axis direction) the circuit board 110, multiple protrusions 140 on each of the left and right sides of the soldering area SA in an overall “ "Shape or horizontal flip" "View of shape settings." Figure 8 (b) is shown in such a way Figure 8 (a) shows a view of the filling state of the filling member B when multiple protrusions 140 are provided.

[0117] refer to Figure 8 (a) According to the example, the plurality of protrusions 140 can be configured to have at least two or more rows, such as three rows. In the example, each row of the plurality of protrusions 140 can be spaced apart at predetermined intervals along the horizontal direction (e.g., ±x-axis direction) of the circuit board 110.

[0118] In the example, multiple protrusions 140 may be provided on each of the left and right sides of the welding area SA, spaced apart from the welding area SA on which multiple solder members 130 are provided. In this case, edge areas PA may also be formed on each of the left and right sides of the welding area SA corresponding to the arrangement of the multiple protrusions 140.

[0119] According to the example, when viewing the circuit board 110 from above (e.g., in the +z axis direction), multiple protrusions 140 can be configured to have an integral "" on each of the left and right sides of the soldering area SA. "Shape or horizontal flip" "Shape. For example, protrusion 140 may not be provided in the central right region or central left region of the edge region PA. When viewing the circuit board 110 from above, the plurality of protrusions 140 may be configured with a shape having a central portion recessed toward the soldering region SA."

[0120] exist Figure 8 In the arrangement of the plurality of protrusions 140 shown, the distance ld between the solder member 130 located at the inner edge of the welding area SA and the protrusion 140 located at the outermost edge of the edge area PA can be designed to be in the range of 1.5 mm to 3.0 mm, but this disclosure is not limited thereto.

[0121] The distance dc between the upper region (e.g., the +y axis region) and the lower region (e.g., the -y axis region) of the edge region PA can be designed to be about 10 mm, but this disclosure is not limited thereto.

[0122] Reference Figure 8 (b) By designing the arrangement of multiple protrusions 140 corresponding to the various arrangement structures of multiple solder components 130 in the welding area SA, the filling direction (or flow direction) of the filling component B filled between the second electronic component 122 and the circuit board 110 can be controlled.

[0123] refer to Figure 9 and Figure 10 According to the example, multiple protrusions 140 may be arranged in at least one group in the corner portion of the edge of the circuit board 110 facing the second electronic component 122. The multiple protrusions 140 may be configured to have an integral X shape within the group.

[0124] refer to Figure 9(a) When viewing the circuit board 110 from above (e.g., the +z axis direction), the plurality of protrusions 140 can be grouped and arranged at each of the upper left, lower left, upper right, and lower right locations relative to the soldering area SA. In this case, the edge area PA can also be divided into an upper left edge area PA_l1, a lower left edge area PA_l2, an upper right edge area PA_r1, and a lower right edge area PA_r2 corresponding to the arrangement of the plurality of protrusions 140. The upper left edge area PA_l1 and the lower left edge area PA_l2 can be arranged to be spaced apart at a predetermined interval along the vertical direction (e.g., the ±y axis direction) on the left side of the soldering area SA (e.g., the -x axis direction). The upper right edge area PA_r1 and the lower right edge area PA_r2 can be arranged to be spaced apart at a predetermined interval along the vertical direction (e.g., the ±y axis direction) on the right side of the soldering area SA (e.g., the +x axis direction).

[0125] Reference Figure 9 (b) Filling component B with Figure 9 In the case of the edge region PA corresponding to the arrangement shown in (a), it can be identified that the filling member B does not fill the empty area formed between the edge regions PA_l1, PA_l2, PA_r1, and PA_r2 (because they are spaced apart from each other). In this case, the filling member B can fill the area near the four vertices of the second electronic component 122 between the second electronic component 122 and the circuit board 110.

[0126] refer to Figure 10 (a), with Figure 9 Unlike (a), when viewing the circuit board 110 from above (e.g., in the +z axis direction), multiple protrusions 140 can be arranged in groups along the diagonal direction relative to the soldering area SA. For example, multiple protrusions 140 can be arranged in the upper left edge region PA_l1 and the lower right edge region PA_r2.

[0127] Reference Figure 10 (b) Filling component B with Figure 10 In the case of the edge region PA corresponding to the arrangement shown in (a), it can be identified that the filling member B fills with the upper left edge region PA_l1 and the lower right edge region PA_r2 as the center. In this case, the filling member B can fill near the diagonal vertex of the second electronic component 122 between the second electronic component 122 and the circuit board 110.

[0128] Reference Figure 11 The plurality of protrusions 140 may have an arrangement in which the number of the plurality of protrusions 140 gradually decreases along a predetermined direction (e.g., the -y-axis direction or the +y-axis direction).

[0129] refer to Figure 11(a) When viewing the circuit board 110 from above (e.g., the +z-axis direction), the plurality of protrusions 140, according to the example, may have an arrangement in which the number of protrusions decreases along a first direction (e.g., the -y-axis direction) in the first edge region PA_l. In the example, when viewing the circuit board 110 from above (e.g., the +z-axis direction), the plurality of protrusions 140 may have an arrangement in which the number of protrusions decreases along a second direction opposite to the first direction (e.g., the +y-axis direction) in the second edge region PA_r. For example, when viewing the circuit board 110 from above, the plurality of protrusions 140 may have an inclined arrangement or a right-angled triangular arrangement in which the number of protrusions decreases or increases in each edge region PA.

[0130] Reference Figure 11 (b) Filling component B with Figure 11 In the case of the edge region PA corresponding to the arrangement structure shown in (a), when viewing the circuit board 110 from above, the filling member B is filled with multiple protrusions 140 as the center and can be distributed in an inclined direction on the XY plane.

[0131] refer to Figure 12 According to the example, the multiple protrusions 140 can be configured to have a left-right asymmetric structure relative to the weld area SA. In this case, the areas of the first edge region PA_l and the second edge region PA_r formed on the left and right sides of the weld area SA can be different from each other.

[0132] refer to Figure 12 (a) According to the example, the multiple protrusions 140 can be arranged in four rows in the first edge region PA_l. In the example, when viewing the circuit board 110 from above (e.g., in the +z axis direction), the multiple protrusions 140 can be arranged to have an overall "" in the first edge region PA_l. "Shape. For example, multiple protrusions 140 can be arranged in four rows, wherein the central portion of the first edge region PA_r protrudes towards the soldering region SA. In the example, when viewing the circuit board 110 from above (e.g., in the +z axis direction), the multiple protrusions 140 can be arranged to have an integral "shape" in the second edge region PA_r." "Shape. For example, multiple protrusions 140 can be arranged in two rows, wherein the central portion of the second edge region PA_r protrudes towards the welding region SA. In this case, the area of ​​the first edge region PA_l can be larger than that of the second edge region PA_r."

[0133] Reference Figure 12 (b) Filling component B with Figure 12In the case of the edge region PA corresponding to the arrangement structure shown in (a), the filling member B is distributed toward the center portion of each edge region PA_l and PA_r, and it can be identified that the distribution range of the filling member B in the first edge region PA_l, which has more protrusions, is wider than that in the second edge region PA_r.

[0134] Reference Figure 13 and Figure 14 The distribution range of the filling member B can be adjusted by adjusting the size of the protrusions and / or the spacing between the protrusions, according to the example of multiple protrusions 140.

[0135] refer to Figure 13 (a) and Figure 14 (a), Figure 13 (a) The diameter (or dimension) sa of the plurality of protrusions 140 shown can be designed to be smaller than Figure 14 (a) shows the diameter (or size) sb of the multiple protrusions 140. On the other hand, Figure 13 (a) The spacing dd between the multiple protrusions 140 shown in (a) can be designed to be greater than that between the protrusions 140 and the spacing dd between them. Figure 14 (a) shows the width of the spacing between the multiple protrusions 140.

[0136] In this case, having Figure 14 (b) The capillary effect of the multiple protrusions 140 in the arrangement structure can be compared to Figure 13 The arrangement in (a) is smoother. Therefore, the distribution range of the filling member B filling the edge region PA can be identified. Figure 14 (b) in comparison Figure 13 (a) is wider.

[0137] Reference Figure 15 In the example of multiple protrusions 140, protrusions of different sizes can be alternately arranged in each row within the edge region PA. In the example, the size of the protrusions included in each row of each edge region PA_l, PA_r can vary in the vertical direction (e.g., the ±y-axis direction). For example, in the multiple protrusions 140 included in each row, small-sized protrusions and large-sized protrusions can be alternately arranged in the vertical direction. Figure 15 As shown in (b), the filling member B is filled with... Figure 15 In the case of the edge region PA corresponding to the arrangement shown in (a), it can be identified that the filler member B is distributed around a relatively large protrusion. This distribution pattern of the filler member B may be caused by the difference in the adhesion area between the filler member B and the protrusion.

[0138] refer to Figure 16In the soldering area SA' according to the example, when viewing the circuit board 110 from above (e.g., in the +z axis direction), the overall left-right shape can be asymmetrically formed due to the change in the arrangement structure of the multiple connecting pads 113a. In this case, the multiple protrusions 140 according to the example can be configured to have a left-right asymmetrical structure relative to the soldering area SA'. Furthermore, the areas of the first edge region PA_l and the second edge region PA_r formed on the left and right sides of the soldering area SA' can be different from each other.

[0139] refer to Figure 16 (a) According to the example, the plurality of protrusions 140 can be arranged in three rows in the first edge region PA_l, but this disclosure is not limited thereto. In the example, the plurality of protrusions 140 can be arranged to have a grid pattern in the first edge region PA_l. According to the example, the plurality of protrusions 140 can be arranged in five rows in the second edge region PA_r, but this disclosure is not limited thereto. In the example, the plurality of protrusions 140 can be arranged to have a grid pattern in the second edge region PA_r. Furthermore, the plurality of protrusions 140 arranged in the first edge region PA_l can be designed to have a smaller size than the plurality of protrusions 140 arranged in the second edge region PA_r.

[0140] In this case, such as Figure 16 As shown in (b), when the filling member B fills the edge region PA, it can be identified that the distribution range of the filling member B in the second edge region PA_r is wider than that in the first edge region PA_l.

[0141] Figure 17 This is a view showing the filling range of a filling member located on a circuit board according to an embodiment of the present disclosure.

[0142] Reference Figure 17 As described above, by providing multiple protrusions 140 in the edge region PA of the circuit board 110, when the filler member B is used, the filler member B can uniformly fill the entire edge region PA through capillary action. Furthermore, contact between the filled filler member B and the multiple solder members 130 provided in the soldering region SA can be prevented as much as possible. In this case, the electrical performance of the solder members 130 can be ensured, and at the same time, the reliability of the second electronic component 122 and the circuit board 110 can be enhanced in the event of thermal shock or drop.

[0143] Figure 18 This is a diagram illustrating the manufacturing process of a printed circuit board assembly according to an embodiment of the present disclosure.

[0144] Figure 19 This is a process diagram illustrating the formation process of a plurality of protrusions according to embodiments of the present disclosure.

[0145] Figure 20 This is a process diagram illustrating the formation process of a plurality of protrusions according to embodiments of the present disclosure.

[0146] refer to Figure 18 The method for manufacturing a printed circuit board assembly 100 according to the example may include forming a plurality of protrusions 140 (1810) in an edge region PA spaced apart from the soldering region SA of the circuit board 110. For example, as described above, the plurality of protrusions 140 may be formed by a soldering process of applying and / or curing soldering material on a plurality of dummy pads 113b disposed on the circuit board 110.

[0147] According to the example, the multiple protrusions 140 can be formed not only by welding but also by a joining member P made of a material different from the welding material. In the following text, refer to... Figure 19 and Figure 20 Describe the process of forming protrusion 140 using a bonding member (or bonding solution) P.

[0148] Figure 19 (a) is a view showing the joining member P being distributed onto the circuit board 110 by the dispensing device 200. Figure 19 (b) is shown in Figure 19 (a) A view of the second electronic component 122 mounted (or set) on the circuit board 110 after the bonding member P distributed on the circuit board 110 has been cured to form a plurality of protrusions 140.

[0149] refer to Figure 19 (a) Before installing the second electronic component 122, the operator can use the dispensing device (or dispenser) 200 to apply the bonding member P to the area of ​​the circuit board 110 where the plurality of solder members 130 are not provided.

[0150] Reference Figure 19 (b) An operator may apply a bonding member P to a circuit board 110 and then cure it to form a plurality of protrusions 140. Then a second electronic component 122 is mounted (or set) on the circuit board 110 such that the edges of the plurality of protrusions 140 and the second electronic component 122 face each other, while a plurality of solder members 130 are set on the connection pads 113a of the circuit board 110.

[0151] Subsequently, although not specifically shown in the accompanying drawings, the operator can fill the edges of the second electronic component 122 and the circuit board 110 with the filler component B. In this case, the filled filler component B can flow into the internal space between the second electronic component 122 and the circuit board 110 through the plurality of protrusions 140 and then be cured.

[0152] Figure 20(a) is a view showing the joining member P being dipped and stamped onto the circuit board 110 from the external storage container by the stamping device 300. Figure 20 (b) is shown in Figure 20 (a) A view of the second electronic component 122 mounted (or set) on the circuit board 110 after the stamped bonding member P on the circuit board 110 has been cured to form a plurality of protrusions 140.

[0153] refer to Figure 20 (a) Before installing the second electronic component 122, the operator can use the stamping device 300 to immerse the bonding member P from the outer container storing the bonding member P, and then apply the bonding member P to the area of ​​the circuit board 110 where the plurality of solder members 130 are not provided.

[0154] Reference Figure 20 (b) An operator may apply a bonding member P to a circuit board 110 and then cure it to form a plurality of protrusions 140. Then a second electronic component 122 is mounted (or set) on the circuit board 110 such that the edges of the plurality of protrusions 140 and the second electronic component 122 face each other, while a plurality of solder members 130 are set on the connection pads 113a of the circuit board 110.

[0155] Subsequently, although not specifically shown in the accompanying drawings, the operator can fill the edges of the second electronic component 122 and the circuit board 110 with the filler component B. In this case, the filled filler component B can flow into the internal space between the second electronic component 122 and the circuit board 110 through the plurality of protrusions 140 and then be cured.

[0156] For reference Figure 19 and Figure 20 As described, when multiple protrusions 140 are formed using the joining member P, the dummy pads 113b used to fix the soldering material required during the soldering process become unnecessary, thus increasing the design freedom of the circuit board 110.

[0157] According to the example, a method for manufacturing a printed circuit board assembly 100 may include applying soldering material to a plurality of connection pads 113a (1820) disposed in a soldering area SA.

[0158] According to the example, a method for manufacturing a printed circuit board assembly 100 may mount (or set) an electronic component (e.g., a second electronic component 122) on a circuit board 110 such that a plurality of protrusions 140 and the edges of the electronic component 122 face each other. In this case, each of the plurality of contact points 125 of the electronic component 122 and the plurality of connection pads 113a of the circuit board 110 may contact the upper / lower portions of a plurality of solder members 130.

[0159] According to the example, a method for manufacturing a printed circuit board assembly 100 may include melting and reflowing soldering material (1840) by applying heat to a plurality of solder members 130 while the electronic component 122 is mounted (or set) on the circuit board 110. In this case, by melting and then solidifying the soldering material, the electronic component 122 and the circuit board 110 may be physically and / or electrically connected by the plurality of solder members 130.

[0160] According to an example, a method for manufacturing a printed circuit board assembly 100 may include filling a filler member B between a circuit board 110 and an electronic component 122 (1850). For example, an operator may perform an underfill or sidefill process to fill the filler member B into the space between the edge of the electronic component (e.g., a second electronic component 122) where the plurality of protrusions 140 are located and the circuit board 110. In this case, the filler member B may penetrate along the narrow gaps formed between the plurality of protrusions 140 by capillary action and be uniformly distributed in the edge regions where the plurality of protrusions 140 are formed.

[0161] Figure 21 This is a top view showing a printed circuit board assembly according to a comparative embodiment of the present disclosure.

[0162] Figure 22 This illustrates a comparative embodiment according to the present disclosure. Figure 21 The diagram shows a cross-sectional view of the printed circuit board assembly taken by line II-II'.

[0163] Figure 23 This is a view showing the filling range of a filling member in a circuit board according to a comparative embodiment of the present disclosure.

[0164] Figure 24 This is a view showing the crack state of a solder component that occurs when the filler component is underfilled.

[0165] Figure 25 This is a view showing the filling range of a filling member located on a circuit board according to a comparative embodiment of the present disclosure.

[0166] Figure 26 This is a view showing the crack state of a solder component that occurs when the filler component is overfilled.

[0167] Reference Figure 21 and Figure 22 According to the comparative example, the printed circuit board assembly 100' may include a circuit board 110, at least one electronic component 120, and / or multiple solder components 130. In the description... Figure 21 and Figure 22When the printed circuit board assembly 100' is shown, the same reference numerals are assigned to the same components. Figure 1 The components are substantially the same as or similar to the printed circuit board assembly 100 shown in Figure 2, and the description of the components can be replaced by the description of the printed circuit board assembly 100.

[0168] In the printed circuit board assembly 100' according to the comparative example, the soldering area SA of the plurality of solder members 130 that connect the second electronic component 122 and the circuit board 110 can be smaller than the overall size of the second electronic component 122.

[0169] and Figure 1 Unlike the printed circuit board assembly 100 of the example according to this disclosure shown in FIG2, the printed circuit board assembly 100' of the comparative example does not have a periphery of the soldering area SA disposed on the circuit board 110 (specifically, in the edge area (e.g., Figure 1 Multiple protrusions (e.g., in the edge region PA) Figure 1 Multiple protrusions (140).

[0170] Reference Figures 23 to 26 In the printed circuit board assembly 100' according to the comparative example, after the second electronic component 122 is mounted (or disposed) on the circuit board 110, when the filler component B is filled in the space between the second electronic component 122 and the circuit board 110, the filler component B often cannot be uniformly applied to the overlapping area of ​​the second electronic component 122 and the circuit board 110 including the soldering area SA.

[0171] In such Figure 23 In the case of underfilling of filler member B, filler member B may be insufficient to protect multiple solder members 130, and cracks may occur in the solder members 130 due to repeated external impacts or stresses. Figure 24 (C1, C2 in the example). Therefore, compared with the printed circuit board assembly 100 according to this disclosure, the printed circuit board assembly 100 according to the comparative example has lower reliability in cases such as drops.

[0172] On the contrary, in such Figure 25 In the case where the filler component B is overfilled, cracks will occur in the solder component 130 due to the thermal expansion / contraction of the filler component B caused by the heat generated by the solder component 130 during the operation of the printed circuit board assembly. Figure 26 (C3, C4, C5 in the example). Therefore, compared with the printed circuit board assembly 100 according to the present disclosure, the printed circuit board assembly 100' according to the comparative example has lower reliability in terms of thermal shock.

[0173] A printed circuit board assembly 100 according to an example of this disclosure may include an electronic component 120. The printed circuit board assembly 100 may include a printed circuit board (PCB) 110 on which the electronic component 120 is disposed. The printed circuit board assembly 100 may include a plurality of solder members 130 located between the electronic component 120 and the printed circuit board 110, and electrically connecting the electronic component 120 and the printed circuit board 110. A plurality of protrusions 140 may be disposed on the printed circuit board 110 spaced apart from the plurality of solder members 130 and positioned near the edge of the electronic component 120. The printed circuit board assembly 100 may include a filler member B that fills the edge of the electronic component 120 between the printed circuit board 110 and the electronic component 120. The distribution of the filler member B may be facilitated by the adhesive force between the filler member B and the plurality of protrusions 140, and by the cohesive force of the filler member B during liquid filling between the printed circuit board 110 and the electronic component 120.

[0174] According to the example, the distribution of the filler member B can be controlled by at least one of the dimensions of the plurality of protrusions 140, the distance between the plurality of solder members 130 and the plurality of protrusions 140, or the gap between the plurality of protrusions 140, such that the filler member B does not contact the plurality of solder members 130.

[0175] According to the example, the filler component B may be formed from at least one of the following non-conductive materials: epoxy resin series, silicone resin series, polyurethane series, acrylic resin series, or polyamide series.

[0176] According to the example, the spacing between the plurality of protrusions 140 and the plurality of solder members 130 can be set to 0.1 mm or greater, such that during the distribution of the filler member B, the filler member B does not contact the plurality of solder members 130.

[0177] According to the example, multiple solder components 130 may be disposed inside the edge of electronic components 120 on printed circuit board 110.

[0178] According to the example, the multiple protrusions 140 may have a smaller size than the multiple solder members 130, such that the filler members B do not contact the multiple solder members 130 during the distribution of the filler members B.

[0179] According to the example, each of the plurality of protrusions 140 may have the shape of one of a hemisphere, a cylinder, or a polyhedron.

[0180] According to the example, the multiple protrusions 140 may have a lower height h than the multiple solder components 130 so as not to contact the electronic components 120.

[0181] According to the example, multiple protrusions 140 are set in two or more rows, and the multiple protrusions 140 included in each row can be set alternately with the multiple protrusions 140 included in other adjacent rows.

[0182] According to the example, multiple protrusions 140 are set to two or more rows, and the multiple protrusions 140 included in each row can be set to face the multiple protrusions 140 included in other adjacent rows.

[0183] According to the example, the plurality of protrusions 140 are configured to be spaced apart from each other at a predetermined interval, and the spacing d between the plurality of protrusions can be set to 0.4 mm or greater, such that during the distribution of the filler member B, the filler member B does not contact the plurality of solder members 130.

[0184] According to the example, the printed circuit board 110 may include a plurality of connection pads 113a and a plurality of dummy pads 113b, each of a plurality of solder components 130 being disposed on the plurality of connection pads 113a, and each of a plurality of protrusions 140 being disposed on the plurality of dummy pads 113b. Each of the plurality of protrusions 140 may be formed by a soldering process in which solder material is applied to each of the plurality of dummy pads 113b.

[0185] According to the example, a plurality of protrusions 140 can be formed by distributing bonding members P at predetermined intervals on a printed circuit board 110 by a dispensing device 200 along the outer regions of a plurality of solder members 130.

[0186] According to the example, the plurality of protrusions 140 can be formed by impregnating the bonding member P from the external storage container by a stamping device 300, and then stamping the bonding member P at predetermined intervals along the external region of the plurality of solder members 130 by the stamping device 300.

[0187] A method for manufacturing a printed circuit board assembly 100, including a printed circuit board 110 on which electronic components 120 are disposed, according to an example of the present disclosure, may include: (1810) forming a plurality of protrusions 140 in an edge region PA of the printed circuit board 110, the edge region PA being spaced apart from a soldering region SA of the printed circuit board 110 on which a plurality of solder members 130 are disposed. The method for manufacturing the printed circuit board assembly 100 may include: (1820) applying solder material to a plurality of connection pads 113a disposed in the soldering region SA. The method for manufacturing the printed circuit board assembly 100 may include: (1830) disposing the electronic components 120 on the printed circuit board 110 such that the plurality of protrusions 140 and the edges of the electronic components 120 face each other. The method for manufacturing the printed circuit board assembly 100 may include: (1850) filling the spaces between the plurality of protrusions 140 with filler members B. The distribution of the filler member B can be promoted by the adhesion between the filler member B and the plurality of protrusions 140, and by the cohesion of the filler member B when it is liquid-filled between the printed circuit board 110 and the electronic component 120.

[0188] According to the example, the method for manufacturing the printed circuit board assembly 100 may further include: (1840) melting and reflowing soldering material to electrically connect the electronic component 120 mounted on the printed circuit board 110 and the printed circuit board 110.

[0189] According to the example, the distribution of the filler member B can be controlled by at least one of the dimensions of the plurality of protrusions 140, the distance between the plurality of solder members 130 and the plurality of protrusions 140, and the gap between the plurality of protrusions 140, such that the filler member B does not contact the plurality of solder members 130.

[0190] According to the example, the printed circuit board 110 may include a plurality of connection pads 113a and a plurality of dummy pads 113b, each of a plurality of solder components 130 being disposed on the plurality of connection pads 113a, and each of a plurality of protrusions 140 being disposed on the plurality of dummy pads 113b. Each of the plurality of protrusions 140 may be formed by a soldering process in which solder material is applied to each of the plurality of dummy pads 113b.

[0191] According to the example, a plurality of protrusions 140 can be formed by distributing bonding members P at predetermined intervals on a printed circuit board 110 by a dispensing device 200 along the outer regions of a plurality of solder members 130.

[0192] According to the example, the plurality of protrusions 140 can be formed by impregnating the bonding member P from the external storage container by a stamping device 300, and then stamping the bonding member P at predetermined intervals along the external region of the plurality of solder members 130 by the stamping device 300.

Claims

1. A printed circuit board assembly (100), the printed circuit board assembly (100) comprising: Electronic components (120); A printed circuit board (110), on which the electronic component (120) is disposed; A plurality of solder components (130) are located between the printed circuit board (110) and the electronic component (120) and electrically connect the electronic component (120) and the printed circuit board (110); Multiple protrusions (140) are located on the printed circuit board (110) and are configured to be spaced apart from the multiple solder components (130) and positioned near the edge of the electronic component (120); as well as A filler member (B) fills the edges of the electronic component (120) between the printed circuit board (110) and the electronic component (120). The distribution of the filling member (B) is facilitated in the following manner: The adhesion between the filling member (B) and the plurality of protrusions (140); as well as The cohesive force of the filling member (B) during the liquid filling of the filling member (B) between the printed circuit board (110) and the electronic component (120).

2. The printed circuit board assembly (100) according to claim 1, wherein, The distribution of the filler member (B) is controlled by at least one of the size of the plurality of protrusions (140), the distance between the plurality of solder members (130) and the plurality of protrusions (140), or the gap between the plurality of protrusions (140), such that the filler member (B) does not contact the plurality of solder members (130).

3. The printed circuit board assembly (100) according to claim 1 or 2, wherein, The filler member (B) is formed from at least one of the following: epoxy resin series, silicone resin series, polyurethane series, acrylic resin series, or polyamide series, which are non-conductive materials.

4. The printed circuit board assembly (100) according to any one of claims 1 to 3, wherein, The spacing between the plurality of protrusions (140) and the plurality of solder components (130) is set to 0.1 mm or greater, such that when the filler component (B) is distributed, the filler component (B) does not contact the plurality of solder components (130).

5. The printed circuit board assembly (100) according to any one of claims 1 to 4, wherein, The plurality of solder components (130) are disposed inside the edge of the electronic component (120).

6. The printed circuit board assembly (100) according to any one of claims 1 to 5, wherein, The plurality of protrusions (140) have a smaller size than the plurality of solder members (130) such that when the filler members (B) are distributed, the filler members (B) do not contact the plurality of solder members (130).

7. The printed circuit board assembly (100) according to any one of claims 1 to 6, wherein, Each of the plurality of protrusions (140) has a hemispherical shape, a cylindrical shape, or a polyhedral shape.

8. The printed circuit board assembly (100) according to any one of claims 1 to 7, wherein, Each of the plurality of protrusions (140) has a height (h) lower than the height of the plurality of solder components (130) so as not to contact the electronic component (120).

9. The printed circuit board assembly (100) according to any one of claims 1 to 8, in, The plurality of protrusions (140) are arranged in two or more columns, with the plurality of protrusions (140) in each column being alternately arranged with the plurality of protrusions (140) in other adjacent columns.

10. The printed circuit board assembly (100) according to any one of claims 1 to 8, in, The plurality of protrusions (140) are arranged in two or more columns. In this configuration, the multiple protrusions (140) included in each column are configured to face the multiple protrusions (140) included in other adjacent columns.

11. The printed circuit board assembly (100) according to any one of claims 1 to 10, in, The plurality of protrusions (140) are arranged to be spaced apart from each other at a predetermined distance, and The distance (d) between the plurality of protrusions (140) is set to 0.4 mm or greater, such that when the filler member (B) is distributed, the filler member (B) does not contact the plurality of solder members (130).

12. The printed circuit board assembly (100) according to any one of claims 1 to 11, in, The printed circuit board (110) includes a plurality of connection pads (113a) and a plurality of dummy pads (113b), each of the plurality of solder components (130) is disposed on the plurality of connection pads (113a), and each of the plurality of protrusions (140) is disposed on the plurality of dummy pads (113b). Each of the plurality of protrusions (140) is formed by a welding process in which welding material is applied to each of the plurality of dummy pads (113b).

13. The printed circuit board assembly (100) according to any one of claims 1 to 11, wherein, The plurality of protrusions (140) are formed by distributing bonding members (P) at predetermined intervals along the outer region of the plurality of solder members (130) on the printed circuit board (110) by a dispensing device (200).

14. The printed circuit board assembly (100) according to any one of claims 1 to 11, wherein, The plurality of protrusions (140) are formed in the following manner: The joining component (P) is impregnated from the external storage container by a stamping device (300), and The stamping device (300) stamps the joining member (P) at predetermined intervals along the outer region of the plurality of solder members (130).

15. A method of manufacturing a printed circuit board assembly (100), the printed circuit board assembly (100) comprising a printed circuit board (110) on which electronic components (120) are mounted, the method comprising: Multiple protrusions (140) are formed on the edge region (PA) of the printed circuit board (110), and the edge region (PA) is spaced apart (1810) from the soldering region (SR) of the printed circuit board (110) where multiple solder components (130) are provided; Welding material is applied to a plurality of connecting pads (113a) (1820) disposed in the welding area (SR); The electronic component (120) is mounted on the printed circuit board (110) such that the plurality of protrusions (140) and the edges of the electronic component (120) face each other (1830); The filler member (B) (1850) is filled using the plurality of protrusions (140) disposed between the installed electronic component (120) and the printed circuit board (110). The distribution of the filling member (B) is facilitated in the following manner: The adhesion between the filling member (B) and the plurality of protrusions (140); as well as The cohesive force of the filling member (B) during the liquid filling of the filling member (B) between the printed circuit board (110) and the electronic component (120).

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