Light detection module

Abstract

The present invention suppresses a decrease in cooling efficiency of cooling a sensor chip by a cooling device. The light detection module includes: a base member; a cooling device and a sensor chip that are stacked in one direction and mounted on the base member; and an active chip mounted on the base member so as to be spaced apart from the cooling device and the sensor chip in a direction intersecting the one direction.

Description

Technical Field

[0001] This technology (the technology involved in this disclosure) relates to optical detection modules, and in particular to a technology applicable and effective to optical detection modules having a cooling device and a sensor chip mounted on a base component. Background Technology

[0002] As a light detection module, one known type is a light detection module in which a cooling device and a sensor chip are mounted on a base component. Patent Document 1 discloses an imaging module in which a Peltier element and a sensor chip are stacked on a base component when viewed from above.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2014-36041

[0004] However, while there are various types of sensor chips used for substance identification, sensing applications in regions with wavelengths longer than visible light are widespread. However, sensor chips in this region are not based on silicon (Si) as a semiconductor structure, but rather on compound semiconductors such as indium gallium arsenide (InGaAs), resulting in higher dark current. Therefore, in optical detection modules that package such sensor chips, mounting the sensor chip along with cooling devices such as Peltier elements on a base component to reduce the sensor chip's temperature is effective.

[0005] On the other hand, signals output from sensor chips are typically processed via cables by personal computers or the cloud for substance identification. However, due to processing delays and client-side configurations, it is sometimes necessary to prepare systems that incorporate AI (Artificial Intelligence) processing.

[0006] In Si-based sensor chips, the evolution of sensors capable of AI processing is driven by advancements in performance through the stacking of logic chips. However, the technology of stacking Si-based logic chips on non-Si-based sensor chips is not straightforward due to significant differences in CTE / elastic modulus.

[0007] Therefore, when using a system-in-package (SoC) approach that mounts the sensor chip and the AI-enabled logic chip on the same base component, mounting the heat-generating logic chip while the sensor chip needs cooling is not straightforward. Specifically, when the logic chip, sensor chip, and cooling device are mounted together on the same base component, the heat from the logic chip can affect the cooling efficiency of the sensor chip via the cooling device, raising concerns that the heat from the logic chip might lead to a decrease in cooling efficiency. Summary of the Invention

[0008] The purpose of this technology is to provide a technique that can suppress the decrease in cooling efficiency of sensor chips cooled by a cooling device.

[0009] (1) An optical detection module according to one aspect of the present technology comprises: a base component; a cooling device and a sensor chip, which are overlapped and mounted on the base component in one direction; and an active chip, which is spaced apart from the cooling device and the sensor chip in a direction intersecting the aforementioned one direction and mounted on the base component.

[0010] (2) The optical detection module involved in other aspects of the present technology includes: a base component; a cooling device and a sensor chip, which are overlapped and mounted on the base component in one direction; an active chip, which is mounted on the base component in a direction intersecting the one direction, separated from the cooling device and the sensor chip; and a heat sink, which is disposed on the side of the base component opposite to the cooling device side in such a way that it overlaps with the active chip when viewed from above.

[0011] (3) The optical detection module involved in other aspects of the present technology comprises: a base component; a cooling device and a sensor chip, which overlap and are mounted on the base component in one direction; and an active chip, which is mounted on the base component in a direction intersecting the one direction, separated from the cooling device and the sensor chip.

[0012] Furthermore, the aforementioned active chip is mounted via an interlayer on the side of the base component opposite to the cooling device side.

[0013] (4) The optical detection module involved in other aspects of the present technology comprises: a base component; a cooling device and a sensor chip, which overlap and are mounted on the base component in one direction; an active chip, which is spaced apart from the cooling device and the sensor chip in a direction intersecting the one direction and mounted on the base component; and an intermediate wiring substrate, which is mounted on the base component.

[0014] Furthermore, the wiring substrate has a first portion fixed to the base component and a second portion extending from the first portion along the thickness direction of the base component, wherein the active chip is mounted on the second portion of the wiring substrate.

[0015] (5) The optical detection module involved in other aspects of the present technology comprises: a base component having a recessed portion in one direction; a cooling device and a sensor chip overlapping and mounted on the first surface side of the base component in the one direction; an active chip spaced apart from the cooling device and the sensor chip in a direction intersecting the one direction and mounted in the recessed portion of the base component; and a heat transfer component filling the recessed portion of the base component to cover the active chip and having a higher heat transfer rate than the base component.

[0016] (6) Other aspects of the present technology involve an electronic device comprising: the above-mentioned light detection module; an optical lens for imaging light from the subject onto the imaging surface of the above-mentioned light detection module; and a signal processing circuit for processing the signal output from the above-mentioned light detection module. Attached Figure Description

[0017] Figure 1 This is a schematic plan view of the upper surface of the light detection module according to the first embodiment of the present technology.

[0018] Figure 2 It is schematically shown along Figure 1 The longitudinal section diagram of the longitudinal section structure along the a1-a1 cutting line.

[0019] Figure 3 yes Figure 2 The unfolded diagram.

[0020] Figure 4 It is shown Figure 2 A chip layout diagram of a typical sensor chip configuration.

[0021] Figure 5A This is a schematic cross-sectional view illustrating the steps in the manufacturing method of the optical detection module according to the first embodiment of the present technology.

[0022] Figure 5B Is following Figure 5A The cross-sectional diagram of the subsequent process.

[0023] Figure 5C Is following Figure 5B The cross-sectional diagram of the subsequent process.

[0024] Figure 5D Is following Figure 5C The cross-sectional diagram of the subsequent process.

[0025] Figure 5E Is following Figure 5D The cross-sectional diagram of the subsequent process.

[0026] Figure 5F Is following Figure 5E The cross-sectional diagram of the subsequent process.

[0027] Figure 6 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the second embodiment of the present technology.

[0028] Figure 7 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the third embodiment of the present technology.

[0029] Figure 8This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the fourth embodiment of the present technology.

[0030] Figure 9 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the fifth embodiment of the present technology.

[0031] Figure 10 This is a schematic diagram showing the back view of the lower surface (back side) of the light detection module according to the sixth embodiment of the present technology, opposite to the upper surface side.

[0032] Figure 11 It is a schematic representation of the direction along the vertically reversed direction. Figure 10 The longitudinal section diagram of the longitudinal section structure along the a10-a10 section line.

[0033] Figure 12 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the seventh embodiment of the present technology.

[0034] Figure 13 This is a schematic longitudinal cross-sectional view showing the longitudinal cross-sectional structure of the optical detection module according to the eighth embodiment of the present technology.

[0035] Figure 14 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the ninth embodiment of the present technology.

[0036] Figure 15 This is a schematic longitudinal cross-sectional view showing the longitudinal cross-sectional structure of the optical detection module according to the tenth embodiment of the present technology.

[0037] Figure 16 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the eleventh embodiment of the present technology.

[0038] Figure 17 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the twelfth embodiment of the present technology.

[0039] Figure 18 This is a schematic longitudinal cross-sectional view showing the longitudinal cross-sectional structure of the optical detection module according to the thirteenth embodiment of the present technology.

[0040] Figure 19 This is a schematic view of the back side of the light detection module according to the fourteenth embodiment of the present technology, showing the lower surface side (back side) opposite to the upper surface side.

[0041] Figure 20 It is a schematic representation of the direction along the vertically reversed direction. Figure 19The longitudinal section diagram of the longitudinal section structure along section line a19-a19.

[0042] Figure 21 This is a schematic longitudinal cross-sectional view of a variation 14-2 of the fourteenth embodiment of the present technology.

[0043] Figure 22 This is a schematic longitudinal cross-sectional view of a variation 14-3 of the fourteenth embodiment of the present technology.

[0044] Figure 23 This is a schematic longitudinal cross-sectional view of a variation 14-5 of the fourteenth embodiment of the present technology.

[0045] Figure 24 This is a schematic longitudinal cross-sectional view of a variation 14-6 of the fourteenth embodiment of the present technology.

[0046] Figure 25 This is a schematic plan view of the upper surface of the light detection module according to the fifteenth embodiment of the present technology.

[0047] Figure 26 It is schematically shown along Figure 25 The longitudinal section diagram of the longitudinal section structure along the a25-a25 section line.

[0048] Figure 27 This is a schematic diagram showing the back view of the lower surface (back side) of the light detection module according to the sixteenth embodiment of the present technology, opposite to the upper surface side.

[0049] Figure 28 It is a schematic representation of the direction along the vertically reversed direction. Figure 27 The longitudinal section diagram of the longitudinal section structure along section line a27-a27.

[0050] Figure 29 This is a schematic longitudinal cross-sectional view showing the longitudinal cross-sectional structure of the optical detection module according to the seventeenth embodiment of the present technology.

[0051] Figure 30 It shows that Figure 29 The diagram shows the state of the optical detection module mounted on the mounting substrate of the electronic device, which is related to... Figure 25 The longitudinal section view at the same location as the a25-a25 section line.

[0052] Figure 31 It shows that Figure 29 The diagram shows the state of the optical detection module mounted on the mounting substrate of the electronic device, which is related to... Figure 25 The longitudinal section view at the same location as the b25-b25 section line.

[0053] Figure 32This is a schematic plan view of the upper surface of the light detection module according to the eighteenth embodiment of the present technology.

[0054] Figure 33 It is schematically shown along Figure 32 The longitudinal section diagram of the longitudinal section structure along the a32-a32 section line.

[0055] Figure 34 This is a schematic longitudinal cross-sectional view of a variation 18-1 of the eighteenth embodiment of the present technology.

[0056] Figure 35 This is a schematic longitudinal cross-sectional view of a variation 18-2 of the eighteenth embodiment of the present technology.

[0057] Figure 36 This is a schematic longitudinal cross-sectional view of a variation 18-3 of the eighteenth embodiment of the present technology.

[0058] Figure 37 This is a schematic longitudinal cross-sectional view of a variation 18-4 of the eighteenth embodiment of the present technology.

[0059] Figure 38 This is a schematic longitudinal cross-sectional view illustrating other embodiments.

[0060] Figure 39 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the nineteenth embodiment of the present technology.

[0061] Figure 40A This is a schematic cross-sectional view illustrating the process steps included in the manufacturing method of the optical detection module according to the nineteenth embodiment of the present technology.

[0062] Figure 40B Is following Figure 40A The cross-sectional diagram of the subsequent process.

[0063] Figure 40C Is following Figure 40B The cross-sectional diagram of the subsequent process.

[0064] Figure 40D Is following Figure 40C The cross-sectional diagram of the subsequent process.

[0065] Figure 40E Is following Figure 40D The cross-sectional diagram of the subsequent process.

[0066] Figure 40F Is following Figure 40E The cross-sectional diagram of the subsequent process.

[0067] Figure 40G Is following Figure 40FThe cross-sectional diagram of the subsequent process.

[0068] Figure 40H Is following Figure 40G The cross-sectional diagram of the subsequent process.

[0069] Figure 41 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the twentieth embodiment of the present technology.

[0070] Figure 42A This is a schematic cross-sectional view illustrating the process steps in the manufacturing method of the optical detection module according to the twentieth embodiment of the present technology.

[0071] Figure 42B Is following Figure 42A The cross-sectional diagram of the subsequent process.

[0072] Figure 42C Is following Figure 42B The cross-sectional diagram of the subsequent process.

[0073] Figure 43 This is a schematic longitudinal cross-sectional view showing the longitudinal cross-sectional structure of the optical detection module according to the twenty-first embodiment of the present technology.

[0074] Figure 44A This is a schematic cross-sectional view illustrating the process steps included in the manufacturing method of the optical detection module according to the twenty-first embodiment of the present technology.

[0075] Figure 44B Is following Figure 44A The cross-sectional diagram of the subsequent process.

[0076] Figure 44C Is following Figure 44B The cross-sectional diagram of the subsequent process.

[0077] Figure 44D Is following Figure 44C The cross-sectional diagram of the subsequent process.

[0078] Figure 44E Is following Figure 44D The cross-sectional diagram of the subsequent process.

[0079] Figure 44F Is following Figure 44E The cross-sectional diagram of the subsequent process.

[0080] Figure 45 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the twenty-second embodiment of the present technology.

[0081] Figure 46AThis is a schematic cross-sectional view illustrating the process steps in the manufacturing method of the optical detection module according to the twenty-second embodiment of the present technology.

[0082] Figure 46B Is following Figure 46A The cross-sectional diagram of the subsequent process.

[0083] Figure 46C Is following Figure 46B The cross-sectional diagram of the subsequent process.

[0084] Figure 46D Is following Figure 46C The cross-sectional diagram of the subsequent process.

[0085] Figure 46E Is following Figure 46D The cross-sectional diagram of the subsequent process.

[0086] Figure 46F Is following Figure 46E The cross-sectional diagram of the subsequent process.

[0087] Figure 47 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the twenty-third embodiment of the present technology.

[0088] Figure 48A This is a schematic longitudinal cross-sectional view of a variation 23-1 of the twenty-third embodiment of the present technology.

[0089] Figure 48B This is a schematic longitudinal cross-sectional view of a variation 23-2 of the twenty-third embodiment of the present technology.

[0090] Figure 49 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the twenty-fourth embodiment of the present technology.

[0091] Figure 50 This is a diagram illustrating a configuration example of an electronic device according to the twenty-fifth embodiment of the present technology. Detailed Implementation

[0092] Hereinafter, embodiments of this technology will be described in detail with reference to the accompanying drawings.

[0093] Furthermore, in the accompanying drawings referenced in the following description, the same or similar reference numerals are used to label the same or similar parts. However, it should be noted that the drawings are schematic, and the relationship between thickness and planar dimensions, the ratio of thickness of each layer, etc., may differ from reality. Therefore, specific thicknesses and dimensions should be determined with reference to the following description.

[0094] Furthermore, the accompanying drawings also include the dimensional relationships and proportions of the various figures. Additionally, the effects described in this specification are merely illustrative and not intended to be limiting; other effects may also exist.

[0095] Furthermore, the following embodiments illustrate apparatus and methods for embodying the technical concept of this technology, and do not limit the configuration to the following. That is, the technical concept of this technology can be modified in various ways within the scope of the technology described in the claims.

[0096] Furthermore, the definitions of up and down, etc., in the following description are merely for illustrative purposes and do not limit the technical concept of this technology. For example, of course, if the object is rotated 90° for observation, up and down are interpreted as left and right; if it is rotated 180° for observation, up and down are interpreted in reverse.

[0097] Furthermore, in the following embodiments, among the three directions orthogonal to each other in space, the first and second directions orthogonal to each other in the same plane are respectively designated as the X direction and the Y direction, and the third direction orthogonal to the first and second directions is designated as the Z direction. Also, in the following embodiments, the thickness direction of the base component, described later, will be referred to as the Z direction.

[0098] In addition, the thickness of the base component refers to the distance between the first facet and the second facet, which are located on opposite sides of each other in the Z direction, and the thickness direction of the base component refers to the direction in which the thickness of the base component is expressed.

[0099] Furthermore, in the following embodiments, the Z direction will be described as one direction of this technology.

[0100] Furthermore, in the following embodiments, the direction intersecting the Z-direction is referred to as the planar direction. While not limited to this, the following embodiments are described with the case where the planar direction is orthogonal to the Z-direction in mind.

[0101] [First Implementation]

[0102] In this first embodiment, the case of using a Peltier element as a cooling device for cooling a sensor chip will be described.

[0103] In addition, in this first embodiment, the Z direction is described as one direction of the present technology.

[0104] Overall structure of the optical detection module

[0105] like Figure 1 , Figure 2 and Figure 3As shown, the optical detection module 1A according to the first embodiment of this technology includes: a base member 10 having a thickness in the Z direction; a Peltier element 20 serving as a cooling device mounted on the base member 10; a sensor chip 40 overlapping with the Peltier element 20 in the Z direction and mounted on the base member 10; and a logic chip 30 serving as an active chip (power chip) mounted on the base member 10, spaced apart from the Peltier element 20 and the sensor chip 40 in a planar direction intersecting the Z direction.

[0106] Furthermore, the light detection module 1A according to this first embodiment also includes a cap component 50, which is separated from the Peltier element 20 and the sensor chip 40, covers the sensor chip 40, and is mounted on the base component 10.

[0107] The sensor chip 40 is not limited to this, but may be mounted on the base member 10 via the wiring substrate 25, for example. The Peltier element 20 and the sensor chip 40 are hermetically sealed in the chamber portion 57 formed by the base member 10 and the cap member 50.

[0108] Here, the Peltier element 20 corresponds to a specific example of the "cooling device" of this technology. Additionally, the logic chip 30 corresponds to a specific example of the "active chip" of this technology.

[0109] Furthermore, the thickness direction (Z direction) representing the distance between the first facet S1 and the second facet S2 of the base component 10, which are located on opposite sides of each other, is a specific example of "a direction" in this technology.

[0110] <Base Components>

[0111] like Figure 1 As shown, the base component 10 is not limited to this, but for example, it may be composed of a rectangle with four sides in a two-dimensional planar shape that includes mutually orthogonal X and Y directions, i.e., in planar shape viewed from above. Furthermore, as... Figure 2 and Figure 3 As shown, the base component 10 has a first facet S1 and a second facet S2 located on opposite sides of each other in the thickness direction (Z direction) of the base component 10.

[0112] In addition, such as Figure 2 and Figure 3As shown, the base component 10 has: a first recess 11 recessed from a first facet S1 toward a second facet S2; a second recess 12 recessed from the bottom of the first recess 11 toward the second facet S2 and having a planar dimension smaller than that of the first recess 11; and a third recess 13 recessed from the bottom of the second recess 12 toward the second facet S2 and having a planar dimension smaller than that of the second recess 12. The first recess 11, the second recess 12, and the third recess 13 overlap each other when viewed from above, and are arranged in this order from the first facet S1 toward the second facet S2 in the thickness direction (Z direction) of the base component 10.

[0113] Here, top-down observation mainly refers to observing the base component 10 from the direction along the thickness direction (Z direction) of the base component 10.

[0114] Although the base component 10 is not shown in detail, it has a multilayer wiring structure in which multiple insulating layers and wiring layers are stacked. The base component 10 of this first embodiment is not limited to this, but may be, for example, made of a ceramic multilayer wiring substrate using ceramic as the insulating layer, which has good thermal conductivity.

[0115] In addition, the first recess 11, the second recess 12 and the third recess 13 can be defined as stepped portions.

[0116] <Peltier components>

[0117] like Figure 2 and Figure 3 As shown, the Peltier element 20 includes a cooling side plate (heat-absorbing side plate) 21 and a heating side plate (heating side plate) 22 that are spaced apart from each other and overlap in the thickness direction (Z direction) of the Peltier element 20, and a heat-moving layer 23 disposed between the cooling side plate 21 and the heating side plate 22. The heat-moving layer 23 of the Peltier element 20 is made of, for example, a bismuth-tellurium semiconductor. By allowing a direct current to flow in the heat-moving layer 23, the sensor chip 40 is cooled using the Peltier effect, where heat moves from the cooling side plate 21 to the heating side plate 22. The Peltier element 20 can switch between the cooling side and the heating side by changing the direction of the direct current. The cooling side plate 21 and the heating side plate 22 are made of, for example, metal plates with good thermal conductivity.

[0118] The Peltier element 20 is fixed to the third recess 13 of the base component 10 and is electrically connected to the wiring of the base component 10. That is, the Peltier element 20 is mounted in the third recess 13 of the base component 10.

[0119] The Peltier element 20 is fixed to the third recess 13 of the base component 10 with the heating side plate portion 22 located on the bottom surface of the third recess 13 of the base component 10 and the heating side plate portion 22 connected to the bottom surface of the third recess 13.

[0120] The power terminals of the Peltier element 20 are electrically connected to the wiring of the base component 10, and power is supplied to the Peltier element 20 from the outside via the base component 10. The Peltier element 20 absorbs heat from the sensor chip 40 through the cooling side plate 21 and dissipates the absorbed heat through the heating side plate 22 to cool the sensor chip 40.

[0121] <Wire Wiring Board>

[0122] like Figure 2 and Figure 3 As shown, the wiring substrate 25 is fixed to the second recess 12 of the base component 10 and is electrically connected to the wiring of the base component 10. That is, the wiring substrate 25 is mounted on the second recess 12 of the base component 10.

[0123] The wiring substrate 25 has a chip mounting surface (first surface) and a back surface (second surface) located on opposite sides of each other in the thickness direction (Z direction) of the wiring substrate 25. Furthermore, the wiring substrate 25 is mounted on the second recess 12 with the back surface side located on the bottom surface side of the second recess 12 of the base member 10.

[0124] The wiring substrate 25 has a multilayer wiring structure in which insulating layers and wiring layers are stacked in multiple layers. Furthermore, the wiring substrate 25 is made of a ceramic wiring substrate, which has better thermal conductivity than a resin wiring substrate.

[0125] <Sensor Chip>

[0126] like Figure 2 and Figure 3 As shown, the sensor chip 40 is bonded and fixed to the chip mounting surface side of the wiring substrate 25 via the adhesive layer 41. The sensor chip 40 has a light-incident surface (light-receiving surface) 40x and a back surface 40y located on opposite sides of each other in its thickness direction (Z direction). Furthermore, the sensor chip 40 is fixed to the chip mounting surface side of the wiring substrate 25 with its back surface 40y located on the wiring substrate 25 side.

[0127] like Figure 4 As shown, the sensor chip 40 has a rectangular two-dimensional planar shape when viewed from above. The light detection module 1A (101) of this first embodiment is as follows... Figure 50 As shown, the image light (incident light 106) from the subject is received via the optical lens 102, and the amount of light of the incident light 106 that forms an image on the imaging surface is converted into an electrical signal per pixel unit and output as a pixel signal.

[0128] The sensor chip 40 has a rectangular pixel array portion 2A disposed in the center of a two-dimensional plane including mutually orthogonal X and Y directions, and a peripheral portion 2B disposed outside the pixel array portion 2A in a manner surrounding the pixel array portion 2A.

[0129] Pixel array section 2A is a receiver, for example, by Figure 50 The light-receiving surface of the optical lens (optical system) 102 shown is where the light is converged. And, as... Figure 4 As shown, in the pixel array section 2A, a plurality of sensor pixels 3 are arranged in a matrix on a two-dimensional plane including the X and Y directions. In other words, the sensor pixels 3 are repeatedly arranged in each of the mutually orthogonal X and Y directions in the two-dimensional plane.

[0130] like Figure 4 As shown, a plurality of pads 4 are arranged in the peripheral portion 2B. The plurality of pads 4 are arranged, for example, along each of the four sides of a two-dimensional plane of the sensor chip 40. Furthermore, the plurality of pads 4 are respectively connected via... Figure 2 and Figure 3 The bonding wire 42 shown is electrically connected to multiple pads on the wiring substrate 25.

[0131] Although the sensor chip 40 is not shown in detail, it mainly includes: a semiconductor layer having a first facet and a second facet located on opposite sides of each other in the thickness direction (Z direction) of the sensor chip 40, a microlens layer disposed on the first facet side of the semiconductor layer, and a multilayer wiring layer disposed on the second facet side of the semiconductor layer.

[0132] Here, the microlens layer side of the sensor chip 40 is the light incident surface (light receiving surface) 40x, and the multilayer wiring layer side of the sensor chip 40 is the back surface 40y.

[0133] In the semiconductor layer of sensor chip 40, for Figure 4 Each sensor pixel 3 shown is provided with a photoelectric conversion unit that converts light incident from the light-incident surface 40x side of the sensor chip 40 into signal charge. While the semiconductor layer is not limited to this, it is composed of a compound semiconductor such as indium gallium arsenide (InGaAs) that absorbs light of a predetermined wavelength (e.g., infrared light) and generates signal charge. That is, the sensor chip 40 of this first embodiment is based on a compound semiconductor.

[0134] In the multilayer wiring layer of the sensor chip 40, multiple layers of interlayer insulating film and wiring layer are provided, and a Figure 4 Pad 4 is shown.

[0135] <Active Chips and Intermediate Layers>

[0136] like Figure 2 and Figure 3 As shown, the logic chip 30 is mounted on the first face S1 side of the base component 10 via the interposer layer 35.

[0137] The logic chip 30 has a main face portion 30x and a back face portion 30y located on opposite sides of each other in its thickness direction (Z direction). Furthermore, the logic chip 30 is mounted on a chip mounting face portion of the interposer layer 35 with a bump electrode 31 inserted between its main face portion 30x and the interposer layer 35.

[0138] Although the logic chip 30 is not shown in detail, it mainly includes: a semiconductor layer having a first facet and a second facet located on opposite sides of each other in its thickness direction (Z direction), and a multilayer wiring layer disposed on the first facet side of the semiconductor layer.

[0139] Here, the multilayer wiring layer side of the logic chip 30 is the main face 30x, and the semiconductor layer side of the logic chip 30 is the back face 30y.

[0140] The logic chip 30 incorporates logic circuitry, such as those with AI (Artificial Intelligence) functionality, as internal circuitry. Furthermore, transistor elements constituting the internal circuitry are disposed on the semiconductor layer of the logic chip 30. Additionally, multiple layers of insulating and wiring layers are disposed on the multilayer wiring layer of the logic chip 30, and pads are provided thereon. The pads are located on the main surface 30x of the logic chip 30.

[0141] The semiconductor layer of the logic chip 30 is made of, for example, monocrystalline silicon. That is, the logic chip 30 of this first embodiment is made based on silicon.

[0142] Although not shown in detail, the interposer 35 has a chip mounting face and a back face located opposite each other in its thickness direction (Z direction). The interposer 35 has a multilayer wiring structure in which insulating layers and wiring layers are stacked multiple times. Furthermore, the interposer 35 is made of a resin wiring substrate, which has lower thermal conductivity than a ceramic wiring substrate. Pads are provided on the chip mounting face side and the back face side of the interposer 35.

[0143] like Figure 2 and Figure 3 As shown, the logic chip 30 is mounted on the chip mounting surface of the interposer 35 with a bump electrode 31 inserted between its main surface 30x and the chip mounting surface of the interposer 35. The bump electrode 31 is electrically and mechanically connected to the pads provided on the main surface 30x of the logic chip 30, and also electrically and mechanically connected to the pads provided on the chip mounting surface of the interposer 35.

[0144] like Figure 2 and Figure 3As shown, the interposer 35 is mounted on the first surface S1 of the base component 10 with a bump electrode 36 inserted between its back surface and the first surface S1. The bump electrode 36 is electrically and mechanically connected to the pads provided on the chip mounting surface of the interposer 35, and also electrically and mechanically connected to the pads provided on the first surface S1 of the base component 10. That is, the internal circuitry (logic circuitry) of the logic chip 30 is electrically connected to the wiring of the base component 10 via the bump electrode 31, the interposer 35, and the bump electrode 36 respectively.

[0145] <Helmet Components>

[0146] like Figure 2 and Figure 3 As shown, the cap component 50 is bonded and fixed to the first surface S1 side of the base component 10 via the resin layer 56. While the cap component 50 is not limited to this, it may include, for example, a frame 51 fixed to the first recess 11 of the base component 10 via the resin layer 56, a frame 52 fixed on the side of the frame 51 opposite to the base component 10 side, such that their respective inner regions overlap when viewed from above, and a transparent plate (sealed glass) 54 fixed on the side of the frame 52 opposite to the side of the frame 51 (base component 10 side) covering the inner region of the frame 52. Furthermore, the cap component 50 has a recess on its inner side, and the frame 51 is bonded and fixed to the first recess 11 of the base component 10 via the resin layer 56, thereby forming a chamber portion 57 together with the base component 10.

[0147] The frame 51 is made of, for example, fused glass with a lower thermal conductivity than ceramic. The frame 52 is made of, for example, ceramic with good thermal conductivity. The transparent plate 54 is made of, for example, glass.

[0148] <Other components>

[0149] like Figure 2 and Figure 3 As shown, a plurality of lead pins 19 serving as external terminals are disposed on the second surface S2 side of the base component 10. Each of these lead pins 19 has one end fixed to the second surface S2 side of the base component 10 and protrudes downward from the second surface S2 side of the base component 10. Furthermore, each lead pin 19 is electrically connected to the wiring of the base component 10.

[0150] like Figure 1 As shown, multiple passive components Pv are mounted on the first surface S1 side of the base component 10. These passive components Pv include capacitor components, resistor components, etc.

[0151] Manufacturing method of optical detection module

[0152] Next, use Figures 5A to 5F The manufacturing method of the optical detection module 1A according to this first embodiment will be described.

[0153] First, prepare Figure 5A The base component 10 is shown. The base component 10 has a first face S1 and a second face S2 located on opposite sides of each other, and has a first recess 11, a second recess 12 and a third recess 13 arranged sequentially from the first face S1 side toward the second face S2 side.

[0154] Next, as Figure 5B As shown, a Peltier element 20 is disposed in the third recess 13 of the base component 10, and a wiring substrate 25 is disposed in the second recess 12. The Peltier element 20 is fixed to the bottom surface of the third recess 13 with the heating side plate portion 22 located on the bottom surface side of the third recess 13. The wiring substrate 25 is fixed to the bottom surface of the second recess 12 in a manner connected to the cooling side plate portion 21 of the Peltier element 20.

[0155] In this process, the power terminals of the Peltier element 20 and the wiring of the wiring substrate 25 are electrically connected to the wiring of the base component 10. That is, the Peltier element 20 is mounted in the third recess 13 of the base component 10, the wiring substrate 25 is mounted in the second recess 12 of the base component 10, and is directly or indirectly connected to the cooling side plate portion 21 of the Peltier element 20.

[0156] Alternatively, the Peltier element 20 and the wiring substrate 25 can be fixed to the base component 10 during the manufacturing process of the light detection module 1A, as in the first embodiment, or the base component 10 with the Peltier element 20 and the wiring substrate 25 pre-installed can be prepared.

[0157] Next, as Figure 5C As shown, a logic chip 30 is mounted on the first surface S1 of the base member 10 via an interposer layer 35. The mounting of the logic chip 30 is performed by attaching the interposer layer 35, on which the logic chip 30 is pre-mounted, to the first surface S1 of the base member 10. Furthermore, the mounting of the interposer layer 35 is performed by melting and solidifying the bump electrodes 36. The logic circuitry mounted on the logic chip 30 is electrically connected to the wiring of the interposer layer 35 via the bump electrodes 31.

[0158] In this process, the wiring of the interposer 35 is electrically connected to the wiring of the base component 10 via the bump electrode 36.

[0159] In addition, in this process, the logic circuit of the logic chip 30 is electrically connected to the wiring of the base component 10 via the bump electrode 31, the wiring of the interposer 35, and the bump electrode 36.

[0160] Alternatively, an intermediary layer 35 may be installed on the first face S1 of the base component 10, and then a logic chip 30 may be installed on the intermediary layer 35.

[0161] Next, as Figure 5D As shown, a sensor chip 40 is mounted on the side of the wiring substrate 25 opposite to the Peltier element 20 side. The sensor chip 40 is mounted by bonding and fixing the sensor chip 40 to the wiring substrate 25 with an adhesive layer 41 sandwiched between the back side 40y of the sensor chip 40 and the chip mounting surface side of the wiring substrate 25, and then electrically connecting the pads of the sensor chip 40 to the pads of the wiring substrate 25 with bonding wires 42.

[0162] Through this process, the internal circuit of the photoelectric conversion unit containing the sensor chip 40 is electrically connected to the logic circuit of the logic chip 30 mainly through the bonding wire 41, the wiring of the wiring substrate 25, the wiring of the base component 10, and the wiring of the interposer 35.

[0163] Next, as Figure 5E As shown, a resin layer 56 is formed in the first recess 11 of the base component 10, and then, as Figure 5F As shown, the frame 51 of the cap component 50 is glued and fixed to the first recess 11 of the base component 10.

[0164] In this process, the cap component 50, while separated from and covering the sensor chip 40, is bonded and fixed to the first surface S1 side of the base component 10 via the resin layer 56. That is, the cap component 50 is bonded and fixed to the first surface S1 side of the base component 10 in a state where it is thermally separated from the base component 10 by the resin layer 56.

[0165] In addition, in this process, a chamber portion 57 is formed by the base component 10 and the cap component 50, and the Peltier element 20 and the sensor chip 40 are airtightly sealed in the chamber portion 57.

[0166] In addition, in this first embodiment, the case in which the cap component 50, which is constructed by pre-assembling the frame 51, frame 52 and transparent plate 54, etc., is fixed to the base component 10 has been described, but the cap component 50 can also be constructed by assembling the frame 51, frame 52 and transparent plate 54, etc., on the first face S1 side of the base component 10.

[0167] Main effects of the first embodiment

[0168] Next, the main effects of this first embodiment will be explained.

[0169] The optical detection module 1A involved in this first embodiment is as follows: Figures 1 to 3As shown, the logic chip 30 is mounted on the base member 10, spaced apart from the Peltier element 20 and the sensor chip 40 in the planar direction. With this configuration, the heat generated by the logic chip 30 is transferred to the base member 10. Furthermore, the heat transferred to the base member 10 is dissipated (heat dissipation) by the base member 10 and moves towards the Peltier element 20. That is, the thermal resistance from the logic chip 30 through the base member 10 to the Peltier element 20 is increased, making it less likely for the heat generated by the logic chip 30 to be transferred to the Peltier element 20. In other words, thermal separation between the Peltier element 20 and the logic chip 30 is facilitated. Therefore, according to the light detection module 1A of this first embodiment, the decrease in cooling efficiency of the sensor chip 40 via the Peltier element 20 (the decrease in cooling efficiency of the Peltier element 20 caused by the heat generated by the logic chip 30) can be suppressed.

[0170] In addition, since the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be suppressed, the reliability of the optical detection module 1A, which mounts the logic chip 30 together with the Peltier element 20 and the sensor chip 40 on the same base component 10, can be improved.

[0171] Furthermore, in the optical detection module 1A according to this first embodiment, the logic chip 30 is mounted to the base member 10 via an interposer 35. By adopting this configuration, thermal separation between the base member 10 and the logic chip 30 can be facilitated via the interposer 35. Compared to the case where the logic chip 30 is directly mounted to the base member 10 without the interposer 35, the heat generated by the logic chip 30 is less likely to be transferred to the base member 10. Therefore, according to the optical detection module 1A according to this first embodiment, the decrease in cooling efficiency of the sensor chip 40 via the Peltier element 20 can be further suppressed. As the interposer 35, a ceramic interposer with high thermal conductivity can be used, but as in this first embodiment, a resin interposer with lower thermal conductivity than ceramic is preferred.

[0172] Furthermore, according to the light detection module 1A of this first embodiment, a compound semiconductor-based sensor chip 40 and an advanced technology logic chip 30 can be mounted on the same base component 10, thereby assigning the functions of the logic chip 30 to the sensor chip 40, which helps to improve performance.

[0173] Furthermore, in the first embodiment described above, it was explained that... Figure 2 The diagram shows the case where the wiring substrate 25 is in contact with the base component 10. However, if the wiring substrate 25 is electrically connected to the base component 10 via the Peltier element 20, it may not be necessary for the wiring substrate 25 to be in contact with the base component 10.

[0174] [Second Implementation]

[0175] like Figure 6 As shown, the optical detection module 1B in the second embodiment of this technology has basically the same configuration as the optical detection module 1A in the first embodiment described above, except for the following configurations.

[0176] That is, such as Figure 6 As shown, the light detection module 1B according to the second embodiment of this technology further includes a heat dissipation path portion 60 that is spaced apart from the base member 10 and connected to the logic chip 30. Furthermore, the heat dissipation path portion 60 of this second embodiment is a graphite sheet 61 that serves as a heat sink connected to both the logic chip 30 and the cap member 50. The graphite sheet 61 is connected to the back surface portion 30y of the logic chip 30 and to the frame 52 of the cap member 50. Additionally, the graphite sheet 61 is, for example, made of black.

[0177] In the light detection module 1B according to this second embodiment, the heat generated by the logic chip 30 is transferred from the logic chip 30 to the graphite sheet 61. Furthermore, the heat transferred to the graphite sheet 61 is dissipated (dissipated) from the graphite sheet 61 to the atmosphere, and then transferred from the graphite sheet 61 to the cap member 50. Then, the heat transferred to the cap member 50 is dissipated to the atmosphere from the larger cap member 50. That is, the cap member 50 functions as a heat dissipation component.

[0178] Here, as described in the first embodiment above, the cap component 50 is thermally separated from the base component 10 by the resin layer 56. Furthermore, for the cap component 50, the frame 51, which is fixed to the base component 10 via the resin layer 56, is made of fused glass with high thermal resistance. That is, the thermal resistance from the cap component 50 to the base component 10 increases, resulting in a structure where heat is not easily transferred from the cap component 50 to the base component 10.

[0179] Therefore, the light detection module 1B according to this second embodiment can further suppress the decrease in cooling efficiency of the sensor chip 40 by the Peltier element 20 compared with the light detection module 1A according to the first embodiment.

[0180] Furthermore, since the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be further suppressed, the reliability of the optical detection module 1A, which mounts the logic chip 30 together with the Peltier element 20 and the sensor chip 40 on the same base component 10, can be further improved.

[0181] In addition, since the graphite sheet 61 is made of black, it can suppress the reflection of unnecessary light by the graphite sheet 61.

[0182] [Third Implementation Method]

[0183] like Figure 7As shown, the optical detection module 1C in the third embodiment of this technology has basically the same configuration as the optical detection module 1B in the second embodiment described above, except for the following configurations.

[0184] That is, such as Figure 7 As shown, the light detection module 1C according to the third embodiment of this technology, as a heat dissipation path part 60, includes a heat radiation promoting sheet 62 instead of the one described in the second embodiment. Figure 6 The graphite sheet 61 is shown. Furthermore, the heat radiation promoting sheet 62 is connected to the back surface portion 31y of the logic chip 30. The heat radiation promoting sheet 62 is the same as in the second embodiment described above, for example, made of black material.

[0185] In the light detection module 1C according to this third embodiment, the heat generated by the logic chip 30 is transferred to the heat radiation promoting sheet 62. Furthermore, the heat transferred to the heat radiation promoting sheet 62 is dissipated (dissipated) from the heat radiation promoting sheet 62 to the outside air.

[0186] In the light detection module 1C of this third embodiment, compared with the light detection module 1A of the first embodiment described above, the decrease in cooling efficiency of the sensor chip 40 by the Peltier element 20 can be further suppressed.

[0187] Furthermore, since the heat radiation promoting sheet 62 is made of black, it is similar to... Figure 6 The graphite sheet 61 shown is the same, which can suppress the reflection of unwanted light by the heat radiation promoting sheet 62.

[0188] [Fourth Implementation Method]

[0189] like Figure 8 As shown, the light detection module 1D in the fourth embodiment of this technology has basically the same configuration as the light detection module 1B in the second embodiment described above, except for the following configurations.

[0190] That is, such as Figure 8 As shown, the light detection module 1D according to this fourth embodiment includes a base component 10D instead of the one described in the second embodiment. Figure 6 The base component 10 is shown. The base component 10D is essentially the same as... Figure 6 The base component 10 shown has the same configuration, except that it also has a recess 15 disposed on the first face S1 side. The logic chip 30 is mounted on the bottom face of the recess 15 via an interposer layer 35.

[0191] In the light detection module 1D according to this fourth embodiment, the logic chip 30 is also thermally separated from the base component 10D through the interposer layer 35. Therefore, compared with the case where the logic chip 30 is directly mounted on the base component 10D without passing through the interposer layer 35, the thermal resistance from the logic chip 30 to the base component 10D is greater, and the heat generated by the logic chip 30 is not easily transferred to the base component 10D.

[0192] The base component 10D of this fourth embodiment is basically the same as the recess 15. Figure 6 The base component 10 shown has the same configuration. The recess 15 is recessed from the first face S1 side to the second face S2 side of the base component 10D.

[0193] In the light detection module 1D according to this fourth embodiment, the same effect as that of the light detection module 1B according to the second embodiment can also be obtained.

[0194] Furthermore, in the light detection module 1D according to this fourth embodiment, the logic chip 30 and the interposer layer 35 are disposed in the recess 15 provided in the base member 10. This allows for the suppression of unwanted light directly incident on the logic chip 30.

[0195] Furthermore, by providing a recess 15 in the base member 10, the thickness of the recess 15 can be made smaller than the thickness between the first surface S1 and the second surface S2 of the base member 10D, thus reducing the likelihood of warping at the recess 15 where the logic chip 30 is mounted. In other words, warping of the base member 10D can be suppressed.

[0196] In addition, the technique of mounting the logic chip 30 in the recess 15 of the base component 10D via the interposer layer 35 can also be applied in the first embodiment and the second embodiment described above.

[0197] Furthermore, the recess 15 can be defined as a spatial portion. And the logic chip 30 can be configured such that at least a portion of it is located within the spatial portion (recess 15) provided on the base member 10D.

[0198] [Fifth Implementation Method]

[0199] like Figure 9 As shown, the optical detection module 1E in the fifth embodiment of this technology has basically the same configuration as the optical detection module 1A in the first embodiment described above, except for the following configurations.

[0200] That is, such as Figure 9 As shown, the light detection module 1E according to this fifth embodiment includes a base member 10E with a recess 16 provided on the second face S2 side, replacing the first embodiment described above. Figure 2The base component 10 is shown. Furthermore, a passive component Pv is mounted on the bottom surface of the recess 16 of the base component 10D.

[0201] The base component 10E of this fifth embodiment is basically the same as the recess 16. Figure 2 The base component 10 shown has the same configuration. The recess 16 is provided at a position that overlaps with the logic chip 30 when viewed from above, and is recessed from the second face S2 side of the base component 10D toward the first face S1 side.

[0202] In the light detection module 1E according to this fifth embodiment, the same as in the first embodiment described above, it is possible to suppress the decrease in cooling efficiency of the sensor chip 40 cooled by the Peltier element 20.

[0203] Furthermore, since the recess 16 is provided in the base component 10E, the thickness of the recess 16 can be made smaller than the thickness between the first surface S1 and the second surface S2 of the base component 10E. Therefore, it is less likely to cause warping at the mounting portion where the logic chip 30 is mounted (the portion overlapping the recess 16 when viewed from above). That is, in the light detection module 1E according to this fifth embodiment, the same as in the fourth embodiment described above, warping of the base component 10E can be suppressed.

[0204] [Sixth Implementation Method]

[0205] Next, use Figure 10 and Figure 11 The light detection module involved in the sixth embodiment of this technology will be described.

[0206] Figure 10 This is a schematic diagram showing the back view of the lower surface side of the light detection module according to the sixth embodiment of the present technology. Figure 11 It is schematically shown in reverse along Figure 10 The longitudinal section diagram of the longitudinal section structure along the a10-a10 section line.

[0207] like Figure 10 and Figure 11 As shown, the light detection module 1F in the sixth embodiment of this technology has basically the same configuration as the light detection module 1D in the fourth embodiment described above, except for the following configurations.

[0208] That is, such as Figure 10 and Figure 11 As shown, the light detection module 1F according to this sixth embodiment includes a base component 10F to replace the one described in the fourth embodiment. Figure 8 The base component 10D is shown. Furthermore, the light detection module 1F according to this sixth embodiment also includes a heat sink 65 as a heat dissipation component.

[0209] The base component 10F is essentially the same as that in the fourth embodiment described above. Figure 8 The base component 10D shown has the same configuration, except that it has an opening 14 instead of the third recess 13 of the base component 10D. Other configurations are largely the same. Figure 8 The same applies to the base component 10D shown.

[0210] like Figure 10 and Figure 11 As shown, the opening 14 extends from the second recess 12 of the base member 10F to the second surface S2, and penetrates the base member 10F in the thickness direction (Z direction).

[0211] The heat sink 65 is disposed on the second surface S2 side of the base member 10F such that it overlaps with the Peltier element 20 when viewed from above, and is fixed to the base member 10F by blocking the opening 14. The heat sink 65 is bonded to the second surface S2 side of the base member 10D via a resin layer 65a.

[0212] like Figure 11 As shown, the Peltier element 20 is disposed at the opening 14 of the base member 10F. Furthermore, the heat-generating side plate 22 of the Peltier element 20 is directly connected to the heat sink 65 without passing through the base member 10F.

[0213] In the light detection module 1F of this sixth embodiment, similar to the light detection module 1D of the fourth embodiment described above, it is able to suppress the decrease in cooling efficiency of the sensor chip 40 cooled by the Peltier element 20, and it is able to suppress the warping of the base component 10F.

[0214] Furthermore, the light detection module 1F according to this sixth embodiment includes a heat sink 65 disposed on the second surface S2 side of the base member 10F. Moreover, the heat-generating side plate portion 22 of the Peltier element 20 is directly connected to the heat sink 65 without passing through the base member 10F. Therefore, since the Peltier element 20 and the base member 10F are separated by a heat sink 65 different from that of the base member 10F, thermal separation between the Peltier element 20 and the logic chip 30 can be promoted, making it less likely that the heat generated by the logic chip 30 will be transferred to the Peltier element 20.

[0215] In addition, since the heat sink 65 is bonded and fixed to the second surface S2 side of the base component 10F via the resin layer 65a, the heat sink 65 can be thermally separated from the base component 10F, making it less likely for the heat generated by the logic chip 30 to be transferred to the Peltier element 20.

[0216] Therefore, according to the light detection module 1F of this sixth embodiment, the decrease in cooling efficiency of the sensor chip 40 by the Peltier element 20 can be further suppressed.

[0217] In addition, since the heat-generating side plate 22 of the Peltier element 20 is directly connected to the heat sink 65 without passing through the base member 10F, it is also easy to allow external heat dissipation (release) of the heat-generating side plate 22 of the Peltier element 20 to the heat-to-light detection module 1F.

[0218] [Seventh Implementation Method]

[0219] In this seventh embodiment, an example of applying the present technology to a non-hermetic optical detection module 1G will be described.

[0220] like Figure 12 As shown, the optical detection module 1G according to the seventh embodiment of the present technology includes: a base component 10G, a Peltier element 20 serving as a cooling device mounted on the base component 10G, a sensor chip 40 mounted on the base component 10G in a manner overlapping the Peltier element 20 when viewed from above, and a logic chip 30 mounted on the base component 10G, which is spaced apart from the Peltier element 20 and the sensor chip 40 in the planar direction and is mounted via an interposer layer 35.

[0221] In addition, the light detection module 1G according to this seventh embodiment also includes: a cap member 50G that is spaced apart from the Peltier element 20 and the sensor chip 40 and covers the sensor chip 40 and is mounted on the base member 10, and a graphite sheet 61 that serves as a heat dissipation path 60.

[0222] Furthermore, the light detection module 1G according to this seventh embodiment also includes a heat sink 66 mounted on the base component 10G as a heat dissipation component. Specifically, the light detection module 1G according to this seventh embodiment also includes a heat sink 66 that is connected between the Peltier element 20 and the sensor chip 40, respectively, and is fixed to the base component 10G via a resin layer 65a.

[0223] like Figure 12 As shown, the base component 10G is essentially the same as that in the fourth embodiment described above. Figure 8 The base component 10D shown has the same configuration, except that it has an opening (through hole) 17 instead of the first to third recesses 11, 12, and 13. The opening 17 extends across the first surface portion S1 and the second surface portion S2 of the base component 10G and penetrates the base component 10G in the thickness direction (Z direction). In this base component 10G, the other configurations are generally the same. Figure 8The base component 10D shown is the same.

[0224] like Figure 12 As shown, the heat sink 66 has a main body 66A and a flange 66B integrated with the main body 66A and having a larger external dimension than the main body when viewed from above. The heat sink 66 is fixed with the main body 66A inserted into the opening 17 of the base member 10G and the flange 66B bonded to the second surface S2 side of the base member 10G via a resin layer 65a. That is, a portion of the heat sink 66 is disposed within the through hole 17 of the base member 10G. In other words, at least a portion of the heat sink 66 is located between the base members 10G.

[0225] like Figure 12 As shown, the sensor chip 40 is fixed to the main body 66A of the heat sink 66 on the first face S1 side of the base component 10G, with the back side 40y side of the sensor chip 40 located on the chip mounting face side of the main body 66A of the heat sink 66. Furthermore, the sensor chip 40 uses pads 4 (see reference 40x) provided on its light incident face 40x... Figure 4 It is electrically connected to the pads provided on the first face S1 of the base component 10G via the bonding wire 42.

[0226] like Figure 12 As shown, the Peltier element 20 is fixed to the heat sink 66 with the cooling side plate portion 21 connected to the flange portion 66B side of the heat sink 66. In this embodiment, the Peltier element 20 absorbs heat transferred from the sensor chip 40 to the heat sink 66 through the cooling side plate portion 21, and dissipates the absorbed heat through the heating side plate portion 22 to cool the sensor chip 40.

[0227] like Figure 12 As shown, the cap component 50G is fixed to the first face S1 side of the base component 10G. While not limited to this, the cap component 50G includes: a frame 58 fixed to the first face S1 of the base component 10G, and a transparent plate 54 fixed to the inner region of the frame 58 on the side opposite to the base component 10G. The cap component 50G has a recess on its inner side, forming a chamber portion 57 together with the base component 10G. The sensor chip 40 is sealed within the chamber portion 57.

[0228] like Figure 12 As shown, the logic chip 30 is mounted on the bottom surface of the recess 15 of the base member 10G via the interposer layer 35, similar to the fourth embodiment described above. Furthermore, the graphite sheet 61 is connected to the back surface 30y side of the logic chip 30 and to the frame 52G of the cap member 50G. The graphite sheet 61 is, for example, made of black material.

[0229] In the light detection module 1G of this seventh embodiment, similar to the sixth embodiment described above, since the Peltier element 20 and the base component 10G are separated by a heat sink 66 different from the base component 10G, thermal separation between the Peltier element 20 and the logic chip 30 can be promoted. Compared with the first embodiment described above, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20.

[0230] In addition, since the heat sink 66 is bonded and fixed to the second surface S2 side of the base component 10G via the resin layer 65a, the heat sink 66 can be thermally separated from the base component 10G, making it less likely for the heat generated by the logic chip 30 to be transferred to the Peltier element 20.

[0231] Therefore, in the light detection module 1G according to this seventh embodiment, the same as in the sixth embodiment described above, the decrease in cooling efficiency of the sensor chip 40 by the Peltier element 20 can be further suppressed.

[0232] Additionally, the back side of the sensor chip 40 is not via Figure 11 The wiring substrate 25 shown is connected to the heat sink 66. Furthermore, the heat-generating side plate 22 of the Peltier element 20 is directly connected to the heat sink 65 without passing through the base member 10G. Therefore, according to this seventh embodiment, the light detection module 1G can more easily dissipate heat from the heat-generating side plate 22 of the Peltier element 20 to the outside of the light detection module 1F, compared to the sixth embodiment described above.

[0233] [Eighth Implementation Method]

[0234] like Figure 13 As shown, the optical detection module 1H according to the eighth embodiment of the present technology includes: a base component 10H, a Peltier element 20 serving as a cooling device mounted on the base component 10H, a sensor chip 40 mounted on the base component 10H in a manner that overlaps with the Peltier element 20 when viewed from above, and a logic chip 30 mounted on the base component 10H that is spaced apart from the Peltier element 20 and the sensor chip 40 in the planar direction.

[0235] In addition, the light detection module 1H according to this eighth embodiment also includes: a cap member 50H that is spaced apart from the Peltier element 20 and the sensor chip 40 and is mounted on the base member 10H covering the sensor chip 40, and a graphite sheet 61 that serves as a heat dissipation path 60.

[0236] like Figure 13As shown, the base component 10H is not limited to this, but may include, for example, a core layer 71 having a first facet 71x and a second facet 71y located on opposite sides, a multilayer wiring layer 72 disposed on the first facet 71x side of the core layer 71, and an opening 71a disposed on the core layer 71.

[0237] Although not shown in detail, the core layer 71 may have, for example, a multilayer wiring structure consisting of multiple layers of an insulating layer made of ceramic material and wiring layers made of conductive material. The multilayer wiring layer 72 includes, for example, an insulating layer made of resin and wiring 72a made of conductive material.

[0238] The opening 71a extends from the second face 71y of the core layer 71 to the first face 71x and penetrates the core layer 71 in the thickness direction (Z direction).

[0239] Here, in this eighth embodiment, the surface portion of the multilayer wiring layer 72 opposite to the core layer 71 becomes the first surface portion S1 of the base member 10H, and the second surface portion 71y of the core layer 71 becomes the second surface portion S2 of the base member 10H.

[0240] like Figure 13 As shown, the sensor chip 40 is fixed to the surface portion of the multilayer wiring layer 72 (the first surface portion S1 of the base component 10H) on the first surface portion S1 side of the base component 10H, with the back portion 40y side of the sensor chip 40 located on the side of the multilayer wiring layer 72. Furthermore, although not shown in detail, the sensor chip 40 has pads 4 (see reference 40x) provided on its light incident surface portion 40x. Figure 4 It is electrically connected to the pads provided on the multilayer wiring layer 72 via wire bonding.

[0241] like Figure 13 As shown, the Peltier element 20 is fixed to the core layer 71 (base member 10H) with its cooling side plate portion 21 connected to the second surface portion 71y of the core layer 71. In this embodiment, the Peltier element 20 absorbs heat transferred from the sensor chip 40 to the base member 10H through the cooling side plate portion 21, and cools the sensor chip 40 by dissipating the absorbed heat through the heating side plate portion 22.

[0242] like Figure 13As shown, the cap component 50H is fixed to the first surface S1 (surface portion of the multilayer wiring layer 72) of the base component 10H. The cap component 50H is not limited to this, but may include, for example, a cover body 59 having a top plate portion 59a and leg portions 59b, and an opening 59c provided in the top plate portion 59a, and a transparent plate 54 fixed to the top plate portion 59a of the cover body 59 by blocking the opening 59c of the cover body 59. The transparent plate 54 is bonded and fixed to the top plate portion 59a via an adhesive layer 53. The cap component 50H has a recess on its inner side, forming a chamber portion 57 together with the base component 10H. The sensor chip 40 is sealed in the chamber portion 57 formed by the base component 10H and the cap component 50H. The cover body 59 is made of, for example, ceramic with a higher thermal conductivity than resin. Although the cap component 50H does not... Figure 13 The diagram in the middle, but with Figure 2 The cap component 50 shown is the same and is bonded to the base component 10H via the resin layer 56.

[0243] like Figure 13 As shown, the logic chip 30 is disposed in the opening 71a of the core layer 71 and mounted on the multilayer wiring layer 72 from the core layer 71 side. The logic chip 30 is fixed to the base component 10H such that the pads disposed on its main surface 30x side are electrically connected to the wiring 72a of the multilayer wiring layer 72 and its main surface 30x is connected to the multilayer wiring layer 72.

[0244] The logic chip 30 is covered by resin 74 in the opening 71a of the base component 10H. Furthermore, the logic chip 30 is separated from and isolated from the core layer 71 of the base component 10H.

[0245] like Figure 13 As shown, the graphite sheet 61, when viewed from above, overlaps with the logic chip 30 and is connected to the first facet S1 (surface portion of the multilayer wiring layer 72) of the base member 10H, and is also connected to the cover body 59 of the cap member 50H. Furthermore, the graphite sheet 61 is made of, for example, black material.

[0246] In the light detection module 1H according to this eighth embodiment, the heat generated by the logic chip 30 is mainly transferred from the logic chip 30 to the multilayer wiring layer 72 via wiring 72a. The heat transferred to the multilayer wiring layer 72 is then transferred to the graphite sheet 61. Furthermore, the heat transferred to the graphite sheet 61 is dissipated (radiated) to the atmosphere from the graphite sheet 61, and is transferred to the cap member 50H from the graphite sheet 61. Then, the heat transferred to the cap member 50H is dissipated to the atmosphere from the larger cap member 50. That is, the cap member 50H functions as a heat dissipation component.

[0247] In the optical detection module 1H according to this eighth embodiment, the logic chip 30 is separated from the core layer 71 of the base component by the resin 74, and the logic chip 30 is covered by the resin. Therefore, the heat dissipation path of the heat generated by the logic chip mainly follows the direction of the graphite sheet 61 (heat dissipation path portion 60), which can promote thermal separation between the Peltier element 20 and the logic chip 30. Compared with the first embodiment described above, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20. Therefore, in the optical detection module 1H according to this eighth embodiment, as in the sixth embodiment described above, the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be further suppressed.

[0248] [Ninth Implementation Method]

[0249] like Figure 14 As shown, the light detection module 1I in the ninth embodiment of this technology has basically the same configuration as the light detection module 1H in the eighth embodiment described above, except for the following configurations.

[0250] That is, such as Figure 14 As shown, the light detection module 1I according to this ninth embodiment includes a base component 10I and a thermal radiation promoting sheet 62 instead of the one described in the eighth embodiment. Figure 13 The base component 10H and graphite sheet 61 are shown. Other components are generally the same as in the eighth embodiment described above.

[0251] Figure 14 The base component 10I shown is basically the same as Figure 13 The base component 10H has the same structure, except that it also has a multi-layer wiring layer 73 disposed on the second face 71y side of the core layer 71. Other structures are roughly the same. Figure 13 The base component 10H is the same.

[0252] like Figure 14 As shown, the base component 10I includes: a core layer 71 having a first surface 71x and a second surface 71y located on opposite sides of each other; a multilayer wiring layer 72 disposed on the first surface 71x side of the core layer 71; an opening 71a disposed on the core layer 71; and a multilayer wiring layer 73 disposed on the second surface 71y side of the core layer 71. Although not shown in detail, the multilayer wiring layer 73 includes, for example, an insulating layer made of resin and a wiring layer made of a conductive material. In this ninth embodiment, the core layer 71 includes, for example, a copper plate as a solid metal plate with a wide range of expansion.

[0253] The opening 71a of the base component 10I is blocked by a multilayer wiring layer 72 on the first surface 71x side of the core layer 71 and by a multilayer wiring layer 73 on the second surface 71y side of the core layer 71. Furthermore, a logic chip 30 is disposed in the opening 71a and filled with resin 74.

[0254] Here, in this ninth embodiment, the surface portion of the multilayer wiring layer 72 opposite to the core layer 71 becomes the first surface portion S1 of the base member 10H, and the surface portion of the multilayer wiring layer 73 opposite to the core layer 71 becomes the second surface portion S2 of the base member 10H.

[0255] like Figure 14 As shown, the logic chip 30 is mounted on the multilayer wiring layer 72 at the opening 71a of the core layer 71. Similar to the eighth embodiment described above, the logic chip 30 is fixed to the base component 10I with its pads on its main surface 30x side electrically connected to the wiring 72a of the multilayer wiring layer 72 and its main surface 30x connected to the multilayer wiring layer 72.

[0256] The logic chip 30 is covered by resin 74 at the opening 71a of the base component 10H. Furthermore, the logic chip 30 is separated from the core layer 71 of the base component 10H and is thermally separated from the core layer 71.

[0257] like Figure 14 As shown, the Peltier element 20 is fixed to the multilayer wiring layer 73 (base member 10I) with its cooling side plate portion 21 connected to the surface portion of the multilayer wiring layer 73. In this embodiment, the Peltier element 20 absorbs the heat transferred from the sensor chip 40 to the base member 10I through the cooling side plate portion 21, and cools the sensor chip 40 by dissipating the absorbed heat through the heating side plate portion 22.

[0258] like Figure 14 As shown, the cap component 50H is the same as in the eighth embodiment described above, fixed to the first surface S1 (surface portion of the multilayer wiring layer 72) of the base component 10I. Furthermore, the heat radiation promoting sheet 62 is also the same as in the eighth embodiment described above, overlapping the logic chip 30 and connected to the first surface S1 (surface portion of the multilayer wiring layer 72) of the base component 10I when viewed from above. The heat radiation promoting sheet 62 is, for example, made of black. In other words, the heat radiation promoting sheet 62 is connected to the side of the multilayer wiring layer 72 opposite to the logic chip 30 side.

[0259] In the light detection module 1I according to this ninth embodiment, the heat generated by the logic chip 30 is mainly transferred from the logic chip 30 to the multilayer wiring layer 72 via wiring 72a. Then, the heat transferred to the multilayer wiring layer 72 is transferred from the multilayer wiring layer 72 to the heat radiation promoting sheet 62. Furthermore, the heat transferred to the heat radiation promoting sheet 62 is dissipated (dissipated) from the heat radiation promoting sheet 62 to the atmosphere.

[0260] In the light detection module 1I according to this ninth embodiment, the logic chip 30 is also separated from the core layer 71 of the base component, and the logic chip 30 is covered with resin. Therefore, the heat dissipation path of the heat generated by the logic chip 30 mainly becomes the direction of the heat radiation promoting sheet 62 (heat dissipation path portion 60), which can promote thermal separation between the Peltier element 20 and the logic chip 30. Compared with the first embodiment described above, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20. Therefore, in the light detection module 1I according to this ninth embodiment, similar to the sixth embodiment described above, the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be further suppressed.

[0261] [Tenth Implementation]

[0262] This tenth embodiment is a combination of the first embodiment and the eighth embodiment described above.

[0263] like Figure 15 As shown, the light detection module 1J according to the tenth embodiment of the present technology includes: a base component 10J, a Peltier element 20 serving as a cooling device mounted on the base component 10J, a sensor chip 40 mounted on the base component 10J in a manner that overlaps with the Peltier element 20 when viewed from above, and a logic chip 30 mounted on the base component 10J that is spaced apart from the Peltier element 20 and the sensor chip 40 in the planar direction.

[0264] In addition, the light detection module 1J according to this tenth embodiment also includes: a cap member 50 that is spaced apart from the Peltier element 20 and the sensor chip 40 and covers the sensor chip 40 and is mounted on the base member 10J, and a graphite sheet 61 that serves as a heat dissipation path 60.

[0265] like Figure 15 As shown, the base component 10J is not limited to this, but may include, for example, a core layer 71 having a first facet 71x and a second facet 71y located on opposite sides, a multilayer wiring layer 72 disposed on the first facet 71x side of the core layer 71, and an opening 71a disposed on the core layer 71.

[0266] Although not shown in detail, the core layer 71 may have, for example, a multilayer wiring structure consisting of multiple layers of an insulating layer made of ceramic material and wiring layers made of conductive material. The multilayer wiring layer 72 includes, for example, an insulating layer made of resin and wiring 72a made of conductive material. The multilayer wiring layer 72 of this tenth embodiment is similar to that of the eighth embodiment described above. Figure 13 Unlike the multilayer wiring layer 72 shown, it is not disposed in the area where the cap member 50 is mounted, but is selectively disposed on the first face 71x side of the core layer 71.

[0267] The core layer 71 has the same characteristics as in the first embodiment described above. Figure 2 and Figure 3 The base component 10 shown has the same first recess 11, second recess 12, and third recess 13. Furthermore, in each of the first to third recesses 11, 12, and 13, the frame 51 of the cap component 50, the wiring substrate 25, and the Peltier element 20 are fixed in the same manner as in the first embodiment described above.

[0268] The opening 71a extends from the second face 71y of the core layer 71 to the first face 71x and penetrates the core layer 71 in the thickness direction (Z direction).

[0269] Here, in this tenth embodiment, the surface portion of the multilayer wiring layer 72 opposite to the core layer 71 side and the first surface portion 71x of the core layer 71 in the region where the multilayer wiring layer 72 is not selectively provided become the first surface portion S1 of the base member 10J. Furthermore, the second surface portion 71y of the core layer 71 becomes the second surface portion S2 of the base member 10H.

[0270] like Figure 15 As shown, the logic chip 30 is disposed in the opening 71a of the core layer 71 and mounted on the multilayer wiring layer 72 from the core layer 71 side. The logic chip 30 is fixed to the base component 10J with the pads disposed on its main surface 30x side electrically connected to the wiring 72a of the multilayer wiring layer 72 and its main surface 30x connected to the multilayer wiring layer 72.

[0271] The logic chip 30 has its back surface 30y and side surface covered by resin 74 at the opening 71a of the base component 10J. Furthermore, the logic chip 30 is separated from the core layer 71 of the base component 10J and is thermally separated from the core layer 71.

[0272] like Figure 15 As shown, the graphite sheet 61, when viewed from above, overlaps with the logic chip 30 and is connected to the first facet S1 (surface portion of the multilayer wiring layer 72) of the base member 10J, and is also connected to the frame 52 of the cap member 50. Furthermore, the graphite sheet 61 is, for example, made of black.

[0273] In the light detection module 1J according to this tenth embodiment, the heat generated by the logic chip 30 is mainly transferred from the logic chip 30 to the multilayer wiring layer 72 via wiring 72a. Then, the heat transferred to the multilayer wiring layer 72 is transferred from the multilayer wiring layer 72 to the graphite sheet 61. Furthermore, the heat transferred to the graphite sheet 61 is dissipated (radiated) to the atmosphere from the graphite sheet 61, and is transferred from the graphite sheet 61 to the cap member 50H. Then, the heat transferred to the cap member 50 is dissipated to the atmosphere from the larger cap member 50. That is, the cap member 50 functions as a heat dissipation component.

[0274] In the light detection module 1J according to this tenth embodiment, similar to the eighth embodiment described above, the logic chip 30 is separated from the core layer 71 of the base component 10J by the resin 74, and the logic chip 30 is covered by the resin 74. Therefore, the heat dissipation path of the heat generated by the logic chip 30 mainly follows the direction of the graphite sheet 61 (heat dissipation path portion 60), which can promote thermal separation between the Peltier element 20 and the logic chip 30. Compared with the first embodiment described above, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20. Therefore, in the light detection module 1J according to this tenth embodiment, similar to the sixth embodiment described above, the decrease in cooling efficiency of the sensor chip 40 cooled by the Peltier element 20 can be further suppressed.

[0275] [Eleventh Implementation Method]

[0276] like Figure 16 As shown, the light detection module 1K in the eleventh embodiment of this technology has basically the same configuration as the light detection module 1J in the tenth embodiment described above, except for the following configurations.

[0277] That is, such as Figure 16 As shown, the light detection module 1K according to this eleventh embodiment includes a thermal radiation promoting sheet 62 instead of the one described in the tenth embodiment. Figure 15 The graphite sheet 61 shown is otherwise largely the same as in the fifteenth embodiment described above. The heat radiation promoting sheet 62 is the same as in the ninth embodiment described above. Figure 14 The heat radiation promoting sheet 62 shown is identical to the one shown, overlapping with the logic chip 30 when viewed from above and connected to the first facet S1 (surface portion of the multilayer wiring layer 72) of the base component 10K. Furthermore, the heat radiation promoting sheet 62 is made of, for example, black.

[0278] In the light detection module 1K according to this eleventh embodiment, the logic chip 30 is also separated from the core layer 71 of the base component 10K, and the logic chip 30 is covered by resin 74. Therefore, the heat dissipation path of the heat generated by the logic chip 30 mainly becomes the direction of the heat radiation promoting sheet 62 (heat dissipation path portion 60), which can promote thermal separation between the Peltier element 20 and the logic chip 30. Compared with the first embodiment described above, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20. Therefore, in the light detection module 1K according to this eleventh embodiment, as in the sixth embodiment described above, the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be further suppressed.

[0279] [Twelfth Implementation]

[0280] This twelfth embodiment is to... Figure 11 The sixth embodiment shown above and Figure 16 The above-described tenth embodiment is a combination of methods.

[0281] like Figure 17 As shown, the light detection module 1L according to the twelfth embodiment of the present technology includes: a base component 10L, a Peltier element 20 serving as a cooling device mounted on the base component 10L, a sensor chip 40 mounted on the base component 10L in a manner overlapping the Peltier element 20 when viewed from above, and a logic chip 30 mounted on the base component 10L that is spaced apart from the Peltier element 20 and the sensor chip 40 in the planar direction.

[0282] In addition, the light detection module 1L according to this twelfth embodiment also includes: a cap member 50 that is spaced apart from the Peltier element 20 and the sensor chip 40 and is mounted on the base member 10J covering the sensor chip 40; a heat radiation promoting sheet 62 that serves as a heat dissipation path 60; and a heat sink 65 that serves as a heat dissipation member.

[0283] like Figure 17 As shown, the base component 10L is not limited to this, but may include, for example, a core layer 71 having a first facet 71x and a second facet 71y located on opposite sides, a multilayer wiring layer 72 disposed on the first facet 71x side of the core layer 71, and an opening 71a disposed on the core layer 71. In addition, the base component 10L also includes an opening 14.

[0284] Although not shown in detail, the core layer 71 may have, for example, a multilayer wiring structure consisting of multiple layers of an insulating layer made of ceramic material and wiring layers made of conductive material. The multilayer wiring layer 72 includes, for example, an insulating layer made of resin and wiring 72a made of conductive material. The multilayer wiring layer 72 of this twelfth embodiment is similar to that of the tenth embodiment described above. Figure 15The multilayer wiring layer 72 shown is not located in the area where the cap member 50 is mounted, but is selectively located on the first face 71x side of the core layer 71.

[0285] The core layer 71 has the same characteristics as in the sixth embodiment described above. Figure 11 The base component 10F shown has the same first recess 11, second recess 12, and opening (through hole) 14. Furthermore, in each of the first and second recesses 11 and 12, the frame 51 of the cap component 50 and the wiring substrate 25 are fixed in the same manner as in the sixth embodiment described above.

[0286] like Figure 17 As shown, the heat sink 65 is disposed on the second surface S2 side of the base component 10L in a manner that overlaps with the Peltier element 20 when viewed from above, and is fixed to the core layer 71 (base component 10L) by blocking the opening 14. The heat sink 65 is bonded to the second surface S2 side of the base component 10L by a resin layer 65a.

[0287] like Figure 17 As shown, the Peltier element 20 is disposed in the opening 14 of the base member 10L. Furthermore, the heat-generating side plate 22 of the Peltier element 20 is directly connected to the heat sink 65 without passing through the base member 10F.

[0288] The opening 71a extends from the second face 71y of the core layer 71 to the first face 71x and penetrates the core layer 71 in the thickness direction (Z direction).

[0289] Here, in this twelfth embodiment, the surface portion of the multilayer wiring layer 72 opposite to the core layer 71 side and the first surface portion 71x of the core layer 71 in the region where the multilayer wiring layer 72 is not selectively provided become the first surface portion S1 of the base member 10L. Furthermore, the second surface portion 71y of the core layer 71 becomes the second surface portion S2 of the base member 10L.

[0290] like Figure 17 As shown, the logic chip 30 is disposed in the opening 71a of the core layer 71 and mounted on the multilayer wiring layer 72 from the core layer 71 side. The logic chip 30 is fixed to the base component 10L with the pads disposed on its main surface 30x side electrically connected to the wiring 72a of the multilayer wiring layer 72 and its main surface 30x connected to the multilayer wiring layer 72.

[0291] In the light detection module 1L according to this twelfth embodiment, the logic chip 30 is also separated from the core layer 71 of the base component 10L, and the logic chip 30 is covered by resin 74. Therefore, the heat dissipation path of the heat generated by the logic chip 30 mainly becomes the direction of the heat radiation promoting sheet 62 (heat dissipation path portion 60), which can promote thermal separation between the Peltier element 20 and the logic chip 30. Compared with the first embodiment described above, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20. Therefore, in the light detection module 1L according to this twelfth embodiment, as in the sixth embodiment described above, the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be further suppressed.

[0292] Alternatively, a graphite sheet 61 can be used instead of a heat radiation promoting sheet 62 as the heat dissipation path section 60.

[0293] [Thirteenth Implementation Method]

[0294] This thirteenth embodiment is to... Figure 12 The seventh embodiment shown above and Figure 16 The above-described tenth embodiment is a combination of methods.

[0295] like Figure 18 As shown, the light detection module 1M according to the thirteenth embodiment of this technology includes: a base component 10M, a Peltier element 20 serving as a cooling device mounted on the base component 10M, a sensor chip 40 mounted on the base component 10M in a manner overlapping the Peltier element 20 when viewed from above, and a logic chip 30 mounted on the base component 10M that is spaced apart from the Peltier element 20 and the sensor chip 40 in the planar direction.

[0296] In addition, the light detection module 1M according to this thirteenth embodiment also includes: a cap member 50G that is spaced apart from the Peltier element 20 and the sensor chip 40 and is mounted on the base member 10M covering the sensor chip 40, and a heat radiation promoting sheet 62 that serves as a heat dissipation path 60.

[0297] In addition, the light detection module 1M according to this seventh embodiment also includes a heat sink 66 mounted on the base component 10M as a heat dissipation component.

[0298] like Figure 18 As shown, the base component 10M is not limited to this, but may include, for example, a core layer 71 having a first facet 71x and a second facet 71y located on opposite sides, a multilayer wiring layer 72 disposed on the first facet 71x side of the core layer 71, and an opening 71a disposed on the core layer 71.

[0299] like Figure 18As shown, the base component 10M is not limited to this, but may include, for example, a core layer 71 having a first facet 71x and a second facet 71y located on opposite sides, a multilayer wiring layer 72 disposed on the first facet 71x side of the core layer 71, and an opening (through hole) 17 and an opening 71a disposed on the core layer 71.

[0300] Although not shown in detail, the core layer 71 may have, for example, a multilayer wiring structure consisting of multiple layers of an insulating layer made of ceramic material and wiring layers made of conductive material. The multilayer wiring layer 72 includes, for example, an insulating layer made of resin and wiring 72a made of conductive material. The multilayer wiring layer 72 of this thirteenth embodiment is similar to that of the twelfth embodiment described above. Figure 17 The multilayer wiring layer 72 shown is not located in the area where the cap component 50G is mounted, but is selectively located on the first face 71x side of the core layer 71.

[0301] Here, in this thirteenth embodiment, the surface portion of the multilayer wiring layer 72 opposite to the core layer 71 side and the first surface portion 71x of the core layer 71 in the region where the multilayer wiring layer 72 is not selectively provided become the first surface portion S1 of the base member 10M. Furthermore, the second surface portion 71y of the core layer 71 becomes the second surface portion S2 of the base member 10M.

[0302] like Figure 18 As shown, for the heat sink 66, the main body 66A is inserted into the opening 17 of the core layer 71, and the flange 66B is fixed to the second surface 71y side of the core layer 71 (the second surface S2 side of the base component 10G).

[0303] like Figure 18 As shown, the sensor chip 40 is the same as in the seventh embodiment described above. On the first face S1 side of the base component 10M, the back face 40y side of the sensor chip 40 is fixed to the main body 66A of the heat sink 66 in a state where the chip mounting face side of the main body 66A of the heat sink 66 is located.

[0304] In addition, such as Figure 18 As shown, the Peltier element 20 is also the same as in the twelfth embodiment described above, so that the cooling side plate portion 21 is fixed to the heat sink 66 in a state where the connecting surface of the flange portion 66B side of the heat sink 66 is connected.

[0305] In addition, such as Figure 18 As shown, the cap component 50G is also fixed to the first surface S1 side (first surface 71x side of the core layer 71) of the base component 10M, similar to the seventh embodiment described above. The cap component 50G has a recess on its inner side, forming a chamber portion 57 together with the base component 10M. The sensor chip 40 is sealed in the chamber portion 57.

[0306] like Figure 18 As shown, the logic chip 30 is the same as in the thirteenth embodiment described above, disposed in the opening 71a of the core layer 71, and mounted on the multilayer wiring layer 72 from the core layer 71 side. The logic chip 30 is fixed to the base member 10H with the pads disposed on its main surface 30x side electrically connected to the wiring 72a of the multilayer wiring layer 72, and its main surface 30x connected to the multilayer wiring layer 72.

[0307] The logic chip 30 is covered by resin 74 at the opening 71a of the base component 10M. Furthermore, the logic chip 30 is separated from and isolated from the core layer 71 of the base component 10M.

[0308] like Figure 18 As shown, the heat radiation promoting sheet 62 overlaps with the logic chip 30 and is connected to the first surface S1 (surface portion of the multilayer wiring layer 72) of the base component 10M when viewed from above. Furthermore, the heat radiation promoting sheet 62 is made of, for example, black.

[0309] In the light detection module 1M according to this thirteenth embodiment, the logic chip 30 is also separated from the core layer 71 of the base component 10M, and the logic chip 30 is covered by resin 74. Therefore, the heat dissipation path of the heat generated by the logic chip 30 mainly becomes the direction of the heat radiation promoting sheet 62 (heat dissipation path portion 60), which can promote thermal separation between the Peltier element 20 and the logic chip 30. Compared with the first embodiment described above, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20. Therefore, in the light detection module 1M according to this thirteenth embodiment, as in the sixth embodiment described above, the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be further suppressed.

[0310] Alternatively, a graphite sheet 61 can be used instead of a heat radiation promoting sheet 62 as the heat dissipation path section 60.

[0311] [Fourteenth Implementation]

[0312] In this fourteenth embodiment, using Figure 19 and Figure 20 An example of applying the present technology related to the heat sink and thermal via to the optical detection module of the fourth embodiment described above will be described.

[0313] Figure 19 This is a schematic rear view of the lower surface side of the light detection module according to the fourteenth embodiment of the present technology. Figure 20 It is schematically shown in reverse along Figure 19 The longitudinal section diagram of the longitudinal section structure along section line a19-a19.

[0314] like Figure 19 and Figure 20 As shown, the light detection module 1N in the fourteenth embodiment of this technology has basically the same configuration as the light detection module 1D in the fourth embodiment described above, except for the following configurations.

[0315] That is, such as Figure 19 and Figure 20 As shown, the light detection module 1N according to the fourteenth embodiment of this technology also includes a heat sink 67 as a heat dissipation component and a heat dissipation via 68A.

[0316] like Figure 19 and Figure 20 As shown, the heat sink 67 is configured to overlap at least with the logic chip 30 when viewed from above, on the second surface S2 side of the base member 10D opposite to the Peltier element 20 side, in other words, on the side of the base member 10D opposite to the first surface S1 side. While the heat sink 67 of this fourteenth embodiment is not limited to this, it may, for example, have a rectangular planar shape, overlap with both the logic chip 30 and the Peltier element 20 when viewed from above, and extend across both the logic chip 30 and the Peltier element 20 when viewed from above. For example, a metal plate such as CuW with good thermal conductivity can be used as the heat sink 67.

[0317] like Figure 20 As shown, a heat dissipation via 68A is disposed in the base component 10D between the logic chip 30 and the heat sink 67, and extends in the thickness direction (Z direction) of the base component 10D. In this fourteenth embodiment, since the logic chip 30 is mounted on the recess 15 of the base component 10D via the interposer 35, the heat dissipation via 68A is disposed between the recess 15 of the base component 10D and the heat sink 67.

[0318] The heat dissipation via 68A can be spaced apart from the bump electrode 36 and the heat sink 67 of the interposer 35, or it can be connected to at least one of the bump electrode 36 and the heat sink 67. The heat dissipation via 68A is provided in the groove of the base component 10D and is made of a metal material with good thermal conductivity, such as Cu.

[0319] In addition, although multiple heat dissipation vias 68A are provided in this fourteenth embodiment, a heat dissipation via 68A with a larger cross-sectional shape can also be provided.

[0320] In the light detection module 1N according to this fourteenth embodiment, the heat generated by the logic chip 30 is transferred from the logic chip 30 to the heat dissipation via 68A via the bump electrode 31, the interposer layer 35, and the bump electrode 36. Then, the heat transferred to the heat dissipation via 68A is transferred to the heat sink 67. Next, the heat transferred to the heat sink 67 is dissipated (dissipated) to the outside air or other components. That is, the light detection module 1N according to this fourteenth embodiment is a heat dissipation structure that dissipates the heat generated by the logic chip 30 to the heat sink 67, which is different from the heat dissipation path section 60. By adopting such a heat dissipation structure, the heat generated by the logic chip 30 can be significantly dissipated from the second surface S2 side of the base member 10D, i.e., the back side of the package.

[0321] Furthermore, since the heat generated by the logic chip 30 can be significantly dissipated from the second surface S2 side of the base component 10D, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20. Therefore, according to the light detection module 1N of this fourteenth embodiment, the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be further suppressed.

[0322] Furthermore, there are no limitations on the planar dimensions or thickness of the heat sink 67, and the heat sink can be made larger than the planar dimensions of the base member 10D. However, as in this fourteenth embodiment, when lead pins 19 and the like are arranged as external terminals on the second surface S2 side of the base member 10D, it is preferable to set the planar dimensions or shape of the heat sink 67 taking into account the configuration of the external terminals.

[0323] Variations of the fourteenth embodiment

[0324] <Variation Example 14-1>

[0325] In the fourteenth embodiment described above, it is explained that... Figure 20 The diagram shows a base component 10D between the logic chip 30 and the heat sink 67 with a heat dissipation via 68A, but the heat dissipation via 68A can also be omitted. In this case, the heat generated by the logic chip 30 can still be dissipated from the second surface S2 side of the base component 10D. However, the heat dissipation efficiency will be lower compared to the case where the heat dissipation via 68A is provided.

[0326] <Variation Example 14-2>

[0327] Furthermore, in the fourteenth embodiment described above, it is explained that... Figure 20 The diagram shows a case where a heat dissipation via 68A is provided in the base component 10D between the logic chip 30 and the heat sink 67, but if... Figure 21As shown, a heat dissipation via 68B can also be provided in the base component 10D between the Peltier element 20 and the heat sink 67. In this case, the heat dissipation effect of the Peltier element 20 can be improved.

[0328] The heat dissipation via 68B can be spaced apart from the Peltier element 20 and the heat sink 67, or it can be connected to at least one of the Peltier element 20 and the heat sink 67. The heat dissipation via 68B is the same as the heat dissipation via 68A, and is provided in the groove of the base component 10D, and is made of a metal material with good thermal conductivity (e.g., Cu).

[0329] In this variation 14-2, heat dissipation via 68A is equivalent to a specific example of the "first heat dissipation via" of this technology, and heat dissipation via 68B is equivalent to a specific example of the "second heat dissipation via" of this technology.

[0330] <Variation Example 14-3>

[0331] Furthermore, in the fourteenth embodiment described above, a heat sink 67 was provided that overlaps with both the logic chip 30 and the Peltier element 20 when viewed from above. However, it is also possible to do so as described above. Figure 22 As shown, the heat sink is divided into a first heat sink 67A that overlaps with the logic chip when viewed from above, and a second heat sink 67B that overlaps with the Peltier element 20 when viewed from above. That is, in this variation 14-3, the heat sink 67A is provided, and the second heat sink 67B is provided on the side of the base member 10D opposite to the Peltier element 20 side, overlapping with the Peltier element 20 in the thickness direction (Z direction) of the base member 10D and spaced apart from the first heat sink 67A. In this case, thermal separation between the Peltier element 20 and the logic chip 30 can be facilitated.

[0332] In addition, in this case, the planar dimensions, planar shape, thickness, material, etc. of the first heat sink 67A and the second heat sink 67B can also be changed.

[0333] Alternatively, in this variation 14-3, a heat dissipation via 67A (first heat dissipation via) can be provided in the base component 10D between the logic chip 30 and the first heat sink 67A, and a heat dissipation via 68B (second heat dissipation via) can also be provided in the base component 10D between the Peltier element 20 and the second heat sink 67B.

[0334] <Variation Example 14-4>

[0335] In addition, in the fourteenth embodiment described above, the logic chip 30 is mounted to the recess 15 of the base component 10D via the interposer layer 35, but the mounting method of the logic chip 30 is not limited to the fourteenth embodiment described above.

[0336] For example, although not shown, the following mounting method may also be used: the logic chip 30 is face-up bonded to the bottom surface of the recess 15 of the base component 10D, and the pads of the logic chip 30 are electrically connected to the wiring of the base component 10D by wire bonding.

[0337] <Variation Example 14-5>

[0338] In addition, as a method of installing logic chips, such as Figure 23 As shown, the installation method can also be as follows: an opening 15a is provided on the bottom part of the recess 15 of the base component 10D, and the logic chip 30 is bonded to the heat sink 67 face-up through this opening 15a, and the electrode pads of the logic chip 30 are electrically connected to the wiring of the base component 10D through the bonding wire 15b.

[0339] <Variation Example 14-6>

[0340] In addition, in the fourteenth embodiment described above, the heat dissipation method is to sandwich the base member 10D between the Peltier element 20 and the heat sink 67, but the heat dissipation method of the Peltier element 20 is not limited to the fourteenth embodiment described above.

[0341] For example, such as Figure 24 As shown, the heat dissipation method can also be as follows: an opening 14 is provided in the base component 10D to replace the third recess 13, and the Peltier element 20 is connected to the heat sink 67 through this opening 14.

[0342] <Other Implementation Methods>

[0343] Furthermore, in the fourteenth embodiment described above, the technology related to the heat sink (67, 67A, 67B) and the heat dissipation vias (68A, 68B) was described as being applied to the fourth embodiment described above. However, the technology related to the heat sink (67, 67A, 67B) and the heat dissipation vias (68A, 68B) can also be applied to other embodiments other than the fourteenth embodiment described above.

[0344] [Fifteenth Implementation]

[0345] Next, use Figure 25 and Figure 26 The light detection module according to the fifteenth embodiment of this technology will be described.

[0346] Figure 25 This is a schematic plan view of the upper surface of the light detection module according to the fifteenth embodiment of the present technology.

[0347] Figure 26 It is schematically shown along Figure 25The longitudinal section diagram of the longitudinal section structure along the a25-a25 section line.

[0348] like Figure 25 and Figure 26 As shown, the optical detection module 1P involved in the fifteenth embodiment of this technology has basically the same configuration as the optical detection module 1A involved in the first embodiment described above, except that the mounting position of the logic chip 30 is different.

[0349] That is, such as Figure 25 and Figure 26 As shown, in this fifteenth embodiment, the logic chip 30 is located on the side of the base member 10 opposite to the Peltier element 20 side, that is, on the second surface S2 side of the base member 10 opposite to the first surface S1 side. It is disposed planarly apart from the Peltier element 20 and the sensor chip 40, and is mounted to the base member 10 via an interposer layer 35. By adopting this configuration, the space on the second surface S2 side of the base member can be effectively utilized, the decrease in cooling efficiency of the sensor chip 40 via the Peltier element 20 can be suppressed, and miniaturization of the package, i.e., miniaturization of the light detection module 1P, can be achieved.

[0350] [Sixteenth Implementation]

[0351] Next, use Figure 27 and Figure 28 The light detection module according to the sixteenth embodiment of this technology will be described.

[0352] Figure 27 This is a schematic diagram showing the back view of the lower surface (back side) of the light detection module according to the sixteenth embodiment of the present technology, opposite to the upper surface side.

[0353] Figure 28 It is a schematic representation of the direction along the vertically reversed direction. Figure 27 The longitudinal section diagram of the longitudinal section structure along section line a27-a27.

[0354] like Figure 27 and Figure 28 As shown, the light detection module 1Q according to the sixteenth embodiment of this technology has basically the same configuration as the light detection module 1P according to the fifteenth embodiment described above, except for the following configurations.

[0355] That is, such as Figure 27 and Figure 28As shown, the light detection module 1Q according to the sixteenth embodiment of the present invention further includes a first heat sink 69A, which is connected to the logic chip 30 on the side opposite to the interposer layer 35. Additionally, the light detection module 1Q according to the sixteenth embodiment of the present invention also includes a second heat sink 69B, which is disposed on the second surface S2 side of the base member 10 opposite to the Peltier element 20 side, i.e., on the side opposite to the first surface S1 side of the base member 10, overlapping the Peltier element 20 when viewed from above.

[0356] The first heat sink 69A is fixed to the back surface 30y of the logic chip 30 using an adhesive 75 with excellent thermal conductivity. The second heat sink 69B is fixed to the second surface S2 of the base component 10 using the same adhesive 75. For example, a metal plate with good thermal conductivity such as CuW can be used for both the first heat sink 69A and the second heat sink 69B.

[0357] In the light detection module 1Q according to this sixteenth embodiment, the heat generated by the logic chip 30 is transferred from the logic chip 30 to the first heat sink 69A. Then, the heat transferred to the first heat sink 69A is dissipated (dissipated) from the first heat sink 69A to the external air or other components. That is, the light detection module 1Q according to this sixteenth embodiment has a heat dissipation structure that dissipates the heat generated by the logic chip 30 to the first heat sink 69A. By adopting such a heat dissipation structure, the heat generated by the logic chip 30 can be significantly dissipated from the second surface S2 side of the base component 10, i.e., the back side of the package.

[0358] Furthermore, the logic chip 30 is mounted on the second face S2 side of the base component 10 via the interposer 35 and is thermally separated from the base component 10. Therefore, according to the light detection module 1Q of this sixteenth embodiment, the heat generated by the logic chip 30 is not easily transferred to the Peltier element 20, and the heat generated by the logic chip 30 can be significantly dissipated from the second face S2 side of the base component 10.

[0359] Furthermore, since the heat generated by the logic chip 30 can be significantly dissipated from the second surface S2 side of the base component 10, the heat generated by the logic chip 30 is less likely to be transferred to the Peltier element 20. Therefore, according to the light detection module 1Q of this sixteenth embodiment, the decrease in cooling efficiency of the sensor chip 40 through the Peltier element 20 can be further suppressed.

[0360] Furthermore, in the light detection module 1Q according to this sixteenth embodiment, the heat from the heat-generating side plate portion 22 of the Peltier element 20 is transferred to the second heat sink 69B via the base member 10. Then, the heat transferred to the second heat sink 69B is dissipated (dissipated) from the second heat sink 69B to the external air or other components. That is, the light detection module 1Q according to this sixteenth embodiment has a heat dissipation structure that dissipates the heat generated by the sensor chip 40 to the second heat sink 69B. By employing such a heat dissipation structure, the heat from the heat-generating side plate portion 22 of the Peltier element 20 can be easily dissipated (released) to the outside of the light detection module 1Q, thereby improving the cooling effect of cooling the sensor chip 40 through the Peltier element 20.

[0361] Furthermore, in the sixteenth embodiment described above, a first heat sink 69A overlapping the logic chip 30 in the thickness direction (Z direction) of the base member 10 and a second heat sink 69B overlapping the sensor chip 40 in the thickness direction (Z direction) of the base member 10 are described on the second surface S2 side. However, this technology is not limited to this sixteenth embodiment, and at least one of the first heat sink 69A and the second heat sink 69B may be provided.

[0362] Furthermore, in the sixteenth embodiment described above, a first heat sink 69A overlapping the logic chip 30 in the thickness direction (Z direction) of the base member 10 and a second heat sink 69B overlapping the sensor chip 40 in the thickness direction (Z direction) of the base member 10 are described on the second surface S2 side. However, this technology is not limited to this sixteenth embodiment, and at least one of the first heat sink 69A and the second heat sink 69B may be provided.

[0363] [Seventeenth Implementation]

[0364] Next, use Figure 29 This describes the light detection module involved in the seventeenth embodiment of the present technology.

[0365] Figure 29 This is a schematic longitudinal cross-sectional view showing the longitudinal cross-sectional structure of the optical detection module according to the seventeenth embodiment of the present technology.

[0366] like Figure 29 As shown, the light detection module 1R according to the seventeenth embodiment of this technology has basically the same configuration as the light detection module 1Q according to the sixteenth embodiment described above, except for the following configurations.

[0367] That is, such as Figure 29As shown, in the seventeenth embodiment of the present invention, the base component 10 has a recess 16 that is recessed from the second surface S2 side to the first surface S1 side. Furthermore, a logic chip 30 and an interposer layer 35 are disposed in the recess 16, and the logic chip 30 is mounted on the bottom surface of the recess 16 via the interposer layer 35.

[0368] Furthermore, the light detection module 1R according to this seventeenth embodiment includes a heat sink 69 instead of the one described in the sixteenth embodiment. Figure 28 The first heat sink 69A and the second heat sink 69B are shown.

[0369] The heat sink 69 is disposed on the second surface S2 side of the base component 10 opposite to the Peltier element 20 side, that is, on the side of the base component 10 opposite to the first surface S1 side, in such a way that it overlaps with the logic chip 30 and the Peltier element 20 when viewed from above, and extends across the logic chip 30 and the Peltier element 20 when viewed from above. Furthermore, the heat sink 69 is connected and fixed to the second surface S2 of the base component 10 and the back surface 30y of the logic chip 30 respectively via adhesive 75.

[0370] In the light detection module 1R according to this seventeenth embodiment, the same effect as that of the light detection module 1Q according to the sixteenth embodiment can also be obtained.

[0371] Furthermore, for the light detection module 1R according to this seventeenth embodiment, the logic chip 30 and the interposer layer 35 are disposed in the recess 16 on the second face S2 side of the base member 10, so the thickness of the package in the Z direction can be reduced, and the light detection module 1R can be made thinner.

[0372] Furthermore, the recess 16 can be defined as a spatial portion. And the logic chip 30 can be configured such that at least a portion of it is located within the spatial portion (recess 16) provided on the base member 10.

[0373] Installation status of the optical detection module

[0374] Figure 30 It shows that Figure 29 The diagram shows the state of the optical detection module mounted on the mounting substrate of the electronic device, which is related to... Figure 25 The longitudinal section view at the same location as the a25-a25 section line.

[0375] Figure 31 It shows that Figure 29 The diagram shows the state of the optical detection module mounted on the mounting substrate of the electronic device, which is related to... Figure 25 The longitudinal section view at the same location as the b25-b25 section line.

[0376] like Figure 30 and Figure 31 As shown, the light detection module 1R is mounted on the mounting substrate 76 and assembled into the housing 77 of the electronic device. At this time, the light detection module 1R is assembled into the housing 77 with the heat sink 69 connected to it. Therefore, heat transferred to the heat sink 69 is dissipated (dissipated) to the housing 77 via the heat sink 69. Thus, according to the light detection module 1R of this seventeenth embodiment, the cooling effect of the logic chip 30 can be improved, and the cooling efficiency of the Peltier element 20 can be improved.

[0377] In addition, since the logic chip 30 is mounted in the recess 16 of the base component 10, the heat sink 69 can be flattened, reducing the difficulty of connecting the heat sink 69 to the housing 77.

[0378] Furthermore, there are cases where the heat sink 69 is pre-installed on the base component 10 before product shipment, and cases where the heat sink 69 is installed on the base component 10 during assembly of the housing 77. Therefore, by adopting the mounting method of mounting the logic chip 30 on the recess 16 on the second face S2 side of the base component 10, it is possible to handle both cases where the heat sink 69 is pre-installed on the base component 10 before product shipment and cases where the heat sink 69 is installed on the base component 10 during assembly of the housing 77.

[0379] [Eighteenth Implementation Method]

[0380] Next, use Figure 32 and Figure 33 The optical detection module according to the eighteenth embodiment of this technology will be described.

[0381] Figure 32 This is a schematic top view of the upper surface of the light detection module according to the eighteenth embodiment of the present technology. Figure 33 It is schematically shown along Figure 32 The longitudinal section diagram of the longitudinal section structure along the a32-a32 section line.

[0382] like Figure 32 and Figure 33 As shown, the light detection module 1S according to the eighteenth embodiment of this technology is basically the same as described above. Figure 14 The light detection module 1I shown in the ninth embodiment has the same configuration, but the following configurations are different.

[0383] That is, such as Figure 32 and Figure 33As shown, the optical detection module 1S according to the eighteenth embodiment of this technology also includes an intermediate wiring substrate 80. Furthermore, the configuration of the base component 10I is different, and the mounting method of the logic chip 30 is also different. The intermediate wiring substrate 80 mediates (relays) the electrical connection between the base component 10I and the logic chip 30. The intermediate wiring substrate 80 can also be referred to as a circuit board.

[0384] like Figure 32 and Figure 33 As shown, the light detection module 1S according to this eighteenth embodiment is the same as that in the fourteenth embodiment described above, and includes: a base member 10I, a Peltier element (cooling device) 20 and a sensor chip 40 that are mounted on the base member 10I in the thickness direction (Z direction) when viewed from above, and a logic chip 30 that is mounted on the base member and spaced apart from the Peltier element 20 and the sensor chip 40 in the planar direction. Furthermore, the light detection module 1S according to this eighteenth embodiment also includes an intermediate wiring substrate 80 mounted on the base member 10I.

[0385] like Figure 32 and Figure 33 As shown, the intermediate wiring substrate 80 has a first portion 81 fixed to the base member 10I and a second portion 82 extending from the first portion 81 along the thickness direction (Z direction) of the base member 10I. In this eighteenth embodiment, the first portion 81 is, for example, fixed to the first surface S1 side of the base member 10I and, when viewed from above, spans the side surface S3 of the base member 10I. The second portion 82 is, for example, spaced apart from the side surface S3 of the base member 10I and adjacent to the side surface S3 of the base member 10I.

[0386] The intermediate wiring substrate 80 is composed of a rigid wiring substrate 80A, such as a molded circuit component (MID) having connection terminals on its surface. As the rigid wiring substrate 80A, a resin substrate with low thermal conductivity is preferably used.

[0387] like Figure 32 and Figure 33 As shown, the logic chip 30 is mounted on the second portion 82 of the intermediate wiring substrate 80. That is, the main surface area 30x of the logic chip 30 is along the thickness direction (Z direction) of the base member 10I. In other words, the logic chip 30 is arranged in a direction perpendicular to the two-dimensional plane of the base member 10I.

[0388] like Figure 32 and Figure 33 As shown, a cooling device 83 connected to the logic chip 30 is provided on the side opposite to the intermediate wiring substrate 80.

[0389] In the light detection module 1I according to this eighteenth embodiment, since the logic chip 30 is mounted on the base member 10I via the intermediate wiring substrate 80, thermal separation between the base member 10I and the logic chip 30 can be facilitated by the intermediate wiring substrate 80, making it difficult for the heat generated by the logic chip 30 to be transferred to the base member 10I. Therefore, according to the light detection module 1S according to this eighteenth embodiment, the decrease in cooling efficiency of the sensor chip 40 cooled by the Peltier element 20 can be suppressed. In addition, warping of the base member 10I can also be suppressed.

[0390] Furthermore, since the logic chip 30 is mounted on the base component 10I with its main face (mounting face) 30x along the thickness direction (Z direction) of the base component 10I, compared with the case where the logic chip 30 is mounted on the base component 10I with its main face 30x facing the first face S1 of the base component 10I, miniaturization of the package, i.e., miniaturization of the light detection module 1S, can be achieved.

[0391] Variations of the eighteenth embodiment

[0392] <Variation Example 18-1>

[0393] like Figure 34 As shown, a heat sink 84, which is connected to both the side portion S3 of the base component 10I and the second portion 82 of the intermediate wiring substrate 80, can also be provided between the side portion S3 of the base component 10I and the second portion 82 of the intermediate wiring substrate 80. In this case, the heat dissipation effect of the heat generated by the logic chip 30 can be improved.

[0394] Alternatively, a heat dissipation via 82a can be provided in the second portion 82 of the intermediate wiring substrate 80 to facilitate the transfer of heat from the logic chip 30 to the heat sink 84. In this case, the heat dissipation effect of the heat generated by the logic chip 30 can be further improved.

[0395] <Variation Example 18-2>

[0396] In the above-described eighteenth embodiment, the case in which the first portion 81 of the intermediate wiring substrate 80 is fixed to the first surface S1 side of the base member 10I is described, but the fixing of the first portion 81 of the intermediate wiring substrate 80 is not limited to this eighteenth embodiment.

[0397] For example, such as Figure 35As shown, the first portion 81 of the intermediate wiring substrate 80 can also be fixed to the second surface S2 side of the base member 10I, which is opposite to the first surface S1. The second portion 82 of the intermediate wiring substrate 80 is adjacent to the side surface S3 of the base member 10I. In this case, the same effect as in the eighteenth embodiment described above can be obtained.

[0398] <Variation Example 18-3>

[0399] Furthermore, when the first portion 81 of the intermediate wiring substrate 80 is fixed to the second face S2 side of the base member 10I, as... Figure 36 As shown, the second portion 82 of the intermediate wiring substrate 80 may also extend away from the base component 10I in the thickness direction (Z direction) of the base component 10I.

[0400] <Variation Example 18-4>

[0401] In the above embodiment 18, the case where the intermediate wiring substrate 80 is composed of a rigid wiring substrate 80A was described, but the intermediate wiring substrate 80 can also be as follows: Figure 37 The example shown is constructed from a flexible wiring substrate 80B. In this case, the same effect as in the eighteenth embodiment described above can be obtained. Furthermore, in this variation 18-3, a heat sink 84 or heat dissipation vias 82a can be provided in the same manner as in variation 18-1.

[0402] <Other Implementation Methods>

[0403] Furthermore, while the eighteenth embodiment described above illustrates the application of the technology related to the intermediate wiring substrate 80 to the ninth embodiment, the technology related to the intermediate wiring substrate 80 can also be applied to the other embodiments described above. For example, such as Figure 38 As shown, the technology related to the intermediate wiring substrate 80 can be applied to the first embodiment described above. Furthermore, although not shown, the technology related to the intermediate wiring substrate 80 can also be applied to other embodiments described below the first embodiment.

[0404] [Nineteenth Implementation]

[0405] In this nineteenth embodiment, using Figure 39 This section describes an example of applying the present technology, related to the flow holes of the liquid metal component and the base component, to the optical detection module of the fourth embodiment described above.

[0406] like Figure 39 As shown, the light detection module 1T according to the nineteenth embodiment of this technology is basically the same as the light detection module 1D according to the fourth embodiment described above (refer to...). Figure 8 The following structures are different, even though they have the same basic structure.

[0407] That is, such as Figure 39 As shown, the light detection module 1T according to the nineteenth embodiment of this technology further includes: a liquid metal component 90 as a heat transfer component, which fills the recess 15 of the base component 10D in a manner covering the logic chip 30, and has a heat transfer rate higher than that of the base component 10D; and a cover component 91, which blocks the opening side of the recess 15 and is fixed to the first surface S1 side of the base component 10D. Furthermore, the base component 10D of this nineteenth embodiment also includes: an opening 15c provided on the first surface S1 side of the base component 10D, and a flow hole (communication hole) 15d communicating with the opening 15c and the recess 15 respectively. Furthermore, in this nineteenth embodiment, a graphite sheet 61 serving as a heat dissipation path 60 is fixed to the cover component 91, and the opening 15c of the base component 10D is blocked by the graphite sheet 61.

[0408] Furthermore, in this nineteenth embodiment, an underfill resin 32 is filled between the logic chip 30 and the interposer 35, and an underfill resin 37 is filled between the bottom surface of the recess 15 and the interposer 35. The underfill resin 32 includes a bump electrode 31, which electrically insulates the bump electrode 31 from the liquid metal component 90. The underfill resin 37 also includes a bump electrode 36, which electrically insulates the bump electrode 36 from the liquid metal component 90.

[0409] The liquid metal component 90 is a substance in which a metal powder with excellent electromagnetic wave shielding properties is mixed into a liquid metal. The metal powder with excellent electromagnetic wave shielding properties can be, for example, silver (Ag), copper (Cu), or nickel (Ni). The liquid metal can be, for example, gallium (Ga), indium (In), or tin (Sn) based liquid metals. This liquid metal component 90 possesses excellent electromagnetic wave shielding and thermal conductivity properties.

[0410] Here, the liquid metal component 90 is equivalent to a specific example of the "heat transfer component" of this technology.

[0411] In the base component 10D, an opening 15c is provided on the first surface S1 of the base component 10D, spaced apart from the recess 15. For the flow hole 15d, one end communicates with the opening 15c, and the other end, opposite to that end, communicates with the recess 15. The flow hole 15d has: a longitudinal portion extending in the thickness direction (depth direction: Z direction) from the first surface S1 (opening 15c) side of the base component 10D toward the second surface S2 side, and a transverse portion extending from the longitudinal portion toward the recess 15.

[0412] like Figure 39As shown, in this nineteenth embodiment, since the recess 15 of the base member 10D is provided on the first surface S1 side of the base member 10D, the cover member 91 covering the opening side of the recess 15 is also provided on the first surface S1 side of the base member 10D. Furthermore, the opening 15c of the base member 10D is blocked by a graphite sheet 61, which serves as a heat dissipation path 60, provided on the side of the cover member 91 opposite to the side of the liquid metal member 90. The cover member 91 is preferably made of a material with high thermal conductivity, such as ceramic or metal. The cover member 91 of this nineteenth embodiment is, for example, made of a flat plate.

[0413] Manufacturing method of optical detection module

[0414] Next, use Figures 40A to 40H The manufacturing method of the optical detection module 1T according to this nineteenth embodiment will be described. In this nineteenth embodiment, the sealing of the logic chip 30 included in the manufacturing method of the optical detection module 1T will be specifically described.

[0415] First, prepare Figure 40A The base component 10D is shown. The base component 10 has a first surface S1 and a second surface S2 located on opposite sides, and each has a first recess 11, a second recess 12, and a third recess 13 arranged sequentially from the first surface S1 side toward the second surface S2 side. Furthermore, the base component 10D of this nineteenth embodiment also has a recess 15 and an opening 15c provided on the first surface S1 side, and a flow hole 15d communicating with the recess 15 and the opening 15c respectively.

[0416] Next, as Figure 40B As shown, similar to the first embodiment described above, the Peltier element 20 is fixed to the third recess 13 of the base member 10, and the wiring substrate 25 is fixed to the second recess 12. Alternatively, a base member 10D in which the Peltier element 20 and the wiring substrate 25 are pre-fixed to the third recess 13 and the second recess 12, respectively, can also be used.

[0417] Next, as Figure 40C As shown, a logic chip 30 is mounted on the bottom surface of the recess 15 of the base member 10 via an interposer layer 35. The mounting of the logic chip 30 is performed by mounting the interposer layer 35, on which the logic chip 30 is pre-mounted, onto the first surface S1 (bottom surface of the recess 15) of the base member 10D. Furthermore, the mounting of the interposer layer 35 is performed by melting and solidifying the bump electrodes 36. Then, after mounting the interposer layer 35, as... Figure 40C As shown, a bottom filling resin 37 containing a bump electrode 36 is filled between the bottom surface of the recess 15 of the base component 10D and the intermediate layer 35.

[0418] The internal circuitry mounted on the logic chip 30 is electrically connected to the wiring of the interposer layer 35 via bump electrodes 31. Additionally, an underfill resin 32 containing the bump electrodes 31 is filled between the logic chip 30 and the interposer layer 35.

[0419] In this process, the wiring of the interposer 35 is electrically connected to the wiring of the base component 10 via the bump electrode 36.

[0420] In addition, during this process, the internal circuitry of the logic chip 30 is electrically connected to the wiring of the base component 10 via the bump electrode 31, the wiring of the interposer layer 35, and the bump electrode 36.

[0421] Next, as Figure 40D As shown, similar to the first embodiment described above, the sensor chip 40 is mounted on the side of the wiring substrate 25 opposite to the Peltier element 20 side. The sensor chip 40 is mounted by bonding and fixing the sensor chip 40 to the wiring substrate 25 with an adhesive layer 41 sandwiched between the back side of the sensor chip 40 and the mounting surface side of the wiring substrate 25, and then electrically connecting the pads of the sensor chip 40 to the pads of the wiring substrate 25 with bonding wires 42.

[0422] Next, as Figure 40E As shown, similar to the first embodiment described above, the frame 51 of the cap component 50 is glued and fixed to the first recess 11 of the base component 10.

[0423] Next, liquid metal component 90 is injected into the recess 15 of the base component 10D, such as... Figure 40F As shown, the back surface 30y and side surface of the logic chip 30 are covered with liquid metal component 90. Regarding the injection of the liquid metal component 90, the recess 15 is filled with the liquid metal component 90 so that no gap is formed between the liquid metal component 90 and the cover component 91 when the opening side of the recess 15 is blocked by the cover component 91 in a subsequent process.

[0424] Next, as Figure 40G As shown, a cover member 91 is fixed to the first face S1 side of the base member 10D, blocking the opening side of the recess 15. The cover member 91 is fixed by pressing the liquid metal member 90 with the cover member 91.

[0425] In this process, the liquid metal component 90 flows into the flow hole 15d by pressing the cover component 91. Therefore, the cover component 91 can block the opening side of the recess 15 when the liquid metal component 90 fills the recess 15, or in other words, when there is no gap between the liquid metal component 90 and the cover component 91.

[0426] Next, as Figure 40HAs shown, a graphite sheet 61 is attached to the face of the cover member 91 on the side opposite to the liquid metal member 90, and the opening 15c of the base member 10D is blocked with the graphite sheet 61.

[0427] Through this process, the logic chip 30 is sealed in the recess 15 of the base component 10D with the back portion 30y and side portion of the logic chip 30 covered by the liquid metal component 90.

[0428] Main effects of the nineteenth embodiment

[0429] Because the logic chip 30 is driven at high speed, electromagnetic noise is easily generated depending on the driving conditions. This noise can affect the image quality performance of the light detection module when the logic chip 30, Peltier element 20, and sensor chip 40 are mounted together on the same base component 10D. Furthermore, if the logic chip 30 is small, its heat dissipation is reduced.

[0430] In this regard, the light detection module 1T according to the nineteenth embodiment covers the back surface 30y and side surface of the logic chip 30 with a liquid metal component 90. Therefore, the propagation of electromagnetic noise generated by the driving of the logic chip 30 can be suppressed; in other words, electromagnetic noise from the logic chip can be suppressed. Even when the logic chip 30, Peltier element 20, and sensor chip 40 are mounted together on the same base component 10D, the impact on image quality performance can be suppressed. Furthermore, since the back surface 30y and side surface of the logic chip 30 are covered with the liquid metal component 90, the liquid metal component 90 functions as a heat sink, thus improving heat dissipation.

[0431] Furthermore, regarding the light detection module 1T according to this nineteenth embodiment, since the base member 10D has an opening 15c that is connected to the recess 15 via the flow hole 15d, it is possible to block the opening side of the recess 15 with the cover member 91 when the liquid metal member 90 has filled the recess 15, in other words, when there is no gap between the liquid metal member 90 and the cover member 91.

[0432] Furthermore, in the light detection module 1T according to this nineteenth embodiment, since the opening 15c, which is connected to the recess 15 of the base member 10D via the flow hole 15d, is blocked by the graphite sheet 61, the outflow of the liquid metal member 90 filling the recess 15 can be suppressed. In addition, since there is no need to block the opening 15c with a new component, the manufacturing cost can be reduced.

[0433] Furthermore, in this nineteenth embodiment, an example of applying the present technology related to the flow hole portion 15d of the liquid metal component 90 and the base component 10D to the fourth embodiment described above has been described. However, the present technology related to the flow hole portion 15d of the liquid metal component 90 and the base component 10D can also be applied to other embodiments other than the fourth embodiment described above.

[0434] [Twentieth Implementation]

[0435] like Figure 41 As shown, the optical detection module 1U in the twentieth embodiment of this technology has basically the same configuration as the optical detection module 1T in the nineteenth embodiment described above, except that the configuration of the cover component 91 is different.

[0436] That is, such as Figure 41 As shown, the cover member 91 of this twentieth embodiment has a through hole 91a extending through the cover member 91 in its thickness direction. The through hole 91a communicates with the recess 15 when the cover member 91 blocks the opening side of the recess 15. In this twentieth embodiment, the opening 15c of the base member 10D serves as an injection port for injecting liquid metal member 90 into the recess 15, and the through hole 91a of the cover member 91 serves as a vent.

[0437] The through hole 91a of the cover component 91 and the opening 15c of the base component 10D are blocked by graphite sheet 61.

[0438] Manufacturing method of optical detection module

[0439] Next, specifically regarding the sealing of the logic chip included in the manufacturing method of the optical detection module 1U according to this nineteenth embodiment, using... Figures 42A to 42C Please provide an explanation.

[0440] First, perform the same steps as in the nineteenth embodiment described above, such as... Figure 42A As shown, Peltier element 20, wiring substrate 25, logic chip 30, interposer 35, sensor chip 40 and cap component are mounted on base component 10D.

[0441] Next, as Figure 42B As shown, a cover member 91 is fixed on the first face S1 side of the base member 10D and the opening side of the recess 15 is blocked.

[0442] In this process, although the logic chip 30 is mounted in the recess 15 via the interposer layer 35, the liquid metal component 90 has not yet been filled into the recess 15.

[0443] Next, liquid metal component 90 is injected into the recess 15 through the flow hole 15d from the opening 15c of the base component 10D, such as... Figure 42C As shown, the back portion 30y and side portion of the logic chip 30 are covered with liquid metal component 90, and the recess 15 is filled with liquid metal component 90.

[0444] In this process, since the cover member 91 is provided with a through hole 91a, the liquid metal member 90 can be injected into the recess 15 while the gas in the recess 15 is discharged to the outside through the through hole 91a. Therefore, the recess 15 can be filled with liquid metal member 90 without forming a gap between the cover member 91 and the liquid metal member 90.

[0445] Main effects of the 20th embodiment

[0446] In the light detection module 1U according to the twentieth embodiment, the same effect as that of the light detection module 1T according to the nineteenth embodiment can also be obtained.

[0447] Furthermore, in this twentieth embodiment, an example of applying the present technology related to the flow hole portion 15d of the liquid metal component 90 and the base component 10D to the fourth embodiment described above has been described. However, the present technology related to the flow hole portion 15d of the liquid metal component 90 and the base component 10D can also be applied to other embodiments other than the fourth embodiment described above.

[0448] [Twenty-first implementation]

[0449] In this twenty-first embodiment, using Figure 43 This technology, related to liquid metal components, is applied to the optical detection module of the eighth embodiment described above (see reference). Figure 13 Let me illustrate with an example.

[0450] like Figure 43 As shown, the optical detection module 1V according to the twenty-first embodiment of this technology has basically the same configuration as the optical detection module 1H according to the eighth embodiment described above, except for the following configurations.

[0451] That is, such as Figure 43As shown, the optical detection module 1V according to the twenty-first embodiment of this technology further includes: a liquid metal component 90, which fills the recess 71a of the base component 10H in a manner that covers the logic chip 30; and a heat sink 92 as a cover component, which is fixed to the second surface S2 side of the base component 10H in a manner that blocks the opening side of the recess 71a. Furthermore, the base component 10H of this twenty-first embodiment also includes: an opening 71b provided on the first surface S1 side of the base component 10H, and a flow hole (communication hole) 71c communicating with the opening 71b and the recess 71a respectively. Furthermore, in this twenty-first embodiment, the graphite sheet 61, which serves as the heat dissipation path 60, is fixed to the first surface S1 side of the base component 10H in a manner that overlaps with the logic chip 30 (recess 71a) when viewed from above, and the opening 71b of the base component 10H is blocked by the graphite sheet 61.

[0452] Furthermore, the base component 10H of this twenty-first embodiment also has a through hole 72b that penetrates the multilayer wiring layer 72 in its thickness direction and communicates with the recess 71a. The through hole 72b, together with the opening 71b, is blocked by a graphite sheet 61.

[0453] In the base component 10H, an opening 71b is provided on the first surface S1 of the base component 10H and is separated from the recess 71a when viewed from above. For the flow hole 71c, one end communicates with the opening 71b, and the other end, opposite to that end, communicates with the recess 71a. The flow hole 71c has: a longitudinal portion extending from the opening 71b toward the second surface S2 of the base component 10H in the thickness direction (depth direction: Z direction), and a transverse portion extending from the longitudinal portion toward the recess 71a.

[0454] like Figure 43 As shown, in this twenty-first embodiment, since the recess 71a of the base component 10H is provided on the second surface S2 side of the base component 10H, the heat sink 92 covering the opening side of the recess 71a is also provided on the second surface S2 side of the base component 10H. Furthermore, the opening 71b and the through hole 72b of the base component 10H are respectively blocked by a graphite sheet 61, which serves as a heat dissipation path 60, provided on the side of the base component 10H opposite to the heat sink 92 side.

[0455] The heat sink 92 has a flat portion and a plurality of fin portions disposed on the side opposite to the flat portion. Furthermore, the heat sink 92 blocks the opening side of the recess 71a with its flat portion located on the recess 71a side of the base member 10H.

[0456] In addition, in this twenty-first embodiment, the opening 71b of the base component 10H becomes the injection port for injecting the liquid metal component 90 into the recess 71a, and the through hole 72b becomes the vent hole.

[0457] Manufacturing method of optical detection module

[0458] Next, specifically regarding the sealing of the logic chip 30 included in the manufacturing method of the optical detection module 1V according to this twenty-first embodiment, using... Figures 44A to 44F Please provide an explanation.

[0459] First, prepare Figure 44A The base component 10H shown has a first surface S1 and a second surface S2 located on opposite sides. Furthermore, the base component 10H of this twenty-first embodiment also includes: a recess 71a provided on the second surface S2 side, an opening 71b provided on the first surface S1 side, and a flow hole 71c communicating with the recess 71a and the opening 71b respectively. Additionally, the base component 10H of this twenty-first embodiment also has a through hole 72b that penetrates multiple wiring layers 72 in its thickness direction (Z direction) and communicates with the outer side of the second surface S2 and the recess 71a respectively.

[0460] Additionally, a Peltier element 20 has been installed on the second face S2 side of the base component 10H.

[0461] Next, as Figure 44B As shown, a logic chip 30 is mounted on the bottom surface (multilayer wiring layer 72) of the recess 71a of the base component 10H.

[0462] Next, as Figure 44C As shown, the sensor chip 40 is mounted on the first face S1 side of the base component 10H in a manner that overlaps with the Peltier element 20 when viewed from above.

[0463] Next, as Figure 44D As shown, the cap component 50H is fixed on the first face S1 side of the base component 10H in a manner that overlaps with the sensor chip 40 when viewed from above. The base component 10H and the cap component 50H form a chamber portion 57, and the sensor chip 40 is sealed in the chamber portion 57.

[0464] Next, as Figure 44E As shown, a heat sink 92 is fixed on the second face S2 side of the base component 10H, and the opening side of the recess 71a is blocked.

[0465] Next, liquid metal component 90 is injected into the recess 71a through the flow hole 71c from the opening 71b of the base component 10H, as shown in the figure. Figure 44FAs shown, the back portion 30y and side portion of the logic chip 30 are covered with liquid metal component 90, and the recess 71a is filled with liquid metal component 90.

[0466] In this process, since the cover member 91 is provided with a through hole 72b, the liquid metal member 90 can be injected into the recess 71a while the gas in the recess 71a is discharged to the outside through the through hole 72b. Therefore, the liquid metal member 90 can fill the recess 71a without forming a gap between the bottom part of the recess 71a and the liquid metal member 90.

[0467] Through this process, the logic chip 30 is sealed in the recess 71a of the base component 10H with the back portion 30y and side portion of the logic chip 30 covered by the liquid metal component 90.

[0468] Main effects of the twenty-first embodiment

[0469] In the light detection module 1V according to the twenty-first embodiment, the same effect as that of the light detection module 1T according to the nineteenth embodiment can also be obtained.

[0470] Furthermore, in this twenty-first embodiment, an example of applying the present technology related to the flow hole portion 71c of the liquid metal component 90 and the base component 10H to the eighth embodiment described above has been described. However, the present technology related to the flow hole portion 71c of the liquid metal component 90 and the base component 10H can also be applied to other embodiments other than the eighth embodiment described above.

[0471] [Twenty-second implementation]

[0472] In this twenty-second embodiment, using Figure 45 An example of applying the technique of placing a liquid metal component 90w between the Peltier element 20 and the sensor chip 40 to the optical detection module of the nineteenth embodiment described above will be described.

[0473] like Figure 45 As shown, the light detection module 1W according to the twenty-second embodiment of this technology is basically the same as the light detection module 1T according to the nineteenth embodiment described above (refer to...). Figure 39 The following structures are different, even though they have the same basic structure.

[0474] That is, such as Figure 45As shown, the optical detection module 1W according to the twenty-second embodiment of this technology further includes: a frame 26 disposed between the wiring substrate 25 and the sensor chip 40, and a liquid metal component 90w filled inside the frame 26. The frame 26 is made of, for example, an adhesive resin for bonding and fixing the sensor chip 40 to the wiring substrate 25. That is, the frame 26 functions as an adhesive for bonding and fixing the sensor chip 40 to the wiring substrate 25, and also functions as a dam for retaining the liquid metal component 90w.

[0475] Furthermore, the wiring substrate 25 of this twenty-second embodiment also includes: a first opening 25a, which is provided on a first surface side of the sensor chip 40 and inside the frame 26 when viewed from above; a second opening 25b, which is provided on the first surface side of the sensor chip 40 and outside the frame 26 when viewed from above; and a flow hole 25c, which communicates with the first opening 25a and the second opening 25b respectively. The second opening 25b is blocked by the frame 51 of the cap member 50. In this twenty-second embodiment, the first opening 25a serves as the inlet for the liquid metal member 90w, and the second opening 25b serves as a vent.

[0476] The liquid metal component 90w is sealed by the wiring substrate 25, the sensor chip 40, and the housing 26. The same material as the liquid metal component 90 can be used for the liquid metal component 90.

[0477] Manufacturing method of optical detection module

[0478] Next, specifically regarding the sealing of the liquid metal component 90A included in the manufacturing method of the optical detection module 1W according to this twenty-second embodiment, using... Figures 46A to 46F Please provide an explanation.

[0479] First, the process includes installing Peltier elements 20 and wiring substrates 25 in the third and second recesses of the base component 10D, installing logic chips 30 in the recesses 15 of the base component 10D via the interposer 35, filling the recesses 15 of the base component 10D with liquid metal components 90, and blocking the opening side of the recesses 15 of the base component 10D with a cover component 91. Then, as... Figure 46A As shown, a frame 26 is formed on the chip mounting surface side of the wiring substrate 25 using adhesive resin. In this process, viewed from above, the first opening 25a of the wiring substrate 25 is located inside the frame 26, and the second opening 25b of the wiring substrate 25 is located outside the frame 26. Furthermore, the flow-through hole 25c extends across the inside and outside of the frame 26 when viewed from above. The first opening 25a is provided on the wiring substrate 25 in the area where the frame 51, to which the cap member 50 is bonded and fixed, is located.

[0480] Next, as Figure 46B As shown, the inside of the frame 26 is filled with liquid metal component 90W.

[0481] Next, as Figure 46C As shown, the sensor chip 40 is pressed onto the frame 26 and the sensor chip 40 is glued and fixed onto the wiring substrate 25.

[0482] In this process, due to the pressing of the sensor chip 40, excess liquid metal component 90W flows from the first opening 25a into the flow hole 25c. Therefore, the sensor chip 40 can be bonded and fixed to the wiring substrate 25 without forming a gap between the cover component 91 and the liquid metal component 90W, while the inside of the frame 26 is filled with the liquid metal component 90W.

[0483] In addition, through this process, a liquid metal component 90W can be placed between the wiring substrate 25 and the sensor chip 40, or in other words, between the Peltier element 20 and the sensor chip 40.

[0484] Next, as Figure 46D As shown, the pads 4 of the sensor chip 40 are electrically connected to the pads of the interposer layer 35 using bonding wire 42, and then as follows... Figure 46E As shown, the frame 51 is bonded and fixed to the first recess 11 of the base component 10D using the resin layer 56, and the frame 51 is used to block the second opening 25b of the wiring substrate 25.

[0485] Next, fix frame 52 to frame 51, and then as follows: Figure 46F As shown, the transparent plate 54 is glued and fixed to the frame 52 using the adhesive layer 53.

[0486] Through this process, a cap component 50 is formed that is fixed to the first face S1 side of the base component 10D.

[0487] In addition, this process can seal the Peltier element 20, the wiring substrate 25 and the sensor chip 40 in the chamber portion 57 formed by the base component 10D and the cap component 50.

[0488] Main effects of the twenty-second implementation method

[0489] In the light detection module 1W according to the twenty-second embodiment, the same effect as that of the light detection module 1T according to the nineteenth embodiment can also be obtained.

[0490] Furthermore, the light detection module 1W according to this twenty-second embodiment has a liquid metal component 90W between the Peltier element 20 and the sensor chip 40, thereby improving the cooling efficiency of cooling the sensor chip 40 through the Peltier element 20.

[0491] Furthermore, in this twenty-second embodiment, an example of applying the technique of setting a liquid metal component 90 between the Peltier element 20 and the sensor chip 40 to the nineteenth embodiment described above has been described. However, the technique of setting a liquid metal component 90 between the Peltier element 20 and the sensor chip 40 can also be applied to other embodiments besides the nineteenth embodiment described above.

[0492] [Twenty-third Implementation]

[0493] In this twenty-third embodiment, the conductive path (connection path) for electrically connecting the sensor chip and the base component will be described.

[0494] Figure 47 This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the twenty-third embodiment of the present technology.

[0495] like Figure 47 As shown, the light detection module 1X according to the twenty-third embodiment of this technology has basically the same configuration as the light detection module 1N according to the fourteenth embodiment described above, except for the following configurations.

[0496] That is, such as Figure 47 As shown, the light detection module 1X according to this twenty-third embodiment does not possess the features of the fourteenth embodiment described above. Figure 20 Instead of the wiring substrate 25 shown, the sensor chip 40 is bonded and fixed to the Peltier element 20 via the adhesive layer 41. Specifically, the sensor chip 40 is bonded and fixed to the cooling side plate portion 21 of the Peltier element 20 with its back side portion 40y located on the side of the Peltier element 20 via the adhesive layer 41.

[0497] In addition, such as Figure 47 As shown, the light detection module 1X according to this twenty-third embodiment includes a base component 10X and a cap component 50X to replace... Figure 20 The base component 10D and the cap component 50 are shown.

[0498] Base component 10X has essentially the same configuration as base component 10D, and is omitted. Figure 20 The first recess 11 is shown. Other components are generally the same as those of the base component 10D.

[0499] The cap part 50X is basically the same as Figure 20 The cap component 50 has the same structure, omitted. Figure 20The frame 51 is shown. Other components are generally the same as those of the cap component 50. The frame 52 of the cap component 50X is bonded and fixed to the first facet S1 of the base component 10X via a resin layer 56.

[0500] In addition, such as Figure 47 As shown, the light detection module 1X according to this twenty-third embodiment has a first conductive path 45A via the Peltier element 20 and a second conductive path 45B not via the Peltier element 20 as conductive paths (connection paths) for electrically connecting the sensor chip 40 and the base member 10X.

[0501] The first conductive path 45A includes: a relay connection portion (electrode pad) 21a disposed on the cooling side plate portion 21 of the Peltier element 20, a first bonding wire 42a electrically connecting the relay connection portion 21a to the bonding pad 4 (4a) which serves as the connection portion of the sensor chip 40, and a second bonding wire 42b electrically connecting the relay connection portion 21a to the component side connection portion 10a1 of the base component 10D.

[0502] The second conductive path 45B includes a bonding wire 42 that electrically connects the pad 4 (4b) of the sensor chip 40, which serves as the connection portion of the sensor chip 40, to the component-side connection portion 10a2 of the base component 10X without passing through the Peltier element 20.

[0503] The first and second pads 4a and 4b of the sensor chip 40 are contained within a plurality of pads 4 of the sensor chip 40. The relay connection portion 21a of the Peltier element 20 is electrically decoupled from the cooling side plate portion 21. The component-side connection portions 10a1 and 10b2 of the base component 10X are electrically connected to the wiring of the base component 10X, respectively.

[0504] Here, in the second conductive path 45B, since the sensor chip 40 is directly connected to the base component 10D by the bonding wire 42, when the temperature of the base component 10X is higher than the temperature of the sensor chip 40, heat reflow from the base component 10X to the sensor chip 40 is likely to occur.

[0505] In this regard, in the first conductive path 45A, since it passes through the Peltier element 20, the heat reflow from the base component 10X to the sensor chip 40 can be reduced without reducing the heat dissipation efficiency compared to the second conductive path 45B.

[0506] Furthermore, since the first conductive path 45A has an increased number of joints and a longer path length compared to the second conductive path 45B, it is preferable to use the second conductive path 45B as a transmission path for signals, clocks, etc., where high speed is important. Conversely, it is preferable to use the first conductive path 45A as a reference potential supply path for power supplies, grounding, etc., where high speed is not important.

[0507] According to the light detection module 1X of this twenty-third embodiment, the same effect as that of the light detection module 1N of the fourteenth embodiment can be obtained, and the heat reflow from the base component 10X to the sensor chip 40 can be reduced without reducing the heat dissipation efficiency.

[0508] Variations of the twenty-third embodiment

[0509] <Variation Example 23-1>

[0510] In the twenty-third embodiment described above, the case where a relay connection portion 21a is provided in the Peltier element 20 is described, but it is also possible to do so as follows: Figure 48A As shown, in a modified example 23-1, a wiring component 46 having a relay connection 21a is mounted on a Peltier element 20.

[0511] In this case, the first conductive path 45A includes: a relay connection portion (electrode pad) 21a disposed on the wiring component 46, a first bonding wire 42a electrically connecting the relay connection portion 21a to the pad 4 (4a) serving as the connection portion of the sensor chip 40, and a second bonding wire 42b electrically connecting the relay connection portion 21a and the component-side connection portion 10a1 of the base component 10X.

[0512] In this case, the same effect as the twenty-third embodiment described above can be achieved.

[0513] <Variation Example 23-2>

[0514] Furthermore, in the twenty-third embodiment described above, the use of Figure 47 The cap component shown is 50x instead. Figure 20 The case of the cap component 50 shown is different, but as... Figure 48B As shown, as a variation 23-2, the cap component 50 can also be used.

[0515] <Variation Example 23-3>

[0516] Furthermore, in the twenty-third embodiment described above, the technology related to the first conductive path 45A was described as being applied to the fourteenth embodiment described above, but the technology related to the first conductive path 45A can also be applied to other embodiments besides the fourteenth embodiment described above.

[0517] [Twenty-fourth Implementation]

[0518] In this twenty-fourth embodiment, the cooling path will be described.

[0519] Figure 49This is a schematic longitudinal cross-sectional view illustrating the longitudinal cross-sectional structure of the optical detection module according to the twenty-fourth embodiment of the present technology.

[0520] like Figure 49 As shown, the optical detection module 1Y in the twenty-fourth embodiment of this technology has basically the same configuration as the optical detection module 1N in the fourth embodiment described above, except for the following configurations.

[0521] That is, such as Figure 49 As shown, the optical detection module 1Y according to this twenty-fourth embodiment further includes a cooling medium supply path 95 disposed on the base member 10D and supplied with a cooling medium. Additionally, the optical detection module 1Y according to this twenty-fourth embodiment also includes a connection port 96 disposed on the base member 10D and communicating with the cooling medium supply path 95.

[0522] Figure 49 The diagram shows a state where the cooling medium supply pipe 97 is connected to the connection port 96 of the base component 10D, and the cooling medium supply source 98 is connected to the cooling medium supply path 95 of the base component 10D via the connection port 96 and the cooling medium supply pipe 97. Cooling water, cooling gas, etc., can be used as the cooling medium.

[0523] like Figure 49 As shown, the cooling medium supply path 95 is located between the first facet S1 and the second facet S2 of the base component 10D, and overlaps with the logic chip 30 and the Peltier element 20 respectively when viewed from above.

[0524] Since the optical detection module 1Y according to this twenty-fourth embodiment has a cooling medium supply path 95 in the base component 10D, the heat dissipation efficiency can be greatly improved by supplying cooling medium to the cooling medium supply path 95.

[0525] In addition, due to the increased heat capacity, it can also improve its tolerance to temperature changes.

[0526] Therefore, the light detection module 1Y according to this twenty-fourth embodiment can achieve the same effect as the light detection module 1N according to the fourth embodiment described above, and can significantly improve heat dissipation efficiency.

[0527] Furthermore, in the twenty-fourth embodiment described above, the technology related to the cooling medium supply path 95 was applied to the fourth embodiment described above, but the technology related to the cooling medium supply path 95 can also be applied to other embodiments besides the fourth embodiment described above.

[0528] [Twenty-fifth Implementation] Application examples in electronic devices

[0529] This technology (the technology disclosed herein) can be applied to various electronic devices such as digital cameras, digital camcorders, mobile phones with shooting functions, or other devices with shooting functions.

[0530] Figure 50 This is a diagram illustrating the schematic configuration of an electronic device (e.g., a camera) according to the twenty-third embodiment of the present technology.

[0531] like Figure 50 As shown, the electronic device 100 includes a solid-state imaging device 101, an optical lens 102, a shutter device 103, a drive circuit 104, and a signal processing circuit 105. This electronic device 100 illustrates an embodiment in which the light detection modules 1A-1Y according to the first embodiment of the present technology are used as the solid-state imaging device 101 in an electronic device (e.g., a camera).

[0532] Optical lens 102 causes the image light (incident light 106) from the subject to be imaged on the imaging surface of solid-state imaging device 101. As a result, signal charge accumulates within solid-state imaging device 101 for a certain period of time. Shutter device 103 controls the illumination time and shading time of solid-state imaging device 101. Drive circuit 104 supplies drive signals to control the transmission action of solid-state imaging device 101 and the shutter action of shutter device 103. Charge transfer in solid-state imaging device 101 is performed using the drive signal (timing signal) supplied from drive circuit 104. Signal processing circuit 105 performs various signal processing on the signal (pixel signal (image signal)) output from solid-state imaging device 101. The processed image signal is stored in a storage medium such as a memory or output to a monitor.

[0533] With this configuration, in the solid-state imaging device 101, the decrease in cooling efficiency of the sensor chip 40 by the Peltier element 20 (the decrease in cooling efficiency of the Peltier element 20 caused by the heat generated by the logic chip 30) can be suppressed, thereby improving the image reliability of the electronic device 100 of the twenty-fifth embodiment.

[0534] Furthermore, the electronic device 100, which is capable of applying the above-described embodiment to a solid-state imaging device, is not limited to a camera and can also be applied to other electronic devices. For example, it can also be applied to imaging devices such as camera modules suitable for mobile devices such as mobile phones or tablet terminals.

[0535] Furthermore, besides the solid-state imaging device described above as an image sensor, this technology can be widely applied to all light detection modules, including distance measuring sensors such as those called ToF (Time of Flight) sensors. A distance measuring sensor emits light towards an object, detects the reflected light from the object's surface, and calculates the distance to the object based on the time of flight from emitting the light to receiving the reflected light. The aforementioned light detection module can also be used in this distance measuring sensor.

[0536] Alternatively, this technology can also be configured as follows.

[0537] (1) A light detection module comprising: a base component; a cooling device and a sensor chip, which overlap and are mounted on the base component in one direction; and an active chip, which is mounted on the base component in a direction intersecting the one direction, spaced apart from the cooling device and the sensor chip.

[0538] (2) The optical detection module according to (1), wherein the active chip is mounted on the base component via an intermediary layer.

[0539] (3) The light detection module according to (1) or (2) further comprises: a heat dissipation path portion that is spaced apart from the base component and connected to the active chip.

[0540] (4) The light detection module according to (3) further comprises: a cap component covering the sensor chip and fixed to the base component via a resin layer, wherein the heat dissipation path is a graphite sheet connected to the active chip and the cap component respectively.

[0541] (5) The light detection module according to (3), wherein the heat dissipation path is a heat radiation promoting sheet connected to the side opposite to the intermediary layer side of the active chip.

[0542] (6) The light detection module according to any one of (2) to (5), wherein the active chip and the intermediary layer are respectively disposed in the recess provided on the base component.

[0543] (7) The light detection module according to any one of (2) to (6) further comprises a heat dissipation component, which is connected to the cooling device on the side opposite to the sensor chip side of the cooling device and fixed to the base component via a resin layer.

[0544] (8) The light detection module according to any one of (2) to (6) further comprises a heat dissipation component, which is connected between the cooling device and the sensor chip, respectively connected to the cooling device and the sensor chip, and fixed to the base component via a resin layer.

[0545] (9) The light detection module according to (8), wherein at least a portion of the heat dissipation component is located between the base components.

[0546] (10) The optical detection module according to (1), wherein the base component has: a core layer, an opening disposed in the core layer, and a multilayer wiring layer disposed on the side of the core layer opposite to the cooling device side and including an insulating layer and wiring, wherein the active chip is disposed in the opening spaced apart from the core layer and connected to the wiring of the multilayer wiring layer.

[0547] (11) The light detection module according to (10) further comprises: a cap component covering the sensor chip and fixed to the base component via a resin layer; and a graphite sheet connected to the multilayer wiring layer and the cap component respectively.

[0548] (12) The light detection module according to (10) further comprises: a heat radiation promoting sheet connected to the side opposite to the active chip side of the multilayer wiring layer.

[0549] (13) The light detection module according to (4) or (11), wherein the cap component has a frame fixed to the base component via the insulating layer, the frame comprising fused glass.

[0550] (14) The light detection module according to (4) or (11), wherein the cap component further comprises a transparent plate that overlaps with and is spaced apart from the sensor chip in one direction.

[0551] (15) The light detection module according to (1) further includes a heat sink, which is disposed on the side of the base component opposite to the cooling device side, in such a way that it overlaps with the active chip in one direction at least.

[0552] (16) The optical detection module according to (15) further comprises: a heat dissipation via of the base component disposed between the active chip and the heat sink.

[0553] (17) The light detection module according to (15), wherein the heat sink extends across the active chip and the cooling device and overlaps with the active chip and the cooling device respectively in the one direction.

[0554] (18) The optical detection module according to (17) further comprises: a first heat dissipation via disposed between the active chip and the heat sink of the base component; and a second heat dissipation via disposed between the cooling device and the heat sink of the base component.

[0555] (19) According to the light detection module of (15), wherein the heat sink is configured as a first heat sink and a second heat sink is further provided, wherein the second heat sink overlaps with the cooling device in one direction on the side opposite to the cooling device side of the base component and is spaced apart from the first heat sink.

[0556] (20) The optical detection module according to (19) further comprises: a first heat dissipation via disposed between the active chip and the first heat sink; and a second heat dissipation via disposed between the cooling device and the second heat sink.

[0557] (21) The light detection module according to any one of (15) to (20), wherein the active chip is mounted in the recess of the base component via an intermediary layer.

[0558] (22) The light detection module according to (1) further includes a heat sink, which is arranged on the cooling device side of the base component in such a way that it overlaps with the active chip in at least one direction, and the active chip is fixed to the heat sink through an opening in the bottom part of the recess of the base component.

[0559] (23) The optical detection module according to (1), wherein the active chip is mounted via an intermediary layer on the side of the base component opposite to the side on which the sensor chip is mounted.

[0560] (24) The light detection module according to (23), wherein the active chip is configured such that at least a portion of it is located within the space of the base component.

[0561] (25) The light detection module according to (23) further comprises: a heat sink that overlaps with the sensor chip in one direction.

[0562] (26) The light detection module according to (23) further comprises: a heat sink that overlaps with the active chip in one direction.

[0563] (27) The light detection module according to (23) further comprises: a first heat sink, which is connected to the active chip on the side opposite to the intermediary layer side of the active chip; and a second heat sink, which is disposed on the side opposite to the cooling device side of the base component in such a way that it overlaps with the cooling device when viewed from above.

[0564] (28) The light detection module according to any one of (23) to (27), wherein the active chip and the intermediary layer are respectively disposed in the recess provided on the base component.

[0565] (29) The light detection module according to (28) further includes a heat sink, which is disposed on the side of the base component opposite to the cooling device side in such a way that it overlaps with the cooling device and the active chip when viewed from above, and is respectively connected to the base component and the active chip.

[0566] (30) The optical detection module according to (1) further comprises an intermediate wiring substrate mounted on the base component, the intermediate wiring substrate having: a first portion fixed to the base component and a second portion extending from the first portion along the thickness direction of the base component, the active chip being mounted on the second portion of the intermediate wiring substrate.

[0567] (31) The light detection module according to (30), wherein the base component has a first face and a second face located on opposite sides of each other in one direction, and the first portion of the intermediate wiring substrate is fixed to the first face side or the second face side of the base component.

[0568] (32) The light detection module according to (31), wherein the second portion of the intermediate wiring substrate is adjacent to the side portion of the base component.

[0569] (33) The light detection module according to (32) wherein a heat sink is provided between the second part of the intermediate wiring substrate and the side part of the base component.

[0570] (34) The light detection module according to (31), wherein the second portion of the intermediate wiring substrate extends in the direction away from the base member in the one direction.

[0571] (35) The optical detection module according to any one of (30) to (34), wherein the wiring substrate is a rigid wiring substrate or a flexible wiring substrate.

[0572] (36) The light detection module according to any one of (30) to (34), wherein the intermediate wiring substrate is a molded circuit component having connection terminals on its surface.

[0573] (37) The optical detection module according to (1), wherein the base component has a recessed portion in the one direction, the active chip is mounted in the recessed portion of the base component, and a heat transfer component with a higher heat transfer rate than the base component is filled in the recessed portion of the base component to cover the active chip.

[0574] (38) The light detection module according to (37) further comprises: a cover component that blocks the opening side of the recess and is fixed to the base component.

[0575] (39) According to the light detection module of (38), wherein the base component further comprises: a first face and a second face located on opposite sides of each other in one direction, an opening provided on the first face, and a flow hole communicating with the opening and the recess respectively, the cover component being fixed to the first face side of the base component, and the opening of the base component being blocked by a heat dissipation path fixed on the cover component on the side opposite to the heat transfer component side.

[0576] (40) The light detection module according to (38) or (39), wherein the cover component has a through hole extending through the thickness direction of the cover component, and the through hole of the cover component is blocked by the heat dissipation path portion.

[0577] (41) According to the light detection module of (37), wherein the base component further comprises: a first face and a second face located on opposite sides of each other in one direction, an opening provided on the first face, and a flow hole communicating with the opening and the recess respectively, the cover component being fixed to the second face side of the base component, and the opening of the base component being blocked by a heat dissipation path fixed to the first face side.

[0578] (42) The light detection module according to any one of (37) to (41), wherein the heat transfer component is also disposed between the cooling device and the sensor chip.

[0579] (43) The optical detection module according to any one of (37) to (42), wherein the heat transfer component is a liquid metal component obtained by mixing metal powder with liquid metal.

[0580] (44) The light detection device according to any one of (1) to (43) further comprises: a conductive path that electrically connects the sensor chip to the base component via the Peltier element.

[0581] (45) The light detection device according to any one of (1) to (44) further comprises: a cooling medium supply path disposed on the base component.

[0582] (46) An electronic device comprising: a light detection module; an optical lens for imaging light from a subject onto an imaging surface of the light detection module; and a signal processing circuit for processing a signal output from the light detection module, the light detection module comprising: a base component; a cooling device and a sensor chip mounted on the base component, which overlap each other in the thickness direction of the base component when viewed from above; and an active chip mounted on the base component, which is spaced apart from the cooling device and the sensor chip in the planar direction.

[0583] The scope of this technology is not limited to the exemplary embodiments illustrated and described, but also includes all embodiments capable of achieving equivalent effects to the purpose of this technology. Furthermore, the scope of this technology is not limited to the combination of inventive features defined by the claims, but can be defined by any desired combination of specific features from all disclosed features.

[0584] Explanation of reference numerals in the attached figures

[0585] 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1I, 1J, 1K, 1L, 1M, 1N, 1P, 1Q, 1R, 1S, 1T, 1U, 1V, 1W, 1X, 1Y... Light detection module; 2A... Pixel array section; 2B... Peripheral section; 3... Sensor pixel; 4... Solder pad; 10, 10D, 10E, 10F, 10G, 10H, 10I, 10J, 10K, 10L, 10M... Base component; 10a1, 10a2... Component side connection section; 11... First recess; 12... Second recess; 13... Third recess; 14... Opening; 15... Recess; 15a... Opening; 15b... Solder pad Wire; 15c...Opening; 15d...Flow-through hole; 16...Recess; 17...Opening; 19...Lead pin; 20...Peltier element; 21...Cooling side plate; 21a...Relay connection; 22...Heating side plate; 23...Heat-moving layer; 25...Wiring substrate; 25a...First opening; 25b...Second opening; 25c...Flow-through hole; 26...Frame; 30...Logic chip; 30x...Main surface; 30y...Back surface; 31...Bump electrode; 32...Bottom filling resin; 35...Intermediate layer (wiring substrate); 36...Bump electrode; 37...Bottom filling resin; 40...Transfer Sensor chip; 40x...light incident face; 40y...back face; 41...adhesive layer; 42...bonding wire; 42a...first bonding wire; 42b...second bonding wire; 45a...first conductive path; 45b...second conductive path; 46...wiring component; 50, 50G, 50H, 50X...cap component; 51, 52...frame; 53...adhesive; 54...transparent plate; 56...resin layer; 57...chamber; 58...frame; 59...cover body; 59a...top plate; 59b...leg; 60...heat dissipation path; 61...graphite sheet; 62...heat radiation promoting sheet; 65, 66, 67, 67A 67B... Heat sink; 68A, 68B... Heat dissipation vias; 69, 69A, 69B... Heat sink; 71... Core layer; 71a... Recess; 71b... Opening; 71c... Flow hole; 72, 73... Multilayer wiring layer; 72a... Wiring; 72b... Through hole; 75... Adhesive; 76... Mounting substrate; 77... Housing; 80... Intermediate wiring substrate; 80A... Rigid wiring substrate; 80B... Flexible wiring substrate; 81... First part; 82... Second part; 82a... Heat dissipation via; 83... Cooling device; 84... Heat sink; 90, 90W... Liquid metal components; 91...Cover component; 91a...through hole; 92...heat sink; 95...cooling medium supply path; 96...connection port; 97...cooling medium supply pipe; 98...cooling medium supply source; 100...electronic equipment; 101...solid-state imaging device; 102...optical system (optical lens); 103...shutter device; 104...drive circuit; 105...signal processing circuit; S1...first face part; S2...second face part; S3...side part; Pv...passive component (driven component).

Claims

1. A light detection module, comprising: Base components; A cooling device and a sensor chip are overlapped and mounted on the base component in one direction; and An active chip is mounted on the base component in a direction intersecting the aforementioned direction, separated from the cooling device and the sensor chip.

2. The optical detection module according to claim 1, wherein, The active chip is mounted to the base component via an intermediary layer.

3. The optical detection module according to claim 2, wherein, The optical detection module also features: A heat dissipation path portion that is separated from the base component and connected to the active chip.

4. The optical detection module according to claim 3, wherein, The optical detection module also features: A cap component that covers the sensor chip and is fixed to the base component via a resin layer. The heat dissipation path is a graphite sheet that is connected to both the active chip and the cap component.

5. The optical detection module according to claim 3, wherein, The heat dissipation path is a heat radiation promoting sheet connected to the side of the active chip opposite to the interposer layer side.

6. The optical detection module according to claim 2, wherein, The active chip and the interposer layer are respectively disposed in the recess provided in the base component.

7. The optical detection module according to claim 2, wherein, The optical detection module also includes a heat dissipation component, which is connected to the cooling device on the side opposite to the sensor chip side of the cooling device and is fixed to the base component via a resin layer.

8. The optical detection module according to claim 1, wherein, The optical detection module also includes a heat sink, which is disposed on the side of the base component opposite to the cooling device side, in a manner that overlaps with the active chip at least in one direction.

9. The optical detection module according to claim 8, wherein, The optical detection module also includes heat dissipation vias provided in the base component between the active chip and the heat sink.

10. The optical detection module according to claim 8, wherein, The heat sink extends across the active chip and the cooling device, and overlaps with the active chip and the cooling device respectively in the one direction.

11. The optical detection module according to claim 10, wherein, The optical detection module also features: A first heat dissipation via is disposed between the active chip and the heat sink in the base component; and The second heat dissipation through hole is disposed on the base component between the cooling device and the heat dissipation plate.

12. The optical detection module according to claim 1, wherein, The optical detection module also includes a heat sink, which is configured on the cooling device side of the base component to overlap with the active chip in at least one direction. The active chip is fixed to the heat sink through an opening provided on the bottom surface of the recess in the base component.

13. The optical detection module according to claim 1, wherein, The active chip is mounted via an intermediary layer on the side of the base component opposite to the side on which the sensor chip is mounted.

14. The optical detection module according to claim 13, wherein, The optical detection module also features: A first heat sink is provided on the side of the active chip opposite to the side of the interposer layer, and is connected to the active chip; and The second heat sink is disposed on the side of the base component opposite to the cooling device side, in a manner that overlaps with the cooling device when viewed from above.

15. The optical detection module according to claim 13, wherein, The active chip and the interposer layer are respectively disposed in the recess provided in the base component.

16. The optical detection module according to claim 15, wherein, The optical detection module also includes a heat sink, which is disposed on the side of the base component opposite to the cooling device side, such that it overlaps with the cooling device and the active chip when viewed from above, and is respectively connected to the base component and the active chip.

17. The optical detection module according to claim 1, wherein, The optical detection module also includes an intermediate wiring substrate mounted on the base component. The intermediate wiring substrate has: a first portion fixed to the base component, and a second portion extending from the first portion along the thickness direction of the base component. The active chip is mounted on the second portion of the intermediate wiring substrate. The base component has a first facet and a second facet located on opposite sides of each other in one direction. The first portion of the intermediate wiring substrate is fixed to the first face side or the second face side of the base component.

18. The optical detection module according to claim 17, wherein, The second portion of the intermediate wiring substrate is adjacent to the side portion of the base component via a heat sink. The intermediate wiring substrate is a molded circuit component with connection terminals on its surface.

19. The optical detection module according to claim 17, wherein, The second portion of the intermediate wiring substrate extends in one direction away from the base member. The intermediate wiring substrate is a molded circuit component with connection terminals on its surface.

20. The optical detection module according to claim 17, wherein, The intermediate wiring substrate is a rigid wiring substrate or a flexible wiring substrate.

21. The optical detection module according to claim 1, wherein, The base component has a recess that is recessed in the said one direction. The active chip is mounted in the recess of the base component. A heat transfer component with a higher heat transfer rate than the base component is filled in the recess of the base component in a manner that covers the active chip.

22. The optical detection module according to claim 21, wherein, The optical detection module also includes a cover component that blocks the opening side of the recess and is fixed to the base component. The base component further comprises: a first facet and a second facet located on opposite sides of each other in one direction, an opening provided on the first facet, and a flow hole communicating with the opening and the recess respectively. The cover component is fixed to the first face side of the base component. The opening of the base component is blocked by a heat dissipation path, which is fixed to the side of the cover component opposite to the heat transfer component side. The cover component has a through hole extending through the thickness of the cover component. The through hole of the cover component is blocked by the heat dissipation path.

23. The optical detection module according to claim 21, wherein, The base component further comprises: a first facet and a second facet located on opposite sides of each other in one direction, an opening provided on the first facet, and a flow hole communicating with the opening and the recess respectively. The cover component is fixed to the second face side of the base component. The opening of the base component is blocked by a heat dissipation path fixed to the first face side.

24. The optical detection module according to claim 21, wherein, The heat transfer component is also disposed between the cooling device and the sensor chip. The heat transfer component is a liquid metal component obtained by mixing metal powder with liquid metal.

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