Semiconductor chip test sorting machine

Abstract

The invention discloses a semiconductor chip testing and sorting machine, and relates to the technical field of semiconductor chip testing, the semiconductor chip testing and sorting machine comprises a sorting machine body, the top of the sorting machine body is provided with an adjusting assembly and a sorting assembly, the sorting assembly comprises a substrate mechanism and a plurality of suction mechanisms, the suction mechanism comprises a positioning frame. According to the semiconductor chip testing and sorting machine, pressure borne by a chip can be sensed through a pressure sensor, pressing is stopped when the pressure is too large, the chip can be prevented from being pressed and damaged, the adsorption capacity of a suction cup to the chip can be improved by starting a vacuum pump, and the inner supporting metal made of titanium alloy can play a supporting role and can also play a role in clamping. The suction component has the advantages of being simple in structure and light in weight, the external suction nozzle is soft in texture and good in chemical stability, scratching cannot be caused when the suction component makes contact with the surface of a chip, and the problem that a traditional suction component of the sorting machine cannot meet low-hardness contact and high-performance supporting at the same time is solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip testing technology, specifically to a semiconductor chip testing and sorting machine. Background Technology

[0002] With the globalization of the semiconductor industry and the refinement of end-user applications, semiconductor chips, as the core functional carriers of electronic devices, directly determine the reliability of end products through their performance stability and yield. Test sorting machines can integrate multiple test modules to simultaneously complete multi-dimensional tests such as electrical performance, thermal performance, mechanical reliability, and environmental adaptability. Based on the test results, the chips are divided into qualified and unqualified products, achieving graded screening. This not only ensures the reliability of end products but also maximizes the utilization of chip production capacity.

[0003] In the prior art, such as Chinese announcement number CN119035113B, a fully automatic semiconductor chip testing and sorting machine is disclosed, including a chassis and a loading and unloading robot mounted on the chassis. The chassis is equipped with a loading tray, a testing component, a tray conveying component, and a preheating tray module. The tray conveying component consists of a conveying frame fixed on the chassis, a conveying component mounted on the conveying frame, a loading component and a unloading component located at the left and right ends of the conveying frame. The loading component is used to place the tray, and the unloading component is used to collect the tray.

[0004] Traditional semiconductor sorting machines typically use hard or semi-hard materials for their nozzles, such as nitrile rubber. However, when the nozzle material is too hard, it can easily scratch the chip surface, damage the pins, or even cause the internal circuitry of the chip to break. If a soft nozzle is used directly, the soft material can easily deform after the nozzle picks up the chip, causing the chip to fall off. However, traditional nozzles cannot simultaneously meet the requirements of low-hardness contact and high-performance support.

[0005] Therefore, we propose a semiconductor chip testing and sorting machine to solve the problems mentioned above. Summary of the Invention

[0006] The purpose of this invention is to provide a semiconductor chip testing and sorting machine to solve the problem mentioned in the background art that traditional suction nozzles cannot simultaneously meet the requirements of low-hardness contact and high-performance support.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor chip testing and sorting machine, comprising a sorting machine body, an adjustment component and a sorting component disposed on the top of the sorting machine body, the sorting component comprising a base mechanism and a suction mechanism, wherein multiple suction mechanisms are provided, each suction mechanism comprising a positioning frame, wherein limit grooves are formed on both sides of the positioning frame, movable blocks are slidably connected to the inner walls of two limit grooves, and reinforcing blocks are fixedly connected between the opposing sides of two movable blocks, and a space is provided between the top of the reinforcing block and the inner top of the positioning frame. A multi-stage electric telescopic rod is provided. The bottom of the reinforcing block is fixedly connected to a mounting base. The bottom of the mounting base is fixedly connected to an inner support metal, which is made of titanium alloy. A pressure sensor is installed at the bottom of the inner support metal. A suction nozzle made of silicone rubber is fixedly connected to the outer surface of the inner support metal. A suction cup is provided at the bottom of the suction nozzle. The surface of the suction cup is coated with a coating area. A vacuum cavity is opened inside the suction nozzle near its bottom. A vacuum tube is fixedly connected to the top of the vacuum cavity near its edge.

[0008] Preferably, a support groove is formed on one outer surface of the mounting base, and a vacuum pump is installed on the inner wall of the support groove. The connection end of the vacuum pump is fixedly connected to one end of the vacuum tube.

[0009] Preferably, the inner support metal has a conveying channel inside, and the vacuum tube is disposed inside the conveying channel.

[0010] Preferably, the base mechanism includes a connecting seat, a floating base is fixedly connected to the inner bottom of the connecting seat, a plurality of suction mechanisms are fixedly installed on the bottom of the floating base, an internal groove is formed on the outer surface of the floating base, and a controller is provided on the inner wall of the internal groove.

[0011] Preferably, a miniature camera is provided on one side of the connector, and an embedding groove is provided on the other side of the connector. A fixed base is coupled to the inner wall of the embedding groove, and a piezoelectric ceramic sheet is provided inside the embedding groove.

[0012] Preferably, the adjustment component includes a support column, which is fixedly installed on the top of the sorting machine body. A mounting base is fixedly connected to the bottom outer surface of the support column, and a drive motor is provided on the top outer surface of the support column. A support screw is fixedly connected to the output shaft of the drive motor, and the bottom end of the support screw is rotatably embedded in the middle of the top of the mounting base.

[0013] Preferably, the top of the mounting base is fixedly connected to two support rods, and a mounting bracket is slidably connected between the outer surfaces of the two support rods, with the support screw threaded into the interior of the mounting bracket.

[0014] Preferably, a movable hole is provided on one side of the mounting bracket, and a hydraulic cylinder is provided on the inner wall of one side of the mounting bracket. An extension rod is fixedly connected to one end of the hydraulic cylinder. The outer surface of the extension rod is rotatably connected to the inner wall of the movable hole. A limit frame is fixedly connected to one side of the bottom of the mounting bracket. A limit slide is slidably connected to the inner wall of the limit frame. One end of the limit slide and one end of the extension rod are both fixedly connected to the outer surface of the fixed base.

[0015] Preferably, a chip placement assembly is fixedly connected to the top of the sorting machine body. The chip placement assembly includes two fixed slide rods, and a movable plate is slidably connected between the tops of the two fixed slide rods. The chip placement assembly also includes a servo motor, and an adjusting screw is fixedly connected to the output shaft of the servo motor. One end of the adjusting screw is threaded through the movable plate to its outside. Both ends of the adjusting screw are movably fitted with limit frames, and the two limit frames, the two fixed slide rods, and the servo motor are all fixedly installed on the top of the sorting machine body.

[0016] Preferably, a mounting plate is bolted to the top of the movable plate, and the top of the mounting plate has multiple placement slots, each of which contains a semiconductor chip block.

[0017] Compared with the prior art, the beneficial effects of the present invention are: 1. During use, press the suction nozzle against the surface of the semiconductor chip section. The pressure sensor can detect the pressure on the chip and stop pressing when the pressure is too high to avoid damaging the chip. Activating the vacuum pump can improve the suction cup's adsorption capacity for the chip. The inner support metal made of titanium alloy can provide support and has the advantage of being lightweight. The outer suction nozzle is soft and chemically stable, and will not scratch the chip surface when in contact with it. This solves the problem that traditional sorting machine suction components cannot simultaneously meet the requirements of low hardness contact and high performance support.

[0018] 2. During use, each multi-stage electric telescopic rod is controlled by the controller, which allows one or more nozzles to pick up the chip individually, or all nozzles to descend and pick up the chip at the same time. This makes it suitable for chips of different sizes and avoids unstable adsorption caused by size mismatch. The coating area on the surface of the suction cup increases the adsorption friction to prevent small chips from slipping and avoids scratching the chip surface by hard contact.

[0019] 3. During use, when the nozzle is rotated to the target position, the miniature camera captures an image of the nozzle and the chip. The control system identifies the offset of the chip position and then outputs a corresponding voltage to the piezoelectric ceramic sheet. Driven by the voltage, the piezoelectric ceramic sheet undergoes precise deformation, thereby automatically correcting the slight offset of the nozzle. This solves the problem of chip offset caused by machine vibration. By activating the servo motor, drive motor, and hydraulic cylinder, the position of the semiconductor chip blocks is adjusted in a timely manner, thereby achieving the purpose of assisted automatic positioning. Attached Figure Description

[0020] Figure 1 This is a first-view perspective perspective view of a semiconductor chip testing and sorting machine according to the present invention; Figure 2 This is a second-view perspective perspective view of a semiconductor chip testing and sorting machine according to the present invention; Figure 3 This is a perspective view of the chip placement component of a semiconductor chip testing and sorting machine according to the present invention; Figure 4 This is a three-dimensional view of the chip placement component of a semiconductor chip testing and sorting machine according to the present invention. Figure 5 This is a perspective view of the adjustment component of a semiconductor chip testing and sorting machine according to the present invention; Figure 6 This is a bottom perspective view of the sorting component of a semiconductor chip testing and sorting machine according to the present invention. Figure 7 This is a perspective view of the sorting component of a semiconductor chip testing and sorting machine according to the present invention. Figure 8 This is a perspective view of the suction mechanism portion of a semiconductor chip testing and sorting machine according to the present invention; Figure 9 This is a cross-sectional perspective view of the suction mechanism of a semiconductor chip testing and sorting machine according to the present invention; Figure 10 This is a three-dimensional cross-sectional view of the suction cup portion of a semiconductor chip testing and sorting machine according to the present invention.

[0021] In the picture: 1. Sorting machine body; 2. Chip placement assembly; 201. Fixed slide bar; 202. Moving plate; 203. Limiting frame; 204. Servo motor; 205. Adjusting screw; 206. Mounting plate; 207. Placement slot; 208. Semiconductor chip block; 3. Adjustment assembly; 301. Support column; 302. Mounting base; 303. Support rod; 304. Supporting screw; 305. Drive motor; 306. Mounting frame; 307. Limiting frame; 308. Movable hole; 309. Hydraulic cylinder; 310. Extension rod; 311. Limiting slide; 4. Sorting assembly; 41. Base mechanism; 411. Connecting seat; 41 2. Fixed base; 413. Miniature camera; 414. Floating base; 415. Built-in slot; 416. Controller; 417. Embedded slot; 418. Piezoelectric ceramic sheet; 42. Suction mechanism; 421. Positioning frame; 422. Limiting slot; 423. Movable block; 424. Reinforcing block; 425. Multi-stage electric telescopic rod; 426. Mounting base; 427. Support slot; 428. Vacuum pump; 429. Suction nozzle; 4210. Inner support metal; 4211. Vacuum tube; 4212. Conveying channel; 4213. Pressure sensor; 4214. Vacuum cavity; 4215. Suction cup; 4216. Coating area. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Example 1: Refer to Figures 1-10As shown, the present invention provides a technical solution: a semiconductor chip testing and sorting machine, including a sorting machine body 1, an adjustment component 3 and a sorting component 4 arranged on the top of the sorting machine body 1, the sorting component 4 including a base mechanism 41 and a suction mechanism 42, the suction mechanism 42 being provided in multiple ways, the suction mechanism 42 including a positioning frame 421, the positioning frame 421 having limit grooves 422 on both sides, the inner walls of the two limit grooves 422 being slidably connected to movable blocks 423, the two movable blocks 423 being fixedly connected to each other with reinforcing blocks 424. A multi-stage electric telescopic rod 425 is connected between the top of the bracket and the inner top of the positioning frame 421. A mounting base 426 is fixedly connected to the bottom of the reinforcing block 424. An inner support metal 4210 is fixedly connected to the bottom of the mounting base 426. The inner support metal 4210 is made of titanium alloy. A pressure sensor 4213 is installed at the bottom of the inner support metal 4210. A suction nozzle 429 is fixedly connected to the outer surface of the inner support metal 4210. The suction nozzle 429 is made of silicone rubber. A suction cup 4215 is provided at the bottom of the suction nozzle 429. The surface of the suction cup 4215 is coated with a coating. In area 4216, and coating area 4216, a vacuum cavity 4214 is formed inside the nozzle 429 near its bottom. A vacuum tube 4211 is fixedly connected to the top of the vacuum cavity 4214 near its edge. A support groove 427 is formed on one outer surface of the mounting base 426. A vacuum pump 428 is installed on the inner wall of the support groove 427. The connection end of the vacuum pump 428 is fixedly connected to one end of the vacuum tube 4211. A conveying channel 4212 is formed inside the inner support metal 4210. The vacuum tube 4211 is located inside the conveying channel 4212. The base mechanism 41 includes a connecting seat 411, a floating base 414 is fixedly connected to the inner bottom of the connecting seat 411, a plurality of suction mechanisms 42 are fixedly installed on the bottom of the floating base 414, an internal groove 415 is provided on the outer surface of the floating base 414, a controller 416 is provided on the inner wall of the internal groove 415, a miniature camera 413 is provided on one side of the connecting seat 411, an embedding groove 417 is provided on the other side of the connecting seat 411, a fixed base 412 is coupled to the inner wall of the embedding groove 417, and a piezoelectric ceramic sheet 418 is provided inside the embedding groove 417.

[0024] In this embodiment, during use, the controller 416 controls each multi-stage electric telescopic rod 425, allowing one or more suction nozzles 429 to pick up the chip individually, or all suction nozzles 429 to descend simultaneously to pick up the chip. This adapts to chips of different sizes, avoiding unstable adsorption due to size mismatch. At this time, the movable block 423 moves within the limiting groove 422, serving a positional limitation function. By pressing the suction nozzles 429 against the surface of the semiconductor chip block 208, air between the suction cup 4215 and the chip is expelled, thus adsorbing the chip. The pressure sensor 4213 senses the pressure on the chip; when the pressure is too high, pressing stops to prevent damage to the chip. Activating the vacuum pump 428 connects it to the vacuum tube 4211 to extract gas from the vacuum chamber 4214, thereby improving the adsorption capacity of the suction cup 4215 on the chip. The inner support metal 4210, made of titanium alloy, provides support... The internal support function is achieved, while the external suction nozzle 429 is made of silicone rubber with a hardness not exceeding 20 Shore A. Its soft texture and good chemical stability prevent scratching when in contact with the chip surface, solving the problem that traditional sorting machine suction components cannot simultaneously meet the requirements of low-hardness contact and high-performance support. The coating area 4216 on the surface of the suction cup 4215 is made of polytetrafluoroethylene nanofiber coating with a thickness of less than 10μm. It increases the adsorption friction to prevent small chips from slipping and avoids scratching the chip surface by hard contact. In addition, when the suction nozzle 429 is rotated to the target station, the miniature camera 413 will capture an image of the suction nozzle 429 and the chip. The control system identifies the offset of the chip position and then outputs a corresponding voltage to the piezoelectric ceramic plate 418. The piezoelectric ceramic plate 418 will produce precise deformation under voltage drive, thereby completing the automatic correction of the slight offset of the suction nozzle 429 and solving the problem that machine vibration can easily cause chip offset.

[0025] Example 2: Figures 1-10As shown, the adjustment assembly 3 includes a support column 301, which is fixedly installed on the top of the sorting machine body 1. A mounting base 302 is fixedly connected to the bottom outer surface of the support column 301. A drive motor 305 is installed on the top outer surface of the support column 301. A support screw 304 is fixedly connected to the output shaft of the drive motor 305. The bottom end of the support screw 304 is rotatably embedded in the middle of the top of the mounting base 302. Two support rods 303 are fixedly connected to the top of the mounting base 302. A mounting bracket 306 is slidably connected between the outer surfaces of the two support rods 303. The support screw 304 is threaded into the inside of the mounting bracket 306. A movable hole 308 is opened on one side of the mounting bracket 306. A hydraulic cylinder 309 is installed on the inner wall of one side of the mounting bracket 306. An extension rod 310 is fixedly connected to one end of the hydraulic cylinder 309. The outer surface of the extension rod 310 is connected to the movable hole. The inner wall of 308 is rotatably connected, and the bottom of the mounting bracket 306 is fixedly connected to a limiting frame 307 near one side. The inner wall of the limiting frame 307 is slidably connected to a limiting slide 311. One end of the limiting slide 311 and one end of the extension rod 310 are both fixedly connected to the outer surface of the fixed base 412. The base mechanism 41 includes a connecting seat 411. The inner bottom of the connecting seat 411 is fixedly connected to a floating base 414. Multiple suction mechanisms 42 are fixedly installed at the bottom of the floating base 414. The outer surface of the floating base 414 is provided with an internal groove 415. The inner wall of the internal groove 415 is provided with a controller 416. A miniature camera 413 is provided on one side of the connecting seat 411. An embedding groove 417 is provided on the other side of the connecting seat 411. The inner wall of the embedding groove 417 is coupled to the fixed base 412. A piezoelectric ceramic sheet 418 is provided inside the embedding groove 417.

[0026] In this embodiment, during use, the target position of chip sorting is detected in real time by the miniature camera 413. When the position adjustment of the semiconductor chip block 208 cannot meet the requirements, the position of the suction nozzle 429 is adjusted by adjusting the sorting component 4. By starting the drive motor 305, its output shaft rotates, thereby driving the support screw 304 to rotate. Under the support of the two support rods 303, the mounting frame 306 will move up and down in the vertical direction, so that the suction nozzle 429 can quickly complete the suction and transfer when picking up the chip. At this time, by starting the hydraulic cylinder 309, it can be extended and shortened, thereby driving the extension rod 310 to move inside the movable hole 308. At the same time, the limiting slide 311 slides inside the limiting frame 307, which can improve the support capacity of the entire component of the sorting component 4. The extension length of the extension rod 310 can be automatically adjusted according to the shooting and positioning results of the miniature camera 413. All of these are controlled by the control system set in the sorting machine body 1, thereby achieving the purpose of automatic positioning.

[0027] Example 3: Figures 1-10As shown, a chip placement assembly 2 is fixedly connected to the top of the sorting machine body 1. The chip placement assembly 2 includes two fixed slide rods 201, and a movable plate 202 is slidably connected between the tops of the two fixed slide rods 201. The chip placement assembly 2 also includes a servo motor 204. An adjusting screw 205 is fixedly connected to the output shaft of the servo motor 204. One end of the adjusting screw 205 is threaded through the movable plate 202 to its outside. Limiting frames 203 are movably sleeved on both ends of the adjusting screw 205. The two limiting frames 203, the two fixed slide rods 201, and the servo motor 204 are all fixedly installed on the top of the sorting machine body 1. An mounting plate 206 is bolted to the top of the movable plate 202. The top of the mounting plate 206 has multiple placement slots 207, and each placement slot 207 has a semiconductor chip block 208 inside. The base mechanism 41 includes a connecting seat 411, and a floating base 414 is fixedly connected to the inner bottom of the connecting seat 411. Multiple suction mechanisms 42 are fixedly installed on the bottom of the floating base 414. The outer surface of the floating base 414 has an internal groove 415, and a controller 416 is set on the inner wall of the internal groove 415. A miniature camera 413 is set on one side of the connecting seat 411, and an embedding groove 417 is set on the other side of the connecting seat 411. A fixed base 412 is coupled to the inner wall of the embedding groove 417, and a piezoelectric ceramic sheet 418 is set inside the embedding groove 417.

[0028] In this embodiment, during use, the miniature camera 413 can detect the matching degree between the nozzle 429 and the semiconductor chip block 208 in real time. The control system inside the sorting machine 1 can then receive the information collected by the miniature camera 413 and adjust the position of the semiconductor chip block 208 accordingly. Specifically, the servo motor 204 is activated, causing its output shaft to rotate, which in turn drives the adjusting screw 205 to rotate. Since the moving plate 202 slides on top of the fixed slide bar 201, it moves left and right under the rotation of the adjusting screw 205. The individual semiconductors are combined to form the semiconductor chip block 208. By positioning the semiconductor chip block 208 inside the placement slot 207 and simultaneously mounting the mounting plate 206 on the moving plate 202, the semiconductor chip block 208 can be adjusted in position according to the position detected by the miniature camera 413.

[0029] The device's operation and working principle are as follows: During use, the miniature camera 413 can detect the real-time matching degree between the suction nozzle 429 and the semiconductor chip block 208. The control system inside the sorting machine 1 receives the information collected by the miniature camera 413 and adjusts the position of the semiconductor chip block 208 accordingly. Specifically, the servo motor 204 is activated, causing its output shaft to rotate, which in turn drives the adjusting screw 205. Since the moving plate 202 slides on top of the fixed slide rod 201, it moves left and right under the rotation of the adjusting screw 205. The individual semiconductors are combined to form the semiconductor chip block 208. The chip block 208 is positioned inside the placement slot 207, and the mounting plate 206 is mounted on the moving plate 202. This allows the semiconductor chip block 208 to adjust its position in conjunction with the position detected by the miniature camera 413. The miniature camera 413 monitors the target position of the chip sorting in real time. When the position adjustment of the semiconductor chip block 208 is insufficient, the position of the suction nozzle 429 is adjusted by adjusting the sorting component 4. By starting the drive motor 305, its output shaft rotates, which in turn rotates the support screw 304. Under the support of the two support rods 303, the mounting bracket 306 moves vertically up and down, enabling the suction nozzle 429 to quickly pick up the chip. The process involves picking up and transferring chips. At this time, the hydraulic cylinder 309 is activated, causing it to extend and retract, thereby moving the extension rod 310 within the movable hole 308. Simultaneously, the limiting slide 311 slides within the limiting frame 307, improving the support capacity for the entire sorting assembly 4. The extension length of the extension rod 310 can be automatically adjusted based on the shooting and positioning results of the miniature camera 413. Each multi-stage electric telescopic rod 425 is controlled by the controller 416, allowing one or more suction nozzles 429 to pick up chips individually, or all suction nozzles 429 to descend and pick up chips simultaneously, thus adapting to chips of different sizes. Meanwhile, the movable block 423 moves within the limiting groove 422, providing... The positioning function, by pressing the suction nozzle 429 against the surface of the semiconductor chip block 208, expels the air between the suction cup 4215 and the chip, thereby adsorbing the chip. The pressure sensor 4213 can sense the pressure on the chip, and stop pressing when the pressure is too high, thus preventing damage to the chip. By activating the vacuum pump 428, which connects to the vacuum tube 4211, the gas inside the vacuum chamber 4214 is extracted, thereby improving the adsorption capacity of the suction cup 4215 on the chip. The inner support metal 4210, made of titanium alloy, provides both support and is lightweight. The outer suction nozzle 429 is soft and chemically stable, and will not scratch the chip surface when in contact with it.The coating area 4216 on the surface of the suction cup 4215 uses a polytetrafluoroethylene nanofiber coating. Additionally, when the nozzle 429 is rotated to the target position, the miniature camera 413 captures images of the nozzle 429 and the chip. The control system identifies the offset of the chip's position and then outputs a corresponding voltage to the piezoelectric ceramic sheet 418. Driven by this voltage, the piezoelectric ceramic sheet 418 undergoes precise deformation, thus automatically correcting the minute offset of the nozzle 429.

[0030] The wiring diagrams for the servo motor 204, drive motor 305, hydraulic cylinder 309, miniature camera 413, controller 416, piezoelectric ceramic plate 418, multi-stage electric telescopic rod 425, vacuum pump 428, and pressure sensor 4213 in this invention are common knowledge in the field, and their working principles are known technologies. The appropriate models are selected according to actual use. Therefore, the control methods and wiring arrangements for the servo motor 204, drive motor 305, hydraulic cylinder 309, miniature camera 413, controller 416, piezoelectric ceramic plate 418, multi-stage electric telescopic rod 425, vacuum pump 428, and pressure sensor 4213 will not be explained in detail.

[0031] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor chip testing and sorting machine, comprising a sorting machine body (1), wherein an adjustment component (3) and a sorting component (4) are disposed on the top of the sorting machine body (1), characterized in that: The sorting component (4) includes a base mechanism (41) and a suction mechanism (42). Multiple suction mechanisms (42) are provided, each including a positioning frame (421). Limiting grooves (422) are provided on both sides of the positioning frame (421). Movable blocks (423) are slidably connected to the inner walls of both limiting grooves (422). Reinforcing blocks (424) are fixedly connected between the two movable blocks (423). A multi-stage electric telescopic rod (425) is provided between the top of the reinforcing block (424) and the inner top of the positioning frame (421). A mounting base (426) is fixedly connected to the bottom of the reinforcing block (424). The bottom of the mounting base (426) is fixedly... An inner support metal (4210) is fixedly connected to the inner support metal (4210), and the inner support metal (4210) is made of titanium alloy. A pressure sensor (4213) is set at the bottom of the inner support metal (4210). A suction nozzle (429) is fixedly connected to the outer surface of the inner support metal (4210), and the suction nozzle (429) is made of silicone rubber. A suction cup (4215) is provided at the bottom of the suction nozzle (429). A coating area (4216) is coated on the surface of the suction cup (4215). A vacuum cavity (4214) is opened in the inside of the suction nozzle (429) near its bottom. A vacuum tube (4211) is fixedly connected to the top of the vacuum cavity (4214) near its edge.

2. The semiconductor chip testing and sorting machine according to claim 1, characterized in that: The mounting base (426) has a support groove (427) on one side of its outer surface. A vacuum pump (428) is installed on the inner wall of the support groove (427). The connection end of the vacuum pump (428) is fixedly connected to one end of the vacuum tube (4211).

3. The semiconductor chip testing and sorting machine according to claim 2, characterized in that: The inner support metal (4210) has a conveying channel (4212) inside, and the vacuum tube (4211) is located inside the conveying channel (4212).

4. The semiconductor chip testing and sorting machine according to claim 3, characterized in that: The base mechanism (41) includes a connecting seat (411), and a floating base (414) is fixedly connected to the inner bottom of the connecting seat (411). Multiple suction mechanisms (42) are fixedly installed at the bottom of the floating base (414). An internal groove (415) is provided on the outer surface of the floating base (414), and a controller (416) is provided on the inner wall of the internal groove (415).

5. The semiconductor chip testing and sorting machine according to claim 4, characterized in that: A miniature camera (413) is provided on one side of the connector (411), and an embedding groove (417) is provided on the other side of the connector (411). A fixed base (412) is coupled to the inner wall of the embedding groove (417), and a piezoelectric ceramic sheet (418) is provided inside the embedding groove (417).

6. The semiconductor chip testing and sorting machine according to claim 5, characterized in that: The adjustment component (3) includes a support column (301), which is fixedly installed on the top of the sorting machine body (1). A mounting base (302) is fixedly connected to the bottom outer surface of the support column (301). A drive motor (305) is provided on the top outer surface of the support column (301). A support screw (304) is fixedly connected to the output shaft of the drive motor (305). The bottom end of the support screw (304) is rotatably embedded in the top middle of the mounting base (302).

7. The semiconductor chip testing and sorting machine according to claim 6, characterized in that: The top of the mounting base (302) is fixedly connected to two support rods (303), and a mounting bracket (306) is slidably connected between the outer surfaces of the two support rods (303). The support screw (304) is threaded into the inside of the mounting bracket (306).

8. The semiconductor chip testing and sorting machine according to claim 7, characterized in that: The mounting bracket (306) has a movable hole (308) on one side. A hydraulic cylinder (309) is provided on the inner wall of one side of the mounting bracket (306). An extension rod (310) is fixedly connected to one end of the hydraulic cylinder (309). The outer surface of the extension rod (310) is rotatably connected to the inner wall of the movable hole (308). A limit frame (307) is fixedly connected to one side of the bottom of the mounting bracket (306). A limit slide (311) is slidably connected to the inner wall of the limit frame (307). One end of the limit slide (311) and one end of the extension rod (310) are both fixedly connected to the outer surface of the fixed base (412).

9. The semiconductor chip testing and sorting machine according to claim 8, characterized in that: A chip placement assembly (2) is fixedly connected to the top of the sorting machine body (1). The chip placement assembly (2) includes two fixed slide rods (201). A moving plate (202) is slidably connected between the tops of the two fixed slide rods (201). The chip placement assembly (2) also includes a servo motor (204). An adjusting screw (205) is fixedly connected to the output shaft of the servo motor (204). One end of the adjusting screw (205) is threaded through the moving plate (202) to its outside. Both ends of the adjusting screw (205) are movably fitted with limit frames (203). The two limit frames (203), the two fixed slide rods (201), and the servo motor (204) are all fixedly installed on the top of the sorting machine body (1).

10. The semiconductor chip testing and sorting machine according to claim 9, characterized in that: The top of the movable plate (202) is bolted with an mounting plate (206), and the top of the mounting plate (206) has multiple placement slots (207), each of which contains a semiconductor chip block (208).

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