High-temperature-resistant epoxy molding compound material for silicon carbide packaging device and preparation method of high-temperature-resistant epoxy molding compound material

Abstract

The invention discloses a high-temperature-resistant epoxy molding compound material for a silicon carbide packaging device and a preparation method of the high-temperature-resistant epoxy molding compound material. The high-temperature-resistant epoxy molding compound material comprises the following raw materials in parts by weight: 5-12 parts of high-temperature-resistant epoxy resin, 5-10 parts of polyfunctional epoxy resin, 8-20 parts of a polyfunctional curing agent, 60-85 parts of filler, 5-20 parts of a flame retardant, 1-10 parts of a silane coupling agent and 0.001-0.5 part of a catalyst. The functionality of the polyfunctional epoxy resin is greater than or equal to 3, and the functionality of the polyfunctional curing agent is greater than or equal to 2.5. According to the invention, the high-temperature-resistant epoxy resin, the polyfunctional epoxy resin and the polyfunctional curing agent are reacted, so that the epoxy molding compound has high crosslinking degree, and the prepared epoxy molding compound has higher Tg, high bonding strength and low water absorption.

Description

Technical Field

[0001] This invention belongs to the field of polymer materials technology, and particularly relates to a high-temperature resistant epoxy molding compound material and its preparation method. Background Technology

[0002] In recent years, with the continuous development of the semiconductor industry, power semiconductor devices made from third-generation semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) have become a key development area in the semiconductor industry. Compared with first- and second-generation semiconductor materials, third-generation semiconductor materials have wider band gaps, higher breakdown electric fields, higher thermal conductivity, higher electron saturation velocity, and higher radiation resistance, and are widely used in 5G communications, the Internet of Things, autonomous driving, new energy vehicles, and other fields.

[0003] Because third-generation power semiconductor devices have higher operating temperatures, higher withstand voltage requirements, and more complex operating conditions, higher demands are placed on the heat resistance, insulation performance, and service life of encapsulation materials in harsh environments. Traditional epoxy resin encapsulation materials can no longer meet these requirements. Developing epoxy molding compounds with high glass transition temperatures (Tg) and long service life in harsh environments for third-generation semiconductor power devices is of significant research importance and application value. Summary of the Invention

[0004] To overcome the problems in the prior art, the present invention provides a high-temperature resistant epoxy molding compound material for silicon carbide packaging devices and its preparation method, which improves the glass transition temperature of the epoxy molding compound material and has high bonding strength and low water absorption.

[0005] To solve the above-mentioned technical problems, the technical solution proposed by this invention is as follows:

[0006] This invention provides a high-temperature resistant epoxy molding compound material for silicon carbide packaging devices, which is prepared from the following raw materials in parts by weight: The composition comprises 5-12 parts of high-temperature resistant epoxy resin, 5-10 parts of multifunctional epoxy resin, 8-20 parts of multifunctional curing agent, 60-85 parts of filler, 5-20 parts of flame retardant, 1-10 parts of silane coupling agent, and 0.001-0.5 parts of catalyst; wherein the functionality of the multifunctional epoxy resin is ≥3; and the functionality of the multifunctional curing agent is ≥2.5.

[0007] This invention uses novel high-temperature resistant epoxy resin and multifunctional epoxy resin as matrix resins, and cures them with multifunctional curing agents to significantly improve the crosslinking degree of the system, thereby increasing the glass transition temperature of epoxy molding compounds. Moreover, while ensuring high-temperature resistance, it can also achieve high bonding strength and low water absorption, and can be used for silicon carbide encapsulation devices.

[0008] As an optional implementation method, in the preparation method provided by the present invention, the high-temperature resistant epoxy resin is obtained by reacting p-styreneoxybenzoic acid with tetramethylbiphenyl after acyl chlorination.

[0009] As an optional implementation, the high-temperature resistant epoxy resin is prepared in the preparation method provided by the present invention as follows: S1. Add bromostyrene to a p-hydroxybenzoic acid solution, heat the mixture to react, evaporate the solvent, then add concentrated hydrochloric acid dropwise, and a white precipitate will form. After treatment, p-styreneoxybenzoic acid is obtained.

[0010] S2. The p-styreneoxybenzoic acid obtained in step S1 is subjected to acyl chloride treatment to obtain p-styreneoxybenzoyl chloride.

[0011] S3. Tetramethylbiphenyl hydrochloride was added to the p-styreneoxybenzoyl chloride obtained in step S2. After ice bath reaction, it was treated to obtain tetramethylbiphenyl-di-p-styreneoxybenzoate.

[0012] S4. Dissolve the tetramethylbiphenyl-di-p-styreneoxybenzoate obtained in step S3, add the phase transfer agent solution dropwise in an ice bath, and after the ice bath reaction, obtain the crude product. After treatment, obtain the new high-temperature resistant epoxy resin.

[0013] In this invention, p-hydroxybenzoic acid is first reacted with bromostyrene to prepare p-styreneoxybenzoic acid. The p-styreneoxybenzoic acid is then acylchlorinated to obtain p-styreneoxybenzoyl chloride. Tetramethylbiphenyl is added to the p-styreneoxybenzoyl chloride, and after the reaction, tetramethylbiphenyl-di-p-styreneoxybenzoate is obtained. After dissolving the tetramethylbiphenyl-di-p-styreneoxybenzoate, a phase transfer agent solution is added dropwise, and after an ice bath reaction, a novel high-temperature resistant epoxy resin is obtained.

[0014] As an optional implementation method, in the preparation method provided by the present invention, the mass ratio of p-hydroxybenzoic acid, bromostyrene and tetramethylbiphenyl is 1:0.5:0.1-1:2:1.

[0015] In this invention, controlling the proportion of reactants within the above-mentioned range helps to reduce the occurrence of side reactions and improve product yield.

[0016] As an optional implementation method, in the preparation method provided by the present invention, in step S1, the temperature is raised to 50~100℃ and the reaction is carried out for 12~24h; after the white precipitate is precipitated, it is filtered and recrystallized to obtain p-styreneoxybenzoic acid.

[0017] In this invention, controlling the reaction temperature within the above-mentioned range can reduce the occurrence of side reactions.

[0018] As an optional implementation method, in the preparation method provided by the present invention, in step S2, the temperature is raised to 50~100℃ and the reaction is carried out for 5~12 hours.

[0019] In this invention, controlling the reaction temperature within the above-mentioned range can more effectively control the reaction rate and ethanol evaporation, and reduce the occurrence of side reactions.

[0020] As an optional implementation, in the preparation method provided by the present invention, step S3 includes filtration, distillation, washing and recrystallization.

[0021] As an optional implementation, in the preparation method provided by the present invention, the multifunctional epoxy resin is selected from one or more of phenolic epoxy resin, naphthalene-type epoxy resin, dicyclopentadiene-phenol-type epoxy resin, or tetraglycidylamine-type epoxy resin.

[0022] As an optional implementation, in the preparation method provided by the present invention, the multifunctional curing agent is selected from one or more of linear phenolic resin, phenolic aromatic resin, xylok phenolic resin, or acid anhydride.

[0023] As an optional implementation, in the preparation method provided by the present invention, the filler is selected from one or more of crystalline silica, spherical silica, molten silica, aluminum oxide, titanium dioxide or glass fiber.

[0024] As an optional implementation, in the preparation method provided by the present invention, the catalyst is selected from one or more of triethylamine, triphenylphosphine, tetraphenylphosphine adducts or imidazole compounds.

[0025] As an optional implementation, in the preparation method provided by the present invention, the flame retardant is selected from one or more of ammonium polyphosphate, phosphate ester flame retardants, hypophosphite, or aluminum hydroxide.

[0026] As an optional implementation, in the preparation method provided by the present invention, the silane coupling agent is selected from one or more of epoxy silane coupling agents, amino silane coupling agents, or vinyl silane coupling agents.

[0027] As an optional implementation, the preparation method provided by the present invention further includes 1 to 5 parts of pigment.

[0028] As an optional implementation, in the preparation method provided by the present invention, the pigment is carbon black.

[0029] Based on the same technical concept, the present invention also provides a method for preparing the above-mentioned high-temperature resistant epoxy molding compound material, comprising the following steps: after mixing all raw materials evenly, heating and extruding the mixture in a twin-screw extruder, cooling and crushing the mixture, and then pre-pressing it to obtain the high-temperature resistant epoxy molding compound material.

[0030] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The present invention utilizes high-temperature resistant epoxy resin, multifunctional epoxy resin and multifunctional curing agent to react, which has a high degree of crosslinking and the epoxy molding compound prepared has a higher Tg (≥220℃).

[0031] (2) In this invention, the high-temperature resistant epoxy resin will form a highly cross-linked three-dimensional network structure after curing. This tight molecular arrangement greatly reduces the internal pores and channels for water molecules to penetrate, thus hindering the entry of water from a spatial structure perspective. At the same time, the high-temperature resistant epoxy resin, multifunctional epoxy resin and multifunctional curing agent are used in this invention to react synergistically, so that the epoxy molding compound in this invention has a low water absorption rate of about 0.5% or less.

[0032] (3) The epoxy molding compound of the present invention exhibits high bonding strength with copper (Cu) and polyimide copper-clad laminate (Pmc). This is because the high-temperature resistant epoxy resin contains active groups (such as epoxy groups and hydroxyl groups), which can chemically react with the oxide layer (such as Cu2O and CuO) on the surface of copper to form stable chemical covalent bonds. When the Pmc surface contains active groups such as hydroxyl and carboxyl groups, it can also crosslink with the active groups of the epoxy resin, achieving "chemical bonding" at the molecular level. At the same time, the epoxy resin in the present invention has good fluidity, which can fully wet the surface of copper or Pmc before curing (especially when the surface has a small rough structure), filling the surface depressions and gaps, and forming a "mechanical interlocking" effect after curing. Meanwhile, the physical forces such as van der Waals forces and hydrogen bonds between molecules further enhance the tightness of the interface. The bonding strength of the epoxy molding compound material prepared in the present invention (with Cu and Pmc) is approximately 390 N or more. Detailed Implementation

[0033] To facilitate understanding of the present invention, the present invention will be described more fully and in detail below in conjunction with the specification and preferred embodiments, but the scope of protection of the present invention is not limited to the following specific embodiments.

[0034] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by those skilled in the art. The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of the invention.

[0035] Unless otherwise specified, all raw materials, reagents, instruments and equipment used in this invention can be purchased from the market or prepared by existing methods.

[0036] Preparation of high-temperature resistant epoxy resin Example 1 (1) Add 15g of p-hydroxybenzoic acid, sodium hydroxide catalyst, 10ml of ethanol solvent and distilled water to a four-necked flask, wherein the mass ratio of p-hydroxybenzoic acid to sodium hydroxide is 1.5:1, and stir until homogeneous. Then, control the temperature at 100℃, slowly add 20ml of bromostyrene solution dropwise using a dropping funnel, maintain the temperature, react for 12h, evaporate the solvent, cool to room temperature, and add 10ml of concentrated hydrochloric acid. A large amount of white precipitate precipitates out. Filter and recrystallize to obtain the product p-styreneoxybenzoic acid.

[0037] (2) Add 20g of styreneoxybenzoic acid, 28ml of SOCl2, and 80ml of solvent ethanol to a four-necked flask and stir thoroughly to make it homogeneous. Then, control the temperature at 50℃ and react for 5-12 hours. Then, distill under reduced pressure to obtain the product p-styreneoxybenzoyl chloride.

[0038] (3) Add 5g of tetramethylbiphenyl to a four-necked flask, dissolve it in dichloromethane, place it in an ice-water bath, control the temperature, then add 1.8g of sodium hydroxide catalyst, and react at room temperature for 24h. Filter, distill, wash, and recrystallize to obtain tetramethylbiphenyl-di-p-styreneoxybenzoate.

[0039] (4) Dissolve the product in dichloromethane, add 9g of phase transfer agent solution tetrabutylammonium bromide dropwise in an ice bath, react in an ice bath to obtain crude product, then wash, dry and recrystallize to obtain a new type of high temperature resistant epoxy resin.

[0040] Example 2 (1) Add 10g of p-hydroxybenzoic acid, sodium hydroxide catalyst, 10ml of ethanol solvent and distilled water to a four-necked flask, wherein the ratio of p-hydroxybenzoic acid to sodium hydroxide is 1.5:1, and stir well. Then, control the temperature at 50℃, slowly add 20ml of bromostyrene solution dropwise using a dropping funnel, maintain the temperature, react for 24h, evaporate the solvent, cool to room temperature, and add concentrated hydrochloric acid dropwise. A large amount of white precipitate precipitates out. Filter and recrystallize to obtain the product p-styreneoxybenzoic acid.

[0041] (2) Add 10g of p-styreneoxybenzoic acid, 28ml of SOCl2, and 80ml of solvent ethanol to a four-necked flask and stir thoroughly to make it homogeneous. Then, control the temperature at 100℃ and react for 5-12 hours. Then, distill under reduced pressure to obtain the product p-styreneoxybenzoyl chloride.

[0042] (3) Add 5g of tetramethylbiphenyl to a four-necked flask, dissolve it in dichloromethane, place it in an ice-water bath, control the temperature, then add 1.2g of sodium hydroxide catalyst, and react at room temperature for 12h. Filter, distill, wash, and recrystallize to obtain tetramethylbiphenyl-di-p-styreneoxybenzoate.

[0043] (4) Dissolve the product in dichloromethane, add 6g of phase transfer agent solution tetrabutylammonium bromide dropwise in an ice bath, react in an ice bath to obtain crude product, then wash, dry and recrystallize to obtain a new type of high temperature resistant epoxy resin.

[0044] Example 3 (1) Add 8g of p-hydroxybenzoic acid, sodium hydroxide catalyst, 60ml of ethanol solvent and distilled water to a four-necked flask, wherein the ratio of p-hydroxybenzoic acid to sodium hydroxide is 1.5:1, and stir well. Then, control the temperature at 80℃, slowly add 20ml of bromostyrene solution dropwise using a dropping funnel, maintain the temperature, react for 20h, evaporate the solvent, cool to room temperature, and add concentrated hydrochloric acid dropwise. A large amount of white precipitate precipitates out. Filter and recrystallize to obtain the product p-styreneoxybenzoic acid.

[0045] (2) Add 10g of p-styreneoxybenzoic acid, 28ml of SOCl2, and 60ml of solvent ethanol to a four-necked flask and stir thoroughly to make it homogeneous. Then, control the temperature at 80℃ and react for 5-12 hours. Then, distill under reduced pressure to obtain the product p-styreneoxybenzoyl chloride.

[0046] (3) Add 8g of tetramethylbiphenyl to a four-necked flask, dissolve it in dichloromethane, place it in an ice-water bath, control the temperature, then add 1g of sodium hydroxide catalyst, and react at room temperature for 24h. Filter, distill, wash, and recrystallize to obtain tetramethylbiphenyl-di-p-styreneoxybenzoate.

[0047] (4) Dissolve the product in dichloromethane, add 5g of phase transfer agent solution tetrabutylammonium bromide dropwise in an ice bath, react in an ice bath to obtain crude product, then wash, dry and recrystallize to obtain a new type of high temperature resistant epoxy resin.

[0048] Preparation of high-temperature resistant epoxy molding compound material for silicon carbide packaging devices Example 4 A high glass transition temperature epoxy molding compound, with the following raw material component ratio by weight: Eight parts of the high-temperature resistant epoxy resin prepared in Example 1, 6 parts of phenolic epoxy resin 8 parts of phenolic aromatic phenolic resin 63 parts of crystalline silica 0.3 parts of triphenylphosphine; Nine parts of phosphate ester flame retardant. 1.7 parts carbon black Four parts of epoxy silane coupling agent.

[0049] The specific preparation method is as follows: After the above components are mixed evenly in a stainless steel mixer, they are melt-mixed and extruded at 120-150°C using a screw extruder and then cooled. The cooled material is then crushed, pre-pressed into sample blocks of the required size, and its performance is tested.

[0050] Example 5 A high glass transition temperature epoxy molding compound, with the following raw material component ratio by weight: Six parts of the high-temperature resistant epoxy resin prepared in Example 2, Six parts of dicyclopentadiene phenolic epoxy resin. 10 parts of Xylok type phenolic resin 65 parts of spherical silica 0.1 parts of triphenylphosphine; 10 parts of ammonium polyphosphate 1.9 parts carbon black Two parts of epoxy silane coupling agent.

[0051] The specific preparation method is as follows: After the above components are mixed evenly in a stainless steel mixer, they are melt-mixed and extruded at 120-150°C using a screw extruder and then cooled. The cooled material is then crushed, pre-pressed into sample blocks of the required size, and its performance is tested.

[0052] Example 6 A high glass transition temperature epoxy molding compound, with the following raw material component ratio by weight: 10 parts of the high-temperature resistant epoxy resin prepared in Example 2 7 parts of tetraglycidylamine type epoxy resin 10 parts curing agent (linear phenolic resin and acid anhydride in a 2:3 ratio), 63 parts of filler (spherical silica powder: molten silica powder = 5:3) 0.2 parts of triphenylphosphine; 7 parts hypophosphite 0.8 parts carbon black Two parts of epoxy silane coupling agent.

[0053] The specific preparation method is as follows: After the above components are mixed evenly in a stainless steel mixer, they are melt-mixed and extruded at 120-150°C using a screw extruder and then cooled. The cooled material is then crushed, pre-pressed into sample blocks of the required size, and its performance is tested.

[0054] Comparative Example 1 An epoxy molding compound differs from Example 4 in that it does not use the high-temperature resistant epoxy resin prepared according to the present invention, but uses a biphenyl-type epoxy resin of the same type, while the remaining steps are the same as in Example 4.

[0055] 8 parts of biphenyl-type epoxy resin (tetramethylbiphenyl diglycidyl ether), 6 parts of phenolic epoxy resin 8 parts of phenolic aromatic phenolic resin 63 parts of crystalline silica 0.3 parts of triphenylphosphine; Nine parts of phosphate ester flame retardant. 1.7 parts carbon black Four parts of epoxy silane coupling agent.

[0056] The specific preparation method is as follows: After the above components are mixed evenly in a stainless steel mixer, they are melt-mixed and extruded at 120-150°C using a screw extruder and then cooled. The cooled material is then crushed, pre-pressed into sample blocks of the required size, and its performance is tested.

[0057] Comparative Example 2 An epoxy molding compound differs from Example 4 in that the phenolic epoxy resin is replaced with bisphenol A epoxy resin (a non-multifunctional epoxy resin), while the remaining steps are the same as in Example 4.

[0058] Eight parts of high-temperature resistant epoxy resin prepared in Example 1 6 parts of bisphenol A epoxy resin, 8 parts of phenolic aromatic phenolic resin 63 parts of crystalline silica 0.3 parts of triphenylphosphine; Nine parts of phosphate ester flame retardant. 1.7 parts carbon black Four parts of epoxy silane coupling agent.

[0059] The specific preparation method is as follows: After the above components are mixed evenly in a stainless steel mixer, they are melt-mixed and extruded at 120-150°C using a screw extruder and then cooled. The cooled material is then crushed, pre-pressed into sample blocks of the required size, and its performance is tested.

[0060] Comparative Example 3 An epoxy molding compound differs from Example 4 in that the phenolic aromatic phenolic resin is replaced with a linear phenolic resin (non-multifunctional curing agent), while the remaining steps are the same as in Example 4.

[0061] Eight parts of high-temperature resistant epoxy resin prepared in Example 1 6 parts of phenolic epoxy resin 8 parts of linear phenolic resin, 63 parts of crystalline silica 0.3 parts of triphenylphosphine; Nine parts of phosphate ester flame retardant. 1.7 parts carbon black Four parts of epoxy silane coupling agent.

[0062] The specific preparation method is as follows: After the above components are mixed evenly in a stainless steel mixer, they are melt-mixed and extruded at 120-150°C using a screw extruder and then cooled. The cooled material is then crushed, pre-pressed into sample blocks of the required size, and its performance is tested.

[0063] The performance of the epoxy molding compounds prepared in the examples and comparative examples was tested, and the results are shown in Table 1 below.

[0064] Table 1: Test performance of epoxy molding compounds in examples and comparative examples

[0065] As shown in Table 1, compared with the comparative examples, the epoxy molding materials prepared in the examples have a higher glass transition temperature (≥220℃). The bond strength is significantly improved, reaching approximately 390 N or higher, preferably 400 N or higher. The water absorption rate is significantly reduced, to approximately 0.5% or lower. Simultaneously, it does not affect the gel time, coefficient of thermal expansion, or flame retardant properties. Comparative Example 1 uses a biphenyl-type epoxy resin commonly used in the prior art, which has a lower glass transition temperature and bond strength, and a higher water absorption rate. Comparative Example 2 uses a bisphenol A epoxy resin as the multifunctional epoxy resin, which also has a lower glass transition temperature and bond strength, and a higher water absorption rate. Comparative Example 3 uses a linear phenolic resin as the multifunctional curing agent, which also has a lower glass transition temperature and bond strength, and a higher water absorption rate.

[0066] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. However, it should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A high-temperature resistant epoxy molding compound material for silicon carbide packaging devices, characterized in that, It is prepared from the following raw materials in parts by weight: The composition comprises 5-12 parts of high-temperature resistant epoxy resin, 5-10 parts of multifunctional epoxy resin, 8-20 parts of multifunctional curing agent, 60-85 parts of filler, 5-20 parts of flame retardant, 1-10 parts of silane coupling agent, and 0.001-0.5 parts of catalyst; wherein the functionality of the multifunctional epoxy resin is ≥3, and the functionality of the multifunctional curing agent is ≥2.

5.

2. The high-temperature resistant epoxy molding compound material for silicon carbide packaging devices according to claim 1, characterized in that, The high-temperature resistant epoxy resin is obtained by reacting p-styreneoxybenzoic acid with tetramethylbiphenyl after acyl chlorination.

3. The high-temperature resistant epoxy molding compound material for silicon carbide packaging devices according to claim 1, characterized in that, The preparation method of the high-temperature resistant epoxy resin is as follows: S1. Add bromostyrene to a p-hydroxybenzoic acid solution, heat the reaction and evaporate the solvent, then add concentrated hydrochloric acid dropwise, a white precipitate is formed, and after treatment, p-styreneoxybenzoic acid is obtained. S2. The p-styreneoxybenzoic acid obtained in step S1 is subjected to acyl chloride treatment to obtain p-styreneoxybenzoyl chloride; S3. Tetramethylbiphenyl hydrochloride was added to the p-styreneoxybenzoyl chloride obtained in step S2. After ice bath reaction, it was treated to obtain tetramethylbiphenyl-di-p-styreneoxybenzoate. S4. Dissolve the tetramethylbiphenyl-di-p-styreneoxybenzoate obtained in step S3, add the phase transfer agent solution dropwise in an ice bath, and after the ice bath reaction, obtain the crude product. After treatment, obtain the new high-temperature resistant epoxy resin.

4. The high-temperature resistant epoxy molding compound material for silicon carbide packaging devices according to claim 3, characterized in that, The mass ratio of p-hydroxybenzoic acid, bromostyrene, and tetramethylbiphenyl is 1:0.5:0.1-1:2:

1.

5. The high-temperature resistant epoxy molding compound material for silicon carbide packaging devices according to claim 3, characterized in that, In step S1, the temperature is raised to 50~100℃ and the reaction is carried out for 12~24h; after a white precipitate is formed, it is filtered and recrystallized to obtain p-styreneoxybenzoic acid.

6. The high-temperature resistant epoxy molding compound material for silicon carbide packaging devices according to claim 3, characterized in that, In step S2, the temperature is raised to 50~100℃ and the reaction is carried out for 5~12 hours; in step S3, the processing includes filtration, distillation, washing and recrystallization.

7. The high-temperature resistant epoxy molding compound material for silicon carbide packaging devices according to claim 1, characterized in that, The multifunctional epoxy resin is selected from one or more of phenolic epoxy resin, naphthalene-type epoxy resin, dicyclopentadiene-phenolic epoxy resin, or tetraglycidylamine-type epoxy resin; the multifunctional curing agent is selected from one or more of linear phenolic resin, phenol-aromatic phenolic resin, xylok-type phenolic resin, or acid anhydride; the filler is selected from one or more of crystalline silica, spherical silica, fused silica, aluminum oxide, titanium dioxide, or glass fiber.

8. The high-temperature resistant epoxy molding compound material for silicon carbide packaging devices according to claim 1, characterized in that, The catalyst is selected from one or more of triethylamine, triphenylphosphine, tetraphenylphosphine adducts or imidazole compounds; the flame retardant is selected from one or more of ammonium polyphosphate, phosphate ester flame retardants, hypophosphite or aluminum hydroxide; the silane coupling agent is selected from one or more of epoxy silane coupling agents, amino silane coupling agents or vinyl silane coupling agents.

9. The high-temperature resistant epoxy molding compound material for silicon carbide packaging devices according to claim 1, characterized in that, It also includes 1 to 5 parts of pigment, wherein the pigment is carbon black.

10. A method for preparing a high-temperature resistant epoxy molding compound material for silicon carbide packaging devices as described in any one of claims 1-9, characterized in that, The process includes the following steps: after mixing all raw materials evenly, heating and extruding the mixture in a twin-screw extruder, cooling and crushing it, and then pre-pressing it to obtain a high-temperature resistant epoxy molding compound material.

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