Combined computer host case

Abstract

The invention discloses a combined computer host case. The combined computer host case comprises a calculation function cabin, a heat dissipation function cabin and an extended storage function cabin. The functional cabins are detachably connected through interconnection frames arranged among the functional cabins, and mechanical interconnection mechanisms and electrical interconnection interfaces are arranged on the interconnection frames and used for achieving mechanical fixation, power distribution and data transmission between the adjacent cabins. Wherein the calculation function cabin is used for accommodating a core calculation part, the heat dissipation function cabin forms an independent power supply cabin and a video card cabin through an internal isolation air duct plate, and the extended storage function cabin is provided with a hard disk bracket which can be vertically inserted and pulled. The functional cabins are sequentially stacked from bottom to top, and hidden installation and electromagnetic shielding continuity are achieved through cooperation of the shield structure and the interconnection frame. According to the scheme, the problems of internal heat accumulation, insufficient electromagnetic shielding effectiveness, difficulty in hardware expansion and maintenance and the like of a traditional integrated case are effectively solved, and the integrated case has the advantages of compact structure, high heat dissipation efficiency, good electromagnetic compatibility and convenience in maintenance.

Description

Technical Field

[0001] This invention relates to the field of computer hardware technology, and in particular to a modular computer chassis. Background Technology

[0002] As the core computing device, the desktop computer chassis plays a crucial role in housing, securing, and protecting key hardware components such as the motherboard, central processing unit (CPU), power supply, data storage devices, and various expansion cards. Currently, most mainstream computer chassis on the market adopt an integrated sheet metal or plastic shell structure, concentrating all functional components within a single enclosed or semi-enclosed space. This traditional architecture has gradually revealed several inherent technical shortcomings over long-term use.

[0003] Firstly, regarding heat dissipation performance, the limited internal space of an all-in-one chassis means all heat-generating components, such as high-power graphics cards, power supplies, and high-speed storage devices, share the same thermal environment. This easily leads to heat buildup and thermal interference, especially under high-load computing scenarios. Inefficient heat dissipation can cause components to overheat and throttle, affecting the stable output of computing performance. Although adding fans or liquid cooling systems can improve heat dissipation, this often comes with increased noise, increased energy consumption, and more complex internal airflow design.

[0004] Secondly, regarding electromagnetic compatibility (EMC), high-frequency electronic components inside the chassis generate electromagnetic radiation and may also be subject to interference from the external electromagnetic environment. Traditional chassis rely on an integral metal shell for shielding, but electromagnetic leakage points can easily form at the front panel interfaces, ventilation openings, and gaps between chassis joints, weakening the overall shielding effectiveness, potentially affecting the normal operation of the equipment, and making it difficult to meet increasingly stringent EMC standards.

[0005] Furthermore, in terms of scalability and maintainability, the integrated structure makes hardware upgrades, troubleshooting, and routine cleaning relatively difficult. Users or maintenance personnel often need to remove multiple side panels or even partially disassemble the structure to access specific internal components. Cable management is also a major challenge; messy cables not only obstruct airflow and affect heat dissipation but also increase the risk of poor contact and reduce the utilization of internal space. Summary of the Invention

[0006] In view of this, embodiments of the present invention provide a modular computer chassis to solve or improve the technical problems existing in the prior art.

[0007] The technical solution of this invention is implemented as follows: a modular computer host chassis, comprising: The functional compartment unit has a computing functional compartment for accommodating core computing components, a heat dissipation functional compartment for accommodating high-heat-generating components, and an extended storage functional compartment for accommodating data storage devices. The interconnection frame is set between any two adjacent functional modules, has a mechanical interconnection mechanism on the interconnection frame, and has an electrical interconnection interface located within the interconnection frame, for realizing detachable connection between adjacent functional modules, and for realizing power distribution and data transmission between adjacent functional modules; The computing function compartment, the heat dissipation function compartment, and the extended storage function compartment are stacked sequentially from bottom to top and interconnected with each other through the interconnection frame.

[0008] As an improvement, the computing module includes: The calculation chamber is a rectangular hollow cavity structure with an opening at the top, and its bottom is integrally formed with a base. A motherboard mounting tray is horizontally positioned within the computing compartment to support and secure the computer motherboard. The first connecting ring is fixedly installed on the upper part of the inner wall of the computing cabin and cooperates with the mechanical interconnection mechanism. The portion of the computing cabin located above the first connecting ring extends upward to form a first protective cover. The inner contour of the first protective cover is adapted to the outer contour of the interconnect frame and is used to be fitted onto the outside of the interconnect frame during docking.

[0009] As an improvement, the heat dissipation compartment includes: The heat dissipation chamber is a horizontally placed rectangular box structure; An isolation air duct plate is horizontally set in the middle of the inner cavity of the heat dissipation chamber, dividing the heat dissipation chamber into two independent heat dissipation spaces, the heat dissipation space located on the upper side of the isolation air duct plate constitutes the power supply compartment, and the heat dissipation space located on the lower side of the isolation air duct plate constitutes the graphics card compartment. The heat dissipation vents are provided in two sets, located at one end of the heat dissipation chamber, and respectively in the power supply compartment and the graphics card compartment; An exhaust fan is located at the other end of the heat dissipation chamber and is configured corresponding to the power supply compartment and the graphics card compartment to exhaust hot air from the chamber. The second connecting ring is provided in two parts, which are respectively fixedly embedded in the openings at the top and bottom of the heat dissipation chamber; The portion of the heat dissipation chamber located above the second connecting ring has its circumferential sidewalls extending upward to form a second upper shield; the portion of the heat dissipation chamber located below the second connecting ring has its circumferential sidewalls extending downward to form a second lower shield; the second lower shield abuts against the first shield of the computing function compartment to achieve a concealed installation of the interconnect frame.

[0010] As an improvement, the extended storage compartment includes: The extended storage compartment has a rectangular hollow cavity structure with an opening at the top; Multiple hard drive trays are provided, and each hard drive tray is arranged parallel and spaced apart in the extended storage compartment. The two sides of each hard drive tray are slidably connected to the inner wall of the extended storage compartment to realize its vertical insertion and removal perpendicular to the bottom surface of the extended storage compartment. The cover plate is magnetically attached to the side end face of the extended storage compartment by magnets located on its edge, and is used to seal the upper opening of the extended storage compartment; The third connecting ring is fixedly installed on the lower part of the inner wall of the extended storage compartment; The portion of the extended storage compartment located below the third connecting ring has its circumferential sidewalls extending downward to form a third protective cover; when the extended storage functional compartment is docked with the interconnect frame below, the third protective cover is fitted over the outside of the corresponding interconnect frame and docks with the second upper protective cover on the top of the heat dissipation functional compartment.

[0011] As an improvement, the interconnection frame has a rectangular frame structure.

[0012] As an improvement, the mechanical interconnection mechanism includes: Multiple guide posts are provided, each located at one of the four corners of the interconnection frame, and are inserted into the corresponding connecting rings; Each of the guide posts extends perpendicular to the mating surface of the interconnection frame and is used to engage with the connecting ring in the corresponding functional compartment.

[0013] As an improvement, the electrical interconnection interface includes: An electrical interface socket array is fixedly installed within the interconnection frame and is used to transmit power and low-speed control signals between adjacent functional compartments. A high-speed data bus bridge board is fixedly installed within the interconnection frame and arranged side by side with the electrical interface socket array. It is used to establish a PCIe high-speed data communication channel between the computing function compartment and the heat dissipation function compartment or the extended storage function compartment.

[0014] As an improvement, the joint surfaces of the interconnection frame with the computing functional compartment, the heat dissipation functional compartment, and the extended storage functional compartment are provided with electromagnetic shielding pads to form a continuous electromagnetic shielding cavity after docking.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention divides the host chassis into three independent modules: a computing module, a cooling module, and an expansion storage module, employing a vertical stacking layout. This effectively isolates the heat sources of core computing components, high-heat-generating components (such as the power supply and graphics card), and storage devices. The cooling module features an isolation air duct plate, creating independent cooling spaces for the power supply and graphics card. Combined with a forced exhaust design, this avoids the problem of heat flow interference found in traditional all-in-one chassis, significantly improving overall cooling efficiency, preventing component overheating and throttling, and ensuring the stability of high-performance computing.

[0016] This invention provides electromagnetic shielding pads at the joint surfaces of each functional compartment and the interconnection frame, and forms a continuous electromagnetic shielding cavity through a protective cover structure after docking. This effectively reduces electromagnetic leakage points caused by interfaces and gaps in traditional chassis, enhances the overall electromagnetic shielding performance, and reduces the risk of internal components being affected by external interference.

[0017] This invention employs a detachable interconnect frame and modular functional compartment design, allowing users to quickly disassemble and replace specific functional compartments (such as the hard drives in the extended storage compartment, which can be easily maintained through vertical plug-and-play) without disassembling the entire chassis. Internal cables are centrally managed through the electrical interfaces of the interconnect frame, reducing cable clutter, improving airflow, lowering the risk of poor contact, and simplifying hardware upgrades and routine maintenance.

[0018] This invention achieves precise positioning and secure connection between functional compartments through the guide columns and connecting ring mechanism of the interconnected frame. The protective cover structure conceals the connecting components, improving the overall appearance. The stacked layout saves space, while the rectangular frame interconnection design ensures mechanical strength and electrical connection stability.

[0019] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a modular computer host chassis according to the present invention; Figure 2 This is a schematic diagram of the internal structure of a modular computer host chassis according to the present invention; Figure 3 for Figure 2 A magnified view of a section at point B in the middle; Figure 4 This is a schematic diagram of the computing module in a modular computer chassis according to the present invention. Figure 1 ; Figure 5 This is a schematic diagram of the computing module in a modular computer chassis according to the present invention. Figure 2 ; Figure 6 This is a schematic diagram of the interconnect frame portion in a modular computer host chassis according to the present invention; Figure 7 This is a schematic diagram of the internal structure of the heat dissipation compartment in a modular computer host chassis according to the present invention. Figure 8 This is a schematic diagram of the structure of an extended storage compartment in a modular computer host chassis according to the present invention; Figure 9 This is a schematic diagram of the internal structure of an extended storage compartment in a modular computer host chassis according to the present invention.

[0022] Figure label: 1. Computing module; 11. Computing module body; 12. Base; 13. Motherboard mounting tray; 14. First connecting ring; 2. Heat dissipation compartment; 21. Heat dissipation compartment body; 22. Isolation air duct plate; 23. Heat dissipation hole section; 24. Exhaust fan; 25. Second connecting ring; 3. Extended storage compartment; 31. Extended storage compartment body; 32. Hard drive bracket; 33. Cover plate; 34. Third connecting ring; 4. Interconnection frame; 5. Guide pillars; 61. Electrical interface female connector array; 62. High-speed data bus bridge board; 7. Electromagnetic shielding pad. Detailed Implementation

[0023] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0024] It is important to note that terms such as "first," "second," "symmetric," and "array" are used only to distinguish between descriptive and positional descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified with terms such as "first" or "symmetric" may explicitly or implicitly include one or more of that feature; similarly, when the quantity of certain features is not limited by words such as "two" or "three," it should be noted that such features also explicitly or implicitly include one or more features. In this invention, unless otherwise explicitly specified and limited, terms such as "installation," "connection," and "fixation" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection, a direct connection, a welding connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the accompanying drawings and specific circumstances.

[0025] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0026] This invention provides a modular computer chassis, which can be referred to as follows. Figures 1-2 The system includes functional compartment units and an interconnect frame 4. Each functional compartment unit has a computing compartment 1 for housing core computing components, a heat dissipation compartment 2 for housing high-heat-generating components, and an extended storage compartment 3 for housing data storage devices. The interconnect frame 4 is positioned between any two adjacent functional compartments, has a mechanical interconnection mechanism on the interconnect frame 4, and an electrical interconnection interface within the interconnect frame 4, for enabling detachable connections between adjacent functional compartments and for power distribution and data transmission between adjacent functional compartments. The computing compartment 1, heat dissipation compartment 2, and extended storage compartment 3 are stacked sequentially from bottom to top and interconnected via the interconnect frame 4.

[0027] This invention divides the host chassis into three independent modules: a computing functional compartment 1, a heat dissipation functional compartment 2, and an expansion storage functional compartment 3. These modules are arranged in a vertically stacked layout, and an interconnecting frame 4 enables detachable mechanical connections and power and data transmission between the functional compartments. This effectively isolates the heat sources of core computing components, high-heat-generating components, and storage devices, avoiding the problems of heat flow interference and heat accumulation found in traditional integrated chassis, thus improving heat dissipation efficiency. Simultaneously, the modular design makes hardware expansion and maintenance more convenient. Users can individually disassemble and replace specific functional compartments, simplifying the upgrade and maintenance process. This solves the shortcomings of traditional chassis, such as heat accumulation inside the chassis and difficulties in hardware expansion and maintenance.

[0028] As one implementation method of this embodiment, please refer to Figures 4-5 The computing function compartment 1 includes a computing compartment body 11, a motherboard mounting tray 13, and a first connecting ring 14. The computing compartment body 11 is a rectangular hollow cavity structure with an open top. As the main structure, it provides physical space and a protective shell for core computing components such as the motherboard and CPU, protecting them from external collisions and interference. The bottom of the computing compartment body 11 has an integrally formed base 12, which can enhance the stability and anti-tipping ability of the chassis and ensure the stability of the host computer.

[0029] The motherboard mounting tray 13 is horizontally positioned within the computing compartment 11 to support and secure the computer motherboard. Serving as a mounting platform, the motherboard mounting tray 13 provides standard screw holes and other fixing methods to ensure the motherboard is accurately positioned and securely fixed within the computing compartment 11, preventing loosening due to transportation or vibration. Simultaneously, the horizontally positioned motherboard mounting tray 13 provides a stable and reliable mounting platform for the computer motherboard, effectively preventing bending moments from heavy heatsinks and reducing the risk of motherboard deformation. It also facilitates cabling and the installation of various expansion cards.

[0030] The first connecting ring 14 is fixedly installed on the upper part of the inner wall of the computing module 11 and cooperates with the mechanical interconnection mechanism. The first connecting ring 14 has a ring-shaped structure, realizing the mechanical connection between the computing module 1 and the mechanical interconnection mechanism on the upper interconnection frame 4, so as to achieve precise alignment and initial locking between the computing module 1 and the interconnection frame 4. At the same time, in the stacked structure of the functional modules, each functional module is connected through the interconnection frame 4, which can ensure the structural strength of the connection between the functional modules.

[0031] The portion of the computing cabin 11 located above the first connecting ring 14 extends upward to form a first protective cover. The inner contour of the first protective cover is adapted to the outer contour of the interconnection frame 4 and is used to be fitted onto the outside of the interconnection frame 4 during docking.

[0032] During the docking process, the first protective cover is fitted over the outside of the interconnect frame 4, further serving a guiding and positioning function to ensure the stability of the connection between the computing function compartment 1 and the interconnect frame 4. Simultaneously, the first protective cover encloses the interconnect frame 4, achieving a concealed installation and giving the chassis a cohesive and clean overall appearance, enhancing its visual appeal. Furthermore, the tight fit with the interconnect frame 4 forms an additional physical barrier, helping to enhance electromagnetic shielding and reduce dust ingress into the internal connection interfaces.

[0033] During assembly, the computer motherboard is first mounted and secured on the motherboard mounting tray 13. Then, the motherboard mounting tray 13, with the motherboard attached, is placed and secured inside the computing compartment 11. At this point, all core computing components of the computer host are integrated and protected within the computing compartment 11. The base 12 ensures the stability of the core units when placed within the computer host.

[0034] When assembling the complete host, the computing module 1, as the lowest-level module, docks with the interconnect frame 4 above it via the first connecting ring 14 and the first protective cover integrated on its upper part. The first protective cover guides the interconnect frame 4 into the correct position, and then the first connecting ring 14 inserts into the mechanical interconnection mechanism of the interconnect frame 4 to complete the mechanical connection. At the same time, the electrical interface socket array 61 and the high-speed data bus bridge board 62 within the interconnect frame 4 dock with the interfaces extending from the motherboard to complete the power and data communication.

[0035] Through the connection between the computing module 1 and the interconnect frame 4, the motherboard in the computing module 1 gains the ability to transmit power, control signals and high-speed data upwards, thereby driving and controlling the devices in the heat dissipation module and the extended storage module stacked above it, realizing a complete workflow from core computing to functional expansion.

[0036] In specific implementations, the computing function compartment 1, through its rectangular computing compartment body 11 with an upper opening, an integrally formed bottom base 12, and a horizontally arranged motherboard mounting tray 13, provides a stable and protected independent installation space for the core computing components. The first connecting ring 14 on the upper part of its inner wall cooperates with the first protective cover that extends upward. When docking with the interconnect frame 4, the first protective cover is fitted outside the interconnect frame 4 and abuts against the protective cover of the upper function compartment. This structure not only achieves precise positioning and concealed connection between function compartments, ensuring the simplicity of the overall appearance, but also forms a continuous electromagnetic shielding cavity together with the electromagnetic shielding pad 7, effectively solving the electromagnetic leakage problem caused by the seams of traditional chassis and significantly improving electromagnetic compatibility.

[0037] As one implementation method of this embodiment, please refer to Figure 3 and 7 The heat dissipation compartment 2 includes a heat dissipation body 21, an isolation air duct plate 22, a heat dissipation hole section 23, an exhaust fan 24, and a second connecting ring 25. The heat dissipation body 21 is a horizontally placed rectangular box structure, serving as the main body of the heat dissipation compartment 2 and providing space for heat dissipation of the power supply and graphics card. The isolation duct plate 22 is horizontally positioned in the center of the inner cavity of the heat dissipation chamber 21, dividing the heat dissipation chamber 21 into two independent heat dissipation spaces. The heat dissipation space located on the upper side of the isolation duct plate 22 constitutes the power supply compartment, and the heat dissipation space located on the lower side of the isolation duct plate 22 constitutes the graphics card compartment. The isolation duct plate 22 separates the heat dissipation chamber 21 into two independent heat dissipation spaces, physically isolating the main heat sources of the power supply and graphics card in terms of airflow and preventing mutual interference of their hot airflows, thus forming independent heat dissipation channels and greatly improving their heat dissipation efficiency. At the same time, the isolation duct plate 22 also serves as an internal support structure for the heat dissipation functional compartment 2, enhancing the rigidity and deformation resistance of the heat dissipation chamber 21.

[0038] Two sets of heat dissipation holes 23 are provided, located at one end of the heat dissipation chamber 21, and respectively in the power supply compartment and the graphics card compartment; external cold air enters the corresponding power supply compartment and the graphics card compartment through the corresponding heat dissipation holes 23, ensuring that the incoming air can flow directly over the heat-generating surface of the power supply or the graphics card to achieve efficient heat exchange.

[0039] An exhaust fan 24 is located at the other end of the heat dissipation chamber 21, corresponding to the power supply compartment and the graphics card compartment, and is used to exhaust hot air from the chamber. As the power source for the heat dissipation chamber 2, the exhaust fan 24 actively forces the air in the heat dissipation chamber 21, after heat exchange, to be expelled from the rear of the chamber. When the exhaust fan 24 is working, it creates a negative pressure in the power supply compartment and the graphics card compartment, thereby forcibly drawing in cool air from the heat dissipation vents 23 at the other end, forming a horizontal forced airflow channel with a clear direction from front to back, which greatly improves the heat dissipation efficiency of the heat dissipation chamber 2.

[0040] Two second connecting rings 25 are provided, which are fixedly embedded in the openings at the top and bottom of the heat dissipation chamber 21, respectively. The second connecting ring 25 at the top of the heat dissipation chamber 21 is used to connect the upper interconnect frame 4 and the extended storage function compartment 3. The second connecting ring 25 at the bottom is used to connect the lower interconnect frame 4 and the computing function compartment 1, so as to realize the stacking of each function compartment.

[0041] The portion of the heat dissipation chamber 21 located above the second connecting ring 25 has its circumferential sidewalls extending upward to form a second upper shield; the portion of the heat dissipation chamber 21 located below the second connecting ring 25 has its circumferential sidewalls extending downward to form a second lower shield; the second lower shield abuts against the first shield of the computing function compartment 1 to achieve a concealed installation of the interconnect frame 4.

[0042] When the second lower shield docks downwards, it abuts against the first shield of the computing function compartment 1; when the second upper shield docks upwards, it abuts against the third shield of the extended storage function compartment 3. After the second lower shield abuts against the first shield of the computing function compartment 1, it can cover the interconnection frame 4 located between the two, making the main unit chassis appear as a whole, aesthetically pleasing. At the same time, the overlapping metal structures of the shields, together with the electromagnetic shielding pads 7, form a continuous electromagnetic shielding cavity.

[0043] In specific implementations, the heat dissipation compartment 2 divides the chassis into independent power supply compartments and graphics card compartments through its internal horizontal isolation air duct plate 22, completely isolating the heat dissipation airflow of the two main heat sources. This effectively avoids the heat accumulation problem caused by mutual interference of hot airflow in traditional all-in-one chassis. With the heat dissipation holes 23 at one end of the chassis corresponding to each compartment and the forced exhaust fan 24 at the other end, independent horizontal forced air ducts with a clear direction from front to back are formed in each compartment, which greatly improves the heat dissipation efficiency of high-heat components such as power supply and graphics card, and ensures the stable performance of the host under high load operation.

[0044] As one implementation method of this embodiment, please refer to Figures 8-9 The extended storage compartment 3 includes an extended storage compartment body 31, hard drive trays 32, a cover plate 33, and a third connecting ring 34. The extended storage compartment body 31 is a rectangular hollow cavity structure with an open top, providing installation space and physical protection for all hard drive trays and storage devices.

[0045] Multiple hard drive trays 32 are provided, each arranged parallel and spaced apart within the expansion storage compartment 31. Each hard drive tray 32 is slidably connected to the inner wall of the expansion storage compartment 31 via a sliding rail structure on both sides, allowing for vertical insertion and removal perpendicular to the bottom surface of the expansion storage compartment 31. Each hard drive tray 32 can hold and secure one or more hard drives. The parallel, spaced arrangement allows for accommodating as many storage devices as possible within a limited space, optimizing storage density. The vertical sliding connection of the hard drive trays 32 to the expansion storage compartment 31 allows users to directly insert and remove hard drives from the top opening of the expansion storage compartment 31 without disassembling the entire chassis or touching other components, facilitating maintenance.

[0046] The cover 33 is magnetically attached to the side surface of the expansion storage compartment 31 via magnets located on its edge, thus sealing the upper opening of the expansion storage compartment 31. The cover 33 and the expansion storage compartment 31 together form a complete enclosed structure, protecting the internal hard drive from dust and accidental contact while maintaining the integrity of the overall appearance. Furthermore, the magnetic connection between the cover 33 and the expansion storage compartment 31 requires no tools, allowing for easy opening and closing by hand, facilitating access to the internal hard drive.

[0047] The third connecting ring 34 is fixedly installed on the lower part of the inner wall of the extended storage compartment 31; the third connecting ring 34 connects with the lower interconnect frame 4 to achieve precise positioning and locking. Furthermore, the total weight of the extended storage compartment 3 is transferred to the lower compartment via the interconnect frame 4.

[0048] The portion of the extended storage compartment 31 located below the third connecting ring 34 has its circumferential sidewalls extending downward to form a third protective cover; when the extended storage functional compartment 3 docks with the lower interconnect frame 4, the third protective cover is fitted onto the outside of the corresponding interconnect frame 4 and docks with the second upper protective cover on the top of the heat dissipation functional compartment 2.

[0049] When the third shield mates with the lower interconnect frame 4, it fits over the outside of the interconnect frame 4 for precise guidance. Simultaneously, the third shield extends downwards to mate with the second upper shield on top of the heat dissipation compartment 2, concealing the interconnect frame 4 located between them and maintaining the overall clean and aesthetically pleasing chassis. Furthermore, the tight fit with the second upper shield ensures the continuity of electromagnetic shielding.

[0050] In specific implementation details, the extended storage compartment 3, with its internal multiple vertically pluggable hard drive trays 32, enables direct plugging and unplugging of storage devices perpendicular to the bottom of the compartment. Users only need to open the magnetic cover 33 to perform maintenance from the top, completely avoiding the need for complete disassembly of traditional chassis to replace hard drives. The lower third connecting ring 34 and the downward-extending third protective cover, when docking with the interconnect frame 4, not only ensure precise positioning and mechanical strength between the functional compartments, but also maintain the continuity of the overall electromagnetic shielding cavity through docking with the lower functional compartment cover and the cooperation of the electromagnetic shielding pad. This greatly improves the convenience of storage hardware expansion and maintenance while effectively solving the problem of insufficient electromagnetic shielding performance caused by openings and module docking in traditional chassis.

[0051] As one implementation method of this embodiment, please refer to Figure 6 The Interconnection Frame 4 has a rectangular frame structure. This frame structure minimizes material usage, reducing weight and cost while ensuring sufficient structural strength. The central open area provides space for internal cabling. Furthermore, the rectangular shape of the Interconnection Frame 4 matches the rectangular openings of each functional compartment, ensuring compatibility and consistency in connections.

[0052] During assembly, the interconnect frame 4 is placed between the two functional compartments to be connected. The guide posts 5 on the interconnect frame 4 are precisely inserted into the connecting rings of the lower functional compartment, completing the initial positioning. Subsequently, the upper functional compartment is lowered, and its connecting rings are also fitted onto the guide posts 5 and abut against the upper surface of the interconnect frame 4. The rectangular frame structure of the interconnect frame 4 evenly distributes the pressing force, ensuring the rigidity and stability of the connection and bearing the weight and stress from the upper functional compartment.

[0053] In specific implementation methods, the interconnect frame 4, through the guide posts 5 located at its four corners, engages with the connecting rings of each functional compartment, providing precise mechanical positioning and robust connection for the stacked functional compartments, ensuring the stability of the overall structure. Its internally integrated electrical interface socket array 61 and high-speed data bus bridge board 62, while mechanically connecting, simultaneously complete power distribution between adjacent functional compartments, low-speed control signal transmission, and lossless bridging of the PCIe high-speed data channel, achieving centralized, standardized, and efficient electrical connections between functional compartments. Meanwhile, the electromagnetic shielding pads 7 set on the frame joint end faces, after docking, together with the protective structures of each functional compartment, form a continuous electromagnetic shielding cavity, effectively solving the electromagnetic leakage problem caused by module interfaces and splicing gaps in traditional chassis, and significantly improving the electromagnetic compatibility of the entire machine.

[0054] As one implementation method of this embodiment, please refer to Figure 3 and Figure 6 The mechanical interconnection mechanism includes guide posts 5. Multiple guide posts 5 are provided, respectively located at the four corners of the interconnection frame 4, and are inserted into corresponding connecting rings; each guide post 5 extends perpendicularly to the mating surface of the interconnection frame 4, and is used to insert and cooperate with the connecting ring in the corresponding functional compartment.

[0055] During the docking process, the guide posts 5 are first inserted into the corresponding holes of the connecting rings on the functional compartments, guiding the two functional compartments to be assembled in precise predetermined positions. The guide posts 5, distributed at the four corners of the interconnecting frame 4, effectively eliminate translational or rotational movements between the functional compartments in various horizontal directions, ensuring the accuracy and stability of the connection.

[0056] In specific implementation methods, the mechanical interconnection mechanism uses multiple guide posts 5 located at the four corners of the interconnection frame to vertically insert with the corresponding connecting rings in each functional compartment. This provides rapid and precise positioning and initial locking for the stacked functional compartments, effectively eliminating horizontal misalignment and rotation between compartments and ensuring the alignment accuracy and mechanical stability of the overall stacked structure. This design simplifies the assembly process, enables blind insertion between functional compartments, and provides a solid mechanical foundation for accurate contact of subsequent electrical interconnection interfaces and tight overlap of the protective structure. This solves the problem of traditional integrated chassis requiring complete disassembly for maintenance and difficulty in ensuring structural consistency after reassembly.

[0057] As one implementation method of this embodiment, please refer to Figure 6The electrical interconnection interface includes an electrical interface socket array 61 and a high-speed data bus bridge board 62. The electrical interface socket array 61 is fixedly mounted within the interconnection frame 4 and is used to transmit power and low-speed control signals between adjacent functional compartments. The electrical interface socket array 61 is a combination of multiple electrical interface sockets of various types arranged in a specific pattern, including power terminals and rectangular connectors with a large number of pins. It receives power from the grid and, through internal wiring, distributes different voltages (e.g., +12V, +5V, +3.3V) and sufficient current capacity to the functional compartments connected by the interconnection frame 4, supplying power to devices such as the graphics card in the heat dissipation functional compartment 2 and the hard drive in the extended storage functional compartment 3. Simultaneously, it is responsible for transmitting non-time-sensitive low-speed signals between functional compartments, including but not limited to the PWM speed control signal of the exhaust fan 24 in the heat dissipation functional compartment 2, temperature sensor data of various components, power status monitoring signals, and hard drive activity indicator signals in the extended storage functional compartment 3. Furthermore, the electrical interface female connector array 61 is arranged in the form of a female connector array on the interconnect frame 4, which avoids damage to the easily bent male pins during frequent plugging and unplugging, and improves the durability and reliability of the interface.

[0058] A high-speed data bus bridge board 62 is fixedly mounted within the interconnect frame 4 and arranged side-by-side with the electrical interface socket array 61. It is used to establish a high-speed PCIe data communication channel between the computing functional compartment 1 and the heat dissipation functional compartment 2 or the expansion storage functional compartment 3. Specifically, the high-speed data bus bridge board 62 serves as a carrier for signal relay and protocol conversion, integrating high-speed differential signal lines, impedance matching circuits, and possible signal reshaping chips. It is used to directly establish a physical, lossless PCIe (Peripheral Component Interconnect) bus channel between the computing functional compartment 1 and the heat dissipation functional compartment 2 (for graphics cards) or the expansion storage functional compartment 3 (for NVMe SSDs, etc.).

[0059] During the stacking of the functional compartments, as the guide pillars 5 of the mechanical interconnect mechanism are precisely positioned, the cable connectors inside each functional compartment are simultaneously and accurately inserted into the electrical interface socket array 61 and the high-speed data bus bridge board 62 within the interconnect frame 4, thus establishing three communication paths simultaneously: power, control, and high-speed data. After power is supplied, power originates from the power supply compartment of the heat dissipation functional compartment 2, and is distributed to the heat dissipation functional compartment 2 (powering the graphics card) via the electrical interface socket array 61 of the interconnect frame 4. Simultaneously, power is also distributed to the extended storage functional compartment 3 (powering the hard drive) via the electrical interface socket array 61 of the interconnect frame 4.

[0060] The motherboard in computing bay 1 reads temperature sensor data from the cooling bay 2 in real time via the electrical interface socket array 61 and issues speed control commands (PWM signals) to the exhaust fan 24 accordingly. It can also monitor the status of the hard drives in the expansion storage bay 3. The PCIe lanes provided by the motherboard in computing bay 1 are directly bridged to the graphics card slot in cooling bay 2 or the hard drive interface in expansion storage bay 3 via a high-speed data bus bridge board 62. The operating system recognizes this lane as a standard PCIe device, enabling full-speed data exchange with the graphics card or high-speed storage device without performance loss.

[0061] In specific implementations, the electrical interconnection interface, by arranging the electrical interface female array 61 and the high-speed data bus bridge board 62 side by side within the interconnection frame 4, automatically establishes power distribution, low-speed control signal transmission, and lossless PCIe high-speed data communication channels between functional compartments while the guide column 5 completes the compartment positioning. This integrated interface design completely replaces the messy flying wires in the traditional chassis, not only eliminating the obstruction of airflow by cables and improving the heat dissipation environment, but also effectively preventing poor contact through standardized plugs. Furthermore, it eliminates the need to deal with complicated wiring harnesses when disassembling and maintaining any functional compartment, thus systematically solving the inherent defects of chaotic cable management, difficult maintenance, and susceptibility to interference in high-speed signal transmission in the traditional architecture.

[0062] As one implementation method of this embodiment, please refer to Figure 3 and Figure 6 Electromagnetic shielding gaskets 7 are provided at the joint surfaces of the interconnect frame 4 with the computing functional compartment 1, the heat dissipation functional compartment 2, and the extended storage functional compartment 3 to form a continuous electromagnetic shielding cavity after docking. Specifically, the electromagnetic shielding gaskets 7 are made of conductive and elastic materials, such as conductive rubber, metal springs, or woven metal mesh gaskets. The electromagnetic shielding gaskets 7 are adapted to the rectangular end face contour of the interconnect frame 4.

[0063] When the functional compartments are connected by the interconnecting frame 4, microscopic unevenness and gaps exist between their joint surfaces, which will radiate or receive electromagnetic waves. The electromagnetic shielding gasket 7, when compressed, can elastically fill these gaps, establishing a low-impedance electrical path at the mechanical joints, transforming the originally discontinuous metal surfaces into an electrically continuous whole. By establishing this conductive continuity, the propagation path of electromagnetic energy through the joints can be effectively blocked, thereby transforming a system composed of multiple independent metal cavities into a complete and continuous electromagnetic shield.

[0064] In a specific implementation, the electromagnetic shielding pads 7, located at the joint surfaces of the interconnecting frame 4 and each functional compartment, fill the physical gaps between the frame and the compartment with their conductive elastic material after being mated and pressed together. This establishes a continuous low-impedance electrical path at the mechanical joints of the modular splicing of the functional compartments, electrically connecting the originally independent metal shells of the functional compartments into a complete Faraday cage. This effectively blocks the leakage path of electromagnetic energy through the joint gaps, specifically solving the problem of electromagnetic shielding continuity interruption caused by ventilation openings, module interfaces, and enclosure splicing in traditional integrated chassis, and significantly improving the electromagnetic shielding effectiveness and anti-interference capability of the entire machine.

[0065] In specific implementation of this invention: 1) Chassis assembly: The chassis adopts a vertical stacking architecture, with computing compartment 1, heat dissipation compartment 2, and expansion storage compartment 3 arranged from bottom to top.

[0066] The interconnect frame 4, acting as a connecting component, is placed between any two adjacent functional compartments. During assembly, the guide posts 5 at the four corners of the interconnect frame 4 are first inserted into the corresponding holes of the first connecting ring 14 of the calculation functional compartment 1. Subsequently, as the heat dissipation functional compartment 2 is lowered, its bottom second connecting ring 25 is also inserted into the same guide posts 5 and fits against the upper surface of the interconnect frame 4. The guide posts 5 ensure that all functional compartments can be quickly and accurately aligned during stacking.

[0067] At this point, each functional compartment extends above or below the connecting ring to form a protective shield (the first shield of the computing functional compartment 1, the second upper shield and the second lower shield of the heat dissipation functional compartment 2, and the third shield of the extended storage functional compartment 3). After docking, the shields of the upper and lower functional compartments abut against each other, completely concealing the interconnect frame 4. This not only ensures a coherent and clean appearance of the chassis but also forms a physical barrier.

[0068] Meanwhile, electromagnetic shielding pads 7 are embedded at the joint surfaces of the interconnection frame 4 and each functional compartment. When the functional compartments are pressed onto the interconnection frame 4, the electromagnetic shielding pads 7 are compressed, filling the microscopic gaps and establishing a continuous, low-impedance electrical path between the functional compartments. Together, they form a complete electromagnetic shielding cavity, effectively preventing internal electromagnetic leakage and external interference.

[0069] 2) Power distribution and signal transmission: The power supply, serving as the main power source, is directly installed within the power supply compartment of the cooling compartment 2. The power supply's output cables are directly connected to the electrical interface socket array 61 within its interconnect frame 4. Power is transmitted downwards through the electrical interface socket array 61 of the interconnect frame 4 to the computing compartment 1, supplying power to core computing components such as the motherboard, CPU, and memory. Simultaneously, power is transmitted upwards through the same interconnect frame 4 (or another interconnect frame 4 above it) to the extended storage compartment 3, supplying power to all hard drives. The power supply can also power the graphics card and exhaust fan 24 located within the cooling compartment 2.

[0070] The electrical interface female array 61 integrates a variety of power terminals and connectors, which are responsible for accurately distributing different voltages (such as +12V, +5V, +3.3V) and currents of the power output to each functional compartment.

[0071] The low-speed control signal transmission path is implemented through the electrical interface socket array 61, with the motherboard in the computing function compartment 1 serving as the system control center. The motherboard reads temperature sensor data from the graphics card and power supply in the cooling function compartment 2, as well as the status data of the hard drives in the extended storage function compartment 3, in real time via the electrical interface socket array 61. Based on this data, the motherboard generates control signals (such as PWM signals) and sends them to the exhaust fan 24 in the cooling function compartment 2 through the same path, achieving intelligent speed regulation.

[0072] The high-speed data communication path is implemented by the high-speed data bus bridge board 62. The PCIe lanes provided by the motherboard in the computing function compartment 1 are connected to the high-speed data bus bridge board 62 via dedicated cables. The high-speed data bus bridge board 62 integrates high-speed differential signal lines and possible signal reshaping chips to ensure signal integrity. The PCIe lanes are bridged without loss to the graphics card slots in the heat dissipation function compartment 2 or the hard drive interfaces (such as NVMe interfaces) in the expansion storage function compartment 3 via the high-speed data bus bridge board 62.

[0073] 3) Heat dissipation: The isolation air duct plate 22 divides the inner cavity of the heat dissipation chamber 21 into the upper power supply chamber and the lower graphics card chamber, so that the heat dissipation airflow of the two main heat sources (power supply and graphics card) is completely independent, avoiding mutual interference of hot exhaust gases.

[0074] During the heat dissipation process, external cool air enters the power supply compartment through the corresponding heat dissipation vents 23. When the exhaust fan 24 is working, it creates a negative pressure inside the compartment, forcibly drawing hot air out from the rear. Similarly, external cool air enters the graphics card compartment through another set of heat dissipation vents 23, blowing directly onto the graphics card cooler. When the exhaust fan 24 is working, it creates a negative pressure inside the compartment, forcibly drawing hot air out from the rear.

[0075] 4) Maintenance and expansion: When maintenance of the internal components of the chassis is required, since all functional compartments are detachably connected via the interconnect frame 4, maintenance can be performed simply by removing the corresponding functional compartment from its top. Similarly, when upgrading or replacing the hard drive in the expansion storage compartment 3, the user can simply lift the magnetically attached cover 33 and directly insert or remove the hard drive mounted vertically on the hard drive tray 32 from the top, without disassembling the entire chassis or touching other components.

[0076] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in the present invention, and these should all be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A modular computer chassis, characterized in that, include: The functional compartment unit has a computing functional compartment (1) for accommodating core computing components, a heat dissipation functional compartment (2) for accommodating high-heat-generating components, and an extended storage functional compartment (3) for accommodating data storage devices. Interconnection frame (4), set between any two adjacent functional compartments, has a mechanical interconnection mechanism on the interconnection frame (4) and an electrical interconnection interface within the interconnection frame (4) for realizing detachable connection between adjacent functional compartments, and for realizing power distribution and data transmission between adjacent functional compartments; The computing function compartment (1), the heat dissipation function compartment (2), and the extended storage function compartment (3) are stacked sequentially from bottom to top and interconnected with each other through the interconnection frame (4).

2. The modular computer chassis according to claim 1, characterized in that, The computing module (1) includes: The calculation chamber (11) has a rectangular hollow cavity structure with an open top, and a base (12) is integrally formed at the bottom. The motherboard mounting tray (13) is horizontally positioned inside the computing compartment (11) to support and fix the computer motherboard; The first connecting ring (14) is fixedly installed on the upper part of the inner wall of the computing cabin (11) and cooperates with the mechanical interconnection mechanism; The portion of the computing cabin (11) above the first connecting ring (14) extends upward to form a first protective cover. The inner contour of the first protective cover is adapted to the outer contour of the interconnect frame (4) and is used to be fitted onto the outside of the interconnect frame (4) during docking.

3. A modular computer chassis according to claim 2, characterized in that... The heat dissipation chamber (2) includes: The heat dissipation chamber (21) has a horizontally placed rectangular box structure; The isolation air duct plate (22) is horizontally set in the middle of the inner cavity of the heat dissipation chamber (21), dividing the heat dissipation chamber (21) into two independent heat dissipation spaces, the heat dissipation space located on the upper side of the isolation air duct plate (22) constitutes the power supply compartment, and the heat dissipation space located on the lower side of the isolation air duct plate (22) constitutes the graphics card compartment. The heat dissipation hole section (23) is provided in two sets, which are located at one end of the heat dissipation chamber (21) and should be respectively located in the power supply compartment and the graphics card compartment; An exhaust fan (24) is located at the other end of the heat dissipation chamber (21) and is configured corresponding to the power supply compartment and the graphics card compartment, for exhausting hot air from the chamber; The second connecting ring (25) is provided in two parts, which are respectively fixedly embedded in the openings at the top and bottom of the heat dissipation chamber (21); The portion of the heat dissipation chamber (21) above the upper second connecting ring (25) has its circumferential sidewalls extending upward to form a second upper shield; the portion of the heat dissipation chamber (21) below the lower second connecting ring (25) has its circumferential sidewalls extending downward to form a second lower shield; the second lower shield abuts against the first shield of the computing function compartment (1) to achieve a concealed installation of the interconnect frame (4).

4. A modular computer chassis according to claim 3, characterized in that, The extended storage compartment (3) includes: The extended storage compartment (31) has a rectangular hollow cavity structure with an opening at the top; Multiple hard disk trays (32) are provided, and each hard disk tray (32) is arranged in parallel and spaced apart in the extended storage compartment (31). The two sides of each hard disk tray (32) are slidably connected to the inner wall of the extended storage compartment (31) to realize its vertical insertion and removal perpendicular to the bottom surface of the extended storage compartment (31). The cover plate (33) is attached to the side end face of the extended storage compartment (31) by magnets set on its edge, and is used to close the upper opening of the extended storage compartment (31). The third connecting ring (34) is fixedly installed on the lower part of the inner wall of the extended storage compartment (31); The portion of the extended storage compartment (31) located below the third connecting ring (34) has its circumferential sidewalls extending downward to form a third protective cover; when the extended storage functional compartment (3) docks with the lower interconnect frame (4), the third protective cover is fitted onto the outside of the corresponding interconnect frame (4) and docks with the second upper protective cover on the top of the heat dissipation functional compartment (2).

5. A modular computer chassis according to claim 1, characterized in that: The interconnection framework (4) has a rectangular frame structure.

6. A modular computer chassis according to claim 4, characterized in that, The mechanical interconnection mechanism includes: Multiple guide posts (5) are provided and are respectively set at the four corners of the interconnection frame (4) and are inserted into the corresponding connecting rings; Each of the guide posts (5) extends perpendicularly to the mating surface of the interconnect frame (4) and is used to engage with the connecting ring in the opposite functional compartment.

7. A modular computer chassis according to claim 1, characterized in that, The electrical interconnection interface includes: An electrical interface socket array (61) is fixedly installed within the interconnection frame (4) for transmitting power and low-speed control signals between adjacent functional compartments; A high-speed data bus bridge board (62) is fixedly installed in the interconnect frame (4) and arranged side by side with the electrical interface socket array (61) to establish a PCIe high-speed data communication channel between the computing function compartment (1) and the heat dissipation function compartment (2) or the extended storage function compartment (3).

8. A modular computer chassis according to any one of claims 1, characterized in that, The interconnection frame (4) is provided with an electromagnetic shielding pad (7) at the joint end face of the computing function compartment (1), the heat dissipation function compartment (2) and the extended storage function compartment (3) to form a continuous electromagnetic shielding cavity after docking.

Images