Wiring method of printed circuit board

Abstract

The invention discloses a wiring method of a printed circuit board. The method comprises the steps that a lamination file of the printed circuit board is acquired, a first corresponding relation is constructed based on the lamination file, the first corresponding relation represents the corresponding relation between each signal and a physical constraint condition under different preset impedances, and the signals are signals used for constructing the printed circuit in the lamination file; obtaining principle structure data of the printed circuit board, and obtaining a target signal and target impedance corresponding to the target signal from the principle structure data; determining a physical constraint condition simultaneously corresponding to the target signal and the target impedance from the first corresponding relation as a target physical constraint condition corresponding to the target signal; and inputting a target physical constraint condition corresponding to the target signal into printed circuit board layout software, so that the printed circuit board layout software performs automatic wiring according to the target physical constraint condition. According to the embodiment of the invention, full-automatic wiring of the printed circuit board can be realized, and the wiring efficiency is improved.

Description

Technical Field

[0001] This application belongs to the field of circuit layout, and in particular relates to a wiring method for printed circuit boards. Background Technology

[0002] With the rapid development of cutting-edge technologies such as artificial intelligence, electronic devices are becoming increasingly complex and integrated. As a core component of electronic devices, the design of printed circuit boards (PCBs) is becoming increasingly important.

[0003] In related technologies, automated PCB routing can be achieved through some automatic routing software. However, although these software programs have a certain degree of automation, in actual operation, technicians still need to spend a lot of time and effort manually inputting the physical constraints corresponding to each signal. This process not only increases labor costs but is also prone to human input errors, severely hindering the improvement of routing efficiency.

[0004] Therefore, how to achieve fast and accurate PCB routing is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application provides a wiring method for printed circuit boards, which can realize fully automated PCB wiring and improve wiring efficiency.

[0006] In a first aspect, embodiments of this application provide a routing method for a printed circuit board, comprising: acquiring a stack-up file of the printed circuit board, and constructing a first correspondence relationship based on the stack-up file, wherein the first correspondence relationship characterizes the correspondence between each signal and physical constraints under different preset impedances, and the signals are signals used to construct printed circuits in the stack-up file; acquiring schematic structure data of the printed circuit board, and acquiring a target signal and a target impedance corresponding to the target signal from the schematic structure data; determining physical constraints corresponding to both the target signal and the target impedance from the first correspondence relationship, and using these as target physical constraints corresponding to the target signal; and inputting the target physical constraints corresponding to the target signal into printed circuit board layout software, so that the printed circuit board layout software performs automatic routing according to the target physical constraints.

[0007] In one embodiment, obtaining a stack-up file of a printed circuit board and constructing a first correspondence based on the stack-up file includes: converting the stack-up file into a markup text format to obtain a markup text format stack-up file; and constructing a first correspondence based on the markup text format stack-up file.

[0008] In one embodiment, converting an overlay file into a markup text format to obtain an overlay file in markup text format includes: constructing an overlay information list based on valid overlay information in the overlay file; According to the preset key, retrieve the value corresponding to the key from the overlay information list; construct the material dictionary and overlay dictionary based on the preset key and the value corresponding to the preset key; call the element tree corresponding to the markup text format, and construct the markup text format overlay file based on the material dictionary and overlay dictionary.

[0009] In one embodiment, acquiring the schematic structure data of a printed circuit board and acquiring the target signal and the target impedance corresponding to the target signal from the schematic structure data includes: acquiring the target signal according to the schematic structure data; classifying the target signal according to a preset classification rule to obtain multiple categories of target signals; and using the impedance corresponding to the preset classification rule as the target impedance corresponding to each category of target signal.

[0010] In one embodiment, the target signal includes a differential signal; the method further includes: constructing a target text file containing the differential signal based on the principle structure data; and determining the target impedance corresponding to the differential signal in the target text file according to a preset differential impedance library.

[0011] In one implementation, constructing a target text file containing differential signals based on schematic structure data includes: obtaining network connection information corresponding to components from the schematic structure data; constructing a network tree based on the network connection information; obtaining differential pair information based on the network tree; and storing the obtained differential pair information as a target text file.

[0012] In one embodiment, after acquiring the schematic structure data of the printed circuit board and obtaining the target signal and the target impedance corresponding to the target signal from the schematic structure data, the method further includes: if there is no physical constraint condition that corresponds to both the target signal and the target impedance in the first correspondence, constructing a target physical constraint condition that satisfies the target impedance based on the target impedance and the overlay file.

[0013] In one embodiment, after inputting the target physical constraints corresponding to the target signal into the printed circuit board layout software, the method further includes: obtaining the package name of the printed circuit board; determining the target fan-out mode that matches the package name from the preset package fan-out library; and performing fan-out operation on the package of the printed circuit board according to the target fan-out mode.

[0014] In one embodiment, the preset package fan-out library includes at least: a fan-out layout library and a region rule library, wherein the fan-out layout library contains layout methods corresponding to different package devices, and the region rule library contains region rules corresponding to different package devices.

[0015] In one implementation, the physical constraints include at least one of line width, line spacing, and length matching rules.

[0016] Secondly, embodiments of this application provide a wiring method apparatus for a printed circuit board, comprising: The first acquisition module is used to acquire the stack-up file of the printed circuit board and construct a first correspondence relationship based on the stack-up file. The first correspondence relationship represents the correspondence between each signal and physical constraints under different preset impedances. The signals are the signals used to construct the printed circuit in the stack-up file. The second acquisition module is used to acquire the schematic structure data of the printed circuit board, and to acquire the target signal and the target impedance corresponding to the target signal from the schematic structure data. The determination module is used to determine the physical constraints that correspond to both the target signal and the target impedance from the first correspondence, and use them as the target physical constraints corresponding to the target signal. The configuration module is used to input the target physical constraints corresponding to the target signal into the printed circuit board layout software, so that the printed circuit board layout software can automatically perform routing according to the target physical constraints.

[0017] Thirdly, embodiments of this application provide a wiring device for a printed circuit board, the device including: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, it implements the wiring method for a printed circuit board in the first aspect or any embodiment of the first aspect.

[0018] Fourthly, a computer-readable storage medium storing computer program instructions that, when executed by a processor, implement the wiring method of the printed circuit board in the first aspect or any embodiment of the first aspect.

[0019] Fifthly, embodiments of this application provide a computer program product in which instructions, when executed by a processor of an electronic device, cause the electronic device to perform a printed circuit board wiring method as described in the first aspect or any embodiment of the first aspect.

[0020] The printed circuit board (PCB) routing method, apparatus, device, and computer storage medium of this application embodiment can acquire the PCB overlay file and then construct a first correspondence relationship representing the relationship between signals, impedances, and physical constraints based on the overlay file. It also acquires the PCB schematic data to obtain the target signal and its corresponding target impedance. Furthermore, the physical constraints corresponding to both the target signal and target impedance in the first correspondence relationship can be used as the target physical constraints for the target signal. The target physical constraints are then input into PCB layout software to enable automatic routing based on these constraints. It is understood that in this application embodiment, by automatically determining the physical constraints corresponding to each signal and setting them in the automatic routing software, full automation of PCB automatic routing is achieved, reducing manual intervention by technicians and improving the accuracy and efficiency of automatic routing. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown; Figure 2 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown; Figure 3 A schematic diagram of the process for converting layered file formats according to an embodiment of this application is shown; Figure 4 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown; Figure 5 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown; Figure 6 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown; Figure 7 This illustration shows a schematic diagram of an XML file generation interface provided in one embodiment of this application; Figure 8 A schematic diagram of a differential signal extraction interface provided in one embodiment of this application is shown. Figure 9 The following are schematic diagrams of the wiring interface of a printed circuit board provided in one embodiment of this application; Figure 10 This is a schematic diagram of the wiring device for a printed circuit board provided in another embodiment of this application; Figure 11 This is a schematic diagram of the wiring device for a printed circuit board provided in another embodiment of this application. Detailed Implementation

[0023] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0024] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0025] With the increasing integration of electronic devices, PCB design has become more challenging. Driven by the widespread adoption of high-speed signal transmission technology, the increasing complexity of multi-layered circuit structures, and the trend towards miniaturization of components, traditional manual placement and routing methods, which rely on manual operation by technicians, are inefficient and prone to design errors. Consequently, traditional manual routing is ill-suited to the stringent requirements of modern PCB design.

[0026] To address these issues, automatic routing technology has gradually become a key tool in PCB design. Automatic routing systems can automatically generate trace paths through software algorithms, significantly improving design efficiency. Common automatic routing algorithms include mesh-based A* algorithms, graph-based Lee algorithms, and improved algorithms for specific needs, such as ant colony optimization and genetic algorithms. These technologies not only significantly reduce routing time but also help optimize key design factors such as signal integrity and electromagnetic interference. As an example, Specctra is a PCB autorouter that uses powerful algorithms and optimization techniques to automatically generate efficient trace paths in complex design environments.

[0027] However, in practice, automatic routing software often struggles to adapt to the diverse needs of PCB design. For instance, when faced with multiple rule combinations or cross-layer routing requirements, technicians still need to spend considerable time and effort manually inputting the physical constraints for each signal. This process not only increases labor costs but is also highly susceptible to human error, severely hindering the improvement of routing efficiency.

[0028] To address the problems of the prior art, this application provides a wiring method for a printed circuit board. The wiring method for a printed circuit board provided in this application will be described below.

[0029] Figure 1 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown. Figure 1 As shown, the wiring method for a printed circuit board includes the following steps S110-S140: S110. Obtain the stack-up file of the printed circuit board and construct the first correspondence based on the stack-up file.

[0030] The first correspondence characterizes the correspondence between each signal and physical constraints under different preset impedances. The signals are those used to construct printed circuits in the overlay file.

[0031] For example, a PCB stackup file can be used to describe the physical architecture and electrical performance of the PCB. The stackup file can include parameters such as the structural parameters, material parameters, and electrical characteristics of each layer of the PCB.

[0032] In one example, the layer structure parameters can include information such as the number of layers, their type, and the layer order. For example, the total number of PCB layers can be 4, 8, or 16. The PCB layer structure type can include signal layers, power layers, ground layers, etc. Furthermore, taking a 4-layer PCB as an example, its layer stacking order can be signal layer (top layer), power layer, ground layer, and signal layer (bottom layer).

[0033] In another example, material parameters may include substrate material, interlayer thickness, and copper foil thickness. For instance, substrate material may include the material of each layer, and parameters such as the dielectric constant (DK) and dissipation factor (DF) for each material. Interlayer thickness characterizes the dielectric thickness between two adjacent layers. Copper foil thickness characterizes the thickness of the copper foil in each layer.

[0034] In another example, electrical performance parameters may include preset impedance values ​​for each type of signal.

[0035] In PCB design, various signal types may be used to achieve different functions. These may include high-speed signals, low-speed signals, power signals, and ground signals. Furthermore, different signals may have different preset impedances. And different signals can be deployed on different layers.

[0036] For example, physical constraints are used to characterize the limitations on geometric dimensions, spatial relationships, and electrical rules in the PCB routing process, including circuit board layout, routing, and component placement.

[0037] In some alternative embodiments, physical constraints include at least one of line width, line spacing, and length matching rules to ensure that the PCB has functional correctness, signal integrity, and manufacturability.

[0038] Line width characterizes the width of a signal line; an appropriate line width can prevent overheating and burning. Line spacing characterizes the distance between signals; an appropriate line spacing can prevent crosstalk or short circuits between adjacent lines. Furthermore, it can be understood that differential signals can exist in a PCB, consisting of two signal lines with opposite polarities and equal amplitudes. To ensure synchronous transmission of the two differential signal lines, the lengths between them must meet length matching rules. That is, when the lengths of the two differential signal lines meet the length matching rules, signal distortion, timing errors, or bit errors caused by different transmission delays can be avoided.

[0039] In one example, length matching rules could include equal lengths, consistent trace spacing, etc.

[0040] In addition, physical constraints may also include conditions such as vias and component spacing.

[0041] Furthermore, physical constraints can be calculated using parameters in the overlay file, and the physical constraints can differ for different preset impedances. Specifically, different signals can have different preset impedances, and therefore, different signals have different physical constraints. Thus, the physical constraints for each signal can be calculated using parameters in the overlay file, thereby establishing a first correspondence between signals and physical constraints.

[0042] The same signal can have different preset impedances. For example, the impedance corresponding to a single-ended signal A can be 60 ohms (Ω), and the impedance corresponding to a single-ended signal B can be 75 Ω.

[0043] S120. Obtain the schematic structure data of the printed circuit board, and obtain the target signal and the target impedance corresponding to the target signal from the schematic structure data.

[0044] For example, the schematic data of a printed circuit board may include all information about the circuit schematic, from components to constraint rules.

[0045] In one example, the schematic data includes at least component information, network connection information, impedance matching information, and package information. For instance, component information may include component symbols and parameters; network connection information may include signal line connection relationships; impedance matching information may include the impedances corresponding to different signals; and package information may include the package names corresponding to the components.

[0046] Furthermore, all signals in the printed circuit board can be obtained from the schematic data, and the signals for which physical constraints are to be assigned can be used as target signals. Furthermore, the impedance corresponding to each target signal can be determined from the schematic data.

[0047] In one example, the schematic structure data can be an EDP file of the PCB schematic.

[0048] S130. From the first correspondence, determine the physical constraints that correspond to both the target signal and the target impedance, and use them as the target physical constraints corresponding to the target signal.

[0049] For example, physical constraints corresponding to both the target signal and the target impedance can be determined from the first correspondence, and these constraints can be used as the target physical constraints corresponding to the target signal.

[0050] In one example, the physical constraints corresponding to a single-ended signal with an impedance of 75Ω can be found from the first correspondence. For instance, the physical constraints found in the first correspondence for a single-ended signal with an impedance of 75Ω are a line width of 3.5 mils and a line spacing of 10 mils. The line width and spacing found can be used as the target physical constraints for this single-ended signal.

[0051] In some optional embodiments, if there are no physical constraints corresponding to both the target signal and the target impedance in the first correspondence, target physical constraints that satisfy the target impedance are constructed based on the target impedance and the overlay file, thereby ensuring that all signals have corresponding physical constraints.

[0052] For example, the physical constraints corresponding to the target signal can be calculated based on the target impedance of the target signal, as well as the layer structure parameters, material parameters, and electrical characteristic parameters in the stack-up file.

[0053] S140. Input the target physical constraints corresponding to the target signal into the printed circuit board layout software so that the printed circuit board layout software can automatically route according to the target physical constraints.

[0054] For example, the target physical constraints corresponding to the target signal found in the first correspondence can be imported into the printed circuit board layout software, thereby enabling the printed circuit board layout software to perform automatic routing based on the target physical constraints.

[0055] In one example, a script file can be written or called programmatically to enable Specctra to perform automatic routing based on the script file. For instance, a do file can be written using the skill, and Specctra can obtain the physical constraint rules corresponding to each signal based on the contents of the do file.

[0056] For example, the target physical constraints corresponding to the target signal can be determined in Allegro.

[0057] For example, a first correspondence representing the relationship between signals, impedances, and physical constraints can be constructed based on the stack-up file of the printed circuit board (PCB). The schematic structure data of the PCB can also be obtained to extract the target signal and its corresponding target impedance. Furthermore, the physical constraints corresponding to both the target signal and target impedance in the first correspondence can be used as the target physical constraints for the target signal. The target physical constraints are then input into PCB layout software to enable automatic routing based on these constraints. It is understood that in this embodiment, by automatically determining the physical constraints for each signal and setting them in the automatic routing software, full automation of PCB routing is achieved, reducing manual intervention by technicians and improving the accuracy and efficiency of automatic routing.

[0058] Furthermore, in order to achieve the construction of the first correspondence, as another implementation of this application, this application also provides another implementation of the wiring method for printed circuit boards, as detailed in the following embodiments.

[0059] Figure 2 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown. Figure 2 As shown, the wiring method for a printed circuit board includes the following steps: S210. Convert the stacked file into markup text format to obtain a stacked file in markup text format.

[0060] S220. Construct a first correspondence based on the stacked file in markup text format.

[0061] S230. Obtain the schematic structure data of the printed circuit board, and obtain the target signal and the target impedance corresponding to the target signal from the schematic structure data.

[0062] S240. From the first correspondence, determine the physical constraints that correspond to both the target signal and the target impedance, and use them as the target physical constraints corresponding to the target signal.

[0063] S250. Input the target physical constraints corresponding to the target signal into the printed circuit board layout software so that the printed circuit board layout software can automatically route according to the target physical constraints.

[0064] In some embodiments, steps S230-S250 are the same as steps S120-S140, and will not be described in detail here.

[0065] In some embodiments, in step S210, the overlay file is converted into a markup text format to obtain an overlay file in markup text format.

[0066] For example, after obtaining the overlay file, it can be converted into eXtensible Markup Language (XML) format. The XML-formatted overlay file can then be stored in the command path.

[0067] In one example, the overlay file can be in tabular form, i.e., Excel format. An Excel overlay file can be converted to XML format. Furthermore, the Excel and XML overlay files can be stored in the same directory.

[0068] In some optional embodiments, in order to achieve XML format conversion of the stacked files, Figure 3 This illustration shows a flowchart of a layered file format conversion provided in one embodiment of this application. Figure 3 As shown, the wiring method for a printed circuit board includes the following steps S211-S214: S211. Construct a stacking information list based on the valid stacking information in the stacking file.

[0069] For example, valid overlay information may include information related to each layer of the overlay file, such as the layer's identity document (ID), layer name, material, type, etc.

[0070] For example, the stacked file in Excel format can be read line by line by traversal, and the valid lines containing valid stacking information can be obtained, thereby reading the valid stacking information based on the valid lines.

[0071] In one example, the Python library `openpyxl` can be used to open an Excel file storing overlay information. The `iter_rows` method can then be used to read the overlay rows from the Excel file. The system can automatically calculate the number of valid rows (i.e., the number of rows containing valid overlay information) and extract the valid overlay information based on these rows. For example, valid overlay information can be extracted from row 20 of the Excel file, and the number of valid rows containing valid overlay information is 8. Furthermore, the valid overlay information can be extracted from the data within these valid rows.

[0072] For example, a stacking information list can be constructed using the obtained valid stacking information. This stacking information list can store the valid stacking information corresponding to each row in the valid rows.

[0073] In one example, a layer management list can be created and named Layer_user. During initialization, the attribute values ​​for each layer can be retrieved from the valid rows using a loop and stored in Layer_user. For example, for layer 1 in the layer file, the data read from the Excel file, named LAYER1, with a thickness of 1.0, material Material1, dielectric constant of 2, loss factor of 0.01, and type dielectric, can be stored in Layer_user.

[0074] S212. According to the preset key, retrieve the value corresponding to the key from the overlay information list.

[0075] For example, the value corresponding to the key can be found from the stacked information list according to the preset key name.

[0076] In one example, you can use the material as the key and the corresponding DK and DF as the values ​​to find the DK and DF for each material from the stack-up information list. Alternatively, you can use the layer ID as the key and the material, layer name, thickness, and layer type (conductor or dielectric layer) as the values ​​to find the material, layer name, thickness, and layer type for each layer ID from the stack-up information list.

[0077] For example, the keys and their corresponding values ​​can be preset by technicians according to different needs.

[0078] S213. Construct a material dictionary and a layer dictionary based on preset keys and their corresponding values.

[0079] For example, a material dictionary and a stack dictionary can be constructed based on the keys and values ​​obtained from the stack information list.

[0080] For example, the material dictionary can store material parameters corresponding to all layers in the stack file, including the material name, the DK and DF corresponding to each material.

[0081] In one example, the materials dictionary can be named `materials_dict`, and it can be constructed using materials as keys with DK and DF values. That is, the materials dictionary can be stored as: Material Name: (DK, DF). For example, in the materials dictionary, storing 'Material1': ('2.0', '0.01') can represent that the material is Material1, and its corresponding DK value is 2.0; its DF value is 0.01.

[0082] For example, the stacking dictionary can store layer information corresponding to all layers in the stacking file. The layer information may include layer ID, material, layer name, thickness, and layer type, etc.

[0083] In one example, the layer dictionary can be named `layer_dict`, and it can be constructed using the following format: layer ID as the key, material, layer name, thickness, and layer type (conductor or dielectric layer) as the value. That is, the storage of the layer dictionary can be represented as: layer ID: (material name, layer name, thickness, layer type). For example, the layer dictionary might store: 1: ('Material1', 'LAYER1', '1.0', 'dielectric'), which indicates that the first layer uses Material1 material, is named LAYER1, has a thickness of 1.0 unit, and is of type dielectric (dielectric layer).

[0084] S214. Call the element tree corresponding to the markup text format, and construct the markup text format overlay file based on the material dictionary and the overlay dictionary.

[0085] For example, the data format in the material dictionary and the overlay dictionary can be converted into an XML-compliant file through the element tree corresponding to the markup text format, thereby obtaining an XML-formatted overlay file.

[0086] In one example, the xml.etree.ElementTree library can be used to convert material dictionaries and layered dictionaries into XML files that conform to a specific format. These XML files can include namespaces and version information.

[0087] For example, an XML file may include material information, stack-up information, and impedance information.

[0088] The material information may include the material name, dielectric constant, magnetic permeability, and loss factor, and its format is as follows: “ <material name=" Material1"> <permittivity> <double> 2.0< / double> < / permittivity> <permeability> <double> 1< / double> < / permeability> <dielectriclosstangent> <double> 0.01< / double> < / dielectriclosstangent> < / material> " The above code can be represented as Material1, with a dielectric constant of 2.0, a permeability of 1, and a loss factor of 0.01.

[0089] Furthermore, the stacking information may include layer name, thickness, and type, in the following format: “ <Material="Material1" Name="LAYER1" Thickness="1.0" Type="conductor" / > The above code can represent a material name of Material1, a layer name of LAYER1, a thickness of 1 (the unit can be mil), and a type of conductor layer.

[0090] Furthermore, impedance information may include layer name, line width, and line spacing, in the following format: “Etch_Layer Name="LAYER1" Width_50_Ohm="3" Width_100_Ohm="1" Spacing_85_Ohm="1" / >” The code above can represent a layer name (LAYER1) where the required line width (in mils) is 3 to achieve a 50Ω impedance, the required line width is 1 mil to achieve a 100Ω impedance, and the required line spacing is 1 mil to achieve an 85Ω impedance.

[0091] For example, a stacking information list can be constructed based on the valid stacking information in the stacking file, and the corresponding values ​​can be retrieved from the stacking information list using preset keys in the stacking dictionary and material dictionary, thus realizing the construction of the stacking dictionary and material dictionary. Further, the element tree corresponding to the markup text format can be called, and an XML-formatted stacking file can be constructed based on the material dictionary and stacking dictionary. It is understood that in this embodiment, constructing the stacking dictionary and material dictionary enables structured storage of data in the stacking information list. Furthermore, when constructing the XML-formatted stacking file, the element values ​​corresponding to each node of the markup text format element tree can be quickly found using the material dictionary and stacking dictionary, achieving fast and accurate construction of the XML file.

[0092] In some embodiments, in step S220, a first correspondence can be constructed based on an XML-formatted overlay file.

[0093] For example, the relationship between signals, impedances and physical constraints can be obtained from an XML-formatted overlay file to obtain a first correspondence.

[0094] In one example, the layer to which the signal belongs can be determined. Furthermore, by reading the impedance corresponding to that layer in the XML format overlay file, the line width and line spacing corresponding to the signal can be determined, that is, the physical constraints of the signal under different impedances can be determined.

[0095] In this embodiment, the overlay file can be converted into an XML format that the system can recognize, resulting in an XML format overlay file; then, the XML format overlay file can be used to automatically construct the first correspondence, thereby improving the process of fully automated PCB routing.

[0096] In order to achieve the construction of the first correspondence, as another implementation of this application, this application also provides another implementation of the wiring method of the printed circuit board, as detailed in the following embodiments.

[0097] Figure 4 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown. Figure 4 As shown, the wiring method for a printed circuit board includes the following steps: S410. Obtain the stack-up file of the printed circuit board and construct the first correspondence based on the stack-up file.

[0098] S420. Obtain the target signal based on the principle structure data.

[0099] S430. According to the preset classification rules, classify the target signals to obtain target signals of multiple categories.

[0100] S440. Use the impedance corresponding to the preset classification rule as the target impedance for each type of target signal.

[0101] S450. From the first correspondence, determine the physical constraints that correspond to both the target signal and the target impedance, and use them as the target physical constraints corresponding to the target signal.

[0102] S460. Input the target physical constraints corresponding to the target signal into the printed circuit board layout software so that the printed circuit board layout software can automatically route according to the target physical constraints.

[0103] In some embodiments, step S410 is the same as step S110, and steps S450-S460 are the same as steps S130-S140, which will not be described in detail here.

[0104] In some embodiments, in S420, a target signal can be obtained based on the principle structure data. The target signal may be a signal for which physical constraints are to be assigned.

[0105] It is understandable that the target signal can be a signal used in the PCB to implement various functions, which may include high-speed signals, low-speed signals, etc. For example, high-speed signals may include signals in the high-speed parallel bus inside the central processing unit (CPU).

[0106] In some alternative embodiments, the target signal may include a differential signal, such as Figure 5 As shown, Figure 5 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown, wherein the wiring method for the printed circuit board may further include the following steps S510-S520: S510. Based on the principle structure data, construct a target text file containing differential signals.

[0107] For example, differential signal pairs in a PCB can be extracted by analyzing the schematic diagram, thereby constructing a text file containing the differential signals.

[0108] In one example, differential signals can be automatically extracted by analyzing the EDP file of the PCB schematic, and a text file can be constructed based on the extracted differential signals.

[0109] In some optional embodiments, network connection information corresponding to components can be obtained from the schematic structure data. A network tree is constructed based on the network connection information. Differential pair information is obtained from the network tree and stored as a target text file.

[0110] For example, the EDP file of a PCB schematic can be parsed to determine the relevant information for each component. In this example, component characteristic variables can be defined, and the value of each variable can be determined using the EDP file. These component characteristic variables can include the component's label (PartRef), pin name (PinName), pin number (PinIndex), pin type (PinType), and the network to which the pin is connected (PinRefNet). Furthermore, Pin_s_coord and Pin_e_coord can be defined to store the coordinates of the component pin connections.

[0111] Based on various variables and their corresponding values, network connection information between various components in a PCB can be constructed. In essence, this network connection information is a structured data set describing the connection of a component's (PartRef) pins (PinName / PinIndex) to a network (PinRefNet).

[0112] For example, a network tree corresponding to the PCB can be generated using a network tree construction function based on network connection information. In one example, the DiffNetC function can be used to generate a network tree to represent the connection structure between differential signal pins, and each node of the network tree can represent a device or network connected to a differential pin.

[0113] Furthermore, the network tree can be filtered using preset rules to obtain differential pair information. In one example, preset rules can be used to filter invalid connections in the network tree and identify differential signals in the network tree according to the preset rules, thereby constructing differential pair information.

[0114] In one example, by identifying each network name in the network tree and determining two networks whose network names differ only in the last character and are marked with "+" and "-", difference pair information can be filtered out based on the determined two networks.

[0115] Furthermore, after obtaining the difference pair information, it can be stored as a target text file according to a preset storage format. For example, the obtained difference information can be output to the target text file, namely diff.txt, where the storage format of a difference pair is (difference pair name: difference network 1, difference network 2), that is, (DP1: diff+, diff-).

[0116] In this embodiment, a network tree is constructed using structural data to intelligently identify differential pairs, thereby improving the efficiency of differential pair identification and reducing the error rate. Furthermore, by outputting the identified differential pairs in text file format, the system can subsequently identify differential pairs, laying a solid foundation for fully automated wiring.

[0117] S520. Determine the target impedance corresponding to the differential signal in the target text file according to the preset differential impedance library.

[0118] For example, the preset differential impedance library can be a database pre-configured by technicians according to different needs. It can include different differential signals and their corresponding impedances.

[0119] In one example, the impedance corresponding to each pair of differential signals in the diff.txt file can be obtained by calling a preset differential impedance library.

[0120] For example, a target text file containing differential signals can be constructed based on the principle structure data. Then, according to a preset differential impedance library, the target impedance corresponding to the differential signals in the target text file can be determined. It is understood that, for differential signals with special requirements, the preset differential impedance library can be used to achieve rapid impedance matching, thereby improving the fully automated process of automatic routing.

[0121] In some embodiments, in S430, the target signal can be classified according to a preset classification rule to obtain target signals of multiple categories.

[0122] For example, target signals with physical constraints can be classified according to preset classification rules. It is understood that signals of the same category have similar electrical characteristics, wiring requirements, and functional requirements.

[0123] In one example, preset classification rules can be stored in a class library. This class library may contain classification hierarchies to refine the category to which the target signal belongs. For example, the first level may include attributes or constraints characterizing the major class (D) of the signal, and attributes or constraints characterizing the signal direction (S). Further, the second level may include subclass A or subclass B. And the storage format of the class library can be represented as (DSA 50OHM B 50OHM).

[0124] S440. Use the impedance corresponding to the preset classification rule as the target impedance for each type of target signal.

[0125] For example, the preset classification rules include the impedance corresponding to the category of signal. That is, different categories of signals can correspond to different impedances.

[0126] The impedance corresponding to each category of target signal can be determined in the preset classification rules and used as the target impedance of the target signal of that category.

[0127] In this embodiment, the target signals are classified according to a preset classification rule, and corresponding physical constraints are uniformly assigned to each type of target signal, thereby avoiding setting physical constraints for each signal individually, improving wiring efficiency and the accuracy of constraint setting.

[0128] To improve the flexible routing management of different types of packages, as another implementation of this application, this application also provides another implementation of the routing method for printed circuit boards, as detailed in the following embodiments.

[0129] Figure 6 A schematic flowchart of a wiring method for a printed circuit board according to an embodiment of this application is shown. Figure 6 As shown, the wiring method for a printed circuit board includes the following steps: S610. Obtain the stack-up file of the printed circuit board and construct a first correspondence based on the stack-up file.

[0130] S620: Obtain the schematic structure data of the printed circuit board, and obtain the target signal and the target impedance corresponding to the target signal from the schematic structure data.

[0131] S630. From the first correspondence, determine the physical constraint conditions that correspond simultaneously to the target signal and the target impedance, and use them as the target physical constraint conditions corresponding to the target signal.

[0132] S640: Input the target physical constraints corresponding to the target signal into the printed circuit board layout software.

[0133] S650, Obtain the package name of the printed circuit board.

[0134] S660. Determine the target fan-out method that matches the package name from the preset package fan-out library, and perform fan-out operation on the package device of the printed circuit board according to the target fan-out method.

[0135] In some embodiments, steps S610-S640 are the same as steps S110-S140, and will not be described in detail here.

[0136] In some embodiments, in S650, the package name of the printed circuit board can be obtained.

[0137] The name of a packaged device can include its package number and model number. It is understood that the packaged device name can uniquely identify a chip.

[0138] In one example, the packaged device may include a ball grid array (BGA), a small outline package (SOP), a quad flat no-leads (QFN) package, and a connector (Conn).

[0139] In some embodiments, in S660, a target fan-out mode matching the package device name is determined from a preset package fan-out library, and the package device of the printed circuit board is fan-out operated according to the target fan-out mode.

[0140] For example, different packaged devices can have different fan-out modes. Technicians can pre-store the fan-out modes corresponding to different packaged devices in a preset package fan-out library.

[0141] In some optional embodiments, the preset encapsulation fan-out library includes at least: a fan-out layout library and a region rule library.

[0142] The fan-out layout library contains layout methods corresponding to different packaged devices, and the region rule library contains region rules corresponding to different packaged devices.

[0143] In one example, a subdrawing library (i.e., a fan-out layout library) and a region rule library can be established for the complex pin fan-out design of BGAs. The subdrawing library contains standard fan-out templates for different BGA packages, which can be directly called according to PBC requirements. The region rule library contains design rules for specific regions. It's understandable that BGA devices have many pins with very small pin spacing; therefore, when routing within them, the trace width should be minimized. A special region can be created, and relevant constraints can be set so that the trace width automatically decreases when routing into that region.

[0144] Furthermore, after determining the fan-out method of the package, existing empty network holes and traces can be identified and deleted. Then, the remaining holes and traces are locked to prevent them from being changed by subsequent automatic routing. Then, the program writes a do file, such as route 25, etc. After completion, it calls specctra to execute the routing do file to perform automatic routing, thereby realizing automated routing.

[0145] In this embodiment, by predefining fan-out methods suitable for various packages and writing the corresponding package device names into a preset package fan-out library, the fan-out method of the package device is automatically determined, reducing the time for manual operation and improving design efficiency.

[0146] Furthermore, combined Figure 7 , Figure 8 , Figure 9The following examples illustrate the wiring methods for printed circuit boards.

[0147] Figure 7 This illustration shows a schematic diagram of an XML file generation interface provided in one embodiment of this application; Figure 8 A schematic diagram of a differential signal extraction interface according to an embodiment of this application is shown. The routing method for printed circuit boards can be applied to an automatic routing system for printed circuit boards, wherein the automatic routing system has, for example... Figure 7 The XML file generation interface shown is 700. (For example...) Figure 7 As shown, the XML file generation interface may include button 1, button 2, button 3, and a first display area 701. When the user clicks button 1, they can select an overlay file, and the selected overlay file will be displayed in the first display area. When the user clicks button 2, the overlay file can be converted into an XML file. When the user clicks button 3, the interface can be closed.

[0148] Automatic wiring systems may also include, for example Figure 8 The differential signal extraction interface shown is 800. Figure 8 As shown, the differential signal extraction interface may include buttons 4, 5, and 6, as well as a second display area 801. When the user clicks button 4, they can select an EDP file. When the user clicks button 5, the differential signal can be extracted from the EDP file. When the user clicks button 6, the interface can be closed.

[0149] Furthermore, to avoid cumbersome processes, the automatic cabling system allows for the uploading and control of automatic cabling files within a single automatic cabling interface. Figure 9 The following are schematic diagrams of the wiring interface of a printed circuit board provided in one embodiment of this application, such as... Figure 9 As shown, the automatic routing interface integrates the button functions from the XML file generation interface and the differential signal extraction interface. Additionally, the automatic routing interface includes buttons 7 and 8. When the user clicks button 7, the target signal can be classified, and constraints can be set for different categories of target signals. When the user clicks button 8, the system begins the automatic routing operation.

[0150] Based on the printed circuit board wiring method provided in the above embodiments, this application also provides specific implementations of a printed circuit board wiring device. Please refer to the following embodiments.

[0151] First see Figure 10 The wiring device for a printed circuit board provided in this application includes the following modules: The first acquisition module 1001 is used to acquire the stack-up file of the printed circuit board and construct a first correspondence relationship based on the stack-up file. The first correspondence relationship represents the correspondence between each signal and physical constraints under different preset impedances. The signals are the signals used to construct the printed circuit in the stack-up file. The second acquisition module 1002 is used to acquire the schematic structure data of the printed circuit board, and to acquire the target signal and the target impedance corresponding to the target signal from the schematic structure data. The determining module 1003 is used to determine the physical constraint conditions that correspond to both the target signal and the target impedance from the first correspondence relationship, and use them as the target physical constraint conditions corresponding to the target signal. The setting module 1004 is used to input the target physical constraints corresponding to the target signal into the printed circuit board layout software, so that the printed circuit board layout software can automatically perform routing according to the target physical constraints.

[0152] As one implementation of this application, the first acquisition module 1001 acquires the overlay file of the printed circuit board in the following manner and constructs a first correspondence based on the overlay file: converting the overlay file into a markup text format to obtain an overlay file in markup text format; and constructing a first correspondence based on the overlay file in markup text format.

[0153] As one implementation of this application, the first acquisition module 1001 converts the overlay file into a markup text format in the following manner to obtain the markup text format overlay file: constructing an overlay information list based on the valid overlay information in the overlay file; obtaining the value corresponding to the key from the overlay information list according to the preset key; constructing a material dictionary and an overlay dictionary based on the preset key and the value corresponding to the preset key; calling the element tree corresponding to the markup text format, and constructing the markup text format overlay file based on the material dictionary and the overlay dictionary.

[0154] As one implementation of this application, the second acquisition module 1002 acquires the schematic structure data of the printed circuit board in the following manner, and acquires the target signal and the target impedance corresponding to the target signal from the schematic structure data: acquire the target signal according to the schematic structure data; classify the target signal according to the preset classification rules to obtain multiple categories of target signals; and use the impedance corresponding to the preset classification rules as the target impedance corresponding to each category of target signal.

[0155] As one implementation of this application, the target signal includes a differential signal, and the device further includes a matching module for constructing a target text file containing the differential signal based on the principle structure data; and determining the target impedance corresponding to the differential signal in the target text file according to a preset differential impedance library.

[0156] As one implementation of this application, the matching module constructs a target text file containing differential signals based on the principle structure data in the following manner: obtaining the network connection information corresponding to the components from the principle structure data; constructing a network tree based on the network connection information; obtaining differential pair information based on the network tree, and storing the obtained differential pair information as a target text file.

[0157] As one implementation of this application, after obtaining the schematic structure data of the printed circuit board and obtaining the target signal and the target impedance corresponding to the target signal from the schematic structure data, the device further includes a construction module, which is used to construct the target physical constraint condition that satisfies the target impedance based on the target impedance and the stack-up file when there is no physical constraint condition that corresponds to both the target signal and the target impedance in the first correspondence.

[0158] As one implementation of this application, after inputting the target physical constraints corresponding to the target signal into the printed circuit board layout software, the setting module 1004 is further used to: obtain the package name of the printed circuit board; determine the target fan-out method that matches the package name from the preset package fan-out library, and perform fan-out operation on the package of the printed circuit board according to the target fan-out method.

[0159] As one implementation of this application, the preset package fan-out library includes at least: a fan-out layout library and a region rule library, wherein the fan-out layout library contains layout methods corresponding to different package devices, and the region rule library contains region rules corresponding to different package devices.

[0160] As one implementation of this application, the physical constraints include at least one of line width, line spacing, and length matching rules.

[0161] Figure 11 A schematic diagram of the hardware structure of the wiring device for a printed circuit board provided in an embodiment of this application is shown.

[0162] The wiring device on the printed circuit board may include a processor 1101 and a memory 1102 storing computer program instructions.

[0163] Specifically, the processor 1101 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.

[0164] Memory 1102 may include mass storage for data or instructions. For example, and not limitingly, memory 1102 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 1102 may include removable or non-removable (or fixed) media. Where appropriate, memory 1102 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, memory 1102 is non-volatile solid-state memory.

[0165] Memory may include read-only memory (ROM), random access memory (RAM), disk storage media devices, optical storage media devices, flash memory devices, and electrical, optical, or other physical / tangible memory storage devices. Therefore, typically, memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the methods according to one aspect of this disclosure.

[0166] The processor 1101 reads and executes computer program instructions stored in the memory 1102 to implement any of the printed circuit board wiring methods in the above embodiments.

[0167] In one example, the wiring device on the printed circuit board may also include a communication interface 1103 and a bus 1110. Wherein, as Figure 11 As shown, the processor 1101, memory 1102, and communication interface 1103 are connected through bus 1110 and complete communication with each other.

[0168] The communication interface 1103 is mainly used to realize communication between various modules, devices, units and / or equipment in the embodiments of this application.

[0169] Bus 1110 includes hardware, software, or both, that couples components of an online data traffic metering device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 1110 may include one or more buses. Although specific buses are described and illustrated in embodiments of this application, any suitable bus or interconnect is contemplated herein.

[0170] The printed circuit board routing device can execute the printed circuit board routing method in the embodiments of this application based on the overlay file and schematic structure data, thereby achieving a combination of Figure 1 and Figure 10 The described wiring method for printed circuit boards.

[0171] Furthermore, in conjunction with the printed circuit board wiring methods in the above embodiments, this application embodiment can provide a computer storage medium for implementation. This computer storage medium stores computer program instructions; when these computer program instructions are executed by a processor, they implement any of the printed circuit board wiring methods in the above embodiments.

[0172] This application also provides a computer program product, including a computer program that, when executed, implements any of the printed circuit board wiring methods described in the above embodiments.

[0173] It should be clarified that this application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of this application is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of this application.

[0174] The functional blocks shown in the above-described structural diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this application are programs or code segments used to perform the required tasks. Programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried on a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0175] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0176] The aspects of this disclosure have been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that these instructions, executable via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by special-purpose hardware performing the specified functions or actions, or can be implemented by a combination of special-purpose hardware and computer instructions.

[0177] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A wiring method for a printed circuit board, characterized in that, include: Obtain the stack-up file of the printed circuit board and construct a first correspondence relationship based on the stack-up file. The first correspondence relationship represents the correspondence between each signal and physical constraints under different preset impedances. The signals are the signals used to construct the printed circuit in the stack-up file. Obtain the schematic structure data of the printed circuit board, and obtain the target signal and the target impedance corresponding to the target signal from the schematic structure data; From the first correspondence, determine the physical constraint conditions that simultaneously correspond to the target signal and the target impedance, and use them as the target physical constraint conditions corresponding to the target signal; The target physical constraints corresponding to the target signal are input into the printed circuit board layout software so that the printed circuit board layout software can automatically perform routing according to the target physical constraints.

2. The wiring method for a printed circuit board according to claim 1, characterized in that, The step of obtaining the stack-up file of the printed circuit board and constructing a first correspondence based on the stack-up file includes: The stacked file is converted into a markup text format to obtain the stacked file in the markup text format; The first correspondence is constructed based on the stacked file in the markup-text format.

3. The wiring method for a printed circuit board according to claim 2, characterized in that, The step of converting the overlay file into a markup-based text format to obtain the overlay file in the markup-based text format includes: Construct a stacking information list based on the valid stacking information in the stacking file; According to the preset key, obtain the value corresponding to the key from the stacked information list; Based on the preset key and the value corresponding to the preset key, construct a material dictionary and a stack dictionary; The element tree corresponding to the markup text format is invoked, and the stacked file of the markup text format is constructed based on the material dictionary and the stacked dictionary.

4. The wiring method for a printed circuit board according to claim 1, characterized in that, The step of acquiring the schematic structure data of the printed circuit board and obtaining the target signal and the target impedance corresponding to the target signal from the schematic structure data includes: Based on the aforementioned principle structure data, the target signal is obtained; The target signals are classified according to preset classification rules to obtain target signals of multiple categories; The impedance corresponding to the preset classification rule is used as the target impedance for the target signal of each category.

5. The wiring method for a printed circuit board according to claim 4, characterized in that, The target signal includes a differential signal; The method further includes: Based on the aforementioned principle structure data, a target text file containing the differential signal is constructed; Based on a preset differential impedance library, the target impedance corresponding to the differential signal in the target text file is determined.

6. The wiring method for a printed circuit board according to claim 5, characterized in that, The construction of a target text file containing the differential signal based on the aforementioned principle structure data includes: Obtain the network connection information corresponding to the components from the aforementioned principle structure data; Construct a network tree based on network connectivity information; Based on the network tree, difference pair information is obtained, and the obtained difference pair information is stored as the target text file.

7. The wiring method for a printed circuit board according to claim 1, characterized in that, After acquiring the schematic structure data of the printed circuit board and obtaining the target signal and the target impedance corresponding to the target signal from the schematic structure data, the method further includes: If there is no physical constraint condition that corresponds to both the target signal and the target impedance in the first correspondence, a target physical constraint condition that satisfies the target impedance is constructed based on the target impedance and the overlay file.

8. The wiring method for a printed circuit board according to claim 1, characterized in that, After inputting the target physical constraints corresponding to the target signal into the printed circuit board layout software, the method further includes: Obtain the name of the packaged device on the printed circuit board; From the preset package fan-out library, determine the target fan-out method that matches the name of the package device, and perform fan-out operation on the package device of the printed circuit board according to the target fan-out method.

9. The wiring method for a printed circuit board according to claim 8, characterized in that, The preset package fan-out library includes at least: a fan-out layout library and a region rule library, wherein the fan-out layout library contains layout methods corresponding to different package devices, and the region rule library contains region rules corresponding to different package devices.

10. The wiring method for a printed circuit board according to any one of claims 1-9, characterized in that, Physical constraints include at least one of the following: line width, line spacing, and length matching rules.

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