Capacitor and manufacturing process thereof

Abstract

The invention relates to the field of electric appliances, in particular to a capacitor and a manufacturing process thereof, and the process comprises the following steps: 1, placing a plate for preparing a current-conducting plate I or a current-conducting plate II between two forming dies; secondly, a driving roller is driven to rotate to push the plate to continuously pass through the two forming molds; thirdly, after the plate extends out of the two forming dies by a certain length, a stamping die moves to conduct stamping and bending on the plate; 4, the driving roller intermittently rotates to drive the plate to intermittently move, so that the plate continuously extends out of the two forming molds; 5, the stamping die moves intermittently, the stamping die bends the extending part of the plate for multiple times, and a rectangular current-conducting plate I or a rectangular current-conducting plate II is formed; the capacitor of which the capacitance can be adjusted according to use requirements can be prepared.

Description

Technical Field

[0001] This invention relates to the field of electrical appliances, and more specifically to a capacitor and its manufacturing process. Background Technology

[0002] A capacitor is a device used to store electrical charge. It consists of two conducting plates and a dielectric material, with a certain distance between the plates. The dielectric material can be air, an insulating material, or an electrolyte. When a capacitor is connected to a power source, the positive plate attracts negative charges, and the negative plate attracts positive charges, resulting in the accumulation of equal but opposite charges on both plates. In this way, the capacitor stores electrical charge. The capacitance of a capacitor depends on the area of ​​the conducting plates, the distance between the plates, and the dielectric constant of the dielectric material. For example, patent number CN202695132U, entitled "Capacitor," has the drawback that it cannot manufacture a capacitor whose capacitance can be adjusted according to usage requirements. Summary of the Invention

[0003] The purpose of this invention is to provide a capacitor and its manufacturing process, which can produce a capacitor whose capacitance can be adjusted according to usage requirements.

[0004] The objective of this invention is achieved through the following technical solution:

[0005] A capacitor manufacturing process includes the following steps:

[0006] Step 1: Place the substrate for preparing conductive plate I or conductive plate II between two molding dies;

[0007] Step 2: Drive the drive roller to rotate and push the sheet material through two forming molds continuously;

[0008] Step 3: After the sheet metal extends a certain length from the two forming dies, the stamping die moves to stamp and bend the sheet metal;

[0009] The process also includes the following steps:

[0010] Step 4: The drive roller rotates intermittently, driving the sheet material to move intermittently, causing the sheet material to continuously extend out of the two forming molds;

[0011] Step 5: The stamping die moves intermittently, bending the protruding part of the sheet metal multiple times to form a rectangular conductive plate I or conductive plate II;

[0012] The process also includes the following steps:

[0013] Step Six: After bending multiple times to form a rectangular conductive plate I or conductive plate II, activate the telescopic mechanism II to adjust the position of the stamping die;

[0014] Step 7: The stamping die moves to cut the rectangular conductive plate I or conductive plate II formed by bending, so that conductive plate I or conductive plate II is separated from the sheet material.

[0015] A conductive plate processing device includes a device support, a sliding bracket fixedly connected to the device support, and a lead screw II rotatably connected to the sliding bracket, the threads at both ends of the lead screw II having opposite directions.

[0016] A power mechanism I for rotating a drive screw II is fixedly connected to the sliding bracket; the power mechanism I is preferably a servo motor.

[0017] Two lifting brackets are slidably connected to the sliding bracket. The two lifting brackets are respectively connected to the two ends of the lead screw II by threads. A forming mold is fixedly connected to each lifting bracket, and a drive roller is rotatably connected to each lifting bracket.

[0018] A power mechanism II for driving the drive roller to rotate is fixedly connected to the lifting bracket. The power mechanism II is preferably a servo motor.

[0019] A telescopic mechanism I is fixedly connected to the sliding bracket, a telescopic mechanism II is fixedly connected to the telescopic end of the telescopic mechanism I, and a stamping die is fixedly connected to the telescopic end of the telescopic mechanism II.

[0020] A sensor is fixedly connected to the device bracket, and a drive shaft is rotatably connected to the device bracket. Two arc-shaped cams are rotatably connected to the drive shaft. Each arc-shaped cam is connected to a positioning pin by a thread, and both arc-shaped cams can contact the sensor.

[0021] The sensor is connected to telescopic mechanism II, and the sensor is connected to power mechanism II;

[0022] A capacitor includes a bottom shell and a top shell, with multiple insulating layers disposed between the bottom shell and the top shell, the multiple insulating layers covering each other;

[0023] Multiple conductive plates I and multiple conductive plates II are wrapped between multiple insulating layers. Multiple conductive plates I wrap around each other, and multiple conductive plates II wrap around each other. Each conductive plate I is fixedly connected to a pin I, and each conductive plate II is fixedly connected to a pin II. Multiple insulating layers are interspersed between multiple conductive plates I and multiple conductive plates II.

[0024] Two adjustment brackets are fixedly connected to the bottom housing. Each adjustment bracket is rotatably connected to a lead screw I. Each adjustment bracket is slidably connected to an adjustment block. The two adjustment blocks are respectively threaded to the two lead screws I. Each adjustment block is fixedly connected to a connecting plate.

[0025] One of the circuit boards can contact pin I, and the other circuit board can contact pin II. Attached Figure Description

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and specific implementation methods.

[0027] Figure 1 This is a schematic diagram of the capacitor manufacturing process of the present invention;

[0028] Figure 2 This is a schematic diagram of the capacitor manufacturing process of the present invention;

[0029] Figure 3 This is a schematic diagram of the capacitor manufacturing process of the present invention;

[0030] Figure 4 This is a schematic diagram of the capacitor structure of the present invention;

[0031] Figure 5 This is a schematic cross-sectional view of the capacitor structure of the present invention;

[0032] Figure 6 This is a schematic diagram of the bottom shell structure of the present invention;

[0033] Figure 7 This is a schematic diagram of the connection structure of the insulating layer, conductive plate I, and conductive plate II of the present invention;

[0034] Figure 8 This is a schematic diagram of the conductive plate processing device of the present invention;

[0035] Figure 9 This is a schematic diagram of the stamping die structure of the present invention;

[0036] Figure 10 This is a schematic diagram of the molding die structure of the present invention;

[0037] Figure 11 This is a schematic diagram of the circular arc cam structure of the present invention.

[0038] In the picture:

[0039] Bottom housing 11; Adjusting bracket 12; Lead screw I 13; Adjusting block 14; Connecting plate 15; Top housing 16;

[0040] Insulating layer 21; Conductive plate I 22; Conductive plate II 23;

[0041] Device support 31; sliding support 32; lead screw II 33;

[0042] Lifting bracket 41; forming mold 42; drive roller 43;

[0043] Telescopic mechanism I 51; Telescopic mechanism II 52; Stamping die 53;

[0044] Sensor 61; drive shaft 62; circular arc cam 63. Detailed Implementation

[0045] The present invention will now be described in further detail with reference to the accompanying drawings.

[0046] like Figures 1 to 3 As shown below, the steps and functions of a capacitor manufacturing process will be explained in detail.

[0047] A capacitor manufacturing process includes the following steps:

[0048] Step 1: Place the substrate for preparing conductive plate I 22 or conductive plate II 23 between the two forming molds 42;

[0049] Step 2: Drive the drive roller 43 to rotate and push the sheet material through the two forming molds 42 continuously;

[0050] Step 3: After the sheet metal extends a certain length from the two forming dies 42, the stamping die 53 moves to stamp and bend the sheet metal;

[0051] The process also includes the following steps:

[0052] Step 4: Drive roller 43 rotates intermittently, driving the sheet material to move intermittently, so that the sheet material continuously extends out of the two forming molds 42;

[0053] Step 5: The stamping die 53 moves intermittently, bending the protruding part of the sheet metal multiple times to form a rectangular conductive plate I 22 or conductive plate II 23;

[0054] The process also includes the following steps:

[0055] Step 6: After bending multiple times to form a rectangular conductive plate I 22 or conductive plate II 23, activate the telescopic mechanism II 52 to adjust the position of the stamping die 53;

[0056] Step 7: The stamping die 53 moves to cut the rectangular conductive plate I22 or conductive plate II23 formed by bending, so that the conductive plate I22 or conductive plate II23 is separated from the sheet material.

[0057] like Figures 4 to 7 As shown below, the structure and function of a capacitor will be explained in detail.

[0058] A capacitor includes a bottom shell 11 and a top shell 16, with multiple insulating layers 21 disposed between the bottom shell 11 and the top shell 16, and the multiple insulating layers 21 covering each other.

[0059] Multiple conductive plates I 22 and multiple conductive plates II 23 are wrapped between the multiple insulating layers 21. The multiple conductive plates I 22 wrap around each other, and the multiple conductive plates II 23 wrap around each other. Each conductive plate I 22 is fixedly connected to a pin I, and each conductive plate II 23 is fixedly connected to a pin II. The multiple insulating layers 21 are interspersed between the multiple conductive plates I 22 and multiple conductive plates II 23.

[0060] Two adjustment brackets 12 are fixedly connected to the bottom housing 11. Each adjustment bracket 12 is rotatably connected to a lead screw I 13. Each adjustment bracket 12 is slidably connected to an adjustment block 14. The two adjustment blocks 14 are respectively threaded to the two lead screws I 13. Each adjustment block 14 is fixedly connected to a connecting plate 15.

[0061] One of the switching plates 15 can contact pin I, and the other switching plate 15 can contact pin II.

[0062] When using, such as Figure 7 As shown, the positive and negative terminals of the power supply are pre-connected to two connecting plates 15 respectively. The two connecting plates 15 and the pin I on conductive plate I 22 are in contact with the pin II on conductive plate II 23. Then, the two connecting plates 15 energize conductive plate I 22 and conductive plate II 23 through pin I and pin II. Conductive plate I 22 and conductive plate II 23 are not in contact. An insulating layer 21 is provided between conductive plate I 22 and conductive plate II 23, so that conductive plate I 22 and conductive plate II 23 can store charge.

[0063] Furthermore, when it is necessary to adjust the amount of charge stored in the capacitor, the lead screw I13 is rotated. When the lead screw I13 rotates, it drives the adjusting block 14 to move through the thread. The adjusting block 14 drives the connecting plate 15 to move, so that the connecting plate 15 moves laterally and makes contact with multiple pins I or II. This adjusts the number of conductive plates I22 and conductive plates II23 connected to the power supply. The number of conductive plates I22 and conductive plates II23 connected to the power supply can be adjusted according to the usage requirements, thereby adjusting the amount of charge stored in the capacitor as needed.

[0064] like Figures 8 to 11 As shown, in order to facilitate the processing of conductive plate I22 or conductive plate II23, a conductive plate processing device is designed. The structure and function of the conductive plate processing device are described in detail below.

[0065] A conductive plate processing device includes a device support 31, a sliding support 32 fixedly connected to the device support 31, and a lead screw II 33 rotatably connected to the sliding support 32, with the threads at both ends of the lead screw II 33 having opposite directions.

[0066] A power mechanism I for rotating a drive screw II 33 is fixedly connected to the sliding bracket 32. The power mechanism I is preferably a servo motor.

[0067] Two lifting brackets 41 are slidably connected to the sliding bracket 32. The two lifting brackets 41 are respectively connected to the two ends of the lead screw II 33 by threads. A forming mold 42 is fixedly connected to each lifting bracket 41, and a drive roller 43 is rotatably connected to each lifting bracket 41.

[0068] A power mechanism II for driving the drive roller 43 to rotate is fixedly connected to the lifting bracket 41. The power mechanism II is preferably a servo motor.

[0069] A telescopic mechanism I 51 is fixedly connected to the sliding bracket 32, a telescopic mechanism II 52 is fixedly connected to the telescopic end of the telescopic mechanism I 51, and a stamping die 53 is fixedly connected to the telescopic end of the telescopic mechanism II 52.

[0070] A sensor 61 is fixedly connected to the device bracket 31, and a drive shaft 62 is rotatably connected to the device bracket 31. Two arc cams 63 are rotatably connected to the drive shaft 62. Each arc cam 63 is connected to a positioning pin by a thread, and both arc cams 63 can contact the sensor 61.

[0071] Sensor 61 is connected to telescopic mechanism II 52, and sensor 61 is also connected to power mechanism II.

[0072] In use, the conductive plate I 22 or conductive plate II 23 is placed between two forming molds 42. The power mechanism I is started, and the output shaft of the power mechanism I starts to rotate. The output shaft of the power mechanism I drives the lead screw II 33 to rotate. When the lead screw II 33 rotates, it drives the two lifting brackets 41 to move through the thread, thereby adjusting the relative distance between the two lifting brackets 41. The two lifting brackets 41 move closer to each other, so that the two drive rollers 43 contact the plate. The power mechanism II is started, and the output shaft of the power mechanism II drives the drive rollers 43 to rotate. The rotation of the drive rollers 43 pushes the plate to move, and pushes the plate to continuously pass through the two forming molds 42.

[0073] After the sheet metal extends a certain length from the two forming dies 42, the telescopic mechanism II 52 is activated. The telescopic mechanism II 52 can be a hydraulic cylinder or an electric push rod. The telescopic end of the telescopic mechanism II 52 drives the stamping die 53 to move, causing the stamping die 53 to move upward. The stamping die 53 bends the part of the sheet metal that extends from the two forming dies 42.

[0074] The drive roller 43 rotates intermittently, driving the sheet metal to move intermittently, causing the sheet metal to continuously extend out of the two forming dies 42. The stamping die 53 moves intermittently, and the stamping die 53 bends the extended part of the sheet metal multiple times to form a rectangular conductive plate I 22 or conductive plate II 23.

[0075] Furthermore, the telescopic mechanism I51 is activated. The telescopic mechanism I51 can be a hydraulic cylinder or an electric push rod. The telescopic end of the telescopic mechanism I51 drives the stamping die 53 to move, adjusting the position of the stamping die 53 so that the stamping die 53 is attached to the forming die 42. The telescopic end of the telescopic mechanism II52 drives the stamping die 53 to move upward. The stamping die 53 and the forming die 42 cooperate to cut the conductive plate I22 or the conductive plate II23, so that the conductive plate I22 or the conductive plate II23 is separated from the plate material.

[0076] Furthermore, in order to control the movement of the drive roller 43 and the stamping die 53, a sensor 61 is also provided. The sensor 61 can be a contact sensor. When the sensor 61 is squeezed, the sensor 61 controls the output shaft of the power mechanism II to rotate. When the sensor 61 is no longer squeezed, the telescopic end of the telescopic mechanism II 52 reciprocates once. The device bracket 31 is fixedly connected to the power mechanism III, which drives the drive shaft 62 to rotate. The power mechanism III is preferably a servo motor. The output shaft of the power mechanism III starts to rotate, and the output shaft of the power mechanism III drives the drive shaft 62 to rotate. The drive shaft 62 drives the two arc cams 63 to rotate. The arc cams 63 rotate to squeeze the sensor 61, thereby controlling the drive roller 43 to rotate. When the arc cams 63 and the sensor 61 separate, the drive roller 43 stops rotating, and the telescopic end of the telescopic mechanism II 52 reciprocates once to complete the bending of the protruding part of the sheet metal.

[0077] Furthermore, by adjusting the misalignment angle between the two arc cams 63 and fixing them with positioning pins, the time when the sensor 61 is compressed is adjusted, thereby controlling the length of the plate extension and the size of the rectangular conductive plate I 22 or conductive plate II 23 formed by processing, thus meeting the requirements of the capacitor.

Claims

1. A capacitor manufacturing process, characterized in that: The process includes the following steps: Step 1: Place the substrate for preparing conductive plate I (22) or conductive plate II (23) between two molding dies (42); Step 2: Drive the drive roller (43) to rotate and push the sheet material through the two forming molds (42) continuously; Step 3: After the sheet metal extends a certain length from the two forming dies (42), the stamping die (53) moves to stamp and bend the sheet metal.

2. The capacitor manufacturing process according to claim 1, characterized in that: The process also includes the following steps: Step 4: The drive roller (43) rotates intermittently, driving the sheet material to move intermittently, so that the sheet material continuously extends out of the two forming molds (42); Step 5: The stamping die (53) moves intermittently, and the stamping die (53) bends the protruding part of the sheet multiple times to form a rectangular conductive plate I (22) or conductive plate II (23).

3. The capacitor manufacturing process according to claim 2, characterized in that: The process also includes the following steps: Step 6: After bending the conductive plate I (22) or conductive plate II (23) multiple times, start the telescopic mechanism II (52) to adjust the position of the stamping die (53); Step 7: The stamping die (53) moves to cut the bent rectangular conductive plate I (22) or conductive plate II (23), so that conductive plate I (22) or conductive plate II (23) is separated from the sheet material.

4. The capacitor manufacturing process according to claim 1, characterized in that: Two molding dies (42) are fixedly connected to two lifting brackets (41) respectively. Both lifting brackets (41) are slidably connected to a sliding bracket (32). The sliding bracket (32) is fixedly connected to a device bracket (31).

5. A capacitor manufacturing process according to claim 4, characterized in that: A lead screw II (33) is rotatably connected to the sliding bracket (32). The threads at both ends of the lead screw II (33) are in opposite directions. Two lifting brackets (41) are respectively threaded to the two ends of the lead screw II (33).

6. A capacitor manufacturing process according to claim 5, characterized in that: Each lifting bracket (41) is rotatably connected to a drive roller (43).

7. A capacitor manufacturing process according to claim 5, characterized in that: The sliding bracket (32) is fixedly connected to a telescopic mechanism I (51), the telescopic end of the telescopic mechanism I (51) is fixedly connected to a telescopic mechanism II (52), and the telescopic end of the telescopic mechanism II (52) is fixedly connected to a stamping die (53).

8. A capacitor manufacturing process according to claim 7, characterized in that: A sensor (61) is fixedly connected to the device bracket (31). A drive shaft (62) is rotatably connected to the device bracket (31). Two arc cams (63) are rotatably connected to the drive shaft (62). Each arc cam (63) is connected to a positioning pin by a thread. Both arc cams (63) can contact the sensor (61). The sensor (61) is connected to the telescopic mechanism II (52) and the power mechanism II.

9. A capacitor, characterized in that: It includes a bottom shell (11) and a top shell (16). A multi-layer insulating layer (21) is provided between the bottom shell (11) and the top shell (16). The multi-layer insulating layer (21) covers each other. Multiple conductive plates I (22) and multiple conductive plates II (23) are covered between the multi-layer insulating layer (21). The multiple conductive plates I (22) cover each other, and the multiple conductive plates II (23) cover each other. Each conductive plate I (22) is fixedly connected to a pin I, and each conductive plate II (23) is fixedly connected to a pin II. The multi-layer insulating layer (21) is interspersed between the multiple conductive plates I (22) and the multiple conductive plates II (23).

10. A capacitor according to claim 9, characterized in that: Two adjustment brackets (12) are fixedly connected to the bottom housing (11). Each adjustment bracket (12) is rotatably connected to a lead screw I (13). Each adjustment bracket (12) is slidably connected to an adjustment block (14). The two adjustment blocks (14) are respectively threaded to the two lead screws I (13). Each adjustment block (14) is fixedly connected to a connecting plate (15). One connecting plate (15) can contact pin I, and the other connecting plate (15) can contact pin II.

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