Conductive pin mounting device

Abstract

The invention provides a conductive pin mounting device capable of more effectively mounting a conductive pin. A conductive pin mounting device (10) is provided with a mounting head (12) for mounting a conductive pin (P) on an electronic circuit board, and the mounting head (12) is provided with: an insertion port (14) for inserting the conductive pin (P); an article erecting device (16) that erects the inserted conductive pin (P); a press shaft (18) that presses the upright conductive pin (P); and a press shaft driving motor (20) that drives the press shaft (18). A press nozzle (22) is provided below the press shaft (18), and the press shaft (18) presses the conductive pin (P) erected by the article erecting device (16) via the press nozzle (22).

Description

TECHNICAL FIELD

[0001] The present application relates to a conductive pin mounting device that mounts a conductive pin on an electronic circuit substrate. BACKGROUND

[0002] A substrate lamination technique is known in which metal posts (pins) are used to electrically connect two semiconductor mounting substrates (Patent Literature 1). In Patent Literature 1, a plurality of metal conductive posts 10 are housed in a plurality of housing holes 23 provided in a housing container 22, and the conductive posts 10 are picked up by an assembly head 26 to be mounted on a surface electrode 13a of a substrate 11.

[0003] PRIOR ART DOCUMENT PATENT LITERATURE Patent Literature 1: Japanese Patent Application Publication No. 2016-32033 SUMMARY PROBLEMS TO BE SOLVED BY THE INVENTION However, in the structure of Patent Literature 1, the conductive posts need to be prepared by being housed in a dedicated housing container before mounting, and the assembly head needs to be reciprocated between the housing container and the mounting position a plurality of times when mounting the conductive posts, so the mounting operation takes a lot of time.

[0004] An object of the present application is to provide a conductive pin mounting device that can mount conductive pins more efficiently.

[0005] MEANS FOR SOLVING THE PROBLEMS The conductive pin mounting device of the first application of the present application is provided with a mounting head for mounting a conductive pin on an electronic circuit substrate, and is characterized in that the mounting head is provided with: a drop-in port for dropping in a conductive pin; a standing unit that stands the dropped-in conductive pin; a punching shaft that punches the stood conductive pin; and a driving section that drives the punching shaft, and punches the stood conductive pin by a punching nozzle provided below the punching shaft.

[0006] The conductive pin mounting device of the second application of the present application is characterized in that, in the first application, the conductive pin mounting device is further provided with a turntable rotating unit that rotates the turntable, and the standing unit includes a turntable provided with a plurality of holes, and the dropped-in conductive pin is stood in the holes by rotation of the turntable.

[0007] EFFECTS OF THE INVENTION According to the present application, a conductive pin mounting device that can mount conductive pins more efficiently can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1is a perspective view of a conductive pin mounting device of an embodiment of the present application as viewed from above.

[0009] Figure 2 is a perspective view of the conductive pin mounting device as viewed from below.

[0010] Figure 3 is a partial cutaway perspective view of the conductive pin mounting device as viewed from above.

[0011] Figure 4 is Figure 3 is an enlarged view of the periphery of the object upstanding device of the partial cutaway perspective view.

[0012] Figure 5 is a longitudinal sectional view of the conductive pin mounting device.

[0013] Figure 6 is a perspective view of a turntable of the present embodiment as viewed from above.

[0014] Figure 7 is a plan view and a bottom view of the turntable.

[0015] Figure 8 is a longitudinal sectional view through the center of rotation of the turntable.

[0016] Figure 9 is an enlarged sectional view showing the structure of the periphery of a groove and a hole of the turntable.

[0017] Figure 10 is a side view showing an example of a semiconductor package to which a conductive pin is mounted. DETAILED DESCRIPTION

[0018] Hereinafter, an embodiment of the present application will be described with reference to the drawings. Figure 1 is a perspective view of a conductive pin mounting device of an embodiment of the present application as viewed from above, Figure 2 is a perspective view as viewed from below. Figure 3 is a perspective view of Figure 1 , Figure 2 is a partial cutaway perspective view of the conductive pin mounting device as viewed from above, Figure 4 is Figure 3 is an enlarged view of the periphery of the object upstanding device of the partial cutaway perspective view. In addition, Figure 5 is a longitudinal sectional view of the conductive pin mounting device.

[0019] The conductive pin mounting device 10 of the present embodiment is a device that mounts, for example, a conductive pin (a pillar, a post, a pin, or the like formed of a conductive material such as metal) for multilayering of a semiconductor chip in a semiconductor package to an electronic circuit substrate, and in the present embodiment, a conductive pin P that is a cylindrical article is mounted. The conductive pin mounting device 10 is provided with a mounting head 12 that is relatively movable with respect to an electronic circuit substrate that is a processing target by a driving mechanism not shown. In the present embodiment, the electronic circuit substrate is moved in front and back and left and right with respect to the fixed mounting head 12.

[0020] The mounting head 12 has a drop port 14 for simultaneously dropping a plurality of conductive pins P, an article upstanding device (upstanding unit) 16 that upstands the dropped conductive pins P, a punch shaft 18 that punches the upstanding conductive pins P, and a punch shaft driving motor (driving portion) 20 that drives the punch shaft 18. A punch nozzle 22 is provided below the punch shaft 18, and the punch shaft 18 punches the conductive pins P upstanding by the article upstanding device 16 via the punch nozzle 22 and mounts the conductive pins P to a given position of the electronic circuit substrate.

[0021] The article upstanding device 16 is provided with a turntable 24 that drops the conductive pins P dropped from the drop port 14 and a turntable rotating motor (turntable rotating unit) 26 that rotates the turntable 24. The turntable 24 is provided with a disc-shaped flat portion 28 on which the dropped conductive pins P are placed and an inclined portion 30 that is provided in a mortar shape to the outer periphery of the flat portion 28.

[0022] A hole portion 28B is provided in the center of the flat portion 28, and a lower end portion of a rotating shaft 28A that extends upward in the vertical direction is mounted. The rotating shaft 28A is supported by the main body of the mounting head 12 by passing through an upper and lower pair of bearings 31, for example. The upper end portion of the rotating shaft 28A is connected to a rotating shaft 26A of the turntable rotating motor 26, and the turntable 24 is intermittently rotated by the turntable rotating motor 26.

[0023] In the inclined portion 30, a plurality of grooves 30A along a generatrix that can accommodate the conductive pins P are formed at a given interval along the circumferential direction. In the flat portion 28 outer periphery portion adjacent to the inclined portion 30 corresponding to the lower end of the grooves 30A, vertical holes 30B that can accommodate the conductive pins P from the grooves 30A are respectively formed.

[0024] The lower surface of the turntable 24 is supported by the bottom surface 12A of the main body of the mounting head 12 in a manner of surrounding the rotating shaft 28A, and the punch nozzles 22 are provided at positions (flat portion 28 outer periphery portion) of the bottom surface 12A corresponding to the holes 30B. The punch shafts 18 that can be pushed out to the punch nozzles 22 by passing through the holes 30B are vertically arranged above the punch nozzles 22, and the upper end portions of the punch shafts 18 are supported by shaft holding portions 32.

[0025] The shaft holding portion 32 is fitted in the hollow pusher rod 34 which is open downward, and is held so as to be able to be raised and lowered with respect to the pusher rod 34. The upper end portion of the shaft holding portion 32 is caught in a step portion formed in the inner peripheral portion of the pusher rod 34, and is prevented from falling off from the pusher rod 34. The lower end portion of the shaft holding portion 32 extends downward from the lower end open portion of the pusher rod 34, and the punch shaft 18 further extends downward from the lower end of the shaft holding portion 32. On the other hand, a pusher head 34A is installed at the upper end of the pusher rod 34, and a coil spring 36 is fitted in the pusher rod 34 between the pusher head 34A and the upper end of the shaft holding portion 32. Thus, the shaft holding portion 32 held in the pusher rod 34 is forced downward with respect to the pusher rod 34.

[0026] In addition, the pusher rod 34 is arranged so as to be able to be raised and lowered in a hole 38 provided in the main body of the mounting head 12, and a coil spring 40 is wound on the outside of the hole 38. The coil spring 40 is sandwiched between the hole 38 and the pusher head 34A, and the pusher rod 34 is forced upward with respect to the main body of the mounting head 12 by the coil spring 40. A horizontally rotating eccentric cam (drive portion) 42 abuts against the top surface of the pusher head 34A, and the rotation axis of the eccentric cam 42 is connected to the rotation axis 20A of the punch shaft drive motor 20.

[0027] That is, if the eccentric cam 42 is rotated by the punch shaft drive motor 20, the pusher head 34A (pusher rod 34) is pressed down against the force of the coil spring 40, and the shaft holding portion 32 and the punch shaft 18 are lowered together with the pusher rod 34. The lowering of the pusher rod 34 by the punch shaft drive motor 20 is performed in a state in which any one of the holes 30B of the turret 24 is positioned directly above the punch nozzle 22 by the turret rotation motor 26.

[0028] That is, if one of the holes 30B is positioned at the punch nozzle 22, the rotation of the turret 24 is stopped, the pusher rod 34 is pressed down, and the punch shaft 18 is pushed out to the punch nozzle 22 through the hole 30B. Thus, the conductive pin P housed in the hole 30B in a vertical posture from the slot 30A is punched from the punch nozzle 22. Furthermore, the rotational position of the turret 24 is detected by the encoder 29 provided to the rotation axis 28A, for example, above the turret 24. In addition, according to the resistance of the conductive pin P being punched, the shaft holding portion 32 can be raised against the force of the coil spring 36 in the pusher rod 34, and excessive force is prevented from being applied to the conductive pin P.

[0029] On the other hand, as described above, conductive pins P on multiple turntables 24 are simultaneously supplied from the inlet 14. The inlet 14 has an inverted pyramidal opening, and for example, 1000 to 2000 conductive pins P are simultaneously inserted in a random posture. A conductive pin supply path 44 is provided inside the mounting head 12 body, which connects the inlet 14 to the top of the turntable 24. The conductive pins P inserted into the inlet 14 fall within the conductive pin supply path 44 due to their own weight and are supplied to the flat portion 28 of the turntable 24.

[0030] Figure 6 This is a perspective view of the turntable 24 in this embodiment, viewed from above. Figure 7 (a) is a top view of turntable 24. Figure 7 (b) is a bottom view. Additionally, Figure 8 This is a longitudinal sectional view passing through the center of rotation of turntable 24. Figure 9 It is an enlarged sectional view showing the structure around a slot 30A and a hole 30B.

[0031] like Figures 6-8 As shown, the turntable 24 is shaped such that a disc-shaped planar portion 28 is surrounded by a mortar-shaped inclined portion 30. Grooves 30A, suitable for the size of the conductive pin P, are formed at given intervals along the generatrix of the inclined portion 30. Holes 30B, perpendicular to the planar portion 28, are provided in the planar portion 28 at positions corresponding to the lower ends of each groove 30A (along the periphery of the planar portion 28 of the inclined portion 30). The lower end of the groove 30A connects to the upper end of the hole 30B. Additionally, a hole 28B is provided in the center of the planar portion 28 for mounting the rotating shaft 28A.

[0032] The conductive pins P, dropped into the flat portion 28 through the inlet 14, are randomly distributed on the turntable 24 and are pushed radially outward as the turntable 24 rotates. The conductive pins P are pressed against the inclined portion 30 by centrifugal force or the like on the outer periphery of the flat portion 28, and a portion of them stand upright and fill the groove 30A. For example... Figure 9 As shown, the conductive pin P, which is filled in the groove 30A, slides down along the groove 30A due to its own weight, falls into the hole 30B, and is filled in an upright state. Alternatively, the filling of the conductive pin P into the groove 30A can be facilitated by blowing air supplied from an air supply source (not shown) onto the conductive pin P, which is pressed and concentrated into the inclined portion 30.

[0033] Based on the signal from the encoder 29, when any one of the holes 30B is positioned directly above the press nozzle 22, the rotation of the turntable 24 is stopped, and the press shaft 18 is lowered. By this, the conductive pin P charged in the hole 30B is pushed out of the press nozzle 22 by the press shaft 18, and is mounted to the desired position of the electronic circuit substrate. Further, in order to position the press nozzle 22 of the mounting head 12 to the desired position of the electronic circuit substrate, the electronic circuit substrate is moved by a control mechanism, a driving mechanism, not shown, during the rotation of the turntable 24.

[0034] Figure 10 is a side view showing an example of a semiconductor package to which a conductive pin P is mounted. Figure 10 The illustrated semiconductor package is, for example, a package in which electronic circuit substrates S1, S2 of substantially the same size are overlapped in two layers. A semiconductor chip C1 is mounted on the upper surface of the electronic circuit substrate S1, and a semiconductor chip C2 is mounted on the upper surface of the electronic circuit substrate S2. A plurality of solder balls W are provided on the lower surface of the electronic circuit substrate S1, and a plurality of conductive pins P are mounted on the upper surface of the electronic circuit substrate S1 in a manner of surrounding the semiconductor chip C1 by the conductive pin mounting apparatus 10 of the present embodiment. The electronic circuit substrate S2 is mounted on the conductive pins P.

[0035] As described above, according to the conductive pin mounting apparatus of the present embodiment, by the article upstanding apparatus provided in the mounting head, a large number of conductive pins fed to the mounting head can be sequentially charged into the holes for press of the conductive pins in an upstanding state, and thus the mounting process is highly efficient, and the time can be greatly shortened.

[0036] BRIEF DESCRIPTION OF THE DRAWINGS 10 conductive pin mounting apparatus 12 mounting head 14 feeding port 16 article upstanding apparatus 18 press shaft 20 press shaft driving motor (driving portion) 22 press nozzle 24 turntable 30 inclined portion 30A slot 30B hole 42 eccentric cam (driving portion) C1, C2 semiconductor chip P conductive pin (cylindrical article) S1, S2 electronic circuit substrate

Claims

1. A conductive pin mounting device, comprising: a mounting head for mounting a conductive pin to an electronic circuit board, characterized in that, The mounting head has: The inlet is used to insert a conductive pin; An upright unit that makes the inserted conductive pin stand upright; The stamped shaft, with its conductive pin after being stamped upright; and The drive unit drives the stamping shaft. The conductive pin, which is erected by the upright unit, is stamped through a stamping nozzle located below the stamping shaft.

2. The conductive pin mounting device according to claim 1, characterized in that, The upright unit includes a turntable, which has multiple holes. The conductive pin mounting device also includes a turntable rotation unit, which rotates the turntable. The rotation of the turntable causes the inserted conductive pin to stand upright in the hole.

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