Circuit board uncovering method

Abstract

The invention discloses an uncovering method of a circuit board, which comprises the following steps of: respectively laying a first isolating membrane and a second isolating membrane, and respectively pressing the first isolating membrane and the second isolating membrane on two opposite surfaces of two base materials through a first thickening material and a second thickening material; forming a first blind hole recessed from the first thickening material to the first isolation film to divide the first thickening material into a first sacrificial region and a first reserved region; forming a second blind hole recessed into the second isolating membrane from the second thickening material to divide the second thickening material into a second sacrificial area and a second reserved area; forming a first drilling hole which is recessed from the first sacrificial region and penetrates through the second isolating membrane; forming a second drilling hole which is recessed from the second sacrificial region and penetrates through the first isolating membrane; an uncovering jig penetrates through the second drill hole and the first drill hole and ejects out the first sacrificial area and the second sacrificial area; the double-face uncovering circuit is simple in structure and easy in wiring design, elastic configuration of the internal space of an electronic product is facilitated, and the utilization efficiency of the whole space is improved.

Description

Technical Field

[0001] This invention relates to a method for opening a circuit board, and more particularly to a method for opening a circuit board. Background Technology

[0002] Most existing electronic products employ circuit board structures with height differences (such as stepped designs) to facilitate the wiring and configuration of different functional modules. However, this height difference design often makes the circuit board structure complex, increasing the difficulty of wiring and design, hindering the flexible configuration of internal space in electronic products, and thus limiting the overall space utilization efficiency.

[0003] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a method for opening a circuit board, which addresses the shortcomings of the prior art.

[0005] This invention discloses a method for opening a circuit board cover, characterized in that the method includes: a preparation step: providing two substrates, and laying a first isolation film and a second isolation film on two opposing surfaces of the two substrates respectively; a pressing step: pressing a first thickening material and a second thickening material onto the two opposing surfaces of the two substrates respectively, so that the two substrates are pressed together; a blind hole step: forming a first blind hole recessed from the first thickening material into the first isolation film to divide the first thickening material into a first sacrificial area and a first retention area, and forming a second blind hole recessed from the second thickening material into the second isolation film to divide the second thickening material into a second... A sacrificial region and a second reserved region; a drilling step: forming at least one first drill hole recessed from the first sacrificial region and extending through the second isolation membrane, and forming at least one second drill hole recessed from the second sacrificial region and extending through the first isolation membrane; wherein the first sacrificial region is partially exposed from at least one second drill hole, and the second sacrificial region is partially exposed from at least one first drill hole; a capping step: passing through at least one capping fixture through at least one second drill hole and ejecting the first sacrificial region, passing through at least one first drill hole and ejecting the second sacrificial region, and removing the first isolation membrane and the second isolation membrane from the two substrates to form a double-sided capped circuit board.

[0006] Optionally, the first release film has a distance of not less than 0.3 mm between one side and the periphery of one of the substrates, and the second release film has a distance of not less than 0.3 mm between one side and the periphery of the other substrate.

[0007] Optionally, in the preparation step, the position of the first isolation membrane corresponds to the position of the second isolation membrane.

[0008] Optionally, in the blind scooping step, the first blind hole is formed corresponding to the outer contour of the first separator, so that the periphery of the first separator is exposed from the first blind hole; the second blind hole is formed corresponding to the outer contour of the second separator, so that the periphery of the second separator is exposed from the second blind hole.

[0009] Optionally, the first sacrificial area is located inside the first blind hole, and the first reserved area is located outside the first blind hole; the second sacrificial area is located inside the second blind hole, and the second reserved area is located outside the second blind hole.

[0010] Optionally, the inner wall of the first blind hole and the outer wall of the second blind hole have a distance of not less than 1 mm at any position.

[0011] Optionally, the number of at least one first borehole is further limited to multiple, and the number of at least one second borehole is further limited to multiple; wherein the multiple first boreholes and the multiple second boreholes are spaced apart from each other and arranged in a staggered manner.

[0012] Optionally, the first thickening material includes an adhesive layer and a conductive layer connected to one side of the adhesive layer, the other side of the adhesive layer of the first thickening material is connected to one of the substrates, and a first separator film is embedded in the adhesive layer of the first thickening material and spaced apart from the conductive layer of the first thickening material; wherein, the second thickening material includes an adhesive layer and a conductive layer connected to one side of the adhesive layer, the other side of the adhesive layer of the second thickening material is connected to another substrate, and a second separator film is embedded in the adhesive layer of the second thickening material and spaced apart from the conductive layer of the second thickening material.

[0013] Optionally, the diameter of at least one first borehole and the diameter of at least one second borehole are each not less than 2.0 mm.

[0014] Optionally, each substrate includes an adhesive layer and two conductive layers connected to opposite sides of the adhesive layer; in the pressing step, the two substrates are pressed together by connecting adhesive layers.

[0015] In summary, the circuit board opening method disclosed in this invention, through the design of a "blind fishing step" and a "drilling step," enables the circuit board to complete the opening step using an opening fixture when there is a need for an opening area formed within its periphery (e.g., in-board opening), thereby forming a double-sided opening circuit board. Furthermore, the double-sided opening circuit board has a simple structure and easy wiring design, which facilitates flexible configuration of the internal space of electronic products, thereby improving overall space utilization efficiency.

[0016] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of step S110 of the circuit board opening method according to an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of step S120 of the circuit board opening method according to an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of step S130 of the circuit board opening method according to an embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram of step S140 of the circuit board opening method according to an embodiment of the present invention.

[0021] Figures 5 to 8 This is a schematic diagram of step S150 of the circuit board opening method according to an embodiment of the present invention. Detailed Implementation

[0022] The following specific embodiments illustrate the implementation of the "circuit board opening method" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0023] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0024] Please see Figures 1 to 8As shown, this embodiment discloses a method for opening a circuit board, which includes steps S110 to S150, which can be defined as a preparation step S110, a pressing step S120, a blind drilling step S130, a drilling step S140, and an opening step S150, respectively. It should be noted that the order of the steps and the actual operation method described in this embodiment can be adjusted as needed and are not limited to those described in this embodiment. Furthermore, the circuit board opening method of this embodiment can provide additional operations before, during, or after each step, and some of the described operations can be substituted, eliminated, or rearranged to achieve additional implementations of the method.

[0025] like Figure 1 As shown, preparation step S110 includes: providing two substrates, and laying a first isolation film M1 and a second isolation film M2 on two surfaces of the two substrates that are opposite to each other. For ease of understanding, this embodiment will use a first substrate 1 and a second substrate 2 as examples to illustrate the circuit board opening method of this embodiment, but this invention is not limited thereto.

[0026] Specifically, the first substrate 1 includes an adhesive layer 11 and two conductive layers 12 (e.g., copper) connected to opposite sides of the adhesive layer 11, and the second substrate 2 includes an adhesive layer 21 and two conductive layers 22 (e.g., copper) connected to opposite sides of the adhesive layer 21. However, the composition of the first substrate 1 and the second substrate 2 can be adjusted and varied according to actual needs, and the present invention is not limited thereto. It should be noted that the first substrate 1 and the second substrate 2 adopt substantially the same structure in this embodiment, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the structures of the first substrate 1 and the second substrate 2 may also be slightly different.

[0027] like Figure 1 As shown, the two opposite sides of the first substrate 1 are a first top surface 1a and a first bottom surface 1b, and the two opposite sides of the second substrate 2 are a second top surface 2a and a second bottom surface 2b. In this embodiment, the first release film M1 and the second release film M2 are respectively laid on the first top surface 1a and the second bottom surface 2b, which are opposite to each other, and the position of the first release film M1 corresponds to the position of the second release film M2, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the first release film M1 and the second release film M2 may also be arranged in a staggered manner.

[0028] Furthermore, the distance between either side of the first release liner M1 and the periphery of the first substrate 1 is not less than 0.3 mm, and the distance between either side of the second release liner M2 and the periphery of the second substrate 2 is not less than 0.3 mm. In other words, the first release liner M1 is laid in the internal region of the first substrate 1 and does not contact its periphery, and the second release liner M2 is laid in the internal region of the second substrate 2 and does not contact its periphery.

[0029] Specifically, the first release film M1 and the second release film M2 are each selected from at least one of peelable inks and protective films (such as polyethylene terephthalate (PET) or polypropylene (PP)).

[0030] like Figure 2 As shown, the lamination step S120 includes: laminating a first thickening material 3 and a second thickening material 4 onto a first top surface 1a and a second bottom surface 2b that are opposite to each other on the first substrate 1 and the second substrate 2, so that the first substrate 1 and the second substrate 2 are laminated together to form a multilayer circuit board structure 10.

[0031] In the lamination step S120, the first substrate 1 and the second substrate 2 are connected to each other by a connecting adhesive layer 5 to form a multilayer circuit board structure 10. However, the connection method between the first substrate 1 and the second substrate 2 can be adjusted and changed according to actual needs, and the present invention is not limited thereto.

[0032] The first thickening material 3 includes an adhesive layer 31 and a conductive layer 32 (e.g., copper) connected to one side of the adhesive layer 31, and the other side of the adhesive layer 31 is connected to the first substrate 1. From another perspective, the first separating film M1 is embedded in the adhesive layer 31 and spaced apart from the conductive layer 32.

[0033] Furthermore, the second thickening material 4 includes an adhesive layer 41 and a conductive layer 42 (e.g., copper) connected to one side of the adhesive layer 41. The other side of the adhesive layer 41 is connected to the second substrate 2, and the adhesive layer 41 covers the second insulating film M2. From another perspective, the second insulating film M2 is embedded in the adhesive layer 41 and spaced apart from the conductive layer 42.

[0034] It should be noted that in the multilayer circuit board structure 10, the area of ​​the first thickening material 3 corresponding to the first isolation film M1 will be defined as the formation location of one of the open cover areas, and the area of ​​the second thickening material 4 corresponding to the second isolation film M2 will be defined as the formation location of another open cover area.

[0035] As described above, the two opening areas of the multilayer circuit board structure 10 are arranged correspondingly to each other in this embodiment (e.g., in the same position), but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, when the first isolation film M1 and the second isolation film M2 are arranged in a staggered manner, the two opening areas of the multilayer circuit board structure 10 are arranged in a staggered manner to each other (e.g., not in the same position).

[0036] It is worth mentioning that, depending on the laying position of the first isolation film M1 and the second isolation film M2, the two open areas formed by the multilayer circuit board structure 10 are both located within the periphery of the multilayer circuit board structure 10 (e.g., open area in the board).

[0037] like Figure 3 As shown, the blind fishing step S130 includes: forming a first blind hole P1 recessed from the first thickening material 3 into the first separating membrane M1 to divide the first thickening material 3 into a first sacrificial region 3a and a first retention region 3b, and forming a second blind hole P2 recessed from the second thickening material 4 into the second separating membrane M2 to divide the second thickening material 4 into a second sacrificial region 4a and a second retention region 4b.

[0038] Furthermore, the first blind hole P1 is formed corresponding to the outer contour of the first separator M1, so that the periphery of the first separator M1 is exposed from the first blind hole P1, and the first blind hole P1 is generally annular relative to the first thickening material 3. From another perspective, the first blind hole P1 surrounds the first sacrificial region 3a, which is located inside the first blind hole P1, while the first retention region 3b is located outside the first blind hole P1.

[0039] Furthermore, the second blind hole P2 is formed corresponding to the outer contour of the second separator M2, so that the periphery of the second separator M2 is exposed from the second blind hole P2, and the second blind hole P2 is generally annular relative to the second thickening material 4. From another perspective, the second blind hole P2 surrounds the second sacrificial region 4a, the second sacrificial region 4a is located inside the second blind hole P2, and the second retention region 4b is located outside the second blind hole P2.

[0040] Furthermore, the inner wall of the first blind hole P1 and the outer wall of the second blind hole P2 have a distance of not less than 1 mm at any position, and the inner wall of the second blind hole P2 and the outer wall of the second blind hole P2 have a distance of not less than 1 mm at any position.

[0041] like Figure 4As shown, drilling step S140 includes: forming at least one first drill hole 6 recessed from the first thickening material 3 and extending through to the second separator M2, and forming at least one second drill hole 7 recessed from the second thickening material 4 and extending through to the first separator M1. At this time, the first sacrificial region 3a is partially exposed from the at least one second drill hole 7, and the second sacrificial region 4a is partially exposed from the at least one first drill hole 6. Specifically, the diameter of the at least one first drill hole 6 and the diameter of the at least one second drill hole 7 are each not less than 2.0 mm.

[0042] Furthermore, at least one first drill hole 6 may penetrate the first sacrificial region 3a, the first release membrane M1, the first substrate 1, the adhesive layer 5, the second substrate 2, and the second release membrane M2 of the first thickening material 3, and at least one second drill hole 7 may penetrate the second sacrificial region 4a, the second release membrane M2, the second substrate 2, the adhesive layer 5, the first substrate 1, and the first release membrane M1 of the second thickening material 4.

[0043] In this embodiment, there are multiple first drill holes 6 and multiple second drill holes 7 (only two of each are shown in the figures), and the multiple first drill holes 6 and multiple second drill holes 7 are spaced apart and staggered. However, the number of first drill holes 6, the number of second drill holes 7, and the arrangement of the first drill holes 6 and the second drill holes 7 can all be adjusted and varied according to actual needs, and the present invention is not limited thereto.

[0044] like Figures 5 to 8 As shown, the opening step S150 includes: passing two opening jigs T (e.g., pins) through two second drill holes 7 and ejecting the first sacrificial area 3a; passing two opening jigs T through two first drill holes 6 and ejecting the second sacrificial area 4a; and removing the first isolation film M1 and the second isolation film M2 from the first substrate 1 and the second substrate 2 respectively to form a double-sided opening circuit board 100.

[0045] Furthermore, such as Figure 5 As shown, a portion of each first drill hole 6 is located in the first sacrificial region 3a, and it can be removed from the multilayer circuit board structure 10 synchronously with the first sacrificial region 3a. Figure 6 As shown, a portion of each second drill hole 7 is located in the second sacrificial region 4a, and can be removed from the multilayer circuit board structure 10 synchronously with the second sacrificial region 4a.

[0046] like Figure 7 and Figure 8 As shown, another part of each first borehole 6 is located on the first isolation membrane M1 and the second isolation membrane M2 respectively, and can be removed synchronously with the first isolation membrane M1 and the second isolation membrane M2. Similarly, another part of each second borehole 7 is located on the first isolation membrane M1 and the second isolation membrane M2 respectively, and can also be removed synchronously with the first isolation membrane M1 and the second isolation membrane M2.

[0047] Based on the above, as Figure 8 As shown, the remaining portion of each first drill hole 6 is defined as a first segment 6a, and the remaining portion of each second drill hole 7 is defined as a second segment 7a. The first segment 6a of each first drill hole 6 and the second segment 7a of each second drill hole 7 each penetrate the first substrate 1, the connecting adhesive layer 5, and the second substrate 2.

[0048] According to the above configuration, the double-sided open-cover circuit board 100 has a height difference (e.g., stepped design) and two open-cover areas (not shown in the figure) that are set in corresponding positions (e.g., in the same position) to provide different functional module configurations, realize flexible wiring and space utilization, and thus adapt to the installation height and space requirements of different components.

[0049] From another perspective, one of the openable areas is defined by the inner edge of the first reserved area 3b and the first top surface 1a, while the other openable area is defined by the inner edge of the second reserved area 4b and the second bottom surface 2b.

[0050] [Technical Effects of the Embodiments of the Invention]

[0051] In summary, the circuit board opening method disclosed in this invention, through the design of a "blind fishing step" and a "drilling step," enables the circuit board to complete the opening step using an opening fixture when there is a need for an opening area formed within its periphery (e.g., in-board opening), thereby forming a double-sided opening circuit board. Furthermore, the double-sided opening circuit board has a simple structure and easy wiring design, which facilitates flexible configuration of the internal space of electronic products, thereby improving overall space utilization efficiency.

[0052] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A method for opening a circuit board, characterized in that, The method for opening the circuit board includes: Preparation step 1: Provide two substrates, and lay a first release film and a second release film on two opposing surfaces of the two substrates respectively; A pressing step: A first thickening material and a second thickening material are pressed onto the two opposing surfaces of the two substrates respectively, so that the two substrates are pressed together; A blind retrieval step: forming a first blind hole recessed from the first thickened material into the first separator to divide the first thickened material into a first sacrificial area and a first retention area, and forming a second blind hole recessed from the second thickened material into the second separator to divide the second thickened material into a second sacrificial area and a second retention area; A drilling step: forming at least one first borehole recessed from the first sacrificial region and extending through the second isolation membrane, and forming at least one second borehole recessed from the second sacrificial region and extending through the first isolation membrane; wherein the first sacrificial region is partially exposed from at least one second borehole, and the second sacrificial region is partially exposed from at least one first borehole; and A capping step: passing through at least one second drilled hole with at least one capping fixture and ejecting the first sacrificial area, passing through at least one first drilled hole with at least one capping fixture and ejecting the second sacrificial area, and removing the first isolation film and the second isolation film from the two substrates to form a double-sided capping circuit board.

2. The circuit board opening method according to claim 1, characterized in that, The first separator has a distance of not less than 0.3 mm between either side of it and the periphery of one of the two substrates, and the second separator has a distance of not less than 0.3 mm between either side of it and the periphery of the other substrate.

3. The circuit board opening method according to claim 1, characterized in that, In the preparation step, the position of the first isolation membrane corresponds to the position of the second isolation membrane.

4. The circuit board opening method according to claim 1, characterized in that, In the blind retrieval step, the first blind hole is formed corresponding to the outer contour of the first separator, so that the periphery of the first separator is exposed from the first blind hole; the second blind hole is formed corresponding to the outer contour of the second separator, so that the periphery of the second separator is exposed from the second blind hole.

5. The circuit board opening method according to claim 4, characterized in that, The first sacrificial area is located inside the first blind hole, and the first reserved area is located outside the first blind hole; the second sacrificial area is located inside the second blind hole, and the second reserved area is located outside the second blind hole.

6. The circuit board opening method according to claim 4, characterized in that, The inner wall of the first blind hole and the outer wall of the second blind hole have a distance of not less than 1 mm at any position.

7. The circuit board opening method according to claim 1, characterized in that, The number of at least one first borehole is further limited to a plurality, and the number of at least one second borehole is further limited to a plurality; wherein the plurality of first boreholes and the plurality of second boreholes are spaced apart from each other and arranged in a staggered manner.

8. The circuit board opening method according to claim 1, characterized in that, The first thickening material includes an adhesive layer and a conductive layer connected to one side of the adhesive layer. The other side of the adhesive layer of the first thickening material is connected to one of the two substrates. A first release film is embedded in the adhesive layer of the first thickening material and spaced apart from the conductive layer of the first thickening material. The second thickening material includes an adhesive layer and a conductive layer connected to one side of the adhesive layer. The other side of the adhesive layer of the second thickening material is connected to the other substrate. A second release film is embedded in the adhesive layer of the second thickening material and spaced apart from the conductive layer of the second thickening material.

9. The circuit board opening method according to claim 1, characterized in that, The diameter of at least one of the first boreholes and the diameter of at least one of the second boreholes are each not less than 2.0 mm.

10. The method for opening a circuit board according to claim 1, characterized in that, Each of the substrates includes an adhesive layer and two conductive layers connected to opposite sides of the adhesive layer; in the pressing step, the two substrates are pressed together by connecting adhesive layers.

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