Heat dissipation piece, heat dissipation module and electronic equipment

Abstract

The invention discloses a heat dissipation piece, a heat dissipation module and electronic equipment, and relates to the technical field of heat dissipation, the heat dissipation piece comprises a middle layer and cover plates arranged on the two opposite sides of the middle layer, the middle layer is provided with a flow channel groove, and the cover plates and the flow channel groove define a flow channel; wherein the middle layer is provided with a plurality of ribs which extend in the first direction and are arranged at intervals in the second direction, the first direction is perpendicular to the second direction, a runner groove is formed between every two adjacent ribs, and the surface of at least one side, facing the runner grooves, of each rib is provided with a groove structure. And the groove structure is communicated with the runner groove. The heat dissipation piece disclosed by the invention has relatively good heat dissipation performance.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a heat dissipation component, as well as a heat dissipation module and electronic device using the heat dissipation component. Background Technology

[0002] With the development of AI technology, chip power consumption is constantly increasing, and heat dissipation efficiency has become a core bottleneck restricting the release of hardware performance. In the space-constrained consumer electronics field, active cooling has become the evolution direction of next-generation heat dissipation technology, thus liquid cooling modules have emerged.

[0003] In related technologies, the liquid cooling plate structure of liquid cooling modules typically involves sealing the flow channel layer and the sealing layer through a hot-pressing process. The working fluid of the liquid cooling module fills the flow channel layer and serves as a carrier for the mutual conversion of thermal and mechanical energy. However, to prevent flow channel collapse, guide the flow direction, or create a certain flow effect, the flow channel design of the liquid cooling plate structure incorporates many supporting ribs. However, these supporting ribs reduce the cross-sectional area of ​​the flow channel, affecting the heat transfer effect. Summary of the Invention

[0004] The main objective of this invention is to provide a heat sink, a heat dissipation module, and an electronic device, aiming to solve the problem of poor heat dissipation performance of existing heat sinks. The heat sink provided by this invention has superior heat dissipation performance.

[0005] To achieve the above objectives, the present invention proposes a heat dissipation component, which includes an intermediate layer and cover plates disposed on opposite sides of the intermediate layer. The intermediate layer is provided with a flow channel groove, and the cover plates and the flow channel groove enclose each other to form a flow channel.

[0006] The intermediate layer is provided with a plurality of ribs extending along a first direction and spaced apart along a second direction. The first direction is perpendicular to the second direction. A flow channel groove is formed between two adjacent ribs. At least one side surface of the rib facing the flow channel groove is provided with a groove structure, and the groove structure is connected to the flow channel groove.

[0007] In one embodiment, the groove structure is a single structure that extends along the first direction; Wherein, the groove structure extends through both ends of the rib along the first direction; and / or, the depth of the groove structure along the second direction gradually increases or decreases or increases first and then decreases from one end of the rib along the first direction to the other end of the rib along the first direction; and / or, the opening size of the groove structure along a third direction gradually increases or decreases or increases first and then decreases from one end of the rib along the first direction to the other end of the rib along the first direction, and the third direction is perpendicular to both the first direction and the second direction.

[0008] In one embodiment, the groove structure includes multiple grooves; The plurality of groove structures are spaced apart along the first direction; and / or the plurality of groove structures are spaced apart along a third direction, the third direction being perpendicular to both the first direction and the second direction.

[0009] In one embodiment, the depth of the groove structure along the second direction is defined as d1, and the width of the rib along the second direction is defined as d2; Where d1≤0.3 d2.

[0010] In one embodiment, the inner wall of the groove structure is formed by at least one of a straight line and an arc; Alternatively, the cross-section of the groove structure along the second direction may be semi-circular, semi-elliptical, or polygonal.

[0011] In one embodiment, each of the ribs has a groove structure on both surfaces facing the flow channel; wherein the cross-sectional shape of the groove structure on the two surfaces is the same or different along the second direction; or, the groove structure on the two surfaces is symmetrically arranged with respect to the center line of the rib extending along the first direction. And / or, the surface of the rib facing the flow channel groove is processed by laser engraving, etching, precision machining, ultrasonic scalpel processing or chemical agent processing to form the groove structure.

[0012] In one embodiment, the inner wall of the flow channel and / or the inner wall of the groove structure is provided with a hydrophilic layer; Alternatively, the inner wall of the flow channel and / or the inner wall of the groove structure may be provided with a hydrophobic layer.

[0013] In one embodiment, the cover plate includes a first cover plate and a second cover plate, the first cover plate and the second cover plate are respectively disposed on opposite sides of the intermediate layer, and the flow channel groove penetrates the intermediate layer along the thickness direction of the intermediate layer, so that the first cover plate and the second cover plate and the flow channel groove surround to form the flow channel, and the visible light transmittance of at least a portion of the first cover plate and / or the second cover plate is greater than or equal to a threshold. Wherein, the first cover plate and the second cover plate are made of the same material or different materials; and / or, the first cover plate is a single-layer structure or a multi-layer structure; and / or, the second cover plate is a single-layer structure or a multi-layer structure; and / or, the first cover plate and / or the second cover plate include at least one of a polymer material layer and a metal layer.

[0014] In one embodiment, the intermediate layer includes a liquid cooling layer and an adhesive layer disposed on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layer together form the sidewall of the flow channel groove, and the cover plate is sealed to the liquid cooling layer through the adhesive layer.

[0015] In one embodiment, along the second direction, the edge of the adhesive layer is flush with the edge of the liquid cooling layer; And / or, the adhesive layer includes at least one adhesive layer; wherein, the adhesive layer is formed by dispensing, film application, or screen printing; and / or, the adhesive includes acrylic adhesive, polyurethane adhesive, epoxy adhesive, UV adhesive, polyolefin elastomer adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive. And / or, the thickness of the adhesive layer is in the range of 0.001mm to 0.05mm; And / or, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

[0016] The present invention also proposes a heat dissipation module, the heat dissipation module comprising: The aforementioned heat sink, wherein the cover plate of the heat sink is provided with a first inlet and a first outlet communicating with the flow channel; and A micropump, wherein the micropump has a second inlet and a second outlet, and the micropump is disposed on the heat sink so that the first inlet is connected to the second outlet and the first outlet is connected to the second inlet.

[0017] The present invention also proposes an electronic device, the electronic device comprising the heat sink described above; Alternatively, the electronic device may include the heat dissipation module described above.

[0018] The heat sink of this invention comprises an intermediate layer and cover plates on opposite sides of the intermediate layer, with flow channel grooves in the intermediate layer. The cover plates and flow channel grooves enclose and form flow channels, providing a flow path / space for the working fluid, thus enabling the heat sink to perform its heat dissipation function. Simultaneously, multiple ribs extending along a first direction and spaced apart along a second direction are provided in the intermediate layer, forming flow channel grooves between adjacent ribs. At least one surface of the ribs facing the flow channel grooves has a groove structure, which communicates with the flow channel grooves. This groove structure effectively increases the space for the heat sink to accommodate or fill the working fluid, allowing the working fluid to fill within the flow channels and groove structures. This increases the amount of working fluid filled in the heat sink, increasing the flow area and heat dissipation area, resulting in better heat dissipation performance. Furthermore, the ribs not only provide support to prevent flow channel collapse but also guide the flow of the working fluid, improving the heat dissipation efficiency of the heat sink. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A cross-sectional schematic diagram of an embodiment of the heat sink provided by the present invention; Figure 2 A cross-sectional schematic diagram of another embodiment of the heat sink provided by the present invention; Figure 3 A cross-sectional schematic diagram of another embodiment of the heat sink provided by the present invention. Figure 4 A schematic diagram of the structure of a rib provided by the present invention; Figure 5 for Figure 4 Enlarged view of point A in the middle; Figure 6 A cross-sectional schematic diagram of an embodiment of the reinforcing bar provided by the present invention; Figure 7 A cross-sectional schematic diagram of another embodiment of the reinforcing bar provided by the present invention; Figure 8 A cross-sectional schematic diagram of another embodiment of the reinforcing bar provided by the present invention; Figure 9 A cross-sectional schematic diagram of another embodiment of the reinforcing bar provided by the present invention; Figure 10 This is a schematic diagram of a structure of an embodiment of the heat dissipation module provided by the present invention; Figure 11 This is an exploded view of an embodiment of the heat dissipation module provided by the present invention; Figure 12 This is a cross-sectional schematic diagram of an embodiment of the heat dissipation module provided by the present invention.

[0021] Explanation of icon numbers: 100. Heat dissipation module; 1. Heat dissipation component; 11. Cover plate; 111. First cover plate; 112. Second cover plate; 113. First inlet; 114. First outlet; 115. Polymer material layer; 116. Metal layer; 12. Intermediate layer; 121. Flow channel groove; 122. Liquid cooling layer; 123. Adhesive layer; 124. Rib; 125. Groove structure; 13. Flow channel; 2. Micro pump; 21. Second inlet; 22. Second outlet.

[0022] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0025] Meanwhile, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three options. Taking "A and / or B" as an example, it includes option A, option B, or an option that satisfies both A and B.

[0026] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0027] This invention proposes a heat sink 1. It is understood that the heat sink 1 can be applied to electronic devices such as mobile phones, tablets, laptops, VR (Virtual Reality) products, AR (Augmented Reality) products, watches, and wearable devices, and is not limited thereto.

[0028] Please refer to the reference. Figures 1 to 9 As shown, in this embodiment of the invention, the heat sink 1 includes an intermediate layer 12 and cover plates 11 disposed on opposite sides of the intermediate layer 12. The intermediate layer 12 is provided with a flow channel groove 121, and the cover plates 11 and the flow channel groove 121 enclose each other to form a flow channel 13. The intermediate layer 12 is provided with a plurality of ribs 124 extending along a first direction and spaced apart along a second direction. The first direction is perpendicular to the second direction. A flow channel groove 121 is formed between two adjacent ribs 124. At least one side surface of the rib 124 facing the flow channel groove 121 is provided with a groove structure 125, and the groove structure 125 communicates with the flow channel groove 121.

[0029] In this embodiment, the heat sink 1 is applied in an electronic device to remove the heat generated by the heat-generating element inside the electronic device, thereby achieving a cooling effect and controlling the temperature of the heat-generating element. It is understood that the heat sink 1 has a flow channel 13 inside, which is used to fill a working fluid. The working fluid can act as a heat transfer carrier, and the flow channel 13 of the heat sink 1 provides a flow path / place for the working fluid.

[0030] To further improve the heat dissipation performance of the heat sink 1 and enable the working fluid within the flow channel 13 to flow and achieve heat dissipation, a micro-pump 2 is typically installed on the heat sink 1. The micro-pump 2 is connected to the flow channel 13 of the heat sink 1, thereby providing the flow power for the working fluid within the flow channel 13. This is understandable, as... Figures 10 to 12 As shown, the heat sink 1, the working fluid, and the micro pump 2 form a heat dissipation module 100. Under the action of the micro pump 2, the working fluid in the flow channel 13 of the heat sink 1 moves along the flow channel 13, so that the working fluid can act as a medium for heat transfer during the flow process, and the heat dissipation module 100 can realize the function of heat dissipation.

[0031] Optionally, the visible light transmittance of at least a portion of the heat sink 1 is greater than or equal to a threshold. In this embodiment, by setting the visible light transmittance of at least a portion of the heat sink 1 to be greater than or equal to a threshold, the visual effect of the working fluid flowing within the flow channel 13 can be displayed through the heat sink 1 in that area, i.e., the heat dissipation module 100 can achieve a visual effect, thereby improving the product's display effect and technological feel. It should be noted that the visible light transmittance mentioned in this embodiment refers to the ratio of the radiant energy projected and transmitted through an object to the total radiant energy projected onto the object. Optionally, the threshold can be 70%, 80%, 90%, etc., and is not limited here.

[0032] Understandably, the heat dissipation performance mentioned in this embodiment can be understood as the amount of heat absorbed or released by the working fluid when changing its temperature per unit. The better the heat dissipation performance of the working fluid, the more heat it absorbs or releases when changing its temperature per unit, and the more significant the temperature control effect of the working fluid.

[0033] In this embodiment, as Figures 1 to 3 , Figure 11 and Figure 12 As shown, by setting the heat sink 1 as an intermediate layer 12 and the cover plates 11 on opposite sides of the intermediate layer 12, that is, the cover plates 11 include two, namely the first cover plate 111 and the second cover plate 112. The first cover plate 111, the intermediate layer 12 and the second cover plate 112 are stacked in sequence, and the intermediate layer 12 is sandwiched between the first cover plate 111 and the second cover plate 112, so that the first cover plate 111 and the second cover plate 112 on both sides can support and protect the intermediate layer 12.

[0034] Optionally, at least a portion of the visible light transmittance of the first cover plate 111 and / or the second cover plate 112 is greater than or equal to a threshold. This allows the flow of the working fluid within the flow channel 13 to be visualized through this area, meaning the heat sink 1 can be visualized.

[0035] Understandably, the intermediate layer 12 has a flow channel 121. The flow channel 121 can be a groove, in which case the cover plate 11 covering the groove and the groove on the intermediate layer 12 enclose the flow channel 13; or, the flow channel 121 can be a through-slot structure, in which case the flow channel 121 extends through the intermediate layer 12 along the thickness direction, and the two cover plates 11 (i.e., the first cover plate 111 and the second cover plate 112) enclose the flow channel 121 of the intermediate layer 12 to form the flow channel 13. This allows the working fluid to flow smoothly in the flow channel 13 formed at the flow channel 121, and to make full contact with the liquid cooling layer 122 and the cover plate 11, thereby achieving efficient heat conduction.

[0036] In this embodiment, the flow channel 121 is a through-slot structure disposed on the intermediate layer 12, which simplifies the process of creating the flow channel 121. In one embodiment, as... Figures 1 to 3 , Figure 11 and Figure 12 As shown, the cover plate 11 includes a first cover plate 111 and a second cover plate 112. The first cover plate 111 and the second cover plate 112 are respectively disposed on opposite sides of the intermediate layer 12. The flow channel groove 121 penetrates the intermediate layer 12 along the thickness direction of the intermediate layer 12, so that the first cover plate 111 and the second cover plate 112 and the flow channel groove 121 enclose each other to form a flow channel 13.

[0037] Understandably, depending on the actual design, the shape of the flow channel 121 may include, but is not limited to, straight, serpentine, and spiral shapes, to optimize the flow path of the working fluid and heat exchange efficiency. Corresponding connectors or interfaces may also be provided at the inlet and outlet of the flow channel 13 to facilitate connection with external heat exchange systems such as micropumps and radiators, thus forming a complete heat exchange cycle.

[0038] Of course, in other embodiments, the heat sink 1 may also be configured to include only two cover plates 11 (i.e., a first cover plate 111 and a second cover plate 112), with at least one of the opposing surfaces of the two cover plates 11 recessed to form a flow channel groove 121, such that the other cover plate 11 cooperates with the flow channel groove 121 or the two flow channel grooves 121 to form a flow channel 13, etc., which is not limited here. It is understood that the flow channel groove 121 can be formed by machining, mold processing or etching process, which is not limited here.

[0039] It should be noted that the structural design of the heat sink 1 in the above embodiments is only exemplary. In other embodiments, the structural design of the heat sink 1 can be diversified, all of which are within the protection scope of the present invention.

[0040] In this embodiment, a plurality of spaced ribs 124 are provided in the intermediate layer 12. Optionally, the plurality of ribs 124 extend along a first direction and are spaced along a second direction perpendicular to the first direction, so that a flow channel groove 121 is formed between two adjacent ribs 124.

[0041] It should be noted that the ribs 124 of the intermediate layer 12 extend along the first direction, that is, the length of the ribs 124 along the first direction is the length of the ribs 124, and the width of the ribs 124 along the second direction is the width of the ribs 124. The stacking direction of the first cover plate 111, the intermediate layer 12, and the second cover plate 112 of the cover plate 11 is the third direction, which is perpendicular to both the first and second directions. The thickness of the ribs 124 along the third direction is the thickness of the ribs 124.

[0042] It is understandable that when the flow channel 121 is a through-slot structure, the two adjacent ribs 124 are independent support rib structures; when the flow channel 121 is a groove, the two adjacent ribs 124 are two side wall protrusions located in the groove, which is not limited here.

[0043] In this embodiment, as Figures 1 to 9 , Figure 12 As shown, by providing a groove structure 125 on at least one surface of the rib 124 facing the flow channel 121, that is, by providing a groove structure 125 on at least one surface of the rib 124 along the second direction, the opening of the groove structure 125 faces the flow channel 121 or the flow channel 13, that is, the groove structure 125 connects to the flow channel 121 or the flow channel 13. Thus, the groove structure 125 effectively increases the space for the heat sink 1 to accommodate or fill the working fluid, so that the working fluid can be filled in the flow channel 13 and the groove structure 125, thereby increasing the flow area and heat dissipation area, so that the heat sink 1 has better heat dissipation performance. Moreover, the rib 124 can not only play a supporting role to prevent the flow channel 13 from collapsing, but also guide the flow of the working fluid, so that the flow of the working fluid in the flow channel 13 can achieve a visual effect, improving the display effect and technological sense of the product.

[0044] Optionally, a groove structure 125 is provided on at least one surface of each of the plurality of ribs 124 of the intermediate layer 12 facing the flow channel 121. Of course, in other embodiments, the groove structure 125 may only be provided on some of the surfaces of the ribs 124 facing the flow channel 121, which is not limited here. In this embodiment, the groove structure 125 is formed on the surface of the ribs 124 facing the flow channel 121 by laser engraving, etching, precision machining, ultrasonic scalpel processing, or chemical processing, which is not limited here.

[0045] Optionally, the cross-section of the groove structure 125 along the second direction is semi-circular, semi-elliptical, or polygonal. In this embodiment, the cross-section of the groove structure 125 along the second direction is semi-circular, semi-elliptical, or polygonal, such as semi-circular, semi-elliptical, U-shaped, V-shaped, W-shaped, etc., and is not limited herein. It can be understood that the inner wall of the groove structure 125 is formed by at least one of straight lines and arcs, that is, the inner wall of the groove structure 125 is formed by straight lines to form a polygonal structure, and is not limited herein; or, the inner wall of the groove structure 125 is formed by arcs to form semi-circular, semi-elliptical, irregular arc, etc., and is not limited herein; or, the inner wall of the groove structure 125 is formed by straight lines and arcs to form a U-shape or other irregular shape, etc., and is not limited herein.

[0046] In this embodiment, as Figures 1 to 9 , Figure 12 As shown, each rib 124 has a groove structure 125 on both surfaces facing the flow channel 121. This arrangement can further increase the flow area and heat dissipation area of ​​the working fluid, thereby improving heat dissipation performance. Optionally, each of the multiple ribs 124 in the intermediate layer 12 may have a groove structure 125 on both surfaces facing the flow channel 121, which is not limited here.

[0047] It is understood that the cross-sectional shapes of the groove structures 125 on the two surfaces of each rib 124 along the second direction may be the same or different. That is, the shape and outline of the groove structures 125 on the two surfaces of each rib 124 along the second direction may be the same or different, and this is not limited here. Optionally, the groove structures 125 on the two surfaces are symmetrically arranged with respect to the center line of the rib extending along the first direction.

[0048] To ensure that the rib 124 can provide support and guidance, in one embodiment, the depth of the groove structure 125 along the second direction is defined as d1, and the width of the rib 124 along the second direction is defined as d2; wherein, d1 ≤ 0.3 d2.

[0049] In this embodiment, as Figures 1 to 9 , Figure 12 As shown, the depth of the groove structure 125 along the second direction is d1, and the width of the rib 124 along the second direction is d2. By making the depth d1 of the groove structure 125 less than or equal to 0.3 times the width d2 of the rib 124, the support of the rib 124 for the cover plate 11 can be ensured while increasing the heat dissipation area and the working fluid flow area, thus preventing the flow channel 13 from collapsing.

[0050] In one implementation, such as Figure 4 and Figure 5As shown, only one groove structure 125 is provided on the surface of the rib 124 facing the flow channel 13, that is, there is only one groove structure 125, and the groove structure 125 extends along the first direction. In this embodiment, the extending direction of the groove structure 125 is consistent with the length direction of the rib 124.

[0051] Optionally, the groove structure 125 extends through both ends of the rib 124 along the first direction, that is, the groove structure 125 extends through both ends of the rib 124 along its length. This arrangement ensures smoother flow of the working fluid. In this embodiment, the groove structure 125 extends along the first direction and extends through both ends of the rib 124.

[0052] It is understood that the depth of the groove structure 125 along the second direction can be the same or different in the first direction, and this is not limited here. Optionally, the depth of the groove structure 125 along the second direction can gradually increase, gradually decrease, or increase first and then decrease from one end of the rib 124 along the first direction to the other end of the rib 124 along the first direction. In this embodiment, the depth of the groove structure 125 along the second direction is defined as the depth of the groove structure 125. The depth of the groove structure 125 along the first direction can be set to be different, that is, the depth of the groove structure 125 from one end of the rib 124 along the first direction to the other end of the rib 124 can be set to gradually increase; or, the depth of the groove structure 125 from one end of the rib 124 along the first direction to the other end of the rib 124 can be set to gradually decrease; or, the depth of the groove structure 125 from one end of the rib 124 along the first direction to the other end of the rib 124 can be set to increase first and then decrease, or decrease first and then increase, etc., and this is not limited here.

[0053] In one embodiment, the opening size of the groove structure 125 along the third direction gradually increases or decreases or increases first and then decreases from one end of the rib 124 along the first direction to the other end of the rib 124 along the first direction, and the third direction is perpendicular to both the first direction and the second direction.

[0054] In this embodiment, the opening size of the groove structure 125 on the surface of the rib 124 facing the flow channel groove 121 can be set differently along the first direction. For example, the opening size of the groove structure 125 can be gradually increased from one end of the rib 124 along the first direction to the other end of the rib 124 along the first direction; or, the opening size of the groove structure 125 can be gradually decreased from one end of the rib 124 along the first direction to the other end of the rib 124 along the first direction; or, the opening size of the groove structure 125 can be increased first and then decreased or decreased first and then increased from one end of the rib 124 along the first direction to the other end of the rib 124 along the first direction. No limitation is made here.

[0055] Optionally, the groove structure 125 is flared along the second direction. Of course, in other embodiments, the groove structure 125 may also be flared along the first direction, which is not limited here.

[0056] In one embodiment, the surface of the rib 124 facing the flow channel 13 is provided with only a plurality of groove structures 125, that is, the groove structures 125 include a plurality of grooves. Optionally, the plurality of groove structures 125 are spaced apart along a first direction, that is, the plurality of groove structures 125 are spaced apart along the length direction of the rib 124. Of course, the plurality of groove structures 125 are spaced apart along a third direction, which is perpendicular to both the first and second directions. That is, the plurality of groove structures 125 are spaced apart along the thickness direction of the rib 124. Optionally, the plurality of groove structures 125 are spaced apart or continuous along the third direction, which is not limited here.

[0057] It should be noted that the working fluid fills the flow channel 13 and the groove structure 125 of the heat sink 1, and the working fluid will come into contact with the inner wall of the flow channel 13 and the inner wall of the groove structure 125. In order to reduce the flow resistance of the working fluid in the flow channel 13 and the groove structure 125, the inner wall of the flow channel 13 and / or the inner wall of the groove structure 125 are treated to reduce the flow resistance of the working fluid in the flow channel 13 and the groove structure 125, for example, by providing a coating structure.

[0058] Understandably, when the working fluid is hydrophilic, the inner wall of the flow channel 13 and / or the inner wall of the groove structure 125 is provided with a hydrophilic layer. This arrangement can effectively improve the hydrophilicity of the inner wall of the flow channel 13 and / or the inner wall of the groove structure 125, thereby preventing the working fluid from sticking to the wall during flow and reducing the flow resistance of the working fluid in the flow channel 13 and / or the groove structure 125.

[0059] Of course, when the working fluid is hydrophobic, the inner wall of the flow channel 13 and / or the inner wall of the groove structure 125 is provided with a hydrophobic layer. This arrangement can effectively improve the hydrophobicity of the inner wall of the flow channel 13 and / or the inner wall of the groove structure 125, thereby avoiding the phenomenon of the working fluid sticking to the wall during the flow process, and reducing the flow resistance of the working fluid in the flow channel 13 and / or the groove structure 125.

[0060] Optionally, the inner walls of the flow channel 13 and the groove structure 125 are provided with a hydrophilic layer or a hydrophobic layer. The hydrophilic layer or hydrophobic layer can be formed by vacuum coating or surface treatment with hydrophilic / hydrophobic chemicals. When using hydrophilic / hydrophobic chemicals for surface treatment, the flow channel 13 and the groove structure 125 are poured with the hydrophilic / hydrophobic chemicals, dried, and cured by UV or thermosetting methods to form the hydrophilic layer or hydrophobic layer, which is not limited here.

[0061] In one embodiment, the cover plate 11 is a single-layer structure or a multi-layer structure. In this embodiment, the first cover plate 111 is a single-layer structure or a multi-layer structure; and / or, the second cover plate 112 is a single-layer structure or a multi-layer structure.

[0062] In this embodiment, as Figures 1 to 3 , Figure 11 and Figure 12 As shown, the first cover plate 111 can be provided with a single layer or multiple layers of sealing layers. The first cover plate 111 forms an adhesive seal with the first side of the liquid cooling layer 122 through the adhesive layer 123. The first cover plate 111 also includes a sealing layer and a barrier layer. The barrier layer is disposed close to the flow channel groove 121. The first cover plate 111 forms an adhesive seal with the first side of the liquid cooling layer 122 through the adhesive layer 123. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0063] Understandable, such as Figures 1 to 3 , Figure 11 and Figure 12 As shown, the second cover plate 112 can be provided, including a single layer or multiple layers of sealing layers. The second cover plate 112 forms an adhesive seal with the second side of the liquid cooling layer 122 through the adhesive layer 123. The second cover plate 112 also includes a sealing layer and a barrier layer. The barrier layer is located close to the flow channel groove 121. The second cover plate 112 forms an adhesive seal with the second side of the liquid cooling layer 122 through the adhesive layer 123. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0064] Optionally, the first cover plate 111 and / or the second cover plate 112 include at least one of a polymer material layer 115 and a metal layer 116.

[0065] In this embodiment, according to actual design requirements, the first cover plate 111 can be configured to include a polymer material layer 115 and / or a metal layer 116, and the second cover plate 112 can include a polymer material layer 115 and / or a metal layer 116. For example, both the first cover plate 111 and the second cover plate 112 can be polymer material layers 115, which can meet the lightweight design requirements of the heat sink 1, thereby facilitating the carrying and use of electronic devices with the heat sink 1. Alternatively, one of the first cover plate 111 and the second cover plate 112 can be a polymer material layer 115, and the other can be a metal layer 116, which can ensure the stability of electronic devices with the heat sink 1 in complex working environments and reduce the operating temperature of electronic devices. Alternatively, one of the first cover plate 111 and the second cover plate 112 can be a polymer material layer 115 or a metal layer 116, and the other can be a polymer material layer 115 and a metal layer 116, in which case the polymer material layer 115 and the metal layer 116 are bonded together by an adhesive layer. This allows for the combination of the characteristics of both to improve the overall performance of the heat dissipation component. This is understandable, and vice versa; no specific limitations are made here.

[0066] Optionally, the metal layer 116 is a copper, aluminum, or stainless steel alloy. Optionally, the polymer material layer 115 is made of at least one of the following materials: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), cyclic olefin copolymer (COC), polytetramethylpentene (PMP), polyimide (PI), polymethyl methacrylate (PMMA), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), styrene-acrylonitrile copolymer (AS), acrylonitrile-butadiene-styrene copolymer (ABS), and butadiene-styrene copolymer (BS), without limitation.

[0067] In this embodiment, at least one of the first cover plate 111 and the second cover plate 112 includes a polymer material layer 115, that is, the first cover plate 111 and / or the second cover plate 112 includes a polymer material layer 115. The visible light transmittance of the polymer material layer 115 is greater than or equal to a certain threshold. Optionally, the polymer material layer 115 is a transparent material.

[0068] It is understandable that transparent materials have high visible light transmittance, and the heat sink 1 formed using the aforementioned material also has high visible light transmittance. In some implementations, the visible light transmittance of the heat sink 1 can reach over 90%, enabling the heat dissipation module 100 to achieve a significant flow visualization effect. It should be noted that transparent materials can be understood as materials with visible light transmittance greater than a threshold in the 380nm~760nm wavelength band.

[0069] Optionally, the first cover plate 111 and the second cover plate 112 may be made of the same material or different materials, which is not limited here.

[0070] Understandable, such as Figure 3 As shown, the first cover plate 111 and / or the second cover plate 112 include a polymer material layer 115 and a metal layer 116. In order to ensure that the visible light transmittance of the areas of the first cover plate 111 and / or the second cover plate 112 is greater than or equal to a certain threshold, the area of ​​the metal layer 116 corresponding to the flow channel 13 is processed by etching, so that the area of ​​the metal layer 116 corresponding to the flow channel 13 is provided with through holes. That is, the area corresponding to the flow channel 13 is only provided with the polymer material layer 115. This ensures that the visible light transmittance of the area of ​​the cover plate 11 corresponding to the flow channel 13 is greater than or equal to a certain threshold, thereby allowing the visualization effect of the working fluid's flow within the flow channel 13 to be displayed through this area, i.e., the heat sink 1 can achieve a visualization effect.

[0071] It should be noted that at least a portion of the heat sink 1 is made of the aforementioned material so that the covering layer has high visible light transmittance, ensuring that the heat dissipation module 100 can achieve a significant flow visualization effect. The above embodiments involving the use of transparent material to form the heat sink 1 can be understood as the transparent material forming at least a portion of the heat sink 1 so that at least a portion of the heat sink 1 has high visible light transmittance.

[0072] To further reduce the evaporation loss of the working fluid within the flow channel 13, in one embodiment, the polymer material layer 115 is processed using any one of the following processes: plasma processing, radiation modification, mechanical treatment, coating, surface grafting polymerization, chemical etching, or coupling agent processing to form a modified polymer material layer, such that the water vapor permeability of the modified polymer material layer is ≤0.01 g / (m²). 2 •24h), thereby increasing the difficulty of the working fluid escaping the flow channel 13 by using the modified polymer material layer, which reduces the evaporation loss of the working fluid, thereby improving the heat dissipation performance of the heat sink 1 in the heat dissipation module 100 and extending its service life.

[0073] It should be noted that the surface of the polymer material layer 115 is treated using any one of the following processes: plasma processing, radiation modification, mechanical treatment, coating, surface grafting polymerization, chemical etching, or coupling agent processing. During this treatment, active groups are used to form an active layer on the surface of the polymer material layer 115, resulting in a modified polymer material layer. This modified polymer material layer effectively reduces the evaporation loss of the working fluid within the flow channel 13, thus increasing the difficulty for the working fluid to escape the flow channel 13. This improves heat dissipation performance and service life, thereby ensuring the long-term reliability of the heat dissipation module 100. Optionally, the active groups can be hydroxyl, carboxyl, etc., and are not limited here.

[0074] In one embodiment, the intermediate layer 12 includes a liquid cooling layer 122. The liquid cooling layer 122 is disposed between the first cover plate 111 and the second cover plate 112 for supporting the first cover plate 111 and the second cover plate 112.

[0075] In this embodiment, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be an integrated structure. This ensures that the flow channel 13 formed by the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 has a better sealing effect, preventing leakage (working fluid) problems. Optionally, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 are all made of transparent materials, so that the heat sink 1 can achieve a visible flow effect.

[0076] Of course, in other embodiments, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be separate structures. The first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be connected by means of high-temperature adhesive bonding, UV adhesive light-curing bonding, hot-press bonding sealing welding, hot melt welding, ultrasonic welding, ultra-frequency welding, diffusion welding, etc.

[0077] In one embodiment, the intermediate layer 12 includes a liquid cooling layer 122 and an adhesive layer 123 disposed on both sides of the liquid cooling layer 122. The liquid cooling layer 122 and the adhesive layer 123 together form the sidewall of the flow channel 121, and the cover plate 11 is sealed to the liquid cooling layer 122 through the adhesive layer 123.

[0078] In this embodiment, as Figures 1 to 3 , Figure 12 As shown, the liquid cooling layer 122 has a first adhesive layer on one side and a second adhesive layer on the opposite side. The first adhesive layer, the liquid cooling layer 122, and the second adhesive layer together form an intermediate layer 12. During the processing of the flow channel 121, the first adhesive layer, the liquid cooling layer 122, and the second adhesive layer can be stacked to form the intermediate layer 12, and then the intermediate layer 12 can be cut to form the flow channel 121. This allows the first adhesive layer, the liquid cooling layer 122, and the second adhesive layer to jointly form the sidewall of the flow channel 121, facilitating the formation of the flow channel 121 while also enhancing the sealing of the sidewall of the flow channel 121. This ensures the sealing of the flow channel formed on the heat sink, thereby guaranteeing the heat exchange effect.

[0079] It is understood that the groove structure 125 is disposed on the surface of the liquid cooling layer 122 facing the flow channel 13; or, the groove structure 125 is disposed on the surfaces of the liquid cooling layer 122 and the adhesive layer 123 facing the flow channel 13, which is not limited here.

[0080] Optionally, the first cover plate 111, the liquid cooling layer 122, and the second cover plate 112 can be made of the same or different materials. However, it is necessary to ensure that at least one of the first cover plate 111 and the second cover plate 112 is made of a transparent material.

[0081] In this embodiment, the first adhesive layer and the second adhesive layer are located on both sides of the liquid cooling layer 122, and the first adhesive layer and the second adhesive layer can be made of adhesive or thin film material with good sealing and thermal conductivity. On the one hand, the adhesive layer 123 can firmly connect the cover plate 11 to the liquid cooling layer 122, thereby forming an integral structure of the heat sink 1; on the other hand, the adhesive layers 123 on both sides can also ensure the sealing of the flow channel groove 121 and prevent poor heat exchange effect caused by working fluid leakage.

[0082] Understandably, this allows for the formation of a five-layer stacked structure for the heat sink 1. Depending on actual design requirements, the thickness of each layer can be adjusted to reduce the overall thickness of the heat sink 1, thereby meeting the need for thinner and lighter electronic devices using this heat sink 1.

[0083] During the production and assembly process, the first cover plate 111 and the second cover plate 112 are respectively sealed to the liquid cooling layer 122 through their respective adhesive layers 123, so that the first cover plate 111, the second cover plate 112, and the intermediate layer 12 form a closed flow channel 13 at the flow channel groove 121. The working fluid flows in the flow channel 13, thereby realizing the heat exchange function of the heat sink 1. In this way, the adhesive layer 123 can be used to achieve the bonding and sealing of the first cover plate 111, the second cover plate 112 and the liquid cooling layer 122, which simplifies the sealing process and reduces the processing difficulty of the heat sink 1. In particular, special treatments, such as surface roughening, can be applied to the surfaces of the first cover plate 111 and the second cover plate 112 that are in contact with the adhesive layer 123, which can strengthen the bonding strength between the first cover plate 111 and the second cover plate 112 and the adhesive layer 123.

[0084] In addition, heat dissipation fins can be provided on the first cover plate 111 and / or the second cover plate 112 to increase the heat exchange area and promote air convection, thereby further improving the heat exchange effect of the heat sink 1. Alternatively, a more efficient working fluid (such as a low-viscosity, high-thermal-conductivity liquid) or a phase change material can be used to further improve the heat exchange effect of the heat sink 1.

[0085] Optionally, the adhesive layer 123 includes at least one layer of adhesive. Specifically, depending on the actual design requirements, the adhesive layer 123 may include one, two, or even multiple layers of adhesive to achieve different bonding effects. The adhesive layer 123 may include the same type of adhesive, or it may include different types of adhesive to meet different application needs.

[0086] In this embodiment, the adhesive is applied via dispensing, film application, or screen printing to form the adhesive layer 123. It is understood that the dispensing, film application, and screen printing processes allow for precise control of the adhesive application amount and distribution, ensuring that the adhesive layer 123 has a uniform thickness on both sides of the liquid cooling layer 122 and covers only the areas requiring bonding. This helps reduce unnecessary material waste and improves bonding strength and sealing performance. Furthermore, the adhesive application shape and spacing can be adjusted as needed to accommodate different shapes and sizes of the liquid cooling layer 122 and the cover plate. This helps optimize the structure of the adhesive layer 123, increases the contact area and adhesion of the bonding interface, and thus enhances the overall bonding performance and sealing effect of the heat sink 1.

[0087] Optionally, the adhesive includes acrylic adhesive, polyurethane adhesive, epoxy adhesive, UV adhesive, polyolefin elastomer adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive. It is understood that by designing the adhesive to be any one of acrylic adhesive, polyurethane adhesive, epoxy adhesive, UV adhesive, polyolefin elastomer adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive, bonding and sealing between the first cover plate 111 and the liquid cooling layer 122, and between the second cover plate 112 and the liquid cooling layer 122, can be achieved, thereby simplifying the molding process of the heat sink 1 and reducing the processing difficulty of the heat sink 1.

[0088] In this embodiment, the adhesive can be selected as a pressure-sensitive hot melt composite film. The first cover plate 111 and the liquid cooling layer 122, as well as the second cover plate 112 and the liquid cooling layer 122, are bonded using the pressure-sensitive hot melt composite film. This can improve the reliability of the bonding and sealing, as well as its density, thereby improving the structural stability of the heat sink 1.

[0089] In one embodiment, the thickness of the adhesive layer 123 ranges from 0.001 mm to 0.05 mm. It is understood that the thickness of the adhesive layer 123 can be precisely controlled between 0.001 mm and 0.05 mm during dispensing, film application, or screen printing processes. This allows the adhesive layer 123 to connect the liquid cooling layer 122 to the cover plates 11 on both sides while also reducing the thickness of the adhesive layer 123. This reduces the overall thickness of the heat sink 1, thereby meeting the requirement for thinner and lighter electronic devices using the heat sink 1.

[0090] Understandably, when the heat sink 1 needs to be relatively thin, the thickness of the adhesive layer 123 can be set to 0.001mm~0.02mm; when there is a high requirement for the connection strength of the heat sink 1, the thickness of the adhesive layer 123 can be set to 0.025mm~0.05mm.

[0091] In this embodiment, along the second direction, the edge of the adhesive layer 123 is flush with the edge of the liquid cooling layer 122. Aligning the edges of the adhesive layer 123 and the liquid cooling layer 122 reduces the resistance to the flow of the working fluid within the flow channel, thereby ensuring the heat exchange effect of the heat sink.

[0092] Understandably, the adhesive layer 123 has a guide portion on the side near the flow channel 121, which is used to guide the flow of the working fluid in the flow channel 13.

[0093] In this embodiment, a guide portion, such as one or more rounded corners, can also be provided on the side of the adhesive layer 123 near the flow channel 121. This smooth transition can reduce the flow resistance of the working fluid in the flow channel 13, help reduce energy loss, reduce the pressure drop in the flow channel 13, and further improve the fluidity of the working fluid, thereby ensuring the heat exchange effect of the heat sink 1.

[0094] Optionally, the liquid cooling layer 122 includes at least one of a polymer material layer 115 and a metal layer 116. In this embodiment, the liquid cooling layer 122 can be made of a metal material, or it can be made of a polymer material layer 115 or a polymer material. The liquid cooling layer 122 can also be made of a composite of a metal material and a polymer material layer 115 or a polymer material, which can adapt to different application requirements.

[0095] In this embodiment, the liquid cooling layer 122 includes a metal layer 116. This configuration improves the strength and thermal conductivity of the liquid cooling layer 122, thereby increasing the heat exchange efficiency of the heat sink 1, reducing the operating temperature of the electronic device with the heat sink 1, and also facilitating a reduction in the thickness of the liquid cooling layer 122. Alternatively, the liquid cooling layer 122 includes a polymer material layer 115. This configuration meets the lightweight design requirements of the heat sink 1, making the electronic device with the heat sink 1 easier to carry and use. Alternatively, the liquid cooling layer 122 includes both a polymer material layer 115 and a metal layer 116. This configuration combines the characteristics of both to improve the overall performance of the heat sink 1.

[0096] Optionally, the metal layer 116 may be made of a metal material with high thermal conductivity and corrosion resistance, such as copper, aluminum, or stainless steel alloy, and there is no limitation thereof. Optionally, the polymer material layer 115 may be made of at least one of the following materials: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), cyclic olefin copolymer (COC), polytetramethylpentene (PMP), polyimide (PI), polymethyl methacrylate (PMMA), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), styrene-acrylonitrile copolymer (AS), acrylonitrile-butadiene-styrene copolymer (ABS), and butadiene-styrene copolymer (BS), and there is no limitation thereof.

[0097] like Figures 10 to 12 As shown, the present invention also proposes a heat dissipation module 100, which includes the aforementioned heat dissipation component 1. The specific structure of the heat dissipation component 1 is as described in the foregoing embodiments. Since the heat dissipation module 100 adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, and will not be described in detail here.

[0098] Understandably, the heat dissipation module 100 can be widely used in heat exchange for electronic devices such as tablets, laptops, smart glasses, smartwatches, and smart headsets. It can effectively reduce the operating temperature of these devices and improve their operational stability and lifespan. Its small thickness, light weight, high heat exchange efficiency, and ease of processing and installation make it a promising candidate for market applications.

[0099] In this embodiment, as Figure 11 and Figure 12 As shown, the cover plate 11 of the heat sink 1 is provided with a first inlet 113 and a first outlet 114 that connects to the flow channel 13. The micro pump 2 is provided with a second inlet 21 and a second outlet 22. The micro pump 2 is located on the heat sink 1 so that the first inlet 113 is connected to the second outlet 22 and the first outlet 114 is connected to the second inlet 21.

[0100] In this embodiment, as Figures 10 to 12 As shown, the micropump 2 may include a pump base and a piezoelectric component connected to the pump base. The pump base is provided with a second inlet 21 and a second outlet 22. The heat sink 1 is provided with a first outlet 114 and a first inlet 113. The first outlet 114 is used to communicate with the second inlet 21, and the first inlet 113 is used to communicate with the second outlet 22.

[0101] Optionally, the micropump 2 can be a miniature piezoelectric hydraulic pump. Miniature piezoelectric hydraulic pumps have an amplitude ≤50µm and are characterized by their ultra-thin design, small size, simple structure, high pressure and low flow rate, absence of electromagnetic interference, and low operating noise. They can achieve precise fluid transport and control, making them particularly suitable for electronic devices such as mobile phones, watches, and accessories. Of course, in other embodiments, the micropump 2 can also be an electrostatic micropump; the specific structure is based on existing technology and is not limited here.

[0102] Understandably, a portion of the heat sink 1 around the first outlet 114 and a portion of the pump base around the second inlet 21 form a sealed structure to achieve communication between the first outlet 114 and the second inlet 21. Similarly, a portion of the heat sink 1 around the first inlet 113 and a portion of the pump base around the second outlet 22 form a sealed structure to achieve communication between the first inlet 113 and the second outlet 22, thus achieving communication between the pump base and the flow channel 13 of the heat sink 1.

[0103] It should be noted that the first outlet 114 is used to connect with the second inlet 21, but this does not mean that the first outlet 114 and the second inlet 21 are always connected. It only indicates that under certain conditions, the working medium can flow from the first outlet 114 into the second inlet 21. The relationship between the first inlet 113 and the second outlet 22 is similar.

[0104] In this embodiment, the micropump 2 (pump base) of the heat dissipation module 100 is connected to the flow channel 13 of the heat sink 1. The micropump 2 can serve as a power source to provide the flow power for the working fluid within the flow channel 13 of the heat sink 1. During the flow process, the working fluid can act as a medium for heat transfer, enabling the heat sink 1 to achieve a sustained heat dissipation effect.

[0105] It is understandable that the heat sink 1 on the periphery of the first outlet 114 and the pump base on the periphery of the second inlet 21 are integrated structures, and the heat sink 1 on the periphery of the first inlet 113 and the pump base on the periphery of the second outlet 22 are integrated structures.

[0106] Of course, in other embodiments, the heat sink 1 on the periphery of the first outlet 114 and the pump base on the periphery of the second inlet 21 are separate structures. The heat sink 1 on the periphery of the first outlet 114 and the pump base on the periphery of the second inlet 21 can be connected by methods such as screw fixing, high-temperature adhesive bonding, UV adhesive curing bonding, thermocompression bonding, hot melt welding, ultrasonic welding, and ultra-frequency welding. Similarly, the heat sink 1 on the periphery of the first inlet 113 and the pump base on the periphery of the second outlet 22 can be separate structures, and the heat sink 1 on the periphery of the first inlet 113 and the pump base on the periphery of the second outlet 22 can be connected by the methods described above.

[0107] It should be noted that the relevant technology visualizes the flow of the working fluid, enabling a technologically advanced flow display area. This flow display area can serve to identify components or enhance the aesthetics of the casing, thereby improving the user experience of electronic devices. Currently, the disclosed technologies for visually displaying the flow state of the working fluid involve two liquid working fluids forming a liquid interface. This design allows for a visually apparent flow of the working fluid. However, the visual effect presented by this solution is relatively simple and lacks a strong sense of technological sophistication for the product.

[0108] In one embodiment, the heat dissipation module 100 further includes a working fluid filled within the flow channel 13. The working fluid includes a liquid working fluid and a solid working fluid, with a liquid-solid interface between the liquid and solid working fluids. The liquid working fluid includes a first medium and a second medium, with a liquid-liquid interface between the first medium and the second medium. The first medium includes at least one of water and an alcohol. Optionally, the visible light transmittance of at least a portion of the heat dissipation component 1 is greater than or equal to a threshold.

[0109] In this embodiment, the working fluid is configured as a liquid working fluid and a solid working fluid, such that a liquid-solid interface exists between the liquid and solid working fluids. The liquid working fluid includes a first medium and a second medium, and a liquid-liquid interface exists between the first medium and the second medium. The first medium includes at least one of water and an alcohol. Thus, when the working fluid moves relative to the flow channel 13, the liquid-solid interface and the liquid-liquid interface will move relative to the flow channel 13 used to contain the working fluid, resulting in diverse flow visualization effects for the working fluid.

[0110] Understandably, the first medium of the liquid working fluid has excellent heat dissipation performance, ensuring good temperature control; on the other hand, the first medium needs to form a liquid-liquid interface with the second medium to ensure the flow visualization function of the working fluid. It should be noted that the type of the first medium is not specifically limited. Any medium with excellent heat dissipation performance and capable of forming a liquid-liquid interface with the second medium can be used as the first medium in the embodiments of this application, and no limitation is made here.

[0111] Optionally, the first medium includes at least one of water and alcohol. Water (H2O) and alcohol have good heat dissipation performance. Using water (H2O) and alcohol as the first medium allows the working fluid to achieve better heat dissipation performance, ensuring that the working fluid can achieve better temperature control. In this embodiment, the alcohol may optionally include at least one of methanol, ethanol, ethylene glycol, glycerol, and propylene glycol.

[0112] Of course, in other embodiments, the first medium may also include a water-soluble salt, and the solution formed by the water-soluble salt and water (the first medium) may be called a salt solution. The salt solution may include anions and cations, both of which have strong hydrophilic properties, such that anions can form hydrated anions with H2O, and cations can form hydrated cations with H2O, that is, H2O tends to combine with cations / anions.

[0113] In this embodiment, the second medium is used to form a liquid-liquid interface with the first medium, enabling the working fluid to achieve a visualized flow effect. Any medium that can form a liquid-liquid interface with the first medium can be used as the second medium in this embodiment, and no limitation is made here.

[0114] Optionally, the second medium includes at least one of silicone oil, alkanes, and fluorinated liquids. In this embodiment, the number of second media can be 1, 2, 3, etc., and is not limited thereto. In this embodiment, the fluorinated liquid can form a liquid-liquid interface with the silicone oil or alkanes.

[0115] In this embodiment, the silicone oil may optionally include at least one of dimethyl silicone oil, methylphenyl silicone oil, and polyether-modified silicone oil, and is not limited herein. The fluorinated liquid may optionally include at least one of perfluorocarbon compound, perfluoropolyether, hydrofluoroether, and hydrofluorocarbon, and is not limited herein.

[0116] Understandably, when the working fluid is stationary, there are liquid-solid interfaces between the first and second media of the liquid working fluid and the solid working fluid, respectively, and a liquid-liquid interface between the first and second media of the liquid working fluid. During the flow of the working fluid, the liquid-solid and liquid-liquid interfaces move relative to the flow channel 13, thereby enabling the working fluid to exhibit diverse flow visualization effects. The working fluid is placed within the flow channel 13 of the heat sink 1, and at least a portion of the heat sink 1 has a visible light transmittance greater than or equal to a threshold, allowing the flow visualization effect of the working fluid to be displayed through this area; that is, the heat dissipation module 100 can achieve diverse visualization effects. Furthermore, during the flow, the working fluid can act as a medium for heat transfer, enabling the liquid cooling component to achieve heat dissipation. In this embodiment, using three or more working fluid formulations can generate liquid-liquid and liquid-solid interfaces in the flow channel 13. Using dyes and working fluids with different appearances can achieve colorful display and flow visualization effects, thereby improving the product's appearance and enhancing its technological appeal.

[0117] In one embodiment, the solid working fluid comprises solid particles. In this embodiment, the solid particles are nanoparticles or microparticles. Optionally, the solid particles include at least one of boron nitride, alumina, silicon carbide, fluorinated graphene, carbon nanotube heterostructures, and boron phosphide. It is understood that, in order to avoid the solid particles flowing smoothly in the flow channel 13 and to avoid affecting the micropump 2, the size of the solid particles may be ≤10 μm.

[0118] To further prevent the agglomeration of solid particles in the working fluid when mixed with the liquid working fluid, resulting in clumps or larger particles that could affect the flow of the working fluid within the flow channel 13 and the micropump 2, in one embodiment, the solid particles are particles treated with a surface coupling agent.

[0119] Understandably, the solid particles of the solid working fluid in the working medium are treated with a surface coupling agent before being added into the flow channel 13 and mixed with the liquid working fluid. Particles treated with a surface coupling agent are easier to disperse when mixed with the liquid working fluid after being added into the flow channel 13, effectively preventing the solid particles from agglomerating or clumping.

[0120] In one embodiment, the working medium further includes a water-soluble dye, the solubility of which in the first medium is greater than that in the second medium.

[0121] In this embodiment, by adding a water-soluble dye, the solubility of the water-soluble dye in the first medium is greater than that in the second medium. The water-soluble dye can make the first medium develop color, and the introduction of the water-soluble dye can increase the color contrast between the first medium and the second medium, so that the working fluid can have a significant flow visualization effect.

[0122] Optionally, the water-soluble staining agent includes at least one of Direct Blue, Methylene Blue, and Acid Red, without limitation herein.

[0123] In another embodiment, the working medium also includes an oil-soluble dyeing agent, the solubility of which in the second medium is greater than that in the first medium.

[0124] In this embodiment, by adding an oil-soluble dye, the solubility of the oil-soluble dye in the second medium is greater than that in the first medium. The introduction of the oil-soluble dye can increase the color contrast between the first and second media, so that the working fluid can have a significant flow visualization effect.

[0125] Optionally, the oil-soluble staining agent includes at least one of Solvent Red, Solvent Blue, and Solvent Yellow, without limitation.

[0126] The present invention also proposes an electronic device, which includes the aforementioned heat sink 1. The specific structure of the heat sink 1 is as described in the foregoing embodiments. Since the present electronic device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, and will not be described in detail here.

[0127] The present invention also proposes an electronic device, which includes the aforementioned heat dissipation module 100. The specific structure of the heat dissipation module 100 is as described in the foregoing embodiments. Since the present electronic device adopts all the technical solutions of all the foregoing embodiments, it has at least all the beneficial effects brought about by the technical solutions of the foregoing embodiments, and will not be described in detail here.

[0128] Understandably, electronic devices can be small electronic devices, such as mobile phones, tablets, laptops, smart glasses, smartwatches, smart headsets, etc.

[0129] In this embodiment, the electronic device further includes a housing and electronic functional components. The housing forms a cavity for accommodating the electronic functional components, thereby protecting them.

[0130] Electronic functional components of an electronic device include, but are not limited to: processors, internal memory, charging management modules, power management modules, batteries, antennas, communication modules, cameras, audio modules, speakers, receivers, microphones, sensor modules, motors, and indicators. The electronic device may have more or fewer electronic functional components than described above. These various electronic functional components can be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits (ASICs).

[0131] Electronic functional components release heat when they are in operation. When the internal temperature of the electronic device is too high, it will affect the working efficiency of the electronic functional components and the service life of the electronic device. Therefore, a heat dissipation module 100 is required to control the temperature rise of the electronic functional components.

[0132] In this embodiment, the heat dissipation module 100 is embedded in the housing to achieve temperature control of electronic functional components disposed within the housing's defined area.

[0133] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A heat sink, characterized in that, The heat dissipation component includes an intermediate layer and cover plates disposed on opposite sides of the intermediate layer. The intermediate layer is provided with a flow channel groove, and the cover plates and the flow channel groove enclose each other to form a flow channel. The intermediate layer is provided with a plurality of ribs extending along a first direction and spaced apart along a second direction. The first direction is perpendicular to the second direction. A flow channel groove is formed between two adjacent ribs. At least one side surface of the rib facing the flow channel groove is provided with a groove structure, and the groove structure is connected to the flow channel groove.

2. The heat sink as described in claim 1, characterized in that, The groove structure is a single structure, and the groove structure extends along the first direction; Wherein, the groove structure extends through both ends of the rib along the first direction; and / or, the depth of the groove structure along the second direction gradually increases or decreases or increases first and then decreases from one end of the rib along the first direction to the other end of the rib along the first direction; and / or, the opening size of the groove structure along a third direction gradually increases or decreases or increases first and then decreases from one end of the rib along the first direction to the other end of the rib along the first direction, and the third direction is perpendicular to both the first direction and the second direction.

3. The heat sink as described in claim 1, characterized in that, The groove structure includes multiple types; The plurality of groove structures are spaced apart along the first direction; and / or the plurality of groove structures are spaced apart along a third direction, the third direction being perpendicular to both the first direction and the second direction.

4. The heat sink as described in claim 1, characterized in that, The depth of the groove structure along the second direction is defined as d1, and the width of the rib along the second direction is defined as d2; Where d1≤0.3 d2.

5. The heat sink as described in claim 1, characterized in that, The inner wall of the groove structure is formed by at least one of straight lines and arcs; Alternatively, the cross-section of the groove structure along the second direction may be semi-circular, semi-elliptical, or polygonal.

6. The heat sink as described in claim 1, characterized in that, Each of the ribs has a groove structure on both surfaces facing the flow channel groove; wherein the cross-sectional shape of the groove structure on the two surfaces is the same or different along the second direction; or, the groove structure on the two surfaces is symmetrically arranged with respect to the center line of the rib extending along the first direction; And / or, the surface of the rib facing the flow channel groove is processed by laser engraving, etching, precision machining, ultrasonic scalpel processing or chemical agent processing to form the groove structure.

7. The heat sink as described in claim 1, characterized in that, The inner wall of the flow channel and / or the inner wall of the groove structure is provided with a hydrophilic layer; Alternatively, the inner wall of the flow channel and / or the inner wall of the groove structure may be provided with a hydrophobic layer.

8. The heat sink as described in any one of claims 1 to 7, characterized in that, The cover plate includes a first cover plate and a second cover plate, which are respectively disposed on opposite sides of the intermediate layer. The flow channel groove extends through the intermediate layer along the thickness direction of the intermediate layer, so that the first cover plate and the second cover plate and the flow channel groove enclose the flow channel to form the flow channel. The visible light transmittance of at least a portion of the first cover plate and / or the second cover plate is greater than or equal to a threshold. Wherein, the first cover plate and the second cover plate are made of the same material or different materials; and / or, the first cover plate is a single-layer structure or a multi-layer structure; and / or, the second cover plate is a single-layer structure or a multi-layer structure; and / or, the first cover plate and / or the second cover plate include at least one of a polymer material layer and a metal layer.

9. The heat sink as described in any one of claims 1 to 7, characterized in that, The intermediate layer includes a liquid cooling layer and adhesive layers disposed on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers together form the sidewall of the flow channel. The cover plate is sealed to the liquid cooling layer through the adhesive layers.

10. The heat sink as described in claim 9, characterized in that, Along the second direction, the edge of the adhesive layer is flush with the edge of the liquid cooling layer; And / or, the adhesive layer includes at least one adhesive layer; wherein, the adhesive layer is formed by dispensing, film application, or screen printing; and / or, the adhesive includes acrylic adhesive, polyurethane adhesive, epoxy adhesive, UV adhesive, polyolefin elastomer adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, or thermosetting adhesive. And / or, the thickness of the adhesive layer is in the range of 0.001mm to 0.05mm; And / or, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

11. A heat dissipation module, characterized in that, The heat dissipation module includes: The heat sink as described in any one of claims 1 to 10, wherein the cover plate of the heat sink is provided with a first inlet and a first outlet communicating with a flow channel; and A micropump, wherein the micropump has a second inlet and a second outlet, and the micropump is disposed on the heat sink so that the first inlet is connected to the second outlet and the first outlet is connected to the second inlet.

12. An electronic device, characterized in that, The electronic device includes a heat sink as described in any one of claims 1 to 10; Alternatively, the electronic device may include the heat dissipation module as described in claim 11.

Images