Wafer cleaning and drying module and wafer transfer method after wafer cleaning and drying

Abstract

This invention discloses a wafer cleaning and drying module and a method for transferring wafers after cleaning and drying, comprising: a drying chamber; a lifting mechanism; a flipping mechanism, equipped with a support and grippers for switching the wafer between a vertical and a horizontal position; the grippers having at least a first working position that cooperates with the lifting mechanism, and a second working position that can hold the wafer and switch it between a vertical and a horizontal position, wherein in the first working position the grippers are located at the bottom of the support, and in the second working position the grippers are located at the top of the support and hold the wafer; further comprising: a first sensor located at the bottom of the support for detecting whether the grippers are in the first working position; a second sensor located at the top of the support for detecting whether the grippers are in the second working position; and a third sensor for detecting whether the flipping mechanism is in a horizontal position. This invention provides sensors at both the first and second working positions to ensure that the wafer is effectively flipped and transferred.

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