Die bonding equipment and working method thereof
By combining the multi-directional movement and rotation of the wafer stage and substrate stage with the robotic arm of the rotating arm assembly, the accuracy and efficiency problems caused by the excessive length of the die bonder's swing arm are solved, achieving high-precision and high-efficiency wafer transfer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2026-04-07
AI Technical Summary
The long swing arm of the die bonder results in low rigidity, which affects the accuracy of wafer placement on the substrate and the efficiency of transfer.
By employing a combination of multi-directional movement and rotation of the wafer stage and substrate stage, along with a robotic arm with a rotating arm assembly, the synchronous rotation of the wafer and substrate ensures that all wafers can be picked up and transferred by the robotic arm, thus shortening the length of the robotic arm to improve rigidity.
This improves the accuracy and efficiency of the robotic arm in placing the wafer onto the substrate, and avoids orientation errors between the wafer and the substrate.
Smart Images
Figure CN121815998A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a die bonding device and its operating method. Background Technology
[0002] Die bonders are essential equipment for wafer assembly. They consist of a nozzle, a swing arm, and a pin assembly, with the nozzle mounted on the swing arm. During the transfer of wafers from wafers to substrates, the pin assembly ejects the wafer from the wafer, and the swing arm drives the nozzle to pick up the ejected wafer and place it on the substrate, which includes a lead frame.
[0003] However, due to the large diameter of the wafer, the swing arm of the die bonder needs to be longer. The die bonder has a long stroke when transferring the wafer from the wafer to the substrate. The rigidity of the excessively long swing arm is low, and it is easy to wobble during the wafer transfer process, which increases the difficulty of controlling the swing arm. This reduces the accuracy of placing the wafer on the substrate and also affects the wafer transfer efficiency. Summary of the Invention
[0004] The technical problem solved by this invention is to provide a die bonding device and its working method to improve the accuracy of wafer placement on a substrate and the wafer transfer efficiency.
[0005] To solve the above-mentioned technical problems, the present invention provides a die bonding device, comprising: a wafer stage, the wafer stage being used to carry a wafer to be transferred, the wafer including a plurality of mutually separated wafers, the wafer stage being capable of driving the wafer to reciprocate along a first direction and a second direction perpendicular to each other, and to rotate around a third direction perpendicular to the first direction and the second direction, so as to sequentially move the wafer to a wafer pick-up position on the wafer stage; a substrate stage, the substrate stage being used to carry a substrate, the substrate stage being capable of driving the substrate to reciprocate along a fourth direction and a fifth direction perpendicular to each other and perpendicular to the third direction, so as to sequentially move a plurality of mutually separated wafer bonding positions on the substrate to a wafer placement position on the substrate stage; and a rotating arm assembly including at least one robotic arm capable of rotating around the third direction between the wafer pick-up position and the wafer placement position, for sequentially picking up the wafer from the wafer pick-up position and sequentially placing the picked-up wafers into the wafer bonding positions located on the wafer placement position.
[0006] Optionally, the wafer includes a first portion and a second portion arranged side by side, and the wafer stage is configured to rotate the wafer around the third direction to swap the positions of the first portion and the second portion, so that all the wafers on the wafer can be moved to the wafer pick-up position.
[0007] Optionally, the length of the robotic arm is set such that it can pick up all the wafers on the first portion or the second portion by moving the wafer along the first direction and the second direction; if the dimensions of the first portion and the second portion are not the same along the first direction, the length of the robotic arm is set according to the portion with the larger size.
[0008] Optionally, it also includes: a substrate rotation assembly, the substrate rotation assembly being used to rotate the substrate in the same direction around the third direction when the wafer rotates around the third direction, so as to ensure that the picked-up wafer is placed on the substrate in a predetermined orientation.
[0009] Optionally, the substrate rotation assembly is disposed on the substrate stage, such that the substrate stage can drive the substrate to rotate around the third direction.
[0010] Optionally, the number of robotic arms is one or more than one and is an integer divisible by 360.
[0011] Optionally, when the number of robotic arms is greater than 1, the arrangement angle between adjacent robotic arms is α, where α = 360° / n, and n is the number of robotic arms.
[0012] Optionally, the n robotic arms of the rotating arm assembly are configured to rotate 360° / n around the third direction, so that the n robotic arms take turns rotating above the wafer pickup position and the wafer placement position, and then take turns performing wafer pickup and placement operations.
[0013] Optionally, two of the n robotic arms located above the wafer pickup position and the wafer placement position are configured to perform wafer pickup and placement operations simultaneously.
[0014] Optionally, when the number of robotic arms is one or an even number greater than one, the bonding positions of the wafers on the wafer and the wafers on the substrate are arranged in the same direction, and the fourth direction is consistent with the first direction, the fifth direction is consistent with the second direction.
[0015] Optionally, when the number of robotic arms is an odd number greater than 1 and divisible by 360, the wafers on the wafer and the wafers on the substrate are arranged at an angle of 360° / 2n, where n is the number of robotic arms, and the first direction and the fourth direction, and the second direction and the fifth direction are at an angle of 360° / 2n or 90°-360° / 2n.
[0016] Optionally, the wafer stage includes: a wafer rotation assembly for carrying the wafer and rotatable about a third direction; a first motion assembly slidably connected to the wafer rotation assembly and capable of reciprocating along the first direction; a second motion assembly slidably connected to the first motion assembly and capable of reciprocating along the second direction; and a ejector assembly reciprocating along the third direction to lift the wafer located at the wafer pick-up position, so that the robotic arm can perform a wafer pick-up operation.
[0017] Accordingly, the present invention also provides a method for operating a die bonding device, comprising: providing a die bonding device as described in any of the above technical solutions; moving a wafer carried on a wafer stage along mutually perpendicular first and second directions, and rotating it around a third direction perpendicular to the first and second directions, thereby sequentially moving a plurality of mutually separated wafers on the wafer stage to a wafer pick-up position on the wafer stage; moving a substrate carried on a substrate stage along mutually perpendicular fourth and fifth directions, thereby sequentially moving a plurality of mutually separated wafer bonding positions on the substrate to a wafer placement position on the substrate stage; and sequentially picking up the wafers from the wafer pick-up position by at least one robotic arm of a rotating arm assembly that can rotate between the wafer pick-up position and the wafer placement position around the third direction, and placing the picked-up wafers sequentially on the wafer bonding positions located at the wafer placement position.
[0018] Optionally, the wafer includes a first portion and a second portion arranged side by side; the method for sequentially moving the wafers to the wafer pickup position includes: moving the wafer along the first direction and the second direction via the wafer stage to sequentially move all the wafers included in the first portion to the wafer pickup position; rotating the wafer about the third direction to swap the positions of the first portion and the second portion; after swapping the positions of the first portion and the second portion, moving the wafer along the first direction and the second direction again via the wafer stage to sequentially move all the wafers included in the second portion to the wafer pickup position.
[0019] Optionally, when the wafer rotates about the third direction, the method further includes: rotating the substrate on the substrate stage in the same direction about the third direction to ensure that the picked-up wafer is placed on the substrate in a predetermined orientation.
[0020] Optionally, when the number of robotic arms n is an integer greater than 1 and divisible by 360, and the arrangement angle between adjacent robotic arms is α, where α = 360° / n, the robotic arms are rotated around the third direction, with each rotation angle being 360° / n, so that the n robotic arms take turns rotating to the wafer pickup position and the wafer placement position, and then take turns performing the wafer pickup and placement operations.
[0021] Optionally, when the number of robotic arms is an odd number greater than 1 and divisible by 360, before picking up the wafer from the wafer stage, the wafer carried by the wafer stage is arranged such that the wafers included on it are arranged at an angle of 360° / 2n to the wafer bonding positions on the substrate, and the first direction and the fourth direction, and the second direction and the fifth direction form an angle of 360° / 2n or 90°-360° / 2n.
[0022] Optionally, arranging the wafer at a 360° / 2n angle with the wafer bonding position includes: rotating the wafer around the third direction by 360° / 2n via the wafer stage.
[0023] Optionally, the number of robotic arms is two, and the rotating arm assembly includes a first robotic arm and a second robotic arm. The method for sequentially picking up and placing the wafers includes: the first robotic arm picking up a first wafer located at the wafer picking position; the first robotic arm and the second robotic arm rotating 180° around the third direction, so that the first robotic arm rotates above the wafer placement position, and the second robotic arm rotates above the wafer picking position; the first robotic arm places the picked-up first wafer on the wafer bonding position on the wafer placement position, and the second robotic arm picks up a second wafer from the wafer picking position; the first robotic arm and the second robotic arm rotating 180° around the third direction, so that the second robotic arm moves above the wafer placement position, and the first robotic arm rotates above the wafer picking position; the second robotic arm places the picked-up second wafer on the wafer bonding position on the wafer placement position, and the first robotic arm picks up a third wafer from the wafer picking position; this cycle is repeated until the first robotic arm and the second robotic arm have picked up and transferred all the wafers on the wafer to the substrate.
[0024] Optionally, two of the n robotic arms located above the wafer pickup position and the wafer placement position may simultaneously perform the wafer pickup and placement operations.
[0025] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects:
[0026] In the die bonding equipment provided by this invention, the wafer stage can drive the wafer to reciprocate along a first and a second direction perpendicular to each other, and rotate around a third direction perpendicular to the first and second directions, so as to sequentially move the wafers to the wafer pick-up positions on the wafer stage. Utilizing the rotation function of the wafer stage, wafers on the wafer that are outside the pick-up range of the robotic arm are rotated into the pick-up range of the robotic arm. Furthermore, in conjunction with the translation function of the wafer stage, it is ensured that all wafers on the wafer can be picked up and transferred by the robotic arm. Therefore, the length of the robotic arm in the die bonding equipment can be effectively shortened, thereby improving the rigidity of the robotic arm, and thus improving the accuracy of the robotic arm in placing the wafers on the substrate, as well as the wafer transfer efficiency.
[0027] Furthermore, it also includes a substrate rotation assembly, which is used to rotate the substrate in the same direction around the third direction when the wafer rotates around the third direction, to ensure that the picked-up wafer is placed on the substrate in a predetermined orientation. By keeping the wafer and substrate rotating synchronously, the relative position of the wafer and the substrate can be kept unchanged, thereby effectively avoiding orientation errors in the bonding between the wafer and the substrate.
[0028] In the working method of the die bonding equipment provided by the present invention, the wafer stage can drive the wafer carried thereon to reciprocate along a first direction and a second direction that are perpendicular to each other, and rotate around a third direction that is perpendicular to the first direction and the second direction, so as to move a plurality of mutually separated wafers on the wafer to the wafer pick-up position on the wafer stage in sequence. The substrate stage can drive the substrate carried thereon to move along a fourth direction and a fifth direction that are perpendicular to each other, so as to move a plurality of mutually separated wafer bonding positions on the substrate to the wafer placement position on the substrate stage in sequence; and the wafers are picked up sequentially from the wafer pick-up position by at least one robotic arm of the rotating arm assembly that can rotate between the wafer pick-up position and the wafer placement position around the third direction, and the picked-up wafers are placed sequentially on the wafer bonding positions located on the wafer placement position.
[0029] After the robotic arm has picked up a portion of the wafers, the rotation function of the wafer stage is used to rotate the wafers that are outside the robotic arm's picking range into its range. This, combined with the translation function of the wafer stage, ensures that all wafers on the wafer can be picked up and transferred by the robotic arm. Therefore, the length of the robotic arm can be effectively shortened, thereby increasing its rigidity and improving the accuracy of placing wafers on the substrate, as well as the efficiency of wafer transfer.
[0030] Furthermore, when the wafer rotates around a third direction, the process also includes rotating the substrate on the substrate stage in the same direction around the third direction to ensure that the picked-up wafer is placed on the substrate in a predetermined orientation. By keeping the wafer and substrate rotating synchronously, the relative position of the wafer and the substrate can be kept constant, thereby effectively avoiding orientation errors in the bonding between the wafer and the substrate. Attached Figure Description
[0031] Figure 1 This is a side view of the die bonding device according to an embodiment of the present invention;
[0032] Figure 2 This is a top view of the first and second motion components in the die bonding device according to an embodiment of the present invention.
[0033] Figure 3 This is a top view of the third and fourth motion components in the die bonding device according to an embodiment of the present invention;
[0034] Figure 4 This is a top view of the wafer ring and wafer in the die bonding equipment of this embodiment of the invention;
[0035] Figure 5 This is a schematic diagram of the structure of a substrate loaded with wafers and a blank substrate in the die bonding equipment of this invention.
[0036] Figures 6 to 19 This is a schematic diagram of the steps of the working method of the die bonding device according to an embodiment of the present invention;
[0037] Figure 20 This is a schematic diagram of the pick-up path for the first half of the wafers on the first part of the wafer in the working method of the die bonding equipment according to an embodiment of the present invention.
[0038] Figure 21 This is a schematic diagram of the pick-up path for half of the remaining wafers on the second part of the wafer in the working method of the die bonding equipment of this embodiment of the invention.
[0039] Figure 22 This is a schematic diagram showing the relative positional relationship between the wafer and the substrate before the wafer and substrate are rotated in the working method of the die bonding equipment according to an embodiment of the present invention;
[0040] Figure 23 This is a schematic diagram illustrating the relative positional relationship between the wafer and the substrate after rotating the wafer and the substrate in the working method of the die bonding equipment according to an embodiment of the present invention.
[0041] Figure 24 This is a schematic diagram showing the relative positions of the wafer bonding positions to the substrate when the wafer stage is not rotating, in the working method of the die bonding equipment according to another embodiment of the present invention, when the number of robotic arms is 3.
[0042] Figure 25 This is a schematic diagram showing the relative positions of the wafer bonding positions to the substrate after the wafer on the wafer stage or the wafer stage as a whole rotates 60° in the working method of the die bonding equipment according to another embodiment of the present invention, when the number of robotic arms is 3.
[0043] Figures 26 to 29This is a schematic diagram of the process of the robotic arm picking up the wafer after the wafer stage rotates 360° / 2n in the working method of the die bonding equipment according to another embodiment of the present invention. Detailed Implementation
[0044] To make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following describes this application in further detail with reference to the accompanying drawings and embodiments.
[0045] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to the other component.
[0046] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly specified. "Several" means one or more, unless otherwise expressly specified.
[0047] Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. In the description of this disclosure, it should be understood that the terms “center,” “longitudinal,” “lateral,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this disclosure and for simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.
[0048] Embodiments of this disclosure are described in detail below, with examples of the embodiments illustrated in the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this disclosure, and should not be construed as limiting this disclosure.
[0049] Figure 1 This is a side view of the die bonding device according to an embodiment of the present invention; Figure 2 This is a top view of the first and second motion components in the die bonding device according to an embodiment of the present invention. Figure 3This is a top view of the third and fourth motion components in the die bonding device according to an embodiment of the present invention; Figure 4 This is a top view of the wafer ring and wafer in the die bonding equipment of this embodiment of the invention; Figure 24 This is a schematic diagram showing the relative positions of the wafer transfer points between the wafer and the substrate when the wafer stage is not rotating, in the working method of the die bonding equipment according to another embodiment of the present invention, when the number of robotic arms is 3. Figure 25 This is a schematic diagram showing the relative positions of the wafer bonding positions to the substrate after the wafer on the wafer stage or the entire wafer stage rotates 60° in the working method of the die bonding equipment according to another embodiment of the present invention, when the number of robotic arms is 3.
[0050] Please refer to Figure 1 A die bonding apparatus includes: a wafer stage 100 for carrying a wafer 101 to be transferred, the wafer 101 including a plurality of mutually separated wafers 1011 to be transferred; the wafer stage 100 is capable of reciprocating the wafers 101 along mutually perpendicular first directions S1 and second directions S2 (not shown), and rotating them about a third direction S3 perpendicular to the first directions S1 and second directions S2, so as to sequentially move the wafers 1011 to wafer pick-up positions (not shown) on the wafer stage 100; and a substrate stage 200 for carrying a substrate 201. The substrate stage 200 can drive the substrate 201 to reciprocate along a fourth direction S4 and a fifth direction S5 (not shown) that are perpendicular to each other and perpendicular to the third direction S3, so as to move a plurality of mutually separated wafer bonding positions on the substrate 201 to the wafer placement positions on the substrate stage 200 in sequence; the rotating arm assembly 300 includes at least one robotic arm that can rotate around the third direction S3 between the wafer pick-up position and the wafer placement position, for picking up wafers 1011 in sequence from the wafer pick-up position and placing the picked-up wafers 1011 in sequence on the wafer bonding positions located on the wafer placement positions.
[0051] After the robotic arm has picked up a portion of the wafers 1011 on the wafer 101, the wafer stage 100 uses its rotation function (rotating around a third direction S3) to rotate the wafers 1011 on the wafer 101 that were not within the robotic arm's picking range into the robotic arm's picking range. Then, in conjunction with the wafer stage 100's translation function (reciprocating along mutually perpendicular first and second directions S1 and S2), it ensures that all the wafers 1011 on the wafer 101 can also be picked up and transferred by the robotic arm. Therefore, the length of the robotic arm can be effectively shortened, thereby increasing its rigidity and improving the accuracy of the robotic arm in placing the wafers 1011 on the substrate 201, as well as the efficiency of wafer 1011 transfer.
[0052] Please refer to Figure 4In this embodiment, the wafer 101 includes a first part 101a and a second part 101b of the same shape and size arranged side by side along the first direction S1. The wafer stage 100 is configured to drive the wafer 101 to rotate around the third direction S3 to exchange the positions of the first part 101a and the second part 101b along the first direction S1. The length of the robotic arm is set so that it can pick up all the wafers 1011 on the first part 101a or the second part 101b by moving the wafer 101 along the first direction S1 and the second direction S2.
[0053] In this embodiment, the number of wafers 1011 in the first part 101a and the number of wafers 1011 in the second part 101b are both half the total number of wafers 1011 on the wafer 101. When the length of the robotic arm is set to be just enough to pick up half the number of wafers 1011 on either the first part 101a or the second part 101b, rotating the wafer 101 ensures that the other half of the wafers 1011 on the other part are also completely within the picking range of the robotic arm. To ensure that all wafers 1011 on the wafer 101 can be picked up, the robotic arm is configured to pick up half the number of wafers 1011 on either the first part 101a or the second part 101b by moving the wafer 101 along the first direction S1 and the second direction S2. In this case, the length of the robotic arm is the shortest. Of course, the first part 101a and the second part 101b may also have different shapes and sizes, and the number of wafers on them may also differ. In this case, the length of the robotic arm needs to be set according to the larger portion along the first direction S1. In other words, the length of the robotic arm needs to be set so that it can pick up all the wafers on the larger parts.
[0054] Please continue to refer to this. Figure 1 In this embodiment, there are two robotic arms, namely, the rotating arm assembly 300 includes a first robotic arm 3001 and a second robotic arm 3002. The wafer bonding positions on the substrate stage 200 and the wafers carried on the wafer stage 100 are arranged in the same direction, and the fourth direction S4 and the fifth direction S5 are consistent with the first direction S1 and the second direction S2, respectively.
[0055] In other embodiments, the number of robotic arms may also be 1, or other numbers greater than 1 that are divisible by 360, such as 2, 3, 4, 5, 6, 8.
[0056] In other embodiments, when the number of robotic arms is greater than 1 and is an integer divisible by 360, the arrangement angle between adjacent robotic arms is α, where α = 360° / n, and n is the number of robotic arms. The n robotic arms of the rotating arm assembly are configured to rotate 360° / n around a third direction S3, so that the n robotic arms can take turns rotating above the wafer pick-up position and the wafer placement position, and thus take turns performing wafer 1011 pick-up and placement operations. The two robotic arms located above the wafer pick-up position and the wafer placement position can be configured to perform wafer 1011 pick-up and placement operations simultaneously. This configuration ensures that two robotic arms are simultaneously located above the wafer stage 100 and the substrate stage 200, respectively, so that the wafer 1011 pick-up and wafer 1011 placement operations can be completed simultaneously, thereby improving the transfer efficiency of the wafer 1011.
[0057] Please continue to refer to this. Figure 1 In this embodiment, the angle between the first robotic arm 3001 and the second robotic arm 3002 is 180°.
[0058] Please continue to refer to this. Figure 1 In this embodiment, the rotating arm assembly 300 further includes a rotating device. The first robotic arm 3001 and the second robotic arm 3002 are respectively fixedly connected to the rotating device 3003, and the first robotic arm 3001 and the second robotic arm 3002 are rotated by the rotating device 3003.
[0059] Please continue to refer to this. Figure 1 In conjunction with references Figure 2 In this embodiment, the wafer stage 100 includes: a wafer rotation assembly 1001, which carries the wafer 101 and is rotatable about a third direction S3; a first motion assembly 1002, which is slidably connected to the wafer rotation assembly 1001 and can drive the wafer rotation assembly 1001 to reciprocate along a first direction S1; a second motion assembly 1003, which is slidably connected to the first motion assembly 1002 and can drive the first motion assembly 1002 to reciprocate along a second direction S2; and a pusher assembly 1004, which is reciprocating along a third direction S3 to lift the wafer 1011 located at the wafer pick-up position, so that the robotic arm can pick up the wafer 1011.
[0060] Please continue to refer to this. Figure 1 In conjunction with references Figure 3In this embodiment, it also includes a substrate rotation assembly 2001, which is used to rotate the substrate 201 in the same direction around the third direction S3 when the wafer 101 rotates around the third direction S3, so as to ensure that the picked-up wafer 1011 is placed on the substrate 201 in a predetermined orientation.
[0061] By keeping the wafer 101 and the substrate 201 rotating synchronously, the relative position of the wafer 1011 and the substrate 201 can be kept unchanged, thereby effectively avoiding errors in the bonding orientation between the wafer 1011 and the substrate 201.
[0062] In this embodiment, the substrate rotation assembly 2001 is disposed on the substrate stage 200, so that the substrate stage 200 can drive the substrate 201 to rotate around the third direction S3.
[0063] In this embodiment, the substrate rotation assembly 2001 is the structure of the substrate stage 201 itself.
[0064] In other embodiments, the substrate rotation assembly 2001 may also be an additionally configured structure and mounted on the substrate stage 201.
[0065] In this embodiment, the substrate stage 201 further includes: a third motion component 2002, which is slidably connected to the substrate rotation component 2001, and the third motion component 2002 can drive the substrate rotation component 2001 to reciprocate along the first direction S1; and a fourth motion component 2003, which is slidably connected to the third motion component 2002, and the fourth motion component 2003 can drive the third motion component 2002 to reciprocate along the second direction S2.
[0066] In this embodiment, the substrate 201 is a lead frame.
[0067] In other embodiments, when the number of robotic arms is one or an even number greater than one (except for two), the bonding positions of the wafers on the wafer and the wafers on the substrate are arranged in the same direction, with the fourth direction being consistent with the first, fifth, and second directions.
[0068] In other embodiments, when the number of robotic arms is an odd number greater than 1 and divisible by 360, the wafers on the wafer and the wafers on the substrate are arranged at an angle of 360° / 2n, with the first and fourth directions, and the second and fifth directions forming an angle of 360° / 2n or 90°-360° / 2n. Specifically, the wafer stage rotates the wafer 360° / 2n around a third direction (including clockwise or counterclockwise). This will be explained below with specific examples.
[0069] Please refer to Figure 24Taking the case of three robotic arms as an example, the picking head at the location of the second robotic arm 3002 is set as the picking position, that is, the picking is performed at the second position P2. The picking head at the location of the first robotic arm 3001 is set as the placement position. That is, all robotic arms pick up the wafer at the second position P2 and then rotate the robotic arm to the first position P1 to place the wafer.
[0070] The second position P2 must be more than half of the wafer 101 in the second direction S2 of the wafer stage. That is, as shown in the figure, the upper half of the wafer 101 can be moved to the second position P2 for pickup by moving in the first direction S1 and the second direction S2. (Since the wafer stage 100 cannot move upwards, the lower half of the wafer 1011 cannot be picked up directly by moving in the first direction S1 and the second direction S2. Instead, it is moved by rotating 180° in the third direction S3 to move the lower half of the wafer 1011 to the upper half and into the pickup range.)
[0071] Please continue to refer to this. Figure 24 If the wafer is picked up directly from the wafer stage at the second position P2 and then placed at the first position P1, the relative positions of the wafer 1011 and the wafer bonding positions on the substrate 201 will be incorrect (unable to satisfy A to a, B to b, C to c, D to d), resulting in subsequent bonding failure.
[0072] Please refer to Figure 25 To ensure the robotic arm correctly places the wafer 101 at the first position (P1) after picking it up at the second position (P2), the wafer stage 100 needs to rotate 60° (360° / 2n) clockwise around a third direction S3 perpendicular to the first direction S1 and the second direction S2, or the entire wafer stage needs to be rotated 60° clockwise. If picking up at the third position (P3), the wafer 101 needs to rotate 60° counterclockwise around the third direction S3, or the entire wafer stage needs to be rotated 60° counterclockwise. It's important to note that this 60° rotation further includes a 60° rotation of the first motion component 1002, the second motion component 1003, and the wafer rotation component 1001 during installation. This is to ensure that the first direction S1 and the second direction S2 (i.e., the two directions controlled by the sliding component) of the wafer stage 100 are parallel to the arrangement direction of the wafers 1011 on the wafer 101. Based on the above adjustments, at the second position P2, the wafer 1011 is picked up from the wafer stage 100 and placed at the first position P1. The relative positions of the wafer 1011 and the wafer bonding positions on the substrate 201 will not be incorrect (i.e., satisfying A to a, B to b, C to c, D to d) and will not cause subsequent bonding failure.
[0073] Figure 5 This is a schematic diagram of the structure of a substrate loaded with wafers and a blank substrate in the die bonding equipment of this invention. Figures 6 to 19This is a schematic diagram of the steps of the working method of the die bonding device according to an embodiment of the present invention; Figure 20 This is a schematic diagram of the pick-up path for the first half of the wafers on the first part of the wafer in the working method of the die bonding equipment according to an embodiment of the present invention. Figure 21 This is a schematic diagram of the pick-up path for half of the remaining wafers on the second part of the wafer in the working method of the die bonding equipment of this embodiment of the invention. Figure 22 This is a schematic diagram showing the relative positional relationship between the wafer and the substrate before the wafer and substrate are rotated in the working method of the die bonding equipment according to an embodiment of the present invention; Figure 23 This is a schematic diagram illustrating the relative positional relationship between the wafer and the substrate after rotating the wafer and the substrate in the working method of the die bonding equipment according to an embodiment of the present invention. Figures 26 to 29 This is a schematic diagram of the process of the robotic arm picking up the wafer after the wafer stage rotates 360° / 2n in the working method of the die bonding equipment according to another embodiment of the present invention.
[0074] Accordingly, this embodiment of the invention also provides a method for operating a die bonding device; please refer to the following: Figure 1 The device includes: providing a die bonding apparatus as described in any of the above embodiments; moving a wafer 11 carried on a wafer stage 101 along mutually perpendicular first directions S1 and second directions S2, and rotating it about a third direction S3 perpendicular to the first and second directions, to sequentially move a plurality of mutually separated wafers 1011 on the wafer stage 101 to wafer pick-up positions on the wafer stage 100; moving a substrate 201 carried on a substrate stage 200 along mutually perpendicular fourth directions S4 and fifth directions S5, to sequentially move a plurality of mutually separated wafer bonding positions on the substrate 201 to wafer placement positions on the substrate stage 200; and sequentially picking up wafers 1011 from the wafer pick-up positions by at least one robotic arm of a rotating arm assembly that can rotate about a third direction S3 between the wafer pick-up positions and the wafer placement positions, and sequentially placing the picked-up wafers 1011 at the wafer bonding positions located on the wafer placement positions by rotating at least one robotic arm about a third direction.
[0075] After the robotic arm has picked up a portion of the wafers 1011 on the wafer 101, the wafer stage 100 uses its rotation function (rotating around a third direction S3) to rotate the wafers 1011 on the wafer 101 that were not within the robotic arm's picking range into the robotic arm's picking range. Then, in conjunction with the wafer stage 100's translation function (reciprocating along mutually perpendicular first and second directions S1 and S2), it ensures that all the wafers 1011 on the wafer 101 can also be picked up and transferred by the robotic arm. Therefore, the length of the robotic arm can be effectively shortened, thereby increasing its rigidity and improving the accuracy of the robotic arm in placing the wafers 1011 on the substrate 201, as well as the efficiency of wafer 1011 transfer.
[0076] It should be noted that the wafer stage 100 may include one or more wafer pick-up positions, and the substrate stage 200 may include one or more wafer placement positions.
[0077] Please refer to Figure 4 In this embodiment, the wafer 101 includes a first portion 101a and a second portion 101b arranged side by side along the first direction S1; the length of the robotic arm is set so that it can pick up all the wafers 1011 on the first portion 101a or the second portion 101b by moving the wafer 101 along the first direction S1 and the second direction S2.
[0078] In this embodiment, the number of wafers 1011 in the first part 101a and the number of wafers 1011 in the second part 101b are both half the total number of wafers 1011 on the wafer 101. When the robotic arm is set to pick up exactly half the number of wafers 1011, rotating the wafer 101 ensures that the other half of the wafers 1011 are also completely within the picking range of the robotic arm. While ensuring that all wafers 1011 can be picked up, the robotic arm is positioned along the first direction S1 to pick up exactly half the number of wafers 1011, at which point the length of the robotic arm is at its shortest.
[0079] Please refer to Figure 6 In this embodiment, the substrate stage 200 and the wafer stage 100 are arranged side by side along the first direction S1, and the fourth direction S4 and the fifth direction S5 are consistent with the first direction S1 and the second direction S2, respectively. The initial position of the wafer 101 placed on the wafer stage 100 is away from the substrate stage 200, and the robotic arm needs to pick up the wafers 1011 sequentially starting from the edge of the wafer 101.
[0080] Please continue to refer to this. Figure 6 The rotating arm assembly 300 sequentially picks up and transfers wafers 1011 onto the substrate 201. During the process of the rotating arm assembly 300 picking up and transferring wafers 1011, the wafer stage 100 moves the wafers 101 in the first direction S1 toward the direction closer to the substrate stage 200. When the rotating arm assembly 300 has picked up and transferred half of the wafers 1011, the wafer stage 100 rotates the wafers 101 180° around the third direction S3. After the wafers 101 and the substrate 201 have rotated, the rotating arm assembly 300 sequentially picks up and transfers the remaining wafers 1011 onto the substrate 201. During the process of the rotating arm assembly 300 picking up and transferring wafers 1011, the wafer stage 100 moves the wafers 101 in the first direction S1 toward the direction away from the substrate stage 200.
[0081] It should be noted that in this embodiment, the wafer 101 has completed the semiconductor manufacturing process and has been diced, forming several wafers 1011, each containing a device structure. However, the wafers 1011 are not yet packaged. Therefore, a die bonding device is needed to transfer the wafers 1011 onto the substrate 201 to complete the subsequent electrical connection with the substrate 201 and the packaging process.
[0082] Please continue to refer to this. Figure 4 In this embodiment, each wafer 1011 in the wafer 101 is first transferred onto a wafer ring 104 with a blue film, and then placed on the wafer stage 100. At this time, the wafers 1011 are still arranged in the shape of the wafer 101. The wafers 1011 are arranged in several columns along the first direction S1 and several rows along the second direction S2.
[0083] Please refer to Figure 5 It should be noted that in this embodiment, the several wafers 1011 divided on the wafer 101 usually need to be transferred to multiple substrates 201. After all the bonding positions on a substrate 201 have been filled with wafers 1011, the next blank substrate 201 needs to be replaced.
[0084] Please continue to refer to this. Figure 1 In this embodiment, there are two robotic arms, namely, the rotating arm assembly 300 includes: a first robotic arm 3001 and a second robotic arm 3002.
[0085] In other embodiments, the number of robotic arms may also be 1, or other numbers greater than 1 and an integer divisible by 360.
[0086] In other embodiments, when the number of robotic arms is an integer greater than 1 and divisible by 360, the arrangement angle between adjacent robotic arms is α, where α = 360° / n, and n is the number of robotic arms; the n robotic arms of the rotating arm assembly are configured to rotate 360° / n around a third direction S3, so that the n robotic arms take turns rotating to above the wafer pickup position and the wafer placement position, and then take turns to perform the wafer 1011 pickup and placement operations; the two robotic arms located above the wafer pickup position and the wafer placement position among the n robotic arms are configured to perform the wafer 1011 pickup and placement operations simultaneously.
[0087] This setup ensures that two robotic arms are positioned simultaneously above the wafer stage 100 and the substrate stage 200, respectively, enabling the simultaneous picking and placing of the wafer 1011, thereby improving the transfer efficiency of the wafer 1011.
[0088] Please continue to refer to this. Figure 1In this embodiment, the angle between the first robotic arm 3001 and the second robotic arm 3002 is 180°.
[0089] Please continue to refer to this. Figure 1 In this embodiment, the rotating arm assembly 300 further includes a rotating device 3003. The first robotic arm 3001 and the second robotic arm 3002 are fixedly connected to the rotating device 3003, and the first robotic arm 3001 and the second robotic arm 3002 are rotated by the rotating device 3003.
[0090] Please continue to refer to this. Figure 1 and Figure 2 In this embodiment, the wafer stage 100 includes: a wafer rotation assembly 1001, which carries the wafer 101 and is rotatable about a third direction S3; a first motion assembly 1002, which is slidably connected to the wafer rotation assembly 1001 and can drive the wafer rotation assembly 1001 to reciprocate along a first direction S1; a second motion assembly 1003, which is slidably connected to the first motion assembly 1002 and can drive the first motion assembly 1002 to reciprocate along a second direction S2; and a pusher assembly 1004, which is reciprocating along a third direction S3 to lift the wafer 1011 located at the wafer pick-up position, so that the robotic arm can pick up the wafer 1011.
[0091] Please continue to refer to this. Figure 1 and Figure 3 In this embodiment, the substrate stage 200 includes: a substrate rotation assembly 2001, which is used to rotate the substrate 201 in the same direction as the wafer 101 rotates around the third direction S3, so as to ensure that the picked-up wafer 1011 is placed on the substrate 201 in a predetermined orientation; a third motion assembly 2002, which is slidably connected to the substrate rotation assembly 2001 and can drive the substrate rotation assembly 2001 to reciprocate along the first direction S1; and a fourth motion assembly 2003, which is slidably connected to the third motion assembly 2002 and can drive the third motion assembly 2002 to reciprocate along the second direction S2.
[0092] In this embodiment, the substrate rotation assembly 2001 is the structure of the substrate stage 201 itself.
[0093] In other embodiments, the substrate rotation assembly 2001 may also be an additionally configured structure and mounted on the substrate stage 201.
[0094] In this embodiment, the method for sequentially moving wafers 1011 to wafer pickup positions includes: moving the wafer along a first direction S1 and a second direction S2 via a wafer stage 100 to sequentially move all wafers 1011 included in the first part 101a to the wafer pickup positions; rotating the wafer 101 around a third direction S3 to swap the positions of the first part 101a and the second part 101b along the first direction S1; after swapping the positions of the first part 101a and the second part 101b along the first direction S1, moving the wafer 101 again along the first direction S1 and the second direction S2 via the wafer stage 100 to sequentially move all wafers 1011 included in the second part 101b to the wafer pickup positions.
[0095] Specifically, taking two robotic arms (i.e., the first robotic arm 3001 and the second robotic arm 3002), the first part 101a comprising half of the wafers 1011, and the second part 101b comprising half of the wafers 1011 as an example, the process will be explained in detail:
[0096] Please continue to refer to this. Figure 6 Step 1: Based on the first motion component 1002 and the second motion component 1003, the wafer 1011 to be picked up (such as the first wafer) is moved to the wafer picking position, so that the center position of the wafer 1011 is on the same axis as the center position of the first picking head 3001a of the first robotic arm 3001. At the same time, based on the third motion component 2002 and the fourth motion component 2003, the wafer bonding position of the substrate 201 is moved to the wafer placement position, so that the center position of the wafer bonding position is on the same axis as the center position of the second picking head 3002a of the second robotic arm 3002.
[0097] Please refer to Figure 7 Step 2: The ejector assembly 1004 rises to lift the chip 1011 to the first pickup head 3001a;
[0098] Please refer to Figure 8 Step 3: The first pickup head 3001a picks up the chip 1011, and the ejector pin assembly 1004 descends;
[0099] Please refer to Figure 9Step 4: The first robotic arm 3001 and the second robotic arm 3002 rotate 180° around the third direction S3, so that the first robotic arm 3001 transfers the picked-up wafer 1011 to above the wafer placement position, and the second robotic arm 3002 rotates to above the wafer pickup position. At the same time, based on the first motion component 1002 and the second motion component 1003, the next wafer 1011 (such as the second wafer) is moved to the wafer pickup position, so that the center position of the wafer 1011 is on the same axis as the center position of the second pickup head 3002a. Based on the third motion component 2002 and the fourth motion component 2003, the wafer bonding position of the substrate 201 is moved to the wafer placement position, so that the center position of the wafer bonding position is on the same axis as the center position of the first pickup head 3001a.
[0100] Please refer to Figure 10 Step 5: The first pickup head 3001a descends to place the chip 1011 on the corresponding chip bonding position on the substrate 201, while the ejector pin assembly 1004 rises to lift the chip 1011 to the second pickup head 3002a.
[0101] Please refer to Figure 11 Step 6: The first pickup head 3001a rises and separates from the chip 1011, while the ejector pin assembly 1004 descends, and the second pickup head 3002a picks up the chip 1011.
[0102] Please refer to Figure 12 Step 7: The first robotic arm 3001 and the second robotic arm 3002 rotate 180° around the third direction S3, so that the second robotic arm 3002 transfers the picked-up wafer 1011 to above the wafer placement position, and the first robotic arm 3001 rotates to above the wafer picking position. At the same time, based on the first motion component 1002 and the second motion component 1003, the next wafer 1011 (such as the third wafer) is moved to the wafer picking position, so that the center position of the wafer 1011 is on the same axis as the center position of the first picking head 3001a. Based on the third motion component 2002 and the fourth motion component 2003, the next wafer bonding position of the substrate 201 is moved to the wafer placement position, so that the center position of the wafer bonding position is on the same axis as the center position of the second picking head 3002a.
[0103] Please refer to Figure 13 Step 8: The second pickup head 3002a descends to place the chip 1011 on the corresponding chip bonding position on the substrate 201, while the ejector pin assembly 1004 rises to lift the chip 1011 to the first pickup head 3001a.
[0104] Please refer to Figure 14Step 9: The second pickup head 3002a rises and separates from the chip 1011, while the ejector pin assembly 1004 descends and the first pickup head 3001a picks up the chip 1011.
[0105] Please refer to Figure 15 Step 10: The first robotic arm 3001 and the second robotic arm 3002 rotate 180° around the third direction S3, so that the first robotic arm 3001 transfers the picked-up wafer 1011 to above the wafer placement position, and the second robotic arm 3002 rotates to above the wafer pickup position. At the same time, based on the first motion component 1002 and the second motion component 1003, the next wafer 1011 (such as the fourth wafer) is moved to the wafer pickup position, so that the center position of the wafer 1011 is on the same axis as the center position of the second pickup head 3002a. Based on the third motion component 2002 and the fourth motion component 2003, the next wafer bonding position of the substrate 201 is moved to the wafer placement position, so that the center position of the wafer bonding position is on the same axis as the center position of the first pickup head 3001a.
[0106] Please refer to Figure 16 Repeat Step 2 to Step 10 until the first robotic arm 3001 and the second robotic arm 3002 have picked up and transferred half of the number of wafers 1011 included in the first part 101a to the substrate 201.
[0107] Please refer to Figure 17 Step 11: Based on the wafer rotation component 1001, drive the wafer 101 to rotate 180° around the third direction S3, and rotate the other half of the number of wafers 1011 included in the second part 101b into the pick-up range of the first robotic arm 3001 and the second robotic arm 3002.
[0108] Please refer to Figure 18 Step 12: Based on the first motion component 1002 and the second motion component 1003, move the wafer 1011 to be picked up to the wafer picking position, so that the center position of the wafer 1011 is on the same axis as the center position of the first picking head 3001a. At the same time, based on the third motion component 2002 and the fourth motion component 2003, move the wafer bonding position of the substrate 201 to the wafer placement position, so that the center position of the wafer bonding position is on the same axis as the center position of the second picking head 3002a.
[0109] Please refer to Figure 19 Repeat Step 2 to Step 10 until the other half of the number of wafers 1011 included in the second part 101b of the first robotic arm 3001 and the second robotic arm 3002 are picked up, transferred and moved to the substrate 201.
[0110] Please continue to refer to this. Figures 6 to 15 and in conjunction with references Figure 20 It should be noted that in this embodiment, the first robotic arm 3001 and the second robotic arm 3002 simultaneously perform the picking and placing operations of the wafer 1011. The order in which the first robotic arm 3001 and the second robotic arm 3002 pick up the wafer 1011 is as follows: the wafer 1011 is picked up column by column from the edge position of the wafer 101 to the center position, and the picking path is in a zigzag shape. During this process, the wafer stage 100 drives the wafer 101 to move in the first direction S1 and toward the direction close to the substrate stage 200.
[0111] Please continue to refer to this. Figure 18 In conjunction with references Figure 21 When half of the wafers 1011 have been picked up and transferred, the wafers 101 are rotated 180° and then picked up column by column from the center to the edge, with the picking path being zigzag. During this process, the wafer stage 100 moves the wafers 101 in the first direction S1 and toward the direction away from the substrate stage 200.
[0112] In this embodiment, the first pickup head 3001a and the second pickup head 3002a pick up the wafer 1011 by adsorption.
[0113] In other embodiments, when the number of robotic arms is one, the rotating arm assembly includes: a first robotic arm; the method by which the rotating arm assembly sequentially picks up and transfers wafers to a substrate includes: the first robotic arm picking up wafers; the first robotic arm rotating the picked-up wafers 180° around a third direction to above the substrate; the first robotic arm placing the picked-up wafers on the substrate; and repeating this process until the first robotic arm picks up and transfers all wafers to the substrate.
[0114] In other embodiments, when the number of robotic arms is greater than 1 and is an integer divisible by 360, the method for picking up and transferring the corresponding wafer to the substrate is similar to the method for picking up and transferring the wafer to the substrate when there are only 2 robotic arms. The difference is that the angle of rotation of each robotic arm needs to be adjusted according to the number of robotic arms. The angle of rotation of each robotic arm is β, where β = 360° / n, and n is the number of robotic arms.
[0115] Please continue to refer to this. Figure 17 In this embodiment, when the wafer stage 100 drives the wafer 101 to rotate 180° around the third direction S3, it also includes: rotating the substrate 201 on the substrate stage 200 in the same direction around the third direction S3 to ensure that the picked-up wafer 1011 is placed on the substrate 201 in a predetermined orientation.
[0116] Please refer to Figure 22 and Figure 23Before and after the wafer 101 and substrate 201 are rotated 180°, the edges (a, b, c, d) of the wafer 1011 remain unchanged relative to the edges (A, B, C, D) of the substrate. By keeping the wafer 101 and substrate 201 rotated synchronously, compared with the transfer of the wafer 1011 when rotating the wafer 101, the relative position of the wafer 1011 and substrate 201 can be kept unchanged, thereby effectively avoiding orientation errors in the bonding between the wafer 1011 and substrate 201.
[0117] It should be noted that in this embodiment, when half of the wafers 1011 have been picked up and transferred, the wafers 101 cannot move further towards the substrate stage 200 due to the obstruction of the substrate stage 200. If it is desired to pick up the other half of the wafers 1011 by moving them closer to the substrate stage 200, the distance between the wafer stage 100 and the substrate stage 200 needs to be increased, which requires an additional robotic arm.
[0118] Therefore, in this embodiment, the other half of the wafers 1011 are rotated into the range that the robotic arm can pick up, without increasing the length of the robotic arm.
[0119] In other embodiments, when the number of robotic arms is one or an even number greater than one (except for two), the bonding positions of the wafers on the wafer and the wafers on the substrate are arranged in the same direction, with the fourth direction being consistent with the first, fifth, and second directions.
[0120] In other embodiments, when the number of robotic arms is an odd number greater than 1 and divisible by 360, the wafers on the wafer and the wafers on the substrate are arranged at an angle of 360° / 2n, with the first and fourth directions, and the second and fifth directions forming an angle of 360° / 2n or 90°-360° / 2n. Specifically, the wafer stage rotates the wafer 360° / 2n around a third direction (including clockwise or counterclockwise). This will be explained below with specific examples.
[0121] Please refer to Figure 24 Taking the case of three robotic arms as an example, the picking head at the location of the second robotic arm 3002 is set as the picking position, that is, the picking is performed at the second position P2. The picking head at the location of the first robotic arm 3001 is set as the placement position. That is, all robotic arms pick up the wafer at the second position P2 and then rotate the robotic arm to the first position P1 to place the wafer.
[0122] The second position P2 must be more than half of the wafer 101 in the second direction S2 of the wafer stage. That is, as shown in the figure, the upper half of the wafer 101 can be moved to the second position P2 for pickup by moving in the first direction S1 and the second direction S2. (Since the wafer stage 100 cannot move further upward, the lower half of the wafer 1011 cannot be picked up directly by moving in the first direction S1 and the second direction S2. Instead, it is moved by rotating 180° in the third direction S3 to the upper half of the wafer 1011 so that it can be picked up.)
[0123] Please continue to refer to this. Figure 24 If the wafer is picked up directly from the wafer stage at the second position P2 and then placed at the first position P1, the relative positions of the wafer 1011 and the wafer bonding positions on the substrate 201 will be incorrect (unable to satisfy A to a, B to b, C to c, D to d), resulting in subsequent bonding failure.
[0124] Please refer to Figure 25 To ensure the robotic arm correctly places the wafer 101 at the first position (P1) after picking it up at the second position (P2), the wafer stage 100 needs to rotate 60° (360° / 2n) clockwise around a third direction S3 perpendicular to the first direction S1 and the second direction S2, or the entire wafer stage needs to be rotated 60° clockwise. If picking up at the third position (P3), the wafer 101 needs to rotate 60° counterclockwise around the third direction S3, or the entire wafer stage needs to be rotated 60° counterclockwise. It's important to note that this 60° rotation further includes a 60° rotation of the first motion component 1002, the second motion component 1003, and the wafer rotation component 1001 during installation. This is to ensure that the first direction S1 and the second direction S2 (i.e., the two directions controlled by the sliding component) of the wafer stage 100 are parallel to the arrangement direction of the wafers 1011 on the wafer 101.
[0125] Based on the above adjustments, at the second position P2, the wafer 1011 is picked up from the wafer stage 100 and placed at the first position P1. The relative positions of the wafer 1011 and the wafer bonding positions on the substrate 201 will not be incorrect (i.e., satisfying A to a, B to b, C to c, D to d) and will not cause subsequent bonding failure.
[0126] In this embodiment, after the wafer 101 or the wafer stage 100 has rotated 60°, since the entire wafer stage 100 is at its limit position in the positive y direction, it cannot move further in the y+ direction. At this point, it can only pick up the upper part of the wafer 1011 through the rotated first direction S1 and second direction S2, and the picking path is still serpentine. The specific process is as follows:
[0127] Please refer to Figure 26A serpentine picking path is used to pick up the upper half of the chip 1011.
[0128] Please refer to Figure 27 After picking up the upper half of the chip 1011, the remaining lower half of the chip 1011 is picked up.
[0129] Please refer to Figure 28 The wafer is rotated 180° around the third direction S3 so that the lower half of the wafer 1011 is within the pickup range.
[0130] Please refer to Figure 29 A serpentine picking path is used to pick up the lower half of the chip 1011.
[0131] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A die bonding device, characterized in that, include: A wafer stage is used to carry a wafer to be transferred. The wafer includes a plurality of separate wafers. The wafer stage can drive the wafer to reciprocate along a first direction and a second direction that are perpendicular to each other, and rotate it about a third direction that is perpendicular to the first direction and the second direction, so as to move the wafers sequentially to the wafer pick-up position on the wafer stage. A substrate stage, used to support a substrate, is capable of reciprocating the substrate along a fourth and a fifth direction that are perpendicular to each other and perpendicular to the third direction, so as to sequentially move a plurality of mutually separated wafer bonding positions on the substrate to wafer placement positions on the substrate stage; a rotating arm assembly, including at least one robotic arm that can rotate around the third direction between the wafer pickup position and the wafer placement position, is used to sequentially pick up the wafers from the wafer pickup position and sequentially place the picked-up wafers into the wafer bonding positions located on the wafer placement position.
2. The die bonding equipment as described in claim 1, characterized in that, The wafer includes a first part and a second part arranged side by side. The wafer stage is configured to rotate the wafer around the third direction to swap the positions of the first part and the second part, so that all the wafers on the wafer can be moved to the wafer pick-up position.
3. The die bonding equipment as described in claim 2, characterized in that, The length of the robotic arm is set so that it can pick up all the wafers on the first portion or the second portion by moving the wafer along the first direction and the second direction; if the dimensions of the first portion and the second portion are not the same along the first direction, the length of the robotic arm is set according to the portion with the larger size.
4. The die bonding apparatus as described in claim 1, characterized in that, Also includes: A substrate rotation assembly is used to rotate the substrate in the same direction around the third direction when the wafer rotates around the third direction, so as to ensure that the picked-up wafer is placed on the substrate in a predetermined orientation.
5. The die bonding apparatus as described in claim 4, characterized in that, The substrate rotation assembly is disposed on the substrate stage, so that the substrate stage can drive the substrate to rotate around the third direction.
6. The die bonding apparatus as described in claim 1, characterized in that, The number of robotic arms is one or more than one and is an integer divisible by 360.
7. The die bonding apparatus as described in claim 6, characterized in that, When the number of robotic arms is greater than 1, the arrangement angle between adjacent robotic arms is α, where α = 360° / n, and n is the number of robotic arms.
8. The die bonding apparatus as described in claim 7, characterized in that, The n robotic arms of the rotating arm assembly are configured to rotate 360° / n around the third direction, so that the n robotic arms take turns rotating above the wafer pickup position and the wafer placement position, and then take turns to perform wafer pickup and placement operations.
9. The die bonding apparatus as described in claim 8, characterized in that, Two of the n robotic arms located above the wafer pickup position and the wafer placement position are configured to perform wafer pickup and placement operations simultaneously.
10. The die bonding apparatus as described in claim 6, characterized in that, When the number of robotic arms is one or an even number greater than one, the bonding positions of the wafers on the wafer and the wafers on the substrate are arranged in the same direction, and the fourth direction is consistent with the first direction, the fifth direction is consistent with the second direction.
11. The die bonding apparatus as described in claim 6, characterized in that, When the number of robotic arms is an odd number greater than 1 and divisible by 360, the wafers on the wafer and the wafers on the substrate are arranged at an angle of 360° / 2n, where n is the number of robotic arms, and the first direction and the fourth direction, and the second direction and the fifth direction are at an angle of 360° / 2n or 90°-360° / 2n.
12. The die bonding apparatus as described in claim 1, characterized in that, The wafer stage includes: a wafer rotation assembly for carrying the wafer and rotatable about a third direction; a first motion assembly slidably connected to the wafer rotation assembly and capable of reciprocating along the first direction; a second motion assembly slidably connected to the first motion assembly and capable of reciprocating along the second direction; and a ejector assembly reciprocating along the third direction to lift the wafer located at the wafer pick-up position, so that the robotic arm can perform a wafer pick-up operation.
13. A method for operating a die bonding device, characterized in that, include: Provide a die bonding apparatus as described in any one of claims 1 to 12; The wafers carried on the wafer stage are moved along a first and a second direction that are perpendicular to each other, and rotated around a third direction that is perpendicular to the first and the second directions, so that a number of separate wafers on the wafer stage are moved sequentially to the wafer pick-up position on the wafer stage. The substrate carried on the substrate stage is moved along mutually perpendicular fourth and fifth directions by the substrate stage, thereby sequentially moving several mutually separated wafer bonding positions on the substrate to wafer placement positions on the substrate stage; and The wafers are sequentially picked up from the wafer pick-up position by at least one robotic arm of the rotating arm assembly that can rotate about the third direction between the wafer pick-up position and the wafer placement position, and the picked-up wafers are sequentially placed on the wafer bonding position located on the wafer placement position.
14. The method of operating the die bonding equipment as described in claim 13, characterized in that, The wafer includes a first portion and a second portion arranged side by side; the method for sequentially moving the wafers to the wafer pickup position includes: moving the wafer along the first direction and the second direction via the wafer stage to sequentially move all the wafers included in the first portion to the wafer pickup position; rotating the wafer about the third direction to swap the positions of the first portion and the second portion; after swapping the positions of the first portion and the second portion, moving the wafer along the first direction and the second direction again via the wafer stage to sequentially move all the wafers included in the second portion to the wafer pickup position.
15. The method of operating the die bonding equipment as described in claim 13, characterized in that, When the wafer rotates about the third direction, the method further includes: rotating the substrate on the substrate stage in the same direction about the third direction to ensure that the picked-up wafer is placed on the substrate in a predetermined orientation.
16. The method of operating the die bonding equipment as described in claim 13, characterized in that, When the number of robotic arms n is an integer greater than 1 and divisible by 360, and the arrangement angle between adjacent robotic arms is α, where α = 360° / n, the robotic arms are rotated around the third direction, with each rotation angle being 360° / n, so that the n robotic arms take turns rotating to the wafer pickup position and the wafer placement position, and then take turns performing the wafer pickup and placement operations.
17. The method of operating the die bonding equipment as described in claim 16, characterized in that, When the number of robotic arms is an odd number greater than 1 and divisible by 360, before picking up the wafer from the wafer stage, the wafer carried by the wafer stage is arranged such that the wafers included on it are arranged at an angle of 360° / 2n to the wafer bonding positions on the substrate, and the first direction and the fourth direction, and the second direction and the fifth direction are at an angle of 360° / 2n or 90°-360° / 2n.
18. The method of operating the die bonding equipment as described in claim 17, characterized in that, The step of arranging the wafer at a 360° / 2n angle to the wafer bonding position includes: rotating the wafer around the third direction by 360° / 2n via the wafer stage.
19. The method of operating the die bonding equipment as described in claim 16, characterized in that, The number of robotic arms is two, and the rotating arm assembly includes a first robotic arm and a second robotic arm. The method for sequentially picking up and placing the wafers includes: the first robotic arm picking up a first wafer located at the wafer picking position; the first robotic arm and the second robotic arm rotating 180° around the third direction, so that the first robotic arm rotates above the wafer placement position, and the second robotic arm rotates above the wafer picking position; the first robotic arm places the picked-up first wafer on the wafer bonding position on the wafer placement position, and the second robotic arm picks up a second wafer from the wafer picking position; the first robotic arm and the second robotic arm rotating 180° around the third direction, so that the second robotic arm moves above the wafer placement position, and the first robotic arm rotates above the wafer picking position; the second robotic arm places the picked-up second wafer on the wafer bonding position on the wafer placement position, and the first robotic arm picks up a third wafer from the wafer picking position; this cycle is repeated until the first robotic arm and the second robotic arm have picked up and transferred all the wafers on the wafer to the substrate.
20. The method of operating the die bonding equipment as described in claim 16, characterized in that, Two of the n robotic arms located above the wafer pickup position and the wafer placement position simultaneously perform the wafer pickup and placement operations.