Device for renovating electrostatic chuck and renovating method

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a device for renovating an electrostatic chuck and a renovating method, and the device for renovating the electrostatic chuck comprises a vacuum cavity, a workpiece table and a laser generating and beam combining mechanism integrated with an ultraviolet laser, an infrared laser and a dichroscope. The dichroscope combines the two laser beams to the same light path and accurately points to the electrostatic chuck, during renovation, the central processing unit controls the ultraviolet pulse laser and the infrared pulse laser to alternately act on a cleaning area at extremely short intervals, the real-time monitoring mechanism feeds back the cleaning state, and closed-loop control is achieved. Through non-contact processing, energy accurately acts on a thin film layer, ultraviolet light firstly destroys chemical bonds of the hard thin film, infrared light immediately peels the hard thin film through the heat effect, the problems of base body abrasion and thickness reduction caused by mechanical grinding and polishing are fundamentally avoided, meanwhile, strong acid and strong base are not needed, and the method is environmentally friendly. And the microscopic damage and defects of the matrix caused by chemical corrosion are thoroughly eliminated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a device and method for electrostatic chuck renovation. BACKGROUND

[0002] In semiconductor manufacturing equipment, an electrostatic chuck (ESC) is a key component for fixing, temperature control and conveying wafers in a vacuum chamber. The mainstream electrostatic chuck adopts ceramic material, and a hard film such as a titanium nitride (TiN), silicon carbide (SiC), tantalum carbide (TaC) or diamond-like carbon (DLC) film is usually deposited on the surface of the electrostatic chuck. The hard film mainly plays a role in reducing the generation of particulate matter, enhancing the surface wear resistance and improving the electrical performance. However, after long-term use in a complex process environment, the hard film on the surface of the electrostatic chuck will be worn, scratched, peeled or contaminated, resulting in a decrease in adsorption force and deterioration of insulation performance, which affects the yield of wafer processing. At this time, the electrostatic chuck needs to be renovated, i.e. the old hard film is removed and a new film is deposited.

[0003] At present, the conventional method for removing the old hard film mainly includes mechanical polishing and chemical corrosion. The mechanical polishing removes the film by physical grinding, but this method inevitably wears the ceramic substrate below, resulting in a decrease in the thickness of the substrate. With an increase in the number of renovations, excessive thinning of the ceramic substrate will change the thermal conductivity and electrical performance of the electrostatic chuck, and even cause it to be scrapped. The chemical corrosion method uses strong acid, strong alkali and other corrosive agents to dissolve the hard film, but the corrosive agent will also corrode the ceramic substrate, causing defects such as micro-point corrosion and cracks, resulting in irreversible performance degradation such as a decrease in adsorption force and a decrease in breakdown voltage.

[0004] Therefore, it is urgent to develop a renovation device and method that can accurately, efficiently and non-destructively remove the hard film on the surface of the electrostatic chuck. SUMMARY

[0005] The present application provides a device and method for electrostatic chuck renovation, which solves the defect that the existing technology uses mechanical polishing or chemical corrosion to renovate the electrostatic chuck, which easily damages the ceramic substrate and affects the performance of the electrostatic chuck, and realizes accurate, efficient and non-destructive removal of the hard film on the surface of the electrostatic chuck, thereby prolonging the service life of the electrostatic chuck, ensuring that the performance after renovation is close to that of a new product, and meeting the stringent requirements of semiconductor manufacturing for cleanliness and precision.

[0006] The application provides a device for electrostatic chuck renovation, which comprises a vacuum cavity, a workpiece table, a laser generation and beam combination mechanism, a real-time monitoring mechanism and a central processing unit, the workpiece table is located in the vacuum cavity and used for carrying an electrostatic chuck to be renovated, the laser generation and beam combination mechanism is located in the vacuum cavity and opposite to the workpiece table, the laser generation and beam combination mechanism comprises an ultraviolet laser, an infrared laser and a dichroic mirror, the ultraviolet laser is used for emitting an ultraviolet pulsed laser beam towards the dichroic mirror, the infrared laser is used for emitting an infrared pulsed laser beam towards the dichroic mirror, and the dichroic mirror is used for transmitting the ultraviolet pulsed laser beam and reflecting the infrared pulsed laser beam so as to emit the ultraviolet pulsed laser beam and the infrared pulsed laser beam to the workpiece table in the same path, the real-time monitoring mechanism is arranged on one side of the workpiece table and used for monitoring the cleaning state of the electrostatic chuck on the workpiece table, and the central processing unit is in communication connection with the laser generation and beam combination mechanism and the real-time monitoring mechanism respectively and used for cooperative control.

[0007] According to the device for electrostatic chuck renovation, the ultraviolet laser and the infrared laser are arranged on the two sides of the dichroic mirror, the ultraviolet laser emits an ultraviolet pulsed laser beam towards the dichroic mirror in a first direction, the infrared laser emits an infrared pulsed laser beam towards the dichroic mirror in a second direction, and the dichroic mirror is at an angle of 45 degrees with the first direction and the second direction respectively, so that the ultraviolet pulsed laser beam transmitted by the dichroic mirror and the infrared pulsed laser beam reflected by the dichroic mirror are both emitted to the workpiece table in the first direction.

[0008] According to the device for electrostatic chuck renovation, the ultraviolet laser and the infrared laser are both provided with a power supply, a laser source and a switch, the switches of the ultraviolet laser and the infrared laser are in communication connection with the central processing unit, the central processing unit controls the ultraviolet laser and the infrared laser to alternately emit pulsed laser beams, and the ultraviolet pulsed laser beam emitted by the ultraviolet laser is prior to the infrared pulsed laser beam emitted by the infrared laser.

[0009] According to the device for electrostatic chuck renovation, the laser generation and beam combination mechanism is arranged on a motion table, and a motion control system of the motion table is connected with the central processing unit.

[0010] According to the device for electrostatic chuck renovation, a high-speed oscillating mirror and a flat-field focusing lens are further arranged on the motion table, the high-speed oscillating mirror is located at an exit end of the dichroic mirror and used for controlling deflection of a pulsed laser beam, and the flat-field focusing lens is located at an exit end of the high-speed oscillating mirror and used for correcting focal field curvature aberration of the deflected pulsed laser beam.

[0011] The device for electrostatic chuck renovation provided by the application is characterized in that a fiber coupler is further arranged between the dichroic mirror and the high-speed oscillating mirror, the fiber coupler comprises a transmission optical fiber and an input coupler and an output coupler respectively arranged at two ends of the transmission optical fiber, the input coupler is arranged at the exit end of the dichroic mirror, and the output coupler is arranged at the entrance end of the high-speed oscillating mirror.

[0012] The device for electrostatic chuck renovation provided by the application is characterized in that the high-speed oscillating mirror is fixed on a Z-axis piezoelectric displacement table, a driver of the Z-axis piezoelectric displacement table and a motor driving board of the high-speed oscillating mirror are in communication connection with an FPGA controller, and the FPGA controller is in communication connection with the central processor.

[0013] The flat-field focusing lens is provided with a detection mechanism and a cooling mechanism, the detection mechanism is integrated with a temperature sensor and a confocal distance measuring sensor, the temperature sensor is connected to the cooling mechanism, used for monitoring the temperature of the flat-field focusing lens and performing temperature compensation on the flat-field focusing lens through the cooling mechanism, and the confocal distance measuring sensor is connected to the Z-axis piezoelectric displacement table, used for monitoring the focal length of the pulsed laser beam on the electrostatic chuck and feeding back control to the Z-axis piezoelectric displacement table.

[0014] The device for electrostatic chuck renovation provided by the application is characterized in that the vacuum cavity is equipped with a dust removal system, the dust removal system comprises a particle suction device, a filter and a power supply, the particle suction device is arranged on one side of the workpiece table, and the filter is connected to the particle suction device and located outside the vacuum cavity.

[0015] The vacuum cavity is equipped with an oxygen supply system, the oxygen supply system comprises an oxygen supply nozzle, a gas cabinet and a power supply, the oxygen supply nozzle is arranged on one side of the workpiece table, and the gas cabinet is connected to the oxygen supply nozzle and located outside the vacuum cavity.

[0016] The device for electrostatic chuck renovation provided by the application is characterized in that the real-time monitoring mechanism comprises a high-speed CCD camera and / or a precision spectrometer.

[0017] The application further provides a renovation method of an electrostatic chuck, which is suitable for the device for electrostatic chuck renovation described in any one of the above. A three-dimensional model of the electrostatic chuck to be renovated is generated, and a cleaning area and a non-cleaning area are divided in the three-dimensional model.

[0018] The three-dimensional model is imported into a central processor to calculate a cleaning path of the cleaning area, and the cleaning path is divided into a plurality of cleaning points.

[0019] Fix the electrostatic chuck to be refurbished on the workpiece table in the vacuum cavity, and the surface of the electrostatic chuck has a hard film to be cleaned.

[0020] The central processing unit controls the ultraviolet laser and the infrared laser to alternately generate pulsed laser beams, which act on the hard film of the first cleaning point of the electrostatic chuck, and the real-time monitoring mechanism monitors the cleaning state of the hard film of the first cleaning point.

[0021] After the real-time monitoring mechanism monitors that the hard film of the first cleaning point is cleaned, the laser generation and beam combination mechanism moves to the second cleaning point for laser cleaning based on the cleaning path calculated by the central processing unit, until all the cleaning points on the cleaning path are cleaned.

[0022] After the laser cleaning is completed, the ultrasonic cleaning machine is used to shake and clean the residual particles on the surface of the electrostatic chuck, and the electrostatic chuck is re-coated after the shaking and cleaning, and the electrostatic chuck is refurbished.

[0023] The device for refurbishing the electrostatic chuck provided by the application controls the ultraviolet laser and the infrared laser to work alternately, and the emitted laser beams are combined by the dichroic mirror to alternately act on the same cleaning point on the surface of the electrostatic chuck. In this process, the ultraviolet pulsed laser first acts on the film and destroys its chemical bonds through high-energy photons; after a very short interval, the infrared pulsed laser follows up and uses thermal effect to peel off the weakened film from the ceramic substrate. The real-time monitoring mechanism continuously collects signals in the processing area and feeds back data to the central processing unit to determine whether the cleaning is completed and control the laser beam to move to the next area until the entire surface is processed. The application avoids physical wear and thickness reduction of the ceramic substrate caused by mechanical polishing through non-contact processing, and eliminates micro-erosion and pitting defects of the ceramic substrate caused by chemical corrosion without using strong acid and strong alkali and other corrosive chemicals, thereby maintaining the integrity and insulation performance of the substrate. The device for refurbishing the electrostatic chuck can realize accurate, efficient and non-destructive refurbishment, significantly prolong the service life of the electrostatic chuck, and ensure that the refurbished performance is reliable and consistent. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0025] Fig. 1 It is a schematic diagram of the principle structure of the device for refurbishing the electrostatic chuck provided by the application.

[0026] Fig. 2 This is a schematic diagram showing the positional distribution of the ultraviolet laser, infrared laser, and dichroic mirror provided by the present invention.

[0027] Fig. 3 This is a flowchart illustrating the electrostatic chuck refurbishment method provided by the present invention. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0029] The following is combined with Figs. 1 to 3 The present invention describes the apparatus and method for refurbishing electrostatic chucks.

[0030] One embodiment of the present invention provides an apparatus for electrostatic chuck refurbishment, see [link to relevant documentation]. Fig. 1 As shown, the device for refurbishing electrostatic chucks includes a vacuum chamber, a workpiece stage, a laser generator and beam combiner, a real-time monitoring mechanism, and a central processing unit. The workpiece stage is located inside the vacuum chamber and is used to hold the electrostatic chuck to be refurbished. The laser generator and beam combiner is located inside the vacuum chamber and is positioned opposite the workpiece stage. The laser generator and beam combiner includes an ultraviolet laser, an infrared laser, and a dichroic mirror. The ultraviolet laser emits an ultraviolet pulsed laser beam toward the dichroic mirror, and the infrared laser emits an infrared pulsed laser beam toward the dichroic mirror. The dichroic mirror transmits the ultraviolet pulsed laser beam and reflects the infrared pulsed laser beam, so that the ultraviolet pulsed laser beam and the infrared pulsed laser beam are directed toward the workpiece stage along the same path. The real-time monitoring mechanism is located on one side of the workpiece stage and is used to monitor the cleaning status of the electrostatic chuck on the workpiece stage. The central processing unit communicates with the laser generator and beam combiner and the real-time monitoring mechanism for coordinated control.

[0031] It is understood that the device for electrostatic chuck refurbishment in this embodiment includes a vacuum chamber, a workpiece stage placed within it, and a laser generation and beam combining mechanism. The laser generation and beam combining mechanism integrates an ultraviolet laser, an infrared laser, and a dichroic mirror. The dichroic mirror efficiently transmits the ultraviolet pulsed laser beam emitted by the ultraviolet laser while simultaneously reflecting the infrared pulsed laser beam emitted by the infrared laser with high reflectivity, thereby precisely combining the two laser beams of different wavelengths into the same transmission optical path, pointing together at the electrostatic chuck supported on the workpiece stage. The device for electrostatic chuck refurbishment is also equipped with a real-time monitoring mechanism for observing the cleaning process, and a central processing unit uniformly coordinates and controls the working timing and logic of the entire system.

[0032] In the implementation of the renovation, the electrostatic chuck to be processed is fixed on the workpiece table in the vacuum cavity, the central processing unit controls the ultraviolet laser and the infrared laser to work alternately, and the laser beams emitted by the ultraviolet laser and the infrared laser are combined alternately through the dichroic mirror and act on the same cleaning point on the surface of the electrostatic chuck. In this process, the ultraviolet pulse laser first acts on the film and destroys the chemical bonds thereof through high-energy photons; after a very short interval, the infrared pulse laser follows up and uses the thermal effect to make the weakened film peel off from the ceramic substrate. The real-time monitoring mechanism continuously collects signals of the processing area and feeds back data to the central processing unit to determine whether the cleaning is completed and control the laser beam to move to the next area until the entire surface is processed.

[0033] It should be understood that the laser cleaning of the hard film to be processed on the surface of the electrostatic chuck in the embodiment is a non-contact processing, and the energy is accurately controlled in the hard film layer, which fundamentally avoids the physical wear and thickness thinning problems of the ceramic substrate caused by mechanical polishing. The laser cleaning process does not need to use strong acid, strong base and other corrosive chemicals, and completely eliminates the micro-erosion and pitting defects of the ceramic substrate caused by chemical corrosion, thereby maintaining the integrity and insulation performance of the substrate. Therefore, the device for renovating the electrostatic chuck in the embodiment can realize precise, efficient and lossless renovation, significantly prolong the service life of the electrostatic chuck, and ensure that the performance of the electrostatic chuck after renovation is reliable and consistent.

[0034] In some embodiments of the device for renovating the electrostatic chuck, the ultraviolet laser and the infrared laser are arranged on the two sides of the dichroic mirror, the ultraviolet laser emits the ultraviolet pulse laser beam toward the dichroic mirror in a first direction, the infrared laser emits the infrared pulse laser beam toward the dichroic mirror in a second direction, and the dichroic mirror is at a 45-degree angle with the first direction and the second direction, respectively, so that the ultraviolet pulse laser beam transmitted through the dichroic mirror and the infrared pulse laser beam reflected by the dichroic mirror are both emitted toward the workpiece table in the first direction.

[0035] It can be understood that, referring to Fig. 2As shown, in the present embodiment, the ultraviolet laser and the infrared laser are not coaxially arranged, but are respectively located on the two sides of the dichroic mirror, forming a stable triangular optical path structure. The dichroic mirror, as the core optical node, is accurately fixed at a position with a 45-degree angle with the incidence direction of the two laser beams. Specifically, the dichroic mirror has a transmittance of >95% for 266nm ultraviolet light and a reflectivity of >99% for 1064nm infrared light. The ultraviolet laser of the present embodiment is directly opposite the dichroic mirror along a first direction, while the infrared laser is incident along a second direction perpendicular to the first direction. The dichroic mirror is specially coated and treated, and its optical properties are designed to have a very high transmittance for ultraviolet light and a very high reflectivity for infrared light. The triangular optical path structure of the present embodiment ensures that the two laser beams can intersect and combine paths at the dichroic mirror with minimal energy loss.

[0036] During operation, the beam combination process proceeds along a precise optical path. The ultraviolet pulse laser beam is directly incident on the dichroic mirror from one side along a first direction. Since its wavelength is in the high-transmission band, most of the energy will directly penetrate the lens and continue to propagate along the original first direction. The infrared pulse laser beam is incident on the same point of the dichroic mirror from a perpendicular second direction. The high-reflectivity characteristic of the mirror surface for this wavelength causes the light beam to be deflected by 90 degrees, and its exit direction coincides exactly with the path of the penetrated ultraviolet light. Thus, the two laser beams of different wavelengths and from different directions can be alternately guided to the same position on the surface of the electrostatic chuck of the workpiece table along the first direction as the common axis, and act on the hard film to be cleaned.

[0037] In some embodiments of the device for electrostatic chuck renovation of the present application, the ultraviolet laser and the infrared laser are each provided with a power supply, a laser source and a switch. The switches of the ultraviolet laser and the infrared laser are in communication connection with the central processing unit. The central processing unit controls the ultraviolet laser and the infrared laser to alternately emit pulse laser beams, and the ultraviolet pulse laser beam emitted by the ultraviolet laser precedes the infrared pulse laser beam emitted by the infrared laser.

[0038] It can be understood that in the present embodiment, the ultraviolet laser and the infrared laser are each equipped with an independent drive unit, each containing a dedicated power supply, a laser source and a high-speed optical switch. These high-speed switches are directly connected to the central processing unit of the system through high-speed communication lines. The central processing unit, as the control center, is embedded with a precise timing control program and can send time synchronization instructions with nanosecond-level precision to the switches of the two lasers, forming a centralized and high-precision laser emission control system that ensures the coordinated operation of the dual lasers in complex work processes.

[0039] In the process of refurbishment, the central processor executes strict alternate emission control timing according to preset cleaning strategy. First, the central processor sends a trigger signal to the switch of the ultraviolet laser to make it emit an ultraviolet pulsed laser beam, which acts on the hard film on the surface of the electrostatic chuck, mainly destroying the chemical bonds of the film through photochemical effect. After the first ultraviolet pulsed laser beam ends, after a very short and controlled delay, the central processor immediately sends a trigger signal to the switch of the infrared laser to emit an infrared pulsed laser beam, which acts on the same micro area immediately after the ultraviolet pulsed laser beam, and uses its thermal effect to make the film weakened by ultraviolet light peel off from the substrate due to thermal expansion difference. This alternate pulse mode of ultraviolet pulsed laser beam and infrared pulsed laser beam is repeated in the whole cleaning path, realizing efficient cooperative cleaning.

[0040] In some embodiments of the device for refurbishment of the electrostatic chuck of the application, the laser generation and beam combination mechanism is arranged on the motion table, and the motion control system of the motion table is connected to the central processor. A high-speed galvanometer (scanning speed ≥ 3000 mm / s) and a flat-field focusing lens (focal point deviation ≤ 8 μm for double waveband) are also arranged on the motion table. The high-speed galvanometer is located at the exit end of the dichroic mirror and is used to control the deflection of the pulsed laser beam. The flat-field focusing lens is located at the exit end of the high-speed galvanometer and is used to correct the focal point field curvature aberration of the deflected pulsed laser beam.

[0041] It can be understood that in the present embodiment, the laser generation and beam combination mechanism is integrated as a whole module on a high-precision motion table, and the motion table has multi-axis motion capability, and its motion control system is under the unified command of the central processor. On the motion table, a set of precise dynamic optical scanning system is constructed: the combined laser first enters a high-speed galvanometer, which is composed of high-speed deflectable micro mirrors and is the execution mechanism for controlling the scanning trajectory of the laser beam in two-dimensional plane; then the laser beam passes through a flat-field focusing lens, which is a key optical component of the system and is specially used to correct the inherent optical error of the high-speed galvanometer, i.e. focal point field curvature aberration, which is caused by the change of incident angle during deflection scanning, to ensure that the focal point of the laser beam can accurately fall on a flat image plane at different scanning angles.

[0042] In the implementation of the scanning cleaning, the central processor cooperatively controls the overall displacement of the motion table and the fine deflection of the galvanometer. First, the motion table performs large-scale positioning according to the cleaning path, and moves the laser output end to the vicinity of the target cleaning area. Subsequently, the high-speed galvanometer performs high-speed and slight angular deflection under the control of the central processor, accurately guides the laser focal point to perform rapid two-dimensional scanning filling on the surface of the electrostatic chuck, and covers the complex plane or curved surface profile. During the entire scanning process, the flat-field focusing lens continuously works, and real-time compensation is performed on the focal point drift caused by the deflection of the light beam, so that the spot size and energy density are kept constant whether the laser scanning is to the edge or the center of the field of view, thereby realizing uniform and consistent precise energy application to the entire cleaning area, and avoiding poor cleaning effect or substrate damage caused by defocusing.

[0043] Further, in some examples, the high-speed galvanometer is fixed on the Z-axis piezoelectric displacement table (which can realize ±2mm adjustment, and the adjustment accuracy is ±0.01mm), the driver of the Z-axis piezoelectric displacement table and the motor drive board of the high-speed galvanometer are in communication connection with the FPGA controller, and the FPGA controller is in communication connection with the central processor. The flat-field focusing lens is provided with a detection mechanism and a cooling mechanism, the detection mechanism is integrated with a temperature sensor and a confocal distance measuring sensor, the temperature sensor is connected with the cooling mechanism, is used for monitoring the temperature of the flat-field focusing lens, and performs temperature compensation on the flat-field focusing lens through the cooling mechanism; the confocal distance measuring sensor is connected with the Z-axis piezoelectric displacement table, and is used for monitoring the focal length of the pulsed laser beam on the electrostatic chuck and feeding back the control of the Z-axis piezoelectric displacement table.

[0044] It can be understood that in the present example, the scanning system further integrates a three-dimensional dynamic focusing and real-time feedback compensation architecture. The high-speed galvanometer is fixedly installed on a high-precision Z-axis piezoelectric displacement table, thereby giving the entire scanning head rapid lifting capability in the vertical direction. The motor drive board of the high-speed galvanometer and the driver of the Z-axis piezoelectric displacement table are directly connected to a high-speed FPGA controller, and the FPGA controller serves as a bottom-layer real-time control unit and communicates with the upper central processor. At the same time, the flat-field focusing lens is equipped with integrated detection and cooling mechanisms: the detection mechanism integrates a temperature sensor and a confocal distance measuring sensor, which are respectively used for monitoring the temperature change of the flat-field focusing lens and the real-time distance from the laser focal point to the workpiece surface; the cooling mechanism actively dissipates heat according to the temperature signal. The output signal of the confocal distance measuring sensor is directly fed back to the control system for closed-loop control of the Z-axis piezoelectric displacement table.

[0045] In the cleaning of the electrostatic chuck with three-dimensional topography, the present example can implement precise dynamic focusing. First, the confocal distance sensor measures before or synchronously with the laser processing point, and the collected surface height data is sent to the FPGA controller at a very high speed. The FPGA controller compares the real-time height with the preset focus position and immediately drives the Z-axis piezoelectric displacement table to move up and down with nanometer precision, driving the entire high-speed galvanometer and flat-field focusing lens to move, ensuring that the laser focus is always accurately locked on the undulating workpiece surface. At the same time, the temperature sensor continuously monitors the temperature of the flat-field focusing lens. When the thermal expansion caused by the absorption of laser energy is detected, the system triggers the cooling mechanism for temperature compensation, and the Z-axis piezoelectric displacement table can be instructed by the FPGA controller to perform additional micro-displacement to offset the thermal lens effect. Based on the above closed-loop action process, it is ensured that the laser energy is applied to the hard film without damaging the ceramic substrate below.

[0046] Further, a fiber coupler is arranged between the dichroic mirror and the high-speed galvanometer, and the fiber coupler includes a transmission optical fiber and input and output couplers respectively arranged at two ends of the transmission optical fiber. The input coupler is arranged at the exit end of the dichroic mirror, and the output coupler is arranged at the entrance end of the high-speed galvanometer. It can be understood that the fiber transmission module is introduced in the laser light path of the present embodiment, and the core of the module is a fiber coupler, which is composed of a transmission optical fiber and input and output couplers precisely arranged at two ends of the optical fiber. In the physical layout, the input coupler is precisely positioned at the exit end of the combined beam of the dichroic mirror for receiving the ultraviolet pulsed laser beam or the infrared pulsed laser beam, and the output coupler is arranged in front of the laser entrance port of the high-speed galvanometer assembly.

[0047] In the present embodiment, the laser in free space propagation is converted into total reflection transmission in the optical fiber through the fiber coupler. In the working process, the ultraviolet pulsed laser beam or the infrared pulsed laser beam passing through the dichroic mirror first reaches the input coupler, is efficiently focused and coupled into the transmission optical fiber, and the laser beam completes flexible transmission from the laser source to the scanning head in the optical fiber, effectively isolating the influence of light source vibration on scanning accuracy. When the laser reaches the scanning head end, the output coupler re-directs the laser beam out of the optical fiber, restores it to free space light, and forms a uniform energy distribution and excellent mode spot, which is then collimated and directed to the high-speed galvanometer. The present embodiment not only solves the layout problem of rigid connection between the laser source and the scanning head, but also optimizes the beam quality through the mode selection of the optical fiber, providing an ideal light source basis for subsequent galvanometer scanning and lens focusing.

[0048] In some embodiments of the device for electrostatic chuck renovation, the vacuum cavity is equipped with a dust removal system, which includes a particle suction device arranged on one side of the workpiece table, a filter connected to the particle suction device and located outside the vacuum cavity, and a power supply.

[0049] It can be understood that the embodiment integrates two environmental auxiliary systems of dust removal and oxygen supply in the vacuum cavity. The internal components of the dust removal system include the particle suction device arranged beside the workpiece table, which is used to generate a local negative pressure airflow in the cavity. The external components of the dust removal system include the filter connected to the suction device through a vacuum pipeline and the power supply for supplying power, which constitute a complete particle collection and filtration circuit. The internal components of the oxygen supply system include the oxygen supply nozzle also arranged near the workpiece table, which is used to spray controllable flow of oxygen to the machining area. The external components of the oxygen supply system include the gas cabinet connected to the nozzle through a gas pipeline and the power supply for supplying power, which form a precise process gas supply circuit.

[0050] The embodiment realizes the active control of the local machining environment through the two environmental auxiliary systems of dust removal and oxygen supply. During the renovation operation, the environmental control system is started as needed. When the laser cleaning produces stripping and particles, the dust removal system immediately operates, the particle suction device continuously removes the airflow containing pollutants from the workpiece surface, and sends it to the filter outside the cavity through the pipeline for efficient interception. The purified gas can be exhausted or recycled, thereby effectively preventing the re-deposition of particulate matter and ensuring the cleanliness of the cleaned surface. When processing the carbon-containing hard film, the oxygen supply system is started, the oxygen in the gas cabinet is accurately controlled in flow, and then delivered to the laser action point by the oxygen supply nozzle. The oxygen reacts with the carbon element vaporized under the action of the laser to accelerate the decomposition of the carbon-containing hard film, generating carbon dioxide gas that is easy to volatilize, thereby significantly accelerating and optimizing the removal efficiency of the carbon-containing film.

[0051] In some specific examples of the device for electrostatic chuck renovation of the present application, the real-time monitoring mechanism comprises a high-speed CCD camera and / or a precision spectrometer. It can be understood that the real-time monitoring mechanism of the present example can be composed of two types of sensors, optical monitoring (high-speed CCD camera) and spectral analysis (precision spectrometer), which are installed in parallel or integrated in the vacuum chamber and accurately aligned with the laser processing area on the workpiece table. The high-speed CCD camera has microsecond-level exposure capability for capturing surface topography images of the processing area; and the precision spectrometer analyzes the chemical composition by collecting the plasma or reflected light spectrum signal excited by the processing point. Both the high-speed CCD camera and the precision spectrometer are connected to the central processing unit through a data acquisition card to upload the collected optical and spectral information in real time.

[0052] During the cleaning process, the real-time monitoring mechanism is simultaneously started for closed-loop quality detection. The high-speed CCD camera continuously captures surface images of the laser-affected area, and analyzes the removal degree of the film, the change of the surface topography, and whether there is abnormal sputtering in real time through image processing algorithms. At the same time, the precision spectrometer collects laser-induced breakdown spectroscopy or reflection spectroscopy in real time, and judges whether the chemical composition of the hard film has been removed by identifying the characteristic spectral line intensity change of specific elements (such as Ti, Si, C, N, etc.). The central processing unit compares these real-time data with the preset cleaning endpoint criteria, and once it is confirmed that the current area has been cleaned, it immediately instructs the motion system to move the laser beam to the next processing point, thereby realizing intelligent closed-loop control and ensuring uniform, thorough and lossless cleaning effect.

[0053] The present application also provides an electrostatic chuck renovation method, which is applicable to the device for electrostatic chuck renovation of any one of the above embodiments or examples. In some embodiments, referring to Fig. 3 The electrostatic chuck renovation method comprises the following steps S1-S6.

[0054] S1, generating a three-dimensional model using the electrostatic chuck to be renovated, and dividing the cleaning area and the non-cleaning area in the three-dimensional model.

[0055] This step is the basis for realizing accurate point cleaning. A three-dimensional scanning technology can be used to obtain an accurate digital model of the electrostatic chuck to be renovated. The model not only contains the planar area, but more importantly, it can accurately restore the complex three-dimensional topography of the surface grooves, steps, electrode areas, etc. Then, the cleaning area (the area where the old hard film needs to be removed) and the non-cleaning area (such as the exposed ceramic substrate or sensitive structures that need to be protected) are clearly divided in the three-dimensional model, to ensure the pertinence and safety of the cleaning operation from the source and avoid misprocessing.

[0056] S2, import the three-dimensional model into the central processor to calculate the cleaning path of the cleaning area, and divide the cleaning path into multiple cleaning points.

[0057] The three-dimensional model is imported into the central processor, and the central processor automatically calculates the optimal laser scanning cleaning path based on the model geometric information. The scanning cleaning path is not simply two-dimensional filling, but a three-dimensional space trajectory that adapts to the ups and downs of the curved surface. The path is discretized into countless continuous cleaning points, each of which corresponds to a specific laser focal point three-dimensional coordinate (X, Y, Z), providing a data basis for subsequent dynamic focusing scanning, ensuring that laser energy can uniformly and accurately cover all surfaces to be cleaned, whether they are located on a plane or a deep groove side wall.

[0058] S3, fix the electrostatic chuck to be renovated on the workpiece table in the vacuum cavity, and the surface of the electrostatic chuck has a hard film to be cleaned.

[0059] The electrostatic chuck is fixed on the workpiece table in the vacuum cavity (vacuumized by vacuum pump). The vacuum environment not only avoids the absorption and interference of air on laser energy, but also prevents particle pollution from cleaning the outside environment, and provides controllable atmospheric conditions for subsequent oxygen-assisted processes (for carbon-containing films).

[0060] S4, control the ultraviolet laser and the infrared laser to alternately generate pulsed laser beams by the central processor, act on the hard film of the first cleaning point of the electrostatic chuck, and monitor the cleaning state of the hard film of the first cleaning point by the real-time monitoring mechanism.

[0061] First, set the cleaning parameters, including laser power, pulse width, laser focal spot, scanning speed, fill spacing, defocusing amount, processing times, etc.; the ultraviolet laser power can be set to 1-50W, the pulse width is set to 3-20ns, the laser focal spot is 0.01-0.1mm, the scanning speed is 10-1000mm / s, the fill spacing is 10-30%, and the defocusing amount is -5mm to +5mm; the infrared laser power is set to 100-1000W, the pulse width is set to 50-200ns, the laser focal spot is 0.5-5mm, the scanning speed is 500-10000mm / s, the fill spacing is 20-50%, and the defocusing amount is -10mm to +10mm; the processing times is 2-10 times.

[0062] The central processor controls the ultraviolet laser and the infrared laser to alternately emit pulsed laser beams at nanosecond intervals (≤100 ns). The ultraviolet pulsed laser beam (such as 266 nm) first acts on the cleaning point, and the high photon energy (≥4 eV) directly destroys the chemical bonds (such as Ti-N, C-Si, and C-C) of the hard film (such as TiN, SiC, and DLC), so that the structure of the hard film is loosened. The infrared pulsed laser beam (such as 1064 nm) that follows is strongly absorbed by the film, and a rapid thermal effect is generated. Due to the difference in the thermal expansion coefficients of the film and the ceramic substrate below, a huge stress is generated at the interface, which causes the film that has been weakened by the ultraviolet light to be pried up from the substrate and peeled off.

[0063] When the laser cleaning produces peeling and particles, the dust removal system immediately operates, and the particle suction device continuously draws the airflow containing contaminants away from the surface of the workpiece and sends it to the filter outside the cavity through the pipeline for high-efficiency interception, thereby ensuring the cleanliness of the cleaned surface. When processing the carbon-containing hard film, the oxygen supply system is started, and the oxygen in the gas cabinet is directly delivered to the laser action point by the oxygen supply nozzle after being accurately controlled in flow. The oxygen reacts with the carbon elements vaporized under the action of the laser to accelerate the decomposition of the carbon-containing hard film and accelerate and optimize the removal efficiency of the carbon-containing film.

[0064] During the laser cleaning process, a high-speed CCD camera observes the surface morphology in real time to determine whether the film is physically removed, and a precision spectrometer monitors the intensity of the characteristic spectral signal (such as the Ti element spectrum or the C-C bond characteristic peak) in real time. When the signal disappears or weakens to a preset threshold, it indicates that the film at the cleaning point has been completely removed.

[0065] S5. After the real-time monitoring mechanism monitors that the hard film at the first cleaning point is cleaned, the laser generation and beam combination mechanism moves to the second cleaning point for laser cleaning based on the cleaning path calculated by the central processor, until all the cleaning points on the cleaning path are cleaned.

[0066] Based on the monitoring results of step S4, as soon as it is determined that the current point (the first cleaning point) is cleaned, the central processor immediately instructs the motion system (the motion stage, the galvanometer, and the Z-axis piezoelectric displacement stage) to accurately move the laser focal point to the next point (the second cleaning point). For complex curved surfaces, the Z-axis piezoelectric displacement stage will dynamically focus with nanometer precision according to the real-time feedback of the three-dimensional model and the confocal distance measurement, to ensure that the cleaning effect of each point is consistent. This process is repeated until the entire cleaning path is completed.

[0067] S6. After the laser cleaning is completed, an ultrasonic cleaning machine is used to shake and clean the residual particles on the surface of the electrostatic chuck, and the electrostatic chuck is recoated after the shaking and cleaning, thereby completing the renovation of the electrostatic chuck.

[0068] The laser cleaning mainly removes the thin film attached not firmly, but the surface can still remain a small amount of loose particles, and the step S6 uses the ultrasonic cleaning to perform the final fine cleaning, and the high-frequency oscillation wave is used to remove the residues. Finally, a new hard thin film is re-deposited on the clean and undamaged ceramic substrate, so that the adsorption force, wear resistance and insulation performance of the electrostatic chuck are restored to the state of the new product, and the whole renovation cycle is completed.

[0069] The device for electrostatic chuck renovation and the renovation method of the present application will be described below in combination with specific embodiments.

[0070] Embodiment one: an electrostatic chuck to be renovated, the size of the electrostatic chuck is 8-12 inch, the hard thin film on the surface is TiN, the TiN is distributed on the surface, channel and step position of the electrostatic chuck, the thickness of the TiN is 4-6 μm, the detection adsorption force is 15 Torr, the surface roughness is 0.082 μm, and the breakdown voltage is 2KV / mm. A three-dimensional model of the surface of the electrostatic chuck is constructed, and the three-dimensional model is input into the central processing unit. The electrostatic chuck is placed on the workpiece table in the vacuum cavity. The power of the ultraviolet laser is set to 20W, the pulse width is set to 10ns, the laser focal spot is 0.05mm, the scanning speed is 200mm / s, the filling interval is 10%, and the defocusing amount is-2mm; the power of the infrared laser is set to 400W, the pulse width is set to 80ns, the laser focal spot is 1mm, the scanning speed is 500mm / s, the filling interval is 30%, and the defocusing amount is +3mm; the processing number is 3 times; the TiN thin film on the surface of the electrostatic chuck is cleaned according to the cleaning path, the dust removal system is used to suck away the particles, the high-speed CCD camera is used to observe that the surface is clean, and the precision spectrometer is used to detect that the Ti-N bond characteristic peak disappears. The electrostatic chuck after laser cleaning is placed in the ultrasonic cleaning. After cleaning, the detection of 0.3 μm particles is 2.6 per / cm 2 . The detection adsorption force is 20 Torr (15 Torr before cleaning), the test surface roughness is 0.1 μm (0.082 μm before cleaning), and the breakdown voltage test is 1.98KV / mm.

[0071] Embodiment two: an electrostatic chuck to be refurbished, the size of the electrostatic chuck is 8-12 inch, the hard film on the surface is TaC, the TaC is distributed on the surface, channel and step position of the electrostatic chuck, the thickness of TiN is 1-2 μm, the adsorption force before cleaning is 4 Torr, the surface roughness is 0.21 μm, and the breakdown voltage is 3 KV / mm. A three-dimensional model of the surface of the electrostatic chuck is constructed, and the three-dimensional model is input into a central processing unit. The electrostatic chuck is placed on the workpiece table in the vacuum cavity. The power of the ultraviolet laser is set to 30 W, the pulse width is set to 30 ns, the laser focal spot is 0.02 mm, the scanning speed is 300 mm / s, the filling interval is 20%, and the defocusing amount is +1 mm; the power of the infrared laser is set to 600 W, the pulse width is set to 100 ns, the laser focal spot is 2 mm, the scanning speed is 600 mm / s, the filling interval is 40%, and the defocusing amount is +3 mm; the processing number is 5 times; the TaC film on the surface of the electrostatic chuck is cleaned according to the cleaning path, the dust removal system is used to suck away the particles, 10 SCCM of oxygen is introduced to accelerate the decomposition of TaC, a high-speed CCD camera is used to observe that the surface is clean, and a precision spectrometer is used to detect that the characteristic peak of C-Ta bond disappears. The electrostatic chuck after laser cleaning is placed in the ultrasonic cleaning for cleaning. After cleaning, 0.3 μm particles are detected as 2 / cm 2 , the adsorption force is 10 Torr (4 Torr before cleaning), the surface roughness is 0.24 μm (0.21 μm before cleaning), and the breakdown voltage test is 3.04 KV / mm.

[0072] Embodiment three: an electrostatic chuck to be refurbished, the size of the electrostatic chuck is 8-12 inch, the hard film on the surface is SiC, the SiC is distributed on the surface, channel and step position of the electrostatic chuck, the thickness of the SiC is 2-5 μm, the adsorption force before cleaning is 10 Torr, the surface roughness is 0.35 μm, and the breakdown voltage is 5 KV / mm. A three-dimensional model of the surface of the electrostatic chuck is constructed, and the three-dimensional model is input into a central processing unit. The electrostatic chuck is placed on the workpiece table in the vacuum chamber. The power of the ultraviolet laser is set to 35 W, the pulse width is set to 20 ns, the laser focal spot is 0.03 mm, the scanning speed is 500 mm / s, the filling interval is 25%, and the defocusing amount is +3 mm; the power of the infrared laser is set to 800 W, the pulse width is set to 200 ns, the laser focal spot is 1 mm, the scanning speed is 800 mm / s, the filling interval is 45%, and the defocusing amount is +4 mm; the processing number is 6 times; the SiC film on the surface of the electrostatic chuck is cleaned according to the cleaning path, the dust particles are sucked away using a dust removal system, 8 SCCM of oxygen is introduced to accelerate the decomposition of SiC, a high-speed CCD camera is used to observe that the surface is clean, a precision spectrometer is used to detect that the characteristic peak of C-Si bond disappears, and the electrostatic chuck after laser cleaning is placed in an ultrasonic cleaning tank for cleaning. After cleaning, 0.3 μm particles are detected to be 1.5 per cm 2 , the adsorption force is detected to be 14 Torr (8 Torr before cleaning), the surface roughness is tested to be 0.4 μm (0.35 μm before cleaning), and the breakdown voltage test is 4.97 KV / mm.

[0073] Embodiment four: an electrostatic chuck to be refurbished, the size of the electrostatic chuck is 8-12 inch, the hard film on the surface is DLC, the DLC is distributed on the surface, channel and step position of the electrostatic chuck, the thickness of the DLC is 3-5 μm, the adsorption force before cleaning is 12 Torr, the surface roughness is 0.05 μm, and the breakdown voltage is 3 KV / mm. A three-dimensional model of the surface of the electrostatic chuck is constructed, the cleaning area and the non-cleaning area are divided in the model, the three-dimensional model is input into the central processing unit, and the electrostatic chuck is placed on the workpiece table in the vacuum cavity. The cleaning parameters are set, the power of the ultraviolet laser is set to 40 W, the pulse width is set to 15 ns, the laser focal spot is 0.02 mm, the scanning speed is 350 mm / s, the filling interval is 15%, and the defocusing amount is +2 mm; the power of the infrared laser is set to 1000 W, the pulse width is set to 100 ns, the laser focal spot is 2 mm, the scanning speed is 800 mm / s, the filling interval is 25%, and the defocusing amount is-2 mm; the processing number is 8 times; the DLC film on the surface of the electrostatic chuck is cleaned according to the cleaning path, the dust removal system is used to suck away the particles, 5 SCCM of oxygen is introduced to accelerate the decomposition of the DLC, a high-speed CCD camera is used to observe that the surface is clean, a precision spectrometer is used to detect that the characteristic peak of C-C bond disappears, and the electrostatic chuck after laser cleaning is placed in the ultrasonic cleaning for cleaning. After cleaning, 0.3 μm particles are detected as 2 / cm 2 , the adsorption force is detected as 16 Torr (12 Torr before cleaning), the surface roughness is detected as 0.058 μm (0.05 μm before cleaning), and the breakdown voltage test is 3 KV / mm.

[0074] Example 5: A static chuck to be refurbished, the size of the static chuck is 8-12 inch, the surface of the static chuck is contaminated by metal contaminants, the metal contaminants are distributed on the surface, channel and step position of the static chuck, the thickness of the metal contaminants is 50-200 nm, the adsorption force before cleaning is 2 Torr, the surface roughness is 0.7 μm, and the breakdown voltage is 6 KV / mm. A three-dimensional model of the surface of the static chuck is constructed, and the three-dimensional model is input into a central processing unit. The static chuck is placed on the workpiece table of the vacuum chamber, and the cleaning parameters are set. The power of the ultraviolet laser is set to 15 W, the pulse width is set to 10 ns, the laser focal spot is 0.06 mm, the scanning speed is 200 mm / s, the filling interval is 30%, and the defocusing amount is +3 mm. The power of the infrared laser is set to 400 W, the pulse width is set to 300 ns, the laser focal spot is 1.5 mm, the scanning speed is 1000 mm / s, the filling interval is 35%, and the defocusing amount is +5 mm. The number of processing times is 10 times. The metal contaminants on the surface of the static chuck are cleaned according to the cleaning path, the dust removal system is used to suck away the particles, the high-speed CCD camera is used to observe that the surface is clean, the precision spectrometer is used to detect that the characteristic peak of C-H bond disappears, and the static chuck after laser cleaning is placed in the ultrasonic cleaning. After cleaning, 0.3 μm particles are detected as 1 / cm 2 , the adsorption force is 10 Torr (2 Torr before cleaning), the surface roughness is 0.75 μm (0.7 μm before cleaning), and the breakdown voltage test is 6 KV / mm.

[0075] Comparative Example 1: A static chuck to be refurbished, the size of the static chuck is 8-12 inch, the surface of the static chuck is contaminated by metal contaminants, the metal contaminants are distributed on the surface, channel and step position of the static chuck, the thickness of the metal contaminants is 4-6 μm, the adsorption force is 15 Torr, the surface roughness is 0.082 μm, the breakdown voltage is 2 KV / mm, the surface is polished and polished by a grinder and a polisher, and the polishing amount is 30 μm. The surface roughness is 0.05 μm, the adsorption force is 18 Torr, the breakdown voltage is 1.5 KV / mm, and the polishing causes the thickness of the static chuck substrate to be thinned, which significantly reduces the breakdown voltage.

[0076] Comparative Example 2: An electrostatic chuck to be refurbished, the size of the electrostatic chuck is 8-12 inch, the hard film on the surface is DLC, the DLC is distributed on the surface, channel and step position of the electrostatic chuck, the thickness of the DLC is 3-5 μm, the adsorption force is 12 Torr, the surface roughness is 0.05 μm, and the breakdown voltage is 3 KV / mm. The surface is cleaned with nitric acid solution, and the cleaning time is 3 h. The surface roughness is 0.1 μm, the adsorption force is 8 Torr, the breakdown voltage is 1.2 KV / mm, the electrostatic chuck substrate has micro defects, which causes the adsorption force and the breakdown voltage to decrease, and the surface roughness to increase, and the electrostatic chuck substrate has defects.

[0077] Through the comparative analysis of the above examples and comparative examples, compared with the traditional mechanical polishing and chemical corrosion method, the laser cleaning method of the present application can efficiently and completely remove the hard film on the surface of the electrostatic chuck. The present application can accurately, efficiently and completely remove various hard films and pollutants while perfectly maintaining the physical integrity and chemical stability of the ceramic substrate of the electrostatic chuck through the synergistic effect of the non-contact dual-wavelength laser. Not only does it avoid the irreversible thickness reduction and related performance degradation of the substrate caused by mechanical polishing (such as the breakdown voltage of Comparative Example 1 from 2 KV / mm to 1.5 KV / mm), but also eliminates the micro-erosion defects and performance degradation of the substrate caused by chemical corrosion (such as the adsorption force decrease and the breakdown voltage of Comparative Example 2 decrease to 1.2 KV / mm), thereby ensuring that the key performance of the refurbished device (such as the adsorption force and the breakdown voltage) can be restored or even better than before cleaning, and achieving truly lossless, efficient and reliable refurbishment effect.

[0078] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement to part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An apparatus for electrostatic chuck refurbishment, comprising: The application relates to a laser-based electrostatic chuck cleaning device. The device comprises a vacuum cavity, a workpiece table located in the vacuum cavity and used for carrying an electrostatic chuck to be renewed, a laser generation and combination mechanism located in the vacuum cavity and arranged opposite to the workpiece table, the laser generation and combination mechanism comprising an ultraviolet laser, an infrared laser and a dichroic mirror, the ultraviolet laser being used for emitting an ultraviolet pulsed laser beam towards the dichroic mirror, the infrared laser being used for emitting an infrared pulsed laser beam towards the dichroic mirror, and the dichroic mirror being used for transmitting the ultraviolet pulsed laser beam and reflecting the infrared pulsed laser beam so as to shoot the ultraviolet pulsed laser beam and the infrared pulsed laser beam towards the workpiece table along the same path, a real-time monitoring mechanism arranged on one side of the workpiece table and used for monitoring the cleaning state of the electrostatic chuck on the workpiece table, and a central processing unit in communication connection with the laser generation and combination mechanism and the real-time monitoring mechanism and used for cooperative control. The ultraviolet laser and the infrared laser are arranged on the two sides of the dichroic mirror, the ultraviolet laser emits the ultraviolet pulsed laser beam towards the dichroic mirror along a first direction, the infrared laser emits the infrared pulsed laser beam towards the dichroic mirror along a second direction, and the dichroic mirror is at a 45-degree angle with the first direction and the second direction respectively, so that the ultraviolet pulsed laser beam transmitted by the dichroic mirror and the infrared pulsed laser beam reflected by the dichroic mirror are both shot towards the workpiece table along the first direction. The ultraviolet laser and the infrared laser are both provided with a power supply, a laser source and a switch, the switches of the ultraviolet laser and the infrared laser are in communication connection with the central processing unit, the central processing unit controls the ultraviolet laser and the infrared laser to alternately emit pulsed laser beams, and the ultraviolet pulsed laser beam emitted by the ultraviolet laser is prior to the infrared pulsed laser beam emitted by the infrared laser. The laser generation and combination mechanism is arranged on a motion table, and a motion control system of the motion table is connected with the central processing unit. A high-speed galvanometer and a flat-field focusing lens are further arranged on the motion table, the high-speed galvanometer is located at an exit end of the dichroic mirror and is used for controlling the deflection of the pulsed laser beam, and the flat-field focusing lens is located at an exit end of the high-speed galvanometer and is used for correcting the focal field curvature aberration of the deflected pulsed laser beam.

2. The apparatus for electrostatic chuck refurbishment of claim 1, wherein, An optical fiber coupler is further arranged between the dichroic mirror and the high-speed galvanometer, the optical fiber coupler comprises a transmission optical fiber and an input coupler and an output coupler respectively arranged at two ends of the transmission optical fiber, the input coupler is arranged at the exit end of the dichroic mirror, and the output coupler is arranged at an entrance end of the high-speed galvanometer.

3. The apparatus for electrostatic chuck refurbishment of claim 1, wherein, The high-speed galvanometer is fixed on a Z-axis piezoelectric displacement table, a driver of the Z-axis piezoelectric displacement table and a motor driving board of the high-speed galvanometer are in communication connection with an FPGA controller, and the FPGA controller is in communication connection with the central processing unit.

4. The apparatus for electrostatic chuck refurbishment of claim 1, wherein, ​ 5. The apparatus for electrostatic chuck refurbishment of claim 4, wherein, ​ 6. The apparatus for electrostatic chuck refurbishment of claim 5, wherein, ​ 7. The apparatus for electrostatic chuck refurbishment of claim 5, wherein, ​ The flat-field focusing lens is provided with a detection mechanism and a cooling mechanism, the detection mechanism is integrated with a temperature sensor and a confocal distance sensor, the temperature sensor is connected to the cooling mechanism, used for monitoring the temperature of the flat-field focusing lens, and the flat-field focusing lens is temperature compensated by the cooling mechanism; the confocal distance sensor is connected to the Z-axis piezoelectric displacement table, used for monitoring the focal length of the pulsed laser beam on the electrostatic chuck and feedback controlling the Z-axis piezoelectric displacement table.

8. The apparatus for electrostatic chuck renovation according to any one of claims 1 to 7, characterized in that, The vacuum cavity is equipped with a dust removal system, the dust removal system includes a particle suction device, a filter and a power supply, the particle suction device is arranged on one side of the workpiece table, the filter is connected to the particle suction device and located outside the vacuum cavity; And / or, The vacuum cavity is equipped with an oxygen supply system, the oxygen supply system includes an oxygen supply nozzle, a gas cabinet and a power supply, the oxygen supply nozzle is arranged on one side of the workpiece table, and the gas cabinet is connected to the oxygen supply nozzle and located outside the vacuum cavity.

9. The apparatus for electrostatic chuck refurbishment of any of claims 1-7, wherein, The real-time monitoring mechanism includes a high-speed CCD camera and / or a precision spectrometer.

10. A method of refurbishing an electrostatic chuck, comprising: The device for electrostatic chuck renovation is suitable for the electrostatic chuck renovation method of any one of claims 1-9, the electrostatic chuck renovation method comprising: generating a three-dimensional model using the electrostatic chuck to be renovated, and dividing a cleaning area and a non-cleaning area in the three-dimensional model; importing the three-dimensional model into a central processing unit to calculate a cleaning path of the cleaning area, and dividing the cleaning path into a plurality of cleaning points; fixing the electrostatic chuck to be renovated on a workpiece table in a vacuum cavity, and the electrostatic chuck surface has a hard film to be cleaned; controlling the ultraviolet laser and the infrared laser to alternately generate pulsed laser beams by the central processing unit, and acting on the hard film of the first cleaning point of the electrostatic chuck, and monitoring the cleaning state of the hard film of the first cleaning point by the real-time monitoring mechanism; after the real-time monitoring mechanism monitors that the hard film of the first cleaning point is cleaned, controlling the laser generation and beam combination mechanism to move to the second cleaning point for laser cleaning based on the cleaning path calculated by the central processing unit, until cleaning all cleaning points on the cleaning path is completed; after laser cleaning is completed, using an ultrasonic cleaner to shake and clean the residual particles on the surface of the electrostatic chuck, and re-coating the surface of the electrostatic chuck after the shaking and cleaning, to complete the electrostatic chuck renovation.

Images