Dynamic bearing device, vacuum drying equipment and vacuum drying method

Abstract

The invention relates to a dynamic bearing device, vacuum drying equipment and a vacuum drying method, and the dynamic bearing device comprises a bearing plate which is uniformly provided with a plurality of through holes; the ejector pin assembly comprises an ejector pin frame and a plurality of ejector rods, the multiple ejector rods are arranged on the bearing plate in a penetrating mode through the multiple through holes, and movable intervals are reserved between the circumferential side faces of the ejector rods and the hole walls of the through holes; the dynamic assembly comprises a lifting driving piece and a horizontal driving piece, and the lifting driving piece drives the ejector pin assembly to do lifting motion relative to the bearing plate; the horizontal driving piece drives the ejector pin assembly to move in a horizontal plane relative to the bearing plate; the ejector rod is suitable for extending to the position above the bearing plate under the action of the lifting driving piece, and the ejector rod is suitable for moving in the horizontal direction relative to the through hole under the action of the horizontal driving piece. The position of the substrate relative to the bearing plate is changed through driving of the ejector pin assembly, so that the situation that the local position of the substrate is located at the through hole for a long time is avoided, the substrate is heated more uniformly, and the film forming quality is guaranteed.

Description

Technical Field

[0001] This application relates to the field of vacuum drying technology, and in particular to a dynamic support device, vacuum drying equipment, and vacuum drying method. Background Technology

[0002] Inkjet printing is finding increasingly widespread applications in several emerging fields, such as new displays, RFID, thin-film solar cells, wearable flexible devices, PCBs, and smart skins. Inkjet printing technology offers advantages such as high material utilization, no need for photomasks, low equipment cost, and ease of large-size manufacturing. It enables low-cost, large-area printing of new display devices such as OLEDs and QLEDs, making it one of the most promising processes for fabricating new display devices.

[0003] Among the various factors affecting the efficiency of OLED devices, the uniformity of film formation of each functional layer material is a very important consideration. Generally, vacuum drying equipment is used to dry the substrate to form a film.

[0004] In related technologies, the substrate is placed in a sealed chamber and dried by evacuating the chamber. Specifically, a support plate and a ejector assembly are arranged inside the chamber. Multiple ejector pins of the ejector assembly pass through the support plate from bottom to top. The ejector pins rise relative to the support plate to receive the substrate, and then descend relative to the support plate to place the substrate on the support plate, completing the loading process. The pump can then be activated to perform vacuum drying on the substrate. During vacuum drying, the substrate is supported by the support plate, and heating the support plate accelerates the drying process.

[0005] Due to the requirements for substrate loading and unloading, through holes need to be made on the carrier plate for ejector pins to pass through. Generally, the size of the through hole is larger than that of the ejector pin to allow for the lifting and lowering of the ejector pin. During the substrate drying process, the substrate is located in the part with the through hole. Due to the size difference between the through hole and the ejector pin, an annular gap is left between the through hole and the ejector pin.

[0006] The presence of the annular seam causes two main problems. First, the temperature at the seam is inconsistent with the temperature of the support platform, easily leading to localized temperature inconsistencies on the substrate. Second, when heat from the support platform is transferred to the ejector pins, the seam causes the heat to be transferred through thermal radiation, resulting in a significant difference in the heating rate between the ejector pins and the support platform. Furthermore, the temperature at the support surface of the ejector pins is difficult to maintain, further contributing to localized temperature inconsistencies on the substrate. Because of these localized temperature inconsistencies during vacuum drying, the substrate surface film is highly susceptible to mura defects after drying, negatively impacting film quality. Summary of the Invention

[0007] This application provides a dynamic support device, a vacuum drying equipment, and a vacuum drying method to solve the technical problem in the related art where the temperature uniformity of the substrate is affected by the through holes on the ejector pin and the support plate, which in turn has an adverse effect on the film formation quality.

[0008] Firstly, a dynamic load-bearing device is provided, comprising: A support plate, which is used to support a substrate, and a plurality of through holes are uniformly formed on the support plate; The ejector assembly includes an ejector frame and multiple ejector rods, each ejector rod being connected to the ejector frame. The multiple ejector rods are respectively inserted into the support plate through multiple through holes, and a movable gap is left between the circumferential side of the ejector rod and the hole wall of the through hole. A dynamic component, comprising a lifting drive and a horizontal drive, wherein the lifting drive is driven to be connected to the support plate or the ejector pin assembly to drive the ejector pin assembly to move up and down relative to the support plate; and the horizontal drive is driven to be connected to the support plate or the ejector pin assembly to drive the ejector pin assembly to move in a horizontal plane relative to the support plate. The top rod is adapted to extend above the bearing plate under the action of the lifting drive, and the top rod is adapted to move horizontally relative to the through hole under the action of the horizontal drive.

[0009] In some embodiments, the horizontal drive includes at least two linear drive members, which are adapted to drive the support plate to move in two directions on the horizontal plane, respectively; or, the two linear drive members are adapted to drive the ejector pin assembly to move in two directions on the horizontal plane, respectively.

[0010] In some embodiments, the horizontal drive member drives the carrier plate or the ejector pin assembly to move in two mutually perpendicular directions on a horizontal plane.

[0011] In some embodiments, the push rod includes: A rod, which is used to support a substrate; A connecting plate is provided, the bottom end of the rod is connected to the connecting plate, and a through mounting hole is provided on the connecting plate; the center line of the mounting hole is arranged separately from the center line of the rod. A locking bolt passes through the mounting hole and is threaded to the ejector pin holder, wherein the diameter of the locking bolt's shank is smaller than the diameter of the mounting hole.

[0012] In some embodiments, the top rod further includes a support head, which is detachably mounted on the top of the rod and is used to contact the substrate.

[0013] In some embodiments, the top of the rod is a threaded section, the support head is sleeved on the rod, and the support head is threadedly connected to the rod; The height of the support head relative to the rod is adjusted by rotating the support head relative to the rod.

[0014] In some embodiments, the support surface of the support head is provided with a thermally conductive flexible layer.

[0015] The beneficial effects of the technical solution provided in this application include: This application provides a dynamic support device. During vacuum drying of a substrate to form a film on its surface, a push pin assembly rises relative to a support plate to lift the substrate and move it horizontally relative to the support plate. The substrate is then placed back on the support plate, and the push pin returns to its original position. By periodically changing the substrate's position on the support plate, uneven heating of a particular location on the substrate due to prolonged contact with a through-hole in the support plate is avoided. The changing position of the substrate ensures that different locations on the substrate contact the through-hole, dynamically maintaining uniform heating and preventing defects such as localized MURA (mullion-reducing malformation) after film formation, thus improving the film quality on the substrate surface.

[0016] Because there is a movable gap between the push rod and the wall of the through hole to support the movement of the push rod relative to the support plate, the position of the substrate can be changed in the horizontal direction. To ensure that the substrate is completely moved away from the through hole position when it is currently in that position, the push rod can be used to move the substrate position multiple times each time the substrate position is changed. Thus, the substrate position transfer is completed using a small range of stroke of the push rod. This ensures that different positions of the substrate are at the through hole of the support plate, ensuring uniform dynamic heating of the substrate and improving the film formation quality.

[0017] After the push rod transfers the substrate, it returns to its initial position. As a result, the push rod contacts different positions on the substrate, which avoids the push rod contacting the same position on the substrate for a long time. This makes it easier to ensure uniform dynamic heating of the substrate and improves the film formation quality.

[0018] Secondly, a vacuum drying apparatus is provided, including the dynamic support device as described above.

[0019] Another embodiment of this application provides a vacuum drying device. Since the vacuum drying device includes the above-mentioned dynamic support device, the beneficial effects of the vacuum drying device are the same as those of the above-mentioned dynamic support device, and will not be repeated here.

[0020] Thirdly, a vacuum drying method is provided, based on the dynamic support device described above, and / or the vacuum drying equipment described above, comprising the following steps: The ejector pin assembly is raised relative to the carrier plate to the receiving height, and the substrate is placed onto the ejector pin assembly by a robot. The ejector pin assembly descends relative to the carrier plate and is supported by the carrier plate on the substrate; The substrate is subjected to vacuum drying. At each preset repositioning time interval, the placement position of the substrate on the carrier plate is changed using the ejector pin assembly; Complete the vacuum drying process of the substrate.

[0021] In some embodiments, the method of changing the placement position of the substrate on the carrier plate using the ejector pin assembly includes: The ejector pin assembly is raised relative to the carrier plate to the transposition height to lift the substrate; The ejector pin assembly moves a horizontal distance relative to the carrier plate, thereby causing the substrate to move relative to the carrier plate in the horizontal plane. The ejector pin assembly is lowered relative to the carrier plate, and the substrate is placed on the carrier plate to complete a single substrate repositioning operation. Each change of the substrate's position relative to the carrier plate involves multiple substrate repositioning operations.

[0022] Another embodiment of this application provides a vacuum drying method. Since this vacuum drying method is based on the above-mentioned dynamic support device or vacuum drying equipment, the beneficial effects of this vacuum drying method are the same as those of the above-mentioned dynamic support device or vacuum drying equipment, and will not be repeated here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the dynamic bearing device provided in the embodiments of this application; Figure 2 A schematic diagram of another state of the dynamic bearing device provided in the embodiments of this application; Figure 3 A front view of the dynamic bearing device provided in the embodiments of this application; Figure 4 This is a schematic diagram of the movement process of the ejector pin assembly provided in the embodiments of this application; Figure 5 A schematic diagram of the ejector pin assembly and dynamic assembly provided in the embodiments of this application; Figure 6 A schematic diagram of the push rod provided in the embodiments of this application; Figure 7 This is a schematic diagram of the connection between the top rod and the top rod frame provided in an embodiment of this application.

[0025] In the diagram: 1. Support plate; 1a. Through hole; 2. Ejector pin assembly; 21. Ejector pin bracket; 21a. Threaded hole; 22. Ejector rod; 221. Rod body; 222. Connecting plate; 222a. Mounting hole; 223. Locking bolt; 224. Support head; 3. Dynamic component; 31. Lifting drive component; 311. Base; 312. Lifting power component; 313. Guide rod; 32. Horizontal drive component; 321. First drive assembly; 3211. First mounting bracket; 3212. First linear drive component; 322. Second drive assembly; 3221. Second mounting bracket; 3222. Second linear drive component. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] This application provides a dynamic support device, vacuum drying equipment, and vacuum drying method. During the vacuum drying process of the substrate, the position of the substrate relative to the support plate is changed by a pin assembly, thereby preventing local areas of the substrate from being in the through-hole for a long time, resulting in more uniform heating of the substrate and ensuring film quality. This application solves the technical problem in related technologies where the through-holes on the pins and support plate affect the temperature uniformity of the substrate, thus adversely affecting the film quality.

[0028] Reference Figures 1-3 A dynamic support device includes a support plate 1, a pin assembly 2, and a dynamic component 3. The pin assembly 2 is inserted into the support plate 1 from bottom to top, and the dynamic component 3 is used to move the pin assembly 2 relative to the support plate 1 in the vertical direction and in the horizontal plane. This allows the position of the substrate on the support plate 1 to be changed using the pin assembly 2.

[0029] Reference Figures 1-3 The support plate 1 is used to support the substrate, and multiple through holes 1a are uniformly opened on the support plate 1.

[0030] Reference Figures 1-3The ejector pin assembly 2 includes an ejector pin frame 21 and multiple ejector pins 22. The ejector pin frame 21 is located below the support plate 1, and the multiple ejector pins 22 are all connected to the ejector pin frame 21. The multiple ejector pins 22 are respectively inserted into the support plate 1 through multiple through holes 1a, and there is a movable gap between the circumferential side of the ejector pin 22 and the hole wall of the through hole 1a.

[0031] Reference Figures 1-3 The dynamic component 3 is used to drive the support plate 1 and / or the ejector pin assembly 2 to move in the vertical direction and in the horizontal plane, thereby realizing the vertical movement of the ejector pin assembly 2 relative to the support plate 1 and the horizontal movement.

[0032] Therefore, during the vacuum drying process of the substrate to form a film on the substrate surface, the ejector pin assembly 2 rises relative to the support plate 1 to lift the substrate and drive the substrate to move horizontally relative to the support plate 1. The substrate is then placed back on the support plate 1, and the ejector pin 22 returns to its original position. By periodically changing the placement position of the substrate on the support plate 1, uneven heating of a certain position on the substrate due to prolonged contact with the through-hole 1a of the support plate 1 is avoided. By changing the position of the substrate, different positions of the substrate contact the through-hole 1a, dynamically maintaining uniform heating of the substrate and preventing defects such as localized MURA after film formation on the substrate surface, thus improving the film formation quality on the substrate surface.

[0033] Reference Figure 3 and Figure 4 Because there is a movable gap between the push rod 22 and the wall of the through hole 1a, the push rod 22 can move relative to the support plate 1, thereby changing the position of the substrate in the horizontal direction. To ensure that the substrate is completely moved away from the position of the through hole 1a, the push rod 22 can be used to move the substrate position multiple times each time the substrate position is changed. Thus, the position transfer of the substrate is completed by using the small range of stroke of the push rod 22. This ensures that different positions of the substrate are at the through hole 1a of the support plate 1, ensuring uniform dynamic heating of the substrate and improving the film formation quality.

[0034] Reference Figure 3 and Figure 4 After the substrate is transferred, the push rod 22 returns to its initial position. Thus, the push rod 22 contacts different positions of the substrate, which avoids the push rod 22 contacting the same position of the substrate for a long time. This makes it easier to ensure uniform dynamic heating of the substrate and improves the film formation quality.

[0035] Reference Figure 3 and Figure 4 Specifically, the push rod 22 is cylindrical, and the through hole 1a is a circular hole. The diameter of the push rod 22 is smaller than the diameter of the through hole 1a, so as to leave a movable gap between the push rod 22 and the hole wall of the through hole 1a.

[0036] Even though the movement distance of the push rod 22 within the through hole 1a is limited each time, a large movement of the substrate can be achieved through multiple movements to ensure that the portion of the substrate located at the through hole 1a is moved away.

[0037] Reference Figure 4 In this embodiment, during the vacuum drying process, when the substrate is dynamically moved, the ejector assembly 2 first rises to the repositioning height to lift the substrate, causing it to detach from the support plate 1. Then, by moving the ejector assembly 2 in the horizontal plane, the substrate moves relative to the support plate 1, causing it to move a repositioning distance in the horizontal plane. Next, the ejector assembly 2 descends, placing the substrate onto the support plate 1, and then returns to its original position. The returned ejector assembly 2 then lifts the substrate again, moving it another repositioning distance in the horizontal plane. This repeated operation ensures that the portion of the substrate originally located at the through-hole 1a is moved away, achieving dynamic adjustment of the substrate's position and thus ensuring the temperature uniformity of the substrate.

[0038] The length of the displacement distance is determined by the travel of the push rod 22 relative to the through hole 1a in any direction in the horizontal plane.

[0039] In addition, in this embodiment, multiple target positions where the substrate can be moved are predetermined, and the substrate is moved between multiple target positions by the ejector pin assembly 2 to ensure the uniformity of heating of the substrate.

[0040] Reference Figure 2 and Figure 5 Specifically, the dynamic component 3 includes a lifting drive 31 and a horizontal drive 32. The lifting drive 31 is driven to the support plate 1 or the ejector pin assembly 2 to drive the ejector pin assembly 2 to move up and down relative to the support plate 1. The horizontal drive 32 is driven to the support plate 1 or the ejector pin assembly 2 to drive the ejector pin assembly 2 to move in a horizontal plane relative to the support plate 1.

[0041] Reference Figure 2 and Figure 5 In this embodiment, both the horizontal drive component 32 and the lifting drive component 31 are driven connected to the ejector pin assembly 2. In other embodiments, one of the horizontal drive component 32 and the lifting drive component 31 is driven connected to the ejector pin assembly 2, and the other is driven connected to the support plate 1. In other embodiments, both the horizontal drive component 32 and the lifting drive component 31 are driven connected to the support plate 1. All of these embodiments enable the ejector pin assembly 2 to move up and down relative to the support plate 1 and to move within a horizontal plane.

[0042] Furthermore, the horizontal drive member 32 includes at least two linear drive members, which are adapted to drive the support plate 1 to move in two directions on the horizontal plane, respectively, or the two linear drive members are adapted to drive the ejector pin assembly 2 to move in two directions on the horizontal plane, respectively. In this embodiment, both linear drive members are driven by the ejector pin assembly 2.

[0043] This configuration allows for more flexible repositioning of the substrate by enabling the ejector pin assembly 2 to move relative to the carrier plate 1 in two directions on the horizontal plane. It avoids multiple movements of the substrate in one direction, ensuring the carrier plate 1 provides overall support to the substrate. This also facilitates the expansion of more substrate repositioning positions and ensures uniform heating of the substrate.

[0044] Preferably, the horizontal drive member 32 drives the support plate 1 or the ejector pin assembly 2 to move in two mutually perpendicular directions on the horizontal plane. Furthermore, the two driving directions of the horizontal drive member 32 are respectively arranged along the length and width directions of the support plate 1.

[0045] This configuration ensures that the substrate switches positions on the carrier plate 1 and that the carrier plate 1 provides basic and comprehensive support, thereby guaranteeing the quality of the film formation.

[0046] Reference Figure 2 and Figure 5 Specifically, the horizontal drive component 32 includes a first drive assembly 321 and a second drive assembly 322. The first drive assembly 321 includes a first mounting bracket 3211 and a first linear drive component 3212. The ejector pin holder 21 of the ejector pin assembly 2 is slidably arranged on the first mounting bracket 3211 via a slide rail assembly. The first linear drive component 3212 is mounted on the first mounting bracket 3211 and is drivenly connected to the ejector pin assembly 2 to drive the ejector pin assembly 2 to slide on the first mounting bracket 3211.

[0047] Reference Figure 2 and Figure 5 The second drive assembly 322 includes a second mounting bracket 3221 and a second linear drive member 3222. The first mounting bracket 3211 is slidably arranged on the second mounting bracket 3221 via a slide rail assembly. The second linear drive member 3222 is mounted on the second mounting bracket 3221 and is drivenly connected to the first mounting bracket 3211 to drive the first mounting bracket 3211 and the ejector pin assembly 2 to move synchronously in a linear fashion. The driving directions of the first linear drive member 3212 and the second linear drive member 3222 are arranged at an angle. In this embodiment, the driving directions of the first linear drive member 3212 and the second linear drive member 3222 are respectively set along the length and width directions of the support plate 1.

[0048] With this configuration, the pin assembly 2 can move in multiple directions through the first linear drive 3212 and the second linear drive 3222.

[0049] In this embodiment, both the first linear drive unit 3212 and the second linear drive unit 3222 include a linear motor or a lead screw mechanism to ensure motion accuracy.

[0050] Among them, the lifting drive component 31 is used to drive the horizontal drive component 32 to move up and down, thereby driving the ejector pin assembly 2 to move up and down.

[0051] Reference Figure 2 and Figure 5 Specifically, the lifting drive component 31 includes a base 311, a lifting power component 312, and multiple guide rods 313. The base 311 is located below the horizontal drive component 32. The lifting power component 312 is mounted on the base 311 and is drivenly connected to the second mounting bracket 3221 so as to drive the horizontal drive component 32 and the ejector pin assembly 2 to move up and down by driving the second mounting bracket 3221 to move up and down.

[0052] Multiple guide rods 313 are installed on the base 311 and pass through the second mounting bracket 3221 to guide the second mounting bracket 3221 in raising and lowering.

[0053] Reference Figure 2 and Figure 5 Specifically, both the first mounting bracket 3211 and the ejector pin holder 21 allow the guide rod 313 to pass through, and the guide rod 313 does not contact either the first mounting bracket 3211 or the ejector pin holder 21. Furthermore, the guide rod 313 does not contact the first mounting bracket 3211 or the ejector pin holder 21 during horizontal movement. It should be noted that because the diameter of the through hole 1a in the support plate 1 is small, the travel distance of the ejector pin assembly 2 in all directions is small. Therefore, it is easy to leave space on the first mounting bracket 3211 and the ejector pin holder 21 for the guide rod 313 to pass through, without interfering with the horizontal movement of the first mounting bracket 3211 and the ejector pin holder 21.

[0054] Specifically, the lifting power component 312 includes a lead screw mechanism, which passes through and is driven by the second mounting bracket 3221 to drive the second mounting bracket 3221, the first mounting bracket 3211, and the ejector pin assembly 2 to move up and down. Similar to the guide rod 313, both the first mounting bracket 3211 and the ejector pin assembly 21 have space for the lead screw mechanism to pass through, so as to avoid the lead screw mechanism interfering with the horizontal movement of the first mounting bracket 3211 and the ejector pin assembly 2.

[0055] Reference Figure 3 , Figure 6 and Figure 7 Specifically, the push rod 22 includes a rod body 221, a connecting plate 222 and a locking bolt 223. The connecting plate 222 is fixed to the push pin frame 21 by the locking bolt 223. The rod body 221 is connected to the push pin frame 21 through the connecting plate 222. The rod body 221 is used to support the base plate.

[0056] Reference Figure 3 , Figure 6 and Figure 7Specifically, the rod 221 is fixed to the connecting plate 222. The connecting plate 222 has a through mounting hole 222a, and the ejector pin holder 21 has multiple threaded holes 21a for mounting the ejector rod 22. The locking bolt 223 passes through the mounting hole 222a and is threadedly connected to the ejector pin holder 21 via the threaded holes 21a, thus connecting the connecting plate 222 and the ejector pin holder 21. It can be understood that tightening the locking bolt 223 causes its head to press against the connecting plate 222, and the locking bolt 223 engages with the threaded connection of the ejector pin holder 21, thereby fixing the connecting plate 222 to the ejector pin holder 21.

[0057] Reference Figure 3 , Figure 6 and Figure 7 Furthermore, since the center line of the mounting hole 222a is arranged separately from the center line of the rod 221, the position of the rod 221 relative to the ejector pin 21 can be changed by rotating the connecting plate 222 with the center line of the mounting hole 222a as the axis, thus achieving fine adjustment of the position of the rod 221.

[0058] Furthermore, the diameter of the rod 221 of the locking bolt 223 is smaller than the diameter of the mounting hole 222a. The gap between the locking bolt 223 and the hole wall of the mounting hole 222a allows for fine-tuning of the position of the connecting plate 222 relative to the ejector pin holder 21, thereby also allowing for fine-tuning of the position of the rod 221 relative to the ejector pin holder 21.

[0059] By combining the rotation and linear motion of the connecting plate 222 relative to the ejector pin holder 21 to fine-tune the position of the rod 221 relative to the ejector pin holder 21, the flexibility and range of position adjustment of the rod 221 are enriched.

[0060] With this configuration, since multiple push rods 22 all need to pass through their corresponding through holes 1a on the support plate 1, it is necessary to ensure that the relative positions of each push rod 22 and its corresponding through hole 1a are consistent. In this embodiment, when installing the push rod 22, it is necessary to ensure that the rod body 221 of the push rod 22 is at the center of the through hole 1a. By ensuring the position of each push rod 22, when multiple push rods 22 move synchronously in the horizontal plane, the movement stroke of each push rod 22 is ensured to be consistent, and the possibility of the push rod 22 being damaged during normal movement is not easily present. This ensures that the push pin assembly 2 can move relative to the support plate 1 in the horizontal plane to support the repositioning operation of the substrate.

[0061] It should be noted that the through hole 1a on the support plate 1 is small in size, the linear motion stroke of the ejector pin assembly 2 in the horizontal plane is small, and the position difference of different ejector pins 22 relative to their corresponding through holes 1a is too large, which not only affects the motion stroke of the ejector pin assembly 2, but also may damage some of the ejector pins 22.

[0062] Therefore, in this embodiment, the rod 221 is finely adjusted by connecting the connecting plate 222 and the ejector pin holder 21, so as to meet the adjustment requirements of the position of the ejector pin 22 and ensure that the ejector pin assembly 2 can move normally in the horizontal plane, thereby realizing the repositioning of the substrate.

[0063] Reference Figure 6 The top rod 22 also includes a support head 224, which is detachably mounted on the top of the rod body 221 and is used to contact the substrate.

[0064] This configuration, which uses the support head 224 to replace the rod 221 in contact with the substrate, avoids excessive wear of the rod 221 during actual mass production and facilitates ensuring support for the substrate by replacing the support head 224.

[0065] Furthermore, the support head 224 is made of silicon carbide. This ensures the rigidity of the support head 224 and improves its thermal conductivity, making it easier for the temperature of the support stage to be transferred to the support head 224. This reduces the temperature difference between the substrate at the support head 224 and the support plate 1, thereby preventing uneven heating of the substrate during substrate repositioning and ensuring the film formation quality on the substrate surface.

[0066] Furthermore, the support surface of the support head 224 is provided with a thermally conductive flexible layer. The support head 224 uses the thermally conductive flexible layer to contact the substrate, thereby flexibly contacting the substrate and ensuring heat transfer between the support head 224 and the substrate, thus ensuring the temperature of the substrate at the support head 224.

[0067] This configuration, with its flexible support substrate, ensures that each top rod 22 supports the substrate and reduces the installation accuracy of the support head 224.

[0068] Specifically, the thermally conductive flexible layer is made of ceramic powder silicone.

[0069] Furthermore, the top of the rod 221 is a threaded section, and the support head 224 is sleeved on the rod 221, and the support head 224 is threadedly connected to the rod 221.

[0070] This configuration allows for adjustment of the height of the support head 224 relative to the rod 221 by rotating the support head 224 relative to the rod 221. This facilitates the installation and height adjustment of the support head 224, and makes it easy to adjust all support heads 224 to the same height.

[0071] Preferably, the mating thread between the rod 221 and the support head 224 is a self-locking thread. This is to prevent the height of the support head 224 relative to the rod 221 from changing when the ejector assembly 2 moves.

[0072] This application provides a dynamic support device. When a substrate is vacuum dried to form a film on its surface, the ejector pin assembly 2 rises relative to the support plate 1 to lift the substrate and move it horizontally relative to the support plate 1. The substrate is then placed back on the support plate 1, and the ejector pin 22 returns to its original position. By periodically changing the substrate's position on the support plate 1, uneven heating of a certain location on the substrate due to prolonged contact with the through-hole 1a of the support plate 1 is avoided. The changing position of the substrate ensures that different locations on the substrate contact the through-hole 1a, dynamically maintaining uniform heating of the substrate and preventing defects such as localized MURA (mullion irradiation) after film formation on the substrate surface, thus improving the film quality.

[0073] Because there is a movable gap between the push rod 22 and the wall of the through hole 1a, the push rod 22 can move relative to the support plate 1, thereby changing the position of the substrate in the horizontal direction. To ensure that the substrate is completely moved away from the position of the through hole 1a, the push rod 22 can be used to move the substrate position multiple times each time the substrate position is changed. Thus, the position transfer of the substrate is completed by using the small range of stroke of the push rod 22. This ensures that different positions of the substrate are at the through hole 1a of the support plate 1, ensuring uniform dynamic heating of the substrate and improving the film formation quality.

[0074] After the substrate is transferred, the push rod 22 returns to its initial position. Thus, the push rod 22 contacts different positions of the substrate, which avoids the push rod 22 contacting the same position of the substrate for a long time. This makes it easier to ensure uniform dynamic heating of the substrate and improves the film formation quality.

[0075] Another embodiment of this application provides a vacuum drying apparatus, including the dynamic support device described above.

[0076] Another embodiment of this application provides a vacuum drying device. Since the vacuum drying device includes the above-mentioned dynamic support device, the beneficial effects of the vacuum drying device are the same as those of the above-mentioned dynamic support device, and will not be repeated here.

[0077] Another embodiment of this application provides a vacuum drying method, based on the dynamic support device described above, and / or the vacuum drying equipment described above, comprising the following steps: The ejector pin assembly 2 is raised relative to the carrier plate 1 to the receiving height, and the substrate is placed onto the ejector pin assembly 2 by a robot.

[0078] The ejector pin assembly 2 descends relative to the carrier plate 1 and is supported by the carrier plate 1.

[0079] The substrate is subjected to vacuum drying.

[0080] At each preset repositioning time interval, the pin assembly 2 is used to change the placement position of the substrate on the carrier plate 1.

[0081] Complete the vacuum drying process of the substrate.

[0082] Specifically, changing the placement position of the substrate on the carrier plate 1 using the ejector pin assembly 2 includes: The ejector pin assembly 2 is raised relative to the carrier plate 1 to the shifting height to lift the substrate.

[0083] The ejector pin assembly 2 is moved and repositioned relative to the carrier plate 1 in the horizontal direction by a certain distance, so as to drive the substrate to move relative to the carrier plate 1 in the horizontal plane.

[0084] The ejector pin assembly 2 is lowered relative to the carrier plate 1, and the substrate is placed on the carrier plate 1 to complete a single substrate repositioning operation.

[0085] Each change of the substrate's position relative to the carrier plate 1 involves multiple substrate repositioning operations.

[0086] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0087] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0088] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A dynamic load-bearing device, characterized in that, It includes: A support plate, which is used to support a substrate, and a plurality of through holes are uniformly formed on the support plate; The ejector assembly includes an ejector frame and multiple ejector rods, each ejector rod being connected to the ejector frame. The multiple ejector rods are respectively inserted into the support plate through multiple through holes, and a movable gap is left between the circumferential side of the ejector rod and the hole wall of the through hole. A dynamic component, comprising a lifting drive and a horizontal drive, wherein the lifting drive is driven to be connected to the support plate or the ejector pin assembly to drive the ejector pin assembly to move up and down relative to the support plate; The horizontal drive component is driven to connect with the support plate or the ejector pin assembly to drive the ejector pin assembly to move in the horizontal plane relative to the support plate; The top rod is adapted to extend above the bearing plate under the action of the lifting drive, and the top rod is adapted to move horizontally relative to the through hole under the action of the horizontal drive.

2. The dynamic bearing device according to claim 1, characterized in that, The horizontal drive includes at least two linear drive members, which are adapted to drive the support plate to move in two directions on the horizontal plane, or the two linear drive members are adapted to drive the ejector pin assembly to move in two directions on the horizontal plane.

3. The dynamic bearing device according to claim 1 or 2, characterized in that, The horizontal drive unit drives the carrier plate or the ejector pin assembly to move in two mutually perpendicular directions on the horizontal plane.

4. The dynamic bearing device according to claim 1, characterized in that, The push rod includes: A rod, which is used to support a substrate; A connecting plate is provided, the bottom end of the rod is connected to the connecting plate, and a through mounting hole is provided on the connecting plate; the center line of the mounting hole is arranged separately from the center line of the rod. A locking bolt passes through the mounting hole and is threaded to the ejector pin holder, wherein the diameter of the locking bolt's shank is smaller than the diameter of the mounting hole.

5. The dynamic bearing device according to claim 4, characterized in that, The top rod also includes a support head, which is detachably mounted on the top of the rod and is used to contact the substrate.

6. The dynamic bearing device according to claim 5, characterized in that, The top of the rod is a threaded section, the support head is sleeved on the rod, and the support head is threadedly connected to the rod. The height of the support head relative to the rod is adjusted by rotating the support head relative to the rod.

7. The dynamic bearing device according to claim 5, characterized in that, The support surface of the support head is provided with a thermally conductive flexible layer.

8. A vacuum drying apparatus, characterized in that, Includes the dynamic load-bearing device as described in any one of claims 1 to 7.

9. A vacuum drying method, based on the dynamic support device as described in any one of claims 1 to 7, and / or the vacuum drying apparatus as described in claim 8, characterized in that, Includes the following steps: The ejector pin assembly is raised relative to the carrier plate to the receiving height, and the substrate is placed onto the ejector pin assembly by a robot. The ejector pin assembly descends relative to the carrier plate and is supported by the carrier plate on the substrate; The substrate is subjected to vacuum drying. At each preset repositioning time interval, the placement position of the substrate on the carrier plate is changed using the ejector pin assembly; Complete the vacuum drying process of the substrate.

10. The vacuum drying method according to claim 9, characterized in that, The method of changing the placement position of the substrate on the carrier plate using the ejector pin assembly includes: The ejector pin assembly is raised relative to the carrier plate to the transposition height to lift the substrate; The ejector pin assembly moves a horizontal distance relative to the carrier plate, thereby causing the substrate to move relative to the carrier plate in the horizontal plane. The ejector pin assembly is lowered relative to the carrier plate, and the substrate is placed on the carrier plate to complete a single substrate repositioning operation. Each change of the substrate's position relative to the carrier plate involves multiple substrate repositioning operations.

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