Gold wire consumption metering method of semiconductor wire bonding machine and related equipment thereof

Abstract

The invention discloses a gold wire consumption metering method of a semiconductor wire bonding machine and related equipment thereof. The method comprises the following steps: measuring the radius of a bobbin, the length of the bobbin, the diameter of a gold wire and the length of the gold wire; calculating the number of single-layer coils wound on the bobbin according to the length of the bobbin and the diameter of the gold wire; according to the radius of the bobbin, the diameter of the gold thread and the number of layers of the gold thread, calculating the radius and the perimeter of a circle of each layer of gold thread wound on the bobbin; calculating the number of gold wire winding layers according to the length of the gold wire, the number of single-layer coils and the perimeter of one circle of each layer of gold wire; according to the perimeter of each layer of gold wire by one circle and the rotating speed of a pay-off motor, the pay-off time of paying off each layer of gold wire by one circle is calculated; counting the total processing time of the wire welding machine, calculating the number of pay-off circles of the gold wires according to the total time and the pay-off time of paying off one circle of the gold wires on each layer, and calculating the actual use amount of the gold wires according to the number of pay-off circles of the gold wires. According to the method, the usage amount of the gold threads can be accurately measured by integrating the multi-dimensional parameters and the accurate calculation process.

Description

Technical Field

[0001] This application relates to the field of semiconductor wire bonding machine technology, and in particular to a method for measuring the amount of gold wire used in a semiconductor wire bonding machine, a semiconductor wire bonding machine, processing equipment, and a storage medium. Background Technology

[0002] Semiconductor wire bonders are core equipment in semiconductor packaging processes, used to achieve electrical interconnection between chips and external circuits. Their performance directly affects the functionality and reliability of the chip. Semiconductor wire bonders use wire bonding technology to connect fine metal wires (such as gold wires, copper wires, and aluminum wires) to chip pads and substrate pads, forming a conductive path.

[0003] In semiconductor wire bonding machines, the wire feeding module is the core module responsible for the feeding, positioning, and cutting of solder ribbon / wire. Its function is to achieve precise solder supply and process control through automated mechanisms, directly affecting welding quality and efficiency. For example... Figure 1 As shown, Figure 1 This illustrates the wire feeding structure of a conventional wire feeding module. The module consists of a bobbin 1 and a sensor 2, with gold wire 3 wound around the bobbin 1. It is the radius of spool 1. It is the outermost radius of the overall winding structure (including the gold wire layer) after the gold wire 3 is wound onto the bobbin 1. Traditional methods for measuring gold wire usage are based on a fixed radius. + ) / 2 to calculate the final amount of gold thread used, however, when ( - When the difference between () is large, use () + The discrepancy between the calculated gold thread usage statistics and the actual length of gold thread used is significant, leading to inaccurate cost estimations. This, in turn, affects the company's resource allocation decisions. For example, in the procurement process, relying on inaccurate usage estimates may result in excessive gold thread purchases, causing inventory backlog, tying up a large amount of the company's capital, and increasing warehousing costs and management difficulties; or insufficient purchases may fail to meet production needs, causing production interruptions and delaying order delivery. Summary of the Invention

[0004] The purpose of this application is to provide a method, apparatus, computer equipment, and storage medium for measuring the amount of gold wire used in a semiconductor wire bonding machine, in order to solve the technical problem that existing methods for measuring the amount of gold wire used have a large discrepancy between the calculated statistical results and the actual length of gold wire used, leading to inaccurate cost estimation.

[0005] Firstly, a method for measuring the amount of gold wire used in a semiconductor wire bonding machine is provided, which adopts the following technical solution: A method for measuring the amount of gold wire used in a semiconductor wire bonding machine, comprising: Measure the spool radius, spool length, gold wire diameter, and gold wire length; Calculate the number of single-layer coils wound on the spool based on the spool length and the gold wire diameter; Calculate the radius and circumference of each layer of gold wire wound around the spool, based on the spool radius, gold wire diameter, and number of gold wire layers. Calculate the number of gold wire layers based on the gold wire length, the number of coils in a single layer, and the circumference of one turn of each gold wire layer. Calculate the feeding time for one turn of each layer of gold wire based on the circumference of one turn of each layer and the rotation speed of the feeding motor. The total processing time of the wire bonding machine is calculated. Based on the total processing time and the time for each layer of gold wire to be laid out once, the number of gold wire loops is calculated, and the actual amount of gold wire used is calculated based on the number of gold wire loops.

[0006] Furthermore, the number of single-layer coils wound on the bobbin is calculated using the following formula:

[0007] In the formula, The number of single-layer coils wound on the bobbin, The length of the spool. This refers to the diameter of the gold wire.

[0008] Furthermore, the radius of each layer of gold wire wound around the spool is calculated using the following formula:

[0009] In the formula, For winding on the first axis The radius of the gold wire layer, It is a positive integer; Calculate the circumference of one loop of each layer of gold wire wound on the spool using the following formula:

[0010] In the formula, For winding on the first axis The perimeter of the gold thread layer.

[0011] Furthermore, the steps for calculating the number of gold wire winding layers based on the gold wire length, the number of coils in a single layer, and the circumference of one turn of each gold wire layer specifically include: Calculate the winding length of gold wire in each layer based on the number of coils in a single layer and the circumference of one turn of gold wire in each layer. Calculate the number of gold wire winding layers based on the length of the gold wire and the winding length of each gold wire layer.

[0012] Furthermore, the gold wire winding length of each gold wire layer is calculated according to the following formula:

[0013] In the formula, is the length of the gold wire wound on the wire spool of the first layer of gold wire; is calculated according to the following formula is the total length of the gold wire wound on the wire spool of the gold wire winding layer;

[0014] Let = , the formula for solving the number of gold wire winding layers is:

[0015] In the formula, is the length of the gold wire.

[0016] Further, the wire-out time of each layer of gold wire is calculated according to the following formula:

[0017] In the formula, is the wire-out time of the first layer of gold wire, is the rotation speed of the wire-out motor; The number of gold wire wire-out turns is calculated according to the following formula:

[0018] In the formula, is the number of gold wire wire-out turns, is the total time of the wire bonding machine processing.

[0019] Further, before the steps of calculating the number of gold wire wire-out turns according to the total time and the wire-out time of each layer of gold wire, and calculating the actual amount of gold wire according to the number of gold wire wire-out turns, further comprising: calculating the wire-out time difference of adjacent layers of gold wire; In the wire bonding machine processing, the wire-out time of the gold wire is monitored in real time; Each time the wire-out time of the gold wire is reduced by one wire-out time difference, it is determined that one layer of gold wire on the wire spool is reduced.

[0020] In a second aspect, a semiconductor wire bonding machine is provided, and the semiconductor wire bonding machine comprises a wire-out module, and the wire-out module executes the gold wire consumption metering method of the semiconductor wire bonding machine as described above.

[0021] ​In a third aspect, the embodiments of the present application provide a processing device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the gold wire usage metering method of the semiconductor wire bonding machine according to any one of the first aspect when executing the computer program.

[0022] In a fourth aspect, the embodiments of the present application provide a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the gold wire usage metering method of the semiconductor wire bonding machine according to any one of the first aspect.

[0023] In a fifth aspect, the embodiments of the present application provide a computer program product, which, when running on a terminal device, enables the terminal device to execute the gold wire usage metering method of the semiconductor wire bonding machine according to any one of the first aspect.

[0024] The embodiments of the present application have the following beneficial effects: The present application discloses a gold wire usage metering method of a semiconductor wire bonding machine and related equipment thereof. The present application measures the spool radius, the spool length, the gold wire diameter, and the gold wire length. According to the spool length and the gold wire diameter, the number of single-layer coils wound on the spool is calculated. According to the spool radius, the gold wire diameter, and the number of layers of gold wire, the radius and the circumference of a circle of gold wire of each layer wound on the spool are calculated. According to the gold wire length, the number of single-layer coils, and the circumference of a circle of gold wire of each layer, the number of layers of gold wire wound is calculated. According to the circumference of a circle of gold wire of each layer and the rotation speed of the wire feeding motor, the wire feeding time of a circle of gold wire of each layer is calculated. The total time of processing of the wire bonding machine is counted, and the number of wire feeding circles of gold wire is calculated according to the total time and the wire feeding time of a circle of gold wire of each layer, and the actual usage of gold wire is calculated according to the number of wire feeding circles of gold wire. The present application can accurately measure the gold wire usage by comprehensively considering multi-dimensional parameters and an accurate calculation process, and compared with the traditional measurement method, the present application avoids the error caused by the radius estimation deviation, and effectively improves the accuracy of cost estimation. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the solutions in the present application, the drawings needed in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0026] Figure 1 is a wire feeding structure schematic diagram of a traditional wire feeding module; Figure 2 is a flowchart schematic diagram of the gold wire usage metering method of the semiconductor wire bonding machine provided by the present application; Figure 3is a structural schematic diagram of a processing equipment provided by an embodiment of the present application. DETAILED DESCRIPTION

[0027] In order to make the technical problems to be solved by the present application, technical solutions and beneficial effects clearer, the following will be further described in detail in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application. Figures 1 to 3 The present application will be further described in detail below. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0028] In the following description, specific details are set forth in order to provide a thorough understanding of embodiments of the present application. However, persons of ordinary skill in the art will appreciate that embodiments of the present application can be practiced without these specific details. In other instances, well-known systems, structures, circuits, and methods have not been described in detail in order to avoid obscuring the description of the present application.

[0029] It should be understood that when used in the specification and the appended claims of the present application, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0030] It should also be understood that the term "and / or" used in the specification and the appended claims of the present application means any combination of one or more of the associated listed items and all possible combinations thereof, and includes these combinations.

[0031] As used in the specification and the appended claims of the present application, the term "if" can be interpreted as "when" or "upon" or "in response to a determination" or "in response to detecting" depending on the context. Similarly, the phrase "if it is determined" or "if [a described condition or event] is detected" can be interpreted as meaning "upon determining" or "in response to determining" or "upon detecting [a described condition or event]" or "in response to detecting [a described condition or event]" depending on the context.

[0032] In addition, in the description of the present application and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0033] Reference within the specification of this application to "one embodiment" or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in some embodiments" in various places within specified sections of this specification are not necessarily all referring to the same embodiment, although it can. The terms "including," "comprising," "having" and variations thereof are meant to encompass the items listed thereafter, but do not exclude other items from also being present. The terms "a" and "an" are defined as one or more unless explicitly indicated to the contrary or otherwise evident from the context.

[0034] In a first aspect, a gold wire usage metering method for a semiconductor wire bonding machine is provided, Figure 2 is a flowchart of the gold wire usage metering method for a semiconductor wire bonding machine provided by an embodiment of the application. Referring to Figure 2 The gold wire usage metering method for a semiconductor wire bonding machine provided by the embodiments of the application includes steps S201 to S206. Specifically, S201, measuring the bobbin radius, bobbin length, gold wire diameter and gold wire length; Specifically, in the bobbin and wire data acquisition link, first, the definition and measurement reference surface of each quantity need to be clear, including measuring the bobbin radius , bobbin length , gold wire diameter and gold wire length .

[0035] In the actual measurement process, high-precision measuring tools such as vernier calipers can be used to measure the bobbin radius , bobbin length and gold wire diameter . For the gold wire length , the length calibrated by the manufacturer when the gold wire is factory-produced can be used as the gold wire length, or a special length measuring device can be used to measure to ensure the accuracy of the measurement result.

[0036] S202, calculating the number of single-layer coils wound on the bobbin according to the bobbin length and gold wire diameter; Specifically, the number of single-layer coils wound on the bobbin is calculated according to the following formula:

[0037] In the formula, is the number of single-layer coils wound on the bobbin, is the bobbin length, is the gold wire diameter.

[0038] This step determines the number of gold wires that can be wound on each layer of the spool. In practice, it is essential to ensure the accuracy of the spool length and gold wire diameter measurements to avoid calculation errors caused by data inaccuracies.

[0039] S203, calculate the radius and circumference of one turn of each layer of gold wire wound on the spool based on the spool radius, gold wire diameter and number of gold wire layers; Specifically, the radius of each layer of gold wire wound around the spool is calculated using the following formula:

[0040] In the formula, For winding on the first axis The radius of the gold wire layer, It is a positive integer; Calculate the circumference of one loop of each layer of gold wire wound on the spool using the following formula:

[0041] In the formula, For winding on the first axis The perimeter of the gold thread layer.

[0042] This step allows us to obtain the radius and circumference data for each layer of gold wire during winding. In practical applications, the value of the number of gold wire layers, n, needs to be accurately determined based on the actual usage of the spool to ensure the accuracy of the calculation results.

[0043] S204, calculate the number of gold wire winding layers based on the gold wire length, the number of single-layer coils, and the circumference of one turn of each layer of gold wire; Specifically, based on the number of coils in a single layer and the circumference of one turn of the gold wire in each layer, the winding length of the gold wire in each layer is first calculated, and then the number of gold wire winding layers is calculated based on the gold wire length and the winding length of the gold wire in each layer.

[0044] This step clarifies the number of gold wire layers on the spool. In actual calculations, it's crucial to ensure the accuracy of the gold wire length, the number of coils per layer, and the circumference of one turn of each gold wire layer to obtain a precise result regarding the number of gold wire layers.

[0045] Furthermore, the steps for calculating the number of gold wire winding layers based on the gold wire length, the number of coils in a single layer, and the circumference of one turn of each gold wire layer specifically include: Calculate the winding length of gold wire in each layer based on the number of coils in a single layer and the circumference of one turn of gold wire in each layer. Calculate the number of gold wire winding layers based on the length of the gold wire and the winding length of each gold wire layer.

[0046] Specifically, the gold wire winding length of each gold wire layer is calculated using the following formula:

[0047] In the formula, is the length of gold wire winding of the first layer of gold wire winding layer on the bobbin; is the length of gold wire winding of the last layer of gold wire winding layer on the bobbin; is calculated according to the following formula is the total length of gold wire winding of the gold wire winding layer;

[0048] is the total length of gold wire winding when the number of gold wire layers is 1;

[0049] is the total length of gold wire winding when the number of gold wire layers is 2;

[0050] is the total length of gold wire winding when the number of gold wire layers is 3;

[0051] is the total length of gold wire winding when the number of gold wire layers is 4;

[0052] is the total length of gold wire winding when the number of gold wire layers is n;

[0053] is the total length of gold wire winding when the number of gold wire layers is 4;

[0054] is the total length of gold wire winding when the number of gold wire layers is n;

[0055] is the total length of gold wire winding when the number of gold wire layers is n;

[0056] wherein, the coefficient term of forms an arithmetic sequence with a tolerance of 1, and the general term formula is Therefore, After rearrangement, we get:

[0057] Let = That is: =

[0058] In the formula, is the length of gold wire.

[0059] Let , Then the formula can be simplified as: =

[0060] Expand and organize: =

[0061] = +

[0062] = +( + )

[0063] This is about The quadratic equation: +( + ) - =0 Using the quadratic formula:

[0064] in, , = + , =- Substituting into the above equation, we get:

[0065] Simplified, we get:

[0066] Will , Substitute return, due to The number must be positive. Choose the positive root to obtain the solution for the number of gold wire winding layers. The formula is:

[0067] This step allows us to calculate the number of gold wire layers wound on the spool. In practice, it is crucial to maintain accuracy in solving the quadratic equation to avoid inaccurate calculations leading to an incorrect number of gold wire layers.

[0068] S205, calculate the feeding time for one round of feeding of each layer of gold wire based on the circumference of one round of each layer of gold wire and the rotation speed of the feeding motor; Specifically, the laying time for each layer of gold thread to complete one loop is calculated using the following formula:

[0069] wherein, is the first is the wire-out time of one circle of gold wire layer, is the rotating speed of the wire-out motor.

[0070] Through this step, the wire-out time of each layer of gold wire when the wire-out motor rotates at a specific speed can be determined. In practical applications, the stability of the rotating speed of the wire-out motor has an important influence on the calculation result, and the speed fluctuation of the motor during operation needs to be ensured within the allowable range to ensure the accuracy of the calculation of the wire-out circle time of each layer of gold wire.

[0071] S206, the total time of the wire bonding machine processing is counted, the gold wire wire-out circle number is calculated according to the total time and the wire-out time of each layer of gold wire, and the actual amount of gold wire is calculated according to the gold wire wire-out circle number.

[0072] Specifically, the gold wire wire-out circle number is calculated according to the following formula:

[0073] wherein, is the gold wire wire-out circle number, is the total time of the wire bonding machine processing.

[0074] Through this step, the total number of gold wire wire-out circles in the entire processing process of the wire bonding machine can be obtained. In practical operation, the measurement of the total time T needs to be accurate to a suitable precision to avoid inaccurate calculation of the gold wire wire-out circle number due to time measurement error.

[0075] Further, the actual amount of gold wire is calculated according to the gold wire wire-out circle number. Assuming that the gold wire does not deform such as stretching or compression during the wire-out process of each circle, the actual amount of gold wire is equal to the gold wire wire-out circle number N multiplied by the length of each circle of gold wire, and the length of each circle of gold wire can be obtained according to the circumference of each layer of gold wire calculated in the previous step. For example, if the circumferences of all layers of gold wire are approximately the same (this can be approximately handled in the case that the diameter of the gold wire is relatively small compared to the radius of the spool and the number of layers is not too large), the circumference of the gold wire of a representative layer (such as the middle layer) can be taken as the length of each circle of gold wire. If the difference in the circumference of each layer of gold wire is considered, a more accurate method of calculating each layer separately and then summing them up is required.

[0076] Further, before the steps of calculating the gold wire wire-out circle number according to the total time and the wire-out time of each layer of gold wire, and calculating the actual amount of gold wire according to the gold wire wire-out circle number, the steps further include: calculating the wire-out time difference of one circle of gold wire between adjacent layers of gold wire; monitoring the wire-out time of one circle of gold wire in real time during the processing of the wire bonding machine; If the wire feeding time of each wire layer is reduced by one wire feeding time difference value, it is determined that the wire layer on the spool is reduced by one layer.

[0077] Specifically, in order to obtain more accurate actual wire consumption, the difference in the circumference of each wire layer needs to be considered, that is, the number of wire layers on the spool needs to be monitored during wire feeding. Since the circumferences of different wire layers are different, the wire feeding time of each wire layer is different. First, the circumferences of each wire layer are calculated according to the circumferences of the wire layers calculated in the previous steps, and the wire feeding time difference of adjacent wire layers is calculated according to the rotation speed of the wire feeding motor. , = -

[0078] During the wire bonding machine processing, a special monitoring device is used to monitor the wire feeding time of each wire layer in real time. When the wire feeding time of each wire layer is reduced by one wire feeding time difference value , it is determined that the wire layer on the spool is reduced by one layer. In this way, the change in the number of wire layers on the spool can be accurately tracked, providing a reliable basis for accurately calculating the actual wire consumption and avoiding errors in the calculation of the actual wire consumption due to inaccurate judgment of the number of wire layers.

[0079] If the number of wire layers on the spool changes during the wire bonding machine processing, the time difference of different wire layers needs to be considered when calculating the number of wire feeding turns. During calculation, the total time needs to be subdivided according to the wire feeding time of different wire layers. Specifically, assuming that the number of wire layers on the spool gradually decreases from N layers to N-1 layers during processing, the total time T can be divided into the sum of the time occupied by the wire feeding of each wire layer. For example, if the wire layer on the spool is mainly the nth layer during a certain period of time, the number of wire feeding turns during this period of time can be calculated according to the wire feeding time of the Nth layer and the wire feeding time of the Nth layer . When the wire feeding time is reduced by , that is, the number of wire layers on the spool is reduced by one layer to N-1 layers, the wire feeding time of the N-1th layer and the wire feeding time of the N-1th layer need to be switched to calculate the subsequent number of turns N-1th layer wire feeding turns . The specific calculation formula is:

[0080] ​​​In this way, the total time T of the entire processing process is refined into the sum of the wire-out times of the gold wires of each layer, the wire-out turns of the gold wires of each layer are calculated according to the wire-out times of each layer respectively, the wire-out turns of the gold wires of all layers are added up to obtain the total wire-out turns N of the gold wires. In this way, even if the number of layers of the gold wires on the spool changes, the actual amount of the gold wires can be accurately calculated, that is, the sum of the wire-out turns of the gold wires of each layer multiplied by the circumference (or approximate length) of one turn of the gold wires of the corresponding layer.

[0081] In the above embodiment, the gold wire consumption measurement method of the semiconductor wire bonding machine is disclosed, which can accurately measure the gold wire consumption through comprehensive multi-dimensional parameters and accurate calculation process. Compared with the traditional measurement method, the error caused by the radius estimation deviation is avoided, the accuracy of the cost estimation is effectively improved, a reliable basis is provided for production budget planning and resource allocation decision, and the efficient operation of enterprises is facilitated.

[0082] In a second aspect, a semiconductor wire bonding machine is provided, which includes a wire-out module that executes the gold wire consumption measurement method as described above.

[0083] The gold wire consumption measurement method of the semiconductor wire bonding machine includes: measuring the spool radius, the spool length, the gold wire diameter and the gold wire length; calculating the number of single-layer turns wound on the spool according to the spool length and the gold wire diameter; calculating the radius and the circumference of one turn of the gold wires of each layer wound on the spool according to the spool radius, the gold wire diameter and the number of layers of the gold wires; calculating the number of layers of the gold wires wound according to the gold wire length, the number of single-layer turns and the circumference of one turn of the gold wires of each layer; calculating the wire-out time of one turn of the gold wires of each layer according to the circumference of one turn of the gold wires of each layer and the rotation speed of the wire-out motor; statistically measuring the total time of the wire bonding machine processing, calculating the wire-out turns of the gold wires according to the total time and the wire-out time of one turn of the gold wires of each layer, and calculating the actual consumption of the gold wires according to the wire-out turns of the gold wires.

[0084] Specifically, in the spool and wire data acquisition link, first, the definition and measurement reference surface of each quantity need to be clear, including measuring the spool radius , the spool length , the gold wire diameter and the gold wire length .

[0085] In the actual measurement process, high-precision measurement tools such as vernier calipers can be used to measure the spool radius , the spool length and the gold wire diameter . For the gold wire length The gold wire length can be determined using the length specified by the manufacturer at the time of manufacture, or it can be measured using a specialized length measuring device to ensure the accuracy of the measurement results.

[0086] The number of single-layer coils wound on the bobbin can be calculated using the following formula:

[0087] In the formula, The number of single-layer coils wound on the bobbin, The length of the spool. This refers to the diameter of the gold wire.

[0088] This step determines the number of gold wires that can be wound on each layer of the spool. In practice, it is essential to ensure the accuracy of the spool length and gold wire diameter measurements to avoid calculation errors caused by data inaccuracies.

[0089] Calculate the radius of one loop of each layer of gold wire wound on the spool using the following formula:

[0090] In the formula, For winding on the first axis The radius of the gold wire layer, It is a positive integer; Calculate the circumference of one loop of each layer of gold wire wound on the spool using the following formula:

[0091] In the formula, For winding on the first axis The perimeter of the gold thread layer.

[0092] This step allows us to obtain the radius and circumference data for each layer of gold wire during winding. In practical applications, the value of the number of gold wire layers, n, needs to be accurately determined based on the actual usage of the spool to ensure the accuracy of the calculation results.

[0093] Based on the number of coils in a single layer and the circumference of one turn of gold wire in each layer, first calculate the gold wire winding length of each gold wire layer, and then calculate the number of gold wire winding layers based on the gold wire length and the gold wire winding length of each gold wire layer.

[0094] This step clarifies the number of gold wire layers on the spool. In actual calculations, it's crucial to ensure the accuracy of the gold wire length, the number of coils per layer, and the circumference of one turn of each gold wire layer to obtain a precise result regarding the number of gold wire layers.

[0095] Furthermore, the steps for calculating the number of gold wire winding layers based on the gold wire length, the number of coils in a single layer, and the circumference of one turn of each gold wire layer specifically include: Calculate the winding length of gold wire in each layer based on the number of coils in a single layer and the circumference of one turn of gold wire in each layer. Calculate the number of gold wire winding layers based on the length of the gold wire and the winding length of each gold wire layer.

[0096] Specifically, the gold wire winding length of each gold wire layer is calculated using the following formula:

[0097] In the formula, For winding on the first axis The length of gold wire winding in each layer of gold wire; Calculate according to the following formula Total length of gold wire wound in the gold wire winding layer:

[0098] When the number of gold wire layers is 1, the total length of the gold wire winding is:

[0099] When the number of gold wire layers is 2, the total length of the gold wire winding is:

[0100] Right now

[0101] When the number of gold wire layers is 3, the total length of the gold wire winding is:

[0102] Right now

[0103] When the number of gold wire layers is 4, the total length of the gold wire winding is:

[0104] Right now

[0105] Similarly, when the number of gold wire layers is n, the total length of the gold wire winding is:

[0106] in, The coefficients of the terms form an arithmetic sequence with a common difference of 1, and its general term formula is: ,therefore The results were:

[0107] make = ,Right now: =

[0108] wherein, is the length of gold wire.

[0109] Let , , the formula can be simplified as: =

[0110] Expand and organize: =

[0111] = +

[0112] = +( + )

[0113] This is a quadratic equation about : +( + ) - =0 Using the quadratic equation root formula:

[0114] wherein, , = + , =- , into the above formula can be obtained:

[0115] Simplify can be obtained:

[0116] Put , back, since must be positive, select the positive root, get the formula for solving the number of layers of gold wire winding :

[0117] Through this step, the number of layers of gold wire wound on the wire shaft can be calculated. In actual operation, attention should be paid to the calculation accuracy in the quadratic equation solving process to avoid inaccurate number of layers of gold wire winding due to calculation error.

[0118] The wire-out time of each layer of gold wire is calculated according to the following formula:

[0119] In the formula, is the wire-out time of the i-th layer of gold wire, is the rotation speed of the wire-out motor.

[0120] Through this step, the time required for each layer of gold wire to be wire-out for one turn when the wire-out motor rotates at a specific speed can be determined. In actual application, the stability of the rotation speed of the wire-out motor has an important influence on the calculation result, and it is necessary to ensure that the speed fluctuation of the motor during operation is within the allowable range to ensure the accuracy of the calculation of the wire-out time of each layer of gold wire for one turn.

[0121] The number of wire-out turns of gold wire is calculated according to the following formula:

[0122] In the formula, is the number of wire-out turns of gold wire, is the total time of the wire bonding machine processing.

[0123] Through this step, the total number of wire-out turns of gold wire required during the entire processing of the wire bonding machine can be obtained. In actual operation, the measurement of the total time T needs to be accurate to an appropriate precision to avoid inaccurate calculation of the number of wire-out turns of gold wire due to time measurement error.

[0124] Further, the actual amount of gold wire is calculated according to the number of wire-out turns of gold wire. Assuming that there is no deformation such as stretching or compression during the wire-out process of each turn of gold wire, the actual amount of gold wire is equal to the number of wire-out turns of gold wire N multiplied by the length of each turn of gold wire, and the length of each turn of gold wire can be obtained according to the circumference of each layer of gold wire calculated in the previous step. For example, if the circumferences of all layers of gold wire are approximately the same (this can be approximately handled in the case where the diameter of gold wire is relatively small compared to the radius of the wire shaft and the number of layers is not too large), the circumference of gold wire of a representative layer (such as the middle layer) can be taken as the length of each turn of gold wire. If the difference in circumference of each layer of gold wire is considered, a more accurate method of calculating each layer separately and summing them up is required.

[0125] Further, before the steps of calculating the number of wire-out turns of gold wire according to the total time and the wire-out time of each layer of gold wire for one turn, and calculating the actual amount of gold wire according to the number of wire-out turns of gold wire, there are also: calculating the wire-out time difference of adjacent layers of gold wire for one turn;​ In the wire bonding machine processing process, the wire unwinding time of one circle is monitored in real time; The wire unwinding time of one circle of the gold wire is reduced by one unwinding time difference value, and it is determined that the gold wire layer on the spool is reduced by one layer.

[0126] Specifically, in order to obtain more accurate actual gold wire consumption, the difference in the circumference of each layer of gold wire layer of one circle needs to be considered, that is, the number of layers of gold wire layer on the spool needs to be monitored during unwinding. Because the circumference of different layers of gold wire of one circle is different, the time required for one circle of unwinding is different. First, according to the circumference of each layer of gold wire of one circle calculated in the previous step, combined with the rotation speed of the unwinding motor, the unwinding time difference value of one circle of adjacent gold wire layer can be calculated , = - .

[0127] In the wire bonding machine processing process, a special monitoring device is used to monitor the gold wire unwinding time of one circle in real time. When it is monitored that the gold wire unwinding time of one circle is reduced by one pre-calculated unwinding time difference value , it is determined that the gold wire layer on the spool is reduced by one layer. In this way, the change of the number of gold wire layers on the spool can be accurately tracked, providing a reliable basis for accurate calculation of the actual consumption of gold wire, and avoiding errors in the calculation of the actual consumption of gold wire due to inaccurate judgment of the number of gold wire layers.

[0128] If the number of layers of gold wire on the spool changes during the wire bonding machine processing process, the time difference of one circle of unwinding of different layers of gold wire needs to be considered when calculating the number of unwinding circles of gold wire. When calculating, the total time needs to be subdivided according to the time of one circle of unwinding of different layers of gold wire. Specifically, assuming that during the processing process, the gold wire on the spool is gradually reduced from the initial N layers to N-1 layers, then the total time T can be divided into the sum of the time occupied by the unwinding of each layer of gold wire. For example, if during a certain period of time, the main gold wire on the spool is the nth layer of gold wire, then the number of circles unwound during this period of time can be calculated according to the time of one circle of unwinding of N layers of gold wire and the unwinding time of N layers of gold wire . When the unwinding time is reduced by , that is, the number of gold wire layers on the spool is reduced by one layer to N-1 layers, the time of one circle of unwinding of N-1 layers of gold wire and the unwinding time of N-1 layers of gold wire need to be switched to calculate the subsequent number of circles N-1 layers of gold wire . The specific calculation formula is:

[0129] In this way, the total processing time T is broken down into the sum of the laying times for each layer of gold wire. Then, the number of gold wire loops for each layer is calculated based on the laying time for each layer. Finally, the number of gold wire loops for all layers is added together to obtain the total number of gold wire loops N. This way, even if the number of gold wire layers on the spool changes, the actual amount of gold wire used can be accurately calculated; that is, the sum of the number of gold wire loops for each layer multiplied by the circumference (or approximate length) of one loop of the corresponding layer of gold wire.

[0130] In the above embodiments, this application discloses a semiconductor wire bonding machine, which includes a wire feeding module. The wire feeding module performs the gold wire usage measurement method described above. By integrating multi-dimensional parameters and a precise calculation process, it can accurately measure the amount of gold wire used. Compared with traditional measurement methods, it avoids errors caused by radius estimation deviations, effectively improves the accuracy of cost estimation, provides a reliable basis for production budget planning and resource allocation decisions, and helps enterprises operate efficiently.

[0131] Thirdly, embodiments of this application provide a processing apparatus. Figure 3 This is a schematic diagram of the structure of a processing device provided in one embodiment of this application. Figure 3 As shown, the processing equipment 18 of this embodiment includes: at least one processor 180 ( Figure 3 Only one is shown in the diagram), memory 181, and computer program 182 stored in memory 181 and executable on at least one processor 180; when processor 180 executes computer program 182, it implements the steps in the various method embodiments described above.

[0132] The processing equipment may include, but is not limited to, processor 180 and memory 181. Those skilled in the art will understand that... Figure 3 This is merely an example of processing equipment and does not constitute a limitation on the processing equipment. It may include more or fewer components than shown in the figure, or combinations of certain components, or different components. For example, it may also include input / output devices, network access devices, buses, etc.

[0133] The processor 180 can be a central processing unit (CPU), and can also be other general-purpose processors, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor.

[0134] The memory 181 can be an internal storage unit of the processing device 18, such as a hard disk or a memory of the processing device in some embodiments. The memory 181 can also be an external storage device of the processing device, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the processing device in other embodiments. Further, the memory 181 can include both the internal storage unit and the external storage device of the processing device. The memory 181 is used to store an operating system, an application program, a boot loader, data, and other programs, such as program codes of computer programs, etc. The memory 181 can also be used to temporarily store data that has been output or will be output.

[0135] For example, the computer program 182 can be divided into one or more modules / units, which are stored in the memory 181 and executed by the processor 180 to complete the present application. One or more modules / units can be a series of computer program instruction segments capable of completing a specific function, which are used to describe the execution process of the computer program 182 in the processing device 18.

[0136] It should be understood that the size of the serial number of each step in the above embodiments does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0137] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above functional units and modules is exemplified, and in actual application, the above functions can be completed by different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the above described functions. Each functional unit and module in the embodiment can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or software. In addition, the specific names of each functional unit and module are only for easy distinction, and do not limit the protection scope of the application. The specific working process of the unit and module in the system can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

[0138] The foregoing integrated unit, if realized in the form of a software functional unit and sold or used as an independent product, can be stored in a computer-readable storage medium. Based on such understanding, all or part of the processes in the foregoing embodiment methods can be instructed by a computer program to relevant hardware, and the computer program can be stored in a computer-readable storage medium. When the processor executes the computer program, the steps of each method embodiment can be implemented. The computer program includes computer program code, which can be in the form of source code, object code, executable file, or some intermediate form. The computer-readable medium includes any entity or device that can carry the computer program code to the device / terminal equipment, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal, and software distribution medium. For example, U disk, mobile hard disk, magnetic disk or optical disk, etc. In some jurisdictions, according to legislation and patent practice, the computer-readable medium cannot be an electrical carrier signal and a telecommunication signal.

[0139] In a fourth aspect, the embodiments of the present application also provide a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps in each of the foregoing method embodiments can be implemented.

[0140] In a fifth aspect, the embodiments of the present application also provide a computer program product. When the computer program product runs on a terminal device, the terminal device can implement the steps in each of the foregoing method embodiments.

[0141] In the above embodiments, the description of each embodiment has its own focus, and the parts not described or recorded in a certain embodiment can be referred to the relevant description of other embodiments.

[0142] Those skilled in the art can understand that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are realized in hardware or software depends on the specific application and design constraints of the technical solution. The skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0143] In the embodiments provided in the present application, it should be understood that the disclosed apparatuses / devices and methods can be implemented in other ways. For example, the above-described apparatus / device embodiments are merely illustrative, for example, the division of modules or units is merely a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the shown or discussed elements can be indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other form.

[0144] The units described as separate components in the foregoing can or can not be physically separated, and the components shown as units can or can not be physical units, i.e., they can be located in one place or distributed on multiple network units. Part or all of the units can be selected to achieve the purpose of the embodiments according to actual needs.

[0145] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A method for measuring the amount of gold wire used in a semiconductor wire bonding machine, characterized in that, include: Measure the spool radius, spool length, gold wire diameter, and gold wire length; Calculate the number of single-layer coils wound on the spool based on the spool length and the gold wire diameter; Based on the spool radius, the gold wire diameter, and the number of gold wire layers, calculate the radius and circumference of one turn of each layer of gold wire wound on the spool. The number of gold wire winding layers is calculated based on the gold wire length, the number of single-layer coils, and the circumference of one turn of each gold wire layer. Calculate the feeding time for one turn of each layer of gold wire based on the circumference of one turn of each layer and the rotation speed of the feeding motor. The total processing time of the wire bonding machine is calculated. Based on the total processing time and the time for laying one turn of gold wire for each layer, the number of gold wire loops is calculated, and the actual amount of gold wire used is calculated based on the number of gold wire loops.

2. The method for measuring the amount of gold wire used in a semiconductor wire bonding machine as described in claim 1, characterized in that, The number of single-layer coils wound on the bobbin can be calculated using the following formula: In the formula, The number of single-layer coils wound on the bobbin, The length of the spool. This refers to the diameter of the gold wire.

3. The method for measuring the amount of gold wire used in a semiconductor wire bonding machine as described in claim 1, characterized in that, Calculate the radius of one turn of each layer of gold wire wound on the spool using the following formula: In the formula, For the first one wound on the spool The radius of the gold wire layer, It is a positive integer; Calculate the circumference of one turn of each layer of gold wire wound on the spool using the following formula: In the formula, For the first one wound on the spool The perimeter of the gold thread layer.

4. The method for measuring the amount of gold wire used in a semiconductor wire bonding machine as described in claim 3, characterized in that, The step of calculating the number of gold wire winding layers based on the gold wire length, the number of single-layer coils, and the circumference of one turn of each layer of gold wire specifically includes: Calculate the gold wire winding length of each gold wire layer based on the number of single-layer coils and the circumference of one turn of each gold wire layer. The number of gold wire winding layers is calculated based on the gold wire length and the gold wire winding length of each gold wire layer.

5. The method for measuring the amount of gold wire used in a semiconductor wire bonding machine as described in claim 4, characterized in that, The gold wire winding length of each gold wire layer is calculated using the following formula: In the formula, For the first one wound on the spool The length of gold wire winding in each layer of gold wire; Calculate according to the following formula Total length of gold wire wound in the gold wire winding layer: make = Determine the number of gold wire winding layers. The formula is: In the formula, This refers to the length of the gold wire.

6. The method for measuring the amount of gold wire used in a semiconductor wire bonding machine as described in claim 3, characterized in that, The following formula can be used to calculate the laying time for one round of gold thread laying for each layer: In the formula, For the first The time required for one full turn of the gold thread. This refers to the rotational speed of the wire feeding motor; Calculate the number of gold wire loops using the following formula: In the formula, The number of coils for the gold wire. This refers to the total processing time of the wire bonding machine.

7. The method for measuring the amount of gold wire used in a semiconductor wire bonding machine as described in claim 6, characterized in that, Before the steps of calculating the number of gold wire loops based on the total time and the time for each layer of gold wire to lay one loop, and calculating the actual amount of gold wire used based on the number of gold wire loops, the method further includes: Calculate the time difference of laying out one loop of adjacent gold wire layers; During the wire bonding machine processing, the wire feeding time for one loop of gold wire is monitored in real time; If the time for laying out one turn of gold wire decreases by one laying time difference, it is determined that one layer of gold wire on the spool has been reduced.

8. A semiconductor wire bonding machine, the semiconductor wire bonding machine comprising a wire feeding module, characterized in that, The wire feeding module performs the gold wire consumption measurement method of the semiconductor wire bonding machine as described in any one of claims 1-7.

9. A processing device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the computer program, implements the gold wire usage measurement method for a semiconductor wire bonding machine as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the gold wire consumption measurement method for a semiconductor wire bonding machine as described in any one of claims 1 to 7.

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