Heat dissipation structure and electronic equipment

Abstract

The invention discloses a heat dissipation structure and electronic equipment, and relates to the technical field of servers, the heat dissipation structure comprises a cold plate, the cold plate is provided with a liquid inlet and a liquid outlet, and the cold plate is in contact with a display card structure; the outlet end of the liquid inlet pipeline communicates with the inlet end of the cold plate, so that a cooling medium is conveyed to the cold plate through the liquid inlet pipeline; the inlet end of the liquid outlet pipeline is communicated with the outlet end of the cold plate, so that the cooling medium after heat dissipation of the graphics card structure is led out of the cold plate through the liquid outlet pipeline; the support structure is arranged in the machine box, the support structure is provided with a supporting face, and the supporting face is used for making contact with at least part of the liquid inlet pipeline and the liquid outlet pipeline so as to support the liquid inlet pipeline and the liquid outlet pipeline; the problems that in the prior art, due to air cooling heat dissipation, the heat dissipation efficiency is low, and the occupied space of a fan is too large are solved.

Description

Technical Field

[0001] This application relates to the field of server technology, and more specifically, to a heat dissipation structure and electronic device. Background Technology

[0002] Currently, in the field of high-performance servers, air cooling technology is widely used as the primary heat dissipation method for high-power components such as graphics cards. Air cooling uses fans to generate airflow, which, together with heatsinks, dissipates the heat generated by the graphics card into the environment, thereby controlling the graphics card's temperature and ensuring its stable operation. However, with the continuous breakthroughs in graphics card performance, their power consumption and heat generation have increased significantly, posing unprecedented challenges to traditional air cooling methods.

[0003] The main problem with existing air-cooling technology is that its cooling efficiency struggles to keep up with the increasing heat generated by graphics cards, especially during high-load server operation. Overheating can trigger performance throttling and even damage the hardware. To improve cooling efficiency, manufacturers typically increase the number of fans or their speed. However, this not only increases server noise and vibration, worsening the working environment, but can also affect read / write performance and reduce hardware lifespan due to increased mechanical vibration. Furthermore, the complex structure and maintenance requirements of air-cooling systems significantly increase production costs and maintenance difficulty, negatively impacting server availability and cost-effectiveness. Summary of the Invention

[0004] This application provides a heat dissipation structure and electronic device to solve the problems of low heat dissipation efficiency and excessive space occupied by fans caused by air cooling in the prior art.

[0005] This application provides a heat dissipation structure for mounting on a computer chassis to contact the graphics card structure mounted on the chassis for heat dissipation. The heat dissipation structure includes:

[0006] The cold plate has a liquid inlet and a liquid outlet, and the cold plate is in contact with the graphics card structure.

[0007] The liquid inlet pipe has its outlet end connected to the inlet end of the cold plate to deliver the cooling medium to the cold plate.

[0008] The liquid outlet pipe connects the inlet end to the outlet end of the cold plate to lead the cooling medium after the graphics card structure has been cooled out of the cold plate.

[0009] The support structure is housed within the chassis and has a support surface that contacts at least a portion of the inlet and outlet pipes to support them.

[0010] Furthermore, the support structure includes a support body and a clamp structure. The support body has an inclined support surface, and the clamp structure is detachably mounted on the support surface. The clamp structure includes multiple clamp positions, each of which includes a first clamp and a second clamp. There are multiple liquid outlet pipes and multiple liquid inlet pipes. The multiple first clamps are configured one-to-one with the multiple liquid inlet pipes, and the multiple second clamps are configured one-to-one with the multiple liquid outlet pipes, so as to clamp the liquid inlet pipes and liquid outlet pipes through the first clamps and the second clamps.

[0011] Furthermore, the heat dissipation structure also includes a transition component and a liquid inlet manifold. The transition component includes a liquid inlet part, which has a first water inlet and multiple first water outlets. The first water inlet is connected to the liquid inlet manifold. There are multiple liquid inlet pipes, and the multiple liquid inlet pipes and multiple first water outlets are arranged one-to-one. The inlet end of each liquid inlet pipe is connected to its corresponding first water outlet, so that the cooling medium introduced from the liquid inlet manifold is diverted to the multiple liquid inlet pipes through the liquid inlet part.

[0012] Furthermore, the heat dissipation structure also includes a transition component and a liquid outlet manifold. The transition component includes a liquid outlet part, which has multiple second inlets and second outlets. The second outlets are connected to the liquid outlet manifold. There are multiple liquid outlet pipes, and the multiple liquid outlet pipes and multiple second inlets are arranged in a one-to-one correspondence. The outlet end of each liquid outlet pipe is connected to its corresponding second inlet, so that the cooling medium drawn from the multiple liquid outlet pipes is integrated into the liquid outlet part through the liquid outlet part and drawn out by the liquid outlet manifold.

[0013] Furthermore, the heat dissipation structure also includes a support structure, which has a first support portion and a second support portion. The first support portion is connected to the transition component, and the second support portion is connected to the chassis, so as to support the transition component through the support structure.

[0014] Furthermore, the heat dissipation structure also includes a first vibration damping component, which is detachably mounted on the transition assembly; and / or, the heat dissipation structure also includes a second vibration damping component, which is detachably mounted on the support surface of the support body of the support structure.

[0015] Furthermore, the heat dissipation structure also includes quick connectors, which are used to connect to the inlet end of the liquid inlet pipe and the outlet end of the liquid outlet pipe, respectively. A fan module is installed inside the chassis, and a quick connector support is installed on the fan module. Each quick connector support is provided with a mounting hole. Two mounting holes are provided with two quick connectors, and the two quick connectors extend out from their corresponding mounting holes to the outside, so as to support the quick connectors through the quick connector support.

[0016] Furthermore, the chassis includes a housing, a cover, and a transparent cover plate. The cover plate has an observation opening, and a limiting part is provided on the edge of the observation opening along the width direction of the cover plate. A third connecting part is provided on the limiting part, and a fourth connecting part is provided on the transparent cover plate. The third connecting part and the fourth connecting part are correspondingly provided. The chassis also includes a second connector, which is interlocked within the third connecting part to fix the transparent cover plate to the cover plate.

[0017] Furthermore, the chassis includes a housing, a cover, and a transparent cover plate. The cover plate has an observation opening, and a limiting part is provided on the edge of the observation opening along the width direction of the cover plate. A third connecting part is provided on the limiting part, and a fourth connecting part is provided on the transparent cover plate. The third connecting part and the fourth connecting part are correspondingly provided. The chassis also includes a second connector, which is interlocked within the third connecting part to fix the transparent cover plate to the cover plate.

[0018] Furthermore, the chassis also includes a transparent panel structure, which includes a transparent panel and a panel support frame. The panel support frame is detachably mounted on the chassis body, and the transparent panel is detachably mounted on the side of the panel support frame away from the chassis body.

[0019] According to another aspect of this application, this application also provides an electronic device, including a server. The server includes a chassis, a graphics card structure, and a heat dissipation structure. The graphics card structure and the heat dissipation structure are disposed inside the chassis, and the heat dissipation structure is in contact with the graphics card structure to dissipate heat from the graphics card structure. The heat dissipation structure is the aforementioned heat dissipation structure.

[0020] This application achieves efficient heat dissipation for the graphics card structure by ensuring close contact between the heat dissipation structure and the graphics card structure on the chassis. Specifically, the cold plate, as the core of this structure, features inlet and outlet ports that allow the cooling medium to circulate smoothly and directly contact the key heat sources of the graphics card structure. Through effective contact between the cold plate and the graphics card structure, the heat dissipation efficiency of the graphics card is significantly improved, effectively controlling the temperature of the graphics card under high load, ensuring its stability, and extending its service life.

[0021] The connection between the inlet pipe and the inlet end of the cold plate ensures that the cooling medium can be promptly and evenly distributed across the surface of the cold plate. This precise delivery of the cooling medium allows the cold plate to absorb the heat generated by the graphics card evenly and efficiently, further improving the cooling effect. Meanwhile, the connection between the outlet pipe and the outlet end of the cold plate ensures that the cooling medium can be smoothly discharged after absorbing heat. Through the recycling of the cooling medium, the temperature of the graphics card structure can be rapidly reduced, preventing heat accumulation and improving the server's thermal management capabilities.

[0022] The bracket structure, through its contact with the inlet and outlet pipes, provides necessary physical support for the pipes. The reasonable layout of the bracket structure allows the inlet and outlet pipes to be stably arranged inside the chassis, reducing the risk of pipe damage caused by vibration, improving the overall reliability of the liquid cooling system, optimizing the use of internal space, and enhancing the server's structural compactness and aesthetics. Attached Figure Description

[0023] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0024] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This diagram shows a structure of the heat dissipation structure of an embodiment of this application mounted on a chassis.

[0026] Figure 2 A schematic diagram of the structure of the box lid according to an embodiment of this application is shown;

[0027] Figure 3 A structural diagram of the transparent panel structure according to an embodiment of this application is shown;

[0028] Figure 4 An exploded view of the heat dissipation structure according to an embodiment of this application is shown;

[0029] Figure 5 An exploded view of the support structure according to an embodiment of this application is shown;

[0030] Figure 6 A schematic diagram of the graphics card structure according to an embodiment of this application is shown;

[0031] Figure 7 A schematic diagram of the structure of the quick connector support base according to an embodiment of this application is shown;

[0032] Figure 8 A schematic diagram of the overall structure of the chassis according to an embodiment of this application is shown.

[0033] The above figures include the following reference numerals:

[0034] 1. Chassis; 2. Graphics card structure; 21. Base plate; 3. Cold plate; 4. Liquid inlet pipe; 5. Liquid outlet pipe;

[0035] 6. Support structure; 61. Support surface; 62. Support body; 621. First support section; 622. Second support section; 623. Fourth support section; 624. Fifth support section; 625. Support hole; 626. First connection position; 627. First fixing position; 63. Wire clamp structure; 631. Wire clamp position; 632. Second fixing position; 633. Wire clamp body;

[0036] 7. Transition component; 71. Liquid inlet component; 711. First water inlet; 72. Liquid outlet component; 721. Second water outlet;

[0037] 8. Inlet manifold; 9. Outlet manifold; 10. Support structure; 101. First support part; 102. Second support part; 11. First vibration damping component; 12. Second vibration damping component;

[0038] 13. Quick connector; 131. Flange; 132. First connection hole;

[0039] 14. Quick connector support; 141. Second connecting hole; 142. First section; 143. Second section; 144. Reinforcing part; 145. Third connecting hole; 146. First positioning part;

[0040] 15. Box body; 16. Box cover; 161. Observation port; 162. Limiting part; 163. Third connecting part;

[0041] 18. Transparent cover; 181. Fourth connection position;

[0042] 19. Transparent panel structure; 191. Transparent panel; 190. Snap-fit ​​position; 192. Panel support frame; 1921. Sixth connecting hole; 1924. Main body; 1922. Fifth connector; 193. Fifth connecting hole; 1923. Snap-fit ​​part; 190. Snap-fit ​​position. Detailed Implementation

[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0044] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0045] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] Currently, in the field of high-performance servers, air cooling technology is widely used as the primary heat dissipation method for high-power components such as graphics cards. Air cooling uses fans to generate airflow, which, together with heatsinks, dissipates the heat generated by the graphics card into the environment, thereby controlling the graphics card's temperature and ensuring its stable operation. However, with the continuous breakthroughs in graphics card performance, their power consumption and heat generation have increased significantly, posing unprecedented challenges to traditional air cooling methods.

[0047] The main problem with existing air-cooling technologies is that their cooling efficiency cannot keep up with the increasing heat generated by the graphics card, especially during high-load server operation. Overheating of the graphics card can not only trigger performance throttling but also potentially damage the hardware. To improve cooling efficiency, manufacturers typically increase the number of fans or increase their speed. However, this not only increases server noise and vibration, worsening the working environment, but may also affect server read / write performance and reduce hardware lifespan due to increased mechanical vibration. Furthermore, the complex structure and maintenance requirements of air-cooling systems significantly increase production costs and maintenance difficulty, negatively impacting server availability and economics. Therefore, the purpose of this application is to provide a server with a cooling structure that addresses the above problems, resolving the issues of low cooling efficiency and excessive fan space required by existing air-cooling technologies.

[0048] Example 1

[0049] like Figures 1 to 8 As shown, this application embodiment first provides a heat dissipation structure for mounting on a chassis 1. A graphics card structure 2 is provided inside the chassis 1. The graphics card structure 2 includes a base plate 21 with through holes. The graphics card is located inside the base plate 21. The heat dissipation structure is disposed on the base plate 21 and in contact with the graphics card. The heat dissipation structure includes a cold plate 3, an inlet pipe 4, an outlet pipe 5, and a support structure 6.

[0050] like Figure 4 and Figure 6 As shown, the cold plate 3 is directly mounted on the base plate 21. The cold plate 3 has a liquid inlet and a liquid outlet. The outlet end of the liquid inlet pipe 4 is connected to the inlet end of the cold plate 3, so that the cooling medium can be delivered to the cold plate 3 through the liquid inlet pipe 4. The inlet end of the liquid outlet pipe 5 is connected to the outlet end of the cold plate 3, so that the cooling medium after the heat dissipation of the graphics card structure 2 is led out of the cold plate 3 through the liquid outlet pipe 5. The bracket structure 6 is mounted in the chassis 1. The bracket structure 6 has a support surface 61. The support surface 61 is used to contact at least part of the liquid inlet pipe 4 and the liquid outlet pipe 5 to support the liquid inlet pipe 4 and the liquid outlet pipe 5.

[0051] like Figure 5 As shown, the support structure 6 includes a support body 62 and a wire clamp structure 63. The support body 62 has an inclined support surface 61. The wire clamp structure 63 is detachably mounted on the support member. The wire clamp structure 63 includes multiple wire clamp positions 631, and each wire clamp position 631 includes a first wire clamp and a second wire clamp.

[0052] The wire clamp structure 63 includes a wire clamp body 633, with a first wire clamp and a second wire clamp respectively disposed on both sides of the wire clamp body 633, and the first wire clamp and the second wire clamp located on both sides of the wire clamp body 633 are alternately disposed.

[0053] Optionally, the first clamp and the second clamp can be located on the same side of the clamp body 633.

[0054] There are multiple liquid outlet pipes 5 and multiple liquid inlet pipes 4. Multiple first clamps are set one-to-one with multiple liquid inlet pipes 4, and multiple second clamps are set one-to-one with multiple liquid outlet pipes 5, so as to clamp the liquid inlet pipes 4 and liquid outlet pipes 5 through the first clamps and the second clamps.

[0055] The cooling method of the graphics card using the heat dissipation structure in this embodiment significantly enhances heat dissipation efficiency. By directly attaching the cold plate 3 to the base plate 21 of the graphics card, rapid heat transfer is achieved, effectively avoiding performance degradation caused by overheating of the graphics card. At the same time, the liquid cooling system is quieter, greatly reducing the noise level of the server during operation and creating a quieter working environment. The detachable cable clamp design of this structure simplifies the maintenance process, reduces the risk of liquid leakage caused by pipe vibration, and improves the maintenance efficiency and safety of the server. The inclined support surface 61 and the staggered cable clamp positions 631 enhance compatibility with pipes of different sizes and promote the modular and customized design of the server.

[0056] like Figure 5 As shown, the main body 62 of the support includes a first support portion 621, a second support portion 622, a third support portion, a fourth support portion 623, and a fifth support portion 624. The first support portion 621 has a support surface 61. The second support portion 622 and the third support portion are respectively disposed on both sides of the first support portion 621 along its length direction. The second support portion 622 has the same structure as the third support portion. Here, only the second support portion 622 is described as an example. The second support portion 622 has a trapezoidal structure. A support hole 625 is provided in the middle of the second support portion 622. The support hole 625 can be used as a ventilation hole. For heat dissipation, a fourth bracket 623 is provided on the second bracket 622 away from the first bracket 621. The structure of the fourth bracket 623 is the same as that of the fifth bracket 624. A plurality of first connection positions 626 are provided on the fourth bracket 623, and a plurality of second connection positions are provided on the chassis 1. The plurality of first connection positions 626 and the plurality of second connection positions are provided one-to-one. The heat dissipation structure also includes a plurality of first connectors. The plurality of first connectors can be interleaved on the corresponding first connection positions 626 so as to fix the bracket body 62 to the chassis 1 through the first connectors.

[0057] The trapezoidal structure of the support body 62 in this technical solution, especially the coordinated design of the first support section 621, the second support section 622, the third support section, the fourth support section 623, and the fifth support section 624, not only provides a stable support surface 61 to maintain the structural integrity of the liquid inlet pipe 4 and the liquid outlet pipe 5, avoiding pipe leakage and system failure caused by vibration, but also provides a support hole 625 in the middle of the second support section 622 as a ventilation hole to enhance air circulation, thereby assisting the liquid cooling system in heat dissipation and further reducing the operating temperature of the graphics card. Simultaneously, the precise matching of multiple first connection positions 626 on the fourth support section 623 with multiple second connection positions on the chassis 1, and the stable fixation achieved through the first connector, ensures a tight connection between the support body 62 and the chassis 1, enhancing the stability and reliability of the entire server structure. Furthermore, this design promotes modular assembly and rapid maintenance of the server, reduces production costs and maintenance time, and improves server availability and economic efficiency.

[0058] Optionally, the first connection position 626 is a bolt hole, and the first connector is a connecting bolt.

[0059] The support surface 61 is provided with a plurality of first fixing positions 627, and the wire clamp structure 63 is provided with a plurality of second fixing positions 632. The plurality of first fixing positions 627 and the plurality of second fixing positions 632 are provided one-to-one. The heat dissipation structure also includes a plurality of first fixing members. The plurality of first fixing members can be interleaved on the corresponding first fixing positions 627 so as to fix the wire clamp structure 63 to the first bracket part 621 through the first fixing members. There is a wire clamp space between the wire clamp structure 63 and the support surface 61 so that either the first wire clamp or the second wire clamp can pass through the wire clamp space. That is, there is a preset distance between the wire clamp structure 63 and the support surface 61.

[0060] The heat dissipation structure of this embodiment achieves rapid and stable fixation between the wire clamp structure 63 and the support body 62 by matching the first fixing position 627 arranged on the support surface 61 with the second fixing position 632 on the wire clamp structure 63. The flexible installation method of multiple first fixing parts not only ensures the stability of the wire clamp structure 63, but also allows the liquid inlet pipe 4 and liquid outlet pipe 5 to be accurately clamped within the preset wire clamp space, effectively preventing displacement and vibration of the pipes during server operation or transportation, significantly reducing the risk of pipe leakage, and ensuring the long-term operational stability of the liquid cooling system and the reliability of the server. At the same time, the preset distance design not only provides necessary movement space for the pipes, preventing damage due to excessive tension, but also optimizes the internal spatial layout of the server, improves the server's heat dissipation efficiency, and reduces maintenance difficulty.

[0061] Optionally, the first fixing position 627 is a bolt hole.

[0062] Optionally, the second fixing position 632 is a bolt hole.

[0063] Optionally, the first fastener is a fixing bolt.

[0064] Optionally, a second shock-absorbing component 12 is provided on the support surface 61. In this embodiment, the second shock-absorbing component 12 is shock-absorbing foam or shock-absorbing rubber.

[0065] like Figure 4 As shown, the heat dissipation structure also includes a transition component 7, a liquid inlet manifold 8, and a liquid outlet manifold 9. The transition component 7 includes a liquid inlet part 71 and a liquid outlet part 72. The liquid inlet part 71 has a first water inlet 711 and multiple first water outlets. The first water inlet 711 is connected to the liquid inlet manifold 8. There are multiple liquid inlet pipes 4, and the multiple liquid inlet pipes 4 and multiple first water outlets are arranged one-to-one. The inlet end of each liquid inlet pipe 4 is connected to its corresponding first water outlet to allow the cooling medium introduced from the liquid inlet manifold 8 to pass through... The liquid is diverted through the inlet component 71 to multiple inlet pipes 4. The outlet component 72 has multiple second inlets and second outlets 721. The second outlets 721 are connected to the main outlet pipe 9. There are multiple outlet pipes 5. The multiple outlet pipes 5 and multiple second inlets are arranged one-to-one. The outlet end of each outlet pipe 5 is connected to its corresponding second inlet so that the cooling medium drawn from the multiple outlet pipes 5 is integrated into the outlet component 72 through the outlet component 72 and led out by the main outlet pipe 9.

[0066] The first inlet 711 of the liquid inlet component 71 is connected to the main liquid inlet pipe 8. With the precise correspondence between multiple first outlets and the liquid inlet pipes 4, the cooling medium can be effectively and evenly distributed to each liquid inlet pipe 4, ensuring that every part of the graphics card structure 2 receives sufficient cooling. Similarly, the liquid outlet component 72 is connected to the outlet end of the liquid outlet pipe 5 through multiple second inlets, collecting the cooled medium after heat dissipation back to the second outlet 721, and then leading it out through the main liquid outlet pipe 9. This design not only simplifies the fluid circulation path and improves heat dissipation efficiency but also significantly reduces the risk of cooling medium leakage, enhancing the system's sealing and safety.

[0067] Furthermore, the distribution and connection of the inlet pipe 4 and the outlet pipe 5 ensures that the flow path of the cooling medium is unobstructed, avoids turbulence and pressure loss during the circulation process, improves the fluid dynamics performance of the liquid cooling system, and enables the temperature of the graphics card to be more precisely controlled within the ideal range, thereby enhancing the stability of server operation and extending the service life of the graphics card.

[0068] Optionally, the liquid outlet component 72 is a liquid outlet tank;

[0069] Optionally, the liquid inlet component 71 is a liquid inlet water tank.

[0070] Furthermore, the heat dissipation structure also includes a support structure 10, which has a first support portion 101 and a second support portion 102. The extension directions of the first support portion 101 and the second support portion 102 are perpendicular. The first support portion 101 is connected to the liquid outlet component 72 and the liquid inlet component 71 by bolts, and the second support portion 102 is connected to the chassis 1 to support the transition assembly 7 through the support structure 10.

[0071] Specifically, the bolt holes provided on the liquid outlet component 72 and the liquid inlet component 71 will not affect the sealing of the internal cooling medium.

[0072] Optionally, the heat dissipation structure also includes a first vibration damping component 11, which is detachably mounted on the transition assembly 7.

[0073] The heat dissipation structure of this embodiment further optimizes the physical stability and structural reliability of the liquid cooling system by adding a support structure 10. The support structure 10 includes a first support portion 101 and a second support portion 102 that are perpendicular to each other. The first support portion 101 is firmly connected to the liquid outlet component 72 and the liquid inlet component 71 respectively by bolts. This connection method ensures the stability of the transition component 7, maintaining the integrity of the liquid cooling system and the sealing of the cooling medium even if the server suffers external impact or experiences severe vibration during transportation, thus avoiding hardware damage and system failure caused by coolant leakage. It is worth noting that the design of the support structure 10 avoids the flow area of ​​the cooling medium, and the bolt holes used do not affect the sealing of the cooling medium.

[0074] Furthermore, the heat dissipation structure incorporates a detachable first vibration damping component 11, which is mounted on the transition assembly 7. This component effectively absorbs and disperses vibration energy from external sources, further enhancing the anti-vibration performance of the liquid cooling system and ensuring the smooth circulation of the cooling medium and the long-term operational stability of the system. The detachable design of the first vibration damping component 11 also greatly facilitates server maintenance, allowing for replacement or inspection of the damping component without disassembling the entire liquid cooling system, thus reducing maintenance time and costs.

[0075] Optionally, in this embodiment, the first vibration damping component 11 is vibration damping foam or vibration damping rubber.

[0076] Furthermore, the heat dissipation structure also includes quick connectors 13, which are used to connect to the inlet end of the liquid inlet pipe 4 and the outlet end of the liquid outlet pipe 5, respectively. Specifically, they can be connected by threads. A fan module is provided inside the chassis 1, and the fan module is provided with quick connector support seats 14. Each quick connector support seat 14 is provided with mounting holes, and two mounting holes are corresponding to two quick connectors 13. The two quick connectors 13 extend out from their corresponding mounting holes to the outside, so as to be supported by the quick connector support seats 14. Specifically, quick connectors... The head 13 is provided with a flange 131, which is provided with a plurality of first connection holes 132. The quick connector support 14 is provided with a plurality of second connection holes 141. The plurality of second connection holes 141 and the plurality of first connection holes 132 are provided one-to-one. The heat dissipation structure also includes a plurality of third connectors, which are provided one-to-one with the plurality of first connection holes 132. Each third connector can be inserted into its corresponding first connection hole 132 so as to fix the quick connector 13 to the quick connector support 14 through the third connectors.

[0077] The threaded connection between the quick-connect coupling 13 and the inlet pipe 4 and outlet pipe 5 ensures rapid access and disconnection of the cooling medium, simplifying maintenance operations and reducing maintenance time and labor costs. Simultaneously, the precise correspondence between the flange 131 on the quick-connect coupling 13 and its multiple first connection holes 132 and the multiple second connection holes 141 on the quick-connect coupling support 14, along with the fixing of multiple third connectors, achieves a stable installation of the quick-connect coupling 13. This not only enhances the overall rigidity of the liquid cooling system and effectively prevents the quick-connect coupling 13 from loosening or being damaged during server vibration or movement, but also further ensures the sealing of the cooling medium, preventing coolant leakage.

[0078] Furthermore, the integrated design of the quick connector 13, used in conjunction with the quick connector support 14, optimizes the internal space layout of the server, reduces pipe clutter, and improves the server's neatness and aesthetics. It also facilitates on-site operators' intuitive understanding and rapid maintenance of the liquid cooling system. The external extension design of the quick connector 13 allows for connection and disconnection without additional tools when opening or disassembling the server, significantly enhancing the server's maintainability and scalability.

[0079] Optionally, the first connecting hole 132 is a threaded hole.

[0080] Optionally, the second connecting hole 141 is a threaded hole.

[0081] Optionally, the third connector is a connecting bolt.

[0082] The quick connector support 14 includes a first portion 142, a second portion 143, and a reinforcing portion 144. A second connecting hole 141 is disposed on the first portion 142, and the extending direction of the first portion 142 is perpendicular to the extending direction of the second portion 143. The reinforcing portion 144 is disposed between the first portion 142 and the second portion 143. A plurality of third connecting holes 145 are disposed on the second portion 143, and a plurality of fourth connecting holes are disposed on the fan module. The plurality of third connecting holes 145 are disposed one-to-one with the plurality of fourth connecting holes. The quick connector support 14 also includes a plurality of fourth connecting members, which are disposed one-to-one with the plurality of third connecting holes 145. Each fourth connecting member can be inserted into its corresponding third connecting hole 145 to fix the quick connector support 14 to the fan module through the fourth connecting members. The second part 143 is also provided with a plurality of first positioning parts 146 and a plurality of first positioning holes are provided on the fan module. The plurality of first positioning parts 146 are provided in a one-to-one correspondence with the plurality of first positioning holes, so that when installing the quick connector support 14 and the fan module, the quick connector support 14 is first positioned, and then the fourth connector is used for connection.

[0083] In the heat dissipation structure of this application embodiment, the optimized design of the quick-connect support 14 significantly improves the structural stability and maintenance convenience of the liquid cooling system inside the server. The quick-connect support 14 consists of a first portion 142, a second portion 143, and a reinforcing portion 144, wherein the first portion 142 and the second portion 143 are arranged perpendicularly, and the reinforcing portion 144 is located between them. This structural design greatly increases the mechanical strength of the support, effectively resists the external impact suffered by the server during operation or transportation, ensures the stable support of the quick-connect 13 and the sealing of the cooling medium, and reduces the system failure rate and maintenance costs.

[0084] Meanwhile, the precise matching of the second connection hole 141 on the quick connector support 14 with the third connection hole 145 on the first part 142 and the fourth connection hole on the fan module, through the insertion and fixing of the fourth connector, achieves a stable connection between the quick connector support 14 and the fan module. This not only ensures the airflow guidance of the heat dissipation system and the effective coordination of the liquid cooling system, improving the overall heat dissipation efficiency, but also optimizes the internal layout of the server, reduces space waste, and enhances the overall aesthetics and ease of operation of the system.

[0085] Furthermore, the second part 143 of the quick connector support 14 is provided with a plurality of first positioning parts 146, which cooperate with the first positioning holes on the fan module to achieve rapid positioning during the assembly process, avoid connection failure or poor sealing caused by position error, ensure that each installation can be completed quickly and accurately, significantly improve production efficiency and assembly accuracy, and reduce the risk of operational errors.

[0086] Optionally, the fourth connector is a connecting bolt.

[0087] Optionally, the plurality of third connecting holes 145 and the plurality of fourth connecting holes are bolt holes.

[0088] The chassis 1 includes a housing 15, a cover 16, and a transparent cover 18. The cover 16 has an observation port 161. A limiting part 162 is provided on the edge of the observation port 161 along the width direction of the cover 16. The limiting part 162 protrudes into the housing 15 and is located inside the housing 15. A third connecting part 163 is provided on the limiting part 162. A fourth connecting part 181 is provided on the transparent cover 18. The third connecting part 163 and the fourth connecting part 181 are correspondingly provided. The chassis 1 also includes a second connector. The second connector is interlocked in the third connecting part 163 so as to fix the transparent cover 18 to the cover 16 through the second connector.

[0089] The chassis 1 design in this embodiment significantly improves the server's observability and maintenance convenience through the coordinated optimization of the chassis 15, chassis cover 16, and transparent cover 18, while ensuring the security of system operation. The observation port 161 on the chassis cover 16, combined with the limiting part 162 along its width edge, not only provides a direct view of the server's internal components for real-time monitoring of equipment status, but also, through the structure of the limiting part 162 protruding into the chassis 15, effectively prevents the transparent cover 18 from loosening or falling off during use, ensuring the dustproof and splashproof performance inside the chassis 1 and reducing the probability of system failure due to environmental factors.

[0090] The precise matching of the fourth connection position 181 on the transparent cover 18 with the third connection position 163 on the limiting part 162 of the cover 16, and the through-hole fixing of the second connector, ensures the stable installation of the transparent cover 18 on the cover 16. This tool-free and quick disassembly and assembly design greatly simplifies the equipment maintenance process and improves maintenance efficiency. At the same time, the use of the transparent cover 18 provides users with a clear view of the inside of the server, which is convenient for daily maintenance and troubleshooting, and also enhances the technological feel and aesthetics of the equipment.

[0091] Furthermore, the transparent cover 18 allows for a clear view of the server's operating status and the indicator lights of internal components, facilitating rapid problem identification and subsequent maintenance. This reduces diagnostic difficulties caused by information asymmetry and optimizes the user experience. The integrated design of the limiting part 162 and the third connection part 163 not only enhances the stability of the transparent cover 18 but also ensures a seamless fit between the cover 16 and the chassis 15, improving the overall sealing and protection level of the chassis.

[0092] Optionally, the third connection position 163 is a bolt hole.

[0093] Optionally, the fourth connection position 181 is a bolt hole.

[0094] Optionally, the second connector is a connecting bolt.

[0095] The chassis 1 also includes a transparent panel structure 19, which includes a transparent panel 191 and a panel support frame 192. The panel support frame 192 is detachably mounted on the chassis 15, and the transparent panel 191 is detachably mounted on the side of the panel support frame 192 away from the chassis 15.

[0096] Specifically, the transparent panel 191 is provided with a snap-fit ​​position 190 and a plurality of fifth connecting holes 193, and the panel support frame 192 is provided with a plurality of sixth connecting holes 1921. The plurality of sixth connecting holes 1921 are provided in a one-to-one correspondence with the plurality of fifth connecting holes 193. The panel support frame 192 includes a main body 1924 and a plurality of fifth connectors 1922 provided on the main body 1924. The plurality of fifth connectors 1922 are provided in a one-to-one correspondence with the plurality of sixth connecting holes 1921. A fifth connector 1922 is interlocked within a corresponding sixth connector hole 1921 to fix the transparent panel 191 to the panel support frame 192. A protruding snap-fit ​​portion 1923 is also provided on the main body 1924. The number of snap-fit ​​portions 1923 is the same as the number of snap-fit ​​positions 190. Each snap-fit ​​portion 1923 protrudes from the main body 1924, so that the snap-fit ​​position 190 can snap into its corresponding snap-fit ​​portion 1923.

[0097] The snap-fit ​​position 190 on the transparent panel 191 and the snap-fit ​​part 1923 on the panel support frame 192 form a tight fit, enabling precise positioning of the transparent panel 191 through a simple snap-fit ​​action. This, combined with the insertion and fixation of the fifth connector 1922 on the panel support frame 192 and the fifth connecting hole 193 on the transparent panel 191, creates an efficient and stable transparent panel assembly system. This design not only simplifies the disassembly and assembly process and reduces maintenance time, but also ensures the installation accuracy and stability of the transparent panel 191. It provides maintenance personnel with a clear view of the internal components, facilitating quick identification and troubleshooting, and improving user experience and operational efficiency.

[0098] The main body 1924 and protruding snap-fit ​​portion 1923 of the panel support frame 192 form a stable connection with the chassis 15. This not only enhances the overall rigidity of the transparent panel structure 19, preventing displacement or loosening of the transparent panel during server vibration or movement, but also optimizes the internal space utilization of the chassis through a tight fit with the chassis 15, ensuring server stability and quiet operation. The detachable design of the transparent panel structure 19 not only facilitates regular cleaning and maintenance, preventing dust accumulation from affecting transparency, but also provides the possibility for server customization. For example, users can replace the transparent panel with one of different materials or colors according to their preferences, enhancing the server's aesthetics and market competitiveness.

[0099] Optionally, the fifth connector 1922 is a connecting bolt.

[0100] Optionally, the sixth connecting hole 1921 and the fifth connecting hole 193 are threaded holes.

[0101] Example 2

[0102] This application embodiment also provides an electronic device, which includes a server. The server includes a chassis 1, a graphics card structure 2, and a heat dissipation structure. The graphics card structure 2 and the heat dissipation structure are disposed inside the chassis 1, and the heat dissipation structure is in contact with the graphics card structure 2 to dissipate heat from the graphics card structure 2. The heat dissipation structure is the heat dissipation structure described above.

[0103] This application proposes an electronic device that integrates a server, including a chassis 1, a graphics card structure 2, and a heat dissipation structure. The combination of these three components significantly improves the overall performance and operational reliability of the server. The heat dissipation structure is in close contact with the graphics card structure 2, and through an optimized combined liquid and air cooling mechanism, it greatly improves the heat dissipation efficiency of the graphics card, ensuring temperature control under high-performance computing, thereby enhancing the stability and lifespan of the graphics card. Compared with traditional air cooling methods, the heat dissipation structure in this embodiment not only effectively reduces the noise level of the server, but also optimizes the maintenance process and reduces maintenance time and costs through a tool-free top cover and acrylic panel design. Furthermore, the introduction of the transparent panel provides users with a window to directly observe the internal operating status, improving the speed and accuracy of troubleshooting.

[0104] The above provides a detailed description of the heat dissipation structure and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A heat dissipation structure for mounting on a chassis (1) to contact a graphics card structure (2) disposed on the chassis (1) for heat dissipation of the graphics card structure (2), characterized in that, The heat dissipation structure includes: Cold plate (3), the cold plate (3) has a liquid inlet and a liquid outlet, the cold plate (3) is in contact with the graphics card structure (2); The liquid inlet pipe (4) is connected to the inlet end of the cold plate (3) through which the cooling medium is delivered to the cold plate (3). The liquid outlet pipe (5) is connected to the outlet end of the cold plate (3) so as to lead the cooling medium after dissipating heat from the graphics card structure (2) out of the cold plate (3) through the liquid outlet pipe (5). A support structure (6) is disposed inside the chassis (1). The support structure (6) has a support surface (61) for contacting at least a portion of the inlet pipe (4) and the outlet pipe (5) to support the inlet pipe (4) and the outlet pipe (5).

2. The heat dissipation structure according to claim 1, characterized in that, The support structure (6) includes a support body (62) and a clamp structure (63). The support body (62) has an inclined support surface (61). The clamp structure (63) is detachably mounted on the support surface. The clamp structure (63) includes multiple clamp positions (631). Each clamp position (631) includes a first clamp and a second clamp. There are multiple outlet pipes (5) and multiple inlet pipes (4). Multiple first clamps are arranged in a one-to-one correspondence with multiple inlet pipes (4). Multiple second clamps are arranged in a one-to-one correspondence with multiple outlet pipes (5) so as to clamp the inlet pipes (4) and the outlet pipes (5) through the first clamps and the second clamps.

3. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure further includes a transition component (7) and a liquid inlet manifold (8). The transition component (7) includes a liquid inlet part (71), which has a first inlet (711) and multiple first outlets. The first inlet (711) is connected to the liquid inlet manifold (8). There are multiple liquid inlet pipes (4), and the multiple liquid inlet pipes (4) and multiple first outlets are arranged one-to-one. The inlet end of each liquid inlet pipe (4) is connected to its corresponding first outlet so that the cooling medium introduced from the liquid inlet manifold (8) is diverted to the multiple liquid inlet pipes (4) through the liquid inlet part (71).

4. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure further includes a transition component (7) and a liquid outlet manifold (9). The transition component (7) includes a liquid outlet part (72), which has multiple second inlets and second outlets (721). The second outlets (721) are connected to the liquid outlet manifold (9). There are multiple liquid outlet pipes (5), and the multiple liquid outlet pipes (5) and multiple second inlets are arranged in a one-to-one correspondence. The outlet end of each liquid outlet pipe (5) is connected to the corresponding second inlet so that the cooling medium drawn from the multiple liquid outlet pipes (5) is integrated into the liquid outlet part (72) through the liquid outlet part (72) and drawn out by the liquid outlet manifold (9).

5. The heat dissipation structure according to claim 3 or 4, characterized in that, The heat dissipation structure also includes a support structure (10), which has a first support part (101) and a second support part (102). The first support part (101) is connected to the transition component (7), and the second support part (102) is connected to the chassis (1) to support the transition component (7) through the support structure (10).

6. The heat dissipation structure according to claim 3 or 4, characterized in that, The heat dissipation structure further includes a first vibration damping component (11), which is detachably disposed on the transition component (7); and / or, the heat dissipation structure further includes a second vibration damping component (12), which is detachably disposed on the support surface (61) of the support body (62) of the support structure (6).

7. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure also includes quick connectors (13), which are used to connect to the inlet end of the liquid inlet pipe (4) and the outlet end of the liquid outlet pipe (5), respectively. A fan module is provided inside the chassis (1), and a quick connector support seat (14) is provided on the fan module. Each quick connector support seat (14) is provided with a mounting hole. The two mounting holes are corresponding to the two quick connectors (13). The two quick connectors (13) extend out from their corresponding mounting holes to the outside, so as to support the quick connectors (13) through the quick connector support seat (14).

8. The heat dissipation structure according to claim 1, characterized in that, The chassis (1) includes a chassis body (15), a chassis cover (16) and a transparent cover plate (18). The chassis cover (16) is provided with an observation port (161). A limiting part (162) is provided on the edge of the observation port (161) along the width direction of the chassis cover (16). A third connecting part (163) is provided on the limiting part (162). A fourth connecting part (181) is provided on the transparent cover plate (18). The third connecting part (163) is corresponding to the fourth connecting part (181). The chassis (1) also includes a second connector. The second connector is inserted into the third connecting part (163) so that the transparent cover plate (18) can be fixed on the chassis cover (16) by the second connector.

9. The heat dissipation structure according to claim 1, characterized in that, The chassis (1) also includes a transparent panel structure (19), which includes a transparent panel (191) and a panel support frame (192). The panel support frame (192) is detachably mounted on the housing (15) of the chassis (1), and the transparent panel (191) is detachably mounted on the side of the panel support frame (192) away from the housing (15).

10. An electronic device, characterized in that, The system includes a server, which includes a chassis (1), a graphics card structure (2), and a heat dissipation structure. The graphics card structure (2) and the heat dissipation structure are disposed inside the chassis (1), and the heat dissipation structure is in contact with the graphics card structure (2) to dissipate heat from the graphics card structure (2). The heat dissipation structure is the heat dissipation structure according to any one of claims 1 to 9.

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