Optimization method of heating assembly in glass mold pressing equipment, equipment, medium and product

Abstract

The embodiment of the invention discloses an optimization method and equipment for a heating assembly in glass mold pressing equipment, a medium and a product. The method comprises the following steps: determining interface contact thermal resistance between two contact objects according to contact parameters between the two contact objects; according to the interface contact thermal resistance between the two contact objects and the parameter value of each contact surface of the heating assembly in the glass mold pressing equipment, determining the target interface contact thermal resistance of each contact surface of the heating assembly in the glass mold pressing equipment; establishing a simulation model of the glass mold pressing equipment according to the contact thermal resistance of each target interface and the parameter value of the heating assembly; obtaining a simulation result of the surface temperature of the heating assembly according to the simulation model; and carrying out structure optimization on the heating assembly in the glass mold pressing equipment according to the simulation result to obtain a structure optimization result. The simulation model is established by considering the interface contact thermal resistance of the contact surface in the heating assembly, so that the simulation effectiveness can be improved, the structure optimization of the heating assembly is realized, and the performance of the heating assembly is improved.

Description

Technical Field

[0001] This invention relates to the field of glass forming technology, and in particular to an optimization method, equipment, medium, and product for heating components in glass molding equipment. Background Technology

[0002] With the development of optical technology, the demand for high-quality, high-precision optical devices is increasing. Precision glass molding technology is an effective and efficient method for producing complex-shaped precision micro-optical components. The heating components in the glass molding equipment determine the high quality and efficiency of glass lens production.

[0003] However, existing glass molding equipment suffers from long heating and cooling cycles and low temperature uniformity in its heating components, limiting manufacturing efficiency and glass forming quality. Therefore, it is necessary to optimize the structure of existing heating components and improve their performance to achieve high-temperature, rapid, and uniform heating, thereby enabling efficient and high-quality glass forming. Summary of the Invention

[0004] This invention provides a method, equipment, medium, and product for optimizing heating components in glass molding equipment, in order to establish an effective simulation model of the heating components and perform precise structural optimization of the heating components.

[0005] According to one aspect of the present invention, an optimization method for a heating component in a glass molding apparatus is provided, the method comprising:

[0006] Determine the interfacial thermal resistance between the two contacting objects based on the contact parameters between them.

[0007] Based on the interfacial contact thermal resistance between two contacting objects and the parameter values ​​of each contact surface of the heating component in the glass molding equipment, determine the target interfacial contact thermal resistance of each contact surface of the heating component in the glass molding equipment.

[0008] Based on the contact thermal resistance of each target interface and the parameter values ​​of the heating components, a simulation model of the glass molding equipment is established.

[0009] The simulation results of the surface temperature of the heating component are obtained based on the simulation model; and the structure of the heating component in the glass molding equipment is optimized based on the simulation results to obtain the structure optimization results.

[0010] According to another aspect of the present invention, an optimization device for a heating component in a glass molding apparatus is provided, the device comprising:

[0011] The interface contact thermal resistance determination module is used to determine the interface contact thermal resistance between two contacting objects based on the contact parameters between the two contacting objects.

[0012] The target interface contact thermal resistance determination module is used to determine the target interface contact thermal resistance of each contact surface of the heating component in the glass molding equipment based on the interface contact thermal resistance between two contacting objects and the parameter values ​​of each contact surface of the heating component in the glass molding equipment.

[0013] The simulation model building module is used to build a simulation model of the glass molding equipment based on the contact thermal resistance of each target interface and the parameter values ​​of the heating components.

[0014] The structure optimization module is used to obtain the simulation results of the surface temperature of the heating component based on the simulation model; and to optimize the structure of the heating component in the glass molding equipment based on the simulation results, thereby obtaining the structure optimization results.

[0015] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0016] At least one processor; and a memory communicatively connected to said at least one processor; wherein,

[0017] The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the optimization method for the heating component in the glass molding apparatus according to any embodiment of the present invention.

[0018] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the optimization method for the heating component in the glass molding apparatus according to any embodiment of the present invention.

[0019] According to another aspect of the present invention, a computer program product is provided, comprising a computer program that, when executed by a processor, implements the optimization method for the heating component in a glass molding apparatus according to any embodiment of the present invention.

[0020] The technical solution of this invention determines the interfacial thermal resistance between two contacting objects based on their contact parameters; it then determines the target interfacial thermal resistance of each contact surface of the heating component in the glass molding equipment based on the interfacial thermal resistance between the two contacting objects and the parameter values ​​of each contact surface of the heating component; a simulation model of the glass molding equipment is established based on the target interfacial thermal resistance and the parameter values ​​of the heating component; simulation results of the surface temperature of the heating component are obtained based on the simulation model; and the structure of the heating component in the glass molding equipment is optimized based on the simulation results, resulting in a structural optimization. This solves the optimization problem of the heating component in the glass molding equipment, improves the performance of the heating component, achieves high-temperature, rapid, and uniform heating, and realizes efficient and high-quality glass forming.

[0021] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a flowchart of an optimization method for a heating component in a glass molding apparatus according to Embodiment 1 of the present invention;

[0024] Figure 2 This is a schematic diagram of heat transfer between two contacting objects according to Embodiment 1 of the present invention;

[0025] Figure 3 This is a schematic diagram of an exemplary heating component structure;

[0026] Figure 4 This is a structural diagram of a glass molding equipment;

[0027] Figure 5 This is a schematic diagram of the simulation results of the surface temperature of a heating component according to Embodiment 1 of the present invention;

[0028] Figure 6 This is a flowchart of an optimization method for a heating component in a glass molding apparatus according to Embodiment 2 of the present invention;

[0029] Figure 7 This is a schematic diagram of a steady-state thermal resistance test apparatus according to Embodiment 2 of the present invention;

[0030] Figure 8 This is a schematic diagram of the actual calculated value of contact thermal resistance and the theoretical calculated value of contact thermal resistance of a steady-state thermal resistance test device according to Embodiment 2 of the present invention;

[0031] Figure 9 This is a schematic diagram of temperature measurement of a heating component in a glass molding apparatus according to Embodiment 2 of the present invention;

[0032] Figure 10 This is a schematic diagram comparing the measured temperature data with the simulation data at each preset temperature measurement point;

[0033] Figure 11 A schematic diagram of the simulation results of surface temperature when heat spreaders of different thicknesses are added above the heating assembly is shown.

[0034] Figure 12 The simulation shows the temperature at five preset temperature measurement points when heat spreaders of different thicknesses are added to the heating assembly.

[0035] Figure 13 A schematic diagram showing the length and effective heating area of ​​a heating component is provided.

[0036] Figure 14 Simulation results of surface temperature of heating components under various heating rod arrangement structures are shown;

[0037] Figure 15 The simulation temperature data corresponding to five preset temperature measurement points are shown when the heating rods on the heating assembly are arranged in different ways.

[0038] Figure 16 This is a schematic diagram of a structurally optimized heating component.

[0039] Figure 17 This is a simulation of the temperature at five preset temperature measurement points before and after structural optimization of a heating component.

[0040] Figure 18 This is a schematic diagram of the structure of an optimized device for heating components in a glass molding apparatus according to Embodiment 3 of the present invention;

[0041] Figure 19 This is a schematic diagram of the structure of an electronic device that implements the optimization method of the heating component in the glass molding equipment of the present invention. Detailed Implementation

[0042] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0043] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0044] Example 1

[0045] Figure 1 This is a flowchart of an optimization method for a heating component in a glass molding apparatus according to Embodiment 1 of the present invention. This embodiment is applicable to glass forming using a non-isothermal molding apparatus. The method can be executed by an optimization device for the heating component in the glass molding apparatus. This optimization device can be implemented in hardware and / or software and can be configured in electronic devices such as computers or servers. Figure 1 As shown, the method includes:

[0046] Step 110: Determine the interfacial thermal resistance between the two contacting objects based on the contact parameters between the two contacting objects.

[0047] Contact parameters can include parameters that affect heat transfer. For example, contact parameters may include: surface roughness, thermal conductivity, contact pressure, surface hardness, gas pressure in the gas gap between the two contacting objects, thermal adaptability coefficient, gas gap size, and the thermal conductivity of the gas. Interfacial contact thermal resistance determines the heat transfer coefficient between different contacting plate layers.

[0048] Interfacial contact thermal resistance can be determined in several ways. For example, it can be determined by performing heat transfer analysis on the contact surface, dividing the interfacial contact thermal resistance into the thermal resistance generated in the contact area and the thermal resistance generated by the gas gaps at the contact surface. Alternatively, the interfacial contact thermal resistance can be calculated by measuring the temperature difference at the contact surface and combining it with the heat flux density. Through measurements and calibration under various conditions, a mapping table between interfacial contact thermal resistance and contact parameters can be generated. In applications, the interfacial contact thermal resistance under different conditions can be obtained by consulting the mapping table.

[0049] Optionally, the interfacial contact thermal resistance between the two contacting objects is determined based on the contact parameters between them, including: determining the point contact heat transfer coefficient between the two contacting objects based on the surface roughness, thermal conductivity, contact pressure, and surface hardness of the two contacting objects; determining the gas gap heat transfer coefficient between the two contacting objects based on the gas pressure, thermal adaptability coefficient, gas gap, and thermal conductivity of the gas gap between the two contacting objects; and determining the interfacial contact thermal resistance between the two contacting objects based on the point contact heat transfer coefficient and the gas gap heat transfer coefficient.

[0050] For example, Figure 2 This is a schematic diagram of heat transfer between two contacting objects according to Embodiment 1 of the present invention. Figure 2 As shown, when determining the interfacial contact thermal resistance between two contacting objects, the contact surfaces can be considered as one side being flat and the other rough; the interfacial contact thermal resistance is mainly affected by surface roughness. Since it is a dry contact, gaps generally exist between the contact points, filled with air. Therefore, heat transfer is achieved through conduction, radiation, and convection through the gas contact gaps. The interfacial contact thermal resistance can be divided into two parts: the thermal resistance generated in the contact area and the thermal resistance generated by the gas gaps. The greater the surface roughness, the smaller the contact area, and the more the interfacial contact thermal resistance is generated by the gaps. Heat transfer in the contact area occurs simultaneously through air gaps and point contacts.

[0051] The contact between two isotropic and randomly distributed Gaussian rough surfaces can be modeled as the contact between a single Gaussian surface with combined characteristics of the two surfaces and a perfectly smooth surface. The combined average surface roughness of the two contacting objects is... In the formula, and These are the surface roughnesses of the two contacting objects. The combined average thermal conductivity of the two contacting objects is... In the formula, and Let be the thermal conductivity of the two contacting objects, respectively. The heat transfer coefficient at point contact is... In the formula, The contact pressure is the pressure at the contact area between the two contacting objects. The surface hardness of the contact area between two contacting objects.

[0052] When the gas flow follows the transition and free molecular flow states, the gas gap heat transfer coefficient is: In the formula, The gas constant is The gas pressure in the gas gap. The thermal adaptability coefficient of the gas gap. For gas gaps, Let be the thermal conductivity of the gas. The gas gap is the size of the gap between the contact surfaces of two contacting objects, and is related to the surface roughness. The gas gap is... In the formula, The equivalent elastic modulus of the contact between two elastic bodies , and These are the elastic moduli of the two contacting objects. and These are the Poisson's ratios of the two contacting objects.

[0053] The interfacial heat transfer coefficient between two contacting objects is The interfacial contact thermal resistance is the reciprocal of the interfacial heat transfer coefficient, i.e. .

[0054] By considering the interfacial thermal resistance between two contacting objects as the thermal resistance of point contact and the thermal resistance of gas gap, the reliability of determining the interfacial thermal resistance can be improved, thereby improving the reliability of the calculation of the target interfacial thermal resistance of each contact surface of the heating component, realizing reliable simulation of the heating component, and facilitating accurate structural optimization of the heating component.

[0055] Step 120: Determine the target interface contact thermal resistance of each contact surface of the heating component in the glass molding equipment based on the interface contact thermal resistance between the two contacting objects and the parameter values ​​of each contact surface of the heating component in the glass molding equipment.

[0056] Figure 3 This is a schematic diagram of an exemplary heating component structure. Figure 3 As shown, the heating assembly consists of a heating plate, a heat transfer plate, and a cooling plate, arranged from top to bottom. A heating rod is installed in the heating plate, and a temperature sensor can be installed within the heating plate. Specifically, the temperature sensor can be located directly above the heating rod, or at the horizontal center of the heating plate. A coolant channel can be provided in the cooling plate. (The text abruptly ends here, so the translation stops as well.) Figure 3The heating assembly shown can heat and cool the object. During heating, the resistance heating rod in the heating layer is activated, and it stops during cooling. The cooling of the heating assembly is mainly achieved through convection heat transfer, with heat being carried away by the water channels in the cooling layer and nitrogen gas in the space. The heat transfer plate reduces the large thermal deformation caused by the direct action of the cooling plate on the heating plate, and also reduces the impact of the cooling plate on the overall heating during the heating process. The cooling plate is used to insulate against high temperatures and to cool the object after molding when heating stops.

[0057] In the glass molding process, the glass needs to reach its transition temperature before it can be molded. Initially, the heating element heats the glass to the set temperature at full power. Then, the glass molding equipment closes the mold and presses it to a specified pressure for a certain period before the glass is formed. Next, the pressure is reduced and held. After this holding period, the mold is opened and cooled to a certain temperature before the mold and glass are transferred. This process constitutes a production cycle, so minimizing the heating and cooling time is crucial.

[0058] The heating element can be made of materials that heat up quickly, have low specific heat capacity, and are resistant to thermo-pressure. Since the glass needs to be heated to very high temperatures, and the glass molding process requires a vacuum and nitrogen atmosphere, materials with high oxidation resistance can be selected to fabricate and construct the glass molding heating element. For example, 310s stainless steel can be used as the material for the heating element. For example, each surface of the heating element can be a square with a side length of 120 mm.

[0059] like Figure 3 As shown, there are two contact surfaces between the heating plate and the heat transfer plate, and between the heat transfer plate and the cooling plate. The contact parameters for each contact surface in the heating assembly can be determined based on actual conditions, such as surface roughness, thermal conductivity, contact pressure, surface hardness, gas pressure in the gas gap, thermal adaptability coefficient, gas gap size, and the thermal conductivity of the gas. Substituting the contact parameters of each contact surface in the heating assembly into the calculation formulas for the point contact heat transfer coefficient and the gas gap heat transfer coefficient, the target interface contact thermal resistance of each contact surface is then calculated.

[0060] Step 130: Based on the contact thermal resistance of each target interface and the parameter values ​​of the heating components, establish a simulation model of the glass molding equipment.

[0061] Figure 4 This is a structural diagram of a glass molding device. (Example) Figure 4 As shown, the glass molding equipment includes a frame, a pressing assembly, a heating assembly, and a mold. The heating assembly includes an upper part and a lower part. The mold can be placed between the upper and lower parts of the heating assembly, and the mold can be opened and closed by moving the upper and lower parts of the heating assembly.

[0062] The glass molding process consists of four stages: heating, molding, holding pressure, and cooling. Heat is transferred to the mold through the upper and lower heating elements. Once the mold reaches the appropriate temperature, a pressure-lowering element applies pressure to complete the glass molding process. Then, a holding pressure stage is performed. After the holding pressure is completed, heating is stopped, and the mold cools to a suitable temperature before being removed, completing the production process.

[0063] According to such Figure 3 The heating components shown and Figure 4 The glass molding equipment shown can have its physical fields set, allowing for the creation of a simulation model of the equipment in simulation software. For example, the simulation software can select laminar flow of cooling water, solid-fluid heat transfer, and other parameters to create a multiphysics field with non-isothermal flow. After creating the three-dimensional model of the glass molding equipment, the materials of each component can be set. Table 1 provides an example of parameter values ​​for a glass molding equipment.

[0064] Table 1

[0065]

[0066] The boundary conditions for the glass molding equipment simulation are set according to the parameters in Table 1. Combining the aforementioned method for calculating interfacial contact thermal resistance, equivalent target interfacial contact thermal resistance or equivalent target thermal conductivity coefficients are set for each heat conduction contact surface in the heating assembly. For example, 3500, 7000, and 2000 are defined for the three contact surfaces: heating plate and heat transfer plate, heat transfer plate and cooling plate, and cooling plate and base plate, respectively. The equivalent thermal conductivity (W is watts, m is meters, K is Kelvin) was used to accurately simulate contact thermal resistance, while the convective heat dissipation conditions of all external walls were set to a heat transfer coefficient of 10. The ambient temperature was 15 ℃ (degrees Celsius), the cooling water temperature was set to 6 ℃ and the inlet flow rate was set to 41 L / min (liters / minute), and the heating power of the heating rod was 3600 W.

[0067] After setting the boundary conditions for the glass molding equipment in the simulation software, some meshes can be refined, the transient study step can be selected, and the solver can be started to calculate and obtain simulation results.

[0068] Step 140: Obtain the simulation results of the surface temperature of the heating component based on the simulation model; and optimize the structure of the heating component in the glass molding equipment based on the simulation results to obtain the structural optimization results.

[0069] For example, Figure 5 This is a schematic diagram illustrating the simulation results of the surface temperature of a heating component according to Embodiment 1 of the present invention. Figure 5As shown, the surface temperatures of the heating components exhibit significant differences, indicating poor temperature uniformity. Simulation results reveal that the temperature near the heating rod inlet is considerably higher than that at the far end. This is because the effective heating area of ​​the heating rod does not cover the far end, leading to reduced temperature uniformity. Therefore, based on... Figure 5 The simulation results shown can be used to optimize the structure of the heating component. For example, structural optimization can improve the temperature uniformity of the heating component and increase the effective heating area of ​​the heating rod.

[0070] Optionally, the heating components in the glass molding equipment are structurally optimized based on the simulation results to obtain structural optimization results, including: performing at least one of the following structural optimizations on the heating components in the glass molding equipment based on the simulation results to obtain structural optimization results: whether to add a heat spreader plate to the heating components, the thickness of the added heat spreader plate, the length of the heating rod, and the arrangement structure of the heating rod.

[0071] By comparing simulation results with and without a heat spreader in the heating assembly, it's possible to determine which configuration yields superior performance, thus enabling structural optimization. When adding a heat spreader, different thicknesses can be used, and simulation results can be compared to determine the optimal thickness. Similarly, heating rods of varying lengths can be used, and simulation results can be compared to determine the optimal length. For multiple heating rods, their arrangement can be adjusted; by comparing simulation results under different arrangements, the optimal arrangement can be determined.

[0072] The technical solution of this embodiment determines the calculation method of the interface contact thermal resistance between two contacting objects, and then determines the target interface contact thermal resistance of each contact surface in the heating component accordingly, thereby realizing the establishment of an accurate simulation model of the heating component. Based on the accurate simulation model, the surface temperature of the heating component under various conditions can be simulated. Based on the temperature comparison under various conditions, the structure of the heating component can be optimized, solving the optimization problem of the heating component in the glass molding equipment. Through structural optimization, the performance of the heating component can be improved to achieve high temperature, fast and uniform heating effect, and realize efficient and high-quality glass forming.

[0073] Example 2

[0074] Figure 6 This is a flowchart of an optimization method for a heating component in a glass molding apparatus according to Embodiment 2 of the present invention. This embodiment is a further refinement and addition to the above technical solution, and the technical solution in this embodiment can be combined with various optional solutions in one or more of the above embodiments. Figure 6 As shown, the method includes:

[0075] Step 610: Determine the point contact heat transfer coefficient between the two contacting objects based on their surface roughness, thermal conductivity, contact pressure, and surface hardness.

[0076] Step 620: Determine the heat transfer coefficient of the gas gap between the two contacting objects based on the gas pressure, thermal adaptability coefficient, gas gap, and thermal conductivity of the gas.

[0077] Step 630: Determine the interfacial thermal resistance between the two contacting objects based on the point contact heat transfer coefficient and the gas gap heat transfer coefficient.

[0078] After determining the interfacial thermal resistance between two contacting objects, the validity of the interfacial thermal resistance can be verified to ensure the reliability of the calculation method. For example, an alternative method can be used to determine the reliability of the current calculation method. For instance, by measuring the temperature difference at the contact surface using a steady-state thermal resistance test apparatus and combining this with heat flux density, the actual calculated value of the interfacial thermal resistance can be determined. Then, the actual calculated value is compared with the theoretical calculated value determined in steps 610 to 630 to determine the reliability of the interfacial thermal resistance calculation method determined in steps 610 to 630.

[0079] It should be noted that the specific method for determining the actual calculated value of contact thermal resistance provided below can be used as another method for determining the interfacial contact thermal resistance between two contacting objects in this invention. That is, this invention can use steps 610 to 630 to determine the interfacial contact thermal resistance between two contacting objects; or, it can use the method for determining the actual calculated value of contact thermal resistance described below to determine the interfacial contact thermal resistance between two contacting objects; or, it can combine the two methods to determine the interfacial contact thermal resistance between two contacting objects. For example, after verifying the reliability of the theoretical calculated value through the actual calculated value of contact thermal resistance, the interfacial contact thermal resistance between any two contacting objects can then be determined through steps 610 to 630.

[0080] Optionally, after determining the interfacial contact thermal resistance between the two contacting objects based on the point contact heat transfer coefficient and the gas gap heat transfer coefficient, the method further includes: obtaining the temperature measurement values ​​at each test point in a pre-constructed steady-state thermal resistance test device; wherein the steady-state thermal resistance test device includes a first test piece and a second test piece in contact; determining the heat flux density on both sides of the contact interface between the first test piece and the second test piece based on the temperature measurement values ​​at each test point; determining the contact surface temperature difference when the first test piece and the second test piece are in contact based on the heat flux density, the position of each test point, and the temperature measurement values; and determining the actual calculated value of the contact thermal resistance when the first test piece and the second test piece are in contact based on the contact surface temperature difference and the heat flux density.

[0081] Figure 7 This is a schematic diagram of a steady-state thermal resistance test apparatus according to Embodiment 2 of the present invention. Figure 7 As shown, the steady-state thermal resistance test apparatus, from top to bottom, includes: a pressure platform, a ceramic sheet, a temperature sensor, a metal cylinder, and a heating platform. The metal cylinder is separated from the steady-state thermal resistance test apparatus by the ceramic sheet. The metal cylinder consists of a first test piece and a second test piece in contact. Multiple test points can be set on the metal cylinder, and temperature sensors can be installed at each test point to measure the temperature. By measuring the temperature difference when the first and second test pieces are in contact under constant heat flux and a stable temperature field, and combining this with the heat flux density, the actual calculated value of the contact thermal resistance can be obtained.

[0082] For example, such as Figure 7 As shown, six temperature sensors, labeled 71, 72, 73, 74, 75, and 76, are arranged from top to bottom on a metal cylinder. The contact interface between the first and second test pieces is denoted by 70. The bottom of the steady-state thermal resistance test apparatus can be heated and maintained at a temperature of 100°C. Different pressures, such as 100 N to 500 N, can be applied to the upper part of the apparatus via a pressure platform. The actual calculated value of the contact thermal resistance at the contact interface 70 between the first and second test pieces can be calculated using the steady-state temperature measurements.

[0083] When two solid-solid interfaces with uniform cross-sections are subjected to a certain external load, the two surfaces come into contact and heat is transferred. Since heat can only be transferred in one direction, and the test piece is surrounded by insulation, the heat flow is axially transferred within the test piece. Although a small portion of the heat flow is three-dimensional near the contact interface due to the contraction of thermal flux lines, it becomes one-dimensional again after the heat leaves the contact surface. Thus, from a macroscopic perspective, this type of problem can be treated as a one-dimensional heat conduction problem.

[0084] The heat flux density of the test piece is In the formula, The thermal conductivity of the test piece; For the temperature gradient, a first-order Taylor expansion can be used. Sure. and Test points and The measured temperature value, For test points and The distance between them. In the above exemplary case, the temperature gradient can be determined using the temperature measurements from temperature sensors 71 to 76. The linear deviation of the temperature at multiple test points can be analyzed using the temperature measurements from multiple test points to determine the reliability of the temperature measurement data. The heat flux density on both sides of the contact interface between the first and second test pieces can be determined using the heat flux densities of the first and second test pieces. For example, the heat flux density on both sides of the contact interface between the first and second test pieces can be determined using the average heat flux density of the first and second test pieces.

[0085] The actual calculated contact thermal resistance when the first test piece and the second test piece are in contact is: In the formula, The temperature difference at the contact surfaces when the first test piece and the second test piece come into contact. The heat flux density is measured on both sides of the interface between the first and second test pieces. and These are the high-temperature side temperature and the low-temperature side temperature on both sides of the contact interface between the first test piece and the second test piece, respectively. This can be determined using the temperature measurements from temperature sensors 73 and 74. For example, , , The temperature measurement value is from temperature sensor 74. The distance between the contact interface 70 and the temperature sensor 74; The temperature measurement value is from temperature sensor 73. The distance between the contact interface 70 and the temperature sensor 73.

[0086] Five sets of experiments can be conducted under different pressures, such as 100N, 200N, 300N, 400N, and 500N. Based on the locations of six test points and temperature measurements, the actual calculated values ​​of the contact thermal resistance under the five sets of experiments can be obtained. By employing the steady-state thermal resistance method test apparatus, the actual calculated values ​​of the contact thermal resistance under different forces, different temperature conditions, and different material information can be obtained. Based on this, a mapping table can be formed to obtain the interfacial contact thermal resistance between two contacting objects.

[0087] In this embodiment of the invention, the actual calculated value of the contact thermal resistance obtained through experiments can be used to verify the validity of the theoretical calculated value of the contact thermal resistance in the steady-state thermal resistance test device determined according to steps 610 to 630, so as to determine whether the method of calculating the interface contact thermal resistance between two contacting objects in steps 610 to 630 is effective.

[0088] Optionally, after determining the interfacial contact thermal resistance between the two contacting objects based on the point contact heat transfer coefficient and the gas gap heat transfer coefficient, the method further includes: determining the theoretically calculated value of the contact thermal resistance when the first test piece and the second test piece are in contact, based on the parameter values ​​of the steady-state thermal resistance method test device and the interfacial contact thermal resistance between the two contacting objects; comparing the actual calculated value of the contact thermal resistance with the theoretically calculated value of the contact thermal resistance, and determining the interfacial contact thermal resistance between the two contacting objects as the valid calculation method when the comparison passes.

[0089] Substituting the parameter values ​​of the first and second test pieces in the steady-state thermal resistance test apparatus into the calculation methods in steps 610 to 630, the theoretical calculated value of the contact thermal resistance when the first and second test pieces are in contact is obtained. For example, Table 2 shows the parameter values ​​related to the interface contact thermal resistance in a steady-state thermal resistance test apparatus according to Embodiment 2 of the present invention.

[0090] Table 2

[0091]

[0092] Substitute the parameter values ​​shown in Table 2 into steps 610 to 630 to determine the theoretically calculated contact thermal resistance when the first test piece and the second test piece are in contact in the steady-state thermal resistance test apparatus. Among them, In micrometers, Gpa is gigapascal, and pa is pascal.

[0093] Figure 8 This is a schematic diagram showing the actual calculated value and the theoretical calculated value of the contact thermal resistance of a steady-state thermal resistance test device according to Embodiment 2 of the present invention. Figure 8 As shown, the left side compares the contact thermal resistance when the first and second test pieces are in contact under different contact pressures, while the right side compares the interfacial heat transfer coefficients when the first and second test pieces are in contact under different contact pressures. Figure 8 As shown, with increasing contact pressure, the contact thermal resistance decreases while the interfacial heat transfer coefficient increases. The actual calculated contact thermal resistance is higher than the theoretical calculated value under the same pressure. This is because during the experiment, heat loss occurs during the upward transfer process, reducing the amount of heat transferred to the test piece above through the contact interface, thus causing the actual calculated contact thermal resistance to be higher than the theoretical calculated value. However, the difference between the actual and theoretical calculated contact thermal resistance is less than 5%, verifying the accuracy of determining the interfacial contact thermal resistance in steps 610 to 630. The required interfacial heat transfer coefficients between each plate layer can be obtained based on steps 610 to 630, laying the foundation for subsequent simulations, ensuring the reliability of the simulation model, and consequently ensuring the reliability of the heating component structure optimization.

[0094] Furthermore, when the method of determining the interface contact thermal resistance between the two contacting objects in steps 610 to 630 is an effective calculation method, the target interface contact thermal resistance of each contact surface of the heating component can be determined based on the interface contact thermal resistance between the two contacting objects.

[0095] Step 640: Determine the target interface contact thermal resistance of each contact surface of the heating component in the glass molding equipment based on the interface contact thermal resistance between the two contacting objects and the parameter values ​​of each contact surface of the heating component in the glass molding equipment.

[0096] Step 650: Based on the contact thermal resistance of each target interface and the parameter values ​​of the heating components, establish a simulation model of the glass molding equipment.

[0097] Step 660: Obtain the simulation results of the surface temperature of the heating component based on the simulation model.

[0098] To ensure the reliability of optimizing the heating component structure based on simulation results, the simulation results can be verified to determine the effectiveness of the simulation model. If the simulation model is effective, simulations under different conditions can be performed to optimize the heating component structure.

[0099] Optionally, before obtaining the simulation results of the surface temperature of the heating component based on the simulation model, the method further includes: acquiring the actual temperature change data measured at the preset temperature measurement point of the heating component in the glass molding equipment, and determining the temperature simulation change data corresponding to the preset temperature measurement point based on the simulation results; comparing the actual temperature change data at the preset temperature measurement point with the temperature simulation change data, and determining the simulation model to be valid when the comparison passes.

[0100] Figure 9 This is a schematic diagram of temperature measurement of a heating component in a glass molding apparatus according to Embodiment 2 of the present invention. Figure 9 As shown, temperature sensors can be set at preset temperature measurement points on the heating assembly to measure temperature changes. For example, a coordinate system can be established with the insertion direction of the heating rod in the heating assembly as the positive y-axis and the right horizontal direction as the positive x-axis. A circle with a preset radius (e.g., 30) is drawn with the origin (0,0) of the coordinate system as the center, and multiple temperature sensors (e.g., 4) are evenly distributed on the circle. Temperature sensors can also be set at the center of the circle. For example, as shown... Figure 9 As shown, the preset temperature measurement points are 91, 92, 93, 94, and 95, with corresponding coordinates of (0,0), (30,0), (0,30), (-30,0), and (0,-30), respectively.

[0101] By conducting multiple simulations, it can be ensured that the simulation results are stable and consistent, and the data is exported only after there are no significant changes. Figure 10 This is a schematic diagram comparing the measured temperature data with the simulated temperature data at each preset temperature measurement point. For example... Figure 10 As shown, the simulation curves at each preset temperature measurement point share a common characteristic with the experimental curves: when the temperature drops from the high point of 500℃ to 300℃, the rate of temperature decrease remains relatively consistent. However, after dropping below 300℃, the simulated cooling rate is significantly higher than the experimental rate. This is because the cooling efficiency of the circulating water decreases after a certain period, and the power of the chiller cannot fully maintain the initial low temperature of the water. As the working time increases, the initial temperature of the cooling water will increase. In the simulation model, the inlet temperature remains constant at 6℃, so the simulated cooling rate is faster than the experimental cooling rate. At 14.25 minutes, the simulated temperature reaches its peak, which is higher than the tested peak temperature. This is because in heating and cooling experiments, the higher the temperature, the greater the radiative heat dissipation, and the more obvious the radiative effect. Therefore, it can be clearly seen that the highest experimental temperature at the five preset temperature measurement points is significantly lower than the highest simulated temperature. Figure 10 As can be seen, the heating and cooling curves are basically consistent, and the error between the simulation and experimental values ​​is very small. The reliability of the simulation model and simulation results is well verified by five preset temperature measurement points, and the non-uniformity of heat transfer in the heating component is reflected. This provides a foundation for establishing simulation models under more complex conditions in the future. In other words, when the simulation model is effective, the heating component can be simulated under various parameters to obtain corresponding reliable simulation results, and the structure of the heating component can be optimized based on the simulation results.

[0102] Step 670: Based on the simulation results, perform at least one of the following structural optimizations on the heating component in the glass molding equipment to obtain the structural optimization results: whether to add a heat spreader to the heating component, the thickness of the added heat spreader, the length of the heating rod, and the arrangement structure of the heating rod.

[0103] Optionally, the structural optimization result includes at least one of the following: adding a heat spreader plate to the heating component, adding a heat spreader plate to the heating component with a thickness greater than 0 mm and less than or equal to 20 mm, the length of the heating rod being greater than the overall side length of the heating component before optimization, and the arrangement structure of the heating rod being a horizontal single-layer flat paving.

[0104] According to such Figure 5 The simulation results of the heating component show that there is a problem of poor surface temperature uniformity. In order to improve the temperature uniformity of the heating component, a heat spreader can be added to the heating component. The simulation results are used to verify the heating effect with and without the heat spreader, so as to determine whether to add a heat spreader and the thickness of the heat spreader.

[0105] The vapor chamber can be a highly thermally conductive flat plate that transforms point-like or linear non-uniform heat flow into a uniform surface heat flow through its excellent lateral heat conduction capability. Combined with the buffering effect of its heat capacity, its surface becomes an ideal heating plane with highly uniform temperature, thus greatly improving the temperature uniformity of the uppermost surface of the heating assembly. When adding a vapor chamber to an existing heating assembly, the vapor chamber material can be the same as the main body of the heating assembly. The vapor chamber size can be set as a block object with an area of ​​120mm × 120mm. For example, the vapor chamber thickness can be selected within the range of 0mm to 50mm. For instance, vapor chambers with different thicknesses such as 10mm, 15mm, and 20mm can be used. Following steps 610 to 630, the interfacial contact thermal resistance between the vapor chamber and the heating plate is calculated under the same pressure and conditions, and the simulation model of the heating assembly is updated.

[0106] Figure 11 This diagram illustrates simulation results of surface temperatures when heat exchangers of varying thicknesses are added above the heating assembly. Figure 11 It can be seen that stacking a heat spreader can reduce the average temperature of the heating element and decrease the heating rate. This is because after stacking the heat spreader, the heat spreader itself will also absorb heat, increasing the volume of the heating element. Figure 12 The simulation shows the temperature at five preset temperature measurement points when heat spreaders of different thicknesses are added to the heating assembly. Figure 12 The preset temperature measurement points are distinguished by coordinates. Figure 12 It can be seen that when the heat spreader thickness is 0mm (i.e., no heat spreader is added above the heating component), the simulated temperature difference at the preset temperature measurement point reaches 170℃; when the heat spreader thickness is 10mm, the simulated temperature difference at the preset temperature measurement point reaches 95℃; when the heat spreader thickness is 15mm, the simulated temperature difference at the preset temperature measurement point reaches 93℃; and when the heat spreader thickness is 20mm, the simulated temperature difference at the preset temperature measurement point reaches 87℃. According to... Figure 11 as well as Figure 12 It is known that adding a heat spreader has a significant impact on the temperature uniformity of the heating element. However, while a thicker heat spreader can improve temperature uniformity, it can also reduce heating efficiency. Therefore, when optimizing the structure of the heating element, both temperature uniformity and heating efficiency requirements should be considered comprehensively, and the thickness of the heat spreader added to the heating element should be greater than 0 mm and less than or equal to 20 mm. For example, a heat spreader with a thickness of 10 mm can be selected.

[0107] A vapor chamber inherently possesses a certain mass and heat capacity. This means that the vapor chamber needs to absorb a certain amount of heat to raise its own temperature. This characteristic of the vapor chamber acts as a "thermal buffer" or "filter." The vapor chamber can absorb small, instantaneous power fluctuations or localized non-uniformities in the heat source, preventing these fluctuations from being immediately transmitted to the surface of the upper heating element. The vapor chamber releases heat to the load or workpiece above in a smoother and more stable manner. In certain specific heating scenarios, vapor chambers have specific structural designs. For example, they can be designed as a flat vacuum cavity with capillary structures on its inner walls and filled with a small amount of working fluid. In glass molding equipment, due to the vacuum performance of the equipment and the high flatness and parallelism requirements of the upper and lower molding components, the vapor chamber can only be a plate with a simple structure. The array-type heating rod structure in the heating element often results in uneven heat source distribution. The temperature is lower at the gaps between the heating rods and higher directly above; heat is mainly transferred vertically upwards, with very weak horizontal heat exchange. This results in a high temperature area directly above the heating rod and a low temperature area above the gap, creating "hot spots" and "cold spots." The vapor chamber can be made of materials with high thermal conductivity (such as aluminum, copper, copper alloys, or even graphene). When the vapor chamber is placed on a heat source, it immediately absorbs heat from the area directly opposite the heat source. Due to the extremely fast thermal conductivity of the vapor chamber material, heat quickly diffuses laterally from the high-temperature areas to the low-temperature areas. This process continues until the entire upper and lower surfaces of the plate tend to have a very uniform temperature. Therefore, by adding a vapor chamber to the existing heating assembly, using the same material as the main body and setting the vapor chamber as a 120mm × 120mm block with different thicknesses of 10mm, 15mm, and 20mm, the uniformity of the heating assembly can be observed to be improved.

[0108] According to such Figure 12 The temperature readings show that although a heat spreader was added, the temperature uniformity did not meet the expected target. Specifically, according to... Figure 12 It can be seen that the temperature difference in the same horizontal direction (preset temperature measuring points 71, 72, and 74) is not significant, but the temperature difference in the vertical direction (preset temperature measuring points 71, 73, and 75) is very large. Analysis shows that the temperature difference in the horizontal direction is related to the distribution of the heating rods and heat transfer. However, the temperature difference in the vertical direction is related to the effective heating area of ​​the heating rods. The length of the heating rod does not represent its actual effective heating length.

[0109] Figure 13 A schematic diagram showing the length and effective heating area of ​​a heating component is provided. Figure 13As shown, the overall side length of the heating assembly is 120mm. For a 90mm long heating rod, the effective heating range is 70mm from the end of the heating rod. Therefore, to prevent the effective heating length from not covering the 120mm vertical distance of the heating assembly, the heating rod length can be chosen to be greater than the overall side length of the heating assembly before optimization. For example, for a heating assembly with an overall side length of 120mm, a heating rod with a length of 140mm can be selected to achieve an effective heating range of 120mm.

[0110] Based on simulation results, the inventors discovered that temperature uniformity is also related to the arrangement of the heating rods. Since the heating assembly has a certain mass and heat capacity, and needs to be repeatedly heated and cooled during the glass molding process, its volume should be minimized as much as possible. The volume of the heating assembly is closely related to the distribution of the heating rods.

[0111] By designing various arrangement structures for the heating rods and obtaining corresponding simulation results, the optimal arrangement structure for the heating rods can be determined. Figure 14 Simulation results of the surface temperature of the heating assembly under various heating rod arrangement structures are shown. For example... Figure 14 As shown, for example, the heating rods can be distributed in one or two layers. The heating rod area is set to 120mm × 120mm, and six heating rods are arranged. When the heating rods are distributed in one layer, due to volume limitations, the diameter of the heating rod is 10mm, and the heating power is 500W (originally, the diameter was 16mm, and the heating power was 600W). To reduce the computational load of the simulation, only the heating plate, heat transfer plate, and heat spreader can be simulated, with the heating time set to 10 minutes, and other boundary conditions remaining the same. When the heating rods are distributed in two layers, the thickness of the heating layer formed by the heating rods is 50mm, while the thickness of the heating layer with a 1×6 heating rod arrangement is only 20mm, effectively reducing the volume of the heating plate, while the structure of the heat spreader and heat transfer plate remains unchanged.

[0112] Simulations were performed under the same conditions based on the above structures. Figure 15 The simulation results show the simulated temperatures at five preset temperature measurement points for different arrangements of the heating rods on the heating assembly. According to... Figure 15 The simulation results show that a 1×6 arrangement of heating rods results in better temperature uniformity and a faster heating rate. When the effective heating length of the heating rods completely covers the vertical length of the heating component, the temperature difference is mainly reflected in the horizontal distribution. Therefore, choosing a 1×6 arrangement, i.e., a horizontal single-layer flat arrangement, for the heating rods of the heating plate can improve the heating performance and heat uniformity of the heating component.

[0113] Figure 16 This is a schematic diagram of a structurally optimized heating component. (Example) Figure 16As shown, the optimized heating assembly, compared to existing technologies, adds a heat spreader plate with a thickness of up to 10mm; the heating rods are longer, allowing the effective heating area to cover the entire heating assembly, such as a heating rod length of 140mm; the heating rods are laid out in a horizontal single layer, such as in a 1×6 arrangement. Furthermore, the number of temperature sensors can be increased to the same number as the heating rods, allowing for individual control of each heating rod and improving the temperature uniformity of the heating assembly.

[0114] Figure 17 This is a simulation of the temperature at five preset temperature measurement points before and after structural optimization of a heating component. Based on... Figure 17 The temperature comparison shown indicates that after the heating component structure was optimized, the temperature difference between the five preset temperature measurement points was small, all less than 5℃, indicating good thermal uniformity. Compared with the existing heating component, the average heating rate of the heating component increased from the original 31.3℃ / min to 36.2℃ / min after optimization; and the power of the heating rod was reduced from the original 3600W to 3000W, resulting in a certain energy-saving effect.

[0115] The technical solution of this invention determines the point contact heat transfer coefficient between two contacting objects based on their surface roughness, thermal conductivity, contact pressure, and surface hardness; it determines the gas gap heat transfer coefficient between the two contacting objects based on the gas pressure, thermal adaptability coefficient, gas gap, and thermal conductivity of the gas gap; it determines the interfacial contact thermal resistance between the two contacting objects based on the point contact heat transfer coefficient and the gas gap heat transfer coefficient; and it determines the heating element in the glass molding equipment based on the interfacial contact thermal resistance and the parameter values ​​of each contact surface of the heating element. The target interface thermal resistance of each contact surface of the component is determined; based on the target interface thermal resistance and the parameter values ​​of the heating component, a simulation model of the glass molding equipment is established; the simulation results of the surface temperature of the heating component are obtained based on the simulation model; based on the simulation results, at least one of the following structural optimizations is performed on the heating component in the glass molding equipment to obtain the structural optimization results: whether to add a heat spreader plate to the heating component, the thickness of the added heat spreader plate, the length of the heating rod, and the arrangement structure of the heating rod. This solves the optimization problem of the heating component in the glass molding equipment. Through structural optimization, the performance of the heating component can be improved to achieve high temperature, fast and uniform heating effect, and realize efficient and high-quality glass forming.

[0116] Specifically, vapor chambers can effectively improve the temperature uniformity of heating components, but they reduce the heating rate. Choosing a vapor chamber with a smaller thickness can avoid this reduction in heating rate. The effective heating area of ​​the heating rods should cover the heating component. The arrangement of the heating rods affects temperature uniformity and heating / cooling rates. The arrangement of the heating rods should be optimized to minimize the volume of the heating plate. The optimized structure achieves temperature uniformity within 5°C and increases the heating rate by more than 15%. Heating components made of heat-resistant materials with fast heat transfer and low specific heat capacity will have excellent thermal properties. Adding temperature sensors, with each sensor corresponding to a single heating rod, and using temperature control can improve temperature uniformity.

[0117] Example 3

[0118] Figure 18 This is a schematic diagram of the structure of an optimized heating component in a glass molding apparatus according to Embodiment 3 of the present invention. Figure 18 As shown, the device includes: an interface contact thermal resistance determination module 181, a target interface contact thermal resistance determination module 182, a simulation model establishment module 183, and a structure optimization module 184. Wherein:

[0119] Interface contact thermal resistance determination module 181 is used to determine the interface contact thermal resistance between two contacting objects based on the contact parameters between the two contacting objects.

[0120] The target interface contact thermal resistance determination module 182 is used to determine the target interface contact thermal resistance of each contact surface of the heating component in the glass molding equipment based on the interface contact thermal resistance between two contacting objects and the parameter values ​​of each contact surface of the heating component in the glass molding equipment.

[0121] The simulation model building module 183 is used to build a simulation model of the glass molding equipment based on the contact thermal resistance of each target interface and the parameter values ​​of the heating components.

[0122] The structure optimization module 184 is used to obtain the simulation results of the surface temperature of the heating component based on the simulation model; and to optimize the structure of the heating component in the glass molding equipment based on the simulation results, so as to obtain the structure optimization results.

[0123] Optionally, the interface contact thermal resistance determination module 181 includes:

[0124] The point contact heat transfer coefficient determination unit is used to determine the point contact heat transfer coefficient between two contacting objects based on their surface roughness, thermal conductivity, contact pressure, and surface hardness.

[0125] The gas gap heat transfer coefficient determination unit is used to determine the gas gap heat transfer coefficient between two contacting objects based on the gas pressure, thermal adaptability coefficient, gas gap, and thermal conductivity of the gas gap.

[0126] The interface contact thermal resistance determination unit is used to determine the interface contact thermal resistance between two contacting objects based on the point contact heat transfer coefficient and the gas gap heat transfer coefficient between the two contacting objects.

[0127] Optionally, the interface contact thermal resistance determination module 181 includes:

[0128] A temperature measurement acquisition unit is used to acquire temperature measurement values ​​at each test point in a pre-constructed steady-state thermal resistance test apparatus; wherein the steady-state thermal resistance test apparatus includes a first test piece and a second test piece in contact with each other;

[0129] The heat flux density determination unit is used to determine the heat flux density on both sides of the contact interface between the first test piece and the second test piece based on the temperature measurement values ​​at each test point.

[0130] The contact surface temperature difference determination unit is used to determine the contact surface temperature difference when the first test piece and the second test piece are in contact, based on the heat flux density, the location of each test point, and the temperature measurement value.

[0131] The actual calculated value determination unit for contact thermal resistance is used to determine the actual calculated value of contact thermal resistance when the first test piece and the second test piece are in contact, based on the temperature difference and heat flux density of the contact surface.

[0132] Optionally, the interface contact thermal resistance determination module 181 includes:

[0133] The contact thermal resistance theoretical calculation value determination unit is used to determine the theoretical calculation value of the contact thermal resistance when the first test piece and the second test piece are in contact, based on the parameter values ​​of the steady-state thermal resistance method test device and the interface contact thermal resistance between the two contacting objects.

[0134] The contact thermal resistance comparison unit is used to compare the actual calculated value of contact thermal resistance with the theoretical calculated value of contact thermal resistance. When the comparison is successful, the interface contact thermal resistance between the two contacting objects is determined to be the valid calculation method.

[0135] Optionally, the device may also include:

[0136] The temperature data acquisition module is used to acquire the actual temperature change data measured at the preset temperature measurement point of the heating component in the glass molding equipment before obtaining the simulation result of the surface temperature of the heating component based on the simulation model, and to determine the temperature simulation change data corresponding to the preset temperature measurement point based on the simulation result.

[0137] The simulation model verification module is used to compare the actual temperature change data at the preset temperature measurement points with the simulated temperature change data. If the comparison is successful, the simulation model is determined to be valid.

[0138] Optional, the structure optimization module 184 includes:

[0139] The structural optimization unit is used to perform at least one of the following structural optimizations on the heating components in the glass molding equipment based on simulation results, and obtain the structural optimization result:

[0140] Whether a heat spreader is added to the heating assembly, the thickness of the added heat spreader, the length of the heating rod, and the arrangement structure of the heating rod.

[0141] Optionally, the structural optimization results may include at least one of the following:

[0142] A heat spreader plate is added to the heating component; the thickness of the heat spreader plate is greater than 0 mm and less than or equal to 20 mm; the length of the heating rod is greater than the overall side length of the heating component before optimization; and the arrangement structure of the heating rod is a horizontal single-layer flat laying.

[0143] The optimization device for the heating component in the glass molding equipment provided in this embodiment of the invention can execute the optimization method for the heating component in the glass molding equipment provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the method.

[0144] Example 4

[0145] Figure 19 A schematic diagram of an electronic device 10, which can be used to implement embodiments of the present invention, is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0146] like Figure 19 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) or random access memory (RAM), communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded into the RAM 13 from the storage unit 18. The RAM 13 can also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. Input / output (I / O) interfaces are also connected to the bus 14.

[0147] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0148] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the optimization method for heating components in a glass molding apparatus.

[0149] In some embodiments, the method for optimizing the heating component in a glass molding apparatus can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or mounted on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the method for optimizing the heating component in a glass molding apparatus described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform the method for optimizing the heating component in a glass molding apparatus by any other suitable means (e.g., by means of firmware).

[0150] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0151] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0152] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, RAM, ROM, erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0153] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0154] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0155] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0156] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0157] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. An optimization method for a heating component in a glass molding apparatus, characterized in that, include: Determine the interfacial thermal resistance between the two contacting objects based on the contact parameters between them. Based on the interfacial contact thermal resistance between two contacting objects and the parameter values ​​of each contact surface of the heating component in the glass molding equipment, determine the target interfacial contact thermal resistance of each contact surface of the heating component in the glass molding equipment. Based on the contact thermal resistance of each target interface and the parameter values ​​of the heating components, a simulation model of the glass molding equipment is established. The simulation results of the surface temperature of the heating component are obtained based on the simulation model; and the structure of the heating component in the glass molding equipment is optimized based on the simulation results to obtain the structure optimization results.

2. The method according to claim 1, characterized in that, The interfacial contact thermal resistance between two contacting objects is determined based on the contact parameters between them, including: The point contact heat transfer coefficient between the two contacting objects is determined based on their surface roughness, thermal conductivity, contact pressure, and surface hardness. The heat transfer coefficient of the gas gap between two contacting objects is determined based on the gas pressure, thermal adaptability coefficient, gas gap, and thermal conductivity of the gas. The interfacial contact thermal resistance between the two contacting objects is determined based on the point contact heat transfer coefficient and the gas gap heat transfer coefficient between the two contacting objects.

3. The method according to claim 2, characterized in that, The interfacial contact thermal resistance between two contacting objects is determined based on the contact parameters between them, including: The temperature measurement values ​​at each test point in a pre-constructed steady-state thermal resistance test apparatus are obtained; wherein the steady-state thermal resistance test apparatus includes a first test piece and a second test piece in contact with each other; Based on the temperature measurements at each test point, determine the heat flux density on both sides of the interface between the first and second test pieces. The temperature difference at the contact surface when the first test piece and the second test piece come into contact is determined based on the heat flux density, the location of each test point, and the temperature measurement value. Based on the temperature difference at the contact surface and the heat flux density, the actual calculated value of the contact thermal resistance when the first test piece and the second test piece are in contact is determined.

4. The method according to claim 3, characterized in that, The interfacial contact thermal resistance between two contacting objects is determined based on the contact parameters between them, including: Based on the parameter values ​​of the steady-state thermal resistance test device and the interfacial contact thermal resistance between the two contacting objects, the theoretical calculated value of the contact thermal resistance when the first test piece and the second test piece are in contact is determined. The actual calculated value of the contact thermal resistance is compared with the theoretical calculated value of the contact thermal resistance. If the comparison is successful, the interface contact thermal resistance between the two contacting objects is determined to be the effective calculation method.

5. The method according to claim 1, characterized in that, Before obtaining the simulation results of the surface temperature of the heating component based on the simulation model, the method further includes: Obtain the actual temperature change data measured at the preset temperature measurement point of the heating component in the glass molding equipment, and determine the simulated temperature change data corresponding to the preset temperature measurement point based on the simulation results; The actual temperature change data at the preset temperature measurement point is compared with the temperature simulation change data. If the comparison is successful, the simulation model is determined to be valid.

6. The method according to claim 1, characterized in that, Based on the simulation results, the heating components in the glass molding equipment were structurally optimized, resulting in the following optimization results: Based on the simulation results, at least one of the following structural optimizations is performed on the heating component in the glass molding equipment to obtain the structural optimization result: Whether a heat spreader is added to the heating assembly, the thickness of the added heat spreader, the length of the heating rod, and the arrangement structure of the heating rod.

7. The method according to claim 6, characterized in that, The structural optimization results include at least one of the following: A heat spreader plate is added to the heating component; the thickness of the heat spreader plate is greater than 0 mm and less than or equal to 20 mm; the length of the heating rod is greater than the overall side length of the heating component before optimization; and the arrangement structure of the heating rod is a horizontal single-layer flat laying.

8. An electronic device, characterized in that, The electronic device includes: At least one processor; and a memory communicatively connected to said at least one processor; wherein, The memory stores a computer program executable by the at least one processor, which enables the at least one processor to perform an optimization method for the heating component in the glass molding apparatus according to any one of claims 1-7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed by a processor, implement the method for optimizing the heating component in the glass molding apparatus according to any one of claims 1-7.

10. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements an optimization method for the heating component in a glass molding apparatus according to any one of claims 1-7.

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