Non-contact HF pure ceramic integrated card structure and preparation process thereof

Abstract

The invention relates to the technical field of RFID integrated cards, and discloses a non-contact HF pure ceramic integrated card structure and a preparation process thereof. The non-contact HF pure ceramic integrated card structure comprises zirconia ceramic substrates which are opposite up and down, an aluminum oxide antenna base layer between the two substrates, multiple antenna layers on the front and back surfaces of the aluminum oxide antenna base layer, a glass glaze bonding layer for connecting the layers, a via hole penetrating through the aluminum oxide antenna base layer, and an HF chip, high-temperature-resistant insulating layers are arranged among the multiple antenna layers and are electrically conducted through conducting holes, the zirconia ceramic substrate surface layer is provided with a slot for accommodating an HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module materials. According to the non-contact ceramic card, the glass glaze bonding layer, the zirconia ceramic substrate and the alumina antenna base layer are sintered at high temperature to form an integrated structure, all layers of the card body are firmly connected, and the problem of interlayer separation caused by insufficient long-term stability due to the fact that a traditional non-contact ceramic card is bonded through a bonding agent is solved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of RFID integrated cards, in particular to a non-contact HF pure ceramic integrated card structure and a preparation process thereof. BACKGROUND

[0002] As an important application carrier of wireless radio frequency identification technology, the non-contact HF card has deeply penetrated into diversified fields such as identity recognition, financial payment, access control management and high-end consumption, and is more widely applied to scenes such as government affairs security, high-end member service, luxury product traceability, medical health management and scenes with higher requirements for card quality and safety, owing to the core advantages of convenient and efficient reading and writing operation, identification distance adaptation to daily scenes, strong data transmission stability and outstanding anti-interference ability. The ceramic HF card stands out owing to its excellent physical and chemical properties and becomes the preferred substrate of high-end non-contact HF cards. The ceramic HF card has high hardness, excellent wear and scratch resistance, is not easy to produce scratches or deformation during long-term use, can maintain the integrity and high-end texture of the appearance, has strong corrosion resistance and anti-aging ability, can resist the influence of various complex working conditions such as acid and alkali environment and high and low temperature changes, and has a service life far exceeding that of traditional materials. The ceramic HF card has stable physical structure and chemical inertness, does not deteriorate due to environmental factors, and has a high-end delicate appearance texture by nature, which perfectly meets the dual demands of card quality and appearance value in high-end scenes.

[0003] Traditional non-contact ceramic cards mostly adopt multiple ceramic substrates to form a card body through adhesives. Due to the insufficient long-term stability of the adhesives, the card body is prone to interlayer separation after long-term use. SUMMARY

[0004] In view of the deficiencies of the prior art, the application provides a non-contact HF pure ceramic integrated card structure and a preparation process thereof, which solves the problem that traditional non-contact ceramic cards mostly adopt multiple ceramic substrates to form a card body through adhesives, and the card body is prone to interlayer separation after long-term use due to the insufficient long-term stability of the adhesives.

[0005] To achieve the above object, the application is implemented by the following technical scheme: A non-contact HF pure ceramic integrated card structure comprises: upper and lower zirconia ceramic substrates, an alumina antenna base layer between the two zirconia ceramic substrates, a multilayer antenna layer formed on the front and back surfaces of the alumina antenna base layer, a glass glaze adhesive layer for connecting the two zirconia ceramic substrates and the alumina antenna base layer, a through hole penetrating the alumina antenna base layer, and an HF chip; a high-temperature-resistant insulating layer is arranged between the multilayer antenna layer, the multilayer antenna layer is electrically connected through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are sintered at high temperature to form an integrated structure, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material.

[0006] By adopting the above technical scheme, the zirconia ceramic substrate and the alumina antenna base layer are sintered at high temperature to form an integrated structure by the glass glaze adhesive layer, and then the layers of the card body are firmly connected as a whole, thereby improving the problem that the traditional non-contact ceramic card is mostly formed by a plurality of ceramic substrates which are bonded by an adhesive to form a card body, and the card body is prone to interlayer separation after long-term use due to the insufficient long-term stability of the adhesive.

[0007] A preparation process of a non-contact HF pure ceramic integrated card structure comprises the following steps:

[0008] S1, zirconia ceramic substrate preparation: four square zirconia ceramic powder is pressed into a sheet embryo, a front and back zirconia ceramic substrate embryo required for a card is prepared, a slot for accommodating an HF chip is processed on the surface layer zirconia ceramic substrate embryo, and the sheet embryo is sintered at high temperature, and then polished to a preset thickness;

[0009] S2, alumina antenna base layer through hole processing: a through hole is processed on an alumina substrate, and a conductive material is filled in the hole;

[0010] S3, antenna printing: a multilayer HF radio frequency antenna is printed on the front and back surfaces of the alumina substrate, a high-temperature-resistant insulating layer is arranged between the multilayer antenna, and each layer of antenna is connected through the through hole to form an alumina antenna base layer;

[0011] S4, interlayer bonding treatment: a glass glaze adhesive layer is printed on the surface of the antenna layer of the alumina antenna base layer;

[0012] S5, chip connection: the HF chip is connected with the antenna layer in the slot of the surface layer zirconia ceramic substrate;

[0013] S6, slot filling: the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material;

[0014] S7, overall sintering and surface treatment: the front and back zirconia ceramic substrates and the alumina antenna base layer treated in S4 are assembled in position, fixed by a silicon carbide jig, and then overall sintered, and the surface of the card is planarized.

[0015] Preferably, the preparation of the zirconia ceramic substrate in S1 comprises the following steps:

[0016] The tetragonal zirconia ceramic powder is mixed with a dispersant, a binder and a solvent to obtain a uniform ceramic slurry;

[0017] The ceramic slurry is stirred;

[0018] The ceramic slurry is calendered into a sheet embryo using a calender;

[0019] The sheet embryo is dried;

[0020] The dried sheet embryo is cut and the edges are trimmed;

[0021] A slot for accommodating an HF chip is processed on the surface layer sheet embryo;

[0022] The cut, trimmed and slotted sheet embryo is sintered at a high temperature of 1200 to 1400 degrees Celsius for 6 hours;

[0023] The sintered zirconia ceramic substrate is polished to a preset card standard thickness.

[0024] Preferably, the processing of the through hole on the alumina substrate in S2 comprises the following steps:

[0025] The position and number of the through hole are determined according to design requirements;

[0026] A laser device or a CNC device is used to drill a hole on the alumina substrate;

[0027] The hole diameter of the through hole is controlled to be 0.15 to 1.5 mm;

[0028] The hole wall after drilling is cleaned to remove ceramic dust and residues.

[0029] Preferably, the filling of the conductive material in the hole in S2 comprises the following steps:

[0030] The silver paste or copper-silver mixed paste is adjusted to a suitable filling flow state with a viscosity of 100 to 1000 mPa·s;

[0031] The conductive paste is injected into the processed through hole until it is filled to the brim;

[0032] The filled conductive paste is placed in an oven for setting treatment, the setting temperature is 800 degrees Celsius, and the setting time is 2 hours;​

[0033] The filled hole surface is polished until the conductive material is flush with the front and back surfaces of the alumina substrate.

[0034] Preferably, the printing of the multi-layer HF radio frequency antenna in S3 comprises the following steps:

[0035] The silver paste or copper-silver mixed paste is prepared to a state suitable for screen printing with a viscosity of ;

[0036] A screen template for 200 to 300 purposes is made according to the antenna design;

[0037] The first layer of HF radio frequency antenna is printed on the front surface of the alumina substrate using a screen printing device;

[0038] The printed first layer of antenna is subjected to a drying process at a temperature of 800 degrees Celsius for 2 to 4 hours;

[0039] A high-temperature-resistant insulating layer is printed on the first layer of antenna and subjected to a drying and curing process;

[0040] The above steps of printing the antenna and the insulating layer are repeated to complete the printing of the multi-layer antenna;

[0041] The multi-layer HF radio frequency antenna is printed on the back surface of the alumina substrate using a screen printing device, and the printing and drying processes are consistent with those on the front surface;

[0042] The printed multi-layer antenna on the back surface is subjected to a drying process at a temperature of 800 degrees Celsius for 2 to 4 hours.

[0043] Preferably, the connecting of each layer of antenna through the through-hole in S3 comprises the following steps:

[0044] It is confirmed that the conductive material in the through-hole in S2 has been shaped and completed;

[0045] When printing each layer of antenna, make the conductive material in the through-hole contact with each layer of antenna;

[0046] The connecting part of the through-hole and each layer of antenna is subjected to a drying process at a temperature of 800 degrees Celsius for 2 to 4 hours.

[0047] Preferably, the printing of the glass glaze adhesive layer in S4 comprises the following steps:

[0048] The glass glaze paste is prepared to a state suitable for screen printing;

[0049] A screen template for 200 to 300 purposes is made, which covers the area where the antenna layer surface is attached to the zirconia ceramic substrate;

[0050] Printing a glass glaze adhesive layer on the surface of the front antenna layer of the alumina antenna base layer using a silk screen printing device;

[0051]

[0052] Printing a glass glaze adhesive layer on the surface of the back antenna layer of the alumina antenna base layer using a silk screen printing device;

[0053]

[0054] Preferably, the connecting of the HF chip with the antenna layer in S5 comprises the following steps:

[0055] Placing the HF chip in a slot, and aligning the chip pins with the antenna terminals, wherein the slot meets the installation requirements of the size of the HF chip;

[0056] Connecting the chip pins with the antenna terminals by wire bonding, flip chip, COM module coupling, COB soldering, DFN module SMT, or conductive adhesive;

[0057] Solidifying or fixing the connecting part.

[0058] Preferably, the integral sintering in S7 comprises placing the fixed ceramic card in an oven, and the sintering temperature is 800 degrees Celsius, and the sintering time is 3 hours; and the surface flattening in S7 comprises the following steps:

[0059] Preliminary polishing of the surface of the sintered ceramic card using sandpaper or a grinding disc;

[0060] Fine polishing of the surface of the preliminary polished card;

[0061] Polishing of the surface of the fine polished card.

[0062] The application provides a non-contact HF pure ceramic integrated card structure and a preparation process thereof. The application has the following beneficial effects:

[0063] 1. In the application, the zirconia ceramic substrate and the alumina antenna base layer are sintered into an integrated structure through a glass glaze adhesive layer, thereby forming a firm integral connection of the layers of the card body, and thus improving the problem that the traditional non-contact ceramic card is mostly formed by multiple ceramic substrates through an adhesive, and the long-term stability of the adhesive is insufficient, thereby causing the card body to be prone to interlayer separation after long-term use.

[0064] ​​2、In the application, by setting the multi-layer antenna layer between the two zirconia ceramic substrates, and with the zirconia ceramic substrate, the alumina antenna base layer is sintered to form an inseparable integrated structure, and then the antenna layer and the card body structure are deeply integrated, thereby improving the traditional non-contact ceramic card which mostly adopts the separated antenna assembly mode. Because the antenna and the card body can be relatively independently disassembled, the card is easy to be non-destructively dissected.

[0065] 3、In the application, by setting a high-temperature-resistant insulating layer between the multi-layer antenna layer, the electrical isolation between the layers of the antenna is realized, thereby improving the traditional multi-layer antenna structure which mostly does not set a special insulating protection. Because the electrical signal interference is easy to occur between the layers of the antenna, the problem of unstable radio frequency performance is caused. BRIEF DESCRIPTION OF DRAWINGS

[0066] Figure 1 The preparation process steps of the application are shown in the figure. DETAILED DESCRIPTION

[0067] The technical solutions of the application will be described clearly and completely in combination with the drawings of the application. Obviously, the described embodiments are only part of the embodiments of the application, not all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the application.

[0068] The embodiment of the application provides a non-contact HF pure ceramic integrated card structure, which comprises:

[0069] The zirconia ceramic substrates are arranged oppositely, the alumina antenna base layer is located between the two zirconia ceramic substrates, the multi-layer antenna layer is formed on the front and back surfaces of the alumina antenna base layer, the glass glaze adhesive layer is used to connect the two zirconia ceramic substrates and the alumina antenna base layer, the through hole penetrates the alumina antenna base layer, and the HF chip; the high-temperature-resistant insulating layer is arranged between the multi-layer antenna layer, the multi-layer antenna layer realizes electrical conduction through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are sintered at high temperature to form an integrated structure, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material.

[0070] Specifically, by the upper and lower relative arrangement of the zirconium oxide ceramic substrate as the outer layer structure of the card body, the internal antenna layer, chip and other core components can be protected, the zirconium oxide ceramic has wear resistance, corrosion resistance and stable physical and chemical properties, the card is not easy to produce scratches, deformation or material deterioration in the long-term use process, and the card can provide high-end appearance texture and long service life; the aluminum oxide antenna base layer between the two zirconium oxide ceramic substrates can provide a stable bearing carrier for the multi-layer antenna layer, the aluminum oxide antenna base layer has good structural strength and processing performance, can adapt to the processing technology requirements of the through hole, can ensure the forming precision of the through hole, and can also be used as the operation surface of the printing forming of the antenna layer; through the multi-layer antenna layer, the conductive area and signal transmission path of the antenna can be increased, and the efficiency of the HF radio frequency signal transmission and reception can be improved, so that the non-contact card can meet the requirements of 13.The signal transmission requirement of the 56MHz frequency band optimizes the read-write distance and identification stability of the card. The high-temperature-resistant insulating layer arranged between the multiple antenna layers can avoid electrical signal interference or short circuit between the adjacent two layers of antennas, so that each layer of antenna can independently transmit signals, and the electrical performance of the radio frequency circuit is not affected. Through the through hole, an electrical conduction path can be provided for the multiple antenna layers, so that each layer of antenna distributed on the front and back surfaces of the aluminum oxide antenna base layer forms a complete conductive loop through the conductive material in the through hole. The glass enamel adhesive layer has high-temperature resistance and can adapt to the process requirements of the overall sintering of the card. During the high-temperature sintering process, it can form a close combination with the zirconia ceramic substrate and the aluminum oxide antenna base layer, so that the layers of the card body are firmly integrated into one, reducing the risk of separation between the layers, while ensuring the integrity and stability of the card body structure. Through the electrical connection between the HF chip and the antenna layer, a complete HF radio frequency signal processing unit can be constructed, so that the HF chip can receive the radio frequency signals sent by the external read-write device through the antenna layer, and at the same time feed back the information stored in the chip to the external device through the antenna layer, thereby realizing the non-contact read-write function of the card and achieving the purpose of information interaction. Through the slot for accommodating the HF chip, an accurate installation and positioning space can be provided for the HF chip, so that the HF chip can be placed stably and accurately aligned with the terminals of the antenna layer, providing a guarantee for the reliable connection of the chip and the antenna layer, while avoiding the chip protruding from the surface of the card body, so that the appearance of the card body is flat. Through epoxy resin, ceramic glue or PVC / PC laminated module material, the HF chip in the slot can be fixed and protected, reducing the displacement or damage of the chip caused by external factors such as vibration and collision during use, while filling the gap in the slot, keeping the surface of the card body flat, thereby improving the use feel and appearance integrity of the card. Through the glass enamel adhesive layer, the zirconia ceramic substrate and the aluminum oxide antenna base layer are sintered into an integrated structure at high temperature, and then the layers of the card body are firmly connected as a whole, thereby improving the traditional non-contact ceramic card which mostly adopts multiple ceramic substrates bonded by adhesive to form a card body. Due to the insufficient long-term stability of the adhesive, the card body is prone to interlayer separation after long-term use.

[0071] Please refer to the attached Figure 1 A preparation process of a non-contact HF pure ceramic integrated card structure, comprising the following steps:

[0072] S1, zirconia ceramic substrate preparation: the tetragonal zirconia ceramic powder is pressed into a sheet body, and the front and back zirconia ceramic substrate bodies required for the card are prepared. The slot for accommodating the HF chip is processed on the surface zirconia ceramic substrate body, and the sheet body is sintered at high temperature, and then polished to a predetermined thickness;

[0073] Further, the preparation of the zirconia ceramic substrate in S1 comprises the following steps:

[0074] Mixing the tetragonal zirconia ceramic powder with dispersants, binders and solvents to obtain a uniform ceramic slurry;

[0075] Stirring the ceramic slurry;

[0076] Using a calender to calender the ceramic slurry into a sheet embryo;

[0077] Drying the sheet embryo;

[0078] Cutting and edge trimming the dried sheet embryo;

[0079] Processing a slot for accommodating the HF chip on the surface layer sheet embryo;

[0080] Sintering the cut, trimmed and slotted sheet embryo at a high temperature of 1200 to 1400 degrees Celsius for 6 hours;

[0081] Grinding the sintered zirconia ceramic substrate to a preset card standard thickness.

[0082] Specifically, taking the tetragonal zirconia ceramic powder as the core raw material, and matching the conventional dispersants, binders and solvents in the field, the amounts of each component are determined according to the viscosity and uniformity requirements of the ceramic slurry forming, the above-mentioned materials are mixed and stirred to obtain a uniform ceramic slurry, which is used as the basic raw material for subsequent forming; then using a calender, the calendering pressure and speed are adjusted according to the preset thickness of the sheet embryo, the ceramic slurry is calendered into a sheet embryo, and the sheet embryo is then dried, the temperature and time of drying are appropriate to remove the solvent in the slurry without causing deformation of the embryo; after drying, the embryo is cut and edge trimmed according to the preset outer dimensions of the card to ensure that the embryo shape meets the assembly requirements, then a slot for accommodating the HF chip is processed on the surface layer sheet embryo according to the outer dimensions of the HF chip, which provides precise positioning space for subsequent chip installation; then the cut, trimmed and slotted sheet embryo is placed in an oven and sintered at a temperature of 1200 to 1400 degrees Celsius and a time of 6 hours, the temperature and time parameters are determined based on the sintering characteristics of the tetragonal zirconia ceramic powder, which can fully sinter and cure the embryo to form a ceramic matrix with stable structure and excellent performance; finally, the sintered ceramic matrix is polished until it reaches the preset card standard thickness, which is determined according to the application scenario of the non-contact HF card and the adaptation requirements of the reading and writing equipment, the polished zirconia ceramic substrate serves as the outer structure of the card body, which is used to protect the internal antenna layer, chip and other core components, while giving the card a high-end appearance and stable physical properties.

[0083] S2, aluminum oxide antenna base layer via processing: processing a via on the aluminum oxide substrate and filling the via with conductive material;

[0084] Further, the step of processing the via hole on the alumina substrate in S2 comprises the following steps:

[0085] The position and number of the via hole are determined according to design requirements;

[0086] The laser equipment or CNC equipment is used to drill the hole on the alumina substrate;

[0087] The aperture of the via hole is controlled to be 0.15-1.5 mm;

[0088] The hole wall after drilling is cleaned to remove the ceramic chips and residues.

[0089] Specifically, according to the electrical connection design requirements of the multi-layer antenna layer, the position and number of the via hole are determined to ensure that the via hole can accurately correspond to the via node of each layer of the antenna. The design requirements come from the via path planning of the antenna radio frequency circuit and are a necessary prerequisite for realizing the complete electrical loop of the antenna layer. Then, the laser equipment or CNC equipment is selected for drilling operation. The processing precision of such equipment is suitable for the material properties of the alumina substrate and can meet the forming precision requirements of the via hole. During the drilling process, the aperture of the via hole is controlled to be 0.15-1.5 mm. This aperture range is determined based on the filling flowability of the conductive paste and the antenna via efficiency, which can ensure that the conductive paste is filled into the hole smoothly without overflow and can ensure that the conductive material forms reliable electrical contact with the antenna layer. After drilling, the hole wall is cleaned to remove the ceramic chips and residues generated during processing, avoiding impurities affecting the filling effect and electrical via performance of the subsequent conductive paste.

[0090] Further, the step of filling the conductive material in the hole in S2 comprises the following steps:

[0091] The silver paste or copper-silver mixed paste is adjusted to a suitable filling flow state with a viscosity of ;

[0092] The conductive paste is injected into the processed via hole until it is filled to the brim;

[0093] The filled conductive paste is placed in an oven for setting treatment, with a setting temperature of 800 degrees Celsius and a setting time of 2 hours;

[0094] The surface of the filled hole is polished until the conductive material is flush with the front and back surfaces of the alumina substrate.

[0095] Specifically, the silver paste or copper-silver mixed paste is selected as the conductive material, which is adjusted to a viscosity of a viscosity range suitable for filling, the viscosity range is determined based on the flow characteristics of the conductive paste and the filling requirements of the through hole, so as to ensure that the paste can be smoothly filled into the hole without excessive overflow, and to ensure that after filling, there will be no internal voids due to excessive flowability; the conductive paste uses a high-temperature conductive paste that can withstand sintering temperatures above 1200°C; then the prepared conductive paste is injected into the processed through hole until the hole is filled, ensuring that the conductive material can completely cover the hole wall and provide sufficient contact area for subsequent electrical conduction; then the filled alumina substrate is placed in an oven, and processed at a setting temperature of 800°C and a setting time of 2 hours, the temperature and time parameters are determined in combination with the solidification characteristics of the conductive paste and the adaptability to the subsequent overall sintering process, which can make the conductive paste fully set and form a conductive pillar with stable structure and reliable conductive performance; finally, the surface of the filled hole is polished until the conductive material is flush with the front and back surfaces of the alumina substrate, providing a flat working surface for subsequent antenna layer printing, avoiding the influence of protruding or recessed conductive material on the contact effect of the antenna layer and the conductive material.

[0096] S3, antenna printing: printing multi-layer HF radio frequency antennas on the front and back surfaces of the alumina substrate, and setting high-temperature resistant insulating layers between the multi-layer antennas, and connecting each layer of antenna through the through hole to form an alumina antenna base layer;

[0097] Further, the printing of the multi-layer HF radio frequency antenna in S3 includes the following steps:

[0098] The silver paste or copper-silver mixed paste is prepared to a viscosity of 10 to 20 poise , which is suitable for screen printing;

[0099] According to the antenna design, a screen template is made for 200 to 300 purposes;

[0100] A first layer of HF radio frequency antenna is printed on the front surface of the alumina substrate using a screen printing device;

[0101] The printed first layer of antenna is subjected to drying treatment, and the drying temperature is 800°C and the drying time is 2 to 4 hours;

[0102] A high-temperature resistant insulating layer is printed on the first layer of antenna and subjected to drying and curing;

[0103] The above steps of printing the antenna and the insulating layer are repeated to complete the printing of the multi-layer antenna;

[0104] A multi-layer HF radio frequency antenna is printed on the back surface of the alumina substrate using a screen printing device, and the printing and drying process is consistent with that on the front surface;

[0105] The printed back multi-layer antenna is subjected to drying treatment, and the drying temperature is 800°C and the drying time is 2 to 4 hours.

[0106] Specifically, silver paste or copper-silver mixed paste is selected as the antenna conductive material. Based on the characteristics of screen printing and the antenna forming requirements, it is adjusted to a specific viscosity. The appropriate viscosity range for screen printing is determined based on the printability of the paste and the precision of the antenna pattern. This range ensures the paste is smoothly transferred from the screen template to the alumina substrate while preventing drips or pattern deformation after printing. Subsequently, a 200-300 mesh screen template is fabricated according to the design and dimensions of the HF RF antenna. This mesh size range is compatible with the particle size of the selected paste and the precision of the antenna lines, enabling the replication of the antenna design and ensuring the structural integrity of the antenna. The first layer of the HF RF antenna is printed on the front side of the alumina substrate using screen printing equipment. After printing, the substrate is placed in an oven and dried at 800 degrees Celsius for 2 to 4 hours. The temperature and time parameters are determined by combining the high-temperature resistance and curing requirements of the conductive paste, which enables the antenna paste to fully cure and form an antenna layer with stable structure and good conductivity. Then, a high-temperature resistant insulating layer is printed on the first antenna layer and dried and cured. This insulating layer can prevent electrical signal interference or short circuits between adjacent antenna layers, ensuring that each antenna layer works independently and stably. The above steps of printing antennas and insulating layers are repeated until the preset number of antenna layers are printed. Using the same printing and drying process as the front side, multi-layer HF radio frequency antennas are printed on the back side of the alumina substrate. Finally, the multi-layer antennas on the back side are dried at 800 degrees Celsius for 2 to 4 hours to ensure the performance consistency of the antenna layers on the front and back sides.

[0107] Furthermore, the connection of each antenna layer through the via in S3 includes the following steps:

[0108] It has been confirmed that the conductive material inside the via in S2 has been finalized;

[0109] When printing each layer of antenna, make each layer of antenna contact with the conductive material inside the via;

[0110] The connection between the through-hole and each layer of antenna is dried at a temperature of 800 degrees Celsius for 2 to 4 hours.

[0111] Specifically, the conductive material filled in the through hole in S2 is confirmed to ensure that it has completed the shaping process and has stable structure and conductivity. This confirmation is a prerequisite for ensuring the reliability of subsequent electrical connection and avoiding connection failure due to unshaped conductive material. Then, during the printing of each layer of HF radio frequency antenna, the antenna printing position is controlled to ensure that the through node of each layer of antenna is in full contact with the conductive material in the through hole, thereby ensuring the formation of an effective electrical connection path. This alignment method is based on the preset position of the through hole and the antenna design pattern to ensure the accuracy of the contact. Finally, the connection part of the through hole and each layer of antenna is subjected to a drying treatment at a drying temperature of 800 degrees Celsius and a drying time of 2 to 4 hours. This temperature and time parameter is consistent with the drying process after antenna printing, which not only adapts to the high-temperature resistance characteristics of the conductive paste, but also further strengthens the structural stability and electrical reliability of the connection part.

[0112] S4, interlayer bonding treatment: printing a glass glaze adhesive layer on the antenna layer surface of the aluminum oxide antenna base layer;

[0113] Further, the printing of the glass glaze adhesive layer in S4 includes the following steps:

[0114] Adjust the glass glaze paste to a state suitable for screen printing;

[0115] Make a screen template of 200 to 300 purposes, and the screen template covers the area where the antenna layer surface of the zirconia ceramic substrate is attached;

[0116] Use a screen printing device to print a glass glaze adhesive layer on the front antenna layer surface of the aluminum oxide antenna base layer;

[0117] The printed front adhesive layer is naturally dried for 1 to 2 hours until the paste is initially solidified and no longer flows;

[0118] Use a screen printing device to print a glass glaze adhesive layer on the back antenna layer surface of the aluminum oxide antenna base layer;

[0119] The printed back adhesive layer is naturally dried for 1 to 2 hours until the paste is initially solidified and no longer flows.

[0120] Specifically, the glass glaze paste is selected as the interlayer adhesive material, and is adjusted to a state suitable for screen printing according to the process requirements of screen printing and the forming requirements of the adhesive layer. The state needs to ensure that the paste has good printing transferability and forming stability, and avoid the occurrence of sagging or pattern defects after printing. Then, a screen template with a mesh number of 200 to 300 is made according to the bonding range of the aluminum oxide antenna base layer and the zirconia ceramic substrate. The mesh number is adapted to the particle size of the glass glaze paste and the thickness requirement of the adhesive layer, which can control the printing area of the adhesive layer and ensure that the adhesive layer only covers the area where the antenna layer surface is bonded to the zirconia ceramic substrate, avoiding the influence of excess paste on the antenna performance. The glass glaze adhesive layer is printed on the front antenna layer surface of the aluminum oxide antenna base layer using a screen printing device. After printing, the front adhesive layer is naturally dried for 1 to 2 hours until the paste is initially solidified and no longer flows. The drying method and time parameters are determined based on the solidification characteristics of the glass glaze paste, which can preliminarily form the adhesive layer and provide certain adhesion without damaging the existing antenna layer structure. The same printing process is used on the back antenna layer surface of the aluminum oxide antenna base layer, and the same natural drying is performed for 1 to 2 hours until the paste is initially solidified and no longer flows, ensuring the consistency of the front and back adhesive layers.

[0121] S5, chip connection: connecting the HF chip with the antenna layer in the slot of the surface zirconia ceramic substrate;

[0122] Further, the connection of the HF chip with the antenna layer in S5 includes the following steps:

[0123] Place the HF chip in the slot, and align the chip pins with the antenna terminals. The slot meets the installation requirements of adapting to the size of the HF chip.

[0124] Use wire bonding, flip chip, COM module coupling, COB soldering, DFN module SMT, or conductive adhesive to connect the chip pins with the antenna terminals.

[0125] Solidify or fix the connection part.

[0126] Specifically, the outline size data of the HF chip is acquired, which is from the specification parameters of the selected HF chip, and the size of the slot of the surface zirconia ceramic substrate is designed based on the data to meet the mounting requirements of the HF chip outline size, the HF chip is placed in the slot, the chip position is accurately adjusted to make the chip pins correspond to the terminals of the antenna layer, and the position basis is provided for the subsequent reliable connection; then, according to the chip pin characteristics, the antenna terminal structure and the process feasibility, the adaptive connection mode is selected from the wire bonding, flip chip, COM module coupling, COB soldering, DFN module SMT or conductive glue, etc., to connect the chip pins and the antenna terminals, and these connection modes can realize the effective electrical connection between the chip and the antenna layer; finally, the connection part of the chip pins and the antenna terminals is solidified or fixed, and the solidification or fixation condition is determined according to the selected connection mode, such as normal temperature or low temperature solidification when conductive glue is used, and corresponding temperature welding solidification when soldering is used, to strengthen the structural stability and electrical connection reliability of the connection part.

[0127] S6, slot filling: filling the slot with epoxy resin, ceramic glue or PVC / PC laminated module material;

[0128] S7, overall sintering and surface treatment: assembling the front and back zirconia ceramic substrates and the aluminum antenna base layer treated in S4, fixing them through silicon carbide jigs, and then overall sintering and surface treatment of the card;

[0129] Further, the overall sintering in S7 includes placing the fixed ceramic card in an oven, the sintering temperature is 800 degrees Celsius, and the sintering time is 3 hours; the surface treatment of the card in S7 includes the following steps:

[0130] Preliminary polishing of the surface of the sintered ceramic card is performed using sandpaper or a grinding disc;

[0131] Fine grinding treatment is performed on the surface of the card after preliminary polishing;

[0132] Polishing treatment is performed on the surface of the card after fine grinding.

[0133] Specifically, one of epoxy resin, ceramic glue or PVC / PC laminated module material is selected to fill the slot accommodating the HF chip, which has good fixing and protection performance, can effectively wrap the HF chip in the slot, reduce the influence of external vibration and collision on the chip, and fill the slot gap to ensure the preliminary flatness of the card surface; then the surface zirconia ceramic substrate and the bottom zirconia ceramic substrate after the slot filling are assembled with the alumina antenna base layer after the interlayer bonding treatment, the position of each layer structure is ensured to be accurate, and then the overall structure after assembly is fixed by the silicon carbide jig, which can maintain the shape of the card body during high-temperature sintering and avoid structure displacement; the fixed overall structure is placed in the oven for overall sintering, the sintering temperature is 800 degrees Celsius, and the sintering time is 3 hours, which is determined based on the sintering characteristics of the glass glaze adhesive layer and the adaptability of the zirconia ceramic substrate and the alumina antenna base layer, so that the glass glaze adhesive layer can be fully sintered and crystallized to form a firm integrated structure with each component, and eliminate the risk of interlayer separation; after sintering, the card surface is processed, first using sandpaper or grinding disc for preliminary polishing to remove surface protrusions and impurities, then the surface after preliminary polishing is finely ground to further refine the surface flatness, and finally the surface after fine grinding is polished.

[0134] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A non-contact HF pure ceramic integrated card structure, characterized by, The application relates to a high-frequency (HF) card, which comprises upper and lower zirconia ceramic substrates, an alumina antenna base layer between the two zirconia ceramic substrates, a multilayer antenna layer formed on the front and back surfaces of the alumina antenna base layer, a glass glaze adhesive layer for connecting the two zirconia ceramic substrates and the alumina antenna base layer, a through hole penetrating through the alumina antenna base layer, and an HF chip; high-temperature-resistant insulating layers are arranged between the multilayer antenna layers, the multilayer antenna layers are electrically connected through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are integrally formed through high-temperature sintering, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material.

2. A preparation process of a non-contact HF pure ceramic integrated card structure, applied to the non-contact HF pure ceramic integrated card structure of claim 1, characterized in that, The application relates to a high-frequency (HF) card, which comprises upper and lower zirconia ceramic substrates, an alumina antenna base layer between the two zirconia ceramic substrates, a multilayer antenna layer formed on the front and back surfaces of the alumina antenna base layer, a glass glaze adhesive layer for connecting the two zirconia ceramic substrates and the alumina antenna base layer, a through hole penetrating through the alumina antenna base layer, and an HF chip; high-temperature-resistant insulating layers are arranged between the multilayer antenna layers, the multilayer antenna layers are electrically connected through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are integrally formed through high-temperature sintering, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material. The application relates to a high-frequency (HF) card, which comprises upper and lower zirconia ceramic substrates, an alumina antenna base layer between the two zirconia ceramic substrates, a multilayer antenna layer formed on the front and back surfaces of the alumina antenna base layer, a glass glaze adhesive layer for connecting the two zirconia ceramic substrates and the alumina antenna base layer, a through hole penetrating through the alumina antenna base layer, and an HF chip; high-temperature-resistant insulating layers are arranged between the multilayer antenna layers, the multilayer antenna layers are electrically connected through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are integrally formed through high-temperature sintering, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material. The application relates to a high-frequency (HF) card, which comprises upper and lower zirconia ceramic substrates, an alumina antenna base layer between the two zirconia ceramic substrates, a multilayer antenna layer formed on the front and back surfaces of the alumina antenna base layer, a glass glaze adhesive layer for connecting the two zirconia ceramic substrates and the alumina antenna base layer, a through hole penetrating through the alumina antenna base layer, and an HF chip; high-temperature-resistant insulating layers are arranged between the multilayer antenna layers, the multilayer antenna layers are electrically connected through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are integrally formed through high-temperature sintering, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material. The application relates to a high-frequency (HF) card, which comprises upper and lower zirconia ceramic substrates, an alumina antenna base layer between the two zirconia ceramic substrates, a multilayer antenna layer formed on the front and back surfaces of the alumina antenna base layer, a glass glaze adhesive layer for connecting the two zirconia ceramic substrates and the alumina antenna base layer, a through hole penetrating through the alumina antenna base layer, and an HF chip; high-temperature-resistant insulating layers are arranged between the multilayer antenna layers, the multilayer antenna layers are electrically connected through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are integrally formed through high-temperature sintering, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material. The application relates to a high-frequency (HF) card, which comprises upper and lower zirconia ceramic substrates, an alumina antenna base layer between the two zirconia ceramic substrates, a multilayer antenna layer formed on the front and back surfaces of the alumina antenna base layer, a glass glaze adhesive layer for connecting the two zirconia ceramic substrates and the alumina antenna base layer, a through hole penetrating through the alumina antenna base layer, and an HF chip; high-temperature-resistant insulating layers are arranged between the multilayer antenna layers, the multilayer antenna layers are electrically connected through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are integrally formed through high-temperature sintering, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material. The application relates to a high-frequency (HF) card, which comprises upper and lower zirconia ceramic substrates, an alumina antenna base layer between the two zirconia ceramic substrates, a multilayer antenna layer formed on the front and back surfaces of the alumina antenna base layer, a glass glaze adhesive layer for connecting the two zirconia ceramic substrates and the alumina antenna base layer, a through hole penetrating through the alumina antenna base layer, and an HF chip; high-temperature-resistant insulating layers are arranged between the multilayer antenna layers, the multilayer antenna layers are electrically connected through the through hole, the glass glaze adhesive layer and the zirconia ceramic substrate and the alumina antenna base layer are integrally formed through high-temperature sintering, the HF chip is electrically connected with the antenna layer, the surface layer of the zirconia ceramic substrate is provided with a slot for accommodating the HF chip, and the slot is filled with epoxy resin, ceramic glue or PVC / PC laminated module material. ​ ​ 3. The process for preparing a contactless HF all-ceramic integrated card structure according to claim 2, characterized in that: ​ ​ ​ ​ ​ ​ ​ ​ ​ 4. The process for preparing a contactless HF all-ceramic integrated card structure according to claim 2, characterized in that: ​ ​ ​ ​ ​ 5. The process for preparing a contactless HF all-ceramic integrated card structure according to claim 2, characterized in that: ​ The silver paste or copper-silver hybrid paste is formulated to a suitable injection flowable state with a viscosity of about 1,000 cps. ​ The filled conductive paste is placed in an oven for setting treatment, the setting temperature is 800 degrees Celsius, and the setting time is 2 hours; The filled hole surface is polished until the conductive material is flush with the front and back surfaces of the alumina substrate.

6. The process for preparing a contactless HF all-ceramic integrated card structure according to claim 2, characterized in that: The printing of the multi-layer HF radio frequency antenna in S3 includes the following steps: The silver paste or copper-silver hybrid paste is formulated to a state suitable for screen printing with a viscosity of about 100 mPa-s. A silk screen template is made according to the antenna design; A first layer of HF radio frequency antenna is printed on the front surface of the alumina substrate using a silk screen printing device; The printed first layer of antenna is subjected to drying treatment, the drying temperature is 800 degrees Celsius, and the drying time is 2 to 4 hours; A high-temperature-resistant insulating layer is printed on the first layer of antenna and subjected to drying and curing; The above steps of printing the antenna and the insulating layer are repeated to complete the printing of the multi-layer antenna; A multi-layer HF radio frequency antenna is printed on the back surface of the alumina substrate using a silk screen printing device, and the printing and drying processes are consistent with those on the front surface; The printed back multi-layer antenna is subjected to drying treatment, the drying temperature is 800 degrees Celsius, and the drying time is 2 to 4 hours.

7. The process for preparing a contactless HF all-ceramic integrated card structure according to claim 2, characterized in that: The connection of each layer of antenna through the via hole in S3 includes the following steps: It is confirmed that the conductive material in the via hole in S2 has been set and completed; When printing each layer of antenna, make each layer of antenna contact with the conductive material in the via hole; The connection part of the via hole and each layer of antenna is subjected to drying treatment, the drying temperature is 800 degrees Celsius, and the drying time is 2 to 4 hours.

8. The process for preparing a contactless HF all-ceramic integrated card structure according to claim 2, characterized in that: The printing of the glass glaze adhesive layer in S4 includes the following steps: The glass glaze paste is prepared to a state suitable for silk screen printing; A silk screen template is made, which covers the area where the antenna layer surface is attached to the zirconia ceramic substrate; The glass glaze adhesive layer is printed on the front antenna layer surface of the alumina antenna base layer using a silk screen printing device; The printed front adhesive layer is naturally dried for 1 to 2 hours until the paste is initially solidified and no longer flows; The glass glaze adhesive layer is printed on the back antenna layer surface of the alumina antenna base layer using a silk screen printing device; The printed back adhesive layer is naturally dried for 1 to 2 hours until the paste is initially solidified and no longer flows.

9. The process for preparing a contactless HF all-ceramic integrated card structure according to claim 2, characterized in that: The connection of the HF chip and the antenna layer in S5 includes the following steps: The HF chip is placed in a slot, and the chip pins are aligned with the antenna terminals, the slot meets the installation requirements of the size of the HF chip; The chip pins are connected to the antenna terminals by wire bonding, flip chip, COM module coupling, COB soldering, DFN module SMT, or conductive adhesive; The connection part is subjected to curing or fixing treatment.

10. The process for preparing a contactless HF all-ceramic integrated card structure according to claim 2, characterized in that: The overall sintering in S7 includes placing the fixed ceramic card in an oven, the sintering temperature is 800 degrees Celsius, and the sintering time is 3 hours; the surface leveling treatment in S7 includes the following steps: The surface of the sintered ceramic card is initially polished using sandpaper or a grinding disc; The card surface after initial polishing is subjected to fine grinding treatment; The card surface after fine grinding is subjected to polishing treatment.

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