Manufacturing method of 30 oz ultra-thick copper double-sided PCB (Printed Circuit Board)

Abstract

The invention relates to the technical field of PCB manufacturing, and discloses a manufacturing method of a 30 oz ultra-thick copper double-sided PCB. According to the invention, through the manufacturing process of preferentially completing the manufacturing of the outer-layer circuit and then completing the manufacturing of the inner-layer circuit, and carrying out pre-pressing glue filling, the problem of single-time large-scale glue filling caused by 30 oz range in the traditional method is decomposed into two controllable 15 oz glue filling processes, so that the quality risks of lack of glue in pressing, deviation and the like are eliminated from the source, and the production efficiency is improved. The mechanical strength of the circuit and the stability of an inner layer etching pattern are enhanced; the laser cutting bonding sheet is adopted to precisely join the circuit and is matched with the pressing pad to enhance glue filling, so that the board warping problem caused by traditional manual glue filling is avoided, meanwhile, the range of the solder mask surface is reduced to the conventional level through the pre-leveling process, the solder mask frequency is reduced, the process time is greatly shortened, and the production efficiency is improved. And the defects of blistering, cracking and the like caused by multiple times of baking can be overcome, so that the production efficiency and the product consistency of the PCB are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB board manufacturing, in particular to a 30oz super-thick copper double-sided PCB board manufacturing method. BACKGROUND

[0002] Printed circuit board (PCB) as the core support and electrical connection carrier of electronic components is an indispensable basic component in modern electronic equipment. Its development process has experienced the technical evolution from single-sided board, double-sided board to multi-layer board, high-density interconnection board, and is currently developing towards high frequency, high speed, high density and high reliability. Especially in high-power application fields such as new energy vehicles, high-power electronic equipment, industrial control and power system equipment, due to the need to handle a large amount of current and voltage, super-thick copper PCB board can fully meet the needs of these harsh application scenarios and effectively ensure the safe and stable and efficient operation of the power system.

[0003] Currently, the manufacturing of 30oz super-thick copper double-sided PCB board is mainly realized by adopting red copper substrate double-sided etching process. This process needs to complete etching operation twice, and the single etching depth is 15oz. Due to the significant etching depth, the manufacturing process of this kind of thick copper PCB board faces two core process difficulties: firstly, in the pressing link, due to the significant etching amount, the demand for glue filling increases significantly, and the conventional pressing process is difficult to realize the uniform and sufficient filling of resin, which is easy to cause local glue deficiency and interlayer deviation and other defects; secondly, in the solder resist link, 15oz line height difference requires solder resist ink to have strong filling capacity. The conventional process needs to complete through multiple solder resist printing and step-by-step baking, and multiple repeated solder resist-baking cycles are easy to induce serious quality problems such as solder resist layer blistering and cracking. SUMMARY

[0004] The main purpose of the present application is to provide a 30oz super-thick copper double-sided PCB board manufacturing method, which aims to solve the technical problems in the prior art.

[0005] The present application provides a 30oz super-thick copper double-sided PCB board manufacturing method, which comprises the following steps: S1, respectively, cutting the red copper plate, the adhesive sheet, the copper-clad plate and the copper foil to obtain a PCB manufacturing substrate, the PCB manufacturing substrate comprising a first red copper plate 1, a second red copper plate 2, an initial copper-clad plate and a plurality of adhesive sheets and copper foils; S2, respectively, manufacturing outer layer circuits on the first red copper plate 1 and the second red copper plate 2, and cutting the first group of adhesive sheets based on the first red copper plate 1 and the second red copper plate 2 with outer layer circuit structure by using laser cutting technology; S3, respectively, the first red copper plate 1 and the second red copper plate 2 are pressed with the first group of adhesive sheets and copper foils, and first semi-finished plate 16 and second semi-finished plate 17 are obtained; S4, respectively, the first semi-finished plate 16 and the second semi-finished plate 17 are made into inner layer circuit, and the first semi-finished plate 16 and the second semi-finished plate 17 with inner layer circuit structure are cut by laser cutting technology on the second group of adhesive sheets; S5, respectively, the first semi-finished plate 16 and the second semi-finished plate 17 are pressed with the second group of adhesive sheets and copper foils, and third semi-finished plate 18 and fourth semi-finished plate 19 are obtained; S6, etching the initial copper-clad plate to obtain the core substrate 15; S7, the third semi-finished plate 18 and the fourth semi-finished plate 19 are microetched, and the third semi-finished plate 18 and the fourth semi-finished plate 19 after microetching are pressed with the core substrate 15 and the adhesive sheet to obtain the fifth semi-finished plate 20; S8, the fifth semi-finished plate 20 is processed into finished product to obtain 30oz super-thick copper double-sided PCB plate 001.

[0006] The application further provides that the thickness of the first red copper plate 1 and the second red copper plate 2 is 30oz, and the etching thickness of the upper end circuit 101, the lower end circuit of the first red copper plate, and the upper end circuit and the lower end circuit of the second red copper plate 2 is 15oz.

[0007] The application further provides that the adhesive sheet includes first adhesive sheet 3, second adhesive sheet 4, third adhesive sheet 5, fourth adhesive sheet 6, fifth adhesive sheet 7, sixth adhesive sheet 8, seventh adhesive sheet 9 and eighth adhesive sheet 10, the thickness of the first adhesive sheet 3, the second adhesive sheet 4, the fifth adhesive sheet 7 and the sixth adhesive sheet 8 is 15oz, and the thickness of the third adhesive sheet 5 and the fourth adhesive sheet 6 is 0.1mm.

[0008] The application further provides that the copper foil includes first copper foil 11, second copper foil 12, third copper foil 13 and fourth copper foil 14, and the thickness of the first copper foil 11, the second copper foil 12, the third copper foil 13 and the fourth copper foil 14 is 1 / 3oz.

[0009] The application further provides that the step of cutting the first group of adhesive sheets based on the first red copper plate 1 and the second red copper plate 2 with outer layer circuit structure by laser cutting technology comprises: Obtaining the circuit layer point cloud data of the first red copper plate 1 to be pressed and the adhesive sheet material parameters of the first group of adhesive sheets to be cut, and obtaining the laser cutting parameters; According to the line layer point cloud data, an initial line height distribution matrix is obtained, and the line layer point cloud data and the bonding sheet material parameters are analyzed cooperatively to obtain a cutting depth distribution matrix; According to the initial line height distribution matrix, an initial contour boundary vector is constructed, and the initial contour boundary vector is compensated based on the laser cutting parameters to obtain a cutting motion trajectory sequence; According to the cutting depth distribution matrix and the laser cutting parameters, a laser control instruction sequence is obtained, and the laser beam is cooperatively controlled based on the cutting motion trajectory sequence and the laser control instruction sequence to perform cutting work on the bonding sheet.

[0010] The application further provides that the step of constructing the initial contour boundary vector according to the initial line height distribution matrix and compensating the initial contour boundary vector based on the laser cutting parameters to obtain the cutting motion trajectory sequence comprises: The initial line height distribution matrix is subjected to multi-scale gradient field analysis to obtain a gradient amplitude graph, and the gradient amplitude graph is subjected to sub-pixel level edge positioning based on an interpolation fusion algorithm to obtain a contour coordinate sequence; The contour coordinate sequence is subjected to curvature adaptability fitting by using a spline curve fitting algorithm to obtain the initial contour boundary vector, and a local curvature radius is obtained according to the initial contour boundary vector; The laser output power, the repetition frequency, the beam quality factor and the focused spot radius are obtained according to the laser cutting parameters, the heat affected zone depth prediction value is obtained according to the local curvature radius, the laser output power and the repetition frequency; A sidewall thermal damage depth threshold value is obtained, and the heat affected zone compensation amount is obtained by using an iterative optimization algorithm based on the heat affected zone depth prediction value and the sidewall thermal damage depth threshold value; The spot effective action radius is obtained by a Gaussian beam energy distribution model based on the laser output power, the beam quality factor and the focused spot radius, and the total path compensation amount is obtained according to the spot effective action radius and the heat affected zone compensation amount; The cutting path coordinate sequence is obtained according to the total path compensation vector and the initial contour boundary vector, and the cutting motion trajectory sequence is obtained by trajectory reconstruction of the cutting path coordinate sequence by using a quintic spline interpolation algorithm.

[0011] The application further provides that the micro-etched copper thickness of the third semi-finished plate 18 and the fourth semi-finished plate 19 is 1 / 3 oz.

[0012] The application further provides that the step of performing finished product processing on the fifth semi-finished plate 20 to obtain the 30 oz super-thick copper double-sided PCB plate 001 comprises: The surface resin of the fifth semi-finished plate 20 is subjected to plate grinding treatment until the thick copper pattern of the outer layer circuit is completely exposed; The fifth semi-finished plate 20 after the plate grinding treatment is subjected to drilling and copper plating on the inner wall of the drilled hole to form a copper plating layer on the surface of the fifth semi-finished plate 20; The copper plating layer on the surface of the fifth semi-finished plate 20 after the hole metallization treatment is subjected to etching to form a circuit pattern; The surface of the fifth semi-finished plate 20 after the circuit etching treatment is subjected to twice solder mask coating and curing of the solder mask ink to obtain a 30oz super-thick copper double-sided PCB plate 001.

[0013] The application further provides a computer device comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the method for manufacturing the 30oz super-thick copper double-sided PCB plate when executing the computer program.

[0014] The application further provides a computer readable storage medium having a computer program stored thereon, wherein the computer program implements the steps of the method for manufacturing the 30oz super-thick copper double-sided PCB plate when executed by a processor.

[0015] The application has the following beneficial effects: the outer layer circuit is preferentially manufactured and pre-pressed and filled with glue, the problem of large-scale single filling caused by 30oz in the traditional method is decomposed into two controllable 15oz filling processes, and the quality risks such as lack of glue and deviation in pressing are eliminated from the source; in the structural design, the laser cutting adhesive sheet is precisely embedded into the red copper plate circuit, and the synergy of the pressing pad significantly enhances the uniformity of glue filling and the interfacial bonding force, and effectively avoids the thermal stress plate warping problem caused by the traditional manual resin filling process; through the outer layer unit pre-pressing process, the uneven thick copper circuit is flattened by the adhesive sheet and the thin copper foil in advance before final assembly, which not only creates an ideal flat base for the subsequent solder mask manufacturing, but also enhances the mechanical strength of the red copper plate, and provides a guarantee for the pattern stability during the subsequent inner layer etching; the application reduces the curvature difference of the solder mask treatment surface to the conventional level, thereby reducing the number of solder mask times, which not only shortens the solder mask process time by more than 80%, but also is more conducive to eliminating the quality defects such as solder mask blistering and cracking caused by multiple baking, thereby significantly improving the production efficiency and product consistency of the PCB. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The method flowchart of an embodiment of the application; Figure 2 The structural schematic diagram of the 30oz super-thick copper double-sided PCB plate of the application; Figure 3Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 1 ; Figure 4 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 2 ; Figure 5 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 3 ; Figure 6 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 4 ; Figure 7 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 5 ; Figure 8 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 6 ; Figure 9 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 7 ; Figure 10 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 8 ; Figure 11 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 9 ; Figure 12 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 10 ; Figure 13 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 10 ; Figure 14 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 10 ; Figure 15 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application Figure 10 ; Figure 16 Structure diagram of 30oz super-thick copper double-sided PCB manufacturing process of the present application ;

[0017] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings.

[0018] Reference signs: 001、30oz super-thick copper double-sided PCB board; 1, first copper plate; 101, first copper plate upper end line; 2, second copper plate; 201, second copper plate lower end line; 3, first bonding piece; 4, second bonding piece; 5, third bonding piece; 6, fourth bonding piece; 7, fifth bonding piece; 8, sixth bonding piece; 9, seventh bonding piece; 10, eighth bonding piece; 11, first copper foil; 12, second copper foil; 13, third copper foil; 14, fourth copper foil; 15, core substrate; 16, first semi-finished plate; 17, second semi-finished plate; 18, third semi-finished plate; 181, third semi-finished plate after micro-etching treatment; 19, fourth semi-finished plate; 191, fourth semi-finished plate after micro-etching treatment; 20, fifth semi-finished plate; 21, fifth semi-finished plate after plate grinding treatment; 22, fifth semi-finished plate after drilling treatment; 23, fifth semi-finished plate after copper plating treatment; 24, fifth semi-finished plate after etching treatment; 25, fifth semi-finished plate after solder mask treatment. DETAILED DESCRIPTION

[0019] It should be understood that the specific embodiments described herein are merely exemplary and not intended to limit the application.

[0020] As shown in Figures 1-15 The application provides a method for manufacturing a 30oz super-thick copper double-sided PCB board, comprising: S1, respectively cutting the copper plate, the bonding piece, the copper-clad plate and the copper foil to obtain a PCB manufacturing substrate, wherein the PCB manufacturing substrate comprises a first copper plate 1, a second copper plate 2, an initial copper-clad plate, and a plurality of bonding pieces and copper foils; S2, respectively manufacturing outer layer lines on the first copper plate 1 and the second copper plate 2, and cutting the first group of bonding pieces based on the first copper plate 1 and the second copper plate 2 with an outer layer line structure using a laser cutting technology; S3, respectively pressing and filling glue between the first copper plate 1 and the second copper plate 2 and the first group of bonding pieces and copper foils to obtain a first semi-finished plate 16 and a second semi-finished plate 17; S4, respectively manufacturing inner layer lines on the first semi-finished plate 16 and the second semi-finished plate 17, and cutting the second group of bonding pieces based on the first semi-finished plate 16 and the second semi-finished plate 17 with an inner layer line structure using a laser cutting technology.

[0021] It should be noted that the outer layer circuit formed by etching the 30oz red copper plate is not a completely isolated structure, and the connecting ribs reserved between the circuits maintain the overall structural integrity (the connecting ribs are removed by etching in the subsequent productization processing stage), and the circuit edges are optimally designed to form a stepped structure suitable for embedding the laser-cut adhesive sheet (PP sheet), avoiding the deviation of the transfer and alignment caused by the isolated circuit; for the soft PP sheet in a net-like structure after laser cutting, the scheme is matched with a special vacuum suction transfer tool, which maintains the stability of the net-like PP sheet by uniformly distributed micro-suction holes to prevent deformation or damage during the transfer process; in the precise alignment process, a CCD vision alignment system is used to achieve high-precision positioning of the PP sheet and the red copper plate circuit, specifically by using a CCD camera to collect the pre-set positioning mark points of the red copper plate circuit and the corresponding reference holes formed by cutting the PP sheet, the position deviation of the two is quickly calculated by image algorithm and fed back to the motion control module, driving the vacuum suction tool to make X / Y / theta three-way fine adjustment, so that the net-like hollow structure of the PP sheet and the red copper plate circuit are precisely embedded, and the alignment accuracy is controlled within ±0.02mm; at the same time, elastic compression pads are used in the compression process to control the stepped pressure, and the elastic compression pads can deform adaptively with the concave-convex shape of the circuit, ensuring that the resin flows uniformly and fills the gap between the circuits during compression, further compensating for the effects of small alignment deviations. The cooperative application of the above transfer tool, CCD vision alignment system and elastic compression pad ensures the stable realization of the process effects of high-precision embedding and enhanced glue filling.

[0022] S5, respectively, the first semi-finished plate 16 and the second semi-finished plate 17 are compressed and filled with a second group of adhesive sheets and copper foils to obtain a third semi-finished plate 18 and a fourth semi-finished plate 19; S6, etching the initial copper-clad plate to obtain a core substrate 15; S7, micro-etching the third semi-finished plate 18 and the fourth semi-finished plate 19, and compressing and filling the third semi-finished plate 18 and the fourth semi-finished plate 19 after micro-etching with the core substrate 15 and the adhesive sheet to obtain a fifth semi-finished plate 20; S8, productization processing the fifth semi-finished plate 20 to obtain a 30oz super-thick copper double-sided PCB plate 001.

[0023] As shown in steps S1-S8, the present application obtains the PCB manufacturing substrate meeting the size requirements by cutting the red copper plate, the adhesive sheet, the copper-clad plate and the copper foil respectively, and the PCB manufacturing substrate comprises a first red copper plate 1, a second red copper plate 2, a first adhesive sheet 3, a second adhesive sheet 4, a third adhesive sheet 5, a fourth adhesive sheet 6, a fifth adhesive sheet 7, a sixth adhesive sheet 8, a seventh adhesive sheet 9, an eighth adhesive sheet 10, an initial copper-clad plate, a first copper foil 11, a second copper foil 12, a third copper foil 13, a fourth copper foil 14, wherein the first red copper plate 1 and the second red copper plate 2 are as shown in Figure 3 ; as shown in Figure 4 , the upper end circuit is manufactured on the first red copper plate 1, the lower end circuit is manufactured on the second red copper plate 2, and the first adhesive sheet 3 and the second adhesive sheet 4 are laser cut respectively; as shown in Figure 5 , the first red copper plate 1, the first adhesive sheet 3 after laser cutting, the third adhesive sheet 5 and the first copper foil 11 are sequentially laminated and pressure-filled with glue to obtain a first semi-finished product plate 16, and the second red copper plate 2, the second adhesive sheet 4 after laser cutting, the fourth adhesive sheet 6 and the second copper foil 12 are sequentially laminated and pressure-filled with glue to obtain a second semi-finished product plate 17; as shown in Figure 6 , the lower end circuit is manufactured on the first semi-finished product plate 16, the upper end circuit is manufactured on the second semi-finished product plate 17, and the fifth adhesive sheet 7 and the sixth adhesive sheet 8 are laser cut respectively; as shown in Figure 7 , the first semi-finished product plate 16, the fifth adhesive sheet 7 after laser cutting and the third copper foil 13 are sequentially laminated and pressure-filled with glue to obtain a third semi-finished product plate 18, and the second semi-finished product plate 17, the sixth adhesive sheet 8 after laser cutting and the fourth copper foil 14 are sequentially laminated and pressure-filled with glue to obtain a fourth semi-finished product plate 19; as shown in Figure 8 , the third semi-finished product plate 18 and the fourth semi-finished product plate 19 are micro-etched respectively; as shown in Figure 9 , the initial copper-clad plate is etched to obtain a core substrate 15; as shown in Figure 10 , the third semi-finished product plate 18 after micro-etching, the seventh adhesive sheet 9, the core substrate 15, the eighth adhesive sheet 10 and the fourth semi-finished product plate 19 after micro-etching are sequentially laminated and pressure-combined to obtain a fifth semi-finished product plate 20; as shown in Figures 11-15 , the fifth semi-finished product plate 20 is processed (firstly ground, then drilled, copper-plated, etched and solder resist) to obtain a 30oz super-thick copper double-sided PCB plate 001, and the 30oz super-thick copper double-sided PCB plate 001 is as shown in Figure 2The application adopts the process flow of first outer layer and then inner layer, realizes a significant breakthrough in thick copper PCB manufacturing process, and the traditional manufacturing method has obvious technical defects: when the process route of first manufacturing inner layer circuit and then manufacturing outer layer circuit is adopted, uneven phenomenon is prone to occur in the process of pressing and filling glue, and quality risks such as lack of glue are generated; meanwhile, in the outer layer circuit manufacturing stage, due to the large difference between the copper thickness and the base material, the ink filling cannot be completed at one time, and if it is forcibly implemented, it will lead to problems such as ink baking not dry and cracking, and the alternative scheme of manufacturing by multiple times of solder mask will cause the PCB production time to be seriously lengthened, and quality risks such as solder mask blistering and cracking caused by multiple baking are generated; compared with the conventional method of first manufacturing inner layer circuit and then manufacturing outer layer circuit for the traditional thick copper PCB, the application preferentially completes the manufacturing of outer layer circuit and pressing and filling glue, effectively levels the difference of outer layer circuit, reduces the number of solder mask manufacturing from multiple batches in the conventional method to single completion, not only greatly shortens the production cycle, but also fundamentally avoids the quality abnormalities such as solder mask blistering and cracking caused by multiple baking, secondly, through the innovative process of twice pressing of inner layer, the stability of the inner layer pressing quality is ensured, and the complex process of manual resin filling in the traditional process is completely saved.

[0024] In the pressing process, the conventional pressing method needs to go through five complex steps: firstly, the upper and lower inner layer circuits of the TL and BL faces are made on the red copper plate; then the extreme difference area of the circuit is filled with resin manually; during the curing of the baked plate, the substrate needs to be fixed using an auxiliary plate and a clamp, otherwise it will cause serious warping of the plate and resin cracking and other quality problems; after curing, the excess resin on the copper surface needs to be manually polished again; finally, the TL-BL semi-finished plate can be pressed with the bonding sheet and the light plate; this traditional process not only has complex procedures and is highly dependent on the operator, but also has multiple quality control difficulties; compared with the traditional process, the present application forms an inlaid superposition structure with the circuit by laser cutting the bonding sheet, and cooperates with the pressing pad technology to significantly enhance the glue filling capacity, solves the quality risks such as lack of glue and deviation caused by insufficient filling of the extreme difference area in the traditional pressing method, reduces the number of solder mask manufacturing times by leveling the outer circuit, and thus improves the production efficiency and solder mask quality; compared with the complex procedures such as manual resin filling, auxiliary plate fixing and baking, and manual polishing of the resin amount in the traditional process, the present application realizes the inner layer pressing process through two precise control processes, which not only ensures the stability of the inner layer pressing quality, but also completely eliminates the tedious manual intervention process; specifically, the first bonding sheet 3 and the second bonding sheet 4 are laser cut to form a close inlay with the upper end circuit 101 of the first red copper plate and the lower end circuit 201 of the second red copper plate respectively; similarly, the laser cutting of the fifth bonding sheet 7 and the sixth bonding sheet 8 ensures close fitting with the lower end circuit of the first red copper plate 1 and the upper end circuit of the second red copper plate 2; this innovative structure design makes the resin flow more uniform and sufficient during the pressing process, eliminating the quality defects caused by uneven filling of the extreme difference area in the traditional method from the source.

[0025] By precisely controlling the total thickness of the seventh bonding sheet 9, the eighth bonding sheet 10 and the core substrate 15, the cumulative value of the two 30oz red copper plates and the two layers of solder mask thickness is accurately matched with the thickness of the finished plate, ensuring the dimensional accuracy of the final product; in the subsequent processing, the surface resin layer of the fifth semi-finished plate 20 is completely polished clean by grinding the plate, completely exposing the thick copper pattern, providing an ideal substrate surface for the subsequent process, and successfully manufacturing a 30oz super-thick copper double-sided PCB plate 001 that meets the design requirements through the standard PCB process of drilling, copper plating, etching and solder mask, achieving the comprehensive technical effect of significantly improving the production efficiency and reducing the manufacturing cost on the premise of ensuring the product quality.

[0026] In one embodiment, the thickness of the first red copper plate 1 and the second red copper plate 2 is 30oz, and the etching thickness of the upper end circuit 101, the lower end circuit of the first red copper plate and the upper end circuit, the lower end circuit of the second red copper plate 2 is 15oz.

[0027] The application uses 30oz ultra-thick red copper plate as a substrate to ensure that the PCB can meet the needs of large current applications, and by etching it to a circuit thickness of 15oz, on the one hand, it significantly reduces the difficulty of glue filling and the risk of glue deficiency caused by excessively large circuit differences in the subsequent lamination process, so that the resin can flow and fill more uniformly and fully; on the other hand, it also reduces the process difficulty of pattern etching, which is conducive to forming a circuit pattern with a steep side wall and higher precision.

[0028] In one embodiment, the adhesive sheet includes a first adhesive sheet 3, a second adhesive sheet 4, a third adhesive sheet 5, a fourth adhesive sheet 6, a fifth adhesive sheet 7, a sixth adhesive sheet 8, a seventh adhesive sheet 9, and an eighth adhesive sheet 10, the thickness of the first adhesive sheet 3, the second adhesive sheet 4, the fifth adhesive sheet 7, and the sixth adhesive sheet 8 is 15oz, and the thickness of the third adhesive sheet 5 and the fourth adhesive sheet 6 is 0.1mm.

[0029] The application realizes precise medium layer control and optimized resin filling effect through such differentiated adhesive sheet configuration. The 15oz thick adhesive sheet is mainly used for the corresponding circuit area, and its sufficient resin content can perfectly fill the gap caused by the 15oz high circuit, effectively preventing lamination cavities. At the same time, its good compressibility helps to adapt to the thickness change in the lamination process, ensuring uniform medium layer. The 0.1mm thin adhesive sheet is used for non-circuit area or as a buffer or insulation layer, which is conducive to accurately controlling the overall plate thickness and reducing unnecessary material accumulation, thereby improving the flatness of the red copper plate circuit and improving the mechanical strength of the first and second semi-finished plates 16 and 17.

[0030] In one embodiment, the copper foil includes a first copper foil 11, a second copper foil 12, a third copper foil 13, and a fourth copper foil 14, the thickness of the first copper foil 11, the second copper foil 12, the third copper foil 13, and the fourth copper foil 14 is 1 / 3oz, and the micro-etched copper thickness of the third semi-finished plate 18 and the fourth semi-finished plate 19 is 1 / 3oz.

[0031] The application uses 1 / 3oz thin copper foil before lamination, which is conducive to better transmitting pressure during lamination, promoting resin flow, and reducing stress problems caused by excessive thickness of copper foil. After lamination, the semi-finished plate is micro-etched, and the final copper thickness is also accurately controlled to be 1 / 3oz, which not only cleans and roughens the copper surface, greatly enhancing the bonding force between the outer circuit and the prepreg, preventing delamination, but also provides a uniform and consistent starting surface for subsequent copper plating and pattern transfer, ensuring the manufacturing precision of fine circuits and the uniformity of plating.

[0032] In one embodiment, the step S2 of cutting the first group of adhesive pieces based on the first and second red copper plates 1 and 2 with outer layer circuit structure by laser cutting technology comprises: S201, obtaining the circuit layer point cloud data of the first red copper plate 1 to be pressed and the adhesive piece material parameters of the first group of adhesive pieces to be cut, and obtaining laser cutting parameters; S202, obtaining an initial circuit height distribution matrix according to the circuit layer point cloud data, and performing collaborative analysis on the circuit layer point cloud data and the adhesive piece material parameters to obtain a cutting depth distribution matrix; S203, constructing an initial contour boundary vector according to the initial circuit height distribution matrix, and compensating the initial contour boundary vector based on the laser cutting parameters to obtain a cutting motion trajectory sequence.

[0033] For example, the specific process is as follows: first, the output power, repetition frequency, beam quality factor and focused spot radius in the laser cutting parameters are combined with the local curvature radius corresponding to the initial contour boundary vector to calculate the heat affected zone depth prediction value of the adhesive piece material during laser cutting by using a heat conduction simulation model, and the heat affected zone compensation amount along the contour boundary is determined by comparing the preset side wall heat damage depth threshold value through an iterative optimization algorithm. Meanwhile, the total path compensation amount is obtained by superimposing the effective spot radius calculated based on the Gaussian beam energy distribution model and the heat affected zone compensation amount, and the trajectory coordinates sequence after compensation is reconstructed by using a quintic spline interpolation algorithm to form the final cutting motion trajectory, thereby realizing heat effect compensation. The guiding logic of the cutting depth distribution matrix for two-dimensional cutting is as follows: although the laser cutting in this scheme is based on two-dimensional trajectory motion, the three-dimensional depth requirement is converted into a dynamic laser energy control instruction on the two-dimensional trajectory by quantifying the target cutting depth of different regions of the adhesive piece (determined by collaborative analysis of the circuit layer point cloud data and the adhesive piece material parameters, such as cutting through the line embedding region and retaining a preset thickness in the non-embedding region), and the laser output power and pulse waveform are adjusted through the laser control instruction sequence to realize differential cutting depth control at different two-dimensional trajectory positions. This process does not involve laser ablation technology, but uses the local concentration of laser energy to form a cutting effect matching the target depth on the two-dimensional trajectory path through energy gradient distribution, so as to ensure that the cut adhesive piece can accurately embed the circuit and meet the structural requirements of subsequent pressing and glue filling. Those skilled in the art can realize this process according to the above logic and the energy regulation function of the conventional laser cutting equipment.

[0034] S204, obtaining a laser control instruction sequence according to the cutting depth distribution matrix and the laser cutting parameters, and cooperatively controlling the laser beam to perform cutting work on the adhesive piece based on the cutting motion trajectory sequence and the laser control instruction sequence.

[0035] As described in steps S201-S204, the present application generates a digital elevation model of the line layer three-dimensional topography by indexing the line layer point cloud data based on a two-dimensional grid coordinate, taking the height value within the grid cell as an element, i.e. obtaining the initial line height distribution matrix, and cooperatively analyzing the line layer point cloud data and the adhesive sheet material parameters to form a cutting depth distribution matrix containing the geometric characteristics of the flow guide structure; the present application predicts and compensates by prepositioning the requirement of the subsequent pressing process on the resin fluidity before the cutting process, actively shaping the cavity geometry conducive to resin flow in the cutting stage, which is beneficial to solve the fundamental problem of insufficient pressing preparation caused by the single design of the cavity and the lack of consideration of material flow characteristics in traditional cutting methods.

[0036] The present application extracts high-precision contour coordinate sequences through multi-scale gradient analysis and sub-pixel positioning technology, and uses a spline curve fitting algorithm to adaptively fit the curvature of the contour coordinate sequence to obtain an initial contour boundary vector, wherein the initial contour boundary vector is a continuous geometric boundary description for driving the laser equipment to track the trajectory, has smooth geometric characteristics, and can reflect the line design characteristics; through heat effect compensation of the initial contour boundary vector based on laser cutting parameters, a machining path instruction set is obtained, which controls the motion state of the laser head, contains time and position relationship, and meets the requirements of dynamic smoothness, thereby solving the problems of sidewall quality degradation and geometric precision misalignment caused by heat accumulation in traditional cutting.

[0037] The present application performs gradient response energy modulation on the laser cutting parameters corresponding to each spatial position within the cutting range based on the cutting depth distribution matrix to obtain a laser output power sequence, and performs regional identification and differential pulse parameter configuration according to the cutting depth distribution matrix to obtain a laser pulse waveform sequence; the laser output power sequence and the laser pulse waveform sequence are spatio-temporally synchronized and integrated to generate a laser control instruction sequence strictly time-aligned with the cutting motion trajectory sequence; through this gradient response energy modulation and regional adaptive pulse control, it is beneficial to solve the systematic problems of deep area overburning, shallow area cutting deficiency and poor processing effect of functional areas caused by the fixed energy parameters in traditional methods; to solve the cavity quality defect problems caused by the mismatch between the cutting strategy and the three-dimensional topography, material characteristics and regional functions in traditional methods, and to improve the precision of adhesive plate cutting.

[0038] In one embodiment, the step S203 of constructing an initial contour boundary vector according to the initial line height distribution matrix, and compensating the initial contour boundary vector based on the laser cutting parameters to obtain a cutting motion trajectory sequence, comprises: S2031, performing multi-scale gradient field analysis on the initial line height distribution matrix to obtain a gradient amplitude map, and performing sub-pixel level edge positioning on the gradient amplitude map based on an interpolation fusion algorithm to obtain a contour coordinate sequence; S2032, performing curvature self-adaptive fitting on the contour coordinate sequence by using a spline curve fitting algorithm to obtain an initial contour boundary vector, and obtaining a local curvature radius according to the initial contour boundary vector; S2033, obtaining a laser output power, a repetition frequency, a beam quality factor and a focused spot radius according to the laser cutting parameters, obtaining a heat affected zone depth prediction value according to the local curvature radius, the laser output power and the repetition frequency; S2034, obtaining a sidewall thermal damage depth threshold, and solving by using an iterative optimization algorithm based on the heat affected zone depth prediction value and the sidewall thermal damage depth threshold to obtain a heat affected zone compensation amount; S2035, obtaining an effective spot action radius by a Gaussian beam energy distribution model based on the laser output power, the beam quality factor and the focused spot radius, and obtaining a total path compensation amount according to the effective spot action radius and the heat affected zone compensation amount; S2036, obtaining a cutting path coordinate sequence according to the total path compensation vector and the initial contour boundary vector, and reconstructing a trajectory of the cutting path coordinate sequence by using a quintic spline interpolation algorithm to obtain a cutting motion trajectory sequence.

[0039] As described in steps S2031-S2036 above, the present application obtains a series of gradient amplitude maps of different scales by performing multi-scale gradient field analysis on the initial line height distribution matrix, and performs sub-pixel level edge positioning on the gradient amplitude maps based on an interpolation fusion algorithm to obtain a contour coordinate sequence, and performs curvature adaptive fitting on the contour coordinate sequence using a spline curve fitting algorithm to obtain an initial contour boundary vector; by calculating the change rate of the tangent vector at each point on the contour line, the local curvature radius is obtained, according to the laser cutting parameters to obtain the laser output power, the repetition frequency, the beam quality factor and the focused spot radius, according to the actual viscosity value of the adhesive sheet resin, the laser output power, the repetition frequency and the local curvature radius, they are jointly input into the trained heat affected zone depth prediction model, the model establishes a nonlinear mapping relationship between the above input parameters and the heat affected zone depth through a machine learning algorithm, and its technical basis is that: the resin viscosity directly affects the thermal sensitivity and the molten flowability of the material, the higher the viscosity, the deeper the heat affected zone, the laser output power and the repetition frequency jointly determine the heat input energy per unit area, the higher the energy, the more serious the heat affected zone; the local curvature radius reflects the dynamics characteristics in the processing process, the laser scanning speed change in the sharp corner area with small curvature radius will cause energy accumulation, causing the local increase of the heat affected zone depth in this area, and the model outputs the heat affected zone depth prediction value continuously distributed along the cutting path based on the comprehensive action of the above parameters.

[0040] The preset side wall thermal damage depth threshold value representing the maximum allowed heat affected depth is obtained, and an iterative optimization algorithm based on gradient descent is used to solve the heat affected zone compensation amount. The optimization process takes the path offset amount as the optimization variable, and the maximum predicted heat affected zone depth on the offset path as the constraint condition. The specific implementation is as follows: the target function is defined as the depth deviation function, and the value is the difference between the heat affected zone depth prediction value and the side wall thermal damage depth threshold value. Iterative calculation starts from the initial offset amount; in each iteration, a new predicted path is generated based on the current offset amount, and the model re-predicts the heat affected zone depth according to the geometric characteristics of the new path, and calculates the current depth deviation value; when the current depth deviation value is greater than 0, the gradient of the target function is calculated by the gradient descent method and the offset amount is updated to obtain the next iteration offset amount; repeat this process until the current depth deviation value is not greater than 0, at this time the obtained offset amount is the minimum heat affected zone compensation amount that satisfies the constraint condition. The heat affected zone compensation amount generated by this method changes dynamically along the cutting path, ensuring that the heat affected depth of each region is effectively controlled during the machining process. Through the Gaussian beam energy distribution model, the radial distance corresponding to the radial energy density falling to the ablation threshold of the adhesive sheet material is calculated using the laser output power, beam quality factor and focused spot radius to obtain the effective action radius of the spot. The heat affected zone compensation amount and the effective action radius of the spot are algebraically added to obtain the total path compensation amount. According to the total path compensation vector and the initial contour boundary vector, the cutting path coordinate sequence is obtained, and the five spline interpolation algorithm is used to reconstruct the cutting path coordinate sequence to obtain the cutting motion trajectory sequence.

[0041] In one embodiment, the micro-etched copper thickness of the third semi-finished plate 18 and the fourth semi-finished plate 19 is 1 / 3 oz.

[0042] After obtaining the third semi-finished plate 18 and the fourth semi-finished plate 19, since the outermost 1 / 3 oz copper foil is exposed to the air, a thin oxide layer will form on its surface and may be contaminated, thereby seriously weakening the bonding force between it and the adhesive sheet used for subsequent lamination, resulting in the risk of delamination after final lamination. By accurately controlling the micro-etching thickness to match the lamination copper foil thickness (1 / 3 oz) in the design, the present application not only completely cleans the bonding interface, but also completely preserves the functional inner layer circuit, thereby fundamentally eliminating the delamination risk during final lamination and ensuring the structural integrity and long-term reliability of the ultra-thick copper multilayer board.

[0043] In one embodiment, the step S8 of performing finished processing on the fifth semi-finished plate 20 to obtain a 30 oz ultra-thick copper double-sided PCB board 001 includes: S801, grinding the surface resin of the fifth semi-finished plate 20 until the thick copper pattern of the outer layer circuit is completely exposed.

[0044] It should be noted that the present scheme adopts a two-stage precision grinding and copper surface cleaning synergistic process to realize precise removal of the resin on the surface of the fifth semi-finished plate 20 and copper surface flattening treatment: in the first stage, diamond grinding wheel is used for rough grinding, by pre-setting the grinding plate pressure (0.1-0.3 MPa) and the feed speed (5-8 m / min) to quickly remove most of the resin layer on the surface, and at the same time, an online dust suction device is used to suck the slag generated during grinding in real time to avoid the accumulation and adhesion of the slag; in the second stage, an alumina soft grinding brush is used for fine grinding, the grinding plate pressure is reduced to 0.05-0.1 MPa, and the feed speed is adjusted to 3-5 m / min to reduce the mechanical damage to the copper surface, and alkaline cleaning liquid (pH value 10-11) is sprayed synchronously during the fine grinding process to completely remove the residual slag and oxide layer on the copper surface through the synergistic effect of chemical cleaning and mechanical grinding, and to ensure the cleanliness of the copper surface; in order to precisely control the stopping point of the grinding plate and ensure the uniformity of the copper surface height, the grinding plate equipment is integrated with a laser ranging sensor and a copper surface detection module, the laser ranging sensor monitors the change of the plate thickness in real time during the grinding process, and when the detected plate thickness reaches the preset target value (the theoretical total thickness of the core substrate 15 + the bonding sheet + the red copper plate), a pre-stop signal is triggered; the copper surface detection module scans the plate surface in real time through eddy current detection technology, and when the copper surface coverage reaches more than 98% and the copper surface thickness fluctuation is ≤±0.03 mm, the equipment immediately stops grinding, and at the same time, the precise control of the lamination thickness of each layer during the production process of the fifth semi-finished plate 20 (such as the etching thickness of the red copper plate and the thickness of the bonding sheet, which are strictly executed according to the preset standard) is combined to ensure the uniformity of the overall thickness of the substrate, and then to ensure the uniformity of the copper surface height after grinding, and to avoid the occurrence of local copper exposure or residual resin.

[0045] S802, drilling the fifth semi-finished plate 20 after the grinding plate treatment, and copper plating on the inner wall of the drilled hole to form a copper layer on the surface of the fifth semi-finished plate 20; S803, etching the copper layer on the surface of the fifth semi-finished plate 20 after the hole metallization treatment to form a circuit pattern; S804, twice solder mask coating and curing of the solder mask ink on the surface of the plate member of the fifth semi-finished plate 20 after the line etching treatment to obtain a 30oz super-thick copper double-sided PCB plate 001.

[0046] As described in steps S801-S804, the present application removes the resin layer on the surface of the fifth semi-finished product plate 20 by milling plate processing, directly exposing the outer layer thick copper circuit of the first red copper plate 1 and the second red copper plate 2 which have been flattened by the previous pressing process, reducing the circuit surface difference faced by the subsequent solder mask process from about 1.05mm of the traditional 30oz thick copper plate to the conventional level, so that only two solder mask coatings are needed to completely cover the circuit surface; and by drilling and copper plating, an electrically conductive channel is established between the third semi-finished product plate 18, the core substrate 15 and the fourth semi-finished product plate 19, and a complete circuit pattern including internal interconnection and external interface is formed on the copper layer plated on the plate surface by one etching process; based on the flat surface realized by the foregoing process, the dozens of times of solder mask required by the traditional super-thick copper plate are simplified to twice, which not only completely solves the problems of ink blistering and cracking caused by multiple baking, but also shortens the solder mask process time by more than 80%, which is conducive to improving the production efficiency and the production efficiency of the super-thick copper PCB.

[0047] As Figure 16 indicated, the present application also provides a computer device, including a memory and a processor, the memory stores a computer program, and the processor realizes the steps of the above-mentioned 30oz super-thick copper double-sided PCB plate manufacturing method when executing the computer program.

[0048] The present application also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program is executed by a processor to realize the steps of the above-mentioned 30oz super-thick copper double-sided PCB plate manufacturing method.

[0049] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when executed, can include the processes of the above-mentioned embodiment methods. Any reference to memory, storage, databases, or other media in this application and in examples used herein, unless specifically stated otherwise, can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM), or external cache memory. As an illustration but not limitation, RAM is available in many forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct RAMbus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0050] It should be noted that in this document, the terms "comprising", "including", or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, device, article, or method that comprises a list of elements does not only include those elements, but can also include other elements not expressly listed or inherent to such process, device, article, or method. Without more limitations, an element defined by the statement "comprising a" does not exclude the presence of additional identical elements in the process, device, article, or method that includes the element.

[0051] The above description is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, based on the content of the present application specification and drawings, is also included in the patent protection scope of the present application.

Claims

1. A method for manufacturing a 30 oz super thick copper double-sided PCB board, characterized in that, The method comprises the following steps: S1, respectively, the red copper plate, adhesive sheet, copper-clad plate and copper foil are subjected to cutting treatment to obtain a PCB manufacturing substrate, the PCB manufacturing substrate comprises a first red copper plate, a second red copper plate, an initial copper-clad plate and a plurality of adhesive sheets and copper foils; S2, the first red copper plate and the second red copper plate are subjected to outer layer circuit manufacturing, and the first group of adhesive sheets is cut based on the first red copper plate and the second red copper plate with an outer layer circuit structure by using a laser cutting technology; S3, the first red copper plate and the second red copper plate are respectively subjected to pressure bonding and glue filling with the first group of adhesive sheets and copper foils to obtain a first semi-finished product plate and a second semi-finished product plate; S4, the first semi-finished product plate and the second semi-finished product plate are respectively subjected to inner layer circuit manufacturing, and the second group of adhesive sheets is cut based on the first semi-finished product plate and the second semi-finished product plate with an inner layer circuit structure by using a laser cutting technology; S5, the first semi-finished product plate and the second semi-finished product plate are respectively subjected to pressure bonding and glue filling with the second group of adhesive sheets and copper foils to obtain a third semi-finished product plate and a fourth semi-finished product plate; S6, the initial copper-clad plate is subjected to etching to obtain a core substrate; S7, the third semi-finished product plate and the fourth semi-finished product plate are subjected to micro-etching, and the third semi-finished product plate and the fourth semi-finished product plate subjected to micro-etching are subjected to pressure bonding with the core substrate and the adhesive sheet to obtain a fifth semi-finished product plate; S8, the fifth semi-finished product plate is subjected to finished product processing to obtain a 30oz super-thick copper double-sided PCB plate.

2. The method of claim 1, wherein the 30 oz super thick copper double-sided PCB is made by, The thicknesses of the first red copper plate and the second red copper plate are both 30oz, and the etching thicknesses of the upper end circuit, the lower end circuit of the first red copper plate and the upper end circuit, the lower end circuit of the second red copper plate are all 15oz.

3. The method of claim 1, wherein the 30 oz super thick copper double-sided PCB is made by, The adhesive sheet comprises a first adhesive sheet, a second adhesive sheet, a third adhesive sheet, a fourth adhesive sheet, a fifth adhesive sheet, a sixth adhesive sheet, a seventh adhesive sheet and an eighth adhesive sheet, the thicknesses of the first adhesive sheet, the second adhesive sheet, the fifth adhesive sheet and the sixth adhesive sheet are all 15oz, and the thicknesses of the third adhesive sheet and the fourth adhesive sheet are both 0.1mm.

4. The method of making a 30 oz super thick copper double sided PCB board of claim 1, wherein, The copper foil comprises a first copper foil, a second copper foil, a third copper foil and a fourth copper foil, and the thicknesses of the first copper foil, the second copper foil, the third copper foil and the fourth copper foil are all 1 / 3oz.

5. The method of making a 30 oz super thick copper double sided PCB board of claim 1, wherein, The step of cutting the first group of adhesive sheets based on the first red copper plate and the second red copper plate with an outer layer circuit structure by using a laser cutting technology comprises the following steps: Obtaining the circuit layer point cloud data of the first red copper plate to be pressure bonded and the adhesive sheet material parameters of the first group of adhesive sheets to be cut, and obtaining laser cutting parameters; Obtaining an initial circuit height distribution matrix according to the circuit layer point cloud data, and performing collaborative analysis on the circuit layer point cloud data and the adhesive sheet material parameters to obtain a cutting depth distribution matrix; Constructing an initial contour boundary vector according to the initial circuit height distribution matrix, and performing thermal effect compensation on the initial contour boundary vector based on the laser cutting parameters to obtain a cutting motion trajectory sequence; According to the cutting depth distribution matrix and the laser cutting parameter, a laser control instruction sequence is acquired, and a laser beam is cooperatively controlled to perform a cutting work on the bonding sheet based on the cutting motion trajectory sequence and the laser control instruction sequence.

6. The method of making a 30 oz super thick copper double-sided PCB board of claim 5, wherein, The step of constructing an initial contour boundary vector according to the initial line height distribution matrix and performing thermal effect compensation on the initial contour boundary vector based on the laser cutting parameter to obtain a cutting motion trajectory sequence comprises: performing multi-scale gradient field analysis on the initial line height distribution matrix to obtain a gradient amplitude graph, and performing sub-pixel level edge positioning on the gradient amplitude graph based on an interpolation fusion algorithm to obtain a contour coordinate sequence; adopting a spline curve fitting algorithm to perform curvature self-adaptability fitting on the contour coordinate sequence to obtain an initial contour boundary vector, and acquiring a local curvature radius according to the initial contour boundary vector; acquiring a laser output power, a repetition frequency, a beam quality factor and a focused spot radius according to the laser cutting parameter, and acquiring a thermal influence zone depth prediction value according to the local curvature radius, the laser output power and the repetition frequency; acquiring a sidewall thermal damage depth threshold, and solving an iterative optimization algorithm based on the thermal influence zone depth prediction value and the sidewall thermal damage depth threshold to obtain a thermal influence zone compensation amount; acquiring a spot effective action radius based on the laser output power, the beam quality factor and the focused spot radius through a Gaussian beam energy distribution model, and acquiring a total path compensation amount according to the spot effective action radius and the thermal influence zone compensation amount; acquiring a cutting path coordinate sequence according to the total path compensation vector and the initial contour boundary vector, and performing trajectory reconstruction on the cutting path coordinate sequence by adopting a quintic spline interpolation algorithm to obtain a cutting motion trajectory sequence.

7. The method of making a 30 oz super thick copper double sided PCB board of claim 1, wherein, The micro-etched copper thickness of the third and fourth semi-finished plates is 1 / 3 oz.

8. The method of making a 30 oz super thick copper double sided PCB board of claim 1, wherein, The step of performing a finished product processing on the fifth semi-finished plate to obtain a 30 oz super-thick copper double-sided PCB plate comprises: performing plate grinding processing on the surface resin of the fifth semi-finished plate until the thick copper pattern of the outer layer circuit is completely exposed; performing drilling on the fifth semi-finished plate after the plate grinding processing, and performing copper plating on the inner wall of the drilled hole to form a plate surface copper plating layer of the fifth semi-finished plate; performing etching on the plate surface copper plating layer of the fifth semi-finished plate after the hole metallization processing to form a circuit pattern; performing twice solder mask coating and curing solder mask ink on the surface of the fifth semi-finished plate after the circuit etching processing to obtain an oz super-thick copper double-sided PCB plate. 9.A computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the computer device is configured to perform the method according to any one of claims 1-8 when the computer program is executed by the processor. The processor executes the computer program to implement the steps of the method of any one of claims 5 to 6.

10. A computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method of any one of claims 5 to 6.

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