Technological method for improving uniformity of PCB (Printed Circuit Board) mixed compression material dielectric layer

Abstract

The invention provides a process method for improving the uniformity of a PCB (Printed Circuit Board) mixed compression material dielectric layer. The process method comprises the following steps of: performing browning, combining, riveting, laminating, pressing, target drilling, cutting and grinding, drilling, inner layer processing, browning, laminating, pressing, target drilling, cutting and grinding on an inner layer board of a PCB. According to the process method for improving the uniformity of the dielectric layer of the PCB mixed compression material, a traditional one-time compression process is replaced, the poor thickness uniformity of the dielectric layer caused by the characteristic difference of a Standard Loss material and an Ultra low loss material can be improved, and the thickness difference of the dielectric layer caused by mixed compression of the Standard Loss material and the Ultra low loss material of a thick multilayer board can be improved. By means of the method, the poor laser hole machining quality caused by non-uniformity of the mixed pressing dielectric layer can be effectively improved, the back drilling hole stub control precision and impedance control uniformity are improved, and the market trend requirement can be met.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and in particular to a process method for improving the uniformity of dielectric layers in PCB mixed-layer materials. Background Technology

[0002] As market capacity becomes saturated and competition among companies intensifies, AI-related electronic products are transforming, the demand for high-speed materials is increasing, and process applications are placing higher demands on the ability to manufacture mixed-layer dielectrics in PCBs.

[0003] Currently, to address the increasing costs of high-speed material applications, the industry typically employs a hybrid approach, combining high-speed materials with conventional materials to reduce costs. However, the differences in material properties mean that lamination parameters are preferentially matched to the high-speed material, resulting in poor dielectric uniformity in the conventional material's dielectric layer. This reduces PCB laser hole production yield, hinders back-drilling depth control, and makes impedance uniformity management difficult.

[0004] Therefore, it is necessary to provide a process method to improve the uniformity of the dielectric layer of PCB mixed-layer materials to solve the above-mentioned technical problems. Summary of the Invention

[0005] This invention provides a process method for improving the uniformity of the dielectric layer in PCB mixed-layer materials, overcoming the processing costs and limitations of existing technologies, and providing a process method for improving the uniformity of the dielectric layer in PCB mixed-layer materials, which can overcome the bottlenecks of existing technologies.

[0006] To solve the above-mentioned technical problems, the present invention provides a process method for improving the uniformity of the dielectric layer of PCB mixed-layer materials, comprising the following steps: The process involves browning, assembly, riveting, lamination, drilling and grinding, drilling, inner layer, browning, lamination, and drilling and grinding of the inner PCB board.

[0007] Preferably, browning is achieved by roughening the copper surface through oxidation, thereby promoting the adhesion between the copper surface and the resin. The assembly-riveting-overlay process involves stacking the inner layer board and PP according to the customer's design, following a specific order and the positioning square holes punched in the inner layer. The pressing process involves heating and pressing the laminated boards, followed by hot pressing and cold pressing, to create a multilayer board. The program uses the Standard Loss material program. Preferably, the drilling and grinding process involves using X-ray to grasp the inner layer target, then drilling three positioning holes for drilling, and cutting away the copper foil and excess adhesive from the edge of the board after lamination. The drilling is to create alignment holes on the edge of the plate after pressing; Preferably, the inner layer consists of inner layer graphics and external data; Browning is a process that roughens the copper surface through oxidation, thereby promoting the adhesion between the copper surface and the resin. Preferably, the lamination is performed according to the customer-designed lamination method, where the inner layer board and PP are lamination in a certain order and according to the alignment holes on the edge of the inner layer board; The pressing process involves heating and pressing the laminated boards, followed by hot pressing and cold pressing, to create a multilayer board. The program uses an Ultra low loss material program. Preferably, the target cutting process involves using X-ray to grasp the inner layer target, then drilling three positioning holes for drilling, and cutting away the copper foil and excess adhesive from the edge of the board after lamination.

[0008] Compared with related technologies, the process method for improving the uniformity of the dielectric layer of PCB mixed-layer materials provided by the present invention has the following beneficial effects: This invention provides a process method for improving the uniformity of the dielectric layer in PCB mixed-layer materials: 1. Traditional lamination using a single high-grade material is costly. The current method of using two mixed materials effectively reduces material costs. 2. This process effectively reduces the non-uniformity of the dielectric layer caused by material differences, which is beneficial to subsequent processing and improves product quality. 3. Inhomogeneous dielectric layer affects signal transmission, and impedance and loss control are both affected. In summary, the mixed-pressure process leads to uneven dielectric layer, which has a significant impact on the quality of subsequent processing and signal control. This invention breaks through the above processes, thereby improving the product processing quality and meeting market product demands. Attached Figure Description

[0009] Figure 1 This is a process flow diagram of a method for improving the uniformity of the dielectric layer of a PCB mixed-layer material according to the present invention. Figure 2 This is a schematic diagram of the lamination and mixing steps in a process method for improving the uniformity of the dielectric layer of a PCB mixed-lamination material according to the present invention. Figure 3 This is a schematic diagram illustrating the dielectric layer thickness improvement process of a PCB mixed-layer material dielectric layer uniformity improvement method according to the present invention. Figure 4 This is a schematic diagram illustrating the impedance improvement process of a PCB mixed-layer dielectric layer uniformity improvement method according to the present invention. Detailed Implementation

[0010] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0011] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 ,in, Figure 1This is a process flow diagram of a method for improving the uniformity of the dielectric layer of a PCB mixed-layer material according to the present invention. Figure 2 This is a schematic diagram of the lamination and mixing steps in a process method for improving the uniformity of the dielectric layer of a PCB mixed-lamination material according to the present invention. Figure 3 This is a schematic diagram illustrating the dielectric layer thickness improvement process of a PCB mixed-layer material dielectric layer uniformity improvement method according to the present invention. Figure 4 This is a schematic diagram illustrating impedance improvement in a process method for improving the uniformity of the dielectric layer in PCB mixed-layer materials according to the present invention. The process method for improving the uniformity of the dielectric layer in PCB mixed-layer materials is characterized by comprising the following steps: The process involves browning, assembly, riveting, lamination, drilling and grinding, drilling, inner layer, browning, lamination, and drilling and grinding of the inner PCB board.

[0012] Browning involves roughening the copper surface through oxidation to promote the bonding force between the copper surface and the resin. The assembly-riveting-overlay process involves stacking the inner layer board and PP according to the customer's design, following a specific order and the positioning square holes punched in the inner layer. The pressing process involves heating and pressing the laminated boards, followed by hot pressing and cold pressing, to create a multilayer board. The program uses the Standard Loss material program. The target cutting process involves using X-ray to capture the inner layer target, then drilling three positioning holes for drilling, and cutting away the copper foil and excess adhesive from the edge of the board after lamination. The drilling is to create alignment holes on the edge of the plate after pressing; The inner layer is used to create the inner layer graphics and external board data; Browning is a process that roughens the copper surface through oxidation, thereby promoting the adhesion between the copper surface and the resin. The lamination process involves stacking the inner layer board and PP in a specific order according to the customer's design, and aligning them with the alignment holes on the inner layer board edges. The pressing process involves heating and pressing the laminated boards, followed by hot pressing and cold pressing, to create a multilayer board. The program uses an Ultra low loss material program. The target cutting process involves using X-ray to capture the inner layer target, then drilling three positioning holes for drilling, and cutting away the copper foil and excess adhesive from the edge of the board after lamination.

[0013] The present invention provides a process method for improving the uniformity of dielectric layer in PCB mixed-lamination materials, which can improve the dielectric layer thickness difference caused by the mixed lamination of Standard Loss material and Ultra Low Loss material in thick multilayer boards.

[0014] AI high-speed materials all have the need for loss signal control, and considering cost, mixed-pressure stacking process is often adopted. This method can effectively improve the poor quality of laser hole processing caused by the inhomogeneity of the mixed-pressure dielectric layer, improve the control accuracy of back-drilled hole stub and the uniformity of impedance control, and can cover market trend demand.

[0015] Compared with related technologies, the process method for improving the uniformity of the dielectric layer of PCB mixed-layer materials provided by the present invention has the following beneficial effects: This invention provides a process method for improving the uniformity of the dielectric layer in PCB mixed-layer materials: 1. Traditional lamination using a single high-grade material is costly. The current method of using two mixed materials effectively reduces material costs. 2. This process effectively reduces the non-uniformity of the dielectric layer caused by material differences, which is beneficial to subsequent processing and improves product quality. 3. Inhomogeneous dielectric layer affects signal transmission, and impedance and loss control are both affected. In summary, the mixed-pressure process leads to uneven dielectric layer, which has a significant impact on the quality of subsequent processing and signal control. This invention breaks through the above processes, thereby improving the product processing quality and meeting market product demands.

[0016] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A process for improving dielectric layer uniformity of PCB mixed technology material, characterized in that, The method comprises the following steps: The inner layer of the PCB is browned, combined, riveted, laminated, pressed, drilled, targeted and ground, browned, laminated, pressed, drilled, targeted and ground.

2. The process for improving dielectric layer uniformity of PCB panelized material of claim 1, wherein, The brown is to roughen the copper surface by oxidation to promote the bonding force between the copper surface and the resin; The combination-riveting-lamination is to laminate the inner layer and the PP according to a certain order and according to the positioning square hole of the inner layer punch. The pressing is to heat and press the laminated board, and the multi-layer board is obtained after hot pressing and cold pressing, and the Standard Loss material program is used.

3. The process for improving dielectric layer uniformity of PCB panelized material of claim 1, wherein, The drilling target grinding is to grab the inner layer target through X-ray, then use the drill bit to punch out three positioning holes for drilling, and cut off the copper foil and the flow glue on the edge of the pressed board. The drilling is to drill the alignment hole on the edge of the pressed board.

4. The process for improving dielectric layer uniformity of PCB panelized material of claim 1, wherein, The inner layer is to make the inner layer pattern and the board outer data. The brown is to roughen the copper surface by oxidation to promote the bonding force between the copper surface and the resin.

5. The process for improving dielectric layer uniformity of PCB panelized material of claim 1, wherein, The lamination is to laminate the inner layer and the PP according to a certain order and according to the positioning square hole of the inner layer punch. The pressing is to heat and press the laminated board, and the multi-layer board is obtained after hot pressing and cold pressing, and the Ultra low loss material program is used.

6. The process for improving dielectric layer uniformity of PCB panelized material of claim 1, wherein, The drilling target grinding is to grab the inner layer target through X-ray, then use the drill bit to punch out three positioning holes for drilling, and cut off the copper foil and the flow glue on the edge of the pressed board.

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