Electronic equipment and preparation method of shell

Abstract

The invention discloses an electronic device and a preparation method of a shell, and the electronic device comprises a shell which is composed of a target area and a non-target area; the target area corresponds to the first part of the shell; the non-target area corresponds to the second part of the shell; wherein the target area presents a first effect, and the non-target area presents a second effect; the first effect is different from the second effect; the first part comprises a first effect layer and a second effect layer which are stacked, and the first effect layer is located on the side, facing the outer side of the shell, of the second effect layer; the second part comprises a second effect layer; the first effect layer is used for forming a first effect, and the second effect layer is used for forming a second effect.

Description

[0001] This application is a divisional application of the application with the application date of September 30, 2022, the application number of 202211230489.2, and the title of "Preparation method of electronic device and shell". TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic devices, more particularly, to an electronic device and a preparation method of a shell. BACKGROUND

[0003] With the continuous development of science and technology, more and more electronic devices are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable important tool for people today.

[0004] Electronic devices need to be set with a shell, which not only supports and protects the internal devices of the device, but also enables the electronic device to have a set appearance effect. In existing electronic devices, the shell is usually an integrated shell formed by injection molding process, and the outer surface of the shell is generally a plane or a smooth curved surface. The appearance effect displayed by the shell is single, resulting in a single appearance effect of the electronic device. SUMMARY

[0005] Therefore, the present application provides an electronic device and a preparation method of a shell, as follows:

[0006] The first aspect of the present application provides an electronic device, which comprises:

[0007] a shell, the shell being composed of a target area and a non-target area; the target area corresponding to a first part of the shell; the non-target area corresponding to a second part of the shell;

[0008] wherein the target area presents a first effect, and the non-target area presents a second effect; the first effect is different from the second effect; the first part comprises a first effect layer and a second effect layer stacked together, and the first effect layer is located on the side of the second effect layer facing the outer side of the shell; the second part comprises the second effect layer; the first effect layer is used to form the first effect, and the second effect layer is used to form the second effect.

[0009] Preferably, in the above electronic device, on the outer side of the shell, the target area is higher than the first area of the non-target area, and the second area of the non-target area is a transition area between the target area and the first area.

[0010] Preferably, in the above electronic device, the first effect layer comprises a first color layer, or the first effect layer comprises a first color layer and a first transparent layer located on the side of the first color layer facing the outer side of the shell.

[0011] The second effect layer includes a second color layer, or the second effect layer includes a second color layer and a second transparent layer located on the outer side of the housing of the second color layer.

[0012] Preferably, in the above-mentioned electronic device, in the target area, the first transparent layer is located on the side of the first color layer that is opposite to the second color layer, and the second transparent layer is located between the first color layer and the second color layer;

[0013] In the non-target area, the second transparent layer is located on the side of the second color layer facing the outside of the shell.

[0014] Preferably, in the above-mentioned electronic device, the thickness of the second transparent layer is not less than 0.4 mm.

[0015] Preferably, in the above-mentioned electronic device, the thickness of the second transparent layer is in the range of 0.4mm-0.8mm.

[0016] Preferably, in the above-mentioned electronic device, the target area includes at least one through hole, and the electronic device further includes: at least one camera module located on one side of the second effect layer of the housing, and the lens of the at least one camera module is exposed based on the corresponding through hole;

[0017] A light-transmitting cover is installed inside the through hole.

[0018] Preferably, in the above-mentioned electronic device, the cover plate is flush with the outer surface of the target area.

[0019] A second aspect of this application provides a method for manufacturing a housing in any of the aforementioned electronic devices, comprising:

[0020] A first workpiece is prepared, wherein a first effect layer presenting a first effect and a fixing structure for fixing are provided on the inner surface of the first workpiece; the shell has a first part and a second part;

[0021] The first workpiece is fixed in the target position inside the mold by a fixing structure;

[0022] The second workpiece is formed by in-mold injection molding;

[0023] A second effect layer is formed on the inner surface of the second workpiece, which presents a second effect. The first effect is different from the second effect. In the first part, the first effect layer and the second effect layer are stacked and located on the side of the second effect layer facing the outside of the shell.

[0024] Remove the fixed structure to form a shell.

[0025] Optionally, in the above preparation method, the area of ​​the first effect layer corresponding to the fixed structure has a hollow structure, and the fixed structure passes through the hollow structure. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0028] Figure 1 A cross-sectional view of a housing in an electronic device provided in this application embodiment;

[0029] Figure 2 This is a partially enlarged cross-sectional view of an electronic device housing provided in an embodiment of this application;

[0030] Figure 3 A cross-sectional view of the housing in another electronic device provided in this application embodiment;

[0031] Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0032] Figures 5-12 A process flow diagram of a method for manufacturing an electronic device housing provided in this application embodiment;

[0033] Figure 13 This is a schematic diagram showing the appearance of a shell formed by the preparation method described in the embodiments of this application;

[0034] Figure 14 This is a schematic diagram showing the appearance of another shell formed by the preparation method described in the embodiments of this application. Detailed Implementation

[0035] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] refer to Figure 1 As shown, Figure 1 This is a cross-sectional view of a housing in an electronic device provided in an embodiment of this application. The electronic device includes... Figure 1 The housing 100 shown.

[0038] The shell 100 is composed of a target area 101 and a non-target area 102;

[0039] Among them, the target area 101 presents the first effect, and the non-target area 102 presents the second effect; the first effect and the second effect are different.

[0040] On the outside of the housing 100, the target area 101 is higher than the first area 21 of the non-target area 102, and the second area 22 of the non-target area 102 is the transition area between the target area 101 and the first area 21.

[0041] In the casing 100 of the electronic device of this application, the target area 101 and the non-target area 102 can present different effects, so that the electronic device can display different appearance effects.

[0042] The target area 101 and the non-target area 102 can be made of different colored materials, so that the target area 101 presents a first effect and the non-target area 102 presents a second effect. Specifically, a first structural component made of the first colored material can be used as the target area 101, and a second structural component made of the second colored material can be used as the non-target area 102. The first structural component and the second structural component can be spliced ​​together to form the required shell 100.

[0043] Preferably, to avoid splicing marks on the outer surface of the casing, the first effect of the target area 101 can be presented through a transparent layer, and the second effect of the non-target area 102 can be presented through a transparent layer. In this way, the target area 101 and the non-target area 102 can display their appearance effects based on the same transparent layer.

[0044] On the inner surface of the transparent layer, different colored coatings or films can be applied to the target area 101 and the non-target area 102 respectively. Combined with the height difference between the target area 101 and the non-target area 102 on the outside of the housing 100, the target area 101 presents the first effect and the non-target area 102 presents the second effect.

[0045] refer to Figure 2 As shown, Figure 2This is a partially enlarged cross-sectional view of an electronic device housing provided in an embodiment of this application. The transition region 22 extends from the target region 101 to the non-target region 102 and includes at least a transparent region. Figure 2 The area shown by the dashed ellipse. Due to this transparent area, when viewed from the outside of the housing 100, the line of sight can extend from the target area 101 to the non-target area 102. Figure 2 The transparent area is traversed from right to left. Thus, when viewed from the outside of the shell 100, the target area 101 can appear to float due to the height difference between the target area 101 and the non-target area 102, as well as the different first and second effects they present.

[0046] refer to Figure 3 As shown, Figure 3 A cross-sectional view of the housing in another electronic device provided in this application embodiment, based on the above embodiment, Figure 3 In the illustrated configuration, target area 101 corresponds to the first part of shell 100; non-target area 102 corresponds to the second part of shell, and the first part has a higher hierarchical structure than the second part. The first part includes a first transparent layer 31, a first color layer 32, a second transparent layer 33, and a second color layer 34, stacked sequentially from the outside to the inside of the shell; the first color layer 31 creates a first effect; the second color layer 32 creates a second effect; the second part includes a second transparent layer 33 and a second color layer 34, stacked sequentially from the outside to the inside of shell 100.

[0047] By using injection molding, the first transparent layer 31 and the first color layer 32 can be injection molded and embedded into the second transparent layer 33 at the position corresponding to the target area 101. This results in the first part having more layers than the second part, which not only facilitates the formation of the required height difference between the target area 101 and the non-target area 102 on the outside of the shell 100, but also eliminates the obvious boundary marks of the two-part splicing structure on the outer surface of the shell 100 caused by conventional splicing structures, forming a surface structure with good integrity and smoothness at the junction of the two areas.

[0048] Optionally, the first transparent layer 31 and the second transparent layer 33 are made of the same material and are integrally formed into the first and second transparent layers. Since the first transparent layer 31 and the second transparent layer 33 are made of the same material, the first transparent layer 31 can be prepared first, and a first color layer 32 can be provided on the inner surface of the first transparent layer 31. Then, the second transparent layer 33 is prepared by injection molding. When preparing the second transparent layer 33, the second transparent layer 33 is formed by injection molding based on the first transparent layer 31 with the first color layer 32 attached. The first transparent layer 31 and the second transparent layer 33 are made of the same material, which allows the first transparent layer 31 to be integrally embedded into the formed second transparent layer 33, so that the first transparent layer 31 and the second transparent layer 32 form an integral structure, thereby avoiding the boundary splicing marks between different materials.

[0049] In this embodiment, the thickness d of the second transparent layer 33 in the target area 101 is greater than a set threshold. If it is in the transition area 22, the line of sight can pass through the second transparent layer 33 in the transition area 22 to perceive the first transparent layer 31 and the first color layer 32 in the target area 101 with a good floating effect.

[0050] Optionally, the threshold value is set to be no less than 0.4 mm. In this embodiment, the thickness d of the second transparent layer 33 is set to a range of 0.4 mm to 0.8 mm. When the thickness d of the second transparent layer 33 is set to a range of 0.4 mm to 0.8 mm, on the one hand, it can avoid the inability to display the floating effect of the first transparent layer 31 and the first color layer 32 in the target area 101 due to the thinness of the second transparent layer 33; on the other hand, it can avoid the case where the thickness of the second transparent layer 33 is too large, resulting in a large thickness of the housing 100, which would affect the thin and light design of the electronic device.

[0051] Obviously, in other ways, the above-mentioned floating effect can be weakened or not set. In this case, the thickness of the second transparent layer 33 in the target area 101 is less than the set threshold, or even the thickness of the second transparent layer 33 can be set to 0. Through the mold closing design in injection molding, the mold can be seamlessly attached to the side surface of the first color layer 32 away from the first transparent layer 31, so that the thickness of the second transparent layer 33 in the target area 101 can be 0.

[0052] In this embodiment, the thickness of the second transparent layer 33 in the target area 101 can be controlled by setting the distance between the mold and the side surface of the first color layer 32 away from the first transparent layer 31 when the mold is closed.

[0053] refer to Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Based on the above embodiment, Figure 4In the illustrated configuration, the target area 101 includes at least one through-hole 41, and the electronic device further includes at least one camera module 42 located on one side of the second color layer 34 of the housing 100, with the lens 421 of the at least one camera module 42 exposed based on the corresponding through-hole 41.

[0054] Obviously, if the non-photosensitive electronic components in the electronic device are located inside the target area 101, then there is no need to provide a through hole 41 in the target area 101, and the target area 101 can be a whole surface structure without through holes.

[0055] To ensure the flatness of the outer surface of the housing 100 on the target area 101, and to prevent contamination or damage to the lens 421 of the camera module 42, a light-transmitting cover 43 is provided inside the through hole 41. On the outer side of the housing 100, the cover 43 is flush with the outer surface of the target area 101, that is, the cover 43 is flush with or nearly flush with the outer surface of the target area 101.

[0056] exist Figure 4 In the electronic device shown, on the outside of the housing 100, the target area 101 and the non-target area 102 of the camera module 42 are arranged to form different appearance effects, thereby realizing the diversity of the appearance of the electronic device.

[0057] In this embodiment, the electronic device may have one or more camera modules 42. When there are multiple cameras, each camera module 42 is configured to correspond to a through hole 41, and the through holes 41 are all located within the target area 101.

[0058] On the outside of conventional electronic devices, the area of ​​the casing around the camera module and the area outside the camera module are usually of the same height and color, which cannot highlight the area where the camera module is located. The technical solution of this application uses the target area 101 as the outside of the casing 100 corresponding to the camera module 42. Since the target area 101 and the non-target area 102 have a first effect and a second effect respectively, the area where the camera module is located can be prominently displayed on the outside of the casing.

[0059] Based on the above embodiments, another embodiment of this application also provides a method for preparing a casing for the electronic notebook described above, the method being as follows: Figures 5-12 As shown.

[0060] refer to Figures 5-12 As shown, Figures 5-12 This application provides a process flow diagram of a method for manufacturing an electronic device housing, the method comprising:

[0061] Step S11: As Figure 5 As shown, the first workpiece 001 is prepared.

[0062] The first workpiece 001 has a first effect layer 002 on its inner surface, which presents the first effect, and a fixing structure 003 for fixing. In this embodiment, the inner surface of the structure is the surface facing the inner side of the electronic device housing. The fixing structure 003 may be integrally formed with the first workpiece 001.

[0063] The first effect layer 002 can cover the fixed structure 003. To ensure the adhesion between the first effect layer 002 and the first workpiece 001 in areas other than the fixed structure 003, and to achieve a gapless fit, such as… Figure 5 As shown, the area of ​​the first effect layer 002 corresponding to the fixed structure 003 has a hollow structure, and the fixed structure 003 passes through the hollow structure.

[0064] Step S12: As Figures 6-8 As shown, the first workpiece 001 is fixed in the target position inside the mold A by the fixing structure 003.

[0065] Mold A includes, for example: Figure 6 As shown and the first mold A1 and as Figure 7 The second mold A2 shown has a complementary graphic structure to the first mold A1 and the second mold A2. For example... Figure 8 As shown, when the first mold A1 and the second mold A2 are closed, a model space 004 that is adapted to the shell structure can be formed.

[0066] The fixing structure 003 fixes the first workpiece 001 at the target position of mold A, which can be a groove 005 on the surface of the second mold A2. Each groove 005 corresponds one-to-one with the fixing structure 003. The depth of the groove 005 is no greater than the height of the fixing structure 003 protruding from the first effect layer 002.

[0067] When the depth of the groove 005 is equal to the height of the fixed structure 003 protruding from the first effect layer 002, the inner surface of the first effect layer 002 in the first workpiece 001 can abut against the surface of the second mold A2, so that when the subsequent injection molding is performed, the non-injection molded material can be shaped between the first effect layer 002 and the second mold A2.

[0068] When the depth of the groove 005 is less than the height of the fixed structure 003 protruding from the first effect layer 002, such as Figure 8 As shown, there is a gap of height d between the inner surface of the first effect layer 002 in the first workpiece 001 and the surface of the second mold A2, so that when injection molding is performed in the subsequent steps, the injection molding material of thickness d can be injection molded and shaped between the first effect layer 002 and the second mold A2.

[0069] Step S13: As Figure 9As shown, the second workpiece 006 is formed by in-mold injection molding.

[0070] based on Figure 8 The structure shown has a first workpiece 001 with a first effect layer 002 fixed in a model space 004 based on a groove 005. Then, molten liquid injection molding material is injected into the model space 004. After the injection molding material cools and solidifies, a second workpiece 006 is formed. The first workpiece 01 is then embedded into the second workpiece 006.

[0071] The first effect layer 002 has a lower melting point than the injection molding material to avoid damage to the first effect layer 002 during the injection molding process.

[0072] Step S14: As Figure 10 and Figure 11 As shown, a second effect layer 007 is formed on the inner surface of the second workpiece 006, presenting a second effect, which is different from the first effect.

[0073] In this step, firstly, as Figure 10 Demolding is performed as shown, removing mold A. Then, as... Figure 11 As shown, a second effect layer 007 is formed on the inner surface of the second workpiece 006, presenting a second effect, which is different from the first effect.

[0074] Step S15: As Figure 12 As shown, the fixed structure 003 is removed to form a shell.

[0075] The removal of the fixing structure 003 includes: removing the portion containing the fixing structure 003 to form at least one through hole 41. The area corresponding to the fixing structure 003 can be completely penetrated to form a through hole penetrating the housing. In this case, as in the above embodiment, a cover plate can be provided on the outside of the through hole 41. In other methods, a portion of the fixing structure 003 can be removed from the inside of the housing to form a non-penetrating through hole. If a transparent layer of a certain thickness can be retained on the outside of the fixing structure 003, this transparent layer can be reused as a cover plate for the camera module.

[0076] In the preparation method of this application embodiment, the through hole 41 formed based on the fixed structure serves as the light-receiving through hole of the camera module of the electronic device. Moreover, the fixed structure 003 can be reused as an alignment structure in the injection molding process for the alignment of the first workpiece 01 and the mold A.

[0077] In the preparation method of this application embodiment, the material of the first workpiece 001 is the same as the material of the second workpiece 006 formed by in-mold injection molding, so as to form the transparent layer of the shell. The first workpiece 001 and the second workpiece 006 are made of the same material, so that while the second workpiece 007 is being formed by injection molding, the molten injection molding material can be molded together with the first workpiece 001, and the edge of the first workpiece 001 can soften and deform in this process. This not only achieves a seamless integration of the first workpiece 001 and the second workpiece 007, but also makes the outer surface of the shell smoothly connected without any splicing marks.

[0078] The manufacturing method can form the shell of the above embodiment, and the first effect is presented by a first workpiece 001 with a first effect layer 002 attached to its inner surface. The target area of ​​the shell includes the first workpiece 001 and the first effect layer 002 disposed on its inner surface. The target area of ​​the shell includes a second workpiece 006 outside the area below the first workpiece 001 and a second effect layer 007 disposed on its surface.

[0079] In this embodiment, the preparation of the first workpiece 001 includes: applying a first color layer to the inner surface of a transparent plastic part to form a first workpiece with a first effect layer on its inner surface. The transparent plastic part, as the first workpiece 001, corresponds to the first transparent layer in the above embodiment.

[0080] The first workpiece 001 can be prepared using ICM (Inductively Coupled Molding) technology, and then the first effect layer 002 can be bonded and fixed to its inner surface with a fixed structure 003. The first workpiece 001 with the first effect layer 002 bonded and fixed can be cut using a CNC (Computer Numerical Control) machine tool to form the required shape structure.

[0081] In this embodiment, a second effect layer 007 exhibiting the second effect is formed on the inner surface of the second workpiece 006; a second color layer is applied to the inner surface of the second workpiece 006 to form a third workpiece. The second workpiece 006 corresponds to the second transparent layer in the above embodiment.

[0082] Reference 13 and Figure 14 As shown, Figure 13 This is a schematic diagram showing the appearance of a shell formed by the preparation method of this application embodiment. Figure 14 This is a schematic diagram illustrating the appearance of another shell formed by the preparation method of this application embodiment. Based on Figure 13 and Figure 14 It is understood that the electronic device housing prepared based on the technical solution of this application can form the first effect and the second effect in the target area and the non-target area, respectively.

[0083] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0084] It should be noted that, in the description of this application, the accompanying drawings and embodiments are illustrative rather than restrictive. The same reference numerals throughout the embodiments identify the same structures. Additionally, for ease of understanding and description, the thicknesses of some layers, films, panels, regions, etc., may be exaggerated in the drawings. It is also understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element or there may be intermediate elements. Furthermore, "on" means positioning an element on or below another element, but does not inherently mean positioning it above another element according to the direction of gravity.

[0085] The terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the middle.

[0086] It should also be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0087] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device, the electronic device comprising: A housing, comprising a target area and a non-target area; The target area corresponds to the first part of the shell; The non-target area corresponds to the second part of the shell; The target area exhibits a first effect, and the non-target area exhibits a second effect; the first effect is different from the second effect; the first part includes a stacked first effect layer and a second effect layer, with the first effect layer located on the side of the second effect layer facing the outer side of the shell; the second part includes the second effect layer; the first effect layer is used to form the first effect, and the second effect layer is used to form the second effect.

2. The electronic device according to claim 1, wherein on the outside of the housing, the target region is higher than the first region of the non-target region, and the second region of the non-target region is a transition region between the target region and the first region.

3. The electronic device according to claim 1, wherein the second effect layer comprises a second color layer, or the second effect layer comprises a second color layer and a second transparent layer located on the second color layer facing the outside of the housing.

4. The electronic device according to any one of claims 1-3, wherein the first effect layer comprises a first color layer, or the first effect layer comprises a first color layer and a first transparent layer located on the outside of the first color layer toward the housing.

5. The electronic device according to claim 4, wherein in the target area, the first transparent layer is located on the side of the first color layer opposite to the second color layer, and the second transparent layer is located between the first color layer and the second color layer; In the non-target area, the second transparent layer is located on the side of the second color layer facing the outside of the housing.

6. The electronic device according to claim 5, wherein the thickness of the second transparent layer is not less than 0.4 mm.

7. The electronic device according to claim 1, wherein the target area includes at least one through-hole, and the electronic device further includes: At least one camera module is located on one side of the second effect layer of the housing, and the lens of the at least one camera module is exposed based on the corresponding through hole; A light-transmitting cover plate is provided inside the through hole.

8. The electronic device according to claim 7, wherein the cover plate is flush with the outer surface of the target area.

9. A method for preparing a shell, comprising: A first workpiece is prepared, wherein a first effect layer presenting a first effect and a fixing structure for fixing are provided on the inner surface of the first workpiece; The housing has a first part and a second part; The first workpiece is fixed at the target position inside the mold by the fixing structure. The second workpiece is formed by in-mold injection molding; A second effect layer is formed on the inner surface of the second workpiece, which presents a second effect, and the first effect is different from the second effect; in the first part, the first effect layer and the second effect layer are stacked and located on the side of the second effect layer facing the outside of the shell; The fixed structure is removed to form the shell.

10. The preparation method according to claim 9, wherein the region of the first effect layer corresponding to the fixing structure has a hollow structure, and the fixing structure passes through the hollow structure.

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