3D space heat conduction component
By using a combination of a bent upper and lower shell, capillary structure, and vacuum pumping technology, the problem of multi-directional heat dissipation from the heat source is solved, achieving efficient heat conduction and heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-12
- Publication Date
- 2026-04-10
AI Technical Summary
Existing technologies struggle to effectively dissipate heat from heat sources at different directions and heights. Heat pipes cannot cover the entire heat source, leading to increased conduction paths and heat pipe failure. Heat plates, limited to planar conduction, cannot adapt to complex structures.
The upper and lower shells replace the heat pipes, and the shape is formed to fit the heat source by bending. Capillary structures are set in the flow channel, and copper powder is sintered to form an integral structure. Combined with the use of vacuum pumping and heat transfer fluid, multi-directional heat dissipation is achieved.
It achieves effective heat dissipation from different planar heat sources, improves the strength of the flow channel structure, avoids the risk of capillary structure damage and leakage, and enhances the heat dissipation effect.
Smart Images
Figure CN121843067A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of heat dissipation, in particular to a 3D space heat conduction component. BACKGROUND
[0002] With the increasing market demand, the power consumption of chips is getting higher and higher, which leads to the increasing difficulty of heat dissipation year by year. The mainstream technology in the current market is to use heat pipes or heat plates for heat conduction. However, the heat pipe is limited by the structure, and the heat pipe diameter cannot cover the entire heat source, which leads to an increase in the conduction path of the uncovered heat source, resulting in the problem of heat pipe failure due to the dry tail of the heat pipe. Moreover, the forming process of the heat pipe is limited, which leads to the fact that some structures that need to make sharp turns cannot be formed, or the internal capillary structure of the heat pipe is damaged after forming, resulting in the failure of the function of the heat pipe. Although the heat plate in the prior art can increase the contact area, it is generally used for heat conduction in the X-Y two directions of the plane due to the limitation of the sealing property, and cannot dissipate heat for heat sources with different directions and different heights. SUMMARY
[0003] In order to solve the problem that it is difficult to dissipate heat for heat sources with different directions and different heights, the present application provides a 3D space heat conduction component to solve the above-mentioned problem.
[0004] The technical scheme adopted by the present application to solve its technical problem is: a 3D space heat conduction component, comprising an upper shell, a lower shell and a capillary structure, the edges of the upper shell and the lower shell are matched and fixedly connected with each other, the upper shell and the lower shell are in a sheet structure, and the upper shell and the lower shell are both bent in multiple ways to form a shape that fits the position of the heat source, a flow channel is formed between the upper shell and the lower shell, and the capillary structure is arranged in the flow channel.
[0005] As a preferred, the capillary structure is formed as an integral structure by sintering copper powder, and the shape of the capillary structure is the same as the shape of the flow channel.
[0006] As a preferred, the copper powder is 60 mesh to 150 mesh copper powder.
[0007] As a preferred, a cylindrical hollow pipe is fixedly connected at the tail connection of the upper shell and the lower shell, and the cylindrical hollow pipe is in communication with the flow channel.
[0008] As a preferred, the upper shell and the lower shell are both metal shells.
[0009] As a preferred, the flow channel between the upper shell and the lower shell is vacuumized from the position of the cylindrical hollow pipe.
[0010] As a preferred, the flow channel between the upper shell and the lower shell is also filled with a heat-conducting liquid, and the volume of the heat-conducting liquid is less than the volume in the flow channel.
[0011] As a preference, the edge portions of the upper shell and the lower shell are fixed by copper material welding, friction welding or brazing welding.
[0012] The present application has the advantages that the upper shell and the lower shell are used to replace the heat pipe, the upper shell and the lower shell can be bent to conform to the shape of the heat source, the lower shell can directly conform to the heat source on different planes, for example, the top surface and the side surface of the heat source are cooled at the same time, the flow channel is supported by the sintered capillary structure to avoid capillary damage, and the bending radius of the upper shell and the lower shell can be designed to be smaller because the upper shell and the lower shell are first stamped, and the upper shell and the lower shell conform to the heat source more closely. BRIEF DESCRIPTION OF DRAWINGS
[0013] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only exemplary, and other drawings can be obtained by the provided drawings without creative labor for those skilled in the art.
[0014] Figure 1 is a structural schematic diagram of an optimal embodiment of a 3D space heat conduction member of the present application; Figure 2 is a structural schematic diagram of a capillary structure of a 3D space heat conduction member of the present application.
[0015] Reference signs: 1, upper shell; 2, lower shell; 3, capillary structure; 4, cylindrical hollow pipe. DETAILED DESCRIPTION
[0016] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0017] The concepts involved in the present application will be described below with reference to the drawings. It should be pointed out here that the following descriptions of the concepts are only to make the content of the present application easier to understand, and do not limit the scope of protection of the present application; meanwhile, the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.
[0018] As Figure 1 and Figure 2As shown, the present invention provides an embodiment of a 3D spatial heat conduction component, including an upper shell 1, a lower shell 2, and a capillary structure 3. The edges of the upper shell 1 and the lower shell 2 are attached to each other and fixedly connected. The upper shell 1 and the lower shell 2 are sheet-like structures, and both the upper shell 1 and the lower shell 2 are bent in multiple ways to form a shape that fits the position of the heat source. The bending can be achieved by stamping or other mechanical processing methods. A flow channel is formed between the upper shell 1 and the lower shell 2, and the capillary structure 3 is provided in the flow channel.
[0019] The capillary structure 3 is formed by sintering copper powder into an integral structure. The shape of the capillary structure 3 is the same as that of the flow channel. The copper powder is 60-150 mesh, so that after the copper powder is sintered into the capillary structure 3, capillary channels for liquid to flow through can be formed inside. The capillary structure 3 in this application promotes liquid flow on the one hand, and on the other hand, it can also support the flow channel between the upper shell 1 and the lower shell 2, improve the strength of the upper shell 1 and the lower shell 2 at the flow channel, avoid deformation and blockage of the flow channel affecting the heat dissipation effect, and support the flow channel through the sintered capillary structure 3 to prevent capillary damage. At the same time, since the upper shell 1 and the lower shell 2 are stamped first, the curvature of the bending point can be designed to be smaller, which makes it more closely fit the heat source.
[0020] A cylindrical hollow tube 4 is fixed at the tail connection of the upper shell 1 and the lower shell 2. The cylindrical hollow tube 4 is connected to the flow channel. After the upper shell 1 and the lower shell 2 are fixed, the cylindrical hollow tube 4 is located at the tail joint of the upper shell 1 and the lower shell 2. By connecting the cylindrical hollow tube 4 to the air extraction device, the air between the upper shell 1 and the lower shell 2 can be extracted, so that the flow channel is in a vacuum state and the cylindrical hollow tube 4 is temporarily sealed for subsequent processing. The air extraction device is existing technology and will not be described in detail here.
[0021] Both the upper shell 1 and the lower shell 2 are metal shells, which facilitates heat conduction to the air for heat dissipation.
[0022] A vacuum is drawn between the upper shell 1 and the lower shell 2 from the position of the cylindrical hollow tube 4.
[0023] The flow channel between the upper shell 1 and the lower shell 2 is also filled with heat-conducting fluid. After the flow channel between the upper shell 1 and the lower shell 2 is evacuated, the entire structure is transferred to a vacuum operating environment. Under vacuum conditions, the temporary seal of the cylindrical hollow tube 4 is removed, and heat-conducting fluid is added from the cylindrical hollow tube 4 into the evacuated flow channel. Finally, the cylindrical hollow tube 4 is sealed, including but not limited to sealing the cylindrical hollow tube 4 by welding. It is only necessary to ensure that the cylindrical hollow tube 4 can remain sealed under high temperature conditions.
[0024] When heated, the heat transfer fluid evaporates into a gaseous state. Therefore, the volume of the heat transfer fluid needs to be smaller than the volume inside the flow channel to leave enough space to accommodate the evaporated heat transfer fluid. Since the capillary structure 3 can only adsorb liquid heat transfer fluid, it can transport the lower-temperature liquid heat transfer fluid to various parts of the flow channel for heat absorption through the capillary structure 3. Meanwhile, the gaseous heat transfer fluid can drift to the lower-temperature areas of the flow channel to release heat, and then form a liquid heat transfer fluid.
[0025] Traditional heat pipes, limited by their tubular structure, struggle to dissipate heat from large-area heat sources, resulting in incomplete heat source coverage. Furthermore, their internal structure restricts their bending at large angles. This application, however, replaces the heat pipe with an upper shell 1 and a lower shell 2. These shells can be bent to fit the heat source, and the lower shell 2 can directly adhere to heat sources on different planes, simultaneously dissipating heat from the top and sides of the heat source—a feat difficult to achieve with traditional heat pipe solutions. Additionally, the flow channel in this application incorporates correspondingly shaped capillary structures 3, enhancing its structural strength and further reducing the risk of deformation and leakage.
[0026] The edges of the upper shell 1 and the lower shell 2 are fixed by copper welding, friction welding or brazing. After welding, the upper shell 1 and the lower shell 2 form an integral structure to avoid the risk of leakage.
[0027] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of written expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this application, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.
Claims
1. A 3D spatial heat conduction component, characterized in that: It includes an upper shell (1), a lower shell (2) and a capillary structure (3). The edges of the upper shell (1) and the lower shell (2) are attached to each other and fixedly connected. The upper shell (1) and the lower shell (2) are sheet-like structures. Both the upper shell (1) and the lower shell (2) are bent in multiple ways to form a shape that fits the position of the heat source. A flow channel is formed between the upper shell (1) and the lower shell (2). A capillary structure (3) is provided in the flow channel.
2. The 3D spatial heat conduction component as described in claim 1, characterized in that: The capillary structure (3) is formed by sintering copper powder into an integral structure, and the shape of the capillary structure (3) is the same as the shape of the flow channel.
3. A 3D spatial heat conduction component as described in claim 2, characterized in that: The copper powder used is 60-150 mesh copper powder.
4. A 3D spatial heat conduction component as described in claim 1, characterized in that: A cylindrical hollow tube (4) is fixed at the tail connection of the upper shell (1) and the lower shell (2), and the cylindrical hollow tube (4) is connected to the flow channel.
5. A 3D spatial heat conduction component as described in claim 1, characterized in that: Both the upper shell (1) and the lower shell (2) are metal shells.
6. A 3D spatial heat conduction component as described in claim 5, characterized in that: A vacuum is drawn between the upper shell (1) and the lower shell (2) from the position of the cylindrical tube (4).
7. A 3D spatial heat conduction component as described in claim 4, characterized in that: The flow channel between the upper shell (1) and the lower shell (2) is also filled with heat-conducting liquid, the volume of which is smaller than the volume of the flow channel.
8. A 3D spatial heat conduction component as described in claim 4, characterized in that: The edges of the upper shell (1) and the lower shell (2) are fixed by copper welding, friction welding or brazing.