Chip mounter feeder for solar silicon wafers

Abstract

The invention relates to the technical field of photovoltaic panel production feeding, in particular to a solar silicon wafer chip mounter feeder, which comprises a material conveying mechanism, a feeding mechanism, a feeding mechanism and a feeding mechanism, and is characterized in that the material conveying mechanism comprises a first conveying assembly and a second conveying assembly arranged below one end of the first conveying assembly, and the first conveying assembly and the second conveying assembly are in a T shape on the same horizontal plane; the feeding mechanism is fixedly arranged above one end, far away from the second conveying assembly, of the first conveying assembly; the aligning mechanism is arranged at the end, close to the second conveying assembly, of the first conveying assembly and comprises a baffle, a supporting plate, a rack plate and a first electromagnetic plate. The material transferring mechanism is arranged below the alignment mechanism and comprises a rectangular protection frame, a supporting rod, a linkage strip and a first air cylinder, the material transferring mechanism is used for bearing materials from the alignment mechanism and transferring the materials to a material carrying tray on the second conveying assembly, and the feeder is high in automation degree, capable of effectively achieving automatic material transferring of silicon wafer stacks, easy to operate and high in practicability. And the labor intensity of workers can be effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic panel production material supply technology, and in particular to a chip mounter for solar silicon wafers. Background Technology

[0002] Photovoltaic panels and silicon wafers are inseparable core links in the industry chain. They are related as "foundation" and "finished product". Silicon wafers are made from high-purity silicon material and are the basic material for manufacturing photovoltaic cells. Their status is similar to that of "chips" in computers. Raw silicon wafers are made into photovoltaic cells that can convert light energy into electrical energy through precision semiconductor processes such as texturing, diffusion, and coating. Finally, multiple cells are packaged and combined with glass, backsheets, etc. to form the final photovoltaic panel that generates electricity. In the production process of photovoltaic panels, whether it is the cutting of silicon wafers or the subsequent stringing, workers need to stack the silicon wafers on a holding tray to achieve material feeding in the automated production of solar panels. For example, existing published documents CN223006748U-Silicon Wafer Stacking Box and Silicon Wafer Transfer Device and existing published documents CN222736531U-A Fixing Fixture for Photovoltaic Panel Production both disclose a feeder for silicon wafer feeding. Although the above devices can realize the transfer of silicon wafers, the above feeders still have the following shortcomings in actual use: 1. When using the existing silicon wafer feeder (container tray), the staff needs to manually place the stacked silicon wafers into the feeder. This operation method has the disadvantages of high labor intensity for the staff and easy damage to the silicon wafers during the stacking process. 2. When using the existing silicon wafer feeder (carrying tray), in order for the subsequent assembly robot to achieve effective and accurate placement and installation of silicon wafers and avoid deviations in placement and assembly, the staff needs to stack multiple silicon wafers in the feeder, and even need to make repeated adjustments during stacking, making the overall operation complicated. Therefore, it is necessary to improve the existing technology to solve the above-mentioned technical problems. Summary of the Invention

[0003] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0004] In view of the problems of complex operation, high labor intensity for workers and damage to silicon wafers caused by the existing feeders, a new feeder for solar silicon wafer placement machine is proposed.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a feeder for a solar silicon wafer placement machine, comprising: a conveying mechanism, including a first conveying component and a second conveying component disposed below one end of the first conveying component, wherein the first and second conveying components are T-shaped on the same horizontal plane; a feeding mechanism fixed above the end of the first conveying component away from the second conveying component, the feeding mechanism being used for aligning and stacking materials, wherein two symmetrical feeding mechanisms are grouped together, and multiple groups of feeding mechanisms are arranged in an array along the conveying direction of the first conveying component; an alignment mechanism disposed at the end of the first conveying component near the second conveying component, including a baffle, a support plate, a rack plate and a first electromagnetic plate, wherein the lower ends of the baffle are T-shaped on both sides. The pallet is symmetrically fixed with connecting ears extending towards the first conveying assembly. Rotating columns are symmetrically fixed at both ends of the pallet, and the rotating columns are slidably sleeved on the free ends of the connecting ears. A second spring is slidably sleeved on the rotating column, and the two ends of the second spring are respectively fixedly connected to the rotating column and the connecting ear. A toothed disc is fixed on the free end of one of the rotating columns, and the toothed disc meshes with the rack plate above. The toothed disc is driven to rotate by the lateral movement of the rack plate. A second cylinder is symmetrically fixed at both ends of the middle part of the baffle. The material transfer mechanism is located below the alignment mechanism and includes a rectangular guard frame, a support rod, a linkage bar, and a first cylinder. The material transfer mechanism is used to receive materials from the alignment mechanism and transfer them to the material tray on the second conveying assembly.

[0006] The beneficial effects of this invention are as follows: When using this chip mounter feeder, the operator places the stacked silicon wafers on the feeding mechanism, which automatically transfers the stacked silicon wafers to the first conveying component. When the stacked silicon wafers move to the alignment mechanism, the transfer mechanism automatically transfers the stacked silicon wafers to the material tray on the second conveying component. The second conveying component then moves the material tray containing the silicon wafers to the picking station of the assembly robot. In use, the operator only needs to place the stacked silicon wafers directly on each feeding mechanism, and then the silicon wafers can be automatically loaded into the material tray and automatically transferred to the picking station. This design is convenient to operate and can effectively reduce the labor intensity of the operator. In addition, in actual operation, the feeding mechanism can achieve the initial alignment of the two symmetrical sides of the stacked silicon wafers. Through the cooperation of the baffle and the tray, the other two symmetrical sides of the stacked silicon wafers can be aligned, thus achieving automatic alignment of the silicon wafers. After alignment, the silicon wafers are automatically transferred to the material carrier tray. This setting does not require manual alignment by the staff, which greatly reduces the tediousness of the staff's work.

[0007] As a preferred embodiment of the solar silicon wafer mounting machine feeder of the present invention, the first conveying assembly includes a first conveyor belt, a first outer guard, rollers and a first roller, wherein the first outer guard is disposed on the outside of the first conveyor belt, the first roller is slidably sleeved in the first conveyor belt on the side away from the second conveyor assembly, the rollers are disposed in the first conveyor belt on the side close to the second conveyor assembly, and the two rollers are aligned vertically and attached to the inner wall of the first conveyor belt; a first rotating rod is fixedly sleeved in the first roller, and both ends of the first rotating rod are connected to the first outer guard through rolling bearings, one end of the first rotating rod is embedded in the output end of the first motor, and the first motor is fixedly connected to the outer wall of the first outer guard, and both ends of the rollers are rotatably connected to the first outer guard.

[0008] As a preferred embodiment of the solar silicon wafer mounting machine feeder of the present invention, wherein: one side of the pallet is provided with an arc-shaped surface that fits against the outer wall of the first conveyor belt, and the top horizontal surface of the pallet and the top horizontal surface of the first conveyor belt are located on the same horizontal plane; the fixed section of the second cylinder is fixedly connected to the top surface of the first outer guard.

[0009] As a preferred embodiment of the solar silicon wafer mounting machine feeder of the present invention, the second conveying assembly includes a second conveyor belt, a second outer guard, and a second roller. The second outer guard is disposed outside the second conveyor belt. The inner sides of both ends of the second conveyor belt are slidably sleeved with the second roller. A second rotating rod is fixedly sleeved in the second roller. Both ends of the second rotating rod are connected to the second outer guard through rolling bearings. One end of one of the second rotating rods is embedded in the output end of a second motor. The second motor is fixedly connected to the outer wall of the second outer guard.

[0010] As a preferred embodiment of the feeder for a solar silicon wafer mounting machine according to the present invention, wherein: a linkage column is fixedly provided at one end of the rack plate away from the first conveyor belt, and the other end of the linkage column is fixedly connected to a fixing strip; a first electromagnetic plate is fixedly connected to one side of the fixing plate, and the fixing plate is fixedly connected to one side of the baffle by bolts; a third guide rod is symmetrically fixed on the fixing plates on both sides of the first electromagnetic plate, and the free end of the third guide rod is slidably sleeved on the fixing strip.

[0011] As a preferred embodiment of the feeder for a solar silicon wafer mounting machine according to the present invention, the feeding mechanism includes a rotating table, a U-shaped plate, and support bars. The closed end of the U-shaped plate is located below one side of the rotating table. Support bars are provided below the two parallel plates of the U-shaped plate. An L-shaped plate is fixed at the lower end of the outer side wall of the two parallel plates of the U-shaped plate. A second guide rod is symmetrically fixed at both ends of one side of the support bar and slidably sleeved on the L-shaped plate. A first spring is slidably sleeved on the second guide rod between the L-shaped plate and the support bar. A third electromagnetic plate for magnetic adsorption of the support bar is fixed on one side of the vertical plate of the L-shaped plate. An extension plate fixedly connected to the rotating table is provided above the two parallel plates of the U-shaped plate. A first guide rod is slidably sleeved at both ends of the extension plate. The lower ends of the two first guide rods are fixedly connected to the U-shaped plate, and the upper ends of the two first guide rods are fixed on the same linkage plate. A second electromagnetic plate is fixed on the top surface of the extension plate, and a magnet plate is fixed on the bottom surface of the linkage plate. The sides of the second electromagnetic plate and the magnet plate that are close to each other are of the same polarity.

[0012] As a preferred embodiment of the solar silicon wafer mounting machine feeder of the present invention, the two ends of the rotating table are symmetrically fixed with output shafts, the output shafts are rotatably connected to the first outer frame through rolling bearings, the free end of one of the output shafts is fitted into the output end of the third motor, and the third motor is fixedly connected to the first outer frame.

[0013] As a preferred embodiment of the solar silicon wafer mounting machine feeder of the present invention, wherein: a storage groove for fitting the closed end plate of the U-shaped plate is provided on one side of the rotating table; the top surface of the side where the two support strips are close together is provided as a first inclined surface.

[0014] As a preferred embodiment of the feeder for a solar silicon wafer placement machine according to the present invention, the transfer mechanism includes a rectangular guard frame, support rods, a linkage bar, and a first cylinder. Two sets of support rods are symmetrically arranged on the inner side of the rectangular guard frame, and the two support rods in the same set are arranged in an array along the width direction of the second conveyor belt. The two support rods in the same set are fixedly connected to the same lifting plate. A through groove with an open top for clearance fit of the support rods is opened vertically on the side wall of the rectangular guard frame. A convex plate is fixedly provided at the lower end of the first cylinder, and the fixed section of the first cylinder is fixedly connected to the outer wall of the rectangular guard frame. A limiting device with open ends for clearance fit of the convex plate is opened at the center of the top surface of the lifting plate along the conveying direction of the second conveyor belt. The groove and the lifting plates on both sides of the limiting groove are symmetrically slidably fitted with sixth guide rods, and the lower ends of the two sixth guide rods are fixed on the top surface of the same linkage bar. The top surfaces of both ends of the linkage bar are symmetrically fixed with Z-shaped plates. The free ends of the two Z-shaped plates on the side of the rectangular guard frame away from the first conveying component are spirally fitted onto the same screw rod. One end of the screw rod is embedded in the output end of the fourth motor, and the fourth motor is fixedly connected to the outer wall of the rectangular guard frame. The two Z-shaped plates can be moved towards each other or in opposite directions by rotating the screw rod. A connecting plate is fixed on the outer wall of the rectangular guard frame away from the first conveying component. A hydraulic cylinder is fixed in the middle of the bottom surface of the connecting plate, and the fixed section of the hydraulic cylinder is fixedly connected to the outer wall of the second outer guard frame.

[0015] As a preferred embodiment of the solar silicon wafer mounting machine feeder of the present invention, the free ends of two Z-shaped plates on the side of the rectangular guard frame near the first conveying component are slidably sleeved on the same fourth guide rod, and both ends of the fourth guide rod are fixedly connected to the outer wall of the rectangular guard frame; fifth guide rods are symmetrically fixed on the bottom surface of the connecting plates on both sides of the hydraulic cylinder, and the free ends of the fifth guide rods are slidably sleeved on the outer wall of the second outer guard frame; the top surface of the end of the support rod located inside the rectangular guard frame is provided with a second inclined surface. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of a chip mounter for solar silicon wafers.

[0017] Figure 2 For the present invention Figure 1 Left view of the structure.

[0018] Figure 3 This is a schematic diagram of the overall structure of the feeding mechanism in this invention.

[0019] Figure 4 This is a cross-sectional view of the feeding mechanism in the present invention along the axis of the first guide rod.

[0020] Figure 5 This is a schematic diagram of the overall structure of the alignment mechanism in this invention.

[0021] Figure 6 This is a schematic diagram showing the cooperation of the support plate, rack plate and first electromagnetic plate in this invention.

[0022] Figure 7 This is a schematic diagram of the overall structure of the material transfer mechanism in this invention.

[0023] Figure 8 This is an exploded view of the material transfer mechanism in this invention.

[0024] Figure 9 For the present invention Figure 1 A vertical sectional view of the structure in the conveying direction of the first conveying component.

[0025] Figure 10 For the present invention Figure 1 A vertical sectional view of the structure in the conveying direction of the second conveying component. Detailed Implementation

[0026] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0029] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth. Example

[0030] Reference Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 7 , Figure 9 and Figure 10 This is the first embodiment of the present invention. This embodiment provides a chip mounter for solar silicon wafers. When the chip mounter is in use, the feeding mechanism 100 is used for transferring silicon wafers between the picking end and the feeding end, the loading mechanism 200 is used for the worker to place the silicon wafers, the alignment mechanism 300 is used for further automatic alignment of the silicon wafers, and the transfer mechanism 400 is used for transferring the silicon wafers.

[0031] Specifically, it includes a conveying mechanism 100, comprising a first conveying component 101 and a second conveying component 102 disposed below one end of the first conveying component 101, wherein the first conveying component 101 and the second conveying component 102 are T-shaped on the same horizontal plane; and a feeding mechanism 200 fixedly disposed above the end of the first conveying component 101 away from the second conveying component 102, the feeding mechanism 200 being used for aligning and stacking materials, with two symmetrical feeding mechanisms 200 forming a group, and multiple groups of feeding mechanisms 200 arranged in an array along the conveying direction of the first conveying component 101. It should be noted that... Two aligned feeding assemblies 200 are used for automatic collection of silicon wafers after cutting; an alignment mechanism 300 is provided at one end of the first conveying assembly 101 near the second conveying assembly 102, including a baffle 301, a tray 302, a rack plate 303 and a first electromagnetic plate 304; and a transfer mechanism 400 is provided below the alignment mechanism 300, including a rectangular guard frame 401, a support rod 402, a linkage bar 403 and a first cylinder 404. The transfer mechanism 400 is used to receive materials from the alignment mechanism 300 and transfer them to the material tray 103 on the second conveying assembly 102. In practical use, this chip mounter feeder can be used for automatic feeding before cutting, as well as for automatic feeding between string soldering operations after cutting.

[0032] See details Figure 1 , Figure 2 , Figure 9 and Figure 10As shown, the first conveying assembly 101 includes a first conveyor belt 101a, a first outer protective frame 101b, rollers 101c, and a first roller 101d. The first outer protective frame 101b is disposed on the outside of the first conveyor belt 101a. The first roller 101d is slidably sleeved in the first conveyor belt 101a on the side away from the second conveying assembly 102. The rollers 101c are disposed in the first conveyor belt 101a on the side close to the second conveying assembly 102, and the two rollers 101c are vertically aligned and attached to the inner wall of the first conveyor belt 101a. This design allows the first conveyor belt 101a on the side close to the alignment mechanism 300 to be vertically arranged, which facilitates better alignment of the first conveyor belt 101a with the alignment mechanism. Material transfer is performed at 300. A first rotating rod 101d-2 is fixedly sleeved in the first roller 101d, and both ends of the first rotating rod 101d-2 are connected to the first outer protective frame 101b through rolling bearings. One end of the first rotating rod 101d-2 is embedded in the output end of the first motor 101d-1, and the first motor 101d-1 is fixedly connected to the outer wall of the first outer protective frame 101b. Both ends of the roller 101c are rotatably connected to the first outer protective frame 101b. In use, the operation of the first motor 101d-1 enables the first roller 101d to drive the first conveyor belt 101a to move, thereby transporting the stacked silicon wafers to the alignment mechanism 300. The second conveying assembly 102 includes a second conveyor belt 102a, a second outer protective frame 102b, and a second roller 102c. The second outer protective frame 102b is disposed outside the second conveyor belt 102a. The inner sides of both ends of the second conveyor belt 102a are slidably sleeved with the second roller 102c. A second rotating rod 102c-1 is fixedly sleeved in the second roller 102c. Both ends of the second rotating rod 102c-1 are connected to the second outer protective frame 102b through rolling bearings. One end of one of the second rotating rods 102c-1 is embedded in the output end of the second motor 102c-2. The second motor 102c-2 is fixedly connected to the outer wall of the second outer protective frame 102b. In use, the operation of the second motor 102c-2 enables the second roller 102c to drive the second conveyor belt 102a to move, thereby transferring the silicon wafers stacked on the material tray 103 to the robot picking station. The lower ends of the first outer protective frame 101b and the second outer protective frame 102b are both fixedly connected to the base plate 104.

[0033] See details Figure 5 , Figure 6 and Figure 9As shown, the lower ends of the baffle 301 are symmetrically fixed with connecting ears 301a extending towards the first conveying assembly 101. The two ends of the pallet 302 are symmetrically fixed with rotating columns 302b, which are slidably sleeved on the free ends of the connecting ears 301a, allowing the pallet 302 to rotate about the rotating columns 302b. A second spring 302b-2 is slidably sleeved on the rotating column 302b, and both ends of the second spring 302b-2 are respectively fixedly connected to the rotating column 301a. 2b and connecting ear 301a to realize the automatic reset of rotating column 302b. A toothed disc 302b-1 is fixed on the free end of one of the rotating columns 302b, and the toothed disc 302b-1 meshes with the rack plate 303 above. The toothed disc 302b-1 is driven to rotate by the lateral movement of the rack plate 303. The two ends of the middle part of the baffle 301 are symmetrically fixed with a second cylinder 301b. The fixed section of the second cylinder 301b is fixedly connected to the top surface of the first outer guard 101b. When in use, as the first conveyor belt 101a is conveyed, one side of the stacked silicon wafers will be stacked on the pallet 302, while the other side of the stacked silicon wafers will abut against the side of the baffle 301. As the first conveyor belt 101a is conveyed and the second cylinder 301b is extended, the stacked silicon wafers can be transferred out from the first conveyor belt 101a.

[0034] Furthermore, one side of the pallet 302 is provided with an arc-shaped surface 302a that fits against the outer wall of the first conveyor belt 101a, and the top horizontal surface of the pallet 302 is on the same horizontal plane as the top horizontal surface of the first conveyor belt 101a, so that the stacked silicon wafers can be better transferred from the first conveyor belt 101a to the pallet 302.

[0035] Additionally, it should be noted that this device also includes a controller (not shown in the attached drawings) for controlling various electrical components, and the controller is located in a position convenient for operators to use. Example

[0036] Reference Figure 1 , Figure 5 , Figure 6 and Figure 9 This is the second embodiment of the present invention. This embodiment is based on the previous embodiment. The difference is that, in order to better implement the present invention, the structure for controlling the lateral movement of the rack plate 303 is described in detail, hence this embodiment is proposed.

[0037] Specifically, a linkage column 303a is fixedly provided at one end of the rack plate 303 away from the first conveyor belt 101a, and the other end of the linkage column 303a is fixedly connected to the fixing bar 303b. The first electromagnetic plate 304 is fixedly connected to one side of the fixing plate 304a, and the fixing plate 304a is fixedly connected to one side of the baffle 301 by bolts. The fixing plates 304a on both sides of the first electromagnetic plate 304 are symmetrically fixed with third guide rods 304b, and the free end of the third guide rod 304b is slidably sleeved on the fixing bar 303b to realize the limiting guidance when the fixing bar 303b is moved. In use, the above-mentioned configuration generates magnetism through the energization of the first electromagnetic plate 304 to magnetically attract the fixing strip 303b, thereby enabling the rack plate 303 to move along the axis of the linkage column 303a. Due to the meshing between the rack plate 303 and the gear disk 302b-1, the gear disk 302b-1 rotates as the rack plate 303 moves laterally. Ultimately, the support plate 302 rotates around the rotating column 302b as an axis, and the support plate 302 loses its support for the silicon wafer. When the first electromagnetic plate 304 is de-energized, the second spring 302b-2 can reset the support plate 302. Example

[0038] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 9 This is the third embodiment of the present invention. This embodiment is based on the previous embodiment. The difference is that, in order to better implement the present invention, the feeding mechanism 200 for feeding silicon wafers in the present invention is described in detail.

[0039] Specifically, the feeding mechanism 200 includes a rotating table 201, a U-shaped plate 202, and a support bar 203. The closed end of the U-shaped plate 202 is located below one side of the rotating table 201. Support bars 203 are provided below the two parallel plates of the U-shaped plate 202. An L-shaped plate 202b is fixed at the lower end of the outer side wall of the two parallel plates of the U-shaped plate 202. A second guide rod 203b is symmetrically fixed at both ends of one side of the support bar 203 and is slidably sleeved on the L-shaped plate 202b to limit and guide the movement of the support bar 203. A first spring 203b-1 is slidably sleeved on the second guide rod 203b between the L-shaped plate 202b and the support bar 203. The first spring 203b-1 can realize the automatic reset of the second guide rod 203b. A third electromagnetic plate 202b-1 for magnetic adsorption of the support bar 203 is fixed on one side of the vertical plate of the L-shaped plate 202b. Above the two parallel plates of the U-shaped plate 202, an extension plate 201b is provided and fixedly connected to the rotating table 201. Both ends of the extension plate 201b are slidably sleeved with first guide rods 202a to limit and guide the movement of the U-shaped plate 202. The lower ends of the two first guide rods 202a are fixedly connected to the U-shaped plate 202, and the upper ends of the two first guide rods 202a are fixedly mounted on the same linkage plate 202a-1. A second electromagnetic plate 201b-1 is fixedly mounted on the top surface of the extension plate 201b, and a magnet plate 202a-2 is fixedly mounted on the bottom surface of the linkage plate 202a-1. The sides of the second electromagnetic plate 201b-1 and the magnet plate 202a-2 that are close to each other are of the same polarity. The two ends of the rotating table 201 are symmetrically fixed with output shafts 201c. The output shafts 201c are rotatably connected to the first outer frame 101b through rolling bearings. The free end of one of the output shafts 201c is fitted into the output end of the third motor 201c-1, and the third motor 201c-1 is fixedly connected to the first outer frame 101b. In use, the U-shaped plate 202 without stacked silicon wafers is tilted upwards. Workers can then insert the stacked silicon wafers inside the U-shaped plate 202. The U-shaped plate 202 limits the sides of the stacked silicon wafers, and the support strip 203 limits the bottom of the wafer stack. Then, the third motor 201c-1 drives the rotating table 201 to rotate, allowing the open end of the U-shaped plate 202 to move downwards. The wafer stack is then parallel to the first conveyor belt 101a. Then, the third electromagnetic plate 202b-1 and the second electromagnetic plate 201b-1 are energized simultaneously. When the third electromagnetic plate 202b-1 is energized, it magnetically attracts the support strip 203, and the support strip 203 loses its restraint on the silicon wafer stack. When the second electromagnetic plate 201b-1 is energized, it repels the magnetic plate 202a-2, so that the U-shaped plate 202 moves upward and loses its restraint on the side wall of the silicon wafer stack. In this way, the silicon wafer stack on the feeding mechanism 200 is transferred to the first conveyor belt 101a.

[0040] Furthermore, one side of the rotating table 201 is provided with a storage groove 201a for the closed end plate of the U-shaped plate 202 to fit, so that the U-shaped plate 202 can move up and down automatically while providing good side protection for the silicon wafer stack; the top surface of the side of the two support strips 203 that are close to each other is provided with a first inclined surface 203a to facilitate the unloading of the silicon wafer stack from the support strips 203. Example

[0041] Reference Figure 1 , Figure 2 , Figure 7 , Figure 8 and Figure 9This is the fourth embodiment of the present invention. This embodiment is based on any of the above embodiments. The difference is that, in order to better implement the present invention, the transfer mechanism 400 for silicon wafer transfer in the present invention is described in detail.

[0042] Specifically, the material transfer mechanism 400 includes a rectangular guard frame 401, support rods 402, linkage bars 403, and a first cylinder 404. Two sets of support rods 402 are symmetrically arranged on the inner side of the rectangular guard frame 401, and the two support rods 402 in the same set are arranged in an array along the width direction of the second conveyor belt 102a. The two support rods 402 in the same set are fixedly connected to the same lifting plate 402a. A through groove 401b with an open top and used for clearance fit of the support rods 402 is opened vertically on the side wall of the rectangular guard frame 401. A convex plate 404a is fixedly provided at the lower end of the first cylinder 404, and the fixed section of the first cylinder 404 is fixedly connected to the outer side wall of the rectangular guard frame 401. A limiting groove 402a-1 with open ends and used for clearance fit of the convex plate 404a is opened in the middle of the top surface of the lifting plate 402a along the conveying direction of the second conveyor belt 102a. Sixth guide rods 403c are symmetrically slidably sleeved on the lifting plates 402a on both sides of the limiting groove 402a-1, thereby limiting and guiding the movement of the lifting plates 402a. The lower ends of the two sixth guide rods 403c are fixed to the top surface of the same linkage bar 403. Z-shaped plates 403a are symmetrically fixed to the top surfaces of both ends of the linkage bar 403. The free ends of the two Z-shaped plates 403a on the side of the rectangular guard frame 401 away from the first conveying component 101 are spirally sleeved on the same screw rod 403b. One end of the screw rod 403b is embedded in the output end of the fourth motor 403b-1, and the fourth motor 403b-1 is fixedly connected to the outer wall of the rectangular guard frame 401. The rotation of the screw rod 403b enables the two Z-shaped plates 403a to move towards or away from each other. The rectangular guard frame 401 is close to the first conveying component 101. Two Z-shaped plates 403a on one side are slidably sleeved on the same fourth guide rod 401c, and both ends of the fourth guide rod 401c are fixedly connected to the outer wall of the rectangular guard frame 401 to limit and guide the movement of the Z-shaped plates 403a; a connecting plate 401a is fixedly provided on the outer wall of the rectangular guard frame 401 away from the first conveying assembly 101, and a hydraulic cylinder 401a-1 is fixedly provided in the middle of the bottom surface of the connecting plate 401a, and the fixed section of the hydraulic cylinder 401a-1 is fixedly connected to the outer wall of the second outer guard frame 102b; a fifth guide rod 401a-2 is symmetrically fixed on the bottom surface of the connecting plate 401a on both sides of the hydraulic cylinder 401a-1, and the free end of the fifth guide rod 401a-2 is slidably sleeved on the outer wall of the second outer guard frame 102b to limit and guide the movement of the hydraulic cylinder 401a-1; In use, the above-mentioned configuration involves the retraction of the first cylinder 404, which causes the convex plate 404a to move the lifting plate 402a upward. This allows the support rod 402 to move upward from the inside of the rectangular guard frame 401. The support rod 402 then contacts and lifts the stacked silicon wafers. After the support plate 302 loses its support for the silicon wafers, the first cylinder 404 extends to move the lifting plate 402a downward, storing the silicon wafers inside the rectangular guard frame 401. Then, the hydraulic cylinder 401a-1 moves upward, causing the rectangular guard frame 401 to move downward and engage with the load. On the outside of the tray 103, under the operation of the fourth motor 403b-1, the two Z-shaped plates 403a drive the lifting plate 402a to move in opposite directions through the linkage bar 403, so that the support rod 402 is pulled out from the bottom of the silicon wafer stack, and the silicon wafer stack is neatly stacked in the material tray 103, which facilitates the subsequent transfer of material tray 103 by the second conveyor belt 102a; in actual use, a positioning sensor component should be installed on the second conveyor component 102 so that the material tray 103 can be accurately moved to the bottom of the rectangular guard frame 401.

[0043] Furthermore, the top surface of the end of the support rod 402 located inside the rectangular guard frame 401 is provided with a second inclined surface 402b to facilitate the unloading of the silicon wafer stack from the support rod 402.

[0044] Additionally, it should be noted that components not described in detail in this article are existing technologies.

[0045] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., variations in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the invention is not limited to the particular embodiments but extends to a variety of modifications that still fall within the scope of the appended claims.

[0046] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the currently considered best mode for carrying out the invention, or those features that are not relevant to implementing the invention) may be omitted.

[0047] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0048] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A chip mounter feeder for solar silicon wafers, characterized in that: include, The material conveying mechanism (100) includes a first conveying component (101) and a second conveying component (102) disposed below one end of the first conveying component (101), and the first conveying component (101) and the second conveying component (102) are T-shaped on the same horizontal plane; A feeding mechanism (200) is fixed above the end of the first conveying assembly (101) away from the second conveying assembly (102). The feeding mechanism (200) is used for aligning and stacking materials. Two symmetrical feeding mechanisms (200) are arranged as a group, and multiple groups of feeding mechanisms (200) are arranged in an array along the conveying direction of the first conveying assembly (101). An alignment mechanism (300) disposed at one end of the first conveying assembly (101) near the second conveying assembly (102) includes a baffle (301), a support plate (302), a rack plate (303), and a first electromagnetic plate (304). The lower ends of the baffle (301) are symmetrically fixed with connecting ears (301a) extending towards the first conveying assembly (101). The support plate (302) has symmetrically fixed rotating posts (302b) at both ends, and the rotating posts (302b) are slidably sleeved on the free ends of the connecting ears (301a). b) A second spring (302b-2) is slidably sleeved on the upper part, and the two ends of the second spring (302b-2) are respectively fixedly connected to the rotating column (302b) and the connecting ear (301a). A gear plate (302b-1) is fixedly mounted on the free end of one of the rotating columns (302b), and the gear plate (302b-1) meshes with the rack plate (303) above. The gear plate (302b-1) is driven to rotate by the lateral movement of the rack plate (303). The baffle (301) has two symmetrically fixed second cylinders (301b) at its two ends in the middle part; and, The transfer mechanism (400) located below the alignment mechanism (300) includes a rectangular guard frame (401), a support rod (402), a linkage bar (403) and a first cylinder (404). The transfer mechanism (400) is used to receive materials from the alignment mechanism (300) and transfer them to the material tray (103) on the second conveying assembly (102).

2. The chip mounter feeder for solar silicon wafers as described in claim 1, characterized in that: The first conveying assembly (101) includes a first conveyor belt (101a), a first outer guard (101b), rollers (101c) and a first roller (101d), wherein the first outer guard (101b) is disposed on the outside of the first conveyor belt (101a), the first roller (101d) is slidably sleeved in the first conveyor belt (101a) on the side away from the second conveying assembly (102), and the rollers (101c) are disposed in the first conveyor belt (101a) on the side close to the second conveying assembly (102), and the two rollers (101c) are aligned vertically and attached to the inner wall of the first conveyor belt (101a); A first rotating rod (101d-2) is fixedly sleeved in the first roller (101d), and both ends of the first rotating rod (101d-2) are connected to the first outer guard (101b) through rolling bearings. One end of the first rotating rod (101d-2) is embedded in the output end of the first motor (101d-1), and the first motor (101d-1) is fixedly connected to the outer wall of the first outer guard (101b). Both ends of the roller (101c) are rotatably connected to the first outer guard (101b).

3. The chip mounter feeder for solar silicon wafers as described in claim 2, characterized in that: One side of the pallet (302) is provided with an arc-shaped surface (302a) that fits against the outer wall of the first conveyor belt (101a), and the top horizontal surface of the pallet (302) and the top horizontal surface of the first conveyor belt (101a) are located on the same horizontal plane. The fixed section of the second cylinder (301b) is fixedly connected to the top surface of the first outer guard (101b).

4. The chip mounter feeder for solar silicon wafers as described in claim 2, characterized in that: The second conveying assembly (102) includes a second conveyor belt (102a), a second outer protective frame (102b), and a second roller (102c). The second outer protective frame (102b) is disposed outside the second conveyor belt (102a). The inner sides of both ends of the second conveyor belt (102a) are slidably sleeved with the second roller (102c). A second rotating rod (102c-1) is fixedly sleeved in the second roller (102c). Both ends of the second rotating rod (102c-1) are connected to the second outer protective frame (102b) through rolling bearings. One end of one of the second rotating rods (102c-1) is embedded in the output end of the second motor (102c-2). The second motor (102c-2) is fixedly connected to the outer wall of the second outer protective frame (102b).

5. A chip mounter feeder for solar silicon wafers as described in claim 4, characterized in that: The rack plate (303) is fixedly provided with a linkage column (303a) at one end away from the first conveyor belt (101a), and the other end of the linkage column (303a) is fixedly connected to the fixing bar (303b). The first electromagnetic plate (304) is fixedly connected to one side of the fixing plate (304a), and the fixing plate (304a) is fixedly connected to one side of the baffle (301) by bolts. The fixing plates (304a) on both sides of the first electromagnetic plate (304) are symmetrically provided with third guide rods (304b), and the free end of the third guide rod (304b) is slidably sleeved on the fixing bar (303b).

6. The chip mounter feeder for solar silicon wafers as described in claim 5, characterized in that: The feeding mechanism (200) includes a rotating table (201), a U-shaped plate (202), and a support bar (203). The closed end of the U-shaped plate (202) is located below one side of the rotating table (201). Support bars (203) are provided below the two parallel plates of the U-shaped plate (202). An L-shaped plate (202b) is fixed at the lower end of the outer side wall of the two parallel plates of the U-shaped plate (202). A second guide rod (203b) is symmetrically fixed at both ends of one side of the support bar (203) and slidably sleeved on the L-shaped plate (202b). A first spring (203b-1) is slidably sleeved on the second guide rod (203b) between the L-shaped plate (202b) and the support bar (203). A third electromagnetic plate (202b-1) for magnetically adsorbing the support bar (203) is fixed on one side of the vertical plate of the L-shaped plate (202b). Above the two parallel plates of the U-shaped plate (202), an extension plate (201b) is provided and fixedly connected to the rotating table (201). Both ends of the extension plate (201b) are slidably sleeved with first guide rods (202a). The lower ends of the two first guide rods (202a) are fixedly connected to the U-shaped plate (202), and the upper ends of the two first guide rods (202a) are fixed on the same linkage plate (202a-1). A second electromagnetic plate (201b-1) is fixed on the top surface of the extension plate (201b), and a magnet plate (202a-2) is fixed on the bottom surface of the linkage plate (202a-1). The sides of the second electromagnetic plate (201b-1) and the magnet plate (202a-2) that are close to each other are of the same polarity.

7. A chip mounter feeder for solar silicon wafers as described in claim 6, characterized in that: The rotating platform (201) has output shafts (201c) fixedly mounted symmetrically at both ends. The output shafts (201c) are rotatably connected to the first outer frame (101b) through rolling bearings. The free end of one of the output shafts (201c) is fitted into the output end of the third motor (201c-1), and the third motor (201c-1) is fixedly connected to the first outer frame (101b).

8. A chip mounter feeder for solar silicon wafers as described in claim 7, characterized in that: The rotating platform (201) has a storage groove (201a) on one side for fitting the closed end plate of the U-shaped plate (202). The top surface of the two support strips (203) that are close to each other is provided with a first inclined surface (203a).

9. A chip mounter feeder for solar silicon wafers as described in claim 5 or 8, characterized in that: The material transfer mechanism (400) includes a rectangular guard frame (401), support rods (402), linkage bar (403), and a first cylinder (404). Two sets of support rods (402) are symmetrically arranged on the inner side of the rectangular guard frame (401), and the two support rods (402) in the same set are arranged in an array along the width direction of the second conveyor belt (102a). The two support rods (402) in the same set are fixedly connected to the same lifting plate (402a). A through groove (401b) with an open top and used for clearance fit of the support rods (402) is opened vertically on the side wall of the rectangular guard frame (401). The lower end of the first cylinder (404) is fixedly provided with a convex plate (404a), and the fixed section of the first cylinder (404) is fixedly connected to the outer wall of the rectangular guard frame (401). The top surface of the lifting plate (402a) is provided with a limiting groove (402a-1) with open ends for clearance fit with the convex plate (404a) along the conveying direction of the second conveyor belt (102a). The lifting plates (402a) on both sides of the limiting groove (402a-1) are symmetrically slidably fitted with sixth guide rods (403c), and the lower ends of the two sixth guide rods (403c) are fixedly provided on the top surface of the same linkage bar (403). The top surfaces of the two ends of the linkage bar (403) are symmetrically fixed with Z-shaped plates (403a). The rectangular guard frame (401) is away from the first conveyor belt. Two Z-shaped plates (403a) on one side of component (101) are spirally sleeved on the same screw rod (403b). One end of the screw rod (403b) is fitted into the output end of the fourth motor (403b-1), and the fourth motor (403b-1) is fixedly connected to the outer wall of the rectangular guard frame (401). The two Z-shaped plates (403a) can move towards each other or in opposite directions by rotating the screw rod (403b). A connecting plate (401a) is fixedly provided on the outer wall of the rectangular guard frame (401) away from the first conveying component (101). A hydraulic cylinder (401a-1) is fixedly provided in the middle of the bottom surface of the connecting plate (401a), and the fixed section of the hydraulic cylinder (401a-1) is fixedly connected to the outer wall of the second outer guard frame (102b).

10. A chip mounter feeder for solar silicon wafers as described in claim 9, characterized in that: The free ends of the two Z-shaped plates (403a) on the side of the rectangular guard frame (401) near the first conveying assembly (101) are slidably sleeved on the same fourth guide rod (401c), and both ends of the fourth guide rod (401c) are fixedly connected to the outer wall of the rectangular guard frame (401). The fifth guide rod (401a-2) is symmetrically fixed on the bottom surface of the connecting plate (401a) on both sides of the hydraulic cylinder (401a-1), and the free end of the fifth guide rod (401a-2) is slidably sleeved on the outer wall of the second outer guard (102b). The top surface of the end of the support rod (402) located inside the rectangular guard frame (401) is provided with a second inclined surface (402b).

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