Chip ejector pin device and semiconductor processing equipment

Abstract

The invention relates to a chip ejector pin device and semiconductor processing equipment, and relates to the technical field of semiconductors. The chip ejector pin device comprises an assembling assembly, an ejector pin assembly, a pin cap assembly, a limiting assembly and a driving assembly, the ejector pin assembly comprises a plurality of ejector pins and a mounting base, the ejector pins are mounted above the mounting base in the first direction, the pushing ends of the ejector pins are located on the same horizontal plane, and the mounting base is in sliding connection with the base; the pin cap assembly comprises a substrate and a cap body, the substrate is in sliding connection with the base, the cap body is installed on the substrate, the cap body is provided with an adsorption groove and a plurality of via holes, the adsorption groove is used for vacuum adsorption of a film placed on a chip, and each ejector pin is arranged in the corresponding via hole in a penetrating mode; the limiting assembly comprises a limiting block and a follower, the limiting block is connected with the base plate, the follower is fixed to the limiting block, and at least part of the follower is located on the side, close to the mounting base, of the limiting block; the driving assembly can drive the ejector pin assembly to move in the first direction. According to the invention, the separation yield of the chip can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a chip ejector device and semiconductor processing equipment. Background Technology

[0002] In high-precision semiconductor packaging equipment, chips are typically carried on thin films for processing on semiconductor assembly equipment. Separating the chip from the film is a crucial step, usually accomplished using a pick-and-place mechanism. During chip pickup, a vacuum is first used to adsorb the film to prevent movement. Then, a pick-and-place device pushes the chip from below the film, creating a gap between the chip and the film, allowing the adsorption head to quickly peel the chip off and move it.

[0003] However, when peeling and demolding slender chips, uneven force can easily occur during chip ejection, leading to cracks or damage. Summary of the Invention

[0004] Therefore, it is necessary to provide a chip ejector device and semiconductor processing equipment to address the problem of cracks or damage occurring during chip ejection.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] In a first aspect, embodiments of this application provide a chip ejector device, comprising:

[0007] Assembly components, including the base;

[0008] The ejector assembly includes multiple ejector pins and a mounting base. Along a first direction, each ejector pin is mounted above the mounting base, and the pushing ends of each ejector pin are located on the same horizontal plane. The mounting base is slidably connected to the base.

[0009] A pin cap assembly includes a substrate and a cap body. The substrate is slidably connected to the base, and the cap body is mounted on the substrate. The cap body has an adsorption groove and multiple through holes. The adsorption groove is used for vacuum adsorption of a thin film placed on a chip, and each pin is respectively inserted through a corresponding through hole.

[0010] A limiting component includes a limiting block and a follower, wherein the limiting block is connected to the substrate, the follower is fixed to the limiting block, and the follower is at least partially located on the side of the limiting block near the mounting base.

[0011] The driving component is capable of driving the ejector pin assembly to move along the first direction.

[0012] In one embodiment of the first aspect, the limiting component further includes a fixing block and an elastic member, the fixing block being fixed to the base, the limiting block being disposed above the fixing block along the first direction, and the two ends of the elastic member being connected to the limiting block and the fixing block respectively.

[0013] In one embodiment of the first aspect, the limiting component further includes an adjusting bolt, the fixing block has a threaded hole, the adjusting bolt passes through the fixing block and is threadedly connected to the bottom of the substrate, and the end of the adjusting bolt connected to the substrate is provided with an adjusting nut.

[0014] In one embodiment of the first aspect, the assembly further includes a leveling screw, an expansion sleeve, and an expansion shaft. The base has a first mounting hole and a second mounting hole. The leveling screw is installed in the first mounting hole, and the expansion sleeve is installed in the second mounting hole.

[0015] In one embodiment of the first aspect, the assembly further includes a mounting bolt and a disc spring, the base has a third mounting hole, the mounting bolt is threaded into the third mounting hole, the disc spring is sleeved on the periphery of the mounting bolt, the mounting bolt is locked to the third mounting hole, and the disc spring is compressed to generate pressure on the base.

[0016] In one embodiment of the first aspect, the ejector assembly further includes a connecting rod, a mounting block, and a clamping block. The connecting rod has a first slot and a second slot at its end away from the mounting base, and the first slot and the second slot intersect. One end of the mounting block has a plug-in portion, which is installed in the first slot and fixed along the second slot by a pin. Each ejector pin is sequentially laid on the end of the mounting block away from the connecting rod. The clamping block is fixed to the mounting block, and one side of the clamping block has a toothed surface that clamps each ejector pin onto the mounting block.

[0017] In one embodiment of the first aspect, the ejector assembly further includes a sleeve and a knob, one end of the sleeve being connected to the mounting base, one end of the connecting rod passing through the end of the sleeve away from the mounting base, and the knob being disposed at the connection between the sleeve and the connecting rod to lock the connecting rod.

[0018] In one embodiment of the first aspect, the needle cap assembly further includes a vacuum seat and a fixing seat, the vacuum seat being connected to the cap body, the fixing seat being connected to the end of the vacuum seat away from the cap body, and the fixing seat being fixed to the substrate.

[0019] In one embodiment of the first aspect, the drive assembly includes a motor, a lead screw, a connecting block, a first slider, a second slider, and a third slider. The motor is drivenly connected to the lead screw, the lead screw is threadedly engaged with the connecting block, the first slider, the second slider, and the third slider are distributed sequentially from top to bottom along the first direction, and the connecting block is connected to the second slider.

[0020] The base has a guide rail on one side, which is parallel to the first direction. The first slider, the second slider, and the third slider are slidably engaged with the guide rail. The base plate is connected to the first slider and the third slider, and the mounting base is connected to the second slider.

[0021] Secondly, embodiments of this application also provide a semiconductor processing apparatus, including the chip ejector device described in any of the above embodiments.

[0022] Compared to related technologies, the beneficial effects of this application are as follows: This application provides a chip ejector device and semiconductor processing equipment. The chip ejector device includes an assembly assembly, an ejector assembly, a pin cap assembly, a limiting assembly, and a driving assembly, with the ejector assembly and pin cap assembly slidably connected to a base. The pin cap assembly includes a cap body on which a chip placed on a thin film is held. When the driving assembly drives the ejector assembly to move upward, each ejector pin extends out of the cap body and pushes the chip through the thin film, creating a gap between the chip and the thin film. Furthermore, the pushing ends of each ejector pin are always located on the same horizontal plane to ensure uniform force on all parts of the chip, reducing chip damage caused by uneven force. After a gap is created between the chip and the thin film, an external suction element picks up the chip and separates it from the thin film, achieving complete separation of the chip and the thin film, ensuring stable force on the chip during the separation process, and improving the chip separation yield. When changing chips, the drive component drives the ejector pin assembly to move downwards. The ejector pin retracts into the cap body. As the ejector pin assembly continues to descend, the mounting base and the follower of the limit component come into contact. Then, the limit block drives the entire pin cap assembly to move down to the loading station, avoiding interference between the pin cap assembly and the adsorption component when the chip is being loaded. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the assembly structure of the chip ejector device in some embodiments of this application. Figure 1 ;

[0025] Figure 2 This is a schematic diagram showing the disassembled structure of the chip ejector device in some embodiments of this application;

[0026] Figure 3 This is a schematic diagram of the cap structure in some embodiments of this application;

[0027] Figure 4 This is a schematic diagram of the assembly structure of the chip ejector device in some embodiments of this application. Figure 2 ;

[0028] Figure 5 These are schematic diagrams of the assembly components in some embodiments of this application;

[0029] Figure 6 This is a schematic diagram showing the force direction of the expansion shaft in some embodiments of this application;

[0030] Figure 7 This is a schematic diagram of the structure of the ejector pin assembly in some embodiments of this application;

[0031] Figure 8 for Figure 7 The diagram shows an enlarged view of part A.

[0032] Figure 9 This is a schematic diagram of the structure of the needle cap assembly in some embodiments of this application;

[0033] Figure 10 This is a schematic diagram of the structure of the vacuum channel in some embodiments of this application.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100. Chip ejector pin assembly; 110. Assembly component; 111. Base; 1111. First mounting hole; 1112. Second mounting hole; 1113. Third mounting hole; 1114. Motor slot; 112. Leveling screw; 113. Expansion sleeve; 114. Expansion shaft; 115. Mounting bolt; 116. Washer; 117. Disc spring; 118. Guide rail; 120. Ejector pin assembly; 121. Ejector pin; 122. Clamping block; 1221. Toothed surface; 123. Mounting block; 1231. Insertion part; 1232. Stepped surface; 124. Connecting rod; 1241. First slot; 1242. Second slot; 125. Sleeve rod; 126. Knob; 127. 128. Mounting base; 139. Limiting bolt; 130. Needle cap assembly; 131. Cap body; 1311. Through hole; 1312. Adsorption groove; 1313. First vacuum channel; 132. Vacuum seat; 1321. Second vacuum channel; 133. Fixing base; 134. Base plate; 135. Gas connector; 136. Sealing ring; 140. Limiting assembly; 141. Limiting block; 142. Follower; 143. Fixing block; 144. Elastic element; 145. Adjusting bolt; 150. Drive assembly; 151. Motor; 152. Origin sensor; 153. Lead screw; 154. Connecting block; 155. First slider; 156. Second slider; 157. Third slider;

[0036] z, first direction; x, second direction; y, third direction. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, where the term "and / or" appears, "and / or" merely describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. Where the terms "first" and "second" appear, these terms are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" can explicitly or implicitly include at least one of those features. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0043] See Figure 1As shown, this application embodiment provides a chip ejector device 100, which can be used for ejecting elongated chips. The chip ejector device 100 includes an assembly assembly 110, an ejector assembly 120, a pin cap assembly 130, a limiting assembly 140, and a driving assembly 150. The assembly assembly 110 is used to fix the chip ejector device 100 to a slide rail or machine base, thereby installing the chip ejector device 100 at the work station. The ejector assembly 120, pin cap assembly 130, limiting assembly 140, and driving assembly 150 are all mounted on the assembly assembly 110, and the driving assembly 150 drives the ejector assembly 120 and pin cap assembly 130 to move up and down, thereby achieving the separation of the chip from the thin film.

[0044] Continue reading Figure 2 and Figure 3 As shown, specifically, the assembly assembly 110 includes a base 111 to mount the chip ejector pin assembly 100 to the work station, and the level of the base 111 is adjusted to ensure that all ejector pins 121 are on the same horizontal plane. The ejector pin assembly 120 includes multiple ejector pins 121 and a mounting base 127. Along the first direction z, each ejector pin 121 is mounted above the mounting base 127, and the pushing ends of each ejector pin 121 are all located on the same horizontal plane. The mounting base 127 is slidably connected to the base 111. The pin cap assembly 130 includes a substrate 134 and a cap body 131. The substrate 134 is slidably connected to the base 111, and the cap body 131 is mounted on the substrate 134. The cap body 131 has an adsorption groove 1312 and multiple through holes 1311. The adsorption groove 1312 is used for vacuum adsorption of the thin film placed on the chip, and each ejector pin 121 passes through a corresponding through hole 1311. The limiting assembly 140 includes a limiting block 141 and a follower 142. The limiting block 141 is connected to the substrate 134, and the follower 142 is fixed to the limiting block 141, with at least a portion of the follower 142 located on the side of the limiting block 141 closest to the mounting base 127. The driving assembly 150 is capable of driving the ejector pin assembly 120 to move along a first direction z.

[0045] For example, the first direction z is the direction of gravity. During chip and film separation, the cap 131 is connected to an external vacuum system to generate a vacuum suction force in the adsorption groove 1312 at the top of the cap 131, causing the film carrying the chip to be adsorbed onto the top of the cap 131. The horizontal direction includes a second direction x and a third direction y that are perpendicular to each other, and both the second direction x and the third direction y are perpendicular to the first direction z. The ejector pins 121 are equidistantly distributed on the horizontal plane, and the pushing ends of each ejector pin 121 are on the same plane, thereby ensuring that the height of each ejector pin 121 is uniform when pushing the chip, and that the force on the chip is uniform throughout, avoiding cracks or damage caused by uneven force on the chip. It can be understood that the pushing end of the ejector pin 121 refers to the tip of the ejector pin 121, which is able to push the chip through the film.

[0046] During operation, each ejector pin 121 retracts into the cap 131, and the thin film carrying the chip is adsorbed on top of the cap 131. The drive assembly 150 drives the ejector pin assembly 120 to rise, causing the pushing end of the ejector pin 121 to extend out of the through hole 1311 of the cap 131, thereby causing the ejector pin 121 to push the chip, creating a gap between the chip and the thin film. The pickup element located above the chip ejector pin assembly 100 picks up the upper surface of the chip, separating the chip from the thin film.

[0047] During the loading of the next chip, the drive assembly 150 drives the ejector pin 121 to retract into the cap body 131 and continues to drive the ejector pin assembly 120 to descend. When the bottom of the mounting base 127 abuts against the follower 142, the cap assembly 130 follows the ejector pin assembly 120 as it descends, bringing the cap body 131 to the loading position and re-adsorbing the film carrying the chip. Thus, through the multi-stage movement of the ejector pin assembly 120 and the cap assembly 130, the chip loading and the adsorption component are misaligned, preventing interference between the cap assembly 130 and the adsorption component during chip loading. This application eliminates the need for an additional drive mechanism for the cap assembly 130, resulting in a more compact overall design, simpler control, improved space utilization, and reduced design costs.

[0048] Continue reading Figure 4 As shown, in some embodiments, the limiting component 140 further includes a fixing block 143 and an elastic member 144. The fixing block 143 is fixed to the base 111. Along the first direction z, the limiting block 141 is disposed above the fixing block 143. The two ends of the elastic member 144 are respectively connected to the limiting block 141 and the fixing block 143.

[0049] For example, the fixing block 143 is a flat plate, one side of which is fixed to the base 111. The elastic element 144 is a helical spring, one end of which is connected to the fixing block 143 and the other end of which is connected to the limiting block 141 to provide elastic support for the limiting block 141 and the follower 142. Since the limiting block 141 is connected to the base plate 134, when the ejector pin assembly 120 presses down against the follower 142, the follower 142 and the limiting block 141 synchronously drive the base plate 134 to descend, realizing the synchronous descent movement of the pin cap assembly 130. Under the elastic force of the elastic element 144, when the ejector pin assembly 120 rises, the elastic element 144 drives the pin cap assembly 130 to reset.

[0050] Furthermore, there are two elastic elements 144, which are distributed at both ends of the limiting block 141. The follower 142 is located in the middle of the limiting block 141, so that when the follower 142 is pressed down, the two ends of the limiting block 141 are subjected to uniform force, and the needle cap assembly 130 descends stably.

[0051] Furthermore, the limiting assembly 140 also includes two guide posts, which are disposed between the limiting block 141 and the fixing block 143, with the elastic element 144 sleeved on the outside of the guide posts. In this way, the guide posts guide the movement direction of the limiting block 141, thereby ensuring that the needle cap assembly 130 always moves in a direction parallel to the first direction z, improving operational accuracy.

[0052] In some embodiments, the follower 142 is a bolt, and the limiting block 141 is provided with a corresponding screw hole. Through the threaded engagement between the follower 142 and the limiting block 141, the length of the follower 142 on the limiting block 141 can be adjusted by turning the follower 142, thereby adjusting the pressing distance of the ejector pin 121 and realizing the follower control of the needle cap assembly 130.

[0053] In some embodiments, the limiting component 140 further includes an adjusting bolt 145, which passes through the fixing block 143 and is threaded to the bottom of the base plate 134. The end of the adjusting bolt 145 connected to the base plate 134 is provided with an adjusting nut.

[0054] For example, the nut of the adjusting bolt 145 is located below the fixing block 143, thereby limiting the maximum rising height of the cap body through the contact between the nut and the fixing block 143. Simultaneously, the length of the adjusting bolt 145 above the fixing block 143 can be adjusted by rotating the adjusting nut. Since the adjusting bolt 145 is locked to the base plate 134 of the needle cap assembly 130, the overall height of the needle cap assembly 130 is adjusted, allowing the cap body 131 to adapt to different film heights and meet the film adsorption requirements under different operating conditions.

[0055] Continue reading Figure 5 As shown, in some embodiments, the assembly assembly 110 further includes a leveling screw 112, an expansion sleeve 113, and an expansion shaft 114. The base 111 has a first mounting hole 1111 and a second mounting hole 1112. The leveling screw 112 is installed in the first mounting hole 1111, and the expansion sleeve 113 is installed in the second mounting hole 1112.

[0056] For example, multiple leveling screws 112 are provided and distributed at different parts of the mounting surface of the base 111. The base 111 is correspondingly provided with multiple first mounting holes 1111. When the base 111 is installed in the working position, the leveling screws 112 are installed in the first mounting holes 1111. By rotating the leveling screws 112, the height of a certain part of the base 111 is slightly changed, thereby achieving precise adjustment of the overall level, ensuring the horizontal parallelism of the ejector pin 121 and the cap 131 in the first direction z and the second direction x, improving the pushing accuracy of the ejector pin 121, and further ensuring uniform force on the chip.

[0057] See also Figure 6As shown, multiple expansion sleeves 113, second mounting holes 1112, and expansion shafts 114 are provided. After the leveling screw 112 is adjusted to be horizontal, each expansion sleeve 113 is installed in the corresponding second mounting hole 1112. Then, the expansion shaft 114 presses down on the expansion sleeve 113, generating a force perpendicular to the leveling screw 112, which tightens the base 111 for fixation. Since the direction of the fixing and locking force of the expansion sleeve 113 is different from the direction of the force of the leveling screw 112, it will not change the adjustment amount of the leveling screw 112, thus better maintaining the horizontal parallelism of the chip ejector device 100 after adjustment.

[0058] In some embodiments, the assembly assembly 110 further includes a mounting bolt 115 and a disc spring 117. The base 111 has a third mounting hole 1113, which is a threaded hole. The mounting bolt 115 passes through the fixing platform and connects to the third mounting hole 1113. The disc spring 117 is sleeved on the periphery of the mounting bolt 115. By locking the mounting bolt 115 to the third mounting hole 1113, the disc spring 117 is compressed, generating pressure on the base 111.

[0059] For example, the mounting bolt 115 is threaded into the third mounting hole 1113. When the base 111 is installed in the working position, the mounting bolt 115 passes through the washer 116 and the disc spring 117 and connects to the third mounting hole 1113. The disc spring pre-presses the base 111 to perform the initial fixation of the base 111, and then the leveling screw 112 is used to adjust the level.

[0060] Continue reading Figure 7 and Figure 8 As shown, in some embodiments, the ejector pin assembly 120 further includes a connecting rod 124, a mounting block 123, and a clamping block 122. The connecting rod 124 has a first slot 1241 and a second slot 1242 at its end away from the mounting base 127, and the first slot 1241 and the second slot 1242 intersect. One end of the mounting block 123 has a plug-in portion 1231, which is installed in the first slot 1241 and fixed along the second slot 1242 by a pin. Each ejector pin 121 is sequentially arranged on the end of the mounting block 123 away from the connecting rod 124. The clamping block 122 is fixed to the mounting block 123, and one side of the clamping block 122 has a toothed surface 1221 that clamps each ejector pin 121 onto the mounting block 123.

[0061] For example, the top plate of the connecting rod 124 has a first slot 1241 and a second slot 1242 intersecting in a cross shape. The first slot 1241 is parallel to the second direction x, and the second slot 1242 is parallel to the third direction y. The mounting block 123 has a plug-in portion 1231 at one end near the connecting rod 124. The plug-in portion 1231 has a flat structure so that it can be inserted into the first slot 1241. After the plug-in portion 1231 is inserted into the first slot 1241, a fixing pin passes through the plug-in portion 1231 of the mounting block 123 along the second slot 1242. In this way, the mounting block 123 is fixed to the connecting rod 124 from two directions, ensuring the accuracy and convenience of replacing the mounting block 123.

[0062] The mounting block 123 has a stepped surface 1232 at the end away from the connecting rod 124. The stepped surface 1232 is a planar structure, and each ejector pin 121 lies flat on the platform. After the clamping block 122 is installed on the stepped surface 1232 by bolts and pins, the ejector pins 121 are fixed by the toothed surface 1221 of the clamping block 122. In this way, the contact area between the ejector pin 121 and the mounting surface is effectively reduced by the cooperation of the planar surface and the toothed surface 1221, improving the installation accuracy and better fixing the ejector pins 121 to the mounting block 123. This prevents some ejector pins 121 from being in a compressed state while others remain in an uncompressed state when the ejector pins 121 are pressed. Moreover, when increasing or decreasing the number of ejector pins 121 according to different chip sizes, the ejector pins 121 can be quickly disassembled and assembled by simply loosening the screws, improving the convenience and positional accuracy of ejector pin replacement.

[0063] In some embodiments, the ejector pin assembly 120 further includes a sleeve 125 and a knob 126. One end of the sleeve 125 is connected to the mounting base 127, and one end of the connecting rod 124 passes through the end of the sleeve 125 away from the mounting base 127. The knob 126 is located at the connection between the sleeve 125 and the connecting rod 124 to lock the connecting rod 124.

[0064] For example, one end of the sleeve 125 is inserted into the mounting and fixed with a limiting bolt 128, the bottom of which protrudes so as to abut against the follower 142 when the ejector assembly 120 is pressed down. The end of the connecting rod 124 away from the ejector 121 is inserted into the sleeve 125 and locked by a knob 126.

[0065] Continue reading Figure 9 As shown, in some embodiments, the needle cap assembly 130 further includes a vacuum seat 132 and a fixing seat 133. The vacuum seat 132 is connected to the cap body 131, and the fixing seat 133 is connected to the end of the vacuum seat 132 away from the cap body 131. The fixing seat 133 is slidably connected to the base 111.

[0066] See also Figure 10As shown, exemplarily, the cap body 131 has a first vacuum channel 1313, and the vacuum seat 132 has a second vacuum channel 1321. After the cap body 131 and the vacuum seat 132 are assembled, the first vacuum channel 1313 and the second vacuum channel 1321 are connected. A gas connector 135 is provided on one side of the vacuum seat 132, and it is connected to an external vacuum system through the gas connector 135, so that the adsorption groove 1312 of the cap body 131 forms a vacuum adsorption force, adsorbing the film onto the cap body 131. A fixing seat 133 is installed at the end of the vacuum seat 132 away from the cap body 131 and is connected to the substrate 134 by bolts, so that the cap body 131 can move with the substrate 134.

[0067] The connecting rod 124 passes through the second vacuum channel 1321 of the vacuum base 132 and is coaxially arranged with the vacuum base 132 so that the ejector pin 121 and the cap 131 are on the same mounting reference. This better ensures the concentricity of the ejector pin 121 and the cap 131 through hole 1311, reduces the positional deviation between the ejector pin 121 and the chip, improves the ejection position accuracy of the chip, and reduces the risk of chip damage during ejection.

[0068] Furthermore, a sealing ring 136 is also provided inside the vacuum seat 132. The sealing ring 136 is sleeved on the outside of the connecting rod 124 to seal the gap between the connecting rod 124 and the vacuum seat 132, ensuring the sealing performance of the second vacuum channel 1321 and improving the adsorption capacity of the cap 131.

[0069] Continue reading Figure 2 As shown, in some embodiments, the drive assembly 150 includes a motor 151, a lead screw 153, a connecting block 154, a first slider 155, a second slider 156, and a third slider 157. The motor 151 is driven by the lead screw 153, and the lead screw 153 is threadedly engaged with the connecting block 154. The first slider 155, the second slider 156, and the third slider 157 are distributed sequentially from top to bottom along the first direction z. The connecting block 154 is connected to the second slider 156. A guide rail 118 is provided on one side of the base 111. The guide rail 118 is parallel to the first direction z. The first slider 155, the second slider 156, and the third slider 157 are slidably engaged with the guide rail 118. The base plate 134 is simultaneously connected to the first slider 155 and the third slider 157. The mounting base 127 is connected to the second slider 156. The fixing base 133 is also present.

[0070] Combined Figure 5As shown, exemplarily, the motor 151 is mounted in the motor slot 1114 of the base 111 to reduce the overall size of the device. The output shaft of the motor 151 and the lead screw 153 are both mounted on pulleys and driven by a belt, so that the lead screw 153 can rotate when the motor 151 is in operation. One side of the connecting block 154 is connected to the lead screw 153, and the other side is connected to the second slider 156. The lead screw 153 is bolted to the connecting block 154. During the rotation of the lead screw 153, the connecting block 154 can move up and down, thereby driving the second slider 156 and the ejector pin assembly 120 to move synchronously. By designing the ejector pin assembly 120 and the pin cap assembly 130 on the same linear guide rail 118, the perpendicularity of the cap body 131 and the ejector pin 121 is better ensured, reducing the angular deviation between the connecting rod 124 and the fixed seat 133 in the first direction z, resulting in smoother relative movement between them.

[0071] Furthermore, the drive assembly 150 also includes an origin sensor 152, which is mounted on the base 111 and electrically connected to the motor 151 to provide a position memory starting point for the motor 151, accurately control the amount of work done by the motor 151 each time it moves, and ensure that the displacement of the ejector pin 121 is constant during batch operations.

[0072] Embodiments of this application also provide a semiconductor processing apparatus, including the chip ejector device 100 in any of the above embodiments.

[0073] This embodiment has the chip ejector device 100 of any of the above embodiments, and therefore has all the beneficial effects of the chip ejector device 100 of any of the above embodiments, which will not be described in detail here.

[0074] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A chip ejector pin device, characterized in that, include: Assembly components, including the base; The ejector assembly includes multiple ejector pins and a mounting base. Along a first direction, each ejector pin is mounted above the mounting base, and the pushing ends of each ejector pin are located on the same horizontal plane. The mounting base is slidably connected to the base. A pin cap assembly includes a substrate and a cap body. The substrate is slidably connected to the base, and the cap body is mounted on the substrate. The cap body has an adsorption groove and multiple through holes. The adsorption groove is used for vacuum adsorption of a thin film placed on a chip, and each pin is respectively inserted through a corresponding through hole. A limiting component includes a limiting block and a follower, wherein the limiting block is connected to the substrate, the follower is fixed to the limiting block, and the follower is at least partially located on the side of the limiting block near the mounting base. The driving component is capable of driving the ejector pin assembly to move along the first direction.

2. The chip ejector pin device according to claim 1, characterized in that, The limiting component further includes a fixing block and an elastic element. The fixing block is fixed to the base. Along the first direction, the limiting block is disposed above the fixing block. The two ends of the elastic element are respectively connected to the limiting block and the fixing block.

3. The chip ejector pin device according to claim 2, characterized in that, The limiting component also includes an adjusting bolt, which passes through the fixing block and is threaded to the bottom of the substrate. The end of the adjusting bolt that is connected to the substrate is provided with an adjusting nut.

4. The chip ejector pin device according to claim 1, characterized in that, The assembly assembly also includes a leveling screw, an expansion sleeve, and an expansion shaft. The base has a first mounting hole and a second mounting hole. The leveling screw is installed in the first mounting hole, and the expansion sleeve is installed in the second mounting hole.

5. The chip ejector pin device according to claim 4, characterized in that, The assembly assembly also includes a mounting bolt and a disc spring. The base has a third mounting hole. The mounting bolt is threaded into the third mounting hole. The disc spring is sleeved around the mounting bolt. The mounting bolt is locked to the third mounting hole. The disc spring is compressed, generating pressure on the base.

6. The chip ejector pin device according to claim 1, characterized in that, The ejector pin assembly further includes a connecting rod, a mounting block, and a clamping block. The connecting rod has a first slot and a second slot at its end away from the mounting base, and the first slot and the second slot intersect. One end of the mounting block has a plug-in portion, which is installed in the first slot and fixed along the second slot by a pin. Each ejector pin is sequentially laid on the end of the mounting block away from the connecting rod. The clamping block is fixed to the mounting block, and one side of the clamping block has a toothed surface that clamps each ejector pin onto the mounting block.

7. The chip ejector pin device according to claim 6, characterized in that, The ejector pin assembly also includes a sleeve and a knob. One end of the sleeve is connected to the mounting base, and one end of the connecting rod passes through the end of the sleeve away from the mounting base. The knob is located at the connection between the sleeve and the connecting rod to lock the connecting rod.

8. The chip ejector pin device according to claim 1, characterized in that, The needle cap assembly further includes a vacuum seat and a fixing seat. The vacuum seat is connected to the cap body, and the fixing seat is connected to the end of the vacuum seat away from the cap body. The fixing seat is fixed to the substrate.

9. The chip ejector pin device according to claim 8, characterized in that, The drive assembly includes a motor, a lead screw, a connecting block, a first slider, a second slider, and a third slider. The motor is connected to the lead screw in a transmission manner, and the lead screw is threadedly engaged with the connecting block. The first slider, the second slider, and the third slider are distributed sequentially from top to bottom along the first direction, and the connecting block is connected to the second slider. The base has a guide rail on one side, which is parallel to the first direction. The first slider, the second slider, and the third slider are slidably engaged with the guide rail. The base plate is connected to the first slider and the third slider, and the mounting base is connected to the second slider.

10. A semiconductor processing apparatus, characterized in that, The chip ejector device includes any one of claims 1 to 9.

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