Wafer adsorption device

Abstract

The invention provides a wafer adsorption device. The wafer adsorption device comprises a tooth fork body, a tooth fork cover plate and a suction cup. The tooth fork body comprises a bearing part and a handle part, and a groove is formed in one main plane of the tooth fork body. The tooth fork cover plate covers the groove so that the tooth fork cover plate and the tooth fork body jointly define an airflow channel. The suction cup is fixedly connected with the tooth fork body and provided with an adsorption face facing a wafer and a flow guide structure. The flow guide structure is communicated with the airflow channel and used for spraying airflow from the airflow channel out of the periphery of the suction cup at a high speed so as to form an air film used for adsorbing the wafer. According to the wafer adsorption device, a high-speed gas film is formed through the suction cup and the flow guide structure of the suction cup so as to realize non-contact or micro-contact adsorption of the wafer, stress damage and pollution risks of the wafer in the carrying process are effectively reduced, and the reliability and cleanliness of ultrathin wafer operation are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, and in particular to an adsorption device for handling wafers. Background Technology

[0002] As the semiconductor industry moves towards spatial integration and advanced packaging technologies, wafer thickness continues to decrease, leading to the increasingly widespread application of ultra-thin wafers (e.g., those with a thickness of 100-150 micrometers). In complex manufacturing processes, these ultra-thin wafers require highly precise, non-destructive automated handling between different steps.

[0003] In related technologies, contact-type wafer transfer devices are commonly used, such as mechanical clamping or vacuum adsorption forks. Among them, vacuum adsorption forks are more common. Their working principle is that the adsorption holes on the fork contact the wafer surface, and the negative pressure is used to adsorb and fix the wafer onto the fork. Then, a drive mechanism (such as a robotic arm) drives the fork to complete the transfer.

[0004] However, this type of contact-based adsorption method faces several challenges when handling increasingly sophisticated ultrathin wafers. First, ultrathin wafers have poor rigidity and are easily deformed. The localized suction force generated by vacuum adsorption can introduce uneven stress within the wafer, potentially causing warping or even hidden damage. Second, the direct physical contact between the vacuum fork and the wafer carries the risk of particulate contamination. Friction at the contact surface can generate tiny particles or transfer contaminants from the vacuum fork to the back of the wafer, affecting chip yield. Furthermore, for wafers that already exhibit some warping, the rigid vacuum adsorption end face is difficult to seal effectively, leading to unstable adsorption forces and impacting the reliability of the handling process. Summary of the Invention

[0005] The purpose of this application is to provide a wafer adsorption device, which aims to solve the technical problems of stress damage, particulate contamination and unstable adsorption that are easily caused to ultra-thin wafers by contact adsorption methods in related technologies.

[0006] To achieve the above objectives, this application provides a wafer adsorption device comprising: a toothed fork body, a toothed fork cover plate, and a suction cup.

[0007] The fork body includes a support portion and a handle portion connected to the support portion. The handle portion has a mounting portion for connecting a drive mechanism. A groove is provided on a main plane of the fork body. A fork cover is provided in the groove to define an airflow channel together with the fork body. A suction cup is fixedly connected to the fork body. The suction cup has an adsorption surface facing the wafer and a flow guiding structure. The flow guiding structure connects to the airflow channel and is used to eject airflow from the airflow channel at high speed from the periphery of the suction cup to form an air film for adsorbing the wafer.

[0008] In one embodiment, the support portion has at least one positioning groove on another main plane opposite to one main plane; the suction cup is sealed in the positioning groove.

[0009] In one embodiment, the positioning groove is provided with a positioning part for positioning; the suction cup also includes a positioning boss that cooperates with the positioning part.

[0010] In one embodiment, an air outlet is provided in the middle of the positioning groove; the air outlet is used to deliver airflow from the airflow channel to the suction cup.

[0011] In one embodiment, the wall of the positioning groove is formed with a sloping guide groove, which guides the airflow flowing out of the airflow channel; the angle between the sloping guide groove and the main plane of the tooth fork body is 10 degrees to 20 degrees.

[0012] In one embodiment, the suction cup has a central air intake area communicating with an airflow channel; the flow guiding structure includes at least one flow guiding groove; the flow guiding groove extends from the central air intake area to the periphery of the suction cup to guide the airflow from the central air intake area to the periphery of the suction cup.

[0013] In one embodiment, the guide grooves extend in a vortex shape around the central air intake area.

[0014] In one embodiment, the periphery of the suction cup is an inclined rectifier surface; the angle between the rectifier surface and the suction surface is 10 to 20 degrees; the airflow is ejected along the rectifier surface.

[0015] In one embodiment, the wafer adsorption device further includes a shock-absorbing plate; the adsorption surface is recessed with a receiving groove for accommodating the shock-absorbing plate; the shock-absorbing plate is used to provide buffer protection when the wafer comes into contact with the chuck.

[0016] In one embodiment, the toothed fork cover plate has an air inlet at one end of the corresponding handle, the air inlet being used to connect an external air source to the airflow channel.

[0017] The wafer adsorption device provided in this application achieves non-contact or micro-contact adsorption by forming a high-speed jet gas film between the suction cup and the wafer. This avoids direct rigid contact between the adsorption end face and the wafer, thereby effectively reducing the local stress applied to the ultra-thin wafer and avoiding the risk of warping or damage. At the same time, the non-contact adsorption method also reduces the possibility of particulate contamination caused by physical contact, improving the cleanliness and reliability of the handling process. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is an exploded schematic diagram of a wafer adsorption device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the wafer adsorption device from one angle. Figure 3 yes Figure 2 A magnified view of a portion of region A of the wafer adsorption device shown. Figure 4 yes Figure 3 The cross-sectional view of the wafer adsorption device shown along direction II; Figure 5 This is a schematic diagram of the suction cup at one angle; Figure 6 This is a schematic diagram of the suction cup from another angle; Figure 7 This is a schematic diagram of the wafer adsorption device from another angle.

[0020] Figure label: 100. Fork body; 110. Bearing part; 120. Handle; 121. Mounting part; 130. Positioning groove; 131. Positioning part; 132. Air outlet; 133. Angled guide groove; 140. Groove; 150. Airflow channel; 161. First main plane; 162. Second main plane; 200. Tooth fork cover; 210. Air inlet; 300, suction cup; 310, adsorption surface; 320, central air intake area; 330, guide channel; 340, rectifying surface; 350, boss base; 360, positioning boss; 370, receiving groove; 400. Shock absorber pads. Detailed Implementation

[0021] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0022] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0023] The directional terms used in this description, such as "up," "down," "left," "right," "inner," and "outer," are only for reference to the directions shown in the attached diagram. These directional terms should be changed if the directions in the attached diagram change.

[0024] This application provides a wafer adsorption device; please refer to [link / reference]. Figure 1 , Figure 1 This is an exploded view of a wafer adsorption device. In one embodiment, the wafer adsorption device includes a toothed fork body 100, a toothed fork cover plate 200, and a suction cup 300 (see [link to documentation]). Figure 7 ).

[0025] Specifically, the fork body 100 can be made of a high-strength, low-thermal-expansion-coefficient material (such as aluminum alloy or ceramic) to ensure structural stability under high-speed motion and temperature-changing environments. The fork body 100 includes a generally C-shaped support portion 110 and a handle portion 120 integrally formed with and extending from the support portion 110. The C-shaped opening design of the support portion 110 allows it to easily extend from the side under the wafer for load-bearing operations. The end of the handle portion 120 is provided with a mounting portion 121, which has multiple mounting holes for a secure mechanical connection with an external drive mechanism (such as a robotic arm) via fasteners such as bolts.

[0026] It is understood that the connection method between the mounting part 121 and the drive mechanism is not limited to the bolt fastening described above. Quick-release clips, electromagnetic engagement, or other connection methods well known to those skilled in the art can also be used, and this application does not impose specific limitations on this. Similarly, the drive mechanism can be a multi-axis articulated robot arm, a linear coordinate robot, or other automated equipment capable of providing precise displacement control, and this application does not impose limitations on this either.

[0027] On the first main plane 161 of the tooth fork body 100, a continuous groove 140 is recessed along the contour of the bearing portion 110 and the handle portion 120. In one embodiment, the depth of the groove 140 can be 0.5 mm to 2 mm to ensure that an airflow channel with a sufficient cross-sectional area can be formed.

[0028] The shape of the fork cover 200 matches the outer contour of the fork body 100. The fork cover 200 is sealed onto the groove 140 by means of structural adhesive or the like, thereby defining the airflow channel 150 together with the fork body 100 (see [link]). Figure 4 ).

[0029] In one embodiment, the seal between the fork cover plate 200 and the fork body 100 can be achieved using a structural sealant (e.g., HBC-1059). During assembly, the sealant is evenly applied to the mating surface around the groove 140 of the fork body 100, and then the fork cover plate 200 is aligned and placed on top. After the sealant cures, a sealed bond is formed.

[0030] It is understandable that, in addition to using structural sealant, the sealing connection between the fork cover plate 200 and the fork body 100 can also be achieved in other ways, such as by using laser welding, brazing, or other welding methods to form an integrated structure, or by setting O-rings between the mating surfaces and fastening them with bolts to achieve a detachable sealing connection. The scope of protection of this application is not limited to the specific sealing method.

[0031] In one embodiment, please refer to Figure 1 The toothed fork cover 200 has a through air inlet 210 at the end corresponding to the handle 120. The air inlet 210 is the interface connecting the entire wafer adsorption device to an external air source (not shown). In actual use, clean, dry airflow from the factory's compressed air system is connected to the air inlet 210 via pneumatic piping and enters from there into the sealed airflow channel 150 (e.g., formed by the toothed fork body 100 and the toothed fork cover 200) formed by the toothed fork body 100 and the toothed fork cover 200. Figure 4 Inside (as shown), a continuous and stable airflow supply is provided to generate the Bernoulli effect at suction cup 300.

[0032] The suction cup 300 can be fixedly connected to the toothed fork body 100 by means of adhesive bonding or other methods. Each suction cup 300 has an adsorption surface 310 for facing the wafer (see [link]). Figure 6 The device includes an internal airflow guiding structure, which is connected to the airflow channel 150. When the wafer adsorption device is operating, airflow from an external air source is guided by the airflow guiding structure of the chuck through the airflow channel 150 and ultimately ejected at high speed from the periphery of the chuck 300. The high-speed ejected airflow forms a stable gas film between the chuck 300 and the adsorbed wafer. This gas film generates adsorption force, thereby adsorbing the wafer in a non-contact or micro-contact manner.

[0033] Please refer to the following: Figure 1 and Figure 2 , Figure 2 This is a schematic diagram of the wafer adsorption device from an angle. The toothed fork body 100 has two main planes facing away from each other, wherein the first main plane 161 (as shown in the diagram) Figure 1 A groove 140 is provided on the first main plane 161, and a second main plane 162 (as shown) is provided opposite to the first main plane 161. Figure 2As shown, at least one positioning groove 130 is provided on the surface. Each positioning groove 130 is used to install a suction cup 300, which is sealed in the positioning groove 130 by means of adhesive bonding or other methods.

[0034] The number and layout of the positioning slots 130 can be adjusted according to the size and weight of the wafer to be transported, as well as the requirements for uniformity of adsorption force. This application does not impose specific limitations in this regard. For example, one or more positioning slots 130 can be provided as long as they meet the design requirements of structural mechanics and fluid mechanics. The example shown in the accompanying drawings of this application is a wafer adsorption device with six positioning slots 130 evenly distributed on the support portion 110. This multi-point support layout can provide a more stable and uniform adsorption force for large-size wafers.

[0035] Please refer to this application together. Figure 3 and Figure 4 ,in, Figure 3 yes Figure 2 A magnified view of a portion of region A of the wafer adsorption device shown. Figure 4 yes Figure 3 The above two figures show a cross-sectional view of the wafer adsorption device along direction II; the two figures above illustrate the specific structure of the positioning groove 130 in one embodiment.

[0036] In one embodiment, please refer to Figure 3 The positioning groove 130 is provided with a positioning part 131 for positioning. Specifically, the positioning part 131 can be three grooves evenly distributed around the center of the positioning groove 130.

[0037] It is understood that the number and specific structure of the positioning parts 131 are not limited to the three evenly distributed grooves shown in the attached drawings. Depending on actual design requirements, the positioning parts 131 can be one, two, or any number, and their layout can be adjusted according to the positioning accuracy requirements, for example, an asymmetrical or linear layout can be used. Furthermore, the geometry of the positioning parts 131 is not limited to grooves; it can be any structure capable of effectively engaging with the suction cup 300, such as positioning pin holes, keyways, irregular flanges, or other mechanical positioning structures. This application does not impose specific limitations in this regard.

[0038] In one embodiment, please continue to refer to Figure 3 and Figure 4 An air outlet 132 is provided in the middle of the positioning groove 130. One end of the air outlet 132 is connected to the airflow channel 150 inside the tooth fork body 100, and the other end of the air outlet 132 is open towards the suction cup 300 (not shown). The air outlet 132 is used to deliver the airflow from the airflow channel 150 to the suction cup 300.

[0039] In one embodiment, the wall of the positioning groove 130 is designed with an inclined structure, thereby forming an inclined guide groove 133. This inclined guide groove 133 guides the airflow flowing from the airflow channel 150 through the air outlet 132. In a specific embodiment, the inclined surface of the inclined guide groove 133 is aligned with the second main plane 162 of the tooth fork body 100 (e.g., ...). Figure 2 The angle formed (as shown) is 10 to 20 degrees to achieve the ideal flow guiding effect.

[0040] Please refer to the following: Figure 5 and Figure 6 ,in, Figure 5 This is a schematic diagram of the suction cup 300 at one angle; Figure 6 This is a schematic diagram of the suction cup 300 from another angle; In one embodiment, please refer to Figure 5 The suction cup 300 has a central air intake area 320 inside, which is used to receive airflow from the air outlet 132 on the toothed fork body 100. The airflow guiding structure of the suction cup 300 is specifically manifested as at least one guide groove 330 extending outward from the central air intake area 320. After the airflow enters from the central air intake area 320, it will be guided to the periphery of the suction cup 300 along the path of the guide groove 330.

[0041] It is understood that the number of flow channels 330 can be one or more, and their specific width, depth, and length can be designed according to the required airflow and pressure distribution. In addition, the specific geometric contours of the flow channels 330, such as their cross-sectional shape (e.g., U-shape or V-shape), the curvature and slope of the channel walls, etc., are not limited by this application, as long as they can effectively guide the airflow.

[0042] In one embodiment, please continue to refer to Figure 5 The geometry of the guide channel 330 is designed to extend in a vortex shape around the central air intake area 320. This vortex-shaped flow channel design can effectively guide the airflow to rotate inside the suction cup 300, thereby forming a stable, rotating air film at the bottom of the suction cup 300. This plays an important role in improving the stability of the non-contact adsorption process and preventing the wafer from drifting slightly during handling.

[0043] In one embodiment, the periphery of the suction cup 300 can be a downwardly sloping rectifying surface 340. After being guided by the guide groove 330, the airflow will eventually be ejected at high speed along the gap formed between the rectifying surface 340 and the wafer surface. The sloping angle of the rectifying surface 340 can be specially designed. In one embodiment, the angle formed between the rectifying surface 340 and the adsorption surface 310 of the suction cup 300 can be 10 to 20 degrees. Such an angle helps to constrain the jet direction of the airflow and can generate a nozzle-like acceleration effect, thereby forming a stronger negative pressure below the suction cup 300 and improving the adsorption force.

[0044] The bottom of the suction cup 300 is a flat adsorption surface 310. During operation, the adsorption surface 310 faces and is parallel to the wafer surface. The adsorption surface 310 is the reference plane for forming the adsorption gas film and negative pressure zone. The flatness and surface finish of the adsorption surface 310 are required to ensure that a small gap with uniform thickness and stable flow field can be formed between it and the wafer.

[0045] On the back of the suction cup 300, i.e., on the side away from the suction surface 310, an annular boss base 350 is provided. The boss base 350 is a platform higher than the flow channel plane in the central region. Multiple positioning bosses 360 extend upward from the boss base 350. In this embodiment, three cylindrical positioning bosses 360 are provided in a circumferentially evenly distributed manner. The size and position of each positioning boss 360 match the positioning part 131 in the positioning groove 130 on the fork body 100. During installation, the positioning boss 360 is inserted into the corresponding positioning part 131, and then sealed with sealant (e.g., HBC-1059 model) to achieve a fixed fit between the suction cup 300 and the fork body 100. It is understood that other technical solutions can also be used to achieve fixation and sealing between the suction cup 300 and the positioning groove 130. For example, a sealing ring can be set between the two, and detachable fixation can be achieved through threaded connection or snap-fit ​​connection; or, in some applications with extremely high requirements for integration, permanent connection methods such as welding or brazing can also be used. The scope of protection of this application is not limited to the specific fixation method.

[0046] In one embodiment, please refer to Figure 6 The wafer adsorption device also includes a shock absorber 400. To accommodate the installation of the shock absorber 400, a receiving groove 370 is recessed on the adsorption surface 310 of the suction cup 300. The shock absorber 400 is fixedly disposed within the receiving groove 370.

[0047] Specifically, the damping pad 400 is typically made of a soft material with good elasticity and a high coefficient of friction, such as rubber, silicone, polyurethane, or special elastomers. Its main function is to provide safety protection: when the wafer suction device performs pick-up and drop operations, or during high-speed transport when equipment vibration causes a momentary, minute contact between the wafer and the suction cup 300, the damping pad 400 acts as a buffer, preventing the hard suction cup 300 body from directly impacting or scratching the wafer surface. Furthermore, the high frictional properties of the damping pad 400 also help provide sufficient lateral resistance when contact occurs, preventing the wafer from sliding horizontally under inertia, thereby further ensuring the safety and stability of the wafer transport process. It is understood that the thickness of the damping pad 400 can be slightly greater than the depth of the receiving groove 370, causing the surface of the damping pad 400 to slightly bulge out of the suction surface 310 for preferential contact with the wafer; alternatively, it can be flush with the suction surface 310, serving only as a buffer stop at extreme positions.

[0048] Please see Figure 7 , Figure 7 This is another structural schematic diagram of the wafer adsorption device, showing a view of the wafer adsorption device in this embodiment after the suction cups 300 and the toothed fork body 100 are assembled. Multiple suction cups 300 are respectively mounted in positioning slots 130 formed on the second main plane 162 of the toothed fork body 100 (see [link]). Figure 2 Inside. After assembly, the suction cup 300 and the toothed fork body 100 form a stable integral structure, and the air passage of each suction cup 300 is connected to the airflow channel 150 inside the toothed fork body 100.

[0049] The working principle and airflow path of the wafer adsorption device in this embodiment are as follows: First, please refer to Figure 1 Clean compressed air from outside enters the air inlet 210 at the end of the tooth fork cover 200 through the connecting pipe.

[0050] Next, the airflow enters the sealed airflow channel 150 formed by the groove 140 of the fork body 100 and the fork cover plate 200 (e.g., Figure 4 (As shown). The airflow flows within the airflow channel 150 and along the handle 120 and the support portion 110 of the fork body 100 to the top of each positioning groove 130.

[0051] Then, please see Figure 3 and Figure 4 The airflow passes through the air outlet 132 in the middle of the positioning groove 130 and leaves the airflow channel 150.

[0052] Then please see Figure 5The airflow enters the central air intake zone 320 inside the suction cup 300 from the air outlet 132. In the central air intake zone 320, the airflow is distributed into multiple vortex-shaped guide channels 330. Guided by the guide channels 330, the airflow begins to rotate at high speed, forming a stable vortex.

[0053] Finally, this high-speed rotating airflow reaches the periphery of the suction cup 300 and is ejected tangentially at high speed outward along the tiny gap between the inclined rectifying surface 340 and the surface of the wafer to be adsorbed (not shown). According to the Bernoulli effect, high-speed gas flow generates low pressure. Therefore, a stable negative pressure zone and a uniform gas film are formed between the adsorption surface 310 of the suction cup 300 and the wafer. This negative pressure zone generates an upward adsorption force that holds the wafer in place, while the gas film provides support, allowing the wafer to suspend below the suction cup 300 in a non-contact or micro-contact manner, thereby achieving stable, low-stress adsorption of the wafer.

[0054] As mentioned above, the wafer adsorption device provided in this application, by setting an internal airflow channel 150 on the toothed fork body 100 and cooperating with a suction cup 300 with a special airflow guiding structure, can eject airflow at high speed from the periphery of the suction cup 300, forming a stable and uniform air film between the suction cup 300 and the wafer. This non-contact or micro-contact adsorption method based on the Bernoulli effect has the following advantages compared with related technologies: The uniform support of the gas film avoids the localized stress concentration caused by traditional vacuum adsorption, significantly reducing the risk of warping, microcracks or breakage of ultrathin wafers.

[0055] The non-contact or micro-contact working method fundamentally avoids direct physical friction between the adsorption device and the back of the wafer, effectively preventing the generation of particles and cross-contamination, and ensuring high cleanliness during the handling process.

[0056] The rotating air film formed by the vortex-shaped guide channel 330 enhances the rigidity and stability of the air cushion, effectively suppressing wafer vibration and drift even during high-speed start-stop handling, thus improving operational reliability.

[0057] For wafers that have a certain degree of warping, the air film can better conform to its surface contour and form an effective adsorption force, which has better adaptability to working conditions compared to traditional rigid chucks.

[0058] It should be noted that the terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0059] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this application.

Claims

1. A wafer adsorption device, characterized in that, include: The main body of the fork includes a support portion and a handle portion connected to the support portion; The handle has a mounting portion for connecting the drive mechanism; a groove is provided on one main plane of the bearing portion; A toothed fork cover plate, with a sealing cover, is provided in the groove to define an airflow channel together with the toothed fork body; A suction cup is fixedly connected to the toothed fork body; the suction cup has an adsorption surface facing the wafer and a flow guiding structure; The flow guiding structure connects to the airflow channel and is used to eject the airflow from the airflow channel at high speed from the periphery of the suction cup to form an air film for adsorbing the wafer.

2. The wafer adsorption device according to claim 1, characterized in that, The supporting part has at least one positioning groove on another main plane that is opposite to the one main plane; the suction cup is sealed in the positioning groove.

3. The wafer adsorption device according to claim 2, characterized in that, The positioning groove is provided with a positioning part for positioning; the suction cup also includes a positioning boss that cooperates with the positioning part.

4. The wafer adsorption device according to claim 2, characterized in that, An air outlet is provided in the middle of the positioning groove; the air outlet is used to deliver airflow from the airflow channel to the suction cup.

5. The wafer adsorption device according to claim 2, characterized in that, The positioning groove has a sloping guide groove formed on its wall, which guides the airflow from the airflow channel. The angle between the inclined guide groove and the main plane of the tooth fork body is 10 to 20 degrees.

6. The wafer adsorption device according to claim 1, characterized in that, The suction cup has a central air intake area that communicates with the airflow channel; the flow guiding structure includes at least one flow guiding groove. The airflow channel extends from the central air intake area to the periphery of the suction cup to guide the airflow from the central air intake area to the periphery of the suction cup.

7. The wafer adsorption device according to claim 6, characterized in that, The guide channels all extend in a vortex shape around the central air intake area.

8. The wafer adsorption device according to claim 6, characterized in that, The periphery of the suction cup is an inclined rectifier surface; The angle between the rectifying surface and the adsorption surface is 10 to 20 degrees; the airflow is ejected along the rectifying surface.

9. The wafer adsorption device according to claim 1, characterized in that, The wafer adsorption device further includes a shock-absorbing plate; the adsorption surface is recessed with a receiving groove for accommodating the shock-absorbing plate; The shock-absorbing sheet is used to provide buffer protection when the wafer comes into contact with the chuck.

10. The wafer adsorption device according to claim 1, characterized in that, The toothed fork cover plate has an air inlet at one end corresponding to the handle, and the air inlet is used to connect an external air source to the airflow channel.

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