Power module with pressing element

Abstract

A power module includes a substrate, a power semiconductor die, a housing, a first type of pressing element, and a second type of pressing element. The substrate and the housing define an interior space of the power module. The housing includes a first fastening side and a second fastening side, each including a fastening feature, and a first non-fastening side and a second non-fastening side, each intersecting the first fastening side and the second fastening side. The pressing elements of the first type are located at the first and second fastening sides, and the pressing elements of the second type are located at the first and second non-fastening sides. The two types of pressing elements are configured to press against the substrate in a mounted state of the power module. The pressing elements of the second type have a different geometry and / or material composition than the pressing elements of the first type.

Description

Background Technology

[0001] The demand for electronic modules used in power applications (often referred to as power modules) continues to increase rapidly across a wide range of industries, including automotive, consumer electronics, renewable energy, manufacturing, and medical. Advances in semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) have enabled the manufacture of such power modules, which offer advantages such as smaller footprint, higher voltage and current capabilities, and faster switching speeds.

[0002] As power modules become smaller and / or deliver higher currents, efficient heat dissipation becomes particularly important for ensuring acceptable reliability and lifespan. In some applications, heat dissipation is facilitated by mounting the power module to a heat sink. In such applications, heat dissipation from the power module to the heat sink can be facilitated by including a thermal interface material (TIM) layer between the outer mounting surface of the power module and the surface of the heat sink. However, an uneven thermal interface between the outer mounting surface of the power module and the surface of the heat sink can reduce the reliability and / or lifespan of the power module.

[0003] Therefore, a solution is needed to ensure a uniform thermal interface for efficient heat dissipation from the power module to the heat sink. Summary of the Invention

[0004] According to an embodiment of the power module, the power module includes: a substrate; a power semiconductor die attached to the substrate; a housing, the substrate and the housing defining an internal space in which the power semiconductor die is enclosed, the housing including a first fastening side and a second fastening side opposite to the first fastening side, each of the first fastening side and the second fastening side including a fastening feature, the housing also including a first non-fastening side and a second non-fastening side opposite to the first non-fastening side, the first non-fastening side and the second non-fastening side each intersecting the first fastening side and the second fastening side; a first type of pressing element located at the first fastening side and the second fastening side; and a second type of pressing element located at the first non-fastening side and the second non-fastening side, wherein the two types of pressing elements are configured to press against the substrate in the mounted state of the power module, wherein the second type of pressing element has a different geometry and / or material composition than the first type of pressing element.

[0005] According to an embodiment of the method, the method includes: attaching a power semiconductor die to a substrate; providing a housing including a first fastening side, a second fastening side opposite to the first fastening side, a first non-fastening side, and a second non-fastening side opposite to the first non-fastening side, wherein each of the first fastening side and the second fastening side includes a fastening feature, wherein each of the first non-fastening side and the second non-fastening side intersects with the first fastening side and the second fastening side; providing a first type of pressing element and a second type of pressing element, the second type of pressing element having a different geometry and / or material composition than the first type of pressing element; and mounting the housing to the substrate such that the substrate and the housing define an internal space in which the power semiconductor die is enclosed, the housing pressing the first type of pressing element against the substrate at the first fastening side and the second fastening side, and the housing pressing the second type of pressing element against the substrate at the first non-fastening side and the second non-fastening side.

[0006] According to an embodiment of an electronic component, the electronic component includes: a power module mounted to a heat sink, the power module including: a substrate; a power semiconductor die attached to the substrate; a housing, the substrate and the housing defining an internal space in which the power semiconductor die is enclosed, the housing including a first fastening side and a second fastening side opposite to the first fastening side, each of the first fastening side and the second fastening side including a fastening feature, the housing also including a first non-fastening side and a second non-fastening side opposite to the first non-fastening side, the first non-fastening side and the second non-fastening side each intersecting the first fastening side and the second fastening side; a first type of pressing element located at the first fastening side and the second fastening side; and a second type of pressing element located at the first non-fastening side and the second non-fastening side, wherein both types of pressing elements press against the substrate, wherein the second type of pressing element has a different geometry and / or material composition than the first type of pressing element.

[0007] Those skilled in the art will recognize additional features and advantages upon reading the following detailed description and consulting the accompanying drawings. Attached Figure Description

[0008] The elements in the accompanying drawings are not necessarily proportional to each other. The same reference numerals denote corresponding similar parts. Features of the various illustrated embodiments can be combined unless they are mutually exclusive. Embodiments are shown in the accompanying drawings and described in detail below.

[0009] Figure 1 A perspective view of a power module according to an embodiment is shown.

[0010] Figure 2 A side view of the power semiconductor die and substrate of a power module according to an embodiment is shown.

[0011] Figure 3 A side view of the housing of a power module according to an embodiment is shown.

[0012] Figures 4A-4D A side view of the pressing element of the power module according to an embodiment is shown.

[0013] Figure 5 A side view of the substrate of the power semiconductor die, pressing element, and power module according to an embodiment is shown.

[0014] Figure 6 A side view of the housing and pressing element of the power module according to an embodiment is shown.

[0015] Figure 7A A side view of a power module according to an embodiment is shown.

[0016] Figure 7B A top view of a power module according to an embodiment is shown.

[0017] Figure 8A -8C shows a side view of an electronic component according to an embodiment. Detailed Implementation

[0018] This document describes a power module having a first type of pressing element and a second type of pressing element configured to press against a substrate of the power module when the power module is in a mounted state (e.g., mounted to a heat sink). The first type of pressing element and the second type of pressing element have different geometries (e.g., size, shape) and / or different material compositions. Forming the first type of pressing element and the second type of pressing element in this manner allows the pressing force exerted on the substrate to be more uniformly distributed between the first type of pressing element and the second type of pressing element, thereby potentially improving the uniformity of force on the heat sink and thus improving the uniformity of the thermal interface between the power module and the heat sink. A more uniform thermal interface between the power module and the heat sink can provide more efficient heat dissipation of the power module during operation. Therefore, a power module having a first type of pressing element and a second type of pressing element as disclosed herein can improve the performance (e.g., reliability, lifespan) of the power module.

[0019] An exemplary embodiment of a power module having a first type of pressing element and a second type of pressing element will now be described with reference to the accompanying drawings.

[0020] Figure 1A perspective view of a power module 100 according to an embodiment is shown. The power module 100 includes a power semiconductor die 120 attached to a substrate 110. The substrate 110 and the housing 130 of the power module 100 define an internal space 105 in which the power semiconductor die 120 is surrounded.

[0021] The housing 130 includes a first fastening side 130 FS1 and the first fastening side 130 FS1 The opposite second fastening side 130 FS2 First fastening side 130 FS1 Second fastening side 130 FS2 Each of these includes a means for mounting the power module 100 to, for example, a heat sink ( Figure 1 Fastening feature 132 (not shown). In this example, fastening feature 132 is respectively from the first fastening side 130. FS1 Second fastening side 130 FS2 Lugs that extend outward and each include a hole 133 to receive fasteners (e.g., screws, clips), but other types of fastening features 132 may also be considered.

[0022] The housing 130 also includes a first non-fastening side 130 NS1 and the first non-fastening side 130 NS1 The opposite second non-fastening side 130 NS2 First non-fastening side 130 NS1 Second non-fastening side 130 NS2 Each of them is connected to the first fastening side 130. FS1 Second fastening side 130 FS2 Intersecting. In this example, the first non-fastened side 130 NS1 Second non-fastening side 130 NS2 Basically perpendicular to the first fastening side 130 FS1 Second fastening side 130 FS2 Although this is not necessary. For reference and to aid in the subsequent description, the first fastening side 130 FS1 Second fastening side 130 FS2 Oriented along the y-direction, and the first non-fastened side 130. NFS1 Second non-fastening side 130 NFS2 Oriented along the x-direction, although this is not required.

[0023] According to an embodiment, the power module 100 includes a first fastening side 130. FS1 Second fastening side 130 FS2 The first type of pressing element 141 in each of them, and the first non-fastening side 130 NFS1 Second non-fastening side 130 NFS2The second type of pressing element 142 is located in each of them. Figure 1 In the example of the power module 100, the first type of pressing element 141 is along the first fastening side 130. FS1 Second fastening side 130 FS2 Each of them is oriented longitudinally (along the y-direction), and the second type of pressing element 142 is along the first non-fastening side 130. NFS1 Second non-fastening side 130 NFS2 Each of them is oriented longitudinally (along the x-direction), but other orientations of the first type of pressing element 141 and the second type of pressing element 142 may also be considered. Both the first type of pressing element 141 and the second type of pressing element 142 are configured to press against the substrate 110 in the mounted state of the power module 100 (e.g., when the power module 100 is mounted to a heat sink), as will be shown and described later in this disclosure.

[0024] According to the embodiments described herein, the second type of pressing element 142 has a different geometry and / or material composition than the first type of pressing element 141. Different geometries may include different sizes, shapes, etc. Different material compositions can lead to differences in properties between the first type of pressing element 141 and the second type of pressing element 142, such as different hardness, rigidity, elasticity, plasticity, etc. In some cases, the power module 100 forming the first type of pressing element 141 and the second type of pressing element 142 with different geometries and / or material compositions can compensate along the fastening side 130. FS1 / 130 FS2 130 on the non-fastened side NFS1 / 130 NFS2 The pressure difference, such as the difference caused by the plastic deformation of the housing 130, can thus allow for a more uniform distribution of the pressure on the substrate 110 between the first type of pressing element 141 and the second type of pressing element 142 when the power module 100 is in the mounted state. This uniform distribution of the pressure on the substrate 110 by the first type of pressing element 141 and the second type of pressing element 142 can further improve the thermal interface between the power module 100 and the heat sink by increasing the uniformity of the pressure between the substrate 110 and the heat sink, and by more uniformly distributing the thermal interface material (TIM) when the power module 100 is mounted to the heat sink. Therefore, including the first type of pressing element 141 and the second type of pressing element 142 in the power module 100 as described herein can improve the heat dissipation of the power module 100 during operation and can improve the performance of the power module 100 (e.g., reliability, lifespan).

[0025] The following describes further details of the power module 100 and its components, as well as the steps for forming the power module 100.

[0026] Figure 2 A side view of the power semiconductor die 120 and substrate 110 of the power module 100 according to an embodiment is shown.

[0027] Examples of substrate 110 include DCB (Direct Copper Bond) or AMB (Active Metal Brazing) substrates, printed circuit boards (PCBs), lead frames, or other substrates such as insulating metal substrates (IMS). Figure 2 In the example, substrate 110 includes an insulating layer 111 and metallization layers 112 and 113 on opposite sides of the insulating layer 111. Insulating layer 111 may include ceramic, a polymer such as polyimide, etc. Metallization layers 112 and 113 may each include copper, aluminum, an alloy, etc. Metallization layer 112 may include one or more traces and / or contact pads. Metallization layer 113 may be configured to interface with another component (e.g., a heat sink). Other arrangements of metallization layers 112 and / or 113, insulating layer 111, and other metallization and / or insulating layers of substrate 110 are also contemplated.

[0028] Figure 2 The power semiconductor die 120 shown is attached to the metallization layer 112 of the substrate 110. Attaching the power semiconductor die 120 to the substrate 110 can include soldering (e.g., diffusion soldering), brazing, adhesion, etc. The power semiconductor die 120 can include one or more devices, including transistors, diodes, resistors, capacitors, and / or other types of active or passive devices. In some examples, the power semiconductor die 120 is a vertical power semiconductor die (e.g., a vertical power transistor die). For a vertical power transistor die, the primary current flow path is between the front and back sides of the power semiconductor die 120 (along...). Figure 2 (in the z-direction). In one embodiment, the power semiconductor die 120 is a SiC transistor die, such as a SiC power MOSFET (metal-oxide-semiconductor field-effect transistor) die. The power semiconductor die 120 can be a Si power MOSFET die, a HEMT (high electron mobility transistor) die, an IGBT (insulated gate bipolar transistor) die, a JFET (junction field-effect transistor) die, etc.

[0029] Although not specifically shown, power module 100 may include one or more additional power semiconductor dies 120 attached to substrate 110. The power semiconductor dies 120 may all have similar or identical designs (e.g., device type, structure, material, size, etc.), or some or each of the power semiconductor dies 120 may have different designs. Various arrangements of the power semiconductor dies 120 on substrate 110 are conceivable. The power semiconductor dies 120 and / or their constituent devices may be arranged to form all or part of a power electronic circuit (e.g., a DC / AC inverter, DC / DC converter, AC / DC converter, AC / AC converter, multiphase inverter, H-bridge, motor driver, etc.). In some examples, the power electronic circuit including the power semiconductor die 120 is a half-bridge or full-bridge circuit.

[0030] Figure 3 A side view of the housing 130 of the power module 100 according to an embodiment is shown. The housing 130 may be a frame housing. The frame housing may include one or more pieces of metal, plastic, composite material, and / or other suitable material, constructed and arranged to surround the power semiconductor die 120. Although not specifically shown herein, the housing 130 may include a cover that further defines the internal space 105 of the power module 100. Alternatively, the power module 100 may include a cover attached to the housing opposite the substrate 110.

[0031] In some examples, the housing 130 is a molded housing formed from a molding compound. The molding compound is a plastic sealant typically formed from an organic resin such as epoxy resin. The plastic sealant may include fillers such as non-molten inorganic materials. A catalyst may be used to accelerate the curing reaction of the organic resin. Other materials (e.g., flame retardants, adhesion promoters, ion traps, stress relievers, colorants, etc.) may be added to the plastic sealant, depending on the application. The molding compound can be formed by injection molding, compression molding, film-assisted molding (FAM), reaction injection molding (RIM), resin transfer molding (RTM), blow molding, etc.

[0032] Figures 4A-4DA side view of a first-type pressing element 141 and a second-type pressing element 142 of a power module 100 according to an embodiment is shown. Each of the first-type pressing element 141 and the second-type pressing element 142 can be formed of any suitable material, such as polymeric materials (e.g., thermoplastics, elastomers), composite materials, etc. In some examples, the first-type pressing element 141 and / or the second-type pressing element 142 are formed of an adhesive or other bonding agent for mounting the housing 130 to a substrate. In some examples, the first-type pressing element 141 and / or the second-type pressing element 142 are formed as part of the housing 130, for example, molded from the same material as the rest of the housing 130 (e.g., a molding compound) or formed from a different material than the rest of the housing 130 (e.g., co-molded using a process such as two-component or multi-injection molding).

[0033] Figure 4A An example is shown where a first type of pressing element 141 and a second type of pressing element 142 have different heights in the z-direction. Specifically, the second type of pressing element 142 has a height h2 that is greater than the height h1 of the first type of pressing element 141. A second type of pressing element 142 with a height greater than that of the first type of pressing element 141 is formed (i.e., on the non-fastening side 130 of the housing 130). NS1 / 130 NS2 The power module 100 (with pressing element at the location) can achieve a uniform distribution of pressing force of the first type pressing element 141 and the second type pressing element 142 on the substrate 110 by increasing the pressing force of the second type pressing element 142 relative to the first type pressing element 141 when the power module 100 is in the installed state.

[0034] Figure 4BAn example is shown in which a first-type pressing element 141 comprises a first material and a second-type pressing element 142 comprises a second material different from the first material. In this example, the distribution of pressing force between the first-type pressing element 141 and the second-type pressing element 142 can be controlled by forming the first-type and second-type pressing elements 141 and 142 with materials that have different responses to forces applied when the power module 100 is mounted to the heat sink (e.g., compressive force between the housing 130 and the substrate 110). The second-type pressing element 142 may, for example, have different plasticity (e.g., a higher elastic limit) and / or different elasticity (e.g., a higher elastic modulus) than the first-type pressing element 141. When the power module 100 with this configuration of first-type pressing elements 141 and second-type pressing elements 142 is mounted, the degree to which the first-type pressing element 141 is compressed and elastically and / or plastically deformed may be greater than the degree to which a pressing element of similar size formed from the same material as the second-type pressing element 142 would occur. When the power module 100 is in the mounted state, this increased deformation of the first type of pressing element 141, achieved by forming it with a different material (e.g., less rigid) than the second type of pressing element 142, can increase the pressing force of the second type of pressing element 142 relative to the first type of pressing element 141. Therefore, selecting materials with specific properties and characteristics for each of the first type of pressing element 141 and the second type of pressing element 142 (e.g., a deformable material for the first type of pressing element 141 and a rigid material for the second type of pressing element 142) can promote a more uniform distribution of the pressing force of the first type of pressing element 141 and the second type of pressing element 142 on the substrate 110 when the power module 100 is in the mounted state, thereby potentially improving the thermal interface between the power module 100 and the heat sink.

[0035] Figure 4C and 4D An example is shown in which the second type of pressing element 142 has a different shape than the first type of pressing element 141. Figure 4C In the example, the first type of pressing element 141 gradually narrows toward the substrate 110, wherein in the x-direction (e.g., perpendicular to the substrate 110)... Figure 1 The first fastening side 130 of the housing 130 shown FS1 Second fastening side 130 FS2 It gradually narrows. Figure 4D In the example, each of the first type of pressing elements 141 includes multiple segments, each segment gradually narrowing toward the substrate 110, wherein in the y-direction (e.g., perpendicular to the first non-fastening side 130 of the housing 130) NS1 Second non-fastening side 130NFS2 The pressure element 141 of the first type may gradually narrow in multiple directions, for example, having a conical shape. Other shapes may be considered. Furthermore, although not specifically shown, the pressure element 142 of the second type may be shaped.

[0036] Compared to a pressing element having a shape similar to the second type of pressing element 142 (e.g., a pressing element that does not taper towards the substrate), such as Figure 4C and 4D The first type of pressing element 141, shown with a shape such as a cone, may respond differently to the force applied when the power module 100 is mounted to the heat sink. When the power module 100 is mounted to the heat sink, the first type of pressing element 141 with a shape such as a cone can be compressed and elastically and / or plastically deformed to a greater extent. This increased deformation of the first type of pressing element 141, which can be achieved by forming a first type of pressing element 141 with a shape different from that of the second type of pressing element 142, can increase the pressing force of the second type of pressing element 142 relative to the first type of pressing element 141 when the power module 100 is in the mounted state. Therefore, forming each of the first type of pressing element 141 and the second type of pressing element 142 with different shapes can promote a more uniform distribution of the pressing force of the first type of pressing element 141 and the second type of pressing element 142 on the substrate 110 when the power module 100 is in the mounted state, thereby potentially improving the thermal interface between the power module 100 and the heat sink.

[0037] Figure 5 A side view of a power semiconductor die 120, a first-type pressing element 141, a second-type pressing element 142, and a substrate 110 of a power module 100 according to an embodiment is shown. In this example, the first-type pressing element 141 and the second-type pressing element 142 are attached to the substrate 110 before the housing 130 is mounted to the power module 100. Although both the first-type pressing element 141 and the second-type pressing element 142 are shown attached to the substrate 110, it is conceivable that only the first-type pressing element 141 or only the second-type pressing element 142 may be attached to the substrate 110 before the housing 130 is mounted to the power module 100.

[0038] In some examples, the first type of pressing element 141 and / or the second type of pressing element 142 are glued or otherwise adhered to the substrate 110. As previously described, the first type of pressing element 141 and / or the second type of pressing element 142 may be formed of glue or other adhesive, which is applied to the substrate 110 and used to mount the housing 130 to the substrate 110.

[0039] Figure 6 A side view of a power module 100 according to an embodiment is shown, comprising a housing 130 and a first-type pressing element 141 and a second-type pressing element 142. In this example, the first-type pressing element 141 and / or the second-type pressing element 142 may be a separate body from the housing 130, which is attached to the housing 130 prior to mounting the housing 130 to the substrate 110 (e.g., by glue or other adhesive). In some examples, the first-type pressing element 141 and / or the second-type pressing element 142 may be formed by glue or other adhesive applied to the housing 130 and used to mount the housing 130 to the substrate 110.

[0040] Alternatively, the first type of pressing element 141 and / or the second type of pressing element 142 may be part of the housing 130. The first type of pressing element 141 and / or the second type of pressing element 142 may be molded, for example, from the same material (e.g., molding compound) used to form the remainder of the housing 130 as a feature of the housing 130. In other examples, the first type of pressing element 141 and / or the second type of pressing element 142 may be integrally formed with the housing 130 and comprise a different material than the housing 130, for example, by co-molding the housing 130 and the first type of pressing element 141 and / or the second type of pressing element 142 using a process such as two-component or multi-injection molding.

[0041] Figure 7A and 7B A view of the power module 100 after the housing 130 has been mounted onto the substrate 110 is shown. Figure 7A A side view of a power module 100 according to an embodiment is shown. Figure 7B A top view of a power module 100 according to an embodiment is shown.

[0042] The housing 130 is mounted to the substrate 110 such that the substrate 110 and the housing 130 define an internal space 105 in which the power semiconductor die 120 is enclosed. After the housing 130 is mounted to the substrate, the housing 130 is positioned on the first fastening side 130. FS1 Second fastening side 130 FS2 The first type of pressing element 141 is pressed against the substrate 110, and on the first non-fastening side 130 NFS1 Second non-fastening side 130 NFS2 The second type of pressing element 142 is pressed against the substrate 110.

[0043] The manner in which the housing 130 is mounted to the substrate 110 depends on the configuration of the first type of pressing element 141 and the second type of pressing element 142. For example, an example in which the first type of pressing element 141 and / or the second type of pressing element 142 are first attached to the substrate 110 before the housing 130 is mounted (e.g., as shown in...). Figure 5 As shown, mounting the housing 130 to the substrate 110 may include attaching (e.g., gluing, adhering) the housing 130 to a first type of pressing element 141 and / or a second type of pressing element 142.

[0044] For an example in which the first type of pressing element 141 and / or the second type of pressing element 142 is formed by an adhesive or other glue for attaching the housing 130 to the substrate 110, mounting the housing 130 to the substrate 110 may include applying an adhesive or other glue to the substrate 110 or the housing 130, and then placing the housing 130 on the substrate 110, wherein the adhesive or other glue forms the first type of pressing element 141 and / or the second type of pressing element 142 between the housing 130 and the substrate 110.

[0045] For example, where a first type of pressing element 141 and / or a second type of pressing element 142 are attached to the housing 130 before the housing 130 is mounted to the substrate 110 (e.g., ... Figure 6 (as shown), or examples in which the first type of pressing element 141 and / or the second type of pressing element 142 are part of the housing 130 or integrally formed with the housing 130 (e.g., as shown). Figure 6 As shown, mounting the housing 130 to the substrate 110 may include gluing or attaching a first-type pressing element 141 and / or a second-type pressing element 142 to the substrate 110.

[0046] Various combinations of these methods can be considered for mounting the housing 130 to the substrate 110.

[0047] Figures 8A-8C A side view of an electronic component 10 according to an embodiment is shown. The electronic component 10 includes a power module 100 mounted to a heat sink 200, wherein a thermal interface 150 is formed between the power module 100 and the heat sink 200. In some examples, the thermal interface 150 includes a thermal interface material (TIM). Figures 8A-8C (Not shown in the image). In this example, the power module 100 is mounted to the heat sink 200 using a fastener 300 (e.g., a screw or pin), which is inserted through a hole 133 in the fastening feature 132 and into the heat sink 200. However, other methods of mounting the power module 100 to the heat sink 200 may also be considered.

[0048] Figures 8A-8CA power module 100 in an installed state with a heat sink 200 is shown. The heat sink 200 can be cooled passively or actively. In some examples, the heat sink 200 is a solid metal block such as a substrate. The heat sink 200 may include one or more channels for carrying fluids. The heat sink 200 may include fins, ridges, or other surface features for enhancing thermal performance.

[0049] As previously described, the two types of pressing elements 141 and 142 are configured to press against the substrate 110 in the mounted state of the power module 100, by Figure 8A The bottom row of arrows indicates the pressure exerted by the pressing elements 141 and 142 on the substrate 110 by the force of the fasteners 300 placed on the housing 130 (specifically, on the fastening feature 132), as indicated by the arrows aligned with each fastener 300. For an example where the first type of pressing element 141 and / or the second type of pressing element 142 is a body separate from the housing 130, opposing forces are also generated between the first type of pressing element 141 and / or the second type of pressing element 142 and the housing 130, wherein the first type of pressing element 141 and / or the second type of pressing element 142 are configured to press against the housing 130 in the installed state, as shown in the image. Figure 8A The arrows in the middle and top of the text indicate this.

[0050] As previously mentioned, for example, refer to Figures 4A-4D As described, forming a first type of pressing element 141 and a second type of pressing element 142 with different geometries and / or different material compositions can be located in the power module 100 as follows: Figure 8A In the installation state shown, the pressing force is more evenly distributed on the substrate 110 between the first type of pressing element 141 and the second type of pressing element 142. Figure 8A (The bottom arrow in the text indicates that this could potentially improve the thermal interface 150 between the power module 100 and the heat sink 200.)

[0051] Figure 8B and 8C An example is shown in which the first type of pressing element 141 undergoes a certain amount of plastic deformation when the power module 100 is installed on the heat sink 200. Figure 8B and 8C Each shows a deformation region 141 d Although the plastic deformation of the first type of pressing element 141 is not limited to these areas. For example... Figure 8B and Figure 8CThe deliberate deformation of the first type of pressing element 141, as shown, can increase the pressing force of the second type of pressing element 142 relative to the first type of pressing element 141, and thus achieve a uniform distribution of the pressing force of the first type of pressing element 141 and the second type of pressing element 142 on the substrate 110 when the power module 100 is in the mounted state. Figure 8B An example is shown in which plastic deformation can be achieved by forming the first type of pressing element 141 from a material different from that of the second type of pressing element 142, for example, as shown in the reference. Figure 4B As described. Figure 8C An example is shown in which plastic deformation can be achieved by forming a first type of pressing element 141 having a shape different from that of the second type of pressing element, for example, as shown in the reference. Figure 4C and 4D As described.

[0052] Although this disclosure is not limited thereto, the examples numbered below illustrate one or more aspects of this disclosure.

[0053] Example 1. A power module includes: a substrate; a power semiconductor die attached to the substrate; a housing defining an internal space in which the power semiconductor die is enclosed, the housing including a first fastening side and a second fastening side opposite to the first fastening side, each of the first and second fastening sides including a fastening feature, the housing also including a first non-fastening side and a second non-fastening side opposite to the first non-fastening side, the first and second non-fastening sides intersecting the first and second fastening sides respectively; a first type of pressing element located at the first and second fastening sides; and a second type of pressing element located at the first and second non-fastening sides, wherein the two types of pressing elements are configured to press against the substrate in a mounted state of the power module, wherein the second type of pressing element has a different geometry and / or material composition than the first type of pressing element.

[0054] Example 2: The power module according to Example 1, wherein the second type of pressing element has a different height, different shape, different plasticity and / or different elasticity than the first type of pressing element.

[0055] Example 3: A power module according to Example 1 or 2, wherein a first type of pressing element comprises a first material, and wherein a second type of pressing element comprises a second material different from the first material.

[0056] Example 4: A power module according to any one of Examples 1 to 3, wherein the second type of pressing element has a greater height than the first type of pressing element.

[0057] Example 5: A power module according to any one of Examples 1 to 4, wherein the second type of pressing element has a different shape than the first type of pressing element.

[0058] Example 6: A power module according to any one of Examples 1 to 5, wherein the second type of pressing element has a higher elastic modulus than the first type of pressing element.

[0059] Example 7: A power module according to any one of Examples 1 to 6, wherein the second type of pressing element has a higher elastic limit than the first type of pressing element.

[0060] Example 8: A power module according to any one of Examples 1 to 7, wherein the pressing element of the first type gradually narrows toward the substrate.

[0061] Example 9: A power module according to any one of Examples 1 to 8, wherein the pressing element of the first type is a body separate from the housing and is also configured to press against the housing in the installed state of the power module.

[0062] Example 10: A power module according to Example 9, wherein a first type of pressing element is attached to the housing.

[0063] Example 11: A power module according to Example 9, wherein a pressing element of the first type is attached to a substrate.

[0064] Example 12: A power module according to any one of Examples 1 to 8, wherein the pressing element of the first type is part of the housing.

[0065] Example 13: A power module according to any one of Examples 1 to 8 or 12, wherein a first type of pressing element is integrally formed with the housing and comprises a material different from the housing.

[0066] Example 14: A power module according to any one of Examples 1 to 13, wherein the second type of pressing element is a body separate from the housing and is also configured to press against the housing in the installed state of the power module.

[0067] Example 15: A power module according to Example 14, wherein a second type of pressing element is attached to the housing.

[0068] Example 16: A power module according to Example 14, wherein a second type of pressing element is attached to a substrate.

[0069] Example 17: A power module according to any one of Examples 1 to 13, wherein the second type of pressing element is part of the housing.

[0070] Example 18: A power module according to any one of Examples 1 to 13 or 17, wherein the second type of pressing element is integrally formed with the housing and comprises a material different from the housing.

[0071] Example 19, a method comprising: attaching a power semiconductor die to a substrate; providing a housing including a first fastening side, a second fastening side opposite the first fastening side, a first non-fastening side, and a second non-fastening side opposite the first non-fastening side, wherein each of the first fastening side and the second fastening side includes a fastening feature, wherein each of the first non-fastening side and the second non-fastening side intersects with the first fastening side and the second fastening side; providing a first type of pressing element and a second type of pressing element, the second type of pressing element having a different geometry and / or material composition than the first type of pressing element; and mounting the housing to the substrate such that the substrate and the housing define an internal space in which the power semiconductor die is enclosed, the housing pressing the first type of pressing element against the substrate at the first fastening side and the second fastening side, and the housing pressing the second type of pressing element against the substrate at the first non-fastening side and the second non-fastening side.

[0072] Example 20: The method according to Example 19, wherein a first type of pressing element comprises a first material, and wherein a second type of pressing element comprises a second material different from the first material.

[0073] Example 21: The method according to Example 19 or 20, wherein the second type of pressing element has a greater height than the first type of pressing element.

[0074] Example 22: The method according to any one of Examples 19 to 21, wherein the second type of pressing element has a higher elastic modulus than the first type of pressing element.

[0075] Example 23: The method according to any one of Examples 19 to 22, wherein the second type of pressing element has a higher elastic limit than the first type of pressing element.

[0076] Example 24. An electronic component comprising: a power module mounted to a heat sink, the power module including: a substrate; a power semiconductor die attached to the substrate; a housing defining an internal space in which the power semiconductor die is enclosed, the housing including a first fastening side and a second fastening side opposite to the first fastening side, each of the first and second fastening sides including a fastening feature, the housing also including a first non-fastening side and a second non-fastening side opposite to the first non-fastening side, the first and second non-fastening sides intersecting the first and second fastening sides respectively; a first type of pressing element located at the first and second fastening sides; and a second type of pressing element located at the first and second non-fastening sides, wherein both types of pressing elements press against the substrate, wherein the second type of pressing element has a different geometry and / or material composition than the first type of pressing element.

[0077] Terms such as "first" and "second" are used to describe various elements, regions, sections, etc., and are not intended to be limiting. Throughout the specification, the same term refers to the same element.

[0078] As used herein, the terms “having,” “containing,” “including,” “comprising,” etc., are open-ended terms indicating the presence of the said element or feature, but do not exclude additional elements or features. Unless the context clearly indicates otherwise, the articles “a,” “an,” and “the” are intended to include both plural and singular forms.

[0079] Unless otherwise expressly stated, the expression “and / or” shall be interpreted to include all possible combinations and separations. For example, the expression “A and / or B” shall be interpreted to mean only A, only B, or both A and B. Unless otherwise expressly stated, the expression “at least one of” shall be interpreted in the same manner as “and / or”. For example, the expression “at least one of A and B” shall be interpreted to mean only A, only B, or both A and B.

[0080] It should be understood that, unless otherwise expressly stated, the features of the various embodiments described herein can be combined with each other.

[0081] Although specific embodiments have been shown and described herein, those skilled in the art will understand that various alternatives and / or equivalent embodiments may be substituted for the shown and described specific embodiments without departing from the scope of the invention. This application is intended to cover any modifications or variations of the specific embodiments discussed herein. Therefore, the invention is intended to be limited only by the claims and their equivalents.

Claims

1. A power module, comprising: Substrate; A power semiconductor die, the power semiconductor die being attached to the substrate; The housing, the substrate, and the housing define an internal space in which the power semiconductor die is surrounded, the housing including a first fastening side and a second fastening side opposite to the first fastening side, each of the first fastening side and the second fastening side including a fastening feature, the housing also including a first non-fastening side and a second non-fastening side opposite to the first non-fastening side, the first non-fastening side and the second non-fastening side each intersecting the first fastening side and the second fastening side; A first type of pressing element, wherein the first type of pressing element is located at the first fastening side and the second fastening side; as well as The second type of pressing element is located at both the first non-fastening side and the second non-fastening side. Two types of pressing elements are configured to press against the substrate in the mounted state of the power module, and The second type of pressing element has a different geometry and / or material composition than the first type of pressing element.

2. The power module according to claim 1, wherein, The second type of pressing element has a different height, different shape, different plasticity and / or different elasticity than the first type of pressing element.

3. The power module according to claim 1, in, The first type of pressing element includes a first material, and The second type of pressing element comprises a second material that is different from the first material.

4. The power module according to claim 1, wherein, The second type of pressing element has a greater height than the first type of pressing element.

5. The power module according to claim 1, wherein, The second type of pressing element has a different shape than the first type of pressing element.

6. The power module according to claim 1, wherein, The second type of pressing element has a higher elastic modulus than the first type of pressing element.

7. The power module according to claim 1, wherein, The second type of pressing element has a higher elastic limit than the first type of pressing element.

8. The power module according to claim 1, wherein, The first type of pressing element gradually narrows toward the substrate.

9. The power module according to claim 1, wherein, The first type of pressing element is a body separate from the housing and is also configured to press against the housing in the installed state of the power module.

10. The power module according to claim 9, wherein, The first type of pressing element is attached to the housing.

11. The power module according to claim 9, wherein, The first type of pressing element is attached to the substrate.

12. The power module according to claim 1, wherein, The first type of pressing element is part of the housing.

13. The power module according to claim 1, wherein, The first type of pressing element is integrally formed with the housing and comprises a material different from the housing.

14. The power module according to claim 1, wherein, The second type of pressing element is a body separate from the housing and is also configured to press against the housing in the installed state of the power module.

15. The power module according to claim 14, wherein, The second type of pressing element is attached to the housing.

16. The power module according to claim 14, wherein, The second type of pressing element is attached to the substrate.

17. The power module according to claim 1, wherein, The second type of pressing element is part of the housing.

18. The power module according to claim 1, wherein, The second type of pressing element is integrally formed with the housing and comprises a material different from that of the housing.

19. A method comprising: Attaching power semiconductor dies to a substrate; A housing is provided, the housing including a first fastening side, a second fastening side opposite to the first fastening side, a first non-fastening side, and a second non-fastening side opposite to the first non-fastening side, wherein each of the first fastening side and the second fastening side includes a fastening feature, wherein each of the first non-fastening side and the second non-fastening side intersects with the first fastening side and the second fastening side; Provides a first type of pressing element and a second type of pressing element, the second type of pressing element having a different geometry and / or material composition than the first type of pressing element; and The housing is mounted to the substrate such that the substrate and the housing define an internal space in which the power semiconductor die is surrounded, the housing pressing a first type of pressing element against the substrate at the first fastening side and the second fastening side, and the housing pressing a second type of pressing element against the substrate at the first unfastening side and the second unfastening side.

20. The method according to claim 19, in, The first type of pressing element includes a first material, and The second type of pressing element comprises a second material that is different from the first material.

21. The method according to claim 19, wherein, The second type of pressing element has a greater height than the first type of pressing element.

22. The method according to claim 19, wherein, The second type of pressing element has a higher elastic modulus than the first type of pressing element.

23. The method according to claim 19, wherein, The second type of pressing element has a higher elastic limit than the first type of pressing element.

24. An electronic component, comprising: Power modules installed on the heat sink, The power module includes: Substrate; A power semiconductor die, the power semiconductor die being attached to the substrate; The housing, the substrate, and the housing define an internal space in which the power semiconductor die is surrounded, the housing including a first fastening side and a second fastening side opposite to the first fastening side, each of the first fastening side and the second fastening side including a fastening feature, the housing also including a first non-fastening side and a second non-fastening side opposite to the first non-fastening side, the first non-fastening side and the second non-fastening side each intersecting the first fastening side and the second fastening side; A first type of pressing element, wherein the first type of pressing element is located at the first fastening side and the second fastening side; and The second type of pressing element is located at both the first non-fastening side and the second non-fastening side. In this configuration, two types of pressing elements are pressed against the substrate. The second type of pressing element has a different geometry and / or material composition than the first type of pressing element.

Images