A coplanarity regulation control method for packaging
By employing real-time detection and dynamic control methods, combined with a multi-factor coupling model, the problems of lag and insufficient precision in packaging coplanarity control were solved, achieving high-precision coplanarity control and improving packaging quality and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANJING RUIXINFENG ELECTRONIC TECH CO LTD
- Filing Date
- 2026-03-16
- Publication Date
- 2026-05-15
AI Technical Summary
Existing methods for controlling the coplanarity of packaging suffer from control lag, insufficient precision, and low efficiency, and cannot cope with the interference of multiple factors in the packaging process, resulting in poor packaging quality for fine-pitch and high-density packaging.
By employing real-time detection, quantitative analysis, and dynamic control methods, the coplanarity parameters of components are collected in real time through the control unit. Combined with the initial position coordinates and a multi-factor coupling model, the packaging temperature and pressing pressure are dynamically adjusted to achieve precise control of coplanarity deviation.
It improves the accuracy of coplanarity control, reduces component losses, increases packaging yield and production efficiency, and meets the requirements of fine-pitch and high-density packaging.
Smart Images
Figure CN121843561B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of regulation and control technology, specifically relating to a coplanarity regulation and control method for packaging. Background Technology
[0002] In the field of surface mount technology (SMT) and precision packaging, the coplanarity of components such as QFP, BGA, and QFN is a core indicator that determines the packaging quality and reliability. It directly affects the soldering yield, electrical interconnect stability, and long-term service performance of components. According to standards such as JEDEC JESD22-B108 and GJB3243, the coplanarity requirement of pins for fine-pitch devices with lead pitch ≤0.65mm should not exceed 0.1mm. Even a slight height deviation can cause problems such as poor soldering, tombstoning, and bridging, ultimately leading to the scrapping of the entire board.
[0003] Current methods for controlling the coplanarity of packaging mainly rely on a passive control mode of post-detection correction, which has several drawbacks. Firstly, current methods often use 3D AOI and laser triangulation to detect coplanarity, followed by manual adjustment or simple mechanical correction. This lacks a comprehensive control system encompassing detection, analysis, and real-time control, resulting in significant lag and an inability to handle dynamic disturbances such as thermal stress during packaging. Secondly, current methods only correct based on a single height difference, failing to consider the coupled effects of substrate warping and CTE mismatch during packaging. This leads to substantial fluctuations in coplanarity after correction, making it difficult to meet the stringent requirements of fine-pitch and high-density packaging. Furthermore, existing correction processes require repeated shutdowns for detection and adjustment, significantly reducing the continuous operating efficiency of the packaging production line and easily causing contact damage to component pins.
[0004] Therefore, there is an urgent need for a control method that can achieve real-time detection, quantitative analysis, and dynamic regulation, accurately couple multiple influencing factors in the packaging process, solve the current problems of lag, insufficient accuracy, and low efficiency, and meet the coplanarity requirements of precision packaging. Summary of the Invention
[0005] The purpose of this section is to outline some aspects of the embodiments of the present invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section, as well as in the abstract and title of the present application, to avoid obscuring the purpose of this section, the abstract and title of the invention. Such simplifications or omissions shall not be used to limit the scope of the present invention.
[0006] In view of the aforementioned existing problems, the present invention is proposed.
[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution:
[0008] In a first aspect, the present invention provides a method for coplanarity control in packaging, comprising:
[0009] The system performs pre-packaging processing on the component to be packaged and acquires the initial position coordinates of the pins of the component to be packaged, and transmits the initial position coordinates of the pins of the component to be packaged to the control unit.
[0010] The packaging process for the components to be packaged is initiated, and the control unit monitors the coplanarity-related parameters of the components in real time.
[0011] The control unit performs quantitative calculations of coplanarity deviation based on the initial position coordinates and coplanarity-related parameters;
[0012] The control parameters are determined based on the height deviation of a single pin, the spatial weighting coefficient of a single pin, and the overall coplanarity deviation.
[0013] Dynamic control is achieved by adjusting the pressing pressure and the packaging temperature according to the control parameters.
[0014] In a second aspect, the present invention provides a computer device, comprising:
[0015] One or more processors;
[0016] The memory stores operable instructions that, when executed by the one or more processors, cause the one or more processors to perform operations, including the flow of the coplanarity control method for encapsulation as described above.
[0017] Thirdly, the present invention provides a computer-readable medium for storing software, the software including instructions executable by one or more computers, the instructions causing the one or more computers to perform operations, the operations including the flow of the coplanarity control method for encapsulation as described above.
[0018] The beneficial effects of the present invention are as follows, compared with the prior art:
[0019] This invention significantly improves the accuracy of component coplanarity control: through a control system and a multi-factor coupled quantitative model, the overall coplanarity deviation of the packaged component is controlled within a preset threshold, thus improving control accuracy; the entire component packaging process continuously collects parameters, calculates deviations, and adjusts control parameters, enabling real-time response to dynamic interference factors such as thermal stress deformation, ensuring that coplanarity remains within acceptable limits during packaging; it eliminates the need for repeated shutdowns for testing and manual adjustments, achieving automated control and significantly improving the continuous operation efficiency of component packaging; the use of non-contact 3D automatic optical inspection (3D AOI) equipment avoids scratching and squeezing damage to pins, reduces component loss rate, and improves component packaging yield. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:
[0021] Figure 1 This is an overall flowchart of the coplanarity control method for encapsulation described in this invention;
[0022] Figure 2 This is a flowchart of the method for quantifying coplanarity deviation based on initial position coordinates and coplanarity-related parameters of the control unit described in this invention. Detailed Implementation
[0023] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0024] Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without inventive effort should fall within the scope of protection of this invention.
[0025] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.
[0026] According to an embodiment of the present invention, in combination Figure 1 The flowchart shown illustrates a coplanarity control method for encapsulation according to the present invention, comprising:
[0027] S1. Perform pre-packaging processing on the component to be packaged and acquire the initial position coordinates of the component's pins, then transmit the initial position coordinates of the component's pins to the control unit. Note that the following should be noted in this step:
[0028] In a preferred embodiment, the method for pre-packaging of components to be packaged specifically includes:
[0029] Select the components to be packaged and clean their surfaces, that is, remove oil, oxide layer and impurities;
[0030] The method for acquiring the initial position coordinates of the component to be packaged specifically includes:
[0031] The pre-processed components to be packaged are sent to the packaging station. Before starting the packaging process of the components to be packaged, a 3D automatic optical inspection (3D AOI) device is used to scan the components to be packaged to collect and record the initial position coordinates of the pins of the components to be packaged. , , ),in For the first The x-coordinate of the initial position coordinates of each pin. For the first The ordinate of the initial position coordinates of each pin. For the first The vertical coordinates of the initial position coordinates of each pin. =1,2,..., , Given the total number of pins, the initial position coordinates are collected, and the collected initial position coordinates of the pins are transmitted to the control unit.
[0032] In this embodiment, the component to be packaged includes a chip and a substrate. The chip is located on top of the substrate, and one end of the chip's pins is vertically attached to the substrate pads. A 3D Automated Optical Inspection (3D AOI) device connected to a control unit is set around the packaging station. By marking a color point at the center point outside the pins of the component to be packaged, the 3D AOI device scans the color point to collect its coordinates as the position coordinates of the pins of the component to be packaged. The control unit can be a PLC or an industrial computer.
[0033] For example, the color of the mark at the center point outside the pin of the component to be packaged can be red or white.
[0034] S2. Initiate the packaging process for the component to be packaged, and the control unit monitors the coplanarity-related parameters of the component in real time. The key process parameters and the real-time position coordinates of the pins during the packaging process constitute the coplanarity-related parameters of the component. The key process parameters include the packaging temperature and pressing pressure collected by the temperature sensor and pressure sensor, respectively. It should be noted that in this step:
[0035] In a preferred embodiment, the packaging process of the component to be packaged is initiated. Throughout the packaging process, the real-time position coordinates of the pins are acquired in real time by a 3D AOI device and transmitted to the control unit. Simultaneously, key process parameters during the packaging process are acquired in real time by temperature and pressure sensors connected to the control unit and transmitted to the control unit.
[0036] In this embodiment, the packaging process for the components to be packaged includes heating and melting, and pressing. Heating and melting involves using a temperature control module to heat the substrate at a corresponding heating temperature until the solder paste uniformly coated on the pins to be soldered is completely melted into a liquid state. This allows the liquid solder paste to fill the gap between the pins and the substrate pads, achieving a preliminary connection between the two. At the same time, temperature control prevents excessive oxidation of the solder paste or damage to the chip and substrate due to high temperature. Pressing includes applying a preset pressing pressure through a pressure control module during heating and melting to firmly press the chip and pins onto the substrate. This ensures that the pins are in full contact with the solder paste, ensuring tightness and uniformity of the soldering, while fixing the position of the chip and pins. After the solder paste cools and solidifies, a stable electrical connection and mechanical fixation are formed, completing an important stage of packaging.
[0037] Furthermore, before starting the packaging process for the components to be packaged, solder coating must be completed. Solder coating involves uniformly applying a layer of solder paste to the substrate pads, where the pins need to be soldered. The purpose is to prepare for subsequent heating and melting, so that the pins can be firmly bonded to the substrate pads, while removing the oxide layer on the soldering surface to ensure the conductivity of the solder.
[0038] Furthermore, the temperature regulation module uses a temperature-controlled heating plate connected to the control unit. The temperature-controlled heating plate is directly embedded in the top wall of the bearing surface of the packaging station. A substrate is set on the bearing surface of the packaging station. The probe of the temperature sensor is attached to the temperature-controlled heating plate to collect the packaging temperature in real time. The pressure regulation module includes an electronic pressure regulating valve, a cylinder and an air source. The cylinder and the air source are connected by a pipeline. The output end of the cylinder is connected to the packaging head. An electronic pressure regulating valve connected to the control unit is set on the pipeline. The pressure sensor is integrated inside the packaging head to collect the pressing pressure in real time. The packaging head is used to press the pins onto the substrate by applying the pressing pressure.
[0039] For example, the main components of solder paste are solder powder and flux.
[0040] S3. The control unit performs quantitative calculations of coplanarity deviation based on the initial position coordinates and coplanarity-related parameters. For example... Figure 2 As shown, the following points need to be explained in this step:
[0041] In a preferred embodiment, the method for quantifying the coplanarity deviation based on the initial position coordinates and coplanarity-related parameters of the control unit specifically includes:
[0042] Based on the initial position coordinates and coplanarity-related parameters, the control unit calculates three quantification indicators to accurately quantify the coplanarity deviation, as shown below:
[0043] S3.1 Perform quantization calculation of the height deviation of a single pin. Note that the following points should be noted in this step:
[0044] In a preferred embodiment, the mathematical expression for the quantization calculation of the height deviation of a single pin is:
[0045] ;
[0046] In this mathematical expression, For the first Each pin in Altitude deviation at time A positive value indicates that the pin is above the reference height, and a negative value indicates that it is below the reference height; For the first Each pin in The vertical coordinate of the real-time position at time t, i.e., the first... Each pin in Real-time altitude at any given moment; For the first The vertical coordinate of the initial position coordinate of the nth pin, i.e., the first pin... The reference height of each pin; For the first Each pin in The thermal stress-induced deformation correction amount at any given time is used to subtract the effect of the pin's own thermal deformation on the height deviation. , for The packaging temperature at any given time; The standard room temperature is 25℃ by default. For the first The pin length of each pin; The coefficient of thermal expansion of the chip; The coefficient of thermal expansion of the substrate; In order to be in Time of the first The angle between the line connecting each pin to the geometric center point of the component and the horizontal plane, and the x-coordinate of the geometric center point of the component. for , For the first Each pin in The x-coordinate of the real-time position coordinates at any given moment, and the y-coordinate of the geometric center point of the component. for , For the first Each pin in The ordinate of the real-time position coordinates at any given moment, and the vertical coordinate of the geometric center point of the component. for , , This is used to correct the effect of the pin tilt angle on thermal deformation. The smaller the angle, the greater the impact of thermal deformation on height deviation, and the more accurate the correction.
[0047] In this embodiment, Use the first Each pin in The vertical coordinate of the real-time position at time t minus the first value used as the reference height. The vertical coordinate of the initial position coordinate of the first pin and the first pin Each pin in The deformation correction amount induced by thermal stress at time is obtained to obtain the first Each pin in The height deviation at any time is used to deduct the influence of the pin's own thermal deformation on the height deviation, so as to truly reflect the height deviation of the pin itself, rather than the interference caused by the height deviation and thermal deformation, and provide an accurate basis for subsequent adjustment. By comprehensively considering four key influencing factors—temperature difference, pin length, coefficient of thermal expansion, and pin tilt angle—all key variables of thermal stress-induced deformation are covered, avoiding inaccurate deformation correction caused by calculation of a single factor.
[0048] S3.2, Perform quantization calculation of the space weighting coefficient for a single pin. Note that the following points should be noted in this step:
[0049] In a preferred embodiment, the mathematical expression for the quantization calculation of the space weighting coefficient of a single pin is:
[0050] ;
[0051] In this mathematical expression, For the first Each pin in Spatial weighting coefficients at any given time; For the first Each pin in The x-coordinate of the real-time location coordinates at any given moment; For the first Each pin in The ordinate of the real-time location coordinates at any given moment; The x-coordinate of the geometric center point of the component; The maximum value among the initial positions of all pins and the geometric center point of the component in the horizontal plane direction is the first pin in the horizontal plane direction. The initial position of each pin and the distance between the geometric center point of the component .
[0052] In this embodiment, in the mathematical expression for the quantization calculation of the spatial weighting coefficient of a single pin, Essentially , For the first in the horizontal direction The distance between the real-time position of each pin and the geometric center point of the component; the smaller this distance, the greater the impact on coplanarity. Its function is to achieve the standardization of molecules; the 1 in the molecule realizes the first position in the horizontal direction. The greater the impact of the real-time position of each pin on coplanarity, the more significant the effect on coplanarity. The larger the value, the more it distinguishes the magnitude of the influence of pins in different spatial locations on the overall coplanarity; the 1 in the denominator is used to weaken the interference of extreme values.
[0053] S3.3, Perform quantitative calculations of the overall coplanarity deviation. Note that the following points should be noted in this step:
[0054] In a preferred embodiment, the mathematical expression for the quantitative calculation of the overall coplanarity deviation is:
[0055] ;
[0056] In this mathematical expression, for The overall coplanarity deviation of components at any given time is calculated using a weighted root mean square, which better reflects the overall deviation distribution of all pins and provides more accurate quantification. For the first Each pin in Spatial weighting coefficients at any given time; For the first Each pin in Altitude deviation at any moment; For the first Each pin in The weighted squared deviation at time t represents the contribution of the pins at different spatial locations to the overall coplanarity, specifically in the horizontal direction. The smaller the distance between the real-time position of each pin and the geometric center point of the component, the greater the impact on coplanarity, which is consistent with the actual coplanarity influence law of packaging. For all solder balls in The sum of the spatial weighting coefficients at each time step is used for standardization.
[0057] In this embodiment, the mathematical expression for the quantitative calculation of the overall coplanarity deviation is as follows: The purpose of using squaring is to amplify the impact of the difference between deviations, ensuring that all height deviations can be effectively quantified, thus meeting the need for accurate quantification of height deviations.
[0058] S4. The control unit determines the control parameters based on the height deviation of a single pin, the spatial weighting coefficient of a single pin, and the overall coplanarity deviation. It should be noted that in this step:
[0059] In a preferred embodiment, the method for determining the control parameters based on the height deviation of a single pin, the spatial weighting coefficient of a single pin, and the overall coplanarity deviation specifically includes:
[0060] Preset coplanarity allowable deviation threshold ,Will Overall coplanarity deviation of time components Permissible deviation threshold for coplanarity Compare and combine the first Each pin in Thermal stress-induced deformation correction at time The decision-making and control parameters are as follows:
[0061] when ≤ When the coplanarity of the components is determined to meet the requirements, no adjustment is needed. The key process parameters in the current packaging process are maintained, and the process returns to S2 to continue execution from the time when the control unit detects the coplanarity-related parameters of the components in real time.
[0062] when > When the coplanarity of components is deemed unsuitable, the adjustment amounts of the pressing pressure and packaging temperature, which are used as control parameters, are calculated. The mathematical expressions for these control parameters include:
[0063] The mathematical expression for the adjustment amount of the pressing pressure is:
[0064] ;
[0065] In this mathematical expression, for The amount of adjustment of the pressing pressure at any given time. A positive value indicates increased pressing pressure. A negative value indicates a reduction in pressing pressure; This refers to the initial compression pressure during the packaging process; This is the allowable deviation threshold for coplanarity; for The overall coplanarity deviation of components at any given moment; For all pins in The average value of the spatial weighting coefficients at time points. , This reflects the overall impact of pin spatial distribution on pressure control. The smaller the distance between the pin's real-time position and the component's geometric center point, the higher the proportion of pins. The larger; This represents the total number of pins. for The average height deviation of all pins at any given time. Its absolute value and The ratio is used to quantify the severity of the overall height deviation. The greater the severity of the overall height deviation, the greater the compensation force, thus avoiding insufficient control. The direction determination factor for the pressing pressure. , For a sign function, when A value greater than 0 indicates that the overall pin count is too high. =1 indicates that the pressing pressure needs to be increased to suppress the pin height; when If this happens, it indicates that the overall pin count is too low. =-1 means that the pressing pressure needs to be reduced to avoid excessive pressing pressure causing the pins to be lower, thus enabling automatic adaptation of the pressure adjustment direction;
[0066] The mathematical expression for the adjustment amount of the packaging temperature is:
[0067] ;
[0068] In this mathematical expression, for The amount of time required to adjust the packaging temperature; For all pins in The average value of the thermal stress-induced deformation correction at time t. ; The average length of all pins, ; The coefficient of thermal expansion of the chip; The coefficient of thermal expansion of the substrate; This is the weighted average of the thermal expansion coefficients of the chip and the substrate. ; The optimal packaging temperature; This is the determining factor for temperature direction. ,when A value greater than 0 indicates excessive thermal deformation and excessively high encapsulation temperature. =-1 indicates that the package temperature should be lowered; when When k_T = 0, it indicates insufficient thermal deformation and that the packaging temperature is too low. When k_T = 1, it indicates that the packaging temperature should be increased. This is a temperature deviation compensation item, which is determined by both the temperature deviation and the coefficient of thermal expansion. The larger the temperature deviation and the more severe the mismatch in the coefficient of thermal expansion, the greater the compensation force, thus avoiding sudden changes in the packaging temperature. This is a coplanarity deviation compensation term, used to correlate coplanarity deviation with temperature control coplanarity. The larger the deviation, the greater the compensation, ensuring that thermal deformation correction and coplanarity control are synchronized.
[0069] In this embodiment, the permissible deviation threshold for coplanarity According to packaging specifications and industry standards, such as GJB3243-98 Surface Mount Requirements for Electronic Components, the coplanarity error of components should be ≤0.1mm. Therefore, the permissible deviation threshold for coplanarity is... The initial compression pressure during the encapsulation process is 0.1mm; the initial pressure depends on the design requirements of the encapsulation. In this configuration, the substrate is in direct contact with the substrate pads and pins. Therefore, the impact of thermal deformation on coplanarity is significantly greater than that on the chip. Since the chip is encapsulated by packaging material, the heat loss transmitted to the pins due to thermal deformation is even greater. Thus, the coefficient of thermal expansion of the substrate is carefully determined. The weight is 0.6 and the coefficient of thermal expansion of the chip is... The weight is 0.4; The packaging temperature setting is determined according to the packaging specifications and industry standards, such as IPC / JEDEC J-STD-020. .
[0070] Furthermore, in the mathematical expression for the adjustment amount of the pressing pressure, The initial compression pressure during the encapsulation process Based on, according to Overall coplanarity deviation of time components Permissible deviation threshold for coplanarity The deviation ratio is used to determine the basic adjustment range, ensuring that the adjustment amount of the pressing pressure is positively correlated with the severity of the deviation, thus avoiding blind adjustment; This reflects the influence of the spatial distribution of the pins on the bonding pressure. Used to correct the interference of the number of pins on compensation, avoiding over- or under-adjustment caused by too many or too few pins, and suitable for package scenarios with different pin counts; The severity of the overall height deviation is quantified. The greater the severity of the overall height deviation, the greater the compensation. This avoids both insufficient regulation and excessive compensation.
[0071] Furthermore, in the mathematical expression for the adjustment amount of the packaging temperature, With all pins in Average value of thermal stress-induced deformation correction at time t. As a key point, combined with the average length of all pins and the coefficient of thermal expansion of the chip Coefficient of thermal expansion with substrate The sum of these factors determines the basic range of temperature adjustment, ensuring that the adjustment amount precisely matches the degree of thermal deformation, thus correcting the impact of thermal stress on the coplanarity of components from the source.
[0072] S5. The control unit dynamically adjusts the pressure and packaging temperature based on the adjustment amounts of the control parameters. It should be noted that the following points apply to this step:
[0073] In a preferred embodiment, the method for dynamic control of the control unit based on the adjustment amount of the pressing pressure and the adjustment amount of the packaging temperature of the control parameters specifically includes:
[0074] The control unit adjusts the pressing pressure and encapsulation temperature in real time through the pressure regulation module and temperature regulation module, respectively, based on the adjustment amounts of the pressing pressure and encapsulation temperature control parameters. The adjusted pressing pressure is... The adjusted packaging temperature is Simultaneously, the process involves real-time acquisition of coplanarity-related parameters after adjustment using 3D AOI equipment. This is repeated as the control unit performs quantitative calculations of coplanarity deviation based on the initial position coordinates and coplanarity-related parameters, and then dynamically adjusts the control unit according to the adjustment amounts of the pressing pressure and packaging temperature based on the control parameters, until… ≤ This completes a dynamic adjustment of coplanarity; during the component packaging process, the process of continuously repeating from the control unit to the control unit to dynamically adjust the coplanarity-related parameters of the component in real time, and the adjustment of the pressing pressure and packaging temperature of the control parameters, thereby achieving dynamic real-time adjustment of the overall coplanarity.
[0075] In this embodiment, the control unit adjusts the packaging temperature to a specific value by controlling the temperature-controlled heating plate, which functions as a temperature regulation module. The control unit adjusts the pressing pressure to a certain level by controlling the electronic pressure regulating valve of the pressure regulating module. .
[0076] This invention constructs a control system encompassing real-time detection, quantitative modeling, and dynamic regulation, achieving real-time control of coplanarity throughout the entire packaging process. It establishes a multi-factor coupled quantitative control model, introducing thermal stress-induced deformation correction, and comprehensively considers the influence of key factors such as packaging temperature, pressing pressure, and thermal expansion coefficient mismatch on coplanarity, thereby improving control accuracy, simplifying the control method, and enhancing control efficiency. In summary, the purpose of this invention is to overcome the shortcomings of existing technologies in packaging coplanarity control, including lag, insufficient accuracy, and low efficiency, and to provide a coplanarity control method for packaging. By constructing a system of real-time detection, quantitative modeling, and dynamic regulation, it accurately quantifies coplanarity deviations and influencing factors during the packaging process, achieving real-time and accurate control of coplanarity, thereby improving packaging quality and production efficiency.
[0077] Other aspects disclosed in the embodiments of the present invention also provide a computer device including one or more processors and a memory.
[0078] The memory is used to store operable instructions that, when executed by the one or more processors, cause the one or more processors to perform operations, including the flow of the coplanarity control method for encapsulation described in the foregoing embodiments, particularly... Figure 1 The flowchart of the method is shown.
[0079] Other aspects disclosed in the embodiments of the present invention also provide a computer-readable medium for storing software including instructions executable by one or more computers, which, upon execution, cause the one or more computers to perform operations including the flow of the coplanarity control method for encapsulation described in the foregoing embodiments, particularly... Figure 1 The flowchart of the method is shown.
[0080] It should be recognized that embodiments of the present invention may be implemented or carried out by computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer-readable storage medium.
[0081] The method can be implemented using standard programming techniques, including a non-transitory computer-readable storage medium configured with a computer program in the computer program, wherein the storage medium is configured such that the computer operates in a specific and predefined manner.
[0082] Each program can be implemented in a high-level procedural or object-oriented programming language to communicate with the computer system; however, if required, the program can be implemented in assembly or machine language.
[0083] In any case, the language can be either compiled or interpreted.
[0084] Furthermore, for this purpose, the program can run on programmed application-specific integrated circuits.
[0085] The processes described herein (or variations and / or combinations thereof) can be executed under the control of one or more computer systems configured with executable instructions, and can be implemented by hardware or a combination thereof as code (e.g., executable instructions, one or more computer programs, or one or more applications) that commonly executes on one or more processors. The computer program includes a plurality of instructions executable by one or more processors.
[0086] Furthermore, the method can be implemented in any suitable computing platform, including but not limited to personal computers, minicomputers, mainframes, workstations, networked or distributed computing environments, standalone or integrated computer platforms, or in communication with charged particle tools or other imaging devices.
[0087] Various aspects of the present invention can be implemented in machine-readable code stored on a non-transitory storage medium or device, whether portable or integrated into a computing platform, such as a hard disk, optical read and / or write storage medium, RAM, ROM, etc., such that it can be read by a programmable computer, and when the storage medium or device is read by the computer, it can be used to configure and operate the computer to perform the processes described herein.
[0088] Furthermore, machine-readable code, or parts thereof, can be transmitted via wired or wireless networks.
[0089] When such media includes instructions or programs that combine with a microprocessor or other data processor to implement the steps described above, the invention described herein includes these and other different types of non-transitory computer-readable storage media.
[0090] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.
Claims
1. A method for coplanarity control in packaging, characterized in that, include: The system performs pre-packaging processing on the component to be packaged and acquires the initial position coordinates of the pins of the component to be packaged, and transmits the initial position coordinates of the pins of the component to be packaged to the control unit. The packaging process of the component to be packaged is initiated, and the control unit monitors the coplanarity-related parameters of the component in real time. The key process parameters and the real-time position coordinates of the pins during the packaging process constitute the coplanarity-related parameters of the component. The key process parameters include the packaging temperature and pressing pressure collected by the temperature sensor and pressure sensor, respectively. The control unit performs quantitative calculations of coplanarity deviation based on the initial position coordinates and coplanarity-related parameters; The control parameters are determined based on the height deviation of a single pin, the spatial weighting coefficient of a single pin, and the overall coplanarity deviation. Dynamic control is achieved by adjusting the pressing pressure and the packaging temperature according to the control parameters.
2. The coplanarity control method for packaging according to claim 1, characterized in that, Methods for pre-packaging of components to be packaged include: Select the components to be packaged and clean their surfaces. The method for acquiring the initial position coordinates of the component to be packaged specifically includes: The pre-processed components to be packaged are sent to the packaging station. Before starting the packaging process of the components to be packaged, a 3D automatic optical inspection (3D AOI) device is used to scan the components to be packaged to collect and record the initial position coordinates of the pins of the components to be packaged. , , ),in For the first The x-coordinate of the initial position coordinates of each pin. For the first The ordinate of the initial position coordinates of each pin. For the first The vertical coordinates of the initial position coordinates of each pin. , Given the total number of pins, the initial position coordinates are collected.
3. The coplanarity control method for packaging according to claim 2, characterized in that, The packaging process for the components to be packaged is initiated. Throughout the packaging process, the real-time position coordinates of the pins are acquired in real time by a 3D AOI device and transmitted to the control unit. Simultaneously, key process parameters during the packaging process are acquired in real time by temperature and pressure sensors connected to the control unit and transmitted to the control unit.
4. The coplanarity control method for packaging according to claim 3, characterized in that, The method for quantitatively calculating the coplanarity deviation of the control unit based on the initial position coordinates and coplanarity-related parameters specifically includes: Perform quantization calculations on the height deviation of a single pin; Perform quantization calculation of the spatial weighting coefficient of a single pin; Perform quantitative calculations on the overall coplanarity deviation.
5. The coplanarity control method for packaging according to claim 4, characterized in that, The mathematical expression for the quantization calculation of the height deviation of a single pin is: ； In this mathematical expression, For the first Each pin in Altitude deviation at any moment; For the first Each pin in The vertical coordinate of the real-time position at any given moment; For the first The vertical coordinates of the initial position coordinates of each pin; For the first Each pin in The amount of deformation correction induced by thermal stress at any given time. , for The packaging temperature at any given time; Standard room temperature; For the first The pin length of each pin; The coefficient of thermal expansion of the chip; The coefficient of thermal expansion of the substrate; In order to be in Time of the first The angle between the line connecting each pin to the geometric center point of the component and the horizontal plane, and the x-coordinate of the geometric center point of the component. for , For the first Each pin in The x-coordinate of the real-time position coordinates at any given moment, and the y-coordinate of the geometric center point of the component. for , For the first Each pin in The ordinate of the real-time position coordinates at any given moment, and the vertical coordinate of the geometric center point of the component. for , ; The mathematical expression for the quantization calculation of the spatial weighting coefficient of a single pin is: ； In this mathematical expression, For the first Each pin in Spatial weighting coefficients at any given time; For the first Each pin in The x-coordinate of the real-time location coordinates at any given moment; For the first Each pin in The ordinate of the real-time location coordinates at any given moment; The x-coordinate of the geometric center point of the component; The maximum value among the initial positions of all pins and the geometric center point of the component in the horizontal plane direction is the first pin in the horizontal plane direction. The initial position of each pin and the distance between the geometric center point of the component ; The mathematical expression for the quantitative calculation of the overall coplanarity deviation is: ； In this mathematical expression, for The overall coplanarity deviation of components at any given moment; For the first Each pin in Spatial weighting coefficients at any given time; For the first Each pin in Altitude deviation at any given time.
6. The coplanarity control method for packaging according to claim 5, characterized in that, The method for determining control parameters based on the height deviation of a single pin, the spatial weighting coefficient of a single pin, and the overall coplanarity deviation specifically includes: Preset coplanarity allowable deviation threshold ,Will Overall coplanarity deviation of time components Permissible deviation threshold for coplanarity Compare and combine the first Each pin in Thermal stress-induced deformation correction at time The decision-making and control parameters are as follows: When When the coplanarity of the components is deemed to meet the requirements, no adjustment is needed, and the key process parameters in the current packaging process are maintained. when When the coplanarity of components is deemed unsuitable, the adjustment amounts of the pressing pressure and packaging temperature, which are used as control parameters, are calculated. The mathematical expressions for these control parameters include: The mathematical expression for the adjustment amount of the pressing pressure is: ； In this mathematical expression, for The amount of adjustment of the pressing pressure at any given time; This refers to the initial compression pressure during the packaging process; This is the allowable deviation threshold for coplanarity; for The overall coplanarity deviation of components at any given moment; For all pins in The average value of the spatial weighting coefficients at any given time; This represents the total number of pins. for The average height deviation of all pins at any given time; The direction determination factor for the pressing pressure. ; The mathematical expression for the adjustment amount of the packaging temperature is: ； In this mathematical expression, for The amount of time required to adjust the packaging temperature; For all pins in The average value of the deformation correction induced by thermal stress at time . ; The average length of all pins, ; The coefficient of thermal expansion of the chip; The coefficient of thermal expansion of the substrate; This is the weighted average of the thermal expansion coefficients of the chip and the substrate; The optimal packaging temperature; This is the determining factor for temperature direction. .
7. The coplanarity control method for packaging according to claim 6, characterized in that, The method of dynamic control by the control unit based on the adjustment amount of the pressing pressure and the adjustment amount of the packaging temperature of the control parameters specifically includes: The control unit adjusts the pressing pressure and encapsulation temperature in real time through the pressure regulation module and temperature regulation module, respectively, based on the adjustment amounts of the pressing pressure and encapsulation temperature control parameters. The adjusted pressing pressure is... The adjusted packaging temperature is Simultaneously, the process involves real-time acquisition of coplanarity-related parameters after adjustment using 3D AOI equipment. This is repeated as the control unit performs quantitative calculations of coplanarity deviation based on the initial position coordinates and coplanarity-related parameters, and then dynamically adjusts the control unit according to the adjustment amounts of the pressing pressure and packaging temperature based on the control parameters, until… This completes a dynamic adjustment of coplanarity; during the component packaging process, the process of continuously repeating from the control unit to the control unit to dynamically adjust the coplanarity-related parameters of the component in real time, and the adjustment of the pressing pressure and packaging temperature of the control parameters, thereby achieving dynamic real-time adjustment of the overall coplanarity.
8. A computer device, characterized in that, include: One or more processors; The memory stores operable instructions that, when executed by the one or more processors, cause the one or more processors to perform operations, including the flow of the coplanarity control method for encapsulation as described in any one of claims 1 to 7.
9. A computer-readable medium for storing software, characterized in that: The software includes instructions executable by one or more computers, which, upon execution, cause the one or more computers to perform operations including the flow of the coplanarity control method for encapsulation as described in any one of claims 1 to 7.