Chip production process based on microcircuit

Abstract

The invention discloses a microcircuit-based chip production process, which comprises screening and pretreatment of a microcircuit, upgrading and reconstruction and a special packaging process, and is characterized in that during screening, high-precision equipment is used for measuring performance indexes, and ultrasonic and chemical combination is adopted for cleaning; advanced software optimization design is used for upgrading and reconstruction, a multi-layer wiring technology is adopted, and wiring parameters and via hole design are accurately controlled; according to the special packaging technology, a novel composite packaging material composed of epoxy resin, aluminum oxide powder and carbon fibers is selected, a multi-layer packaging structure comprising an inner microcircuit protection layer, a middle heat dissipation layer and an outer protection layer is designed, and packaging is conducted through the vacuum infusion and heating curing technology. The process improves the performance, stability and reliability of the chip.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and in particular to a chip manufacturing process based on microcircuits. Background Technology

[0002] With the rapid development of electronic technology, chips are increasingly used in various electronic devices, placing higher demands on their performance, stability, and reliability. Traditional chip manufacturing processes have limitations in areas such as microcircuit selection, upgrading, and packaging, making it difficult for chip performance and quality to meet the growing market demand. Therefore, it is necessary to develop a more advanced microcircuit-based chip manufacturing process. Summary of the Invention

[0003] The purpose of this application is to provide a microcircuit-based chip manufacturing process to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this application provides the following technical solution: a chip manufacturing process based on microcircuits, comprising: Microcircuit screening and preprocessing Microcircuits with relatively stable performance and meeting parameter requirements were selected from a large pool of microcircuits. High-precision testing equipment was used to test the resistance, capacitance, inductance, voltage, current, and other performance indicators of the selected microcircuits to ensure stable performance and compliant parameters.

[0005] The selected microcircuits were cleaned using a combination of ultrasonic and chemical cleaning methods, rinsed thoroughly with deionized water, and then dried. After cleaning, they were tested and classified again for future upgrades and modifications.

[0006] Upgrading and transforming microcircuits The selected microcircuits were optimized using advanced circuit design software. Through software simulation and analysis, the circuit layout and component parameters were comprehensively optimized.

[0007] The selected microcircuits are then optimized using advanced circuit design software. This software includes, but is not limited to: Cadence Virtuoso is a powerful and widely used integrated circuit design software. It boasts a rich set of design tools for analog, digital, and mixed-signal circuit design. It can perform a range of operations including schematic design, layout design, and circuit simulation. Its simulation capabilities can accurately simulate various circuit performance indicators, such as voltage, current, and frequency response, helping designers identify and resolve potential problems during the design phase and improving the accuracy and reliability of circuit designs.

[0008] Synopsys HSPICE: As a leading circuit simulation software, HSPICE is renowned for its high-precision simulation results. It supports various circuit element models and can perform comprehensive simulation analysis of complex integrated circuits. It can simulate the performance variations of circuits under different process conditions and predict the circuit's performance in practical applications. Designers can use this software to optimize the performance of microcircuits to ensure they meet design requirements.

[0009] Mentor Graphics HyperLynx: Primarily used for high-speed PCB design and signal integrity analysis. In microcircuit upgrades and modifications, for designs involving multi-layer routing and high-speed signal transmission, HyperLynx can provide in-depth analysis of issues such as signal reflection, crosstalk, and delay. Through simulation and optimization of routing schemes, it reduces signal interference and improves circuit stability and reliability.

[0010] Replace and add components to improve the performance and functionality of microcircuits.

[0011] Multilayer wiring technology is employed during the microcircuit upgrade phase. First, the microcircuit surface is pretreated to enhance the adhesion of subsequent deposited materials. Physical vapor deposition (PVD) or chemical vapor deposition (CVD) methods are used to sequentially deposit multiple layers of insulating and conductive materials on the microcircuit surface. The insulating material is selected from polyimide or silicon dioxide, which have low dielectric constants and good mechanical properties to reduce capacitive coupling and crosstalk during signal transmission. The conductive material is selected from copper or aluminum, utilizing their excellent conductivity. After each layer deposition, the required wiring pattern is precisely formed through photolithography and etching processes. The width and spacing of the wiring are optimized according to the chip design requirements and manufacturing process level; generally, the wiring width can be controlled at the micrometer or even nanometer level to improve circuit integration. During the multilayer wiring process, vias are used to achieve electrical connections between different conductive layers. The diameter and depth of the vias are also precisely designed to ensure low-resistance electrical connections and good mechanical stability. Simultaneously, to improve wiring reliability, a passivation layer is added to the wiring surface to prevent oxidation of the conductive materials and corrosion from the external environment.

[0012] Special packaging process A novel composite encapsulation material is composed of epoxy resin, alumina powder, and carbon fiber. Epoxy resin, as the matrix material, accounts for 50%-70% and possesses excellent adhesion and insulation properties, firmly bonding the alumina powder and carbon fiber while providing a stable electrical environment for the microcircuit. The alumina powder, with a particle size of 1-50 micrometers, accounts for 20%-40% and utilizes its high thermal conductivity to rapidly conduct heat generated by the microcircuit. The carbon fiber content is 5%-15%, enhancing the mechanical strength and toughness of the encapsulation material and preventing damage to the encapsulation structure under external impact. During preparation, a combination of high-speed stirring and ultrasonic dispersion is used to ensure uniform mixing of all components.

[0013] Multi-layer packaging structure: Inner microcircuit protective layer: The coating is made of parylene with a thickness of 1-10 micrometers. It has excellent insulation properties, chemical stability and moisture resistance, and can effectively isolate external electromagnetic interference and chemical substances from erosion of the microcircuit.

[0014] Intermediate heat dissipation layer: Made of highly thermally conductive copper or aluminum, with a thickness of 50-200 micrometers. The heat dissipation layer is designed with a microchannel structure, with a width of 10-100 micrometers and a depth of 20-200 micrometers. The microchannels can be filled with coolant or highly thermally conductive gel to improve heat dissipation efficiency.

[0015] Outer protective layer: Made of high-strength polycarbonate or glass fiber reinforced plastic, with a thickness of 100-500 micrometers, providing excellent impact resistance and weather resistance. The surface of the protective layer undergoes special treatment, such as coating with waterproof, dustproof, and UV-resistant coatings, to further enhance its protective performance.

[0016] Encapsulation Process: The microcircuit is placed in a custom-designed encapsulation mold. The mold is first evacuated to -0.09 MPa to -0.1 MPa to remove air and moisture. Then, the mixed novel composite encapsulation material is injected into the mold at a rate of 1-10 ml / min using vacuum infusion technology, ensuring the material fully fills all corners of the mold. After injection, depending on the properties of the encapsulation material, the mold is heated to 100℃-200℃ and held for 30 minutes to 3 hours for curing, allowing the encapsulation material to form a robust encapsulation structure.

[0017] In summary, the technical effects and advantages of this invention are as follows: By employing high-precision microcircuit screening and preprocessing, the performance of microcircuits entering subsequent production stages is ensured to be stable, thereby improving the overall quality and reliability of the chips.

[0018] Advanced circuit design software and multilayer wiring technology were used to upgrade and transform the microcircuit, which improved the circuit integration and performance and reduced signal interference.

[0019] The special packaging process uses new composite packaging materials and multi-layer packaging structures, which have good heat dissipation performance, mechanical strength and protection performance, effectively protecting microcircuits and extending the life of the chip. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic flowchart of a microcircuit-based chip manufacturing process in an embodiment of this application. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] In the description of this disclosure, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] It should also be noted that all standard parts used in this application are commercially available, and can be custom-made according to the description and drawings. Unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances, and unless explicitly limited, machinery, parts, and equipment can all adopt conventional models in the prior art.

[0025] In this document, the term "comprising" is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0026] Examples of chip manufacturing processes based on microcircuits: Example 1: Production of a high-performance processor chip Microcircuit screening and preprocessing Screening: Selecting microcircuits from a batch of newly produced microcircuits for chip manufacturing. High-precision testing instruments, such as the Keysight E4980A LCR meter, are used to measure the resistance, capacitance, and inductance of the microcircuits, while a Keithley 2450 source meter is used to measure performance indicators such as voltage and current. Strict parameter ranges are set, such as resistance deviation within ±5% and capacitance value within ±3% of the specified value, to screen out microcircuits with stable performance and compliant parameters.

[0027] Cleaning: First, the selected microcircuits are placed in an ultrasonic cleaner and ultrasonically cleaned at a frequency of 40kHz for 10 minutes to remove surface dust and larger particulate impurities. Then, the microcircuits are immersed in a chemical cleaning tank containing a special cleaning agent for 5 minutes to chemically clean them and remove oil and other organic impurities. Finally, they are rinsed repeatedly with deionized water three times, 2 minutes each time, and then placed in an oven to dry at 80℃ for 30 minutes. After drying, they are tested and classified again using the aforementioned testing instruments.

[0028] Upgrading and transforming microcircuits Design Optimization: The selected microcircuits were comprehensively optimized using Cadence Virtuoso software. The functional requirements and performance bottlenecks of the microcircuits were analyzed, and the circuit layout was redesigned, adjusting component positions and connections to reduce signal transmission delays and interference. For example, frequently interacting components were placed as close as possible to shorten signal transmission paths.

[0029] Component replacement and addition: Based on the optimized design, replace some low-performance resistors and capacitors with high-precision, low-noise components. Simultaneously, add necessary filter capacitors and protection diodes to improve the microcircuit's anti-interference capability and stability.

[0030] Multilayer cabling technology Pretreatment: Plasma treatment is performed on the surface of the microcircuit to improve the surface roughness and activity, thereby enhancing the adhesion of subsequent deposited materials.

[0031] Material deposition: A physical vapor deposition (PVD) method was used to sequentially deposit multiple layers of insulating and conductive materials on the surface of the microcircuit. First, a 100 nm thick silicon dioxide layer was deposited as the bottom insulating layer, followed by a 200 nm thick copper layer as the conductive layer. This process was repeated, resulting in a total of 5 conductive layers and 4 insulating layers.

[0032] Photolithography and etching: Using photolithography, the designed wiring pattern is transferred onto each layer of deposited material through a high-precision photomask. Then, an etching process is used to precisely remove unwanted material, forming the desired wiring pattern. The wiring width is controlled at 5 micrometers, and the spacing is 3 micrometers.

[0033] Via fabrication: Vias are fabricated at locations where different conductive layers need to be connected using photolithography and etching processes. The via diameter is 2 micrometers, and the depth is precisely controlled according to the thickness of different layers to ensure low-resistance electrical connections.

[0034] Passivation layer addition: A 100nm thick silicon nitride layer is deposited on the wiring surface as a passivation layer to prevent oxidation of the copper conductive layer.

[0035] Special packaging process Preparation of novel composite encapsulation material: Weigh 60% epoxy resin, 30% alumina powder (particle size 20 micrometers), and 10% carbon fiber according to the mass ratio. Place these materials in a high-speed stirrer and stir at 1000 r / min for 20 minutes, while simultaneously turning on an ultrasonic dispersion device at an ultrasonic frequency of 30 kHz to ensure uniform mixing of all components.

[0036] Multi-layer packaging structure assembly Inner microcircuit protective layer: A 5-micrometer-thick poly(p-xylene) coating is deposited on the surface of the microcircuit using chemical vapor deposition (CVD).

[0037] Intermediate heat dissipation layer: A copper heat sink with a thickness of 100 micrometers is selected. Microchannels with a width of 50 micrometers and a depth of 100 micrometers are processed inside the heat sink using precision machining equipment. The microchannels are filled with a highly thermally conductive gel.

[0038] Outer protective layer: The outer protective shell is made of 200-micron thick glass fiber reinforced plastic and manufactured using injection molding. A waterproof, dustproof, and UV-resistant coating is applied to the surface of the protective shell.

[0039] Encapsulation Process: The upgraded microcircuit is placed in a custom-designed encapsulation mold, which is then evacuated to -0.095 MPa using a vacuum pump. The mixed novel composite encapsulation material is then injected into the mold at a rate of 5 ml / min using a vacuum infusion device, ensuring that the material fully fills every corner of the mold. After injection, the mold is placed in a heating oven and cured at 150°C for 2 hours, allowing the encapsulation material to form a robust encapsulation structure.

[0040] Example 2: Production of a certain IoT sensor chip Microcircuit screening and preprocessing Screening: Considering the characteristics of IoT sensor chips, performance metrics of the microcircuits were measured using equipment such as the Agilent 34461A digital multimeter. More stringent low-power parameter ranges were set, such as quiescent current less than 10μA, to screen out microcircuits that met the requirements.

[0041] Cleaning: The ultrasonic cleaning frequency was adjusted to 35kHz, and the cleaning time was 8 minutes. Chemical cleaning was performed using cleaning agents with different formulations, with a soaking time of 4 minutes. Deionized water rinsing was performed twice, with each rinse lasting 3 minutes. Drying was carried out at 70℃ for 40 minutes. Performance testing and classification were performed again after drying.

[0042] Upgrading and transforming microcircuits Design optimization: Circuit simulation and optimization were performed using Synopsys HSPICE software. The focus was on optimizing the power consumption and sensitivity of the microcircuit, adjusting component parameters and circuit topology to reduce power consumption and improve response sensitivity to target signals.

[0043] Component replacement and addition: Replace with low-power transistors and microcontrollers, and add high-precision sensor components, such as MEMS accelerometers, to enhance the chip's functionality.

[0044] Multilayer cabling technology Pretreatment: A chemical treatment method is used to treat the surface of the microcircuit with specific chemical reagents to improve surface activity.

[0045] Deposited materials: Polyimide was deposited as an insulating material with a thickness of 80 nm using chemical vapor deposition (CVD); aluminum was deposited as a conductive material with a thickness of 150 nm. A total of 4 conductive layers and 3 insulating layers were deposited.

[0046] Photolithography and etching: The wiring width is controlled at 3 micrometers, and the spacing is 2 micrometers. Advanced photolithography and etching processes ensure high precision and high resolution of the wiring pattern.

[0047] Via fabrication: The via diameter is 1.5 micrometers, and the depth is precisely controlled according to the layer thickness to ensure good electrical connection.

[0048] Passivation layer addition: An 80nm thick silicon oxide layer is deposited as a passivation layer to protect the wiring.

[0049] Special packaging process Preparation of a novel composite encapsulation material: The mass ratio of epoxy resin (55%), alumina powder (10 μm particle size), and carbon fiber was adjusted to 55%. The stirring speed was 1200 r / min, the stirring time was 15 minutes, and the ultrasonic frequency was 35 kHz.

[0050] Multi-layer packaging structure assembly Inner microcircuit protective layer: The thickness of the parylene coating is 3 micrometers.

[0051] Intermediate heat dissipation layer: An aluminum heat sink with a thickness of 80 micrometers is selected, with a microchannel width of 30 micrometers and a depth of 80 micrometers, and filled with coolant.

[0052] Outer protective layer: The protective shell is made of 150-micron thick polycarbonate material and manufactured by hot pressing process, and the surface is coated with a protective coating.

[0053] Encapsulation process: The mold is evacuated to -0.09MPa, the pouring speed is 3 ml / min, the heating and curing temperature is 130℃, and the curing time is 2.5 hours.

[0054] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip manufacturing process based on microcircuits, characterized in that: Includes the following steps: Microcircuit screening and preprocessing: Select microcircuit with relatively stable performance and parameters that meet the requirements from a large number of microcircuit samples, and then clean and retest and classify them. Microcircuit upgrade and modification: Optimize the design of the screened microcircuits, replace and add some components, and adopt multilayer wiring technology; Special packaging process: New composite packaging materials are selected, a multi-layer packaging structure is designed, and vacuum potting and heat curing technology are used to encapsulate the microcircuits.

2. The chip manufacturing process based on microcircuits according to claim 1, characterized in that, During the microcircuit screening process, high-precision testing equipment is used to test the resistance, capacitance, inductance, voltage, and current performance indicators of the microcircuit.

3. The chip manufacturing process based on microcircuits according to claim 1, characterized in that, The microcircuit cleaning method combines ultrasonic cleaning and chemical cleaning, and is then rinsed with deionized water and dried.

4. The chip manufacturing process based on microcircuits according to claim 1, characterized in that, The circuit optimization design for the microcircuit upgrade and transformation was carried out using advanced circuit design software.

5. The chip manufacturing process based on microcircuits according to claim 1, characterized in that, The novel composite encapsulation material of the special encapsulation process is composed of epoxy resin, alumina powder and carbon fiber.

6. The chip manufacturing process based on microcircuits according to claim 1, characterized in that, The special packaging process employs a multi-layer structure design, including an inner microcircuit protection layer, a middle heat dissipation layer, and an outer protective layer.

7. The chip manufacturing process based on microcircuits according to claim 1, characterized in that, The special encapsulation process employs vacuum injection technology to inject encapsulation material, and controls the heating temperature and time for curing.

8. The chip manufacturing process based on microcircuits according to claim 1, characterized in that, The multilayer wiring technology specifically involves the following steps: During the microcircuit upgrade and modification stage, the microcircuit surface is first pretreated to enhance the adhesion of subsequent deposited materials. Physical vapor deposition (PVD) or chemical vapor deposition (CVD) methods are used to sequentially deposit multiple layers of insulating and conductive materials on the microcircuit surface. The insulating material is selected from polyimide or silicon dioxide, which have low dielectric constants and good mechanical properties, to reduce capacitive coupling and crosstalk in signal transmission. The conductive material is selected from copper or aluminum, utilizing their excellent conductivity. After each layer is deposited, the required wiring pattern is precisely formed through photolithography and etching processes. The width and spacing of the wiring are optimized according to the chip design requirements and manufacturing process level. During the multilayer wiring process, vias are used to achieve electrical connections between different conductive layers. The diameter and depth of the vias are also precisely designed to ensure low-resistance electrical connections and good mechanical stability. Simultaneously, to improve the reliability of the wiring, a passivation layer is added to the wiring surface to prevent oxidation of the conductive material and corrosion from the external environment.

9. The chip manufacturing process based on microcircuits according to claim 1, characterized in that, In the special packaging process: Novel composite encapsulation material: Epoxy resin is used as the matrix material, accounting for 50%-70%. It has good adhesion and insulation properties, which can firmly bond alumina powder and carbon fiber, and provide a stable electrical environment for microcircuits. Alumina powder has a particle size of 1-50 micrometers and accounts for 20%-40%. Its high thermal conductivity is used to quickly conduct away the heat generated by the microcircuit. The carbon fiber content is 5%-15%, which enhances the mechanical strength and toughness of the encapsulation material and prevents the encapsulation structure from being damaged by external impact. During preparation, a combination of high-speed stirring and ultrasonic dispersion is used to ensure that all components are uniformly mixed. Multi-layer packaging structure: Inner microcircuit protective layer: Utilizing a parylene coating with a thickness of 1-10 micrometers, it possesses excellent insulation properties, chemical stability, and moisture resistance, effectively isolating the microcircuit from external electromagnetic interference and chemical corrosion. Middle heat dissipation layer: Made of highly thermally conductive copper or aluminum, with a thickness of 50-200 micrometers. The heat dissipation layer incorporates a microchannel structure with a width of 10-100 micrometers and a depth of 20-200 micrometers. These microchannels can be filled with coolant or highly thermally conductive gel to improve heat dissipation efficiency. Outer protective layer: Made of high-strength polycarbonate or glass fiber reinforced plastic, with a thickness of 100-500 micrometers, providing excellent impact resistance and weather resistance. The surface of the protective layer undergoes special treatment, such as coating with waterproof, dustproof, and UV-resistant coatings, to further enhance its protective performance. Encapsulation process: The microcircuit is placed in a customized encapsulation mold. The mold is first evacuated to -0.09MPa to -0.1MPa to remove air and moisture. Then, the mixed new composite encapsulation material is injected into the mold at a rate of 1-10 ml / min using vacuum infusion technology to ensure that the material fully fills all corners of the mold. After injection, the mold is heated to 100℃-200℃ according to the characteristics of the encapsulation material and kept at 30 minutes to 3 hours for curing, so that the encapsulation material forms a robust encapsulation structure.

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