Die package having a protection structure to reduce or prevention of material introduction into an air

Abstract

A bare die package with protection to reduce or prevent penetration of material into the air cavity and related methods of manufacture. In an exemplary aspect, to avoid or reduce material (e.g., encapsulation material, such as molding material and / or coating material) into or into an air cavity in an active filter region of a filter, a die package includes a guard structure. The protection structure is a structure on or adjacent to a die operable for use in a filter that redirects the material from or reduces the material from entering a gap between the die and the substrate. The protective structure reduces or prevents material from entering the air cavity of the die so as to prevent such material from affecting the acoustic performance of the air cavity of the filter.

Description

Priority application

[0001] This application claims priority to U.S. Patent Application Serial No. 18 / 467,798, filed September 15, 2023, entitled “DIE PACKAGE WITH GUARDSTRUCTURE TO REDUCE OR PREVENT MATERIAL SEEPAGE INTO AIR CAVITY, AND RELATEDFABRICATION METHODS”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to integrated circuit (IC) packages that incorporate exposed dies, which may be bare die acoustic filters. Background Technology

[0003] Mobile wireless device manufacturers are adding ever-increasing capabilities to handheld-sized devices. This increased capability means more electronic components must be packed into the package. This trend is driving the reduction in the size of electronic components used for radio frequency (RF) signal processing. One challenge in miniaturizing electronic components is finding a way to provide the same functionality in physically smaller electronic devices. Another challenge arises from the fact that physically smaller devices dissipate the same or similar amounts of power, resulting in the same or similar heat generation. The heat generated within physically smaller devices leads to higher operating temperatures in smaller packages, increasing the likelihood of impacting device performance and its lifespan. Therefore, finding more efficient ways to dissipate heat while reducing device size is desirable.

[0004] One type of device already used for signal filtering in RF signal processing circuitry (e.g., RF front-end (RFFE) circuitry) provided in smaller electronic devices is the acoustic wave (AW) filter, such as a surface acoustic wave (SAW) filter or a bulk acoustic wave (BAW) filter. AW filters remove or reduce energy in one or more frequency bands from an input analog signal. AW filters filter frequencies by converting electromagnetic wave propagation into mechanical wave propagation on the surface of a substrate material. AW filters can be implemented as die filters and included in packages such as IC packages, system-in-packages (SiPs), exposed die module packages (BDMPs), or other IC packages or modules. In IC packages, filter circuitry can be incorporated as a die filter coupled to the package substrate (e.g., an integrated circuit (IC) die). The die filter is encapsulated within the SiP. In BDMPs or chip-scale packages (CSPs), the die filter is provided as an exposed die filter coupled to the package substrate and is also encapsulated. The exposed die filter has a cavity within the active filter region of the die (“filter die”) that allows it to be operated in the filter. This cavity serves as an acoustic cavity between the die filter and the package substrate. The volume of the cavity is designed to act as a resonator to filter and transmit RF signals converted from electrical signals to mechanical energy. When the filter die is coupled to the substrate, a gap defining the height of the cavity exists between the filter die and the substrate. During the encapsulation and / or coating process of the filter die, encapsulation or coating material can seep (i.e., flow slowly) through this gap and into the cavity, which includes metal interconnects, metal pads, and the active filter region of the filter die. It is important to prevent or minimize the seepage of encapsulation or coating material into the cavity so as not to unintendedly alter the acoustic filtering characteristics of the cavity, thereby avoiding yield loss and / or reliability failure. Summary of the Invention

[0005] The aspects disclosed herein include a die package with a protective structure that reduces or prevents material infiltration into an air cavity. Related manufacturing methods are also disclosed. As an example, the die package may be an exposed die module package (BDMP) or a chip-scale package (CSP). The die package is an integrated circuit (IC) package including at least one exposed semiconductor die (“die”). The exposed die is a die in the die package that has an unencapsulated region between the surface of the die and a coupling surface adjacent to the surface of the die (e.g., the surface of a package substrate). The unencapsulated region between the die and the coupling surface provides an air cavity between the die and the coupling surface. The die package includes a filter, which is a cavity filter, having an unencapsulated region between the active side of the die (“filter die”) operable as a filter and the coupling surface to maintain an air cavity that acts as a cavity resonator for filtering and transmitting radio frequency (RF) signals at a specific frequency. The filter die may include filter circuitry and / or devices, such as acoustic wave (AW) filters, which may be surface acoustic wave (SAW) filters or bulk acoustic wave (BAW) filters. Therefore, the volume of the cavity is specifically designed so that the filter provides the desired acoustic filtering characteristics. In an exemplary aspect, to prevent or reduce the entry or infiltration of material (e.g., encapsulation materials, such as molding materials and / or coating materials) into the cavity of the filter (e.g., during manufacturing), the die package disclosed herein includes a protective structure. This protective structure is a structure located on or adjacent to the filter die that redirects material to prevent or reduce material entry into the gap between the filter die and the substrate. The protective structure reduces or prevents material entry into the cavity of the filter die to avoid such material affecting the acoustic performance of the cavity of the filter. The protective structure redirects material to prevent or reduce material entry into the cavity in the active filter region of the filter, i.e., the die region including circuitry involved in the filtered signal and / or filtering material (i.e., piezoelectric material).

[0006] In one example, the protective structure is adjacent to and / or located at one or more die edges of the filter die, outside the air cavity outside the active filter region of the filter die. The protective structure redirects material to prevent or reduce material ingress into the gap adjacent to the die edge of the filter die, and thus redirects material to prevent or reduce material ingress into the air cavity within the active filter region of the filter die. Providing this protective structure also avoids the need to enlarge the die size to provide sufficient area in the gap between the die edge and the active filter region of the filter die to accommodate material, thereby reducing or preventing such material infiltration or entry into the air cavity within the active filter region of the filter die.

[0007] In one exemplary aspect, the protective structure in the die package includes one or more channels at least partially located in a gap within the filter between the filter die and a substrate in the die package. The one or more channels may be formed to be disposed in the gap between the filter die and the substrate, and may be located and / or adjacent to one or more die edges of the filter die. The channels provide additional volume and flow paths to redirect excess material (e.g., encapsulation material, such as molding material and / or coating material) adjacent to the die edge to prevent or reduce excess material infiltration into the air cavity in the active filter region of the filter die. The channels disposed in the gap also reduce the height of the gap adjacent to the edge of the filter die, thereby providing a smaller area for material (e.g., encapsulation material, such as molding material and / or coating material) to enter the air cavity in the active filter region of the filter die. Each channel may be formed as a region between two adjacent channel structures that extend parallel to each other and are adjacent to the die edge of the filter die. The channel structure may be part of a layer (e.g., a photoresist layer, dielectric layer, metal layer, passivation layer) formed and processed during the manufacturing or assembly of the die package to form the channel structure.

[0008] In another example, the protective structure in the die package includes a protrusion coupled to the filter die and extending into the gap between the filter die and the substrate. The protrusion is formed at one or more die edges of the filter die outside the active filter region of the filter die and / or in the gap adjacent to the one or more die edges. The protrusion may extend to the die edge of the filter die. The protrusion in the gap reduces the height of the gap adjacent to the edge of the filter die, thereby providing a smaller area for encapsulation material (e.g., molding material and / or coating material) to enter the cavity in the active filter region of the filter die. The protrusion may be part of a layer (e.g., photoresist layer, dielectric layer, metal layer, passivation layer) formed during the manufacture or assembly of the die package and processed to form the protrusion.

[0009] In another exemplary aspect, the protective structure in the die package is provided as a die recess formed in the filter die adjacent to the gap between the filter die and the substrate. The die recess is formed adjacent to and / or located outside one or more die edges of the filter die and outside the cavity in the active filter region of the filter die. The die recess in the filter die provides additional space volume as a reservoir of a type that accommodates and retains encapsulation material (e.g., molding material and / or coating material) or other materials. This reduces or prevents such material from entering or seeping into the cavity in the active filter region of the filter. The additional space volume provided by the recess in the filter die essentially provides a region with reduced resistance than the gap, resulting in additional material entering and remaining outside the cavity in the active filter region of the filter die. In another example, the die recess in the filter die may also be formed adjacent to and / or located at all die edges of the filter die to surround the entire active filter region of the filter die. As another example, the die recess can be formed by performing a retaining die cut on the filter die during the manufacturing and / or assembly of the filter die or the die package.

[0010] It should be noted that in the examples disclosed herein, the die package may be provided as an exposed die module package (BDMP) or a chip-scale package (CSP) including one or more filters. The die package may also be provided as an IC package, which may include other IC dies (e.g., radio frequency IC (RFIC) dies, system-on-a-chip (SiP), power management IC (PMIC) dies, and memory dies) in addition to one or more filters, and may be coupled to a substrate of the IC package.

[0011] In this regard, in one exemplary aspect, a die package is provided. The die package includes a substrate having a first surface. The die package also includes a filter comprising a die operable for use in the filter and including a second surface and a plurality of die edges adjacent to the second surface. The filter further includes a plurality of metal bumps coupled to the second surface and to the first surface of the substrate, thereby forming a gap between the first surface and the die. The filter also includes a gas cavity located within the gap between the first surface and the die. The die package further includes one or more protective structures, each adjacent to the gap and each adjacent to a first die edge among the plurality of die edges.

[0012] In another exemplary aspect, a method of manufacturing a die package is provided. The method includes: providing a substrate including a first surface. The method further includes: providing a die operable for use in a filter and including a second surface, a plurality of die edges adjacent to the second surface, and a plurality of metal bumps coupled to the second surface. The method further includes: forming one or more protective structures located on the die and adjacent to the first die edge of the plurality of die edges. The method further includes: coupling the plurality of metal bumps to the first surface of the substrate to form a gas cavity in a gap between the first surface and the die, and distributing the one or more protective structures adjacent to the gap. Attached Figure Description

[0013] FIG. 1A This is a side view of an exemplary die package in the form of an exposed die module package (BDMP) that includes filters, which are exposed die filters, each of which includes a die (“filter die”) coupled to a substrate (e.g., a package substrate) that is operable for use in the filter, the substrate having a corresponding air cavity formed between the die and the substrate.

[0014] FIG. 1B yes FIG. 1A A close-up side view of a portion of the die package;

[0015] FIG. 2A This is a side view of an exemplary die package including a filter, which is an exposed die filter including a die (“filter die”) coupled to a substrate and operable for use in the filter, the substrate having a cavity formed in a gap between the filter die and the substrate, wherein the die package also includes a protective structure in the form of one or more channels in the gap to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter;

[0016] FIG. 2B-1 and FIG. 2B-2 It is available to FIG. 2A The image shows a top view and a side view of a corresponding portion of a filter die in a die package, and illustrates an exemplary continuous channel formed on the bottom surface of the filter die adjacent to the die edge of the filter die, such that the continuous channel will be disposed in the gap between the filter die and the substrate.

[0017] FIG. 2C-1 and FIG. 2C-2 It is available to FIG. 2AThe image shows a top view and a side view of a corresponding portion of a filter die in a die package, and illustrates an exemplary discontinuous channel formed on the bottom surface of the die adjacent to the die edge of the filter die, such that the discontinuous channel will be disposed in the gap between the filter die and the substrate.

[0018] FIG. 3 This is a side view of another exemplary die package including a filter, which is an exposed die filter including a die (“filter die”) coupled to a substrate and operable for use in the filter, the substrate having an air cavity formed in a gap between the filter die and the substrate, wherein the die package also includes a protective structure in the form of a raised structure in the gap to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the air cavity of the filter;

[0019] FIG. 4 This is a side view of another exemplary die package including a filter, which is an exposed die filter including a die (“filter die”) coupled to a substrate and operable for use in the filter, the substrate having an air cavity formed in a gap between the filter die and the substrate, wherein the die package also includes a protective structure in the form of a die recess in the die adjacent to and / or located at one or more die edges of the filter die, the protective structure redirecting material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the air cavity of the filter;

[0020] FIG. 5 The flowchart illustrates an exemplary manufacturing process for fabricating a die package including a filter, wherein the filter is an exposed die filter, the exposed die filter including a die (“filter die”) coupled to a substrate and operable for use in the filter, the substrate having a cavity formed in a gap between the filter die and the substrate, wherein the die package also includes protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... FIG. 2A , FIG. 2B-1 to FIG. 2B-2 , FIG. 2C-1 to FIG. 2C-2 , FIG. 3 and FIG. 4 bare die package in;

[0021] FIG. 6 This is an example of using by FIG. 2A A flowchart of another exemplary manufacturing process for patterning a protective structure of a bare die that can be manipulated to be used in a filter, where the photoresist film layer in the process forms the photoresist material structure.

[0022] FIG. 7A to FIG. 7B Examples are given based on FIG. 6 An exemplary manufacturing stage of an exemplary manufacturing process;

[0023] FIG. 8A to FIG. 8B This is an example of FIG. 2A The flowchart shows another exemplary manufacturing process in which the protective structure of the filter die is patterned into a dielectric material structure formed by a dielectric layer;

[0024] FIG. 9A to FIG. 9C Examples are given based on FIG. 8A and FIG. 8B An exemplary manufacturing stage of an exemplary manufacturing process;

[0025] FIG. 10A to FIG. 10B This is an example of FIG. 2A The flowchart shows another exemplary manufacturing process in which the protective structure of the filter die is patterned into a metal structure formed by metal layers;

[0026] FIG. 11A to FIG. 11C Examples are given based on FIG. 10A and FIG. 10B An exemplary manufacturing stage of an exemplary manufacturing process;

[0027] FIG. 12A to FIG. 12B This is an example of FIG. 2A A flowchart of another exemplary manufacturing process in which the protective structure of the filter die is patterned into a passivation structure formed by a passivation layer;

[0028] FIG. 13A to FIG. 13D Examples are given based on FIG. 12A to FIG. 12B An exemplary manufacturing stage of an exemplary manufacturing process;

[0029] FIG. 14A to FIG. 14C This is an example of manufacturing. FIG. 4 A flowchart of another exemplary manufacturing process for a die package having a protective structure in the form of a die recess;

[0030] FIG. 15A to FIG. 15F Examples are given based on FIG. 14A to FIG. 14C An exemplary manufacturing stage of an exemplary manufacturing process;

[0031] FIG. 16This is a block diagram of an exemplary wireless communication device including a radio frequency (RF) component. The RF component may include a die package containing a filter, which is an exposed die filter. The exposed die filter includes a die (“filter die”) coupled to a substrate and operable for use in the filter. The substrate has a cavity formed in a gap between the filter die and the substrate. The die package also includes protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... FIG. 2A , FIG. 2B-1 to FIG. 2B-2 , FIG. 2C-1 to FIG. 2C-2 , FIG. 3 , FIG. 4 , FIG. 7B , FIG. 9C , FIG. 11C , FIG. 13D and FIG. 15F And according to FIG. 5 to FIG. 6 , FIG. 8A to FIG. 8B , FIG. 10A to FIG. 10B , FIG. 12A to FIG. 12B as well as FIG. 14A to FIG. 14C A bare die package manufactured by any of the exemplary manufacturing processes described above; and

[0032] FIG. 17 This is a block diagram of an exemplary processor-based system that may include a die package comprising a die package containing a filter, the filter being an exposed die filter, the exposed die filter including a die (“filter die”) coupled to a substrate and operable for use in the filter, the substrate having a cavity formed in a gap between the filter die and the substrate, wherein the die package further includes protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... FIG. 2A , FIG. 2B-1 to FIG. 2B-2 , FIG. 2C-1 to FIG. 2C-2 , FIG. 3 , FIG. 4 , FIG. 7B , FIG. 9C , FIG. 11C , FIG. 13D and FIG. 15F And according to FIG. 5 to FIG. 6 , FIG. 8A to FIG. 8B , FIG. 10A to FIG. 10B , FIG. 12A to FIG. 12B as well as FIG. 14A to FIG. 14C A bare die package manufactured by any of the exemplary manufacturing processes described above. Detailed Implementation

[0033] Several exemplary aspects of this disclosure will now be described with reference to the accompanying drawings. The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects.

[0034] The aspects disclosed herein include a die package with protection to reduce or prevent material infiltration into a cavity. Related manufacturing methods are also disclosed. As an example, the die package may be an exposed die module package (BDMP) or a chip-scale package (CSP). The die package is an integrated circuit (IC) package including at least one exposed semiconductor die (“die”). The exposed die is a die in the die package that has an unencapsulated region between the surface of the die and a coupling surface adjacent to the surface of the die (e.g., the surface of a package substrate). The unencapsulated region between the die and the coupling surface provides an air cavity between the die and the coupling surface. The die package includes a filter, which is a cavity filter, having an unencapsulated region between the active side of the die (“filter die”) operable as a filter and the coupling surface to maintain a cavity that acts as a cavity resonator for filtering and transmitting radio frequency (RF) signals at a specific frequency. The filter die may include filter circuitry and / or devices, such as acoustic wave (AW) filters, which may be surface acoustic wave (SAW) filters or bulk acoustic wave (BAW) filters. Therefore, the volume of the cavity is specifically designed so that the filter provides the desired acoustic filtering characteristics. In an exemplary aspect, to prevent or reduce the entry or infiltration of material (e.g., encapsulation materials, such as molding materials and / or coating materials) into the cavity of the filter (e.g., during manufacturing), the die package disclosed herein includes a protective structure. This protective structure is a structure located on or adjacent to the filter die that redirects material to prevent or reduce material entry into the gap between the filter die and the substrate. The protective structure reduces or prevents material entry into the cavity of the filter die to avoid such material affecting the acoustic performance of the cavity of the filter. The protective structure redirects material to prevent or reduce material entry into the cavity in the active filter region of the filter, i.e., the die region including circuitry involved in the filtered signal and / or filtering material (i.e., piezoelectric material).

[0035] Before discussing examples of exposed die packages, which include filters that may be exposed die filters and also include protective structures to redirect material (e.g., encapsulation materials, such as molding materials and / or coating materials) to prevent them from entering or seeping into the air cavity of the filter, the following references first. FIG. 1A and FIG. 1B The paper discusses bare die packages that do not include the protective structure.

[0036] In this respect, FIG. 1A and FIG. 1B This is a side view of an exemplary integrated die package 100 in the form of an exposed die module package (BDMP) 102. FIG. 1A and FIG. 1B BDMP 102 is a die package comprising at least one die having an unencapsulated region between the die side and a coupling surface (e.g., a surface of a package substrate). This unencapsulated region between the die and the coupling surface provides an air cavity between the die and the coupling surface. For example, the die package may include a filter, which is an exposed die filter, specifically a cavity filter, which has no encapsulation between the active side of a die (“filter die”) operable in the filter and the coupling surface to maintain an air cavity that acts as a cavity resonator for filtering and transmitting RF signals at a specific frequency.

[0037] In this example, such as FIG. 1A As shown, BDMP 102 includes a package substrate 104 comprising one or more metallization layers 106(1) to 106(5) parallel to each other in a first horizontal direction (X and / or Y direction). In this example, the metallization layers 106(1) to 106(5) include corresponding metal interconnects 108(1) to 108(5) (e.g., metal traces, metal lines) to provide external signal routing to a semiconductor die (“die”) 110. The die 110 is electrically coupled to the package substrate 104 via one or more metal bumps 112 (e.g., metal interconnects, solder balls, ball grid array (BGA) interconnects) coupled to the metal interconnects 108(1) in the metallization layer 106(1) adjacent to the die 110. In this example, BDMP 102 also includes a filter 114, which is a die-exposed filter. BDMP 102 includes a die 116 operable for use in filter 114, and is therefore referred to herein as "filter die 116". Filter die 116 is mechanically and electrically coupled to package substrate 104 via metal bumps 118, such that a gap 120 exists between filter die 116 and package substrate 104. Gap 120 provides an air cavity 122 between filter die 116 and a first surface 124 of package substrate 104 to provide an acoustic air cavity for filter 114. As an example, filter 114 can be coupled to die 110 via package substrate 104, such that filter 114 can filter signals processed by die 110. For example, die 110 may be a radio frequency integrated circuit (RFIC) die including RF front-end circuitry and / or transceiver circuitry.

[0038] Other examples FIG. 1AAs shown, the filter die 116 is encapsulated by a first encapsulation layer 126(1) and a second encapsulation layer 126(2) (e.g., a molding overlay in this example) to protect and insulate the filter die 116. The first encapsulation layer 126(1) and the second encapsulation layer 126(2) are formed of a coating material, such as a molding material, which is applied (i.e., formed) on the filter die 116 during the manufacture and / or assembly of the BDMP 102. For example, the first encapsulation layer 126(1) may initially also be applied to the filter die 116, and the second encapsulation layer 126(2) may be applied to the first encapsulation layer 126(1). The first encapsulation layer 126(1) also closes the gap 120 between the filter die 116 and the package substrate 104, thereby forming an air cavity 122. However, as FIG. 1B A close-up partial side view of the die package 100 is shown. As part of the process of forming the first encapsulation layer 126(1), a portion 128 of the encapsulation material used to form the first encapsulation layer 126(1) (“encapsulation material portion 128”) may enter / permeate into the gap 120 adjacent to the die edge 130 of the filter die 116. The encapsulation material portion 128 may enter the gap 120 between the filter die 116 and the package substrate 104 below the filter die 116. It should be noted that the encapsulation material portion 128 may also enter into the gap between the filter die 116 and the package substrate 104. FIG. 1B The gap 120 between the adjacent edges of the other die edges of the filter die 116 (not shown). Therefore, the encapsulation material portion 128 of the first encapsulation layer 126(1) enters a portion that would otherwise be part of the air cavity 122 of the filter 114. It is important to prevent or reduce the infiltration of encapsulation material or other materials into the air cavity 122 so as not to unintendedly alter the acoustic filtering characteristics of the air cavity 122 of the filter die 116, thereby avoiding yield loss and / or reliability failure.

[0039] To prevent or reduce the infiltration or flow of materials (e.g., encapsulating materials, such as molding materials and / or coating materials) into the filter's air cavity so as not to alter the acoustic filtering characteristics of the air cavity, FIG. 2A to FIG. 2C-2 An example of a die package 200 is illustrated. This die package is an exposed die package and includes a protective structure 202 configured to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the air cavity 204 of a filter 206 within the die package 200. The filter 206 in this example is an exposed die filter. FIG. 2AThis is a side view of the die package 200. In this example, as discussed in more detail below, the die package 200 includes a protective structure 202 in the form of one or more channels 208, which are arranged adjacent to a gap 210 between a die 212 operable for use in a filter 206 and a first top surface 214 of a substrate 216 (e.g., a package substrate). Therefore, the die 212 is referred to herein as "filter die 212". The filter die 212 may include filter circuitry and / or devices, such as acoustic wave (AW) filters, which may be surface acoustic wave (SAW) filters or bulk acoustic wave (BAW) filters. In this example, as discussed in more detail below, the channels 208 are disposed in the gap 210. This example of the die package 200 includes a plurality of channels 208. The channels 208 are configured to redirect encapsulation material 218 (e.g., molding material and / or coating material) or other materials to prevent them from entering or seeping into the air cavity 204 of the filter 206.

[0040] In this example, FIG. 2AThe die package 200 is an integrated circuit (IC) package that includes an exposed semiconductor die (“die”) in the form of a filter die 212. An exposed die is a die in an IC package that has an unencapsulated region between its surface and a coupling surface adjacent to that surface (e.g., the surface of a package substrate). In this example, filter 206 includes a filter die 212 coupled to a substrate 216, which may be a package substrate. The substrate 216 in this example includes one or more metallization layers 220(1) to 220(X) parallel to each other in a first horizontal direction (X-axis and / or Y-axis direction). In this example, the metallization layers 220(1) to 220(X) include corresponding metal interconnects 222(1) to 222(X) (e.g., metal traces, metal lines) to provide external signal routing to the filter die 212. The filter die 212 is mechanically and electrically coupled to the substrate 216 via one or more metal bumps 224 (e.g., metal interconnects, solder balls, BGA interconnects) coupled to metal interconnects 222(1) adjacent to the upper metallization layer 220(1) of the filter die 212. The metal bumps 224 are coupled to and between a first top surface 214 of the substrate 216 and a second bottom surface 226 of the filter die 212. In this way, a gap 210 exists between the second bottom surface 226 of the filter die 212 and the substrate 216 due to the support height of the metal bumps 224 in a second vertical direction (Z-axis direction) orthogonal to the first horizontal direction (X-axis and / or Y-axis direction). The gap 210 provides an air cavity 204 between the filter die 212 and the first surface 214 of the substrate 216 in the active filter region 228 of the filter die 212 to provide an acoustic air cavity for the filter 206. The active filter region 228 of the filter die 212 is a region on the second bottom surface 226 of the filter die 212 that includes circuitry and / or filtering material (i.e., piezoelectric material) relating to the filtered signal as part of the capability of the filter 206. The volume of the air cavity 204 is specifically designed so that the filter 206 provides the desired acoustic filtering characteristics.

[0041] Other examples FIG. 2AAs shown, in this example, the filter die 212 is encapsulated by a first encapsulation layer 230(1) and a second encapsulation layer 230(2) to protect and insulate the filter die 212. The first encapsulation layer 230(1) and the second encapsulation layer 230(2) are formed of an encapsulation material such as a molding material or a coating material, which is disposed on the filter die 212 during the manufacture and / or assembly of the die package 200. For example, the first encapsulation layer 230(1) may initially be deposited on the filter die 212, and the second encapsulation layer 230(2) is disposed on the first encapsulation layer 230(1). The first encapsulation layer 230(1) also closes the gap 210 between the filter die 212 and the substrate 216, thereby forming a gas cavity 204. However, as part of the process of forming the first encapsulation layer 230(1), encapsulation material 218 from the first encapsulation layer 230(1) or the second encapsulation layer 230(2) enters or permeates into the gap 210 adjacent to the first die edge 232(1) and / or the second die edge 232(2) of the filter die 212, wherein the first die edge 232(1) and the second die edge 232(2) are adjacent to the second bottom surface 226 of the filter die 212. It should be noted that the filter die 212 includes at least two (2) additional die edges, which are not present if the filter die 212 is generally rectangular in shape. FIG. 2A The side view shows this. However, the encapsulating material 218 may enter or seep into the gap 210 adjacent to the die edges 232(1), 232(2). However, in this example, in order to prevent or reduce the seepage of the encapsulating material 218 into the air cavity 204 of the filter 206 so as not to change the acoustic filtering characteristics of the air cavity 204 in an unintended manner to avoid yield loss and / or reliability problems, the channel 208 is provided in the gap 210 adjacent to the first die edge 232(1) and the second die edge 232(2) as a protective structure 202, which will now be discussed in more detail.

[0042] like FIG. 2AAs shown, channel 208 is located in the non-active region 234 of filter 206 between the corresponding first die edge 232(1) and second die edge 232(2) of filter die 212 and the corresponding adjacent metal bump 224 in the first horizontal direction (X-axis and / or Y-axis direction). It should be noted that channel 208 may be positioned only adjacent to a die edge, such as the first die edge 232(1). The non-active region 234 of filter 206 in gap 210 does not include the circuitry and / or filtering material (i.e., piezoelectric material) on the second bottom surface 226 of filter die 212 that pertains to the filtered signal as part of the capability of filter 206. In this example, active filter region 228 is located in gap 210 such that metal bump 224 is located between the active filter region 228 and the non-active region 234 of filter 206 in the first horizontal direction (X-axis and / or Y-axis direction). Channel 208 provides additional volume and flow path to allow material to flow within and along the channel due to capillary flow, redirecting excess encapsulating material 218 (e.g., molding material and / or coating material) adjacent to the first die edge 232(1) and / or the second die edge 232(2) to prevent or reduce the infiltration of this excess encapsulating material into the air cavity 204 in the active filter region 228 of the filter die 212. Channel 208, positioned within gap 210, also reduces the height of gap 210 adjacent to the first die edge 232(1) and the second die edge 232(2) of the filter die 212, thereby providing a smaller area for the encapsulating material 218 to enter the air cavity 204 in the active filter region 228 of the filter die 212. In this example, channel 208 is located outside the active filter region 228 of filter 206. The active filter region 228 is located in the gap 210 such that the metal bump 224 is positioned between the active filter region 228 and the passive region 234 of the filter 206 in a first horizontal direction (X-axis and / or Y-axis direction). Therefore, in this example, the encapsulating material 218 present in the passive region 234 in the gap 210 and inside the channel 208 does not affect the acoustic characteristics of the air cavity 204 in the active filter region 228 of the filter 206.

[0043] FIG. 2B-1 and FIG. 2B-2 These are top and side views of the corresponding portions of filter die 212(1), which can be... FIG. 2A The filter die 212 in filter 206. FIG. 2B-1 and FIG. 2B-2 The filter die 212(1) and FIG. 2A The common components between the filter dies 212 are shown by common component numbers. FIG. 2B-1 and FIG. 2B-2The filter die 212(1) in the middle has continuous channels 208(1) (which can be FIG. 2A Channel 208 in the filter die 212(1) serves as a protective structure 202(1) formed on the second bottom surface 226 of the filter die 212(1), which extends continuously in a closed pattern around the non-active region 234 of the filter die 212(1). FIG. 2B-1 A partial top view of the filter die 212(1) is shown, in which continuous channels 208(1) extend continuously adjacent to the first die edge 232(1) and the third die edge 232(3), the third die edge being adjacent to the first die edge 232(1) and extending in a direction orthogonal to the direction of the first die edge (Y-axis direction) (X-axis direction). However, it should be noted that although FIG. 2B-1 Not shown, but the continuous channel 208(1) may extend continuously adjacent to each of the first, second, third, and fourth die edges 232(1) to 232(4) of the filter die 212(1) to completely surround the active filter region 228 of the filter die 212(1). The continuous channel 208(1) provides additional volume and flow path to allow material to flow in and along the continuous channel 208(1) due to capillary flow. This will redirect excess encapsulation material 218 (e.g., molding material and / or coating material) adjacent to the die edges 232(1) to 232(4) to prevent or reduce the infiltration of this excess encapsulation material into the air cavity 204 in the active filter region 228 of the filter die 212(1) (see also...). FIG. 2A ).

[0044] like FIG. 2B-1 and FIG. 2B-2 As shown, each of the continuous channels 208(1) is formed from two adjacent channel structures 236(1), which extend parallel to each other and beyond the second bottom surface 226 of the filter die 212(1), such that the channel structures 236(1) extend into the gap 210 (see [reference]). FIG. 2AThe channel structure 236(1) may be composed of a metallic or dielectric material, which may be manufactured or processed as a residual structure from the manufacture of the filter die 212(1) and / or the die package 200. For example, the channel structure 236(1) may be composed of a photoresist structure, a dielectric structure, a metallic structure, or a passivation structure formed by a corresponding deposited photoresist film layer, dielectric layer, metallic layer, or passivation layer on the second bottom surface 226 of the filter die 212(1) as part of patterning an opening for the under-bump metal (UBM) 238. The channel structure 236(1) is formed between the corresponding adjacent die edges 232(1) to 232(4) and the metallic bumps 224 and their corresponding UBM 238 on the filter die 212(1), such that the continuous channel 208(1) is located in the non-active region 234 of the filter die 212(1).

[0045] Therefore, as FIG. 2A as well as FIG. 2B-1 to FIG. 2B-2 As shown, the continuous channel 208(1) can redirect material (such as encapsulation material 218) to prevent it from entering the gap 210 adjacent to one or more of the die edges 232(1) to 232(4) of the filter die 212(1), and thus redirect the material to prevent and / or reduce the amount of material entering the air cavity 204 in the active filter region 228 of the filter die 212(1). Providing the continuous channel 208(1) as a protective structure 202(1) also avoids the need to enlarge the die size of the filter die 212(1) to provide sufficient area in the gap 210 between one or more of the die edges 232(1) to 232(4) and the active filter region 228 of the filter die 212(1) to accommodate material, thereby reducing or preventing such material from penetrating or entering the air cavity 204 in the active filter region 228 of the filter die 212(1).

[0046] FIG. 2C-1 and FIG. 2C-2 These are top and side views of a corresponding portion of another alternative filter die 212(2), which may be FIG. 2A The filter die 212 in filter 206. FIG. 2C-1 and FIG. 2C-2 The filter die 212(2) and FIG. 2A The common components between the filter dies 212 are shown by common component numbers. FIG. 2C-1 and FIG. 2C-2 The filter die 212(2) in the middle has a discontinuous channel 208(2) (which can be FIG. 2AChannel 208 in the filter die 212(2) serves as a protective structure 202(2) formed on the second bottom surface 226 of the filter die 212(2), which extends in a closed pattern around the non-active region 234 of the filter die 212(2). FIG. 2C-1 and FIG. 2C-2 As shown, each of the discontinuous channels 208(2) is formed from two adjacent discontinuous channel structures 236(2), which extend parallel to each other and beyond the second bottom surface 226 of the filter die 212(2), such that the channel structures 236(2) extend into the gap 210 (see [reference]). FIG. 2A The discontinuous channel structure 236(2) has an opening 240 that allows additional flow paths into the discontinuous channel 208(2). This allows encapsulation material 218 or other materials to more easily enter the discontinuous channel 208(2) and then be retained within the discontinuous channel 208(2) to prevent or reduce the entry or infiltration of such materials into the gaps 210 in the active filter region 228 of the filter die 212(2). The discontinuous channel 208(1) provides additional volume and flow paths to allow material to flow in and along the discontinuous channel 208(2) due to capillary flow. This redirects excess encapsulation material 218 (e.g., molding material and / or coating material) adjacent to the die edges 232(1) to 232(4) to prevent or reduce the infiltration of such excess encapsulation material into the air cavities 204 in the active filter region 228 of the filter die 212 (see also...). FIG. 2A ).

[0047] like FIG. 2C-1 A partial top view of the filter die 212(2) is shown. Discontinuous channels 208(2) extend continuously adjacent to the first die edge 232(1) and the third die edge 232(3). The third die edge is adjacent to the first die edge 232(1) and extends in a direction orthogonal to the direction of the first die edge (Y-axis direction) (X-axis direction) to prevent or reduce the entry or infiltration of encapsulation material 218 into the active filter region 228 of the filter die 212(2) and into the gas cavity 204 (see [reference]). FIG. 2A However, it should be noted that, although FIG. 2C-1 Not shown, but the discontinuous channel 208(2) may extend continuously adjacent to each of the first, second, third and fourth die edges 232(1) to 232(4) of the filter die 212(2) to completely surround the active filter region 228 of the filter die 212(2).

[0048] The channel structure 236(2) may be composed of a metallic or dielectric material, and may be manufactured or processed as a residual structure from the manufacture of the filter die 212(2) and / or the die package 200. For example, the channel structure 236(2) may be composed of a photoresist structure, a dielectric structure, a metallic structure, or a passivation structure, which are formed by corresponding deposited photoresist film layers, dielectric layers, metallic layers, or passivation layers formed on the second bottom surface 226 of the filter die 212(2) as part of patterning the opening for the UBM 238. The channel structure 236(2) is formed between the corresponding adjacent die edges 232(1) to 232(4) and the metallic bumps 224 on the filter die 212(2) and their corresponding UBM 238, such that the discontinuous channel 208(2) is located in the non-active region 234 of the filter die 212(2).

[0049] Therefore, as FIG. 2A as well as FIG. 2C-1 to FIG. 2C-2 As shown, the discontinuous channel 208(2) redirects material (such as encapsulation material 218) to prevent it from entering the gap 210 adjacent to one or more of the die edges 232(1) to 232(4) of the filter die 212(2), and thus redirects the material to prevent and / or reduce the amount of material entering the air cavity 204 in the active filter region 228 of the filter die 212(2). Providing the discontinuous channel 208(2) as a protective structure 202(2) also avoids the need to enlarge the die size of the filter die 212(2) to provide sufficient area in the gap 210 between one or more of the die edges 232(1) to 232(4) and the active filter region 228 of the filter die 212(2) to accommodate material, thereby reducing or preventing such material from penetrating or entering the air cavity 204 in the active filter region 228 of the filter die 212(2).

[0050] FIG. 3 This is a side view of another exemplary die package 300, which is an exposed die package and includes features similar to... FIG. 2A The filter 306 in the bare die package 200. However, FIG. 3 The bare die package 300 includes an alternative protective structure 302 in the form of a raised structure 308. FIG. 2A The bare die package 200 and FIG. 3Common components among the die packages are shown by common component numbering. As discussed below, although the protrusion 308 does not include or form a channel, it can also redirect material, prevent and / or reduce material (e.g., encapsulation material, such as molding material and / or coating material) entering or seeping into the air cavity 204 of the filter die 212. This is because the protrusion 308 is coupled to and extends from the second bottom surface 226 of the filter die 212 into the gap 210. In this example, the protrusion 308 also extends to the first die edge 232(1) and the second die edge 232(2) of the filter die 212 to intersect with the corresponding planes P1, P2 (in the YZ-axis plane) of the first die edge 232(1) and the second die edge 232(2) in the second vertical direction (Z-axis direction).

[0051] like FIG. 3 As shown, the protrusion 308 is located in the non-active region 234 of filter 306 between the corresponding first die edge 232(1) and second die edge 232(2) of filter die 212 and the corresponding adjacent metal bump 224 in the first horizontal direction (X-axis and / or Y-axis direction). Filter 306 in this example is an exposed die filter. It should be noted that the protrusion 308 may be positioned only adjacent to a die edge, such as the first die edge 232(1). The protrusion 308 reduces the height H1 of gap 210 to a reduced height H2 adjacent to the first die edge 232(1) and the second die edge 232(2) to reduce the area in which material can enter gap 210 and possibly enter the air cavity 204 in the active filter region 228 of filter die 212. The reduced height H2 of the gap 210 caused by the protrusion 308 increases the resistance in the gap 210 adjacent to the first die edge 232(1) and the second die edge 232(2), preventing further material from entering the gap 210 beyond the protrusion 308 in the horizontal direction (X-axis and / or Y-axis direction). Therefore, in this example, the encapsulating material 218 present in the non-active region 234 of the gap 210 and adjacent to the protrusion 308 does not affect the acoustic characteristics of the air cavity 204 in the active filter region 228 of the filter 306.

[0052] In this example, the protrusion structure 308 may be a single protrusion structure 308 that extends in a closed pattern around the entire non-active region 234 of the filter die 212. Alternatively, the protrusion structure 308 may be a plurality of individual protrusion structures 308 strategically located in different and various regions adjacent to one or more die edges 232(1) to 232(4) of the filter die 212.

[0053] FIG. 4This is a side view of yet another exemplary die package 400, which is an exposed die package and includes features similar to... FIG. 3 The filter 406 in the bare die package 300. However, FIG. 4 The die package 400 includes an alternative protective structure 402 in the form of a die recess 408. FIG. 3 The bare die package 300 and FIG. 4 Common elements among the die packages 400 are shown by common element numbering. As discussed below, although the die recess 408 does not include or form a channel, the die recess 408 may also redirect material and prevent and / or reduce the entry or penetration of material (e.g., encapsulation material, such as molding material and / or coating material) into the air cavity 204 of the filter die 212. The die recess 408 is formed in the filter die 212 adjacent to the gap 210. As an example, the die recess 408 may be formed by performing a retaining die cut on the filter die 212 during the manufacture and / or assembly of the filter die 212 or the die package 400. In this example, the die recess 408 is formed adjacent to and / or located outside the air cavity 204 in one or more die edges 232(1), 232(2) of the filter die 212 and in the active filter region 228 of the filter die 212. The die recess 408 in the filter die 212 provides additional space volume as a reservoir that can accommodate and retain encapsulation material 218 (e.g., molding material and / or coating material). This reduces or prevents such encapsulation material 218 from entering or seeping into the air cavity 204 in the active filter region 228 of the filter die 212. The additional space volume provided by the die recess 408 in the filter die 212 essentially provides a region with reduced resistance compared to the gap 210, causing the encapsulation material 218 to enter and remain outside the air cavity 204 in the active filter region 228 of the filter die 212.

[0054] like FIG. 4As shown, the die recess 408 is located in the non-active region 234 of filter 406 between the corresponding first die edge 232(1) and second die edge 232(2) of filter die 212 and the corresponding adjacent metal bump 224 in the first horizontal direction (X-axis and / or Y-axis direction). In this example, filter 406 is an exposed die filter. In this example, the die recess 408 also extends to the first die edge 232(1) and second die edge 232(2) of filter die 212 to intersect with the corresponding planes P1, P2 (in the YZ-axis plane) of the first die edge 232(1) and second die edge 232(2) in the second vertical direction (Z-axis direction). It should be noted that the die recess 408 may be positioned only adjacent to one die edge, such as the first die edge 232(1). The die recess 408 increases the height H1 of the gap 210 to an increased height H3 adjacent to the first die edge 232(1) and the second die edge 232(2), thereby increasing the area in the gap 210 in the non-active region 234 of the filter die 212 that the encapsulating material 218 can enter, and thus reducing the likelihood of such encapsulating material 218 entering the air cavity 204 in the active filter region 228 of the filter die 212. The increased height H3 of the gap 210 in the non-active region 234 caused by the die recess 408 reduces the resistance in the gap 210 adjacent to the first die edge 232(1) and the second die edge 232(2), facilitating material entry from the top into the die recess 408. Therefore, in this example, the encapsulating material 218 present in the non-active region 234 in the gap 210 and in the die recess 408 and adjacent to the die edges 232(1), 232(2) does not affect the acoustic characteristics of the air cavity 204 in the active filter region 228 of the filter 406.

[0055] In this example, the die recess 408 may be a single die recess 408 that extends in a closed pattern around the entire non-active region 234 of the filter die 212. Alternatively, the die recess 408 may be a plurality of individual die recesses 408 strategically located in different and various regions adjacent to one or more die edges 232(1) to 232(4) of the filter die 212, cut or otherwise formed in the second bottom surface 226 of the filter die 212.

[0056] FIG. 5This is a flowchart illustrating an exemplary manufacturing process 500 of a die package including a filter, the filter including a die (“filter die”) coupled to a substrate capable of operating as a filter, the substrate having a cavity formed in a gap between the filter die and the substrate, wherein the die package also includes protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... FIG. 2A , FIG. 2B-1 to FIG. 2B-2 , FIG. 2C-1 to FIG. 2C-2 , FIG. 3 and FIG. 4 The bare die packages in the series are 200, 300, and 400. FIG. 5 The manufacturing process 500 is about FIG. 2A to FIG. 4 The bare die package described is any one of 200, 300, or 400. However, it should be noted that... FIG. 5 The manufacturing process 500 can also be used to manufacture other die packages including filters, the filters including filter dies coupled to a substrate having air cavities formed in the gap between the filter dies and the substrate, wherein the die package also includes protective structures to redirect materials (e.g., encapsulation materials, such as molding materials and / or coating materials) to prevent them from entering or seeping into the air cavity of the filter.

[0057] In this respect, such as FIG. 5 As shown, the first exemplary step in the manufacturing process 500 in this example is to provide a substrate 216 including a first surface 214. FIG. 5 (See box 502 in the text). Another exemplary step in the manufacturing process 500 is to provide filter dies 212, 212(1), 212(2) including a second surface 226, a plurality of die edges 232(1) to 232(4) adjacent to the second surface 226, and a plurality of metal bumps 224 coupled to the second surface 226. FIG. 5 (Box 504 in the middle). Another exemplary step in the manufacturing process 500 is to form one or more protective structures 202, 202(1), 202(2), 302, 402 (in the middle) located on the filter dies 212, 212(1), 212(2) and adjacent to the first die edge 232(1) of the plurality of die edges 232(1) to 232(4). FIG. 5 (See box 506 in the text). Another exemplary step in the manufacturing process 500 is to couple a plurality of metal bumps 224 to a first surface 214 of the substrate 216 to form an air cavity 204 in the gap 210 between the first surface 214 and the filter dies 212, 212(1), 212(2), and to arrange one or more protective structures 202, 202(1), 202(2), 302, 402 adjacent to the gap 210 (see box 506 in the text).FIG. 5 (Box 508 in the middle).

[0058] A die package including a filter can be manufactured in other manufacturing processes. The filter includes a die (“filter die”) coupled to a substrate that is operable as a filter. The substrate has a cavity formed in a gap between the filter die and the substrate. The die package also includes protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... FIG. 2A , FIG. 2B-1 to FIG. 2B-2 , FIG. 2C-1 to FIG. 2C-2 , FIG. 3 and FIG. 4 The bare die packages in the series are 200, 300, and 400.

[0059] For example, FIG. 6 , FIG. 8A to FIG. 8B , FIG. 10A to FIG. 10B as well as FIG. 12A to FIG. 12B This illustrates the manufacture of structures with protective features (e.g., FIG. 2A to FIG. 2C-2 Flowcharts of alternative manufacturing processes 600, 800, 1000, and 1200 for the bare die package (200) in the example. FIG. 6 The manufacturing process 600 is a process of patterning a protective structure of a die (“filter die”) that can be operated as a filter into a photoresist film structure formed by photoresist film layers. FIG. 7A to FIG. 7B Examples are given based on FIG. 6 Exemplary manufacturing stages 700A to 700B of the exemplary manufacturing process 600. FIG. 8A to FIG. 8B The manufacturing process 800 is a process of patterning a protective structure that can be operated as a filter die (“filter die”) into a dielectric material structure formed by a dielectric layer. FIG. 9A to FIG. 9C Examples are given based on FIG. 8A to FIG. 8B Exemplary manufacturing stages 900A to 900C of the exemplary manufacturing process 800. FIG. 10A to FIG. 10B The manufacturing process 1000 is a process of patterning a protective structure that can be operated as a filter die (“filter die”) into a metal structure formed of metal layers. FIG. 11A to FIG. 11C Examples are given based on FIG. 10A to FIG. 10B Exemplary manufacturing stages 1100A to 1100C of the exemplary manufacturing process 1000. FIG. 12A to FIG. 12B The manufacturing process 1200 is a process of patterning a protective structure that can be operated as a filter die (“filter die”) into a passivation structure formed by a passivation layer. FIG. 13A to FIG. 13D Examples are given based on FIG. 12A to FIG. 12B Exemplary manufacturing stages 1300A to 1300D of the exemplary manufacturing process 1200.

[0060] Now using FIG. 2A To illustrate, we will use the example of the bare die package 200. FIG. 6 , FIG. 8A to FIG. 8B , FIG. 10A to FIG. 10B as well as FIG. 12A to FIG. 12B The manufacturing processes are 600, 800, 1000, and 1200. However, it should be noted that... FIG. 6 , FIG. 8A to FIG. 8B , FIG. 10A to FIG. 10B as well as FIG. 12A to FIG. 12B The discussion of manufacturing processes 600, 800, 1000, and 1200 in the text is not limited to manufacturing. FIG. 2A The bare die package 200.

[0061] In this respect, such as FIG. 7A The exemplary manufacturing stage 700A illustrates that the exemplary step in manufacturing process 600 for patterning a protective structure capable of operating as a die (“filter die”) as a photoresist film structure formed from a photoresist film layer can provide a filter die 212 having an active filter region 228. FIG. 6 (See box 602 in the image). Filter dies 212 may be provided as part of a semiconductor wafer 702, which includes a plurality of filter dies 212 that will eventually be diced. Active filter region 228 is a region of filter die 212 that includes circuitry 704 and / or filtering material (i.e., piezoelectric material) on the second bottom surface 226 of the filter die 212 relating to filtered signals. Photoresist layer 706 is deposited on active filter region 228 and the second bottom surface 226 of filter die 212 to prepare for patterning of photoresist layer 706, which will ultimately be used to form channels 208 of protective structure 202. FIG. 6 (Box 602 in the middle). Subsequently, the photoresist film layer 706 is patterned and a portion of the photoresist film layer 706 is removed to form adjacent parallel channel structures 236, wherein channels 208 are formed as protective structures 202 in the openings 708 between the channel structures 236 ( FIG. 6 (Box 604 in the middle).

[0062] It should be noted that FIG. 7B Only one channel 208 formed for the protective structure 202 is shown; however, the photoresist layer 706 can be patterned to form multiple channels, for example... FIG. 2A , FIG. 2B-1 and / or FIG. 2C-1 Channels 208, 208(1), and 20(2) are shown. It should also be noted that, alternatively, the photoresist layer 706 can be patterned to form a channel structure 236, such as adjacent to the edge 232(1) of the die, thereby forming a raised structure as a protective structure, as... FIG. 3 The bare die package 300.

[0063] like FIG. 9A Exemplary manufacturing stage 900A illustrates that an exemplary step in manufacturing process 800 for patterning a protective structure capable of operating as a filter die (“filter die”) into a dielectric material structure formed of a dielectric material layer can provide a filter die 212 having an active filter region 228. FIG. 8A (See box 802 in the image). Filter dies 212 may be provided as part of semiconductor wafer 902, which includes multiple filter dies 212 that will eventually be diced. Dielectric layer 904 is deposited on active filter region 228 and second bottom surface 226 of filter dies 212 to prepare for patterning of dielectric layer 904, which will ultimately be used to form channels 208 of protective structure 202. FIG. 8A (See box 802 in the image). Then, a photoresist layer 706 is deposited on the dielectric layer 904 and patterned to form openings 708 in the photoresist layer 706, thereby preparing for the patterning of the dielectric layer 904, which will ultimately be used to form channels 208 of the protective structure 202. FIG. 8A (See box 802 in the image). Patterning the photoresist layer 706 may involve exposing the photoresist layer 706 with a mask and developing the photoresist layer 706. Then, the patterning of the photoresist layer 706 is used to remove (e.g., using etching, dry etching, etc.) portions of the dielectric layer 904 to enlarge the opening 708 formed in the photoresist layer 706. Then, as... FIG. 9B As shown in manufacturing stage 900B, a portion of dielectric layer 904 is removed to form adjacent parallel channel structures 236, which extend into dielectric layer 904, wherein channels 208 are formed as protective structures 202 in openings 708 between channel structures 236. FIG. 8A (Box 804 in the middle). Then, as... FIG. 9C As shown in manufacturing stage 900C, the photoresist film layer 706 can be removed from the dielectric layer 904, leaving the filter die 212 on which the protective structure 202 is formed. FIG. 8B (Box 806 in the middle).

[0064] It should be noted that FIG. 9C Only one channel 208 formed for the protective structure 202 is shown; however, the photoresist layer 706 can be patterned to form multiple channels, for example... FIG. 2A , FIG. 2B-1 and / or FIG. 2C-1 Channels 208, 208(1), and 208(2) are shown. It should also be noted that, alternatively, dielectric layer 904 may be patterned to form a channel structure 236, such as adjacent to the edge 232(1) of the die, thereby forming a raised structure as a protective structure, as... FIG. 3The bare die package 300.

[0065] like FIG. 11A Exemplary steps in manufacturing process 1000, exemplified by exemplary manufacturing stage 1100A, for patterning a protective structure capable of operating as a die (“filter die”) as a metal structure formed of metal layers, can provide a filter die 212 having an active filter region 228. FIG. 10A (See box 1002 in the image). Filter dies 212 may be provided as part of semiconductor wafer 1102, which includes a plurality of filter dies 212 that will eventually be diced. A photoresist layer 706 is deposited on the active filter region 228 and the second bottom surface 226 of the filter dies 212 to prepare for patterning of a metal layer that will ultimately be used to form the channels 208 of the protective structure 202. FIG. 10A (See box 1002 in the image). Then, the photoresist layer 706 is patterned to form openings 708 within it, which will ultimately be used to form channels 208 of the protective structure 202. FIG. 10A (See box 1002 in the image). Patterning the photoresist layer 706 may involve exposing the photoresist layer 706 with a mask and developing the photoresist layer 706. Then, as... FIG. 11B As shown in exemplary manufacturing stage 1100B, a metal layer 1104 is deposited on the photoresist film layer 706 that has not been removed and in the opening 708. FIG. 10A (Frame 1004 in the middle). This is for preparing the metallic material deposited in the opening 708 to form the protective structure 202. Then, as FIG. 11C As shown in exemplary manufacturing stage 1100C, a metal layer 1104 present on a photoresist film layer 706 is removed together with the photoresist film layer 706. This leaves portions of the metal layer 1104 to form adjacent parallel channel structures 236, wherein channels 208 are formed in openings 708 between the channel structures 236 as protective structures 202. FIG. 10B (Box 1006 in the middle).

[0066] It should be noted that FIG. 11C Only one channel 208 formed for the protective structure 202 is shown; however, the metal layer 1104 can be patterned to form multiple channels, for example... FIG. 2A , FIG. 2B-1 and / or FIG. 2C-1 Channels 208, 208(1), and 208(2) are shown. It should also be noted that, alternatively, the metal layer 1104 may be patterned to form a channel structure 236, such as adjacent to the edge 232(1) of the bare die, thereby forming a raised structure as a protective structure, as... FIG. 3 The bare die package 300.

[0067] likeFigure 13A Exemplary steps in manufacturing process 1200, exemplified by exemplary manufacturing stage 1300A, for patterning a protective structure capable of operating as a die (“filter die”) as a passivation structure formed by a passivation layer, can provide a filter die 212 having an active filter region 228. Figure 12A (See box 1202 in the image). Filter dies 212 may be provided as part of semiconductor wafer 1302, which includes a plurality of filter dies 212 that will eventually be diced. Passivation layer 1306 is deposited on active filter region 228, adjacent to metal structure 1308 formed on second bottom surface 226 of filter die 212, and on second bottom surface 226 of filter die 212 to prepare for patterning of metal layer, which will ultimately be used to form channels 208 of protective structure 202. Figure 12A (Box 1202 in the middle). Then, as... Figure 13B As shown in exemplary manufacturing stage 1300B, a photoresist film layer 706 is subsequently deposited on a passivation layer 1306 and patterned to form openings 708 in the photoresist film layer 706, thereby preparing for patterning of the passivation layer 1306, which will ultimately be used to form channels 208 of the protective structure 202. Figure 12A (See box 1204 in the image). Patterning of the photoresist layer 706 may involve exposing the photoresist layer 706 with a mask and developing the photoresist layer 706.

[0068] Then, as Figure 13C As shown in exemplary manufacturing stage 1300C, the passivation layer 1306 present in the opening 708 of the photoresist film layer 706 is removed. This leaves portions of the passivation layer 1306 to form adjacent parallel channel structures 236, wherein channels 208 are formed in the openings 708 between the channel structures 236 as protective structures 202. Figure 12B (Box 1206 in the text). Then, as... Figure 13D As shown in exemplary manufacturing stage 1300D, photoresist layer 706 is removed ( Figure 12B (Box 1208 in the middle).

[0069] It should be noted that Figure 13D Only two channels 208 formed for the protective structure 202 are shown; however, the passivation layer 1306 can be patterned to form one or more channels, for example... Figure 2A , Figure 2B-1 and / or Figure 2C-1 Channels 208, 208(1), and 208(2) are shown. It should also be noted that, alternatively, the passivation layer 1306 may be patterned to form a channel structure 236, such as adjacent to the edge 232(1) of the die, thereby forming a raised structure as a protective structure, as... Figure 3 The bare die package 300.

[0070] Figures 14A to 14C This is a flowchart illustrating another exemplary alternative manufacturing process 1400 for manufacturing a die package having, as shown in... Figure 4 The bare die package 400 provides a protective structure in the form of a bare die recess. Figures 15A to 15F Examples are given based on Figures 14A to 14C Exemplary manufacturing stages 1500A to 1500F of the exemplary manufacturing process 1400. The following will now be used... Figure 4 To illustrate, we will use the example of the bare die package 400. Figures 14A to 14C The manufacturing process in step 1400. However, it should be noted that... Figures 14A to 14C The discussion of the manufacturing process in the text is not limited to manufacturing. Figure 4 The bare die package 400.

[0071] In this respect, such as Figure 15A As shown in the exemplary manufacturing stage 1500A, manufacturing Figure 4 The first step in the bare die package 400 is to provide components including, as in... Figure 4 The wafer 1502 of multiple filter dies 212(1), 212(2) in the filter die 212 is then cut in the second vertical direction (Z-axis direction) using a cutting device 1504 (e.g., a laser or cutting blade) between the filter dies 212(1), 212(2) in the first horizontal direction to form a first recess 1503(1). Figure 14A (See box 1402 in the image). The dicing is not performed through the entire wafer 1502, but rather up to a first depth D1. Then, the dicing device 1504 is removed, and the remaining dicing in wafer 1502 will provide dicing tracks 1506 for the final dicing of filter dies 212(1), 212(2), as shown in the image. Figure 15B The exemplary manufacturing stage 1500B is shown in the example ( Figure 14B (Box 1404 in the middle).

[0072] Then, as Figure 15C As shown in the exemplary manufacturing stage 1500C, the next manufacturing step may be to perform a second cut in the cutting path 1506 in the second vertical direction (Z-axis direction) using the same or different cutting equipment 1504 (e.g., a laser), the second cut being located at a second depth D2 greater than the first depth D1, to form a second recess 1503(2). Figure 14B (in frame 1406). The second cut provides final die recesses 408(1), 408(2), which will be provided in filter dies 212(1), 212(2) to provide a protective structure, for example Figure 4The protective structure 402 shown in the die package 400. The second cut also has a width W2 that is reduced compared to the first width W1 of the first cut, so as to provide die recesses 408(1), 408(2) that are separate from the second recesses 1503(3) in the respective filter dies 212(1), 212(2) after the dies are cut. Then, the cutting device 1504 is removed, as Figure 15D The exemplary manufacturing stage 1500D is shown in the figure. Figure 14B (Box 1408 in the middle).

[0073] Then, as Figure 15E As shown in the exemplary manufacturing stage 1500E, the next manufacturing step may include grinding the wafer 1502 using grinding equipment 1510 to prepare the wafer 1502 for dicing. Figure 14C (Box 1410 in the middle). Then, as... Figure 15F As shown in the exemplary manufacturing stage 1500F, the next manufacturing step may include dicing the wafer 1502 to form individual filter dies 212(1), 212(2), each of which has residual corresponding die recesses 408(1), 408(2) as corresponding protective structures 402(1), 402(2). Figure 14C (See box 1412 in the image). It should be noted that the die recesses 408(1), 408(2) may also extend to each of the corresponding die edges 232(1), 232(2) of the filter dies 212(1), 212(2).

[0074] A die package may be provided herein as, for example, a CSP, BDMP, and / or a system-in-package (SiP), the die package including a filter, the filter including a die (“filter die”) coupled to a substrate capable of operating as a filter, the substrate having a cavity formed in a gap between the filter die and the substrate, wherein the die package further includes protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... Figure 2A , Figures 2B-1 to 2B-2 , Figures 2C-1 to 2C-2 , Figure 3 and Figure 4 The bare die packages in the series are 200, 300, and 400.

[0075] Furthermore, a die package may be provided in or integrated into any processor-based device, the die package including a filter comprising a die (“filter die”) coupled to a substrate capable of operating as a filter, the substrate having a cavity formed in a gap between the filter die and the substrate, wherein the die package further includes protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... Figure 2A , Figures 2B-1 to 2B-2 , Figures 2C-1 to 2C-2 , Figure 3 , Figure 4 , Figure 7B , Figure 9C , Figure 11C , Figure 13D and Figure 15F And according to Figures 5 to 6 , Figures 8A to 8B , Figures 10A to 10B , Figures 12A to 12B as well as Figures 14A to 14C The exemplary manufacturing processes 500, 600, 800, 1000, 1200, and 1400, and the bare die packages 200, 300, and 400 manufactured according to any aspect disclosed herein, are examples. Examples not intended to be limiting include: set-top boxes, entertainment units, navigation devices, communication devices, fixed location data units, mobile location data units, Global Positioning System (GPS) devices, mobile phones, cellular phones, smartphones, Session Initiation Protocol (SIP) phones, tablet computers, phablets, servers, computers, portable computers, mobile computing devices, wearable computing devices (e.g., smartwatches, health or fitness trackers, glasses, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle components, avionics systems, drones, and multirotor aircraft.

[0076] In this respect, Figure 16An exemplary wireless communication device 1600 is illustrated, the wireless communication device including a radio RF component formed of one or more ICs 1602, wherein any of the ICs 1602 may include a die package 1603 including a filter, the filter including a die (“filter die”) coupled to a substrate capable of operating as a filter, the substrate having a cavity formed in a gap between the filter die and the substrate, wherein the die package 1603 further includes protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... Figure 2A , Figures 2B-1 to 2B-2 , Figures 2C-1 to 2C-2 , Figure 3 , Figure 4 , Figure 7B , Figure 9C , Figure 11C , Figure 13D and Figure 15F And according to Figures 5 to 6 , Figures 8A to 8B , Figures 10A to 10B , Figures 12A to 12B as well as Figures 14A to 14C The exemplary manufacturing processes 500, 600, 800, 1000, 1200, and 1400, and the bare die packages 200, 300, and 400 manufactured according to any aspect disclosed herein. Figure 16 As shown, the wireless communication device 1600 includes a transceiver 1604 and a data processor 1606. The data processor 1606 may include memory for storing data and program code. The transceiver 1604 includes a transmitter 1608 and a receiver 1610 supporting bidirectional communication. Generally, the wireless communication device 1600 may include any number of transmitters 1608 and / or receivers 1610 for any number of communication systems and frequency bands. All or part of the transceiver 1604 may be implemented on one or more analog ICs, RFICs, mixed-signal ICs, etc.

[0077] The transmitter 1608 or receiver 1610 can be implemented using either a superheterodyne architecture or a direct conversion architecture. In a superheterodyne architecture, the signal undergoes multi-stage frequency conversion between RF and baseband. For example, for receiver 1610, the signal is converted from RF to intermediate frequency (IF) in one stage and then from IF to baseband in another stage. In a direct conversion architecture, the signal is converted between RF and baseband in a single stage. Superheterodyne and direct conversion architectures can use different circuit blocks and / or have different requirements. Figure 16 In the wireless communication device 1600, the transmitter 1608 and receiver 1610 are implemented using a direct frequency conversion architecture.

[0078] In the transmission path, data processor 1606 processes the data to be transmitted and provides I and Q analog output signals to transmitter 1608. In the exemplary wireless communication device 1600, data processor 1606 includes digital-to-analog converters (DACs) 1612(1) and 1612(2) to convert the digital signals generated by data processor 1606 into I and Q analog output signals (e.g., I and Q output currents) for further processing.

[0079] Within transmitter 1608, low-pass filters 1614(1) and 1614(2) filter the I and Q analog output signals, respectively, to remove unwanted signals caused by the previous digital-to-analog conversion. Amplifiers (AMPs) 1616(1) and 1616(2) amplify the signals from low-pass filters 1614(1) and 1614(2), respectively, and provide I and Q baseband signals. Upconverter 1618 uses mixers 1620(1) and 1620(2) to upconvert the I and Q baseband signals from transmit (TX) local oscillator (LO) signal generator 1622 to provide upconverted signal 1624. Filter 1626 filters upconverted signal 1624 to remove unwanted signals caused by upconversion and noise in the receive band. Power amplifier (PA) 1628 amplifies the up-converted signal 1624 from filter 1626 to obtain the desired output power level and provide a transmit RF signal. The transmit RF signal is routed through duplexer or switch 1630 and transmitted via antenna 1632.

[0080] In the receiving path, antenna 1632 receives signals transmitted by the base station and provides the received RF signal, which is routed through duplexer or switch 1630 and provided to low-noise amplifier (LNA) 1634. Duplexer or switch 1630 is designed to operate using a specific receive (RX) to TX duplexer frequency separation, such that the RX signal is isolated from the TX signal. The received RF signal is amplified by LNA 1634 and filtered by filter 1636 to obtain the desired RF input signal. Downconversion mixers 1638(1) and 1638(2) mix the output of filter 1636 with the I and Q RX LO signals (i.e., LO_I and LO_Q) from RX LO signal generator 1640 to generate I and Q baseband signals. The I and Q baseband signals are amplified by AMP1642(1) and 1642(2) and further filtered by low-pass filters 1644(1) and 1644(2) to obtain I and Q analog input signals, which are provided to data processor 1606. In this example, data processor 1606 includes analog-to-digital converters (ADCs) 1646(1) and 1646(2) to convert the analog input signals into digital signals to be further processed by data processor 1606.

[0081] exist Figure 16 In the wireless communication device 1600, a TX LO signal generator 1622 generates I and Q TXLO signals for up-conversion, while an RX LO signal generator 1640 generates I and Q RX LO signals for down-conversion. Each LO signal is a periodic signal with a specific base frequency. A TX phase-locked loop (PLL) circuit 1648 receives timing information from a data processor 1606 and generates control signals for adjusting the frequency and / or phase of the TX LO signals from the TX LO signal generator 1622. Similarly, an RX PLL circuit 1650 receives timing information from a data processor 1606 and generates control signals for adjusting the frequency and / or phase of the RX LO signals from the RX LO signal generator 1640.

[0082] Figure 17An example of a processor-based system 1700 is illustrated. A component of the processor-based system 1700 is IC 1702. Some or all of the components in the processor-based system 1700 may be provided in or include die packages 1704(1) to 1704(7) comprising a filter, the filter including a die (“filter die”) coupled to a substrate capable of operating as a filter, the substrate having a cavity formed in a gap between the filter die and the substrate, wherein the die packages 1704(1) to 1704(7) further include protective structures to redirect material (e.g., encapsulation material, such as molding material and / or coating material) to prevent it from entering or seeping into the cavity of the filter, including but not limited to... Figure 2A , Figures 2B-1 to 2B-2 , Figures 2C-1 to 2C-2 , Figure 3 , Figure 4 , Figure 7B , Figure 9C , Figure 11C , Figure 13D and Figure 15F And according to Figures 5 to 6 , Figures 8A to 8B , Figures 10A to 10B , Figures 12A to 12B as well as Figures 14A to 14C The exemplary manufacturing processes 500, 600, 800, 1000, 1200, and 1400, and the die packages 200, 300, and 400 manufactured according to any aspect disclosed herein, are described. In this example, a processor-based system 1700 may be formed in or included as part of a die package 1704 and formed as a system-on-a-chip (SoC) 1706. The processor-based system 1700 includes a CPU 1708, which includes one or more processors 1710, which may also be referred to as a CPU core or processor core. The CPU 1708 may be included in the die package 1704(1). The CPU 1708 may have a cache memory 1712 coupled to the CPU 1708 for fast access to temporarily stored data. The CPU 1708 is coupled to a system bus 1714 and may couple master and slave devices included in the processor-based system 1700 to each other. As is well known, the CPU 1708 communicates with these other devices by exchanging address, control, and data information via the system bus 1714. For example, the CPU 1708 may communicate bus traffic requests to the memory controller 1716, which is an example of a slave device. Although Figure 17 Not illustrated, but multiple system buses 1714 may be provided, each of which may have a different configuration.

[0083] Other master and slave devices can be connected to system bus 1714. For example... Figure 17 As illustrated, by way of example, these devices may include a memory system 1720, one or more input devices 1722, one or more output devices 1724, one or more network interface devices 1726, and one or more display controllers 1728, the memory system including a memory controller 1716 and a memory array 1718. The network interface device 1726 may be included in or may be the die package 1704(5). Each of the memory system 1720, one or more input devices 1722, one or more output devices 1724, one or more network interface devices 1726, and one or more display controllers 1728 may be provided in the same or different circuit packages. Input devices 1722 and / or output devices 1724 may be included in corresponding die packages 1704(6), 1704(7). Input devices 1722 may include any type of input device, including but not limited to input keys, switches, voice processors, etc. Output devices 1724 may include any type of output device, including but not limited to audio, video, other visual indicators, etc. Network interface device 1726 can be any device configured to allow data exchange to and from network 1730. Network 1730 can be any type of network, including but not limited to wired or wireless networks, private or public networks, local area networks (LANs), wireless local area networks (WLANs), wide area networks (WANs), and Bluetooth. ™ Networks and the Internet. The network interface device 1726 can be configured to support any type of communication protocol desired.

[0084] CPU 1708 may also be configured to access display controller 1728 via system bus 1714 to control information transmitted to one or more displays 1732. Display 1732 may be included in die package 1704(4). Display controller 1728 transmits information to be displayed to display 1732 via one or more video processors 1734, which process the information to be displayed into a format suitable for display 1732. Display controller 1728 and video processor 1734 may be included in or as die packages 1704(2), 1704(3) and the same or different circuit packages, and may be included in the same or different circuit packages containing, for example, CPU 1708. Display 1732 may include any type of display, including but not limited to cathode ray tube (CRT), liquid crystal display (LCD), plasma display, light-emitting diode (LED) display, etc.

[0085] Those skilled in the art will further understand that the various exemplary logic blocks, modules, circuits, and algorithms described in connection with the aspects disclosed herein can be implemented as electronic hardware, stored in memory or another computer-readable medium and executed by a processor or other processing device, or a combination of both. The memory disclosed herein can be of any type and size and can be configured to store any type of information desired. To clearly illustrate this interchangeability, the functionality of the various exemplary components, blocks, modules, circuits, and steps has been generally described above. How such functionality is implemented depends on the specific application, design choices, and / or design constraints imposed on the overall system. Those skilled in the art can implement the described functionality in different ways for each specific application, but such specific implementation decisions should not be construed as departing from the scope of this disclosure.

[0086] The various exemplary logic blocks, modules, and circuits described in conjunction with the aspects disclosed herein may be implemented or executed using a processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic unit, discrete hardware component, or any combination thereof, designed to perform the functions described herein. The processor may be a microprocessor, but in alternative embodiments, it may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors cooperating with a DSP core, or any other such configuration).

[0087] The aspects disclosed herein may be embodied in hardware and instructions stored in the hardware, and may reside in, for example, random access memory (RAM), flash memory, read-only memory (ROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), registers, hard disks, removable disks, CD-ROMs, or any other form of computer-readable medium known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Alternatively, the storage medium may be integral with the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a remote station. Alternatively, the processor and storage medium may reside as discrete components in a remote station, base station, or server.

[0088] It should also be noted that the operational steps described in any of the exemplary aspects of this document are described for the purpose of providing examples and discussion. The described operations may be performed in many different orders other than the order illustrated. Furthermore, the operations described in a single operational step may actually be performed in multiple different steps. Additionally, one or more operational steps discussed in the exemplary aspects may be combined. It should be understood that, as will be apparent to those skilled in the art, many different modifications may be made to the operational steps illustrated in the flowcharts. Those skilled in the art will also understand that any of a variety of different techniques and arts can be used to represent information and signals. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0089] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein can be applied to other variations. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0090] Specific implementation examples are described in the following numbered clauses: 1. A die package, the die package comprising: The substrate includes the first surface; Filter, the filter comprising: A bare die, operable for use in a filter, the bare die comprising: Second surface; and Multiple die edges, the multiple die edges being adjacent to the second surface; A plurality of metal bumps coupled to the second surface and to the first surface of the substrate, thereby forming a gap between the first surface and the die; and An air cavity, the air cavity being located in the gap between the first surface and the bare die; and One or more protective structures, each of which is adjacent to the gap and each is adjacent to a first bare edge among the plurality of bare edge edges. 2. The bare die package as described in Clause 1, wherein: The substrate includes one or more metallization layers parallel to each other in a first direction; and The one or more protective structures are located in the first direction between the edge of the first bare sheet and at least one of the plurality of metal bumps. 3. The bare die package as described in Clause 2, wherein: The bare wafer further includes: The non-active region is located in the gap between the plurality of metal bumps and the edges of the plurality of bare wafers in the first direction; An active filter region is located adjacent to the air cavity, such that the plurality of metal bumps are positioned between the active filter region and the edges of the plurality of bare dies in the first direction; and The one or more protective structures are located in the first direction between the plurality of metal bumps and the edges of the plurality of bare plates. 4. The bare die package as described in Clause 1, wherein: The substrate includes one or more metallization layers parallel to each other in a first direction; and Each of the one or more protective structures extends in the first direction to the edge of the first bare sheet and intersects with a first plane of the edge of the first bare sheet in a second direction orthogonal to the first direction. 5. A die package according to any one of Clauses 1 to 4, wherein the one or more protective structures include at least one protective structure extending adjacent to each die edge of the plurality of die edges. 6. A die package according to any one of Clauses 1 to 5, wherein the one or more protective structures comprise materials included in the group consisting of metallic materials, dielectric materials, photoresist films, and passivation layers. 7. A die package according to any one of clauses 1 to 3, 5 and 6, wherein the one or more protective structures include one or more channels located in the gap and adjacent to the edge of the first die. 8. A die package according to any one of clauses 1 to 3, 5 and 6, wherein the one or more protective structures comprise a plurality of channels parallel to each other. 9. The die package according to Clause 7, wherein one or more channels are disposed between a plurality of channel structures that are parallel to each other and extend beyond the first surface of the substrate in the gap. 10. A bare die package as described in Clause 7 or 9, wherein: The substrate includes one or more metallization layers parallel to each other in a first direction; and The one or more channels are located in the first direction between the edge of the first die and at least one of the plurality of metal bumps. 11. A die package according to any one of Clauses 7, 9 and 10, wherein the one or more channels extend continuously in a closed pattern adjacent to each of the plurality of die edges. 12. A die package according to any one of Clauses 7, 9 and 10, wherein the one or more channels are discontinuous. 13. A die package according to any one of clauses 1 to 6, wherein the one or more protective structures include a protrusion coupled to the second surface, the protrusion being located in the gap and adjacent to the edge of the first die. 14. The die package as described in Clause 13, wherein: The substrate includes one or more metallization layers parallel to each other in a first direction; and The protrusion structure is located in the first direction between the edge of the first bare sheet and at least one of the plurality of metal protrusions. 15. A die package according to any one of Clauses 1 to 6, wherein the one or more protective structures include one or more die recesses in the die, wherein the one or more die recesses are adjacent to the edge of the first die. 16. The die package as described in Clause 15, wherein: The substrate includes one or more metallization layers parallel to each other in a first direction; and The one or more die recesses extend in the first direction to the edge of the first die and intersect with a first plane of the edge of the first die in a second direction orthogonal to the first direction. 17. The die package according to Clause 15 or 16, wherein the one or more die recesses extend continuously in a closed pattern adjacent to each of the plurality of die edges. 18. A bare die package according to any one of Clauses 1 to 17, said bare die package being integrated into a device selected from the group consisting of: set-top boxes; entertainment units; navigation devices; communication devices; fixed location data units; mobile location data units; global positioning system (GPS) devices; mobile phones; cellular phones; smartphones; session initiation protocol (SIP) phones; tablet computers; tablet phones; servers; computers; portable computers; mobile computing devices; wearable computing devices; desktop computers; personal digital assistants (PDAs); monitors; computer monitors; televisions; tuners; radios; satellite radios; music players; digital music players; portable music players; digital video players; video players; digital video disc (DVD) players; portable digital video players; automobiles; vehicle components; avionics systems; unmanned aerial vehicles; and multirotor aircraft. 19. A method for manufacturing a die package, the method comprising: A substrate including a first surface is provided; Provides a die operable for use in a filter and including a second surface, a plurality of die edges adjacent to the second surface, and a plurality of metal bumps coupled to the second surface; Forming one or more protective structures located on the bare die and adjacent to the first edge of one of the plurality of bare die edges; and The plurality of metal bumps are coupled to the first surface of the substrate to form an air cavity in the gap between the first surface and the die, and the one or more protective structures are positioned adjacent to the gap. 20. The method according to Clause 19, wherein: Providing the substrate further includes providing the substrate comprising one or more metallization layers parallel to each other in a first direction; and Setting the one or more protective structures adjacent to the gap includes setting the one or more protective structures in the first direction between the edge of the first bare sheet and at least one of the plurality of metal bumps. 21. The method according to Clause 19, wherein: Providing the substrate further includes providing the substrate comprising one or more metallization layers parallel to each other in a first direction; and Setting the one or more protective structures adjacent to the gap includes setting the one or more protective structures to extend in the first direction to the edge of the first bare sheet and to intersect with a first plane of the edge of the first bare sheet in a second direction orthogonal to the first direction. 22. The method according to any one of Clauses 19 to 21, wherein forming the one or more protective structures further comprises forming at least one of the one or more protective structures extending adjacent to each of the plurality of die edges. 23. The method according to Clause 19 or 22, wherein forming the one or more protective structures includes forming one or more channels located on the die and adjacent to the edge of the first die. 24. The method according to Clause 23, wherein forming the one or more channels located on the die and adjacent to the edge of the first die comprises: The first layer is disposed on the second surface of the bare die; and The first layer is patterned to form one or more openings, the one or more openings including the one or more channels located in the first layer on the die and adjacent to the edge of the first die. 25. The method according to any one of Clauses 19 to 22, wherein forming the one or more protective structures includes forming a protrusion structure coupled to the second surface of the die and adjacent to the edge of the first die. 26. The method according to Clause 25, wherein forming the protrusion structure coupled to the second surface of the die and adjacent to the edge of the first die comprises: A first layer is disposed on the second surface of the die; and the first layer is patterned to form the protrusion structure coupled to the second surface of the die and adjacent to the edge of the first die. 27. The method according to Clause 19, wherein forming the one or more protective structures includes forming one or more die recesses in the die adjacent to the edge of the first die. 28. The method described according to Clause 27, wherein: Providing the substrate further includes providing the substrate comprising one or more metallization layers parallel to each other in a first direction; and Forming the one or more die recesses further includes forming the one or more die recesses that extend to the edge of the first die and intersect a first plane of the edge of the first die in a second direction orthogonal to the first direction. 29. The method according to Clause 27 or 28, wherein forming the one or more die recesses in the die adjacent to the edge of the first die includes cutting the second surface and adjacent to the edge of the first die to form the one or more die recesses in the die.

Claims

1. A die package, the die package comprising: A substrate, the substrate including a first surface; A filter, the filter comprising: A bare die, operable for use in a filter, the bare die comprising: Second surface; and Multiple die edges, the multiple die edges being adjacent to the second surface; A plurality of metal bumps coupled to the second surface and to the first surface of the substrate, thereby forming a gap between the first surface and the die; and An air cavity, the air cavity being located in the gap between the first surface and the bare die; and One or more protective structures, each of which is adjacent to the gap and each is adjacent to a first bare edge among the plurality of bare edge edges.

2. The die package according to claim 1, wherein: The substrate includes one or more metallization layers parallel to each other in a first direction; and The one or more protective structures are located in the first direction between the edge of the first bare sheet and at least one of the plurality of metal bumps.

3. The bare die package according to claim 2, wherein: The bare wafer also includes: The non-active region is located in the gap between the plurality of metal bumps and the edges of the plurality of bare wafers in the first direction; An active filter region is located adjacent to the air cavity, such that the plurality of metal bumps are positioned between the active filter region and the edges of the plurality of bare dies in the first direction; and The one or more protective structures are located in the first direction between the plurality of metal bumps and the edges of the plurality of bare plates.

4. The die package according to claim 1, wherein: The substrate includes one or more metallization layers that are parallel to each other in a first direction; and Each of the one or more protective structures extends in the first direction to the edge of the first bare sheet and intersects with a first plane of the edge of the first bare sheet in a second direction orthogonal to the first direction.

5. The die package of claim 1, wherein the one or more protective structures include at least one protective structure extending adjacent to each of the plurality of die edges.

6. The die package of claim 1, wherein the one or more protective structures comprise materials included in the group consisting of metallic materials, dielectric materials, photoresist films, and passivation layers.

7. The die package of claim 1, wherein the one or more protective structures include one or more channels located in the gap and adjacent to the edge of the first die.

8. The die package of claim 1, wherein the one or more protective structures comprise a plurality of channels parallel to each other.

9. The die package of claim 7, wherein one or more channels are disposed between a plurality of channel structures that are parallel to each other and extend beyond the first surface of the substrate in the gap.

10. The die package according to claim 7, wherein: The substrate includes one or more metallization layers parallel to each other in a first direction; and The one or more channels are located in the first direction between the edge of the first die and at least one of the plurality of metal bumps.

11. The die package of claim 7, wherein the one or more channels extend continuously in a closed pattern adjacent to each of the plurality of die edges.

12. The die package of claim 7, wherein the one or more channels are discontinuous.

13. The die package of claim 1, wherein the one or more protective structures include a protrusion coupled to the second surface, the protrusion being located in the gap and adjacent to the edge of the first die.

14. The die package according to claim 13, wherein: The substrate includes one or more metallization layers parallel to each other in a first direction; and The protrusion structure is located in the first direction between the edge of the first bare sheet and at least one of the plurality of metal protrusions.

15. The die package of claim 1, wherein the one or more protective structures include one or more die recesses in the die, wherein the one or more die recesses are adjacent to the edge of the first die.

16. The die package according to claim 15, wherein: The substrate includes one or more metallization layers that are parallel to each other in a first direction; and The one or more die recesses extend in the first direction to the edge of the first die and intersect with a first plane of the edge of the first die in a second direction orthogonal to the first direction.

17. The die package of claim 15, wherein the one or more die recesses extend continuously in a closed pattern adjacent to each of the plurality of die edges.

18. The die package of claim 1, wherein the die package is integrated into a device selected from the group consisting of: set-top boxes; entertainment units; navigation devices; communication devices; fixed location data units; mobile location data units; global positioning system (GPS) devices; mobile phones; cellular phones; smartphones; session initiation protocol (SIP) phones; tablet computers; tablet phones; servers; computers; portable computers; mobile computing devices; wearable computing devices; desktop computers; personal digital assistants (PDAs); monitors; computer monitors; televisions; tuners; radios; satellite radios; music players; digital music players; portable music players; digital video players; video players; digital video disc (DVD) players; portable digital video players; automobiles; vehicle components; avionics systems; unmanned aerial vehicles; and multirotor aircraft.

19. A method of manufacturing a die package, the method comprising: A substrate including a first surface is provided; Provides a die operable for use in a filter and including a second surface, a plurality of die edges adjacent to the second surface, and a plurality of metal bumps coupled to the second surface; One or more protective structures are formed on the bare die and adjacent to the first edge of the plurality of bare die edges; as well as The plurality of metal bumps are coupled to the first surface of the substrate to form an air cavity in the gap between the first surface and the die, and the one or more protective structures are positioned adjacent to the gap.

20. The method of claim 19, wherein: Providing the substrate further includes providing the substrate comprising one or more metallization layers parallel to each other in a first direction; and Setting the one or more protective structures adjacent to the gap includes setting the one or more protective structures in the first direction between the edge of the first bare sheet and at least one of the plurality of metal bumps.

21. The method of claim 19, wherein: Providing the substrate further includes providing the substrate comprising one or more metallization layers parallel to each other in a first direction; and Setting the one or more protective structures adjacent to the gap includes setting the one or more protective structures to extend in the first direction to the edge of the first bare sheet and to intersect with a first plane of the edge of the first bare sheet in a second direction orthogonal to the first direction.

22. The method of claim 19, wherein forming the one or more protective structures further comprises forming at least one of the one or more protective structures extending adjacent to each of the plurality of die edges.

23. The method of claim 19, wherein forming the one or more protective structures includes forming one or more channels located on the die and adjacent to the edge of the first die.

24. The method of claim 23, wherein forming the one or more channels located on the die and adjacent to the edge of the first die comprises: The first layer is disposed on the second surface of the bare die; as well as The first layer is patterned to form one or more openings, the one or more openings including the one or more channels located in the first layer on the die and adjacent to the edge of the first die.

25. The method of claim 19, wherein forming the one or more protective structures includes forming a protrusion structure coupled to the second surface of the die and adjacent to the edge of the first die.

26. The method of claim 25, wherein forming the protrusion structure coupled to the second surface of the die and adjacent to the edge of the first die comprises: The first layer is disposed on the second surface of the bare die; as well as The first layer is patterned to form the protrusion structure coupled to the second surface of the die and adjacent to the edge of the first die.

27. The method of claim 19, wherein forming the one or more protective structures includes forming one or more die recesses in the die adjacent to the edge of the first die.

28. The method of claim 27, wherein: Providing the substrate further includes providing the substrate comprising one or more metallization layers parallel to each other in a first direction; and Forming the one or more die recesses further includes forming the one or more die recesses that extend to the edge of the first die and intersect a first plane of the edge of the first die in a second direction orthogonal to the first direction.

29. The method of claim 27, wherein forming the one or more die recesses in the die adjacent to the edge of the first die comprises cutting the second surface and adjacent to the edge of the first die to form the one or more die recesses in the die.

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