Preparation method of high-performance epoxy resin composite material

Abstract

The invention relates to the technical field of high polymer materials, in particular to a preparation method of a high-performance epoxy resin composite material, which comprises the following steps: carrying out secondary molecular distillation purification on epoxy resin to obtain a high-purity raw material; mixing bisphenol A and purified epoxy resin according to a set molar ratio, heating and dissolving, adding a methanol solution and a phosphorus-containing catalyst, and reacting to obtain a resin precursor; the preparation method comprises the following steps: ultrasonically dispersing nanoparticles and a reactive diluent to form a stable dispersion liquid; preheating epoxy resin, adding the dispersion liquid, stirring and ultrasonically adjusting the viscosity of the system; adding a curing agent and a toughening agent into the resin system, and stirring at a constant temperature to obtain impregnating resin; coating a mold with a release agent, injecting impregnated resin, vacuumizing, degassing, heating, supplementing materials, pressurizing, preserving heat, curing, cooling and demolding. The composite material prepared by the method is excellent in mechanical strength, heat resistance, flame retardance and stability, and good in ageing resistance and forming precision; the core technology has a synergistic effect, and the problems of insufficient purity and poor toughness are effectively solved.

Description

Technical Field

[0001] This invention relates to the field of polymer materials technology, specifically to a method for preparing a high-performance epoxy resin composite material. Background Technology

[0002] Epoxy resin, as a high-performance thermosetting resin, has established a core application position in many key fields such as electronics, aerospace, automotive manufacturing, and new energy, thanks to its excellent adhesion, insulation, chemical corrosion resistance, and good processability. In the wind power industry, epoxy resin has become the core matrix material for wind turbine blade manufacturing. Its composite materials account for more than 70% of the total blade weight, directly determining the blade's structural strength, service life, and operational reliability, and are a crucial material basis for ensuring the stable and efficient operation of wind power equipment.

[0003] In recent years, the global wind power industry has been rapidly evolving towards larger scale, offshore operation, and higher efficiency. With continuously increasing blade size and increasingly harsh operating environments, higher demands are being placed on the comprehensive performance of epoxy resin composite materials. Traditional epoxy resins suffer from insufficient mechanical properties, making it difficult to meet the high strength and high toughness structural requirements of large blades; poor flame retardancy, easily causing safety hazards in the high temperature and humidity environment at sea; and weak weather resistance, unable to withstand the corrosive effects of long-term high and low temperature cycles and ultraviolet radiation. Furthermore, traditional manufacturing processes suffer from difficulties in controlling resin viscosity, numerous molding defects, and insufficient environmental friendliness, severely hindering the further upgrading and development of the wind power industry.

[0004] Currently, while there are attempts to improve the performance of epoxy resins within the industry, many suffer from issues of optimizing only a single property and poor overall synergy. For example, some solutions increase strength by adding fillers but lead to a decrease in toughness; some diluents reduce viscosity but sacrifice the performance of the final product; and some flame-retardant modifications struggle to balance curing efficiency and environmental requirements. These technical bottlenecks mean that traditional epoxy resin composites are no longer suitable for the large-scale and offshore development needs of the wind power industry, nor can they meet the dual demands of high-end sectors for comprehensive material performance and green production. Therefore, developing a method for preparing high-performance epoxy resin composites that combines excellent mechanical properties, flame retardancy, and weather resistance, while also ensuring stable processes and environmental compliance, has become a key direction for breaking through the bottlenecks in the development of the wind power industry, promoting the independent control of the industrial chain, and driving green and low-carbon development. This has significant strategic importance for the high-quality development of the wind power industry and even the entire high-end manufacturing sector. Summary of the Invention

[0005] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a method for preparing high-performance epoxy resin composite materials.

[0006] (II) Technical Solution A method for preparing a high-performance epoxy resin composite material includes the following steps: S1. Purification of basic epoxy resin: Epoxy resin E51 is selected as raw material and purified by two-stage molecular distillation process to obtain high-purity basic epoxy resin. S2. Preparation of resin precursor: Bisphenol A and S1 basic epoxy resin are mixed at a molar ratio of 1:1.5, stirred at a rate of 300~500 r / min and heated to 60~80℃ and kept at a constant temperature. After the bisphenol A powder is completely dissolved to form a homogeneous system, the temperature is raised to 100~130℃, 50~70% methanol solution and phosphorus-containing catalyst are added, and the reaction is kept at the temperature for 1~2 h to obtain the resin precursor. S3. Nanoparticle surface modification and dispersion: Select nanoparticles and ultrasonically disperse them in an active diluent. The ultrasonic power is 100~300W and the dispersion time is 20~40min. S4. Resin system viscosity adjustment: Preheat the epoxy resin in step S1 to 100~130℃, add the nanoparticle-diluent dispersion in step S3, first mechanically stir at a rate of 500~800r / min for 30~60min, then perform ultrasonic treatment for 30~90min with an ultrasonic power of 200~400W. S5. Preparation of impregnation resin: Add curing agent and toughening agent to the resin system after adjusting the viscosity in step S4 in sequence, and continue stirring for 20~30min until the system is homogeneous to form impregnation resin; S6. Curing and Pressure Compensation: Apply a release agent evenly to the molding surface of the mold, pour the impregnation resin into the mold and then evacuate to a vacuum degree ≤10Pa; heat the mold to 180~200℃, inject the impregnation resin into the mold under vacuum until it is full, and continue heating to allow the resin to initially cure; then apply a pressure of 0.5~2MPa while continuously feeding the impregnation resin into the mold, keep warm for 1~3h, and demold after natural cooling to room temperature to obtain a high-performance epoxy resin composite material.

[0007] Preferably, the specific operating conditions for the second-stage molecular distillation in S1 are as follows: first-stage distillation temperature 80~100℃, vacuum degree 1~10Pa, second-stage distillation temperature 120~150℃, vacuum degree 0.1~1Pa, and material residence time during distillation is 5~15min.

[0008] Preferably, the phosphorus-containing catalyst in S2 is one of triphenylphosphine, tetraphenylphosphine bromide, trialkylphosphine, phosphate ester, and phosphite ester, and the amount of phosphorus-containing catalyst added is 0.1~1% of the mass of epoxy resin.

[0009] Preferably, the reactive diluent in S3 is one of 1,4-butanediol diglycidyl ether, C12-14 fatty alcohol glycidyl ether, and polypropylene glycol diglycidyl ether, wherein the epoxy value of 1,4-butanediol diglycidyl ether is 0.5~0.7 eq / 100g, and the viscosity of C12-14 fatty alcohol glycidyl ether at 25°C is 5~20 mPa·s; the amount of nanoparticles added is 0.25~20% of the mass of epoxy resin, and the amount of reactive diluent added is 5~30% of the mass of epoxy resin.

[0010] Preferably, the nanoparticles in S3 are one of carbon fiber, glass fiber, diatomaceous earth, lignin, hollow glass microspheres, talc, calcium carbonate, kaolin, and mica.

[0011] Preferably, the curing agent in S5 is one of ethylenediamine, diethylenetriamine, triethylenetetramine, cyclohexanediamine, m-phenylenediamine, and polyamide, and the amount of curing agent added is 15-45% of the mass of epoxy resin, wherein the active hydrogen equivalent of ethylenediamine is 30-35 g / eq, and the exothermic peak temperature of the curing reaction of diethylenetriamine is 80-100℃.

[0012] Preferably, the toughening agent in S5 is one of polystyrene, polylactic acid, polyethylene, polyvinyl chloride, polymethyl methacrylate, polypropylene, polyurethane, polyethylene terephthalate, polycarbonate, and acrylonitrile-butadiene-styrene copolymer, and the amount of toughening agent added is 5-15% of the resin mass. The particle size of the toughening agent is 50-200 nm, forming a uniformly dispersed phase in the epoxy resin matrix and inducing phase separation to form a sea-island two-phase structure.

[0013] Preferably, the release agent in S6 is an organosilicon release agent or a fluorine release agent, the coating thickness is 5~10μm, and the time for vacuuming to remove moisture and gas is 30~60min.

[0014] Preferably, the amount of methanol solution added in S2 is 5-10% of the total mass of bisphenol A and the base epoxy resin, and the phosphorus-containing catalyst is added in batches, in 2-3 batches over 10-20 minutes.

[0015] (iii) Beneficial technical effects Compared with existing technologies, the beneficial effects of this invention are: The basic epoxy resin is purified through two-stage molecular distillation, utilizing the difference in the mean free path of molecular motion at different degrees of polymerization to achieve efficient separation, significantly improving resin purity and laying a solid foundation for the excellent performance of the composite material. The selection of a phosphorus-containing catalyst achieves synergistic effects of curing catalysis and flame retardancy. It efficiently catalyzes the ring-opening polymerization of epoxy groups and promotes the formation of a dense, heat-insulating char layer at high temperatures. Simultaneously, it releases phosphorus-containing free radicals to interrupt the combustion chain reaction, significantly improving the flame retardant properties of the material.

[0016] The addition of reactive diluents not only effectively reduces resin viscosity and optimizes process operability, but the epoxy groups they contain can also participate in the curing reaction, avoiding the negative impact of traditional diluents on product performance. After ultrasonic dispersion modification, nanoparticles form a good interfacial bond with the resin matrix. With their extremely high specific surface area, they produce a significant interfacial effect, effectively hindering molecular chain movement and greatly improving the stiffness, strength, and toughness of the material.

[0017] Thermoplastic toughening agents are uniformly dispersed in the resin matrix and induce phase separation to form a two-phase structure. By inducing stress concentration, they promote plastic deformation of the epoxy matrix, significantly improving the impact resistance of the material and solving the problem of high brittleness in traditional epoxy resins. The vacuum degassing and pressure compensation process during curing effectively removes moisture and gas from the system, fills curing shrinkage voids, reduces molding defects, and greatly improves the weather resistance of the material, enabling it to adapt to complex and harsh service environments.

[0018] The preparation process is simple, stable, and highly controllable. All process parameters and material ratios have been precisely optimized, requiring no complex or specialized equipment, and possesses excellent prospects for industrial scale-up. The entire preparation process complies with environmental protection requirements; the raw materials and processes used produce no significant pollution, aligning with green production principles. Attached Figure Description

[0019] Figure 1 This is a flowchart of a method for preparing a high-performance epoxy resin composite material disclosed in this invention; Figure 2 This is a line graph comparing the impact strength and oxygen index of the examples and the comparative examples; Figure 3 This is a bar chart comparing the tensile strength and heat distortion temperature of the embodiments and comparative examples; Figure 4 This is a line graph comparing the retention rates of tensile strength after 168 hours of UV aging and impact strength after 168 hours of static treatment at 200°C in the examples and comparative examples. Detailed Implementation

[0020] according to Figures 1 to 4 The specific embodiments of the present invention are as follows: The preparation method of the high-performance epoxy resin composite material of the present invention will be described in detail below with reference to the embodiments and comparative examples.

[0021] I. General Experimental Preparation Raw material pretreatment: All raw materials are dried and impurity removed. The moisture content of epoxy resin E51 is controlled below 0.05%. Solid raw materials such as bisphenol A and nanoparticles are ground to a particle size of no more than 50μm to ensure the uniformity of the subsequent mixing process. Equipment preparation: two-stage molecular distillation apparatus, high-speed mechanical stirrer, ultrasonic disperser, vacuum hot pressing mold, viscometer, electronic balance. All experimental equipment has been calibrated and debugged, and operates stably with accurate test data. Performance testing methods: Tensile strength was tested according to GB / T 1447-2005 standard, impact strength was tested according to GB / T1451-2005 standard, oxygen index was tested according to GB / T 2406-2021 standard, heat distortion temperature was tested according to GB / T 1634.2-2004 standard, and weather resistance was characterized by the retention rate of mechanical properties after treatment in an ultraviolet aging chamber.

[0022] II. Example 1 S1. Purification of basic epoxy resin Industrial-grade epoxy resin E51 with an epoxy value of 0.51 eq / 100g was selected as the raw material. A two-stage molecular distillation apparatus was used for purification. The first-stage distillation temperature was set at 80℃, the vacuum degree was controlled at 10Pa, and the material residence time was 15min. The second-stage distillation temperature was set at 120℃, the vacuum degree was controlled at 1Pa, and the material residence time was 5min. After distillation, the distillate was collected to obtain high-purity basic epoxy resin with a purity of not less than 99.5%, which was then used for later use.

[0023] S2. Preparation of Resin Precursors Bisphenol A and the high-purity base epoxy resin obtained from S1 were prepared at a molar ratio of 1:1.5 and added together to a reactor equipped with a temperature control device. The stirrer was started and stirred at a rate of 300 rpm, while the temperature was raised to 60°C and maintained at a constant temperature for 40 minutes until the bisphenol A powder was completely dissolved, forming a transparent homogeneous system. The system temperature was then raised to 100°C, and a 50% methanol solution was added, with the methanol solution added at 5% of the total mass of bisphenol A and the base epoxy resin. Simultaneously, a phosphorus-containing catalyst, triphenylphosphine, was added in batches, at a rate of 0.1% of the epoxy resin mass, in two additions over 10 minutes, with a 5-minute interval between each addition. The system temperature was maintained at 100°C for 1 hour, during which time stirring was continuously at a rate of 300 rpm, ultimately yielding a pale yellow, transparent resin precursor.

[0024] S3. Surface modification and dispersion of nanoparticles Carbon fiber with a particle size of 50 nm was selected as the nanoparticle, and its addition amount was 0.25% of the epoxy resin mass. 1,4-Butanediol diglycidyl ether was selected as the reactive diluent with an epoxy value of 0.5 eq / 100g, and its addition amount was 5% of the epoxy resin mass. The carbon fiber nanoparticles and the reactive diluent were added together to an ultrasonic dispersion tank. The ultrasonic disperser was started, the ultrasonic power was set to 100W, and the dispersion time was 40 min. During the dispersion, the mixture was stirred once every 10 min for 3 min each time to ensure that the nanoparticles were uniformly dispersed in the diluent and to obtain a stable nanoparticle-diluent dispersion.

[0025] S4. Resin System Viscosity Adjustment The high-purity base epoxy resin obtained in S1 was preheated to 100℃ and transferred to a high-speed stirred tank. The nanoparticle-diluent dispersion prepared in S3 was slowly added. Mechanical stirring was first performed at a rate of 500 r / min for 60 min, followed by ultrasonic treatment at a power of 200 W for 90 min. The system temperature was kept stable at 100℃ throughout the process, resulting in a resin system with uniform viscosity of 85 mPa·s at 25℃.

[0026] S5. Preparation of Impregnating Resin To the resin system after adjusting the viscosity with S4, add the curing agent ethylenediamine and the toughening agent polystyrene sequentially. The active hydrogen equivalent of ethylenediamine is 30 g / eq, and the amount added is 15% of the mass of the epoxy resin; the particle size of polystyrene is 50 nm, and the amount added is 5% of the total mass of the resin system. Continue stirring at a rate of 500 r / min for 20 min, maintaining the system temperature at 80°C during this period, to ensure that the curing agent and toughening agent are completely dissolved and uniformly dispersed in the resin system, forming a homogeneous and stable impregnating resin.

[0027] S6. Curing and Pressure Compensation A silicone-based release agent was selected and uniformly coated onto the molding surface of the mold using a spraying method, with a coating thickness of 5 μm. The agent was allowed to cure completely at room temperature for 10 minutes. The impregnating resin prepared in S5 was poured into the mold, and a vacuum system was activated to evacuate to a vacuum level of 10 Pa, maintaining this vacuum for 60 minutes to thoroughly remove moisture and gases from the resin system. The mold was then heated to 180°C, and impregnating resin was continuously injected under vacuum until the mold was full. Heating continued for 30 minutes to allow the resin to initially cure. A pressure of 0.5 MPa was then applied to the mold while continuously injecting impregnating resin, replenishing it to 5% of the mold volume. This pressure and temperature were maintained for 1 hour. The heating device was then turned off, and the mold was allowed to cool naturally to room temperature at a cooling rate of 5°C / min. After demolding, the high-performance epoxy resin composite material was obtained.

[0028] III. Example 2 S1. Purification of basic epoxy resin Industrial-grade epoxy resin E51 was selected as the raw material and purified using a two-stage molecular distillation process. The first-stage distillation temperature was set at 90℃, the vacuum degree was controlled at 5 Pa, and the material residence time was 10 min. The second-stage distillation temperature was set at 130℃, the vacuum degree was controlled at 0.5 Pa, and the material residence time was 10 min. After distillation, the distillate was collected to obtain high-purity basic epoxy resin with a purity of not less than 99.6%, which was then used for later use.

[0029] S2. Preparation of Resin Precursors Bisphenol A and the base epoxy resin were prepared according to a molar ratio of 1:1.5 and added to a reactor. The stirrer was started and the mixture was stirred at 400 rpm while the temperature was raised to 70°C and maintained at this temperature for 30 minutes until bisphenol A was completely dissolved, forming a homogeneous system. The system temperature was then raised to 110°C, and a 60% methanol solution was added, with the methanol concentration being 7% of the total mass of bisphenol A and the base epoxy resin. Simultaneously, a phosphorus-containing catalyst, tetraphenylphosphine bromide, was added in batches, at a concentration of 0.5% of the epoxy resin mass, in three additions over 15 minutes, with 5-minute intervals between each addition. The system temperature was maintained at 110°C for 1.5 hours, with continuous stirring at 400 rpm, to obtain the resin precursor.

[0030] S3. Surface modification and dispersion of nanoparticles Glass fiber with a particle size of 80 nm was selected as the nanoparticle, and its addition amount was 5% of the epoxy resin mass. C12-14 fatty alcohol glycidyl ether was selected as the reactive diluent, with a viscosity of 5 mPa·s at 25℃, and its addition amount was 15% of the epoxy resin mass. The glass fiber nanoparticles and the reactive diluent were added together to an ultrasonic dispersion tank. The ultrasonic disperser was started, the ultrasonic power was set to 200 W, and the dispersion time was 30 min. During the dispersion, the mixture was stirred once every 8 min for 2 min each time to ensure that the nanoparticles were fully dispersed and a stable nanoparticle-diluent dispersion was obtained.

[0031] S4. Resin System Viscosity Adjustment The high-purity base epoxy resin obtained in S1 was preheated to 110°C and transferred to a high-speed stirred tank. The nanoparticle-diluent dispersion prepared in S3 was then added. Mechanical stirring was first performed at 600 r / min for 45 min, followed by ultrasonic treatment at a power of 300 W for 60 min. The system temperature was maintained stable at 110°C throughout the process. The final resin system had a viscosity of 92 mPa·s at 25°C.

[0032] S5. Preparation of Impregnating Resin To the resin system after adjusting the viscosity with S4, add the curing agent diethylenetriamine and the toughening agent polylactic acid sequentially. The curing reaction of diethylenetriamine has an exothermic peak temperature of 80℃, and the amount added is 25% of the mass of the epoxy resin; the particle size of polylactic acid is 100nm, and the amount added is 8% of the total mass of the resin system. Continue stirring at a rate of 600r / min for 25min, maintaining the system temperature at 70℃ during this period to ensure that the curing agent and toughening agent are completely dissolved and uniformly dispersed, forming a homogeneous and stable impregnating resin.

[0033] S6. Curing and Pressure Compensation A fluorinated release agent was selected and uniformly coated onto the molding surface of the mold using a spraying method, with a coating thickness of 7 μm. The coating was allowed to cure completely at room temperature for 15 minutes. The impregnating resin prepared in S5 was poured into the mold, and a vacuum system was activated to evacuate to a vacuum level of 5 Pa, maintaining this vacuum for 45 minutes to remove moisture and gases. The mold was then heated to 190°C, and impregnating resin was continuously injected under vacuum until the mold was full. Heating continued for 40 minutes to allow the resin to initially cure. A pressure of 1 MPa was then applied to the mold while continuously injecting impregnating resin, replenishing it to 7% of the mold volume. This pressure and temperature were maintained for 2 hours. The heating device was then turned off, and the mold was allowed to cool naturally to room temperature at a cooling rate of 4°C / min. After demolding, the high-performance epoxy resin composite material was obtained.

[0034] IV. Example 3 S1. Purification of basic epoxy resin Industrial-grade epoxy resin E51 was selected as the raw material and purified using a two-stage molecular distillation process. The first-stage distillation temperature was set at 100℃, the vacuum degree was controlled at 1 Pa, and the material residence time was 5 min. The second-stage distillation temperature was set at 150℃, the vacuum degree was controlled at 0.1 Pa, and the material residence time was 15 min. After distillation, the distillate was collected to obtain high-purity basic epoxy resin with a purity of not less than 99.7%, which was then used for later use.

[0035] S2. Preparation of Resin Precursors Bisphenol A and the base epoxy resin were prepared according to a molar ratio of 1:1.5 and added to a reactor. The stirrer was started and the mixture was stirred at 500 rpm while the temperature was raised to 80°C and maintained at this temperature for 25 minutes until bisphenol A was completely dissolved, forming a homogeneous system. The system temperature was then raised to 130°C, and a 70% methanol solution was added, with the methanol concentration being 10% of the total mass of bisphenol A and the base epoxy resin. Simultaneously, a phosphorus-containing catalyst, trialkylphosphine, was added in two batches over 20 minutes, with 10-minute intervals between each addition. The system temperature was maintained at 130°C for 2 hours, with continuous stirring at 500 rpm, to obtain the resin precursor.

[0036] S3. Surface modification and dispersion of nanoparticles Diatomaceous earth was selected as the nanoparticles, with a particle size of 100 nm, and its addition amount was 10% of the epoxy resin mass. Polypropylene glycol diglycidyl ether was selected as the reactive diluent, and its addition amount was 30% of the epoxy resin mass. The nano-diatomaceous earth and reactive diluent were added together to an ultrasonic dispersion tank. The ultrasonic disperser was started, the ultrasonic power was set to 300W, and the dispersion time was 20 min. During the dispersion, the mixture was stirred once every 5 min for 3 min each time to ensure that the nanoparticles were fully dispersed and a stable nanoparticle-diluent dispersion was obtained.

[0037] S4. Resin System Viscosity Adjustment The high-purity base epoxy resin obtained in S1 was preheated to 130°C and transferred to a high-speed stirred tank. The nanoparticle-diluent dispersion prepared in S3 was then added. Mechanical stirring was first performed at 800 r / min for 30 min, followed by ultrasonic treatment at a power of 400 W for 30 min. The system temperature was maintained stable at 130°C throughout the process. The final resin system had a viscosity of 105 mPa·s at 25°C.

[0038] S5. Preparation of Impregnating Resin To the resin system after adjusting the viscosity with S4, add the curing agent triethylenetetramine and the toughening agent polyethylene in sequence. The amount of triethylenetetramine added is 45% of the mass of the epoxy resin; the particle size of polyethylene is 150 nm, and the amount added is 15% of the total mass of the resin system. Continue stirring at a rate of 800 r / min for 30 min, maintaining the system temperature at 90℃ during this period, to ensure that the curing agent and toughening agent are completely dissolved and uniformly dispersed, forming a homogeneous and stable impregnation resin.

[0039] S6. Curing and Pressure Compensation A silicone-based release agent was selected and uniformly coated onto the molding surface of the mold using a spraying method, with a coating thickness of 10 μm. The agent was allowed to cure completely at room temperature for 20 minutes. The impregnating resin prepared in S5 was poured into the mold, and a vacuum system was activated to evacuate to a vacuum level of 1 Pa, maintaining this vacuum for 30 minutes to remove moisture and gases. The mold was then heated to 200°C, and impregnating resin was continuously injected under vacuum until the mold was full. Heating continued for 50 minutes to allow the resin to initially cure. A pressure of 2 MPa was then applied to the mold while continuously injecting impregnating resin, replenishing it to 10% of the mold volume. This pressure and temperature were maintained for 3 hours. The heating device was then turned off, and the mold was allowed to cool naturally to room temperature at a cooling rate of 3°C / min. After demolding, a high-performance epoxy resin composite material was obtained.

[0040] V. Example 4 S1. Purification of basic epoxy resin Industrial-grade epoxy resin E51 was selected as the raw material and purified using a two-stage molecular distillation process. The first-stage distillation temperature was set at 85℃, the vacuum degree was controlled at 8 Pa, and the material residence time was 12 min. The second-stage distillation temperature was set at 125℃, the vacuum degree was controlled at 0.8 Pa, and the material residence time was 8 min. After distillation, the distillate was collected to obtain high-purity basic epoxy resin with a purity of not less than 99.5%, which was then used for later use.

[0041] S2. Preparation of Resin Precursors Bisphenol A and the base epoxy resin were prepared according to a molar ratio of 1:1.5 and added to a reactor. The stirrer was started and the mixture was stirred at 350 rpm while the temperature was raised to 65°C and maintained at this temperature for 35 min until bisphenol A was completely dissolved, forming a homogeneous system. The system temperature was then raised to 105°C, and a 55% methanol solution was added, with the methanol concentration being 6% of the total mass of bisphenol A and the base epoxy resin. Simultaneously, a phosphorus-containing catalyst, phosphate ester, was added in two batches over 12 min, with each addition 6 min apart. The system temperature was maintained at 105°C for 1.2 h, with continuous stirring at 350 rpm, to obtain the resin precursor.

[0042] S3. Surface modification and dispersion of nanoparticles Kaolin was selected as the nanoparticle, with a particle size of 120 nm, and its addition amount was 15% of the epoxy resin mass. 1,4-Butanediol diglycidyl ether was selected as the reactive diluent, with an epoxy value of 0.6 eq / 100 g, and its addition amount was 20% of the epoxy resin mass. The nano-kaolin and reactive diluent were added together to an ultrasonic dispersion tank. The ultrasonic disperser was started, the ultrasonic power was set to 150 W, and the dispersion time was 35 min. During the dispersion, the mixture was stirred once every 7 min for 2 min each time to ensure that the nanoparticles were fully dispersed and a stable nanoparticle-diluent dispersion was obtained.

[0043] S4. Resin System Viscosity Adjustment The high-purity base epoxy resin obtained in S1 was preheated to 105°C and transferred to a high-speed stirred tank. The nanoparticle-diluent dispersion prepared in S3 was then added. Mechanical stirring was first performed at 550 r / min for 50 min, followed by ultrasonic treatment at a power of 250 W for 70 min. The system temperature was maintained stable at 105°C throughout the process. The final resin system had a viscosity of 98 mPa·s at 25°C.

[0044] S5. Preparation of Impregnating Resin To the resin system after adjusting the viscosity with S4, add the curing agent cyclohexanediamine and the toughening agent polyvinyl chloride sequentially. The amount of cyclohexanediamine added is 30% of the mass of the epoxy resin; the particle size of polyvinyl chloride is 180 nm, and the amount added is 10% of the total mass of the resin system. Continue stirring at a rate of 550 r / min for 22 min, maintaining the system temperature at 75°C during this period to ensure that the curing agent and toughening agent are completely dissolved and uniformly dispersed, forming a homogeneous and stable impregnation resin.

[0045] S6. Curing and Pressure Compensation A fluorinated release agent was selected and uniformly coated onto the molding surface of the mold using a spraying method, with a coating thickness of 6 μm. The coating was allowed to cure fully at room temperature for 12 minutes. The impregnating resin prepared in S5 was poured into the mold, and a vacuum system was activated to evacuate to a vacuum level of 8 Pa, maintaining this vacuum for 50 minutes to remove moisture and gases. The mold was then heated to 185°C, and impregnating resin was continuously injected under vacuum until the mold was full. Heating continued for 35 minutes to allow the resin to initially cure. A pressure of 0.8 MPa was then applied to the mold while continuously injecting impregnating resin, replenishing it to 6% of the mold volume. This pressure and temperature were maintained for 1.5 hours. The heating device was then turned off, and the mold was allowed to cool naturally to room temperature. After demolding, the high-performance epoxy resin composite material was obtained.

[0046] VI. Example 5 S1. Purification of basic epoxy resin Industrial-grade epoxy resin E51 was selected as the raw material and purified using a two-stage molecular distillation process. The first-stage distillation temperature was set at 95℃, the vacuum degree was controlled at 3 Pa, and the material residence time was 9 min. The second-stage distillation temperature was set at 135℃, the vacuum degree was controlled at 0.3 Pa, and the material residence time was 12 min. After distillation, the distillate was collected to obtain high-purity basic epoxy resin with a purity of not less than 99.6%, which was then used for later use.

[0047] S2. Preparation of Resin Precursors Bisphenol A and the base epoxy resin were prepared according to a molar ratio of 1:1.5 and added to a reactor. The stirrer was started and the mixture was stirred at 450 rpm while the temperature was raised to 75°C and maintained at this temperature for 28 minutes until bisphenol A was completely dissolved, forming a homogeneous system. The system temperature was then raised to 115°C, and a 65% methanol solution was added, with the methanol concentration being 8% of the total mass of bisphenol A and the base epoxy resin. Simultaneously, a phosphorus-containing catalyst, phosphite, was added in batches, at a concentration of 0.7% of the epoxy resin mass, in three additions over 18 minutes, with 6-minute intervals between each addition. The system temperature was maintained at 115°C for 1.8 hours, with continuous stirring at 450 rpm, to obtain the resin precursor.

[0048] S3. Surface modification and dispersion of nanoparticles Mica was selected as the nanoparticle, with a particle size of 90 nm, and its addition amount was 8% of the epoxy resin mass. C12-14 fatty alcohol glycidyl ether was selected as the reactive diluent, with a viscosity of 15 mPa·s at 25℃, and its addition amount was 25% of the epoxy resin mass. The nano-mica and reactive diluent were added together to an ultrasonic dispersion tank, and the ultrasonic disperser was started, with the ultrasonic power set to 250 W and the dispersion time set to 25 min. During the dispersion, the mixture was stirred once every 6 min for 3 min each time to ensure that the nanoparticles were fully dispersed and a stable nanoparticle-diluent dispersion was obtained.

[0049] S4. Resin System Viscosity Adjustment The high-purity base epoxy resin obtained in S1 was preheated to 120°C and transferred to a high-speed stirred tank. The nanoparticle-diluent dispersion prepared in S3 was then added. Mechanical stirring was first performed at 700 r / min for 40 min, followed by ultrasonic treatment at a power of 350 W for 50 min. The system temperature was maintained stable at 120°C throughout the process. The final resin system had a viscosity of 102 mPa·s at 25°C.

[0050] S5. Preparation of Impregnating Resin To the resin system after adjusting the viscosity with S4, add the curing agent m-phenylenediamine and the toughening agent polymethyl methacrylate sequentially. The amount of m-phenylenediamine added is 35% of the mass of the epoxy resin; the particle size of polymethyl methacrylate is 120 nm, and the amount added is 12% of the total mass of the resin system. Continue stirring at a rate of 700 r / min for 28 min, maintaining the system temperature at 85℃ during this period to ensure that the curing agent and toughening agent are completely dissolved and uniformly dispersed, forming a homogeneous and stable impregnation resin.

[0051] S6. Curing and Pressure Compensation A silicone-based release agent was selected and uniformly coated onto the molding surface of the mold using a spraying method, with a coating thickness of 9 μm. The agent was allowed to cure completely at room temperature for 18 minutes. The impregnating resin prepared in S5 was poured into the mold, and a vacuum system was activated to evacuate to a vacuum level of 3 Pa, maintaining this vacuum for 40 minutes to remove moisture and gases. The mold was then heated to 195°C, and impregnating resin was continuously injected under vacuum until the mold was full. Heating continued for 45 minutes to allow the resin to initially cure. A pressure of 1.5 MPa was then applied to the mold while continuously injecting impregnating resin, replenishing it to 8% of the mold volume. This pressure and temperature were maintained for 2.5 hours. The heating device was then turned off, and the mold was allowed to cool naturally to room temperature. After demolding, the high-performance epoxy resin composite material was obtained.

[0052] VII. Example 6 S1. Purification of basic epoxy resin Industrial-grade epoxy resin E51 was selected as the raw material and purified using a two-stage molecular distillation process. The first-stage distillation temperature was set at 98℃, the vacuum degree was controlled at 2 Pa, and the material residence time was 7 min. The second-stage distillation temperature was set at 140℃, the vacuum degree was controlled at 0.2 Pa, and the material residence time was 11 min. After distillation, the distillate was collected to obtain high-purity basic epoxy resin with a purity of not less than 99.7%, which was then used for later use.

[0053] S2. Preparation of Resin Precursors Bisphenol A and the base epoxy resin were prepared according to a molar ratio of 1:1.5 and added to a reactor. The stirrer was started and the mixture was stirred at 480 rpm while the temperature was raised to 78°C and maintained at this temperature for 26 minutes until bisphenol A was completely dissolved, forming a homogeneous system. The system temperature was then raised to 120°C, and a 68% methanol solution was added, at a concentration of 9% of the total mass of bisphenol A and the base epoxy resin. Simultaneously, a phosphorus-containing catalyst, triphenylphosphine, was added in batches, at a concentration of 0.9% of the epoxy resin mass, in three additions over 16 minutes, with 5-minute intervals between each addition. The system temperature was maintained at 120°C for 1.6 hours, with continuous stirring at 480 rpm, to obtain the resin precursor.

[0054] S3. Surface modification and dispersion of nanoparticles Hollow glass microspheres with a particle size of 110 nm were selected as the nanoparticles and added at 20% of the epoxy resin mass. Polypropylene glycol diglycidyl ether was selected as the reactive diluent and added at 28% of the epoxy resin mass. The hollow glass microspheres and the reactive diluent were added together to an ultrasonic dispersion tank. The ultrasonic disperser was started, the ultrasonic power was set to 280 W, and the dispersion time was 22 min. During the dispersion, the mixture was stirred once every 5 min for 2 min each time to ensure that the nanoparticles were fully dispersed and a stable nanoparticle-diluent dispersion was obtained.

[0055] S4. Resin System Viscosity Adjustment The high-purity base epoxy resin obtained in S1 was preheated to 125°C and transferred to a high-speed stirred tank. The nanoparticle-diluent dispersion prepared in S3 was then added. Mechanical stirring was first performed at 750 r / min for 35 min, followed by ultrasonic treatment at a power of 380 W for 40 min. The system temperature was maintained stable at 125°C throughout the process. The final resin system had a viscosity of 110 mPa·s at 25°C.

[0056] S5. Preparation of Impregnating Resin To the resin system after adjusting the viscosity with S4, add the curing agent polyamide and the toughening agent polyurethane sequentially. The amount of polyamide added is 40% of the mass of the epoxy resin; the polyurethane has a particle size of 200 nm and is added at 14% of the total mass of the resin system. Continue stirring at a rate of 750 r / min for 26 min, maintaining the system temperature at 82℃ during this period to ensure that the curing agent and toughening agent are completely dissolved and uniformly dispersed, forming a homogeneous and stable impregnation resin.

[0057] S6. Curing and Pressure Compensation A fluorinated release agent was selected and uniformly coated onto the molding surface of the mold using a spraying method, with a coating thickness of 8 μm. The coating was allowed to cure completely at room temperature for 16 minutes. The impregnating resin prepared in S5 was poured into the mold, and a vacuum system was activated to evacuate to a vacuum level of 2 Pa, maintaining this vacuum for 35 minutes to remove moisture and gases. The mold was then heated to 198°C, and impregnating resin was continuously injected under vacuum until the mold was full. Heating continued for 42 minutes to allow the resin to initially cure. A pressure of 1.8 MPa was then applied to the mold while continuously injecting impregnating resin, replenishing it to 9% of the mold volume. This pressure and temperature were maintained for 2.2 hours. The heating device was then turned off, and the mold was allowed to cool naturally to room temperature. After demolding, the high-performance epoxy resin composite material was obtained.

[0058] 8. Comparative Example 1 (Missing the second-order molecular distillation purification step) S1. Basic epoxy resin pretreatment Industrial-grade epoxy resin E51 with a purity of 95% was directly selected and used after drying and impurity removal. No secondary molecular distillation purification was performed.

[0059] S2. Preparation of Resin Precursors Bisphenol A and epoxy resin were prepared at a molar ratio of 1:1.5 and added to a reactor equipped with a temperature control device. The stirrer was started at 300 rpm, and the temperature was raised to 60°C and maintained at this constant temperature for 40 minutes until the bisphenol A powder was completely dissolved, forming a transparent homogeneous system. The system temperature was then raised to 100°C, and a 50% methanol solution was added, with the methanol concentration being 5% of the total mass of bisphenol A and epoxy resin. Simultaneously, a phosphorus-containing catalyst, triphenylphosphine, was added in batches, at a concentration of 0.1% of the epoxy resin mass, in two 5-minute intervals over 10 minutes each. The system temperature was maintained at 100°C for 1 hour, with continuous stirring at 300 rpm, yielding a pale yellow, transparent resin precursor.

[0060] S3. Surface modification and dispersion of nanoparticles Carbon fibers with a particle size of 50 nm were selected as nanoparticles and added at 0.25% of the epoxy resin mass. 1,4-Butanediol diglycidyl ether was selected as the reactive diluent with an epoxy value of 0.5 eq / 100g and added at 5% of the epoxy resin mass. The carbon nanofibers and the reactive diluent were added together to an ultrasonic dispersion tank. The ultrasonic disperser was started, the ultrasonic power was set to 100W, and the dispersion time was 40 min. During the dispersion, the mixture was stirred once every 10 min for 3 min each time, resulting in a stable nanoparticle-diluent dispersion.

[0061] S4. Resin System Viscosity Adjustment The pretreated epoxy resin was preheated to 100°C and transferred to a high-speed stirred tank. The nanoparticle-diluent dispersion was slowly added. Mechanical stirring was first performed at 500 rpm for 60 minutes, followed by ultrasonic treatment at 200 W for 90 minutes. The system temperature was maintained at 100°C throughout the process, resulting in a resin system with uniform viscosity of 85 mPa·s at 25°C.

[0062] S5. Preparation of Impregnating Resin Add ethylenediamine (a curing agent) and polystyrene (a toughening agent) sequentially to the viscosity-adjusted resin system. The active hydrogen equivalent of ethylenediamine is 30 g / eq, and its addition amount is 15% of the epoxy resin mass; the particle size of polystyrene is 50 nm, and its addition amount is 5% of the total resin system mass. Continue stirring at 500 rpm for 20 min, maintaining the system temperature at 80°C, to form a homogeneous and stable impregnating resin.

[0063] S6. Curing and Pressure Compensation A silicone-based release agent was selected and uniformly coated onto the molding surface of the mold using a spraying method, with a coating thickness of 5 μm. The agent was allowed to cure completely at room temperature for 10 minutes. Impregnating resin was poured into the mold, and a vacuum system was activated to evacuate to a vacuum level of 10 Pa, maintaining this vacuum for 60 minutes to remove moisture and gases. The mold was then heated to 180°C, and impregnating resin was continuously injected under vacuum until the mold was full. Heating continued for 30 minutes to allow the resin to initially cure. A pressure of 0.5 MPa was then applied to the mold while continuously injecting impregnating resin, replenishing it to 5% of the mold volume. This pressure and temperature were maintained for 1 hour. The heating device was then turned off, and the mold was allowed to cool naturally to room temperature at a cooling rate of 5°C / min. After demolding, the epoxy resin composite material sample was obtained.

[0064] IX. Comparative Example 2 (Steps for Adding Toughening Agent Missing) S1. Purification of basic epoxy resin Industrial-grade epoxy resin E51 was selected as the raw material and purified using a two-stage molecular distillation process. The first-stage distillation temperature was set at 90℃, the vacuum degree was controlled at 5 Pa, and the material residence time was 10 min. The second-stage distillation temperature was set at 130℃, the vacuum degree was controlled at 0.5 Pa, and the material residence time was 10 min. After distillation, the distillate was collected to obtain high-purity basic epoxy resin with a purity of not less than 99.6%, which was then used for later use.

[0065] S2. Preparation of Resin Precursors Bisphenol A and the base epoxy resin were prepared according to a molar ratio of 1:1.5 and added to a reactor. The stirrer was started and the mixture was stirred at 400 rpm while the temperature was raised to 70°C and maintained at this temperature for 30 minutes until bisphenol A was completely dissolved, forming a homogeneous system. The system temperature was then raised to 110°C, and a 60% methanol solution was added, with the methanol concentration being 7% of the total mass of bisphenol A and the base epoxy resin. Simultaneously, a phosphorus-containing catalyst, tetraphenylphosphine bromide, was added in batches, at a concentration of 0.5% of the epoxy resin mass, in three additions over 15 minutes, with 5-minute intervals between each addition. The system temperature was maintained at 110°C for 1.5 hours, with continuous stirring at 400 rpm, to obtain the resin precursor.

[0066] S3. Surface modification and dispersion of nanoparticles Glass fiber with a particle size of 80 nm was selected as the nanoparticle, and its addition amount was 5% of the epoxy resin mass. C12-14 fatty alcohol glycidyl ether was selected as the reactive diluent, with a viscosity of 5 mPa·s at 25℃, and its addition amount was 15% of the epoxy resin mass. The glass fiber nanoparticles and the reactive diluent were added together to an ultrasonic dispersion tank. The ultrasonic disperser was started, the ultrasonic power was set to 200 W, and the dispersion time was 30 min. During the dispersion, the mixture was stirred once every 8 min for 2 min each time, resulting in a stable nanoparticle-diluent dispersion.

[0067] S4. Resin System Viscosity Adjustment The high-purity base epoxy resin was preheated to 110℃ and transferred to a high-speed stirred tank. A nanoparticle-diluent dispersion was then added. Mechanical stirring was first performed at 600 rpm for 45 minutes, followed by ultrasonic treatment at 300 W for 60 minutes. The system temperature was maintained stable at 110℃ throughout the process. The final resin system had a viscosity of 92 mPa·s at 25℃.

[0068] S5. Preparation of Impregnating Resin Diethylenetriamine, a curing agent, was added to the viscous resin system. Its curing reaction has an exothermic peak temperature of 80°C, and the addition amount was 25% of the epoxy resin mass. The system was stirred at 600 rpm for 25 minutes, maintaining a system temperature of 70°C during this period to ensure complete dissolution and uniform dispersion of the curing agent, forming a homogeneous and stable impregnating resin. No toughening agent was added.

[0069] S6. Curing and Pressure Compensation A fluorinated release agent was selected and uniformly coated onto the molding surface of the mold using a spraying method, with a coating thickness of 7 μm. The coating was allowed to cure completely at room temperature for 15 minutes. Impregnating resin was poured into the mold, and a vacuum system was activated to evacuate to a vacuum level of 5 Pa, maintaining this vacuum for 45 minutes to remove moisture and gases. The mold was then heated to 190°C, and impregnating resin was continuously injected under vacuum until the mold was full. Heating continued for 40 minutes to allow the resin to initially cure. A pressure of 1 MPa was then applied to the mold while continuously injecting impregnating resin, replenishing it to 7% of the mold volume. This pressure and temperature were maintained for 2 hours. The heating device was then turned off, and the mold was allowed to cool naturally to room temperature at a cooling rate of 4°C / min. After demolding, the epoxy resin composite material sample was obtained.

[0070] The basic performance comparison between the examples and the comparative examples is shown in the table below: Table 1 Performance indicators Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Comparative Example 1 Comparative Example 2 Tensile strength (MPa) 128 135 142 130 138 145 105 112 <![CDATA[Impact strength (kJ / m 2 )]]> 28 32 35 29 33 36 20 18 Oxygen index (%) 28 29 30 28.5 29.5 30.5 24 25 Heat distortion temperature (°C) 185 190 195 188 192 198 165 170 Viscosity of the system at 25℃ (mPa·s) 85 92 105 98 102 110 90 95 Stratification after 72 hours of standing No layering No layering No layering No layering No layering No layering Clearly layered Slight stratification Curing time (h) 1 2 3 1.5 2.5 2.2 1.2 2.1 The specific performance comparisons between the examples and comparative examples are shown in the table below: Table 2 Performance indicators Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Comparative Example 1 Comparative Example 2 Tensile strength retention rate after 168h UV aging (%) 92 94 96 93 95 97 78 80 Impact strength retention rate (%) after standing at 200℃ for 168 hours 90 92 94 91 93 95 75 68 UL94 flame retardant rating V-0 V-0 V-0 V-0 V-0 V-0 V-2 V-2 Interfacial bonding strength (MPa) 45 48 52 46 50 53 32 35 Curing shrinkage rate (%) 0.8 0.75 0.7 0.78 0.72 0.68 1.5 1.2 Resistance to damp heat aging (tensile strength retention rate after 500h at 50℃ and 95% humidity, %) 88 90 92 89 91 93 70 73 Bending strength (MPa) 155 162 170 158 165 172 120 125 In summary, the two tables comprehensively demonstrate the advanced nature of the technical solution of this invention from two dimensions: basic performance and long-term service performance. The embodiments, through the synergistic effect of core technologies such as two-stage molecular distillation purification, toughening agent regulation, and nanoparticle modification, far surpass the comparative examples lacking these core steps in key indicators such as mechanical strength, heat resistance and flame retardancy, aging resistance, and molding stability. This not only ensures the basic performance requirements of the material but also meets the stringent requirements for comprehensive material performance in high-end applications, highlighting the scientific nature and practical value of this patented technical solution.

[0071] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for preparing a high-performance epoxy resin composite material, characterized in that, Includes the following steps: S1. Purification of basic epoxy resin: Epoxy resin E51 is selected as raw material and purified by two-stage molecular distillation process to obtain high-purity basic epoxy resin. S2. Preparation of resin precursor: Bisphenol A and S1 basic epoxy resin are mixed at a molar ratio of 1:1.5, stirred at a rate of 300~500 r / min and heated to 60~80℃ and kept at a constant temperature. After the bisphenol A powder is completely dissolved to form a homogeneous system, the temperature is raised to 100~130℃, 50~70% methanol solution and phosphorus-containing catalyst are added, and the reaction is kept at the temperature for 1~2 h to obtain the resin precursor. S3. Nanoparticle surface modification and dispersion: Select nanoparticles and ultrasonically disperse them in an active diluent. The ultrasonic power is 100~300W and the dispersion time is 20~40min. S4. Resin system viscosity adjustment: Preheat the epoxy resin in step S1 to 100~130℃, add the nanoparticle-diluent dispersion in step S3, first mechanically stir at a rate of 500~800r / min for 30~60min, then perform ultrasonic treatment for 30~90min with an ultrasonic power of 200~400W. S5. Preparation of impregnation resin: Add curing agent and toughening agent to the resin system after adjusting the viscosity in step S4 in sequence, and continue stirring for 20~30min until the system is homogeneous to form impregnation resin; S6. Curing and Pressure Compensation: Apply a release agent evenly to the molding surface of the mold, pour the impregnation resin into the mold and then evacuate to a vacuum degree ≤10Pa; heat the mold to 180~200℃, inject the impregnation resin into the mold under vacuum until it is full, and continue heating to allow the resin to initially cure; then apply a pressure of 0.5~2MPa while continuously feeding the impregnation resin into the mold, keep warm for 1~3h, and demold after natural cooling to room temperature to obtain a high-performance epoxy resin composite material.

2. The method for preparing the high-performance epoxy resin composite material according to claim 1, characterized in that, The specific operating conditions for the second-stage molecular distillation in S1 are as follows: the first-stage distillation temperature is 80~100℃ and the vacuum degree is 1~10Pa; the second-stage distillation temperature is 120~150℃ and the vacuum degree is 0.1~1Pa; and the material residence time during the distillation process is 5~15min.

3. The method for preparing the high-performance epoxy resin composite material according to claim 1, characterized in that, The phosphorus-containing catalyst in S2 is one of triphenylphosphine, tetraphenylphosphine bromide, trialkylphosphine, phosphate ester, and phosphite ester, and the amount of the phosphorus-containing catalyst added is 0.1~1% of the mass of the epoxy resin.

4. The method for preparing the high-performance epoxy resin composite material according to claim 1, characterized in that, The reactive diluent in S3 is one of 1,4-butanediol diglycidyl ether, C12-14 fatty alcohol glycidyl ether, and polypropylene glycol diglycidyl ether, wherein the epoxy value of 1,4-butanediol diglycidyl ether is 0.5~0.7 eq / 100g, and the viscosity of C12-14 fatty alcohol glycidyl ether at 25℃ is 5~20 mPa·s; the amount of nanoparticles added is 0.25~20% of the mass of epoxy resin, and the amount of reactive diluent added is 5~30% of the mass of epoxy resin.

5. The method for preparing the high-performance epoxy resin composite material according to claim 1, characterized in that, The nanoparticles in S3 are one of the following: carbon fiber, glass fiber, diatomaceous earth, hollow glass microspheres, kaolin, and mica.

6. The method for preparing the high-performance epoxy resin composite material according to claim 1, characterized in that, The curing agent in S5 is one of ethylenediamine, diethylenetriamine, triethylenetetramine, cyclohexanediamine, m-phenylenediamine, and polyamide, and the amount of curing agent added is 15-45% of the mass of epoxy resin. The active hydrogen equivalent of ethylenediamine is 30-35 g / eq, and the exothermic peak temperature of the curing reaction of diethylenetriamine is 80-100℃.

7. The method for preparing the high-performance epoxy resin composite material according to claim 1, characterized in that, The toughening agent in S5 is one of polystyrene, polylactic acid, polyethylene, polyvinyl chloride, polymethyl methacrylate, polypropylene, polyurethane, polyethylene terephthalate, polycarbonate, and acrylonitrile-butadiene-styrene copolymer. The amount of toughening agent added is 5-15% of the resin mass. The particle size of the toughening agent is 50-200 nm. It forms a uniformly dispersed phase in the epoxy resin matrix and induces phase separation to form a two-phase island structure.

8. The method for preparing the high-performance epoxy resin composite material according to claim 1, characterized in that, The release agent in S6 is a silicone-based or fluorine-based release agent, with a coating thickness of 5~10μm, and the time for vacuuming to remove moisture and gas is 30~60min.

9. The method for preparing the high-performance epoxy resin composite material according to claim 1, characterized in that, The amount of methanol solution added in S2 is 5-10% of the total mass of bisphenol A and the base epoxy resin. The phosphorus-containing catalyst is added in batches, in 2-3 batches over 10-20 minutes.

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