High-temperature-resistant test board for testing large-current power device and test method
By designing a high-temperature resistant test board compatible with multiple models and integrating power supply, detection, and control modules, the problems of poor model adaptability and low testing efficiency of existing devices have been solved, achieving efficient and safe power device testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XINFENGYANG TECHNOLOGY (SUZHOU) CO LTD
- Filing Date
- 2026-02-03
- Publication Date
- 2026-04-14
AI Technical Summary
Existing high-temperature aging test equipment is not compatible with different models of power devices, and the number of devices tested at one time is limited, resulting in high testing costs and low efficiency.
Design a high-temperature resistant test board that integrates a power module, a detection module, and a control module. It is compatible with multiple power devices of the same or different models, and ensures test accuracy and safety through a multiplexing module and a temperature detection circuit.
It enables efficient and accurate testing of multiple power devices, reducing testing costs and difficulty, and improving testing efficiency and safety.
Smart Images
Figure CN121856597A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of chip testing technology, and in particular to a high-temperature resistant test board and testing method for testing high-current power devices. Background Technology
[0002] Currently, when conducting high-temperature performance tests on high-current power devices (such as IGBTs and IPMs), it is often necessary to design corresponding high-temperature aging test devices. However, high-temperature aging test devices cannot test different models of power devices. When the model of the power device to be tested changes, the corresponding high-temperature aging test device needs to be replaced simultaneously. In addition, there is also an upper limit to the number of power devices that a high-temperature aging test device can test at one time. Summary of the Invention
[0003] To address at least one of the aforementioned technical problems, this disclosure provides a high-temperature resistant test board and test method for testing high-current power devices.
[0004] According to some embodiments of this disclosure, a high-temperature resistant test board for testing high-current power devices is provided. The high-temperature resistant test board is used to be installed in the cavity of a high-temperature aging test device to test high-current power devices. It includes a substrate and a power module, a detection module, and a control module disposed on the substrate. The power module includes a power interface, a protection circuit, and a power supply loop. The power interface is used to connect an external power supply line. The power supply loop is used to convert the power signal received by the power interface into a power signal adapted to the device under test. The protection circuit is disposed between the power supply loop and the power interface and is used for overcurrent cut-off protection. The testing module includes multiple testing interfaces, a motor terminal interface, and a signal acquisition circuit. The testing interfaces are used to mount the device under test (DUT). The multiple testing interfaces may be of the same or different models. Each testing interface is connected to the power supply circuit and the motor terminal interface. The signal acquisition circuit is connected to the motor terminal interface to acquire the output signal of the DUT. The control module includes a controller and a communication interface. The controller is connected to the testing interfaces to send control signals. The controller is also connected to the signal acquisition circuit to acquire the output signal of the DUT. Finally, the controller is connected to the communication interface to send test data to the testing equipment via the communication interface.
[0005] Based on the above scheme, the high-temperature resistant test board can install multiple identical or different high-current power devices under test. The high-temperature resistant test board integrates a power supply module, a detection module, and a control module, which can send corresponding control signals to the devices under test and collect the device output signals. It can independently analyze the performance of each device and generate test results. The high-temperature resistant test board can reduce the cost and difficulty of testing high-current power devices.
[0006] In some possible implementations, the detection module further includes a multiplexing module, the input of which is connected to the plurality of detection interfaces, the output of which is connected to the motor terminal interface, and the control of which is connected to the controller.
[0007] Based on the above solution, the multiplexing module can realize the alternating connection of multiple detection interfaces with one motor terminal interface, thereby reducing the number of components on the high temperature resistance test board, reducing the size and manufacturing cost of the high temperature resistance test board.
[0008] In some possible implementations, the power module further includes a current feedback circuit, which includes a shunt resistor, a differential amplifier, and an analog-to-digital converter. The shunt resistor is disposed between the power supply circuit and the detection interface. The input terminal of the differential amplifier is connected to both ends of the shunt resistor, the output terminal of the differential amplifier is connected to the input terminal of the analog-to-digital converter, and the output terminal of the analog-to-digital converter is connected to the controller.
[0009] Based on the above scheme, the output current of the power supply circuit is collected by the current feedback circuit designed by the differential circuit. This can detect whether the power supply circuit is abnormal, avoid inaccurate testing caused by current fluctuations, and improve the accuracy of device testing.
[0010] In some possible implementations, the substrate is made of epoxy board, and the surface of the substrate is provided with a gold layer made by an immersion gold process, the thickness of the gold layer being greater than or equal to 3 micrometers.
[0011] Based on the above scheme, an epoxy board is used to make the substrate, and an immersion gold process is used to make a gold layer larger than 3 micrometers to ensure that the high temperature test board can withstand the high temperature environment and provide a guarantee for the high temperature aging test of the device.
[0012] In some possible implementations, the control module further includes a first temperature detection circuit and a second temperature detection circuit. The first temperature detection circuit is located at the detection interface and is used to detect the temperature of the device under test. The second temperature detection circuit is located around the substrate and is used to detect the ambient temperature.
[0013] Based on the above scheme, two temperature detection circuits are set up to detect the device temperature and the ambient temperature respectively, so as to ensure the accuracy of the test environment.
[0014] In some possible implementations, the protection circuit includes a fuse with an adjustable rated current range; or, the protection circuit includes a voltage regulator.
[0015] Based on the above scheme, the protection circuit is equipped with a fuse and a voltage regulator with adjustable current range, which can realize overcurrent and overvoltage protection, improve test safety, and avoid damage to the device by impact.
[0016] According to some embodiments of this disclosure, a method for testing high-current power devices is also provided, applied to a high-temperature resistant test board for testing high-current power devices as described in any of the above embodiments. The high-temperature resistant test board for testing high-current power devices is installed in the cavity of a high-temperature aging test device, and includes: interface status data of a detection interface in a detection module, the interface status data indicating the model of the corresponding detection interface and whether a device under test is installed; determining target detection parameters based on the interface status data, the target detection parameters indicating the detection sequence of at least one device under test and the control parameters of each device under test; sending the target detection data to the high-temperature aging test device to control the high-temperature aging test device to generate a corresponding test environment; upon receiving a preparation completion signal from the high-temperature aging test device, testing at least one device under test according to the detection sequence and recording the test data of each device under test; and generating a test report based on the test data of each device under test.
[0017] Based on the above scheme, by detecting the type of device under test on the high-temperature test board and generating corresponding test parameters, and then sending them to the high-temperature aging test device to generate the corresponding test environment, and finally testing each device and generating a report, it is possible to achieve rapid testing of a large number of high-current power devices in one loading and unloading operation, thereby improving testing efficiency.
[0018] In some possible implementations, the test data includes device temperature, device voltage, and device current. The generation of a test report based on the test data of each device under test includes: determining the corresponding device as high-temperature stable if a first condition and a second condition are met; the first condition includes device temperature fluctuation being less than or equal to a first temperature fluctuation threshold and device voltage fluctuation being less than or equal to a voltage fluctuation threshold; the second condition includes device temperature fluctuation being less than or equal to a second temperature fluctuation threshold and device current fluctuation being less than or equal to a current fluctuation threshold.
[0019] Based on the above scheme, the device is tested and judged from the perspectives of temperature fluctuation, voltage fluctuation and current fluctuation, which can improve the accuracy of the test report.
[0020] In some possible implementations, the method further includes: during the test, acquiring first temperature data and second temperature data, wherein the first temperature data is temperature data sent by the high-temperature aging test device, and the second temperature data is temperature data detected by the high-temperature resistant test board for testing high-current power devices; and interrupting the test if the difference between the first temperature data and the second temperature data is greater than a preset temperature difference.
[0021] Based on the above scheme, the ambient temperature detected by the test board is compared with the ambient temperature set by the high-temperature aging test device. The test is interrupted when the temperature data difference is large, so as to avoid inaccurate test due to inaccurate ambient temperature.
[0022] In some possible implementations, the method further includes: during the test, acquiring the electrical parameters of the power supply circuit of the high-temperature resistant test board for testing high-current power devices; and controlling the power supply circuit to be cut off if the electrical parameters are greater than a safety threshold or if the electrical parameters do not match the control parameters.
[0023] Based on the above scheme, during the test, the electrical parameters of the power supply circuit are compared with the safety threshold and control parameters respectively. If any one of them is mismatched, the power supply circuit is cut off, thereby ensuring test safety and test accuracy.
[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure.
[0025] Other features and aspects of this disclosure will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description
[0026] To more clearly illustrate the technical solutions and advantages in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This diagram shows a structural block diagram of a high-temperature resistant test board for testing high-current power devices according to an embodiment of the present disclosure. Figure 2 This diagram shows a structural block diagram of a detection module according to an embodiment of the present disclosure; Figure 3 A structural block diagram of a power module according to an embodiment of the present disclosure is shown; Figure 4 A flowchart illustrating a high-current power device testing method according to an embodiment of the present disclosure is shown. Detailed Implementation
[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art under the premise of equivalent changes and modifications should fall within the protection scope of the present invention.
[0029] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.
[0030] Various exemplary embodiments, features, and aspects of this disclosure will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.
[0031] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.
[0032] In this document, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. Furthermore, the term "at least one" in this document means any combination of at least two of any one or more elements. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.
[0033] Furthermore, to better illustrate this disclosure, numerous specific details are set forth in the following detailed description. Those skilled in the art will understand that this disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the main points of this disclosure.
[0034] Currently, when conducting high-temperature performance tests on high-current power devices (such as IGBTs and IPMs), it is often necessary to design corresponding high-temperature aging test devices. However, high-temperature aging test devices cannot test different models of power devices. When the model of the power device to be tested changes, the corresponding high-temperature aging test device needs to be replaced simultaneously. In addition, there is also an upper limit to the number of power devices that a high-temperature aging test device can test at one time.
[0035] To address at least one of the aforementioned technical problems, this disclosure provides a scheme for separating the test board from the high-temperature aging test device. By setting up a high-temperature resistant test board compatible with multiple identical or different high-current power devices, multiple devices to be tested can be mounted on the high-temperature resistant test board at once. Each high-temperature resistant test board is equipped with an independent control system for controlling the operation of the devices to be tested. One or more high-temperature resistant test boards with the devices to be tested are then installed in the cavity of the high-temperature aging test device, and the high-temperature aging test device is connected to the high-temperature resistant test board. In this way, the high-temperature aging test device only needs to generate a high-temperature test environment, and the detection and control of the devices are performed independently based on the high-temperature resistant test board. After the test is completed, only the new devices need to be disassembled and installed, which can improve testing efficiency and reduce testing costs.
[0036] In this embodiment of the disclosure, please refer to Figure 1 A high-temperature resistant test board for testing high-current power devices includes a substrate and a power supply module, a detection module, and a control module disposed on the substrate. The power supply module is used to provide the high current required by the device under test, the detection module is used to detect each device under test, and the control module is used to control the test process and analyze data to generate a report.
[0037] In this embodiment, the substrate is made of epoxy board, and the surface of the substrate is provided with a gold layer formed by immersion gold plating, the thickness of which is greater than or equal to 3 micrometers. Based on the above scheme, by making the substrate with epoxy board and using immersion gold plating to form a gold layer greater than 3 micrometers, it is ensured that the high-temperature test board can withstand high-temperature environments, providing a guarantee for high-temperature aging tests of devices. In some embodiments, the substrate can also be made of ceramic material. The ceramic substrate serves as a circuit carrier, with copper plating and nickel plating on the top and bottom surfaces, which can improve heat dissipation efficiency and ensure circuit operation safety.
[0038] The power module includes a power interface, a protection circuit, and a power supply loop. The power interface is used to connect an external power supply line. The power supply loop is used to convert the power signal received by the power interface into a power signal that is compatible with the device under test. The protection circuit is located between the power supply loop and the power interface and is used for overcurrent cut-off protection.
[0039] In some possible implementations, the protection circuit includes a fuse with an adjustable rated current range, enabling overcurrent protection. In other possible implementations, the protection circuit includes a voltage regulator, which prevents voltage surges and provides overvoltage protection. This dual protection against overcurrent and overvoltage improves test safety and prevents device damage from surges.
[0040] The testing module includes multiple testing interfaces, a motor terminal interface, and a signal acquisition circuit. The testing interfaces are used to mount the device under test (DUT). The multiple testing interfaces may be of the same or different models. The testing interfaces are connected to the power supply circuit and the motor terminal interface, respectively. The signal acquisition circuit is connected to the motor terminal interface to obtain the output signal of the DUT. In some cases, a universal interface can be used, which can be adapted to different models of high-current power devices.
[0041] The control module includes a controller and a communication interface. The controller is connected to the detection interface to send control signals, the controller is connected to the signal acquisition circuit to acquire the output signal of the device under test, and the controller is connected to the communication interface to send test data to the test equipment through the communication interface.
[0042] Based on the above structure, the high-temperature resistant test board of this disclosure embodiment can install multiple identical or different high-current power devices to be tested. The high-temperature resistant test board integrates a power supply module, a detection module, and a control module, which can send corresponding control signals to the devices under test and collect the device output signals. It can independently analyze the performance of each device and generate test results. The high-temperature resistant test board can reduce the cost and difficulty of testing high-current power devices.
[0043] In some embodiments, please refer to Figure 2 The detection module also includes a multiplexing module. The input of the multiplexing module is connected to multiple detection interfaces, the output of the multiplexing module is connected to the motor terminal interface, and the control terminal of the multiplexing module is connected to the controller. Based on the above scheme, the multiplexing module can realize the alternating connection of multiple detection interfaces to one motor terminal interface, thereby reducing the number of components on the high-temperature resistance test board, reducing the size and manufacturing cost of the high-temperature resistance test board.
[0044] In some embodiments, please refer to Figure 3The power module also includes a current feedback circuit, which comprises a shunt resistor, a differential amplifier, and an analog-to-digital converter (ADC). The shunt resistor is positioned between the power supply circuit and the detection interface. The input of the differential amplifier is connected to both ends of the shunt resistor, and the output of the differential amplifier is connected to the input of the ADC. The output of the ADC is connected to the controller. Based on this scheme, the current feedback circuit, designed with a differential circuit, acquires the output current of the power supply circuit, enabling the detection of any abnormalities in the power supply circuit. This avoids inaccurate testing due to current fluctuations and improves the accuracy of device detection.
[0045] In some embodiments, the control module further includes a first temperature detection circuit and a second temperature detection circuit. The first temperature detection circuit is located at the detection interface and is used to detect the temperature of the device under test. The second temperature detection circuit is located around the substrate and is used to detect the ambient temperature. Based on the above scheme, by setting two temperature detection circuits to detect the device temperature and the ambient temperature respectively, the accuracy of the test environment is ensured. In practical applications, the device temperature detected by the first temperature detection circuit is one of the test parameters, while the ambient temperature detected by the second temperature detection circuit is used to verify the accuracy of the simulated environment. The controller connects to the high-temperature aging test device through a communication interface to obtain the set temperature data. By comparing the detected temperature data with the set temperature data, the accuracy of the simulated environment can be verified.
[0046] This disclosure also provides a testing method for high-current power devices, applied to a high-temperature resistant test board for testing high-current power devices according to any of the above embodiments. The high-temperature resistant test board for testing high-current power devices is installed in the cavity of a high-temperature aging test apparatus. Please refer to... Figure 4 The testing methods include: S101, Interface status data of the detection interface in the detection module, the interface status data indicates the model of the corresponding detection interface and whether the device to be tested is installed; S102. Based on the interface status data, determine the target detection parameters, which indicate the detection sequence of at least one device under test and the control parameters of each device under test. S103. Send the target detection data to the high-temperature aging test device to control the high-temperature aging test device to generate the corresponding test environment. S104. Upon receiving the signal indicating that the high-temperature aging test device is ready, test at least one device under test according to the test sequence and record the test data of each device under test. S105. Generate a test report based on the test data of each device under test.
[0047] Based on the above S101~S105, by detecting the type of device under test on the high-temperature test board and generating corresponding test parameters, and then sending them to the high-temperature aging test device to generate the corresponding test environment, and finally testing each device and generating a report, it is possible to achieve rapid testing of a large number of high-current power devices in one loading and unloading operation, thereby improving testing efficiency.
[0048] In this embodiment of the disclosure, the test data includes device temperature, device voltage, and device current. The test report for each device under test is determined based on device temperature, device voltage, and device current; that is, the high-temperature stability of the device under test is determined by device temperature, device voltage, and device current. The determination method includes: determining the corresponding device as high-temperature stable if both a first condition and a second condition are met; the first condition includes device temperature fluctuation being less than or equal to a first temperature fluctuation threshold and device voltage fluctuation being less than or equal to a voltage fluctuation threshold; the second condition includes device temperature fluctuation being less than or equal to a second temperature fluctuation threshold and device current fluctuation being less than or equal to a current fluctuation threshold.
[0049] Based on the above scheme, the device is tested and judged from the perspectives of temperature fluctuation, voltage fluctuation and current fluctuation, which can improve the accuracy of the test report.
[0050] In this embodiment of the disclosure, the parameters of the high-temperature aging test device and the high-temperature resistance test plate also need to be detected simultaneously during the test process to ensure that the test parameters are accurate and to avoid inaccurate test results due to errors in the test device or test plate data.
[0051] In some possible implementations, temperature data is detected during the test to enable feedback-based emergency stop. Specifically, the method includes: during the test, acquiring first temperature data and second temperature data, where the first temperature data is temperature data sent by the high-temperature aging test device and the second temperature data is temperature data detected by a high-temperature resistant test board used for testing high-current power devices; and interrupting the test if the difference between the first temperature data and the second temperature data exceeds a preset temperature difference.
[0052] Based on the above scheme, the ambient temperature detected by the test board is compared with the ambient temperature set by the high-temperature aging test device. The test is interrupted when the temperature data difference is large, so as to avoid inaccurate test due to inaccurate ambient temperature.
[0053] In some possible implementations, power supply data is detected during testing to enable feedback emergency stop. Specifically, the method includes: acquiring the electrical parameters of the power supply circuit of the high-temperature resistant test board used for testing high-current power devices during testing; and controlling the power supply circuit to disconnect if the electrical parameters exceed a safety threshold or if the electrical parameters do not match the control parameters.
[0054] Based on the above scheme, during the test, the electrical parameters of the power supply circuit are compared with the safety threshold and control parameters respectively. If any one of them is mismatched, the power supply circuit is cut off, thereby ensuring test safety and test accuracy.
[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. At the same time, those skilled in the art should understand and implement the above description. Therefore, any equivalent changes or modifications made without departing from the concept disclosed in the present invention should be covered within the scope of protection of the present invention.
Claims
1. A high-temperature-resistant test board for high-current power device testing for mounting in a cavity of a high-temperature aging test device for testing a high-current power device, characterized by, It includes a substrate and a power module, a detection module, and a control module disposed on the substrate; The power module includes a power interface, a protection circuit, and a power supply circuit. The power interface is used to connect an external power supply line. The power supply circuit is used to convert the power signal received by the power interface into a power signal adapted to the device under test. The protection circuit is located between the power supply circuit and the power interface and is used for overcurrent cut-off protection. The detection module includes multiple detection interfaces, a motor terminal interface, and a signal acquisition circuit. The detection interfaces are used to install the device under test. The multiple detection interfaces may be of the same or different models. The detection interfaces are respectively connected to the power supply circuit and the motor terminal interface. The signal acquisition circuit is connected to the motor terminal interface to obtain the output signal of the device under test. The control module includes a controller and a communication interface. The controller is connected to the detection interface to send control signals, the controller is connected to the signal acquisition circuit to obtain the output signal of the device under test, and the controller is connected to the communication interface to send test data to the test equipment through the communication interface.
2. The high-temperature resistant test board for testing high-current power devices according to claim 1, characterized in that, The detection module also includes a multiplexing module. The input terminal of the multiplexing module is connected to the plurality of detection interfaces, the output terminal of the multiplexing module is connected to the motor terminal interface, and the control terminal of the multiplexing module is connected to the controller.
3. The high-temperature resistant test board for testing high-current power devices according to claim 1, characterized in that, The power module further includes a current feedback circuit, which includes a shunt resistor, a differential amplifier, and an analog-to-digital converter. The shunt resistor is located between the power supply circuit and the detection interface. The input terminal of the differential amplifier is connected to both ends of the shunt resistor. The output terminal of the differential amplifier is connected to the input terminal of the analog-to-digital converter. The output terminal of the analog-to-digital converter is connected to the controller.
4. The high-temperature resistant test board for testing high-current power devices according to claim 1, characterized in that, The substrate is made of epoxy board, and the surface of the substrate is provided with a gold layer made by immersion gold process, the thickness of the gold layer being greater than or equal to 3 micrometers.
5. The high-temperature resistant test board for testing high-current power devices according to claim 1, characterized in that, The control module further includes a first temperature detection circuit and a second temperature detection circuit. The first temperature detection circuit is located at the detection interface and is used to detect the temperature of the device under test. The second temperature detection circuit is located around the substrate and is used to detect the ambient temperature.
6. The high-temperature resistant test board for testing high-current power devices according to claim 1, characterized in that, The protection circuit includes a fuse with an adjustable rated current range; or, the protection circuit includes a voltage regulator.
7. A testing method for high-current power devices, applied to a high-temperature resistant test board for testing high-current power devices according to any one of claims 1-6, wherein the high-temperature resistant test board for testing high-current power devices is installed in the cavity of a high-temperature aging test apparatus, characterized in that... include: The interface status data of the detection interface in the detection module indicates the model of the corresponding detection interface and whether the device under test is installed. Based on the interface status data, target detection parameters are determined, which indicate the detection sequence of at least one device under test and the control parameters of each device under test. The target detection data is sent to the high-temperature aging test device to control the high-temperature aging test device to generate the corresponding test environment; Upon receiving the preparation completion signal of the high-temperature aging test device, at least one device under test is tested according to the test sequence, and the test data of each device under test is recorded. Test reports are generated based on the test data of each device under test.
8. The method according to claim 7, characterized in that, The test data includes device temperature, device voltage, and device current. The generation of a test report based on the test data for each device under test includes: If both the first and second conditions are met, the corresponding device will be determined to be high-temperature stable. The first condition includes device temperature fluctuation being less than or equal to a first temperature fluctuation threshold and device voltage fluctuation being less than or equal to a voltage fluctuation threshold. The second condition includes device temperature fluctuation being less than or equal to a second temperature fluctuation threshold and device current fluctuation being less than or equal to a current fluctuation threshold.
9. The method according to claim 7, characterized in that, The method further includes: During the test, first temperature data and second temperature data are acquired. The first temperature data is the temperature data sent by the high-temperature aging test device, and the second temperature data is the temperature data detected by the high-temperature resistant test board for testing high-current power devices. The test is interrupted if the difference between the first temperature data and the second temperature data is greater than a preset temperature difference.
10. The method according to claim 7, characterized in that, The method further includes: During the test, the electrical parameters of the power supply circuit of the high-temperature resistant test board used for testing the high-current power device are obtained; If the electrical parameter is greater than the safety threshold or the electrical parameter does not match the control parameter, the power supply circuit is cut off.