Semiconductor probe card body processing device and method

Abstract

The invention belongs to the technical field of semiconductor probe card body machining, and discloses a semiconductor probe card body machining device and method.The semiconductor probe card body machining device comprises a supporting base, a mounting disc is fixedly mounted at the top end of the supporting base, and limiting guide rails are mounted at the left end and the right end of the outer side face of the mounting disc; an adjusting assembly is movably mounted in the middle of the top end of the mounting disc. The inner supporting wheel at the tail end expands outwards until the inner supporting wheel tightly abuts against the inner wall of the central hole of the PCB, the fixing mode of positioning from the center through inner supporting friction force is adopted, installation steps are simple and rapid, stress is uniform, positioning is stable, due to the supporting effect of the supporting base, the whole PCB is stably heightened in the air, and the service life of the PCB is prolonged. The front surface and the back surface of the PCB are completely exposed in the operation space, so that the operation mode that the PCB must be horizontally placed or turned over in the traditional process is changed, a key physical premise is provided for subsequent synchronous operation of front surface needle threading and back surface welding, and the processing convenience is improved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor probe card pin body processing technology, specifically a semiconductor probe card pin body processing apparatus and method. Background Technology

[0002] Semiconductor probe cards are core components in wafer testing. The probe pins on these cards act as "tentacles" that directly contact the wafer pads, and the accuracy of their installation and the reliability of their soldering are crucial to the accuracy of the test results. Existing probe pin fabrication, especially the assembly of high-density probe cards, typically involves precisely inserting tens of thousands of micron-sized pins into corresponding holes on the PCB and then soldering them in place.

[0003] In existing manufacturing processes, the fixing and handling of probe card PCBs presents numerous inconveniences. Typically, the PCB is placed flat on a worktable or secured using edge clamps. This method limits operators to processing only one side of the PCB, for example, inserting a probe from side A. When soldering is required on the end of a probe on side B, the entire PCB must be carefully removed from the fixture, flipped, and then reinstalled and aligned. This "flipping-reinstallation" process is not only extremely time-consuming, but also highly susceptible to displacement, tilting, or even detachment of inserted but not secured probes during the flipping and secondary clamping process, severely impacting processing accuracy and yield.

[0004] Furthermore, processing efficiency is also limited by the coordination of tools and the alignment method. During pin insertion and soldering, guide tools need to be placed on the top and bottom sides of the PCB board respectively. In traditional processes, the alignment of these two tools often needs to be adjusted separately, making it difficult to guarantee their absolute coaxiality, resulting in cumbersome and error-prone alignment operations. After processing one hole, moving to the next hole in the same queue often requires moving the entire (usually bulky) PCB board or tooling platform, rather than moving the small processing tool head. This "workpiece moving" mode results in slow equipment response, high vibration, and long positioning time, significantly restricting processing speed and making the entire probe card assembly cycle very long, making it difficult to meet the ever-increasing semiconductor testing needs. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor probe card pin body processing apparatus and method to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor probe card pin processing device, comprising a support base, a mounting plate fixedly mounted on the top of the support base, limit guide rails mounted on both the left and right ends of the outer side of the mounting plate, an adjustment component movably mounted in the middle of the top of the mounting plate, the left and right sides of the bottom of the adjustment component being movably engaged with the two limit guide rails, an inner support component movably sleeved inside each of the two limit guide rails, one end of the inner support component being connected to the adjustment component, locking holes being provided at the upper and lower ends of the relatively far side of the two limit guide rails, a pin-threading welding component being provided on the relatively far side of the two limit guide rails, a synchronization component being installed on the relatively far side of the two pin-threading welding components, and locking components being installed at the upper and lower ends of the relatively close side of the two pin-threading welding components, the pin-threading welding components being movably engaged with the locking holes through the locking components.

[0007] As a further technical solution of the present invention, the adjustment component includes an adjustment block, which is movably engaged with the limiting guide rail. The adjustment component also includes a vertically arranged adjustment screw, the bottom end of which is movably mounted at the middle position of the top of the mounting plate. A threaded sleeve is threaded onto the outer side of the adjustment screw, and a movable block is fixedly sleeved onto the outer side of the threaded sleeve.

[0008] As a further technical solution of the present invention, a first fixed seat is installed on both the left and right sides of the bottom of the movable block, and a second fixed seat is installed in the middle of the top of the adjusting block, and a connecting rod is movably connected between the second fixed seat and the first fixed seat.

[0009] As a further technical solution of the present invention, the inner support assembly includes an extension rod, one end of which passes through one end of the limiting guide rail and is connected to the adjusting block. The end of the extension rod away from the adjusting block is equipped with a mounting bracket, and an inner support wheel is movably mounted on the inner side of the mounting bracket.

[0010] As a further technical solution of the present invention, the needle welding assembly includes an adjustment frame, and extension frames are installed at both the upper and lower ends of the adjustment frame near the limiting guide rail. When the needle welding assembly and the limiting guide rail are engaged with each other, the extension frames are located directly above the locking hole.

[0011] As a further technical solution of the present invention, the locking assembly includes a pull plate, a pull rod is installed at the bottom end of the pull plate, a limit spring is movably sleeved on the outer side of the pull rod, the upper and lower ends of the limit spring are respectively connected to the bottom end of the pull plate and one end of the extension frame, and when the needle welding assembly is movably engaged with the limit guide rail, the pull rod is inserted into the inside of the locking hole and movably engaged with the locking hole.

[0012] As a further technical solution of the present invention, slots are provided at both the upper and lower ends of the inner side of the adjustment frame, and a locking block is movably engaged inside the slot. A fine-tuning screw is threaded inside the locking block, and the end of the fine-tuning screw away from the limiting guide rail passes through one side of the adjustment frame and is connected to the synchronization component.

[0013] As a further technical solution of the present invention, the synchronization component includes a motor mounting bracket, the outer side of the motor mounting bracket and the adjustment bracket are fixed to each other, a main motor is installed on the inner side of the motor mounting bracket, a drive gear is installed at the output end of the main motor, driven gears are meshed at both the upper and lower ends of the drive gear, and the middle of the two driven gears is connected to the upper and lower micro-adjustment screws.

[0014] As a further technical solution of the present invention, each of the two card blocks is equipped with an elastic telescopic rod at one end that is relatively close to each other, a needle holder is installed at one end that is relatively close to each other, an electromagnet is installed at one end that is relatively close to each other, a through hole is opened at one end of the upper needle holder, and a welding machine located directly below the through hole is installed at one end of the lower needle holder.

[0015] The semiconductor probe card pin body processing method includes the following steps:

[0016] S1: Fixing the PCB board: Pass the mounting plate through the central hole of the probe card PCB board, start the adjustment component to drive the two inner support components to move apart, so that the inner support wheels on them abut against the inner wall of the hole, thereby fixing and raising the PCB board.

[0017] S2: Synchronous Alignment: Activate the synchronization component, which drives the upper and lower fine adjustment screws to rotate synchronously through the drive gear and driven gear, thereby driving the upper and lower needle holders installed on the card block to move synchronously until they are aligned with the upper and lower ends of the target hole on the PCB board.

[0018] S3: Needle insertion and welding: The operator inserts the needle through the through hole of the upper needle holder, so that the needle passes through the hole in the PCB board, activates the electromagnet, brings the welding machine mounted on the lower needle holder close to the end of the needle, and starts the welding machine to perform welding.

[0019] S4: Queue processing: After completing the processing of one hole, keep the PCB board stationary and repeat step two. Only drive the upper and lower needle holders to move to the next hole in the same queue through the synchronization component, and repeat step three to complete the sequential assembly of multiple holes in the queue.

[0020] The beneficial effects of this invention are as follows:

[0021] 1. This invention achieves rapid and stable fixation of the probe card PCB board by setting up an adjustment component and an internal support component, and elevates it to facilitate double-sided collaborative operation. This solves the technical problems of cumbersome PCB board fixation, easy displacement, and inability to perform double-sided operations in the prior art. In use, the mounting plate is passed through the center hole of the PCB board, and then the adjustment screw in the adjustment component is rotated. The adjustment screw drives the movable block to move, and through the linkage mechanism, it drives the two adjustment blocks to move relative to each other. The adjustment blocks further drive the extension rod of the internal support component, causing the end of the internal support wheel to expand outward until it tightly abuts against the inner wall of the center hole of the PCB. This fixing method, which uses the friction of the internal support to position from the center, is not only simple and quick to install, but also provides uniform force and stable positioning. Due to the support of the support base, the entire PCB board is stably elevated in the air, so that its front and back sides are fully exposed in the operating space. This changes the traditional operation mode in which the PCB board must be laid flat or flipped, providing a key physical prerequisite for subsequent "front-side needle insertion and back-side soldering" synchronous operation and improving the convenience of processing.

[0022] 2. This invention achieves synchronized and precise alignment of the upper and lower sides of the PCB board hole by setting up a synchronization component and a needle-threading and welding component linked to it. This solves the technical problems of existing technologies where the upper and lower tools need to be adjusted separately, alignment is difficult, and errors are easily generated. The upper threading frame and the lower welding machine are fixed on two clamping blocks, which are threaded onto two parallel micro-adjustment screws. The main motor in the synchronization component drives the driven gear connected to the two micro-adjustment screws through the driving gear. The gear transmission system ensures that once the main motor is started, the rotation angle and speed of the upper and lower micro-adjustment screws are completely consistent. Therefore, the upper and lower clamping blocks and the threading frame and welding machine on them can move along the guide of the micro-adjustment screws at a completely synchronized speed and displacement. When aligning the hole, the operator does not need to adjust the upper and lower tools separately. Just start the main motor to move the upper and lower tools simultaneously and accurately above and below the target hole at one time. This ensures that the needle guide hole and the center of the welding machine are coaxial, greatly simplifying the alignment operation and significantly improving the alignment accuracy and efficiency.

[0023] 3. This invention, through the aforementioned fixing method and synchronous alignment mechanism, combined with the needle-welding assembly, achieves simultaneous completion of "needle-welding" and efficient processing of "fixed workpiece, moving tool," solving the problems of fragmented processing flow, long auxiliary time, and low overall efficiency in traditional processes. After the PCB board is stably elevated and the upper and lower tools are synchronously aligned, the operator can immediately insert the needle through the upper through-hole. After the needle passes through the PCB, its end immediately reaches the working range of the welding machine below. At this time, through the action of the electromagnet and the elastic telescopic rod, the welding machine moves close to the end of the needle and completes the welding. The two core steps of "needle-threading" and "welding" are completed collaboratively at the same station and at the same time node, without any flipping or waiting. In addition, after processing a hole, the PCB board remains stationary. The operator only needs to restart the synchronous assembly to quickly move the lightweight needle-welding assembly to the next hole in the queue and immediately repeat the needle-welding operation, almost eliminating the auxiliary time for hole switching and significantly improving processing efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram showing the present invention with the needle welding assembly hidden.

[0026] Figure 3 This is an exploded view of the structure of the limiting guide rail and adjustment component of the present invention;

[0027] Figure 4 This is a separate schematic diagram of the internal support component structure of the present invention;

[0028] Figure 5 This is a schematic diagram illustrating the fit between the needle-threading welding assembly and the synchronization assembly of the present invention;

[0029] Figure 6 for Figure 5 Enlarged schematic diagram of the structure at point A;

[0030] Figure 7 This is a partial schematic diagram of the synchronization component structure of the present invention;

[0031] Figure 8 This is a separate schematic diagram of the needle welding assembly structure of the present invention.

[0032] In the diagram: 1. Support base; 2. Mounting plate; 3. Limiting guide rail; 4. Adjustment assembly; 401. Adjusting block; 402. Movable block; 403. Threaded sleeve; 404. Adjusting screw; 405. First fixed seat; 406. Second fixed seat; 407. Connecting rod; 5. Inner support assembly; 501. Extension rod; 502. Mounting bracket; 503. Inner support wheel; 6. Locking hole; 7. Needle threading and welding assembly; 701. Adjusting bracket; 702. Slot; 703. Locking block; 704. Fine-tuning screw; 705. Extension bracket; 706. Elastic telescopic rod; 707. Needle threading frame; 708. Welding machine; 8. Synchronization assembly; 801. Motor fixing bracket; 802. Main motor; 803. Drive gear; 804. Driven gear; 9. Locking assembly; 901. Pull plate; 902. Pull rod; 903. Limiting spring. Detailed Implementation

[0033] like Figures 1 to 8 As shown in the embodiment of the present invention, the semiconductor probe card pin processing device includes a support base 1. A mounting plate 2 is fixedly installed on the top of the support base 1. Limiting guide rails 3 are installed on both the left and right ends of the outer side of the mounting plate 2. An adjustment component 4 is movably installed in the middle of the top of the mounting plate 2. The left and right sides of the bottom of the adjustment component 4 are movably engaged with the two limiting guide rails 3. An inner support component 5 is movably sleeved inside the two limiting guide rails 3. One end of the inner support component 5 is connected to the adjustment component 4. Locking holes 6 are opened at the upper and lower ends of the relatively far side of the two limiting guide rails 3. A needle welding component 7 is provided on the relatively far side of the two limiting guide rails 3. A synchronization component 8 is installed on the relatively far side of the two needle welding components 7. Locking components 9 are installed at the upper and lower ends of the relatively close side of the two needle welding components 7. The needle welding component 7 is movably engaged with the locking hole 6 through the locking component 9.

[0034] During the processing and assembly of the needle body and probe PCB, the material is first drawn into micron-level fine filaments using an external wire drawing machine. Then, an ultra-thin PTFE dry film lubricating layer is coated on the needle body surface using plasma deposition and spraying equipment, while keeping the conductive ends exposed. Specifically, the surface is treated with Ar plasma, followed by spraying PTFE sol, and then cured at a low temperature of 180 degrees Celsius. After the coating treatment is completed, the cut straight needle is bent into a specific cantilever shape using a needle bending machine to provide elastic pressure during contact.

[0035] Through the above-mentioned wire drawing, spraying, and bending processes, it is possible to ensure that the needle body can be correctly assembled with the probe card, reduce the coefficient of friction, reduce particle generation, extend probe life, improve test stability, and avoid the problem of wear and particle shedding that easily occurs during repeated probe contact tests, which leads to a decrease in yield.

[0036] like Figure 1 and Figure 2 as well as Figure 3 As shown, the adjustment component 4 includes an adjustment block 401, which is movably engaged with the limiting guide rail 3. The adjustment component 4 also includes a vertically arranged adjustment screw 404. The bottom end of the adjustment screw 404 is movably mounted at the middle position of the top of the mounting plate 2. A threaded sleeve 403 is threaded onto the outer side of the adjustment screw 404. A movable block 402 is fixedly mounted onto the outer side of the threaded sleeve 403. First fixed seats 405 are installed on both the left and right sides of the bottom end of the movable block 402. Second fixed seats 406 are installed at the middle of the top of the adjustment block 401. A connecting rod 407 is movably connected between the second fixed seat 406 and the first fixed seat 405.

[0037] When assembling the needle body and probe card PCB, first pass the mounting plate 2 through the middle of the probe card PCB, and keep both inner support components 5 in the middle of the PCB. According to the size of the round hole, rotate the adjusting screw 404 to drive the movable block 402 to move up and down, and drive the two connecting rods 407 to deflect relative to each other, and finally drive the two adjusting blocks 401 to move closer or further away from each other.

[0038] like Figure 2 and Figure 4 As shown, the inner support assembly 5 includes an extension rod 501. One end of the extension rod 501 passes through one end of the limiting guide rail 3 and is connected to the adjusting block 401. The end of the extension rod 501 away from the adjusting block 401 is equipped with a mounting bracket 502. The inner side of the mounting bracket 502 is movably equipped with an inner support wheel 503.

[0039] The compatible PCB center hole range is Φ20-Φ42mm, and the extension rod 501 stroke corresponds to an opening amount of 2.5-6mm.

[0040] Example: When the two adjusting blocks 401 move away from each other, the two extension rods 501 also move away from each other, and drive the two inner support wheels 503 to move away from each other. Finally, the two inner support wheels 503 come into contact with the inner side of the round hole. Through the friction between the two inner support wheels 503 and the inner side of the round hole, the device is fixed at the center of the PCB. Since the bottom of the mounting plate 2 is supported by the support base 1, the entire probe card PCB is limited and fixed and raised, so that it can operate on both sides of the PCB at the same time.

[0041] By adjusting the fit between component 4 and inner support component 5, the device can be quickly installed on the center of the PCB by simply rotating the adjusting screw 404, and the probe card PCB can be raised. At this time, both sides of the PCB can be processed, which effectively avoids the problem that traditional processing devices require the PCB to be placed on the worktable and can only process one side, thus effectively improving processing efficiency.

[0042] like Figure 1and Figure 5 as well as Figure 6 As shown, the needle welding assembly 7 includes an adjustment frame 701. Extension frames 705 are installed at both the upper and lower ends of the adjustment frame 701 near the limiting guide rail 3. When the needle welding assembly 7 and the limiting guide rail 3 are engaged, the extension frames 705 are located directly above the locking hole 6. The locking assembly 9 includes a pull plate 901. A pull rod 902 is installed at the bottom end of the pull plate 901. A limiting spring 903 is movably sleeved on the outer side of the pull rod 902. The upper and lower ends of the limiting spring 903 are respectively connected to the bottom end of the pull plate 901 and one end of the extension frame 705. When the needle welding assembly 7 and the limiting guide rail 3 are engaged, the pull rod 902 is inserted into the interior of the locking hole 6 and engaged with the locking hole 6.

[0043] After the PCB board is fixed, the inner side of the pin welding assembly 7 can be passed through the PCB board and fixed between it and the two limiting guide rails 3. That is, pull the pull plate 901 outward, so that the limiting spring 903 is compressed and the pull rod 902 is displaced outward. When the pull rod 902 corresponds to the locking hole 6, the pull plate 901 is released. Under the reset action of the limiting spring 903, the pull rod 902 is driven to insert into the locking hole 6 to realize the assembly and fixation between the pin welding assembly 7 and the limiting guide rail 3.

[0044] like Figure 1 and Figure 5 as well as Figure 7 and Figure 8 As shown, the upper and lower ends of the inner side of the adjusting frame 701 are provided with slots 702. Each slot 702 contains a movable locking block 703. A fine-tuning screw 704 is threaded into the locking block 703. The end of the fine-tuning screw 704 away from the limiting guide rail 3 passes through one side of the adjusting frame 701 and is connected to the synchronization component 8. The synchronization component 8 includes a motor mounting bracket 801, which is fixed to the outer side of the adjusting frame 701. A main motor 802 is mounted on the inner side of the motor mounting bracket 801, and a drive gear is mounted on the output end of the main motor 802. The upper and lower ends of the drive gear 803 are meshed with driven gears 804. The middle of the two driven gears 804 is connected to the upper and lower micro-adjustment screws 704. The two locking blocks 703 are each equipped with an elastic telescopic rod 706 at their relatively close ends. The two elastic telescopic rods 706 are each equipped with a needle holder 707 at their relatively close ends. The two needle holders 707 are each equipped with an electromagnet at their relatively close ends. A through hole is opened at one end of the upper needle holder 707. A welding machine 708 is installed at one end of the lower needle holder 707, which is located directly below the through hole.

[0045] The upper and lower fine adjustment screws 704 are engaged by the same module of the driving gear 803 and the double driven gear 804. The relationship between the screw pitch P and the gear rotation angle θ: ΔL=P·θ / 360° is used as the basis for synchronous positioning measurement. Based on this, those skilled in the art can directly complete the alignment compensation and error verification.

[0046] Example: During the assembly of the needle body and probe card, the hole is rotated to the inner side of the needle insertion and welding assembly 7, and the main motor 802 is turned on. The drive gear 803 rotates accordingly, driving the upper and lower driven gears 804 to rotate synchronously. Simultaneously, the upper and lower micro-adjustment screws 704 rotate, driving the upper and lower locking blocks 703 to move synchronously. The upper and lower locking blocks 703 then align with the upper and lower ends of the hole until the upper and lower needle holders 707 correspond to the upper and lower ends of the hole. At this point, the operator holds the needle body, passes it through the through hole of the upper needle holder 707, and inserts it onto the PCB, completing the assembly. After insertion, the electromagnets installed on the upper and lower needle holders 707 are activated. The two electromagnets attract each other, causing the upper and lower needle holders 707 to move closer together and overcome the elastic force of the elastic telescopic rod 706. This allows the welding machine 708 located on the lower needle holder 707 to approach the end of the needle body, and the welding machine 708 is activated to perform welding. After welding is completed, the electromagnets are de-energized, the elastic telescopic rod 706 is reset, and the two needle holders 707 are pushed apart. Insertion and welding are performed simultaneously. Meanwhile, the synchronous component 8 is operated to move the position of the upper and lower needle holders 707 to perform the assembly process of the needle body at the next hole position until the assembly process of all needle bodies is completed.

[0047] The electromagnet's attraction force is limited to 0.8-1.5N, and the elastic telescopic rod 706's restoring force is limited to 0.6-1.1N, ensuring that the total resultant force F_total in the attraction state is greater than 0.2N. This guarantees that the welding machine 708 only approaches in one direction and does not overtravel. Its travel range is limited to 0.6-1.0mm. The range limit is achieved by converting the travel limit end face with the pitch of the fine-tuning screw 704, thereby ensuring that the welding machine 708's approach and positioning action is repeatable.

[0048] By utilizing the cooperation between the needle insertion and welding assembly 7 and the synchronization assembly 8, the positions of the upper and lower needle holders 707 are simultaneously adjusted through the action of the synchronization assembly 8, so that they correspond to the upper and lower ends of the hole respectively. This allows the insertion and welding of the needle body to be completed synchronously without flipping the PCB. At the same time, the holes in a row can be assembled sequentially without moving the PCB, which significantly shortens the processing time and improves the overall processing efficiency.

[0049] The semiconductor probe card pin body processing method includes the following steps:

[0050] S1: Fixing the PCB board: Pass the mounting plate 2 through the central hole of the probe card PCB board, start the adjustment component 4 to drive the two inner support components 5 to move apart, so that the inner support wheels 503 on them abut against the inner wall of the hole, thereby fixing and raising the PCB board.

[0051] S2: Synchronous alignment: Start the synchronization component 8, and drive the upper and lower micro-adjustment screws 704 to rotate synchronously through the drive gear 803 and the driven gear 804, which in turn drive the upper and lower needle holders 707 installed on the card block 703 to move synchronously until they are aligned with the upper and lower ends of the target hole on the PCB.

[0052] S3: Needle insertion and welding: The operator inserts the needle body through the through hole of the upper needle holder 707, so that the needle body passes through the hole of the PCB board, activates the electromagnet, so that the welding machine 708 installed on the lower needle holder 707 approaches the end of the needle body, and starts the welding machine 708 to perform welding.

[0053] S4: Queue processing: After completing the processing of one hole, keep the PCB board stationary and repeat step two. Only drive the upper and lower needle holders 707 to move to the next hole in the same queue through the synchronization component 8, and repeat step three to complete the sequential assembly of multiple holes in the queue.

Claims

1. A semiconductor probe card pin processing device, comprising a support base (1), characterized in that: The top of the support base (1) is fixedly installed with an installation plate (2). The left and right ends of the outer side of the installation plate (2) are both equipped with limit guide rails (3). An adjustment component (4) is movably installed in the middle of the top of the installation plate (2). The left and right sides of the bottom of the adjustment component (4) are movably engaged with the two limit guide rails (3). The interior of the two limit guide rails (3) is movably sleeved with an inner support component (5). One end of the inner support component (5) is connected to the adjustment component (4). The upper and lower ends of the two limit guide rails (3) on the opposite side are provided with locking holes (6). The opposite side of the two limit guide rails (3) is provided with a needle welding component (7). The opposite side of the two needle welding components (7) is provided with a synchronization component (8). The upper and lower ends of the opposite side of the two needle welding components (7) are provided with locking components (9). The needle welding component (7) is movably engaged with the locking hole (6) through the locking component (9).

2. The semiconductor probe card pin processing apparatus according to claim 1, characterized in that: The adjustment component (4) includes an adjustment block (401), which is movably engaged with the limiting guide rail (3). The adjustment component (4) also includes a vertically arranged adjustment screw (404), the bottom end of which is movably mounted at the middle position of the top of the mounting plate (2). The outer side of the adjustment screw (404) is threaded with a threaded sleeve (403), and the outer side of the threaded sleeve (403) is fixedly fitted with a movable block (402).

3. The semiconductor probe card pin processing apparatus according to claim 2, characterized in that: The movable block (402) has a first fixed seat (405) installed on both the left and right sides of its bottom end, and the adjusting block (401) has a second fixed seat (406) installed in the middle of its top end. A connecting rod (407) is movably connected between the second fixed seat (406) and the first fixed seat (405).

4. The semiconductor probe card pin processing apparatus according to claim 3, characterized in that: The inner support assembly (5) includes an extension rod (501), one end of which passes through one end of the limiting guide rail (3) and is connected to the adjusting block (401). The end of the extension rod (501) away from the adjusting block (401) is equipped with a mounting bracket (502), and the inner side of the mounting bracket (502) is movably equipped with an inner support wheel (503).

5. The semiconductor probe card pin processing apparatus according to claim 4, characterized in that: The needle welding assembly (7) includes an adjustment frame (701). The upper and lower ends of the adjustment frame (701) near the limiting guide rail (3) are equipped with extension frames (705). When the needle welding assembly (7) and the limiting guide rail (3) are engaged, the extension frame (705) is located directly above the locking hole (6).

6. The semiconductor probe card pin processing apparatus according to claim 5, characterized in that: The locking assembly (9) includes a pull plate (901), and a pull rod (902) is installed at the bottom end of the pull plate (901). A limit spring (903) is movably sleeved on the outer side of the pull rod (902). The upper and lower ends of the limit spring (903) are respectively connected to the bottom end of the pull plate (901) and one end of the extension frame (705). When the needle welding assembly (7) is movably engaged with the limit guide rail (3), the pull rod (902) is inserted into the interior of the locking hole (6) and movably engaged with the locking hole (6).

7. The semiconductor probe card pin processing apparatus according to claim 6, characterized in that: The upper and lower ends of the inner side of the adjustment frame (701) are provided with slots (702), and the slots (702) are movably engaged with blocks (703). The blocks (703) are threaded with fine adjustment screws (704). The end of the fine adjustment screw (704) away from the limit guide rail (3) passes through one side of the adjustment frame (701) and is connected to the synchronization component (8).

8. The semiconductor probe card pin processing apparatus according to claim 7, characterized in that: The synchronization component (8) includes a motor mounting bracket (801), which is fixed to the outer side of the adjustment bracket (701). A main motor (802) is mounted on the inner side of the motor mounting bracket (801). A drive gear (803) is mounted on the output end of the main motor (802). Driven gears (804) are meshed at both ends of the drive gear (803). The middle of the two driven gears (804) is connected to the upper and lower micro-adjustment screws (704).

9. The semiconductor probe card pin body processing apparatus according to claim 8, characterized in that: Each of the two locking blocks (703) has an elastic telescopic rod (706) installed at one end that is close to the other. Each of the two elastic telescopic rods (706) has a needle holder (707) installed at one end that is close to the other. Each of the two needle holders (707) has an electromagnet installed at one end that is close to the other. A through hole is opened at one end of the upper needle holder (707), and a welding machine (708) located directly below the through hole is installed at one end of the lower needle holder (707).

10. The semiconductor probe card pin processing method according to claim 9, characterized in that: Includes the following steps: S1: Fixing the PCB board: Pass the mounting plate (2) through the middle hole of the probe card PCB board, start the adjustment component (4) to drive the two inner support components (5) to move apart, so that the inner support wheel (503) on it abuts against the inner wall of the hole, thereby fixing and raising the PCB board; S2: Synchronous alignment: Start the synchronization component (8), and drive the upper and lower fine adjustment screws (704) to rotate synchronously through the active gear (803) and driven gear (804), thereby driving the upper and lower needle holders (707) installed on the card block (703) to move synchronously until they are aligned with the upper and lower ends of the target hole on the PCB board. S3: Needle insertion and welding: The operator inserts the needle body through the through hole of the upper needle holder (707) so that the needle body passes through the hole of the PCB board, activates the electromagnet, and brings the welding machine (708) mounted on the lower needle holder (707) close to the end of the needle body and starts the welding machine (708) to perform welding. S4: Queue processing: After completing the processing of one hole, keep the PCB board still and repeat step two. Only drive the upper and lower needle holders (707) to move to the next hole in the same queue through the synchronization component (8), and repeat step three to complete the sequential assembly of multiple holes in the queue.

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