D2PAK packaging-based driver, thermal management system and control method

Abstract

The invention discloses a D2PAK packaging-based driver, a thermal management system and a control method. A PCB (Printed Circuit Board) is connected to a controller bottom plate; the D2PAK packaging type power device module and the heat dissipation ceramic chip module are respectively mounted on a first preset bonding pad area on the first surface of the PCB and a second preset bonding pad area on the second surface of the PCB through a preset welding process, and are vertically and oppositely arranged; the first surface of the heat conduction interface material layer is attached to the radiator area of the controller bottom plate; the controller bottom plate is connected with the controller cover plate, and the second surface of the heat conduction interface material layer is aligned with the first preset bonding pad area; the D2PAK packaging type power device module is connected with a compressor and a PTC heating module in the thermal management system. According to the embodiment of the invention, the D2PAK packaging type power device module can serve as a power device of a compressor and a power device of a PTC heating module at the same time, a core module in a heat management system can be shared, an integrated wiring harness design is adopted, and the space utilization rate is improved.

Description

Technical Field

[0001] This application relates to the field of thermal management system technology for new energy vehicles, and in particular to a driver, thermal management system and control method based on D2PAK packaging. Background Technology

[0002] The PTC heater (PTC stands for Positive Temperature Coefficient) and the electric compressor are two core components of the thermal management system in new energy vehicles. Their performance directly determines the vehicle's temperature control response speed, comfort, and battery cycle life, thus having a critical impact on the entire vehicle. In current mainstream applications, the PTC heater and compressor typically employ an architecture combining independent drivers with plug-in power devices. They are connected to the vehicle system through independent power modules, control units, high-voltage wiring harnesses, and connectors. Due to the inherent limitations of plug-in packaging and the constraints of the independent architecture, the following problems exist: 1) Low system integration: The PTC heater and compressor are two independent system components with independent drivers and plug-in power devices. The space utilization rate of these two independent system components is low. The two sets of wiring harnesses occupy space and independent operation and maintenance increase the system cost. 2) The installation process is complex. Specifically, thermal grease is evenly applied to the surface of the controller base plate, and the ceramic substrate is tightly adhered to the surface of the thermal grease layer. Thermal grease is then evenly applied again to the side of the ceramic substrate facing away from the base plate. The leads of the power devices are then bent and shaped. The power devices are then securely connected to the base plate with screws, and the leads are subsequently soldered to the PCB board, finally completing the overall assembly of the PCB board. The assembly of plug-in power devices requires multiple complex processes, resulting in high installation costs, extended production cycles, and increased production and maintenance costs. 3) Insufficient temperature sampling accuracy, i.e., due to the limitations of the packaging structure, temperature detection can only monitor the temperature of the power device pins and cannot accurately reflect the actual temperature of the wafer body, causing the over-temperature protection setpoint to deviate from the actual requirements. 4) Stress concentration at the pins: plug-in power devices need to be adapted to the installation space and PCB layout through pin bending process, which may affect the reliability of device connection in the long term. Summary of the Invention

[0003] This application provides a driver, thermal management system, and control method based on D2PAK packaging, aiming to solve the problems of low space utilization, space occupation by two independent system components, and increased system cost due to independent operation and maintenance in the existing architecture where PTC heaters and compressors use independent drivers combined with plug-in power devices.

[0004] In a first aspect, embodiments of this application provide a driver based on a D2PAK package, applied to a thermal management system for new energy vehicles. The driver includes a controller base plate, a heat dissipation ceramic plate module, a D2PAK packaged power device module, a PCB board, a thermal interface material layer, and a controller cover plate. The PCB board is connected to the controller base plate, with a first side of the PCB board facing the controller cover plate and a second side of the PCB board facing the controller base plate. The D2PAK packaged power device module is mounted to a first preset pad area on the first side of the PCB board using a preset soldering process. The heat dissipation ceramic plate module is mounted to a first preset pad area on the first side of the PCB board using a preset soldering process. The soldering process is applied to the second preset pad area on the second side of the PCB board, and the second preset pad area is perpendicularly aligned with the first preset pad area; the first side of the thermal interface material layer is attached to the heat sink area of ​​the controller base plate; the controller base plate is connected to the controller cover plate, and the second side of the thermal interface material layer is aligned with the second preset pad area, and the second side of the thermal interface material layer is attached to the heat dissipation ceramic plate module on the second preset pad area; wherein, the D2PAK packaged power device module is connected to the compressor and PTC heating module in the thermal management system.

[0005] Secondly, embodiments of this application also provide a thermal management system for use in new energy vehicles, which includes a driver based on a D2PAK package as described in the first aspect above, a compressor and a PTC heating module, and a temperature detection module and an MCU control unit; the D2PAK packaged power device module in the driver based on the D2PAK package is connected to both the compressor and the PTC heating module in the thermal management system, the temperature detection module is disposed on the PCB board of the driver based on the D2PAK package and located on one side of the D2PAK packaged power device module, and the temperature detection module is connected to the MCU control unit.

[0006] Thirdly, embodiments of this application also provide a control method for a thermal management system, which is applied to the thermal management system described in the second aspect above; the control method for the thermal management system includes: The temperature detection module in the thermal management system collects the current sampling parameters according to a preset temperature acquisition cycle and sends them to the MCU control unit in the thermal management system; the current sampling parameters are the sampling parameters corresponding to the current operating temperature of the D2PAK packaged power device module in the thermal management system under the current operating state. The MCU control unit determines the current temperature measurement temperature based on the current sampling parameters; If the MCU control unit determines that the current measured temperature is greater than a first preset temperature threshold and the corresponding over-temperature duration is greater than or equal to a preset duration, then it controls the driver based on the D2PAK package in the thermal management system to shut down according to a preset over-temperature protection strategy.

[0007] This application provides a driver, thermal management system, and control method based on a D2PAK package. The driver based on the D2PAK package includes a controller base plate, a heat sink ceramic plate module, a D2PAK packaged power device module, a PCB board, a thermal interface material layer, and a controller cover plate. The PCB board is connected to the controller base plate, with the first side of the PCB board facing the controller cover plate and the second side of the PCB board facing the controller base plate. The D2PAK packaged power device module is mounted on the first preset pad area on the first side of the PCB board using a preset soldering process. The heat sink ceramic plate module... The second preset pad area is mounted on the second side of the PCB board using a preset soldering process, and the second preset pad area is perpendicularly aligned with the first preset pad area. The first side of the thermal interface material layer is attached to the heat sink area of ​​the controller base plate. The controller base plate is connected to the controller cover plate, and the second side of the thermal interface material layer is aligned with the first preset pad area, and the second side of the thermal interface material layer is attached to the heat sink ceramic plate module on the first preset pad area. The D2PAK packaged power device module is connected to both the compressor and the PTC heating module in the thermal management system. This embodiment allows the D2PAK packaged power device module to simultaneously function as a power device for both the compressor and the PTC heating module, sharing the core modules in the thermal management system, and employing an integrated wiring harness design to improve space utilization. Attached Figure Description

[0008] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 An exploded view of the driver based on the D2PAK package provided in an embodiment of this application; Figure 2 A partial structural mounting diagram of a driver based on a D2PAK package provided for an embodiment of this application; Figure 3 A schematic diagram illustrating an application scenario for a driver based on a D2PAK package, provided in an embodiment of this application; Figure 4 A schematic block diagram of the structure of the thermal management system provided in the embodiments of this application; Figure 5 This is a flowchart illustrating the control method of the thermal management system provided in an embodiment of this application. Detailed Implementation

[0010] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0011] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0012] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0013] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0014] Please also refer to Figures 1-3 ,in Figure 1 This is an exploded view of the driver based on the D2PAK package provided in an embodiment of this application. Figure 2 This is a partial structural installation diagram of a driver based on a D2PAK package provided in an embodiment of this application. Figure 3 This is a schematic diagram illustrating an application scenario for a driver based on a D2PAK package, provided in an embodiment of this application. For example... Figures 1-3As shown, the D2PAK-packaged driver 1 includes a controller base plate 10, a heat sink ceramic plate module 20, a D2PAK-packaged power device module 30, a PCB board 40, a thermal interface material layer 50, and a controller cover plate 60. The PCB board 40 is connected to the controller base plate 10, with its first surface facing the controller cover plate 60 and its second surface facing the controller base plate 10. The D2PAK-packaged power device module 30 is mounted on a first preset pad area on the first surface of the PCB board 40 using a preset soldering process. The heat sink ceramic plate module 20 is mounted on the controller cover plate 60 using the preset soldering process. The second preset pad area on the second surface of the PCB board 40 is arranged perpendicularly to the first preset pad area; the first surface of the thermal interface material layer 50 is attached to the heat sink area of ​​the controller base plate 10; the controller base plate 10 is connected to the controller cover plate 60, and the second surface of the thermal interface material layer 50 is aligned with the second preset pad area, and the second surface of the thermal interface material layer 50 is attached to the heat dissipation ceramic plate module 20 on the second preset pad area; wherein, the D2PAK packaged power device module 30 is connected to the compressor 2 and the PTC heating module 3 in the thermal management system.

[0015] In this embodiment, the specific assembly process of the driver 1 based on the D2PAK package is as follows: 1) The D2PAK packaged power device module is mounted on the first preset pad area on the first side of the PCB board 40 using a preset soldering process; the heat dissipation ceramic plate module 20 is mounted on the second preset pad area on the second side of the PCB board 40 using the preset soldering process, and the second preset pad area is perpendicularly aligned with the first preset pad area; wherein, the first preset pad area and the second preset pad area can be regarded as two areas that are completely opposite to each other on the front and back sides of the PCB board 40; when the heat dissipation ceramic plate module 20 is mounted on the second preset pad area using the preset soldering process, the soldering surface of each heat dissipation ceramic plate in the heat dissipation ceramic plate module 20 is a mixture of alumina and copper, which can be used for soldering after tin spraying; 2) Connect the D2PAK packaged power device module 30 to both the compressor 2 and the PTC heating module 3 in the thermal management system; the specific wiring method for the above connection needs to be determined with reference to the total number and purpose of the multiple D2PAK packaged power devices set in the D2PAK packaged power device module 30. 3) The first side of the thermal interface material layer is attached to the heat sink area of ​​the controller base plate; wherein the thermal interface material layer is thermal grease or thermal gel. 4) Connect the PCB board 40 to the controller base plate 10, with the first side of the PCB board 40 facing the controller cover plate 60 and the second side of the PCB board 40 facing the controller base plate 10, and make the second side of the thermal interface material layer 50 aligned with the second preset pad area, and make the second side of the thermal interface material layer 50 fit against the heat dissipation ceramic plate module 20 on the second preset pad area; 5) Connect the controller base plate 10 to the controller cover plate 60.

[0016] Through the above installation process, compared to the typical architecture of PTC heaters and compressors in new energy vehicle thermal management systems, which use independent drivers combined with plug-in power devices and are connected to the vehicle system through independent power modules, control units, high-voltage wiring harnesses, and connectors, the plug-in power devices are assembled by uniformly applying thermal grease to the surface of the controller base plate, tightly adhering the ceramic substrate to the surface of the thermal grease layer, uniformly applying thermal grease again to the side of the ceramic substrate away from the base plate, and bending the pins of the power devices. The power devices are then fastened to the base plate with screws, and the pins are then soldered to the PCB board, completing the entire assembly process of the PCB board. This eliminates many manual operation steps, shortens the assembly cycle, adapts to the needs of mass production, avoids operational errors caused by manually bending pins and manually applying grease, and improves welding accuracy and consistency of heat conduction paths. Moreover, the compressor 2 and PTC heating module 3 in the thermal management system share the D2PAK packaged power device module 30 in the driver 1 based on D2PAK package, and can also share the main control, power supply, communication, high and low voltage EMC (EMC stands for Electromagnetic Compatibility) and other core modules in the thermal management system. The integrated wiring harness design improves space utilization and can be flexibly adapted to the compact installation space in new energy vehicles.

[0017] In the D2PAK packaging process, D2PAK stands for Double DPAK (DPAK for Dual Plastic Package), and its standard name is TO-263. It is a surface-mount package. The D2PAK packaging process includes the main processes of lead frame pretreatment, wafer thinning and dicing, chip mounting, wire bonding, molding, post-curing, lead trimming and shaping, lead plating, electrical testing and sorting, marking, appearance inspection, and tape and reel packaging. The D2PAK packaging process features a thicker lead frame, larger thermal pads, and a larger and stronger molded body. Because each D2PAK packaged power device in a D2PAK packaged power device module uses a D2PAK package and is compatible with automated production line assembly, it has advantages such as low thermal resistance, efficient heat dissipation, low parasitic inductance, suppression of switching spikes, and vibration resistance. Moreover, the D2PAK packaged power device used in this application abandons the screw fastening design of traditional plug-in devices, eliminates the screw holes on the base plate, simplifies the processing steps, and eliminates the need for additional positioning and fixing structures, thereby reducing the overall number of parts in the driver and lowering its structural complexity and cost.

[0018] Specifically, the preset soldering process is a reflow soldering process. When the D2PAK packaged power device module is mounted onto the first preset pad area on the first surface of the PCB board 40 using the preset soldering process, and when the heat sink ceramic plate module 20 is mounted onto the second preset pad area on the second surface of the PCB board 40 using the preset soldering process, the reflow soldering process is used. If the D2PAK packaged power device module 30 includes multiple D2PAK packaged power devices and the heat sink ceramic plate module 20 includes multiple heat sink ceramic plates, then each D2PAK packaged power device and each heat sink ceramic plate can be mounted onto the corresponding position of the corresponding pad area on the PCB board using the reflow soldering process. The main process of the reflow soldering process includes: accurately mounting the pre-processed D2PAK packaged power devices or heat sink ceramic plates to the corresponding pad areas of the PCB board 40 using a fully automatic pick-and-place machine, and curing them according to a preset curve in a nitrogen-protected reflow oven to achieve an automated process of reliable soldering. Before the pre-treated D2PAK packaged power devices are precisely mounted onto the pads of the PCB board 40 using a fully automated pick-and-place machine, solder paste (composed of solder powder, flux, etc.) needs to be printed on the pads in the first preset pad area of ​​the PCB board 40, and tin is sprayed onto the pads in the second preset pad area. Only then can the pre-treated D2PAK packaged power devices or heat sink ceramic sheets be mounted onto the corresponding areas of the pads using the fully automated pick-and-place machine. During the curing process in the nitrogen-protected reflow oven according to the preset curve, the D2PAK packaged power devices or heat sink ceramic sheets are aligned with the pads of the PCB board 40. The soldering material undergoes a series of temperature cycles including preheating, activation, reflow, and cooling. During these processes, the soldering material melts, wets the pads and leads of the D2PAK packaged power device (or heat sink ceramic plate), and forms a strong metallurgical bond (forming an intermetallic compound) after cooling. When the solder paste is cured in a nitrogen-protected reflow oven according to a preset curve, it includes at least the following important parameters: liquidus temperature (e.g., 217°C for lead-free solder and 183°C for leaded solder), peak temperature (usually 20-30°C above the liquidus), time the solder paste is above the liquidus (generally 30-90 seconds), heating and cooling rates, etc. If a nitrogen-protected reflow oven is divided into a preheating zone, a holding zone, a reflow zone, and a cooling zone according to a preset curve, the heating rate in the preheating zone is 1-3°C / s and the maximum does not exceed 6°C / s. The holding time in the holding zone is 60 to 120 seconds. In the reflow zone, the solder paste is above the liquidus line for 30-90 seconds and the peak temperature does not exceed 230°C. The cooling rate in the cooling zone is 2-4°C / s.

[0019] In one embodiment, such as Figures 1-3As shown, the D2PAK packaged power device module 30 includes multiple D2PAK packaged power devices. The first group of D2PAK packaged power devices serves as the three-phase inverter bridge power device in the compressor and is connected to the compressor 2. The second group of D2PAK packaged power devices serves as the lower bridge arm power device of the PTC heating module and is connected to the PTC heating module 3.

[0020] In this embodiment, the D2PAK packaged power device module 30 integrates the packaged power devices required for the compressor 2 and PTC heating module 3 in the thermal management system. It is at least divided into a first group of D2PAK packaged power devices and a second group of D2PAK packaged power devices. The first group of D2PAK packaged power devices serves as the three-phase inverter bridge power devices in the compressor and is connected to the compressor 2. The second group of D2PAK packaged power devices serves as the lower bridge arm power devices of the PTC heating module and is connected to the PTC heating module 3. This integrated power device configuration allows for the sharing of core modules in the thermal management system, such as the main control, power supply, communication, and high / low voltage EMC modules. Furthermore, the integrated wiring harness design facilitates connection with other modules in the thermal management system, improving space utilization and allowing for flexible adaptation to the compact installation space within new energy vehicles.

[0021] In one embodiment, such as Figures 1-3As shown, the first group of D2PAK packaged power devices includes six D2PAK packaged power devices, respectively designated as the first D2PAK packaged power device 31, the second D2PAK packaged power device 32, the third D2PAK packaged power device 33, the fourth D2PAK packaged power device 34, the fifth D2PAK packaged power device 35, and the sixth D2PAK packaged power device 36; the second group of D2PAK packaged power devices includes two D2PAK packaged power devices, respectively designated as the seventh D2PAK packaged power device 37 and the eighth D2PAK packaged power device 38; wherein, the first D2PAK packaged power device 31, the second D2PAK packaged power device 32, and the sixth D2PAK packaged power device 36... The three D2PAK packaged power devices 33 serve as the first upper bridge arm power device, the second upper bridge arm power device, and the third upper bridge arm power device in the three-phase inverter bridge power device of the compressor 2, respectively; the fourth D2PAK packaged power device 34, the fifth D2PAK packaged power device 35, and the sixth D2PAK packaged power device 36 serve as the first lower bridge arm power device, the second lower bridge arm power device, and the third lower bridge arm power device in the three-phase inverter bridge power device of the compressor 2, respectively; the seventh D2PAK packaged power device 37 serves as the first lower bridge arm power device of the PTC heating module 3, and the eighth D2PAK packaged power device 38 serves as the second lower bridge arm power device of the PTC heating module 3.

[0022] In this embodiment, after defining the specific uses of each of the above eight D2PAK packaged power devices and connecting each D2PAK packaged power device with other non-power devices of the compressor 2 or the PTC heating module 3 according to the actual wiring requirements, the D2PAK packaged power device module 30 is realized as a module integrating the packaged power devices required by the compressor 2 and the PTC heating module 3 in the thermal management system. The main controller in the thermal management system (such as an MCU control unit, where MCU stands for Microcontroller Unit) controls the on / off state of each D2PAK packaged power device in the first group of D2PAK packaged power devices to achieve inversion, and drives the compressor motor through the U / V / W three-phase output terminal; the main controller can also rely on its own PTC self-adjustment characteristics to control the on / off state of the second group of D2PAK packaged power devices to achieve precise adjustment of heating power, and connect to the PTC heating module through the PTC output terminal.

[0023] In one embodiment, such as Figures 1-3As shown, the heat dissipation ceramic plate module 20 includes eight heat dissipation ceramic plates, which are respectively designated as the first heat dissipation ceramic plate 21, the second heat dissipation ceramic plate 22, the third heat dissipation ceramic plate 23, the fourth heat dissipation ceramic plate 24, the fifth heat dissipation ceramic plate 25, the sixth heat dissipation ceramic plate 26, the seventh heat dissipation ceramic plate 27, and the eighth heat dissipation ceramic plate 28. The first heat dissipation ceramic plate 21, the second heat dissipation ceramic plate 22, and the third heat dissipation ceramic plate 23 are respectively arranged perpendicularly to the first upper bridge arm power device, the second upper bridge arm power device, and the third upper bridge arm power device. The fourth heat dissipation ceramic plate 24, the fifth heat dissipation ceramic plate 25, and the sixth heat dissipation ceramic plate 26 are respectively arranged perpendicularly to the first lower bridge arm power device, the second lower bridge arm power device, and the third lower bridge arm power device. The seventh heat dissipation ceramic plate 27 is arranged perpendicularly to the first lower bridge arm power device, and the eighth heat dissipation ceramic plate 28 is arranged perpendicularly to the second lower bridge arm power device.

[0024] In this embodiment, the total number of heat dissipation ceramic sheets included in the heat dissipation ceramic sheet module 20 is the same as the total number of D2PAK packaged power devices included in the D2PAK packaged power device module 30, and each heat dissipation ceramic sheet is vertically aligned with a corresponding D2PAK packaged power device to ensure that each heat dissipation ceramic sheet serves as a heat dissipation structure for a corresponding D2PAK packaged power device and can effectively dissipate heat.

[0025] In one embodiment, such as Figures 1-3 As shown, the copper foil networks on the welding surfaces of the first heat dissipation ceramic plate 21, the second heat dissipation ceramic plate 22, and the third heat dissipation ceramic plate 23 are all positive DC bus networks; the copper foil networks on the welding surfaces of the fourth heat dissipation ceramic plate 24, the fifth heat dissipation ceramic plate 25, and the sixth heat dissipation ceramic plate 26 are the U-phase network, V-phase network, and W-phase network of the output end, respectively; the copper foil networks on the welding surfaces of the seventh heat dissipation ceramic plate 27 and the eighth heat dissipation ceramic plate 28 are both lower bridge networks of the PTC heating module 3.

[0026] In this embodiment, if the side of the eight heat dissipation ceramic sheets 21 to 28 facing the second side of the PCB board 40 is considered the front side, then the front sides of the eight heat dissipation ceramic sheets are all solderable copper foil networks. Specifically, the front sides of the first to third heat dissipation ceramic sheets 21 are used as the positive DC bus network and are respectively connected to the first D2PAK packaged power device 31, the second D2PAK packaged power device 32, and the third D2PAK packaged power device 33, and are also connected to the positive DC bus in the thermal management system; the front sides of the fourth to sixth heat dissipation ceramic sheets 24 are divided into... The U-phase network, V-phase network, and W-phase network, which serve as output terminals, are connected to the fourth D2PAK packaged power device 34, the fifth D2PAK packaged power device 35, and the sixth D2PAK packaged power device 36, and are also connected to the compressor 2 in the thermal management system. The front sides of the seventh heat sink ceramic plate 27 and the eighth heat sink ceramic plate 28 are used as the lower bridge network of the PTC heating module 3, connected to the seventh D2PAK packaged power device 37 and the eighth D2PAK packaged power device 38, and are also connected to the upper bridge network of the PTC heating module 3 (and of course, to other components in the PTC heating module 3 based on actual needs). Through the above specific wiring method, the heat sink ceramic plates are specifically connected to the entire driver.

[0027] In one embodiment, such as Figures 1-3 As shown, the PCB board 40 has four copper layers (not shown) in the middle layer, and each copper layer has 60 to 100 through-hole structures evenly distributed.

[0028] The through-hole structure has a hole diameter of 0.4mm to 0.6mm and a drilling diameter of 0.2mm to 0.3mm.

[0029] In this embodiment, when four copper layers are provided in the middle layer of the PCB board 40, and 60-100 through-hole structures are evenly distributed on each copper layer, and the through-holes of each copper layer are aligned with the through-holes of the other three copper layers, the heat from the top layer of the PCB board to the bottom layer is efficiently conducted through the through-holes. The heat is further transferred to the heat sink 11 in the heat sink area of ​​the controller base plate 10 through the heat sink ceramic plate module 20 and the thermal interface material layer 50 on the bottom layer. In specific implementation, the heat sink 11 can be adapted with a refrigerant to enhance the heat dissipation effect (as shown in the reference). Figure 2 The gaps between the heat sinks 11 in the heat sink area can be filled with refrigerant 12. Moreover, the four complete copper layers in the middle of the PCB board, together with the evenly distributed thermal vias, form a three-dimensional heat dissipation path, which improves the heat conduction efficiency. The working heat of the multiple power devices on the top layer of the PCB board can be quickly transferred to the bottom heat sink ceramic plate, resulting in a more uniform temperature distribution on the heat dissipation surface and effectively avoiding local overheating.

[0030] In one embodiment, such as Figures 1-2 As shown, a plurality of locking screw through holes 41 are uniformly arranged on the area surrounding the D2PAK packaged power device module 30 on the PCB board 40. The PCB board 40 is screwed to the controller base plate 10 by a plurality of locking screws having the same number as the plurality of locking screw through holes 41 passing through the corresponding locking screw through holes.

[0031] In this embodiment, multiple locking screw through holes 41 are uniformly arranged on the area surrounding the D2PAK packaged power device module 30 on the PCB board 40. For example, there are five locking screw through holes 41. Five locking screws pass through the corresponding locking screw through holes to screw onto the controller base plate 10, thereby forming a layout with uniformly distributed screws around the perimeter and central filling. This ensures that the PCB board 40 is evenly stressed, guaranteeing the structural reliability for long-term use. It also ensures that the stress on the PCB board and the D2PAK packaged power device module is evenly distributed, suppressing and reducing PCB board deformation, ensuring the structural reliability for long-term use, and effectively avoiding board deformation caused by local stress concentration. After the PCB board 40 is connected to the controller base plate 10 in the above manner, the controller base plate 10 and the controller cover plate 60 are fixed together by assembly screws, thereby completing the entire assembly process of the D2PAK packaged driver.

[0032] As can be seen, the driver based on the D2PAK package in this embodiment enables the D2PAK packaged power device module to serve as the power device for both the compressor and the PTC heating module. It can share the core module in the thermal management system and adopts an integrated wiring harness design, which improves its space utilization.

[0033] This application also provides a thermal management system for use in new energy vehicles, such as... Figure 4 As shown, the thermal management system includes a driver 1 based on a D2PAK package as described in any of the preceding embodiments, a compressor 2 and a PTC heating module 3, and includes a temperature detection module 4 and an MCU control unit 5. The D2PAK packaged power device module 30 in the driver 1 is connected to both the compressor 2 and the PTC heating module 3 in the thermal management system. The temperature detection module 4 is located on the PCB board 40 of the driver 1 based on the D2PAK package and is located on one side of the D2PAK packaged power device module 30. The temperature detection module 4 is connected to the MCU control unit 5.

[0034] In this embodiment, please also refer to Figures 1-3The thermal management system described herein can be applied to the thermal management system of new energy vehicles (pure electric and hybrid). In its specific implementation, in addition to the driver 1 based on D2PAK packaging as described in any of the aforementioned embodiments, it also includes a compressor 2 and a PTC heating module 3, and includes a temperature detection module 4 and an MCU control unit 5 (the compressor 2 and the PTC heating module 3 are also connected to the MCU control unit 5). The temperature detection module 4 specifically adopts an NTC resistor (NTC stands for Negative Temperature Coefficient) and is set adjacent to the heat dissipation surface of each D2PAK packaged power device in the D2PAK packaged power device module 30 in the driver 1 based on D2PAK packaging. This changes the internal chip heat dissipation path of the D2PAK packaged power device from the traditional wafer, packaging substrate, lead frame, pin, PCB board to temperature detection module to the bottom heat dissipation surface of the wafer and packaging substrate to temperature detection module. The heat transfer link is shorter, the thermal resistance loss is smaller, and the temperature attenuation is significantly reduced. This makes the sampling temperature of the temperature detection module highly correlated with the wafer temperature of the D2PAK packaged power device, and the temperature measurement accuracy is improved.

[0035] Moreover, compared to the typical architecture of PTC heaters and compressors in new energy vehicle thermal management systems, which use independent drivers combined with plug-in power devices and are connected to the vehicle system through independent power modules, control units, high-voltage wiring harnesses, and connectors, the plug-in power device assembly involves uniformly applying thermal grease to the surface of the controller base plate, tightly adhering the ceramic substrate to the surface of the thermal grease layer, uniformly applying thermal grease again to the side of the ceramic substrate away from the base plate, and bending the pins of the power device. The power device is then fastened to the base plate with screws, and the pins are then soldered to the PCB board, completing the entire PCB board assembly process. This eliminates many manual operation steps, shortens the assembly cycle, adapts to mass production needs, avoids operational errors caused by manually bending pins and manually applying grease, and improves welding accuracy and consistency of heat conduction paths. Moreover, the compressor 2 and PTC heating module 3 in the thermal management system share the D2PAK packaged power device module 30 in the driver 1 based on D2PAK package, and can also share the main control, power supply, communication, high and low voltage EMC (EMC stands for Electromagnetic Compatibility) and other core modules in the thermal management system. The integrated wiring harness design improves space utilization and can be flexibly adapted to the compact installation space in new energy vehicles.

[0036] This application also provides a control method for a thermal management system, such as... Figure 5The diagram shown is a flowchart illustrating the control method of a thermal management system provided in this application embodiment. The control method of the thermal management system is applied to the thermal management system described in any of the foregoing embodiments, such as... Figure 5 As shown, the control method of the thermal management system provided in this application includes steps S110 to S130.

[0037] S110. The temperature detection module in the thermal management system collects the current sampling parameters according to a preset temperature acquisition cycle and sends them to the MCU control unit in the thermal management system; the current sampling parameters are the sampling parameters corresponding to the current operating temperature of the D2PAK packaged power device module in the thermal management system under the current operating state. S120. The MCU control unit determines the current temperature measurement temperature based on the current sampling parameters. S130. If the MCU control unit determines that the current measured temperature is greater than a first preset temperature threshold and the corresponding over-temperature duration is greater than or equal to a preset duration, then it controls the driver based on the D2PAK package in the thermal management system to shut down according to a preset over-temperature protection strategy.

[0038] In this embodiment, please refer to again Figures 1-4 To more accurately detect the true temperature of each D2PAK packaged power device in the D2PAK packaged power device module 30 and formulate an over-temperature protection strategy that fits the operating conditions to avoid protection failure or false triggering, the temperature detection module 4 can first collect the current sampling parameters according to a preset temperature acquisition cycle. If the temperature detection module 4 specifically uses a negative temperature coefficient thermistor and is located adjacent to the bottom heat dissipation surface of the D2PAK packaged power device module 30 in the D2PAK packaged driver, the current sampling parameter obtained by the negative temperature coefficient thermistor according to the preset temperature acquisition cycle (such as 50ms, 100ms, 150ms; of course, the above values ​​are only examples and can be set to other acquisition cycles according to the user's actual needs) is not a temperature value but a sampling resistance value. This sampling resistance value is sent to the MCU control unit 5, where the MCU control unit 5 obtains the current measured temperature corresponding to the current sampling resistance value according to the preset temperature-resistance curve. The range of the current sampling parameters of the temperature detection module 4 that corresponds to the measured temperature value can be limited to -40℃ to 200℃.

[0039] If the MCU control unit 5 determines that the current measured temperature is greater than a first preset temperature threshold (e.g., set to 105℃; however, this value is only an example and can be set to other temperature values ​​according to user needs) and the corresponding over-temperature duration is greater than or equal to a preset duration (e.g., set to 1 second; however, this value is only an example and can be set to a duration according to user needs), then it controls the D2PAK-packaged driver in the thermal management system to shut down according to a preset over-temperature protection strategy. Specifically, the MCU control unit 5 generates a shutdown signal to shut down the D2PAK-packaged driver, thereby ensuring the safety of other components in the thermal management system. By reasonably setting the first preset temperature threshold, it better reflects the actual working state of the wafer, resulting in faster response speed, enhanced system stability, and a closed-loop protection mechanism to prevent devices from operating at critical temperatures for extended periods.

[0040] In a D2PAK-packaged driver, the PCB board has four copper layers in the middle layer, and each copper layer has 60-100 through-hole structures evenly distributed on each copper layer. After aligning the through-holes of each copper layer with the through-holes of the other three copper layers, frequent thermal cycling will cause micro-cracks in the internal copper layers, and the thermal resistance will increase with aging time. The MCU control unit 5 can dynamically lower the first preset temperature threshold as the number of thermal cycles increases. Specifically, the first preset temperature threshold = initial first preset temperature threshold - α * (N / N) max ) β The initial preset temperature threshold is set to 105°C, α represents the maximum compensation coefficient (e.g., 10°C~15°C), β represents the aging sensitivity factor (usually 1.5~2, indicating accelerated aging in later stages), and N represents the current cumulative number of uses of the driver based on the D2PAK package. max This indicates the maximum cumulative number of uses for a driver based on the D2PAK package.

[0041] In one embodiment, such as Figure 5 As shown, after step S130, the following is also included: S140, if the MCU control unit determines that the current measured temperature is less than or equal to the second preset temperature threshold and the corresponding cooling duration is greater than or equal to the preset duration, then controls the driver based on the D2PAK package in the thermal management system to restart according to the over-temperature protection strategy.

[0042] In this embodiment, if a shutdown signal is generated in the MCU control unit 5 to shut down the D2PAK-packaged driver, the temperature detection module 4 collects the current sampling parameters according to a preset temperature acquisition cycle. This ensures that temperature measurement continues even when the D2PAK-packaged driver shuts down. If the MCU control unit 5 determines that the current measured temperature is less than or equal to a second preset temperature threshold (e.g., 95°C; however, this value is only an example and can be set to other temperatures according to user needs, as long as the second preset temperature threshold is less than the first preset temperature threshold) and the corresponding cooling duration is greater than or equal to a preset duration, then it controls the D2PAK-packaged driver in the thermal management system to restart according to a preset over-temperature protection strategy. Specifically, a restart signal is generated in the MCU control unit 5 to restart the D2PAK-packaged driver and indicate that the fault has been cleared. Similarly, by reasonably setting the second preset temperature threshold, it better matches the actual working state of the wafer, resulting in faster response speed, enhanced system stability, and a closed-loop protection mechanism to prevent devices from operating at critical temperatures for extended periods.

[0043] In summary, this application provides a driver, thermal management system, and control method based on a D2PAK package. The driver based on the D2PAK package includes a controller base plate, a heat sink ceramic plate module, a D2PAK packaged power device module, a PCB board, a thermal interface material layer, and a controller cover plate. The PCB board is connected to the controller base plate, with its first side facing the controller cover plate and its second side facing the controller base plate. The D2PAK packaged power device module is mounted on a first preset pad area on the first side of the PCB board using a preset soldering process. The heat sink ceramic plate... The module is mounted on the second preset pad area on the second side of the PCB board using a preset soldering process, and the second preset pad area is perpendicularly aligned with the first preset pad area. The first side of the thermal interface material layer is attached to the heat sink area of ​​the controller base plate. The controller base plate is connected to the controller cover plate, and the second side of the thermal interface material layer is aligned with the first preset pad area, and the second side of the thermal interface material layer is attached to the heat sink ceramic plate module on the first preset pad area. The D2PAK packaged power device module is connected to both the compressor and the PTC heating module in the thermal management system. This embodiment allows the D2PAK packaged power device module to simultaneously function as a power device for both the compressor and the PTC heating module, sharing the core modules in the thermal management system, and employing an integrated wiring harness design to improve space utilization.

[0044] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this application.

[0045] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For example, the division of each unit is merely a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0046] The steps in the methods of this application embodiment can be adjusted, merged, or deleted according to actual needs. The units in the apparatus of this application embodiment can be merged, divided, or deleted according to actual needs. Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0047] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, a terminal, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application.

[0048] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A driver based on a D2PAK package, characterized in that, A thermal management system for new energy vehicles; the D2PAK-packaged driver includes a controller base plate, a heat dissipation ceramic plate module, a D2PAK-packaged power device module, a PCB board, a thermal interface material layer, and a controller cover plate; the PCB board is connected to the controller base plate, with a first side of the PCB board facing the controller cover plate and a second side of the PCB board facing the controller base plate; the D2PAK-packaged power device module is mounted on a first preset pad area on the first side of the PCB board using a preset soldering process; the heat dissipation ceramic plate module is mounted on a second preset pad area on the second side of the PCB board using the preset soldering process, with the second preset pad area perpendicularly aligned with the first preset pad area; the first side of the thermal interface material layer is attached to the heat sink area of ​​the controller base plate; The controller base plate is connected to the controller cover plate, and the second surface of the thermal interface material layer is aligned with the second preset pad area, and the second surface of the thermal interface material layer is attached to the heat dissipation ceramic plate module on the second preset pad area; wherein, the D2PAK packaged power device module is connected to the compressor and PTC heating module in the thermal management system.

2. The driver based on the D2PAK package according to claim 1, characterized in that, The D2PAK packaged power device module includes multiple D2PAK packaged power devices. The first group of D2PAK packaged power devices serves as the three-phase inverter bridge power device in the compressor and is connected to the compressor. The second group of D2PAK packaged power devices serves as the lower bridge arm power device of the PTC heating module and is connected to the PTC heating module.

3. The driver based on the D2PAK package according to claim 2, characterized in that, The first group of D2PAK packaged power devices includes six D2PAK packaged power devices, respectively designated as the first D2PAK packaged power device, the second D2PAK packaged power device, the third D2PAK packaged power device, the fourth D2PAK packaged power device, the fifth D2PAK packaged power device, and the sixth D2PAK packaged power device; the second group of D2PAK packaged power devices includes two D2PAK packaged power devices, respectively designated as the seventh D2PAK packaged power device and the eighth D2PAK packaged power device; wherein, the first D2PAK packaged power device, the second D2PAK packaged power device, and the third D2PAK packaged power device... PAK packaged power devices serve as the first, second, and third upper bridge arm power devices in the three-phase inverter bridge power devices of the compressor, respectively; the fourth, fifth, and sixth D2PAK packaged power devices serve as the first, second, and third lower bridge arm power devices in the three-phase inverter bridge power devices of the compressor, respectively; the seventh D2PAK packaged power device serves as the first lower bridge arm power device of the PTC heating module, and the eighth D2PAK packaged power device serves as the second lower bridge arm power device of the PTC heating module.

4. The driver based on the D2PAK package according to claim 3, characterized in that, The heat dissipation ceramic plate module includes eight heat dissipation ceramic plates, which are respectively designated as the first heat dissipation ceramic plate, the second heat dissipation ceramic plate, the third heat dissipation ceramic plate, the fourth heat dissipation ceramic plate, the fifth heat dissipation ceramic plate, the sixth heat dissipation ceramic plate, the seventh heat dissipation ceramic plate, and the eighth heat dissipation ceramic plate. The first, second, and third heat dissipation ceramic plates are respectively arranged perpendicularly to the first, second, and third upper bridge arm power devices. The fourth, fifth, and sixth heat dissipation ceramic plates are respectively arranged perpendicularly to the first, second, and third lower bridge arm power devices. The seventh heat dissipation ceramic plate is arranged perpendicularly to the first lower bridge arm power device, and the eighth heat dissipation ceramic plate is arranged perpendicularly to the second lower bridge arm power device.

5. The driver based on the D2PAK package according to claim 4, characterized in that, The copper foil networks on the welding surfaces of the first, second, and third heat dissipation ceramic plates are all positive DC bus networks; the copper foil networks on the welding surfaces of the fourth, fifth, and sixth heat dissipation ceramic plates are the U-phase, V-phase, and W-phase networks at the output end, respectively; and the copper foil networks on the welding surfaces of the seventh and eighth heat dissipation ceramic plates are both lower bridge networks of the PTC heating module.

6. The driver based on the D2PAK package according to claim 1, characterized in that, The PCB board has four copper layers in the middle layer, and each copper layer has 60 to 100 through-hole structures evenly distributed.

7. The driver based on the D2PAK package according to claim 6, characterized in that, The diameter of the through-hole structure is 0.4mm~0.6mm and the drilling diameter is 0.2mm~0.3mm.

8. A thermal management system applied to new energy vehicles, characterized in that, The device includes a driver based on a D2PAK package as described in any one of claims 1-7, further comprising a compressor and a PTC heating module, and includes a temperature detection module and an MCU control unit; the D2PAK packaged power device module in the driver is connected to both the compressor and the PTC heating module in the thermal management system, the temperature detection module is disposed on the PCB board of the driver based on the D2PAK package and located on one side of the D2PAK packaged power device module, and the temperature detection module is connected to the MCU control unit.

9. A control method for a thermal management system, applied to the thermal management system as described in claim 8, characterized in that the method... include: The temperature detection module in the thermal management system collects the current sampling parameters according to a preset temperature acquisition cycle and sends them to the MCU control unit in the thermal management system; the current sampling parameters are the sampling parameters corresponding to the current operating temperature of the D2PAK packaged power device module in the thermal management system under the current operating state. The MCU control unit determines the current temperature measurement temperature based on the current sampling parameters; If the MCU control unit determines that the current measured temperature is greater than a first preset temperature threshold and the corresponding over-temperature duration is greater than or equal to a preset duration, then it controls the driver based on the D2PAK package in the thermal management system to shut down according to a preset over-temperature protection strategy.

10. The control method for the thermal management system according to claim 9, characterized in that, After the step of the MCU control unit controlling the D2PAK-packaged driver in the thermal management system to shut down according to a preset over-temperature protection strategy if it determines that the current measured temperature is greater than a first preset temperature threshold and the corresponding over-temperature duration is greater than a preset duration, the system further includes: If the MCU control unit determines that the current measured temperature is less than or equal to a second preset temperature threshold and the corresponding cooling duration is greater than or equal to the preset duration, then it controls the D2PAK-packaged driver in the thermal management system to restart according to the over-temperature protection strategy.

Images