Passivation equipment

Abstract

The invention relates to passivation equipment which comprises a shell, a reaction cavity is formed in the shell, and an opening communicated with the reaction cavity is formed in the shell; the ionization assembly can enter and exit from the reaction cavity through the opening, and the ionization assembly comprises a carrier plate used for placing at least one row of first small boats; the insulating part is arranged on the carrier plate, the electrode plate is arranged on the insulating part and used for placing at least one row of second small boats, and the second small boats are in one-to-one correspondence with the first small boats; when the ionization assembly is located in the reaction cavity, the carrier plate and the electrode plate are connected with opposite electrodes respectively, so that a discharge gap is formed between the first boat and the second boat which are adjacent to each other and placed on the carrier plate and the electrode plate, and silicon wafers in the first boat and the second boat are passivated. The passivation equipment is provided with the ionization assembly, so that the reaction temperature of the passivation process can be reduced.

Description

Technical Field

[0001] This invention relates to the field of solar module manufacturing technology, and in particular to a passivation device. Background Technology

[0002] Currently, the mainstream passivation process uses ALD (atomic layer deposition) to deposit AL2O3. This process has a reaction temperature as high as 300℃, which results in high energy consumption and is not suitable for low-temperature passivation processes, such as meeting the low-temperature process requirements of HBC and HTBC batteries. Summary of the Invention

[0003] Therefore, it is necessary to provide a passivation device that addresses the issue of high reaction temperatures in passivation equipment.

[0004] This disclosure provides a passivation apparatus, including...

[0005] A housing having a reaction chamber and an opening communicating with the reaction chamber; and

[0006] An ionization assembly, which can enter and exit the reaction chamber through the opening, includes:

[0007] A carrier plate for placing at least one row of the first small boats;

[0008] Insulating components, mounted on a carrier plate; and

[0009] An electrode plate, mounted on an insulating component, is used to place at least one row of second boats, each of which corresponds one-to-one with the first boat.

[0010] When the ionization component is located in the reaction chamber, the carrier plate and the electrode plate are respectively connected to opposite electrodes, so that a discharge gap is formed between the first small boat and the second small boat placed adjacent to each other on the carrier plate and the electrode plate, so as to passivate the silicon wafers in the first small boat and the second small boat.

[0011] In one embodiment, the passivation device further includes an electrode rod disposed at the bottom of the housing. When the ionization component is located in the reaction chamber, the electrode rod is located below the ionization component and electrically connected to the electrode plate. The carrier plate is electrically connected to the housing, and the electrode rod and the housing are respectively connected to opposite electrodes.

[0012] In one embodiment, the ionization assembly further includes an electrode block, a clearance hole is formed on the carrier plate, the electrode block is disposed in the clearance hole and electrically connected to the electrode plate, a gap is formed between the electrode block and the clearance hole, and when the ionization assembly is located in the reaction chamber, the electrode block abuts against the electrode rod.

[0013] In one embodiment, the passivation device includes at least two ionization components, a support column, and an electrode bridge. The at least two ionization components are arranged vertically at intervals. The support column is disposed between the two ionization components and is electrically connected to the carrier plates of the two ionization components respectively. The electrode bridge is electrically connected to the electrode plates of the two ionization components respectively.

[0014] In one embodiment, the carrier plate is provided with a through hole located below the electrode plate. The through hole is used to pass through the end of the electrode bridge so that the end of the electrode bridge abuts against the electrode plate; and / or, the electrode bridge includes an electrode bridge body, an elastic part, and an abutting part. The elastic part is disposed at one end of the electrode bridge body, and the abutting part is connected to the elastic part and is used to abut against the electrode plate.

[0015] And / or, the electrode bridge is provided with holes.

[0016] In one embodiment, the carrier plate is provided with at least one row of conductive blocks, one of the conductive blocks being used to place a first small boat.

[0017] In one embodiment, the upper surface of the conductive block is coplanar with the upper surface of the electrode plate;

[0018] And / or, both the conductive block and the electrode plate are provided with positioning elements, and the positioning elements on the conductive block and the positioning elements on the electrode plate correspond one-to-one. The positioning elements are used to position the first boat or the second boat.

[0019] In one embodiment, both the carrier plate and the electrode plate are provided with airflow holes;

[0020] And / or, at least two electrode plates are provided on the carrier plate, and the two motor plates are electrically connected.

[0021] In one embodiment, the carrier plate is provided with two rows of first small boats, the electrode plate is provided between the two rows of first small boats, and the electrode plate is provided with a row of second small boats, with a discharge gap formed between the second small boats and the first small boats on both sides.

[0022] And / or, the carrier plate is provided with two rows of first small boats, the electrode plate is provided between the two rows of first small boats, the electrode plate is provided with two rows of second small boats, and a discharge gap is formed between the first small boats and the adjacent second small boats;

[0023] And / or, the carrier plate is provided with two rows of first small boats, and there are two electrode plates. Each electrode plate is provided with a row of second small boats. The first small boats and the second small boats are arranged alternately, and a discharge gap is formed between adjacent first small boats and second small boats.

[0024] In one embodiment, the housing is grounded.

[0025] The aforementioned passivation equipment uses an ionization component to place a first boat and a second boat. After the carrier plate and electrode plate are connected to opposite electrodes, an ionization gap is formed between the first boat and the second boat. Radio frequency power is supplied to the ionization component to ionize the process gas in the ionization gap to carry out the passivation reaction. This can reduce the activation energy of the chemical reaction, thereby reducing the temperature requirement and lowering the reaction temperature of the passivation equipment to below 200°C. Therefore, it can also be applied to the passivation process of HBC and HTBC batteries.

[0026] Furthermore, in this design, the ionization assembly combines structures with different polarities by placing an insulating component between the carrier plate and the electrode plate. The first and second small boats, located on the carrier plate and the electrode plate respectively, are also incorporated as part of the electrodes, reducing the space occupied in the reaction chamber. Simultaneously, the ionization assembly also functions as a boat support, moving in and out of the reaction chamber with the silicon wafer. Therefore, when passivating silicon wafers of different dices, only the appropriate ionization assembly needs to be placed in the reaction chamber, improving the utilization rate of the passivation equipment. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the passivation device according to one embodiment of the present solution;

[0028] Figure 2 This is a schematic diagram of the ionization component in one embodiment of the present solution;

[0029] Figure 3 This is a cross-sectional view of an ionization component according to one embodiment of this solution;

[0030] Figure 4 for Figure 3 Enlarged view of point I in the middle;

[0031] Figure 5 This is a schematic diagram of the structure of the double-layer ionization component in one embodiment of this solution;

[0032] Figure 6 This is a schematic diagram of the passivation device in one embodiment of the present solution.

[0033] Explanation of icon numbers:

[0034] passivation equipment 100 case 10 Intake components 11 Ionization components 20 carrier board 21 clearance hole 211 Through hole 212 Insulating components 22 electrode plate 23 Electrode blocks 24 Insulating block 25 Conductive block 26 Positioning components 27 electrode rod 30 Support column 40 Electrode bridge 50 Electrode bridge body 51 Elastic part 52 Butt part 53 hole 54 airflow hole 80 First Small Boat 200 Second small boat 300 heating element 12 Detailed Implementation

[0035] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0041] Please see Figures 1 to 2 The present invention provides a passivation device 100, including a housing 10 and an ionization component 20. The housing 10 forms a reaction chamber and has an opening communicating with the reaction chamber. The ionization component 20 can enter and exit the reaction chamber through the opening. The ionization component 20 includes a carrier plate 21 for placing at least one row of first boats 200, an insulating member 22 disposed on the carrier plate 21, and an electrode plate 23 disposed on the insulating member 22 for placing at least one row of second boats 300. The second boats 300 are arranged in a one-to-one correspondence with the first boats 200. When the ionization component 20 is located in the reaction chamber, the carrier plate 21 and the electrode plate 23 are respectively connected to opposite electrodes, so that a discharge gap is formed between adjacent first boats 200 and second boats 300 placed on the carrier plate 21 and the electrode plate 23, so as to passivate the silicon wafers in the first boats 200 and second boats 300.

[0042] The passivation equipment described above uses an ionization component 20 to place a first small boat 200 and a second small boat 300. After the carrier plate 21 and the electrode plate 23 are respectively connected to opposite electrodes, an ionization gap is formed between the first small boat 200 and the second small boat 300. Radio frequency power is supplied to the ionization component 20 to ionize the process gas in the ionization gap to carry out the passivation reaction. This can reduce the activation energy of the chemical reaction, thereby reducing the temperature requirement and lowering the reaction temperature of the passivation equipment to below 200°C. Therefore, it can also be applied to the passivation process of HBC and HTBC batteries.

[0043] In this design, the ionization component 20 has an insulating element 22 mounted on a carrier plate 21, and an electrode plate 23 mounted on the insulating element 22. This combines structures with different polarities, reducing the space occupied by the passivation equipment 100. Furthermore, by utilizing the metallic nature of the boat, it is incorporated as part of the electrode, further reducing the need for electrode structures. Moreover, the arrangement of the electrode plate 23 on the carrier plate 21 allows the ionization component 20 to function as a boat support, moving in and out of the reaction chamber with the boat. Thus, by changing the arrangement of the ionization component 20, it can be used to passivate silicon wafers of different assemblies. For example, after one set of silicon wafers has been passivated, another ionization component 20 and the boat can be placed in the reaction chamber for passivation without requiring electrode replacement time, thereby improving production cycle time.

[0044] The structure of the housing 10 in this embodiment is as follows: Figure 1 As shown, the shell 10 has a double-layer structure. An inlet / outlet is provided on one side of the shell 10; this inlet / outlet is the aforementioned opening, such as on the front, rear, left, right, or top side, for the ionization component 20 and the small boat to enter and exit the reaction chamber. A heating element 12 is provided between the double layers. In this embodiment, an air inlet component 11 is provided at the upper end of the shell 10 to achieve upper-end air intake. A flow equalization plate is provided in the reaction chamber to ensure uniform distribution of the reaction gas. Correspondingly, an air outlet is provided at the lower end of the shell 10. In other embodiments, an air intake scheme can also be adopted on the side of the shell 10, with the corresponding air outlet of the shell 10 located at the lower end or side. Alternatively, the shell 10 can be a single-layer structure, with an air curtain provided in the reaction chamber to separate the area containing the reaction gas and the heating element 12.

[0045] Correspondingly, the first small boat 200 and the second small boat 300 in this scheme can have the same structure or different structures. The first small boat 200 and the second small boat 300 are used to define the position of the small boat and to distinguish whether the small boat is connected to different electrodes. Of course, the structures of multiple first small boats 200 can also be different. Specifically, considering the position of the first small boat 200, for example, the small boats used for two-piece segments are all single-sided opening structures, while the small boats used for three-piece and four-piece segments are single-sided opening small boats located on both sides, and the small boat located in the middle is open on both sides.

[0046] In one embodiment, the passivation device 100 further includes an electrode rod 30, which is disposed at the bottom of the housing 10. When the ionization component 20 is located in the reaction chamber, the electrode rod 30 is located below the ionization component 20 and is electrically connected to the electrode plate 23. The carrier plate 21 is electrically connected to the housing 10, and the electrode rod 30 and the housing 10 are respectively connected to opposite electrodes. The electrode rod 30 is connected to the electrode plate 23 to introduce radio frequency or intermediate frequency power to the electrode plate 23. In this embodiment, the housing 10 of the passivation device 100 is made of metal, and the housing 10 is directly grounded as the negative electrode. In this solution, the electrode rod 30 is disposed at the bottom of the housing 10, and the connection between the electrode plate 23 and the electrode rod 30 can be realized when the ionization component 20 is placed in the reaction chamber. The structure is simple and easy to connect. In other embodiments, two wires can also be used to connect the carrier plate 21 and the electrode plate 23 respectively, so that they are respectively connected to the positive and negative electrodes.

[0047] Furthermore, such as Figures 2 to 4 As shown, the ionization assembly 20 also includes an electrode block 24. A clearance hole 211 is formed on the carrier plate 21. The electrode block 24 is disposed in the clearance hole 211 and electrically connected to the electrode plate 23. A gap is formed between the electrode block 24 and the clearance hole 211. When the ionization assembly 20 is located in the reaction chamber, the electrode block 24 abuts against the electrode rod 30. In this embodiment, the clearance hole 211 on the carrier plate 21 exposes the electrode plate 23 on the lower side of the carrier plate 21. The electrode block 24 is disposed in the clearance hole 211 and electrically connected to the electrode plate 23. This means that the electrical connection end of the electrode plate 23 is also exposed on the lower side of the ionization assembly 20, facilitating electrical connection with the electrode rod 30 located at the bottom of the housing 10.

[0048] To ensure the stability of the electrode block 24, the ionization assembly 20 also includes an insulating block 25. The insulating block 25 is disposed in the gap and abuts against both the electrode block 24 and the carrier plate 21. The insulating block 25 abuts between the electrode block 24 and the carrier plate 21 to position the electrode block 24 and prevent the electrode block 24 from shifting due to force, thus avoiding contact with or detachment from the carrier plate 21. To ensure the stability of the connection position of the insulating block 25, the insulating block 25 is configured with a boss structure, the boss being located between the carrier plate 21 and the electrode plate 23. The insulating block 25 can be an integral annular structure sleeved on the outside of the electrode block 24, or it can be a separate structure, spaced apart in the gap between the electrode block 24 and the clearance hole 211.

[0049] In one embodiment, such as Figure 5As shown, the passivation device 100 includes at least two ionization components 20, as well as support columns 40 and electrode bridges 50. The at least two ionization components 20 are arranged vertically at intervals. The support columns 40 are disposed between the two ionization components 20 and are electrically connected to the carrier plates 21 of the two ionization components 20 respectively. The electrode bridges 50 are electrically connected to the electrode plates 23 of the two ionization components 20 respectively. In this embodiment, because the ionization components 20 are a combination of electrodes and carrier plates 21, both the positive and negative electrodes are located below the small boat. Therefore, according to the size of the reaction chamber of the passivation device 100, the corresponding number of ionization components 20 can be placed, thereby increasing the production capacity of the passivation device 100.

[0050] Furthermore, the carrier plate 21 is provided with a through hole 212, which is located below the electrode plate 23. The through hole 212 is used to pass through the end of the electrode bridge 50, so that the end of the electrode bridge 50 abuts against the electrode plate 23. To facilitate the installation of the electrode bridge 50, the through hole 212 can be set at the end of the carrier plate 21. After the upper ionization component 20 is placed on the support column 40, the electrode bridge 50 is installed, and the electrode bridge 50 is snapped between the upper and lower electrode plates 23. In one embodiment, the electrode bridge 50 is provided with a hole 54, which is used for the passage of reaction gas.

[0051] To ensure a stable electrical connection between the electrode bridge 50 and the upper and lower electrode plates 23, in one embodiment, the electrode bridge 50 includes an electrode bridge body 51, an elastic portion 52, and an abutment portion 53. The elastic portion 52 is disposed at one end of the electrode bridge body 51, and the abutment portion 53 is connected to the elastic portion 52 and is used to abut against the electrode plate 23. The elastic portion 52 is disposed between the electrode bridge body 51 and the abutment portion 53 to adjust the distance between them. This ensures that the abutment portion 53 can contact the electrode plate 23 and also accommodates the arrangement of two sets of ionization components 20 with different distances, thereby reducing the assembly precision of the ionization components 20. Figure 1 As shown, the elastic part 52 is located at the upper end of the electrode bridge body 51, and the abutting part 53 is connected to the upper end of the elastic part 52 for abutting against the upper electrode plate 23. In this embodiment, the elastic part is a spring. In order to make the connection of the elastic part more stable, a sleeve and a guide post are respectively provided on the electrode bridge body 51 and the abutting part 53. The sleeve is sleeved on the outer side of the end of the guide post, and the spring is sleeved on the outer side of the sleeve. The spring, sleeve and guide post are all made of conductive material.

[0052] In one embodiment, such as Figure 2 As shown, at least one row of conductive blocks 26 is provided on the carrier plate 21, and one conductive block 26 is used to place a first small boat 200. The conductive block 26 conducts electricity to the first small boat 200 on the one hand, and can also be used to position the first small boat 200 on the other hand.

[0053] Furthermore, the upper surface of the conductive block 26 is coplanar with the upper surface of the electrode plate 23, so that the upper ends of the adjacent first small boat 200 and second small boat 300 are at the same height, and the silicon wafers in the two adjacent small boats are both in the transverse electric field region formed by the voltage difference between the first small boat 200 and the second small boat 300, thereby achieving passivation of the two silicon wafers.

[0054] Furthermore, both the conductive block 26 and the electrode plate 23 are provided with positioning elements 27. The positioning elements 27 on the conductive block 26 and the electrode plate 23 correspond one-to-one, and the positioning elements 27 are used to position the first small boat 200 or the second small boat 300. After the positioning elements 27 position the small boats, they can ensure the stability of the positions of the first small boat 200 and the second small boat 300 during the transportation of the ionization component 20, and prevent the small boats from shaking.

[0055] To facilitate the outflow of reactant gas from the gas outlet of the reaction chamber and reduce its retention within the chamber, airflow holes 80 are provided on both the carrier plate 21 and the electrode plate 23, allowing the reactant gas to pass through the electrode plate 23 and the carrier plate 21 to the gas outlet. Figure 2 As shown, the airflow hole 80 is located between the positioning member 27 and the electrode plate 23. If two rows of second small boats 300 can be placed on the electrode plate 23, then the airflow hole 80 is provided between the positioning members 27 that position the two rows of positioning small boats. The airflow hole 80 can be a continuous elongated hole or multiple small holes spaced apart.

[0056] In one embodiment, a carrier plate 21 has two rows of first small boats 200, an electrode plate 23 is disposed between the two rows of first small boats 200, and a row of second small boats 300 is disposed on the electrode plate 23. Discharge gaps are formed between the second small boats 300 and the first small boats 200 on both sides. Figure 6 As shown, both rows of first boats 200 are single-sided opening shell structures, with the openings facing the electrode plate 23. The second boats 300 on the electrode plate 23 are double-sided opening structures, with the openings on both sides facing the boats on either side. There is a voltage difference between the second boats 300 on the electrode plate 23 and the first boats 200 on both sides, forming a transverse electric field on both sides. This allows for passivation of the sides of the second boats 300. This arrangement is used for edge passivation of three-part silicon wafers. In use, if the reaction chamber space of the passivation device 100 is large, a larger ionization component 20 can be selected, allowing for multiple rows of first boats 200 and second boats 300 on the electrode plate 23 and carrier plate 21 to passivate multiple sets of three-part wafers.

[0057] In another embodiment, two rows of first small boats 200 are disposed on the carrier plate 21, and an electrode plate 23 is disposed between the two rows of first small boats 200. Two rows of second small boats 300 are disposed on the electrode plate 23, and a discharge gap is formed between the first small boats 200 and the adjacent second small boats 300. Both rows of first small boats 200 are shell structures with openings on one side, and the openings are oriented towards the electrode plate 23. The two rows of second small boats 300 on the electrode plate 23 are also structures with openings on one side, and the openings are oriented towards the openings of the first small boats 200. In this embodiment, they are used for edge passivation of the bi-wafer silicon wafers. In this embodiment, two rows of second small boats 300 are disposed on the electrode plate 23 to form ionization gaps with the first small boats 200 on both sides, thereby achieving passivation of both sets of bi-wafer silicon wafers and improving the throughput of the passivation equipment 100.

[0058] In another embodiment, two rows of first small boats 200 are disposed on the carrier plate 21, and two electrode plates 23 are disposed, each electrode plate 23 having one row of first small boats 200. The first small boats 200 and second small boats 300 are alternately disposed, and the two electrode plates 23 are electrically connected, forming a discharge gap between adjacent first small boats 200 and second small boats 300. In this embodiment, by setting two first small boats 200 and two second small boats 300, and by setting the first small boats 200 and second small boats 300 alternately, four small boats are disposed in one row, and the alternating arrangement creates a voltage difference between adjacent small boats, which can be used to ionize the reactive gas. Therefore, in this embodiment, the first small boats 200 and second small boats 300 disposed on both sides are single-sided open small boats, and the two rows of small boats disposed in the middle are double-sided open small boats. The openings of the four small boats in each row are arranged opposite each other, thereby achieving edge passivation of the quarter-wafer silicon wafer.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A passivation device, characterized in that: include A housing having a reaction chamber and an opening communicating with the reaction chamber; and An ionization assembly, which can enter and exit the reaction chamber through the opening, includes: A carrier plate for placing at least one row of the first small boats; Insulating components, mounted on a carrier plate; and An electrode plate, mounted on an insulating component, is used to place at least one row of second boats, each of which corresponds one-to-one with the first boat. When the ionization component is located in the reaction chamber, the carrier plate and the electrode plate are respectively connected to opposite electrodes, so that a discharge gap is formed between the first small boat and the second small boat placed adjacent to each other on the carrier plate and the electrode plate, so as to passivate the silicon wafers in the first small boat and the second small boat.

2. The passivation apparatus as described in claim 1, characterized in that: The passivation device further includes an electrode rod disposed at the bottom of the housing. When the ionization component is located in the reaction chamber, the electrode rod is located below the ionization component and is electrically connected to the electrode plate. The carrier plate is electrically connected to the housing, and the electrode rod and the housing are respectively connected to opposite electrodes.

3. The passivation apparatus as described in claim 2, characterized in that: The ionization assembly further includes an electrode block. A clearance hole is formed on the carrier plate. The electrode block is disposed in the clearance hole and electrically connected to the electrode plate. A gap is formed between the electrode block and the clearance hole. When the ionization assembly is located in the reaction chamber, the electrode block abuts against the electrode rod.

4. The passivation apparatus as described in claim 1, characterized in that, The passivation device includes at least two ionization components, as well as a support column and an electrode bridge. The at least two ionization components are arranged vertically at intervals. The support column is arranged between the two ionization components and is electrically connected to the carrier plates of the two ionization components respectively. The electrode bridge is electrically connected to the electrode plates of the two ionization components respectively.

5. The passivation apparatus as described in claim 4, characterized in that, The carrier plate is provided with a through hole located below the electrode plate. The through hole is used to pass through the end of the electrode bridge so that the end of the electrode bridge abuts against the electrode plate. And / or, the electrode bridge includes an electrode bridge body, an elastic part and an abutting part, the elastic part is disposed at one end of the electrode bridge body, the abutting part is connected to the elastic part, and the abutting part is used to abut against the electrode plate; And / or, the electrode bridge is provided with holes.

6. The passivation apparatus as described in claim 1, characterized in that, The carrier plate is provided with at least one row of conductive blocks, and one of the conductive blocks is used to place the first small boat.

7. The passivation apparatus as described in claim 6, characterized in that, The upper surface of the conductive block is coplanar with the upper surface of the electrode plate; And / or, both the conductive block and the electrode plate are provided with positioning elements, and the positioning elements on the conductive block and the positioning elements on the electrode plate correspond one-to-one. The positioning elements are used to position the first boat or the second boat.

8. The passivation apparatus as described in claim 1, characterized in that, Both the carrier plate and the electrode plate are provided with airflow holes; And / or, at least two electrode plates are provided on the carrier plate, and the two electrode plates are electrically connected to each other.

9. The passivation apparatus as described in claim 1, characterized in that, The carrier plate is provided with two rows of first small boats, the electrode plate is provided between the two rows of first small boats, and the electrode plate is provided with a row of second small boats. Discharge gaps are formed between the second small boats and the first small boats on both sides. And / or, the carrier plate is provided with two rows of first small boats, the electrode plate is provided between the two rows of first small boats, the electrode plate is provided with two rows of second small boats, and a discharge gap is formed between the first small boats and the adjacent second small boats; And / or, the carrier plate is provided with two rows of first small boats, and there are two electrode plates. Each electrode plate is provided with a row of second small boats. The first small boats and the second small boats are arranged alternately, and a discharge gap is formed between adjacent first small boats and second small boats.

10. The passivation apparatus as claimed in claim 1, characterized in that, The casing is grounded.

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