Display device and preparation method thereof

Abstract

The invention provides a display device and a preparation method thereof, and belongs to the technical field of semiconductors. The display device comprises a driving backboard, a plurality of pixel units and a plurality of lenses, wherein the pixel units and the lenses are arranged on the driving backboard in an array mode. Each pixel unit comprises a blue-light pixel unit, a green-light pixel unit and a red-light pixel unit, and the blue-light pixel unit, the green-light pixel unit and the red-light pixel unit are all electrically connected with the driving backboard; the distances between the epitaxial layer of the blue-light pixel unit, the epitaxial layer of the green-light pixel unit and the epitaxial layer of the red-light pixel unit and the driving back plate are different from one another; the lenses are located on the sides, back to the driving back plate, of the pixel units, and the orthographic projection of one lens on the driving back plate covers at least two pixel units. The display density of the display device can be improved.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, and specifically relates to a display device and its manufacturing method. Background Technology

[0002] Micro-LED displays have many advantages such as high brightness, high display density, and short response time. They are the next generation of display technology after liquid crystal displays (LCDs) and organic light-emitting diode (OLEDs).

[0003] In related technologies, Micro-LED display devices typically employ a three-color chip method (Red, Green, Blue, RGB) to achieve color. This means that a Micro-LED display device includes multiple pixel units arranged in an array. Each pixel unit includes blue light-emitting pixel units, green light-emitting pixel units, and red light-emitting pixel units. The blue, green, and red light-emitting pixel units are all laid flat on a driver backplane.

[0004] However, since different pixel units are all laid flat on the driver backplane, a large gap needs to be maintained between adjacent pixel units to leave enough space for the driver circuit and pads. This makes it difficult to reduce the spacing between adjacent pixel units, which severely limits the improvement of display density and affects the luminous efficiency of the display device. Summary of the Invention

[0005] This disclosure provides a display device and its manufacturing method, which can improve the display density of the display device. The technical solution is as follows: On one hand, embodiments of this disclosure provide a display device, the display device including a driving backplate, a plurality of pixel units arranged in an array on the driving backplate, and a plurality of lenses; Each pixel unit includes a blue light pixel unit, a green light pixel unit, and a red light pixel unit, and the blue light pixel unit, the green light pixel unit, and the red light pixel unit are all electrically connected to the driving backplane; The distances between the epitaxial layer of the blue light pixel unit, the epitaxial layer of the green light pixel unit, and the epitaxial layer of the red light pixel unit and the driving backplate are different; Multiple lenses are located on the side of the pixel unit facing away from the driving backplate, and the orthographic projection of one lens on the driving backplate covers at least two of the pixel units.

[0006] In another implementation of this disclosure, the orthogonal projection of one of the lenses onto the drive backplate covers four of the pixel units, namely one blue light pixel unit, two green light pixel units, and one red light pixel unit.

[0007] In another implementation of this disclosure, the blue light pixel unit, the green light pixel unit, and the red light pixel unit all include a first electrode, and one side of the first electrode is electrically connected to the driving backplate. The blue light pixel unit is electrically connected to the driving backplate via the first electrode; The red light pixel unit and the blue light pixel unit further include a second electrode, and the blue light pixel unit is electrically connected to the driving backplate in sequence through the second electrode and the first electrode; The red light pixel unit further includes a third electrode, and the red light pixel unit is electrically connected to the driving backplate in sequence through the third electrode, the second electrode and the first electrode.

[0008] In another implementation of this disclosure, the second electrode and the third electrode have the same structure, and the thickness of the second electrode and the third electrode is between 1 and 1.5 times the maximum thickness of any pixel unit.

[0009] In another implementation of this disclosure, the first electrode includes a first bonding electrode layer, a second bonding electrode layer, and a transparent conductive layer sequentially stacked on the driving backplate. The first bonding electrode layer is electrically connected to the driving backplane, and the transparent conductive layer is electrically connected to the epitaxial layer of the corresponding pixel unit.

[0010] In another implementation of this disclosure, both the green light pixel unit and the red light pixel unit further include a fourth electrode; The epitaxial layer of the blue light pixel unit is electrically connected to the second electrode through the fourth electrode; The epitaxial layer of the red light pixel unit is electrically connected to the third electrode through the fourth electrode.

[0011] In another implementation of this disclosure, the fourth electrode has the same structure as the first electrode.

[0012] In another implementation of this disclosure, the blue light pixel unit further includes a first insulating layer and a first common cathode layer; The first insulating layer covers the side of the epitaxial layer of the blue light pixel unit away from the driving backplate, and the first insulating layer has a first contact hole; The first common cathode layer covers the first insulating layer and is electrically connected to the epitaxial layer of the blue light pixel unit through the first contact hole.

[0013] On the other hand, this disclosure also provides a preparation method, the preparation method comprising: providing a driving backplate; Multiple pixel units are fabricated on the driving backplate. The multiple pixel units include blue light pixel units, green light pixel units and red light pixel units. The epitaxial layers of the blue light pixel units, the green light pixel units and the red light pixel units are at different distances from the driving backplate. A lens is fabricated on the side of the pixel unit facing away from the driving backplate, and the orthogonal projection of one of the lenses onto the driving backplate covers at least two of the pixel units.

[0014] In another implementation of this disclosure, a lens is fabricated on the side of the pixel unit facing away from the driving backplate, further comprising: The orthogonal projection of one of the lenses onto the drive backplate covers four of the pixel units, namely one blue light pixel unit, two green light pixel units, and one red light pixel unit.

[0015] The beneficial effects of the technical solutions provided in this disclosure are: In the display device provided in this embodiment, the pixel unit includes a blue light pixel unit, a green light pixel unit, and a red light pixel unit, and the distances between the epitaxial layers of the blue light pixel unit, the green light pixel unit, and the red light pixel unit and the driving backplane are different. In this way, the three-dimensional stacking structure formed between the different pixel units (on a horizontal plane parallel to the driving backplane and on a plane perpendicular to the driving backplane) can break the physical limitations of the spacing between adjacent pixel units. By integrating the driving lines and pads in the vertical direction, the pixel units are arranged more compactly in the horizontal plane, thereby significantly improving the display density of the device and thus increasing the luminous efficiency.

[0016] Furthermore, since the orthographic projection of a lens onto the drive backplate covers at least two pixel units, at least two pixel units can share the same lens, allowing the pixel units to be arranged more densely in the horizontal plane and improving display performance. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a partial cross-sectional view of the display device provided in the embodiments of this disclosure; Figure 2 This is a partial cross-sectional view of the display device provided in the embodiments of this disclosure; Figure 3 This is a flowchart of a method for manufacturing a display device according to an embodiment of this disclosure; Figure 4 This is a flowchart of another method for manufacturing a display device provided in this disclosure. Figure 5 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 6 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 7 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 8 This is a schematic diagram of the arrangement of green light pixel units provided in an embodiment of this disclosure; Figure 9 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 10 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 11 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 12 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 13 This is a schematic diagram of the arrangement of blue light pixel units provided in an embodiment of this disclosure; Figure 14 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 15 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 16 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 17 This is a schematic diagram of the manufacturing process of the display device provided in the embodiments of this disclosure; Figure 18 This is a schematic diagram of the arrangement of red light pixel units provided in an embodiment of this disclosure; Figure 19 This is a schematic diagram of the lens arrangement provided in an embodiment of this disclosure.

[0019] The symbols in the diagram represent the following meanings: 1. Drive backplane; 2. Lens; 3. Pixel unit; 31. Green pixel unit; 311. First insulating layer; 3110. First contact hole; 312. First common cathode layer; 32. Red pixel unit; 321. Second insulating layer; 3210. Second contact hole; 322. Second common cathode layer; 33. Blue pixel unit; 331. Third insulating layer; 3310. Third contact hole; 332. Third common cathode layer; 301, First electrode; 3011, First bonded electrode layer; 3012, Second bonded electrode layer; 3013, Transparent conductive layer; 302, Second electrode; 303, Third electrode; 304, Fourth electrode; 310, Epitaxial layer; 3101, First semiconductor layer; 3102, First current blocking layer; 3103, Active layer; 3104, Second current blocking layer; 3105, Second semiconductor layer; 320, Epitaxial substrate; 330, Buffer layer; 340, Passivation layer. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0021] This disclosure provides a display device. Figure 1 and Figure 2 This is a partial cross-sectional view of the display device. Figure 1 and Figure 2 The cross-sectional views are different. Combined Figure 1 and Figure 2 As shown, the light-emitting diode chip includes a driving backplate 1, multiple pixel units 3 arranged in an array on the driving backplate 1, and multiple lenses 2.

[0022] Each pixel unit 3 includes a green light pixel unit 31 (see...) Figure 1 ), Red light pixel unit 32 (see Figure 2 ) and blue light pixel unit 33 (see Figure 1 The green pixel unit 31, red pixel unit 32, and blue pixel unit 33 are all electrically connected to the driving backplate 1. The epitaxial layers 310 of the green pixel unit 31, red pixel unit 32, and blue pixel unit 33 are at different distances from the driving backplate 1. Multiple lenses 2 are located on the side of the pixel unit 3 facing away from the driving backplate 1, and the orthogonal projection of one lens 2 onto the driving backplate 1 covers at least two pixel units 3.

[0023] In the display device provided in this embodiment, the pixel unit includes a green pixel unit 31, a red pixel unit 32, and a blue pixel unit 33, and the distances between the epitaxial layer 310 of the green pixel unit 31, the epitaxial layer 310 of the red pixel unit 32, and the epitaxial layer 310 of the blue pixel unit 33 and the driving backplate 1 are different from each other. In this way, the three-dimensional stacking structure formed between the different pixel units 3 (on a horizontal plane parallel to the driving backplate 1 and on a plane perpendicular to the driving backplate 1) can break the physical limitation of the spacing between adjacent pixel units. By integrating the driving lines and pads in the vertical direction, the pixel units are arranged more compactly in the horizontal plane, thereby significantly improving the display density of the device and thus improving the luminous efficiency.

[0024] Furthermore, since the orthographic projection of a lens 2 onto the drive backplate 1 covers at least two pixel units 3, at least two pixel units 3 can share the same lens 2, making the pixel units 3 more densely arranged in the horizontal plane and improving display performance.

[0025] In this embodiment, the orthogonal projection of a lens 2 onto the drive backplate 1 covers four pixel units 3, which are a green light pixel unit 31, two red light pixel units 32, and a blue light pixel unit 33.

[0026] In the above implementation, due to limitations of the material itself, the brightness of the red pixel unit 32 is much smaller than that of the green pixel unit 31 and the blue pixel unit 33 for the same size. Therefore, within the area covered by a lens 2, two red pixel units 32 are arranged, while only one green pixel unit 31 and one blue pixel unit 33 are arranged. In this way, the red light can be effectively enhanced, thereby improving the display effect.

[0027] It is worth noting that the light emitted by each pixel unit 3 located within the orthographic projection of the same lens 2 is all transmitted through the lens 2. All pixel units 3 located within the orthographic projection of the same lens 2 together form a single pixel.

[0028] In this embodiment, the green light pixel unit 31, the red light pixel unit 32 and the blue light pixel unit 33 all include a first electrode 301, and one side of the first electrode 301 is electrically connected to the driving back plate 1.

[0029] The green pixel unit 31 is electrically connected to the driving backplate 1 through the first electrode 301.

[0030] The red light pixel unit 32 and the blue light pixel unit 33 also include a second electrode 302. The blue light pixel unit 33 is electrically connected to the driving backplate 1 through the second electrode 302 and the first electrode 301 in sequence.

[0031] The red light pixel unit 32 also includes a third electrode 303, and the red light pixel unit 32 is electrically connected to the driving backplate 1 through the third electrode 303, the second electrode 302 and the first electrode 301 in sequence.

[0032] In the above implementation, the arrangement of the first electrode 301, the second electrode 302, and the third electrode 303 enables different pixel units to be electrically connected to the driving backplate 1. Simultaneously, it allows the red light pixel unit 32 to be positioned above the blue light pixel unit 33, and the blue light pixel unit 33 to be positioned above the green light pixel unit 31. That is, the above arrangement ensures that the distance between the epitaxial layer 310 of the green light pixel unit 31 and the driving backplate 1 is less than the distance between the epitaxial layer 310 of the blue light pixel unit 33 and the driving backplate 1, and both are less than the distance between the epitaxial layer 310 of the red light pixel unit 32 and the driving backplate 1.

[0033] In other words, the red light pixel unit 32 is closest to the lens 2, followed by the blue light pixel unit 33, and then the green light pixel unit 31. This provides the best light output conditions for the weaker red light pixel unit 32, ensuring its brightness.

[0034] Furthermore, LEDs generate heat during operation. If the heat from the bottom-layer pixel units cannot be dissipated in time, it will lead to increased device temperature, decreased efficiency, and shortened lifespan. Since the green pixel unit 31 requires a higher driving current, it generates a significant amount of heat. Placing the green pixel unit 31 as close as possible to the driving backplate 1 provides the shortest and most efficient heat dissipation path for this heat-generating unit, allowing its heat to be conducted away most quickly, thereby improving the overall thermal stability and long-term reliability of the device.

[0035] Green and blue pixel units 31 typically use gallium nitride (GaN) materials, which require extremely high temperatures for epitaxial growth and subsequent processes (usually exceeding 1000°C, with subsequent processes reaching hundreds of degrees Celsius). Red pixel unit 32, however, typically uses indium gallium aluminum phosphide (AlInGaP) materials, which are not resistant to high temperatures. When the temperature exceeds a certain threshold (approximately 400-500°C), its luminous efficiency suffers a catastrophic and permanent decrease. Therefore, the above setup involves first performing a high-temperature GaN process (to fabricate green and blue pixel units 31) followed by a low-temperature AlInGaP process (to fabricate red pixel unit 32). The underlying green pixel unit 31 can withstand the low temperature of the subsequent red light process without damage. However, if the red pixel unit 32 were fabricated at the bottom layer, the high-temperature processes applied to the upper blue and green pixel units 31 would burn the underlying red pixel unit 32, causing a sharp decline in efficiency or even complete failure.

[0036] In this embodiment of the disclosure, the second electrode 302 and the third electrode 303 have the same structure, and the thickness of the second electrode 302 and the third electrode 303 is between 1 and 1.5 times the maximum thickness of any pixel unit 3.

[0037] The above thickness allows the light-emitting layers of the green light pixel unit 31, red light pixel unit 32, and blue light pixel unit 33 to be at different heights without affecting each other.

[0038] In this embodiment, the thickness of both the first electrode 301 and the second electrode 302 can be 1μm-5μm. This allows the epitaxial layers 310 of the green pixel unit 31, the red pixel unit 32, and the blue pixel unit 33 to be at different heights without affecting each other.

[0039] Optionally, both the second electrode 302 and the third electrode 303 can be Cr, Al, Ti, Ni, Pt, or Au electrodes. This allows the electrodes to be provided with excellent oxidation resistance and conductivity through these metals.

[0040] Optionally, the green light pixel unit 31, the red light pixel unit 32 and the blue light pixel unit 33 are all trapezoidal, and the sidewall of each pixel unit 3 forms an angle of 65°-83° with the plane on or parallel to the upper surface of the driving back plate 1.

[0041] The 65°-83° angled sidewalls effectively reduce total internal reflection loss, allowing more light to escape from the top of pixel unit 3 and improving light extraction efficiency. For example, this design enhances the vertical light intensity distribution of green pixel unit 31 (450nm band) while maintaining brightness uniformity at large viewing angles (e.g., 120°). Furthermore, the trapezoidal structure suppresses light crosstalk, preventing color mixing between adjacent pixel units 3 (e.g., red pixel unit 32 and blue pixel unit 33) and reducing the risk of color gamut degradation.

[0042] Optionally, the first electrode 301 includes a first bonding electrode layer 3011, a second bonding electrode layer 3012, and a transparent conductive layer 3013 sequentially stacked on the driving backplate 1. The first bonding electrode layer 3011 is electrically connected to the driving backplate 1, and the transparent conductive layer 3013 is electrically connected to the epitaxial layer 310 of the corresponding pixel unit 3.

[0043] In the above implementation, the first electrode 301 is used to bond the green light pixel unit 31 and the driving backplate 1 together, while the second electrode 302 is bonded to the driving backplate 1 together.

[0044] The transparent conductive layer 3013 is used to improve current spreadability and ensure uniform light emission. The first bonding electrode layer 3011 forms an ohmic contact with the transparent conductive layer 3013 and serves as a bonding interface, while also achieving electrical connection with the second bonding electrode layer 3012. The second bonding electrode layer 3012 is responsible for receiving signals from the driving circuit on the driving backplane 1.

[0045] In this embodiment, the transparent conductive layer 3013 is an ITO film layer.

[0046] In this embodiment, both the red pixel unit 32 and the blue pixel unit 33 further include a fourth electrode 304. The epitaxial layer 310 of the blue pixel unit 33 is electrically connected to the second electrode 302 through the fourth electrode 304. The epitaxial layer 310 of the red pixel unit 32 is electrically connected to the third electrode 303 through the fourth electrode 304.

[0047] For example, the fourth electrode 304 has the same structure as the first electrode 301. Further details will not be provided here.

[0048] Optionally, the green pixel unit 31 further includes a first insulating layer 311 and a first common cathode layer 312. The first insulating layer 311 covers the side of the epitaxial layer 310 of the green pixel unit 31 away from the driving backplate 1, and the first insulating layer 311 has a first contact hole 3110. The first common cathode layer 312 covers the first insulating layer 311 and is electrically connected to the epitaxial layer 310 of the green pixel unit 31 through the first contact hole 3110.

[0049] In the above implementation, the first insulating layer 311 is used to prevent short circuits between the green pixel unit 31 and the driving backplane 1 or other circuit layers, ensuring the stability of signal transmission. The design of the first contact hole 3110 allows for precise filling of the first common cathode layer 312, while avoiding the negative impact of the insulating material on electrical performance. The first common cathode layer 312 directly contacts the N-type electrode of the green pixel unit 31 by filling the first contact hole 3110, forming a low-resistance path and ensuring efficient current injection into the light-emitting element.

[0050] In other words, the isolation function of the first insulating layer 311 combined with the conductivity of the first common cathode layer 312 not only prevents leakage but also optimizes the current distribution.

[0051] In this embodiment, the red pixel unit 32 further includes a second insulating layer 321, a second common cathode layer 322, and a second contact hole 3210. The arrangement of the second insulating layer 321, the second common cathode layer 322, and the second contact hole 3210 in the red pixel unit 32 is similar to the arrangement of the first insulating layer 311, the first common cathode layer 312, and the first contact hole 3110 in the green pixel unit 31, and will not be described again here.

[0052] In this embodiment, the blue light pixel unit 33 further includes a third insulating layer 331, a third common cathode layer 332, and a third contact hole 3310. The arrangement of the third insulating layer 331, the third common cathode layer 332, and the third contact hole 3310 in the blue light pixel unit 33 is similar to the arrangement of the first insulating layer 311, the first common cathode layer 312, and the first contact hole 3110 in the green light pixel unit 31, and will not be described again here.

[0053] In this embodiment, the epitaxial layer 310 of the green pixel unit 31, the epitaxial layer 310 of the red pixel unit 32, and the epitaxial layer 310 of the blue pixel unit 33 have the same thin film structure. The following description will take the green pixel unit 31 as an example.

[0054] The epitaxial layer 310 includes a first semiconductor layer 3101, a first current blocking layer 3102, an active layer 3103, a second current blocking layer 3104, and a second semiconductor layer 3105 stacked sequentially.

[0055] In this embodiment, the first semiconductor layer 3101 and the first current blocking layer 3102 are of the first conductivity type, and the second semiconductor layer 3105 and the second current blocking layer 3104 are of the second conductivity type, and the second conductivity type is different from the first conductivity type.

[0056] When the display device is working, an electron transition occurs between the first semiconductor layer 3101 and the second semiconductor layer 3105, and the active layer 3103 emits light.

[0057] In this embodiment, the first semiconductor layer 3101 is a P-type GaN layer, the active layer 3103 is a quantum well layer, and the second semiconductor layer 3105 is an N-type GaN layer.

[0058] Accordingly, the first current blocking layer 3102 is a P-type current blocking layer, and the second current blocking layer 3104 is an N-type current blocking layer.

[0059] Of course, in other embodiments, the first semiconductor layer 3101 may also be an N-type GaN layer, the second semiconductor layer 3105 may be a P-type GaN layer, and the active layer 3103 may be a quantum well layer. This disclosure does not limit this.

[0060] This disclosure also provides a method for manufacturing a display device. Figure 3 A flowchart illustrating a method for manufacturing a display device according to an embodiment of this disclosure is shown below. Figure 3 As shown, the preparation method includes: S301: Provides a drive backplane 1.

[0061] S302: Multiple pixel units 3 are fabricated on the driving backplate 1.

[0062] For example, the plurality of pixel units 3 include a green light pixel unit 31, a red light pixel unit 32 and a blue light pixel unit 33, and the distances between the epitaxial layer of the green light pixel unit 31, the epitaxial layer of the red light pixel unit 32 and the epitaxial layer of the blue light pixel unit 33 and the driving backplate 1 are different from each other.

[0063] S303: A lens 2 is fabricated on the side of the pixel unit 3 facing away from the driving backplate 1.

[0064] For example, the orthogonal projection of a lens 2 onto the drive backplate 1 covers at least two pixel units 3.

[0065] The epitaxial layers of the green pixel unit 31, the red pixel unit 32, and the blue pixel unit 33 are spaced at different distances from the driving backplane 1. This three-dimensional stacking structure formed between the different pixel units 3 (on a horizontal plane parallel to the driving backplane 1 and on a plane perpendicular to the driving backplane 1) breaks the physical limitations of the spacing between adjacent pixel units 3. By integrating driving lines and pads vertically, the pixel units 3 are arranged more compactly on the horizontal plane, significantly increasing the display density of the device and thus improving luminous efficiency.

[0066] Furthermore, since the orthographic projection of a lens 2 onto the drive backplate 1 covers at least two pixel units 3, at least two pixel units 3 can share the same lens 2, making the pixel units 3 more densely arranged in the horizontal plane and improving display performance.

[0067] This disclosure also provides another method for manufacturing a display device. Figure 4 This is a flowchart of another method for manufacturing a display device provided in this disclosure, such as... Figure 4 As shown, the preparation method includes: S401: Provide an epitaxial substrate 320 and prepare an epitaxial layer 310 on the epitaxial substrate.

[0068] For example, the epitaxial layer 310 includes a second semiconductor layer 3105, a second current blocking layer 3104, an active layer 3103, a first current blocking layer 3102 and a first semiconductor layer 3101 sequentially stacked on the epitaxial substrate 320.

[0069] For example, a buffer layer 330 is prepared on the epitaxial substrate 320 before the epitaxial layer 310 is prepared.

[0070] S402: A transparent conductive layer 3013 and a first bonding electrode layer 3011 are prepared on the side of the epitaxial layer 310 facing away from the epitaxial substrate.

[0071] The first bonding electrode layer 3011 is a metal electrode layer, and the electrode material can be at least one of Cr, Pt, Ti, Pt, Au, Sn or Au.

[0072] S403: A drive backplate 1 is provided, one side of the drive backplate 1 having a second bonding electrode layer 3012.

[0073] The second bonding electrode layer 3012 is a metal electrode layer, and the electrode material can be at least one of Cr, Pt, Ti, Pt, Au, Sn or Au.

[0074] S404: Bond the first bonding electrode layer 3011 and the second bonding electrode layer 3012 together (see...) Figure 5 ).

[0075] S405: Remove epitaxial substrate 320 and buffer layer 330.

[0076] In this embodiment, different methods are selected to remove the substrate depending on the material of the epitaxial substrate 320. For example, laser lift-off is used for sapphire materials, while chemical mechanical polishing (CMP) is used for silicon-based materials.

[0077] The buffer layer 330 is etched by inductively coupled plasma (ICP).

[0078] After removing the epitaxial substrate 320 and the buffer layer 330, the epitaxial layer 310 is thinned using BCl3 and Cl2 plasma until the remaining thickness of the epitaxial layer 310 is 0.9-1.35µm.

[0079] S406: Graphicalize epitaxial layer 310 (see...) Figure 6 ).

[0080] The array pattern corresponding to the green light pixel unit 31 is formed on the epitaxial layer 310 by photolithography. Similarly, ICP etching, BCl3 and Cl2 plasma etching are used.

[0081] For example, the green light pixel unit 31 is a trapezoid, and its sidewall forms an angle of 65°-83° with the plane on or parallel to the upper surface of the drive back plate 1.

[0082] This design enhances the vertical light intensity distribution while maintaining brightness uniformity over a wide viewing angle.

[0083] S407: Perform pixel isolation.

[0084] Using IBE etching, the transparent conductive layer 3013, the first bonding electrode layer 3011, the second bonding electrode layer 3012, and the driving backplate 1 are etched according to the arrangement of each pixel unit 3, thereby forming independent P-side contacts for each pixel unit 3 (see [link to IBE etching method]). Figure 7 ).

[0085] S408: Prepare a first insulating layer 311 and open a first contact hole 3110 in the first insulating layer 311 that corresponds one-to-one with the green light pixel unit 31.

[0086] S409: A first common cathode layer 312 is formed on the first insulating layer 311.

[0087] The first common cathode layer 312 fills the first contact hole 3110 and is connected to the epitaxial layer 310 in the green light pixel unit 31.

[0088] For example, a first insulating layer 311 is formed on the surface of the green light pixel unit 31 by a low-temperature deposition method, wherein the operating temperature is 240°C-280°C.

[0089] For example, the first insulating layer 311 is an SiO2 or Al2O3 film. The thickness of the first insulating layer 311 is 300-600 nm.

[0090] This completes the fabrication process for the green pixel unit 31. The arrangement of the green pixel unit 31 is as follows: Figure 8 As shown.

[0091] S4010: Preparation of passivation layer 340 (see...) Figure 9 ).

[0092] The passivation layer 340 fills the spaces between adjacent green light pixel units 31 and covers the green light pixel units 31. The passivation layer 340 is used to increase the thickness, laying the foundation for subsequent steps.

[0093] For example, passivation layer 340 was prepared using plasma-enhanced chemical vapor deposition (PECVD). The process temperature was between 240℃ and 280℃, and passivation layer 340 was a SiO2 layer with a thickness of 2-3.5µm. This thickness facilitates subsequent horizontal CMP planarization.

[0094] S4011: Electrode holes are etched in the passivation layer 340, and the second electrode 302 is deposited by vapor deposition (see...). Figure 10 ).

[0095] The electrode hole is etched to the first electrode 301. After electroplating copper or other metals in the electrode hole, the second electrode 302 can be formed, so that the second electrode 302 and the first electrode 301 are electrically connected.

[0096] After the second electrode 302 is fabricated, the passivation layer 340 and the second electrode 302 are subjected to CMP planarization treatment, thereby laying the foundation for the subsequent fabrication of the blue light pixel unit 33.

[0097] S4012: Fabrication of blue light pixel unit 33 (see...) Figures 11-12 ).

[0098] The process of fabricating the blue light pixel unit 33 is similar to the process of fabricating the green light pixel unit 31 described above, that is, fabricating an epitaxial layer 310, and bonding the epitaxial layer 310 to the driving backplate 1 through the first bonding electrode layer 3011 and the second bonding electrode layer 3012, and fabricating the third insulating layer 331, the third contact hole 3310, and the third common cathode layer 332. The arrangement of the blue light pixel unit 33 is as follows: Figure 13 As shown.

[0099] S4013: Fabrication of red light pixel unit 32 (see...) Figures 14-17 ).

[0100] The process of fabricating the red pixel unit 32 is similar to the process of fabricating the green pixel unit 31 described above, that is, fabricating an epitaxial layer 310, and bonding the epitaxial layer 310 to the driving backplate 1 through the first bonding electrode layer 3011 and the second bonding electrode layer 3012, and fabricating the second insulating layer 321, the second contact hole 3210, and the second common cathode layer 322. The arrangement of the red pixel unit 32 is as follows: Figure 18 As shown.

[0101] It is worth noting that during the fabrication of the red light pixel unit 32, the epitaxial layer 310 corresponding to the blue light pixel unit 33 needs to be removed (see [link]). Figure 14 The red light pixel unit 32 is then re-planarized using CMP, laying the foundation for its subsequent fabrication. Furthermore, a third electrode 303 needs to be fabricated to increase the height of the red light pixel unit 32.

[0102] S4014: A lens 2 is fabricated on the side of pixel unit 3 facing away from the driving backplate 1. The arrangement of lens 2 is as follows: Figure 19 As shown.

[0103] In this embodiment, the orthogonal projection of a lens 2 onto the drive backplate 1 covers at least two pixel units 3.

[0104] In this embodiment, the orthogonal projection of a lens 2 onto the drive backplate 1 covers four pixel units 3, which are a green light pixel unit 31, two red light pixel units 32, and a blue light pixel unit 33.

[0105] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” etc., are used only to indicate relative positional relationships; when the absolute position of the described objects changes, the relative positional relationship may also change accordingly.

[0106] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A display device, characterized in that, The display device includes a driving backplate (1), a plurality of pixel units (3) arranged in an array on the driving backplate (1), and a plurality of lenses (2). Each pixel unit (3) includes a green light pixel unit (31), a red light pixel unit (32), and a blue light pixel unit (33), and the green light pixel unit (31), the red light pixel unit (32), and the blue light pixel unit (33) are all electrically connected to the driving backplate (1); The distances between the epitaxial layer of the green pixel unit (31), the epitaxial layer of the red pixel unit (32), and the epitaxial layer of the blue pixel unit (33) and the driving backplate (1) are different from each other; Multiple lenses (2) are located on the side of the pixel unit (3) facing away from the driving backplate (1), and the orthographic projection of one lens (2) on the driving backplate (1) covers at least two pixel units (3).

2. The display device according to claim 1, characterized in that, The orthographic projection of one of the lenses (2) onto the drive backplate (1) covers four of the pixel units (3), which are a green light pixel unit (31), two red light pixel units (32) and a blue light pixel unit (33).

3. The display device according to claim 1, characterized in that, The green light pixel unit (31), the red light pixel unit (32) and the blue light pixel unit (33) each include a first electrode (301), one side of the first electrode (301) being electrically connected to the driving back plate (1); The green light pixel unit (31) is electrically connected to the driving back plate (1) through the first electrode (301); The red light pixel unit (32) and the blue light pixel unit (33) further include a second electrode (302), and the blue light pixel unit (33) is electrically connected to the driving back plate (1) in sequence through the second electrode (302) and the first electrode (301); The red light pixel unit (32) further includes a third electrode (303), and the red light pixel unit (32) is electrically connected to the driving backplate (1) in sequence through the third electrode (303), the second electrode (302) and the first electrode (301).

4. The display device according to claim 3, characterized in that, The second electrode (302) and the third electrode (303) have the same structure, and the thickness of the second electrode (302) and the third electrode (303) is between 1 and 1.5 times the maximum thickness of any pixel unit (3).

5. The display device according to claim 3, characterized in that, The first electrode (301) includes a first bonding electrode layer (3011), a second bonding electrode layer (3012) and a transparent conductive layer (3013) stacked sequentially on the driving back plate (1). The first bonding electrode layer (3011) is electrically connected to the driving backplate (1), and the transparent conductive layer (3013) is electrically connected to the epitaxial layer of the corresponding pixel unit (3).

6. The display device according to claim 5, characterized in that, Both the red light pixel unit (32) and the blue light pixel unit (33) further include a fourth electrode (304); The epitaxial layer of the blue light pixel unit (33) is electrically connected to the second electrode (302) through the fourth electrode (304); The epitaxial layer of the red light pixel unit (32) is electrically connected to the third electrode (303) through the fourth electrode (304).

7. The display device according to claim 6, characterized in that, The fourth electrode (304) has the same structure as the first electrode (301).

8. The display device according to any one of claims 1-7, characterized in that, The green pixel unit (31) further includes a first insulating layer (311) and a first common cathode layer (312). The first insulating layer (311) covers the side of the epitaxial layer of the green light pixel unit (31) away from the driving back plate (1), and the first insulating layer (311) has a first contact hole (3110). The first common cathode layer (312) covers the first insulating layer (311) and is electrically connected to the epitaxial layer of the green light pixel unit (31) through the first contact hole (3110).

9. A method for manufacturing a display device, characterized in that, The preparation method includes: Provide a drive backplane (1); Multiple pixel units (3) are fabricated on the driving backplate. The multiple pixel units include green light pixel units (31), red light pixel units (32) and blue light pixel units (33). The epitaxial layers of the green light pixel units (31), the red light pixel units (32) and the blue light pixel units (33) are at different distances from the driving backplate (1). A lens (2) is prepared on the side of the pixel unit (3) facing away from the driving back plate (1), and the orthogonal projection of one of the lenses (2) on the driving back plate (1) covers at least two of the pixel units (3).

10. The preparation method according to claim 9, characterized in that, The process further includes fabricating a lens (2) on the side of the pixel unit (3) facing away from the driving backplate (1), and also includes: The orthographic projection of one of the lenses (2) onto the drive backplate (1) covers four of the pixel units (3), which are a green light pixel unit (31), two red light pixel units (32) and a blue light pixel unit (33).

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