Electronic device

Abstract

The invention provides an electronic device, which is provided with a plurality of display areas and a transparent area surrounding the display areas, and comprises a first substrate, a plurality of light-emitting units, a plurality of first optical units, a first packaging layer and a second packaging layer, the light-emitting units are arranged on the first substrate and located in the display areas respectively. The first optical units are located in the display areas respectively and arranged on the light-emitting units respectively. The first packaging layer is arranged on the light-emitting unit and located between the light-emitting unit and the first optical unit. The second encapsulation layer is arranged on the first optical unit; the first packaging layer is in contact with the second packaging layer in the transparent area, so that the plurality of first optical units are respectively sealed in a plurality of spaces formed by the first packaging layer and the second packaging layer.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to a display device. Background Technology

[0002] Currently, common displays typically achieve color display effects by mixing different colors of light. For example, in LED (light-emitting diode) displays, each pixel can be configured with LEDs of three colors, such as red, green, and blue LEDs. However, this design suffers from problems such as inconsistent efficiency among the three colors of LEDs and low yield when mass-transferring LEDs of three colors.

[0003] In another design, LEDs of the same color (such as blue light) can be used in conjunction with light-converting materials to produce different colors of light, thereby achieving a color display effect. However, some light-converting materials (such as red light-converting materials) are easily affected by ambient moisture and / or oxygen, resulting in poor reliability. Furthermore, the light-converting materials are often housed in multiple openings within a bank layer located above the light-emitting components. This bank layer is typically a single, continuous layer laid within the display panel. This structure makes the electronic devices less flexible, hindering the manufacture of flexible display devices that utilize light-converting materials. Summary of the Invention

[0004] This invention provides an electronic device that can protect light conversion materials from the effects of environmental moisture and / or oxygen, and is suitable for using light conversion materials to manufacture flexible display devices.

[0005] An electronic device according to the present invention has multiple display areas and a transparent area surrounding the multiple display areas. The electronic device includes a first substrate, multiple light-emitting units, multiple first optical units, a first encapsulation layer, and a second encapsulation layer. The light-emitting units are disposed on the first substrate and are respectively located in the display areas; the first optical units are respectively located in the display areas and are respectively disposed on the light-emitting units; the first encapsulation layer is disposed on the light-emitting units and is located between the light-emitting units and the first optical units; the second encapsulation layer is disposed on the first optical units; the first encapsulation layer contacts the second encapsulation layer in the transparent area, so that the multiple first optical units are respectively enclosed in multiple spaces formed by the first encapsulation layer and the second encapsulation layer. Attached Figure Description

[0006] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein:

[0007] Figure 1A This is a top view schematic diagram of an electronic device according to an embodiment of the present invention.

[0008] Figure 1BThis is a partial cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention, showing along... Figure 1A The cross-sectional view shown is a section line AA'.

[0009] Figures 2 to 5 This is a partial cross-sectional schematic diagram of an electronic device according to different embodiments of the present invention, showing along... Figure 1A The cross-sectional view shown is a section line AA'.

[0010] Figure 6A This is a top view schematic diagram of an electronic device according to another embodiment of the present invention.

[0011] Figure 6B This is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention, showing along... Figure 6A The cross-sectional view shown is a section line BB'.

[0012] Figure 7 This is a partial cross-sectional schematic diagram of an electronic device according to different embodiments of the present invention, showing along... Figure 6A The cross-sectional view shown is a section line BB'.

[0013] Figure 8A This is a top view schematic diagram of an electronic device according to another embodiment of the present invention.

[0014] Figure 8B This is a partial cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention, showing along... Figure 8A The cross-sectional view shown by section line CC'.

[0015] Figure 9 This is a partial cross-sectional schematic diagram of an electronic device according to different embodiments of the present invention, showing along... Figure 8A The cross-sectional view shown by section line CC'. Detailed Implementation

[0016] The following description, with reference to the accompanying drawings, will illustrate an electronic device according to a preferred embodiment of the present invention, wherein the same components will be described using the same reference numerals. It should be understood that the following description provides many different embodiments for implementing various embodiments of the present invention. The specific components and arrangements described below are merely for the simple and clear description of some embodiments of the present invention. Of course, these various embodiments are only illustrative and not intended to limit the scope of the present invention. Furthermore, repeated reference numerals or designations may be used in different embodiments; these repetitions are only for the simple and clear description of some embodiments of the present invention and do not represent any association between the different embodiments and / or structures discussed. Moreover, when referring to a film layer being located on or above another film layer, this includes the case where one film layer is in direct contact with another film layer; or, it may also include the case where one or more other film layers are spaced apart, in which case one film layer may not be in direct contact with another film layer.

[0017] Relative terms, such as "lower" or "bottom" and "higher" or "top," may be used in the embodiments to describe the relative relationship of one component of the figures to another. It is understood that if the apparatus in the figures is flipped upside down, the component described as being on the "lower" side will become the component on the "higher" side.

[0018] Here, the terms "about," "approximately," and "roughly" generally indicate within 20% of a given value or range, preferably within 10%, and even more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. The quantities given here are approximate quantities, meaning that the meaning of "about," "approximately," and "roughly" may be implied even without specific mention of them.

[0019] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, constituent parts, regions, layers, and / or portions, these components, constituent parts, regions, layers, and / or portions should not be limited by these terms, and these terms are only used to distinguish different components, constituent parts, regions, layers, and / or portions. Therefore, a first component, constituent part, region, layer, and / or portion discussed below may be referred to as a second component, constituent part, region, layer, and / or portion without departing from the teachings of some embodiments of the present invention.

[0020] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having meanings consistent with the relevant art and the background or text of this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this invention.

[0021] Some embodiments of the present invention can be understood in conjunction with the accompanying drawings, which are also considered part of the description of the embodiments of the present invention. It should be understood that the drawings of the embodiments of the present invention are not shown to scale of actual devices and components. The shape and thickness of the embodiments may be exaggerated in the drawings to clearly illustrate the features of the embodiments of the present invention. Furthermore, the structures and devices in the drawings are shown schematically to clearly illustrate the features of the embodiments of the present invention.

[0022] In some embodiments of the present invention, relative terms such as "down," "up," "parallel," "vertical," "below," "above," "top," "bottom," etc., should be understood as the orientation shown in the paragraph and related figures. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation. Terms related to joining or connecting, such as "connected," "linked," "contact," etc., unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact but with another structure disposed between them. Furthermore, these terms related to joining or connecting may also include cases where both structures are movable or both structures are fixed.

[0023] It is worth noting that in this invention, the term "substrate" may include components already formed on a transparent substrate and various film layers covering the substrate, on which any desired multiple active components (such as transistors) may be formed; however, for the sake of simplicity in the drawings, only a flat substrate is used here.

[0024] Please refer to Figure 1A and Figure 1B As shown, where Figure 1A This is a top view schematic diagram of the electronic device 10 according to an embodiment of the present invention. Figure 1B This is a partial cross-sectional schematic diagram of the electronic device 10 according to an embodiment of the present invention, showing along... Figure 1A The cross-sectional view shown is a section line AA'.

[0025] It should be understood that, without departing from the spirit of the present invention, features in several different embodiments can be replaced, recombined, or mixed to complete other embodiments.

[0026] like Figure 1A As shown, the electronic device 10 in this embodiment can be, for example, but not limited to, a display device, having multiple display areas DA and a transparent area TA surrounding the multiple display areas DA. Each display area DA can be, for example, a pixel area, and each pixel area (each display area DA) can have multiple sub-pixel areas. In this embodiment, each display area DA can, for example, have three sub-pixel areas, such as a red sub-pixel area R, a green sub-pixel area G, and a blue sub-pixel area B, to emit red light, green light, and blue light respectively, thereby achieving the purpose of color display, but is not limited to this. Figure 1AAs shown, in this embodiment, multiple display areas DA are arranged in a matrix, for example, on a plane defined by a first direction X and a second direction Y. A transparent area TA surrounds the multiple display areas DA. The first direction X is defined as the direction parallel to one of the long or short sides of the electronic device 10, and the second direction Y is defined as the direction parallel to the other of the long or short sides of the electronic device 10, and the second direction Y is perpendicular to the first direction X. In this embodiment, the transparent area TA may include at least a transparent region, for example, the entire transparent area TA may be a transparent region, or only a portion of the transparent area TA may be a transparent region, so that the electronic device 10 forms a transparent display.

[0027] Please refer to the following at the same time Figure 1A and Figure 1B As shown, in this embodiment, the electronic device 10 includes a first substrate 11, a plurality of light-emitting units 12, a plurality of first optical units 13, a first encapsulation layer 14, a plurality of first filter units 15, a second encapsulation layer 16, and a third encapsulation layer 17. It should be noted that... Figure 1A This is a top view of electronic device 10, which shows that electronic device 10 includes multiple display areas DA. Figure 1B A cross-sectional view of a display area DA and an adjacent transparent area TA of the display electronic device 10, i.e., along... Figure 1A The cross-sectional view shown is the section line AA', therefore Figure 1B The display area DA includes a first substrate 11, a light-emitting unit 12, a first optical unit 13, a first encapsulation layer 14, a first filter unit 15, a second encapsulation layer 16, and a third encapsulation layer 17.

[0028] The following will refer to Figure 1B As shown, the detailed structure within a display area DA and its adjacent transparent area TA is explained, wherein... Figure 1B The display area is a cross-section defined by a first direction X and a third direction Z (e.g., the normal direction of the display surface of the electronic device 10), where the third direction Z is perpendicular to the first direction X and the second direction Y. The display area DA can be defined as the area of ​​the orthogonal projection of the first filter unit 15 onto the first substrate. The light-emitting unit 12 and the first optical unit 13 are disposed in the display area DA. The transparent area TA can be defined as the area outside the orthogonal projection of the first filter unit 15 onto the first substrate.

[0029] like Figure 1BAs shown, a light-emitting unit 12 is disposed in a display area DA on a first substrate 11. The light-emitting unit 12 includes a first embankment layer 121 and a light-emitting component 122. A first optical unit 13 is located in the display area DA and disposed on the light-emitting unit 12. The first optical unit 13 includes a second embankment layer 131 and a first light conversion component 132, and is positioned above the light-emitting component 122. A first light-filtering unit 15 is located in the display area DA and disposed on the first optical unit 13. The first light-filtering unit 15 includes a first light-shielding layer 151 and a first color light-filtering component 152, and is positioned above the first light conversion component 132. The first encapsulation layer 14 is disposed on the light-emitting unit 12 and located between the light-emitting unit 12 and the first optical unit 13. The second encapsulation layer 16 is disposed on the first optical unit 13 and located between the first optical unit 13 and the first filter unit 15. The third encapsulation layer 17 is disposed on the first filter unit 15. The first encapsulation layer 14 contacts the second encapsulation layer 16 in the transparent area TA, so that the first optical unit 13 is enclosed in the space SP1 formed by the first encapsulation layer 14 and the second encapsulation layer 16. The second encapsulation layer 16 contacts the third encapsulation layer 17 in the transparent area TA, so that the first filter unit 15 is enclosed in the space SP2 formed by the second encapsulation layer 16 and the third encapsulation layer 17. In this embodiment, each light-emitting unit 12 may include one or more light-emitting components 122 as needed, each first optical unit 13 may include one or more first light conversion components 132 as needed, and each first filter unit 15 may include one or more first color filter components 152 as needed. One light-emitting component 122 is configured corresponding to one first light conversion component 132, and one first light conversion component 132 is configured corresponding to one first color filter component 152. In other words, one light-emitting component 122 is located in the orthographic projection of a corresponding first light conversion component 132, and one first light conversion component 132 is located in the orthographic projection of a corresponding first color filter component 152. It should be noted that the above structural relationships can be applied to other embodiments described below.

[0030] In addition, the electronic device 10 may further include a fourth encapsulation layer 18 disposed between the first substrate 11 and the first encapsulation layer 14. The fourth encapsulation layer 18 contacts the first encapsulation layer 14 in the transparent area TA, so that the light-emitting unit 12 is enclosed in the space SP3 formed by the first encapsulation layer 14 and the fourth encapsulation layer 18.

[0031] Furthermore, the electronic device 10 may further include a first support layer 19 disposed on the side of the first substrate 11 away from the light-emitting unit 12; wherein, as Figure 1BAs shown, the first support layer 19 can be attached to the underside of the first substrate 11 via a first adhesive layer 20. Similarly, the electronic device 10 may further include a second support layer 21 disposed on the side of the third encapsulation layer 17 away from the first filter unit 15; wherein, as Figure 1B As shown, the second support layer 21 can be attached to the top of the third encapsulation layer 17 through a second adhesive layer 22.

[0032] As mentioned above, in order to form a transparent area in the transparent area TA, a first light-transmitting material layer 23 can be formed between the third encapsulation layer 17 and the second support layer 21 (and / or the second adhesive layer 22) within the transparent area TA to improve the light transmittance of the transparent area TA. For example, a luminance meter or spectrometer can be used to measure the intensity S1 (in nits) of light after passing through the electronic device 10. For example, a light source can be placed on one side of the electronic device 10 (such as below the first support layer 19), and a luminance meter can be placed on the other side (such as above the second support layer 21). The intensity S1 of light emitted from the light source after passing through the electronic device 10 (such as the transparent area TA) can be obtained by measuring the luminance meter. In addition, the reference light intensity S2 can be obtained by directly receiving the light emitted from the light source (without passing through the electronic device 10) with the luminance meter. The light transmittance of the electronic device 10 can be obtained by taking the ratio of intensity S1 to intensity S2 (S1 / S2). Generally speaking, the refractive index of each film layer in the electronic device 10 (such as the transparent area TA) will affect its light transmittance. That is, the refractive index matching of the multilayer film layers will affect the light transmittance of the overall stacked structure. Therefore, limiting the refractive index of each film layer material to be similar can achieve a better light transmittance of the product.

[0033] The structures, materials, and other characteristics of each component will be described below. In this embodiment, the first substrate 11 may be a flexible substrate, such as including glass, quartz, sapphire, ceramic, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other suitable materials, or a combination of the above materials, but the present invention is not limited thereto; its coefficient of thermal expansion (CTE) may be, for example, between 0 and 50 ppm / K (0 < CTE < 50 ppm / K), its maximum tensile strength (UTS) may be, for example, between 100 Mpa and 1000 Mpa (1000 Mpa > UTS > 100 Mpa), its elongation may be, for example, between 7% and 100% (100% > elongation > 7%), but the present invention is not limited thereto. Therefore, the electronic device 10 of this embodiment may be a flexible display. In addition, the first substrate 11 may be a substrate including a circuit layer (not shown in the figure) electrically connected to the light-emitting unit 12. This circuit layer includes, for example, different passive components and / or active components, such as resistors, capacitors, inductors, diodes, metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, bipolar junction transistors (BJTs), lateral-diffusion metal-oxide-semiconductor transistors, high-power metal-oxide-semiconductor transistors, thin-film transistors (TFTs), or other types of transistors. In addition, the first substrate 11 may be a driving substrate for driving the light-emitting unit 12 to emit light, such as a complementary metal-oxide-semiconductor substrate, a liquid crystal on silicon (LCOS) substrate, a thin-film transistor substrate, or other circuit boards with working circuits, and the present invention is not limited thereto.

[0034] Such as Figure 1BAs shown, in the light-emitting unit 12, the first embankment layer 121 includes at least one first opening 121a for accommodating the light-emitting component 122. In this embodiment, the first embankment layer 121 may include, for example, three first openings 121a, so that the light-emitting unit 12 includes three light-emitting components 122 respectively disposed in the three first openings 121a, such as three identical blue light-emitting diodes; for example, the light-emitting component 122 may include, for example, liquid crystal, organic light-emitting diode (OLED), inorganic light-emitting diode (LED) (e.g., mini LED, micro LED), quantum dot light-emitting diode (QLED, QDLED), fluorescence, phosphorescence, other suitable materials or combinations of the above materials, but the present invention is not limited thereto. Additionally, a circuit layer 123 can be disposed below the light-emitting component 122 for electrical connection with the light-emitting component 122, so as to control and drive the plurality of light-emitting components 122 to emit light through the circuit layer 123. The circuit layer 123 may include, for example, active components (e.g., thin-film transistors), passive components (e.g., capacitors, bonding pads), multiple metal layers, and insulating layers between the multiple metal layers, to drive the light-emitting component 122 via the circuit layer 123. Furthermore, the plurality of circuit layers 123 can be electrically connected to each other. It should be noted that the circuit pattern of the circuit layer 123 is mainly arranged within the display area DA, but may also be partially or not arranged within the transparent area TA. Additionally, the circuit layer 123 may be partially arranged within the area of ​​each light-emitting unit 12; for example, the circuit pattern of the circuit layer 123 may be disposed below the first embankment layer 121 and the light-emitting component 122. The above description is merely illustrative and is not intended to limit the scope of the invention.

[0035] Furthermore, in the first optical unit 13, the second embankment layer 131 includes at least one second opening 131a for accommodating the first light conversion component 132. In this embodiment, the second embankment layer 131 may include, for example, three second openings 131a, so that the first optical unit 13 may include three first light conversion components 132 respectively disposed in the three second openings 131a, wherein the first light conversion component 132 includes, for example, a red light conversion component 132R, a green light conversion component 132G, and a light diffusion component 132D, which are respectively disposed above the plurality of light-emitting components 122. In addition, the first light conversion component 132 in this embodiment may include, for example, a phosphor for converting the light emitted by the light-emitting component 122 into red light, green light, blue light, or other suitable color light. In some other embodiments, the first light conversion component 132 (e.g., red light conversion component 132R and green light conversion component 132G) may, for example, comprise a quantum dot material. The quantum dot material may, for example, have a core-shell structure. The core may comprise CdSe, CdTe, CdS, ZnS, ZnSe, ZnO, ZnTe, InAs, InP, GaP, other suitable materials, or combinations of the above materials, but the invention is not limited thereto. Furthermore, the first light conversion component 132 (e.g., light diffusion component 132D) may, for example, simply replace the aforementioned quantum dot material with a material that does not have wavelength conversion function (e.g., without phosphor particles or quantum dot material). For example, the material used for replacement may comprise a polymer, a glass matrix, or titanium dioxide (TiO2), but the invention is not limited thereto.

[0036] Furthermore, in the first filtering unit 15, the first light-shielding layer 151 is disposed on the second embankment layer 131 and includes at least one third opening 151a for accommodating the first color filter component 152, that is, the third opening 151a is disposed on the aforementioned second opening 131a; in this embodiment, the first light-shielding layer 151 may include, for example, three third openings 151a, so that the first filtering unit 15 may include three first color filter components 152 respectively disposed in the three third openings 151a, wherein the first color filter component 152 includes, for example, a red light filter component 152R, a blue light filter component 152B, and a green light filter component 152G. The red light filter 152R primarily allows only red wavelength light to pass through, the blue light filter 152B primarily allows blue wavelength light to pass through, and the green light filter 152G primarily allows green wavelength light to pass through. The three first color filters 152 can be respectively set in different third openings 151a, such that the red light filter 152R is set on the red light conversion component 132R, the blue light filter 152B is set on the light diffusion component 132D, and the green light filter 152G is set on the green light conversion component 132G. In this way, light of specific wavelengths can pass through the first color filters 152 to achieve better display quality and contrast. Therefore, in this embodiment, the light emitted by the first light-emitting component 122 (e.g., blue light) can sequentially pass through the red light conversion component 132R and the red light filter component 152R before being emitted as red light; the light emitted by the second light-emitting component 122 (e.g., blue light) can sequentially pass through the light diffusion component 132D and the blue light filter component 152B before being emitted as blue light; and the light emitted by the third light-emitting component 122 (e.g., blue light) can sequentially pass through the green light conversion component 132G and the green light filter component 152G before being emitted as green light. Furthermore, the first light-shielding layer 151 can be, for example, a black matrix layer (BM), and the material of the first light-shielding layer 151 can be, for example, black photoresist, black printing ink, black resin, organic resin, or glass paste; the present invention is not limited thereto. In other embodiments, the first light-shielding layer 151 can function as, for example, a pixel definition layer (PDL); the present invention is not limited thereto. The above description is merely illustrative and is not intended to limit the scope of the present invention.

[0037] like Figure 1BAs shown, the electronic device 10 may further include a first encapsulation layer 14, a second encapsulation layer 16, a third encapsulation layer 17, and a fourth encapsulation layer 18, which can contact each other to form multiple enclosed spaces for accommodating the multiple light-emitting units 12, the multiple first optical units 13, and the multiple first filter units 15. Specifically, the first encapsulation layer 14 and the second encapsulation layer 16 are in contact in the transparent area TA and form an enclosed space SP1 in the display area DA to accommodate the first optical unit 13. The second encapsulation layer 16 and the third encapsulation layer 17 are in contact in the transparent area TA and form an enclosed space SP2 in the display area DA to accommodate the first filter unit 15. The fourth encapsulation layer 18 is in contact with the first encapsulation layer 14 in the transparent area TA and forms an enclosed space SP3 in the display area DA to accommodate the light-emitting unit 12. In this embodiment, the materials of the first encapsulation layer 14, the second encapsulation layer 16, the third encapsulation layer 17, and the fourth encapsulation layer 18 can be selected from materials with low water vapor transmission rate (WVTR), such as, but not limited to, SiO2. x N y SiO x SiN x Materials such as SiO2, ZnO, and Al2O3, or combinations thereof, can be used to form the encapsulation layer 14, 16, 17, and 18 using CVD or ALD processes. The materials of the first encapsulation layer 14, second encapsulation layer 16, third encapsulation layer 17, and fourth encapsulation layer 18 can be the same or different, and this invention is not limited thereto. For example, the first encapsulation layer 14, second encapsulation layer 16, third encapsulation layer 17, and fourth encapsulation layer 18 of this embodiment may have the following characteristics: their water vapor transmission rate may not exceed 1*10⁻⁶. -5 g / day / m 2 Its refractive index can be between 1.32 and 1.75, and its haze can be less than 0.5. It should be noted that the above description is merely an example and is not intended to limit the scope of the invention. Here, by utilizing the arrangement of the first encapsulation layer 14, the second encapsulation layer 16, the third encapsulation layer 17, and the fourth encapsulation layer 18, and their low water vapor transmittance, the light-emitting unit 12, the first optical unit 13, and the first filter unit 15 can be fully encapsulated, preventing external moisture and / or oxygen from damaging the light-emitting unit 12, the first optical unit 13, and the first filter unit 15 located in the enclosed space. In particular, it can protect the light conversion material in the first optical unit 13, making it suitable for using light conversion materials to manufacture flexible transparent displays.

[0038] The first support layer 19 and the second support layer 21 can provide support and protection functions. Their materials include, for example, polycarbonate (PC), polyethylene terephthalate (PET), etc., but the present invention is not limited thereto.

[0039] The materials of the first adhesive layer 20 and the second adhesive layer 22 may include optically clear adhesive (OCA), optically clear resin (OCR), or other suitable transparent adhesive materials, and the present invention is not limited thereto. The first adhesive layer 20 and the second adhesive layer 22 may, for example, have the following characteristic: their water vapor transmission rate may not exceed 30 g / day / m². 2 Its transmittance can be greater than 95%, and its refractive index can be between 1.32 and 1.75. It should be noted that the above description is merely illustrative and not intended to limit the scope of the invention.

[0040] The first light-transmitting material layer 23 can be formed, for example, by a transparent negative photoresist, and has characteristics such as a transmittance greater than 99% and a refractive index between 1.32 and 1.75. It should be noted that the above description is merely illustrative and not intended to limit the scope of the invention. The electronic device 10 of this embodiment can form a transparent display by means of the design of the first light-transmitting material layer 23.

[0041] In another embodiment, the first substrate 11, the fourth encapsulation layer 18, the first support layer 19 and the first adhesive layer 20 may be replaced by a glass substrate (such as an ITO glass substrate), and the second support layer 21 may be replaced by another (glass) substrate. The material may be, for example, glass, polymer film, resin or adhesive layer, etc. This structure may be, for example, a non-flexible transparent display.

[0042] In another embodiment, the following can be omitted: Figure 1B In the illustrated embodiment, the second encapsulation layer 16 allows the first filter unit 15 to be directly disposed on the first optical unit 13. The first encapsulation layer 14 and the third encapsulation layer 17 are in contact in the transparent area TA and form a closed space (not shown) in the display area DA to accommodate the first optical unit 13 and the first filter unit 15. It should be noted that the above description is merely illustrative and not intended to limit the scope of the invention.

[0043] The following will illustrate the structural configuration of the electronic device according to different embodiments of the present invention with reference to the accompanying drawings. It should be noted that the following embodiments are merely examples and the present invention is not limited thereto.

[0044] Figure 2This is a partial cross-sectional schematic diagram of an electronic device 10a according to another embodiment of the present invention, showing along... Figure 1A The cross-sectional view shown by section line AA' indicates that the electronic device 10a of this embodiment has a component composition and connection relationship that is substantially the same as the electronic device 10 of the aforementioned embodiment. The difference lies in that, in the electronic device 10a of this embodiment, the first light-transmitting material layer 23 extends downward to the first substrate 11. This design can significantly increase the proportion of the first light-transmitting material layer 23 in the transparent area TA, thereby effectively improving the overall light transmittance of the electronic device 10a.

[0045] In another embodiment, the first substrate 11, the fourth encapsulation layer 18, the first support layer 19 and the first adhesive layer 20 may be replaced by a glass substrate (such as an ITO glass substrate), and the second support layer 21 may be replaced by another substrate. The material may be, for example, glass, polymer film, resin or adhesive layer, etc. This structure may be, for example, a non-flexible transparent display.

[0046] Figure 3 This is a partial cross-sectional schematic diagram of an electronic device 10b according to another embodiment of the present invention, showing along... Figure 1A The cross-sectional view shown by section line AA' indicates that the electronic device 10b of this embodiment has a component composition and connection relationship that is largely the same as the electronic device 10 of the aforementioned embodiment. The difference lies in that the electronic device 10b of this embodiment further includes a second substrate 24 and a third adhesive layer 25. The second substrate 24 is disposed on the side of the first substrate 11 adjacent to the light-emitting unit 12, and the third encapsulation layer 17 contacts the second substrate 24. The third adhesive layer 25 is disposed between the light-emitting unit 12 and the first optical unit 13. In this embodiment, as... Figure 3As shown, the second substrate 24 is disposed between the third encapsulation layer 17 and the second adhesive layer 22, and the third adhesive layer 25 is disposed between the light-emitting unit 12 and the first encapsulation layer 14. The materials and characteristics of the second substrate 24 can be referenced to the materials and characteristics of the first substrate 11 in the aforementioned embodiments, and the materials and characteristics of the third adhesive layer 25 can be referenced to the materials and characteristics of the first adhesive layer 20 or the second adhesive layer 22 in the aforementioned embodiments, and therefore will not be repeated here. Furthermore, the electronic device 10b of this embodiment has two first light-transmitting material layers 23a and 23b. The first light-transmitting material layer 23a is disposed in the light-transmitting area TA around the light-emitting unit 12 and is located between the fourth encapsulation layer 18 and the third adhesive layer 25. The first light-transmitting material layer 23b is disposed in the light-transmitting area TA around the first optical unit 13 and is located between the first encapsulation layer 14 and the third adhesive layer 25. The electronic device 10b is structurally designed to be suitable for a dual-substrate manufacturing process. For example, a light-emitting unit 12 and related components can be formed on the first substrate 11, and a first filter unit 15 and a first optical unit 13 and related components can be formed on the second substrate 24. Then, the two substrate structures are bonded together using a third adhesive layer 25 to form the electronic device 10b. It should be noted that the above description is merely an example and is not intended to limit the scope of the invention.

[0047] Figure 4 This is a partial cross-sectional schematic diagram of an electronic device 10c according to another embodiment of the present invention, showing along... Figure 1A The cross-sectional view shown by section line AA' indicates that the electronic device 10c of this embodiment has a component composition and connection relationship that is substantially the same as the electronic device 10 of the aforementioned embodiment. The difference is that the electronic device 10c of this embodiment further includes a third substrate 26, a second optical unit 27, a second filter unit 28, a fifth encapsulation layer 29, a sixth encapsulation layer 30, a seventh encapsulation layer 31, a second light-transmitting material layer 32, and a fourth adhesive layer 33. Figure 4 A cross-sectional view of a display area DA and an adjacent transparent area TA of a display electronic device 10c is shown. A third substrate 26 is disposed on the side of the first substrate 11 away from the light-emitting unit 12. A second optical unit 27 is disposed between the third substrate 26 and the first substrate 11, and is located in the display area DA and below the light-emitting unit 12. A second filter unit 28 is disposed between the third substrate 26 and the second optical unit 27, and is located in the display area DA and below the second optical unit 27. The second optical unit 27 is enclosed in a space SP4 formed by a fifth encapsulation layer 29 and a sixth encapsulation layer 30, and the second filter unit 28 is enclosed in a space SP5 formed by a sixth encapsulation layer 30 and a seventh encapsulation layer 31. Figure 4As shown, the second optical unit 27 includes a third embankment layer 271 and at least one second light conversion component 272. The third embankment layer 271 may include, for example, three fourth openings 271a. In this way, the second optical unit 27 may include three second light conversion components 272 respectively disposed in the three fourth openings 271a. The second light conversion components 272 include, for example, a red light conversion component 272R, a green light conversion component 272G, and a light diffusion component 272D, which are respectively disposed below the plurality of light-emitting components 122. In addition, The second filtering unit 28 may include a second light-shielding layer 281 and at least one second color filter component 282. The second light-shielding layer 281 may include, for example, three fifth openings 281a. In this way, the second filtering unit 28 may include three second color filter components 282 respectively disposed in the three fifth openings 281a. The second color filter components 282 may include, for example, a red light filter component 282R, a blue light filter component 282B, and a green light filter component 282G, respectively disposed under the plurality of second light conversion components 272. It should be noted that the material of the third substrate 26 can refer to the aforementioned first substrate 11, the material of the second optical unit 27 can refer to the aforementioned first optical unit 13, the material of the second filter unit 28 can refer to the aforementioned first filter unit 15, the materials of the fifth encapsulation layer 29, the sixth encapsulation layer 30, and the seventh encapsulation layer 31 can refer to the aforementioned first encapsulation layer 14, the second encapsulation layer 16, and the third encapsulation layer 17, the material of the second light-transmitting material layer 32 can refer to the aforementioned first light-transmitting material layer 23, and the material of the fourth adhesive layer 33 can refer to the aforementioned first adhesive layer 20; therefore, further details are omitted. Figure 4 As shown, the electronic device 10c in this embodiment is, for example, a double-sided transparent display. A light-emitting unit 12, a first optical unit 13, and a first light-filtering unit 15 can be disposed on the first substrate 11, and a second light-filtering unit 28 and a second optical unit 27 can be disposed on the third substrate 26. The light-emitting unit 12, the first optical unit 13, and the first light-filtering unit 15 can be encapsulated by a first encapsulation layer 14, a second encapsulation layer 16, a third encapsulation layer 17, and a fourth encapsulation layer 18. The connection relationship and materials of the first encapsulation layer 14, the second encapsulation layer 16, the third encapsulation layer 17, and the fourth encapsulation layer 18 can be referred to as follows: Figure 1BThe electronic device 10 shown will not be described in detail here. Furthermore, the second optical unit 27 and the second filter unit 28 can be encapsulated by a fifth encapsulation layer 29, a sixth encapsulation layer 30, and a seventh encapsulation layer 31. The fifth encapsulation layer 29 and the sixth encapsulation layer 30 are in contact in the transparent area TA, forming a closed space SP4 in the display area DA to house the second optical unit 27. The sixth encapsulation layer 30 and the seventh encapsulation layer 31 are in contact in the transparent area TA, forming a closed space SP5 in the display area DA to house the second filter unit 28. The materials of the fifth encapsulation layer 29, the sixth encapsulation layer 30, and the seventh encapsulation layer 31 can be referenced from the materials of the first encapsulation layer 14, the second encapsulation layer 16, and the third encapsulation layer 17, and will not be described in detail here. This prevents the light conversion materials in the first optical unit 13 and the second optical unit 27 from being damaged by ambient moisture and oxygen.

[0048] Figure 5 This is a partial cross-sectional schematic diagram of an electronic device 10d according to another embodiment of the present invention, showing along... Figure 1A The cross-sectional view shown by section line AA' indicates that the electronic device 10d of this embodiment has a component composition and connection relationship that is largely the same as that of the electronic device 10c of the aforementioned embodiment. The difference lies in that, in the electronic device 10d of this embodiment, the first light-transmitting material layer 23 extends downward to the first substrate 11, and the second light-transmitting material layer 32 extends downward to the third substrate 26. This design can significantly increase the proportion of the first light-transmitting material layer 23 and the second light-transmitting material layer 32 in the transparent area TA, thereby effectively improving the overall light transmittance of the electronic device 10d.

[0049] In another embodiment, the first substrate 11 and the fourth encapsulation layer 18 can be replaced by a glass substrate (such as an ITO glass substrate), and the second support layer 21 can be replaced by another substrate. The material of the substrate can be, for example, glass, polymer film, resin, or adhesive layer. The first support layer 19, the first adhesive layer 20, and the third substrate 26 can be replaced by another glass substrate and an adhesive layer. This structure can be, for example, a non-flexible double-sided transparent display.

[0050] Next, please refer to Figure 6A and Figure 6B As shown, where Figure 6A This is a top view schematic diagram of the electronic device 10e according to an embodiment of the present invention. Figure 6B This is a partial cross-sectional schematic diagram of the electronic device 10e according to an embodiment of the present invention, showing along... Figure 6A The cross-sectional view shown is a section line BB'.

[0051] like Figure 6AAs shown, the electronic device 10e in this embodiment can be, for example, but not limited to, a display device, having a plurality of display areas DA and a non-display area NA surrounding the plurality of display areas DA. A detailed description of this can be found in [reference needed]. Figure 1A The electronic device 10 will not be described in detail here. It should be noted that... Figure 6A This is a top view of electronic device 10e, which shows that electronic device 10e includes multiple display areas DA. Figure 6B A cross-sectional view of a display area DA and an adjacent non-display area NA of the display electronic device 10e, i.e., along Figure 6A The cross-sectional view shown is of section line BB', therefore Figure 6B It mainly displays the detailed structure of a display area DA.

[0052] like Figure 6B As shown, the electronic device 10e of this embodiment is similar to the electronic device 10 of the aforementioned embodiments (e.g., ...). Figure 1B The components and their connections are largely the same as those shown. The difference is that in this embodiment, the electronic device 10e uses a non-display area NA instead of the transparent area TA of the electronic device 10. In this embodiment, the first embankment layer 121 and circuit layer 123 of the light-emitting unit 12, the second embankment layer 131 of the first optical unit 13, and the first light-shielding layer 151 of the first light-filtering unit 15 all extend into the non-display area NA. Furthermore, the electronic device 10e does not have a first light-transmitting material layer 23. Therefore, the electronic device 10e can be, for example, a non-transparent flexible display.

[0053] Figure 7 This is a partial cross-sectional schematic diagram of the electronic device 10f according to different embodiments of the present invention, showing along... Figure 6A The cross-sectional view shown is a section line BB'. The electronic device 10f of this embodiment has a component composition and connection relationship of the components that are generally the same as those of the electronic device 10e of the previous embodiment. The difference is that a fifth adhesive layer 34 is further included between the light-emitting unit 12 and the first encapsulation layer 14, and a fourth substrate 35 is further included between the third encapsulation layer 17 and the second adhesive layer 22. The material of the fifth adhesive layer 34 can refer to the first adhesive layer 20 mentioned above, and the material of the fourth substrate 35 can refer to the first substrate 11 mentioned above, so it will not be described again. In this embodiment, the light-emitting unit 12 can be disposed on the first substrate 11, and the first optical unit 13 and the first filter unit 15 can be disposed on the fourth substrate 35. Then, the two substrates are bonded together using the fifth adhesive layer 34 to form the electronic device 10f.

[0054] Figure 8A This is a top view schematic diagram of an electronic device 10' according to another embodiment of the present invention. Figure 8B This is a partial cross-sectional schematic diagram of an electronic device 10' according to another embodiment of the present invention, showing along... Figure 8A The cross-sectional view shown is along section line CC'. Note that... Figure 8A This is a top view of the electronic device 10', which shows that the electronic device 10' includes multiple display panels 10g, and each display panel 10g includes multiple display areas DA. Figure 8B A partial cross-sectional view of two adjacent display panels 10g in the display electronic device 10', for example, a cross-sectional view including two display areas DA of one display panel 10g and one display area DA of the adjacent other display panel 10g, that is, along Figure 8A The cross-sectional view shown is of section line CC', therefore Figure 8B It mainly displays the detailed structure of the three display areas DA.

[0055] like Figure 8A and 8B As shown, the electronic device 10' of this embodiment includes a plurality of display panels 10g and a splicing material 101 for splicing the plurality of display panels 10g. Each display panel 10g can be any of the aforementioned electronic devices 10-10f or a variation thereof. For example, the display panel 10g can be any of the aforementioned electronic devices 10-10f. Figure 1B , 2 The electronic devices 10, 10a, 10b, 10c, or 10d shown in Figures 3, 4, or 5 are flexible transparent displays. Thus, the electronic device 10' formed by splicing multiple display panels 10g can constitute a flexible, spliced ​​transparent display. In this embodiment, the display panel 10g is as follows: Figure 2 The electronic device 10a shown is modified in that the first substrate 11, the fourth encapsulation layer 18, the first support layer 19, and the first adhesive layer 20 can be replaced by a first glass substrate G1, and the third encapsulation layer 17, the second support layer 21, and the second adhesive layer 22 can be replaced by a second glass substrate G2, and the two substrate structures are separated by an adhesive layer (such as...). Figure 3 The third adhesive layer 25 shown is bonded together; in addition, the splicing material 101 has a width W1, which can be, for example, optically transparent adhesive, optically transparent resin or other suitable transparent adhesive, and its refractive index is, for example, between 1.32 and 1.75. Therefore, the electronic device 10' can be, for example, a non-flexible large-size transparent display obtained by splicing.

[0056] In addition, such as Figure 8BAs shown, in order to reduce the impact of splicing seams and improve the visual quality of large-size displays, the width of each splicing material 101 (splicing seam) can be adjusted according to the manufacturing process, so that the pitch W2 of two adjacent first color filter components (e.g., 152R' and 152R") that allow light of the same color to pass through in two adjacent display panels 10g can be ±30% of the pitch W3 of two adjacent first color filter components 152 (e.g., 152R and 152R') that allow light of the same color to pass through in the same display panel 10g; in detail, the "W2" can be measured as follows: Figure 8B The left side of the red filter component 152R' shown is to the left side of the red filter component 152R'", and the "W3" can measure as follows: Figure 8B The left side of the red filter component 152R to the left side of the red filter component 152R' shown. It should be noted that the above description is merely illustrative and not intended to limit the scope of the invention.

[0057] Figure 9 This is a partial cross-sectional schematic diagram of an electronic device according to different embodiments of the present invention, showing along... Figure 8A The cross-sectional view shown by section line CC'.

[0058] like Figure 9 As shown, the electronic device of this embodiment has a largely the same component composition and connection relationship as the electronic device 10' of the aforementioned embodiment. The difference lies in that the display panel 10h of this embodiment is, for example, a flexible double-sided transparent display, which can be, for example, the aforementioned electronic device 10c (such as...). Figure 4 The changes shown in the diagram form a flexible double-sided display. Furthermore, depending on requirements, the first substrate 11 and the fourth encapsulation layer 18 can be replaced by a glass substrate 36 (such as an ITO glass substrate), the second support layer 21 can be replaced by another glass substrate 37, and the first support layer 19, the first adhesive layer 20, and the third substrate 26 can be replaced by another glass substrate 38 and a sixth adhesive layer 39, forming a non-flexible double-sided splicing display. Detailed descriptions of the materials are available in the aforementioned embodiments and will not be repeated here. Additionally, the splicing material 101 can be a transparent material, or it can be part of the transparent area TA of the electronic device.

[0059] Of course, the display panel in the electronic device of this embodiment can also be any of the aforementioned electronic devices 10 to 10f, or combinations and / or variations thereof, and the present invention is not limited thereto. For example, it can be the aforementioned... Figure 5The electronic device 10d shown, and in conjunction with the aforementioned display panel 10h, can be modified in various ways. For example, the first light-transmitting material layer 23 can extend downward to the first substrate 11, and the second light-transmitting material layer 32 can extend downward to the third substrate 26. This design can significantly increase the proportion of the first light-transmitting material layer 23 and the second light-transmitting material layer 32 in the transparent area TA, thereby effectively improving the overall light transmittance of the display panel 10h and its electronic device.

[0060] In summary, the electronic device of this embodiment has multiple display areas and a transparent area surrounding the multiple display areas. The electronic device includes a first substrate, multiple light-emitting units, multiple first optical units, a first encapsulation layer, and a second encapsulation layer. The light-emitting units are disposed on the first substrate and are located in the display areas respectively; the first optical units are located in the display areas and are disposed on the light-emitting units respectively; the first encapsulation layer is disposed on the light-emitting units and is located between the light-emitting units and the first optical units; the second encapsulation layer is disposed on the first optical units; the first encapsulation layer contacts the second encapsulation layer in the transparent area, so that the multiple first optical units are respectively enclosed in the multiple spaces formed by the first encapsulation layer and the second encapsulation layer. With the above structural design, the electronic device of the present invention can utilize multiple encapsulation layers, such as a first encapsulation layer, a second encapsulation layer, a third encapsulation layer, a fourth encapsulation layer, etc., which are in contact with each other in the transparent area and form multiple sealed spaces in the display area. The material to be protected, such as a light conversion material, is placed in these multiple sealed spaces. Because the encapsulation layer uses a material with low water vapor transmittance, it can completely cover the light-emitting unit and the first optical unit, reducing the chance of external water vapor and / or oxygen coming into contact with the light-emitting unit and the first optical unit located in the sealed space. In particular, the light conversion material in the first optical unit is suitable for using light conversion materials to manufacture flexible transparent display devices.

[0061] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included within the scope defined by the appended claims.

Claims

1. An electronic device having a plurality of display areas and a transparent area surrounding the plurality of display areas, the electronic device comprising: First substrate; Multiple light-emitting units are disposed on the first substrate, wherein the multiple light-emitting units are respectively located in the multiple display areas; Multiple first optical units are respectively located in the multiple display areas and respectively disposed on the multiple light-emitting units; A first encapsulation layer is disposed on the plurality of light-emitting units and located between the plurality of light-emitting units and the plurality of first optical units; as well as A second encapsulation layer is disposed on the plurality of first optical units; The first encapsulation layer contacts the second encapsulation layer in the transparent area, so that the plurality of first optical units are respectively enclosed in the plurality of spaces formed by the first encapsulation layer and the second encapsulation layer.

2. The electronic device as claimed in claim 1, characterized in that, Including: Multiple first filter units are located in the multiple display areas and are respectively disposed on the multiple first optical units.

3. The electronic device as claimed in claim 2, characterized in that, Including: A third encapsulation layer is disposed on the plurality of first filter units, wherein the second encapsulation layer contacts the third encapsulation layer in the transparent area, such that the plurality of first filter units are respectively enclosed in the plurality of spaces formed by the second encapsulation layer and the third encapsulation layer; and A fourth encapsulation layer is disposed between the first substrate and the first encapsulation layer. The fourth encapsulation layer contacts the first encapsulation layer in the transparent area, so that the multiple light-emitting units are respectively enclosed in the multiple spaces formed by the first encapsulation layer and the fourth encapsulation layer.

4. The electronic device as claimed in claim 2, characterized in that, The plurality of first filter units include a first light-shielding layer and a first color filter assembly, the first light-shielding layer including a third opening for accommodating the first color filter assembly.

5. The electronic device as claimed in claim 1, characterized in that, Each of the plurality of light-emitting units includes a first embankment layer and a light-emitting component, the first embankment layer including a first opening for accommodating the light-emitting component.

6. The electronic device as claimed in claim 1, characterized in that, Each of the first optical units includes a second embankment layer and a first light conversion component, the second embankment layer including a second opening for accommodating the first light conversion component.

7. The electronic device as claimed in claim 1, characterized in that, Including: A first support layer is disposed on the side of the first substrate away from the plurality of light-emitting units.

8. The electronic device as claimed in claim 1, characterized in that, Including: A second support layer is disposed on the side of the third encapsulation layer away from the plurality of first optical units.

9. The electronic device as claimed in claim 1, characterized in that, Including: A second substrate is disposed relative to the first substrate, wherein the plurality of light-emitting units and the plurality of first optical units are located between the first substrate and the second substrate.

10. The electronic device as claimed in claim 9, characterized in that, Including: An adhesive layer is disposed between the plurality of light-emitting units and the plurality of first optical units.

11. The electronic device as claimed in claim 1, characterized in that, Including: A third substrate is disposed on the side of the first substrate away from the plurality of light-emitting units; A plurality of second optical units are respectively disposed between the third substrate and the first substrate, wherein the plurality of second optical units are respectively located in the plurality of display areas; and Multiple second filter units are respectively disposed between the third substrate and the multiple second optical units, wherein the multiple second filter units are respectively located in the multiple display areas.

12. The electronic device as claimed in claim 11, characterized in that, Each of the plurality of second optical units includes a third embankment layer and a second light conversion component, the third embankment layer including a fourth opening for accommodating the second light conversion component.

13. The electronic device as claimed in claim 11, characterized in that, Each of the plurality of second filter units includes a second light-shielding layer and a second color filter assembly, the second light-shielding layer including a fifth opening for accommodating the second color filter assembly.

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