Wafer transfer box lifting structure

Abstract

The embodiment of the invention provides a wafer transfer box lifting structure, a wafer transfer box comprises an upper box body and a lower box body which can be separated, the lifting structure is installed on the lower box body and comprises a lifting mechanism, the lifting mechanism comprises a supporting part and a lifting part, the lifting part and the supporting part are of an integrated structure, at least part of the supporting part extends into a containing space, and the lifting part is installed on the upper box body. The height of the supporting part extending into the accommodating space is adjustable; and the control mechanism comprises a control part, and the control part drives the lifting part to move in the vertical direction through movement in the horizontal direction, so that the position height of the supporting part is changed. The height of the supporting part of the lifting structure extending into the accommodating space can be adjusted according to needs, and when the wafer is clamped and fixed, the supporting part can be accurately lifted to a proper position to be in contact with the wafer. After the wafer is clamped and fixed, the supporting part can be separated from the wafer in time, so that the subsequent unnecessary contact or friction between the supporting part and the wafer is avoided, and the risk that the surface of the wafer is polluted or damaged is reduced.

Description

Technical Field

[0001] This specification relates to the field of semiconductor technology, specifically to a wafer transfer box lifting structure. Background Technology

[0002] In the highly precise field of semiconductor manufacturing, which demands extremely stringent environmental cleanliness, wafers play a crucial role as the core material for fabricating silicon semiconductor integrated circuits. Throughout the semiconductor production process, wafers undergo numerous delicate steps, including photolithography, etching, doping, and deposition. Each step imposes near-obsessive requirements on the quality and cleanliness of the wafer; even the slightest contamination or damage can lead to a decline in chip performance or even render the chip unusable, resulting in significant economic losses.

[0003] As an indispensable key piece of equipment in the semiconductor manufacturing process, wafer cassettes primarily undertake the crucial task of placing and transporting wafers. In the vast and complex production systems of chip manufacturing companies, wafers need to be frequently transferred between different production equipment while maintaining a stable state during storage. To achieve this goal, and to simplify the transportation process and minimize the risk of wafer contamination during transfer and storage, chip manufacturers widely use wafer cassettes for handling and storing wafers. The design and use of wafer cassettes directly affect the safety and reliability of wafers during the production process, and are of paramount importance for ensuring the quality and production efficiency of semiconductor products.

[0004] However, traditional wafer transport boxes currently face several unresolved issues in practical applications. Most traditional wafer transport boxes employ a simple and direct design, placing the wafer directly inside and then clamping it in place. In this design, the bottom surface of the clamped wafer directly contacts the inner wall of the transport box or its internal support components. While semiconductor manufacturing environments undergo rigorous purification, the presence of microparticles cannot be completely eliminated, and these particles easily adhere to the inner wall of the transport box or the surface of the support components. When the bottom surface of the wafer comes into contact with these potentially contaminated surfaces, vibrations and shaking during transport can cause scratches, contamination, and other damage to the wafer surface. Summary of the Invention

[0005] In view of this, embodiments of this specification provide a wafer transfer box lifting structure.

[0006] This specification provides the following technical solution in its embodiments: a wafer transfer box lifting structure, wherein the wafer transfer box includes a separable upper box and a lower box, the upper box and the lower box cooperate to form a receiving space for placing wafers, a clamping mechanism is provided inside the wafer transfer box, the lifting structure is used to support the wafer when clamping and fixing it, and to separate from the wafer after clamping is completed, the lifting structure is installed on the lower box and includes:

[0007] A lifting mechanism, comprising a support part and a lifting part, wherein the lifting part and the support part are an integral structure, the support part extends at least partially into the receiving space, and the height of the support part extending into the receiving space is adjustable;

[0008] The control mechanism includes a control unit, which drives the lifting unit to move vertically by moving horizontally, thereby changing the position and height of the support unit.

[0009] Preferably, the control unit includes an inner housing, the lifting unit is housed within the inner housing, a track is provided on the inner housing, and the lifting unit extends at least partially into the track. When the control unit moves in the horizontal direction, the lifting unit extending into the track moves along the track, thereby realizing the up-and-down movement of the lifting unit.

[0010] Preferably, the height of the first end of the track is greater than the height of the second end of the track. When the inner shell moves in the horizontal direction, the portion of the lifting part extending into the track moves between the first end and the second end of the track.

[0011] Preferably, the track is provided in at least two sets, and the two sets of track are distributed vertically along the inner shell.

[0012] Preferably, the control mechanism further includes a control rod, which is connected to the inner housing. The lower housing has a sliding hole through which the control rod passes, and the control rod slides in the sliding hole to drive the inner housing to move in the horizontal direction.

[0013] Preferably, the lifting part includes a lifting block and a sliding rod. The lifting block is disposed inside the inner housing. The first end of the sliding rod is fixedly connected to the lifting block, and the second end of the sliding rod extends into the track.

[0014] Preferably, the support portion includes a support column, the inner shell has a through hole for the support column to pass through, and a baffle extends upward from the edge of the support column, the baffle being L-shaped.

[0015] Preferably, the top of the support portion extends upward to form a support protrusion, which is hemispherical.

[0016] Preferably, the lifting structure further includes an outer shell, which is installed at the bottom of the lower box, and the lifting mechanism and the control mechanism are at least partially disposed within the outer shell.

[0017] Preferably, the clamping structure includes:

[0018] A fixing part is mounted on the lower housing and abuts against the first side of the wafer;

[0019] The first adjustment part includes a first mounting part and a first sliding member. The first mounting part is mounted on the lower housing. The first sliding member can move relative to the first mounting part to realize the change of distance between the first sliding member and the fixed part, ensuring that the first sliding member is always in contact with the second side opposite to the first side of the wafer.

[0020] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0021] The support section of the lifting structure can be adjusted in height to extend into the receiving space as needed. When clamping and securing the wafer, it can accurately rise to the appropriate position to contact the wafer, providing stable support and preventing damage due to uneven force or shaking during clamping. After the wafer is clamped and secured, the support section can promptly separate from the wafer, avoiding unnecessary contact or friction between the support section and the wafer during subsequent transport and storage operations. This reduces the risk of contamination or damage to the wafer surface and ensures that the wafer quality is not affected. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the wafer transfer box provided in this application;

[0024] Figure 2 This is a schematic diagram of the internal structure of the wafer transfer box provided in this application;

[0025] Figure 3 This is a schematic diagram of the wafer transfer box lifting structure provided in this application;

[0026] Figure 4 This is an exploded view of the wafer transport box lifting structure provided in this application.

[0027] In the figure, 1. Upper box; 2. Lower box; 3. Lifting mechanism; 31. Outer shell; 32. Control rod; 33. Support part; 34. Inner shell; 35. Track; 36. Slide rod; 37. Baffle; 38. Support protrusion; 39. Lifting block; 4. First adjustment part; 41. First mounting part; 42. First sliding part; 5. Fixing part; 6. Sliding hole. Detailed Implementation

[0028] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0029] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0031] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0032] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0033] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0034] like Figures 1-3 As shown, a wafer transfer box lifting structure is disclosed. The wafer transfer box includes a separable upper box body 1 and a lower box body 2. The upper box body 1 and the lower box body 2 cooperate to form a receiving space for placing wafers. A clamping mechanism is provided inside the wafer transfer box. The lifting structure is used to support the wafer when clamping and fixing it, and to separate from the wafer after clamping is completed. The lifting structure is installed on the lower box body 2 and includes:

[0035] The lifting mechanism 3 includes a support part 33 and a lifting part, the lifting part and the support part 33 are an integral structure, the support part 33 extends at least partially into the receiving space, and the height of the support part 33 extending into the receiving space is adjustable;

[0036] The control mechanism includes a control unit, which drives the lifting unit to move vertically by moving horizontally, thereby changing the position and height of the support unit 33.

[0037] When a wafer needs to be placed, the control unit in the control mechanism moves horizontally. This horizontal movement is converted into vertical movement of the lifting unit through a specific mechanical transmission structure. Since the lifting unit and the support unit 33 are an integral structure, the vertical movement of the lifting unit drives the support unit 33 to move vertically, increasing the height of the support unit 33 within the receiving space until it contacts the wafer and provides support. This, in conjunction with the clamping mechanism within the wafer transfer box, completes the clamping and fixing of the wafer. After the clamping mechanism has clamped and fixed the wafer, the control mechanism activates again, with the control unit moving horizontally in the opposite direction. Again, through the mechanical transmission structure, this drives the lifting unit to move vertically in the opposite direction, lowering the height of the support unit 33 until it separates from the wafer, returning to its initial state or a position that does not affect subsequent wafer operations.

[0038] The support portion 33 of the lifting structure can be adjusted in height to extend into the receiving space as needed. When clamping and fixing the wafer, it can accurately rise to the appropriate position to contact the wafer, providing stable support and preventing damage due to uneven force or shaking during clamping. This ensures the integrity and quality of the wafer during transport. Because the height of the support portion 33 is adjustable, this lifting structure can accommodate wafers of different thicknesses. For thicker wafers, the support portion 33 can rise to a higher position for support; for thinner wafers, it rises to a lower position, improving the versatility and flexibility of the wafer transport box. After the wafer is clamped and fixed, the support portion 33 can promptly separate from the wafer, avoiding unnecessary contact or friction between the support portion 33 and the wafer during subsequent transport and storage operations. This reduces the risk of contamination or damage to the wafer surface and ensures that the wafer quality is not affected.

[0039] like Figures 2-4 As shown, in some embodiments, the control unit includes an inner housing 34, the lifting unit is housed within the inner housing 34, a track 35 is provided on the inner housing 34, the lifting unit extends at least partially into the track 35, and when the control unit moves in the horizontal direction, the lifting unit extending into the track 35 moves along the track 35, thereby realizing the up and down movement of the lifting unit.

[0040] The inner housing 34 of the control unit is in a specific initial position. The lifting unit is housed inside the inner housing 34, and at least partially extends into the track 35 provided on the inner housing 34. At this time, the lifting unit is in a relatively fixed initial height position due to the shape and position of the track 35, and the support unit 33 (connected to the lifting unit) is also at the corresponding initial height. Since the lifting unit extends into the track 35, as the control unit (inner housing 34) moves horizontally, the shape of the track 35 exerts a force on the lifting unit. The track 35 is usually designed to have an inclined or curved shape. When the inner housing 34 moves horizontally, the lifting unit moves along the direction of the track 35 under the guidance of the track 35. Because the track 35 has a height change in the vertical direction, the lifting unit moves up and down in the vertical direction.

[0041] The track 35 on the inner housing 34 provides a precise path for the movement of the lifting unit. By designing tracks 35 with different shapes and slopes, the vertical movement distance and speed of the lifting unit can be precisely controlled, enabling the support unit 33 to accurately reach the required height position, achieving stable and precise support for the wafer and meeting the operational requirements of wafers of different thicknesses and different clamping requirements. Each time the control unit performs the same horizontal movement, the lifting unit, guided by the track 35, reaches the same height position, ensuring the repeatability and accuracy of the height positioning of the support unit 33.

[0042] The lifting unit is housed within the inner casing 34, and its lifting movement is achieved using the rails 35 on the inner casing 34. This design effectively utilizes limited space, making the entire lifting structure more compact. In space-constrained equipment such as wafer transfer boxes, a compact structure reduces space occupation and facilitates overall equipment layout and installation. The rails 35 constrain and guide the movement of the lifting unit, reducing swaying and offset during movement, and making the vertical movement of the lifting unit more stable. Stable movement ensures that the support force of the support unit 33 on the wafer is evenly distributed, avoiding wafer damage or poor clamping effect caused by unstable support.

[0043] like Figures 2-4 As shown, in some embodiments, the position height of the first end of the track 35 is greater than the position height of the second end of the track 35. When the inner housing 34 moves in the horizontal direction, the portion of the lifting part extending into the track 35 moves between the first end and the second end of the track 35.

[0044] The inner housing 34 of the control unit is in an initial horizontal position. At this time, the portion of the lifting unit extending into the track 35 is located at a certain position on the track 35 (it may be near the first end, the second end, or the middle position, depending on the initial setting). Since the height of the first end of the track 35 is greater than the height of the second end of the track 35, the track 35 is inclined downwards (from the first end to the second end). The support 33 is connected to the lifting unit, and its height extending into the wafer transfer box is determined by the position of the lifting unit in the track 35. When the inner housing 34 moves horizontally in the direction that brings the lifting unit closer to the second end of the track 35, because the track 35 is inclined downwards, the portion of the lifting unit extending into the track 35 will slide down the inclined surface of the track 35. As the position of the lifting unit in the track 35 changes, its vertical height gradually decreases, thereby causing the height of the support 33 to decrease synchronously. For example, after the wafer is clamped and fixed, it is necessary to separate the support 33 from the wafer. This method can be used to lower the support 33 and detach it from the wafer. When the inner housing 34 moves horizontally towards the first end of the track 35, the portion of the lifting part extending into the track 35 rises along the inclined surface of the track 35. As the position of the lifting part changes within the track 35, its vertical height gradually increases, thereby causing the height of the support part 33 to rise synchronously. For example, when it is necessary to clamp and fix the wafer, this method raises the support part 33 to a suitable height, contacts the wafer, and provides support for the wafer, thus cooperating with the clamping mechanism to complete the clamping operation.

[0045] The inclined design of track 35 allows for precise and continuous adjustment of the height of the support section 33 as the lifting unit moves between the first and second ends of track 35. By controlling the horizontal movement distance of the inner housing 34, the position of the lifting unit within track 35 can be precisely controlled, thereby precisely controlling the height of the support section 33 to meet the requirements of wafers of different thicknesses and clamping levels. For example, for wafers with small thickness differences, a minute horizontal movement can achieve a fine adjustment of the height of the support section 33, ensuring stable support for the wafer. Since track 35 has two endpoints with different heights, the lifting unit can achieve a large height adjustment range as it moves between these two endpoints. This allows the lifting structure to adapt to the transport needs of various wafer specifications, whether thin or thick, achieving appropriate support and clamping operations by adjusting the height of the support section 33, thus improving the versatility and flexibility of the equipment.

[0046] like Figures 2-4 As shown, in some embodiments, at least two sets of tracks 35 are provided, and the two sets of tracks 35 are vertically distributed along the inner housing 34. Wafers of different sizes and thicknesses have different requirements for the height and support method of the support portion 33. The design of two sets of vertically distributed tracks 35 can adapt to the support requirements of wafers of different specifications by adjusting parameters such as the shape and tilt angle of the tracks 35, and controlling the horizontal movement range of the inner housing 34.

[0047] like Figures 2-4 As shown, in some embodiments, the control mechanism further includes a control rod 32, which is connected to the inner housing 34. The lower housing 2 has a sliding hole 6 through which the control rod 32 passes. The control rod 32 slides in the sliding hole 6, causing the inner housing 34 to move in the horizontal direction.

[0048] When wafer operations are required (such as clamping or releasing), the operator applies external force to the control lever 32, which can be a manual push or pull force. Since the control lever 32 is connected to the inner housing 34 and can slide within the sliding hole 6 of the lower housing 2, when external force is applied to the control lever 32, it moves horizontally within the sliding hole 6. This movement of the control lever 32 directly drives the inner housing 34 to move horizontally in sync. As the inner housing 34 moves horizontally, its internal track 35 guides the lifting section (the portion extending into the track 35) to move along the track 35. Because the track 35 is typically designed with an incline or other specific shape, the lifting section moves vertically up and down under the guidance of the track 35, thereby driving the support section 33 to move vertically up and down synchronously, achieving wafer support or separation operations. Operation via the control lever 32 is very intuitive and simple. The operator only needs to apply a push or pull force to the control lever 32 to control the horizontal movement of the inner housing 34, thereby achieving the lifting and lowering of the support section 33.

[0049] like Figures 2-4 As shown, in some embodiments, the lifting part includes a lifting block 39 and a slide rod 36. The lifting block 39 is disposed inside the inner housing 34. The first end of the slide rod 36 is fixedly connected to the lifting block 39, and the second end of the slide rod 36 extends into the track 35.

[0050] When no external force is applied to the control mechanism, the inner housing 34 is in its initial position, the lifting block 39 is located at a specific position inside the inner housing 34, the first end of the slide rod 36 is fixedly connected to the lifting block 39, and the second end extends into the track 35. At this time, the support part 33 (associated with the lifting part) is at the corresponding initial height. When the operator applies a horizontal external force to the inner housing 34 through components such as the control lever 32, the inner housing 34 begins to move horizontally. Since the inner housing 34 is the mounting base for the lifting block 39 and the slide rod 36, its movement will drive the lifting block 39 and the slide rod 36 to move synchronously. As the inner housing 34 moves horizontally, the second end of the slide rod 36 extending into the track 35 will be constrained and guided by the track 35. Due to the shape design of the track 35, the slide rod 36 can only move along the direction of the track 35 within the track 35. As the slide bar 36 moves within the track 35, its first end is fixedly connected to the lifting block 39. The up-and-down movement of the slide bar 36 (guided by the track 35) causes the lifting block 39 to move up and down within the inner housing 34 accordingly. The movement of the lifting block 39 further drives the connected support part 33 to move, thereby adjusting the height of the support part 33 and completing the support or separation operation of the wafer.

[0051] The shape and dimensions of the track 35 are precisely designed, and the movement of the slide rod 36 within the track 35 is strictly constrained, allowing for highly precise height adjustment of the lifting block 39 and the support 33. The cooperation between the slide rod 36 and the track 35 ensures that the movement trajectory of the lifting unit is entirely determined by the track 35, avoiding movement deviations caused by other factors (such as unstable movement of the inner housing 34 or loose components). The first end of the slide rod 36 is fixedly connected to the lifting block 39, providing reliable support and transmission. When the slide rod 36 is guided by the track 35, it can stably transmit force to the lifting block 39, enabling smooth movement of the lifting block 39. Simultaneously, the contact between the slide rod 36 and the track 35 increases structural stability and reduces swaying and vibration during movement.

[0052] like Figures 2-4 As shown, in some embodiments, the support portion 33 includes a support column, and the inner housing 34 has a through hole for the support column to pass through. A baffle 37 extends upward from the edge of the support column, and the baffle 37 is L-shaped. When the support column moves upward, its upper end gradually approaches the wafer. If a wafer clamping operation is performed, the support column rises to a suitable height, and the top of the support column contacts the bottom of the wafer, providing upward support for the wafer. At the same time, the vertical portion of the L-shaped baffle 37 is close to the side of the wafer, and the horizontal portion is located above the wafer, which restricts the horizontal movement of the wafer and prevents the wafer from detaching upward.

[0053] like Figures 2-4 As shown, in some embodiments, the top of the support portion 33 extends upward to form a support protrusion 38, which is hemispherical. The top of the hemispherical support protrusion 38 is relatively smooth and has no sharp edges, which can prevent scratching the wafer.

[0054] like Figures 1-2 As shown, in some embodiments, the lifting structure further includes a housing 31, which is installed at the bottom of the lower housing 2. The lifting mechanism 3 and the control mechanism are at least partially disposed within the housing 31. The housing 31, installed at the bottom of the lower housing 2, forms a relatively independent and enclosed (or semi-enclosed) space. The lifting mechanism 3 and the control mechanism are at least partially disposed within the housing 31. The housing 31 at least partially encloses the lifting mechanism 3 and the control mechanism, effectively preventing external dust, impurities, and contaminants from entering the interior. In the wafer manufacturing environment, dust and impurities may adhere to the wafer surface, affecting the quality and performance of the wafer. The protective function of the housing 31 can reduce this situation, protect the lifting mechanism 3 and the control mechanism from damage, and ensure their normal operation.

[0055] like Figure 2 As shown, in some embodiments, the clamping structure includes:

[0056] Fixing part 5, which is mounted on the lower housing 2 and abuts against the first side of the wafer;

[0057] The first adjustment part 4 includes a first mounting part 41 and a first sliding member 42. The first mounting part 41 is mounted on the lower housing 2. The first sliding member 42 can move relative to the first mounting part 41 to realize the change of distance between the first sliding member 42 and the fixed part 5, so as to ensure that the first sliding member 42 is always in contact with the second side opposite to the first side of the wafer.

[0058] The first mounting part 41 of the first adjustment part 4 is also mounted on the lower housing 2, and the first sliding member 42 can move relative to the first mounting part 41. By adjusting the position of the first sliding member 42 relative to the first mounting part 41, the distance between the first sliding member 42 and the fixing part 5 can be changed. Since the fixing part 5 is already in contact with the first side of the wafer, adjusting the distance between the first sliding member 42 and the fixing part 5 ensures that the first sliding member 42 is always in contact with the second side opposite to the first side of the wafer. In this way, the wafer is fixed by the fixing part 5 on the first side and in contact with the first sliding member 42 on the second side, thus being constrained in two opposite directions, achieving the clamping and fixing of the wafer.

[0059] By cooperating with the fixing part 5 and the first adjusting part 4, the wafer is clamped from two opposite sides, effectively preventing displacement or damage due to shaking or collision during transport, thus ensuring the stability of the wafer during transport. The first sliding member 42 can move relative to the first mounting part 41, adjusting the distance between it and the fixing part 5. This allows the clamping structure to adapt to wafers of different sizes. Regardless of the size of the wafer, the position of the first sliding member 42 can be adjusted to cooperate with the fixing part 5, achieving reliable clamping of the wafer and improving the versatility and flexibility of the clamping structure. This clamping method involves contact between the wafer's two sides, avoiding excessive pressure on the wafer surface or creating sharp contact points. This reduces the possibility of scratches, breakage, or other damage to the wafer surface caused by clamping operations, thus protecting the quality and performance of the wafer.

[0060] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.

[0061] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer transfer box lifting structure, the wafer transfer box comprising a separable upper box body and a lower box body, the upper box body and the lower box body cooperating to form a receiving space for placing wafers, and a clamping mechanism provided inside the wafer transfer box, characterized in that, The lifting structure is used to support the wafer during clamping and fixing, and to separate from the wafer after clamping is completed. The lifting structure is installed on the lower housing and includes: A lifting mechanism, comprising a support part and a lifting part, wherein the lifting part and the support part are an integral structure, the support part extends at least partially into the receiving space, and the height of the support part extending into the receiving space is adjustable; The control mechanism includes a control unit, which drives the lifting unit to move vertically by moving horizontally, thereby changing the position and height of the support unit.

2. The wafer transfer box lifting structure according to claim 1, characterized in that, The control unit includes an inner housing, the lifting part is housed within the inner housing, a track is provided on the inner housing, and the lifting part extends at least partially into the track. When the control unit moves in the horizontal direction, the lifting part extending into the track moves along the track, thereby realizing the up-and-down movement of the lifting part.

3. The wafer transfer box lifting structure according to claim 2, characterized in that, The position height of the first end of the track is greater than the position height of the second end of the track. When the inner shell moves in the horizontal direction, the portion of the lifting part extending into the track moves between the first end and the second end of the track.

4. The wafer transfer box lifting structure according to claim 3, characterized in that, The track is provided in at least two sets, and the two sets of track are distributed vertically along the inner shell.

5. The wafer transfer box lifting structure according to claim 4, characterized in that, The control mechanism also includes a control rod, which is connected to the inner housing. The lower housing has a sliding hole through which the control rod passes, and the control rod slides in the sliding hole to drive the inner housing to move in the horizontal direction.

6. The wafer transfer box lifting structure according to any one of claims 2-5, characterized in that, The lifting unit includes a lifting block and a sliding rod. The lifting block is disposed inside the inner housing. The first end of the sliding rod is fixedly connected to the lifting block, and the second end of the sliding rod extends into the track.

7. The wafer transfer box lifting structure according to claim 6, characterized in that, The support includes a support column, and the inner shell has a through hole for the support column to pass through. A baffle extends upward from the edge of the support column and is L-shaped.

8. The wafer transfer box lifting structure according to claim 7, characterized in that, The top of the support extends upward to form a support protrusion, which is hemispherical.

9. The wafer transfer box lifting structure according to claim 1, characterized in that, The lifting structure also includes an outer shell, which is installed at the bottom of the lower box. The lifting mechanism and the control mechanism are both at least partially housed within the outer shell.

10. The wafer transfer box lifting structure according to any one of claims 1-9, characterized in that, The clamping structure includes: A fixing part is mounted on the lower housing and abuts against the first side of the wafer; The first adjustment part includes a first mounting part and a first sliding member. The first mounting part is mounted on the lower housing. The first sliding member can move relative to the first mounting part to realize the change of distance between the first sliding member and the fixed part, ensuring that the first sliding member is always in contact with the second side opposite to the first side of the wafer.

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