Inductor component, method for manufacturing inductor component, and substrate for manufacturing inductor component

Abstract

An inductor component (10) is provided with a green body (11), a first insulating layer (31), and inductor wiring (51). The inductor wiring (51) is provided with: a wiring main body (52); and a protruding part (53) protruding from the outer surface of the wiring main body (52) on the third negative direction (Z2) side. The outer surface of the wiring main body (52) on the third negative direction (Z2) side is in contact with the outer surface of the first insulating layer (31) on the third positive direction (Z1) side. When seen in the third positive direction (Z1), the protruding portion (53) is located within a range surrounded by the outer edge of the wiring body (52) and extends along the wiring body (52). In a cross-sectional view from a cross-section orthogonal to the first main surface (11A), a dimension (53W) of the protruding portion (53) in a direction parallel to the first main surface (11A) is smaller than a dimension (52W) of the wiring body (52) in a direction parallel to the first main surface (11A) at a location to which the protruding portion (53) is connected.

Description

Technical Field

[0001] This disclosure relates to inductor components, methods for manufacturing inductor components, and substrates for manufacturing inductor components. Background Technology

[0002] The inductor component disclosed in Patent Document 1 includes a blank and inductor wiring. The blank has a first main surface. The inductor wiring extends parallel to the first main surface within the blank. Furthermore, the inductor wiring is spiral-shaped. That is, the inductor wiring has parallel portions.

[0003] Patent Document 1: Japanese Patent No. 6447368

[0004] In the inductor component disclosed in Patent Document 1, the cross-sectional area of ​​the inductor wiring is increased to reduce the DC resistance of the inductor wiring. However, for example, when the width of the inductor wiring is increased, the spacing between the parallel portions of the inductor wiring becomes narrower. Therefore, in the event of manufacturing errors, the possibility of short circuits occurring between the parallel portions of the inductor wiring is high. Summary of the Invention

[0005] To address the aforementioned issues, one aspect of this disclosure provides an inductor component comprising: a blank containing a magnetic material and having a planar main surface; an insulating layer located within the blank and extending in a plane parallel to the main surface; and an inductor wiring within the blank, extending parallel to the main surface. When one direction orthogonal to the main surface is designated as the positive direction and the opposite direction as the negative direction, the inductor wiring comprises: a wiring body extending on the outer surface of the insulating layer on the positive direction side; and a protrusion protruding from the outer surface of the wiring body on the negative direction side, the outer surface of the wiring body on the negative direction side contacting the outer surface of the insulating layer on the positive direction side. When viewed in the positive direction, the protrusion is located within a region surrounded by the outer edge of the wiring body and extends along the wiring body. When viewed in cross-section from a plane orthogonal to the main surface, the dimension of the protrusion in the direction parallel to the main surface is smaller than the dimension of the wiring body at the location where the protrusion is connected in the direction parallel to the main surface.

[0006] Additionally, one aspect of this disclosure provides a method for manufacturing an inductor component, comprising: a seed layer forming step, wherein a conductive seed layer is formed on the main surface of a base substrate; an insulating layer forming step, wherein an insulating layer having an opening having a predetermined wiring pattern is formed on the seed layer; a resin wall forming step, wherein a resin wall is formed on the insulating layer along the outer edge of the opening; an inductor wiring forming step, wherein a wiring body is formed within a space surrounded by the resin wall by electroplating generated by supplying power to the seed layer, and a protrusion extending from the wiring body within the opening and along the wiring body is integrally formed; a blank forming step, wherein after the inductor wiring forming step, a magnetic layer comprising a magnetic material is formed around the wiring body and the protrusion; and a seed layer removal step, wherein after the blank forming step, the seed layer is removed.

[0007] Additionally, one aspect of this disclosure provides a substrate for manufacturing an inductor component, comprising: a base substrate; a seed layer located on the main surface of the base substrate and having conductivity; an insulating layer located on the seed layer and parallel to the main surface of the base substrate; and an inductor wiring located on the insulating layer and extending parallel to the main surface of the base substrate. When one direction orthogonal to the main surface of the base substrate is designated as the positive direction and the direction opposite to the positive direction is designated as the negative direction, the inductor wiring comprises: a wiring body extending on the outer surface of the insulating layer on the positive direction side; and a protrusion protruding from the outer surface of the wiring body on the negative direction side on the negative direction side. When viewed in the positive direction, the protrusion extends along the wiring body, and the negative direction side surface of the protrusion contacts the seed layer.

[0008] It can prevent different parts of the inductor wiring from short-circuiting with each other and reduce the DC resistance of the inductor wiring. Attached Figure Description

[0009] Figure 1 This is a perspective view of the inductor component according to the first embodiment.

[0010] Figure 2 This is a side perspective view of the inductor component according to the first embodiment.

[0011] Figure 3 It is along Figure 2 The sectional view along line 3-3.

[0012] Figure 4 It is along Figure 3 The sectional view along line 4-4.

[0013] Figure 5This is a flowchart of the manufacturing process of the inductor component according to the first embodiment.

[0014] Figure 6 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0015] Figure 7 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0016] Figure 8 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0017] Figure 9 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0018] Figure 10 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0019] Figure 11 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0020] Figure 12 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0021] Figure 13 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0022] Figure 14 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0023] Figure 15 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0024] Figure 16 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0025] Figure 17 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0026] Figure 18 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0027] Figure 19 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0028] Figure 20 This is an explanatory diagram of the manufacturing method of the inductor component according to the first embodiment.

[0029] Figure 21This is a perspective view of the inductor component according to the second embodiment.

[0030] Figure 22 This is a perspective view of the inductor component of the second embodiment from the top surface.

[0031] Figure 23 It is along Figure 22 A sectional view along line 23-23.

[0032] Figure 24 This is a flowchart of the manufacturing process of the inductor component according to the second embodiment.

[0033] Figure 25 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0034] Figure 26 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0035] Figure 27 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0036] Figure 28 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0037] Figure 29 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0038] Figure 30 This is an explanatory diagram of the manufacturing method of the inductor component according to the second embodiment.

[0039] Figure 31 This is a perspective view of the inductor component in the modified example.

[0040] Figure 32 This is a perspective view of the inductor component in the modified example.

[0041] Figure 33 This is a cross-sectional view of the inductor component in the modified example.

[0042] Figure 34 This is a cross-sectional view of the inductor component in the modified example.

[0043] Figure 35 This is an explanatory diagram illustrating the manufacturing method of the modified inductor component. Detailed Implementation

[0044] Hereinafter, embodiments of the inductor component will be described with reference to the accompanying drawings. Furthermore, the components are sometimes shown enlarged for ease of understanding. The dimensional ratios of the components may differ from those in the actual figures or other accompanying drawings.

[0045] <Inductor component of the first embodiment>

[0046] Hereinafter, a first embodiment of the inductor component and the method for manufacturing the inductor component will be described.

[0047] (Overall composition)

[0048] like Figure 1 As shown, the inductor component 10 is generally rectangular in shape. The inductor component 10 includes a blank 11.

[0049] The blank 11 is generally rectangular. That is, the blank 11 has six planar outer surfaces. One of these six outer surfaces is designated as the first main surface 11A. The surface located opposite to and parallel to the first main surface 11A is designated as the second main surface 11B. Furthermore, the four surfaces perpendicular to the first main surface 11A—in other words, the outer surfaces other than the first main surface 11A and the second main surface 11B—are designated as the side surfaces 11C of the blank 11. The shapes of the first main surface 11A, the second main surface 11B, and the side surfaces 11C of the blank 11 are all rectangular.

[0050] Here, the axis parallel to the long side of the first main surface 11A is designated as the first axis X. The axis parallel to the short side of the first main surface 11A is designated as the second axis Y. The axis perpendicular to the first main surface 11A is designated as the third axis Z. In this embodiment, the first axis X, the second axis Y, and the third axis Z are orthogonal to each other. Furthermore, a specific direction along the first axis X is designated as the first positive direction X1, and the direction opposite to the first positive direction X1 is designated as the first negative direction X2. Similarly, a specific direction along the second axis Y is designated as the second positive direction Y1, and the direction opposite to the second positive direction Y1 is designated as the second negative direction Y2. Finally, the direction in which the first main surface 11A faces along the third axis Z is designated as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is designated as the third negative direction Z2.

[0051] like Figure 2 As shown, the blank 11 sequentially comprises a first magnetic layer 21, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, and a third magnetic layer 25 as a magnetic layer 20 from the third negative direction Z2 side. Specifically, the outer surface of the third magnetic layer 25 facing the third positive direction Z1 is the first main surface 11A. The outer surface of the first magnetic layer 21 facing the third negative direction Z2 is the second main surface 11B. Furthermore, in... Figure 2 In the diagram, the boundaries of each magnetic layer 20 are hypothetically illustrated using double-dotted lines. In reality, sometimes clear boundaries cannot be observed between these magnetic layers 20.

[0052] The material of the magnetic layer 20, i.e., the material of the blank 11, includes a magnetic material. Specifically, the material of the blank 11 is an organic resin containing metallic magnetic powder. In this embodiment, the metallic magnetic powder is a metallic magnetic powder composed of an Fe-based alloy or an amorphous alloy. More specifically, the metallic magnetic powder is an FeSiCr-based metallic powder containing iron.

[0053] The inductor component 10 has two insulating layers. The two insulating layers are a first insulating layer 31 and a second insulating layer 32.

[0054] The first insulating layer 31 extends within the blank 11 on a plane parallel to the first main surface 11A. The first insulating layer 31 contacts the surface of the first magnetic layer 21 on the third positive direction Z1 side. In the third axis Z direction, the position of the first insulating layer 31 is the same as that of the first interlayer magnetic layer 22.

[0055] The second insulating layer 32 extends within the blank 11 on a plane parallel to the first main surface 11A. The second insulating layer 32 contacts the surface of the third magnetic layer 25 on the third negative direction Z2 side. In the third axis Z direction, the position of the second insulating layer 32 is the same as the position of the second interlayer magnetic layer 24. Furthermore, "parallel" only requires substantial parallelism, allowing for manufacturing errors. For example, parallelism is considered as long as the acute angle formed by the first insulating layer 31 and the first main surface 11A is less than 5 degrees.

[0056] like Figure 2 As shown, the inductor component 10 includes inductor wiring 51. The inductor wiring 51 is made of a conductive material. In this embodiment, the inductor wiring 51 is composed of copper at a ratio of 99 wt% or more and sulfur at a ratio of 0.1 wt% or more and 1.0 wt% or less.

[0057] The inductor wiring 51 is located inside the blank 11. The inductor wiring 51 extends parallel to the first main surface 11A. The inductor wiring 51 is located in the same layer as the first insulating layer 31 and the second magnetic layer 23 in the third axis Z direction. That is, the outer surface of the inductor wiring 51 in the third negative direction Z2 side is in contact with the outer surface of the first magnetic layer 21 in the third positive direction Z1 side. The second insulating layer 32 is located on the outer surface of the inductor wiring 51 in the third positive direction Z1 side.

[0058] The inductor wiring 51 includes a wiring body 52. ​​The wiring body 52 is a portion of the inductor wiring 51 located in the same layer as the second magnetic layer 23 in the third axis Z direction. Therefore, the wiring body 52 extends on the outer surface of the first insulating layer 31 in the third positive direction Z1 side. That is, the outer surface of the wiring body 52 in the third negative direction Z2 side is in contact with the outer surface of the first insulating layer 31 in the third positive direction Z1 side.

[0059] like Figure 3As shown, when the inductor component 10 is viewed in the third negative direction Z2, the inductor wiring 51 extends in a spiral shape. Furthermore, there is a distance between the outer edge of the inductor wiring 51 and the side surface 11C of the blank 11. Therefore, the inductor wiring 51 is not exposed on the side surface 11C of the blank 11. In this embodiment, other conductive objects reaching the side surface 11C of the blank 11 are not connected to the inductor wiring 51. Therefore, conductive objects electrically connected to the inductor wiring 51 are not exposed on the side surface 11C of the blank 11.

[0060] The wiring body 52 has a pair of pad portions P and a wiring portion L. The pad portions P are located at both ends of the wiring body 52. ​​The pad portion P located on the first positive direction X1 side is designated as the inner pad portion P1. The pad portion P located on the first negative direction X2 side is designated as the outer pad portion P2. In other words, when viewed in the third negative direction Z2, the inner pad portion P1 is located on the first positive direction X1 side relative to the geometric center of the blank 11. The outer pad portion P2 is located on the first negative direction X2 side relative to the inner pad portion P1.

[0061] The wiring section L connects a pair of pad sections P. Specifically, when viewing the inductor component 10 in the third negative direction Z2, the wiring section L extends counterclockwise from the inner pad section P1 to the outer pad section P2, with the diameter increasing as the number of turns increases. The wiring section L has approximately 2.0 turns.

[0062] Furthermore, the number of turns of the wiring section L is determined based on an imaginary vector as follows: First, an imaginary vector is constructed with the first end of the center line CL of the wiring section L as both its starting and ending point. In this state, the vector is a zero vector. Then, while observing in the third negative direction Z2, with the starting point of this vector fixed, the ending point of the vector is moved along the center line CL of the wiring section L to the second end of the center line CL. At this time, a 360-degree rotation of the vector's orientation is defined as 1.0 turns, and the number of turns is calculated. For example, if the imaginary vector rotates 180 degrees, the number of turns is 0.5 turns.

[0063] In the wiring section L, the width dimension in the direction perpendicular to the center line CL and parallel to the first main surface 11A is approximately constant throughout the wiring section L. The center line CL of the wiring section L is determined as follows: When viewed in the third negative direction Z2, the line segment that connects any point on the outer edge of the wiring section L to a point on its opposite outer edge is determined, and the distance between those two points is the shortest. When line segments are determined throughout the entire area of ​​the outer edge of the wiring section L in this way, the line connecting the midpoints of these determined line segments is set as the center line CL of the wiring section L when viewed in the third negative direction Z2.

[0064] like Figure 4As shown, the inductor component 10 includes a resin wall 41. The resin wall 41 is made of insulating resin. The resin wall 41 is laminated on a portion of the surface of the first insulating layer 31 in the third positive direction Z1. The resin wall 41 is located in the same layer as the wiring body 52 and the second magnetic layer 23 in the third axis Z direction. The resin wall 41 covers the side surface 52S of the wiring body 52 in the outer surface of the inductor wiring 51. In addition, the resin wall 41 also reaches the same layer as the second interlayer magnetic layer 24 and the second insulating layer 32 in the third axis Z direction. That is, the resin wall 41 is also in contact with the second interlayer magnetic layer 24 and the second insulating layer 32. Furthermore, the side surface 52S of the wiring body 52 refers to the outer surface of the wiring body 52 other than the outer surface in the third positive direction Z1 and the outer surface in the third negative direction Z2.

[0065] In addition, Figure 4 In the diagram, the outer surface of the resin wall 41 in the third positive direction Z1 side is in contact with the outer surface of the third magnetic layer 25 in the third negative direction Z2 side. In practice, the outer surface of the resin wall 41 in the third positive direction Z1 side may not be in contact with the outer surface of the third magnetic layer 25 in the third negative direction Z2 side, but may be embedded in the second insulating layer 32.

[0066] The inductor component 10 includes a first columnar wiring 61A and a second columnar wiring 61B. The material of each columnar wiring is the same as that of the inductor wiring 51. Each columnar wiring extends in a direction intersecting the first main surface 11A. Each columnar wiring is located in the same layer as the second interlayer magnetic layer 24 and the third magnetic layer 25 in the third axis Z direction. Each columnar wiring extends in a direction orthogonal to the first main surface 11A, i.e., in the third axis Z direction.

[0067] Each columnar wiring is in contact with the outer surface of the wiring body 52 on the third positive direction Z1 side. Therefore, each columnar wiring is electrically connected to the inductor wiring 51. Specifically, the outer surface of the first columnar wiring 61A on the third negative direction Z2 side is in contact with the surface of the inner pad portion P1 parallel to the first main surface 11A. The outer surface of the second columnar wiring 61B on the third negative direction Z2 side is in contact with the surface of the outer pad portion P2 parallel to the first main surface 11A.

[0068] The inductor component 10 includes a first external electrode 81A and a second external electrode 81B. Each external electrode is located on the first main surface 11A of the blank 11. That is, each external electrode covers a portion of the outer surface of the blank 11.

[0069] On the first main surface 11A, the first external electrode 81A is located on the side of the first positive direction X1 relative to the geometric center of the first main surface 11A. On the first main surface 11A, the second external electrode 81B is located on the side of the first negative direction X2 relative to the geometric center of the first main surface 11A. Furthermore, the first external electrode 81A is in contact with the surface of the first cylindrical wiring 61A facing the third positive direction Z1. The second external electrode 81B is in contact with the surface of the second cylindrical wiring 61B facing the third positive direction Z1.

[0070] The inductor component 10 includes a solder resist 70. The solder resist 70 has higher insulation properties compared to the blank 11. The solder resist 70 covers the portion of the blank 11 facing the third positive direction Z1, excluding at least two external electrodes. That is, the first main surface 11A of the blank 11 is covered by the external electrodes and the solder resist 70, and is therefore not exposed. Furthermore, the outer surface of the solder resist 70 on the third positive direction Z1 side does not need to be completely exposed. For example, a portion of each external electrode may also cover a portion of the outer surface of the solder resist 70 on the third positive direction Z1 side.

[0071] (Regarding the protruding part)

[0072] Next, the detailed configuration of the inductor wiring 51 will be explained.

[0073] like Figure 4 As shown, the inductor wiring 51 includes a wiring body 52 and a protrusion 53. In the manufacturing method described later, the inductor wiring 51 is formed in a single process using electroplating. That is, the wiring body 52 and the protrusion 53 are integrally formed.

[0074] The protrusion 53 is a portion of the inductor wiring 51 located in the same layer as the first interlayer magnetic layer 22 in the third axis Z direction. The protrusion 53 protrudes from the outer surface of the wiring body 52 on the third negative direction Z2 side. Specifically, the protrusion 53 protrudes from both the wiring portion L and the pad portion P. Furthermore, the protrusion 53 penetrates the first insulating layer 31. In this embodiment, the size of the protrusion 53 is the same as the size of the first insulating layer 31 in the third axis Z direction. Therefore, the positions of the protrusion 53, the first insulating layer 31, and the first interlayer magnetic layer 22 are the same in the third axis Z direction.

[0075] Furthermore, the outer surface of the protrusion 53 on the third negative direction Z2 side contacts the blank 11. The side surface 53S of the protrusion 53 contacts the first insulating layer 31. Moreover, the side surface 53S of the protrusion 53 refers to the outer surface of the protrusion 53 other than the outer surface on the third negative direction Z2 side. However, the protrusion 53 protrudes from the wiring body 52, and therefore does not have an outer surface on the third positive direction Z1 side.

[0076] When viewed in the third positive direction Z1, the protrusion 53 extends along the wiring body 52. ​​Specifically, the protrusion 53 extends from the inner pad portion P1 through the wiring portion L to the outer pad portion P2. That is, the protrusion 53 extends across approximately the entire outer edge of the wiring body 52. ​​Furthermore, as... Figure 3 As shown, when viewed in the third positive direction Z1, the protrusion 53 is located within the area surrounded by the outer edge of the wiring body 52. ​​More specifically, as... Figure 4 As shown, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimension of each part of the inductor wiring 51 in the direction parallel to the first main surface 11A is defined as the width dimension. The width dimension 53W of the protrusion 53 is smaller than the width dimension 52W of the wiring body 52 at the part where the protrusion 53 is connected in the same cross-section.

[0077] (Regarding the introduction)

[0078] Next, the detailed structure of each columnar wiring will be explained.

[0079] like Figure 4 As shown, the first columnar wiring 61A includes a first columnar portion 62A and a first lead-out portion 63A. In the manufacturing method described later, the first columnar wiring 61A is formed in a single process by electroplating. Therefore, the first columnar portion 62A and the first lead-out portion 63A are integrally formed. The shapes of the first columnar portion 62A and the first lead-out portion 63A are both approximately semi-circular columns corresponding to the shape of the inner pad portion P1.

[0080] The first columnar portion 62A is a portion of the first columnar wiring 61A located in the same layer as the third magnetic layer 25 in the third axis Z direction. The first columnar portion 62A extends from the outer surface of the second insulating layer 32 on the third positive direction Z1 side. That is, the outer surface of the first columnar portion 62A on the third negative direction Z2 side is in contact with the outer surface of the second insulating layer 32 on the third positive direction Z1 side.

[0081] The first lead-out portion 63A is a portion located in the same layer as the second interlayer magnetic layer 24 in the third axis Z direction. The first lead-out portion 63A protrudes from the outer surface of the first columnar portion 62A in the third negative direction Z2 side. Furthermore, the first lead-out portion 63A penetrates the second insulating layer 32. Additionally, in the third axis Z direction, the dimensions of the first lead-out portion 63A are the same as those of the second insulating layer 32. Therefore, in the third axis Z direction, the positions of the first lead-out portion 63A, the second insulating layer 32, and the second interlayer magnetic layer 24 are identical.

[0082] One end of the first lead-out portion 63A, on the outer surface of the third negative direction Z2 side, contacts the surface of the inner pad portion P1 parallel to the first main surface 11A. The outer edge of the first lead-out portion 63A is parallel to the outer edge of the inner pad portion P1. Furthermore, when viewed in the third positive direction Z1, the outer edge of the first lead-out portion 63A is parallel to the outer edge of the first columnar portion 62A. Also, when viewed in the third positive direction Z1, the area of ​​the region surrounded by the outer edge of the first columnar portion 62A is less than 1.3 times the area of ​​the region surrounded by the outer edge of the first lead-out portion 63A.

[0083] The side surface 63AS of the first lead-out portion 63A contacts the second insulating layer 32. Furthermore, the side surface 63AS of the first lead-out portion 63A refers to the outer surface of the first lead-out portion 63A other than the outer surface on the third negative direction Z2 side. However, the first lead-out portion 63A protrudes from the first columnar portion 62A, and therefore does not have an outer surface on the third positive direction Z1 side.

[0084] Furthermore, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimension of each part of the first columnar wiring 61A in the direction parallel to the first main surface 11A is defined as the width dimension of the first columnar wiring 61A. The width dimension 63AW of the first lead-out portion 63A is smaller than the width dimension 62AW of the first columnar portion 62A at the location where the first lead-out portion 63A is connected on the same cross-section.

[0085] The second columnar wiring 61B has a second columnar portion 62B and a second lead-out portion 63B. In the manufacturing method described later, the second columnar wiring 61B is formed in a single process by electroplating. Therefore, the second columnar portion 62B and the second lead-out portion 63B are integrally formed. The shapes of the second columnar portion 62B and the second lead-out portion 63B are both approximately quadrangular prisms corresponding to the shape of the outer pad portion P2.

[0086] The second columnar portion 62B is located in the same layer as the third magnetic layer 25 in the third axis Z direction. The second columnar portion 62B extends from the outer surface of the second insulating layer 32 in the third positive direction Z1 side to the third positive direction Z1 side. That is, the outer surface of the second columnar portion 62B in the third negative direction Z2 side is in contact with the outer surface of the second insulating layer 32 in the third positive direction Z1 side.

[0087] The second lead-out portion 63B is a portion of the second columnar wiring 61B located in the same layer as the second interlayer magnetic layer 24 in the third axis Z direction. The second lead-out portion 63B protrudes from the outer surface of the second columnar portion 62B in the third negative direction Z2 side. Furthermore, the second lead-out portion 63B penetrates the second insulating layer 32. Additionally, in the third axis Z direction, the dimensions of the second lead-out portion 63B are the same as those of the second insulating layer 32. Therefore, in the third axis Z direction, the positions of the second lead-out portion 63B, the second insulating layer 32, the second interlayer magnetic layer 24, and the first lead-out portion 63A are identical.

[0088] One end of the second lead-out portion 63B, on the outer surface of the third negative direction Z2 side, contacts the surface of the outer pad portion P2 parallel to the first main surface 11A. The outer edge of the second lead-out portion 63B is parallel to the outer edge of the outer pad portion P2. Furthermore, when viewed in the third positive direction Z1, the outer edge of the second lead-out portion 63B is parallel to the outer edge of the second columnar portion 62B. Also, when viewed in the third positive direction Z1, the area enclosed by the outer edge of the second columnar portion 62B is less than 1.3 times the area enclosed by the outer edge of the second lead-out portion 63B.

[0089] The side surface 63BS of the second lead-out portion 63B contacts the second insulating layer 32. Furthermore, the side surface 63BS of the second lead-out portion 63B refers to the outer surface of the second lead-out portion 63B other than the outer surface on the third negative direction Z2 side. However, since the second lead-out portion 63B protrudes from the second columnar portion 62B, it does not have an outer surface on the third positive direction Z1 side.

[0090] Furthermore, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimension of each part of the second columnar wiring 61B in the direction parallel to the first main surface 11A is defined as the width dimension of the second columnar wiring 61B. The width dimension 63BW of the second lead-out portion 63B is smaller than the width dimension 62BW of the second columnar portion 62B at the location where the second lead-out portion 63B is connected on the same cross-section.

[0091] (Manufacturing method)

[0092] Next, the manufacturing method of the inductor component 10 in the first embodiment will be described. The manufacturing method of the inductor component 10 applies a so-called semi-additive process (SAP).

[0093] like Figure 5As shown, the manufacturing method of the inductor component 10 includes a base preparation step S11, an adhesive layer formation step S12, and a seed layer formation step S13. Furthermore, the manufacturing method of the inductor component 10 includes a first insulating layer formation step S14, a resin wall formation step S15, an inductor wiring formation step S16, a second insulating layer formation step S17, and a columnar wiring formation step S18. Additionally, the manufacturing method of the inductor component 10 includes an insulating layer cutting step S19, a first blank formation step S20, a solder resist formation step S21, a seed layer removal step S22, a second blank formation step S23, an external electrode formation step S24, and a monolithization step S25.

[0094] like Figure 6 As shown, firstly, a base preparation process S11 is performed. Specifically, a plate-shaped base substrate 91 is prepared. The base substrate 91 is made of ceramic. The dimensions of the main surface 91A of the base substrate 91 are such that multiple inductor components 10 can be formed.

[0095] Here, the axis orthogonal to the main surface 91A of the base substrate 91 is designated as the third axis Z. Furthermore, the direction in which the main surface 91A faces along the third axis Z is designated as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is designated as the third negative direction Z2. In other words, the third positive direction Z1 is the "upward direction," and the third negative direction Z2 is the "downward direction." That is, the "upper surface" refers to the surface facing the third positive direction Z1, and the "lower surface" is the surface facing the third negative direction Z2. Moreover, the third positive direction Z1 during the manufacturing of the inductor component 10 corresponds to the third positive direction Z1 in the manufactured inductor component 10. The same applies to the third negative direction Z2.

[0096] Next, as Figure 7 As shown, the adhesive layer forming process S12 is performed. In the adhesive layer forming process S12, an adhesive layer 92 with adhesive properties is coated on the main surface 91A of the base substrate 91. Specifically, the adhesive layer 92 is made of a resin such as polyimide.

[0097] Next, as Figure 8 As shown, a seed layer formation process S13 is performed. In the seed layer formation process S13, a conductive seed layer 93 is formed on the main surface 91A of the base substrate 91. Specifically, the seed layer 93 is formed on the upper surface of the adhesive layer 92 by sputtering. Furthermore, the material of the seed layer 93 is copper. Moreover, the seed layer 93 formed using the seed layer formation process S13 of this embodiment is not a patterned seed layer. For example, the seed layer 93 is formed entirely on the main surface 91A of the base substrate 91.

[0098] Next, as Figure 9As shown, a first insulating layer formation step S14 is performed. In the first insulating layer formation step S14, a first insulating layer 31 with a predetermined wiring pattern and a first opening 94 is formed on the upper surface of the seed layer 93 by photolithography. The position and shape of the first opening 94 correspond to the position and shape of the protrusion 53 of the inductor wiring 51 formed in subsequent steps. In addition, the protrusion 53 extends along the wiring body 52, so the shape of the first opening 94 also corresponds to the shape of the wiring body 52 of the inductor wiring 51. On the other hand, the range of the first opening 94 is a slightly narrower range compared to the range of the wiring body 52. ​​Thus, the "predetermined wiring pattern" refers to the position and shape along the inductor wiring 51 formed in the inductor wiring formation step S16.

[0099] Next, as Figure 10 As shown, the resin wall formation process S15 is performed. In the resin wall formation process S15, a resin wall 41 is formed on the upper surface of the first insulating layer 31 along the outer edge of the first opening 94 by photolithography. At this time, the resin wall 41 is formed at a position slightly separated from the opening edge of the first opening 94.

[0100] Next, as Figure 11 As shown, the inductor wiring formation process S16 is performed. In the inductor wiring formation process S16, the inductor wiring 51 is formed by electroplating by supplying power to the seed layer 93. More specifically, the wiring body 52 is formed within the space surrounded by the resin wall 41, and a protrusion 53 protruding from and extending along the wiring body 52 is integrally formed within the first opening 94. In the inductor wiring formation process S16, the inductor wiring 51 is formed by electroplating in one step, thus the wiring body 52 and the protrusion 53 are integrally formed.

[0101] Next, as Figure 12 As shown, a second insulating layer formation process S17 is performed. In the second insulating layer formation process S17, a second insulating layer 32 with a predetermined pattern of a second opening 95 is formed on the upper surface of the wiring body 52 by photolithography. The position and shape of the second opening 95 correspond to the position and shape of the first lead-out portion 63A and the second lead-out portion 63B formed subsequently. On the other hand, the range of the second opening 95 is slightly narrower than the range in which each columnar portion is formed.

[0102] Next, as Figure 13As shown, a columnar wiring formation process S18 is performed. In this process, power is supplied to the seed layer 93, thereby forming leads within the second opening 95 via electroplating of the inductor wiring 51. Each columnar portion is then integrally formed on the third positive direction Z1 side of the second insulating layer 32, including the leads. Specifically, although not shown in the figure, an auxiliary wall made of resin is formed on the upper surface of the second insulating layer 32 along the outer edge of the second opening 95 using photolithography. The auxiliary wall is formed at a position slightly separated from the opening edge of the second opening 95. Next, each columnar portion is formed within the space surrounded by the auxiliary wall using electroplating. Simultaneously, within the second opening 95, a first lead 63A protruding from the first columnar portion 62A and a second lead 63B protruding from the second columnar portion 62B are integrally formed. Finally, each columnar wiring is formed by removing the auxiliary wall.

[0103] Next, as Figure 14 As shown, the insulating layer cutting process S19 is performed. In the insulating layer cutting process S19, excess portions of the first insulating layer 31 are removed by laser. Specifically, portions of the first insulating layer 31 that do not overlap with the areas containing the inductor wiring 51 and the resin wall 41 when viewed from a direction orthogonal to the main surface 91A of the base substrate 91 are cut to expose the seed layer 93.

[0104] Next, as Figure 15 As shown, the first blank forming process S20 is performed. In the first blank forming process S20, a magnetic layer 20 containing magnetic material is formed around the inductor wiring 51, each lead-out portion, and each columnar portion. Specifically, a magnetic layer 20 other than the first magnetic layer 21 is formed around the first insulating layer 31 covering the protrusion 53, around the resin wall 41 covering the wiring body 52, around the second insulating layer 32 covering the two leads-out portions, and around the two columnar portions.

[0105] More specifically, in the first blank forming process S20, firstly, a resin containing magnetic powder is coated onto the upper surface of the seed layer 93. At this time, the resin containing magnetic powder is coated so that it also covers the upper surface of each columnar wire. Next, a stamping process is performed to cure the resin containing magnetic powder. Afterward, the portion of the resin on the upper surface side is cut until the upper surface of each columnar wire is exposed. Thus, a first interlayer magnetic layer 22, a second magnetic layer 23, a second interlayer magnetic layer 24, and a third magnetic layer 25 are formed on the upper surface side of the seed layer 93. Furthermore, in Figures 15-20 In the illustration, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are not distinguished, and are instead shown as magnetic layer 20.

[0106] Next, as Figure 16 As shown, a solder resist formation process S21 is performed. In the solder resist formation process S21, solder resist 70 is formed in the areas on the upper surface of the third magnetic layer 25 and the upper surface of each columnar wiring where the first external electrode 81A and the second external electrode 81B are not formed. Specifically, insulating resin is patterned in these areas by photolithography. Furthermore, the substrate from the inductor wiring formation process S16 to the removal of the base substrate 91 by the seed layer removal process S22 is processed into a substrate 99 for inductor component manufacturing.

[0107] Next, as Figure 17 As shown, the seed layer removal process S22 is performed. In the seed layer removal process S22, firstly, the substrate 91 is cut and removed. Next, the adhesive layer 92 is removed by methods such as desmearing and ashing. Subsequently, the seed layer 93 is removed by etching.

[0108] Next, as Figure 18 As shown, a second preform forming process S23 is performed. In the second preform forming process S23, a first magnetic layer 21 containing magnetic material is formed on the lower surface of the first insulating layer 31 and the first interlayer magnetic layer 22. Specifically, in the second preform forming process S23, firstly, a resin containing magnetic powder is coated on the lower surface of the first insulating layer 31 and the first interlayer magnetic layer 22. Next, the resin containing magnetic powder is cured by stamping. Afterward, the lower surface side of the resin is cut to make the dimensions of the inductor component 10 reach the desired value. Thus, the first magnetic layer 21 is formed on the surface of the first insulating layer 31 and the first interlayer magnetic layer 22 on the third negative direction Z2 side. Furthermore, in Figures 18-20 In the illustration, the first magnetic layer 21, the first interlayer magnetic layer 22, the second magnetic layer 23, the second interlayer magnetic layer 24, and the third magnetic layer 25 are not distinguished and are instead shown as magnetic layer 20.

[0109] Next, as Figure 19 As shown, the external electrode formation process S24 is performed. In the external electrode formation process S24, a first external electrode 81A and a second external electrode 81B are formed. The area where each external electrode is formed is the area on the upper surface of the third magnetic layer 25 and the upper surface of each columnar wiring that is not covered by the solder resist 70. Copper plating, nickel plating, and gold plating are performed sequentially in this area using an electroless plating method. Thus, the first external electrode 81A and the second external electrode 81B are formed in the aforementioned area. Furthermore, in... Figure 19 as well as Figure 20 In the diagram, the different plating layers of copper, nickel, and gold are not distinguished.

[0110] Next, as Figure 20As shown, a monolithic assembly process S25 is performed. In the monolithic assembly process S25, the inductor component 10 is monolithically assembled by cutting. Specifically, multiple integrally formed inductor components 10 are separated into individual inductor components 10. Furthermore, in Figure 20 In the diagram, the cross-section SL of the inductor component 10, based on the cut, is represented by a dashed line. The inductor component 10 is manufactured through the above processes.

[0111] (Effects of the first implementation method)

[0112] (1-1) In the above embodiment, the inductor wiring 51 includes a wiring body 52 and a protrusion 53. Furthermore, since the protrusion 53 protrudes from the wiring body 52, it reaches the location where the first insulating layer 31 exists in the third axis Z direction. Therefore, the cross-sectional area of ​​the inductor wiring 51 is increased by the amount of the protrusion 53. As a result, the DC resistance of the inductor wiring 51 can be reduced. In addition, the protrusion 53 protrudes from the outer surface of the wiring body 52 on the third negative direction Z2 side and extends along the wiring body 52. ​​That is, the protrusion 53 exists within the range of the outer surface of the wiring body 52 on the third negative direction Z2 side. Therefore, the possibility of different portions of the protrusion 53 short-circuiting with each other is reduced.

[0113] (1-2) In the above embodiment, the wiring body 52 and the protrusion 53 are integrally formed. Therefore, electric field disturbance at the boundary surface between the wiring body 52 and the protrusion 53 is prevented. That is, compared with the case where there is a clear boundary surface between the wiring body 52 and the protrusion 53, the DC resistance can be reduced.

[0114] (1-3) In the above embodiments, the inductor wiring 51 and conductive materials are not exposed on the side 11C of the blank 11. Specifically, for example, the wiring used to form the inductor wiring 51 by electroplating is not exposed. As a result, corrosion of the conductive materials exposed on the side 11C of the blank 11 will not erode the inductor wiring 51 inside the blank 11.

[0115] (1-4) In the above embodiment, the outer surface of the protrusion 53 on the third negative direction Z2 side is in contact with the blank 11. Therefore, the protrusion 53 does not come into contact with other conductive objects. As a result, the possibility of different parts of the protrusion 53 short-circuiting with each other is reduced.

[0116] (1-5) In the above embodiments, the side surface 53S of the protrusion 53 is covered by the first insulating layer 31. This further improves the insulation between different parts of the protrusion 53.

[0117] (1-6) In the above embodiments, the inductor component 10 has columnar wiring. Thus, in the first main surface 11A, the inductor wiring 51 can be electrically connected to an external electronic substrate.

[0118] (1-7) In the above embodiments, the inductor wiring 51 and each column wiring are in contact. Compared with the case where other metal layers are sandwiched between the inductor wiring 51 and the column wiring, the boundary surface from the inductor wiring 51 to the column wiring is reduced. Therefore, high resistance between the inductor wiring 51 and the column wiring is prevented.

[0119] (1-8) In the above embodiments, when forming the inductor wiring 51, a wiring pattern is formed in the first insulating layer 31. As a result, even if the distance between different parts of the inductor wiring 51 is formed to be narrow, the possibility of short circuits between these parts is low. Therefore, compared with the case where the wiring pattern is formed by a seed shaped into a wiring pattern, the narrower space within the blank 11 can be used more effectively.

[0120] (1-9) In the above embodiments, the substrate 99 for manufacturing the inductor component includes a base substrate 91. Therefore, during the manufacturing process of the inductor component 10, the base substrate 91 is held and processed. For example, compared with the case where the blank 11 is directly held and processed, the possibility of damage to the inductor component 10 can be reduced.

[0121] (1-10) In the above embodiments, during the manufacturing process of the inductor component 10, an adhesive layer 92 is sandwiched between the base substrate 91 and the seed layer 93. As a result, when removing the base substrate 91, it is easier to separate the seed layer 93 from the base substrate 91 compared to cutting the base substrate 91. Therefore, the manufacturing difficulties of the inductor component 10 can be reduced.

[0122] (1-11) In the above embodiment, the inductor wiring 51 is spiral-shaped, and the number of turns of the inductor wiring 51 is greater than 1 turn. In other words, the inductor wiring 51 has different portions connected in parallel with each other. In this case, the inductor wiring 51 also has a protrusion 53, so the cross-sectional area of ​​the inductor wiring 51 can be ensured without increasing the width of the inductor wiring 51. That is, the cross-sectional area of ​​the inductor wiring 51 is easily ensured, and short circuits are prevented between the parallel portions of the inductor wiring 51.

[0123] (1-12) In the above embodiment, each columnar wiring includes a columnar portion and a lead-out portion. Furthermore, each columnar portion is connected to the inductor wiring 51 via a lead-out portion integrally formed with the columnar portion. That is, no other conductive portion such as a seed layer 93 is sandwiched between each columnar wiring and the inductor wiring 51. Therefore, compared to the case where there are other conductive portions between each columnar wiring and the inductor wiring 51, the manufacturing process of the inductor component 10 can be simplified.

[0124] (1-13) In the above embodiment, when viewed in the third positive direction Z1, the outer edge of the first lead-out portion 63A is parallel to the outer edge of the first columnar portion 62A. Furthermore, the outer edge of the first lead-out portion 63A is parallel to the outer edge of the inner pad portion P1. Therefore, the structure is simplified compared to the case where the outer edges are not parallel. The same applies to the outer edges of the second columnar wiring 61B and the outer edge of the outer pad portion P2.

[0125] (1-14) In the above embodiment, when viewed in the third positive direction Z1, the area surrounded by the outer edge of the first columnar portion 62A is less than 1.3 times the area surrounded by the outer edge of the first lead-out portion 63A. If the area difference is of this magnitude, it is highly likely that the columnar portion can be formed according to the design even without the conductive portion such as the seed layer 93, through the power supply via the inductor wiring 51. The same applies to the second columnar portion 62B and the second lead-out portion 63B.

[0126] (1-15) In the above embodiment, each lead-out portion is covered by the second insulating layer 32. This improves the insulation between each lead-out portion and the blank 11.

[0127] (1-16) In the above embodiment, in the columnar wiring forming process S18, each columnar portion and the lead-out portion are integrally formed. That is, during the manufacturing process of the inductor component 10, no other conductive portions such as the seed layer 93 are sandwiched between each columnar wiring and the inductor wiring 51. Therefore, compared with the case where there are other conductive portions between each columnar wiring and the inductor wiring 51, the manufacturing process of the inductor component 10 can be simplified.

[0128] <Inductor component of the second embodiment>

[0129] Hereinafter, a second embodiment of the inductor component and the method for manufacturing the inductor component will be described.

[0130] (Overall structure of inductor components)

[0131] like Figure 21 as well as Figure 22As shown, the inductor component 110 of the second embodiment differs from the first embodiment mainly in that it includes a first inductor wiring 151A and a second inductor wiring 151B, has a first external electrode 81A to a fourth external electrode 81D, and the blank 11 does not have a second interlayer magnetic layer 24. Furthermore, since the blank 11 does not contain the second interlayer magnetic layer 24, the inductor component 110 does not have a second insulating layer 32. Also, each columnar wiring does not have a lead-out portion. In the following description, for configurations identical to those in the first embodiment, the same reference numerals will be used, and descriptions will be omitted or simplified.

[0132] like Figure 21 As shown, the outer surfaces of the first main surface 11A and the second main surface 11B on the outer surface of the blank 11 are approximately square.

[0133] like Figure 22 As shown, the inductor component 110 has a first insulating layer 131. When viewed from the third positive direction Z1 side, the first insulating layer 131 extends in the blank 11 on a plane parallel to the first main surface 11A. The first insulating layer 131 is in contact with the surface of the first magnetic layer 21 on the third positive direction Z1 side. In the third axis Z direction, the position of the first insulating layer 131 is the same as that of the first interlayer magnetic layer 22. In this embodiment, the first insulating layer 131 exists separately in two locations, corresponding to the case where the inductor component 110 has a first inductor wiring 151A and a second inductor wiring 151B.

[0134] The inductor component 110 has two inductor wirings. Specifically, the inductor component 110 has a first inductor wiring 151A and a second inductor wiring 151B. The first inductor wiring 151A and the second inductor wiring 151B are located on the same layer in the third axis Z direction. When viewed from the third positive direction Z1 side, the first inductor wiring 151A and the second inductor wiring 151B extend in an S-shape.

[0135] Hereinafter, the wiring portion of the first inductor wiring 151A is designated as the first wiring portion LA, the two pad portions are designated as the first pad portions PA, the wiring body is designated as the first wiring body 152A, and the protrusion is designated as the first protrusion 153A. Furthermore, the first pad portion PA located on the first positive direction X1 side is designated as the first end pad portion P101A, and the first pad portion PA located on the first negative direction X2 side is designated as the second end pad portion P102A.

[0136] Furthermore, the wiring portion of the second inductor wiring 151B is designated as the second wiring portion LB, the two pad portions are designated as the second pad portions PB, the wiring body is designated as the second wiring body 152B, and the protrusion is designated as the second protrusion 153B. Additionally, the second pad portion PB located on the first positive direction X1 side is designated as the first end pad portion P101B, and the second pad portion PB located on the first negative direction X2 side is designated as the second end pad portion P102B.

[0137] The first protrusion 153A of the first inductor wiring 151A has the same configuration as the protrusion 53 of the inductor component 10 in the first embodiment. That is, as Figure 23 As shown, the outer surface of the first protrusion 153A on the third negative direction Z2 side contacts the blank 11. The side surface 153AS of the first protrusion 153A contacts the first insulating layer 131. When viewed in the third positive direction Z1, the first protrusion 153A extends along the first wiring body 152A. Specifically, the first protrusion 153A extends from the first end pad portion P101A through the first wiring portion LA to the second end pad portion P102A. That is, the first protrusion 153A extends over approximately the entire area of ​​the first wiring body 152A. Furthermore, as... Figure 22 As shown, when viewed in the third positive direction Z1, the first protrusion 153A is located within the area surrounded by the outer edge of the first wiring body 152A. More specifically, as... Figure 23 As shown, when viewed in cross-section from a plane orthogonal to the first main surface 11A, the dimensions of each portion of the first inductor wiring 151A in the direction parallel to the first main surface 11A are defined as the width dimensions. The width dimension 153AW of the first protrusion 153A is smaller than the width dimension 152AW of the first wiring body 152A at the location where the first protrusion 153A is connected. Furthermore, although not shown in the figure, the configuration of the second protrusion 153B of the second inductor wiring 151B is the same as that of the first protrusion 153A.

[0138] like Figure 23 As shown, the outer surface of the third positive direction Z1 side of the first inductor wiring 151A is in contact with the outer surface of the third negative direction Z2 side of the third magnetic layer 25. Although the figure is omitted, the outer surface of the third positive direction Z1 side of the second inductor wiring 151B is the same as that of the first inductor wiring 151A, and is in contact with the outer surface of the third negative direction Z2 side of the third magnetic layer 25.

[0139] like Figure 22As shown, the inductor component 110 has four columnar wirings. Specifically, the inductor component 110 has a first columnar wiring 161A, a second columnar wiring 161B, a third columnar wiring 161C, and a fourth columnar wiring 161D. The shape of each columnar wiring is a generally rectangular columnar shape corresponding to the shape of the pad portion to which the columnar wiring is connected.

[0140] In this embodiment, when the inductor component 110 is viewed in the third negative direction Z2, the outer edge of each columnar wiring is approximately aligned with the outer edge of the corresponding pad portion. Therefore, the area of ​​the region surrounded by the outer edge of each columnar wiring is the same as the area of ​​the region surrounded by the outer edge of the pad portion to which the columnar wiring is connected. However, "same area" means that a manufacturing tolerance of, for example, 5% is allowed.

[0141] like Figure 23 As shown, each columnar wiring is located in the same layer as the third magnetic layer 25 in the third axis Z direction.

[0142] One end of the first columnar wiring 161A contacts the surface of the first end pad portion P101A in the first pad portion PA that is parallel to the first main surface 11A. In this embodiment, the difference between the dimension P101AW of the first end pad portion P101A in the direction parallel to the first main surface 11A and the dimension 161AW of the first columnar wiring 161A in the direction parallel to the first main surface 11A is approximately zero.

[0143] One end of the second columnar wiring 161B contacts the surface of the second end pad portion P102A in the first pad portion PA that is parallel to the first main surface 11A. In this embodiment, the difference between the dimension P102AW of the second end pad portion P102A in the direction parallel to the first main surface 11A and the dimension 161BW of the second columnar wiring 161B in the direction parallel to the first main surface 11A is approximately zero.

[0144] Although figures are omitted, the third columnar wiring 161C and the fourth columnar wiring 161D are the same in these aspects. Furthermore, in this embodiment, when viewed in cross-section from a direction orthogonal to the first main surface 11A, the dimensions of each pad portion are the same as the dimensions of the columnar wiring connected to that pad portion in a direction parallel to the first main surface 11A. However, "same dimensions" means that a manufacturing tolerance of, for example, 5% is allowed.

[0145] like Figure 21 As shown, the inductor component 110 has four external electrodes. The four external electrodes are a first external electrode 81A, a second external electrode 81B, a third external electrode 81C, and a fourth external electrode 81D.

[0146] The first external electrode 81A is located on the first main surface 11A, relative to the geometric center of the first main surface 11A, on the side of the first positive direction X1 and the side of the second positive direction Y1. The second external electrode 81B is located on the first main surface 11A, relative to the aforementioned geometric center, on the side of the first negative direction X2 and the side of the second positive direction Y1. The third external electrode 81C is located on the first main surface 11A, relative to the aforementioned geometric center, on the side of the first positive direction X1 and the side of the second negative direction Y2. The fourth external electrode 81D is located on the first main surface 11A, relative to the aforementioned geometric center, on the side of the first negative direction X2 and the side of the second negative direction Y2.

[0147] The first external electrode 81A is in contact with the surface of the first cylindrical wiring 161A facing the third positive direction Z1. The second external electrode 81B is in contact with the surface of the second cylindrical wiring 161B facing the third positive direction Z1. The third external electrode 81C is in contact with the surface of the third cylindrical wiring 161C facing the third positive direction Z1. The fourth external electrode 81D is in contact with the surface of the fourth cylindrical wiring 161D facing the third positive direction Z1.

[0148] (Manufacturing method)

[0149] like Figure 24 As shown, the manufacturing method of the inductor component 110 in the second embodiment differs from the manufacturing method of the first embodiment mainly in that it lacks the resin wall forming process S15, the second insulating layer forming process S17, and the insulating layer cutting process S19. Furthermore, the manufacturing method of the inductor component 110 in the second embodiment differs from the manufacturing method of the first embodiment in that it includes the first DFR forming process S115, the second DFR forming process S117, and the DFR removal process S119. In addition, in Figures 25-30 In the middle, only the illustrations and Figure 23 The diagram corresponding to the cross-sectional view of the inductor component 110 shown. That is, in Figures 25-30 The diagram only shows cross-sections through the first inductor wiring 151A, the first column wiring 161A, and the second column wiring 161B, but the same method is used in cross-sections through the second inductor wiring 151B, the third column wiring 161C, and the fourth column wiring 161D.

[0150] First, in the manufacturing method of the second embodiment, the process proceeds from the base preparation step S111 to the first insulating layer formation step S114 using the same method as in the first embodiment. That is, as... Figure 25As shown, in the second embodiment, after the first insulating layer formation step S114, an adhesive layer 92 is formed on the upper surface of the base substrate 91. A seed layer 93 is formed on the upper surface of the adhesive layer 92. At this time, the seed layer 93 is formed on the entire main surface 91A of the base substrate 91. On the upper surface of the seed layer 93, the first insulating layer 131 is formed separately at two locations. The position and shape of the first opening 194 of the first insulating layer 131 correspond to the position and shape of the first protrusion 153A of the first inductor wiring 151A and the position and shape of the second protrusion 153B of the second inductor wiring 151B formed in subsequent steps.

[0151] Next, as Figure 26 As shown, a first DFR formation process S115 is performed. In the first DFR formation process S115, a first dry film resist DFR1 with two second openings 195 is formed on the upper surface of the seed layer 93 and the first insulating layer 131 by photolithography. The two second openings 195 have a predetermined pattern. Specifically, the position and shape of one second opening 195 correspond to the position and shape of the first wiring body 152A formed later. The position and shape of the other second opening 195 correspond to the position and shape of the second wiring body 152B formed later.

[0152] Next, as Figure 27 As shown, an inductor wiring formation process S116 is performed. In the inductor wiring formation process S116, each inductor wiring is formed by electroplating by supplying power to the seed layer 93. Specifically, a first wiring body 152A is formed in a second opening 195 of the first dry film resist DFR1, and a first protrusion 153A protruding from and extending along the first wiring body 152A is integrally formed in a first opening 194. Furthermore, a second wiring body 152B is formed in another second opening 195, and a second protrusion 153B protruding from and extending along the second wiring body 152B is integrally formed in another first opening 194.

[0153] Next, as Figure 28 As shown, the second DFR formation process S117 is performed. In the second DFR formation process S117, a second dry film resist DFR2 with four third openings 196 is formed on the upper surface of the first dry film resist DFR1 by photolithography.

[0154] Next, as Figure 29As shown, a columnar wiring formation process S118 is performed. In this process, first columnar wiring 161A to fourth columnar wiring 161D are formed within four third openings 196. The positions and shapes of the first columnar wiring 161A to fourth columnar wiring 161D correspond to the positions and shapes of the four third openings 196. This forms a first inductor wiring 151A, a second inductor wiring 151B, and first columnar wiring 161A to fourth columnar wiring 161D.

[0155] Next, as Figure 30 As shown, the DFR removal process S119 is performed. In the DFR removal process S119, the first dry film resist DFR1 and the second dry film resist DFR2 are completely removed by etching.

[0156] like Figure 24 As shown, after the DFR removal process S119, the process proceeds from the first blank formation process S120 to the monolithization process S125 using the same method as in the first embodiment. This manufactures the inductor component 110 of the second embodiment. Furthermore, the structure from the inductor wiring formation process S116 to the removal of the base substrate 91 using the seed layer removal process S122 is processed into a substrate 199 for inductor component manufacturing.

[0157] (Effects of the second implementation method)

[0158] According to the second embodiment described above, in addition to the effects of (1-1) to (1-11) mentioned above, the following effects are also achieved.

[0159] (2-1) In the above embodiment, the inductor component 110 has a second inductor wiring 151B in addition to the first inductor wiring 151A. Therefore, compared with the case of installing two inductor components with one inductor wiring, the installation area can be reduced.

[0160] (2-2) In the above embodiment, when viewed in cross-section from a direction orthogonal to the first main surface 11A, there is no significant difference between the size of each pad portion and the size of each columnar wiring in a direction parallel to the first main surface 11A. Therefore, compared to the case where the difference in each size is large, the DC resistance caused by this difference can be reduced.

[0161] <Example of Change>

[0162] The above-described embodiments and the following modifications can be combined and implemented in a manner that does not contradict each other technically. For example, modifications of the first embodiment can also be combined with the second embodiment within the scope of technical inconsistency.

[0163] (A variation of the first embodiment)

[0164] • The shape of the blank 11 is not limited to the examples of the above embodiments. In addition, as long as the blank 11 functions as an inductor component 10, it may not have part of the magnetic layer 20.

[0165] • The metallic magnetic powder used as the material for the blank 11 is not limited to FeSiCr-based magnetic powders. For example, it can also be FeCo-based, FeSiAl-based, iron oxide-based, or other metallic magnetic powders, or combinations thereof. Furthermore, the material for the blank 11, i.e., the organic resin, can also be epoxy-based, imide-based, liquid crystal polymer-based, acrylic-based, phenol-based, or combinations thereof; in addition to these materials, inorganic fillers can also be mixed in. Additionally, the material for the blank 11 can also be a non-magnetic material.

[0166] • The shape, quantity, position, and other configuration of the inductor wiring 51 are not limited to the examples of the above embodiments. They can also be appropriately changed depending on the shape of the blank 11 and the application of the inductor component 10.

[0167] • On the side 11C of the blank 11, the inductor wiring 51 can also be exposed.

[0168] • The material of the inductor wiring 51 is not limited to a conductor with copper as the main component, but can also be a conductor with Ag, Al, or Au as the main component.

[0169] • The protrusion 53 may not extend continuously from the inner pad portion P1 to the outer pad portion P2. For example, it may extend discontinuously along the inductor wiring 51 in a chain-like manner. That is, the protrusion 53 may also be partially interrupted.

[0170] • The protrusion 53 and the wiring body 52 may not be integrally molded. For example, after the protrusion 53 is formed by electroplating, the electroplating process may end, and then electroplating may begin again to form the wiring body 52. ​​Therefore, strictly speaking, an interface may be formed between the protrusion 53 and the wiring body 52. ​​In this case, it is also considered that the protrusion 53 substantially protrudes from the wiring body 52. ​​Furthermore, when the protrusion 53 and the wiring body 52 are made as separate molded parts, their materials may not be the same.

[0171] • The side 53S of the protrusion 53 may not be in contact with the first insulating layer 31. For example, another metal layer may be sandwiched between the protrusion 53 and the first insulating layer 31.

[0172] • In the direction orthogonal to the first main surface 11A, the size of the protrusion 53 can also be smaller than the size of the first insulating layer 31. In this case, the tip of the protrusion 53 will not extend towards the third negative direction Z2 relative to the first insulating layer 31. Therefore, even if manufacturing errors occur, the tip of the protrusion 53 is less likely to extend in a direction parallel to the first main surface 11A. As a result, short circuits are prevented between the tip of the protrusion 53 and other unwanted conductive parts.

[0173] • The inductor component 10 may not have columnar wiring. For example, the inductor wiring 51 may be exposed from the side 11C of the blank 11 and connected to the external electrode.

[0174] • The first lead-out portion 63A and the first columnar portion 62A may not be integrally molded. For example, after the first lead-out portion 63A is formed by electroplating and the electroplating process is stopped, the first columnar portion 62A is formed by electroplating again. Therefore, strictly speaking, an interface may be formed between the first lead-out portion 63A and the first columnar portion 62A. In this case, it is also considered that the first lead-out portion 63A substantially protrudes from the first columnar portion 62A. Furthermore, when the first lead-out portion 63A and the first columnar portion 62A are made as separate molded parts, their materials may not be the same. The same applies to the second lead-out portion 63B and the second columnar portion 62B.

[0175] • The configuration of each lead-out portion is not limited to the examples of the above embodiments. For example, the outer edge of the first lead-out portion 63A may not be parallel to the outer edge of the first columnar portion 62A. The first lead-out portion 63A may not contact the surface of the outer surface of the inner pad portion P1 that is parallel to the first main surface 11A. In addition, the outer edge of the first lead-out portion 63A may not be parallel to the outer edge of the inner pad portion P1. The same applies to the second lead-out portion 63B and the outer pad portion P2.

[0176] • When viewed in the third positive direction Z1, the area surrounded by the outer edge of the first columnar portion 62A can be greater than 1.3 times the area surrounded by the outer edge of the first lead-out portion 63A. In this case, the first columnar wiring 61A has the first lead-out portion 63A, thereby achieving at least the effect described in (1-1). The same applies to the second lead-out portion 63B.

[0177] • The side 63AS of the first lead-out portion 63A may not contact the second insulating layer 32. For example, other components may be sandwiched between the first lead-out portion 63A and the second insulating layer 32. The same applies to the second lead-out portion 63B.

[0178] • The inductor component 10 may also be without external electrodes and solder resist 70. For example, the columnar wiring may be exposed from the first main surface 11A. This allows for a reduction in the size of the inductor component 10.

[0179] • In the manufacturing method of inductor component 10, the order of each process can be changed as long as inductor component 10 can be manufactured. For example, the solder resist forming process S21 can be performed after the second blank forming process S23.

[0180] • The material of the seed layer 93 is not limited to the examples of the above embodiments. For example, the seed layer 93 may be a single layer of copper, a single layer of silver, or may have multiple layers such as titanium and copper.

[0181] • The material of the seed layer 93 and the material of the protrusion 53 can also be different. For example, the seed layer 93 can be made of silver, and the inductor wiring 51 containing the protrusion 53 can be made of copper. This increases the etching speed when the inductor wiring 51 is stripped from the seed layer 93 by etching. The same applies to the substrate 99 used for manufacturing inductor components.

[0182] • In the adhesive layer forming process S12 to the solder resist forming process S21, inductor wiring 51 and the like can also be formed on both sides of the base substrate 91. At this time, when forming inductor wiring 51 and the like on the third negative direction Z2 side of the base substrate 91, each process can be performed as long as the third negative direction Z2 is the upward direction.

[0183] • The adhesive layer forming process S12 can also be omitted. The seed layer 93 can also be formed directly on the upper surface of the base substrate 91. That is, the substrate 99 used for manufacturing inductor components may not have an adhesive layer 92.

[0184] • In the first insulating layer forming process S14, a negative photosensitive resin may also be used as the material for the first insulating layer 31. In this case, by reducing the photocurability of the portion of the first insulating layer 31 removed by the insulating layer cutting process S19, that portion can be easily peeled off in the insulating layer cutting process S19.

[0185] • Depending on the configuration of the manufactured inductor component 10, one or more processes selected from the second insulating layer forming process S17, the columnar wiring forming process S18, the solder resist forming process S21, the second blank forming process S23, and the external electrode forming process S24 may be omitted.

[0186] • Alternatively, the second insulating layer forming process S17 can be omitted, and the columnar wiring forming process S18 can be performed instead. In this case, during the columnar wiring forming process S18, an auxiliary wall can also be formed on the outer surface of the inductor wiring 51 in the third positive direction Z1 side to form each columnar wiring.

[0187] • In the insulating layer cutting process S19, the method for removing a portion of the first insulating layer 31 is not limited to a laser-based method. For example, a portion of the first insulating layer 31 can also be removed by sandblasting. In this case, it is preferable that the second insulating layer 32 is thicker than the first insulating layer 31. Alternatively, it is preferable that the sandblasting resistance of the second insulating layer 32 is higher than that of the first insulating layer 31.

[0188] • In the seed layer removal process S22, the seed layer 93 can also be removed by etching.

[0189] • If the second blank forming process S23 is omitted, for example, an insulating layer may be formed on the lower surface of the protrusion 53, the first insulating layer 31, and the magnetic layer 20 formed by the first blank forming process S20.

[0190] • In the external electrode forming process S24, the method for forming each external electrode is not limited to the examples of the embodiments described above. For example, copper plating may not be performed.

[0191] • It can also be like Figure 31 as well as Figure 32 As shown in the example, a specific external electrode is wired to multiple inductors. Figure 31 The inductor component 210 shown has five external electrodes. Specifically, the inductor component 210 has a first external electrode 81A on the first negative direction X2 side and the second positive direction Y1 side of the first main surface 11A of the blank 11. The inductor component 210 has a second external electrode 81B on the first positive direction X1 side and the second positive direction Y1 side of the first main surface 11A. The inductor component 210 has a third external electrode 81C on the first negative direction X2 side and the second negative direction Y2 side of the first main surface 11A. The inductor component 210 has a fourth external electrode 81D on the first positive direction X1 side and the second negative direction Y2 side of the first main surface 11A. The inductor component 210 has a fifth external electrode 81E at a location approximately at the geometric center of the first main surface 11A.

[0192] like Figure 32As shown, in one example of the modified example, the inductor component 210 has four inductor wirings 51. Specifically, the inductor component 210 has a first inductor wiring 51A inside the blank 11, on the first negative direction X2 side and the second positive direction Y1 side. The inductor component 210 has a second inductor wiring 51B inside the blank 11, on the first positive direction X1 side and the second positive direction Y1 side. The inductor component 210 has a third inductor wiring 51C inside the blank 11, on the first negative direction X2 side and the second negative direction Y2 side. The inductor component 210 has a fourth inductor wiring 51D inside the blank 11, on the first positive direction X1 side and the second negative direction Y2 side.

[0193] In one example of this modification, specifically, the outer pad P2A of the first inductor wiring 51A is connected to the first external electrode 81A. The outer pad P2B of the second inductor wiring 51B is connected to the second external electrode 81B. The outer pad P2C of the third inductor wiring 51C is connected to the third external electrode 81C. The outer pad P2D of the fourth inductor wiring 51D is connected to the fourth external electrode 81D. Furthermore, the inner pad P1A of the first inductor wiring 51A, the inner pad P1B of the second inductor wiring 51B, the inner pad P1C of the third inductor wiring 51C, and the inner pad P1D of the fourth inductor wiring 51D are connected to the fifth external electrode 81E. Therefore, the fifth external electrode 81E, as one of a plurality of external electrodes, is connected to both the first end of the first inductor wiring 51A and the first end of the second inductor wiring 51B. Therefore, no potential difference is generated between the external electrodes connected to the wiring of each inductor. Electronic components with such a configuration are suitable, for example, as inductors used in multiphase DC / DC converters.

[0194] (A variation of the second implementation)

[0195] ·like Figure 33 As shown, in the direction orthogonal to the first main surface 11A, the size 153AH of the first protrusion 153A can also be smaller than the size 131H of the first insulating layer 131. In this case, the front end of the first protrusion 153A does not extend towards the third negative direction Z2 relative to the first insulating layer 131. Therefore, even if manufacturing errors occur, the front ends of each protrusion are less likely to extend in a direction parallel to the first main surface 11A. As a result, short circuits are prevented between the front end of the first protrusion 153A and other unwanted conductive parts. The same applies to the second protrusion 153B.

[0196] ·like Figure 33As shown, the inductor component 110 may also have an insulating coating CF that covers the side surface of the first inductor wiring 151A, the side surface of the first insulating layer 131 that does not contact the first protrusion 153A, the side surface of the first columnar wiring 161A, and the side surface of the second columnar wiring 161B. This improves the insulation between inductor wirings and between columnar wirings. The same applies to the second inductor wiring 151B.

[0197] • The size of the end face on the third negative direction Z2 side of each columnar wiring can also be smaller than the size of the face on the third positive direction Z1 side of the pad portion to which the columnar wiring is connected. In this case, when viewed in cross-section from a direction orthogonal to the first main surface 11A, the difference between the dimension P101AW of the first end pad portion P101A in the first pad portion PA and the dimension 161AW of the first columnar wiring 161A in a direction parallel to the first main surface 11A is preferably 20μm or less. Similarly, when viewed in cross-section from a direction orthogonal to the first main surface 11A, the difference between the dimension P102AW of the second end pad portion P102A in the first pad portion PA and the dimension 161BW of the second columnar wiring 161B is preferably 20μm or less in a direction parallel to the first main surface 11A.

[0198] Therefore, during the manufacturing process of the inductor component 110, even if there is a slight manufacturing error in the position of the first dry film resist DFR1 and the position of the second dry film resist DFR2, the columnar wiring can be converged within the range of the corresponding pad portion.

[0199] However, even if the difference mentioned above is greater than 20 μm, the effect described in (1-1) is at least achieved by having protrusions in each wiring body. The same applies to the second pad portion PB.

[0200] ·like Figure 33 As shown, the inductor component 110 may also be without external electrodes and solder resist 70. In this case, for example, it is sufficient for each columnar wiring to be exposed from the first main surface 11A. This allows for a reduction in the size of the inductor component 110. Furthermore, in this example, the surface on the third positive direction Z1 side of the columnar wiring functions as an external electrode.

[0201] • Alternatively, one or more processes selected from the first DFR forming process S115 and the second DFR forming process S117 may be omitted, and each inductor wiring and each column wiring may be formed by performing other processes. For example, instead of performing the second DFR forming process S117, an auxiliary wall may be formed on the upper surface of each inductor wiring, and then each column wiring may be formed by electroplating.

[0202] • The conductivity of the outer surface of the first protrusion 153A on the third negative direction Z2 side can also be lower than the conductivity of the first wiring body 152A. For example, the conductivity can be reduced simply by heat-treating the tip of the first protrusion 153A to oxidize it. This improves the insulation between the first inductor wiring 151A and the blank 11. The same applies to the second protrusion 153B.

[0203] • The outer surface of the first protrusion 153A on the third negative direction Z2 side may not contact the blank 11. For example, it may be as follows: Figure 34 As shown, the inductor component 110 includes a metal layer ML covering the outer surface of the first protrusion 153A on the third negative direction Z2 side. When viewed in the third positive direction Z1, it is preferable that the metal layer ML extends along the first protrusion 153A. For example, if nickel is chosen as the material of the metal layer ML, oxidation of the outer surface of the first protrusion 153A on the third negative direction Z2 side and deterioration of the outer surface of the first insulating layer 131 on the third negative direction Z2 side can be suppressed. Furthermore, instead of performing the seed layer removal process S122, the metal layer ML can be formed by removing the base substrate 91 and etching to cover the first protrusion 153A with a seed layer 93. The conductivity of the metal layer ML is preferably less than that of the first wiring body 152A. This improves the insulation between the first inductor wiring 151A and the blank 11. The second protrusion 153B is similar in these respects.

[0204] • It can also be like Figure 35 As shown, after the DFR removal process S119 and before the first blank formation process S120, a process is performed to cover the sides of each inductor wiring and each columnar wiring with an insulating coating CF. The insulating coating CF can be formed, for example, by chemical vapor deposition (CVD). This improves the insulation between inductor wirings and between columnar wirings.

[0205] <Postscript>

[0206] The following describes the technical concepts derived from the above-described implementation methods and their variations. [1]

[0208] An inductor component, comprising:

[0209] The blank contains magnetic material and has a planar main surface;

[0210] An insulating layer, located within the aforementioned blank body, extends in a plane parallel to the aforementioned main surface; and

[0211] The inductor wiring extends parallel to the main surface within the aforementioned blank body.

[0212] When the direction orthogonal to the aforementioned principal plane is designated as the positive direction, and the direction opposite to the aforementioned positive direction is designated as the negative direction,

[0213] The above inductor wiring includes:

[0214] The wiring body extends on the outer surface of the aforementioned positive-direction side of the aforementioned insulating layer; and

[0215] The protrusion protrudes from the outer surface of the wiring body on the negative direction side to the negative direction side.

[0216] The outer surface of the negative direction side of the above-mentioned wiring body is in contact with the outer surface of the positive direction side of the above-mentioned insulation layer.

[0217] When viewed in the aforementioned positive direction, the aforementioned protrusion is located within the area surrounded by the outer edge of the aforementioned wiring body and extends along the aforementioned wiring body.

[0218] When viewed in cross-section from a plane orthogonal to the main plane, the dimension of the protrusion in the direction parallel to the main plane is smaller than the dimension of the wiring body at the location where the protrusion is connected in the direction parallel to the main plane. [2]

[0220] According to the inductor components described in [1], wherein,

[0221] The aforementioned wiring body and the aforementioned protrusion are integrally molded. [3]

[0223] According to the inductor components described in [1] or [2], wherein,

[0224] When the outer surface of the blank, excluding the main surface and the surface opposite to the main surface, is defined as the side surface of the blank,

[0225] On the aforementioned side of the blank, the inductor wiring and the conductive object electrically connected to the inductor wiring are not exposed. [4]

[0227] According to any one of the inductor components described in [1] to [3], wherein,

[0228] The outer surface of the aforementioned protrusion on the negative side is in contact with the aforementioned blank. [5]

[0230] According to any one of the inductor components described in [1] to [4], wherein,

[0231] The conductivity of the outer surface of the aforementioned protrusion on the negative direction side is lower than the conductivity of the aforementioned wiring body. [6]

[0233] According to any one of the inductor components described in [1] to [3], wherein,

[0234] It also includes a metal layer that covers the outer surface of the aforementioned protrusion on the negative side.

[0235] When viewed in the aforementioned positive direction, the aforementioned metal layer extends along the aforementioned protrusion. [7]

[0237] According to the inductor components described in [6], wherein,

[0238] The conductivity of the aforementioned metal layer is lower than that of the aforementioned wiring body. [8]

[0240] According to any one of the inductor components described in [1] to [7], wherein,

[0241] When the outer surface of the aforementioned protrusion, excluding the outer surface on the negative direction side, is designated as a side surface...

[0242] The aforementioned side of the protrusion is in contact with the aforementioned insulating layer. [9]

[0244] According to the inductor components described in [8], wherein,

[0245] In a direction orthogonal to the main surface, the size of the protrusion is smaller than the size of the insulating layer.

[10]

[0247] According to any one of the inductor components described in [1] to [9], wherein,

[0248] It also has columnar wiring, which is connected to the outer surface of the positive side of the wiring body and extends in the blank body in a direction that intersects with the main surface.

[11]

[0250] According to the inductor components described in

[10] , wherein,

[0251] The aforementioned columnar wiring contacts the outer surface of the aforementioned positive direction side of the aforementioned wiring body.

[12]

[0253] According to the inductor components described in

[11] , wherein,

[0254] The aforementioned wiring body includes a wiring section extending parallel to the aforementioned main surface, and a pair of pads connected to each end of the aforementioned wiring section.

[0255] One end of the aforementioned columnar wiring contacts the surface of the aforementioned pad portion that is parallel to the aforementioned main surface.

[0256] When viewed in cross-section from a direction orthogonal to the main surface, the difference between the size of the pad portion and the size of the columnar wiring is less than 20 μm in a direction parallel to the main surface.

[13]

[0258] According to any one of the inductor components described in

[10] to

[12] , wherein,

[0259] The outer surface of the aforementioned wiring body, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the wiring body.

[0260] The outer surface of the columnar wiring described above, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the columnar wiring.

[0261] When the outer surface of the aforementioned insulating layer, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the insulating layer.

[0262] It also has an insulating coating that covers the aforementioned side of the wiring body, the aforementioned side of the columnar wiring, and the aforementioned side of the insulating layer.

[14]

[0264] According to any one of the inductor components described in [1] to

[13] , wherein,

[0265] When the above inductor wiring is set as the first inductor wiring...

[0266] It also includes a second inductor wiring, which is located on the same layer as the first inductor wiring in a direction orthogonal to the main surface and extends parallel to the main surface.

[15]

[0268] According to the inductor components described in

[14] , wherein,

[0269] It also includes multiple external electrodes that cover a portion of the outer surface of the aforementioned blank.

[0270] One of the aforementioned external electrodes is connected to both the first end of the first inductor wiring and the first end of the second inductor wiring.

[16]

[0272] A method for manufacturing an inductor component, wherein:

[0273] The seed layer formation process involves forming a conductive seed layer on the main surface of the base substrate;

[0274] In the insulating layer forming process, an insulating layer with an opening having a specified wiring pattern is formed on the seed layer.

[0275] In the resin wall forming process, a resin wall is formed on the insulating layer along the outer edge of the opening;

[0276] In the inductor wiring forming process, by electroplating with power supplied to the seed layer, a wiring body is formed in the space surrounded by the resin wall, and a protrusion that protrudes from the wiring body and extends along the wiring body in the opening is integrally formed.

[0277] In the blank forming process, after the aforementioned inductor wiring forming process, a magnetic layer containing magnetic material is formed around the wiring body and the aforementioned protrusion; and

[0278] The seed layer removal process is performed after the above-mentioned blank forming process to remove the seed layer.

[17]

[0280] A substrate for manufacturing an inductor component, comprising:

[0281] Base substrate;

[0282] The seed layer, located on the main surface of the aforementioned base substrate, is conductive;

[0283] An insulating layer, located on the seed layer, is parallel to the main surface of the base substrate; and

[0284] The inductor wiring is located on the aforementioned insulating layer and extends parallel to the aforementioned main surface of the aforementioned base substrate.

[0285] When one direction orthogonal to the main surface of the base substrate is designated as the positive direction, and the direction opposite to the positive direction is designated as the negative direction,

[0286] The above inductor wiring includes:

[0287] The wiring body extends on the outer surface of the aforementioned positive-direction side of the aforementioned insulating layer; and

[0288] The protrusion protrudes from the outer surface of the wiring body on the negative direction side to the negative direction side.

[0289] When viewed in the aforementioned positive direction, the aforementioned protrusion extends along the aforementioned wiring body.

[0290] The surface on the negative side of the aforementioned protrusion is in contact with the aforementioned seed layer.

[18]

[0292] According to the substrate for manufacturing inductor components described in

[17] , wherein,

[0293] The material of the seed layer is different from the material of the protrusion.

[19]

[0295] According to the substrate for manufacturing inductor components described in

[17] or

[18] , wherein,

[0296] It also includes an adhesive layer sandwiched between the base substrate and the seed layer.

[0297] The adhesive layer described above is made of an adhesive resin.

[0298] Explanation of reference numerals in the attached figures

[0299] 10…Inductor component; 11…Burnt body; 11A…First main surface; 20…Magnetic layer; 31…First insulating layer; 41…Resin wall; 51…Inductor wiring; 52…Wiring body; L…Wiring section; P…Pad section; 53…Protrusion; 99…Substrate for manufacturing inductor components; 91A…Main surface; 92…Adhesive layer; 93…Seed layer; 94…First opening; 95…Second opening; 81A…First external electrode; 81B…Second external electrode; 81C…Third external electrode; 81D…Fourth external electrode 81E… Fifth external electrode; 110… Inductor component; 131… First insulating layer; 151A… First inductor wiring; 153A… First protrusion; 151B… Second inductor wiring; 152B… Second wiring body; 153B… Second protrusion; 161A… First columnar wiring; 162A… First columnar portion; 163A… First lead-out portion; 161B… Second columnar wiring; 162B… Second columnar portion; 163B… Second lead-out portion; 199… Substrate for manufacturing inductor components.

Claims

1. An inductor component, wherein, have: The blank contains magnetic material and has a planar main surface; An insulating layer, located within the aforementioned blank body, extends in a plane parallel to the aforementioned main surface; and The inductor wiring extends parallel to the main surface within the aforementioned blank body. When the direction orthogonal to the aforementioned principal plane is designated as the positive direction, and the direction opposite to the aforementioned positive direction is designated as the negative direction, The above inductor wiring includes: The wiring body extends on the outer surface of the aforementioned positive-direction side of the aforementioned insulating layer; and The protrusion protrudes from the outer surface of the wiring body on the negative direction side to the negative direction side. The outer surface of the negative direction side of the above-mentioned wiring body is in contact with the outer surface of the positive direction side of the above-mentioned insulation layer. When viewed in the aforementioned positive direction, the aforementioned protrusion is located within the area surrounded by the outer edge of the aforementioned wiring body and extends along the aforementioned wiring body. When viewed in cross-section from a plane orthogonal to the main plane, the dimension of the protrusion in the direction parallel to the main plane is smaller than the dimension of the wiring body at the location where the protrusion is connected in the direction parallel to the main plane.

2. The inductor component according to claim 1, wherein, The aforementioned wiring body and the aforementioned protrusion are integrally molded.

3. The inductor component according to claim 1 or 2, wherein, When the outer surface of the blank, excluding the main surface and the surface opposite to the main surface, is defined as the side surface of the blank, On the aforementioned side of the blank, the inductor wiring and the conductive object electrically connected to the inductor wiring are not exposed.

4. The inductor component according to any one of claims 1 to 3, wherein, The outer surface of the aforementioned protrusion on the negative side is in contact with the aforementioned blank.

5. The inductor component according to any one of claims 1 to 4, wherein, The conductivity of the outer surface of the aforementioned protrusion on the negative direction side is lower than the conductivity of the aforementioned wiring body.

6. The inductor component according to any one of claims 1 to 3, wherein, It also includes a metal layer that covers the outer surface of the aforementioned protrusion on the negative side. When viewed in the aforementioned positive direction, the aforementioned metal layer extends along the aforementioned protrusion.

7. The inductor component according to claim 6, wherein, The conductivity of the aforementioned metal layer is lower than that of the aforementioned wiring body.

8. The inductor component according to any one of claims 1 to 7, wherein, When the outer surface of the aforementioned protrusion, excluding the outer surface on the negative direction side, is designated as a side surface... The aforementioned side of the protrusion is in contact with the aforementioned insulating layer.

9. The inductor component according to claim 8, wherein, In a direction orthogonal to the main surface, the size of the protrusion is smaller than the size of the insulating layer.

10. The inductor component according to any one of claims 1 to 9, wherein, It also has columnar wiring, which is connected to the outer surface of the positive side of the wiring body and extends in the blank body in a direction that intersects with the main surface.

11. The inductor component according to claim 10, wherein, The aforementioned columnar wiring contacts the outer surface of the aforementioned positive direction side of the aforementioned wiring body.

12. The inductor component according to claim 11, wherein, The aforementioned wiring body includes a wiring section extending parallel to the aforementioned main surface, and a pair of pads connected to each end of the aforementioned wiring section. One end of the aforementioned columnar wiring contacts the surface of the aforementioned pad portion that is parallel to the aforementioned main surface. When viewed in cross-section from a direction orthogonal to the main surface, the difference between the size of the pad portion and the size of the columnar wiring is less than 20 μm in a direction parallel to the main surface.

13. The inductor component according to any one of claims 10 to 12, wherein, The outer surface of the aforementioned wiring body, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the wiring body. The outer surface of the aforementioned columnar wiring, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is defined as the side surface of the columnar wiring. When the outer surface of the aforementioned insulating layer, excluding the outer surface on the positive direction side and the outer surface on the negative direction side, is designated as the side surface of the insulating layer. It also has an insulating coating that covers the aforementioned side of the wiring body, the aforementioned side of the columnar wiring, and the aforementioned side of the insulating layer.

14. The inductor component according to any one of claims 1 to 13, wherein, When the above inductor wiring is set as the first inductor wiring... It also includes a second inductor wiring, which is located on the same layer as the first inductor wiring in a direction orthogonal to the main surface and extends parallel to the main surface.

15. The inductor component according to claim 14, wherein, It also includes multiple external electrodes that cover a portion of the outer surface of the aforementioned blank. One of the aforementioned external electrodes is connected to both the first end of the first inductor wiring and the first end of the second inductor wiring.

16. A method for manufacturing an inductor component, wherein, have: The seed layer formation process involves forming a conductive seed layer on the main surface of the base substrate; In the insulating layer forming process, an insulating layer with an opening having a specified wiring pattern is formed on the seed layer. In the resin wall forming process, a resin wall is formed on the insulating layer along the outer edge of the opening; In the inductor wiring forming process, by electroplating with power supplied to the seed layer, a wiring body is formed in the space surrounded by the resin wall, and a protrusion that protrudes from the wiring body and extends along the wiring body in the opening is integrally formed. In the blank forming process, after the aforementioned inductor wiring forming process, a magnetic layer containing magnetic material is formed around the wiring body and the aforementioned protrusion; and The seed layer removal process is performed after the above-mentioned blank forming process to remove the seed layer.

17. A substrate for manufacturing an inductor component, wherein, have: Base substrate; The seed layer, located on the main surface of the aforementioned base substrate, is conductive; An insulating layer, located on the seed layer, is parallel to the main surface of the base substrate; and The inductor wiring is located on the aforementioned insulating layer and extends parallel to the aforementioned main surface of the aforementioned base substrate. When one direction orthogonal to the main surface of the base substrate is designated as the positive direction, and the direction opposite to the positive direction is designated as the negative direction, The above inductor wiring includes: The wiring body extends on the outer surface of the aforementioned positive-direction side of the aforementioned insulating layer; and The protrusion protrudes from the outer surface of the wiring body on the negative direction side to the negative direction side. When viewed in the aforementioned positive direction, the aforementioned protrusion extends along the aforementioned wiring body. The surface on the negative side of the aforementioned protrusion is in contact with the aforementioned seed layer.

18. The substrate for manufacturing an inductor component according to claim 17, wherein, The material of the seed layer is different from the material of the protrusion.

19. The substrate for manufacturing an inductor component according to claim 17 or 18, wherein, It also includes an adhesive layer sandwiched between the base substrate and the seed layer. The adhesive layer described above is made of an adhesive resin.

Images