Apparatus, system and method for generating ionizing gas discharges to treat media

Abstract

An apparatus includes a processing chamber configured to contain a growth medium, at least one reservoir configured to contain at least one fluid, and a plasma reactor. The plasma reactor includes a plurality of electrodes including a first electrode and a second electrode, and a reaction zone is disposed between the first electrode and the second electrode. The apparatus also includes an ignition unit electrically connected to at least one of the plurality of electrodes, an injector in fluid communication with the at least one reservoir, and a pressure regulator configured to transfer the fluid to the injector. Various other apparatuses, systems, and methods are also disclosed.

Description

[0001] Cross-references to related applications

[0002] This PCT international application claims the benefit / priority of U.S. Patent Application No. 18 / 222,027, 18 / 222,053, 18 / 222,080, 18 / 222,103, 18 / 222,135, 18 / 222,176, 18 / 222,220, and 18 / 222,252, filed on July 14, 2023, the disclosures of each of which are incorporated herein by reference in their entirety. Technical Field

[0003] This invention relates generally to the field of nonthermal plasma (NTP) technology. Specifically, the invention relates to apparatus, systems, and methods for treating target media via discharge. A range of media are suitable targets for the apparatus, systems, and methods of use of the invention, and may include, but are not limited to, growth media for plants, seed treatment agents, nutrient components for animal feed, liquids for beverage formulations, personal health formulation components, and surface treatment agents for equipment and industrial applications. Background Technology

[0004] This invention can be used in various environments to achieve specific product and performance results and improvements. In agriculture, plants are frequently subjected to a variety of stresses, such as, but not limited to, water shortage, waterlogging, toxicity, high salinity, and extreme temperatures. These stresses can affect plant health and may reduce crop yields. To promote seed germination and growth in constantly changing environments, techniques such as chemical, physical, and biological treatments are being developed. However, existing treatments may lead to changes in plants, such as, but not limited to, changes in seed morphology, gene expression, or protein levels. Crops grown with such treatments may have potential toxicity to humans and / or the environment. What is needed is a method for generating a stable, consistent growth medium, including fertilizer solutions that can be used with irrigation fertilization, irrigation, and broadcasting treatments, providing readily available nutrients essential for promoting plant growth, including nitrogen and oxygen.

[0005] This invention is also applicable beyond agriculture and can be used in other business sectors. By way of example, and not limitation, nitrogen in various chemical states is essential in beverage production, including certain systems for manufacturing soft drinks, fermented beverages, and distilled beverages and mixtures. In another example, in the field of human health, nitric oxide has been shown to enhance the performance of a range of skincare products, and the number of nitric oxide-containing products used for human digestive health is rapidly increasing. What is needed is a cost-effective way to provide manufacturers and producers involved in a range of applications with equipment and methods capable of handling the media used in these applications. Summary of the Invention

[0006] The disclosed invention provides an apparatus, a system, and a method for using the apparatus within a system to ionize a gas for processing a medium as described herein. The invention differs from prior art and systems in that it can be configured modularly, allowing output to be expanded by connecting multiple units in parallel, thus improving efficiency compared to prior disclosures. The specific system offers flexibility regarding how fluid inputs are combined; unlike prior art systems where fluid inputs including gas and water are fixed, this specific system can use a variety of input configurations. Furthermore, the properties of the prior art address challenges associated with power inputs, including the ability to accept multiple voltage types, such as AC or DC.

[0007] In one aspect, an apparatus for treating a medium via discharge is described. The apparatus includes: a treatment chamber configured to contain a medium; at least one reservoir configured to contain at least one fluid; a plasma reactor including at least one pair of electrodes comprising a first electrode and a second electrode, wherein the electrodes are configured to generate a discharge according to the at least one fluid; and a reaction zone disposed between the first electrode and the second electrode, wherein the reaction zone is configured to allow the discharge to interact with the medium; an ignition unit electrically connected to at least one of the at least one pair of electrodes, wherein the ignition unit is configured to supply a voltage to the at least one electrode; an injector fluidly connected to the at least one reservoir, wherein the injector is configured to deliver the at least one fluid through the reaction zone; and a pressure regulator configured to transfer the at least one fluid to the injector.

[0008] In another aspect, a method for treating a growing medium used in agriculture via discharge is described. The method includes: transferring at least one fluid contained in at least one reservoir to an injector via an atmospheric pressure system; conveying the at least one fluid through a reaction zone of a plasma reactor via the injector, which is fluidly connected to the at least one reservoir; the plasma reactor including at least one pair of electrodes, comprising a first electrode and a second electrode, and the reaction zone being disposed between the first electrode and the second electrode; supplying a voltage to the at least one electrode by an ignition unit electrically connected to the at least one electrode of the at least one pair of electrodes; generating a discharge from the at least one pair of electrodes according to the at least one fluid; and enabling the discharge to interact with the growing medium contained in a treatment chamber via the reaction zone.

[0009] In another aspect, an alternative embodiment of an apparatus for treating a medium via discharge is described. The apparatus includes: a treatment chamber, at least one reservoir, a plasma reactor, an ejector, a pressure regulating system, and an ignition unit comprising: a voltage source configured to provide a voltage; a converter configured to convert the voltage from a direct current (DC) voltage input to an alternating current (AC) voltage output; and an electrical connection interface configured to electrically connect the converter to at least one of a pair of electrodes disposed in the plasma reactor, wherein the pair of electrodes includes a first electrode and a second electrode; a feedback mechanism including a sensor configured to detect reaction data; and a control module communicatively connected to the feedback mechanism, wherein the control module is configured to initiate the generation of a discharge in a reaction zone disposed between the first electrode and the second electrode based on the AC voltage output, wherein the reaction zone is configured to allow the discharge to interact with the medium contained in the treatment chamber.

[0010] In another aspect, a method for treating a medium via discharge is described. The method includes: providing a voltage from a voltage source; converting the voltage from a direct current (DC) voltage input to an alternating current (AC) output by a converter; electrically connecting the converter to at least one of a pair of electrodes disposed in the plasma reactor via an electrical connection interface, wherein the pair of electrodes includes a first electrode and a second electrode; inducing a discharge in a reaction zone disposed between the first electrode and the second electrode by a control module; enabling the discharge to interact with the growth medium contained in the treatment chamber via the reaction zone; and detecting reaction data using a sensor via a feedback mechanism.

[0011] Furthermore, in one aspect, an improved injection apparatus for a plasma reactor is disclosed. The apparatus includes: at least one reservoir, a plasma reactor, an ignition unit, and an injector, wherein the injector is configured to deliver at least one fluid from the at least one reservoir through the reaction zone of the plasma reactor, and the injector includes at least one fluid outlet, wherein the at least one fluid outlet is configured to output the at least one fluid to the plasma reactor in a conical distribution, wherein the conical distribution includes a distribution angle and droplets of the at least one fluid.

[0012] In another aspect, a vapor injection system includes: a fluid inlet in fluid communication with a fluid reservoir, wherein the fluid inlet is configured to deliver fluid; a voltage regulator connected to a power source, wherein the voltage regulator is configured to receive electrical energy from the power source and convert the electrical energy, wherein converting the electrical energy includes: adjusting the voltage of the electrical energy and modifying the frequency of the voltage; and a crystal compressor connected to the voltage regulator and the fluid inlet, wherein the crystal compressor is configured to: receive the converted electrical energy from an iron core coil; receive the fluid from the fluid inlet; generate vapor based on the converted electrical energy and the fluid; and output the vapor using a vapor outlet.

[0013] In another aspect, a method for using a vapor injection system includes receiving fluid from a fluid reservoir via a fluid inlet; receiving electrical energy from a voltage regulator connected to a power source. The method further includes converting the electrical energy by the voltage regulator, wherein converting the electrical energy includes adjusting the voltage of the electrical energy and modifying the frequency of the electrical energy; generating vapor by a crystal compressor based on the converted electrical energy and the fluid; and outputting the vapor using a vapor outlet.

[0014] In another aspect, a low-pressure injection system for multiple fluids is provided. The system includes at least one first fluid inlet and at least one second fluid inlet, the at least one first fluid inlet configured to receive a first fluid from a first fluid reservoir including the first fluid, and the at least one second fluid inlet configured to receive a second fluid from a second fluid reservoir including the second fluid. The system also includes a low-pressure compressor and at least one ejector, the low-pressure compressor configured to pressurize the second fluid received from the second fluid reservoir, and the at least one ejector configured to disperse the combination of the first and second fluids.

[0015] In another aspect, a method of using a low-pressure injection system for multiple fluids is provided. The method includes receiving a first fluid from a first fluid reservoir comprising the first fluid via at least one first fluid inlet, and receiving a second fluid from a second fluid reservoir comprising the second fluid via at least one second fluid inlet. The method further includes supplying pressure to the second fluid received from the second fluid reservoir by a low-pressure compressor, and dispersing the combination of the first and second fluids by at least one injector.

[0016] In one aspect, an apparatus for a modular plasma reactor is disclosed. The apparatus includes a modular plasma reactor comprising a housing; a modular ignition unit detachably connected to the modular plasma reactor; a modular injector detachably connected to the modular plasma reactor; at least one modular reservoir detachably connected to the modular injector; and a controller communicatively connected to one or more of the modular ignition unit and the modular injector.

[0017] In another aspect, a method of using a modular plasma reactor is disclosed. The method includes: detachably connecting a modular ignition unit to the modular plasma reactor, wherein the modular plasma reactor includes a housing; detachably connecting a modular injector to the modular plasma reactor; detachably connecting at least one modular reservoir to the modular injector; and communicatively connecting a controller to one or more of the modular ignition unit and the modular injector.

[0018] In one aspect, an apparatus for processing a substrate such as a food substance is disclosed. The apparatus may include a water supply tank connected to both a reaction chamber and a control module that generates a control signal. The water supply tank has a water level line and a reservoir filled with water up to the water level line. The water supply tank can replenish water when water below the water level line is detected to be depleted. That is, more specifically, when the water level drops below the water level line, the water supply tank can automatically replenish water by drawing additional water from a water source (such as a tank, reservoir, or other water container) fluidly connected to the water supply tank. The reaction chamber is connected to the water supply tank and includes a pair of electrodes having a first electrode and a second electrode positioned opposite the first electrode, and a reaction zone defined between the first and second electrodes. The reaction zone can at least temporarily hold the substrate. The control module is connected to at least the reaction chamber and can generate at least one control signal. The apparatus may also include an injector connecting the water supply tank to the reaction chamber. The injector can generate a dispersion of fine water droplets from water drawn from the reservoir in response to receiving the control signal. Additionally, the device may include a platform configured to support at least one reaction chamber and placed on a flat surface.

[0019] On another front, a method for generating plasma for treating a substrate within a plasma reactor is disclosed. The method may include providing a voltage from a voltage source and converting the voltage from a direct current (DC) voltage input to an alternating current (AC) output by a converter. The method may also include connecting the converter to at least one of a pair of electrodes disposed in the plasma reactor via an electrical connection interface, wherein the pair of electrodes includes a reaction zone defined between a first electrode and a second electrode positioned opposite the first electrode; dispersing a plurality of water droplets drawn from a reservoir in a water tank fluidly connected to the plasma reactor into the reaction zone, wherein the reservoir stores a certain amount of water. Additionally, the method may include flowing a gas mixture into the plasma reactor, wherein at least some of the water droplets are configured to be suspended in the gas mixture and accordingly generate a mist; igniting the plasma by generating a discharge through the mist from the first electrode to the second electrode in the reaction zone. Furthermore, the method may include treating the substrate by exposing it to plasma for a defined duration, and automatically replenishing the water level in the reservoir of the water tank by drawing additional water from a water source fluidly connected to the water tank when the water level drops below a defined set point.

[0020] In one aspect, the invention is described for generating fertilizer blends for use as growth media. The fertilizer blends comprise a reactive mixture containing reactive oxygen species and reactive nitrogen species. The fertilizer blends also include a marine brine solution of a filtered marine blend, wherein the marine brine solution further comprises magnesium, sulfur, potassium, and calcium.

[0021] In another aspect, a method for manufacturing a fertilizer blend for use as a growth medium is described. The method includes forming a reactive mixture having reactive oxygen and nitrogen substances; filtering the marine blend to produce a marine brine solution, wherein the marine brine solution includes magnesium, sulfur, potassium, and calcium; and combining the reactive mixture and the marine brine solution to produce the fertilizer blend.

[0022] In another aspect, a method for using a fertilizer blend generated using the system of the present invention is disclosed. The method includes watering the fertilizer blend over plants, wherein the fertilizer blend comprises a reactive mixture having reactive oxygen and reactive nitrogen substances and a marine brine solution having a filtered marine blend, wherein the marine brine solution further comprises magnesium, sulfur, potassium, and calcium.

[0023] These and other aspects and features of the invention will become apparent to those skilled in the art after reading the following description of specific non-limiting embodiments of the invention in conjunction with the accompanying drawings. Attached Figure Description

[0024] For the purpose of illustrating the invention, the accompanying drawings show aspects of one or more embodiments of the invention. However, it should be understood that the invention is not limited to the exact arrangements and apparatus shown in the drawings, wherein:

[0025] Figure 1 This is an exemplary embodiment of an apparatus for treating a growth medium via discharge.

[0026] Figure 2 This is an exemplary implementation of a plasma reactor assembly.

[0027] Figure 3 This is an exemplary embodiment of an injector with a flow adjustment component.

[0028] Figure 4 This is an exemplary implementation of a piezoelectric steam ejector.

[0029] Figure 5 This is an exemplary embodiment of a device with an external ejector for treating a growth medium via electrical discharge.

[0030] Figure 6 This is an exemplary embodiment of a method for treating a growth medium via discharge.

[0031] Figure 7 This is an exemplary implementation of a segment of the catheter.

[0032] Figure 8 This is an exemplary implementation of the ignition unit.

[0033] Figure 9 This is a block diagram of an exemplary embodiment of a machine learning module according to one or more embodiments of the present disclosure.

[0034] Figure 10 This is an exemplary embodiment of a method for treating a growth medium via discharge.

[0035] Figures 11A to 11C This is an exemplary implementation of an injector used as part of an improved injection system for a plasma reactor.

[0036] Figure 12 This is an exemplary implementation of a steam injection system for a plasma reactor.

[0037] Figure 13 This is an exemplary implementation of a plasma reactor assembly.

[0038] Figure 14 This is an exemplary implementation of an internal steam injection system.

[0039] Figure 15This is an exemplary implementation of an externally mounted steam injection system.

[0040] Figure 16 This is an exemplary depiction of a crystal compressor.

[0041] Figure 17 This is an exemplary implementation of a method for using a vapor injection system.

[0042] Figure 18 This is an exemplary implementation of a low-pressure injection system for multiple fluids.

[0043] Figure 19 An exemplary implementation of a low-pressure injection system for a variety of fluids is illustrated.

[0044] Figure 20 This is an exemplary implementation of an internal low-pressure injection system.

[0045] Figure 21 This is an exemplary implementation of an externally mounted low-pressure injection system.

[0046] Figure 22 This is an exemplary embodiment of a method for using a low-pressure injection system for multiple fluids.

[0047] Figure 23 This is a block diagram of an exemplary embodiment of a device for a modular plasma reactor.

[0048] Figure 24 This is a flowchart of an exemplary method of use for a modular plasma reactor.

[0049] Figure 25 This is an exemplary embodiment of a device including a reaction chamber with automatic water replenishment for treating a substrate.

[0050] Figure 26 This is an exemplary embodiment of a method for treating a growth medium via discharge.

[0051] Figure 27 This is an exemplary embodiment of a fertilizer blend used as a growth medium.

[0052] Figure 28 This is an exemplary embodiment of a method for manufacturing fertilizer blends for use as growth media.

[0053] Figure 29 It is a block diagram of a computational system that can be used to implement any one or more methods and any one or more parts thereof disclosed herein.

[0054] The accompanying drawings are not necessarily drawn to scale and may be shown using dashed lines, diagrams, and partial views. In some cases, details that are unnecessary for understanding the implementation scheme or that make other details difficult to understand may have been omitted. Detailed Implementation

[0055] Specifically, aspects of this disclosure relate to apparatus and methods for treating a medium via discharge. In one embodiment, the apparatus includes a plasma reactor comprising at least a pair of electrodes, the pair including a first electrode and a second electrode and configured to generate a discharge. The plasma reactor also includes a reaction zone disposed between the first and second electrodes, wherein the reaction zone is configured to enable interaction between the discharge and the growth medium contained in a treatment chamber.

[0056] Various aspects of this disclosure can be used to generate reactive oxygen species and reactive nitrogen species (RONS) and to alter solution properties such as pH, conductivity, and redox potential. These aspects can also be used to influence the germination rate of growth media (e.g., seeds), promote plant growth, and increase agricultural yields. This is at least in part because the device is configured to expose the growth medium to non-thermal plasma (NTP) using a high-energy ignition system. The device can generate high-voltage NTP using air, water, and an electrical load without any harmful emissions.

[0057] Various aspects of this disclosure can be used to monitor discharge and / or growth media and provide necessary information to users of the device. This is at least in part because the device includes an ignition unit with a feedback mechanism configured to detect reaction data. In one embodiment, the reaction data may include multiple discharge parameters, fluid parameters, growth medium parameters, etc.

[0058] The aspects of this disclosure can be used to optimize the processing of the growth medium to accommodate variations in voltage, fluid, and / or other factors that may affect the discharge. This is at least in part because the apparatus includes an ignition unit having a control module communicatively connected to a feedback mechanism, wherein the control module is configured to regulate discharge generation in the reaction zone. The control module can adjust at least one processing parameter of the apparatus based on reaction data detected by the feedback mechanism during the interaction between the discharge and the growth medium contained in the processing chamber.

[0059] Various aspects of this disclosure can be used to monitor discharge and / or growth media and provide necessary information to users of the device. This is at least in part because the device includes an ignition unit with a feedback mechanism configured to detect reaction data. In one embodiment, the reaction data may include multiple discharge parameters, fluid parameters, growth medium parameters, etc.

[0060] The aspects of this disclosure can be used to optimize the processing of the growth medium to accommodate variations in voltage, fluid, and / or other factors that may affect the discharge. This is at least in part because the apparatus includes an ignition unit having a control module communicatively connected to a feedback mechanism, wherein the control module is configured to regulate discharge generation in the reaction zone. The control module can adjust at least one processing parameter of the apparatus based on reaction data detected by the feedback mechanism during the interaction between the discharge and the growth medium contained in the processing chamber.

[0061] Various aspects of this disclosure allow for the handling of growth media at low temperatures without damaging the growth media. Exemplary embodiments illustrating aspects of this disclosure are described below in the context of several specific examples.

[0062] Various aspects of this disclosure also relate to a low-pressure injection system for multiple fluids and a method of using the same. In one embodiment, the system includes at least one injector configured to disperse a mixture of a first fluid and a second fluid. Various aspects of this disclosure can be used to generate fine fluid droplets, which allows the second fluid to be ionized and transferred into the generated fine fluid droplets. Exemplary embodiments illustrating aspects of this disclosure are described below in the context of several specific examples.

[0063] This disclosure relates to an apparatus for a modular plasma reactor and a method of using the same. The apparatus includes a modular plasma reactor comprising a housing; a modular ignition unit detachably connected to the modular plasma reactor; a modular injector detachably connected to the modular plasma reactor; at least one modular reservoir detachably connected to the modular injector; and a controller communicatively connected to one or more of the modular ignition unit and the modular injector.

[0064] Various aspects of this disclosure allow for the handling of growth media at cryogenic temperatures without damaging the growth media. In some embodiments, various aspects of this disclosure also allow a controller to detect the connection between the plasma reactor housing and one or more of the ignition unit, injector, and pressure regulator, and to control the power supplied to one or more of the ignition unit, injector, and pressure regulator. Exemplary embodiments illustrating various aspects of this disclosure are described below in the context of several specific examples.

[0065] Various aspects of this disclosure can be used to monitor discharge and / or growth media and provide necessary information to users of the device. This is at least in part because the device includes an ignition unit with a feedback mechanism configured to detect reaction data. In one embodiment, the reaction data may include multiple discharge parameters, fluid parameters, growth medium parameters, etc.

[0066] The aspects of this disclosure can be used to optimize the processing of the growth medium to accommodate variations in voltage, fluid, and / or other factors that may affect the discharge. This is at least in part because the apparatus includes an ignition unit having a control module communicatively connected to a feedback mechanism, wherein the control module is configured to regulate discharge generation in the reaction zone. The control module can adjust at least one processing parameter of the apparatus based on reaction data detected by the feedback mechanism during the interaction between the discharge and the growth medium contained in the processing chamber.

[0067] The aspects of this disclosure can be used to treat growth media using combinations of modified seawater and reactive mixtures. The aspects of this disclosure can further allow for the prevention of diseases that may be prevalent in a variety of growth media.

[0068] Various aspects of this disclosure can be used to generate reactive oxygen species and reactive nitrogen species (RONS) and to alter solution properties such as pH, conductivity, and redox potential. These aspects can also be used to influence the germination rate of growth media (e.g., seeds), promote plant growth, and increase agricultural yields. This is at least in part because the device is configured to expose the growth medium to non-thermal plasma (NTP) using a high-energy ignition system. The device can generate high-voltage NTP using air, water, and an electrical load without any harmful emissions.

[0069] Various aspects of this disclosure allow for the handling of growth media at low temperatures without damaging the growth media. Exemplary embodiments illustrating aspects of this disclosure are described below in the context of several specific examples.

[0070] Now for reference Figure 1This illustrates an exemplary embodiment of an apparatus 100 for treating growth medium 104 via electrical discharge. As used in this disclosure, a "growth medium" is a substance or material that provides the necessary nutrients and environmental conditions for the growth and proliferation of microorganisms, cells, and tissues. In one embodiment, one or more seeds may be placed in growth medium 104. For the purposes of this disclosure, a "seed" is a mature fertilized ovule of a flowering plant (i.e., angiosperm) containing an embryo within a protective shell. Seeds serve as a primary means of reproduction for many plant species, enabling them to disperse and establish new plants. In some embodiments, seeds may include, but are not limited to, cereal seeds (e.g., wheat, rice, corn, barley, oats, millet, etc.), legume seeds (e.g., soybeans, peas, broad beans, lentils, chickpeas, peanuts, etc.), oilseed seeds (e.g., sunflower, rapeseed, flaxseed, sesame, safflower, etc.), vegetable seeds (e.g., tomatoes, peppers, cucumbers, eggplants, lettuce, spinach, etc.), and fruit seeds (e.g., watermelons, melons, apples, citrus, etc.). In this embodiment, the growth medium 104 may comprise a nutrient-rich environment that provides the necessary conditions for seed germination and growth. In some cases, the growth medium may provide the environmental factors required for seed germination and development into a healthy plant, such as, but not limited to, temperature, pH level, and oxygen. In a non-limiting example, the growth medium 104 may comprise soil, which may include a complex mixture of mineral particles, organic matter, water, air, living organisms, etc. In another non-limiting example, the growth medium 104 may comprise a hydroponic mixture or a specially formulated medium designed for seed germination and plant growth.

[0071] Continue to refer to Figure 1 The apparatus 100 includes a processing chamber 108 configured to contain a growth medium 104. As used in this disclosure, a "processing chamber" is a controlled space designed to hold a particular material, substance, or object and subject it to a particular treatment. In one embodiment, the processing chamber 108 may be configured as an open system; for example, but not limited to, the processing chamber 108 may include an open container. In another embodiment, the processing chamber 108 may be configured as a closed system; for example, but not limited to, the processing chamber 108 may be a closed container with an airtight seal. In some embodiments, the processing chamber 108 may be designed to provide easy access to the growth medium 104 being processed. In a non-limiting example, the processing chamber 108 may include a removable or hinged door or port for loading and / or unloading the growth medium 104. In another non-limiting example, the processing chamber 108 may include one or more windows, with or without covers, for visual inspection or sampling during the processing.

[0072] Continue to refer to Figure 1The apparatus 100 includes at least one reservoir 112. As used in this disclosure, a “reservoir” is a container or storage chamber designed to hold at least one fluid used in the processing. In a non-limiting example, the reservoir 112 is configured to contain at least one fluid. As used in this disclosure, a “fluid” is defined as a gas or a liquid. The reservoir can provide a consistent and controlled supply of at least one fluid for processing the growth medium 104, as described in further detail below. In one embodiment, the fluid may include a substance capable of generating a discharge. In some cases, at least one fluid may include a liquid; for example, but not limited to, at least one fluid may include water, an organic solvent, an electrolyte solution, etc. In other cases, at least one fluid may include one or more gases; for example, but not limited to, at least one fluid may include an inert gas (e.g., nitrogen, argon, helium, neon, etc.), oxygen, carbon dioxide, air, a reactive gas (e.g., hydrogen, ammonia, sulfur hexafluoride, etc.), etc. Additionally or alternatively, the apparatus 100 may include multiple reservoirs. In one embodiment, at least one reservoir 112 may include a first reservoir configured to contain a first fluid and a second reservoir configured to contain a second fluid, wherein the first fluid may include at least one gas and the second fluid may include at least one liquid.

[0073] Continue to refer to Figure 1 At least one reservoir 112 may be constructed of a material compatible with the at least one fluid stored therein. For example, but not limited to, at least one reservoir 112 may be made of materials such as corrosion-resistant metals, plastics, and / or glass. In some cases, the size of at least one reservoir 112 may be suitably configured to provide a sufficient fluid supply throughout the process without requiring frequent refilling or interruption. In one embodiment, the fluid may be supplied by a pressurized hose or tube. At least one reservoir 112 may include at least one inlet, at least one outlet, or both. In a non-limiting example, at least one inlet may be used to fill at least one reservoir 112 with at least one fluid, and at least one outlet may be connected to an ejector or other fluid delivery component of the device 100 (such as a pressure regulator and / or pressure regulation system), as described in further detail below. At least one fluid may be input into at least one reservoir 112 through at least one inlet and / or output to an ejector through at least one outlet. In cases where the device 100 has multiple reservoirs, each of the multiple reservoirs may include at least one inlet and at least one outlet. In a non-limiting example, a first reservoir configured to contain a first fluid may include a first inlet and a first outlet, and a second reservoir configured to contain a second fluid may include a second inlet and a second outlet, wherein the first inlet / first outlet may never intersect with the second inlet / second outlet. In this embodiment, the first fluid and the second fluid may not come into contact with each other before exiting through the first outlet / second outlet.

[0074] Continue to refer to Figure 1 The apparatus 100 includes a plasma reactor 116. As used in this disclosure, a "plasma reactor" is a device configured to generate, sustain, and / or control plasma. For the purposes of this disclosure, "plasma" refers to a fourth state of matter other than solid, liquid, and gas. Plasma may comprise a partially ionized gas consisting of a mixture of ions, electrons, and / or neutral particles (i.e., atoms and molecules). In one embodiment, plasma can be formed when at least one fluid is subjected to a high-energy source (such as, but not limited to, heat, radiation, electric fields, etc.), resulting in the ionization of atoms or molecules in at least one fluid by losing or gaining electrons. At least one fluid may be introduced into the plasma reactor 116 using an ejector, as described below in this disclosure. In some cases, the plasma may comprise a nonthermal plasma (NTP), wherein a nonthermal plasma is a plasma whose electron temperature is significantly higher than the temperature of heavier ions and neutral particles. In this case, although the electrons in the plasma have high kinetic energy, the overall temperature of at least one fluid may be kept relatively low (e.g., typically close to room temperature of 20°C–22°C / 68°F–72°F). Alternatively, the energy distribution among particles in nonthermal plasmas may not be in thermal equilibrium because electrons, which are much lighter than ions and neutral particles, gain energy more quickly when subjected to an electric or magnetic field, resulting in higher electron temperatures. On the other hand, heavier ions and neutral particles move more slowly and remain cooler, resulting in a cryogenic temperature for at least one fluid.

[0075] Continue to refer to Figure 1The plasma reactor 116 includes at least one pair of electrodes 120a to 120b, wherein the at least one pair of electrodes includes a first electrode 120a and a second electrode 120b. As used in this disclosure, an "electrode" is a conductor for making electrical contact with a conductive medium and / or a medium that can become conductive given a sufficient voltage difference (such as at least one fluid described above). The at least one pair of electrodes 120a to 120b is configured to generate a discharge according to at least one fluid. As used in this disclosure, a "discharge" refers to a phenomenon in which current flows through at least one fluid between two or more conductive surfaces (i.e., at least one pair of electrodes 120a to 120b), resulting in ionization and subsequently the release of energy in the form of light, heat, or sound. In a non-limiting example, the at least one pair of electrodes 120a to 120b may receive a voltage supplied by an ignition unit (described in further detail below), wherein the voltage may be applied across the surfaces of the at least one pair of electrodes 120a to 120b, thereby generating an electric field between the first electrode 120a and the second electrode 120b. This electric field can accelerate free electrons and other charged particles in at least one fluid, thereby triggering a cascade of ionization events, resulting in the formation of conductive channels of charged particles such as ions and electrons (i.e., plasma), which allow current to flow between the first electrode 120a and the second electrode 120b.

[0076] Continue to refer to Figure 1 Each of at least one pair of electrodes 120a to 120b may be constructed of a metal or metal alloy (such as copper) having specific conductivity and the ability to withstand high temperatures and chemical reactions. In one embodiment, at least one pair of electrodes 120a to 120b may include at least one cathode and at least one anode. For the purposes of this disclosure, a “cathode” is an electrode that carries a negative charge in a circuit, while an “anode” is an electrode that carries a positive charge in a circuit. In some cases, at least one cathode may be an electrode where reduction occurs (i.e., meaning it gains electrons), and at least one anode may be an electrode where oxidation occurs (i.e., meaning it loses electrons). In a non-limiting example, the first electrode 120a may include an anode electrically connected to the ignition unit as described above, and the second electrode 120b may include a cathode electrically connected to ground 124. As used in this disclosure, “ground” is a common reference point or conductive path that provides a baseline for measuring voltage, a return path for current, and a means for safely dissipating excess electrical energy. Ground 124 may be connected to an earth-conducting surface or otherwise connected directly or through a ground electrode conductor. This connection establishes a reference voltage level (i.e., zero volts) relative to which other voltages within device 100 can be measured. Alternatively, ground 124 can provide a path for excess electrical energy to be safely dissipated into the earth, thereby reducing the risk of electric shock, fire, or damage to the equipment of device 100.

[0077] Continue to refer to Figure 1 The plasma reactor includes a reaction zone 128 disposed between a first electrode 120a and a second electrode 120b, wherein the reaction zone 128 is configured to allow interaction between the discharge (i.e., plasma) and the growth medium 104. As used herein, a "reaction zone" is a designated area or space within the plasma reactor 116 where a specific chemical or physical reaction occurs. In some embodiments, generating plasma in the reaction zone may include generating reactive oxygen species (ROS) and reactive nitrogen species (RNS), both of which are highly reactive molecules formed primarily through the interaction of molecular oxygen (O2) and molecular nitrogen (N2) with high-energy substances such as free radicals, ions, and / or electrons generated by the discharge as described above. In some cases, ROS may include, but is not limited to, superoxide (O2 •-), hydroxyl radicals (-OH), and hydrogen peroxide (H2O2). The plasma may collide with O2 molecules, resulting in dissociation, ionization, or excitation, which subsequently leads to the formation of ROS through further reactions. In some cases, RNS may include, but is not limited to, nitric oxide (-NO), nitrogen dioxide (-NO2), and peroxynitrite (ONOO-). The plasma can collide with N2 molecules or other nitrogen-containing molecules, leading to dissociation, ionization, or excitation, which subsequently results in the formation of RNS through further reactions. In one embodiment, additional acids, such as nitrous acid (HNO2) and nitric acid (HNO3), can be generated due to the interaction of plasma, oxygen, nitrogen, and water. These acids can be further oxidized to form NO2 and NO3.

[0078] Still referencing Figure 1 ROS and RNS can drive various chemical and physical reactions within the reaction zone 128 of the plasma reactor 116 during the treatment process. In one embodiment, ROS and RNS can readily participate in oxidation and reduction reactions; for example, but not limited to, ROS and RNS can oxidize organic compounds, reduce their stability, and cause their degradation or modification. In another embodiment, ROS and RNS can effectively inactivate or kill microorganisms, such as bacteria, viruses, fungi, etc.; for example, but not limited to, ROS and RNS can disrupt the cellular structure of microorganisms and interfere with their metabolic functions by attacking cell walls, cell membranes, proteins, nucleic acids, etc. In a further embodiment, ROS and RNS can regulate cellular processes in prokaryotic and eukaryotic cells, such as cell signaling, gene expression, immune responses, etc.; for example, but not limited to, at low concentrations, ROS and RNS can act as signaling molecules that regulate cellular function, while at higher concentrations, they can induce cellular stress, destruction, or apoptosis. In other embodiments, ROS and RNS can also react with other molecules or substances to generate secondary reactive substances.

[0079] In the non-restrictive examples, and continuing to refer to Figure 1 The reaction zone 128 may include a space between a first electrode 120a and a second electrode 120b, in which charge is generated and plasma is generated according to at least one fluid. In one embodiment, the reaction zone 128 may include a gap between at least one pair of electrodes 120a to 120b, wherein the first electrode 120a may be parallel to the second electrode 120b (i.e., in corona discharge). In another embodiment, the reaction zone 128 may include a cylindrical space within a coaxial electrode arrangement. In a non-limiting example, at least one pair of electrodes 120a to 120b may be arranged in a bifurcated configuration (i.e., in a sliding arc discharge). In yet another embodiment, the electrode may be a single conical design with a wide portion and a narrow position, in which the electrode may be mounted in the center of a circular metal cylinder, and both gas and water may be introduced tangentially to prolong the arc or plasma discharge. The first electrode 120a may be configured to bifurcate from the second electrode 120b in a bifurcated configuration; for example, but not limited to, the first electrode 120a and the second electrode 120b may be slightly inclined. At least one pair of electrodes 120a to 120b may include an air gap between the first electrode 120a and the second electrode 120b, wherein the air gap may narrow at one end and gradually widen toward the other end. For example, but not limited to, the first electrode 120a may be closer together at one end and further apart at the other end. In some cases, each of the at least one pair of electrodes 120a to 120b may include various shapes, such as, but not limited to, linear, curved, spiral, etc. In some cases, each of the at least one pair of electrodes 120a to 120b may be symmetrically positioned on both sides of the plasma reactor 116 along the fluid output axis of the ejector's fluid outlet, as described below. The distance between the first electrode 120a and the second electrode 120b can be adjusted to control the discharge intensity.

[0080] Further reference Figure 1In some embodiments, the reaction region 128 may include a plurality of arc points between the first electrode 120a and the second electrode 120b. As used herein, an "arc point" refers to the flow of electrons between the first electrode 120a and the second electrode 120b. In some cases, the arc point may mark the starting point of a discharge. In some cases, the location of the arc point may be influenced by various factors, such as the geometry and material of at least one pair of electrodes 120a to 120b, the distance between the first electrode 120a and the second electrode 120b within at least one pair of electrodes 120a to 120b, the received voltage, the properties of at least one fluid, etc. In a non-limiting example, the arc point may include the region where current "jumps" or "arcs" from the first electrode 120a to the electrode 120b. The first arc point may be formed at the narrowest gap between the first electrode 120a and the second electrode 120b. The first arc point may include an electric field of maximum intensity. As plasma is generated by plasma reactor 116 via discharge, a first arc point can move along the surfaces of at least one pair of electrodes 120a to 120b due to the influence of the electric field and at least one fluid flow. This movement can introduce the remainder of multiple arc points along the surfaces of at least one pair of electrodes 120a to 120b and ensure a continuous, non-equilibrium plasma that enhances the generation of ROS and / or RNS as described above. Reference will be made below. Figure 2 The plasma reactor 116 and its components are described in further detail.

[0081] Continue to refer to Figure 1The device 100 includes an ignition unit 132 electrically connected to at least one of at least one of a pair of electrodes 120a to 120b. As used in this disclosure, an "ignition unit" is an electrical component responsible for providing the initial voltage required to initiate a discharge between the electrodes. In a non-limiting example, the ignition unit is configured to supply voltage to at least one electrode. The at least one electrode may include a first electrode 120a (i.e., an anode), and the ignition unit 132 may include a power source. As used in this disclosure, a "power source" is any system, device, or means that provides power (such as, but not limited to, electricity) to a device. The power source may provide power to the ignition unit 132 and / or other devices / components within the device 100 described in this disclosure (such as, but not limited to, a plasma reactor 116, an ejector, any computing device, etc.). In a non-limiting example, the device 100 may be electrically connected to a power source. In some embodiments, the power source may be externally electrically connected to the device 100. In such embodiments, the power source may include an external power supply. As a non-limiting example, an external power source may include a wall-mounted power outlet connection, a battery, a DC power supply, a renewable energy source, a fuel cell, a generator, etc. In one embodiment, the power source may include direct current (DC) power. In another embodiment, the power source may include alternating current (AC) power. In some embodiments, additionally or alternatively, the power source may include AC or DC renewable power. As a non-limiting example, AC or DC renewable power may include power generated from renewable energy sources such as solar, wind, hydro, geothermal, and biomass. In some embodiments, the power source may include one or more battery cells. As a non-limiting example, the battery cells may be lithium-ion batteries, alkaline batteries, lithium metal batteries, etc. In some cases, transmitting power may include using a continuous conductor 136. As described herein, a “continuous conductor” is an electrical conductor without any interruption, made of a conductive material capable of carrying current over a distance. The conductive material may include any material that conducts current, and as a non-limiting example, may include various metals such as copper, steel, or aluminum, carbon conductive materials, or any other suitable conductive material.

[0082] Continue to refer to Figure 1In some embodiments, ignition unit 132 may be configured to convert a lower input voltage from a power source (e.g., 110V / 220V for AC, or 12V / 24V for DC) to a higher output voltage, thereby providing the necessary electrical energy to drive plasma reactor 116. In one embodiment, the ignition unit may also convert AC to AC. For example, an AC-to-AC converter may be used to convert an AC waveform with one specific frequency and amplitude to an AC waveform with another frequency and another amplitude. For example, the AC voltage controller may be a thyristor-based device that directly converts a fixed AC voltage to a variable AC voltage without changing the frequency. The AC voltage controller may be a phase-controlled device, thus eliminating the need for forced commutation circuitry and allowing the use of natural commutation or grid commutation. In a non-limiting example, ignition unit 132 may include an ignition transformer. As used in this disclosure, an "ignition transformer" is an electrical transformer designed to generate a high-voltage output for initiating a discharge as described above, wherein the electrical transformer is a passive electrical device that transfers electrical energy from one circuit to another through an electromagnetic induction process. In some cases, electrical transformers can be used to increase or decrease the voltage level of an alternating current (AC) signal while maintaining the same frequency. In a non-limiting example, an ignition transformer can be configured to boost the input voltage from a lower level (from the power supply) to a higher voltage level required by the plasma reactor 116 to generate an electric arc (i.e., the arc point).

[0083] In some embodiments, the ignition transformer may include two sets of windings, which may include a primary winding and a secondary winding. Both sets of windings may be wound around a magnetic core. In some cases, the primary winding may be connected to a lower voltage input, while the secondary winding generates a high-voltage output. In a non-limiting example, the ignition unit 132 may include an ignition transformer configured to convert power received from a power source into a high-voltage discharge ranging from 6 kV to 30 kV. In another embodiment, the voltage range may be from 3 kV to 18 kV.

[0084] Continue to refer to Figure 1In some embodiments, the ignition unit 132 may be able to convert an AC voltage that oscillates periodically between positive and negative values ​​into a direct current (DC) with a constant polarity (positive or negative) that does not change over time, to generate a controlled and / or stable discharge for the connected electrodes to generate and / or sustain plasma. In some cases, the device 100 may need to convert AC power to DC power to perform pulsed operation. During pulsed plasma operation, the plasma reactor 116 may operate in a pulsed mode in which plasma can be generated and sustained for a short period, followed by a period without discharge. The DC power supply can be easily controlled and switched on and off as needed, thus making the DC power supply suitable for pulsed plasma operation. In some cases, the device 100 may convert AC power to DC power to reduce electrode wear and contamination; for example, but not limited to, in an AC-powered plasma reactor 116, the constantly changing polarity of the electrodes can lead to accelerated electrode wear and the release of electrode material into the generated plasma. In one embodiment, the device 100 may also convert AC to AC. For example, an AC-to-AC converter may be used to convert an AC waveform with a specific frequency and amplitude to an AC waveform with another frequency and another amplitude. For example, the AC voltage controller can be a thyristor-based device that directly converts a fixed AC voltage to a variable AC voltage without changing the frequency. The AC voltage controller can be a phase-controlled device, thus eliminating the need for forced commutation circuitry and allowing the use of natural commutation or grid commutation. By using a DC power supply, the electrodes can maintain constant polarity, thereby reducing wear and contamination and increasing electrode life. In a non-limiting example, the ignition unit 132 may include a rectifier. As used in this disclosure, a "rectifier" is an electrical device or circuit that converts AC to DC. A rectifier can be constructed using one or more diodes, wherein the diode is a semiconductor device that allows current to flow in only one direction and has low resistance to current in the forward direction (when the voltage is positive) and high resistance to current in the reverse direction (when the voltage is negative). In some cases, the rectifier may include, but is not limited to, a half-wave rectifier, a full-wave rectifier, etc.

[0085] Continue to refer to Figure 1In some embodiments, ignition unit 132 may include a power regulator (i.e., a filter). As described in this disclosure, a "power regulator" is an electrical device that performs power regulation or redistribution, wherein, as described herein, "power regulation" or "power redistribution" refers to the process of maintaining a power supply voltage below its maximum value during operation, non-operation, or charging. In a non-limiting example, a power regulator may be used to remove or attenuate unwanted frequencies, noise, or voltage fluctuations from an output voltage or current. A power regulator may include, but is not limited to, passive filters, active filters, EMI / RFI filters, voltage regulators, etc. Additionally or alternatively, ignition unit 132 may include a balancer. As described herein, a "balancer" is an electrical device that performs power balancing, wherein, for the purposes of this disclosure, "power balancing" refers to the process of balancing electrical energy from one or more first power sources (e.g., a high-power battery) to one or more second power sources (e.g., a low-power battery). Those skilled in the art will recognize various devices / components that may be used within ignition unit 132 of device 100 upon review of the entire contents of this disclosure.

[0086] Continue to refer to Figure 1 The apparatus 100 includes an ejector 140 fluidly connected to at least one reservoir 112. As used in this disclosure, an "ejector" is a component designed to introduce at least one fluid into a plasma reactor 116 (specifically, the reaction zone 128 of the plasma reactor 116). In a non-limiting example, the ejector 140 is configured to deliver at least one fluid through the reaction zone. The at least one fluid can then be used by the plasma reactor 116 to generate plasma. For the purposes of this disclosure, a "fluid connection" refers to a path or link capable of transferring at least one fluid. In a non-limiting example, the fluid connection between the ejector 140 and at least one reservoir 112 can be established using various components (such as, but not limited to, pipes, conduits, hoses, channels, etc.) to form a continuous path for the flow of at least one fluid.

[0087] Continue to refer to Figure 1The ejector 140 may include at least one fluid inlet 144. As used in this disclosure, a “fluid inlet” is an inlet point through which at least one fluid is introduced into the ejector 140 before being delivered to the reaction zone 128 of the plasma reactor 116 or any other process described in this disclosure. In a non-limiting example, as described above, at least one fluid inlet 144 may be connected to the outlet of at least one reservoir 112. In some cases, at least one fluid inlet 144 may be designed to provide a robust, leak-free connection to at least one reservoir; such as, but not limited to, at least one fluid inlet 144 may be sealed using one or more sealing elements (such as O-rings, gaskets, thread sealants, etc.) to ensure a tight seal and / or prevent leakage or contamination. The ejector 140 may include at least one fluid outlet 148. As used in this disclosure, a “fluid outlet” is an outlet point through which at least one fluid is discharged from the ejector 140 into the reaction zone 128 of the plasma reactor 116. In some cases, at least one fluid outlet 148 may be configured to allow at least one fluid to be released to a desired location within the reaction zone 128. For example, but not limited to, at least one fluid outlet 148 may be positioned at the center and directly above at least one pair of electrodes 120a to 120b. At least one fluid outlet 148 may be spaced at a distance from at least one pair of electrodes 120a to 120b or the reaction zone 128. This distance may affect the time and space available for mixing and interaction of at least one fluid with plasma or other process components. In some cases, at least one fluid outlet 148 may be configured to provide an optimal flow pattern and dispersion of at least one fluid to the reaction zone 128. In a non-limiting example, at least one fluid outlet 148 may include a nozzle (i.e., an opening of a specific shape) designed to generate a directional, high-speed flow of at least one fluid, which may improve mixing and dispersion in the reaction zone 128. Such nozzles may include, but are not limited to, swirling nozzles, fan-shaped spray nozzles, impingement jet nozzles, porous nozzles, atomizing nozzles, etc.

[0088] Alternatively or alternatively, and still refer to Figure 1The ejector 140 may include one or more valves configured to monitor, control, or otherwise regulate the flow of at least one fluid delivered through the reaction zone 128 of the plasma reactor 116. As used herein, a "valve" is a component that controls fluid communication between two or more components (e.g., between at least one reservoir 112 and the ejector 140). Exemplary non-limiting valves include directional valves, control valves, selector valves, multi-way valves, check valves, etc. Valves may include any suitable valve configuration, including ball valves, butterfly valves, needle valves, gate valves, wafer valves, regulating valves, etc. Valves may be included in manifolds of hydraulic or pneumatic circuits, allowing for multiple ports and flow paths. Valves may be actuated by any known method, such as, but not limited to, hydraulic, pneumatic, mechanical, or electrical power. For example, in some cases, valves may be actuated by an energized solenoid or electric motor. The valve actuator, and thus the valve itself, may be controlled by a computing device, as described in further detail below. The computing device can communicate with the valve, for example, by means of one or more of electrical communication, hydraulic communication, pneumatic communication, mechanical communication, etc. Furthermore, the injector 140 and its components will be explained in more detail below in this disclosure.

[0089] Continue to refer to Figure 1 The device 100 includes a pressure regulator configured to transfer at least one fluid to an ejector. As used in this disclosure, a "pressure regulator" or "pressure regulation system" is a component and / or mechanism designed to control and maintain the pressure of at least one fluid, wherein such pressure drives at least one fluid into the plasma reactor 116. In one embodiment, the flow of fluid may be regulated by the pressure of a gas, as a higher gas pressure produces more fluid flow. In some cases, a higher gas pressure also regulates droplet size; for example, a higher gas pressure equals a smaller droplet size. In one embodiment, the pressure regulation system may include an atmospheric pressure system. As used in this disclosure, an "atmospheric pressure system" is a mechanism for controlling the pressure of at least one fluid introduced into the plasma reactor 116 to be near atmospheric pressure. For the purposes of this disclosure, "atmospheric pressure" is the pressure exerted by the weight of air in the Earth's atmosphere at sea level, which is approximately 101.3 kPa or 14.7 psi. In some embodiments, a pressure regulator and / or pressure regulation system ensures that at least one fluid injected into the reaction zone 128 of the plasma reactor 116 is maintained at or near atmospheric pressure. In some embodiments, the pressure regulator and / or pressure regulation system is responsible for transferring fluid from at least one reservoir 112 to an injector 140, thereby providing a consistent and controlled flow of at least one fluid to the reaction zone 128 of the plasma reactor 116.

[0090] Continue to refer to Figure 1In some cases, the pressure regulator and / or pressure regulating system may include a flow element connected to at least one reservoir 112, which is configured to allow at least one fluid to flow from at least one fluid inlet 144 of the ejector 140 or the outlet of at least one reservoir 112 to at least one fluid outlet 148 of the ejector 140. The pressure regulator may include the valves described above. In some embodiments, the flow element may include a passive flow element configured to initiate a passive flow process. As used herein, a “passive flow element” is a component that imparts passive flow to at least one fluid, wherein, for the purposes of this disclosure, “passive flow” is fluid flow induced without any external actuator, field, or power source. As described herein, a “passive flow process” is a series of actions or steps taken by the passive flow element to impart passive flow to at least one fluid. In a non-limiting example, where the pressure regulator and / or pressure regulating system includes a passive flow element, the ejector 140 may be able to deliver at least one fluid through the reaction zone 128 according to a passive flow process. The passive flow component may employ one or more passive flow technologies to initiate a passive flow process; for example, but not limited to, passive flow technologies may include permeation, capillary action, surface tension, pressure, gravity-driven flow, hydrostatic flow, vacuum, etc. The passive flow component may be in fluid communication with at least one reservoir 112.

[0091] Still referencing Figure 1In other embodiments, the flow component may include an active flow component configured to initiate an active flow process. As used herein, an "active flow component" is a component that imparts active flow to a fluid, wherein, for the purposes of this disclosure, "active flow" is fluid flow caused by an external actuator, field, or power source. As described herein, an "active flow process" is a series of actions or steps taken by the active flow component to impart active flow to at least one fluid. In some embodiments, the active flow component may be electrically connected to a power source as described above. In a non-limiting example, where the pressure regulator and / or pressure regulation system includes an active flow component, the ejector 140 may be able to deliver at least one fluid through the reaction zone 128 according to the active flow process. The pressure and / or pressure regulation system may be configured to pressurize at least one fluid entering the reaction zone 128 of the plasma reactor 116; for example, but not limited to, the active flow component of the pressure regulator and / or pressure regulation system may include one or more pumps. The pump may include a substantially constant-pressure pump (e.g., a centrifugal pump) or a substantially constant-flow pump (e.g., a positive displacement pump, a gear pump, etc.). The pump may be hydrostatic or hydrodynamic. As used in this disclosure, a "pump" is a mechanical power source that converts mechanical power into fluid energy. A pump can generate a flow with sufficient power to overcome the pressure caused by a load at the pump outlet. A pump can create a vacuum at the pump inlet, thereby forcing fluid from a reservoir into the pump inlet and delivering the fluid to the pump outlet by mechanical action. A hydrostatic pump is a positive displacement pump.

[0092] The hydraulic pump can be a fixed displacement pump (where the displacement may not be adjustable) or a variable displacement pump (where the displacement may be adjustable). Exemplary, non-limiting pumps include gear pumps, rotary impeller pumps, screw pumps, bent-shaft pumps, inline axial piston pumps, radial piston pumps, etc. The pump can be powered by any rotating mechanical power source, such as, but not limited to, an electric motor or a power output device from an electrical source. The pump may be in fluid communication with at least one reservoir 112. (Continue to reference) Figure 1The apparatus 100 may further include a condenser 156 disposed within the reaction zone and located above or below the processing chamber. As used herein, a "condenser" is a component configured to collect reactive products generated by electrical discharge within the reaction zone 128 of the plasma reactor 116. The condenser 156 may be made of steel wool, metal wool, copper, carbon steel, etc. The condenser 156 may be located at or near the outlet and / or may be installed at the bottom of the reaction zone 128 to allow evaporated water to condense into droplets. In one embodiment, the condenser 156 may be a piece of steel wool placed at the bottom of the apparatus 100 or in a conduit or pipe connected to the apparatus. In some cases, the condenser 156 may be disposed inside a conduit. In one embodiment, the condenser 156 may not be an external component but may be integrated within the conduit itself, wherein the conduit may include a conduit that allows fluids such as gases or liquids to flow from one part of the condenser 156 to another part or from the condenser 156 to another component of the apparatus 100. In some embodiments, a condenser 156 may be strategically positioned between reaction zones 128, configured to collect the reactive products before they come into contact with the growth medium 104 contained in the processing chamber 108. In some cases, the reactive products may include ions, free radicals, electrons, excited molecules, etc., as described above; for example, but not limited to, ROS and / or RNS. In other cases, the reactive products may include byproducts or waste generated during the processing. In a non-limiting example, the reactive products may include carbon monoxide (CO) and / or carbon dioxide (CO2), wherein these gases may be generated by the decomposition or discharge of the growth medium 104 and the reaction with impurities in the growth medium 104. Other exemplary byproducts or waste may include, but are not limited to, ozone, volatile organic compounds (VOCs), etc.

[0093] Continue to refer to Figure 1The condenser 156 may include a cooling chamber. As used in this disclosure, a "cooling chamber" is a component configured to rapidly cool reactive products from (i.e., falling) the reaction zone 128 of the plasma reactor. In some embodiments, the cooling chamber may be configured to ensure efficient heat transfer and maintain optimal temperature conditions for the condensation process. The cooling chamber may be constructed of a thermally conductive material, such as, but not limited to, copper, aluminum, stainless steel, etc. In some cases, the material may also be chemically resistant to the reactive products and at least one fluid used in the system. The cooling chamber may be non-conductive and constructed of materials such as, but not limited to, plastics, glass, fiberglass, etc. In some embodiments, the cooling chamber of the condenser 156 may be designed to conform to the shape of the plasma reactor 116 or the processing chamber 108; for example, but not limited to, the cooling chamber may be designed to be cylindrical, conforming to the shape of the plasma reactor 116 and the processing chamber 108, to optimize the flow of reactive products and maximize the contact surface area between the cooling medium and the reactive products, wherein the cooling medium may include water, air, refrigerant, etc., and is configured to effectively remove heat from the reactive products. In some cases, the interior of the cooling chamber may be equipped with fins, coils, plates, etc., to further enhance the heat transfer process (i.e., by increasing the surface area of ​​the cooling chamber). In a non-limiting example, the cooling chamber may include a heat exchanger, wherein the heat exchanger may be configured to facilitate the transfer of heat from reactive products to the cooling medium.

[0094] Continue to refer to Figure 1 The condenser 156 may include a collection surface. As used in this disclosure, a "collection surface" is a designated area within the condenser 156 where reactive products come into contact with the cooling chamber and undergo a phase change from a first state to a second state. In a non-limiting example, the collection surface may be configured such that reactive products in a gaseous state can be converted into a liquid state. This conversion allows the device 100 to efficiently collect and subsequently process or transport the condensed material. In some embodiments, the collection surface may include various surface features (such as, but not limited to, ridges, channels, etc.) to facilitate the flow of the condensed / collected material. In a non-limiting example, the collection surface may include a flat surface, wherein the flat surface may include multiple channels or grooves designed to facilitate the flow of condensed reactive products away from the collection surface. Additionally or alternatively, the collection surface may include a surface finish; for example, but not limited to, the collection surface may be finished or treated (e.g., using a hydrophobic coating, a hydrophilic coating, etc.) to enhance wetting properties and reduce surface tension, thereby further improving condensation efficiency and fluid flow.

[0095] Continue to refer to Figure 1The condenser 156 may include at least one conduit. As used in this disclosure, a "conduit" is a passageway for moving a substance (i.e., the condensed reactive product) from one location within the device 100 to another. In a non-limiting example, the condenser 156 may use one or more conduits to transfer the condensed reactive product from a collection surface to a growth medium 104 contained in a processing chamber 108. In some cases, the conduit may be designed with a circular cross-sectional shape. In some cases, the conduit may be thermally insulating (using materials such as fiberglass) to maintain the desired temperature of the condensed reactive product and / or prevent any undesirable chemical reactions during transport. In some embodiments, one or more conduits may be connected to the collection surface to ensure a leak-proof connection; for example, but not limited to, such a connection between the collection surface and one or more conduits may be established using threaded fittings, compression fittings, flanges, etc. In some embodiments, one or more conduits may be routed from the collection surface to the processing chamber 108 with minimal interference with other components of the device 100 to ensure a smooth flow of the condensed reactive product; for example, but not limited to, suitable supports and / or anchors may be installed on the conduits to prevent sagging, vibration, or any other mechanical stresses that could lead to leakage or damage. Alternatively or additionally, the conduit may be incorporated with one or more valves to regulate the flow of condensed reactive products into the processing chamber 108. The valves may include any valves described in this disclosure. Those skilled in the art, upon reviewing the entire contents of this disclosure, will recognize various devices / components that may be used within the condenser 156 of the apparatus 100.

[0096] Continue to refer to Figure 1The device 100 may include a computing device configured to control various internal components as described above (such as, but not limited to, plasma reactor 116, ignition unit 132, ejector 140, condenser 156, etc.). The computing device may include any computing device as described in this disclosure, including but not limited to microcontrollers, microprocessors, digital signal processors (DSPs), and / or system-on-a-chip (SoCs) as described in this disclosure. The computing device may include a mobile device (such as a mobile phone or smartphone), be included in such a mobile device, and / or communicate with such a mobile device. The computing device may include a single computing device operating independently, or may include two or more computing devices operating collaboratively, in parallel, sequentially, etc.; two or more computing devices may be included together in a single computing device or included in two or more computing devices. The computing device may interface with or communicate with one or more additional devices via a network interface device, as described in further detail below. The network interface device may be used to connect the computing device to one or more networks and one or more devices in a variety of networks. Examples of network interface devices include, but are not limited to, network interface cards (e.g., mobile network interface cards, LAN cards), modems, and any combination thereof. Examples of networks include, but are not limited to, wide area networks (e.g., the Internet, enterprise networks), local area networks (e.g., networks associated with offices, buildings, campuses, or other relatively small geographical spaces), telephone networks, data networks associated with telephone / voice providers (e.g., mobile communication provider data and / or voice networks), direct connections between two computing devices, and any combination thereof. Networks can employ wired and / or wireless communication modes. Generally, any network topology can be used. Information (e.g., data, software, etc.) can be transmitted to and / or from computers and / or computing devices. Computing devices can include, but are not limited to, computing devices or clusters of computing devices in a first location and second computing devices or clusters of computing devices in a second location. Computing devices may include one or more computing devices dedicated to data storage, security, traffic distribution for load balancing, etc. Computing devices can distribute one or more computing tasks as described below across multiple computing devices, which can operate in parallel, serial, redundantly, or in any other manner used to distribute tasks or memory among computing devices. Computing devices can be implemented using a "shared-nothing" architecture, in which data is cached at worker nodes. In one implementation, this enables the scalability of device 100 and / or computing device.

[0097] Continue to refer to Figure 1The computing device may be designed and / or configured to perform any method, method step, or sequence of method steps in any of the embodiments described in this disclosure in any order and with any degree of repetition. For example, the computing device may be configured to repeatedly execute a single step or sequence until a desired or commanded result is achieved; the repetition of steps or sequences of steps may be performed iteratively and / or recursively by using the output of a previous repetition as input for a subsequent repetition, aggregating the inputs and / or outputs of repetitions to produce an aggregated result, reducing or subtracting one or more variables (such as global variables), and / or dividing a larger processing task into a set of smaller processing tasks that are iteratively addressed. The computing device may execute any step or sequence of steps as described in this disclosure in parallel, such as by using two or more parallel threads, processor cores, etc., to execute steps two or more times simultaneously and / or substantially simultaneously; the task partitioning between parallel threads and / or processes may be performed according to any protocol suitable for task partitioning between iterations. Those skilled in the art, upon reviewing the entire contents of this disclosure, will appreciate various ways in which iterative, recursive, and / or parallel processing can be used to subdivide, share, or otherwise process steps, sequences of steps, processing tasks, and / or data.

[0098] Still referencing Figure 1In some embodiments, internal components of device 100 may communicate with a computing device using one or more signals. As used in this disclosure, a “signal” is a human-understandable and / or machine-readable representation of data, such as, but not limited to, electrical and / or digital signals from one device to another; signals may be transmitted using any suitable communication connection. As used in this disclosure, a “communicative connection” means a connection made by means of a link, attachment, or connection between two or more related entities that allow the receiving and / or sending of information therebetween. For example, but not limited to, the connection may be wired or wireless, direct or indirect, and between two or more components, circuits, devices, systems, etc., which allows the receiving and / or sending of data and / or signals therebetween. The data and / or signals therebetween may include, but are not limited to, electrical, electromagnetic, magnetic, video, audio, radio and microwave data and / or signals, combinations thereof, etc. A communication connection may be implemented, for example, but not limited to, directly or by means of one or more intermediate devices or components, via wired or wireless electronic, digital, or analog communication. Furthermore, a communication connection may include electrically coupling or connecting at least one output of one device, component, or circuit to at least one input of another device, component, or circuit. For example, but not limited to, via a bus or other facility for communication between components of a computing device. Communication connections may also include indirect connections via, for example, but not limited to, wireless connections, radio communications, low-power wide-area networks, optical communications, magnetic coupling, capacitive coupling, or optical coupling. In some cases, the term "communicationally coupled" may be used instead of "communicationally connected" in this disclosure. Signals may include optical signals, hydraulic signals, pneumatic signals, mechanical signals, electrical signals, digital signals, analog signals, etc. In some cases, signals may be used to communicate with the computing device, for example, via one or more ports. In some cases, signals may be sent and / or received by the computing device, for example, via input / output ports. Analog signals may be digitized, for example, by means of an analog-to-digital converter. In some cases, analog signals may be processed prior to digitization, for example, by means of any analog signal processing steps described in this disclosure. In some cases, digital signals may be used for communication between two or more devices (including, but not limited to, computing devices). In some cases, digital signals can communicate using one or more communication protocols, including but not limited to Internet Protocol (IP), Controller Area Network (CAN) protocol, serial communication protocols (e.g., Universal Asynchronous Receiver-Transmitter [UART]), parallel communication protocols (e.g., IEEE 128 [Printer Port]), etc.

[0099] Further reference Figure 1In some cases, device 100 and / or computing device may perform one or more signal processing steps on a signal. For example, device 100 and / or computing device may analyze, modify, and / or synthesize signals representing data to improve the signal, for example, by improving transmission, storage efficiency, or signal-to-noise ratio. Exemplary methods of signal processing may include analog, continuous-time, discrete, digital, nonlinear, and statistical methods. Analog signal processing may be performed on non-digital or analog signals. Exemplary analog processes may include passive filters, active filters, adder mixers, integrators, delay lines, companders, multipliers, voltage-controlled filters, voltage-controlled oscillators, phase-locked loops, and / or any other process using operational amplifiers or other analog circuit elements. In some cases, continuous-time signal processing may be used to process signals that vary continuously within a domain (e.g., time). Exemplary non-limiting continuous-time processing may include time-domain processing, frequency-domain processing (Fourier transform), and complex frequency-domain processing. Discrete-time signal processing may be used when a signal is sampled discontinuously or at discrete time intervals (i.e., quantized in time). Analog discrete-time signal processing can use exemplary circuitry such as sampling and holding circuits, analog time-division multiplexers, analog delay lines, and analog feedback shift registers to process signals. Digital signal processing can be used to process digitized discrete-time sampled signals. Typically, digital signal processing can be performed by computing devices or other dedicated digital circuitry, such as, but not limited to, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or dedicated digital signal processors (DSPs). Digital signal processing can be used to perform any combination of typical arithmetic operations, including fixed-point and floating-point, real-valued and complex-valued, multiplication and addition. Digital signal processing can also operate on circular buffers and lookup tables. Other non-limiting examples of algorithms that can be performed according to digital signal processing techniques include Fast Fourier Transform (FFT), Finite Impulse Response (FIR) filters, Infinite Impulse Response (IIR) filters, and adaptive filters such as Wiener filters and Kalman filters. Statistical signal processing can be used to process signals as random functions (i.e., random processes) by leveraging statistical properties. For example, in some implementations, a signal can be modeled using a probability distribution indicating noise, which can then be used to reduce noise in the processed signal.

[0100] Continue to refer to Figure 1The device 100 may include a housing 160 configured to house various internal components, such as, but not limited to, a processing chamber 108, a plasma reactor 116, an ignition unit 132, an injector 140, a pressure regulator, a condenser 156, computing devices, etc. As used herein, a “housing” is an external structure or enclosure that houses and supports the various internal components of the device 100. In some cases, the housing 160 may provide protection, stability, and / or organization to the device 100. In one embodiment, the housing 160 may be designed to house and securely hold the internal components of the device 100. In some cases, the housing 160 may include multiple layers, wherein one or more internal components of the device 100 may be strategically placed in each of the multiple layers, thereby minimizing physical or functional interference between the internal components of the device 100. In a non-limiting example, the housing 160 may include a first layer incorporating the ignition unit 132, a second layer incorporating the injector 140, a third layer incorporating the plasma reactor 116, and a fourth layer incorporating the processing chamber 108 housing the growth medium 104. Each layer may be physically isolated but functionally connected in various ways (e.g., fluid connection, electrical connection, etc.); for example, but not limited to, a continuous conductor 136 may be used to connect at least one of at least one pair of electrodes 120a to 120b of the ignition unit 132 and the plasma reactor 116, the continuous conductor being configured to transfer electricity from the first layer of the housing 160 to the third layer of the housing 160, wherein the continuous conductor may travel from the first layer of the housing 160 through the exterior of the second layer of the housing 160 to the third layer of the housing 160. For example, but not limited to, at least one fluid outlet 148 of the injector 140 may be mechanically fixed to the bottom of the second layer of the housing 160 or the top of the third layer of the housing 160, wherein at least one fluid outlet 148 may include a first end connected to the injector 140 and a second end extending into the third layer of the housing 160, which is in conjunction with the plasma reactor 116. In this embodiment, at least one fluid contained in at least one reservoir 112 may be introduced into the plasma reactor 116 and further from the second layer of the housing 160 through the reaction zone 128 to the third layer of the housing 160. Alternatively or additionally, the housing 160 may include appropriate insulation for the electrode wires (continuous conductor 136), which is configured to prevent electrical short circuits or interference with other components within the housing 160. In a non-limiting example, the insulator may be used at the point where the continuous conductor 136 passes through the housing 160, as referenced. Figure 2 A more detailed description follows.

[0101] Now for reference Figure 2 , for example Figure 2This is an exemplary embodiment of plasma reactor assembly 200. Plasma reactor assembly 200 may include a housing 204. In one embodiment, housing 204 may be part of housing 160 as described above. In another embodiment, housing 204 may be a separate housing configured to house only plasma reactor 116. In a non-limiting example, plasma reactor 116 may be a double-shell structure, wherein housing 204 may be disposed within a third layer of housing 160, such as... Figure 1 As illustrated, at least one pair of electrodes 120a to 120b and a reaction zone 128 between the electrodes 120a to 120b may be disposed within the housing 204. In some embodiments, the housing 204 may be injection molded via an injection mold. As used in this disclosure, an "injection mold" is a manufacturing tool for producing plastic parts. Manufacturing the housing 204 may include using an injection molding process, wherein the injection molding process may involve using an injection mold configured to produce a specific shape and features of the housing 204. In some embodiments, the injection mold may include two halves clamped together, having one or more cavities between the two halves, wherein the cavities may define the shape of the housing 204. In some embodiments, a material such as, but not limited to, molten plastic may be injected into the injection mold under high pressure, filling the space and taking the shape of the injection mold. The injection molding process may include a cooling process configured to cool and / or solidify the injected material. The injection mold may then be opened, and the finished housing 204 may be removed. In some embodiments, the injection mold may be precisely machined to the desired shape and size of the housing 204. In a non-limiting example, housing 204 may include a hollow cylinder.

[0102] Referring again to the figures, one or more continuous conductors 136a to 136b may pass through the housing 204, with one end electrically connected to at least one electrode 208 of at least one pair of electrodes 120a to 120b. In some cases, at least one electrode 208 may include a first electrode 120a. In other cases, at least one electrode 208 may include a second electrode 120b. (Refer to the above figures) Figure 1As described, the other end of the continuous conductors 136a to 136b may be connected to the ignition unit 132 or ground 124. In some embodiments, one or more insulators 212a to 212b may be used at the points where the continuous conductors 136a to 136b pass through the housing 204. For the purposes of this disclosure, an "insulator" is a material that does not readily conduct heat, electricity, or sound. In a non-limiting example, insulators 212a to 212b may include electrical insulators, wherein the electrical insulator is a material having a high resistivity. Electrical insulators may not readily conduct current, thereby preventing current from flowing between the plasma reactor 116 and other components besides the ignition unit 132, thereby reducing the risk of short circuits, electric shock, interference, etc. Exemplary electrical insulators may include plastics, ceramics, glass, rubber, etc.

[0103] Continue to refer to Figure 2 Each of at least one pair of electrodes 120a to 120b may include an angle 216. In a non-limiting example, at least one electrode 208 may include an angle 216 of 6 to 8 degrees, such that the angle between the faces of at least one pair of electrodes is 12 to 16 degrees. As used in this disclosure, the “angle” of an electrode refers to the angle between the longitudinal axis of the electrode and a reference plane or axis within the plasma reactor 116. In one embodiment, the cone shape of the ejector discharge may be 12 to 15 degrees, and the angle of the electrode 208 may be 6 to 8 degrees. In one embodiment, the ejector spacing may match the electrodes 208, or vice versa. In some cases, the angle 216 may affect the characteristics of the plasma generated between the electrodes in the reaction zone 128, such as, but not limited to, the electric field distribution, the efficiency of the discharge process, and the interaction with reactive substances (e.g., ROS, RNS, etc.) within the plasma.

[0104] Continue to refer to Figure 2The ejector 140 can be connected to the plasma reactor 116 via an ejector mounting flange 220. As used in this disclosure, an "ejector mounting flange" is a mechanical component for reliably and leak-proofly attaching the ejector 140 to the housing 204. In a non-limiting example, the ejector mounting flange 220 may include an interface 224 between the ejector 140 and the plasma reactor 116. In some cases, at least one fluid outlet 148 of the ejector 140 may include a threaded adapter. Both the at least one fluid outlet 148 and the interface 224 may include threaded sections; for example, but not limited to, at least one fluid outlet 148 / interface 224 may include a male threaded section / female threaded section, wherein the male threaded section and the female threaded section are compatible (i.e., mating). The ejector 140 may be threaded onto the ejector mounting flange 220 at the interface 224 via at least one fluid outlet 148 with a threaded adapter. In one embodiment, the bottom of the injector 140 may be a fluid outlet 148 with an opening at the bottom, which allows gas and water to exit in a controlled spray cone. The exterior of the fluid outlet 148 may be threaded. The mounting flange 220 may have an interface 224 with a mating thread at its center, thereby allowing the injector 140 to be securely attached to the mounting flange. In one embodiment, the location of the fluid outlet 148 in the mounting flange 220 may allow the release of gas and water to be directly discharged into the center of the reaction zone 128.

[0105] Now for reference Figure 3An exemplary embodiment of an injector 140 having a flow adjustment component 304 is illustrated. In some embodiments, the injector 140 may include a plurality of fluid inlets 144a to 144b. In a non-limiting example, the injector 140 may include a first fluid inlet 144a fluidly connected to a first reservoir, wherein the first fluid inlet may be configured to receive a first fluid from the first reservoir. The first fluid may include one or more gases as described above. The injector 140 may include a second fluid inlet 144b fluidly connected to a second reservoir, wherein the second fluid inlet 144b may be configured to receive a second fluid from the second reservoir. The second fluid may include a liquid, such as, but not limited to, water. In some cases, at least one fluid outlet 148 may be configured to output a mixture of the first and second fluids in the form of droplets to the plasma reactor. As used in this disclosure, a "droplet" refers to a small spherical liquid particle. In a non-limiting example, the injector 140 may generate droplets through various mechanisms, such as, but not limited to, pressure-driven atomization, ultrasonic atomization, electrostatic atomization, etc. The ejector 140 can break down the second fluid into small droplets, which can then be dispersed and mixed with the first fluid. In some cases, the droplets can carry reactants into the reaction zone 128 of the plasma reactor 116. In other cases, the droplets can enhance the mixing and interaction between different fluids or reactive substances within the plasma reactor, thereby improving the efficiency and / or uniformity of the process.

[0106] Continue to refer to Figure 3 As used in this disclosure, a "flow regulation component" is a device that allows precise control and regulation of the flow rate of fluid through an ejector. In some cases, the flow regulation component 304 may include a manual flow control valve that can be manually adjusted to regulate the flow rate of fluid through the ejector 140. In a non-limiting example, by turning a knob, the valve opening or the opening of at least one fluid outlet 148 can be changed, thereby allowing more or less fluid to pass through the ejector 140 or be introduced into the plasma reactor 116. Alternatively or additionally, the flow regulation component 304 may include an 8X control ratio. As used in this disclosure, "control ratio" is a measure of the versatility and flexibility of the flow regulation component 304, indicating how well the flow regulation component 304 can adapt to different flow requirements within the system. Such a flow regulation component 304 can control the flow rate over a range of eight times the minimum flow rate. For example, if the minimum flow rate of the flow regulation component 304 is 1 gallon per minute (GPM), then an 8X control ratio indicates that the flow regulation component 304 can effectively regulate the flow rate from 1 GPM to up to 8 GPM. In a non-limiting example, at least one fluid outlet 148 of the injector 140 can output gas and 5µ to 8µ water droplets 308 in a spray cone 312 of 12 to 15 degrees. In one embodiment, an adjustment component 304 can terminate fluid flow.

[0107] Now for reference Figure 4 This illustrates an exemplary embodiment of a piezoelectric vapor ejector (such as a piezoelectric water vapor ejector 400). As used herein, a "piezoelectric water vapor ejector" is an ejector 140 that utilizes piezoelectric technology to generate water vapor by atomizing at least one liquid (i.e., a second fluid) into fine droplets as described above. As described herein, "water vapor" is the gaseous phase of water (i.e., the second fluid), which occurs when water molecules acquire sufficient energy to detach from the liquid state and disperse in the surrounding air (i.e., the first fluid). As described herein, "piezoelectric technology" is a technology based on the piezoelectric effect: the phenomenon in which a particular material generates an electrical charge when subjected to mechanical stress or otherwise (i.e., mechanical deformation when exposed to an electric field). In some cases, materials such as ceramics (e.g., lead zirconate titanate), quartz crystals, polymers, etc., can exhibit this effect. The piezoelectric water vapor ejector 400 may include piezoelectric elements; for example, but not limited to, ceramic discs or plates may be used to generate mechanical vibrations at a specific frequency when a voltage is applied by a power source 404. Power source 404 may include any power source as described above in this disclosure, such as a DC power source. Mechanical vibration may be transmitted to at least one fluid input from at least one fluid inlet (i.e., a first fluid inlet 144a and / or a second fluid inlet 144b), causing at least one fluid to break down into fine droplets, which then evaporate to form water vapor. In a non-limiting example, at least one fluid outlet 148 of the piezoelectric steam ejector 400 may output a water vapor and air discharge cone of at least 90 degrees. In one embodiment, the piezoelectric steam ejector 400 may have a single inlet for water only. In one embodiment, the piezoelectric steam ejector 400 may discharge into a chamber having a water inlet port and a second port for air and water vapor discharge into the reaction zone 128. In another embodiment, the piezoelectric steam ejector 400 may directly distribute water vapor into the plasma reactor 116, and a second gas-dedicated ejector may directly discharge into the reaction zone 128.

[0108] Now for reference Figure 5 An exemplary embodiment of an apparatus 100 having an external injector 504 for treating a growth medium via discharge is illustrated. As used in this disclosure, an "external injector" is one mounted externally to the apparatus 100 (rather than as referenced above). Figures 1 to 4The ejector described is integrated within device 100. External ejector 504 may include any ejector as described above, such as, but not limited to, ejector 140 (air and water ejector), piezoelectric steam ejector 400, etc. In some embodiments, external ejector 504 may be designed to deliver at least one fluid from at least one reservoir 112 to plasma reactor 116 from an external location via pipe 508. In a non-limiting example, external ejector 504 may be mechanically secured to the exterior of housing 160. In some cases, external ejector 504 may be attached to the exterior of housing 160 via screws or bolts, clamps or clips, sliding or snap-fit ​​connections, etc.

[0109] Alternatively or alternatively, and still refer to Figure 5 The ignition unit 132 may include a coil 512. As used in this disclosure, a "coil" is a spiral or helix of conductive wire that generates an electromagnetic field when current flows through it. In a non-limiting example, the coil 512 may be electrically connected to at least one of a pair of electrodes 120a to 120b (i.e., the first electrode 120a), and the coil is configured to initiate a discharge in the plasma reactor 116. The coil may include an induction coil or a high-voltage transformer coil, wherein the induction coil or high-voltage transformer coil can generate the high-voltage electrical pulse required to generate a discharge between the first electrode 120a and the second electrode 120b.

[0110] Now for reference Figure 6 A flowchart illustrating an exemplary embodiment of a method 600 for treating a growth medium via discharge is provided. Method 600 includes a step 605 of transferring at least one fluid contained in at least one reservoir to an ejector by an atmospheric pressure system. In some embodiments, the at least one reservoir may include a first reservoir configured to contain a first fluid and a second reservoir configured to contain a second fluid, wherein the first fluid may include at least one gas and the second fluid may include at least one liquid. In some embodiments, a pressure regulator may be configured to pressurize at least one fluid entering the reaction zone. This can be implemented without limitation, as described herein.

[0111] Continue to refer to Figure 6Method 600 includes step 610 of delivering at least one fluid through a reaction zone of a plasma reactor by an injector fluidly connected to at least one reservoir, wherein the plasma reactor may include at least one pair of electrodes comprising a first electrode and a second electrode, and the reaction zone is disposed between the first electrode and the second electrode. In some embodiments, the injector may include a first fluid inlet fluidly connected to a first reservoir, wherein the first fluid inlet is configured to receive a first fluid from the first reservoir; a second fluid inlet fluidly connected to a second reservoir, wherein the second fluid inlet is configured to receive a second fluid from the second reservoir; and at least one fluid outlet configured to output a mixture of the first fluid and the second fluid in droplet form to the plasma reactor. The method of claim 11, wherein the injector includes a flow adjustment component configured to regulate the flow rate of the at least one fluid entering the reaction zone. This can be implemented without limitation as described herein.

[0112] Continue to refer to Figure 6 Method 600 includes step 615 of supplying voltage to at least one electrode by an ignition unit electrically connected to at least one of at least one of a pair of electrodes. In some embodiments, the ignition unit may include an ignition circuit configured to convert power received from a power source into a high-voltage discharge of 6 kV to 30 kV. This can be implemented without limitation as described herein.

[0113] Continue to refer to Figure 6 Method 600 includes step 620 of generating a discharge by at least one pair of electrodes according to at least one fluid. In some embodiments, a first electrode of the at least one pair of electrodes may be configured to branch off from a second electrode of the at least one pair of electrodes. In some embodiments, the angle between the faces of the at least one pair of electrodes may be 12 to 16 degrees. In another embodiment, the tilt angle of the electrodes may be 6 to 8 degrees, and the spray cone of the injector may be 12 to 15 degrees. In some embodiments, the reaction zone may include a plurality of arc points between the first electrode and the second electrode of the at least one pair of electrodes. This can be implemented without limitation as described herein.

[0114] Continue to refer to Figure 6 Method 600 includes step 625, which enables the discharge to interact with the growth medium contained in the processing chamber via a reaction zone. This can be implemented without limitation, as described herein.

[0115] Continue to refer to Figure 6Method 600 may include the step of collecting reactive substances generated in the reaction zone during the generation of a discharge using a condenser disposed within the reaction zone and above the processing chamber. Method 600 may also include the step of transferring the reactive substances to the processing chamber using the condenser. This can be implemented without limitation, as described herein.

[0116] Now for reference Figure 7 An exemplary embodiment of a segment of catheter 700 is illustrated. Catheter 700 may include, as referenced above... Figure 1 Any conduit described herein. In some embodiments, conduit 700 may include a conduit that allows fluids such as gases or liquids to flow from one part of condenser 156 to another part or from condenser 156 to another component of device 100. In some cases, the conduit of condenser 156 may include multiple segments of conduit, wherein the multiple segments of conduit are connected to each other. In a non-limiting example, multiple short conduit segments may be connected to form a long conduit within condenser 156, thereby providing a longer passage for fluids. In some cases, the connection between two segments of conduit may be established via a mechanical interface. In a non-limiting example, a segment of conduit 700 may include a body 708, a first mechanical interface 704a, and a second mechanical interface 704b, wherein the first mechanical interface 704a may be connected to a first segment of conduit at a proximal end 712 of body 708, and the second mechanical interface 704b may be connected to a second segment of conduit at a distal end 716 of body 708. In some cases, the mechanical interface may include a rotary joint, wherein, as used herein, a "rotary joint" is a mechanical device for engaging two or more components (such as sections of a conduit) in a manner that allows rotational movement along a connection axis. The rotary joint may be designed to withstand pressure exerted by the flowing fluid and mechanical stresses caused by rotation. The connection sections of the conduit (such as a first section and a second section of the conduit) may include mating profiles that allow assembly and secure connection at their respective ends. In some cases, the proximal end 712 may include an outlet for the flowing fluid, while the distal end 716 may include an inlet for the flowing fluid, and vice versa. Other exemplary mechanical interfaces may include, but are not limited to, elbows, T-joints, cross joints, pipe fittings, couplings, reducers, flange joints, etc.

[0117] Still referencing Figure 7In some cases, the condenser 156 may be disposed inside the conduit. In one embodiment, the condenser 156 may not be an external component but may be integrated within the conduit itself. In some cases, the condenser 156 may be constructed of a thermally conductive material (such as, but not limited to, copper or aluminum). In a non-limiting example, the condenser 156 may include stainless steel wool and may be configured to allow fluids (such as, but not limited to, water vapor) to condense back into water droplets, as described herein. In such embodiments, the conduit may serve not only as a path for fluid flow but also as a containment vessel for the condenser 156 and as a secondary path for heat dissipation.

[0118] Now for reference Figure 8 An exemplary embodiment of the ignition unit 132 is illustrated. The ignition unit includes a voltage source 804. As used in this disclosure, a "voltage source" is an electrical device that provides a stable and continuous potential difference (i.e., voltage) between two points in a circuit. In some embodiments, the voltage source 804 may supply the energy required for the operation of various circuits, devices, and / or components in the device 100. In a non-limiting example, the ignition unit 132 may include an ignition circuit, wherein the ignition circuit is an electrical system / circuit for initiating plasma formation in the plasma reactor 116, as referenced above. Figures 1 to 2 As described. A voltage source 804 connected within the ignition unit provides the electrical energy required to generate and / or sustain discharge between at least one pair of electrodes 120a to 120b within the reaction zone 128. In one embodiment, the voltage source 804 may include an AC power supply, wherein the alternating current (AC) power supply provides a sinusoidal or non-sinusoidal waveform having a specific frequency, amplitude, and / or phase angle. In another embodiment, the voltage source 804 may include a direct current (DC) power supply, wherein the DC power supply provides a constant voltage level. In another non-limiting example, the voltage source 804 may include one or more batteries; for example, but not limited to, the ignition unit 132 may include a portable or stand-alone ignition unit, wherein the batteries may store electrical energy in the form of chemical energy and convert that chemical energy into electrical energy when needed. In some cases, the batteries may include, but are not limited to, lead-acid batteries, lithium-ion batteries, nickel-metal hydride batteries, etc.

[0119] Continue to refer to Figure 8The ignition unit 132 includes a converter 808. As used in this disclosure, a "converter" is an electrical component that transforms electrical energy from one waveform to another. In some cases, the converter 808 may modify the properties of the electrical energy, such as, but not limited to, voltage, current, waveform, etc. In one embodiment, the converter 808 is configured to convert a voltage from a DC voltage input to an AC voltage output. In some cases, AC can be used instead of DC to more efficiently generate and sustain the discharge; for example, but not limited to, an AC voltage oscillating between the first electrode 120a and the second electrode 120b can help the plasma reactor 116 ionize at least one injected fluid, sustain the plasma, and / or prevent charge buildup on at least one pair of electrodes 120a to 120b. In a non-limiting example, the converter 808 may include a DC-to-AC converter, wherein the DC-to-AC converter converts a DC voltage input to an AC voltage output having a specific waveform, frequency, and / or amplitude. In one embodiment, the converter 808 may also convert AC to AC. For example, an AC-to-AC converter may be used to convert an AC waveform having a specific frequency and amplitude to an AC waveform having another frequency and another amplitude. For example, the AC voltage controller can be a thyristor-based device that directly converts a fixed AC voltage to a variable AC voltage without changing the frequency. The AC voltage controller can be a phase-controlled device, thus eliminating the need for forced commutation circuitry and allowing the use of natural commutation or grid commutation. In such embodiments, the converter may include an inverter. In a non-limiting example, converter 808 may include a switching circuit, which is a circuit designed to quickly turn the device on and off to control the flow of current or voltage through the circuit. The switching circuit may generate a series of square wave pulses in a shape approximating an AC waveform; for example, but not limited to, converter 808 may convert a DC and / or AC voltage input into a pulse output, such as a symmetrical or asymmetrical square wave, a pulse train, and / or any other waveform including a sawtooth wave or other waveforms. In some cases, the frequency of the square wave pulses may be determined by an oscillator circuit, which is a circuit that generates periodic signals or waveforms (e.g., sine waves, square waves, etc.). In some cases, converter 808 may use electronic circuitry to modify the frequency of a periodic signal; for example, but not limited to, converter 808 may include frequency multipliers, frequency dividers, mixers, phase-locked loops (PLLs), etc., to increase or decrease the frequency of a periodic signal.

[0120] Still referencing Figure 8 The converter 808 may include a transformer. For the purposes of this disclosure, a "transformer" is an electrical device for transferring electrical energy from a first circuit to a second circuit via electromagnetic induction. In one embodiment, the transformer may be used to increase or decrease the voltage of an AC power supply to isolate the circuits from each other and / or to match the impedance of a load to the power supply. In a non-limiting example, the transformer may include those referenced above. Figure 1 The described ignition transformer. Alternatively or additionally, the switching circuit may include one or more solid-state devices, such as, but not limited to, power MOSFETs, IGBTs, thyristors, etc., to control the flow of current through the circuit. In a non-limiting example, the switching circuit may be controlled; for example, the solid-state devices within the switching circuit may be turned on and off by a control module that monitors or controls the output voltage and current of converter 808, as described in further detail below. In some embodiments, converter 808 may be configured to convert a DC voltage input to a high-voltage discharge at frequencies up to 10,000 kHz (10 MHz). Converter 808, configured to convert a DC voltage input to an AC voltage output, may be implemented using various circuit topologies, such as, but not limited to, H-bridge, full-bridge, or half-bridge configurations, and may incorporate pulse-width modulation (PWM) techniques for voltage and frequency control.

[0121] Continue to refer to Figure 8 The ignition unit 132 may include dielectric barrier discharge (DBD) operation. As used in this disclosure, “dielectric barrier discharge (DBD)” is a plasma discharge that occurs between two electrodes isolated by a dielectric material. In some cases, the dielectric material may act as insulators 212a to 212b as described above, thereby preventing current from flowing directly between at least one pair of electrodes. In a non-limiting example, DBD operation may include applying a high voltage provided by a voltage source 804 and converted by a converter 808 to at least one pair of electrodes 120a to 120b, wherein the first electrode 120a and / or the second electrode 120b of the at least one pair of electrodes 120a to 120b may be dielectrically insulated. The dielectric material may include, but is not limited to, quartz, ceramic, glass, etc. Instead of multiple arc points, multiple fine plasma filaments may be formed between at least one pair of electrodes 120a to 120b, wherein the multiple fine plasma filaments may have only a very short lifetime in the range of a few nanoseconds. In some embodiments, due to the low lifetime of DBD, DBD can be a non-thermal (cold) plasma, where heavy particles can absorb far less energy from the alternating field than lighter and faster electrons. In some embodiments, DBD operation can be via the reference above. Figure 1 The described pressure regulation system operates at atmospheric pressure.

[0122] Continue to refer to Figure 8In some embodiments, converter 808 may be able to convert an AC voltage input to a DC voltage output. In some cases, ignition unit 132 may need to convert AC power to DC power so that device 100 can perform pulsed operation. During pulsed plasma operation, plasma reactor 116 may operate in a pulsed mode in which plasma can be generated and maintained for a short period of time, followed by a period of no discharge. The DC power supply can be easily controlled and switched on and off as needed, thus making the DC power supply suitable for pulsed plasma operation. In some cases, device 100 may convert AC power to DC power to reduce electrode wear and contamination; for example, but not limited to, in an AC-powered plasma reactor 116, the constantly changing polarity of the electrodes can lead to accelerated electrode wear and the release of electrode material into the generated plasma. By using DC power, the electrodes can maintain a constant polarity, thereby reducing wear and contamination and increasing electrode life. In a non-limiting example, ignition unit 132 may include a rectifier. As used in this disclosure, a "rectifier" is an electrical device or circuit that converts AC to DC. A rectifier can be constructed using one or more diodes, where a diode is a semiconductor device that allows current to flow in only one direction and has low resistance to current in the forward direction (when the voltage is positive) and high resistance to current in the reverse direction (when the voltage is negative). In some cases, rectifiers may include, but are not limited to, half-wave rectifiers, full-wave rectifiers, etc.

[0123] Continue to refer to Figure 8The ignition unit 132 includes an electrical connection interface 812 configured to electrically connect the converter 808 to at least one of a pair of electrodes 120a to 120b disposed in the plasma reactor 116. As used in this disclosure, an "electrical connection interface" is a physical and electrical arrangement that enables the transfer of electrical energy or signals between two or more devices and / or components. In a non-limiting example, the electrical connection interface 812 may establish an electrical connection between the voltage source 804 / converter 808 and at least one of the electrodes 120a to 120b. This electrical connection allows current to flow between the voltage source 804 / converter 808 and at least one of the electrodes 120a to 120b (i.e., AC voltage output). In a non-limiting example, the electrical connection interface 812 may include an electrical connector, wherein the electrical connector is a mechatronic device for creating an electrical connection. In some embodiments, the electrical connection interface 812 may include polarity; for example, but not limited to, the electrical connection interface 812 may include a male component connected to a female component. In a non-limiting example, at least one electrode may include a screw terminal that allows attachment of one end of the continuous conductor 136 by tightening a screw. The other end of the continuous conductor 136 may include a male component such as a plug and may be connected to a female component such as a socket located on the ignition unit 132. Other exemplary embodiments of the electrical connection interface 812 may include, but are not limited to, cables, terminals, connectors, wire-to-board / board-to-board connections, etc.

[0124] Continue to refer to Figure 8The ignition circuit includes a feedback mechanism 816. The feedback mechanism 816 includes a sensor 820 configured to detect reaction data 824. As used in this disclosure, "reaction data" is information relating to the reaction occurring in the reaction zone 128 of the plasma reactor 116 and the process or operation of initiating, causing, or otherwise sustaining the reaction in the apparatus 100. In some cases, the reaction may include, but is not limited to, discharge generation, plasma generation, and / or any chemical reaction as described above in this disclosure. In one embodiment, the reaction data 824 may include a plurality of discharge parameters 828. For the purposes of this disclosure, a "discharge parameter" is a measurable property or characteristic of a discharge process (i.e., plasma generation, arc discharge, etc.). In a non-limiting example, discharge parameters 828 may include, but are not limited to, voltage, current, discharge frequency, waveform, phase angle, etc. In another embodiment, the reaction data 824 may include a plurality of fluid parameters 832. For the purposes of this disclosure, a "fluid parameter" is a measurable property or characteristic of a fluid (i.e., a first fluid and / or a second fluid) involved in the process. In a non-limiting example, fluid parameter 832 may include, but is not limited to, flow rate, pressure, fluid temperature, fluid viscosity, fluid density, fluid turbidity, or transparency. In a further embodiment, reaction data 824 may include a plurality of growth medium parameters 836. For the purposes of this disclosure, "growth medium parameter" is a measurable property or characteristic of the growth medium contained in the processing chamber 108 during the processing. In a non-limiting example, growth medium parameter 836 may include, but is not limited to, optical properties, temperature of the growth medium, humidity level within the processing chamber 108, and optical properties of the growth medium (e.g., growth, absorption, reflectivity, transmittance, etc.).

[0125] Continue to refer to Figure 8 As used in this disclosure, a "feedback mechanism" is a system that provides information about the output, results, or other performance of a device, component, or system (i.e., reaction data 824 as listed above) back to a control element (i.e., a control module as described below). In one embodiment, feedback mechanism 816 may include a negative feedback mechanism, wherein the reaction data 824 provided by the feedback loop can be used to counteract / counteract changes in system output or device operation. In this embodiment, feedback mechanism 816 can maintain device performance within a desired range or setpoint even in the presence of disturbances or changes in operating conditions. In another embodiment, feedback mechanism 816 may include a positive feedback mechanism, wherein the reaction data 824 provided by the feedback loop can be used to amplify / enhance changes in system output or device operation. In this embodiment, feedback mechanism 816 can lead to rapid changes or exponential growth in system behavior, such as, but not limited to, signal amplification in the circuitry within device 100.

[0126] Continue to refer to Figure 8As used in this disclosure, a "sensor" is a device that detects, measures, or otherwise converts physical, chemical, or environmental properties into an electrical signal, which can be processed and / or analyzed by the device / system or feedback mechanism 816 to which it is connected. In some embodiments, sensor 820 may include at least one sensor selected from a plurality of sensors comprising a voltage sensor, a moisture sensor, a temperature sensor, and an optical sensor. As used in this disclosure, a "voltage sensor" is a device configured to measure different voltage ranges (mV-kV) between two points in a circuit. In some cases, voltage sensors may operate at different frequencies from DC to high-frequency AC; for example, but not limited to, voltage sensors may be configured to measure AC and / or DC voltages. In a non-limiting example, a voltage sensor may be electrode-connected across at least one pair of electrodes 120a to 120b or connected within a reaction zone 128 to continuously monitor voltage levels. Such a voltage sensor may include a high-voltage probe with a resistive voltage divider.

[0127] Continue to refer to Figure 8 As used in this disclosure, a "moisture sensor" is a device configured to detect the presence of moisture in a material or space (such as, but not limited to, a processing chamber 108 connected to plasma reactor 116). The moisture sensor may be employed by feedback mechanism 816 to monitor the moisture content or humidity of the growth medium or processing chamber 108. In a non-limiting embodiment, the moisture sensor may include a capacitive moisture sensor, wherein the capacitive moisture sensor operates by measuring the capacitance of a sensing element, wherein the sensing element is a thin film or hygroscopic material (such as, but not limited to, a polymer or metal oxide) that absorbs or releases fluid molecules based on ambient humidity. The capacitive moisture sensor may include two electrodes separated by the sensing element, thereby forming a capacitor. When the sensing element contains moisture, the capacitance of the capacitive moisture sensor may change as molecules of at least one fluid in the material increase the effective area of ​​the electrodes. In a non-limiting example, sensor 820 may determine the moisture level of processing chamber 108 by measuring the capacitance change of the capacitive moisture sensor. Alternatively, in another non-limiting embodiment, the moisture sensor may include a resistive moisture sensor, which operates by measuring the resistance of a sensing element in a similar manner. In a non-limiting example, current may be passed through the sensing element, and the voltage drop across the electrodes may be measured. The resistance may be calculated based on Ohm's law. The sensor 820 can then determine the moisture level based on the calculated resistance of the sensing element.

[0128] Continue to refer to Figure 1As used in this disclosure, a "temperature sensor" is a device configured to measure the temperature of other devices / components within device 100. In non-limiting examples, sensor 820 may include, but is not limited to, thermocouples, thermistors, thermometers, passive infrared sensors, resistance temperature sensors (RTDs), semiconductor-based integrated circuits (ICs), combinations thereof, or another undisclosed sensor type, used alone or in combination. For the purposes of this disclosure, and as will be understood by those skilled in the art, "temperature" is a measure of the thermal energy of a system. Temperatures measured by a temperature sensor can be measured alone or in combination using Fahrenheit (℉), Celsius (°C), Kelvin (°K), or other scales. In some embodiments, sensor 820 may be configured to measure the temperature of ignition unit 132, plasma reactor 116, and / or processing chamber 108 during processing. In other embodiments, the temperature sensor may be configured to measure the temperature of the environment surrounding device 100.

[0129] Continue to refer to Figure 1 In a further embodiment, sensor 820 may include an optical device. As used herein, an "optical device" is any device that uses electromagnetic radiation (including, but not limited to, ultraviolet, visible, near-infrared, infrared, etc.) to generate, transmit, detect, or otherwise function. In some embodiments, the optical device may include one or more waveguides. As used herein, a "waveguide" is a component configured to propagate electromagnetic radiation (including, but not limited to, ultraviolet, visible, near-infrared, infrared, etc.). Waveguides may include optical guides, optical fibers, etc. Waveguides may include gratings within a transmissive material. In some cases, waveguides may be configured to function as one or more optical devices, such as resonators (e.g., microring resonators), interferometers, etc. In some cases, waveguides may be configured to propagate electromagnetic radiation (EMR). In a non-limiting example, sensor 820 may include an optical sensor in which the sensor can optically communicate with one or more waveguides. Such a sensor may be configured to detect changes in at least one optical property associated with the growth medium 104. As used in this disclosure, "optical property" is any detectable characteristic associated with electromagnetic radiation (e.g., UV, visible light, infrared, etc.).

[0130] Continue to refer to Figure 1In some embodiments, sensor 820 may include at least one photodetector. In some cases, sensor 820 may include multiple photodetectors, for example, at least one first photodetector and at least one second photodetector. In some cases, at least one first photodetector and / or at least one second photodetector may be configured to measure one or more of a first optical output and a second optical output from a first waveguide and a second waveguide, respectively. As used in this disclosure, a "photodetector" is any device that is light-sensitive and thereby capable of detecting light. In some cases, a photodetector may include a photodiode, a photoresistor, a photosensor, a photovoltaic chip, etc. In some cases, a photodetector may include a germanium-based photodiode. A photodetector may include, but is not limited to, an avalanche photodiode (APD), a single-photon avalanche diode (SPAD), a silicon photomultiplier tube (SiPM), a photomultiplier tube (PMT), a microchannel plate (MCP), a microchannel plate photomultiplier tube (MCP-PMT), an indium gallium arsenide semiconductor (InGaA), a photodiode and / or a photosensitive or photon detection circuit element, a semiconductor, and / or a transducer. As used herein, an avalanche photodiode (APD) is a reverse-biased diode (e.g., but not limited to pn, pin, and other diodes) that allows carriers generated by a single photon to trigger a brief, transient photocurrent "avalanche" on the order of milliamps or higher. This is caused by electrons being accelerated through the high-field region of the diode and bombarding covalent bonds in the ionizing material. These carriers then trigger larger impact ionization of electron-hole pairs. APDs provide a built-in gain stage through avalanche multiplication. When the reverse bias is less than the breakdown voltage, the gain of an APD is approximately linear. For silicon APDs, this gain is on the order of 10 to 100. The material of the APD can contribute to the gain. Germanium APDs can detect infrared light at wavelengths of 1.7 micrometers. InGaA can detect infrared light at wavelengths of 1.6 micrometers. Mercury cadmium telluride (HgCdTe) can detect infrared light at wavelengths of 14 micrometers. APDs with a reverse bias significantly higher than the breakdown voltage are called single-photon avalanche diodes or SPADs. In this configuration, the np electric field is sufficiently high to sustain the avalanche current with a single photon, hence the term "Geiger mode." This avalanche current rises rapidly (sub-nanosecond), making its detection useful for estimating the arrival time of the incident photon. Once triggered, the SPAD can be pulled below its breakdown voltage to reset or suppress the avalanche current before another photon can be detected, since the effect of charge carriers from the additional photon on the current in the diode is negligible when the avalanche current is active. At least one first photodetector can be configured to generate a first signal based on changes in the optical properties of the first waveguide, wherein the first signal may include, but is not limited to, any voltage and / or current waveform. Alternatively or additionally, the sensor device may include a second photodetector located downstream of a second waveguide.In some implementations, the second photodetector may be configured to measure changes in the optical properties of the second waveguide and generate a second signal based on the changes in the optical properties of the second waveguide.

[0131] Continue to refer to Figure 1 In some cases, the photodetector may include a photodetector array, such as, but not limited to, a one-dimensional array. The photodetector array may be configured to detect changes in the optical properties of the waveguide. In some cases, the first photodetector and / or the second photodetector may be wavelength-dependent. For example, but not limited to, the first photodetector and / or the second photodetector may have a narrow wavelength range, each of which is sensitive to that wavelength range. As another non-limiting example, each of the first and second photodetectors may be preceding a wavelength-specific optical filter, such as a bandpass filter and / or a filter bank; in any case, a beam splitter may divide the output from an optical matrix multiplier as described below and provide that output to each of the first and second photodetectors. Alternatively or additionally, one or more optical elements may divide the output from the waveguide before providing it to each of the first and second photodetectors, such that each of the first and second photodetectors receives different wavelengths and / or groups of wavelengths. For example, but not limited to, in some cases, a wavelength demultiplexer may be disposed between the waveguide and the first and / or second photodetectors; and the wavelength demultiplexer may be configured to separate one or more lights or optical arrays according to wavelength. As used in this disclosure, a “wavelength demultiplexer” is a device configured to separate two or more wavelengths of light from a shared optical path. In some cases, a wavelength demultiplexer may include at least one dichroic beam splitter. In some cases, a wavelength demultiplexer may include any of a hot mirror, a cold mirror, a short-pass filter, a long-pass filter, a notch filter, etc. An exemplary wavelength demultiplexer may include part WDM-11P from OZ Optics, Ottawa, Ontario, Canada. Other examples of demultiplexers may include, but are not limited to, gratings, prisms, and / or any other devices and / or components for separating light by wavelength that would be conceived by a person skilled in the art upon review of the full contents of this disclosure. In some cases, at least one photodetector may communicate with a computing device (i.e., by means of a sensed signal), as described below in this disclosure.

[0132] Continue to refer to Figure 8The ignition unit 132 may include a control module 840, which is communicatively connected to the feedback mechanism 816 and configured to control various other components of the ignition unit 132, such as, but not limited to, a voltage source 804, a converter 808, the feedback mechanism 816, etc. The control module may include analog or digital control circuitry or any combination thereof, such as operational amplifier circuitry, transistor-based circuitry or other analog circuitry, combinational logic circuitry using one or more gates, synchronous or asynchronous sequential logic circuitry using one or more registers, latches, or other state-holding elements, finite state machines, etc. The control module 840 may include any computing device as described in this disclosure, including but not limited to microcontrollers, microprocessors, digital signal processors (DSPs), and / or system-on-a-chip (SoCs) as described in this disclosure. The computing device may include a mobile device (such as a mobile phone or smartphone), be included in the mobile device, and / or communicate with the mobile device. The control module 840 may include a single computing device operating independently, or may include two or more computing devices operating collaboratively, in parallel, sequentially, etc.; two or more computing devices may be included together in a single computing device or included in two or more computing devices. Control module 840 can interface with or communicate with one or more additional devices via a network interface device, as described in further detail below. The network interface device can be used to connect control module 840 to one or more networks and one or more devices in a variety of networks. Examples of network interface devices include, but are not limited to, network interface cards (e.g., mobile network interface cards, LAN cards), modems, and any combination thereof. Examples of networks include, but are not limited to, wide area networks (e.g., the Internet, corporate networks), local area networks (e.g., networks associated with offices, buildings, campuses, or other relatively small geographical spaces), telephone networks, data networks associated with telephone / voice providers (e.g., mobile communication provider data and / or voice networks), direct connections between two computing devices, and any combination thereof. Networks can employ wired and / or wireless communication modes. Generally, any network topology can be used. Information (e.g., data, software, etc.) can be transmitted to and / or from computers and / or computing devices. Control module 840 may include, for example, computing devices or clusters of computing devices in a first location and second computing devices or clusters of computing devices in a second location. Control module 840 may include one or more computing devices dedicated to data storage, security, traffic distribution for load balancing, etc. Control module 840 may distribute one or more computing tasks, as described below, across multiple computing devices, which may operate in parallel, serial, redundantly, or in any other manner for distributing tasks or memory among computing devices. Control module 840 may be implemented using a "shared-nothing" architecture, in which data is cached at worker nodes.In one implementation, this enables the scalability of device 100 and / or computing device.

[0133] Continue to refer to Figure 8 The control module 840 may be designed and / or configured to execute any method, method step, or sequence of method steps in any embodiment described herein in any order and with any degree of repetition. For example, the control module 840 may be configured to repeatedly execute a single step or sequence until a desired or commanded result is achieved; the repetition of steps or sequences of steps may be performed iteratively and / or recursively by using the output of a previous repetition as input for a subsequent repetition, aggregating the inputs and / or outputs of repetitions to produce an aggregated result, reducing or decrementing one or more variables (such as global variables), and / or dividing a larger processing task into a set of smaller processing tasks that are iteratively addressed. The control module 840 may execute any step or sequence of steps as described herein in parallel, such as by using two or more parallel threads, processor cores, etc., to execute steps two or more times simultaneously and / or substantially simultaneously; the task division between parallel threads and / or processes may be performed according to any protocol suitable for task division between iterations. Those skilled in the art, upon reviewing the entire contents of this disclosure, will appreciate various ways in which iterative, recursive, and / or parallel processing can be used to subdivide, share, or otherwise process steps, sequences of steps, processing tasks, and / or data.

[0134] Continue to refer to Figure 8 As used in this disclosure, "communicative connection" means a connection made by means of a link, attachment, or connection between two or more related entities that allow the receiving and / or sending of information therebetween. For example, but not limited to, the connection can be wired or wireless, direct or indirect, and between two or more components, circuits, devices, systems, etc., allowing the receiving and / or sending of data and / or signals therebetween. The data and / or signals therebetween can include, but are not limited to, electrical, electromagnetic, magnetic, video, audio, radio and microwave data and / or signals, combinations thereof, etc. A communication connection can be implemented, for example, but not limited to, directly or by means of one or more intermediate devices or components, via wired or wireless electronic, digital, or analog communication. Furthermore, a communication connection can include electrically coupling or connecting at least one output of one device, component, or circuit to at least one input of another device, component, or circuit. For example, but not limited to, via a bus or other facility for mutual communication between elements of a computing device. A communication connection can also include indirect connections via, for example, but not limited to, wireless connections, radio communication, low-power wide area networks, optical communication, magnetic coupling, capacitive coupling, or optical coupling. In some cases, the term “communicative coupling” may be used in place of “communicative connection” in this disclosure.

[0135] Still referencing Figure 8In some embodiments, internal components of device 100 may communicate with control module 840 using one or more signals. As used in this disclosure, a "signal" is a human-understandable and / or machine-readable data representation, such as, but not limited to, electrical and / or digital signals from one device to another; signals may be transmitted using any suitable communication connection. Signals may include optical signals, hydraulic signals, pneumatic signals, mechanical signals, electrical signals, digital signals, analog signals, etc. In some cases, signals may be used to communicate with control module 840, for example, via one or more ports. In some cases, signals may be sent and / or received by control module 840, for example, via input / output ports. Analog signals may be digitized, for example, by means of an analog-to-digital converter. In some cases, analog signals may be processed, for example, by means of any analog signal processing steps described in this disclosure, prior to digitization. In some cases, digital signals may be used to communicate between two or more devices, including but not limited to feedback mechanism 816 and control module 840. In some cases, digital signals can communicate using one or more communication protocols, including but not limited to Internet Protocol (IP), Controller Area Network (CAN) protocol, serial communication protocols (e.g., Universal Asynchronous Receiver-Transmitter [UART]), parallel communication protocols (e.g., IEEE 128 [Printer Port]), etc.

[0136] Further reference Figure 8In some cases, control module 840 may perform one or more signal processing steps on the signal. For example, control module 840 may analyze, modify, and / or synthesize signals representing data to improve the signal, for example, by improving transmission, storage efficiency, or signal-to-noise ratio. Exemplary methods of signal processing may include analog, continuous-time, discrete, digital, nonlinear, and statistical methods. Analog signal processing may be performed on non-digital or analog signals. Exemplary analog processes may include passive filters, active filters, adder mixers, integrators, delay lines, companders, multipliers, voltage-controlled filters, voltage-controlled oscillators, phase-locked loops, and / or any other process using operational amplifiers or other analog circuit elements. In some cases, continuous-time signal processing may be used to process signals that vary continuously within a domain (e.g., time). Exemplary non-limiting continuous-time processing may include time-domain processing, frequency-domain processing (Fourier transform), and complex frequency-domain processing. Discrete-time signal processing may be used when the signal is sampled discontinuously or at discrete time intervals (i.e., quantized in time). Analog discrete-time signal processing can use exemplary circuitry such as sampling and holding circuits, analog time-division multiplexers, analog delay lines, and analog feedback shift registers to process signals. Digital signal processing can be used to process digitized discrete-time sampled signals. Typically, digital signal processing can be performed by computing devices or other dedicated digital circuitry, such as, but not limited to, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or dedicated digital signal processors (DSPs). Digital signal processing can be used to perform any combination of typical arithmetic operations, including fixed-point and floating-point, real-valued and complex-valued, multiplication and addition. Digital signal processing can also operate on circular buffers and lookup tables. Other non-limiting examples of algorithms that can be performed according to digital signal processing techniques include Fast Fourier Transform (FFT), Finite Impulse Response (FIR) filters, Infinite Impulse Response (IIR) filters, and adaptive filters such as Wiener filters and Kalman filters. Statistical signal processing can be used to process signals as random functions (i.e., random processes) by leveraging statistical properties. For example, in some implementations, a signal can be modeled using a probability distribution indicating noise, which can then be used to reduce noise in the processed signal.

[0137] Continue to refer to Figure 8The control module 840 is configured to initiate the generation of a discharge in a reaction zone 128 disposed between a first electrode 120a and a second electrode 120b based on an AC voltage output. The control module 840 can adjust the voltage provided by the voltage source 804. In a non-limiting example, the control module 840 can apply an AC voltage output converted by the converter 808 to at least one of the at least one pair of electrodes 120a to 120b. An AC electric field can be established between the first electrode 120a and the second electrode 120b in the reaction zone 128. When the AC electric field becomes sufficiently strong, a discharge can ionize at least one fluid passing through the reaction zone 128, thereby generating a discharge. The reaction zone 128 is then configured to allow the discharge to interact with the growth medium 104. The control module 840 can receive reaction data 824 detected by a sensor 820 within a feedback mechanism 816 during the interaction between the discharge and the growth medium 104. The reaction data 824 may include any reaction data as described in this disclosure, such as, but not limited to, multiple discharge parameters 828, fluid parameters 832, growth medium parameters 836, etc. A feedback mechanism 816 may provide this reaction data 824 to the control module 840. The control module 840 may process the reaction data 824 and adjust the operation of the ignition unit 12 accordingly, as described in further detail below, to maintain optimal discharge conditions and achieve the desired processing effect.

[0138] Continue to refer to Figure 8In one embodiment, the control module 840 may adjust at least one processing parameter 844 of the device 100 based on reaction data 824. As used in this disclosure, a “processing parameter” is an operating parameter configured to optimize the processing based on information received from the feedback mechanism 816 as described above (e.g., reaction data 824). In one embodiment, the processing parameter 844 may include an AC voltage; for example, but not limited to, the control module 840 may adjust the amplitude of the AC voltage supplied to at least one of at least one of a pair of electrodes 120a to 120b, wherein the AC voltage may affect the intensity of the discharge and the energy transferred to the plasma. In another embodiment, the processing parameter 844 may include an AC frequency; for example, but not limited to, the control module 840 may change the AC frequency of the AC voltage, wherein the AC frequency may affect the rate of generation of a particular plasma substance or chemical reaction. In a further embodiment, the processing parameter 844 may include a pulse width, wherein the pulse width refers to a duration or time interval during which the pulse signal is in its “on” state. In a non-limiting example, ignition unit 132 may include pulse width modulation to modulate an AC voltage supplied by voltage source 804 or output by converter 808. Control module 840 may adjust the pulse width of the modulated signal to control the AC voltage output to at least one of at least one of a pair of electrodes 120a to 120b. In other embodiments, processing parameter 844 may include a phase angle, wherein the phase angle describes a timing or positional difference between two waveforms having the same frequency. In a non-limiting example, control module 840 may control the phase angle between voltage and current waveforms to optimize power transfer of ignition unit 132 and maintain stable discharge within plasma reactor 116. Other exemplary embodiments of processing parameter 844 may include, but are not limited to, the flow rate of at least one fluid, the fluid composition of at least one fluid, etc.

[0139] Continue to refer to Figure 8The control module 840 may use the machine learning module to implement one or more algorithms or generate one or more machine learning models (such as processing machine learning models) to determine at least one processing parameter 844. However, the machine learning module is exemplary and may not be necessary for generating one or more machine learning models and performing any machine learning described herein. In one or more embodiments, training data may be used to generate one or more machine learning models. The training data may include inputs and corresponding predetermined outputs, such that the machine learning model can use the provided exemplary input-output correlations to develop algorithms and / or relationships that then allow the machine learning model to determine its own outputs for the inputs. The training data may contain correlations that the machine learning process can use to model relationships between data elements of two or more categories. Exemplary inputs and outputs may come from a database (such as any database described herein) or be provided by a user of device 100. In other embodiments, the machine learning module may obtain a training set by querying a communicatively connected database that includes past inputs and outputs. The training data may include inputs from various types of databases, resources, and / or user inputs and outputs associated with each of those inputs, such that the machine learning model can determine the outputs. Correlation indicates a causal and / or predictive link between data, which can be modeled as a relationship (such as a mathematical relationship) by a machine learning model, as described in further detail below. In one or more implementations, training data can be formatted and / or organized according to data element categories, for example, by associating data elements with one or more descriptors corresponding to the data element categories. As a non-limiting example, training data may include data input by a person or process in a standardized form, such that the input of a given data element in a given field of the form can be mapped to one or more category descriptors. Elements in the training data may be linked to category descriptors via labels, tokens, or other data elements. A machine learning module can be used to generate a processing machine learning model using the training data. The processing machine learning model can be trained using the correlated inputs and outputs of the training data. The training data may be a dataset that has been transformed from raw data by human, machine, or any other method. The training data may include previous outputs, such that the processing machine learning model iteratively produces outputs. The processing machine learning model using a machine learning process can output transformed data based on the inputs of the training data.

[0140] Continue to refer to Figure 8In one embodiment, adjusting at least one processing parameter 844 may include using a machine learning model (such as a processing machine learning model) to determine at least one processing parameter 844. The processing machine learning model may be trained with training data (such as processing training data). Determining at least one processing parameter 844 using a machine learning model based on reaction data 824 may include receiving user processing training data. In one embodiment, the processing training data may include a plurality of reaction data 824, each associated with at least one processing parameter 844. In another embodiment, each element of the reaction data 824 may be associated with a plurality of processing parameters 844. For example, but not limited to, the processing training data may be used to illustrate how the reaction data may indicate a particular processing parameter 844. The control module may adjust the processing parameter 844 to ensure accurate and effective treatment of the growth medium 104 and optimize the treatment process for desired results. In one embodiment, the processing training data may include a plurality of discharge parameters 828, each associated with at least one processing parameter 844. In this embodiment, the processing training data may be used to illustrate how one or more discharge parameters 828 may indicate one or more processing parameters 844. In another embodiment, the processing training data may further include a plurality of fluid parameters 832, each of which is associated with at least one processing parameter 844. In this embodiment, the processing training data can be used to illustrate how one or more fluid parameters 832 may indicate one or more processing parameters 844. In a further embodiment, the processing training data may further include a plurality of growth medium parameters 836, each of which is associated with at least one processing parameter 844. In this embodiment, the processing training data can be used to illustrate how one or more growth medium parameters 836 may indicate one or more processing parameters 844. Determining at least one processing parameter 844 using a machine learning model may further include training a processing machine learning model based on the processing training data, and using the trained processing machine learning model to determine at least one processing parameter 844.

[0141] Now for reference Figure 9 This illustrates an exemplary embodiment of a machine learning module 900 capable of performing one or more machine learning processes as described in this disclosure. The machine learning module can use machine learning processes to perform determination, classification, and / or analysis steps, methods, procedures, etc., as described in this disclosure. As used in this disclosure, a "machine learning process" is a process that automatically generates an algorithm using training data 904, which will be executed by a computing device / module to produce an output 908 given data provided as input 912; this contrasts with non-machine learning software programs, in which the commands to be executed are predetermined by the user and written in a programming language.

[0142] Still referencing Figure 9As used herein, “training data” refers to data containing correlations that a machine learning process can use to model relationships between data elements of two or more categories. For example, but not limited to, training data 904 may include multiple data entries, each representing a set of data elements recorded, received, and / or generated together; data elements can be associated by shared presence in a given data entry, proximity in a given data entry, etc. Multiple data entries in training data 904 may indicate one or more trends in the correlation between data element categories; for example, but not limited to, higher values ​​of a first data element belonging to a first data element category may tend to be correlated with higher values ​​of a second data element belonging to a second data element category, indicating a possible proportion or other mathematical relationship linking values ​​belonging to the two categories. Multiple data element categories may be correlated in training data 904 according to various correlations; correlations may indicate causal and / or predictive relationships between data element categories, which can be modeled by a machine learning process as relationships such as mathematical relations, as described in further detail below. Training data 904 may be formatted and / or organized according to data element categories, for example, by associating data elements with one or more descriptors corresponding to data element categories. As a non-limiting example, training data 904 may include data input by a person or process in a standardized form, such that the input of a given data element in a given field of the form can be mapped to one or more category descriptors. Elements in training data 904 may be linked to category descriptors via labels, tokens, or other data elements; for example, but not limited to, training data 904 may be provided in a fixed-length format, a format that links the location of data to categories (such as comma-separated values ​​(CSV) format), and / or a self-describing format (such as Extensible Markup Language (XML), JavaScript Object Notation (JSON), etc.), thereby enabling a process or device to detect the category of the data.

[0143] Alternatively, or in another location, and continue to refer to [the relevant information]. Figure 9Training data 904 may include one or more unclassified elements; that is, training data 904 may be unformatted or may not contain descriptors for some data elements. Machine learning algorithms and / or other processes may classify training data 904 according to one or more categories using, for example, natural language processing algorithms, tokenization, detection of relevant values ​​in the raw data, etc.; relevance and / or other processing algorithms may be used to generate categories. As a non-limiting example, in a text corpus, phrases consisting of a number "n" compound words (such as nouns modified by other nouns) may be identified based on the statistical significance and popularity of n-grams containing such words arranged in a specific order; such n-grams may be classified as a language element (such as a "word") and tracked in a manner similar to single words, thereby generating new categories based on statistical analysis. Similarly, in data entries comprising some text data, names may be identified by reference lists, dictionaries, or other compilations of terms, allowing for provisional classification by machine learning algorithms and / or automatic association of data in the data entries with descriptors or to a given format. The ability to automatically classify data entries allows the same training data 904 to be applied to two or more different machine learning algorithms, as described in further detail below. The training data 904 used by the machine learning module 900 can correlate any input data as described in this disclosure with any output data as described in this disclosure.

[0144] Further reference Figure 9One or more supervised and / or unsupervised machine learning processes and / or models, as further detailed below, can be used to filter, classify, and / or select training data; such models may include, but are not limited to, training data classifier 916. Training data classifier 916 may include a “classifier,” as used herein, which is a machine learning model (such as a mathematical model, neural network, or a program generated by a machine learning algorithm referred to as a “classification algorithm”) as defined below, which, as further detailed below, classifies input into data categories or bins and outputs data categories or bins and / or labels associated with them. The classifier may be configured to output at least one data point that labels or otherwise identifies a set of data that is determined to be close to each other, clustered together, etc., according to a distance metric as described below. The distance metric may include any norm, such as, but not limited to, the Pythagorean norm. Machine learning module 900 may use a classification algorithm to generate the classifier, which is defined as the process by which a computing device and / or any module and / or component operating thereon derives a classifier from training data 904. Classification can be performed using, but is not limited to, linear classifiers (such as, but not limited to, logistic regression and / or Naive Bayes classifiers), nearest neighbor classifiers (such as k nearest neighbor classifiers), support vector machines, least squares support vector machines, Fisher linear discriminants, quadratic classifiers, decision trees, boosting trees, random forest classifiers, learned vector quantization and / or neural network-based classifiers.

[0145] Still referencing Figure 9 The machine learning module 900 can be configured to execute a lazy learning process 920 and / or protocol, which may alternatively be referred to as a "lazy loading" or "call-as-you-go" process and / or protocol. This can be a process of performing machine learning by combining the input and training set upon receiving an input to be converted into an output, thereby deriving an algorithm to be used to generate output on demand. For example, a set of initial simulations may be performed to cover the output and / or the initial heuristic and / or "first guess" of the relationship. As a non-limiting example, the initial heuristic may include a ranking of the correlation between the input and the elements of the training data 904. The heuristic may include selecting a number of the highest-ranking correlations and / or elements of the training data 904. Lazy learning can implement any suitable lazy learning algorithm, including but not limited to the K-nearest neighbor algorithm, lazy naive Bayes algorithm, etc.; those skilled in the art, upon reviewing the entire contents of this disclosure, will recognize various lazy learning algorithms applicable to generating outputs as described in this disclosure, including but not limited to lazy learning applications of machine learning algorithms further detailed below.

[0146] Alternatively, or in another location, and continue to refer to [the relevant information]. Figure 9The machine learning process described in this disclosure can be used to generate machine learning model 924. As used in this disclosure, a "machine learning model" is a mathematical and / or algorithmic representation of the relationship between inputs and outputs, generated using any machine learning process (including, but not limited to, any process described above), and stored in memory; once created, machine learning model 924 is fed inputs to the machine learning model, which generates outputs based on derived relationships. For example, but not limited to, a linear regression model generated using a linear regression algorithm can use coefficients derived during the machine learning process to compute linear combinations of input data to compute output data. As another non-limiting example, machine learning model 924 can be generated by creating an artificial neural network (such as a convolutional neural network including an input layer of nodes, one or more intermediate layers, and an output layer of nodes). Connections between nodes can be created via a process of "training" the network, in which elements from a training data set 904 are applied to the input nodes, and then a suitable training algorithm (such as the Levenberg-Marquardt method, conjugate gradient method, simulated annealing, or other algorithms) is used to adjust the connections and weights between nodes in adjacent layers of the neural network to produce desired values ​​at the output nodes. This process is sometimes referred to as deep learning.

[0147] Still referencing Figure 9 The machine learning algorithm may include at least one supervised machine learning process 928. As defined herein, at least one supervised machine learning process 928 includes an algorithm that receives a training set relating several inputs to several outputs and seeks to find one or more mathematical relations relating the inputs to the outputs, wherein each of the one or more mathematical relations is optimal according to a certain criterion specified to the algorithm using a certain scoring function. For example, the supervised learning algorithm may include response data as described above as input, at least one processing parameter as output, and a scoring function in the expected form representing the relation between the inputs and outputs to be detected; for example, the scoring function may seek to maximize the probability that a given input and / or combination of element inputs is associated with a given output, and minimize the probability that a given input is not associated with a given output. The scoring function may be expressed as a risk function representing the “expected loss” of the algorithm relating the inputs to the outputs, wherein the loss is calculated as an error function representing the degree to which a prediction generated by the relation is incorrect when compared to a given input-output pair provided in training data 904. Those skilled in the art will recognize various possible variations of at least one supervised machine learning process 928 that can be used to determine the relation between inputs and outputs after reviewing the entire contents of this disclosure. Supervised machine learning processes can include classification algorithms as defined above.

[0148] Further reference Figure 9Machine learning processes may include at least one unsupervised machine learning process 932. As used herein, an unsupervised machine learning process is a process of deriving inferences from a dataset without regard to labels; therefore, unsupervised machine learning processes are free to discover any structure, relationships, and / or correlations provided in the data. Unsupervised processes may not require a response variable; unsupervised processes can be used to discover patterns of interest and / or inferences between variables, to determine the degree of correlation between two or more variables, etc.

[0149] Still referencing Figure 9 The machine learning module 900 can be designed and configured to create a machine learning model 924 using techniques used to develop linear regression models. The linear regression model may include ordinary least squares regression, the purpose of which is to minimize the squared difference between the predicted and actual results based on an appropriate norm (e.g., the vector space distance norm) used to measure this difference; the coefficients of the resulting linear equation may be modified to improve the minimization. The linear regression model may include the ridge regression method, where the function to be minimized includes a least squares function plus multiplying the square of each coefficient by a scalar value to penalize terms with large coefficients. The linear regression model may include a Least Absolute Shrinkage and Selection Operator (LASSO) model, where ridge regression is combined with multiplying the least squares terms by a factor of 1 divided by twice the sample size. The linear regression model may include a multi-task lasso model, where the norm applied in the least squares terms of the lasso model is the Frobenius norm, which is equal to the square root of the sum of the squares of all terms. Linear regression models may include elastic net models, multi-task elastic net models, minimum angle regression models, LARSlasso models, orthogonal matching pursuit models, Bayesian regression models, logistic regression models, stochastic gradient descent models, perceptron models, passive attack algorithms, robust regression models, Huber regression models, or any other suitable models that may be conceived by those skilled in the art after reviewing the full contents of this disclosure. In one embodiment, the linear regression model may be generalized to a multinomial regression model, thereby seeking a multinomial equation (e.g., a quadratic, cubic, or higher-order equation) that provides the best fit between the predicted output and the actual output; methods similar to those described above may be applied to minimize the error function, as will be apparent to those skilled in the art after reviewing the full contents of this disclosure.

[0150] Continue to refer to Figure 9Machine learning algorithms may include, but are not limited to, linear discriminant analysis. Machine learning algorithms may include quadratic discriminant analysis. Machine learning algorithms may include kernel ridge regression. Machine learning algorithms may include support vector machines, including but not limited to regression processes based on support vector classification. Machine learning algorithms may include stochastic gradient descent algorithms, including classification and regression algorithms based on stochastic gradient descent. Machine learning algorithms may include nearest neighbor algorithms. Machine learning algorithms may include various forms of latent space regularization, such as variational regularization. Machine learning algorithms may include Gaussian processes, such as Gaussian process regression. Machine learning algorithms may include cross-decomposition algorithms, including partial least squares and / or canonical correlation analysis. Machine learning algorithms may include Naive Bayes methods. Machine learning algorithms may include decision tree-based algorithms, such as decision tree classification or regression algorithms. Machine learning algorithms may include ensemble methods, such as bagged meta-estimators, random tree forests, AdaBoost, gradient tree boosting, and / or voting classifier methods. Machine learning algorithms may include neural network algorithms, including convolutional neural network processes.

[0151] Now for reference Figure 10 A flowchart illustrating an exemplary embodiment of a method 1000 for treating a growth medium via discharge is provided. Method 1000 includes a step 1005 where a voltage is supplied by a voltage source. This can be implemented without limitation, as described herein.

[0152] Continue to refer to Figure 10 Method 1000 includes step 1010 of converting a voltage from a direct current (DC) voltage input to an alternating current (AC) output by a converter. In some embodiments, the converter may be configured to convert a DC voltage input to a high-voltage discharge of 10,000 kHz (10 MHz). This can be implemented without limitation as described herein.

[0153] Continue to refer to Figure 10 Method 1000 includes step 1015 of electrically connecting a converter to at least one electrode of a pair of electrodes disposed in a plasma reactor via an electrical connection interface, wherein the pair of electrodes includes a first electrode and a second electrode. In some embodiments, the first electrode of the at least pair of electrodes may be configured to branch off from the second electrode of the at least pair of electrodes. In some embodiments, each electrode of the at least pair of electrodes may include a tilt angle of 6 to 8 degrees (for a combined angle of 12 to 16 degrees between the at least pair of electrodes). In some embodiments, at least one electrode of the pair of electrodes may include a dielectric insulator. This can be implemented without limitation as described herein.

[0154] Continue to refer to Figure 10Method 1000 includes step 1020 of initiating the generation of a discharge in a reaction region disposed between a first electrode and a second electrode by a control module. In some embodiments, the reaction region may include a plurality of arc points between a first electrode and a second electrode in at least one pair of electrodes. This can be implemented without limitation as described herein.

[0155] Continue to refer to Figure 10 Method 1000 includes step 1025, which enables the discharge to interact with the growth medium contained in the processing chamber via a reaction zone. This can be implemented without limitation, as described herein.

[0156] Continue to refer to Figure 10 Method 1000 includes step 1030 of detecting reaction data using a sensor via a feedback mechanism. In some embodiments, the sensor may include at least one of a plurality of sensors selected from a voltage sensor, a current sensor, a temperature sensor, a moisture sensor, and an optical sensor. In some embodiments, the reaction data may include a plurality of discharge parameters, a plurality of fluid parameters, and a plurality of growth medium parameters. This can be implemented without limitation as described herein.

[0157] Continue to refer to Figure 10 Method 1000 may include the following steps: receiving reaction data detected by a sensor from a feedback mechanism by a control module, and adjusting at least one processing parameter of the device based on the reaction data. In some embodiments, adjusting the at least one processing parameter may include training a processing machine learning model by the control module using processing training data, wherein the processing training data may include multiple reaction data as inputs and related to multiple processing parameters as outputs, and the control module determines the at least one processing parameter based on the trained processing machine learning model. As described herein, this may be implemented without limitation.

[0158] Now for reference Figures 11A to 11CAn exemplary embodiment of a portion of an ejector 1100 for a plasma reactor is illustrated. As used in this disclosure, a "plasma reactor" is a device configured to generate, sustain, and / or control plasma. For the purposes of this disclosure, "plasma" refers to a fourth state of matter other than solid, liquid, and gas. Plasma may comprise a partially ionized gas consisting of a mixture of ions, electrons, and / or neutral particles (i.e., atoms and molecules). In one embodiment, plasma can be formed when at least one fluid is subjected to a high-energy source (such as, but not limited to, heat, radiation, electric fields, etc.), resulting in the ionization of atoms or molecules in at least one fluid by losing or gaining electrons. At least one fluid may be fed into the plasma reactor using ejector 1100, as described below in this disclosure. In some cases, the plasma may comprise a nonthermal plasma (NTP), wherein a nonthermal plasma is a plasma whose electron temperature is significantly higher than the temperature of heavier ions and neutral particles. In this case, although the electrons in the plasma have high kinetic energy, the overall temperature of at least one fluid may be kept relatively low (e.g., typically close to room temperature of 30°C–32°C / 68°F–72°F). Alternatively or concurrently, the energy distribution among particles in a non-thermal plasma may not be in thermal equilibrium because electrons, which are much lighter than ions and neutral particles, gain energy more quickly when subjected to an electric or magnetic field, resulting in higher electron temperatures. On the other hand, heavier ions and neutral particles can move more slowly and remain cooler, resulting in a low temperature for at least one fluid. As used in this disclosure, "fluid" is a flowable gaseous or liquid material, including but not limited to water, nitrogen, oxygen, and / or other gases and / or liquids.

[0159] Continue to refer to Figures 11A to 11C As used in this disclosure, an "ejector" is a component designed to introduce at least one fluid into a plasma reactor. Specifically, the injection may occur within the reaction zone of the plasma reactor. In a non-limiting example, the ejector 1100 is configured to deliver at least one fluid through the reaction zone of the plasma reactor. As used in this disclosure, a "reaction zone" is a designated area or space within the plasma reactor where a specific chemical or physical reaction occurs. The at least one fluid can then be used by the plasma reactor to generate plasma. For the purposes of this disclosure, a "fluid connection" refers to a path or link capable of transferring at least one fluid. In a non-limiting example, the fluid connection between the ejector 1100 and at least one reservoir may be established using various components (such as, but not limited to, pipes, conduits, hoses, channels, etc.) to form a continuous path for the flow of at least one fluid.

[0160] Continue to refer to Figures 11A to 11CIn some embodiments, the ejector 1100 includes at least one fluid outlet 1104a to 1104d. As used in this disclosure, a "fluid outlet" is an outlet point through which at least one fluid is discharged from the ejector 1100 into the reaction zone of the plasma reactor. In some embodiments, at least one fluid outlet 1104a to 1104d is configured to output at least one fluid to the plasma reactor in a conical distribution 1112. For the purposes of this disclosure, a "conical distribution" of droplets is a cone-like distribution shape of droplets of at least one fluid. As a non-limiting example, at least one fluid dispersed from at least one fluid outlet 1104a to 1104d may include a conical distribution 1112 due to the physical properties of fluid dynamics. For example, but not limited to, when at least one fluid exits the nozzle of at least one fluid outlet 1104a to 1104d, the at least one fluid initially travels in a straight line before encountering the surrounding air. When the at least one fluid enters the air, it is subjected to aerodynamic forces (such as drag and turbulence), which causes it to spread out in a conical distribution 1112. This phenomenon, known as the Coanda effect, describes the tendency of a fluid jet to adhere to a nearby surface, such as the air surface surrounding droplet 1116. The conical distribution 1112 may also be influenced by the size and shape of the nozzles of at least one fluid outlet 1104a to 1104d, the pressure and velocity of at least one fluid, and the properties of the surrounding air. In some embodiments, the conical distribution 1112 includes a distribution angle. For the purposes of this disclosure, the “distribution angle” of the conical distribution refers to the angle between the longitudinal axis of the conical distribution and a reference plane or axis within the plasma reactor. As a non-limiting example, the distribution angle of the conical distribution of at least one fluid may include various angles, such as, but not limited to, 12°, 13°, 14°, 15°, etc. In some embodiments, the conical distribution of the droplet may conform to the shape of a pair of electrodes of the plasma reactor. As a non-limiting example, when the inclination angle of the pair of electrodes is 6° (i.e., when the angle between the pair of electrodes is 12°), the distribution angle of the conical distribution of at least one fluid may include 12°. In some embodiments, the conical distribution 1112 includes droplets 1116 of at least one fluid. As used in this disclosure, "droplet" refers to a small, spherical liquid particle. In some embodiments, at least one fluid outlet 1104a to 1104d may output droplets 1116 of various sizes of at least one fluid. As a non-limiting example, droplets may include microdroplets. For the purposes of this disclosure, a "microdroplet" is a droplet with a diameter less than 110 micrometers. For example, but not limited to, the diameter of the microdroplets 1116 may include 5µm, 6µm, 7µm, 8µm, etc. In some cases, at least one fluid outlet 1104a to 1104d may be configured to allow at least one fluid to be released to a intended location within the reaction zone.For example, but not limited to, at least one fluid outlet 1104a to 1104d may be placed at the center and directly above at least one pair of electrodes.

[0161] Continue to refer to Figures 11A to 11C In some embodiments, at least one fluid outlet 1104a to 1104d may be configured to generate a nitrogen oxide (NOx) concentration. For example, but not limited to, when the plasma reacts with air, the plasma can generate a variety of reactive substances, including nitrogen oxides (NOx). The reactive substances disclosed herein are further described below. For example, but not limited to, NOx substances can react with droplets 1116 in the plasma reactor to form nitric acid. Because nitric acid is highly soluble in at least one fluid, it can be absorbed by droplets 1116, resulting in an increase in the NOx concentration in the fine droplets. At least one fluid outlet 1104a to 1104d may be located at a distance from at least one pair of electrodes or reaction zones. This distance can affect the time and space available for mixing and interaction of at least one fluid with plasma or other process components. In some cases, at least one fluid outlet 1104a to 1104d may be configured to provide an optimal flow pattern and dispersion of at least one fluid to the reaction zone. In a non-limiting example, at least one fluid outlet 1104a to 1104d may include a nozzle (i.e., an opening of a specific shape). For the purposes of this disclosure, a "nozzle" is a component configured to generate a directional, high-speed flow of at least one fluid. In some embodiments, the nozzle can improve the mixing and dispersion of at least one fluid in the reaction zone. Such a nozzle may include, but is not limited to, swirling nozzles, fan-shaped spray nozzles, impingement jet nozzles, porous nozzles, atomizing nozzles, etc. In another non-limiting example, such a nozzle may include, but is not limited to, ultrasonic nozzles, compressed air nozzles, high-pressure nozzles, low-pressure nozzles, aerodynamic nozzles, micro-mist nozzles, fine mist line nozzles, etc. In some embodiments, at least one fluid outlet 1104a to 1104d may be configured to output a mixture of the first fluid and the second fluid in the form of droplets from the first fluid inlet and the second fluid inlet to the plasma reactor.

[0162] Continue to refer to Figures 11A to 11CIn one embodiment, at least one fluid outlet 1104a to 1104d may include ultrasonic atomization to generate droplets 1116. As a non-limiting example, at least one fluid outlet 1104a to 1104d may use high-frequency sound waves to generate waves on the surface of at least one fluid, which in turn generates droplets 1116 released into the air. In another embodiment, at least one fluid outlet 1104a to 1104d may include pressure atomization to generate droplets 1116. As a non-limiting example, at least one fluid outlet 1104a to 1104d may use compressed air to force water through a nozzle, thereby generating fine droplets. In another embodiment, at least one fluid outlet 1104a to 1104d may include centrifugal atomization to generate droplets 1116. As a non-limiting example, at least one fluid outlet 1104a to 1104d may use a rotating disk or wheel to throw droplets 1116 outwards, thereby generating fine droplets. In another embodiment, at least one fluid outlet 1104a to 1104d may include electrostatic atomization. As a non-limiting example, at least one fluid outlet 1104a to 1104d may use an electric field to break down the flow of at least one fluid into droplets 1116, which are then charged and repel each other, thereby generating fine droplets. In another embodiment, at least one fluid outlet 1104a to 1104d may include thermal atomization. As a non-limiting example, at least one fluid outlet 1104a to 1104d may use a method of heating at least one fluid to generate vapor, and then using a cooling system to condense the vapor back into the droplets 1116, thereby generating fine droplets.

[0163] Continue to refer to Figures 11A to 11CIn some embodiments, at least one fluid outlet 1104a to 1104d may include a plurality of at least one fluid outlet 1104a to 1104d. In some embodiments, at least one fluid outlet 1104a to 1104d may be configured to output at least one fluid 1108a to 1108d. As a non-limiting example, at least one fluid outlet 1104a may be configured to output at least one fluid 1108a. As another non-limiting example, at least one fluid outlet 1104b may be configured to output at least one fluid 1108b. As another non-limiting example, at least one fluid outlet 1104b may be configured to output at least one fluid 1108b. As another non-limiting example, at least one fluid outlet 1104c may be configured to output at least one fluid 1108c. As another non-limiting example, at least one fluid outlet 1104c may be configured to output at least one fluid 1108d. In some embodiments, at least one fluid outlet 1104a to 1104d may be configured to output a mixture of at least one fluid 1108a to 1108c. As a non-limiting example, at least one fluid 1108d may comprise a mixture of at least one fluid 1108a to 1108c. As a non-limiting example, at least one fluid outlet 1104d may be configured to output at least one fluid 1108d, wherein at least one fluid 1108d may comprise a mixture of at least one fluid 1108a to 1108c. In some embodiments, at least one fluid outlet 1104a to 1104d may output a conical distribution 11 of droplets of at least one fluid 1108a to 1108c. The conical distribution 1112 of droplets 1116 of at least one fluid 1108a to 1108c disclosed herein may correspond to a spray cone 312 (see [link to documentation]). Figure 3 ).

[0164] The above has been referenced Figure 1 The conical distribution 11 of droplets of at least one fluid 1104a to 1104c is further described in detail. In some embodiments, at least one fluid outlet 1104a to 1104d is fluidly connected to at least one reservoir 112. As another non-limiting example, at least one fluid outlet 1104a is fluidly connected to a first reservoir 112 that may include at least one fluid 1108a. As another non-limiting example, at least one fluid outlet 1104b is fluidly connected to a second reservoir 112 that may include at least one fluid 1108b. As another non-limiting example, at least one fluid outlet 1104c is fluidly connected to a third reservoir 112 that may include at least one fluid 1108a. In some embodiments, such as Figure 11A As shown, at least one fluid 1108a to 1108c can be externally mixed. In some embodiments, such as Figure 11BAs shown, at least one fluid 1108a to 1108c can be mixed internally. In some embodiments, such as Figure 11C As shown, at least one fluid 1108a to 1108c may be mixed in the ejector reservoir 1120. For the purposes of this disclosure, an "ejector reservoir" is a container or storage chamber of an ejector designed to hold at least one fluid for use in a processing step. In some embodiments, the ejector reservoir 1120 may be fluidly connected to at least one reservoir 112. As a non-limiting example, the ejector reservoir 1120 may be fluidly connected to the outlet of at least one reservoir 112.

[0165] Now for reference Figure 12Exemplary embodiments of a vapor injection system 1200 are presented. In one embodiment, the system 1200 includes a fluid inlet 1204 in fluid communication with a fluid reservoir 1208. In one embodiment, the fluid inlet 1204 may receive fluid from the fluid reservoir 1208. As used herein, a “fluid inlet” is an inlet point through which fluid may be introduced into the vapor injection system prior to use in the manner described herein. In some non-limiting examples, the fluid inlet 1204 may include components such as, but not limited to, pipes, conduits, hoses, channels, etc., to form a continuous path for fluid flow. As used herein, “fluid communication” refers to a path or link capable of transferring at least one fluid. As used herein, a “reservoir” is, for example, a storage system for fluid. In embodiments, the fluid inlet 1204 may be configured to receive fluid from the fluid reservoir 1208. In embodiments, the fluid reservoir 1208 may include a plurality of reservoirs. In one embodiment, the fluid reservoir 1208 may be sealed to substantially prevent leakage of fluid stored in the fluid reservoir 1208. In some embodiments, the fluid reservoir 1208 may be ventilated to allow fluids (such as, but not limited to, air) to freely enter and exit the fluid reservoir 1208. In another embodiment, the fluid reservoir 1208 may be completely sealed. In embodiments, the fluid reservoir 1208 may include a storage reservoir. In one embodiment, the fluid reservoir 1208 may include a pressure reservoir, thereby providing a pressure differential between the interior and exterior of the reservoir. In some cases, the fluid reservoir 1208 may be insulated, for example, to prevent electrical and / or thermal communication between the interior and exterior of the reservoir. In one embodiment, a fluid inlet 1204 may be hydraulically connected to the fluid reservoir 1208. In some embodiments, the fluid inlet 1204 may include a pump. In one embodiment, the pump may be configured to unidirectionally pump fluid from the fluid reservoir 1208 to other components of the vapor injection system 1200. In some embodiments, the pump may include more than one pump and / or several valves. In one embodiment, the several valves may include at least one check valve. As used in this disclosure, a "check valve" is a one-way valve / check valve that opens with fluid movement and pressure and closes to prevent backflow of fluid and / or pressure. In exemplary embodiments, the check valve may be any of a ball check valve, a swing check valve, a tilting disc check valve, etc. Upon reading this disclosure, those skilled in the art will appreciate many ways that can be used to control the flow of fluid from the fluid reservoir 1208 to other components of the vapor injection system 1200. As used in this disclosure, "fluid" is a flowable gaseous or liquid material, including but not limited to water, nitrogen, oxygen, and / or other gases and / or liquids.

[0166] Still referencing Figure 12In some embodiments, fluid inlet 1204 may include a fluid loop configured to direct fluid into components of the vapor injection system 1200. In one embodiment, the fluid loop may be connected to a controller 1212 configured to control the flow of fluid from fluid reservoir 1208 to other components of the vapor injection system 1200. Controller 1212 may include any computing device as described in this disclosure, including but not limited to microcontrollers, microprocessors, digital signal processors (DSPs), and / or system-on-a-chip (SoCs) as described in this disclosure. The computing device may include a mobile device (such as a mobile phone or smartphone), be included in such a mobile device, and / or communicate with such a mobile device. Controller 12 may include a single computing device operating independently, or may include two or more computing devices operating collaboratively, in parallel, sequentially, etc.; two or more computing devices may be included together in a single computing device or included in two or more computing devices. Controller 1212 may interface with or communicate with one or more additional devices via a network interface device, as described in further detail below. The network interface device may be used to connect controller 1212 to one or more networks and one or more devices in a variety of networks. Examples of network interface devices include, but are not limited to, network interface cards (e.g., mobile network interface cards, LAN cards), modems, and any combination thereof. Examples of networks include, but are not limited to, wide area networks (e.g., the Internet, corporate networks), local area networks (e.g., networks associated with offices, buildings, campuses, or other relatively small geographical spaces), telephone networks, data networks associated with telephone / voice providers (e.g., mobile communication provider data and / or voice networks), direct connections between two computing devices, and any combination thereof. Networks may employ wired and / or wireless communication modes. Generally, any network topology can be used. Information (e.g., data, software, etc.) may be transmitted to and / or from computers and / or computing devices. Controller 12 may include, but is not limited to, computing devices or clusters of computing devices in, for example, a first location and a second computing device or cluster of computing devices in a second location. Controller 12 may include one or more computing devices dedicated to data storage, security, traffic distribution for load balancing, etc. Controller 1212 can distribute one or more computing tasks, as described below, across multiple computing devices, which can operate in parallel, serial, redundantly, or in any other manner used to distribute tasks or memory among the computing devices. Controller 1212 can be implemented using a "shared-nothing" architecture, in which data is cached at worker nodes. In one implementation, this enables scalability of system 1200 and / or the computing devices.

[0167] Continue to refer to Figure 12In implementations, controller 1212 may be designed and / or configured to execute any method, method step, or sequence of method steps described in any implementation of this disclosure in any order and with any degree of repetition. For example, controller 1212 may be configured to repeatedly execute a single step or sequence until a desired or commanded result is achieved; the repetition of steps or sequences of steps may be performed iteratively and / or recursively by using the output of a previous repetition as input to a subsequent repetition, aggregating the inputs and / or outputs of repetitions to produce an aggregated result, reducing or decrementing one or more variables (such as global variables), and / or dividing a larger processing task into a set of smaller processing tasks that are iteratively addressed. Controller 12 may execute any steps or sequences of steps as described in this disclosure in parallel, such as by using two or more parallel threads, processor cores, etc., to execute steps two or more times simultaneously and / or substantially simultaneously; the task division between parallel threads and / or processes may be performed according to any protocol suitable for task division between iterations. Those skilled in the art, upon reviewing the entire contents of this disclosure, will appreciate various ways in which iterative, recursive, and / or parallel processing can be used to subdivide, share, or otherwise process steps, sequences of steps, processing tasks, and / or data.

[0168] Continue to refer to Figure 12 The controller 1212 may transmit pump commands to the pump, for example, by means of a pump command signal. As used in this disclosure, a "pump command signal" is a signal representing a pump command. As used in this disclosure, a "pump command" is a communication intended for use with any pump as described herein. In some cases, pump commands can be used to influence pump performance. In some embodiments, the controller 1212 may receive pump data from the pump connected to the fluid inlet 1204, for example, by means of a pump data signal. As used in this disclosure, a "pump data signal" is a signal representing pump data. As used in this disclosure, "pump data" is information associated with any pump described herein. In some cases, pump data may represent pump performance and / or operation.

[0169] Continue to refer to Figure 12System 1200 may include a voltage regulator 1216 connected to power supply 1220. As used herein, a “voltage regulator” is a device capable of regulating the voltage level and frequency of current and converting the type of current. In some embodiments, voltage regulator 1216 may include a rectifier. As used herein, a “rectifier” is a device or component configured to convert alternating current (AC) to direct current (DC). In some embodiments, voltage regulator 1216 may include an inverter. As used herein, an “inverter” is a device or component configured to convert direct current (DC) to alternating current (AC). In one embodiment, voltage regulator 1216 may include a boost converter. As used herein, a “boost converter” is a device or component configured to increase the voltage level of current. As used herein, a “transformer” is a device configured to transfer electrical energy from one circuit to another via electromagnetic induction. In one embodiment, voltage regulator 1216 is configured to receive electrical energy from power supply 1220. As used herein, a “power supply” is any system, device, or means that provides power (such as, but not limited to, electricity) to a device. In some embodiments, power source 1220 may include a generator. In some embodiments, power source 1220 may include a power outlet connected to the power grid. In some embodiments, controller 1212 may be connected to the power source. In some embodiments, a voltage regulator is further configured to transform electrical energy. In some embodiments, transforming electrical energy may include regulating the voltage of the electrical energy. In a further embodiment, transforming electrical energy may include regulating the voltage of the electrical energy to a range between 1210 volts and 220 volts. In some embodiments, voltage regulator 1216 may include a transformer. In some embodiments, voltage regulator 1216 may use a transformer to regulate electrical energy. In some embodiments, transforming electrical energy may include modifying the frequency of the voltage. In a further embodiment, transforming electrical energy may include modifying the frequency of the voltage to 20 kHz. In some embodiments, transforming electrical energy may include modifying the frequency of the voltage to 30 kHz. In a non-limiting example, voltage regulator 1216 can convert AC power received from power supply 1220. Voltage regulator 1216 can use rectifier components to convert the AC power to DC power, then use boost converter components to increase the voltage to 220V, and then use inverter components to increase the frequency to 20kHz. In some embodiments, voltage regulator 1216 can use a rectifier to convert AC power to pulsed DC power. In embodiments, voltage regulator 1216 can use a rectifier in conjunction with filters, amplifiers, and / or digital signal processors to convert AC power into a multi-rate waveform. As used herein, a "multi-rate waveform" is a signal sampled at multiple rates, where each rate corresponds to a specific frequency range of interest. In embodiments, the multi-rate waveform may include multiple waveforms, such as square waves, sawtooth waves, triangle waves, etc.As used herein, a "square wave" is a periodic signal that alternates in a binary manner (such as 0 and 1). As used herein, a "sawtooth wave" is a periodic signal with a linear rise and a sudden fall. As used herein, a "triangle wave" is a periodic signal with a linear rise and a linear fall. In some embodiments, the voltage regulator 1216 may use an inverter to convert DC power to AC power. In some embodiments, the voltage regulator 1216 may use an inverter to convert pulsed DC power to AC power. In one embodiment, the voltage regulator 1216 may also convert AC to AC. For example, an AC-to-AC converter may be used to convert an AC waveform with one specific frequency and amplitude to an AC waveform with another frequency and another amplitude. For example, an AC voltage controller may be a thyristor-based device that directly converts a fixed AC voltage to a variable AC voltage without changing the frequency. The AC voltage controller may be a phase-controlled device, thus eliminating the need for forced commutation circuitry and allowing the use of natural commutation or grid commutation. Those skilled in the art will understand upon reading this disclosure that the components described herein are merely examples, and that the voltage regulator 1216 may include many other components not described herein, and that the components may be used in other orders not described herein.

[0170] Continue to refer to Figure 12 In one embodiment, system 1200 may include a core coil 1224 connected to voltage regulator 1216. In some embodiments, voltage regulator 1216 may include core coil 1224. In one embodiment, core coil 1224 may be configured to deliver converted electrical energy from voltage regulator 1216. In other embodiments, voltage regulator 1216 may be configured to deliver converted electrical energy. As used herein, a "core coil" is an inductor or magnetic component consisting of a coil of wire wound around an iron or ferromagnetic core that resists changes in the current flowing through it. In some embodiments, voltage regulator 1216 may include two or more insulated wire coils wound around a common iron core. In a non-limiting example, core coil 1224 may deliver modified electrical energy from voltage regulator 1216.

[0171] Still referencing Figure 12In one embodiment, system 1200 includes a crystal compressor 1228. As used herein, a "crystal compressor" is a piezoelectric device for generating pressure changes or ultrasonic waves within a fluid. As used herein, a "piezoelectric device" is a device that uses piezoelectric materials (such as certain types of crystals that can change their shape and / or size when a voltage is applied) to generate oscillating pressure waves or ultrasonic vibrations. In some embodiments, crystal compressor 1228 may be connected to a core coil 1224. In a non-limiting example, core coil 1224 may be used to connect voltage regulator 1216 and crystal compressor 1228 to maintain the properties of the converted electrical energy, such as a set voltage and frequency, during transmission. In one embodiment, crystal compressor 1228 may be connected to a fluid inlet 1204. In some embodiments, crystal compressor 1228 may be connected to voltage regulator 1216. In one embodiment, crystal compressor 1228 may be configured to receive converted electrical energy from core coil 1224. In another embodiment, crystal compressor 1228 may receive converted electrical energy from voltage regulator 1216. In some embodiments, the crystal compressor 1228 may receive fluid from the fluid inlet 1204. In some embodiments, the crystal compressor 1228 may be communicatively connected to the controller 1212. In some embodiments, the controller 1212 may be a piezoelectric controller. The piezoelectric controller may include an "open-loop piezoelectric controller" manufactured by Thorlabs, Inc., headquartered in Newton, New Jersey, USA.

[0172] Continue to refer to Figure 12In one embodiment, crystal compressor 1228 generates vapor 1232 based on converted electrical energy and a fluid. In a non-limiting example, crystal compressor 1228 may generate vapor 1232 (such as water vapor) by applying ultrasonic vibrations to a fluid (such as water). In some embodiments, the crystal compressor outputs vapor using vapor outlet 1236. As used herein, a “vapor outlet” is an outlet point through which vapor is discharged. In a non-limiting example, vapor outlet 12 may include a mist nozzle configured to output vapor. In some embodiments, vapor injection system 1200 may be connected to a plasma reactor. In some embodiments, vapor injection system 1200 may be further configured to output vapor to the plasma reactor. As used herein, a “plasma reactor” is a device configured to generate, sustain, and / or control plasma. For the purposes of this disclosure, “plasma” refers to a fourth state of matter other than solid, liquid, and gas. Plasma may comprise a partially ionized gas consisting of a mixture of ions, electrons, and / or neutral particles (i.e., atoms and molecules). In one embodiment, when vapor is subjected to a high-energy source (such as, but not limited to, heat, radiation, electric fields, etc.), plasma can be formed, causing atoms or molecules in the vapor to be ionized by losing or gaining electrons. In this embodiment, a vapor ejector system 1200 can be used to feed vapor into a plasma reactor. In some embodiments, the plasma may include nonthermal plasma (NTP), which is a plasma whose electron temperature is significantly higher than that of heavier ions and neutral particles. In this case, although the electrons in the plasma have high kinetic energy, the overall temperature of the vapor can remain relatively low (e.g., typically close to room temperature of 20°C–22°C / 68°F–72°F). Alternatively or additionally, the energy distribution between particles in the nonthermal plasma may not be in thermal equilibrium because electrons, which are much lighter than ions and neutral particles, can gain energy more quickly when subjected to an electric or magnetic field, resulting in higher electron temperatures. On the other hand, heavier ions and neutral particles can move more slowly and remain cooler, resulting in a lower vapor temperature.

[0173] Now for reference Figure 13 , for example Figure 13This is an exemplary embodiment of a plasma reactor housing assembly 1300. The plasma reactor housing assembly 1300 may include a housing 1304. In another embodiment, the housing 1304 may be a separate housing configured to house only the plasma reactor. In a non-limiting example, the plasma reactor housing assembly 1300 may be a double-shell structure, wherein the housing 1304 may be disposed within another layer of the housing 1304. In some cases, the housing 1304 may be injection molded via an injection mold. As used in this disclosure, an "injection mold" is a manufacturing tool used to produce plastic parts. Manufacturing the housing 1304 may include using an injection molding process, wherein the injection molding process may involve using an injection mold configured to produce a specific shape and features of the housing 1304. In some embodiments, the injection mold may include two halves clamped together, having one or more cavities between the two halves, wherein the cavities may define the shape of the housing 1304. In some cases, a material such as, but not limited to, molten plastic may be injected into the injection mold under high pressure, filling the space and taking the shape of the injection mold. The injection molding process may include a cooling process configured to cool and / or solidify the injected material. The injection mold can then be opened and the finished housing 1304 can be removed. In some embodiments, the injection mold may be precisely machined to the desired shape and size of the housing 1304. In a non-limiting example, the housing 1304 may comprise a hollow cylinder.

[0174] Continue to refer to Figure 13In some embodiments, one or more continuous conductors 1308a to 1308b may pass through the housing 1304, with one end electrically connected to at least one electrode 1312. As used herein, an "electrode" is a conductor for making electrical contact with a conductive medium and / or a medium that can become conductive under a given sufficient voltage difference (such as vapor as described above). In embodiments, at least one electrode 1312 may include one or more electrodes 1312. In embodiments, one or more electrodes 1312 may be configured to generate a discharge according to vapor 1232. As used herein, a "discharge" refers to a phenomenon in which current flows through vapor 1232 between two or more conductive surfaces (i.e., at least one pair of electrodes 1312), resulting in ionization and subsequent release of energy in the form of light, heat, or sound. In one embodiment, the other end of the continuous conductors 1308a to 1308b may be connected to an ignition unit or ground connection. In some embodiments, one or more insulators 1316a to 1316b may be used at the point where the continuous conductors 1308a to 1308b pass through the housing 1304. For the purposes of this disclosure, an "insulator" is a material that does not readily conduct heat, electricity, or sound. In a non-limiting example, insulators 1316a to 1316b may include electrical insulators, wherein the electrical insulator is a material having a high resistivity. Electrical insulators may not readily conduct current, thereby preventing current from flowing between the plasma reactor and other components, thus reducing the risk of short circuits, electric shock, interference, etc. Exemplary electrical insulators may include plastics, ceramics, glass, rubber, etc.

[0175] Continue to refer to Figure 13 Each electrode of at least one pair of electrodes 1312 may include a tilt angle 1320. In a non-limiting example, at least one electrode 1312 may include a tilt angle 1320 of 6 degrees (i.e., the angle between a pair of electrodes 1312 is 12 degrees). As used in this disclosure, the “tilt angle” of an electrode refers to the angle between the longitudinal axis of the electrode and a reference plane or axis within the plasma reactor. In some cases, the tilt angle 1320 may affect the characteristics of the plasma generated between the electrodes 1312 in the reaction zone of the plasma reactor, such as, but not limited to, the electric field distribution, the efficiency of the discharge process, and the interaction with reactive substances in the plasma (e.g., ROS, RNS, etc.).

[0176] Continue to refer to Figure 13The vapor injection system 1200 can be connected to the plasma reactor within the plasma reactor housing assembly 1300 via an injector mounting flange 1324. As used in this disclosure, an "injector mounting flange" is a mechanical component for reliably and leak-proofly attaching the vapor injection system 1200 to the housing 1304. In a non-limiting example, the injector mounting flange 1324 may include an interface 1328 between the vapor injection system 1200 and the plasma reactor. In some cases, the vapor outlet 123 of the vapor injection system 1200 may include a threaded adapter. Both the vapor outlet 123 and the interface 1328 may include threaded sections; for example, but not limited to, the vapor outlet 123 / interface 1328 may include male threaded sections / female threaded sections, wherein the male threaded sections and female threaded sections are compatible (i.e., mating). The vapor injection system 1200 can be threaded onto the injector mounting flange 1324 at the interface 1328 via a vapor outlet 1236 with a threaded adapter.

[0177] Now for reference Figure 14 An exemplary embodiment of an apparatus 1400 having an internal vapor injection system 1200 is illustrated. Apparatus 1400 may include an internal injection system, such as vapor injection system 1200, disposed within apparatus 1400. As used herein, “internal injection system” is an injection system mounted inside apparatus 1400. The injection system can be any injection system described herein. In some embodiments, the internal injection system may be designed to deliver vapor 1232 from fluid reservoir 1208 to plasma reactor 1512.

[0178] Continue to refer to Figure 14 An apparatus 1400 is illustrated for treating a growth medium 104 via discharge. The apparatus 1400 may include the growth medium 1404 within a processing chamber 1408. The apparatus 1400 may include a plasma reactor 1412. The plasma reactor 1412 may include at least a pair of electrodes 1416a to 1416b. The first electrode 1416a may include an anode electrically connected to an ignition unit, and the second electrode 1416b may include a cathode electrically connected to ground 1420. The plasma reactor 1412 may include a reaction zone 1424 disposed between the first electrode 1416a and the second electrode 1416b. The apparatus 1400 may include an ignition unit 1428 electrically connected to at least one electrode of the at least pair of electrodes 1416a to 1416b. The apparatus 1400 may also include a condenser 1432 disposed within the reaction zone 1424 and above the processing chamber 1408.

[0179] Now for reference Figure 15An exemplary embodiment of an apparatus 1500 having an internal vapor injection system 1200 is presented. The apparatus 1500 may include an external vapor injection system, such as vapor injection system 1200, disposed externally to the apparatus 1500. As used in this disclosure, an "external vapor injection system" is one mounted externally to the apparatus 1500 (rather than as referenced above). Figure 14 The described injection system is integrated within the device 1500. The injection system can be any injection system described in this disclosure. The device 1500 may include a growth medium 1504 within a processing chamber 1508. The device 1500 may include a plasma reactor 1512. The plasma reactor 1512 may include at least one pair of electrodes 1516a to 1516b. The first electrode 1516a may include an anode electrically connected to an ignition unit, and the second electrode 1516b may include a cathode electrically connected to ground 1520. The plasma reactor 1512 may include a reaction zone 1524 disposed between the first electrode 1516a and the second electrode 1516b. The device 1500 may include an ignition unit 1528 electrically connected to at least one electrode of the at least one pair of electrodes 1516a to 1516b. The device 1500 may also include a condenser 1532 disposed within the reaction zone 1524 and located above the processing chamber 1508.

[0180] Now for reference Figure 16 An exemplary block diagram 1600 of a crystal compressor 1228 is presented. In this exemplary embodiment, the crystal compressor 1228 includes a crystal 1604. In this exemplary embodiment, the crystal compressor 1228 includes a compression chamber 1608. As used herein, a "compression chamber" is a hermetically sealed component capable of withstanding high levels of pressure. In one embodiment, the compression chamber may receive fluid 1612. In one embodiment, the compression chamber 1608 may be in fluid communication with a fluid inlet 1204. In one embodiment, the crystal 1604 may be activated by converted electrical energy 1616. In one embodiment, the crystal compressor 1228 may receive converted electrical energy 1616 from a core coil 1224. In one embodiment, the crystal compressor 1228 may receive converted electrical energy 1616 directly from a voltage regulator 1216. In a non-limiting example, crystal 1604 may be activated by converted electrical energy 1616, wherein activation causes crystal 1604 to generate ultrasonic pressure, and fluid 1612 may then change its state from liquid to gas 1232 according to the pressure generated by the crystal. In some embodiments, the pressure level generated by crystal 1604 may be adjusted by controller 1212. In some embodiments, vapor 1232 may exit compression chamber 1608 through vapor outlet 1236. Those skilled in the art will recognize upon reading this disclosure that crystal compressor 1228 is described as an example and that crystal compressor 1228 may include many embodiments of crystal compressor 1228 not described in this disclosure.

[0181] Continue to refer to Figure 16 In some embodiments, system 1200 may be a piezoelectric steam ejector. As used herein, a "piezoelectric steam ejector" is an ejector (such as steam injection system 1200) that utilizes piezoelectric technology to generate water vapor by atomizing at least one liquid (i.e., a second fluid) into fine droplets as described above. As described herein, "water vapor" is the gaseous phase of water (i.e., the second fluid), which occurs when water molecules acquire sufficient energy to detach from the liquid state and disperse in the surrounding air (i.e., the first fluid). As described herein, "piezoelectric technology" is a technology based on the piezoelectric effect: the phenomenon in which a particular material generates an electrical charge when subjected to mechanical stress or otherwise (i.e., mechanical deformation when exposed to an electric field). In some cases, materials such as ceramics (e.g., lead zirconate titanate), quartz crystals, polymers, etc., may exhibit this effect. Crystal compressor 1228 may include piezoelectric elements; for example, but not limited to, ceramic discs or plates may be used to generate mechanical vibrations at a specific frequency when a voltage is applied to power supply 1220. Power source 1220 may include any power source as described above in this disclosure, such as a DC power source. Mechanical vibration may be transmitted to the fluid input from fluid inlet 1204, causing at least one fluid to break down into fine mist droplets, which then evaporate to form water vapor.

[0182] Now for reference Figure 17 A flowchart of an exemplary embodiment of method 1700 for using a vapor injection system 1200 is presented. At step 1705, method 1700 includes receiving fluid from a fluid reservoir 1208 via a fluid inlet 1204. In some embodiments, receiving fluid includes using at least one pump. In some embodiments, at least one pump connected to the fluid inlet 1204 is communicatively connected to a controller 1212. This can be implemented without limitation as described herein.

[0183] Continue to refer to Figure 17 At step 1710, method 1700 includes receiving electrical energy from power source 1220 by voltage regulator 1216. In some embodiments, voltage regulator 1216 may be communicatively connected to controller 1212. In a non-limiting example, controller 1212 may be used to regulate the amount of electrical energy to be received from power source 1220. This can be implemented without limitation as described herein.

[0184] Continue to refer to Figure 17At step 1715, method 1700 includes converting electrical energy. In embodiments, converting electrical energy may include regulating the voltage of the electrical energy. In a further embodiment, regulating the voltage of the electrical energy may include adjusting the voltage to a range between 1210 volts and 220 volts. In some embodiments, converting electrical energy may include modifying the frequency of the voltage. In a further embodiment, modifying the frequency may include modifying the frequency to 20 kHz. In some embodiments, modifying the frequency may include modifying the frequency to 30 kHz. In some embodiments, the voltage and / or frequency to be regulated or modified may be set by controller 1212. This can be implemented without limitation as described herein.

[0185] Continue to refer to Figure 17 Method 1700 may include delivering converted electrical energy via a core coil 1224. In some embodiments, method 1700 may also include delivering the converted electrical energy to a crystal compressor 1228 via the core coil 1224. In some embodiments, method 1700 may include delivering the converted electrical energy directly from a voltage regulator 1216 to the crystal compressor 1228. In one embodiment, the voltage regulator 1216 includes a core coil 1224. In some embodiments, method 1700 may include delivering the converted electrical energy via the voltage regulator 1216. As described herein, this may be implemented without limitation.

[0186] Continue to refer to Figure 17 At step 1720, method 1700 includes generating vapor 1232 by a crystal compressor 1228 based on converted electrical energy and fluid. In embodiments, generating vapor 1232 may further include using a controller 1212. In some embodiments, the amount of fluid to be used and / or the modified electrical energy may be set by the controller 1212. In some embodiments, this may be implemented without limitation, as described herein.

[0187] Continue to refer to Figure 17 At step 1725, method 1700 includes discharging steam 1232 using steam outlet 1236. In some embodiments, method 1700 may also include discharging steam 1232 to a plasma reactor using steam outlet 1236. This can be implemented without limitation as described herein.

[0188] At a high level, aspects of this disclosure relate to low-pressure injection systems for multiple fluids and methods of using them. In one embodiment, the system includes at least one injector configured to disperse a mixture of a first fluid and a second fluid. Aspects of this disclosure can be used to generate microfluidic droplets, which allows the second fluid to be ionized and transferred into the generated microfluidic droplets. Exemplary embodiments illustrating aspects of this disclosure are described below in the context of several specific examples.

[0189] Now for reference Figure 18 This document illustrates an exemplary embodiment of a pressure injection system 1800 for multiple fluids. In one embodiment, the low-pressure injection system 1800 for multiple fluids includes at least one first fluid inlet 1804. The at least one first fluid inlet 1804 is communicatively connected to a first fluid reservoir 1808. As used herein, a “first fluid inlet” is an inlet point through which at least a first fluid 1812 can be introduced into the pressure injection system prior to use in the manner described herein. In one embodiment, the at least one first fluid inlet 1804 may be configured to receive the first fluid 1812 from the first fluid reservoir 1808. As used herein, a “reservoir” is, for example, a storage system for fluids. In some cases, the first fluid reservoir 1808 may include multiple reservoirs. In some cases, the first fluid reservoir 1808 may be sealed to substantially prevent leakage of fluid stored in the first fluid reservoir. In some cases, the first fluid reservoir 1808 may be ventilated to allow some fluid (such as, but not limited to, air) to freely enter and exit the first fluid reservoir 1808. Alternatively, the first fluid reservoir 1808 may be completely sealed. In some cases, the first fluid reservoir 1808 may include a storage reservoir. In some cases, the first fluid reservoir 1808 may include a pressure reservoir, thereby providing a pressure differential between the interior and exterior of the reservoir. In some cases, the first fluid reservoir 1808 may be insulated, for example, to prevent electrical and / or thermal communication between the interior and exterior of the reservoir. As used in this disclosure, and still referred to... Figure 18 "Fluid" is a flowable gaseous or liquid material, including but not limited to water, nitrogen, oxygen and / or other gases and / or liquids.

[0190] Continue to refer to Figure 18 The first fluid reservoir 1808 provides a consistent and controlled supply of the first fluid 1812 for use in the pressure injection system 1800, as described in further detail below. In one embodiment, the first fluid 1812 may include a liquid; for example, but not limited to, at least one fluid may include water, an organic solvent, an electrolyte solution, etc. Continuing to refer to... Figure 18The first fluid reservoir 1808 may be constructed of a material compatible with the first fluid 1812 stored therein. For example, but not limited to, the first fluid reservoir 1808 may be made of any material such as corrosion-resistant metal, plastic, and / or glass. In some cases, the size of the first fluid reservoir 1808 may be suitably configured to provide a sufficient supply of the first fluid 1812 without requiring frequent refilling or interruption. The first fluid reservoir 1808 may include at least one inlet, at least one outlet, or both. In a non-limiting example, at least one inlet may be used to fill the first fluid reservoir 1808 with the first fluid 1812, and at least one outlet may be connected to a first fluid line 1816 or any other fluid delivery component of the 1800 described herein. The first fluid 1812 may be introduced into the first fluid reservoir 1808 through at least one inlet and / or discharged to the pressure injection system 1800 through at least one outlet. In cases where the 1800 has multiple first fluid reservoirs 1808, each of the multiple reservoirs may include at least one inlet and at least one outlet. In a non-limiting example, a first reservoir configured to contain a first fluid may include a first inlet and a first outlet, and a second reservoir configured to contain the first fluid may include a second inlet and a second outlet, wherein the first inlet / first outlet may never intersect with the second inlet / second outlet. In this embodiment, the first fluid 1812 may not be discharged from the second first fluid reservoir 1808 through the second outlet until the first fluid reservoir 1808 is emptied.

[0191] Further reference Figure 18A first fluid line 1816 may be configured to provide fluid communication between a first fluid reservoir 1808 and at least one first fluid inlet 1804. For the purposes of this disclosure, "fluid communication" refers to a path or link capable of transferring at least one fluid. In a non-limiting example, the fluid connection between the first fluid reservoir 1808 and at least one first fluid inlet 1804 may be established using the first fluid line 1816. In exemplary embodiments, the first fluid line 1816 may be various components such as, but not limited to, pipes, conduits, hoses, channels, etc., to form a continuous path for the flow of at least one fluid. In one embodiment, at least one first fluid inlet 1804 may be hydraulically connected to the first fluid reservoir 1808. In some cases, the first fluid line may include a first pump 1820. In one embodiment, the first pump 1820 may be configured to unidirectionally pump a first fluid 1812 to a pressure injection system. In some cases, the first pump 1820 may include more than one pump and / or several valves. In one embodiment, the several valves may include at least one check valve. As used in this disclosure, a "check valve" is a one-way valve / check valve that opens with fluid movement and pressure and closes to prevent backflow of fluid and / or pressure. In exemplary embodiments, the check valve may be any of a ball check valve, a swing check valve, a tilting disc check valve, etc. In some cases, the first pump 1820 and / or the first fluid line 1816 may include a fluid circuit configured to direct the first fluid into the pressure injection system 1800. In one embodiment, the fluid circuit may be connected to a controller 1824 (such as...). Figure 29 (Any computing device described), the controller is configured to control the flow of the first fluid 1812 to at least one first fluid inlet 1804 and / or low-pressure injection system 1800.

[0192] Still referencing Figure 18The controller 1824 may include any computing device as described in this disclosure, including but not limited to microcontrollers, microprocessors, digital signal processors (DSPs), and / or system-on-a-chip (SoCs) as described in this disclosure. The computing device may include a mobile device (such as a mobile phone or smartphone), be included in such a mobile device, and / or communicate with such a mobile device. The controller 1824 may include a single computing device operating independently, or may include two or more computing devices operating in a cooperative, parallel, sequential, or other manner; the two or more computing devices may be included together in a single computing device or included in two or more computing devices. The controller 1824 may interface with or communicate with one or more additional devices via a network interface device, as further detailed below. The network interface device may be used to connect the controller 1824 to one or more networks and one or more devices in a variety of networks. Examples of network interface devices include, but are not limited to, network interface cards (e.g., mobile network interface cards, LAN cards), modems, and any combination thereof. Examples of networks include, but are not limited to, wide area networks (e.g., the Internet, enterprise networks), local area networks (e.g., networks associated with offices, buildings, campuses, or other relatively small geographical spaces), telephone networks, data networks associated with telephone / voice providers (e.g., mobile communication provider data and / or voice networks), direct connections between two computing devices, and any combination thereof. Networks can employ wired and / or wireless communication modes. Generally, any network topology can be used. Information (e.g., data, software, etc.) can be transmitted to and / or from computers and / or computing devices. Controller 1824 may include, but is not limited to, computing devices or clusters of computing devices in, for example, a first location and a second computing device or cluster of computing devices in a second location. Controller 1824 may include one or more computing devices dedicated to data storage, security, traffic distribution for load balancing, etc. Controller 1824 can distribute one or more computing tasks as described below across multiple computing devices, which may operate in parallel, serial, redundantly, or in any other manner for distributing tasks or memory among computing devices. The controller 1824 can be implemented using a "shared-nothing" architecture, in which data is cached at worker nodes. In one implementation, this enables scalability of the system 1800 and / or computing devices.

[0193] Continue to refer to Figure 18The controller 1824 may be designed and / or configured to execute any method, method step, or sequence of method steps in any embodiment described herein in any order and with any degree of repetition. For example, the controller 1824 may be configured to repeatedly execute a single step or sequence until a desired or commanded result is achieved; the repetition of steps or sequences of steps may be performed iteratively and / or recursively by using the output of a previous repetition as input for a subsequent repetition, aggregating the inputs and / or outputs of repetitions to produce an aggregated result, reducing or decrementing one or more variables (such as global variables), and / or dividing a larger processing task into a set of smaller processing tasks that are iteratively addressed. The controller 1824 may execute any step or sequence of steps as described herein in parallel, such as by using two or more parallel threads, processor cores, etc., to execute steps two or more times simultaneously and / or substantially simultaneously; the task division between parallel threads and / or processes may be performed according to any protocol suitable for task division between iterations. Those skilled in the art, upon reviewing the entire contents of this disclosure, will appreciate various ways in which iterative, recursive, and / or parallel processing can be used to subdivide, share, or otherwise process steps, sequences of steps, processing tasks, and / or data.

[0194] Continue to refer to Figure 18 The controller 1824 can communicate with the first pump 1820. For example, in some cases, the controller 1824 can transmit pump commands to at least the first pump 1820, for example, by means of a pump command signal. As used in this disclosure, a "pump command signal" is a signal representing a pump command. As used in this disclosure, a "pump command" is a communication intended for use with any pump as described herein. In some cases, the pump command can be used to influence the performance of the first pump 1820. In some cases, the controller 1824 can receive pump data from the first pump 1820, for example, by means of a pump data signal. As used in this disclosure, a "pump data signal" is a signal representing pump data. As used in this disclosure, "pump data" is information associated with any pump described herein. In some cases, the pump data can represent the performance and / or operation of the first pump 1820.

[0195] Further reference Figure 18A pressure injection system 1800 for multiple fluids includes at least one second fluid inlet 1828. The at least one second fluid inlet 1828 is communicatively connected to a second fluid reservoir 1832. As used herein, a “second fluid inlet” is an inlet point through which at least a second fluid 1836 can be introduced into the pressure injection system prior to use in the manner described herein. In one embodiment, at least one second fluid inlet 1828 may be configured to receive the second fluid 1836 from the second fluid reservoir 1832. The second fluid reservoir 1832 may be any reservoir described herein. In some cases, the second fluid reservoir 1832 may include multiple reservoirs. For example, the second fluid reservoir 1832 may be hermetically sealed to substantially prevent leakage of fluid stored in the second fluid reservoir. In some cases, the second fluid reservoir 1832 may be ventilated to allow some fluid (such as, but not limited to, air) to freely enter and exit the second fluid reservoir 1832. Alternatively, the second fluid reservoir 1832 may be completely hermetically sealed. In some cases, the second fluid reservoir 1832 may include a storage reservoir. In some cases, the second fluid reservoir 1832 may include a pressure reservoir, thereby providing a pressure difference between the interior and exterior of the reservoir. In some cases, the second fluid reservoir 1832 may be insulated, for example to prevent electrical and / or thermal communication between the interior and exterior of the reservoir.

[0196] Continue to refer to Figure 18 The second fluid reservoir 1832 provides a consistent and controlled supply of the second fluid 1836 for use in the pressure injection system 1800, as described in further detail below. In one embodiment, the second fluid 1836 may include a gas; for example, but not limited to, the second fluid 1836 may include oxygen, nitrogen, etc. Continue to refer to Figure 18The second fluid reservoir 1832 may be constructed of a material compatible with the stored second fluid 1836. For example, but not limited to, the second fluid reservoir 1832 may be made of any material such as corrosion-resistant metal, plastic, and / or glass. In some cases, the size of the second fluid reservoir 1832 may be suitably configured to provide a sufficient supply of the second fluid 1836 without requiring frequent refilling or interruption. The second fluid reservoir 1832 may include at least one inlet, at least one outlet, or both. In a non-limiting example, at least one inlet may be used to fill the second fluid reservoir 1832 with the second fluid 1836, and at least one outlet may be connected to the second fluid line 1840 or any other fluid delivery component of the 1800 described herein. The second fluid 1836 may be introduced into the second fluid reservoir 1832 through at least one inlet and / or discharged to the pressure injection system 1800 through at least one outlet. In cases where the 1800 has multiple second fluid reservoirs 1832, each of the multiple reservoirs may include at least one inlet and at least one outlet. In a non-limiting example, a first reservoir configured to contain a second fluid may include a first inlet and a first outlet, and a second reservoir configured to contain the second fluid may include a second inlet and a second outlet, wherein the first inlet / first outlet may never intersect with the second inlet / second outlet. In this embodiment, the second fluid 1836 may not be discharged from the second fluid reservoir 1832 through the second outlet until the first and second fluid reservoirs 1832 are emptied. Furthermore, in an exemplary embodiment, the pressure injection system 1800 includes a first fluid reservoir 1808 configured to contain a first fluid and may include a first inlet and a first outlet; and a second fluid reservoir 1832 configured to contain a second fluid and may include a second inlet and a second outlet, wherein the first inlet / first outlet may never intersect with the second inlet / second outlet. In this embodiment, the first and second fluids may not come into contact with each other before being discharged into the pressure injection system 1800.

[0197] Further reference Figure 18The second fluid line 1840 may be configured to provide fluid communication between the second fluid reservoir 1832 and at least one second fluid inlet 1828. For the purposes of this disclosure, "fluid communication" refers to a path or link capable of transferring at least one fluid. In a non-limiting example, the fluid connection between the second fluid reservoir 1832 and at least one second fluid inlet 1828 may be established using the second fluid line 1840. In exemplary embodiments, the second fluid line 1840 may be various components such as, but not limited to, pipes, conduits, hoses, channels, etc., to form a continuous path for the flow of at least one fluid. In one embodiment, at least one second fluid inlet 1828 may be pneumatically connected to the second fluid reservoir 1832. In some cases, the second fluid line 1840 may include a second pump 1844. In one embodiment, the second pump 1844 may be configured to unidirectionally pump the second fluid 1836 to the pressure injection system 1800. In some cases, the second pump 1844 may include more than one pump and / or several second valves. In one embodiment, several second valves may include at least one second check valve. The second check valve can be any check valve described herein. In some cases, the second pump 1844 and / or the second fluid line 1840 may include a fluid circuit configured to direct the first fluid into the pressure injection system 1800. In one embodiment, the fluid circuit may be connected to a controller 1824 (such as...). Figure 6 (and any computing device described herein), the controller is configured to control the flow of the second fluid 1836 to at least one second fluid inlet 1828 and the pressure injection system 1800.

[0198] Continue to refer to Figure 18 The controller 1824 can communicate with the second pump 1844. For example, in some cases, the controller 1824 can transmit pump commands to the second pump 1844, for example, by means of a pump command signal. The pump command signal can be any pump command signal described herein. The pump command can be any pump command described herein. In some cases, the pump command can be used to affect the performance of the second pump 1844. In some cases, the controller 1824 can receive pump data from the second pump 1844, for example, by means of a pump data signal. The pump data signal and pump data can be any pump data described herein. In some cases, the pump data can represent the performance and / or operation of the second pump 1844.

[0199] Still referencing Figure 18System 1800 includes a low-pressure compressor 1848 configured to pressurize a second fluid received from a second fluid reservoir. The pressure compressor 1848 may include a pneumatic compression device. In some embodiments, the pressure compressor 1848 may include a hydraulic compressor, an air compressor, or other compressor. Furthermore, the pressure compressor 1848 may be a piston compressor, a diaphragm compressor, a screw compressor, a vane compressor, a scroll compressor, a rotary cam compressor, a centrifugal compressor, etc. The pressure compressor 1848 may be configured to apply pressure to system 1800, the second fluid 1836, and / or at least one injector 1856. In some embodiments, the pressure compressor 1848 may be configured to apply a pressure between about 2 bar and about 7 bar. In some embodiments, the pressure compressor 1848 may be automated. The pressure compressor 1848 may be automated to apply pressure to system 1800 within a set time period. In some embodiments, the pressure compressor 1848 may be configured to slowly apply increasing pressure to system 1800. In other embodiments, the pressure compressor 1848 may be automated to apply a constant pressure to the system 1800. As a non-limiting example, the pressure compressor 1848 may be driven by direct current (DC) electricity. As used in this disclosure, "direct current" is a unidirectional flow of electric current. In some embodiments, the pressure compressor 1848 may be driven by electricity with varying or reverse voltage levels, such as alternating current (AC) electricity generated by an alternator and / or inverter, or otherwise varying electricity such as that generated by a switching power supply. In some embodiments, the system 1800 may include a high-pressure compressor configured to provide pressure to a second fluid received from a second fluid reservoir. The high-pressure compressor may include a rotary screw compressor, a reciprocating air compressor, a dynamic compressor such as a centrifugal compressor, etc. For example, a dynamic air compressor can generate horsepower by introducing and confining air with rapidly rotating blades to produce pressure, and then storing kinetic energy statically within the compressor. High pressure may include compression to more than 150 psi, and may also range from 1000 to 6000 psi. In some embodiments, the high-pressure compressor may be automated. As a non-limiting example, the high-pressure compressor may be driven by direct current (DC) electricity. As used in this disclosure, "direct current" is a unidirectional flow of electric current. In some embodiments, the high-pressure compressor may be driven by electricity having varying or reverse voltage levels, such as alternating current (AC) electricity generated by an alternator and / or inverter, or otherwise varying electricity such as that generated by a switching power supply.

[0200] Continue to refer to Figure 18The controller 1824 can communicate with the pressure compressor 1848. For example, in some cases, the controller 1824 can transmit compressor commands to the pressure compressor 1848, for example, by means of a compressor command signal. As used in this disclosure, a "compressor command signal" is a signal representing a compressor command. As used in this disclosure, a "compressor command" is a communication intended for use with any compressor as described herein. In some cases, the compressor command can be used to influence the performance of the pressure compressor 1848. In some cases, the controller 1824 can receive compressor data from the pressure compressor 1848, for example, by means of a compressor data signal. As used in this disclosure, a "compressor data signal" is a signal representing compressor data. As used in this disclosure, "compressor data" is information associated with any compressor described herein. In some cases, pump data can represent the performance and / or operation of the pressure compressor 1848.

[0201] Further reference Figure 18 System 1800 may include a combination reservoir 1852. Combination reservoir 1852 may be configured to receive a first fluid 1812 from at least one first fluid inlet 1804 and a second fluid 1836 from at least one second fluid inlet 1828. At least one first fluid inlet 1804 and at least one second fluid inlet 1828 may be used to fill combination reservoir 1852 with the first fluid 1812 and the second fluid 1836, respectively. Furthermore, combination reservoir 1852 may be configured to combine the first fluid 1812 and the second fluid 1836 into a combination of the first fluid 1812 and the second fluid 1836. In one embodiment, combining the first fluid 1812 and the second fluid 1836 may include generating droplets of the first fluid 1812. As used herein, a "droplet" refers to a small, spherical liquid particle. In non-limiting examples, combination reservoir 1852 may generate droplets through various mechanisms, such as, but not limited to, pressure-driven atomization, ultrasonic atomization, electrostatic atomization, etc. The combined reservoir 1852 may be constructed of a material compatible with the combined first fluid 1812 and second fluid 1836. For example, but not limited to, the first fluid reservoir 1808 may be made of any material such as corrosion-resistant metal, plastic and / or glass.

[0202] Continue to refer to Figure 18As shown, system 1800 includes at least one injector 1856 configured to disperse a combination of a first fluid and a second fluid. As used herein, an "injector" is a component designed to dispense at least one fluid for at least one application in a variety of applications. In a non-limiting example, system 1800 and at least one injector 1856 may be configured for industrial applications, agricultural applications, etc. For example, system 1800 and at least one injector 1856 may be configured for uses related to painting or surface coating various articles, conveying waste oil into furnaces for heating or conveying it into plasma reactors, greenhouse humidity control, odor control, and chemical engineering. Those skilled in the art will recognize that system 1800 and at least one injector 1856 can be configured for a variety of applications.

[0203] Further reference Figure 18 At least one ejector 1856 may include at least one first fluid ejector inlet 1860. As used herein, a “first fluid ejector inlet” is an inlet point through which at least a first fluid may be additionally introduced into at least one ejector 1856 before being output by at least one ejector 1856 in such a manner as described herein. In a non-limiting example, at least one first fluid ejector inlet 1860 may be connected to the outlet of at least one first reservoir 1808, as described above. In some cases, at least one first fluid ejector inlet 1860 may be designed to provide a robust, leak-free connection to at least one first reservoir 1808; for example, but not limited to, at least one first fluid ejector inlet 1860 may be sealed using one or more sealing elements (such as O-rings, gaskets, thread sealants, etc.) to ensure a tight seal and / or prevent leakage or contamination.

[0204] Still referencing Figure 18 At least one ejector 1856 may include at least one second fluid ejector inlet 1864. As used herein, a “second fluid ejector inlet” is an inlet point through which at least a second fluid may be additionally introduced into at least one ejector 1856 before being output by at least one ejector 1856 in such a manner as described herein. In a non-limiting example, at least one second fluid ejector inlet 1864 may be connected to the outlet of at least one second reservoir 1832, as described above. In some cases, at least one second fluid ejector inlet 1864 may be designed to provide a robust, leak-free connection to at least one first reservoir 1808; for example, but not limited to, at least one second fluid ejector inlet 1864 may be sealed using one or more sealing elements (such as O-rings, gaskets, thread sealants, etc.) to ensure a tight seal and / or prevent leakage or contamination.

[0205] Continue to refer to Figure 18 At least one injector 1856 may include at least one fluid outlet 1868. As used in this disclosure, a “fluid outlet” is an outlet point through which at least one fluid is discharged from at least one injector 1856. In some cases, at least one fluid outlet 1868 may be configured to allow at least one fluid to be released to a intended location outside the low-pressure injection system 1800. For example, but not limited to, at least one fluid outlet 1868 may be placed adjacent to a surface used for painting and / or surface coating. In some cases, at least one fluid outlet 1868 may be configured to disperse the fluid in an optimal flow pattern and dispersion of at least one fluid. Additionally or alternatively, at least one injector 1856 and / or at least one fluid outlet 188 may be configured to disperse a combination of first fluids in one of a plurality of first fluid spray volumes. In this embodiment, the plurality of first fluid spray volumes may include 4 to 25 liters per minute. Additionally or alternatively, at least one injector 1856 and / or at least one fluid outlet 188 may be configured to disperse a combination of second fluids in one of a plurality of second fluid spray volumes. In this embodiment, the plurality of second fluid spray volumes may include flow rates from 4 liters to 25 liters per minute. Additionally, or alternatively, at least one injector 1856 and / or at least one fluid outlet 1868 may be configured to... Figure 19The dispersion combination is described in more detail in one of a plurality of spray patterns. In this embodiment, the plurality of spray patterns include wide cones, narrow cones, etc. In a non-limiting example, at least one fluid outlet 188 may include a nozzle (i.e., an opening of a special shape) designed to produce a directional high-speed flow of at least one fluid, which can improve mixing and dispersion in the reaction zone. Such nozzles may include, but are not limited to, swirling nozzles, fan-shaped spray nozzles, impingement jet nozzles, orifice nozzles, atomizing nozzles, etc. For example, the nozzle may include an orifice leading to a chamber into which the liquid to be sprayed is delivered under pressure. A spray can then be generated through the orifice, the spray pattern, flow rate, and spray angle depending on the orifice edge profile and the design of the internal pressure chamber. Furthermore, various spray patterns that can be generated by the nozzle exist, such as flat fan-shaped patterns, hollow cone patterns, solid cone patterns, solid flow patterns, atomizing / fogging patterns, etc. For example, in a flat fan-shaped spray pattern, the liquid is shaped into a fan-shaped fluid sheet. It may consist of droplets or waterfall-like water sheets. Flat fan-shaped sprays can have spray angles between 15 and 145 degrees, depending on the nozzle design. Fan-shaped sprays can be formed through simple shaped orifices or by deflecting the spray on a shaped deflecting surface. As a further example, in a solid cone mode, the liquid is broken down into droplets that are more or less uniformly concentrated in the resulting spray cone. Again, this spray cone can vary from 30 degrees to 170 degrees, depending on the nozzle design. Solid cones can be formed using axially and tangentially rotating nozzles as well as helical nozzles. For example, a solid flow mode can comprise a simple focused fluid jet without actual droplets. Solid flows can be formed by forcing the fluid through a shaped orifice that focuses the spray into a jet. As another example, atomization / fog modes produce a uniform mist or fog with little or no impact. This mode can start as a solid or hollow cone, but at a short distance from the nozzle orifice, the mode will lose coherence and form a mist or fog. Many hollow and solid cone nozzles can eventually form a fog if sprayed at sufficient pressure.

[0206] Alternatively or alternatively, and still refer to Figure 18At least one injector 1856 may include one or more valves configured to monitor, control, or otherwise regulate the flow of at least one fluid. As used in this disclosure, a "valve" is a component that controls fluid communication between two or more components (e.g., between the combined reservoir 1852 and at least one injector 1856). Exemplary non-limiting valves include directional valves, control valves, selector valves, multi-way valves, check valves, pilot-operated flow control valves, proportional flow control valves, flow-limiting flow control valves, spool valves, etc. For example, a pilot valve controls the position of an orifice or spool valve, enabling the valve to maintain a consistent flow rate in the event of any change in system pressure. The valve may be controlled by a system pressure signal, which ensures that the valve responds quickly to any changes in operating conditions. As a further example, a proportional flow control valve may include a variable orifice that regulates the flow rate of a hydraulic fluid. An electrical signal controls the size of the orifice, enabling the valve to maintain a precise flow rate. The valve may also include any suitable valve configuration, including ball valves, butterfly valves, needle valves, gate valves, globe valves, wafer valves, regulating valves, etc. Valves can be incorporated into manifolds of hydraulic or pneumatic circuits, allowing for multiple ports and flow paths. For example, flow control valves control the volumetric rate of fluid flowing through them. Generally, changing the orifice size is a way to set and adjust the flow rate. This rate can be altered, for example, by moving a conical needle into and out of the orifice or opening and closing a gap within a ball valve. Depending on the valve's parameters, the flow rate can increase when the valve is open to 100% of its stroke, and a nearly fully open valve allows for increased flow, thereby increasing output and eliminating bottlenecks or throttling. Valves can be actuated by any known method, such as, but not limited to, hydraulic, pneumatic, mechanical, or electrical power. For example, in some cases, valves can be actuated by an energized solenoid or electric motor. For instance, a pressure-compensated flow control valve is a hydraulic component that regulates a constant volumetric flow rate of fluid in a hydraulic system despite changes in system pressure. These valves are particularly useful when it may be necessary to maintain a consistent speed in a hydraulic cylinder, regardless of the stress the cylinder is subjected to. Since speed is proportional to hydraulic flow rate, the speed of a hydraulic cylinder depends on the amount of fluid flowing through it. The valve actuator, and thus the valve itself, can be controlled by a computing device, as described in further detail below. 1824 can communicate with the valve, for example, by means of one or more of electrical, hydraulic, pneumatic, or mechanical communication. Furthermore, the injector 18 and its components will be explained in more detail below in this disclosure.

[0207] Further reference Figure 18Alternatively or concurrently, at least one injector 1856 may break down the first fluid into small droplets, which can then be dispersed and mixed with a second fluid. Furthermore, at least one injector 1856 may be configured to adjust the droplet size of the first fluid 1812 from the combined reservoir 1852. For example, for any given volume of fluid, the smaller the droplet size, the larger the surface area of ​​the spray, where various factors influence droplet size, such as pressure, spray pattern type, spray angle, nozzle type, fluid specific gravity, viscosity, and surface tension. For example, with respect to nozzles, the higher the fluid pressure, the smaller the droplet size. For any given hydraulic nozzle, the relationship between pressure and average droplet size can be expressed as:

[0208]

[0209] Where D is the average droplet size at pressure 1 (P1) and pressure 2 (P2); in other implementations, different exponents may describe this relationship. This gives an approximate relationship for comparing droplet sizes for any given nozzle. As a further example, a solid flow spray may have no droplets at all, a flat fan pattern may form a sheet of liquid with little atomization or may produce a coarse atomized spray, while a solid cone nozzle will produce the next level of atomization, and a hollow cone nozzle will produce the smallest droplets, all of which are described in further detail above. As a further example, for any given flow rate, the wider the spray angle, the smaller the droplet size, because a wider angle allows for more space to distribute the droplets, thus potentially reducing the chance of recombination and increasing the chance of atomization. Additionally, the design of the spray nozzle can affect the spray pattern type (e.g., flat fan, hollow cone), and this can affect the droplet size, as discussed above, but variations in atomization levels can exist even within the same pattern type. For example, a helical nozzle design can produce a solid cone pattern that, for a given pressure, flow rate, and spray angle, produces smaller droplets than an axial swirl nozzle. In an exemplary embodiment, at least one ejector 1856 can be configured to reduce the size of droplets formed in the combined reservoir of the first fluid 1812 to a range of about 5 micrometers to about 50 micrometers. In this embodiment, the second fluid can be ionized due to the small droplet size of the first fluid. Furthermore, the ionized second fluid can be readily transferred into the droplets of the first fluid. In some cases, the droplets can carry reactants into the reaction zone of the plasma reactor, as described in more detail below. In some cases, the droplets can enhance the mixing and interaction between different fluids within the plasma reactor, thereby improving the efficiency and / or uniformity of the process.

[0210] Continue to refer to Figure 18At least one injector 1856 may include a flow adjustment knob 1872. As used in this disclosure, a "flow adjustment knob" is a component that allows precise control and regulation of the fluid flow rate through at least one injector 1856. In some cases, the flow adjustment knob 1872 may include a manual flow control valve that can be manually adjusted to regulate the fluid flow rate through at least one injector 1856; the flow control valve may include any suitable type of flow control valve, including but not limited to ball valves, needle valves, butterfly valves, etc. In a non-limiting example, the flow adjustment knob 1872 is configured such that by turning the knob, a valve opening or an opening of at least one fluid outlet 1868 can be opened and / or closed, thereby allowing more or less fluid to pass through at least one injector 1856. Alternatively or additionally, the flow adjustment knob 1872 may include a 10X control ratio. As used in this disclosure, a "control ratio" is a measure of the versatility and flexibility of the flow through at least one injector 1856 controlled by the flow adjustment knob 1872. For example, the control ratio can further refer to the width of the operating range of the device and is defined as the ratio of the maximum capacity to the minimum capacity. For example, a device with a maximum output of 10 units and a minimum output of 2 units might have a control ratio of 5. In flow measurement, the control ratio indicates the range of flow rates that the flow meter can measure with acceptable accuracy. The flow adjustment knob 1872 can be connected to a flow control valve. For example, a typical control valve with equal percentage flow characteristics might have a control ratio of 30:1; however, when the valve size is too large and throttles at the low end, its control ratio can drop to 3:1 or less. In one embodiment, the flow adjustment knob 1872 can control the fluid flow rate over a range of ten times the minimum flow rate. For example, if the minimum flow rate of the flow adjustment knob 1872 is 1.75 liters per minute (GPM), then a 10X control ratio could indicate that the flow adjustment knob 1872 can effectively adjust the flow rate through at least one injector 1856 from 1.75 liters per minute to up to 17.5 liters per minute. In an exemplary embodiment, the flow adjustment knob 1872 is configured to modify the fluid flow rate to up to 10 liters per minute.

[0211] Now for reference Figure 19An exemplary embodiment of the injector 1856 is shown. As described above, an "injector" is a component designed to dispense at least one fluid for at least one of a variety of applications. In a non-limiting example, the injector 1856 may be configured for industrial applications, agricultural applications, etc. For example, the injector 1856 may be configured for uses related to painting or surface coating various articles, conveying waste oil into furnaces for heating or conveying it into plasma reactors, greenhouse humidity control, odor control, and chemical engineering. In a non-limiting embodiment, the multiple spray patterns include wide cones, narrow cones, etc. In such an embodiment, at least one fluid outlet 1868 of at least one injector 1856 may output a combination 1904 of a first fluid and a second fluid at an arbitrary angle of about 12 degrees to about 15 degrees in a spray cone 1908. The first fluid may be consistent with any first fluid as discussed herein. The second fluid may be consistent with any second fluid as discussed herein.

[0212] Now for reference Figure 20 An exemplary embodiment of an apparatus 2000 for treating a growth medium 2004 via discharge is illustrated. The apparatus 2000 may include a housing 2060 configured to house various internal components as discussed herein. The apparatus 2000 may include an internal injection system disposed within the apparatus 2000, such as a low-pressure injection system 1800. As used herein, an “internal injection system” is an injection system mounted inside the apparatus 2000. The injection system can be any injection system described herein. In some embodiments, an external injection system may be designed to deliver at least one fluid from a first fluid reservoir 1808 and a second fluid reservoir 1832 into the plasma reactor 2012.

[0213] Continue to refer to Figure 20 An apparatus 2000 is illustrated for treating a growth medium 2004 via discharge. The apparatus 2000 may include the growth medium 2004 within a processing chamber 2008. The apparatus 2000 may include a plasma reactor 2012. The plasma reactor 2012 may include at least a pair of electrodes 2016a to 2016b. The first electrode 2016a may include an anode electrically connected to an ignition unit, and the second electrode 2016b may include a cathode electrically connected to ground 2020. The plasma reactor 2012 may include a reaction zone 2024 disposed between the first electrode 2016a and the second electrode 2016b. The apparatus 2000 may include an ignition unit 2028 electrically connected to at least one electrode of the at least pair of electrodes 2016a to 2016b. The apparatus 2000 may also include a condenser 2032 disposed within the reaction zone 2024 and above the processing chamber 2008.

[0214] Now for reference Figure 21An exemplary embodiment of an apparatus 2100 for treating a growth medium 2004 via discharge is illustrated. The apparatus 2100 may include an externally mounted vapor injection system, such as a low-pressure injection system 1800, disposed outside the apparatus 2100. As used herein, an "externally mounted vapor injection system" is mounted externally to the apparatus 22100 (rather than as referenced above). Figure 20 The described injection system is integrated within the device 2100. The injection system can be any injection system described in this disclosure. The device 2100 may include a growth medium 2104 within a processing chamber 2108. The device 2100 may include a plasma reactor 2112. The plasma reactor 2112 may include at least one pair of electrodes 2116a to 2116b. The first electrode 2116a may include an anode electrically connected to an ignition unit, and the second electrode 2116b may include a cathode electrically connected to ground 2120. The plasma reactor 2112 may include a reaction zone 2124 disposed between the first electrode 2116a and the second electrode 2116b. The device 2100 may include an ignition unit 2128 electrically connected to at least one electrode of the at least one pair of electrodes 2116a to 2116b. The device 2100 may also include a condenser 2132 disposed within the reaction zone 2124 and above the processing chamber 2108.

[0215] Now for reference Figure 21 An exemplary embodiment of an apparatus 2100 for treating a growth medium via discharge is illustrated. In some embodiments, the external injection system may be designed to deliver at least one fluid from a first fluid reservoir 1808 and a second fluid reservoir 1832 into the plasma reactor 2112 from an external location via a tube 2136. In a non-limiting example, the external injection system may be mechanically fixed to the exterior of the housing. In some cases, the external injection system may be attached to the exterior of the housing via screws or bolts, clamps or clips, sliding or snap-fit ​​connections, etc.

[0216] Now for reference Figure 22 A flowchart illustrating an exemplary embodiment of a method 600 for using a low-pressure injection system for multiple fluids is provided. Method 600 includes step 2205 of receiving a first fluid from a first fluid reservoir containing the first fluid via at least one first fluid inlet. In some embodiments, at least one first fluid inlet may be hydraulically connected to the first fluid reservoir. Alternatively or additionally, the first fluid may be a liquid. This can be implemented without limitation as described herein.

[0217] Continue to refer to Figure 22Method 2200 includes step 2210 of receiving a second fluid from a second fluid reservoir containing the second fluid via at least one second fluid inlet. In some embodiments, at least one second fluid inlet may be pneumatically connected to the second fluid reservoir. Alternatively or additionally, the second fluid may be a gas. This can be implemented without limitation as described herein.

[0218] Continue to refer to Figure 22 Method 2200 includes step 2215 of supplying pressure by a low-pressure compressor to a second fluid received from a second fluid reservoir. In some embodiments, the low-pressure compressor may be configured to output pressures from 2 bar to 7 bar. This can be implemented without limitation as described herein.

[0219] Continue to refer to Figure 22 Method 2200 includes step 2220 of dispersing a combination of a first fluid and a second fluid by at least one injector. In some embodiments, at least one injector may be configured to disperse the combined first fluid in one of a plurality of first fluid spray volumes. Alternatively or alternatively, the plurality of fluid spray volumes may include 4 to 25 liters per minute. Furthermore, in one embodiment, at least one injector may be configured to disperse the combination in one of a plurality of spray patterns. In one embodiment, the plurality of spray patterns may include a cone pattern. In yet another embodiment, at least one injector may be configured to disperse the combined second fluid in one of a plurality of second fluid flow volumes. Alternatively or alternatively, the plurality of second fluid flow volumes may include a second fluid flow volume of 4 to 25 liters per minute. Furthermore, at least one injector may include at least one first fluid injector inlet connected to a first fluid reservoir, the at least one first fluid injector inlet being configured to receive additional first fluid from the first fluid reservoir. Alternatively or alternatively, at least one injector may also include at least one second fluid injector inlet connected to a second fluid reservoir, wherein the at least one second fluid injector inlet is configured to receive additional second fluid from the second fluid reservoir. Furthermore, at least one of the injectors can be configured to adjust the droplet size of the first fluid. In one embodiment, the droplet size of the first fluid ranges from 5 micrometers to 50 micrometers. As described herein, this can be achieved without limitation.

[0220] Continue to refer to Figure 22 Method 2200 may include modifying the fluid flow rate of a combination of a first fluid and a second fluid by a flow adjustment knob during operation of at least one injector. In some embodiments, the flow adjustment knob may be configured to modify the fluid flow rate to up to 10 liters per minute. Alternatively or additionally, the flow adjustment knob may be configured to modify the injector flow rate for a control ratio of 10. This can be implemented without limitation as described herein.

[0221] Now for reference Figure 23 This document illustrates a block diagram of an exemplary embodiment of an apparatus 2300 for a modular plasma reactor 2304. The apparatus 2300 includes a modular plasma reactor 2304. For the purposes of this disclosure, a “modular plasma reactor” is a plasma reactor that can be detachably connected to other modules. As used in this disclosure, a “plasma reactor” is a device configured to generate, sustain, and / or control plasma. For the purposes of this disclosure, “plasma” refers to a fourth state of matter other than solid, liquid, and gas. Plasma may comprise a partially ionized gas consisting of a mixture of ions, electrons, and / or neutral particles (i.e., atoms and molecules). In one embodiment, plasma can be formed when at least one fluid is subjected to a high-energy source (such as, but not limited to, heat, radiation, electric fields, etc.), resulting in the ionization of atoms or molecules in at least one fluid by losing or gaining electrons. At least one fluid may be introduced into the modular plasma reactor 2304 using an ejector, as described below in this disclosure. In some cases, the plasma may comprise a nonthermal plasma (NTP), wherein a nonthermal plasma is a plasma whose electron temperature is significantly higher than the temperature of heavier ions and neutral particles. In this scenario, although electrons in the plasma possess high kinetic energy, the overall temperature of at least one fluid can remain relatively low (e.g., typically close to room temperature of 20°C–22°C / 68°F–72°F). Alternatively, the energy distribution among particles in a non-thermal plasma may not be in thermal equilibrium because electrons, which are much lighter than ions and neutral particles, gain energy more quickly when subjected to an electric or magnetic field, resulting in higher electron temperatures. On the other hand, heavier ions and neutral particles move more slowly and remain cooler, leading to a lower temperature for at least one fluid.

[0222] Continue to refer to Figure 23The modular plasma reactor 2304 includes a housing 2308. As used in this disclosure, "housing" refers to an external structure configured to include multiple components (such as, but not limited to, components of the device 2300 as described in this disclosure). In some embodiments, housing 2308 may comprise a durable, lightweight material, such as, but not limited to, plastic, metal, etc. In some embodiments, the size of housing 2308 may be scalable. In some embodiments, housing 2308 may be designed and configured to protect sensitive components of device 2300 from damage or contamination. In some embodiments, housing 2308 may be portable. For the purposes of this disclosure, "portable" means an object designed to be transported from one place to another. In a non-limiting example, portable housing 2308 may comprise a shell of components of device 2300. For example, but not limited to, housing 2308 may be configured to protect components of the modular plasma reactor 2304, at least one modular reservoir 2312, modular ignition unit 2316, modular pressure regulator, controller 2320, etc., individually or together. In some embodiments, housing 2308 may include one or more flat surfaces. For the purposes of this disclosure, "flat surface" means the surface of an object that is smooth and uniform, without any significant curvature or protrusions. In a non-limiting example, housing 2308 may include a flat surface such that housing 2308 can be securely placed on a ground surface. In another non-limiting example, housing 2308 may include a flat surface such that housing 2308 can be mounted on another flat surface. In yet another non-limiting example, housing 2308 may include a flat surface such that another object having a flat surface can be mounted on housing 2308. In some embodiments, housing 2308 may include one or more surface coatings and / or modifications to reduce the likelihood of undesirable adhesion or interference with external components such as debris, foreign objects, liquids, etc. Additionally or alternatively, housing 2308 may also include features such as latches, clips, or other fasteners that help secure housing 2308 in place during use.

[0223] Continue to refer to Figure 23In some embodiments, housing 2308 may include at least one aperture providing a path for communication between modules. In a non-limiting example, at least one aperture of housing 2308 of modular injector 2324 may provide a path for at least one fluid inlet of modular injector 2324 to connect to an outlet of at least one modular reservoir 2312. The at least one fluid inlet of modular injector 2324 and the outlet of at least one modular reservoir 2312 are disclosed in further detail below. In another non-limiting example, at least one aperture of housing 2308 of modular plasma reactor 2304 may provide a path for one or more continuous conductors of modular ignition unit 2316 to connect to at least one electrode of modular plasma reactor 2304. The at least one electrode disclosed herein is further described below. In another non-limiting example, at least one aperture of housing 2308 of modular plasma reactor 2304 may provide a path for fluid connection between at least one fluid outlet of modular injector 2324 and modular plasma reactor 2304. The at least one fluid outlet of modular injector 2324 is further described below.

[0224] Continue to refer to Figure 23As used in this disclosure, "communication" is an attribute in which two or more related entities interact with each other, for example, within a particular domain or in some way. In some cases, communication between two or more related entities can be domain-specific, such as, but not limited to, electrical communication, fluid communication, information communication, mechanical communication, etc. As used in this disclosure, "information communication" is an attribute in which two or more related entities interact with each other by means of information flow or general information. For example, but not limited to, communication between modular injector 2324 and controller 2320 may include information communication. For example, but not limited to, communication between modular ignition unit 2316 and controller 2320 may include information communication. As used in this disclosure, "mechanical communication" is an attribute in which two or more related entities interact with each other by means of mechanical means (e.g., mechanical forces (e.g., force) and flow (e.g., velocity)). As used in this disclosure, "electrical communication" is an attribute in which two or more related entities generally interact with each other by means of current or electricity. For example, but not limited to, communication between modular injector 2324 and modular ignition unit 2316 may include electrical communication through one or more continuous conductors. As used in this disclosure, "fluid connectivity" is a property in which two or more related entities typically interact with each other by means of a fluid flow or fluid. For example, but not limited to, communication between the modular injector 2324 and at least one modular reservoir 2312 may include fluid connectivity, wherein at least one fluid flows between the modular injector 2324 and at least one modular reservoir 2312. At least one fluid is disclosed in further detail below. As used in this disclosure, "fluid" is a flowable gaseous or liquid material, including but not limited to water, nitrogen, oxygen, and / or other gases and / or liquids.

[0225] Continue to refer to Figure 23 The housing 2308 may also include a processing chamber configured to contain a growth medium. As used in this disclosure, a "processing chamber" is a controlled space designed to hold a particular material, substance, or object and subject it to a particular treatment. In one embodiment, the processing chamber may be constructed as an open system; for example, but not limited to, the processing chamber may include an open container. In another embodiment, the processing chamber may be constructed as a closed system; for example, but not limited to, the processing chamber may be a closed container with an airtight seal. In some embodiments, the processing chamber may be designed to provide easy access to the growth medium being processed. In a non-limiting example, the processing chamber may include a removable door or hinged door or port for loading and / or unloading the growth medium. In another non-limiting example, the processing chamber may include one or more windows, with or without covers, for visual inspection or sampling during the processing.

[0226] Continue to refer to Figure 23The device 2300 includes a modular ignition unit 2316. In some embodiments, the modular ignition unit 2316 is detachably connected to the modular plasma reactor 2304. For the purposes of this disclosure, "detachably connected" means the ability of an object connected to another object to disconnect from the other object without damaging or destroying said object. In some embodiments, the modular ignition unit 2316 may include a housing 2308 as disclosed above. In some embodiments, the detachable connection may include a threaded connection. For the purposes of this disclosure, a "threaded connection" is a type of connection involving mating male and female halves together to form a connection that holds the threads together. As a non-limiting example, a threaded connection may be accomplished by means of a polarity matching component. As a non-limiting example, a polarity matching component may include a male component or plug that inserts into a female component or socket. In some cases, the threaded connection may be detachable. In some cases, the threaded connection may be detachable, but requires a special tool or key to disassemble. In some embodiments, the threaded connection may be achieved by means of one or more of plug and socket mating, spring pin contact, crown spring mating, etc. In some cases, threaded connections may be keyed to ensure proper alignment of mating parts. In some cases, threaded connections may be lockable. As used in this disclosure, a "matting part" is a part that mates with at least one other part. As a non-limiting example, a mating part may include a connector. In another embodiment, a detachable connection may include a bayonet connection. Bayonet connections may use a locking mechanism that allows the two parts to be connected by inserting and twisting them into place. In another embodiment, a detachable connection may include a snap-fit ​​connection. In some embodiments, a snap-fit ​​connection may include a series of tabs or hooks that snap into place when the two parts are pushed together. As a non-limiting example, a snap-fit ​​connection may include a snap-fit ​​clip, a snap-fit ​​tab, a snap-fit ​​hinge, a snap-fit ​​latch, a snap-fit ​​hook, a snap-fit ​​pin, etc. In another embodiment, a detachable connection may include a latch connection. A latch connection uses a latch or locking mechanism that secures the two parts together. As a non-limiting example, a latch connection may include a cabinet latch, a door latch, an aircraft fastener, etc. In another embodiment, a detachable connection may include a clamp connection. In some embodiments, clamp connections use clamps or compression mechanisms to hold two components together. As non-limiting examples, clamp connections may include hose clamps, C-clamps, pipe clamps, wire rope clamps, collars, spring clamps, etc. In another embodiment, a detachable connection may include a magnetic connection. In some embodiments, a magnetic connection uses magnets to hold two components together. In some embodiments, a detachable connection may include connectors, screws, adapters, feedthroughs, etc. For the purposes of this disclosure, a "connector" is a component configured to establish an electrical or mechanical connection between two or more objects.Examples of connectors include plug and socket connectors, terminal blocks, crimp connectors, etc. For the purposes of this disclosure, a "feedthrough" is an electrical component that allows electrical signals or power to pass through a barrier or enclosure while maintaining isolation between the interior and exterior of the enclosure.

[0227] Continue to refer to Figure 23 In one embodiment, the modular ignition unit 2316 can be detachably connected to the modular plasma reactor 2304 using one or more continuous conductors. As described herein, a “continuous conductor” is an electrical conductor without any interruption, made of a conductive material capable of carrying current over a distance. As a non-limiting example, the conductive material may include any material that conducts current, and as a non-limiting example, may include various metals such as copper, steel, or aluminum, carbon conductive materials, or any other suitable conductive material. In another embodiment, the modular ignition unit 2316 can be detachably connected to the modular plasma reactor 2304 using a connector or adapter. In some embodiments, the connector may be used to join wires or cables together. As a non-limiting example, the connector may connect one or more continuous conductors. In another embodiment, the modular ignition unit 2316 can be detachably connected to the modular plasma reactor 2304 using a high-voltage feedthrough. For the purposes of this disclosure, a “high-voltage feedthrough” is a hermetically sealed electrical connector designed to allow high-voltage current to pass through a vacuum chamber or pressurized chamber (such as the shell of a plasma reactor). Continuing reference Figure 23For the purposes of this disclosure, a “modular ignition unit” is an ignition unit that can be detachably connected to other modules. As used in this disclosure, an “ignition unit” is an electrical component responsible for providing the initial voltage required to initiate a discharge between electrodes. In a non-limiting example, the modular ignition unit 2316 may be configured to supply voltage to at least one electrode. The at least one electrode is disclosed in further detail below. In some embodiments, the modular ignition unit 2316 may include a power source. As used in this disclosure, a “power source” is any system, device, or means that provides power (such as, but not limited to, electricity) to a device. The power source may provide power to the modular ignition unit 2316 and / or other devices / components within the apparatus 2300 described in this disclosure (such as, but not limited to, the modular plasma reactor 2304, the modular injector 2324, any computing device, etc.). In a non-limiting example, the controller 2320 may be electrically connected to the power source. As a non-limiting example, the controller 2320 may control the power to any component of the apparatus 2300, as described below. In some embodiments, the power source may be externally electrically connected to the controller 2320. In this implementation, the power source may include an external power source, such as, but not limited to, a wall-mounted power outlet. In some cases, transmitting power may include using one or more continuous conductors. In some implementations, the power source may include a battery. In one implementation, the power source may include direct current (DC) power. In another implementation, the power source may include alternating current (AC) power. In some implementations, additionally or alternatively, the power source may include AC or DC renewable power. As a non-limiting example, AC or DC renewable power may include electricity generated from renewable energy sources such as solar, wind, hydro, geothermal, and biomass.

[0228] Continue to refer to Figure 23In some embodiments, the modular ignition unit 2316 may be configured to convert a lower input voltage from a power source (e.g., 110V / 220V for AC, or 12V / 24V for DC) to a higher output voltage, thereby providing the necessary electrical energy to drive the modular plasma reactor 2304. In a non-limiting example, the modular ignition unit 2316 may include an ignition transformer. As used in this disclosure, an "ignition transformer" is an electrical transformer designed to generate a high-voltage output for initiating a discharge, wherein the electrical transformer is a passive electrical device that transfers electrical energy from one circuit to another through an electromagnetic induction process. In some cases, the electrical transformer may be used to increase or decrease the voltage level of an alternating current (AC) signal while maintaining the same frequency. In a non-limiting example, the ignition transformer may be configured to boost the input voltage from a lower level (from the power source) to a higher voltage level required by the modular plasma reactor 2304 to generate an electric arc (i.e., the arc point). In some embodiments, the ignition transformer may include two sets of windings, wherein the two sets of windings may include a primary winding and a secondary winding. Two sets of windings can be wound around the magnetic core. In some cases, the primary winding can be connected to a lower voltage input, while the secondary winding generates a high-voltage output. In a non-limiting example, the modular ignition unit 2316 may include an ignition transformer configured to convert power received from a power source into a high-voltage discharge of 6kV to 30kV. In another embodiment, the voltage range can be from 3kV to 18kV. (Continue to reference) Figure 23In some embodiments, the modular ignition unit 2316 may be able to convert an AC voltage that oscillates periodically between positive and negative values ​​into a DC current with a constant polarity (positive or negative) that does not change over time, to generate controlled and / or stable discharges for the connected electrodes to generate and / or sustain plasma. In some cases, the device 2300 may need to convert AC power to DC power to perform pulsed operation. During pulsed plasma operation, the modular plasma reactor 2304 may operate in a pulsed mode in which plasma can be generated and sustained for a short period, followed by a period without discharge. The DC power supply can be easily controlled and switched on and off as needed, thus making the DC power supply suitable for pulsed plasma operation. In some cases, the device 2300 may convert AC power to DC power to reduce electrode wear and contamination; for example, but not limited to, in an AC-powered modular plasma reactor 2304, the constantly changing polarity of the electrodes can lead to accelerated electrode wear and the release of electrode material into the generated plasma. By using a DC power supply, the electrodes can maintain a constant polarity, thereby reducing wear and contamination and increasing electrode life. In one embodiment, the device 2300 may also convert AC to AC. For example, an AC-to-AC converter can be used to convert an AC waveform with a specific frequency and amplitude to an AC waveform with another frequency and amplitude. For example, an AC voltage controller can be a thyristor-based device that directly converts a fixed AC voltage to a variable AC voltage without changing the frequency. The AC voltage controller can be a phase-controlled device, thus eliminating the need for forced commutation circuitry and allowing the use of natural commutation or grid commutation. In a non-limiting example, the modular ignition unit 2316 may include a rectifier. As used in this disclosure, a "rectifier" is an electrical device or circuit that converts AC to DC. A rectifier may be constructed using one or more diodes, wherein the diode is a semiconductor device that allows current to flow in only one direction and has low resistance to current in the forward direction (when the voltage is positive) and high resistance to current in the reverse direction (when the voltage is negative). In some cases, the rectifier may include, but is not limited to, a half-wave rectifier, a full-wave rectifier, etc.

[0229] Continue to refer to Figure 23In some embodiments, the modular ignition unit 2316 may include a power regulator (i.e., a filter). As described in this disclosure, a "power regulator" is an electrical device that performs power regulation or redistribution in a power supply, wherein, as described herein, "power regulation" or "power redistribution" refers to the process of maintaining a power supply voltage below its maximum value during operation, non-operation, or charging. In a non-limiting example, a power regulator may be used to remove or attenuate unwanted frequencies, noise, or voltage fluctuations from an output voltage or current. Power regulators may include, but are not limited to, passive filters, active filters, EMI / RFI filters, voltage regulators, etc. Additionally or alternatively, the modular ignition unit 2316 may include a balancer. As described herein, a "balancer" is an electrical device that performs power balancing, wherein, for the purposes of this disclosure, "power balancing" refers to the process of balancing electrical energy from one or more first power sources (e.g., a high-power battery) to one or more second power sources (e.g., a low-power battery). Those skilled in the art, upon reviewing the entire contents of this disclosure, will recognize various devices / components that may be used within the modular ignition unit 2316 of device 2300.

[0230] Continue to refer to Figure 23 Additionally or alternatively, in some embodiments, the plasma reactor 2304 may include an onboard ignition unit. For the purposes of this disclosure, an "onboard ignition unit" is an ignition unit included in a housing that includes the plasma reactor. In some embodiments, the onboard ignition unit may be directly connected to the modular plasma reactor 2304 using a continuous conductor, feedthrough, connector, or adapter as described above. In some embodiments, the onboard ignition unit may be directly connected to the modular plasma reactor 2304. As a non-limiting example, in a direct connection, the onboard ignition unit may be physically attached to at least one electrode of the modular plasma reactor 2304 or other components within the housing 2308. As another non-limiting example, the onboard ignition unit may be directly connected to the modular plasma reactor 2304 using a variety of techniques, such as, but not limited to, soldering, brazing, adhesive bonding, or mechanical fasteners. As a non-limiting example, mechanical fasteners may include bolts, screws, nuts, washers, rivets, pins, etc. In some embodiments, the controller 2320 may be detachably connected to the onboard ignition unit. In some implementations, the controller 2320 may be configured to control the power to the onboard ignition unit to generate the initial voltage required to initiate a discharge between the electrodes.

[0231] Continue to refer to Figure 23Alternatively or additionally, the modular ignition unit 2316 may include a coil. As used in this disclosure, a "coil" is a wound helix or spiral of conductive wire that generates an electromagnetic field when current flows through it. In a non-limiting example, the coil may be electrically connected to at least one electrode of at least one pair of electrodes of the modular plasma reactor 2304, the coil being configured to initiate a discharge in the modular plasma reactor 2304. As a non-limiting example, the coil may include an induction coil or a high-voltage transformer coil. For the purposes of this disclosure, an "induction coil" is an electronic component that stores energy in a magnetic field when current flows through it. As a non-limiting example, the induction coil may include a coil of wire wound around a core material such as iron or ferrite that amplifies the magnetic field. In some embodiments, the induction coil or high-voltage transformer coil may generate a high-voltage electrical pulse required to generate a discharge between a first and second electrode of at least one pair of electrodes of the modular plasma reactor 2304. By passing a high-frequency current through the induction coil, an oscillating magnetic field can be generated. This magnetic field can then induce a current in the gas or plasma, ionize it, and generate a plasma discharge (e.g., inductively coupled plasma (ICP)). In some implementations, the magnetic field generated around the induction coil can be used to confine the plasma within the modular plasma reactor 2304.

[0232] Continue to refer to Figure 23The apparatus 2300 includes a modular injector 2324. For the purposes of this disclosure, a “modular injector” is an injector that can be detachably connected to other modules. As used herein, an “injector” is a component designed to introduce at least one fluid into a plasma reactor (specifically, the reaction zone of the plasma reactor). In a non-limiting example, the modular injector 2324 may be configured to deliver at least one fluid through the reaction zone. The reaction zone and at least one fluid disclosed herein are described below. The at least one fluid can then be used by the modular plasma reactor 2304 to generate plasma. In some embodiments, the modular injector 2324 is detachably connected to the modular plasma reactor 2304. In some embodiments, the modular injector 2324 may be connected to the modular plasma reactor 2304 using an injector mounting flange. As used herein, an “injector mounting flange” is an edge projecting from an object for attaching the injector to the housing of the plasma reactor. In a non-limiting example, the injector mounting flange may include an interface between the modular injector 2324 and the modular plasma reactor 2304. In some cases, at least one fluid outlet of the modular injector 2324 may include a threaded adapter. Both the at least one fluid outlet and the interface may include threaded sections; for example, but not limited to, at least one fluid outlet / interface may include a male threaded section / female threaded section, wherein the male threaded section and the female threaded section are compatible (i.e., mating). The modular injector 2324 can be screwed onto the injector mounting flange at the interface using at least one fluid outlet with a threaded adapter. Figure 2 An exemplary configuration of the modular injector 2324, at least one fluid outlet of the modular injector 2324, injector mounting flange, and interface is shown.

[0233] Continue to refer to Figure 23The modular ejector 2324 may include at least one fluid inlet. As used in this disclosure, a “fluid inlet” is an inlet point through which at least one fluid is introduced into the modular ejector 2324 before being delivered to the reaction zone of the modular plasma reactor 2304 or any other process described in this disclosure. In a non-limiting example, as described above, at least one fluid inlet may be connected to the outlet of at least one modular reservoir 2312. In some cases, at least one fluid inlet may be designed to provide a robust, leak-free connection to at least one reservoir; for example, but not limited to, at least one fluid inlet may be sealed using one or more sealing elements (such as O-rings, gaskets, thread sealants, etc.) to ensure a tight seal and / or prevent leakage or contamination. The modular ejector 2324 may include at least one fluid outlet. As used in this disclosure, a “fluid outlet” is an outlet point through which at least one fluid is discharged from the modular ejector 2324 into the reaction zone of the modular plasma reactor 2304. In some cases, at least one fluid outlet may be configured to allow at least one fluid to be released to a intended location within the reaction zone. For example, but not limited to, at least one fluid outlet may be positioned at the center and directly above at least one pair of electrodes. At least one fluid outlet may be located at a distance from at least one pair of electrodes or the reaction zone. This distance can affect the time and space available for mixing and interaction of at least one fluid with plasma or other process components. In some cases, at least one fluid outlet may be configured to provide an optimal flow pattern and dispersion of at least one fluid to the reaction zone. In a non-limiting example, at least one fluid outlet may comprise a nozzle (i.e., a specially shaped opening) designed to generate a directional, high-speed flow of at least one fluid, which can improve mixing and dispersion in the reaction zone. Such nozzles may include, but are not limited to, swirling nozzles, fan-shaped spray nozzles, impingement jet nozzles, porous nozzles, atomizing nozzles, etc.

[0234] Continue to refer to Figure 23Alternatively or additionally, the modular injector 2324 may include one or more valves configured to monitor, control, or otherwise regulate the flow of at least one fluid delivered through the reaction zone of the modular plasma reactor 2304. As used herein, a "valve" is a component that controls fluid communication between two or more components (e.g., between at least one modular reservoir 2312 and the modular injector 2324). Exemplary non-limiting valves include directional valves, control valves, selector valves, multi-way valves, check valves, etc. Valves may include any suitable valve configuration, including ball valves, butterfly valves, needle valves, gate valves, stop valves, control valves, wafer valves, regulating valves, etc. Valves may be included in manifolds of hydraulic or pneumatic circuits, for example, allowing multiple ports and flow paths. Valves may be actuated by any known method (such as, but not limited to, by means of, hydraulic, pneumatic, mechanical, or electrical energy). For example, in some cases, valves may be actuated by an energized solenoid or electric motor. The valve actuator, and thus the valve itself, may be controlled by the controller 2320, as described in detail below. The controller 2320 can communicate with the valve, for example, by means of one or more of electrical communication, hydraulic communication, pneumatic communication, mechanical communication, etc.

[0235] Continue to refer to Figure 23 In some embodiments, the modular injector 2324 may include a flow adjustment component. As used in this disclosure, a "flow adjustment component" is a device that allows precise control and regulation of the fluid flow rate through the injector. In some cases, the flow adjustment component may include a manual flow control valve that can be manually adjusted to regulate the fluid flow rate through the modular injector 2324. In a non-limiting example, by turning a knob, the valve opening or the opening of at least one fluid outlet can be changed, thereby allowing more or less fluid to pass through the modular injector 2324 or be introduced into the modular plasma reactor 2304. In some cases, the flow adjustment component may include an actuator that can be controlled by a controller 2320 to regulate the fluid flow rate through the modular injector 2324. The controller 2320 may communicate with the flow adjustment component, for example, by means of one or more of electrical communication, hydraulic communication, pneumatic communication, mechanical communication, etc. In some embodiments, the flow adjustment component may include an 8X control ratio. As used in this disclosure, "control ratio" is a measure of the versatility and flexibility of the flow adjustment component, indicating how well the flow adjustment component adapts to different flow requirements within the system. This flow control unit can control fluid flow rate within a range of up to eight times the minimum flow rate. For example, if the minimum flow rate of the flow control unit is 23 gallons per minute (GPM), then an 8X control ratio indicates that the flow control unit can effectively adjust the flow rate from 1 GPM to up to 8 GPM.

[0236] Continue to refer to Figure 23The apparatus 2300 includes at least one modular reservoir 2312. For the purposes of this disclosure, a “modular reservoir” is a reservoir that can be detachably connected to other modules. As used in this disclosure, a “reservoir” is a container or storage chamber designed to hold at least one fluid. In a non-limiting example, at least one reservoir may be configured to contain at least one fluid. At least one reservoir can provide a consistent and controlled supply of at least one fluid for processing the growth medium, as described in further detail below. In one embodiment, at least one fluid may include a substance capable of generating a discharge. In some cases, at least one fluid may include a liquid; for example, but not limited to, at least one fluid may include water, an organic solvent, an electrolyte solution, etc. In other cases, at least one fluid may include one or more gases; for example, but not limited to, at least one fluid may include an inert gas (e.g., nitrogen, argon, helium, neon, etc.), oxygen, carbon dioxide, air, a reactive gas (e.g., hydrogen, ammonia, sulfur hexafluoride, etc.), etc. Additionally or alternatively, the apparatus 2300 may include multiple reservoirs 2312. In one embodiment, at least one modular reservoir 2312 may include a first modular reservoir 2312 configured to contain a first fluid and a second modular reservoir 2312 configured to contain a second fluid, wherein the first fluid may include at least one gas and the second fluid may include at least one liquid.

[0237] Continue to refer to Figure 23At least one modular reservoir 2312 ma...

Claims

1. An apparatus comprising: Processing chamber, the processing chamber being configured to contain a medium; At least one reservoir, the at least one reservoir being configured to contain at least one fluid; A plasma reactor, wherein the plasma reactor comprises: Multiple electrodes, including a first electrode and a second electrode, wherein the multiple electrodes are configured to generate a discharge according to the at least one fluid; and A reaction region disposed between the first electrode and the second electrode, wherein the reaction region is configured to enable the discharge to interact with the medium; An ignition unit electrically connected to at least one of the plurality of electrodes, wherein the ignition unit is configured to supply voltage to the at least one electrode; An injector, the injector being in fluid communication with the at least one reservoir, wherein the injector is configured to deliver the at least one fluid through the reaction zone; and A pressure regulator configured to transfer the fluid to the injector.

2. The apparatus of claim 1, wherein the at least one reservoir comprises: A first reservoir, configured to contain a first fluid; as well as A second reservoir, configured to contain a second fluid, wherein: The first fluid comprises a gas; and The second fluid includes liquids.

3. The apparatus of claim 2, wherein the ejector is configured to output a mixture of the first fluid and the second fluid in droplet form to the plasma reactor.

4. The apparatus of claim 1, wherein: The first electrode branches off from the second electrode; and The reaction zone includes multiple arc points located between the first electrode and the second electrode.

5. The apparatus of claim 1, wherein: The injector includes a flow adjustment component configured to regulate the flow rate of the at least one fluid entering the reaction zone; and The pressure regulator is configured to pressurize the at least one fluid entering the reaction zone.

6. The apparatus of claim 1, wherein the ignition unit includes an ignition circuit configured to convert power received from a power source into a high-voltage discharge of 6kV to 30kV.

7. The apparatus of claim 1, further comprising a condenser disposed within the reaction zone and above the processing chamber, wherein the condenser is configured to: Collect the reactive substances generated during the discharge in the reaction zone; and The reactive substance is transferred to the processing chamber.

8. The apparatus of claim 1, wherein the first electrode and the second electrode are electrically isolated from each other by a dielectric material.

9. The apparatus of claim 1, wherein the first electrode and the second electrode have different shapes.

10. The apparatus of claim 1, wherein the ejector includes a fluid outlet configured to output the at least one fluid in a conical distribution to the plasma reactor, the conical distribution comprising droplets of the at least one fluid.

11. The apparatus of claim 10, wherein: Each electrode in at least one pair includes a tilt angle of 6 to 8 degrees; and The distribution angle of the conical shape ranges from 12 degrees to 15 degrees.

12. The apparatus of claim 10, wherein the droplets comprise microdroplets with a diameter of 5µ to 8µ.

13. The apparatus of claim 1, wherein the injector comprises a piezoelectric steam injector.

14. The apparatus of claim 1, wherein the injector comprises: A first fluid inlet, which is fluidly connected to a first reservoir in the at least one reservoir; A second fluid inlet is fluidly connected to a second reservoir in the at least one reservoir; as well as A fluid outlet configured to output a combination of a first fluid from the first reservoir and a second fluid from the second reservoir to the plasma reactor.

15. The apparatus of claim 14, further comprising a low-pressure compressor configured to provide a pressure of 2 to 7 bar to the second fluid received from the second reservoir.

16. The apparatus of claim 1, wherein at least one of the at least one reservoir, the ignition unit, or the injector is detachably connected to the plasma reactor.

17. An apparatus comprising a processing chamber, at least one reservoir, a plasma reactor, an ejector, a pressure regulating system, and an ignition unit, said ignition unit comprising: A voltage source configured to provide voltage; A converter configured to convert the voltage from a direct current (DC) voltage input to an alternating current (AC) voltage output; as well as An electrical connection interface configured to electrically connect the converter to at least one of a plurality of electrodes disposed in the plasma reactor, wherein the plurality of electrodes includes a first electrode and a second electrode. A feedback mechanism, comprising a sensor configured to detect response data; as well as A control module, communicatively connected to the feedback mechanism, wherein the control module is configured to: Based on the AC voltage output, a discharge is initiated in the reaction region located between the first electrode and the second electrode; and This allows the discharge to interact with the medium contained in the processing chamber.

18. The apparatus of claim 17, wherein the control module is configured to: Receive the reaction data detected by the sensor from the feedback mechanism; and At least one processing parameter of the device is adjusted based on the reaction data.

19. The apparatus of claim 18, wherein adjusting the at least one processing parameter includes training a processing machine learning model using processing training data.

20. A method comprising: Transfer at least one fluid to the injector; The at least one fluid is delivered through the reaction zone of the plasma reactor of the present invention by the ejector, wherein: The plasma reactor includes multiple electrodes, including a first electrode and a second electrode; and The reaction zone is disposed between the first electrode and the second electrode; A voltage is supplied to the at least one electrode by an ignition unit electrically connected to at least one of the plurality of electrodes; Discharge is generated by the plurality of electrodes according to the at least one fluid; and The reaction zone enables the discharge to interact with the medium contained in the processing chamber.

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