Laser processing equipment of ceramic substrate for circuit board and control method

Abstract

The invention relates to the circuit board processing technology, and particularly discloses laser processing equipment for ceramic substrates for circuit boards and a control method.The laser processing equipment is characterized in that a first driving motor runs to drive four station discs to rotate in the clockwise direction, and after one ceramic substrate is discharged, one ceramic substrate is fed to the station discs in time; it is guaranteed that the four station discs can complete the four steps of feeding, laser machining, cleaning and discharging at the same time; and meanwhile, a second driving motor operates to drive a first bevel gear to rotate, the first bevel gear rotates to drive a second bevel gear to rotate, and the second bevel gear rotates to drive a threaded rod to rotate, so that a sliding rod is driven to slide along a second supporting cylinder, rotation of the center disc is not affected, and the height of the ceramic substrate is adjusted in the rotating process without closing the machine.

Description

Technical Field

[0001] This invention relates to circuit board processing technology, and specifically discloses a laser processing equipment and control method for ceramic substrates used in circuit boards. Background Technology

[0002] Ceramic substrates are special boards made by directly bonding copper foil to the surface of an alumina or aluminum nitride ceramic substrate at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure and interconnection technologies.

[0003] Existing laser processing equipment for ceramic substrates used in circuit boards mostly relies on manual transfer of ceramic substrates or robotic arms to the laser processing station. It is difficult to simultaneously perform the four steps of loading, laser processing, cleaning, and unloading at the same station. Furthermore, the quality of the laser-processed product is related to the distance between the product and the laser processing equipment. Most existing equipment cannot adjust the distance between the product and the laser processing equipment during processing. Adjusting the distance usually requires pausing the equipment for adjustment and then restarting it, which causes significant damage to the equipment. Summary of the Invention

[0004] The purpose of this invention is to provide a laser processing equipment and control method for ceramic substrates used in circuit boards, so as to solve the problems encountered in the background art.

[0005] The objective of this invention can be achieved through the following technical solutions: A laser processing device for ceramic substrates for circuit boards includes a support device and a working device mounted on the support device. The support device is equipped with laser processing equipment and scanning detection equipment, which are used for laser processing of ceramic substrates and scanning detection of the laser-processed ceramic substrates. The working equipment includes a four-station workbench and a pushing device. The four-station workbench is used to simultaneously perform loading, laser processing, cleaning and unloading of ceramic substrates. The pushing device is used to push out unqualified products detected by the scanning and inspection equipment into the unloading conveyor.

[0006] As a further description of the present invention, the supporting device includes a support platform, a motor mounting platform on one side wall of the support platform, a laser equipment mounting platform on one side of the support platform, a mounting plate on the top of the laser processing equipment mounting platform, the laser processing equipment being mounted on the mounting plate, a mounting groove on the side of the laser processing equipment mounting platform, a workbench mounting platform above the mounting groove, two symmetrically distributed unloading equipment mounting platforms on the side of the workbench mounting platform, a pusher device mounting platform on the side of the unloading equipment mounting platform, and two symmetrically distributed baffles on the top of the pusher device mounting platform.

[0007] As a further description of the present invention, the workbench mounting platform includes a first support plate, two symmetrically distributed connecting plates on both sides of the first support plate, the two connecting plates being fixedly connected to the top two side walls of the mounting groove respectively, a support column on the top of the first support plate, a second support plate on the top of the support column, a first support groove on the second support plate, the first support groove passing through the second support plate, the support column and the first support plate in sequence, two symmetrically distributed connecting rods on the top of the second support plate, a first support cylinder on the top of the connecting rod, and a second support groove on the first support cylinder.

[0008] As a further description of the present invention, the four-station workbench includes a first drive motor, which is a stepper motor. The first drive motor is fixedly mounted on the top of the motor mounting platform. The output shaft of the first drive motor is fixedly connected to a drive wheel. A driven wheel is provided on the side of the drive wheel. A transmission belt is sleeved on the drive wheel and the driven wheel. The driven wheel is sleeved on a support column and is rotatably connected to the support column. Two second support cylinders are symmetrically distributed on the top of the driven wheel.

[0009] As a further description of the present invention, a second drive motor is provided below the driven wheel. The second drive motor is fixedly installed on one side of the mounting groove. The output shaft of the second drive motor is fixedly connected to a first bevel gear. The first bevel gear meshes with a second bevel gear. The second bevel gear is rotatably connected to the bottom of the first support plate. A threaded rod is provided on one side of the second bevel gear. The threaded rod passes through the first support groove, and a four-position plate is provided above the threaded rod.

[0010] As a further description of the present invention, the four-station tray includes a central tray, and four station trays arranged in an array around the central tray. A feeding groove is opened at the bottom of the station tray, and a ceramic substrate is placed inside the station tray. A connecting column is provided at the bottom of the central tray, and the connecting column is slidably disposed in a second support groove. A threaded groove is opened at the bottom of the connecting column, and the threaded rod is threadedly connected to the threaded groove. Two sliding rods are also provided symmetrically distributed at the bottom of the central tray. The two sliding rods are disposed on both sides of the connecting column, and the two sliding rods are slidably connected to two second support cylinders respectively.

[0011] As a further description of the present invention, the pushing device includes a third drive motor, which is fixed on a baffle located on one side. The output shaft of the third drive motor passes through the baffle and is fixedly connected to a ball screw. The two ends of the ball screw are rotatably connected to two baffles respectively. A sliding block is slidably arranged on the ball screw. The sliding block is fixedly connected to the sliding pair of the ball screw. The bottom of the sliding block is slidably connected to the top of the pushing device mounting platform. A pushing plate is provided on the top of the sliding block.

[0012] As a further description of the present invention, the working equipment also includes a material feeding and conveying device, the scanning and detection device is disposed above the material feeding and conveying device, the material pushing device is disposed on the side of the material feeding and conveying device, and the material pushing device is disposed at the outlet of the scanning and detection device; The feeding and conveying equipment includes a fourth drive motor and two symmetrically distributed conveying rollers. The fourth drive motor is fixedly installed on a feeding equipment mounting platform on one side. The two conveying rollers are rotatably connected to the top of the two feeding equipment mounting platforms respectively. The output shaft of the fourth drive motor is fixedly connected to one of the conveying rollers. A conveyor belt is fitted on the two conveying rollers. The width of the conveyor belt is adapted to the feeding trough, and the conveyor belt is always directly below the feeding trough.

[0013] As a further description of the present invention, the four workstations are used for feeding, laser processing, cleaning and unloading respectively in a clockwise direction, with the workstation for unloading positioned directly above the conveyor belt.

[0014] A cleaning device is provided above the workstation tray for cleaning. The cleaning device is fixedly installed on the support device. The cleaning device uses air blowing to clean the waste residue left on the ceramic substrate after laser cutting, and then the material is unloaded.

[0015] A control method for a laser processing equipment for ceramic substrates used in circuit boards, the control method comprising the following steps: Step S1: Start the first drive motor. The first drive motor drives the four workstations to rotate clockwise. Step S2: After a ceramic substrate is unloaded, load another ceramic substrate onto the workstation tray in a timely manner to ensure that the four workstation trays can complete the four steps of loading, laser processing, cleaning and unloading simultaneously. Step S3: When the ceramic substrate is finished being unloaded and transported to the next process by the unloading conveyor, the scanning and detection equipment scans the laser-processed ceramic substrate. If a defective product is found, when the product is transported to the corresponding position of the pusher, the defective product is pushed out of the unloading conveyor by the pusher. Step S4: If the reason for the product's non-compliance is found to be that the ceramic substrate is defective and the distance between it and the laser processing equipment is unsuitable, start the second drive motor. The second drive motor will operate to adjust the distance between the ceramic substrate and the laser processing equipment.

[0016] The beneficial effects of this invention are: The invention utilizes a first drive motor to rotate four workstations clockwise. Once a ceramic substrate is unloaded, another ceramic substrate is promptly loaded onto the workstation, ensuring that the four workstations can simultaneously complete the four steps of loading, laser processing, cleaning, and unloading. Simultaneously, a second drive motor rotates a first bevel gear, which in turn rotates a second bevel gear, which in turn rotates a threaded rod. This causes the sliding rod to slide along the second support cylinder without affecting the rotation of the central disc. The height of the ceramic substrate can be adjusted during rotation without shutting down the machine.

[0017] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of the laser processing equipment for the ceramic substrate of the circuit board of the present invention; Figure 2 This is a schematic diagram of the support device structure for the laser processing equipment of the ceramic substrate for circuit boards of the present invention; Figure 3 This is a schematic diagram of the workbench mounting structure of the laser processing equipment for ceramic substrates for circuit boards according to the present invention; Figure 4 This is a schematic diagram of the working structure of the laser processing equipment for ceramic substrates used in circuit boards according to the present invention. Figure 1 ; Figure 5This is a schematic diagram of the four-station workbench structure of the laser processing equipment for ceramic substrates for circuit boards according to the present invention. Figure 6 This is a schematic diagram of the four-station disk structure of the laser processing equipment for ceramic substrates for circuit boards according to the present invention. Figure 7 This is a schematic diagram of the working structure of the laser processing equipment for ceramic substrates used in circuit boards according to the present invention. Figure 1 .

[0020] In the diagram, 1. Support device; 2. Working equipment; 11. Support platform; 12. Motor mounting platform; 13. Laser processing equipment mounting platform; 14. Mounting plate on top; 15. Mounting groove; 16. Workbench mounting platform; 17. Unloading equipment mounting platform; 18. Pushing device mounting platform; 19. Baffle; 21. Four-station workbench; 22. Pushing device; 23. Unloading conveyor; 161. First support plate; 162. Connecting plate; 163. Support column; 164. Second support plate; 165. First support groove; 166. Connecting rod; 167. First support cylinder; 168. Second support groove; 2 11. First drive motor; 212. Drive wheel; 213. Drive wheel; 214. Second support cylinder; 215. Second drive motor; 216. First bevel gear; 217. Second bevel gear; 218. Threaded rod; 219. Four-station plate; 221. Third drive motor; 222. Ball screw; 223. Sliding block; 224. Push plate on top; 231. Fourth drive motor; 232. Conveyor roller; 233. Conveyor belt; 2191. Center plate; 2192. Station plate; 2193. Discharge chute; 2194. Ceramic substrate; 2195. Connecting column; 2196. Sliding rod. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figure 1 As shown, a laser processing equipment for ceramic substrates for circuit boards includes a support device 1, characterized in that it further includes a working device 2 disposed on the support device 1; The support device 1 is equipped with a laser processing device and a scanning and detection device, which are used to perform laser processing on the ceramic substrate and to scan and detect the ceramic substrate after laser processing. Please see Figure 4As shown, the working equipment 2 includes a four-station workbench 21 and a pushing device 22. The four-station workbench 21 is used to simultaneously perform loading, laser processing, cleaning and unloading of ceramic substrates. The pushing device 22 is used to push out unqualified products detected by the scanning and inspection equipment from the transport line.

[0023] Please see Figure 2 As shown, the support device 1 includes a support platform 11. A motor mounting platform 12 is provided on one side wall of the support platform 11. A laser equipment mounting platform 13 is provided on one side of the support platform 11. A mounting plate 14 is provided on the top of the laser processing equipment mounting platform 13. The laser processing equipment is mounted on the mounting plate 14. A mounting groove 15 is provided on the side of the laser processing equipment mounting platform 13. A workbench mounting platform 16 is provided above the mounting groove 15. Two symmetrically distributed unloading equipment mounting platforms 17 are provided on the side of the workbench mounting platform 16. A pusher device mounting platform 18 is provided on the side of the unloading equipment mounting platform 17. Two symmetrically distributed baffles 19 are provided on the top of the pusher device mounting platform 18.

[0024] Please see Figure 3 As shown, the workbench mounting platform 16 includes a first support plate 161. Two connecting plates 162 are symmetrically distributed on both sides of the first support plate 161. The two connecting plates 162 are fixedly connected to the top two side walls of the mounting groove 15, respectively. A support column 163 is provided on the top of the first support plate 161. A second support plate 164 is provided on the top of the support column 163. A first support groove 165 is provided on the second support plate 164. The first support groove 165 passes through the second support plate 164, the support column 163 and the first support plate 161 in sequence. Two connecting rods 166 are symmetrically distributed on the top of the second support plate 164. A first support cylinder 167 is provided on the top of the connecting rod 166. A second support groove 168 is provided on the first support cylinder 167.

[0025] Please see Figure 5 As shown, the four-station workbench 21 includes a first drive motor 211, which is a stepper motor. The first drive motor 211 is fixedly mounted on the top of the motor mounting platform 12. The output shaft of the first drive motor 211 is fixedly connected to a drive wheel 212. A driven wheel 213 is provided on the side of the drive wheel 212. A transmission belt is sleeved on the drive wheel 212 and the driven wheel 213. The driven wheel 213 is sleeved on the support column 163 and is rotatably connected to the support column 163. Two second support cylinders 214 are symmetrically distributed on the top of the driven wheel 213.

[0026] A second drive motor 215 is provided below the driven wheel 213. The second drive motor 215 is fixedly installed on one side of the mounting groove 15. The output shaft of the second drive motor 215 is fixedly connected to a first bevel gear 216. The first bevel gear 216 meshes with a second bevel gear 217. The second bevel gear 217 is rotatably connected to the bottom of the first support plate 161. A threaded rod 218 is provided on one side of the second bevel gear 217. The threaded rod 218 passes through the first support groove 165, and a four-position plate 219 is provided above the threaded rod 218.

[0027] Please see Figure 6 As shown, the four-station tray 219 includes a central tray 2191, and four station trays 2192 arranged in an array around the central tray 2191. Each station tray 2192 has a feeding groove 2193 at its bottom and a ceramic substrate 2194 inside. A connecting post 2195 is located at the bottom of the central tray 2191 and is slidably disposed within a second support groove 168. A threaded groove is located at the bottom of the connecting post 2195, and a threaded rod 218 is threadedly connected to the threaded groove. Two symmetrically distributed sliding rods 2196 are also located at the bottom of the central tray 2191, positioned on either side of the connecting post 2195 and slidably connected to two second support cylinders 214 respectively.

[0028] In operation, the first drive motor 211 drives the drive wheel 212 to rotate. The rotation of the drive wheel 212 drives the driven wheel 213 to rotate via the transmission belt. The rotation of the driven wheel 213 drives the center disk 2191 to rotate in a step-by-step manner. The step-by-step rotation of the center disk 2191 drives the four-station disk 2192 to rotate in a step-by-step manner, simultaneously completing four processes: loading, laser processing, cleaning, and unloading. During processing, without stopping the machine, the distance between the product and the laser equipment can be adjusted, and the second drive motor 215 can be started. The second drive motor 215 drives the first bevel gear 216 to rotate. The rotation of the first bevel gear 216 drives the second bevel gear 217 to rotate. The rotation of the second bevel gear 217 drives the threaded rod 218 to rotate, thereby causing the sliding rod 2196 to slide along the second support cylinder 214 without affecting the rotation of the center disk 2191. During the rotation, the height of the ceramic substrate 2194 can be adjusted without shutting down the machine.

[0029] Please see Figure 7As shown, the feeding device 22 includes a third drive motor 221, which is fixed on a baffle 19 located on one side. The output shaft of the third drive motor 221 passes through the baffle 19 and is fixedly connected to a ball screw 222. The two ends of the ball screw 222 are rotatably connected to the two baffles 19 respectively. A sliding block 223 is slidably arranged on the ball screw 222. The sliding block 223 is fixedly connected to the sliding pair of the ball screw 222. The bottom of the sliding block 223 is slidably connected to the top of the feeding device mounting platform 18. A feeding plate 224 is provided on the top of the sliding block 223.

[0030] Please see Figure 4 As shown, the working device 2 also includes a feeding conveyor 23, the scanning detection device is located above the feeding conveyor 23, the pushing device 22 is located on the side of the feeding conveyor 23, and the pushing device 22 is located at the outlet of the scanning detection device.

[0031] When in use, when the scanner detects a product that is not qualified by laser processing, the third drive motor 221 is started when the unqualified product is transported to the exit of the scanning and detection equipment. The third drive motor 221 drives the ball screw 222 to rotate, the ball screw 222 rotates and drives the sliding block 223 to slide, and the sliding block 223 drives the pusher plate 224 to push the unqualified product away.

[0032] Please see Figure 7 As shown, the feeding conveying device 23 includes a fourth drive motor 231 and two symmetrically distributed conveying rollers 232. The fourth drive motor 231 is fixedly installed on a feeding device mounting platform 17 on one side. The two conveying rollers 232 are rotatably connected to the top of the two feeding device mounting platforms 17 respectively. The output shaft of the fourth drive motor 231 is fixedly connected to one of the conveying rollers 232. A conveyor belt 233 is sleeved on the two conveying rollers 232. The width of the conveyor belt 233 is adapted to the feeding trough 2193, and the conveyor belt 233 is always directly below the feeding trough 2193.

[0033] The four workstations 2192 are used for feeding, laser processing, cleaning and unloading respectively in a clockwise direction. The workstation 2192 used for unloading is located directly above the conveyor belt 233.

[0034] A cleaning device is provided above the workstation tray 2192 for cleaning. The cleaning device is fixedly installed on the support device 1. The cleaning device uses air blowing to clean the waste residue left on the ceramic substrate 2194 after laser cutting, and then unloads the material.

[0035] Working principle: Step S1: Start the first drive motor 211. The first drive motor 211 drives the four workstation disks 2192 to rotate clockwise. Step S2: After a ceramic substrate 2194 is unloaded, load another ceramic substrate 2194 onto the workstation tray 2192 in a timely manner to ensure that the four workstation trays 2192 can complete the four steps of loading, laser processing, cleaning and unloading simultaneously. Step S3: When the ceramic substrate 2194 is finished being unloaded and transported to the next process via the unloading conveyor 23, the scanning and detection equipment scans the laser-processed ceramic substrate 2194. If a defective product is found, when the product is transported to the corresponding position of the pusher 22, the unqualified product is pushed out of the unloading conveyor 23 by the pusher 22. Step S4: If the reason for the product's non-compliance is found to be that the ceramic substrate 2194 is defective and the distance from the laser processing equipment is unsuitable, start the second drive motor 215. The second drive motor 215 will operate to adjust the distance between the ceramic substrate 2194 and the laser processing equipment.

[0036] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A laser processing device for ceramic substrates used in circuit boards, comprising a support device (1), characterized in that, It also includes working equipment (2) installed on the support device (1); The support device (1) is equipped with a laser processing device and a scanning and detection device, which are used to perform laser processing on the ceramic substrate and to perform scanning and detection on the laser-processed ceramic substrate. The working equipment (2) includes a four-station workbench (21) and a pushing device (22). The four-station workbench (21) is used to simultaneously perform loading, laser processing, cleaning and unloading of ceramic substrates. The pushing device (22) is used to push out unqualified products detected by the scanning and inspection equipment into the unloading conveyor.

2. The laser processing equipment for ceramic substrates for circuit boards according to claim 1, characterized in that, The support device (1) includes a support platform (11), a motor mounting platform (12) is provided on one side wall of the support platform (11), a laser equipment mounting platform (13) is provided on one side of the support platform (11), a mounting plate (14) is provided on the top of the laser processing equipment mounting platform (13), the laser processing equipment is mounted on the mounting plate (14), a mounting groove (15) is provided on the side of the laser processing equipment mounting platform (13), a workbench mounting platform (16) is provided above the mounting groove (15), two symmetrically distributed unloading equipment mounting platforms (17) are provided on the side of the workbench mounting platform (16), a pusher device mounting platform (18) is provided on the side of the unloading equipment mounting platform (17), and two symmetrically distributed baffles (19) are provided on the top of the pusher device mounting platform (18).

3. The laser processing equipment for ceramic substrates for circuit boards according to claim 2, characterized in that, The workbench mounting platform (16) includes a first support plate (161). Two connecting plates (162) are symmetrically distributed on both sides of the first support plate (161). The two connecting plates (162) are fixedly connected to the top two side walls of the mounting groove (15). A support column (163) is provided on the top of the first support plate (161). A second support plate (164) is provided on the top of the support column (163). A first support groove (165) is provided on the second support plate (164). The first support groove (165) passes through the second support plate (164), the support column (163) and the first support plate (161) in sequence. Two connecting rods (166) are symmetrically distributed on the top of the second support plate (164). A first support cylinder (167) is provided on the top of the connecting rod (166). A second support groove (168) is provided on the first support cylinder (167).

4. The laser processing equipment for ceramic substrates for circuit boards according to claim 1, characterized in that, The four-station workbench (21) includes a first drive motor (211), which is a stepper motor. The first drive motor (211) is fixedly installed on the top of the motor mounting platform (12). The output shaft of the first drive motor (211) is fixedly connected to a drive wheel (212). A driven wheel (213) is provided on the side of the drive wheel (212). A transmission belt is sleeved on the drive wheel (212) and the driven wheel (213). The driven wheel (213) is sleeved on the support column (163) and is rotatably connected to the support column (163). Two second support cylinders (214) are symmetrically distributed on the top of the driven wheel (213).

5. The laser processing equipment for ceramic substrates for circuit boards according to claim 4, characterized in that, A second drive motor (215) is provided below the driven wheel (213). The second drive motor (215) is fixedly installed on one side of the mounting groove (15). The output shaft of the second drive motor (215) is fixedly connected to a first bevel gear (216). The first bevel gear (216) meshes with a second bevel gear (217). The second bevel gear (217) is rotatably connected to the bottom of the first support plate (161). A threaded rod (218) is provided on one side of the second bevel gear (217). The threaded rod (218) passes through the first support groove (165), and a four-position plate (219) is provided above the threaded rod (218).

6. The laser processing equipment for ceramic substrates for circuit boards according to claim 5, characterized in that, The four-station tray (219) includes a central tray (2191), and four station trays (2192) arranged in an array around the central tray (2191). The station trays (2192) have a feeding groove (2193) at the bottom and a ceramic substrate (2194) inside. The central tray (2191) has a connecting post (2195) at the bottom. The connecting post (2195) is slidably disposed in the second support groove (168). The connecting post (2195) has a threaded groove at the bottom. The threaded rod (218) is threadedly connected to the threaded groove. The central tray (2191) also has two symmetrically distributed sliding rods (2196) at the bottom. The two sliding rods (2196) are disposed on both sides of the connecting post (2195), and the two sliding rods (2196) are slidably connected to the two second support cylinders (214) respectively.

7. The laser processing equipment for ceramic substrates for circuit boards according to claim 1, characterized in that, The feeding device (22) includes a third drive motor (221), which is fixed on a baffle (19) located on one side. The output shaft of the third drive motor (221) passes through the baffle (19) and is fixedly connected to a ball screw (222). The two ends of the ball screw (222) are rotatably connected to the two baffles (19) respectively. A sliding block (223) is slidably arranged on the ball screw (222). The sliding block (223) is fixedly connected to the sliding pair of the ball screw (222). The bottom of the sliding block (223) is slidably connected to the top of the feeding device mounting platform (18). A feeding plate (224) is provided on the top of the sliding block (223).

8. The laser processing equipment for ceramic substrates for circuit boards according to claim 1, characterized in that, The working equipment (2) also includes a feeding conveyor (23), the scanning detection equipment is located above the feeding conveyor (23), the pushing device (22) is located on the side of the feeding conveyor (23), and the pushing device (22) is located at the outlet of the scanning detection equipment; The feeding conveying device (23) includes a fourth drive motor (231) and two symmetrically distributed conveying rollers (232). The fourth drive motor (231) is fixedly installed on a feeding device mounting platform (17) on one side. The two conveying rollers (232) are rotatably connected to the top of the two feeding device mounting platforms (17) respectively. The output shaft of the fourth drive motor (231) is fixedly connected to one of the conveying rollers (232). A conveyor belt (233) is sleeved on the two conveying rollers (232). The width of the conveyor belt (233) is adapted to the feeding trough (2193), and the conveyor belt (233) is always directly below the feeding trough (2193).

9. A laser processing equipment for ceramic substrates for circuit boards according to claim 6, characterized in that, The four workstations (2192) are used for loading, laser processing, cleaning and unloading respectively in a clockwise direction. The workstation (2192) used for unloading is located directly above the conveyor belt (233). A cleaning device is provided above the workstation tray (2192) for cleaning. The cleaning device is fixedly installed on the support device (1). The cleaning device cleans the waste residue left on the ceramic substrate (2194) after laser cutting by blowing air, and then unloads the material.

10. A control method for a laser processing equipment for ceramic substrates for circuit boards as described in any one of claims 1-9, characterized in that, The control method includes the following steps: Step S1: Start the first drive motor (211). The first drive motor (211) drives the four workstations (2192) to rotate clockwise. Step S2: After a ceramic substrate (2194) is unloaded, load another ceramic substrate (2194) onto the work station tray (2192) in a timely manner to ensure that the four work station trays (2192) can complete the four steps of loading, laser processing, cleaning and unloading at the same time. Step S3: When the ceramic substrate (2194) is finished being unloaded and transported to the next process via the unloading conveyor (23), the scanning and detection device scans the laser-processed ceramic substrate (2194). If a defective product is found, when the product is transported to the corresponding position of the pusher (22), the defective product is pushed out of the unloading conveyor (23) by the pusher (22). Step S4: If it is found that the reason for the product's non-compliance is that the ceramic substrate (2194) is not qualified and the distance from the laser processing equipment is not suitable, start the second drive motor (215) and the second drive motor (215) will adjust the distance between the ceramic substrate (2194) and the laser processing equipment.

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